Foldable electronic device including antenna

Abstract

Various embodiments relate to an electronic device including an antenna. The electronic device may include: a foldable housing; a flexible display disposed on the foldable housing, wherein at least a portion of the flexible display is configured to fold; and a frame disposed on a boundary portion of the flexible display and connected to a side member of the foldable housing. The side member includes a conductive portion electrically connected to a communication circuit, and the frame includes a low-permittivity material.

Description

[0001] This application is a divisional application of Chinese patent application No. 2019107378201, entitled “Foldable electronic device including antenna”, filed on August 9, 2019. Technical Field

[0002] The present disclosure relates to a foldable electronic device including an antenna. Background Art

[0003] Electronic devices having various structures have been described. For example, the electronic device may be formed to have a curved structure or a folding structure. As another example, the electronic device may include a flip cover, a dual display, a flexible display, and the like.

[0004] The electronic device may provide mobile communication services by using an antenna. The antenna of the electronic device may be arranged in a portion of an area inside and / or outside the housing.

[0005] The housing of the foldable electronic device can be in a folded state or a flat state around the hinge structure. The outer peripheral side surface of the housing of the foldable electronic device can be made of a metal material, and a part of the metal material can be used as an antenna.

[0006] However, in the folded state, a portion of the side surface serving as an antenna and the other side surface made of a metal material are close to each other, and the resulting proximity may degrade the performance of the antenna of the foldable electronic device. Summary of the Invention

[0007] Various embodiments of the present disclosure may provide a foldable electronic device capable of reducing antenna performance degradation when the electronic device is in a folded state.

[0008] According to various exemplary embodiments, an electronic device may include: a foldable housing; a flexible display disposed on the foldable housing, wherein at least a portion of the flexible display is configured to fold; and a frame disposed on a boundary portion of the flexible display and connected to a side member of the foldable housing. The side member includes a conductive portion electrically connected to a communication circuit, and the frame includes a low-permittivity material.

[0009] According to various exemplary embodiments, a foldable electronic device may include: a first housing, the first housing including a first surface, a second surface, and a first side housing, the second surface facing a direction opposite to the first surface, the first side housing surrounding at least a portion of a first space between the first and second surfaces; a second housing, the second housing including a third surface, a fourth surface, and a second side housing, the third surface facing the first surface of the first housing in a folded state of the foldable electronic device, the fourth surface facing a direction opposite to the third surface, the second side housing surrounding at least a portion of a second space between the third and fourth surfaces; a hinge disposed between the first and second housings and defining a folding axis; a flexible display exposed through the first and third surfaces; and a communication circuit disposed in the first and / or second spaces. Each of the first and second side housings may include a conductive portion. At least a portion of the conductive portion of the first side housing may be electrically connected to the communication circuit.

[0010] Various example embodiments may provide a foldable electronic device capable of reducing antenna performance degradation when the electronic device is in a folded state. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a block diagram illustrating an example electronic device in a network environment according to various embodiments;

[0013] Figure 2 is a diagram illustrating an example electronic device in a flat state according to an embodiment;

[0014] Figure 3 is a diagram illustrating an example electronic device in a folded state according to an embodiment;

[0015] Figure 4 is an exploded perspective view illustrating an example electronic device according to an embodiment;

[0016] Figure 5 is a diagram illustrating a first side housing and a second side housing of an exemplary electronic device in a flat state according to an embodiment;

[0017] Figure 6 is a diagram illustrating an example electronic device in a folded state according to an embodiment;

[0018] Figure 7is a diagram illustrating a first side housing and a second side housing of an example electronic device in a flat state according to another embodiment;

[0019] Figure 8 is a diagram illustrating an example electronic device in a folded state according to another embodiment;

[0020] Figure 9 is a diagram illustrating an example electronic device in a folded state according to another embodiment;

[0021] Figure 10 is a diagram illustrating an example electronic device in a flat state according to another embodiment;

[0022] Figure 11 is shown in a folded state Figure 10 A diagram of an example electronic device shown in ;

[0023] Figure 12 is a graph illustrating measured antenna performance of an example electronic device according to various embodiments;

[0024] Figure 13 is a flowchart illustrating an example method for driving an electronic device according to an embodiment;

[0025] Figure 14 is a diagram showing an example cross section of a portion of each of a first housing and a second housing according to an embodiment;

[0026] Figure 15 is a diagram showing an example cross section of a portion of each of a first housing and a second housing when the electronic device is in a folded state according to the embodiment; and

[0027] Figure 16 is an exploded perspective view of an exemplary electronic device including a frame according to various embodiments. DETAILED DESCRIPTION

[0028] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1, the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0029] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load commands or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121 .

[0030] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) together with the main processor 121. Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) that is functionally related to the auxiliary processor 123.

[0031] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0032] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0033] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0034] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display device 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit adapted to measure the strength of the force caused by the touch (e.g., a pressure sensor).

[0036] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0037] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0038] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0039] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0045] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a PCB). Depending on the embodiment, antenna module 197 may include multiple antennas. In this case, at least one antenna suitable for the communication scheme used in a communication network (such as first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0046] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0047] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial response to the request, either by further processing the result or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0048] A foldable electronic device according to various example embodiments (for example, but not limited to, Figure 2 The electronic device 10 may include: a first surface (eg, Figure 2 a first surface 341 facing in a direction opposite to the first surface 341 (eg, Figure 2 and a second surface 342 of the first surface 341 and the second surface 342), and a first side shell (eg, Figure 2 The first side housing 343) of the first housing (eg, Figure 2 comprising a third surface (eg, a first surface 341 facing the first housing structure 310) in the folded state of the foldable electronic device 10; and Figure 2 a third surface 351 facing in a direction opposite to the third surface 351, and a fourth surface (eg, Figure 2 351 and the fourth surface 352), and a second side shell (eg, Figure 2 The second side housing 353) of the second housing (eg, Figure 2a hinge (eg, a hinge) disposed between the first housing structure 310 and the second housing structure 320 and defining a folding axis (axis A) Figure 4 The flexible display (eg, Figure 2 and a communication circuit (eg, Figure 1 The communication module 190 of the first side housing 343 and the second side housing 353 may each include a conductive portion. At least a portion of the conductive portion of the first side housing 343 may be electrically connected to the communication circuit. The corner portion of the first surface 341 parallel to the folding axis (axis A) may include a first protrusion (e.g., Figure 6 The corner portion of the third surface 351 parallel to the folding axis (axis A) may include a second protrusion (e.g., Figure 6 The first side housing 343 may include a first side surface 343a parallel to the folding axis (axis A), a second side surface 343b connected to one side of the first side surface 343a and perpendicular to the folding axis (axis A), and a third side surface 343c connected to the other side of the first side surface 343a and parallel to the second side surface 343b. The second side housing 353 may include a fourth side surface 353a parallel to the folding axis (axis A), a fifth side surface 353b connected to one side of the fourth side surface 353a and arranged adjacent to the second side surface 343b in the folded state of the foldable electronic device 10, and a sixth side surface 353c connected to the other side of the fourth side surface 353a and arranged adjacent to the third side surface 343c in the folded state of the foldable electronic device. At least some of the conductive portions arranged on the second and third side surfaces 343 b and 343 c may be electrically connected to the communication circuit.

[0049] When the foldable electronic device 10 is in the folded state, the first protrusion 610 and the second protrusion 620 can contact each other so that the second side surface 343b and the fifth side surface 353b are spaced apart from each other, and the third side surface 343c and the sixth side surface 353c are spaced apart from each other. Each of the first protrusion 610 and the second protrusion 620 may include a conductive portion. Each of the first protrusion 610 and the second protrusion 620 may include a non-conductive portion. The first protrusion 610 and the second protrusion 620 may have shapes that are symmetrical to each other about the folding axis (axis A).

