A carbon material heater
By adopting carbon material heaters with flexible substrates of carbon material, the challenges of existing RTP equipment in rapid heating and cooling capabilities, temperature uniformity, and heater thermal mass are solved, achieving a more uniform heat flow distribution and higher heating efficiency.
Patent Information
- Application Number
- CN202210644432.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-08
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2042-06-08
AI Technical Summary
Existing RTP equipment has challenges in rapid heating and cooling capabilities, temperature uniformity, and heater thermal mass, resulting in uneven heating and mechanical design complexity.
A carbon material heater is designed by placing a constant resistivity in the current direction using a flexible substrate of carbon material. The heater includes a carbon fiber or glass fiber bundle, with three-dimensional structure and opening characteristics, and is coated to improve mechanical strength and corrosion resistance.
A constant resistivity in the current direction is achieved, the heat flow distribution of the heater is more uniform, the thermal inertia is reduced, the heating efficiency and temperature uniformity are improved, and it is suitable for chemical vapor deposition reactors and fast thermal annealing reactors.
Smart Images

Figure CN114845426B_ABST
Abstract
Description
Technical Field
[0001] The present invention generally relates to the field of semiconductor manufacturing technology. Specifically, the present invention relates to a carbon material heater. Background Art
[0002] Rapid thermal annealing or rapid thermal processing (RTP) is a common semiconductor process. That is, the silicon wafer needs to be heated with a very high heating rate, usually 60°C / s or higher.
[0003] The challenges of existing RTP equipment include:
[0004] 1. The ability to rapidly heat up: sufficient power and the thermal mass of the heater cannot be too high, as excessive thermal inertia will reduce the heating rate;
[0005] 2. The ability of spike-anneal while simultaneously requiring the silicon wafer to rapidly cool down in order to quickly remove heat from the silicon wafer, so the thermal mass of the reaction chamber cannot be too high;
[0006] 3. The ability to achieve temperature uniformity, that is, multi-zone control and the ability to measure high temperatures.
[0007] Figure 6 An existing RTP equipment is shown. As Figure 6 shown, the characteristics of this RTP equipment include: a large number of halogen lamps, zone control, thin filaments, small thermal mass, and fast heating rate. The disadvantages of this RTP equipment include: 1. The shape of the halogen lamp is restricted by the lamp filling and processing technology. The heating area is small, and the heat flux distribution presents a large number of peaks and valleys. Usually, through multi-zone control, as many point light sources or line light sources as possible are designed in a unit space, and these light sources are zone-controlled. These line light sources or point light sources are restricted by the outer diameter of the lamp tube and the lamp holder (the working temperature of the quartz end cap of the lamp tube cannot be higher than 400°C, and forced cooling or being away from high-temperature areas is necessary). Generally, due to the diameter of the lamp tube, the distance between filaments is greater than 15 mm. Therefore, a very high rotational speed of the silicon wafer is also required to smooth out this non-uniformity.
[0008] The common high rotational speed in the current semiconductor industry is about 240 rpm, that is, four revolutions per second. (That is, by stretching the space axis, more movements around the axis are obtained, and the heat flux is integrated and averaged in the movement direction to obtain a more uniform heating.) High rotational speed poses very high requirements for the design of the rotational mechanism of the silicon wafer.
[0009] Due to the anisotropic characteristics of carbon-carbon composites (CFC carbon fiber composites), when using CFC to construct a resistive heater, the resistive heater will have different resistivities in different directions. The heat generation of a resistive heater is determined by the resistivity. For a resistive heater with a curved shape, such as a semi-circular or arc-shaped one, the current direction of the resistive heater will continuously change with the angle between the warp and weft lines. Therefore, the resistivity of the resistive heater will also constantly change, and the heating power of different parts on the resistive heater will also change with the change of resistivity, which is unacceptable in engineering design.
