LED chip, LED chip packaging module and display device

Abstract

LED chip, LED chip packaging module and display device. The LED chip includes: a substrate; a first mesa structure and a second mesa structure; at least one bridging current blocking block, the bridging current blocking block covers part of the upper surface and part of the side surface of the first mesa structure, and covers part of the groove between the first mesa structure and the second mesa structure; a bridging conductive block, the number of the bridging conductive blocks is the same as the number of the bridging current blocking blocks, the main part of the bridging conductive block is located on the bridging current blocking block, the first end of the bridging conductive block is electrically connected to the top layer of the first mesa structure, and the second end of the bridging conductive block is electrically connected to the bottom layer of the second mesa structure; a first conductive pad and a second conductive pad; the top projection of the bridging conductive block has no overlapping part with the top projection of the first conductive pad and the second conductive pad. The reliability of the LED chip is improved.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and in particular to an LED chip, an LED chip packaging module and a display device. Background Art

[0002] LED (light-emitting diode) has the advantages of low cost, high luminous efficiency, energy saving and environmental protection. It is widely used in lighting, visible light communication, luminous display and other scenarios.

[0003] One of the development directions of LED is to develop towards miniaturization and micro-miniaturization. After LED is miniaturized, it forms an array with millimeter or even micron pitch, which can achieve ultra-high resolution, so that it can be more widely used in information display and other fields. Compared with liquid crystal display (LCD) and organic light-emitting display (OLED), LED has advantages such as long luminous life, high brightness, thin volume, low power consumption, and high pixel density. It has become one of the representatives of the third generation display technology with high authenticity, interactive and personalized display as its main characteristics.

[0004] At present, one of the problems encountered in the process of LED chips developing in the direction of miniaturization is the reliability issue. That is, the industry is faced with the need to optimize the corresponding LED chip structure to improve product reliability. Summary of the invention

[0005] The problem solved by the present invention is to provide an LED chip, an LED chip packaging module and a display device to improve product reliability.

[0006] To solve the above problems, the present invention provides an LED chip, comprising: a substrate; a first mesa structure, wherein the first mesa structure is located on the substrate; a second mesa structure, wherein the second mesa structure is located on the substrate; at least one bridging current blocking block, wherein the bridging current blocking block covers part of the upper surface and part of the side surface of the first mesa structure, and covers part of the groove between the first mesa structure and the second mesa structure; a bridging conductive block, wherein the number of the bridging conductive blocks is the same as the number of the bridging current blocking blocks, the main body of the bridging conductive block is located on the bridging current blocking block, the first end of the bridging conductive block is electrically connected to the top layer of the first mesa structure, and the second end of the bridging conductive block is electrically connected to the bottom layer of the second mesa structure; a first conductive pad, wherein the first conductive pad is located above the first mesa structure; a second conductive pad, wherein the second conductive pad is located above the second mesa structure; the top projection of the bridging conductive block has no overlapping part with the top projections of the first conductive pad and the second conductive pad.

[0007] Optionally, there are two bridging conductive blocks, the top projections of the two bridging conductive blocks are symmetrical, and a portion of the top projection of the first conductive pad is sandwiched between the two bridging conductive blocks.

[0008] Optionally, a portion of the top-view projection of the second conductive pad is sandwiched between the two bridging conductive blocks, and a top-view shape of the first conductive pad and a top-view shape of the second conductive pad are substantially symmetrical.

[0009] Optionally, the top projection of the jumper conductive block has a finger portion, a knot portion and a blunt portion, the knot portion spans the groove, the outer end of the finger portion is the first end, and the outer end of the blunt portion is the second end; the knot portion is located within the top projection of the jumper current blocking block; the width of the knot portion is greater than the width of the finger portion.

[0010] Optionally, the top projection of the jumper conductive block has a first finger, a junction and a second finger, the junction spans the groove, the outer end of the first finger is the first end, and the outer end of the second finger is the second end; the junction is located within the top projection of the jumper current blocking block; the width of the junction is greater than the width of the first finger, and the width of the junction is greater than the width of the second finger.

[0011] Optionally, the bisector of the knot and the bisector of the first finger coincide with a first straight line, the bisector of the second finger is a second straight line, the first straight line is parallel to the second straight line, and the second finger is connected to the outer corner of the knot; or, the bisector of the knot and the bisector of the second finger coincide with a first straight line, the bisector of the first finger is a second straight line, the first straight line is parallel to the second straight line, and the first finger is connected to the inner corner of the knot.

[0012] Optionally, the top projection of the cross-current blocking block has a head and a tail; in the top projection, the junction is located in the head, the first finger is located in the tail, and the width of the head is more than 1.5 times the width of the tail.

