Molding method of light-emitting panel, light-emitting panel and display device

Abstract

This invention relates to a method for forming a light-emitting panel, the light-emitting panel itself, and a display device. The method for forming the light-emitting panel includes: forming a conductive adhesive layer on a driving backplate, the conductive adhesive layer including a first adhesive layer body stacked with the driving backplate and conductive particles disposed within the first adhesive layer body; reducing the thickness of the first adhesive layer body to form a second adhesive layer body, such that the conductive particles at least partially protrude from the second adhesive layer body on the side opposite to the driving backplate; transferring a micro-light-emitting device to the side of the second adhesive layer body opposite to the driving backplate and making the electrodes of the micro-light-emitting device contact the conductive particles; pressing the micro-light-emitting device so that the electrodes of the micro-light-emitting device are electrically connected to the driving backplate through the conductive particles and a gap is formed between the epitaxial layer of the micro-light-emitting device and the second adhesive layer body. This invention can reduce damage to the epitaxial layer of the micro-light-emitting device and / or the driving backplate, and improve the panel integration yield.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a method for forming a light-emitting panel, the light-emitting panel, and a display device. Background Technology

[0002] Micro LED technology refers to a high-density integrated array of tiny LEDs on a substrate. With its extremely high luminous efficiency and extremely long display life, micro LED is expected to lead the next generation of display technology.

[0003] Currently, micro-light-emitting devices (LEDs) typically need to be transferred from other substrates to a corresponding driving backplane and connected to the driving backplane to form a light-emitting panel. Therefore, the selection of materials on the driving backplane for connecting with the LEDs is crucial. Alloy welding has side effects due to the high-temperature process, making conductive adhesive a better choice. However, in existing LED panel forming methods, when the LEDs are transferred to the driving backplane, their non-electrode areas are pressed against the conductive adhesive layer, preventing the adhesive from flowing out quickly. Consequently, when the LEDs are electrically connected to the driving backplane, there is high pressure, which can lead to damage to the epitaxial layer of the LEDs and / or the driving backplane, resulting in low panel integration yield. Summary of the Invention

[0004] This invention provides a method for forming a light-emitting panel, a light-emitting panel, and a display device. The method for forming the light-emitting panel can meet the requirements for the transfer of micro-light-emitting devices and electrical connection between them and the driving backplate, and can avoid contact between the epitaxial layer of the micro-light-emitting device and the adhesive layer body, thereby reducing damage to the epitaxial layer of the micro-light-emitting device and / or the driving backplate and improving the screen integration yield.

[0005] On one hand, according to an embodiment of the present invention, a method for forming a light-emitting panel is provided, comprising:

[0006] A conductive adhesive layer is formed on the drive backplate. The conductive adhesive layer includes a first adhesive layer body that is stacked with the drive backplate and conductive particles disposed within the first adhesive layer body.

[0007] The thickness of the first adhesive layer body is reduced to form the second adhesive layer body, so that the conductive particles at least partially protrude from the second adhesive layer body on the side away from the drive backplate.

[0008] The micro-light-emitting device is transferred to the side of the second adhesive layer body away from the driving backplate, and the electrodes of the micro-light-emitting device are brought into contact with the conductive particles.

[0009] The micro-light-emitting device is pressed so that the electrodes of the micro-light-emitting device are electrically connected to the driving backplate through conductive particles and a gap is formed between the epitaxial layer of the micro-light-emitting device and the second adhesive layer body.

[0010] According to one aspect of the present invention, the step of reducing the thickness of a first adhesive layer body to form a second adhesive layer body, such that conductive particles at least partially protrude from the second adhesive layer body on the side opposite to the drive backplate, includes:

[0011] The entire drive backplate with the conductive adhesive layer is placed in the plasma processing equipment.

[0012] Under the first preset conditions, the thickness of the first adhesive layer body is reduced by plasma bombardment process to form the second adhesive layer body, so that the thickness of the second adhesive layer body is greater than or equal to 0.3 μm and less than 1 μm, and the conductive particles at least partially protrude from the second adhesive layer body on the side away from the driving backplate.