[0010] In addition, the common isotropic heater material, graphite, belongs to a bulk material. Its mechanical strength is much lower than that of materials such as metals, and it has no ductility and flexibility, so it cannot be processed into various shapes such as the common spirals, meanders, flakes (thickness < 2 mm), and wires (diameter 1 mm) of metal heaters. Too thick or too thick materials result in too low resistance, unable to meet the electrical requirements of resistance and power. At the same time, it often brings huge problems in mechanical design layout and also causes delays in the rapid response of the system. Summary of the Invention
[0011] To at least partially solve the above problems in the prior art, the present invention proposes a carbon material heater, comprising:
[0012] A carbon material flexible substrate, the resistivity of which in the current direction is configured to be constant.
[0013] In an embodiment of the present invention, it is stipulated that the carbon material flexible substrate comprises:
[0014] A first fiber, through which the current flows; and
[0015] A second fiber, which is perpendicular to the current direction.
[0016] In an embodiment of the present invention, it is stipulated that the first fiber comprises carbon fiber; and / or
[0017] The second fiber comprises carbon fiber or glass fiber.
[0018] In an embodiment of the present invention, it is stipulated that the first and second fibers comprise flat-laid fibers, knitted fibers or woven fibers.
[0019] In an embodiment of the present invention, it is stipulated that the carbon material heater comprises a single layer or multiple layers of the carbon material flexible substrate.
[0020] In an embodiment of the present invention, it is stipulated that the carbon material flexible substrate has openings.
[0021] In one embodiment of the present invention, it is stipulated that the carbon material flexible substrate is a three-dimensional structure, wherein the three-dimensional structure includes an open structure, and the open structure is configured not to form an electric current loop; or
[0022] The three-dimensional structure includes a closed structure, and the closed structure is configured to form an electric current loop.
[0023] In one embodiment of the present invention, it is stipulated that the carbon material heater further includes:
[0024] A coating disposed on the surface of the carbon material flexible substrate, wherein the coating includes a silicon carbide coating, a tantalum carbide coating, or other carbide coatings.
[0025] In one embodiment of the present invention, it is stipulated that the coating is a hardened structure of a flexible material, or the coating is an anti-corrosion or protective coating of a flexible material.
[0026] In one embodiment of the present invention, it is stipulated that the carbon material heater is prepared by fixing the flexible substrate material on a designed jig and then coating, and the part of the jig in contact with the flexible substrate material has large-area openings to achieve the purpose of double-sided coating.
[0027] In one embodiment of the present invention, it is stipulated that the carbon material heater is a homogeneous surface heater, a homogeneous density heater, or a homogeneous hybrid heater.
[0028] In one embodiment of the present invention, it is stipulated that the carbon material heater is a hairpin corrugated heater.
[0029] In one embodiment of the present invention, it is stipulated that the carbon material heater is a spiral tube or a spiral wire heater.
[0030] In one embodiment of the present invention, it is stipulated that the first fiber includes a fiber filament bundle or a fiber ribbon.
[0031] In one embodiment of the present invention, it is stipulated that the minimum dimension of the carbon material heater is less than or equal to 2 mm; and / or
[0032] The thickness of the coating is 5 - 500 μm.
[0033] In one embodiment of the present invention, it is stipulated that the carbon material flexible substrate includes carbon fiber paper (non-woven paper, isotropic), graphite non-woven fabric, graphite paper, or fiber filament bundle.
[0034] In one embodiment of the present invention, it is stipulated that the carbon material heater is a non-linear heater.
[0035] In one embodiment of the present invention, it is stipulated that the carbon material heater is configured as an annular carbon material heater, and the annular carbon material heater has a plurality of concentric annular partitions, wherein each of the annular partitions is a hairpin corrugated heater, and the hairpin teeth of the heaters in adjacent partitions have overlapping parts.
[0036] The present invention also provides a semiconductor reactor having the carbon material heater.
[0037] In one embodiment of the present invention, it is stipulated that the semiconductor reactor includes a chemical vapor deposition reactor or a rapid thermal annealing reactor.