[0050] When the foldable electronic device 10 is in a folded state, the second side surface 343b and the fifth side surface 353b can be spaced apart from each other at an interval of 3-5 mm. The corner portions of the first surface 341 adjacent to the second side surface 343b and the third side surface 343c can be made of a low permittivity material 710 whose specific permittivity is less than 10. The corner portions of the third surface 351 adjacent to the fifth side surface 353b and the sixth side surface 353c can be made of a low permittivity material 710. The low permittivity material 710 may include, for example but not limited to, an injection molding material, etc. The foldable electronic device may further include: a processor disposed in the first space and / or the second space and operatively connected to the communication circuit; a memory disposed in the first space and / or the second space and operatively connected to the processor, the memory being configured to store multiple applications. The memory may store instructions that, when executed by the processor, cause the foldable electronic device 10 to receive an external signal through the communication circuit when it is in the folded state, output a notification in response to receiving the external signal, and provide a communication function in response to receiving a specified input (e.g., from a user) while the foldable electronic device 10 remains in the folded state. The communication function may include, for example, but not limited to, a voice function.

[0051] Figure 2 is a diagram illustrating an example electronic device in a flat state according to an embodiment. Figure 3 is a diagram illustrating an example electronic device in a folded state according to an embodiment.

[0052] Reference Figure 2 and Figure 3 According to an embodiment, the electronic device 10 may include a foldable housing 300, a hinge cover 330 covering a foldable portion of the foldable housing, and a flexible or foldable display 200 (hereinafter, simply referred to as "display 200") arranged in a space formed by the foldable housing 300. In the present disclosure, the surface on which the display 200 is arranged may be referred to as, for example, the front surface of the electronic device 10. In addition, the surface opposite to the front surface may be referred to as, for example, the rear surface of the electronic device 10. In addition, the surface surrounding the space between the front surface and the rear surface may be referred to as, for example, the side surface of the electronic device 10.

[0053] In an embodiment, the foldable housing 300 may include a first housing structure 310, a second housing structure 320 including a sensor area 324 (the term "housing structure" may be used interchangeably with the term "housing" throughout this disclosure), a first back cover 380, and a second back cover 390. The foldable housing 300 of the electronic device 10 is not limited to Figure 2 and Figure 3, and can be implemented by combinations and / or connections of other shapes or components. For example, in another embodiment, the first housing 310 and the first back cover 380 can be integrally formed, and the second housing 320 and the second back cover 390 can be integrally formed.

[0054] In the illustrated embodiment, the first housing structure 310 and the second housing structure 320 can be arranged on either side around a folding axis (axis A) and can have an overall symmetrical shape about the folding axis (axis A). As will be described later, the angle or distance between the first housing structure 310 and the second housing structure 320 can vary depending on whether the electronic device 10 is in a flat state, a folded state, or an intermediate state. In the illustrated embodiment, unlike the first housing structure 310, the second housing structure 320 additionally includes a sensor area 324 where various sensors are arranged, but the two can have mutually symmetrical shapes in other areas.

[0055] In an embodiment, the first shell structure 310 may include a first surface 341 arranged to face the front surface of the electronic device 10 when the electronic device is in a flat state, a second surface 342 arranged to face the opposite direction of the first surface 341 when the electronic device 10 is in a flat state, and a first side shell 343 surrounding at least a portion of the first space between the first surface 341 and the second surface 342.

[0056] In an embodiment, the second housing structure 320 may include a third surface 351 arranged to face the front surface of the electronic device 10 when the electronic device 10 is in the flat state, a fourth surface 352 arranged to face a direction opposite to the third surface 351 when the electronic device 10 is in the flat state, and a second side housing 353 surrounding at least a portion of the second space between the third surface 351 and the fourth surface 352. In an embodiment, when the electronic device 10 is in the folded state, the third surface 351 may face the first surface 341.

[0057] In an embodiment, Figure 2 As shown, the first housing structure 310 and the second housing structure 320 can together form a recess in which the display 200 is accommodated. In the embodiment shown, due to the sensor area 324, the recess can have at least two different widths in a direction perpendicular to the folding axis (axis A).

[0058] For example, the recess can have a first width w1 between a first portion 310a of the first shell structure 310 parallel to the folding axis (axis A) and a first portion 320a of the second shell structure 320 formed on the edge of the sensor area 324, and a second width w2 formed by a second portion 310b of the first shell structure 310 and a second portion 320b of the second shell structure 320 (which does not correspond to the sensor area 324 and is parallel to the folding axis (axis A)).

[0059] In this case, the second width w2 can be formed to be greater than the first width w1. That is, the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320 have mutually asymmetrical shapes and can form the first width w1 of the recess, while the second portion 310b of the first housing structure 310 and the second portion 320b of the second housing structure 320 have mutually symmetrical shapes and can form the second width w2 of the recess. In an embodiment, the first portion 320a and the second portion 320b of the second housing structure 320 can be at different distances from the folding axis (axis A). The width of the recess is not limited to the example shown in the figure. In various embodiments, the recess can have multiple widths, depending on the type of sensor area 324 or due to the asymmetrical shapes of the first housing structure 310 and the second housing structure 320.

[0060] In an embodiment, at least a portion of the first housing structure 310 and the second housing structure 320 may be made of a metallic material and / or a non-metallic material having a rigidity selected to support the display 200 .

[0061] In an embodiment, the sensor area 324 may be formed to have a predetermined area adjacent to a corner of the second housing structure 320. However, the arrangement, shape, and size of the sensor area 324 are not limited to the illustrated example. For example, in another embodiment, the sensor area 324 may be provided in a specific area between another corner of the second housing structure 320 (or its upper end corner) and its lower end corner. In an embodiment, components embedded in the electronic device 10 to perform various functions may be, for example but not limited to, components exposed to the front surface of the electronic device 10 through the sensor area 324, through at least one opening provided in the sensor area 324, or the like. In various embodiments, the components may include various sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0062] The first back cover 380 may be disposed on one side of the folding axis on the rear surface of the electronic device and may have a generally rectangular edge, and the edge may be surrounded by the first housing structure 310. Similarly, the second back cover 390 may be disposed on the other side of the folding axis on the rear surface of the electronic device, and the edge of the second back cover 390 may be surrounded by the second housing structure 320. For example, the first back cover 380 may be disposed on the second surface 342 of the first housing structure 310, and the second back cover 390 may be disposed on the fourth surface 352 of the second housing structure 320.

[0063] In the illustrated embodiment, the first rear cover 380 and the second rear cover 390 may have substantially symmetrical shapes about the folding axis (axis A). However, the first rear cover 380 and the second rear cover 390 do not always have mutually symmetrical shapes, and in another embodiment, the electronic device 10 may include first and second rear covers 380, 390 having various shapes. In another embodiment, the first rear cover 380 may be integrally formed with the first housing structure 310, and the second rear cover 390 may be integrally formed with the second housing structure 320.

[0064] In an embodiment, the first back cover 380, the second back cover 390, the first housing structure 310, and the second housing structure 320 may form a space in which various components of the electronic device 10 (e.g., a printed circuit board or a battery) may be arranged. In an embodiment, at least one component may be arranged on the rear surface of the electronic device 10 or may be visually exposed therein. For example, at least a portion of the sub-display 290 may be visually exposed through the first rear area 382 of the first back cover 380. In another embodiment, at least one component or sensor may be visually exposed through the second rear area 392 of the second back cover 390. In various embodiments, the sensor may include a proximity sensor and / or a rear camera.

[0065] Reference Figure 3 The hinge cover 330 may be disposed between the first housing structure 310 and the second housing structure 320 and may be configured to cover internal components (e.g., the hinge structure or hinge). In an embodiment, the hinge cover 330 may be covered by a portion of the first housing structure 310 and the second housing structure 320, or may be exposed to the outside depending on the state of the electronic device 10 (flat state or folded state).

[0066] For example, when the electronic device 10 is in Figure 2 In the flat state shown, the hinge cover 330 can be covered by the first housing structure 310 and the second housing structure 320 so that the hinge cover 330 is not exposed. Figure 3In the folded state shown (e.g., fully folded state), the hinge cover 330 may be exposed to the exterior between the first housing structure 310 and the second housing structure 320. For example, in an intermediate state where the first housing structure 310 and the second housing structure 320 are folded at a certain angle, the hinge cover 330 may be partially exposed to the exterior between the first housing structure 310 and the second housing structure 320. In this case, the exposed area may be smaller than in the fully folded state. In an embodiment, the hinge cover 330 may include a curved surface.

[0067] The display 200 may be disposed in a space formed by the foldable housing 300. For example, the display 200 may be placed on a recess formed by the foldable housing 300 on most of the front surface of the electronic device 10.

