Fingerprint recognition device and electronic device

Abstract

A fingerprint identification device and an electronic device. The fingerprint identification device comprises: a fingerprint sensing chip; a substrate arranged below the fingerprint sensing chip, the substrate comprising a first connection area and a first connection region, the first connection area being located in a central area of the substrate, the first connection region being located around the first connection area and in an edge area of the substrate, and the fingerprint sensing chip being electrically connected with the substrate through the first connection area. The fingerprint identification device and the electronic device of the embodiments of the present application can improve the security performance of the fingerprint identification device.

Description

Technical Field

[0001] This application relates to the field of fingerprint recognition technology, and more specifically, to a fingerprint recognition device and electronic device. Background Technology

[0002] During the use of capacitive fingerprint recognition modules, the fingerprint recognition area needs to be directly touched by the finger. Since the human body carries static electricity, a momentary discharge occurs when the finger touches the fingerprint recognition area, which can affect the accuracy and sensitivity of the fingerprint recognition module. Therefore, fingerprint recognition modules require specific electrostatic discharge (ESD) protection designs.

[0003] With the development of existing mobile phones and other electronic devices, the size requirements for fingerprint recognition modules are becoming increasingly stringent. For example, as the thickness of mobile phones decreases, the size requirements for fingerprint recognition modules applied to the sides of the phone are also becoming narrower. This makes it increasingly difficult for ESD protection designs on fingerprint recognition modules to be compatible. If an effective ESD discharge path cannot be created, static electricity can accumulate in parts of the fingerprint recognition module, such as reinforcing steel sheets, potentially causing secondary breakdowns of the circuit board, or discharging static electricity to other weak points in the fingerprint recognition module, which is actually more detrimental to the security of the fingerprint recognition module. Summary of the Invention

[0004] This application provides a fingerprint recognition device and an electronic device that can improve the security performance of the fingerprint recognition device.

[0005] In a first aspect, a fingerprint recognition device is provided, comprising: a fingerprint sensing chip; and a substrate disposed below the fingerprint sensing chip, the substrate including a first connection area and a first contact area, the first connection area being located in the central region of the substrate, the first contact area being located around the first connection area and in the edge region of the substrate, and the fingerprint sensing chip being electrically connected to the substrate through the first connection area.

[0006] In the technical solution of this application embodiment, the first contact area of ​​the substrate is located around the first connection area and at the edge of the substrate. It does not affect the first connection area and can realize electrostatic discharge, ensuring the anti-static capability of the fingerprint recognition device, as well as the reliability and security of the fingerprint recognition device.

[0007] In one possible implementation, the substrate has a multilayer structure, the multilayer structure includes a first wiring layer, the first connection area and the first contact area are located on the first wiring layer, the first connection area includes a first pad, and the fingerprint sensor chip is electrically connected to the substrate through the first pad.

[0008] In one possible implementation, the substrate further includes a second connection area and a second contact area, the second connection area being located in the central region of the substrate, and the second contact area being located around the second connection area and in the edge region of the substrate. The fingerprint recognition device further includes a circuit board disposed below the substrate, the circuit board being electrically connected to the substrate through the second connection area.

[0009] In one possible implementation, the second connection area corresponds to the first connection area and is located below the first connection area; and / or, the second connection area corresponds to the first connection area and is located below the first connection area.

[0010] In one possible implementation, the substrate is a multilayer structure, the multilayer structure includes a second wiring layer, the second connection area and the second contact area are located on the second wiring layer, the second connection area includes a second pad, and the circuit board is electrically connected to the substrate through the second pad.

[0011] In one possible implementation, the fingerprint recognition device further includes a reinforcing plate located below the circuit board.

[0012] In one possible implementation, the first end face of the first contact area, which is away from the first connection area, is located on the second end face of the substrate, and the second end face is a cut surface of the substrate.

[0013] In one possible implementation, the first contact area surrounds the first connection area, and the first contact area is a ring-shaped copper-paved area.

[0014] In one possible implementation, the first grounding area includes a first grounding wire surrounding the first connection area, and a plurality of second grounding wires connected to and spaced apart from the first grounding wire, each of the plurality of second grounding wires extending from the first grounding wire in a direction away from the first grounding wire.

[0015] In one possible implementation, the fingerprint recognition device further includes an encapsulation layer disposed above the fingerprint sensing chip, the encapsulation layer being used to encapsulate the fingerprint sensing chip and the substrate.

[0016] In one possible implementation, the fingerprint recognition device is a capacitive fingerprint recognition device.

[0017] In a second aspect, an electronic device is provided, comprising: a fingerprint recognition device according to the first aspect or any possible implementation thereof, the fingerprint recognition device being located on the side of the electronic device. Attached Figure Description

[0018] Figure 1 This is a top view of a possible circuit board in a fingerprint recognition module.

[0019] Figure 2 This is a top view of another possible circuit board in a fingerprint recognition module.

[0020] Figure 3 This is a cross-sectional schematic diagram of a fingerprint recognition module.

