Multi-modal imaging detection probe and multi-modal imaging detection system

Abstract

The embodiment of the present application discloses a kind of multimode imaging detection probe and multimode imaging detection system.The multimode imaging detection probe includes substrate, thermal module, light module, sound module, magnetic detection module, connecting piece and magnetic module;Thermal module, light module, magnetic detection module and sound module are installed on the first surface of substrate, one magnetic pole of magnetic module is vertically contacted with the second surface of substrate, another magnetic pole of magnetic module is away from substrate, the center of substrate and the center of each magnetic pole of magnetic module are in same straight line, the edge of substrate and magnetic module are wrapped in connecting piece.This scheme can provide thermal energy field, light energy field and magnetic field for the biological tissue to be detected, that is, the same biological tissue to be detected can be measured in multiple physical fields at the same time, so that the sound signal generated by the biological tissue to be detected in thermal energy field, light energy field and magnetic field can be obtained simultaneously, so as to provide important data for medical disease diagnosis.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the technical field of medical imaging, in particular to a multi-mode imaging detection probe and a multi-mode imaging detection system. BACKGROUND

[0002] Multi-physical field coupling detection imaging is performed on biological tissues, and various parameter data obtained are helpful to realize higher-precision disease diagnosis, so that multi-physical field coupling detection imaging on biological tissues has important significance for medical disease diagnosis. However, since different sensors are required for measuring various physical quantities, it is currently difficult to realize multi-physical field measurement on the same biological tissue sample at the same time, that is, to simultaneously obtain multiple physical quantities of the biological tissue in limited experimental space. SUMMARY

[0003] The embodiment of the present application provides a multi-mode imaging detection probe and a multi-mode imaging detection system to solve the problem that it is difficult to perform multi-physical field measurement on the same biological tissue sample at the same time.

[0004] In a first aspect, the embodiment of the present application provides a multi-mode imaging detection probe, which comprises a substrate, a thermal module, a light module, an acoustic module, a magnetic detection module, a connecting piece and a magnetic module.

[0005] The thermal module, the light module, the magnetic detection module and the acoustic module are installed on a first surface of the substrate, one magnetic pole of the magnetic module directly contacts a second surface of the substrate, another magnetic pole of the magnetic module is away from the substrate, a center of the substrate is in a same straight line with a center of each magnetic pole of the magnetic module, and an edge of the substrate and the magnetic module are wrapped in the connecting piece.

[0006] The thermal module is used for generating thermal energy; the thermal module is also used for receiving thermal energy and generating a thermal signal according to the received thermal energy; the light module is used for emitting irradiation light; the light module is also used for receiving reflected light; the magnetic module is used for generating a magnetic field; the magnetic detection module is used for detecting the magnetic field and generating a magnetic signal according to the magnetic field; and the acoustic module is used for detecting a sound wave and generating an acoustic signal according to the sound wave.

[0007] Optionally, the substrate comprises a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole.

[0008] Center points of the first through hole, the second through hole and the fifth through hole are in a same straight line, and the fifth through hole is located in the middle of the first through hole and the second through hole.

[0009] Optionally, the magnetic detection module comprises a first detection unit, a second detection unit, a first conductive shell, a second conductive shell, a third conductive shell and a fourth conductive shell.

[0010] The first detection unit is arranged on the substrate and connected with the third and fourth conductive shells;

[0011] The first conductive shell is arranged in the first through hole, the second conductive shell is arranged in the second through hole, the third conductive shell is arranged in the third through hole, the fourth conductive shell is arranged in the fourth through hole, and the second detection unit is arranged in the fifth through hole;

[0012] The first detection unit is used for detecting a static magnetic field and generating a static magnetic field signal according to the static magnetic field, and the second detection unit is used for detecting an alternating magnetic field and generating an alternating magnetic field signal according to the alternating magnetic field.

[0013] Optionally, the first detection unit comprises a Hall element, the second detection unit comprises a Hall coil, the first conductive shell comprises a first copper shell, the second conductive shell comprises a second copper shell, the third conductive shell comprises a third copper shell, and the fourth conductive shell comprises a fourth copper shell.

[0014] Optionally, the acoustic module is embedded in the second detection unit;

[0015] The acoustic module and the inner side of the second detection unit are filled with insulating material.

[0016] Optionally, the acoustic module comprises an acoustic transducer and an acoustic lens.

[0017] The acoustic lens is installed on the side of the acoustic transducer away from the magnetic module.

[0018] Optionally, the thermal module comprises a thermal emitting unit and a thermal receiving unit.

[0019] The thermal emitting unit is embedded in the third conductive shell, and the thermal receiving unit is embedded in the fourth conductive shell.

[0020] The thermal emitting unit and the inner side of the third conductive shell are filled with insulating material, and the thermal receiving unit and the inner side of the fourth conductive shell are filled with insulating material.

[0021] The thermal emitting unit is used for generating thermal energy, and the thermal receiving unit is used for receiving the thermal energy and generating a thermal signal according to the received thermal energy.

[0022] Optionally, the thermal emitting unit comprises an electric heating wire, and the thermal receiving unit comprises a thermocouple.

[0023] Optionally, the optical module comprises an optical emitting unit and an optical receiving unit.

[0024] The optical emitting unit is embedded in the first conductive shell, and the optical receiving unit is embedded in the second conductive shell.

[0025] The optical emitting unit and the inner side of the first conductive shell are filled with insulating material, and the optical receiving unit and the inner side of the second conductive shell are filled with insulating material.

[0026] The light emitting unit is configured to emit the irradiation light, and the light receiving unit is configured to receive the reflected light.