[0068] Therefore, the front surface of the electronic device 10 may include the display 200, a partial area of ​​the first housing structure 310 adjacent to the display 200, and a partial area of ​​the second housing structure 320. The rear surface of the electronic device 10 may include the first back cover 380, a partial area of ​​the first housing structure 310 adjacent to the first back cover 380, the second back cover 390, and a partial area of ​​the second housing structure 320 adjacent to the second back cover 390.

[0069] The display 200 may be a display in which at least a portion of the area can be deformed into a flat surface and / or a curved surface. In an embodiment, the display 200 may include a folding area 203, a first area 201 arranged on one side relative to the folding area 203 (e.g., Figure 2 ), and arranged on the other side (e.g., on the left side of the folding area 203 shown in FIG. Figure 2 For example, the first region 201 may be disposed on the first surface 341 of the first housing structure 310, and the second region 202 may be disposed on the third surface 351 of the second housing structure 320.

[0070] Figure 2 The area division of the display 200 shown in FIG is only an example, and the display 200 may also be divided into a plurality of (eg, at least four or two) areas according to its structure or function. Figure 2 In the embodiment shown, the area of ​​the display 200 can be divided by the folding area 203 extending parallel to the y-axis or the folding axis (axis A), but in another embodiment, the area of ​​the display 200 can also be divided with reference to different folding areas (for example, folding areas parallel to the x-axis) or by different folding axes (for example, folding axes parallel to the x-axis).

[0071] The first region 201 and the second region 202 may have shapes that are generally symmetrical around the folding region 203. Unlike the first region 201, the second region 202 may include a notch cut out depending on whether the sensor region 324 is present, but its shape may be symmetrical with the shape of the first region 201 in other regions. In other words, the first region 201 and the second region 202 may include portions having mutually symmetrical shapes and portions having mutually asymmetrical shapes.

[0072] Hereinafter, operations of the first and second case structures 310 and 320 and various regions of the display 200 depending on the state (eg, flat state or folded state) of the electronic device 10 will be described.

[0073] In an embodiment, when the electronic device 10 is in a flat state (eg, Figure 2 ), the first housing structure 310 and the second housing structure 320 can be arranged to face the same direction, forming a 180° angle between them. The surface of the first area 201 and the surface of the second area 202 of the display 200 can face the same direction (for example, toward the front surface of the electronic device), forming a 180° angle between them. The folding area 203 can form a coplanar surface with the first area 201 and the second area 202.

[0074] In an embodiment, when the electronic device 10 is in a folded state (eg, Figure 3 ), the first housing structure 310 and the second housing structure 320 can be arranged to face each other. The surface of the first area 201 of the display 200 and the surface of the second area 202 thereof can face each other, forming a small angle (for example, but not limited to 0-10 degrees) therebetween. At least a portion of the folding area 203 can be configured as a curved surface having a predetermined curvature.

[0075] In an embodiment, when the electronic device 10 is in the intermediate state, the first housing structure 310 and the second housing structure 320 may be arranged at a specific angle relative to each other. The surface of the first area 201 of the display 200 and the surface of the second area 202 thereof may form an angle that is greater than the angle in the folded state and less than the angle in the flat state. At least a portion of the folding area 203 may be configured as a curved surface having a predetermined curvature. The curvature in this case may be less than that in the folded state.

[0076] Figure 4 is an exploded perspective view illustrating an example electronic device according to an embodiment.

[0077] Reference Figure 4In an embodiment, the electronic device 10 may include a display unit (e.g., including a display) 20, a bracket assembly (e.g., including a bracket) 30, a substrate unit (e.g., including a substrate) 500, a first housing structure (e.g., a first housing) 310, a second housing structure (e.g., a second housing) 320, a first back cover 380, and a second back cover 390. In the present disclosure, the display unit 20 may be referred to as a display module, a display assembly, or a display, etc.

[0078] The display unit 20 may include a display 200 and at least one plate or layer 240 on which the display 200 is placed. In an embodiment, the plate 240 may be disposed between the display 200 and the support assembly 30. The display 200 may be disposed on a surface of the plate 240 (e.g., referring to FIG. 2 ). Figure 4 The plate 240 may be formed in a shape corresponding to the shape of the display 200. For example, the plate 240 may have a partial area formed in a shape corresponding to the notch 204 in the display 200.

[0079] The bracket assembly 30 may include a first bracket 410, a second bracket 420, a hinge structure 340 arranged between the first bracket 410 and the second bracket 420, a hinge cover 330 covering the hinge structure 340 when viewed from the outside, and a wiring member 430 (e.g., a flexible printed circuit (FPC)) extending through the first bracket 410 and the second bracket 420.

[0080] In an embodiment, the bracket assembly 30 may be disposed between the plate 240 and the substrate unit 500. For example, the first bracket 410 may be disposed between the first region 201 of the display 200 and the first substrate 510. The second bracket 420 may be disposed between the second region 202 of the display 200 and the second substrate 520.

[0081] In an embodiment, the wiring member 430 and at least a portion of the hinge structure 340 may be disposed within the bracket assembly 30. The wiring member 430 may be disposed in a direction (e.g., an x-axis direction) passing through the first bracket 410 and the second bracket 420. The wiring member 430 may be disposed in a direction (e.g., an x-axis direction) perpendicular to the folding axis (e.g., an x-axis direction) of the folding region 203 of the electronic device 10. Figure 2 In an embodiment, the hinge structure 340 can be arranged between the first shell structure 310 and the second shell structure 320 to form (e.g., define) the folding axis (e.g., Figure 2 y-axis or folding axis (A)).

[0082] As described above, the substrate unit 500 may include a first substrate 510 disposed near the first bracket 410 and a second substrate 520 disposed near the second bracket 420. The first substrate 510 and the second substrate 520 may be disposed within a space formed by the bracket assembly 30, the first housing structure 310, the second housing structure 320, the first back cover 380, and the second back cover 390. Components for implementing various functions of the electronic device 10 may be mounted on the first substrate 510 and the second substrate 520.

[0083] The first housing structure 310 and the second housing structure 320 can be assembled to be connected to both sides of the bracket assembly 30, respectively, while the display unit 20 remains connected to the bracket assembly 30. As will be described later, the first housing structure 310 and the second housing structure 320 can be slid along both sides of the bracket assembly 30, respectively, so as to be connected to the bracket assembly 30.

[0084] In an embodiment, the first housing structure 310 may include a first rotation support surface 312, and the second housing structure 320 may include a second rotation support surface 322 corresponding to the first rotation support surface 312. The first rotation support surface 312 and the second rotation support surface 322 may include curved surfaces corresponding to the curved surface included in the hinge cover 330.

[0085] In an embodiment, when the electronic device 10 is in a flat state (eg, Figure 2 The first rotation support surface 312 and the second rotation support surface 322 may cover the hinge cover 330 so that the hinge cover 330 is not exposed to the rear surface of the electronic device 10 or is less exposed. Figure 3 ), the first rotation support surface 312 and the second rotation support surface 322 can rotate along the curved surface included in the hinge cover 330 so that the hinge cover 330 is exposed to the rear surface of the electronic device 10 to the greatest extent.

[0086] Figure 5 is a diagram illustrating a first side case and a second side case of an example electronic device in a flat state according to an embodiment.

[0087] In addition to the components described below, Figure 5 The electronic device 10 shown in FIG. Figure 3 and Figure 4 The electronic device 10 shown in FIG. 1 is substantially the same or similar, and like elements are given like reference numerals.

[0088] Reference Figure 5The electronic device 10 according to the embodiment may include a first housing structure 310 and a second housing structure 320, which are arranged on both sides of a hinge structure 340 defining a folding axis A. In the embodiment, a mechanism referred to as a first side housing 343 may be arranged on a side surface of the first housing structure 310, and a mechanism referred to as a second side housing 353 may be arranged on a side surface of the second housing structure 320.