[0021] Figure 4 This is a top view schematic diagram of a possible circuit board according to an embodiment of this application.

[0022] Figure 5 This is a top view schematic diagram of a fingerprint recognition device according to an embodiment of this application, including a substrate.

[0023] Figure 6 This is another top view schematic diagram of the substrate included in the fingerprint recognition device according to an embodiment of this application.

[0024] Figure 7 This is a cross-sectional schematic diagram of a fingerprint recognition device according to an embodiment of this application.

[0025] Figure 8 This is a cross-sectional schematic diagram of the substrate according to an embodiment of this application.

[0026] Figure 9 This is a cross-sectional schematic diagram of the substrate before cutting according to an embodiment of this application.

[0027] Figure 10 This is a top view of the first wiring layer of the substrate according to an embodiment of this application.

[0028] Figure 11 This is another top view schematic diagram of the first wiring layer of the substrate according to an embodiment of this application.

[0029] Figure 12 This is a top view of the second wiring layer of the substrate according to an embodiment of this application.

[0030] Figure 13 This is another top view schematic diagram of the second wiring layer of the substrate according to an embodiment of this application. Detailed Implementation

[0031] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0032] It should be understood that the embodiments of this application can be applied to optical fingerprint systems, including but not limited to optical fingerprint recognition systems and products based on optical fingerprint imaging. The embodiments of this application are only illustrated using optical fingerprint systems as an example, but should not be construed as limiting the embodiments of this application in any way. The embodiments of this application are also applicable to other systems that use optical imaging technology.

[0033] Existing fingerprint recognition modules typically incorporate ESD protection designs on flexible printed circuit boards (FPCs), such as adding a grounding terminal (GND) to the edge of the FPC. The reinforcing steel sheet inside the fingerprint recognition module can be connected to the GND location of the FPC using conductive adhesive.

[0034] Figure 1 and Figure 2 The diagrams show top views of two possible FPCs in existing fingerprint recognition modules, for example, Figure 1 The FPC 11 shown is relatively large and can be used in fingerprint recognition modules on the back of mobile phones; while Figure 2 The FPC12 shown is relatively small in size and has an overall elongated shape, making it suitable for use in fingerprint recognition modules on the side of mobile phones.

[0035] like Figure 1 As shown, the FPC 11 may include GND 111, the distribution of which can be configured according to the actual application. Additionally, the area containing GND 111 also includes a window area 112, allowing the fingerprint recognition module to discharge static electricity through the window area 112.

[0036] Similarly, such as Figure 2 As shown, FPC 12 includes GND 121, the distribution of which can be configured according to the actual application. For example, it can typically be located at the edge of FPC 12. In addition, the area where GND 121 is located also includes a window area 122, so that the fingerprint recognition module can discharge static electricity through the window area 122.

[0037] Figure 3 A cross-sectional schematic diagram of an existing fingerprint recognition module 10 is shown, wherein the fingerprint recognition module 10 is a capacitive fingerprint recognition module as an example for illustration. Figure 3 As shown, the fingerprint recognition module 10, from top to bottom, may include: an epoxy molding compound (EMC) 101, a fingerprint chip 102, a substrate 104, an FPC 105, and a reinforcing steel sheet 106. The fingerprint chip 102 can be fixed to the substrate 104 using non-conductive adhesive 103. The EMC 101 is used to encapsulate the fingerprint chip 102 and the substrate 104. It should be understood that, as... Figure 3 As shown, the FPC 105 may have an opening area 1051, which exposes the GND for static electricity discharge. For example, the opening area 1051 may be located on both sides of the FPC 105, specifically on the upper and lower surfaces of the FPC 105. Within the lower opening area 1051, the reinforcing steel sheet 106 can be electrically connected to the GND of the FPC 105 using conductive adhesive or the like.

[0038] Optionally, the Figure 3 The FPC 105 shown can be as follows: Figure 1 The cross-sectional view of FPC 11 shown is perpendicular to... Figure 1 The surface of the FPC 11 shown, the window area 1051 included in the FPC 105 can be Figure 1 The side view of the windowed area 112 shown; or, the Figure 3 The FPC 105 shown can also be as follows: Figure 2 The cross-sectional view of FPC 12 shown is perpendicular to... Figure 2 The surface of the FPC 12 shown, Figure 3 The window area 1051 shown can be Figure 1 The side view of the windowed area 112 shown.

[0039] Specifically, Figure 3 It also shows the possible paths of ESD. For example... Figure 3 As shown, when a finger touches the fingerprint recognition area of ​​the fingerprint recognition module 10, for example, the finger may touch the upper surface of the EMC 101 or the surface of the protective layer on the upper surface of the EMC 101, static electricity may be generated on the surface of the EMC 101. A portion of this static electricity can be transmitted to the window area 1051 on the upper surface of the FPC 105, where the window area 1051 exposes GND, thus releasing the static electricity. Additionally, a portion of the static electricity may be transmitted to the reinforcing steel sheet 106 below. This portion of static electricity can then pass through the reinforcing steel sheet 106, and then through the window area 1051 located below the FPC 105 and electrically connected to the reinforcing steel sheet 106, and finally be transmitted to the GND of the FPC 105, thereby releasing the static electricity.