[0013] Optionally, in a top view projection, a portion of the head portion that does not overlap with the knot portion has a first width, a portion of the tail portion that does not overlap with the first finger portion has a second width, and the first width is greater than the second width.

[0014] Optionally, the LED chip also includes: a first current spreading layer, the first current spreading layer is located above the first mesa structure, the first conductive pad is located above the first current spreading layer, and the jumper conductive block is electrically connected to the top layer of the first mesa structure by connecting the first current spreading layer; a second current spreading layer, the second current spreading layer is located above the second mesa structure, and the second conductive pad is located above the second current spreading layer; there is no overlapping part between the top projection of the jumper conductive block and the top projection of the second current spreading layer.

[0015] Optionally, the LED chip also includes a first DBR reflective layer, which covers the first current spreading layer and the second current spreading layer; the first conductive pad is located on the first DBR reflective layer, and the first conductive pad penetrates the first DBR reflective layer to electrically connect to the bottom layer of the first mesa structure; the second conductive pad is located on the first DBR reflective layer, and the second conductive pad penetrates the first DBR reflective layer to electrically connect to the second current spreading layer; the first DBR reflective layer also serves as a passivation protective layer.

[0016] Optionally, the LED chip further includes a built-in current blocking block, the built-in current blocking block and the cross-connection current blocking block are in the same layer structure, and the built-in current blocking block is located between the second mesa structure and the second current spreading layer.

[0017] Optionally, a top projection of the built-in current blocking block includes a middle portion and two side portions connected to the middle portion, and the middle portion is circular.

[0018] Optionally, the LED chip also includes a first conductive block, and the first conductive block and the jumper conductive block are in the same layer structure; the top projection of the top layer of the first mesa structure has a concave notch, and the top projection of the first conductive block falls within the concave notch of the first mesa structure.

[0019] Optionally, the top projection of the second mesa structure of the LED chip is a chamfered rectangle with two corner notches, the corner notches face the first mesa structure, and the two corner notches are symmetrical; the corner notches match the jumper conductive block.

[0020] Optionally, the top projection of the concave notch is funnel-shaped, and the top projection of the first conductive block is circular or a nail-shaped with a round head.

[0021] Optionally, a common bisector of the middle portion and the side portion is a third straight line, and the third straight line is parallel or perpendicular to the first straight line.

[0022] Optionally, the LED chip also includes a second conductive block, which is a same-layer structure as the jumper conductive block. The second conductive block is located above the built-in current blocking block and on the second current expansion layer. The second conductive pad is electrically connected to the second current expansion layer by connecting the second conductive block. The top-down projection of the second conductive block falls within the top-down projection of the built-in current blocking block.

[0023] Optionally, the second conductive block includes a core and two wings located on both sides of the core; the first DBR reflective layer has a first through hole and a second through hole penetrating through the first DBR reflective layer; and the second through hole is located above the middle of the core of the second conductive block.

[0024] Optionally, the LED chip further includes a second DBR reflective layer, and the second DBR reflective layer is located on the back side of the substrate.

[0025] In order to solve the above problems, the present invention further provides an LED chip packaging module, comprising the LED chip as described above.

[0026] In order to solve the above problem, the present invention further provides a display device, comprising the LED chip as described above, wherein the LED chip is used as a backlight source chip of a backlight module of the display device.

[0027] In one aspect of the technical solution of the present invention, the provided LED chip is structurally designed so that there is no overlapping between the top projection of the bridging conductive block and the top projection of the first conductive pad and the second conductive pad, thereby preventing chip leakage caused by damage to the protective passivation layer, that is, reducing leakage channels and improving product reliability.

[0028] Furthermore, there is no overlapping part between the top projection of the jumper conductive block and the top projection of the second current spreading layer. Under this structure, the jumper conductive block is located at the edge of the core particle. During the grabbing process of the LED chip, the LED chip will not fail due to the damage of the middle jumper conductive block by the ejector pin (the ejector pin is a tool used to assist in the grabbing of the chip), thereby improving the reliability of the product.

[0029] Furthermore, the provided LED chip is designed with two jumper conductive blocks. When a single jumper conductive block is damaged, it will not cause the core particle to fail, making the product more reliable. At the same time, the two jumper conductive blocks are distributed on both sides of the core particle, further preventing the LED chip from failing due to the middle jumper conductive block being damaged by the ejector pin, further improving the reliability of the product.