[0027] Optionally, the light emitting unit comprises a first optical fiber and a first optical lens, and the light receiving unit comprises a second optical fiber and a second optical lens.

[0028] The first optical lens is installed on a side of the first optical fiber away from the magnetic module, and the second optical lens is installed on a side of the second optical fiber away from the magnetic module.

[0029] Optionally, the multi-mode imaging detection probe further comprises an interface module.

[0030] The interface module comprises a thermal module interface, an optical module interface, an acoustic module interface, a magnetic detection module interface, and a magnetic module interface.

[0031] The thermal module interface is connected with the thermal module, the optical module interface is connected with the optical module, the acoustic module interface is connected with the acoustic module, the magnetic detection module interface is connected with the magnetic detection module, and the magnetic module interface is connected with the magnetic module.

[0032] In a second aspect, the embodiments of the present application further provide a multi-mode imaging detection system, which comprises the multi-mode imaging detection probe, the thermal detection device, the acoustic detection device, the magnetic detection device, the optical detection device, and the upper computer in any of the above embodiments.

[0033] The multi-mode imaging detection probe is connected with the thermal detection device, the acoustic detection device, the magnetic detection device, and the optical detection device, and the thermal detection device, the acoustic detection device, the magnetic detection device, and the optical detection device are connected with the upper computer.

[0034] The thermal detection device is configured to provide electrical energy for the multi-mode imaging detection probe and detect the thermal signal received by the multi-mode imaging detection probe; the acoustic detection device is configured to detect the acoustic signal received by the multi-mode imaging detection probe; the magnetic detection device is configured to provide current for the multi-mode imaging detection probe and detect the magnetic signal received by the multi-mode imaging detection probe; and the optical detection device is configured to provide irradiation light for the multi-mode imaging detection probe and detect the reflected light received by the multi-mode imaging detection probe.

[0035] In the embodiments of the present application, the multi-mode imaging detection probe formed by integrating the thermal module, the optical module, the acoustic module, the magnetic detection module, and the magnetic module through the substrate and the connecting piece can simultaneously provide a thermal energy field, an optical energy field, and a magnetic field for the biological tissue to be detected, that is, the same biological tissue to be detected can be measured in the same time, so that the acoustic signal generated by the biological tissue to be detected in the thermal energy field, the acoustic signal generated by the biological tissue to be detected in the optical energy field, and the acoustic signal generated by the biological tissue to be detected in the magnetic field can be obtained simultaneously, thereby providing important data for medical disease diagnosis. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 A structural schematic diagram of a multi-mode imaging detection probe provided by an embodiment of the present application is shown in FIG. 1.

[0037] Figure 2 A top view of a substrate structure provided by an embodiment of the present application is shown in FIG. 2.

[0038] Figure 3 A structural schematic diagram of another multi-mode imaging detection probe provided by an embodiment of the present application is shown in FIG. 3.

[0039] Figure 4 A structural schematic diagram of an acoustic lens provided by an embodiment of the present application is shown in FIG. 4.

[0040] Figure 5 A structural schematic diagram of a first optical lens or a second optical lens provided by an embodiment of the present application is shown in FIG. 5.

[0041] Figure 6 A structural schematic diagram of an interface module provided by an embodiment of the present application is shown in FIG. 6.

[0042] Figure 7 A structural schematic diagram of another interface module provided by an embodiment of the present application is shown in FIG. 7.

[0043] Figure 8 A structural schematic diagram of a multi-mode imaging detection system provided by an embodiment of the present application is shown in FIG. 8.

[0044] Figure 9 A structural schematic diagram of another multi-mode imaging detection system provided by an embodiment of the present application is shown in FIG. 9. DETAILED DESCRIPTION

[0045] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in connection with the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0046] The embodiments of the present application provide a multi-mode imaging detection probe, Figure 1 A structural schematic diagram of a multi-mode imaging detection probe provided by an embodiment of the present application is shown in FIG. 1. Figure 1As shown, the multi-mode imaging detection probe includes a substrate 110, a thermal module 120, an optical module 130, an acoustic module 140, a magnetic detection module 150, a connector 160, and a magnetic module 170. The thermal module 120, optical module 130, magnetic detection module 150, and acoustic module 140 are mounted on the first surface of the substrate 110. One magnetic pole of the magnetic module 170 is in perpendicular contact with the second surface of the substrate 110, and the other magnetic pole of the magnetic module 170 is away from the substrate 110. The center of the substrate 110 is aligned with the magnetic module 170. The centers of each magnetic pole are aligned in a straight line, and the edges of the substrate 110 and the magnetic module 170 are enclosed within the connector 160; the thermal module 120 is used to generate heat energy; the thermal module 120 is also used to receive heat energy and generate a thermal signal based on the received heat energy; the optical module 130 is used to emit illumination light; the optical module 130 is also used to receive reflected light; the magnetic module 170 is used to generate a magnetic field; the magnetic detection module 150 is used to detect the magnetic field and generate a magnetic signal based on the magnetic field; the acoustic module 140 is used to detect sound waves and generate an acoustic signal based on the sound waves.

[0047] Among them, the multi-mode imaging detection probe integrates multiple physical field measurement modules, which can perform multi-physical field measurements on the same biological tissue sample at the same time. In other words, it can simultaneously acquire multiple physical quantities of biological tissue, thereby providing important data for the diagnosis of medical diseases.