[0040] However, with the development of existing mobile phones and other electronic devices, the size requirements for fingerprint recognition modules are becoming increasingly stringent. For example, as the thickness of mobile phones decreases, the size requirements for fingerprint recognition modules applied to the side of the phone are also becoming narrower, which makes it increasingly difficult for the ESD protection design on the fingerprint recognition module to be compatible. Figure 4 A top view schematic diagram of another possible FPC in existing fingerprint recognition modules is shown. Figure 4The FPC 13 shown is elongated and can be used in fingerprint recognition modules on the side of mobile phones. Specifically, as... Figure 4 As shown, due to the limited side dimensions of the phone, the width of FPC 13 is very small, making it impossible to achieve the same results as before. Figure 2 The FPC 12 shown has a GND window design to release static electricity, and the FPC 13 also cannot have a GND window to connect the reinforcing steel sheet through conductive adhesive. In this case, the fingerprint recognition module cannot generate an effective ESD discharge path, and static electricity may even accumulate through the reinforcing steel sheet, leading to secondary breakdown and discharge to the weak points of the fingerprint recognition module, which is actually more detrimental to the security of the fingerprint recognition module.

[0041] Therefore, embodiments of this application provide a fingerprint recognition device and an electronic device that can solve the above-mentioned problems.

[0042] Figure 5 and Figure 6 Possible schematic diagrams of the substrates included in the fingerprint recognition devices according to embodiments of this application are shown. Figure 5 and Figure 6 As shown, the fingerprint recognition device in this application embodiment may include: a fingerprint sensing chip ( Figure 5 (Not shown in the image). Substrate 21 is disposed below the fingerprint sensor chip. The substrate 21 includes a first connection area 211 and a first contact area 212. The first connection area 211 is located in the central region of the substrate 21, and the first contact area 212 is located around the first connection area 211 and in the edge region of the substrate 21. The fingerprint sensor chip is electrically connected to the substrate 21 through the first connection area 211.

[0043] It should be understood that the fingerprint sensing chip in the embodiments of this application can be used for fingerprint recognition. Specifically, during fingerprint recognition, when a finger touches the fingerprint recognition area of ​​the fingerprint recognition module, the fingerprint sensing chip can receive a signal carrying the fingerprint information of the finger. For example, the fingerprint recognition device in the embodiments of this application can be a capacitive fingerprint recognition device, in which case the fingerprint sensing chip can be used to receive an electrical signal carrying the fingerprint information of the finger, so as to perform fingerprint recognition through the electrical signal, but the embodiments of this application are not limited thereto.

[0044] In this embodiment, the substrate 21 is located below the fingerprint sensor chip and can be used to transmit signals carrying fingerprint information received by the fingerprint sensor chip. Specifically, the substrate 21 includes a first connection area 211, through which the substrate 21 can achieve electrical connection with the fingerprint sensor chip. Optionally, as... Figure 5 and Figure 6As shown, the first connection area 211 can be located in the central region of the substrate 21, while the first grounding area 212 is located around the first connection area 211 and at the edge of the substrate 21. The first grounding area 212 is the area where GND is located. For example, the first grounding area 212 can be located at at least one edge of the first connection area 211. This facilitates wiring and processing and avoids interference between the first grounding area 212 and the first connection area 211.

[0045] Therefore, the fingerprint recognition device of this application embodiment includes a fingerprint sensing chip and a substrate 21. A first connection area 211 and a first contact area 212 are provided on the substrate 21. The first connection area 211 is located in the central region of the substrate 21 and can be used to realize the electrical connection between the substrate 21 and the fingerprint sensing chip. The first contact area 212 is located around the first connection area 211 and is located in the edge region of the substrate 21. It does not affect the first connection area 211 and can realize electrostatic discharge, ensuring the anti-static capability of the fingerprint recognition device, avoiding damage to the weak area of ​​the fingerprint recognition device, and ensuring the reliability and security of the fingerprint recognition device.

[0046] Optionally, the wiring method and distribution location of the first junction area 212 in this application embodiment can be set according to actual application. For example, the first junction area 212 can be located on one or more edge areas of the first connection area 211. Specifically, as Figure 5 and Figure 6 As shown, the first contact area 212 surrounds the first connection area 211. That is, the first contact area 212 can be configured as a ring surrounding the first connection area 211, such as a square ring, a circular ring, or other rings. In other words, the first contact area 212 is provided around the first connection area 211, so that static electricity around the substrate 21 can be released through the first contact area 212, improving the static discharge effect and increasing the security of the fingerprint recognition device 20. Alternatively, unlike... Figure 5 and Figure 6 In this configuration, the first contact area 212 can also be located only in a portion of the edge area of ​​the first connection area 211. For example, the first contact area 212 can be located on either side of the first connection area 211, or on two opposite or intersecting sides of the first connection area 211, to save space. For ease of description, the embodiments of this application mainly focus on... Figure 5 and Figure 6 The following description uses the setup method shown as an example.