[0030] Furthermore, the provided LED chip uses the first DBR reflective layer as a protective passivation layer at the same time, and sets corresponding through holes above the middle position of the top projection of the first conductive block and above the middle position of the top projection of the second conductive block, which can make the corresponding current diffusion (expansion) effect better and the product performance better. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of a partial cross-sectional structure of an LED chip in the first embodiment;

[0032] Figure 2is a schematic top view projection diagram of a top layer of a first mesa structure, a top layer of a second mesa structure, and a substrate in the first embodiment;

[0033] Figure 3 is a schematic top view projection diagram of a first deep trench, a second deep trench and a substrate in the first embodiment;

[0034] Figure 4 is a schematic top view projection diagram of a cross-connected current blocking block and its same-layer structure and a substrate in the first embodiment;

[0035] Figure 5 In the first embodiment, Figure 1 The above further shows a partial cross-sectional structural schematic diagram of the cross-connected current blocking block and its same-layer structure;

[0036] Figure 6 is a schematic top projection diagram of the first current spreading layer, the second current spreading layer and the substrate in the first embodiment;

[0037] Figure 7 In the first embodiment, Figure 5 The schematic diagram of the partial cross-section structure of the bridging conductive block and its same-layer structure is further shown above;

[0038] Figure 8 is a schematic top view projection diagram of a bridging conductive block and its same-layer structure and a substrate in the first embodiment;

[0039] Fig. 9 is a schematic diagram of a common top view projection of a layer where a bridging current blocking block is located, a layer where a bridging conductive block is located, and a substrate in the first embodiment;

[0040] Fig.10 In the first embodiment, Figure 7 A partial cross-sectional structural schematic diagram of the first DBR reflective layer is further shown above;

[0041] Fig.11 is a schematic top projection diagram of the first DBR reflective layer in the first embodiment;

[0042] Fig.12 is a schematic cross-sectional structure diagram of an LED chip in the first embodiment;

[0043] Fig.13 is a schematic top projection diagram of the first conductive pad, the second conductive pad and the substrate in the first embodiment;

[0044] Fig.14 is a schematic diagram of an overall top view projection of the LED chip in the first embodiment, and is a schematic diagram of a solid line perspective structure;

[0045] Fig.15is a schematic top view projection diagram of a top layer of a first mesa structure, a top layer of a second mesa structure, and a substrate in a second embodiment;

[0046] Fig.16 is a schematic top view projection diagram of a cross-connected current blocking block and its same-layer structure and a substrate in the second embodiment;

[0047] Fig.17 is a schematic top view projection diagram of a bridging conductive block and its same-layer structure and a substrate in the second embodiment;

[0048] Fig.18 is a schematic top projection diagram of a first conductive pad, a second conductive pad and a substrate in the second embodiment;

[0049] Fig.19 is a schematic diagram of an overall top view projection of an LED chip in the second embodiment, and is a schematic diagram of a solid line perspective structure;

[0050] Fig. 20 is a schematic top view projection diagram of a top layer of a first mesa structure, a top layer of a second mesa structure, and a substrate in a third embodiment;

[0051] Fig.21 is a schematic top view projection diagram of a bridging conductive block and its same-layer structure and a substrate in a third embodiment;

[0052] Fig. 22 is a schematic diagram of an overall top view projection of an LED chip in the third embodiment, and is a schematic diagram of a solid line perspective structure;

[0053] Fig.23 is a schematic top view projection diagram of a top layer of a first mesa structure, a top layer of a second mesa structure, and a substrate in a fourth embodiment;

[0054] Fig.24 is a schematic top view projection diagram of a cross-connected current blocking block and its same-layer structure and a substrate in a fourth embodiment;

[0055] Fig.25 is a schematic top view projection diagram of a bridging conductive block and its same-layer structure and a substrate in a fourth embodiment;

[0056] Fig.26 is a schematic diagram of an overall top view projection of an LED chip in the fourth embodiment, and is a schematic diagram of a solid line perspective structure;

[0057] Fig. 27 is a schematic top view projection diagram of a top layer of a first mesa structure, a top layer of a second mesa structure, and a substrate in a fifth embodiment;

[0058] Fig.28 is a top projection schematic diagram of a cross-connected current blocking block and its same-layer structure and a substrate in a fifth embodiment;

[0059] Fig.29 is a top projection schematic diagram of a bridging conductive block and its same-layer structure and a substrate in a fifth embodiment;

[0060] Fig.30 It is a schematic diagram of an overall top view projection of the LED chip in the fifth embodiment, and is a schematic diagram of a solid line perspective structure. DETAILED DESCRIPTION

[0061] The present invention provides a new LED chip, an LED chip packaging module and a display device. For a clearer representation, the present invention is described in detail below with reference to the accompanying drawings.