[0089] In an embodiment, the first side housing 343 may include: a first side surface 343a parallel to the folding axis (axis A); a side (eg, Figure 5 ) and perpendicular to the folding axis (axis A) of the second side surface 343b; connected to the other side of the first side surface 343a (eg, Figure 5 In an embodiment, the second side shell 353 may include: a fourth side surface 353a parallel to the folding axis (axis A); a side connected to the fourth side surface 353a (for example, Figure 5 a lower side of the fourth side surface 353a shown in FIG) and a fifth side surface 353b arranged adjacent to the second side surface 343b when the electronic device 10 is in the folded state; and a fifth side surface 353b connected to the other side of the fourth side surface 353a (eg, Figure 5 The electronic device 10 is in the folded state and is disposed adjacent to the third side surface 343c.

[0090] In an embodiment, each of the first side housing 343 and the second side housing 353 may include a conductive portion. For example, the first side housing 343 may include a metal material except for a portion of the second side surface 343b and a portion of the third side surface 343c. The second side housing 353 may include a metal material except for a portion of the fifth side surface 353b and a portion of the sixth side surface 353c.

[0091] In an embodiment, the second side surface 343b may include a plurality of conductive portions 531, 532, and 533 and at least one non-conductive portion 591 and 592 disposed between the plurality of conductive portions 531, 532, and 533. For example, the second side surface 343b may include: a first conductive portion 531, a non-conductive portion 591 and 592 disposed on one side of the first conductive portion 531 (for example, Figure 5 a second conductive portion 532 disposed on the left side of the first conductive portion 531 shown in FIG; and a second conductive portion 532 disposed on the other side of the first conductive portion 531 (eg, Figure 5The third side surface 343c may include: a first conductive portion 531; a second non-conductive portion 592 disposed between the first conductive portion 531 and the third conductive portion 533; and a third conductive portion 533 disposed on the right side of the first conductive portion 531 (for example, Figure 5 a second conductive portion 532 disposed on the left side of the first conductive portion 531 shown in FIG; and a second conductive portion 532 disposed on the other side of the first conductive portion 531 (eg, Figure 5 ); a third conductive portion 533 disposed on the right side of the first conductive portion 531 shown in the figure; a first non-conductive portion 591 disposed between the first conductive portion 531 and the second conductive portion 532; and a second non-conductive portion 592 disposed between the first conductive portion 531 and the third conductive portion 533. In an embodiment, the conductive portions 531, 532, and 533 of the second side surface 343b and the conductive portions 531, 532, and 533 of the third side surface 343c may have shapes that are symmetrical to each other around a horizontal axis that extends through the center of the folding axis (axis A) and is perpendicular to the folding axis (axis A) (e.g., an axis (axis A) that is parallel to the x-axis and extends across the center of the folding axis).

[0092] In an embodiment, the fifth side surface 353b may include a plurality of conductive portions 541, 542, and 543 and at least one non-conductive portion 551 and 552 disposed between the plurality of conductive portions 541, 542, and 543. For example, the fifth side surface 353b may include: a fourth conductive portion 541; a fourth conductive portion disposed on one side of the fourth conductive portion 541 (e.g., Figure 5 a fifth conductive portion 542 disposed on the left side of the fourth conductive portion 541 (eg, Figure 5 The sixth side surface 353c may include: a fourth conductive portion 541; a sixth conductive portion 543 disposed on the right side of the fourth conductive portion 541 (as shown in FIG); a third non-conductive portion 551 disposed between the fourth conductive portion 541 and the fifth conductive portion 542; and a fourth non-conductive portion 552 disposed between the fourth conductive portion 541 and the sixth conductive portion 543. Similarly, the sixth side surface 353c may include: a fourth conductive portion 541; and a fourth non-conductive portion 552 disposed on one side of the fourth conductive portion 541 (e.g., Figure 5 a fifth conductive portion 542 disposed on the left side of the fourth conductive portion 541 (eg, Figure 5a sixth conductive portion 543 disposed on the right side of the fourth conductive portion 541 shown in the figure; a third non-conductive portion 551 disposed between the fourth conductive portion 541 and the fifth conductive portion 542; and a fourth non-conductive portion 552 disposed between the fourth conductive portion 541 and the sixth conductive portion 543. In an embodiment, the conductive portions 541, 542, and 543 of the fifth side surface 353b and the conductive portions 541, 542, and 543 of the sixth side surface 353c may have shapes that are symmetrical to each other about a horizontal axis (axis B) extending through the center of the folding axis (axis A) and perpendicular to the folding axis (axis A) (e.g., an axis (axis A) parallel to the x-axis and extending across the center of the folding axis).

[0093] In an embodiment, each of the first conductive portion 531, the second conductive portion 532, and the third conductive portion 533 arranged on the second side surface 343b and / or the third side surface 343c may be a radiator (e.g., an antenna) that radiates radiation from a communication module (e.g., Figure 1 The communication module 190) outputs an RF signal.

[0094] In an embodiment, the RF signal output from the communication module 190 may include first to third RF signals. According to an embodiment, the first RF signal may be a signal associated with a low frequency band, and the second RF signal and / or the third RF signal may be a signal associated with an intermediate frequency band or a high frequency band. For example, the first RF signal may be a frequency for low frequency band or intermediate frequency band (a low frequency band of about 1 GHz or an intermediate frequency band of about 2.1 GHz) communication, and the second RF signal and / or the third RF signal may be a frequency for high frequency band or ultra-high frequency band (a high frequency band of about 2.7 GHz or an ultra-high frequency band of about 3.5 GHz) communication. According to some embodiments, the second RF signal may be a signal for Bluetooth or Wi-Fi communication in an ISM band of 2.4 GHz or 5 GHz.

[0095] In an embodiment, the first conductive portion 531 may be a first antenna ANT#1 for resonating a first RF signal output from the communication module 190; the second conductive portion 532 may be a second antenna ANT#2 for resonating a second RF signal output from the communication module 190; and the third conductive portion 533 may be a third antenna ANT#3 for resonating a third RF signal output from the communication module 190. In an embodiment, each of the first conductive portion 531, the second conductive portion 532, and the third conductive portion 533 may be formed as a planar inverted F antenna (PIFA) type antenna and may be electrically connected to at least one feed line 561 and at least one ground line 562 formed on a printed circuit board (not shown). Figure 5 and Figure 7In the example, the feeder wire may be marked as "F" and the ground wire may be marked as "G".

[0096] In an embodiment, the first side surface 343a may include a seventh conductive portion 571, and a portion 571a on either side of the seventh conductive portion 571 may function as an antenna. For example, a portion of one side of the seventh conductive portion 571 (eg, Figure 5 The lower side of the seventh conductive portion 571 shown in FIG. 34 may be connected to the second conductive portion 532 disposed on the second side surface 343 b and serve as the second antenna ANT#2. Similarly, a portion of the other side of the seventh conductive portion 571 (e.g., Figure 5 The upper side of the seventh conductive portion 571 shown in FIG. 34 ) may be connected to the second conductive portion 532 disposed on the third side surface 343 c and serve as a second antenna ANT# 2 .

[0097] In an embodiment, the other parts of the seventh conductive portion 571 (i.e., the middle part 571b) except the parts 571a located on both sides thereof do not function as antennas. For example, the parts 571a adjacent to the two edges of the seventh conductive portion 571 may be electrically connected to the ground line 562; and, with reference to the points 581 and 582 connected to the ground line 562, the seventh conductive portion 571 may be divided into a part 571a used as an antenna and a part 571b not used as an antenna. As another example, the seventh conductive portion 571 may be on one side of the seventh conductive portion 571 (e.g., Figure 5 The first point 581 is connected to the ground line 562 at an edge adjacent to the lower side of the seventh conductive portion 571 shown in FIG. 5 , and may be connected to the ground line 562 at a first point 581 adjacent to an edge of ... Figure 5 The seventh conductive portion 571 is connected to the ground line 562 at a second point 582 adjacent to an edge thereof (an upper side thereof shown in FIG); and a portion 571 b between the first point 581 and the second point 582 may not function as an antenna.

[0098] In an embodiment, when viewed from the front of the electronic device 10 (when viewed from above the display of the electronic device 10), the width of each of the first protruding portion 610 and the second protruding portion 620 may be substantially the same as the width w3 of the first side housing 343 or the width w4 of the second side housing 353. For example, when viewed from the front of the electronic device 10, the display 200, the first side housing 343 surrounding a portion of the display 200, and the second side housing 353 surrounding another portion of the display 200 may be arranged on the front surface of the electronic device 10; the width w3 of the first side housing 343 and the width w4 of the second side housing 353 may be constant.