[0047] Specifically, such as Figure 5As shown, in this embodiment of the application, the first grounding area 212 is a ring-shaped copper-plated area, meaning that the first grounding area 212 can be a continuous area, forming a ring around the first connection area 211. This ring-shaped area is configured by copper plating to improve the electrostatic discharge effect of the first grounding area 212. Optionally, the shape of the ring-shaped copper-plated area can also be set according to actual applications. For example, the ring-shaped copper-plated area can be as follows: Figure 5 The ring shown is approximately rectangular, but it could also be a circular ring or other shapes.

[0048] Or, such as Figure 6 As shown, the first grounding area 212 in this embodiment includes a first grounding wire 2121 surrounding the first connection area 211, and a plurality of second grounding wires 2122 connected to the first grounding wire 2121 and spaced apart from each other. Each of the plurality of second grounding wires 2122 extends from the first grounding wire 2121 in a direction away from the first grounding wire 2121, or in other words, extends in a direction away from the first connection area 211. Unlike Figure 5 The setup method for the first junction area 212 shown can be simplified by adopting a different approach. Figure 6 The configuration shown for the first grounding area 212 balances electrostatic discharge effectiveness and manufacturing difficulty. The spacing L between adjacent second grounding wires 2122 within the first grounding area 212 can be adjusted according to the specific application. For example, a larger L facilitates wiring and manufacturing, while a smaller L improves the electrostatic discharge effect of the first grounding area 212.

[0049] It should be understood that the first contact area 212 in this embodiment is located at the edge of the substrate 21, and may include at least a portion of the first contact area 212 belonging to the side of the substrate 21. For example, as Figure 5 and Figure 6 As shown, the upper and lower sides of the first contact area 212 are located on the side of the substrate 21; while the left and right sides of the first contact area 212 are located close to the edge of the substrate 21. However, there is still a partial area between the left and right sides of the first contact area 212 and the edge of the substrate 21. For example, this partial area can be used to set other components, but the embodiments of this application are not limited to this.

[0050] The fingerprint recognition device of this application embodiment will now be described in detail with reference to the accompanying drawings. Figure 7A cross-sectional schematic diagram of a fingerprint recognition device 20 according to an embodiment of this application is shown. The fingerprint recognition device 20 of this application embodiment can be applied to electronic devices, such as mobile phones or laptops. The type of fingerprint recognition device 20 can be set according to actual applications, and its position in the electronic device can be reasonably set according to its type. For example, for ease of explanation, this application uses a capacitive fingerprint recognition device 20 as an example.

[0051] The capacitive fingerprint recognition device 20 can be placed anywhere on the electronic device. For example, it can be placed on the side of the electronic device. Taking a mobile phone as an example, in order not to affect the size of the display area on the front of the phone and to maximize the display area, the fingerprint recognition device 20 can usually be located on the side or the back of the phone. This application embodiment is not limited to this.

[0052] like Figure 7 As shown, in this embodiment of the application, the fingerprint sensor chip 22 is located above the substrate 21, and the fingerprint sensor chip 22 can be fixed to the upper surface of the substrate 21 by the connection structure 23. For example, the connection structure 23 can be a non-conductive adhesive, etc., and this embodiment of the application is not limited to this.

[0053] Optionally, the fingerprint recognition device 20 may further include an encapsulation layer 24 disposed above the fingerprint sensing chip 22, the encapsulation layer 24 being used to encapsulate the fingerprint sensing chip 22 and the substrate 21. Specifically, as shown... Figure 7 As shown, the encapsulation layer 24 can cover the upper surface of the fingerprint sensor chip 22, and can also be used to cover at least a portion of the upper surface of the substrate 21 to achieve encapsulation of the fingerprint sensor chip 22 and the substrate 21. This embodiment is not limited to this. Optionally, the material of the encapsulation layer 24 can be set according to the actual application. For example, the encapsulation layer can be made of EMC or other materials.

[0054] Optionally, such as Figure 7 As shown, the fingerprint recognition device 20 of this application embodiment further includes: a circuit board 25 disposed below the substrate 21. The circuit board 25 can be electrically connected to the substrate 21 to receive a signal carrying fingerprint information transmitted through the substrate 21, so as to perform fingerprint recognition.

[0055] Correspondingly, such as Figure 7 As shown, the substrate 21 also includes a second connection area 213 and a second contact area 214. The second connection area 213 is located in the central region of the substrate 21, and the second contact area 214 surrounds the second connection area 213 and is located in the edge region of the substrate 21. The circuit board 25 is electrically connected to the substrate 21 through the second connection area 213.