[0013] According to one aspect of the present invention, the first preset condition includes at least one of the following: a first temperature, a vacuum level, a plasma flow rate, and a plasma bombardment power of the environment in which the drive backplate on which the conductive adhesive layer is formed.

[0014] According to one aspect of the present invention, the first preset condition includes a first temperature, wherein the value of the first temperature is greater than 60°C to 130°C.

[0015] And / or, the first preset condition includes a vacuum degree, the value of which ranges from 100 mTorr to 1 Torr;

[0016] And / or, the first preset condition includes plasma flow rate, the value of which is in the range of 200SCCM to 400SCCM;

[0017] And / or, the first preset condition includes plasma bombardment power, the value of which ranges from 400W to 900W.

[0018] According to one aspect of the present invention, the step of pressing the micro-light-emitting device includes:

[0019] Pre-pressing the micro-light-emitting device ensures that the electrodes of the micro-light-emitting device come into contact with and are positioned by the conductive particles;

[0020] Under the second preset conditions, the pre-pressed micro-light-emitting device is subjected to pressure so that the second adhesive layer melts and the conductive particles in contact with the electrode deform and come into contact with the driving backplate.

[0021] According to one aspect of the present invention, the second preset condition includes at least one of the second temperature of the environment in which the driving backplate, the second adhesive layer body, and the micro-light-emitting device as a whole are located, and the pressure exerted on the micro-light-emitting device.

[0022] According to one aspect of the present invention, the second preset condition includes a second temperature at which the driving backplate, the second adhesive layer body, and the micro-light-emitting device as a whole are located, the second temperature being in the range of 190°C to 230°C, and / or the second preset condition includes the pressure exerted on the micro-light-emitting device, the pressure being greater than or equal to 70 MPa.

[0023] According to one aspect of the present invention, the ratio of the radial dimension of the deformed conductive particle to the radial dimension of the conductive particle in its original state ranges from 5% to 80%.

[0024] According to one aspect of the present invention, the step of forming a conductive adhesive layer on a drive backplane includes: bonding an anisotropic conductive adhesive film onto the drive backplane to form a conductive adhesive layer.

[0025] According to one aspect of the present invention, an adhesive liquid mixed with conductive particles is applied to a drive backplate and cured to form a conductive adhesive layer.

[0026] On the other hand, according to an embodiment of the present invention, a light-emitting panel is provided, comprising: a driving backplate; a conductive adhesive layer, stacked on the driving backplate, the conductive adhesive layer including a second adhesive layer body and conductive particles disposed on the second adhesive layer body; and a micro-light-emitting device disposed on the side of the second adhesive layer body away from the driving backplate, the micro-light-emitting device including interconnected electrodes and an epitaxial layer, the electrodes pressing against the conductive particles and electrically connected to the driving backplate through the conductive particles, and a gap being formed between the epitaxial layer and the second adhesive layer body.

[0027] According to another aspect of the present invention, the thickness of the second adhesive layer body is greater than or equal to 0.3 μm and less than 1 μm.

[0028] According to another aspect of the present invention, the orthographic projection of the electrodes of the micro-light-emitting device on the driving backplane covers the orthographic projection of the conductive particles on the driving backplane.

[0029] In another aspect, a display device is provided according to an embodiment of the present invention, including the above-described light-emitting panel.

[0030] According to embodiments of the present invention, the method for forming a light-emitting panel, the light-emitting panel, and the display device include forming a conductive adhesive layer on a driving backplate, and then reducing the thickness of a first adhesive layer body to form a second adhesive layer body, thereby exposing the conductive particles of the conductive adhesive layer. This allows the electrodes of the micro-light-emitting device to directly contact the conductive particles during transfer. Furthermore, when applying pressure to the micro-light-emitting device, a gap is maintained between the epitaxial layer of the micro-light-emitting device and the second adhesive layer body, preventing contact between the epitaxial layer of the micro-light-emitting device and the second adhesive layer body, reducing damage to the epitaxial layer of the micro-light-emitting device and / or the driving backplate, and improving the panel integration yield and optimizing the performance of the formed light-emitting panel while ensuring electrical connection between the micro-light-emitting device and the driving backplate. Attached Figure Description

[0031] The features, advantages and technical effects of exemplary embodiments of the present invention will now be described with reference to the accompanying drawings.