[0048] Specifically, the substrate 110 is a support fixing plate of each physical field measurement module of the multi-mode imaging detection probe. For example, the thermal module 120, the light module 130, the magnetic detection module 150 and the acoustic module 140 are installed on the first surface of the substrate 110. One magnetic pole of the magnetic module 170 is in vertical contact with the second surface of the substrate 110, the other magnetic pole of the magnetic module 170 is away from the substrate 110, and the center of the substrate 110 is in the same straight line with the center of each magnetic pole of the magnetic module 170, so that the magnetic field generated by the magnetic module 170 is perpendicular to the substrate 110, that is, each physical field measurement module installed on the substrate 110 is perpendicular to the magnetic field generated by the magnetic module 170. The edge of the substrate 110 and the magnetic module 170 are wrapped in the connecting piece 160, so that the connecting piece 160 can fix the substrate 110 and the magnetic module 170 as a whole, prevent the substrate 110 or the magnetic field module from falling off, and ensure that one magnetic pole of the magnetic module 170 is in vertical contact with the second surface of the substrate 110. The thermal module 120 can generate thermal energy, so as to provide a thermal energy field for the biological tissue to be detected, and detect the reflected thermal energy of the biological tissue to be detected in the thermal energy field, so as to generate a thermal signal according to the reflected thermal energy. The light module 130 can emit irradiation light, so as to provide a light energy field for the biological tissue to be detected, and detect the reflected light of the biological tissue to be detected in the light energy field. The magnetic module 170 can generate a magnetic signal, so as to provide a magnetic energy field for the biological tissue to be detected and the magnetic detection module 150. The magnetic module 170 can be a coil, which can generate a magnetic field when the coil is electrified. The magnetic detection module 150 can detect the magnetic field generated by the magnetic module 170. The acoustic module 140 can detect sound waves and generate an acoustic signal according to the sound waves. The acoustic signal includes a magnetic acoustic signal, a thermal acoustic signal or a light acoustic signal. For example, when the biological tissue to be detected is in a thermal energy field, the acoustic module 140 can generate a thermal acoustic signal; when the biological tissue to be detected is in a light energy field, the acoustic module 140 can generate a light acoustic signal; and when the biological tissue to be detected is in a magnetic field, the acoustic module 140 can generate a magnetic acoustic signal.

[0049] In the embodiment of the present application, the multi-mode imaging detection probe formed by integrating the thermal module, the light module, the acoustic module, the magnetic detection module and the magnetic module through the substrate and the connecting piece can simultaneously provide a thermal energy field, a light energy field and a magnetic field for the biological tissue to be detected, that is, the same biological tissue to be detected can be measured in multiple physical fields at the same time, so that the acoustic signal generated by the biological tissue to be detected in the thermal energy field, the acoustic signal generated by the biological tissue to be detected in the light energy field and the acoustic signal generated by the biological tissue to be detected in the magnetic field can be obtained at the same time, so as to provide important data for medical disease diagnosis.

[0050] Optionally, Figure 2 A top view of the substrate structure provided in the embodiment of the present application is shown in FIG. 2. Figure 2As shown, the substrate 110 includes a first through hole 111, a second through hole 112, a third through hole 113, a fourth through hole 114 and a fifth through hole 115; the center points of the first through hole 111, the second through hole 112 and the fifth through hole 115 are on the same straight line, and the fifth through hole 115 is located in the middle of the first through hole 111 and the second through hole 112.

[0051] Specifically, the first through hole 111 and the second through hole 112 are used to install and fix the light module and the magnetic detection module, and the fifth through hole 115 is used to install and fix the sound module. Among them, the center points of the first through hole 111, the second through hole 112 and the fifth through hole 115 are on the same straight line, and the fifth through hole 115 is located in the middle of the first through hole 111 and the second through hole 112, so that the position fixed by the sound module is in the middle of the light module, which facilitates the sound module to accurately collect sound waves, thereby generating accurate sound signals. The third through hole 113 and the fourth through hole 114 are used to install and fix the heat module and the magnetic detection module.

[0052] It should be noted that, Figure 2 For example, a top view of a substrate structure is shown, the third through hole 113 and the fourth through hole 114 can be at any position on the substrate, and the embodiment does not make specific limitation thereon.

[0053] Figure 3 Another structure schematic diagram of a multi-mode imaging detection probe provided by the embodiment of the present application is shown in the figure, Figure 3 As shown, the magnetic detection module includes a first detection unit 151, a second detection unit 152, a first conductive shell 153, a second conductive shell 154, a third conductive shell 155 and a fourth conductive shell 156; the first detection unit 151 is arranged on the substrate 110, and the first detection unit 151 is connected with the third conductive shell 155 and the fourth conductive shell 156; the first conductive shell 153 is arranged in the first through hole, the second conductive shell 154 is arranged in the second through hole, the third conductive shell 155 is arranged in the third through hole, the fourth conductive shell 156 is arranged in the fourth through hole, and the second detection unit 152 is arranged in the fifth through hole; the first detection unit 151 is used to detect a static magnetic field and generate a static magnetic field signal according to the static magnetic field; the second detection unit 152 is used to detect an alternating magnetic field and generate an alternating magnetic field signal according to the alternating magnetic field.