[0038] The present invention has at least the following beneficial effects: The present invention provides a carbon material heater, whose resistivity in the current direction can remain constant, so as to meet the homogeneous heating requirements in a chemical vapor deposition reactor or a rapid thermal annealing reactor, and has good practicability. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] To further clarify the advantages and features of the embodiments of the present invention, more specific descriptions of the embodiments of the present invention will be presented with reference to the accompanying drawings. It can be understood that these drawings only depict typical embodiments of the present invention and thus will not be considered as limiting its scope. In the drawings, for clarity, the same or corresponding components will be denoted by the same or similar reference numerals.
[0040] Figure 1A -C shows a partial schematic view of a carbon material heater in one embodiment of the present invention.
[0041] Figure 2 Shows a schematic view of the opening of a carbon material heater in one embodiment of the present invention.
[0042] Figure 3 Shows a schematic view of a carbon material heater with a three-dimensional structure in one embodiment of the present invention.
[0043] Figure 4A -D shows a schematic view of a jig in one embodiment of the present invention.
[0044] Figure 5 Shows a schematic view of an annular carbon material heater in one embodiment of the present invention.
[0045] Figure 6 Shows an RTP device of the prior art.
[0046] Figure 7 Shows a schematic view of an application of the present invention to a chemical vapor deposition reactor. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0047] It should be noted that the components in the respective drawings may be exaggerated for illustrative purposes and not necessarily drawn to scale. In the respective drawings, the same or functionally identical components are provided with the same reference numerals.
[0048] In the present invention, unless otherwise specified, "arranged on", "arranged above", and "arranged over" do not exclude the presence of intermediate elements therebetween. In addition, "arranged on or above" only represents the relative positional relationship between two components, and in certain cases, such as after reversing the product direction, it can also be converted to "arranged under or below", and vice versa.
[0049] In the present invention, the respective embodiments are only intended to illustrate the solutions of the present invention and should not be construed as restrictive.
[0050] In the present invention, unless otherwise specified, the quantifiers "a" and "one" do not exclude the scenario of multiple elements.
[0051] It should also be noted here that in the embodiments of the present invention, for the sake of clarity and simplicity, only a part of the components or assemblies may be shown, but those of ordinary skill in the art can understand that, under the teachings of the present invention, the required components or assemblies can be added according to the specific scenario requirements. Additionally, unless otherwise stated, the features in different embodiments of the present invention can be combined with each other. For example, a certain feature in the second embodiment can be used to replace the corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment also falls within the scope of disclosure or the scope of recording of this application.
[0052] It should also be noted here that within the scope of the present invention, the terms "identical", "equal", "equivalent", etc. do not mean that the two values are absolutely equal, but allow for a certain reasonable error, that is, the said terms also cover "substantially identical", "substantially equal", "substantially equivalent". By analogy, in the present invention, the directional terms "perpendicular to", "parallel to", etc. also cover the meanings of "substantially perpendicular to" and "substantially parallel to".
[0053] In view of the problems existing in the existing RTP equipment, it is urgent to design a heating system with a small thermal inertia and a more uniform heat flux system compared to the traditional lamp heating system. Therefore, the present invention conceives a homogeneous heater made of flexible materials such as carbon fiber and graphite paper.
[0054] A simplified model is as follows: In one-dimensional space, a point source with the same power is distributed into 4 quarter-power ones and evenly spread out, then its non-uniformity drops to 1 / 4 of the original. Or to some extent, a higher uniformity can be achieved using a lower rotational speed.
[0055] Another way is to use a large-area surface source such as graphite paper. Considering that graphite paper will significantly increase the total mass of the heating element, making the heating element reach the required thermal power at a slower speed and for a longer time. Therefore, for an RTP system, arranging line light sources more densely in space is a relatively more advantageous solution than surface light sources, or making a certain balance in the ratio of the heating element to the total area to be heated.
[0056] In the present invention, the term "temperature characteristic" refers to the deviation generated by the analog module of a semiconductor device under the influence of external temperature changes.