[0032] Figure 1 This is a schematic flowchart of a method for forming a light-emitting panel according to an embodiment of the present invention;

[0033] Figures 2 to 5 This is a schematic diagram of the structure corresponding to each step of the molding method of the light-emitting panel according to an embodiment of the present invention;

[0034] Figure 6 This is a schematic flowchart of a method for forming a light-emitting panel according to another embodiment of the present invention;

[0035] Figure 7 This is a schematic flowchart of a method for forming a light-emitting panel according to another embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of a light-emitting panel according to an embodiment of the present invention.

[0037] in:

[0038] 10-Drive backplane; 11-Backplane body; 12-Drive circuit;

[0039] 20 - Conductive adhesive layer; 21 - First adhesive layer body; 22 - Conductive particles; 21a - Second adhesive layer body;

[0040] 30 - Micro-light-emitting device; 31 - Epitaxial layer; 32 - Electrode;

[0041] 40-Black matrix layer;

[0042] 50 - Encapsulation layer.

[0043] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0044] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention may be practiced without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of the invention by illustrating examples of the invention. In the accompanying drawings and the following description, at least some well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the invention; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0045] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the true light-emitting panel forming method, the light-emitting panel, and the display device of the present invention.

[0046] In the fabrication of light-emitting panels using micro-light-emitting devices, the micro-light-emitting devices typically need to be transferred from other substrates to a corresponding driving backplane and connected to it. The choice of material on the driving backplane for connecting the micro-light-emitting devices is crucial; a conductive adhesive layer is usually used to fix the position of the driving backplane and the micro-light-emitting devices and provide electrical connection. However, in existing panel fabrication methods, when the micro-light-emitting devices are transferred to the driving backplane, their non-electrode regions, or epitaxial layers, are also pressed against the conductive adhesive layer. This results in high pressure when pressing the transferred micro-light-emitting devices to electrically connect them to the driving backplane, which can easily damage the epitaxial layer of the micro-light-emitting devices and / or the inorganic / organic film layers of the driving backplane, leading to low panel integration yield.

[0047] Therefore, based on the above-mentioned technical problems, the present invention provides a new method for forming a light-emitting panel. The method for forming the light-emitting panel can meet the requirements for the transfer of micro-light-emitting devices and the electrical connection between them and the driving backplate, which is beneficial to the forming of the light-emitting panel. It can also avoid the contact between the epitaxial layer of the micro-light-emitting device and the adhesive layer body, reduce damage to the epitaxial layer of the micro-light-emitting device and / or the driving backplate, and improve the screen integration yield.

[0048] To better understand this invention, the following is combined with... Figures 1 to 8 The method for molding a light-emitting panel, the light-emitting panel, and the display device according to embodiments of the present invention will be described in detail.

[0049] like Figures 1 to 5 As shown, Figure 1 A schematic flowchart of a method for forming a light-emitting panel according to an embodiment of the present invention is shown. Figures 2 to 5A schematic diagram of the structure corresponding to each step of a method for forming a light-emitting panel according to an embodiment of the present invention is shown. The method for forming a light-emitting panel provided by this embodiment of the present invention includes:

[0050] S100, such as Figure 2 As shown, a conductive adhesive layer 20 is formed on the drive backplate 10. The conductive adhesive layer 20 includes a first adhesive layer body 21 stacked with the drive backplate 10 and conductive particles 22 disposed in the first adhesive layer body 21.

[0051] S200, such as Figure 3 As shown, the thickness of the first adhesive layer body 21 is reduced to form the second adhesive layer body 21a, so that the conductive particles 22 at least partially protrude from the second adhesive layer body 21a on the side away from the drive backplate 10.

[0052] S300, such as Figure 4 As shown, the micro-light-emitting device 30 is transferred to the side of the second adhesive layer body 21a away from the driving back plate 10, and the electrode 32 of the micro-light-emitting device 30 is brought into contact with the conductive particles 22.

[0053] S400, such as Figure 5 As shown, the micro-light-emitting device 30 is pressed so that the electrode 32 of the micro-light-emitting device 30 is electrically connected to the driving backplate 10 through the conductive particles 22 and a gap is formed between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a.