[0054] Specifically, when the magnetic module is powered to generate a static magnetic field, the first detection unit 151 can detect the static magnetic field generated by the magnetic module. For example, the magnetic module can include a coil, and the first detection unit 151 can include a Hall element. When a direct current is provided to the coil, the magnetic module can generate a static magnetic field, and at this time, the first detection unit 151 can detect the static magnetic field generated by the magnetic module, so that the first detection unit 151 can generate a static magnetic field signal representing the size of the static magnetic field. The first detection unit 151 is disposed on the substrate 110, and the first detection unit 151 is connected to the third conductive shell 155 and the fourth conductive shell 156, and the static magnetic field signal detected by the first detection unit 151 can be transmitted to an external magnetic detection device through the third conductive shell 155 and the fourth conductive shell 156. When the first conductive shell 153 and the second conductive shell 154 are powered to generate an alternating magnetic field, the second detection unit 152 can detect the alternating magnetic field generated by the first conductive shell 153 and the second conductive shell 154. For example, the second detection unit 152 can include a Hall coil. When an alternating current is provided to the first conductive shell 153 and the second conductive shell 154, the first conductive shell 153 and the second conductive shell 154 can generate an alternating magnetic field, and at this time, the second detection unit 152 can detect the alternating magnetic field generated by the first conductive shell 153 and the second conductive shell 154, so that the second detection unit 152 can generate an alternating magnetic field signal representing the size of the alternating magnetic field and transmit it to an external magnetic detection device connected thereto.

[0055] Optionally, with reference back to Figure 3 , the first detection unit 151 includes a Hall element, the second detection unit 152 includes a Hall coil, the first conductive shell 153 includes a first copper shell, the second conductive shell 154 includes a second copper shell, the third conductive shell 155 includes a third copper shell, and the fourth conductive shell 156 includes a fourth copper shell.

[0056] The Hall element and the Hall coil are both magnetic sensors based on the Hall effect, and both have the advantages of firm structure, small size, light weight, long service life, easy installation, low power consumption, high frequency, and vibration resistance, and can accurately detect a magnetic field or a change in the magnetic field. The first copper shell, the second copper shell, the third copper shell, and the fourth copper shell all have good electrical conductivity. When the first copper shell and the second copper shell transmit an alternating current, the first copper shell and the second copper shell form an alternating magnetic field during the transmission of the alternating current. The third copper shell and the fourth copper shell can quickly transmit the static magnetic field signal detected by the Hall element to an external magnetic detection device.

[0057] Optionally, with reference back to Figure 3 , the acoustic module 140 is embedded in the second detection unit 152; and the acoustic module 140 and the inside of the second detection unit 152 are filled with insulating material 116.

[0058] Specifically, the second detection unit 152 is a hollow structure, for example, the second detection unit 152 is a Hall coil. The acoustic module 140 can detect the acoustic signal, which can be embedded in the second detection unit 152, so that the acoustic module 140 is in the fifth through hole, that is, the acoustic module 140 is in the middle of the first through hole 111 and the second through hole 112. Wherein, the cross-sectional length of the second detection unit 152 parallel to the direction of the substrate 110 can be 1.3-1.5 times the cross-sectional length of the acoustic module 140 parallel to the direction of the substrate 110. The first through hole 111 and the second through hole 112 are used to install and fix the optical module, so that the position of the acoustic module 140 is in the middle of the optical module, which is convenient for the acoustic module 140 to accurately collect the acoustic signal. In addition, the acoustic module 140 embedded in the second detection unit 152 can also enhance the integration of the multi-mode imaging detection probe and reduce the volume of the multi-mode imaging detection probe. The inside of the acoustic module 140 and the second detection unit 152 is filled with insulating material 116, which can prevent the acoustic module 140 from being electrically connected with the second detection unit 152, and ensure the stability of signal transmission between them.

[0059] Optionally, continuing to refer to Figure 3 , the acoustic module 140 comprises an acoustic transducer and an acoustic lens; the acoustic lens is installed on the side of the acoustic transducer away from the magnetic module.

[0060] Wherein, the acoustic transducer is an energy conversion device, that is, it can realize the mutual conversion of electric energy and acoustic energy. When the acoustic transducer detects acoustic waves in different physical fields, the acoustic transducer can convert the acoustic waves into acoustic signals and transmit them to the external acoustic detection device. The acoustic lens can collect acoustic waves generated by the biological tissue to be detected in different physical fields. Installing the acoustic lens on the side of the acoustic transducer away from the magnetic module can make the acoustic transducer receive more acoustic waves, further improve the amount of acoustic waves received by the acoustic transducer, and thus make the acoustic transducer generate more accurate acoustic signals.

[0061] Exemplarily, Figure 4 A structural schematic diagram of an acoustic lens provided by an embodiment of the present application is shown in Figure 4 , wherein the acoustic lens 141 has a threaded structure, which can be fixed on the insulating material 116 in the second detection unit by the threaded structure.

[0062] Optionally, continuing to refer to Figure 3The thermal module includes a thermal emitting unit 121 and a thermal receiving unit 122; the thermal emitting unit 121 is embedded in the third conductive shell 155, and the thermal receiving unit 122 is embedded in the fourth conductive shell 156; the thermal emitting unit 121 and the inner side of the third conductive shell 155 are filled with insulating material 116, and the thermal receiving unit 122 and the inner side of the fourth conductive shell 156 are filled with insulating material 116; the thermal emitting unit 121 is used to emit thermal energy, and the thermal receiving unit 122 is used to receive thermal energy and generate a thermal signal according to the received thermal energy.