[0057] In addition, the numbering of the steps of each method of the present invention does not limit the execution order of the method steps. Unless otherwise specified, the method steps can be executed in different orders.
[0058] The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.
[0059] Figure 1A -C shows a partial schematic view of a carbon material heater in an embodiment of the present invention. The carbon material heater is a non-linear heater, that is, the carbon material heater has at least one non-linear segment. The minimum dimension of the carbon material heater is less than or equal to 2 mm. In the present invention, the term "minimum dimension" refers to the minimum size of the carbon material heater in different directions.
[0060] As Figure 1A shown, the carbon material heater 100 may include a carbon material flexible substrate 101, and the resistivity of the carbon material flexible substrate 101 in the current direction is configured to be constant, where the dashed line indicates the current direction. As Figure 1B shown, the carbon material flexible substrate may include a first fiber 102, and the first fiber 102 is parallel to the current direction. As Figure 1C shown, the carbon material flexible substrate may further include a second fiber 103, and the second fiber 103 is perpendicular to the current direction. Among them, the first fiber 102 may be a carbon fiber, and the second fiber 103 may be a carbon fiber or a glass fiber or other fibers. The first fiber 102 may be a fiber tow or a fiber ribbon.
[0061] In the present invention, the order of magnitude of the term "filament" is 6 - 7 μm.
[0062] The term "fiber tow" refers to a rope or thread woven from "filaments", which is commonly woven from 1000 to thousands of filaments. Therefore, 1000 filaments are called 1K, and 3000 filaments are called 3K. The fiber tow can be further woven into a woven ribbon, and even a woven tube with a circular or annular cross-section (for example, a shoelace is a common woven tube).
[0063] The first fiber 102 and the second fiber 103 can be flat fibers, knitted fibers or woven fibers, as long as the resistance is uniform in the current direction of the carbon material flexible substrate 101, that is, the resistivity is constant. The second fiber 103 is used to fix the first fiber 102 and is non-conductive. Therefore, when a voltage is applied across the two ends of the first fiber 102, the current flows along the first fiber 102 and does not flow along the second fiber 103 to an adjacent first fiber. The carbon material flexible substrate 101 can be single-layer or multi-layer.
[0064] The carbon material flexible substrate 101 can be carbon fiber paper, graphite paper or fiber tow, or a braided belt or braided tube further woven from the tow (the cross-section is a ring or a circle, and the common shoelace weaving process is a braided tube).
[0065] Figure 2 FIG. shows a schematic diagram of the opening of a carbon material heater in an embodiment of the present invention. As Figure 2 shown, the carbon material flexible substrate 101 can be configured with an opening 201, and non-heating structures such as bolts or vertical air ducts can be arranged at the opening 201. The shape of the opening 201 can be circular, kidney-shaped or square.
[0066] Figure 3 FIG. shows a schematic diagram of a carbon material heater with a three-dimensional structure in an embodiment of the present invention. As Figure 3 shown, the carbon material flexible substrate 101 can have a three-dimensional structure 301. The vertical part of the three-dimensional structure 301 can be an open three-dimensional structure, which does not form a current loop to reduce the power density. The vertical part of the three-dimensional structure 301 can also be a closed three-dimensional structure, which forms a current loop to increase the power density.
[0067] The carbon material heater can also include a coating, and the coating is arranged on the surface of the carbon material flexible substrate. The coating can be a silicon carbide coating or a tantalum carbide coating. The coating can be used to protect the substrate from oxidation or corrosion, and can form a hardened structure so that the flexible substrate material becomes a hard material after the coating, so that a stable structure can be formed without support. The thickness of the coating is 5 - 500 um
[0068] Figure 4A -D shows a schematic diagram of a jig in an embodiment of the present invention. The carbon material heater 400 can be constructed with the aid of the jig 401, as Figure 4AAs shown, the carbon material flexible substrate 101 can be fabricated on the fixture 401. There is a gap 402 between the fixture 401 and the carbon material flexible substrate 101. Therefore, during the process of fabricating the coating, the precursor gas can contact the back surface of the carbon material flexible substrate 101, and thus the two surfaces of the carbon material flexible substrate 101 can be coated simultaneously. Figure 4B FIG. shows a case where multiple layers of the carbon material flexible substrate 101 are fabricated on the fixture 401. In Figure 4C this case, the gap 402 can penetrate through the fixture 401. Therefore, the precursor gas can directly enter from the bottom of the fixture 401 and then contact the back surface of the carbon material flexible substrate 101. Figure 4D FIG. shows a case where multiple layers of the carbon material flexible substrate 101 are fabricated in this situation.