[0062] This manual uses simplified notation for each structure, except Fig.12 and Fig.14 , in both the section and top view projections, the same structure is marked only once, respectively, to show the structure more clearly.

[0063] The present invention is an LED chip, please refer to Figures 1 to 14 ,in Fig.14 It is a top-down projection diagram of the various structures of the entire LED chip, and it shows a solid line perspective structure diagram, that is, each structure is displayed in a superimposed solid line.

[0064] like Figures 1 to 14 As shown, the LED chip includes a substrate 100, a first mesa structure 111, a second mesa structure 112, and a cross-current blocking block 130 (refer to Figure 1 , Figure 4 and Fig.14 ), jumper conductive block 150 (reference Figure 7 , Figure 8 and Fig.14 )、the first conductive pad 171 (reference Fig.12 , Fig.13 and Fig.14 ) and the second conductive pad 172 (reference Fig.12 , Fig.13 and Fig.14 ).

[0065] Figure 1 As shown, the first mesa structure 111 is located on the substrate 100 , and the second mesa structure 112 is located on the substrate 100 .

[0066] In this embodiment, the substrate 100 may be sapphire (Al2O3) or the like. As is well known in the art, the first mesa structure 111 and the second mesa structure 112 may generally include, from bottom to top, a first conductive semiconductor layer, a quantum well layer, and a second conductive semiconductor layer. The first conductive semiconductor layer, as the bottom layer of the mesa structure, may generally include structures such as an N-type semiconductor layer and a buffer layer, that is, generally a stacked structure. The quantum well layer and the second conductive semiconductor layer may generally both be stacked structures, and the second conductive semiconductor layer may generally include a P-type semiconductor layer, which serves as the top layer of the mesa structure.

[0067] It should be noted that, in other embodiments of the present invention, a third table structure (not shown) may also be included, that is, there may be more than three table structures, and the corresponding series connection method and structure can be combined with reference to the entire content of this embodiment, which will not be repeated here.

[0068] Figure 2 The top layer (second conductive semiconductor layer) of the first mesa structure 111, the top layer (second conductive semiconductor layer) of the second mesa structure 112, and the top projection of the substrate 100 are shown separately. The top projection of the top layer of the first mesa structure 111 has a concave notch 1111. The top projection of the top layer of the second mesa structure 112 is a chamfered rectangle with two corner notches 1121, which face the first mesa structure 111, and the two corner notches 1121 are symmetrical. In other embodiments, there may be only one corner notch 1121, which may also be a structure similar to the concave notch 1111, exposing the first conductive semiconductor layer of the second mesa.

[0069] Figure 3 The first deep trench 121, the second deep trench 122 and the top projection of the substrate 100 are shown separately. The first deep trench 121 and the second deep trench 122 are formed by a deep etching (ISO) process, and they surround the projections of the first mesa structure 111 and the second mesa structure 112 respectively, and a groove (not marked) described later is formed between the areas surrounded by the first deep trench 121 and the second deep trench 122.

[0070] Figure 4 Shows Figure 1 In the structure shown, the cross-current blocking block 130 and its same-layer structure and the top projection of the substrate, the number of the cross-current blocking blocks 130 corresponds to the number of the gaps 1121, in this embodiment there are two, combined with Figures 1 to 4 It can be seen that the two cross-current blocking blocks 130 respectively cover a portion of the upper surface and a portion of the side surface of the first mesa structure 111 , and cover a portion of the groove between the first mesa structure 111 and the second mesa structure 112 (as mentioned above, not marked).

[0071] Figure 7The partial cross-sectional structure of the LED chip is shown, and the topmost structure is the jumper conductive block 150 .

[0072] Figure 8 The number of the cross-connection conductive blocks 150 is the same as the number of the cross-connection current blocking blocks 130. Since there are two cross-connection current blocking blocks 130, there are also two cross-connection conductive blocks 150. The two cross-connection conductive blocks 150 are located on both sides of the core particle (edge ​​area). Figure 8 Displayed as upper and lower sides.

[0073] Combination Figure 7 and Figure 8 It can be seen that the main part of the bridging conductive block 150 is located on the bridging current blocking block 130 , the first end of the bridging conductive block 150 is electrically connected to the top layer of the first mesa structure 111 , and the second end of the bridging conductive block 150 is electrically connected to the bottom layer of the second mesa structure 112 .

[0074] It should be noted that Figure 8 The dashed line (not marked) is shown in the figure. The dashed line is used to illustrate the cutting direction of each cross-sectional schematic diagram of this embodiment, that is, each cross-sectional structural schematic diagram is along Figure 8 The fold line shown is cut and then reassembled into a plane.