[0056] It should be understood that, similar to the arrangement of the first junction area 212, the wiring method and distribution location of the second junction area 214 in this embodiment can be configured according to actual applications. Specifically, the second junction area 214 can be located on one or more edge areas of the second connection area 213. For example, the arrangement of the second junction area 214 can adopt a similar... Figure 5 or Figure 6 The arrangement of the first contact area 212 shown indicates that the second contact area 214 can surround the second connection area 213, so that the second connection area 213 is surrounded by the second contact area 214. Static electricity can be released through the surrounding second contact areas 214, improving the static electricity release effect and increasing the security of the fingerprint recognition device 20. Alternatively, it can be different. Figure 5 and Figure 6 In this configuration, the second contact area 214 can also be located only in a portion of the edge area of ​​the second connection area 213. For example, the second contact area 214 can be located on either side of the second connection area 213, or on two opposite or intersecting sides of the second connection area 213, to save space. For ease of description, the embodiments of this application mainly use a similar configuration for the second contact area 214. Figure 5 and Figure 6 The following description uses the setup method shown as an example.

[0057] In addition, the second contact area 214 may be configured in the same way as or different from the first contact area 212. For example, the second contact area 214 may be configured in the same way as the first contact area 212 to improve the processing efficiency of the substrate 21, but the embodiments of this application are not limited thereto.

[0058] Optionally, such as Figure 7 As shown, the fingerprint recognition device 20 in this embodiment of the application further includes a reinforcing plate 26, which is located below the circuit board 25. The reinforcing plate 26 can be used to increase the strength of the fingerprint recognition device 20, or in other words, the reinforcing plate 26 can be used to support the components located above the reinforcing plate 26.

[0059] like Figure 7As shown, when a finger performs fingerprint recognition, static electricity may be generated on the surface of the encapsulation layer 24. The ESD path of the fingerprint recognition device 20 may include: a portion of the generated static electricity can be transmitted to the first grounding area 212 and released by the first grounding area 212; another portion of the static electricity may pass through the circuit board 25 and / or the reinforcing plate 26 to reach the second grounding area 214 and be released by the second grounding area 214, thereby effectively releasing all or most of the static electricity and avoiding damage to some weak areas of the fingerprint recognition device 20. For example, it can avoid damaging the surface of the fingerprint recognition device 20, or the circuit board 25 of the fingerprint recognition device 20, thus avoiding damage to the circuit board 25 and ensuring the security of the fingerprint recognition device 20.

[0060] In this embodiment, electrostatic discharge can be achieved by providing a first grounding area 212 on the substrate 21, without the need to provide an additional grounding area for electrostatic discharge on the circuit board 25. For example, there is no need to provide a window area on the circuit board 25, which can save space on the circuit board 25. This is suitable for scenarios with strict requirements on the size of the circuit board 25, especially scenarios where the size of the circuit board 25 is small. For example, it can be applied to scenarios such as the side of a mobile phone. It can meet the size requirements of the fingerprint recognition device, and also ensure the reliability and security of the fingerprint recognition device, and has good anti-static performance.

[0061] The substrate 21 of the present application embodiment will now be described in detail with reference to the accompanying drawings. Figure 8 A cross-sectional schematic diagram of the substrate 21 according to an embodiment of this application is shown. For example, the substrate 21 is shown. Figure 8 The cross-section of the substrate 21 shown can be compared with... Figure 7 The cross-section of the substrate 21 shown is the same. For example... Figure 8 As shown, the substrate 21 has a multilayer structure, which includes a first wiring layer 201. The first connection area 211 and the first contact area 212 are located in the first wiring layer 201 to facilitate the wiring distribution of the first connection area 211 and the first contact area 212.

[0062] Optionally, such as Figure 8 As shown, the first connection area 211 of the first wiring layer 201 may include a first signal area 2112. The first signal area 2112 may be used to transmit the fingerprint signal of the fingerprint sensor chip 22. For example, the first signal area 2112 may be used to receive the fingerprint signal acquired by the fingerprint sensor chip 22. The fingerprint signal carries fingerprint information for fingerprint recognition.

[0063] In addition, the first wiring layer 201 may also be provided with ink, which covers at least part of the first wiring layer 201. For example, the ink may cover part of the surface of the first signal area 2112 of the first wiring layer 201, or part of the surface of the first contact area 212, to protect the first wiring layer 201.

[0064] Optionally, such as Figure 8 As shown, the multi-layer structure may further include: a second wiring layer 202, with the second connection area 213 and the second junction area 214 located in the second wiring layer 202, so as to facilitate the wiring distribution of the second connection area 213 and the second junction area 214.

[0065] Optionally, such as Figure 8 As shown, the second connection area 213 may include a second signal area 2132, which can be used to transmit fingerprint signals. For example, the second signal area 2132 can be used to receive fingerprint signals, such as fingerprint signals transmitted through the first signal area 2112 of the first trace layer 201, and send the received fingerprint signals to the circuit board 25. The fingerprint signals carry fingerprint information for fingerprint recognition.

[0066] In addition, similar to the first routing layer 201, the second routing layer 202 may also be provided with ink, which covers at least a portion of the second routing layer 202. For example, the ink may cover a portion of the surface of the second signal area 2132 of the second routing layer 202, or a portion of the surface of the second contact area 214, to protect the second routing layer 202.