[0069] The fixture 401 can also be tubular, and the carbon material flexible substrate 101 can be wound around the tubular fixture 401 to form a structure of a helix or a solenoid.
[0070] The carbon material heater 100 can be a homogeneous surface heater, a homogeneous density heater, or a hybrid homogeneous heater.
[0071] In the present invention, the term "homogeneous surface heater" means that the forward projection area of the heating element of the heater accounts for more than 20% of the entire projection area of the heating element.
[0072] The carbon material heater 100 can be a hairpin corrugated heater. In the present invention, the hairpin corrugated heater is a hybrid homogeneous heater.
[0073] The carbon material heater 100 can be applied to a semiconductor reactor, and the semiconductor reactor can be a chemical vapor deposition reactor or a rapid thermal annealing (RTP) reactor.
[0074] Figure 7 FIG. shows a schematic diagram of a chemical vapor deposition reactor to which the present invention is applied. As Figure 7 shown, the chemical vapor deposition reactor can include a first heater 701, a second heater 702, and a reaction chamber 703. A substrate can be placed in the reaction chamber 703. The first heater 701 and the second heater 702 can be the carbon material heaters, which are usually arranged outside the reaction chamber 703 and can heat the substrate in the reaction chamber 703.
[0075] In the reaction chamber 703, the substrate is horizontally arranged above the pedestal. Quartz or other high-temperature-resistant non-metallic materials are used as the reaction chamber to accommodate high-temperature process gases, and the process gases flow along the surface of the substrate (pedestal) from one side of the reaction chamber.
[0076] The first heater 701 and the second heater 702 may have a water-cooled metal backplane, and together with the quartz glass of the reaction chamber 703 that transmits infrared, they form a sealed container. This container can be evacuated or purged and protected with nitrogen and / or inert gases.
[0077] An infrared reflective material or heat insulation material may be provided between the first heater 701 and the second heater 702 and the water-cooled backplane to prevent heat transfer from the heating element to the water-cooled backplane. The heat insulation material can be OP quartz or refractory material. The infrared reflective material can be a water-cooled backplane plated with gold (or other reflective coatings), or an infrared reflective coating on OP quartz or refractory material. Or it can be plated on the water-cooled jacket inserted between the backplane and the heating element.
[0078] The quartz surfaces of the first heater 701 and the second heater 702 can be cooled by air cooling.
[0079] The first heater 701 and the second heater 702 can be a surface heater in the shape of a circle composed of multiple long strip heaters in a quasi-orthogonal manner on the front and back. The geometric structure of the first heater 701 and the second heater 702 can be a shape obtained by intercepting n + 1 concentric circles from 2n or 2n + 1 straight long strips. That is to say, the outermost heaters of the first heater 701 and the second heater 702 are approximately 1 / 4 arcs (if there are electrodes extending to both sides, there are ear tabs), the middle heaters are approximately 1 / 4 arcs, plus the straight line segments passing through all the arcs on the outside on both sides. For the innermost heater, it can be a complete central circle plus 2 straight line segments passing through all the arcs on the outside on the left and right. If a central opening (rotating shaft, sensor, observation window) is required, the central part is a 360-degree arc. The temperature control of the first heater 701 and the second heater 702 can be based on a neural network for heating control.