[0099] Figure 6 is shown in a folded state Figure 5FIG. 1 is a diagram of an electronic device shown in FIG.

[0100] Reference Figure 6 In an embodiment, the electronic device 10 may include a first shell structure 310, a second shell structure 320 and a hinge structure 340; the first shell structure 310 includes a first surface 341, a second surface 342 facing in a direction opposite to the first surface 341, and a first side shell 343 surrounding at least a portion of a first space between the first surface 341 and the second surface 342; the second shell structure 320 includes a third surface 351 facing the first surface 341 of the first shell structure 310 when the electronic device 10 is in a folded state, a fourth surface 352 facing in a direction opposite to the third surface 351, and a second side shell 353 surrounding at least a portion of the second space between the third surface 351 and the fourth surface 352; the hinge structure 340 is arranged between the first shell structure 310 and the second shell structure 320 and defines a folding axis (axis A).

[0101] In an embodiment, the first protrusion 610 may be formed on a corner portion of the first surface 341 that is parallel to the folding axis (axis A), and the second protrusion 620 may be formed on a corner portion of the third surface 351 that is parallel to the folding axis (axis A) so as to contact the first protrusion 610 when the electronic device 10 is in the folded state. For example, the first protrusion 610 may be formed to contact the portion 571b (e.g., the portion 571b not serving as an antenna) of the seventh conductive portion 571 disposed on the first side surface 343a. Figure 5 As another example, the first protruding portion 610 may be arranged to overlap with the portion 571b of the seventh conductive portion 571 when viewed from the front of the electronic device 10 (when viewed from above the display of the electronic device 10), and the overlapping portion of the seventh conductive portion 571 may be the portion 571b that does not function as an antenna. Similarly, the second protruding portion 620 may be formed to overlap with the conductive portion 572 (e.g., Figure 5 As another example, the second protruding portion 620 may be arranged to overlap a portion of the conductive portion 572 of the fourth side surface 353a when viewed from the front of the electronic device 10 (when viewed from above the display of the electronic device 10).

[0102] In an embodiment, when the electronic device 10 is in the folded state, the first protrusion 610 and the second protrusion 620 may contact each other, so that the second side surface 343b and the fifth side surface 353b are spaced apart from each other, and the third side surface 343c and the sixth side surface 353c are spaced apart from each other. In an embodiment, when the electronic device 10 is in the folded state, the first protrusion 610 and the second protrusion 620 may contact each other, so that a gap G is formed between the second side surface 343b and the fifth side surface 353b, and similarly, a gap is formed between the third side surface 343c and the sixth side surface 353c.

[0103] In an embodiment, each of the first protrusion 610 and the second protrusion 620 may be made of a metal material. For example, each of the first protrusion 610 and the second protrusion 620 may include a conductive portion. In an embodiment, the conductive portion of each of the first protrusion 610 and the second protrusion 620 may be made of the same material as the conductive portion of each of the first and second side housings 343 and 353.

[0104] In an embodiment, each of the first protrusion 610 and the second protrusion 620 may include a non-metallic material. For example, each of the first protrusion 610 and the second protrusion 620 may include a non-conductive portion. In an embodiment, the non-conductive portion of each of the first protrusion 610 and the second protrusion 620 may be made of the same material as the non-conductive portion of each of the first and second side housings 343 and 353. For example, at least a portion of the first and second protrusions 610 and 620 may be made of a non-conductive injection molding material.

[0105] In an embodiment, the first protrusion 610 and the second protrusion 620 may have mutually symmetrical shapes about the folding axis (axis A). In various embodiments, the first protrusion 610 and the second protrusion 620 do not need to have mutually symmetrical shapes, and various changes may be made to the length, shape, width, thickness, or structure of the first protrusion 610 and the second protrusion 620.

[0106] In an embodiment, when the electronic device 10 is in the folded state, the first protruding portion 610 and the second protruding portion 620 may contact each other so that the second side surface 343b and the fifth side surface 353b (or the third side surface 343c and the sixth side surface 353c) are spaced apart from each other by, for example, but not limited to, 3-5 mm. For example, when the electronic device 10 is in the folded state, the first protruding portion 610 and the second protruding portion 620 may contact each other so that a gap corresponding to, for example, a gap of at least 3-5 mm is formed between the second side surface 343b and the fifth side surface 353b (or between the third side surface 343c and the sixth side surface 353c).

[0107] The electronic device 10 according to the embodiment may be configured such that when the electronic device 10 is in the folded state, the second side surface 343b and the fifth side surface 353b are spaced apart from each other, thereby reducing the degradation of the performance of the antenna arranged on the second side surface 343b (or the third side surface 343c). The electronic device 10 according to the embodiment may be configured such that the second side surface 343b and the fifth side surface 353b (or the third side surface 343c and the sixth side surface 353c) are spaced apart from each other at a distance of, for example, 3-5 mm, thereby reducing the degradation of the performance of the antenna arranged on the second side surface 343b (or the third side surface 343c). For example, the electronic device 10 according to the embodiment may be configured such that the antenna performance in the flat state is the same as the antenna performance in the folded state.

[0108] According to various embodiments, a foldable electronic device (eg, Figure 7 The electronic device 700 may include: a first surface (eg, Figure 2 a first surface 341 facing in a direction opposite to the first surface 341 (eg, Figure 2 and a second surface 342 of the first surface 341 and the second surface 342), and a first side shell (eg, Figure 2 The first side housing 343) of the first housing (eg, Figure 2 comprising a third surface (eg, a first surface 341 facing the first housing structure 310) when the foldable electronic device 700 is in a folded state; and Figure 2 a third surface 351 facing in a direction opposite to the third surface 351, and a fourth surface (eg, Figure 2 351 and the fourth surface 352), and a second side shell (eg, Figure 2 The second side housing 353) of the second housing (eg, Figure 2a hinge structure (eg, a hinge structure) disposed between the first housing structure 310 and the second housing structure 320 to form a folding axis (axis A) Figure 4 The flexible display (eg, Figure 2 and a communication circuit (eg, Figure 1 The communication module 190 of the first side housing 343 and the second side housing 353 may each include a conductive portion. At least a portion of the conductive portion of the first side housing 343 may be electrically connected to the communication circuit. Part of the corner portion of the first surface 341 may be made of a low permittivity material (e.g., Figure 7The first side housing 343 may include a first side surface 343a parallel to the folding axis (axis A), a second side surface 343b connected to one side of the first side surface 343a and perpendicular to the folding axis (axis A), and a third side surface 343c connected to the other side of the first side surface 343a and parallel to the second side surface 343b. The second side housing 353 may include a fourth side surface 353a parallel to the folding axis (axis A), a fifth side surface 353b connected to one side of the fourth side surface 353a and disposed adjacent to the second side surface 343b when the foldable electronic device 700 is in the folded state, and a sixth side surface 353c connected to the other side of the fourth side surface 353a and disposed adjacent to the third side surface 343c when the foldable electronic device 700 is in the folded state. At least some of the conductive portions disposed on the second and third side surfaces 343b, 343c may be electrically connected to the communication circuit. Corner portions of the first surface 341 adjacent to the second and third side surfaces 343b, 343c may be made of a low-permittivity material 710. Corner portions of the third surface 351 adjacent to the fifth and sixth side surfaces 353b, 353c may also be made of a low-permittivity material 710. Corner portions of the first surface 341 adjacent to the first side surface 343a may include a first protrusion 610. The corner portion of the third surface 351 adjacent to the fourth side surface 353a may include a second protrusion 620, which contacts the first protrusion 610 when the foldable electronic device 700 is in the folded state. When the foldable electronic device 700 is in the folded state, the first protrusion 610 and the second protrusion 620 may contact each other, so that the second side surface 343b and the fifth side surface 353b are spaced apart from each other, and the third side surface 343c and the sixth side surface 353c are spaced apart from each other. Each of the first protrusion 610 and the second protrusion 620 may include a conductive portion. Each of the first protrusion 610 and the second protrusion 620 may include a non-conductive portion. The first protrusion 610 and the second protrusion 620 may have shapes that are symmetrical with respect to the folding axis (axis A). When the foldable electronic device 700 is in the folded state, the second side surface 343b and the fifth side surface 353b may be spaced apart from each other by 3-5 mm. The foldable electronic device may further include: a processor arranged in the first space and / or the second space and operatively connected to the communication circuit; a memory arranged in the first space and / or the second space and operatively connected to the processor, the memory being configured to store a plurality of applications.The memory may store instructions that, when executed, cause the processor to receive a voice request through the communication circuit when the foldable electronic device 700 is in a folded state, output a notification in response to receiving the voice request, and provide a communication function in response to receiving a specified input from the user while the foldable electronic device 700 remains in the folded state.