[0067] Optionally, such as Figure 8 As shown, a core material 203 may also be included between the first wiring layer 201 and the second wiring layer 202. The core material 203 can prevent the substrate 21 from warping and improve electrical performance. The material of the core material 203 can be selected according to the actual application.

[0068] It should be understood that the first connection area 211 of the first wiring layer 201 can be used to realize the electrical connection with the fingerprint sensor chip 22, and the second connection area 213 of the second wiring layer 202 can be used to realize the electrical connection with the circuit board 25. Therefore, the first wiring layer 201 can be set closer to the fingerprint sensor chip 22, and the second wiring layer 202 can be set closer to the circuit board 25, that is, the first wiring layer 201 is located above the second wiring layer 202, so as to shorten the connection path.

[0069] Furthermore, to improve processing efficiency, the first connection area 211 and the second connection area 213 in this embodiment can be configured correspondingly to each other, and the first contact area 212 can also be configured correspondingly to the second contact area 214. For example, as Figure 8As shown, the second connection area 213 corresponds to the first connection area 211 and is located below the first connection area 211; and / or, the second connection area 214 corresponds to the first connection area 212 and is located below the first connection area 212.

[0070] In the embodiments of this application, such as Figure 8 As shown, the first end face 2123 of the first contact area 212, away from the first connection area 211, is located on the second end face 215 of the substrate 21, and the second end face 215 is a cut surface of the substrate 21. Specifically, the first end face 2123 can be an exposed copper area of ​​the first contact area 212 to facilitate electrostatic discharge. The first contact area 212 can have at least one first end face 2123, for example, Figure 8 Taking the first contact area 212 having two first end faces 2123 on the left and right as an example, both first end faces 2123 can realize electrostatic discharge.

[0071] Similarly, such as Figure 8 As shown, the third end face 2141 of the second contact area 214, which is away from the second connection area 213, can also be located on the second end face 215 of the substrate 21, that is, both the first end face 2123 and the third end face 2141 can be located on the cut surface of the substrate 21. Furthermore, the second contact area 214 can have at least one third end face 2141, for example, Figure 8 Taking the second contact area 214 having two third end faces 2141 on the left and right as an example, both of the second third end faces 2141 can realize electrostatic discharge.

[0072] Figure 9 A schematic diagram of the substrate 21 before cutting, according to an embodiment of this application, is shown. Figure 9 As shown, taking a substrate 21 with cutting lines on both sides as an example, the cutting lines on both sides are the first cutting line 31 and the second cutting line 32, respectively. Before cutting the substrate 21, the edge region of the substrate 21 is set as a ground region. This ground region extends outward and has a large area, so that the first cutting line 31 and the second cutting line 32 are respectively located within the ground region. When cutting the substrate 21, cutting is performed along the first cutting line 31 and the second cutting line 32, respectively, to obtain the desired result. Figure 8 The substrate 21 shown has a first end face 2123 of the first contact area 212 and a third end face 2141 of the second contact area 214 as part of a cut surface of the substrate 21, so as to expose the first end face 2123 and the third end face 2141, so that the first end face 2123 of the first contact area 212 and the third end face 2141 of the second contact area 214 achieve the effect of exposing copper, thereby releasing static electricity.

[0073] It should be understood that, such as Figure 8 and Figure 9As shown, the substrate 21 in this embodiment can be a multilayer structure, which may include multiple wiring layers. These multiple wiring layers may include at least one first wiring layer 201 and / or at least one second wiring layer 202, as described in this embodiment. Specifically, when the substrate 21 in this embodiment is a multilayer structure, the multilayer structure may include multiple wiring layers, each of which may have a grounding area for electrostatic discharge. For example, the multiple wiring layers may include one or more first wiring layers 201, which are directly electrically connected to the fingerprint sensor chip 22 or indirectly electrically connected through other structures. As another example, the multiple wiring layers may also include one or more second wiring layers 202, which are directly electrically connected to the circuit board 25 or indirectly electrically connected through other structures. Furthermore, since the multiple wiring layers can be electrically connected to each other, the multiple wiring layers can be regarded as including multiple wiring layers that are simultaneously electrically connected to the fingerprint sensor chip 22 and the circuit board 25. That is, the multiple wiring layers can be regarded as either the first wiring layer 201 or the second wiring layer 202. The embodiments of this application are not limited to this.

[0074] Figure 10 and Figure 11 The following are schematic top views of the first wiring layer 201 of the substrate 21 in embodiments of this application before cutting. For example, the... Figure 10 and Figure 11 The first routing layer 201 shown can be Figure 9 The diagram shown is a top view of the first routing layer 201, in which... Figure 10 and Figure 11 Two possible configurations for the first junction area 212 are shown. Figure 12 and Figure 13 The following are schematic top views of the second wiring layer 202 of the substrate 21 in embodiments of this application before cutting. For example, the... Figure 12 and Figure 13 The second routing layer 202 shown can be Figure 9 The diagram shows a top view of the second routing layer 202, in which... Figure 12 and Figure 13 Two possible configurations for the second junction area 214 are shown.