[0080] In the semiconductor reactor, the carbon material heater 100 can form an air inlet nozzle structure with quartz or high-temperature-resistant high-purity materials. In the semiconductor reactor, the carbon material heater can be parallel or perpendicular to the processed silicon wafer or substrate.
[0081] The carbon material heater 100 may have more than two independently power-driven zones, and the independently power-driven zones are homogeneous heaters. Here, the homogeneous heater includes a homogeneous surface heater, a homogeneous density heater, or a mixed homogeneous heater. In the present invention, the term "homogeneous density heater" means that in a certain dimension of the heater (for example, for a circumferentially symmetric heater, it is usually the diameter or a certain circumference, and for a right-angled orthogonal distribution, it is the orthogonal XY axes), for example, on the cross-section of the heater, the density of the heating elements of the heater exceeds 1 point (piece) / 10 mm. For a 300 mm silicon wafer, the corresponding heater diameter is about 400 mm. If a homogeneous density heater is to be formed, the number of heating elements or pieces in the cross-section in a certain diameter direction of the silicon wafer needs to exceed 40. The term "mixed homogeneous heater" means that the heater satisfies the condition of a homogeneous surface heater in one direction and a homogeneous density heater in the other orthogonal direction. For example, a group of high-density parallel line heat sources constitutes a homogeneous surface heater in one direction and a homogeneous density heater in the other direction. That is, the mixed homogeneous heater satisfies the conditions of both the homogeneous surface heater and the homogeneous density heater at the same time.
[0082] For the independently power-driven zones, at the same power, multiple homogeneous line light sources can be split to improve the heating uniformity and reduce the thermal inertia, and the distances of the homogeneous line light sources are evenly staggered.
[0083] Figure 5 The schematic diagram of an annular carbon material heater in an embodiment of the present invention is shown. The annular carbon material heater may have a plurality of concentric annular zones, and each of the annular zones may be a hairpin corrugated heater. For the hairpin corrugated heater, the definitions of the homogeneous heater satisfied in two orthogonal directions are as follows: a. The length intercepted by the heater in a certain direction exceeds 20% of the total length of the cross-section, and b. In the other orthogonal direction, the density of the intercepted heater elements (points) exceeds 1 / 10 (piece / mm) or the total number exceeds the diameter * 1 / 10. a and b are usually in an "or" relationship. For the circumferential heater, the normal direction should be selected as a to satisfy the projection length percentage, and the tangential direction should be selected as b to satisfy the density requirement. Since the silicon wafer rotates around the center, only the uniformity of the heat flux in the tangential direction is compensated. Therefore, it is necessary to give priority to satisfying the optimal projection in the normal direction and the number density in the tangential direction.
[0084] As Figure 5 shown, Figure 5 The upper half of shows the annular zones represented as Zone1 to Zone N from the center to the outside. Figure 5 The lower half of shows a partial enlarged view of the annular carbon material heater. For each of the annular zones, the hairpin corrugated heater includes outer teeth protruding outward from the center and inner teeth protruding toward the center. The outer teeth have at least two sizes. The inner teeth have at least two sizes. AsFigure 5 As shown in the lower part of Figure 5 In the illustrated embodiment, the inner teeth and outer teeth in Region Y each have two different outer diameters and inner diameters, namely Rout ya and Rout yb, and Rin ya and Rin yb, where Rout ya < Rout yb and Rin ya < Rin yb. Alternatively, the minimum inner diameter of the inner teeth of the outer ring heater is less than the maximum outer diameter of the outer teeth of the adjacent inner ring heater. Those skilled in the art should understand that in other embodiments, each partition may also be provided with outer teeth and inner teeth of more sizes.
[0085] For adjacent annular partitions Zone X and Zone Y, where Y = X + 1, there is Rout xa < Rin ya < Rout xb < Rin yb, that is to say, there is an overlapping part between the hairpin teeth of the heater in Region Y and the heater in Region X, but they are not completely overlapping. Only part of the teeth penetrate into the adjacent region, and the other part of the teeth are only within the present region. If Rout xa = Rout xb < Rin ya = Rin yb, that is to say, there will be a zero-power interval between Rout x and Rin y in the whole heating element, resulting in uneven temperature. By using a staggered design, so that there is continuous power output between Rin and Rout, the zero-power interval can be eliminated.