[0109] Figure 7 is a diagram illustrating a first side case and a second side case of an example electronic device in a flat state according to another embodiment. Figure 8 is a diagram illustrating an example electronic device in a folded state according to an embodiment.

[0110] In addition to the components described below, Figure 7 and Figure 8 The electronic device 700 shown in FIG. Figure 5 and Figure 6 The electronic devices 10 shown in FIG. 1 are substantially the same or similar. Figure 7 and Figure 8 Zhongyu Figure 5 and Figure 6 The same elements of the electronic device 10 shown in FIG. 1 are given the same reference numerals, and reference will not be repeated here. Figure 5 and Figure 6 The same components are manufactured as described.

[0111] Reference Figure 7 and Figure 8 According to another embodiment, the electronic device 700 may include a low-permittivity material 710 formed in an area adjacent to or overlapping a portion of the foldable housing 300 (the portion serving as an antenna). For example, the low-permittivity materials 711, 721, and 722 may be formed on portions of the corner portions of the first surface 341 of the first housing structure 310, and the low-permittivity materials 712, 731, and 732 may be formed on portions of the corner portions of the third surface 351 of the second housing structure 320.

[0112] For example, the first low-permittivity material 711 may be formed on a portion of the corners of the first surface 341, and the first low-permittivity material 711 may be arranged to overlap with the first to third conductive portions 531, 532, and 533, which function as antennas, of the first side housing 343. Similarly, the second low-permittivity material 712 may be formed on a portion of the corners of the third surface 351, and the second low-permittivity material 712 may be arranged to face the first low-permittivity material 711 of the first surface 341 when the electronic device 700 is in the folded state.

[0113] As another example, the first housing structure 310 may have a first low-permittivity material 711 formed on the surface of the corner portion of the first surface 341, which is adjacent to the second side surface 343b and the third side surface 343c. Similarly, the second housing structure 320 may have a second low-permittivity material 712 formed on the surface of the corner portion of the third surface 351, which is adjacent to the fifth side surface 353b and the sixth side surface 353c.

[0114] In an embodiment, the first low-permittivity material 711 and the second low-permittivity material 712 may be arranged symmetrically with respect to the folding axis (axis A). In an embodiment, when the electronic device 700 is in the folded state, the first low-permittivity material 711 and the second low-permittivity material 712 may face or contact each other.

[0115] Low permittivity materials can be as follows. Permittivity can be a physical unit that indicates the effect of a medium on an electric field. The higher the permittivity of a medium, the lower the electric field strength acting on the medium. To define permittivity, specific permittivity can be used, which represents the comparison between the permittivity in a vacuum state and the permittivity of a specific material. For example, the specific permittivity of a material can be defined by the following equation 1:

[0116] [Equation 1]

[0117]

[0118] (ε r = specific permittivity, ε = permittivity of the material, ε o = Permittivity in vacuum)

[0119] Examples of specific permittivity of materials are given in the following Table 1. In an embodiment, a low permittivity material may be defined as a material with a specific permittivity less than 10, taking antenna performance into consideration.

[0120] Table 1

[0121] Material <![CDATA[Relative permittivity ε r > vacuum 1 Air 1.0006 paraffin 2.0-2.3 Paper 1.2-2.6 quartz 8.3 Ordinary injection molding (PC) 1-2 Injection molding + rigid reinforcement (PC + GF, etc.) 3-4 Glass 6-10 water 80.7 Metal ∞

[0122] The electronic device 700 according to the embodiment may have a first low-permittivity material 711 formed on a portion of a corner portion of the first surface 341 adjacent to the antenna, and may have a second low-permittivity material 712 formed in a region of the third surface 351 of the second housing structure 320 (which faces the first low-permittivity material 711 when the electronic device 700 is in the folded state), thereby reducing the coupling effect between the energy radiated from the antenna arranged on the second side surface 343b and the conductive portion of the fifth side surface 353b, and thus improving the radiation performance of the antenna arranged on the second side surface 343b. Similarly, the electronic device 700 according to the embodiment may reduce the coupling effect between the energy radiated from the antenna arranged on the third side surface 343c and the conductive portion of the sixth side surface 353c when the electronic device 700 is in the folded state, thereby improving the radiation performance of the antenna arranged on the third side surface 343c.

[0123] In an embodiment, since a portion of the seventh conductive portion 571 (eg, Figure 5 Since the upper and lower sides of the seventh conductive portion 571 shown in FIG. 5 are used as antennas, the third low-permittivity material 721 can be formed on the corner portion of the first surface 341, overlapping with a portion of the first side surface 343 a used as the antenna. Similarly, the fourth low-permittivity material 731 can be formed in the region of the corner portion of the third surface 351, overlapping with a portion of the fourth side surface 353 a, and facing the third low-permittivity material 721 when the electronic device 700 is in the folded state.

[0124] In an embodiment, a portion of the boundary portion between the first housing 310 and the hinge structure 340 may function as an antenna, and the fifth low-permittivity material 722 may be formed on the portion functioning as the antenna. Similarly, a portion of the boundary portion between the second housing structure 320 and the hinge structure 340 may function as an antenna, and the sixth low-permittivity material 732 may be formed on the portion functioning as the antenna.

[0125] In an embodiment, the low permittivity material may include an injection molded material. In an embodiment, the low permittivity material may be made of the same material as the non-conductive portions formed on the first housing structure 310 and the second housing structure 320. For example, the low permittivity material and the non-conductive portions may be made of an injection molded material.

[0126] Figure 9 is a diagram illustrating an example electronic device in a folded state according to an embodiment.

[0127] In addition to the components described below, Figure 9 The electronic device 900 shown in FIG. Figure 7 and Figure 8The electronic device 700 shown in FIG. 7 is substantially the same or similar. Figure 9 Zhongyu Figure 7 and Figure 8 The same elements of the electronic device 700 shown in FIG. 7 are given the same reference numerals, and reference will not be repeated here. Figure 7 and Figure 8 The same components are manufactured as described.

[0128] Reference Figure 9 According to another embodiment, the electronic device 900 may have a first protruding portion 610 formed on a corner portion of the first surface 341 (which is parallel to the folding axis (axis A)), and a second protruding portion 620 formed on a corner portion of the third surface 351 (which is parallel to the folding axis (axis A) so as to contact the first protruding portion 610 when the electronic device 10 is in the folded state. For example, the first protruding portion 610 may be formed to contact the portion 571b (e.g., the portion not used as an antenna) of the seventh conductive portion 571 arranged on the first side surface 343a. Figure 5 As another example, the first protruding portion 610 may be arranged to overlap with the portion 571b of the seventh conductive portion 571 when viewed from the front of the electronic device 10 (when viewed from above the display of the electronic device 10), and the overlapping portion of the seventh conductive portion 571 may be the portion 571b that does not function as an antenna. Similarly, the second protruding portion 620 may be formed to overlap with the conductive portion 572 (e.g., Figure 5 As another example, the second protruding portion 620 may be arranged to overlap a portion of the conductive portion 572 of the fourth side surface 353a when viewed from the front of the electronic device 10 (when viewed from above the display of the electronic device 10).

[0129] Figure 10 is a diagram illustrating an example electronic device in a flat state according to another embodiment. Figure 11 is shown in a folded state Figure 10 FIG. 1 is a diagram of an electronic device shown in FIG.

[0130] In addition to the components described below, Figure 10 and Figure 11 The electronic device 1000 shown in FIG. Figure 7 and Figure 8 The electronic device 700 shown in FIG. 7 is substantially the same as or similar to the electronic device 700 shown in FIG. Figure 10 and Figure 11 In, only Figure 7 and Figure 8 Elements that differ from the elements of the electronic device 700 shown in FIG. 7 are given reference numerals.