[0063] Specifically, the thermal emitting unit 121 can generate thermal energy, for example, the thermal generating unit can be an electric heating wire. When the electric heating wire is powered on, the electric heating wire can generate thermal energy. The thermal receiving unit 122 can receive thermal energy and generate a thermal signal according to the received thermal energy. For example, the thermal receiving unit 122 can be a thermocouple, which can convert the thermal energy it receives into a thermal signal when the thermocouple receives thermal energy. The third conductive shell 155 and the fourth conductive shell 156 are hollow structures. Embedding the thermal emitting unit 121 in the third conductive shell 155 can shield the thermal emitting unit 121 from external electromagnetic waves, preventing the thermal emitting unit 121 from being affected by external electromagnetic waves. Embedding the thermal receiving unit 122 in the fourth conductive shell 156 can shield the thermal receiving unit 122 from external electromagnetic waves, preventing the thermal receiving unit 122 from being affected by external electromagnetic waves. In addition, embedding the thermal emitting unit 121 in the third conductive shell 155 and the thermal receiving unit 122 in the fourth conductive shell 156 can also enhance the integration of the multi-mode imaging detection probe and reduce the volume of the multi-mode imaging detection probe. Filling the thermal emitting unit 121 and the inner side of the third conductive shell 155 with insulating material 116 can prevent the thermal emitting unit 121 from being electrically connected to the third conductive shell 155. Filling the thermal receiving unit 122 and the inner side of the fourth conductive shell 156 with insulating material 116 can prevent the thermal receiving unit 122 from being electrically connected to the fourth conductive shell 156.

[0064] Exemplarily, the cross-sectional length of the third conductive shell 155 and the fourth conductive shell 156 in the direction parallel to the substrate 110 can be 1.2-1.5 times the cross-sectional length of the thermal emitting unit 121 and the thermal receiving unit 122 in the direction parallel to the substrate 110. The center of the third conductive shell 155 and the thermal emitting unit 121 can coincide, and the center of the fourth conductive shell 156 and the thermal receiving unit 122 can coincide.

[0065] Optionally, continuing to refer to Figure 3 The thermal emitting unit 121 includes an electric heating wire, and the thermal receiving unit 122 includes a thermocouple.

[0066] The electric heating wire can generate a large amount of heat energy when electrified, and has the characteristics of not being easy to deform at high temperature, high use temperature, long service life, good oxidation resistance, high resistivity, and low price. The thermocouple can convert heat energy into an electric signal, and has the characteristics of high measurement accuracy, simple installation, fast thermal response, high temperature resistance, and long service life.

[0067] Optionally, with reference back to Figure 3 The optical module includes an optical emitting unit 131 and an optical receiving unit 132. The optical emitting unit 131 is embedded in the first conductive shell 153, and the optical receiving unit 132 is embedded in the second conductive shell 154. Insulating material 116 is filled between the optical emitting unit 131 and the inner side of the first conductive shell 153, and insulating material 116 is filled between the optical receiving unit 132 and the inner side of the second conductive shell 154. The optical emitting unit 131 is configured to emit illuminating light, and the optical receiving unit 132 is configured to receive emitted light.

[0068] Specifically, the optical emitting unit 131 can emit illuminating light, and the optical receiving unit 132 can receive emitted light. For example, the optical emitting unit 131 is connected with a laser 501, and the optical emitting unit 131 can emit illuminating light generated by the laser 501. The optical receiving unit 132 can be connected with an external light detection device, and the optical receiving unit 132 can transmit received incident light to the external light detection device. The first conductive shell 153 and the second conductive shell 154 are hollow structures. Embedding the optical emitting unit 131 in the first conductive shell 153 can shield the optical emitting unit 131 from external electromagnetic waves, preventing the optical emitting unit 131 from being affected by external electromagnetic waves. Embedding the optical receiving unit 132 in the second conductive shell 154 can shield the optical receiving unit 132 from external electromagnetic waves, preventing the optical receiving unit 132 from being affected by external electromagnetic waves. In addition, embedding the optical emitting unit 131 in the first conductive shell 153 and embedding the optical receiving unit 132 in the second conductive shell 154 can also enhance the integration of the multi-mode imaging detection probe and reduce the volume of the multi-mode imaging detection probe. Filling insulating material 116 between the optical emitting unit 131 and the inner side of the first conductive shell 153 can prevent the optical emitting unit 131 from being electrically connected with the first conductive shell 153. Filling insulating material 116 between the optical receiving unit 132 and the inner side of the second conductive shell 154 can prevent the optical receiving unit 132 from being electrically connected with the second conductive shell 154.

[0069] Exemplarily, if the magnetic module is a coil, the distance between the centers of the light emitting unit 131 and the light receiving unit 132 can be 2.5-3.5 times the diameter of the cross section of the magnetic module perpendicular to the substrate 110. The cross-sectional length of the first conductive shell 153 and the second conductive shell 154 in the direction parallel to the substrate 110 can be 1.2-1.5 times the cross-sectional length of the light emitting unit 131 and the light receiving unit 132 in the direction parallel to the substrate 110. The center of the first conductive shell 153 can coincide with the center of the light emitting unit 131, and the center of the second conductive shell 154 can coincide with the center of the light receiving unit 132.

[0070] Optionally, continuing to refer to Figure 3 , the light emitting unit 131 comprises a first optical fiber and a first optical lens, and the light receiving unit 132 comprises a second optical fiber and a second optical lens; the first optical lens is mounted on the side of the first optical fiber away from the magnetic module, and the second optical lens is mounted on the side of the second optical fiber away from the magnetic module.

[0071] The first optical fiber and the second optical fiber are fiber light guide materials made of glass or plastic, and can realize lossless transmission of light by using the principle of total reflection. The first optical lens and the second optical lens can focus the light beams. The first optical lens is mounted on the side of the first optical fiber away from the magnetic module, so that the irradiation light transmitted by the first optical fiber can be focused and emitted. The second optical lens is mounted on the side of the second optical fiber away from the magnetic module, so that the second optical fiber can receive more reflected light, further improving the amount of reflected light received by the second optical fiber.