[0054] The method for forming a light-emitting panel provided in this embodiment of the invention includes forming a conductive adhesive layer 20 on a driving backplate 10, and then reducing the thickness of the first adhesive layer body 21 of the conductive adhesive layer 20 to form a second adhesive layer body 21a, so that the conductive particles 22 of the conductive adhesive layer 20 can be exposed. When the micro-light-emitting device 30 is transferred, its electrode 32 can directly contact the conductive particles 22. When force is applied to the micro-light-emitting device 30, a gap can be maintained between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a, avoiding contact between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a, reducing damage to the epitaxial layer 31 of the micro-light-emitting device 30 and / or the driving backplate 10, and improving the panel integration yield and optimizing the performance of the formed light-emitting panel while ensuring the electrical connection between the micro-light-emitting device 30 and the driving backplate 10.

[0055] As an optional implementation, the method for forming a light-emitting panel provided in this embodiment of the invention includes step S100: bonding an anisotropic conductive film (ACF) onto a driving backplate 10 to form a conductive adhesive layer 20.

[0056] Optionally, in step S100, the provided driving backplate 10 includes a backplate body 11 and a driving circuit 12 disposed on the driving backplate 10. The driving circuit 12 has terminals for electrical connection with the electrodes 32 of the micro-light-emitting device 30. A conductive adhesive layer 20 formed on the driving backplate 10 covers the terminals for electrical connection with the electrodes 32.

[0057] like Figure 6 As shown, Figure 6 A schematic flowchart of a method for forming a light-emitting panel according to another embodiment of the present invention is shown. In some optional embodiments, step S200 includes:

[0058] S210, The drive backplate 10 with the conductive adhesive layer 20 formed thereon is placed in the plasma processing equipment;

[0059] S220. Under first preset conditions, a plasma bombardment process is used to reduce the thickness of the first adhesive layer body 21 to form a second adhesive layer body 21a, such that the thickness of the second adhesive layer body 21a is greater than or equal to 0.3 μm and less than 1 μm, and the conductive particles 22 at least partially protrude from the second adhesive layer body 21a on the side away from the driving backplate 10. Optionally, the thickness of the second adhesive layer body 21a can be any value between 0.3 μm and 1 μm, including the 0.3 μm end value, for example, it can be 0.5 μm, 0.7 μm, etc.

[0060] By employing plasma bombardment, the thickness of the first adhesive layer 21 can be reduced, exposing the conductive particles 22 to the remaining second adhesive layer 21a. This ensures that during steps S300 and S400, the electrodes 32 of the micro-light-emitting device 30 can contact the conductive particles 22, and the epitaxial layer 31 always maintains a gap with the second adhesive layer 21a. In other words, the non-electrode areas of the micro-light-emitting device 30 will not contact the second adhesive layer 21a. During step S400, the second adhesive layer 21a has a larger flow space, and the pressure is concentrated in the electrode 32 area of ​​the micro-light-emitting device 30. The overall contact area between the micro-light-emitting device 30 and the conductive adhesive layer 20 is smaller, which can reduce the pressure used to hold the micro-light-emitting device 30 in step S400. This is also very beneficial to the micro-light-emitting device 30 and the driving backplate 10.

[0061] In some alternative embodiments, in step S220, the gas introduced into the plasma bombardment process can be oxygen (O2), argon (Ar), or a mixture of the two.

[0062] As an optional implementation, in step S220, the first preset condition includes at least one of the following: the first temperature, vacuum level, plasma flow rate, and plasma bombardment power of the overall environment of the drive backplate 10 on which the conductive adhesive layer 20 is formed.

[0063] By limiting the first preset conditions, including at least one of the first temperature, vacuum degree, plasma flow rate and plasma bombardment power of the overall environment of the drive backplate 10 on which the conductive adhesive layer 20 is formed, it is easier to remove the thickness of the first adhesive layer body 21, and ensure the required spacing between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a when performing steps S300 and S400.

[0064] In some optional embodiments, in step S220, the first preset condition includes the first temperature of the environment in which the drive backplate 10 on which the conductive adhesive layer 20 is formed is located. The first temperature can be any value between 60°C and 130°C, including two end values ​​of 60°C and 130°C.