[0075] like Figure 10 and Figure 11As shown, in this embodiment of the application, the first contact area 212 is disposed around the first connection area 211. Optionally, the first connection area 211 includes a first pad 2111, through which the fingerprint sensor chip 22 is electrically connected to the substrate 21. Additionally, the first connection area 211 may also include a first signal area 2112 for transmitting fingerprint signals. It should be understood that since the substrate 21 in this embodiment of the application may include a plurality of first wiring layers 201, the first connection area 211 of each of the plurality of first wiring layers 201 can be electrically connected to the fingerprint sensor chip 22. For example, for any one first connection area 211, the first connection area 211 can be directly electrically connected to the fingerprint sensor chip 22, or indirectly electrically connected. In addition, the first wiring layer 201 of the substrate 21 that is closest to the fingerprint sensor chip 22 may include a first pad 2111. The first wiring layer 201 and the fingerprint sensor chip 22 are electrically connected by soldering the first pad 2111 to the fingerprint sensor chip 22.

[0076] Similar to the structure of the first routing layer 201, such as Figure 12 and Figure 13 As shown, in this embodiment of the application, the second contact area 214 is disposed around the second connection area 213. Optionally, the second connection area 213 includes a second pad 2131, through which the circuit board 25 is electrically connected to the substrate 21. Additionally, the second connection area 213 may also include a second signal area 2132 for transmitting fingerprint signals. It should be understood that since the substrate 21 in this embodiment of the application may include a plurality of second wiring layers 202, the second connection area 213 of each of the plurality of second wiring layers 202 can be electrically connected to the circuit board 25. For example, for any one second connection area 213, the second connection area 213 can be directly electrically connected to the circuit board 25, or indirectly electrically connected. Furthermore, for the second wiring layer 202 of the substrate 21 closest to the circuit board 25, the second wiring layer 202 may include a second pad 2131, and the electrical connection between the second wiring layer 202 and the circuit board 25 is achieved through soldering between the second pad 2131 and the circuit board 25.

[0077] The wiring method and distribution location of the first junction area 212 in this embodiment can be set according to actual applications. For example, Figure 10 and Figure 11 As shown, regardless of the method used, before cutting, the grounding area of ​​the first wiring layer 201 is relatively large, and the third cutting line 33 of the first wiring layer 201 passes through the grounding area. Thus, when cutting the first wiring layer 201 of the substrate 21, cutting along the third cutting line 33 yields the desired result. Figure 8The first wiring layer 201 of the cut substrate 21 shown has its first end face 2123 of the first contact area 212 of the substrate 21 becoming part of the cut surface of the substrate 21, thus exposing the first end face 2123 and enabling it to release static electricity. For example, Figure 10 After the first routing layer 201 shown is cut, the following can be obtained: Figure 5 The first junction area 212 is shown; as shown Figure 11 After the first routing layer 201 shown is cut, the following can be obtained: Figure 6 The first junction area shown is 212.

[0078] Similarly, the wiring method and distribution location of the second junction area 214 in this application embodiment can be set according to actual applications. For example, as Figure 12 and Figure 13 As shown, regardless of the method used, the grounding area of ​​the second wiring layer 202 is relatively large before cutting, and the fourth cutting line 34 of the second wiring layer 202 passes through the grounding area. Therefore, when cutting the second wiring layer 202 of the substrate 21, cutting along the fourth cutting line 34 can achieve the following results: Figure 8 The second wiring layer 202 of the cut substrate 21 shown has its third end face 2141 of the second contact area 214 of the substrate 21 becoming part of the cut surface of the substrate 21, thus exposing the third end face 2141 and enabling it to release static electricity. For example, Figure 12 The second junction area 214 obtained after the second wiring layer 202 is cut is set in the same way as shown. Figure 5 Similar; and Figure 13 The second junction area 214 obtained after the second wiring layer 202 is cut is set in the same way as shown. Figure 6 similar.

[0079] It should be understood that the first wiring layer 201 in this embodiment can be cut separately by the third cutting line 33, and the second wiring layer 202 can be cut separately by the fourth cutting line 34; or, the third cutting line 33 and the fourth cutting line 34 can be the same, that is, the first wiring layer 201 and the second wiring layer 202 can be cut simultaneously to improve the processing efficiency of the substrate 21. Specifically, as Figure 9 As shown, combined with Figure 10-13 As shown, the third cutting line 33 may include, for example, Figure 9 The first cutting line 31 and the second cutting line 32 shown, as well as the third cutting line 33 and the fourth cutting line 34, overlap and are the same cutting lines, so as to realize the synchronous cutting of the multilayer substrate 21 and improve the processing efficiency.