[0072] Exemplarily, Figure 5 A structure diagram of a first optical lens or a second optical lens provided by an embodiment of the present application is shown in Figure 5 , wherein the first optical lens 1311 and the second optical lens 1321 both have a threaded structure. The first optical lens 1311 can be fixed on the insulating material in the first conductive shell through the threaded structure, and the second optical lens 1321 can be fixed on the insulating material in the second conductive shell through the threaded structure.

[0073] Optionally, Figure 6 A structure diagram of an interface module provided by an embodiment of the present application is shown in Figure 1 and Figure 6 The multi-mode imaging detection probe further comprises an interface module 180. The interface module 180 comprises a thermal module interface 171, an optical module interface 172, an acoustic module interface 173, a magnetic detection module interface 174, and a magnetic module interface 175. The thermal module interface 171 is connected with the thermal module 120, the optical module interface 172 is connected with the optical module 130, the acoustic module interface 173 is connected with the acoustic module 140, the magnetic detection module interface 174 is connected with the magnetic detection module 150, and the magnetic module interface 175 is connected with the magnetic module 160.

[0074] The heat module 120 can be connected with an external heat detection device through a heat module interface 171, the light module 130 can be connected with an external light detection device through a light module interface 172, the sound module interface 173 can be connected with an external sound detection device through a sound module interface 173, the magnetic detection module 150 can be connected with an external magnetic detection device through a magnetic detection module interface 174, and the magnetic module 160 can be connected with an external magnetic detection device through a magnetic module interface 175.

[0075] Specifically, Figure 7 Another interface module structure provided by the embodiment of the present application is shown in the figure, Figure 6- Figure 7 The heat module interface 171 includes a first indicator light 1711, a second indicator light 1712, a first heat jack 1713, a second heat jack 1714, and a first switch 1715. The first end of the heat emitting unit is connected with the first end of the first indicator light 1711, the second end of the first indicator light 1711 is connected with the first end of the first heat jack 1713, the second end of the first switch 1715 is connected with the second end of the first heat jack 1713, the first end of the heat receiving unit is connected with the first end of the second indicator light 1712, the second end of the second indicator light 1712 is connected with the first end of the second heat jack 1714, and the second end of the heat receiving unit is connected with the second end of the second heat jack 1714. The first indicator light 1711 can indicate the working state of the heat emitting unit, and the second indicator light 1712 can indicate the working state of the heat receiving unit.

[0076] The light module interface 172 includes a first light jack 1721 and a second light jack 1722. The light emitting unit is connected with the first light jack 1721, and the light receiving unit is connected with the second light jack 1722.

[0077] The sound module interface 173 includes a sound jack 1731. The first end of the sound module is connected with the first end of the sound jack 1731, and the second end of the sound module is connected with the second end of the sound jack 1731.

[0078] The magnetic detection module interface 174 includes a magnetic detection socket 1741, a first magnetic socket 1742, a second magnetic socket 1743, a third magnetic socket 1744, a fourth magnetic socket 1745, a second switch 1746, a third switch 1747, a fourth switch 1748, and a fifth switch 1749. The first end of the second detection unit is connected to the first end of the magnetic detection socket 1741, and the second end of the second detection unit is connected to the second end of the magnetic detection socket 1741. The first conductive housing is connected to the first end of the second switch 1746, and the second end of the second switch 1746 is connected to the first magnetic socket 1742; the second conductive housing is connected to the first end of the third switch 1747, and the second end of the third switch 1747 is connected to the second magnetic socket 1743; the third conductive housing is connected to the first end of the fourth switch 1748, and the second end of the fourth switch 1748 is connected to the third magnetic socket 1744; the fourth conductive housing is connected to the first end of the fifth switch 1749, and the second end of the fifth switch 1749 is connected to the fourth magnetic socket 1745.

[0079] The magnetic module interface 175 includes a magnetic module socket 1751, a third indicator light 1752, and a sixth switch 1753. The first end of the magnetic module is connected to the first end of the third indicator light 1752, the second end of the third indicator light 1752 is connected to the first end of the sixth switch 1753, the second end of the sixth switch 1753 is connected to the first end of the magnetic module socket 1751, and the second end of the magnetic module is connected to the second end of the magnetic module socket 1751. The third indicator light 1752 indicates the operating status of the magnetic module.

[0080] Figure 8 This is a schematic diagram of the structure of a multi-mode imaging detection system provided in an embodiment of the present invention, as shown below. Figure 8 As shown, the multi-mode imaging detection system includes a multi-mode imaging detection probe 100, a thermal detection device 200, an acoustic detection device 300, a magnetic detection device 400, an optical detection device 500, and a host computer 600, all provided in any embodiment of the present invention. The multi-mode imaging detection probe 100 is connected to the thermal detection device 200, the acoustic detection device 300, the magnetic detection device 400, and the optical detection device 500, respectively. The thermal detection device 200, the acoustic detection device 300, the magnetic detection device 400, and the optical detection device 500 are all connected to the host computer 600. The thermal detection device 200 is used to provide electrical energy to the multi-mode imaging detection probe 100 and detect the thermal signal received by the multi-mode imaging detection probe 100; the acoustic detection device 300 is used to detect the acoustic signal received by the multi-mode imaging detection probe 100; the magnetic detection device 400 is used to provide current to the multi-mode imaging detection probe 100 and detect the magnetic signal received by the multi-mode imaging detection probe 100; the optical detection device 500 is used to provide illumination light to the multi-mode imaging detection probe 100 and detect the reflected light received by the multi-mode imaging detection probe 100.