[0065] In some optional embodiments, in step S220, the first preset condition includes the vacuum level of the environment in which the drive backplate 10, on which the conductive adhesive layer 20 is formed, is located. The vacuum level is any value between 100mTorr and 1Torr, including the two endpoints of 100mTorr and 1Torr.

[0066] As an optional implementation, in step S220, the first preset condition may include plasma flow rate, for example, which can be characterized by the flow rate of O2 entering the plasma processing device to provide plasma. The plasma flow rate can be any value between 200 SCCM and 400 SCCM, including the two endpoints of 200 SCCM and 400 SCCM.

[0067] In some optional embodiments, the first preset condition includes plasma bombardment power, which is any value between 400W and 900W, including two values: 400W and 900W.

[0068] The first preset condition adopts at least one of the above conditions, which can better ensure the removal requirements of the thickness of the first adhesive layer body 21, while also avoiding the impact on the performance of the conductive particles 22, and ensuring the electrical connection requirements between the electrode 32 of the micro-light-emitting device 30 and the driving backplate 10.

[0069] like Figure 7 As shown, Figure 7 A schematic flowchart illustrating a method for forming a light-emitting panel according to another embodiment of the present invention is shown. As an optional implementation, the method for forming a light-emitting panel provided in this embodiment of the present invention includes step S400:

[0070] S410. Pre-press the micro-light-emitting device 30 so that the electrode 32 of the micro-light-emitting device 30 contacts and is positioned with the conductive particles 22.

[0071] S420, under the second preset conditions, the pre-pressed micro-light-emitting device 30 is subjected to pressure so that the second adhesive layer body 21a melts and the conductive particles 22 in contact with the electrode 32 deform and come into contact with the driving backplate 10.

[0072] By using pre-pressing and self-pressing in step S400, the positioning of the micro-light-emitting device 30 can be guaranteed. At the same time, when step S420 is executed, the second adhesive layer body 21a can be heated and melted, which is beneficial for the electrical connection between the electrode 32 of the micro-light-emitting device 30 and the wiring terminal of the driving backplate 10.

[0073] In some optional embodiments, in step S420, the second preset condition includes at least one of the second temperature of the environment in which the driving backplate 10, the second adhesive layer body 21a, and the micro-light-emitting device 30 are located, and the pressure exerted on the micro-light-emitting device 30. The second preset condition, defined by the above parameters, can effectively ensure the electrical connection requirements between the micro-light-emitting device 30 and the driving backplate 10.

[0074] As an optional implementation, in step S420, the second preset condition includes the second temperature of the driving backplate 10, the second adhesive layer body 21a, and the micro-light-emitting device 30 as a whole. The value of the second temperature is any value between 190°C and 230°C, including both 190°C and 230°C. Using the above-mentioned temperature range facilitates the melting of the second adhesive layer body 21a, allowing the conductive particles 22 to effectively contact and electrically connect with the driving backplate 10.

[0075] In some alternative embodiments, in step S420, the second preset condition includes the pressure on the micro-light-emitting device 30, which is greater than or equal to 70 MPa. By limiting the second preset condition to include the pressure on the micro-light-emitting device 30, it is also possible to ensure that the conductive particles 22 can effectively deform and contact and electrically connect with the driving backplate 10.

[0076] In some optional embodiments, the forming method of the light-emitting panel provided by the present invention allows the ratio of the radial dimension of the conductive particle 22 after deformation to the radial dimension of the conductive particle 22 in its original state to any value between 5% and 80%, including both 5% and 80%; the ratio of the radial dimension of the conductive particle 22 after deformation to the radial dimension of the conductive particle 22 in its original state can be further selected as 60%. Using the above-mentioned ratio of the deformation of the conductive particle 22 to its original state increases the contact strength between the conductive particle 22 and the micro-light-emitting device 30 and the driving backplate 10, ensuring electrical connection requirements. It should be noted that the radial dimension in its original state mentioned above refers to the diameter of the conductive particle 22, and the radial dimension after deformation refers to the dimension of the conductive particle 22 along the pressure direction when it is deformed under pressure.