[0080] It should be understood that the wiring method and distribution location of the first junction area 212 and the second junction area 214 in the embodiments of this application may be the same or different. For example, if the first junction area 212 adopts such... Figure 10 The structure shown indicates that the second junction area 214 can be adopted as follows: Figure 12 The structure shown, or if the first junction 212 adopts such a structure Figure 11 The structure shown indicates that the second junction area 214 can be adopted as follows: Figure 13 The structure shown ensures that the distribution position of the second contact area 214 is consistent with that of the first contact area 212, which facilitates processing. For example, if the first contact area 212 adopts... Figure 10 The structure shown can also be adopted as follows: Figure 13 The structure shown, or if the first junction 212 adopts such a structure Figure 11 The structure shown indicates that the second junction area 214 can be adopted as follows: Figure 12 The structure shown is such that the distribution position of the second contact area 214 is different from that of the first contact area 212. This allows the first contact area 212 and the second contact area 214 to be reasonably set according to the static electricity distribution of the fingerprint recognition device 20 in actual application, so as to improve the anti-static effect.

[0081] Therefore, the fingerprint recognition device 20 of this application embodiment includes a fingerprint sensing chip 22 and a substrate 21. A first connection area 211 and a first contact area 212 are provided on the substrate 21. The first connection area 211 is located in the central region of the substrate 21 and can be used to realize the electrical connection between the substrate 21 and the fingerprint sensing chip 22. The first contact area 212 is located around the first connection area 211 and is located in the edge region of the substrate 21. It does not affect the first connection area 211 and can realize electrostatic discharge, ensuring the anti-static capability of the fingerprint recognition device 20, as well as the reliability and security of the fingerprint recognition device 20. Furthermore, by realizing electrostatic discharge through the first contact area 212 provided on the substrate 21, there is no need to provide an additional contact area for electrostatic discharge on the circuit board 25. For example, there is no need to provide a window area on the circuit board 25, which can save space on the circuit board 25. It is suitable for scenarios with strict requirements on the size of the circuit board 25, especially scenarios where the size of the circuit board 25 is small, such as scenarios where it can be applied to the side of a mobile phone. It can meet the size requirements of the fingerprint recognition device and ensure the reliability and security of the fingerprint recognition device, and has good anti-static performance.

[0082] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fingerprint recognition device, characterized by, The fingerprint recognition device comprises: a fingerprint sensing chip; a substrate arranged below the fingerprint sensing chip, the substrate comprising a first connecting region and a first grounding region, the first connecting region being located in a central region of the substrate, the first grounding region being located around the first connecting region and in an edge region of the substrate, the fingerprint sensing chip being electrically connected to the substrate through the first connecting region; the substrate further comprising a second connecting region and a second grounding region, the second connecting region being located in the central region of the substrate, the second grounding region being located around the second connecting region and in the edge region of the substrate; a circuit board arranged below the substrate, the circuit board being electrically connected to the substrate through the second connecting region; wherein a first end surface of the first grounding region away from the first connecting region is located at a second end surface of the substrate, a third end surface of the second grounding region away from the second connecting region is located at the second end surface of the substrate, and the second end surface is a cutting surface of the substrate; the first end surface is a copper-exposed region of the first grounding region, and other regions of the first grounding region except the first end surface are non-copper-exposed regions; the third end surface is a copper-exposed region of the second grounding region, and other regions of the second grounding region except the third end surface are non-copper-exposed regions.

2. The fingerprint recognition apparatus according to claim 1, characterized in that, The substrate is a multi-layer structure, the multi-layer structure comprising a first wiring layer, the first connecting region and the first grounding region being located in the first wiring layer, the first connecting region comprising a first pad, and the fingerprint sensing chip being electrically connected to the substrate through the first pad.

3. The fingerprint recognition apparatus according to claim 1, wherein The second connecting region corresponds to the first connecting region and is located below the first connecting region; and / or The second grounding region corresponds to the first grounding region and is located below the first grounding region.

4. The fingerprint recognition apparatus according to claim 1, wherein The substrate is a multi-layer structure, the multi-layer structure comprising a second wiring layer, the second connecting region and the second grounding region being located in the second wiring layer, the second connecting region comprising a second pad, and the circuit board being electrically connected to the substrate through the second pad.

5. The fingerprint recognition apparatus according to claim 1, wherein The fingerprint recognition device further comprises: a reinforcing plate located below the circuit board.

6. The fingerprint recognition apparatus according to any one of claims 1 to 5, wherein, The first grounding region surrounds the first connecting region, and the first grounding region is an annular copper-exposed region.

7. The fingerprint recognition apparatus according to claim 6, wherein The first grounding region comprises a first grounding line surrounding the first connecting region, and a plurality of second grounding lines connected to the first grounding line and spaced apart from each other, each second grounding line of the plurality of second grounding lines extending from the first grounding line towards a direction away from the first grounding line.

8. The fingerprint recognition apparatus according to any one of claims 1 to 5, wherein, The fingerprint recognition device further comprises: a packaging layer arranged above the fingerprint sensing chip, the packaging layer being used to package the fingerprint sensing chip and the substrate.

9. The fingerprint recognition apparatus according to any one of claims 1 to 5, wherein, The fingerprint recognition device is a capacitive fingerprint recognition device.

10. An electronic device, comprising: The fingerprint recognition device as claimed in any one of claims 1 to 9 is located at a side edge of the electronic device. ​

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