[0081] Specifically, Figure 9 Another multi-mode imaging detection system provided by the embodiment of the present application is shown in the structure diagram as Figure 9 As shown, the multi-mode imaging detection probe includes an interface module 180, and the multi-mode imaging detection probe is connected with the thermal detection device 200, the acoustic detection device, the magnetic detection device and the optical detection device through the interface module 180. The interface module 180 of the multi-mode imaging detection probe includes a first thermal jack 1713, a second thermal jack 1714, a first optical jack 1721, a second optical jack 1722, a magnetic detection jack 1741, a first magnetic jack 1742, a second magnetic jack 1743, a third magnetic jack 1744, a fourth magnetic jack 1745, an acoustic jack 1731 and a magnetic module jack 1751.

[0082] For example, the thermal detection device includes a heating power supply 201 and a thermal signal collector 202; the acoustic detection device includes a first amplifier 301 for amplifying acoustic signals and an acoustic signal collector 302; the magnetic detection device includes a direct current stabilized power supply 401, a current excitation source 402, a second amplifier 403 for amplifying alternating magnetic field signals, an alternating magnetic field signal collector 404, a third amplifier 405 for amplifying static magnetic field signals and a static magnetic field signal collector 406. The optical detection device includes a laser 501, a photomultiplier tube 502 for converting reflected light into optical signals and an optical signal collector 503.

[0083] The first thermal jack 1713 is connected with the heating power supply 201, that is, the heating power supply 201 supplies power to the thermal emission unit through the first thermal jack 1713, so that the thermal emission unit generates thermal energy. The second thermal jack 1714 is connected with the thermal signal collector 202, that is, the thermal signal collector 202 is connected with the thermal receiving unit through the second thermal jack 1714, so that the thermal receiving unit can transmit thermal signals to the thermal signal collector 202, and the thermal signal collector 202 transmits the collected thermal signals to the host computer for display.

[0084] The acoustic jack 1731 is connected with the first end of the first amplifier 301, and the second end of the first amplifier 301 is connected with the acoustic signal collector 302. The acoustic jack 1731 is connected with the first end of the first amplifier 301, that is, the acoustic module is connected with the first end of the first amplifier 301 through the acoustic jack 1731, and the acoustic signals generated by the acoustic module can be transmitted to the first amplifier 301 for amplification, the first amplifier 301 transmits the amplified acoustic signals to the acoustic signal collector 302, and the acoustic signal collector 302 transmits the collected acoustic signals to the host computer for display.

[0085] The magnetic module socket 1751 is connected with the direct current stabilized power supply 401, that is, the direct current stabilized power supply 401 can provide power for the magnetic module through the magnetic module socket 1751, so that the magnetic module generates a static magnetic field. The first magnetic socket 1742 and the second magnetic socket 1743 are respectively connected with the current excitation source 402, so that the current excitation source 402 can provide excitation current for the first conductive shell and the second conductive shell through the first magnetic socket 1742 and the second magnetic socket 1743, so that the first conductive shell and the second conductive shell generate an alternating magnetic field. The magnetic detection socket 1741 is connected with the first end of the second amplifier 403, and the second end of the second amplifier 403 is connected with the alternating magnetic field signal collector 404, that is, the second detection unit is connected with the first end of the second amplifier 403 through the magnetic detection socket 1741, and the alternating magnetic field signal generated by the second detection unit can be transmitted to the second amplifier 403 for amplification, and the second amplifier 403 transmits the amplified alternating magnetic field signal to the alternating magnetic field signal collector 404. The alternating magnetic field signal collector 404 transmits the alternating magnetic field signal collected by it to the host computer for display. The third magnetic socket 1744 and the fourth magnetic socket 1745 are respectively connected with the first end of the third amplifier 405, and the second end of the third amplifier 405 is connected with the static magnetic field signal collector 406, that is, the static magnetic field signal transmitted by the third conductive shell and the fourth conductive shell can be transmitted to the third amplifier 405 for amplification, and the third amplifier 405 transmits the amplified static magnetic field signal to the static magnetic field signal collector 406. The static magnetic field signal collector 406 transmits the static magnetic field signal collected by it to the host computer for display.

[0086] The first light socket 1721 is connected with the laser 501, that is, the laser 501 provides illumination light for the light emitting unit through the first light socket 1721, so that the light emitting unit can emit illumination light. The second light socket 1722 is connected with the first end of the photomultiplier tube 502, and the second end of the photomultiplier tube 502 is connected with the light signal collector 503. The second light socket 1722 is connected with the first end of the photomultiplier tube 502, that is, the light receiving unit is connected with the photomultiplier tube 502 through the second light socket 1722, and the reflected light received by the light receiving unit can be transmitted to the photomultiplier tube 502. The photomultiplier tube 502 can generate a light signal according to the reflected light, and the photomultiplier tube 502 can transmit the light signal to the light signal collector 503, and the light signal collector 503 transmits the light signal collected by it to the host computer for display.