[0077] As an optional implementation, the method for forming a light-emitting panel provided in this embodiment of the invention may further include, after the step of pressing the pre-pressed micro-light-emitting device 30 under the second preset conditions, step S400, cooling the pre-pressed conductive adhesive layer 20 so that the molten second adhesive layer body 21a is re-cooled and solidified.

[0078] It is understood that the forming method of the light-emitting panel provided in the above embodiments of the present invention, in step S100, is illustrated by adhering anisotropic conductive adhesive film on the driving back plate 10 to form conductive adhesive layer 20. As an optional embodiment, in step S100, conductive adhesive layer 20 can also be formed by applying an adhesive liquid mixed with conductive particles 22 to the driving back plate 10 and curing it.

[0079] like Figure 8 As shown, Figure 8 A schematic diagram of a light-emitting panel according to an embodiment of the present invention is shown. On the other hand, the present invention also provides a light-emitting panel that can be formed using the light-emitting panel forming methods provided in the above embodiments. The light-emitting panel includes a driving backplate 10, a conductive adhesive layer 20, and a micro-light-emitting device 30. The conductive adhesive layer 20 is stacked on the driving backplate 10, and the conductive adhesive layer 20 includes a second adhesive layer body 21a and conductive particles 22 disposed on the second adhesive layer body 21a. The micro-light-emitting device 30 is disposed on the side of the second adhesive layer body 21a facing away from the driving backplate 10. The micro-light-emitting device 30 includes electrodes 32 and an epitaxial layer 31 interconnected with each other. The electrodes 32 press against the conductive particles 22 and are electrically connected to the driving backplate 10 through the conductive particles 22. A gap is formed between the epitaxial layer 31 and the second adhesive layer body 21a.

[0080] The light-emitting panel provided in this embodiment of the invention can be formed using the forming methods of the light-emitting panel provided in the above embodiments. The electrical connection strength between the micro-light-emitting device 30 and the driving backplate 10 is high, and a gap is formed between the epitaxial layer 31 of the transferred micro-light-emitting device 30 and the second adhesive layer body 21a, which avoids contact between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a, reduces damage to the epitaxial layer 31 and / or the driving backplate 10, and improves the screen integration yield and optimizes the performance of the light-emitting panel while ensuring the electrical connection between the micro-light-emitting device 30 and the driving backplate 10.

[0081] Optionally, in the light-emitting panel provided in this embodiment of the invention, the thickness of the second adhesive layer body 21a is greater than or equal to 0.3 μm and less than 1 μm. This is to further ensure the gap formation requirement between the epitaxial layer 31 of the micro-light-emitting device 30 and the second adhesive layer body 21a.

[0082] As an optional implementation, the orthographic projection of the electrode 32 of the micro-light-emitting device 30 onto the driving backplate 10 overlaps with the orthographic projection of the conductive particles 22 onto the driving backplate 10. This arrangement ensures that the conductive particles 22 are arranged in a one-to-one correspondence with the electrode 32 of the micro-light-emitting device 30, optimizing the electrical connection requirements between the micro-light-emitting device 30 and the driving backplate, and reducing the contact probability between the electrode 32 and the epitaxial layer 31 of the micro-light-emitting device 30.

[0083] Optionally, the light-emitting panel further includes a black matrix layer 40 that is stacked on the second adhesive layer body 21a and separates each micro-light-emitting device 30, and an encapsulation layer 50 that covers the micro-light-emitting devices 30 and the black matrix layer 40. The black matrix layer 40 can prevent light from interfering with each other between the micro-light-emitting devices 30, and the encapsulation layer 50 can protect the micro-light-emitting devices 30.

[0084] In another aspect, embodiments of the present invention also provide a display device, including the light-emitting panel of the above embodiments. The light-emitting panel can be directly used as the display panel of the display device. In other embodiments, the light-emitting panel can be used as a direct-lit backlight of the display device, that is, the light-emitting panel is a backlight panel. The display device may also include a display panel. The display panel includes a display area, and the light-emitting surface of the light-emitting panel can correspond to the display area of ​​the display panel to meet the display requirements of the display device.