[0131] Reference Figure 10 and Figure 11 , the electronic device 1000 according to another embodiment may have a low permittivity material formed on at least a portion of the foldable housing 300, and the low permittivity material may be formed to overlap with a conductive portion serving as an antenna. Figure 10 and Figure 11 In the case of another embodiment of the electronic device 1000, with Figure 7 and Figure 8 Unlike the electronic device 700 shown in FIG, the length, shape, width, thickness, or structure of the low-permittivity material may be variously modified. For example, the first low-permittivity material 711 may be formed on a portion of the corners of the first surface 341, and the first low-permittivity material 711 may be arranged to overlap with the conductive portion of the first side housing 343, which serves as an antenna (e.g., Figure 7 Similarly, the second low permittivity material 712 may be formed on a corner of the third surface 351, and the second low permittivity material 712 may be arranged to face the first low permittivity material 711 of the first surface 341 when the electronic device 700 is in the folded state.

[0132] In the illustrated embodiment, since a portion of the seventh conductive portion 571 (eg, Figure 5 Since the upper and lower sides of the seventh conductive portion 571 shown in FIG. 5 are used as antennas, the third low-permittivity material 1021 can be formed on the corner portion of the first surface 341, overlapping with a portion of the first side surface 343 a used as the antenna. Similarly, the fourth low-permittivity material 1031 can be formed in the region of the corner portion of the third surface 351, overlapping with a portion of the fourth side surface 353 a, and facing the third low-permittivity material 1021 when the electronic device 700 is in the folded state.

[0133] In the illustrated embodiment, the shape, width, thickness, or structure of each of the third low-permittivity material 1021 and the fourth low-permittivity material 1031 may not be constant. For example, the third low-permittivity material 1021 may be formed on the first side surface 343a and the front surface adjacent to the first side surface 343a of the electronic device 1000 so that its width or thickness is not constant. Similarly, the fourth low-permittivity material 1031 may be formed on the third side surface 343c and the front surface adjacent to the third side surface 343c of the electronic device 1000 so that its width or thickness is not constant.

[0134] In various embodiments, various modifications may be made to the arrangement, shape, width, thickness, or structure of the low-permittivity material in addition to the examples shown.

[0135] Figure 12 is a graph illustrating measured antenna performance of an electronic device according to various embodiments.

[0136] exist Figure 12 In the figure, the x-axis can represent the frequency and the y-axis can represent the antenna radiation efficiency.

[0137] exist Figure 12 , reference numeral 1201 denotes antenna performance measured when the foldable electronic device according to the comparative example is in a folded state, and reference numeral 1202 denotes antenna performance measured when the foldable electronic device according to the comparative example is in a flat state.

[0138] The experimental conditions used to test a foldable electronic device according to a comparative example are as follows. The foldable electronic device according to the comparative example is designed so that the majority of its foldable housing is made of metal, and a portion of the foldable housing serves as the antenna. As shown in the figure, it can be understood that because the housing adjacent to the antenna of the foldable electronic device according to the comparative example is made of metal, the antenna performance in the folded state is weaker than that in the flat state.

[0139] exist Figure 12 , reference numerals 1203 and 1204 refer to antenna performance measured when the electronic device according to various embodiments is in a folded state. Reference numeral 1203 refers to antenna performance measured under a condition where the first housing structure and the second housing structure are spaced apart from each other, for example, by an interval of approximately 1 mm, and reference numeral 1204 refers to antenna performance measured under a condition where the first housing structure and the second housing structure are spaced apart from each other, for example, by an interval of approximately 2 mm.

[0140] As can be understood from reference numeral 1204 in the graph, when the electronic device according to various embodiments is in the folded state, the first housing structure and the second housing structure are spaced apart from each other by, for example, approximately 2 mm, thereby maintaining antenna performance comparable to that in the flattened state. It should be noted that in example embodiments, the spacing between the first housing structure and the second housing structure (i.e., the spacing between the second side surface and the fifth side surface (or between the third side surface and the sixth side surface)) can preferably be, for example, in the range of approximately 3-5 mm.

[0141] Figure 13 is a flowchart illustrating an example method for driving the electronic device 10 according to an embodiment.

[0142] In operation 1310, when the foldable electronic device 10 is in the folded state, the electronic device 10 according to an embodiment may receive an external signal through the communication circuit. For example, the electronic device 10 may receive a voice request while the foldable electronic device 10 remains folded.

[0143] In operation 1320, the electronic device 10 according to an embodiment may output a notification in response to receiving an external signal. For example, the electronic device 10 may output a specified notification in response to receiving a voice request. The specified notification may include, for example, but not limited to, a ringtone, a voice notification, and / or a vibration.

[0144] In operation 1330, the electronic device 10 according to an embodiment may provide a communication function in response to receiving a designated input from a user while the foldable electronic device 10 remains folded. The designated input may include, for example, but not limited to, a designated touch gesture, an input via a designated physical key, or a designated voice command. The electronic device 10 according to an embodiment may provide a communication function while remaining in a folded state, and since antenna performance is not degraded even when the electronic device 10 is in a folded state, reliability may be improved while providing the communication function.

[0145] Figure 14 is a diagram illustrating an example cross section of a portion of each of the first housing structure and the second housing structure according to the embodiment. Figure 15 is a diagram showing an example cross section of a portion of each of the first housing structure and the second housing structure when the electronic device according to the embodiment is in the folded state. Figure 14 and Figure 15 It can be shown Figure 7 and Figure 8 A portion of each of the first housing structure 310 and the second housing structure 320 is shown in FIG.

[0146] Reference Figure 14 , according to an embodiment (e.g., Figure 2 The side surface of the first housing structure 1410 of the first housing structure 310 may include a conductive portion 1411 and a non-conductive portion 1412. For example, a portion of the conductive portion 1411 of the first housing structure 1410 may function as an antenna, and the non-conductive portion 1412 may be formed in a region overlapping the conductive portion 1411 functioning as the antenna.

[0147] According to an embodiment, the non-conductive portion 1412 may be located between the conductive portion 1411 (e.g., when Figure 14 1411 when viewed from the upper side of the conductive portion 1411) so that when viewed from the display 1430 (eg, Figure 2Similarly, the side surface of the second housing structure 1420 (eg, Figure 2 The second housing structure 320 may include a conductive portion 1421 and a non-conductive portion 1422. According to an embodiment, the conductive portion 1421 and the non-conductive portion 1422 of the second housing structure 1420 may be formed relative to the folding axis (axis A, for example, Figure 5 The folding axis (A) is symmetrical with the conductive portion 1411 and the non-conductive portion 1412 of the first shell structure 1410.

[0148] In the example shown, the non-conductive portion 1412 of the first housing structure 1410 and the non-conductive portion 1422 of the second housing structure 1410 may be Figure 7 and Figure 8 The low permittivity material 710 is shown in FIG.

[0149] Reference Figure 15 When the electronic device 1400 is in the folded state, the non-conductive portion 1412 of the first housing structure 1410 and the non-conductive portion 1422 of the second housing structure 1420 according to an embodiment may face or contact each other. The electronic device 1400 according to various embodiments can reduce degradation in antenna performance by spacing the conductive portion 1411 of the first housing structure 1410 and the conductive portion 1421 of the second housing structure 1420 apart from each other when the electronic device 1400 is in the folded state. The electronic device 1400 according to various embodiments can reduce the phenomenon of energy radiated from the conductive portion 1411 of the first housing structure 1410 coupling with the conductive portion 1421 of the second housing structure 1420.

[0150] Figure 16 is an exploded perspective view of an exemplary electronic device including a frame according to various embodiments.

[0151] According to various embodiments, Figure 16 The electronic device 1600 (eg, Figure 1 The electronic device 101) may be at least partially similar to Figures 2 to 11 The electronic device shown in .