[0086] Although the embodiments of the present invention have been described above, it should be understood that they are presented only as examples and not as limitations. It will be apparent to those skilled in the relevant art that various combinations, modifications, and changes can be made thereto without departing from the spirit and scope of the present invention. Therefore, the width and scope of the present invention disclosed herein should not be limited by the above-described exemplary embodiments, but should be defined only by the appended claims and their equivalents.
Claims
1. A carbon material heater, characterized in that, comprising: a carbon material flexible substrate, the resistivity of which in the current direction is configured to be constant, wherein the carbon material heater is configured as an annular carbon material heater, the annular carbon material heater having a plurality of concentric annular partitions, each of the annular partitions being a hairpin corrugated heater, wherein the hairpin corrugated heater includes outer teeth protruding outward from the center of the circle and inner teeth protruding toward the center of the circle, the outer teeth having at least two sizes, the inner teeth having at least two sizes, and for adjacent annular partitions, a part of the teeth penetrate into the adjacent area and another part of the teeth are only within the current area.
2. The carbon material heater according to claim 1, characterized in that, the carbon material flexible substrate comprises: a first fiber through which the current flows; and a second fiber perpendicular to the current direction.
3. The carbon material heater according to claim 2, characterized in that, the first fiber includes carbon fiber; and / or the second fiber includes carbon fiber or glass fiber.
4. The carbon material heater according to claim 2, characterized in that, the first and second fibers include laid fibers, knitted fibers or woven fibers.
5. The carbon material heater according to claim 1, characterized in that, it includes a single layer or multiple layers of the carbon material flexible substrate.
6. The carbon material heater according to claim 1, characterized in that, the carbon material flexible substrate has openings.
7. The carbon material heater according to claim 1, characterized in that, the carbon material flexible substrate is a three-dimensional structure, wherein the three-dimensional structure includes an open structure, and the open structure is configured not to form an electric current loop; or the three-dimensional structure includes a closed structure, and the closed structure is configured to form an electric current loop.
8. The carbon material heater according to claim 1, characterized in that, further comprising: a coating disposed on the surface of the carbon material flexible substrate, wherein the coating includes a carbide coating, a silicon carbide coating or a tantalum carbide coating, or the coating is a hardened structure of a flexible material, or the coating is a corrosion-resistant or protective coating of a flexible material.
9. The carbon material heater according to claim 1, characterized in that, the carbon material heater is prepared by fixing the flexible substrate material on a designed fixture and coating the coating, and the part of the fixture in contact with the flexible substrate material has large-area openings to achieve the purpose of double-sided coating.
10. The carbon material heater according to claim 1, characterized in that, the carbon material heater is a homogeneous surface heater, a homogeneous density heater and / or a homogeneous hybrid heater.
11. The carbon material heater according to claim 2, characterized in that, the first fiber includes a fiber tow or a fiber ribbon.
12. The carbon material heater according to claim 8, characterized in that, the minimum dimension of the carbon material heater is less than or equal to 2 mm; and / or the thickness of the coating is 5 - 500 μm.
13. The carbon material heater according to claim 1, characterized in that, The carbon material flexible substrate includes carbon fiber paper, graphite non-woven fabric, graphite paper or fiber filament bundle.
14. The carbon material heater according to claim 1, characterized in that, the carbon material heater is a non-linear heater.
15. A semiconductor reactor, characterized in that, it has the carbon material heater described in any one of claims 1-14.
16. The semiconductor reactor according to claim 15, characterized in that, the semiconductor reactor includes a chemical vapor deposition reactor or a rapid thermal annealing reactor.
Citation Information
Patent Citations
Carbon fiber tool heating cage for vacuum thermal test
CN106608378A
Chemical vapor deposition system
CN113818000A