[0085] In other embodiments, the light-emitting panel can be a single-color light-emitting panel, and the display device can include a color filter and functional elements located on one side of the light-emitting surface of the light-emitting panel. The single-color light emitted by the light-emitting panel passes through the corresponding area of ​​the color filter to present light of a predetermined color, thereby meeting the display requirements. Optionally, the mentioned functional elements can be polarizers, layer structures capable of focusing light, etc., and can be specifically set according to the display requirements of the display device to optimize the performance of the display device.

[0086] Although the invention has been described with reference to preferred embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for forming a light-emitting panel, characterized in that, include: A conductive adhesive layer is formed on the drive backplate, the conductive adhesive layer including a first adhesive layer body stacked with the drive backplate and conductive particles disposed within the first adhesive layer body; The thickness of the first adhesive layer body is reduced to form the second adhesive layer body, so that the conductive particles at least partially protrude from the second adhesive layer body on the side opposite to the drive backplate. The micro-light-emitting device is transferred to the side of the second adhesive layer body away from the driving backplate, and the electrodes of the micro-light-emitting device are brought into contact with the conductive particles. The micro-light-emitting device is pressed so that the electrode of the micro-light-emitting device is electrically connected to the driving backplate through the conductive particles and a gap is formed between the epitaxial layer of the micro-light-emitting device and the second adhesive layer body.

2. The method for forming a light-emitting panel according to claim 1, characterized in that, The step of reducing the thickness of the first adhesive layer to form the second adhesive layer, so that the conductive particles at least partially protrude from the second adhesive layer on the side opposite to the drive backplate, includes: The entire drive backplate with the conductive adhesive layer formed thereon is placed in a plasma processing device; Under a first preset condition, the thickness of the first adhesive layer body is reduced by plasma bombardment to form the second adhesive layer body, such that the thickness of the second adhesive layer body is greater than or equal to 0.3 μm and less than 1 μm, and the conductive particles at least partially protrude from the second adhesive layer body on the side away from the driving backplate.

3. The method for forming a light-emitting panel according to claim 2, characterized in that, The first preset condition includes at least one of the following: temperature, vacuum level, plasma flow rate, and plasma bombardment power of the overall environment in which the drive backplate on which the conductive adhesive layer is formed.

4. The method for forming a light-emitting panel according to claim 3, characterized in that, The first preset condition includes the first temperature, and the value of the first temperature is in the range of 60℃~130℃; And / or, the first preset condition includes the vacuum degree, the vacuum degree being in the range of 100 mTorr to 1 Torr; And / or, the first preset condition includes the plasma flow rate, wherein the plasma flow rate ranges from 200 SCCM to 400 SCCM. And / or, the first preset condition includes the plasma bombardment power, the value of which is in the range of 400W to 900W.

5. The method for forming a light-emitting panel according to any one of claims 1 to 4, characterized in that, The step of pressing the micro-light-emitting device includes: The micro-light-emitting device is pre-pressed so that the electrodes of the micro-light-emitting device come into contact with and are positioned by the conductive particles; Under a second preset condition, the pre-pressed micro-light-emitting device is subjected to a second pre-press, so that the second adhesive layer melts and the conductive particles in contact with the electrode deform and come into contact with the driving backplate.

6. The method for forming a light-emitting panel according to claim 5, characterized in that, The second preset condition includes at least one of the second temperature of the environment in which the driving backplate, the second adhesive layer body, and the micro-light-emitting device as a whole are located, and the pressure exerted on the micro-light-emitting device.

7. The method for forming a light-emitting panel according to claim 6, characterized in that, The second preset condition includes the second temperature of the driving backplate, the second adhesive layer body and the micro-light-emitting device as a whole, the second temperature range being 190℃~230℃, and / or the second preset condition includes the pressure exerted on the micro-light-emitting device, the pressure being greater than or equal to 70MPa.

8. The method for forming a light-emitting panel according to claim 5, characterized in that, The ratio of the radial dimension of the conductive particle after deformation to the radial dimension of the conductive particle in its original state ranges from 5% to 80%.

9. The method for forming a light-emitting panel according to any one of claims 1 to 4, characterized in that, The step of forming a conductive adhesive layer on the drive backplane includes: An anisotropic conductive adhesive film is bonded to the drive backplate to form the conductive adhesive layer; Alternatively, an adhesive solution containing the conductive particles can be applied to the drive backplate and cured to form the conductive adhesive layer.

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