[0152] Reference Figure 16 , the electronic device 1600 according to various embodiments may include: a foldable housing 1610 or 1620 (eg, Figure 3 The foldable housing 300) is at least partially hinged by using a hinge structure 1615 (e.g., Figure 4 The hinge structure 340) is folded; the flexible display 1630 (for example, Figure 2a display 200) which is loaded (e.g., set) on the foldable housing 1610 or 1620 so that at least a portion thereof is configured to be folded; a frame 1640 which is loaded (e.g., set) on the boundary portions 1631 and 1632 of the flexible display 1630 or on at least a portion of the boundary portions and is connected to the foldable housing 1610 or 1620.

[0153] According to an embodiment, the foldable housing 1610 or 1620 may include a first housing structure 1610 (eg, Figure 2 ) or the second housing structure 1620 (e.g., Figure 2 The first housing structure 1610 is provided on one side of the hinge structure 1615 relative to the hinge structure 1615, and the second housing structure 1620 is provided on the other side of the hinge structure 1615.

[0154] According to an embodiment, the foldable housing 1610 or 1620 may include a first side member 1611 (eg, Figure 2 ) and the second side member 1621 (eg, Figure 2 The second side shell 353 of the present invention is provided, wherein the first side member 1611 surrounds a first space set on one side of the hinge structure 1615, and the second side member 1621 surrounds a second space set on the other side of the hinge structure 1615.

[0155] The entire boundary portion of the front surface of the foldable case 1610 or 1620 of the electronic device 1600 according to various embodiments may include a low permittivity material (eg, Figure 7 For example, the electronic device 1600 according to various embodiments may include a low permittivity material 712, 731, and 732 provided on a first surface (eg, Figure 2 The first surface 341) and the third surface (eg, Figure 2 The first and second surfaces are configured to face each other in the folded state of the foldable housing 1610 or 1620, and the frame 1640 may include a low-permittivity material. When the flexible display 1630 is viewed from above, the electronic device 1600 according to an embodiment may have a first frame 1641 or a second frame 1642 provided on a boundary portion of the flexible display 1630 in the unfolded state of the foldable housing 1610 or 1620. According to an embodiment, the frame 1640 may be Figure 14 and Figure 15The non-conductive portion 1412 and the non-conductive portion 1422 shown in FIGURE 14 are substantially the same or similar components. In various exemplary non-limiting commercial embodiments, the frame 1640 can include, for example, but not limited to, various decorative elements for aesthetic purposes.

[0156] According to an embodiment, the frame 1640 may include a first frame 1641 overlapping the first case structure 1610 or a second frame 1642 overlapping the second case structure 1620 .

[0157] According to an embodiment, in the folded state of the foldable housing 1610 or 1620 , the first frame 1641 and the second frame 1642 may contact or approach each other such that a distance therebetween is equal to or less than a designated distance.

[0158] According to an embodiment, the first frame 1641 can be connected to the first side member 1611 while covering the boundary portion of the flexible display 1630, so that the first boundary portion 1631 of the flexible display 1630 set on the first shell structure 1610 (for example, its first non-display area) is not exposed to the outside.

[0159] According to an embodiment, the second frame 1642 can be connected to the second side member 1621 while covering another boundary portion of the flexible display 1630, so that the second boundary portion 1632 of the flexible display 1630 set on the second shell structure 1620 (for example, its second non-display area) is not exposed to the outside.

[0160] According to an embodiment, at least one sensor may be provided on the outer circumference of the flexible display 1630, and a third frame 1643 including a low permittivity material may be provided in a sensor region (eg, Figure 2 According to an embodiment, the third frame 1643 may be formed integrally with the first frame 1641.

[0161] According to an embodiment, the frame 1640 may include a low permittivity material having a specific permittivity less than 10. According to an embodiment, the frame 1640 may include, for example but not limited to, an injection molding material.

[0162] According to an embodiment, the frame 1640 may include a polymer material or a metal material and may be connected to the corresponding housing structure 1610 or 1620 using at least one of bonding, wrapping, thermal attachment, or structural coupling.

[0163] According to various exemplary embodiments, Figures 2 to 11 Unlike the example shown in , the electronic device can be operated in a folded-out manner. According to various embodiments, the second surface of the electronic device (e.g., Figure 2The second surface 342) and the fourth surface (eg, Figure 2 The fourth surface 352 of the foldable housing may face each other in the folded state of the foldable housing. The electronic device according to various exemplary embodiments may have a low permittivity material including a specific permittivity of less than 10 and respectively disposed on the second surface (for example, Figure 2 on at least a portion of the boundary portion of the second surface 342) and the fourth surface (e.g., Figure 2 The electronic device configured as above can reduce the degradation of antenna performance when the foldable housing is in the folded state.

[0164] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0165] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0166] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, depending on an embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0167] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions can include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0168] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0169] According to various embodiments, each component (for example, module or program) in the above-mentioned components can include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components can be omitted, or one or more other components can be added. Alternatively or additionally, multiple components (for example, module or program) can be integrated into a single component. In this case, according to various embodiments, the integrated component can still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by module, program or another component can be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations can be run or omitted in different orders, or one or more other operations can be added.

Claims

1. An electronic device, comprising: a foldable housing comprising a first housing, a second housing, and a hinge connecting the first housing and the second housing to each other, wherein the first housing and the second housing face each other in a folded state; a flexible display, the flexible display being arranged on the first shell and the second shell; a first non-conductive member connected to the first side member of the first housing and covering a periphery of a first display portion corresponding to the first housing; as well as a second non-conductive member connected to the second side member of the second housing and covering a periphery of a second display portion corresponding to the second housing, wherein the second non-conductive member is arranged to face the first non-conductive member in a folded state of the foldable housing; wherein the first side member comprises a plurality of first conductive portions, the plurality of first conductive portions being electrically connected to the communication circuit of the electronic device; The second side member includes a plurality of second conductive portions disposed adjacent to the plurality of first conductive portions in a folded state of the foldable housing, and The plurality of first conductive portions and the plurality of second conductive portions are spaced apart from each other by at least the first non-conductive member and the second non-conductive member in a folded state of the foldable housing.

2. The electronic device according to claim 1, in, The first side member includes a first surface, a second surface, and a third surface, wherein the second surface extends from one end of the first surface and is perpendicular to the first surface, and the third surface extends from the other end of the first surface and is parallel to the second surface. The plurality of first conductive portions include a first metal portion disposed on the first surface, a second metal portion disposed on the second surface, and a third metal portion disposed on the third surface.

3. The electronic device according to claim 2, in, The second side member includes a fourth surface, a fifth surface, and a sixth surface, wherein the fourth surface is parallel to the first surface, the fifth surface extends from one end of the fourth surface and is perpendicular to the fourth surface, and the sixth surface extends from the other end of the fourth surface and is parallel to the fifth surface; The plurality of second conductive portions include: a fourth metal portion disposed on the fourth surface and disposed adjacent to at least a portion of the first metal portion in a folded state of the foldable housing, a fifth metal portion disposed on the fifth surface and disposed adjacent to at least a portion of the second metal portion in a folded state of the foldable housing, and A sixth metal portion is disposed on the sixth surface and is disposed adjacent to at least a portion of the third metal portion in a folded state of the foldable housing.

4. The electronic device according to claim 2, in, The first metal portion is a first antenna operating at a first specified frequency, The second metal portion is a second antenna operating at a second specified frequency, The third metal portion is a third antenna operating at a third designated frequency.

5. The electronic device according to claim 4, in, The first metal portion is connected to a first feeder and a first ground of a printed circuit board disposed in the foldable housing, The second metal portion is connected to a second feeder and a second ground of the printed circuit board, and The third metal portion is connected to a third feed line and a third ground of the printed circuit board.

6. The electronic device according to claim 4, in, The plurality of first conductive portions further include a seventh metal portion disposed on the second surface and connected to the first metal portion disposed on the first surface. A non-conductive portion is provided between the seventh metal portion and the second metal portion in the second surface.

7. The electronic device according to claim 1, in, The first non-conductive member includes at least one first protruding portion, and The second non-conductive member includes at least one second protruding portion disposed adjacent to the first protruding portion in the folded state of the foldable housing.

8. The electronic device according to claim 1, in, Each of the first non-conductive member and the second non-conductive member includes an injection molded material.

9. The electronic device according to claim 1, in, Each of the first non-conductive member and the second non-conductive member includes a material having a specific permittivity lower than 10.

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