[0087] It should be pointed out finally that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; and although the present application has been described in detail with reference to the foregoing embodiments, it should be appreciated by those skilled in the art that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features thereof can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A multi-mode imaging detection probe, characterized in that, It includes a substrate, thermal module, optical module, acoustic module, magnetic detection module, connectors, and magnetic module; The thermal module, the optical module, the magnetic detection module, and the acoustic module are mounted on the first surface of the substrate. One magnetic pole of the magnetic module is in perpendicular contact with the second surface of the substrate, and the other magnetic pole of the magnetic module is away from the substrate. The center of the substrate and the center of each magnetic pole of the magnetic module are on the same straight line. The edge of the substrate and the magnetic module are enclosed in the connector. The thermal module is used to generate heat energy; the thermal module is also used to receive the heat energy and generate a thermal signal based on the received heat energy; the optical module is used to emit irradiation light; the optical module is also used to receive reflected light; the magnetic module is used to generate a magnetic field; the magnetic detection module is used to detect the magnetic field and generate a magnetic signal based on the magnetic field; the acoustic module is used to detect sound waves and generate an acoustic signal based on the sound waves. The substrate includes a first through hole, a second through hole, a third through hole, a fourth through hole, and a fifth through hole; The center points of the first through hole, the second through hole, and the fifth through hole are on the same straight line, and the fifth through hole is located in the middle of the first through hole and the second through hole; The first through hole and the second through hole are used to install and fix the optical module and the magnetic detection module, and the fifth through hole is used to install and fix the acoustic module.

2. The multi-mode imaging detection probe according to claim 1, characterized in that, The magnetic detection module includes a first detection unit, a second detection unit, a first conductive housing, a second conductive housing, a third conductive housing, and a fourth conductive housing; The first detection unit is disposed on the substrate, and the first detection unit is connected to the third conductive housing and the fourth conductive housing; The first conductive housing is disposed in the first through hole, the second conductive housing is disposed in the second through hole, the third conductive housing is disposed in the third through hole, the fourth conductive housing is disposed in the fourth through hole, and the second detection unit is disposed in the fifth through hole; The first detection unit is used to detect a static magnetic field and generate a static magnetic field signal based on the static magnetic field; the second detection unit is used to detect an alternating magnetic field and generate an alternating magnetic field signal based on the alternating magnetic field.

3. The multi-mode imaging detection probe according to claim 2, characterized in that, The first detection unit includes a Hall element, the second detection unit includes a Hall coil, the first conductive housing includes a first copper shell, the second conductive housing includes a second copper shell, the third conductive housing includes a third copper shell, and the fourth conductive housing includes a fourth copper shell.

4. The multi-mode imaging detection probe according to claim 2, characterized in that, The acoustic module is embedded in the second detection unit; The acoustic module and the inner side of the second detection unit are filled with insulating material.

5. The multi-mode imaging detection probe according to claim 4, characterized in that, The acoustic module includes an acoustic transducer and an acoustic lens; The acoustic lens is mounted on the side of the acoustic transducer away from the magnetic module.

6. The multi-mode imaging detection probe according to claim 2, characterized in that, The thermal module includes a thermal emission unit and a thermal receiving unit; The heat-emitting unit is embedded in the third conductive housing, and the heat-receiving unit is embedded in the fourth conductive housing; The space between the heat-emitting unit and the inner side of the third conductive shell is filled with insulating material, and the space between the heat-receiving unit and the inner side of the fourth conductive shell is filled with insulating material. The thermal emission unit is used to generate the thermal energy, and the thermal receiving unit is used to receive the thermal energy and generate the thermal signal based on the received thermal energy.

7. The multi-mode imaging detection probe according to claim 6, characterized in that, The heat-emitting unit includes a heating wire, and the heat-receiving unit includes a thermocouple.

8. The multi-mode imaging detection probe according to claim 2, characterized in that, The optical module includes an optical emitting unit and an optical receiving unit; The light emitting unit is embedded in the first conductive housing, and the light receiving unit is embedded in the second conductive housing; The light emitting unit and the inner side of the first conductive shell are filled with insulating material, and the light receiving unit and the inner side of the second conductive shell are filled with insulating material. The light emitting unit is used to emit the illumination light, and the light receiving unit is used to receive the reflected light.

9. The multi-mode imaging detection probe according to claim 8, characterized in that, The light emitting unit includes a first optical fiber and a first optical lens, and the light receiving unit includes a second optical fiber and a second optical lens; The first optical lens is mounted on the side of the first optical fiber away from the magnetic module, and the second optical lens is mounted on the side of the second optical fiber away from the magnetic module.

10. The multi-mode imaging detection probe according to claim 1, characterized in that, It also includes an interface module; The interface module includes: a thermal module interface, an optical module interface, an acoustic module interface, a magnetic detection module interface, and a magnetic module interface; The thermal module interface is connected to the thermal module, the optical module interface is connected to the optical module, the acoustic module interface is connected to the acoustic module, the magnetic detection module interface is connected to the magnetic detection module, and the magnetic module interface is connected to the magnetic module.

11. A multi-mode imaging detection system, characterized in that, Includes the multi-mode imaging detection probe, thermal detection device, acoustic detection device, magnetic detection device, optical detection device, and host computer as described in any one of claims 1-10; The multi-mode imaging detection probe is connected to the thermal detection device, the acoustic detection device, the magnetic detection device, and the optical detection device, respectively. The thermal detection device, the acoustic detection device, the magnetic detection device, and the optical detection device are all connected to the host computer. The thermal detection device is used to provide power to the multi-mode imaging detection probe and detect the thermal signal received by the multi-mode imaging detection probe; the acoustic detection device is used to detect the acoustic signal received by the multi-mode imaging detection probe; the magnetic detection device is used to provide current to the multi-mode imaging detection probe and detect the magnetic signal received by the multi-mode imaging detection probe; the optical detection device is used to provide illumination light to the multi-mode imaging detection probe and detect the reflected light received by the multi-mode imaging detection probe.

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