[0075] Fig.12 As shown, the first conductive pad 171 is located above the first mesa structure 111, and the second conductive pad 172 is located above the second mesa structure 112. The first conductive pad 171 and the second conductive pad 172 may be made of corresponding various metals or alloys.

[0076] Fig.13 The first conductive pad 171 , the second conductive pad 172 , and a top projection of the substrate 100 are shown separately.

[0077] Comparison Figure 8 and Fig.13 It can be concluded that the top projection of the bridging conductive block 150 in this embodiment has no overlapping portion with the top projections of the first conductive pad 171 and the second conductive pad 172. Fig.14 This structural design can be seen directly in the .

[0078] Fig.14 As shown, in this embodiment, the top projections of the two bridging conductive blocks 150 are symmetrical, and a portion of the top projection of the first conductive pad 171 is sandwiched between the two bridging conductive blocks 150 .

[0079] In this embodiment, the bridging current blocking block 130 and the bridging conductive block 150 both span the groove. The material of the bridging current blocking block 130 can be a corresponding transparent insulating material, such as SiO2, etc. The material of the bridging conductive block 150 can be various metals, metal conductive oxides or other conductive materials, such as copper, silver, gold or corresponding alloys.

[0080] Please continue to refer to Figure 8 In this embodiment, the top projection of the crossover conductive block 150 has a finger 1501, a knot 1502 and a blunt portion 1503. The knot 1502 crosses the groove, the outer end of the finger 1501 is the first end, and the outer end of the blunt portion 1503 is the second end. The knot 1502 falls within the top projection of the crossover current blocking block 130.

[0081] In this embodiment, the width of the junction 1502 is greater than the width of the finger 1501, and the width of the blunt portion 1503 is greater than the width of the junction 1502. The width relationship of each part of the bridging conductive block 150 is reflected in Figure 8 The length of the bridge conductive block 150 is shown in the vertical direction. Figure 8 This design of different widths further optimizes the overall structure of the chip and improves reliability.

[0082] The main part of the aforementioned jumper conductive block 150 is located on the jumper current blocking block 130, which is mainly reflected in the following aspects: the junction 1502 completely falls within the top projection of the jumper current blocking block 130; most of the structure of the finger 1501 and the blunt part 1503 also falls within the top projection of the jumper current blocking block 130, and a small section at the end of the finger 1501 and the blunt part 1503 crosses the jumper current blocking block 130 to achieve corresponding electrical connection.

[0083] In this embodiment, the bisectors of the finger 1501, the knot 1502 and the blunt part 1503 coincide with a straight line, that is, the entire bridging conductive block 150 is axially symmetrical in top view, like a nail-shaped structure with a flat top (i.e., the blunt part 1503) and a neck (i.e., the knot 1502), and the finger 1501 is the nail part of the nail-shaped structure. This structure can utilize the knot 1502 to better cross the groove, and utilize the wide front end of the blunt part 1503 to increase the corresponding conductive contact area, thereby helping to improve the reliability of the product. Please refer to reference Figure 4 In this embodiment, the top projection of the cross-current blocking block 130 includes a head portion 1301 and a tail portion 1302 .

[0084] refer to Fig. 9 In a top view projection, the knot portion 1502 falls within the head portion 1301 , the finger portion 1501 falls within the tail portion 1302 , and the blunt portion 1503 has no overlapping portion with the cross-current blocking block 130 .

[0085] refer to Fig. 9 In the top view projection, the portion of the head 1301 that does not overlap with the junction 1502 has a first width W1, and the portion of the tail 1302 that does not overlap with the finger 1501 has a second width W2, and the first width W1 is greater than the second width W2. This design is because the head 1301 (of the current blocking block 130 that crosses over) is located at the position of the groove, which is usually more uneven, and the current blocking block on the slope will be thinner. In the etching process of the formation process, the current blocking block in these parts is prone to over-etching. Therefore, in this embodiment, the width of the head 1301 is designed to be wider. At this time, the reliability of the structure above the groove (that is, mainly the junction 1502 of the conductive block 150 that crosses over) can be better guaranteed to prevent leakage and other phenomena, thereby further improving product reliability. In this embodiment, the directions of the first width W1 and the second width W2 are both perpendicular to the common bisector of the head 1301 and the tail 1302.

[0086] In this embodiment, Fig. 9 The first width W1 is between 3 μm and 100 μm, for example, 5 μm, 10 μm, 20 μm, 30 μm or 50 μm.

[0087] In this embodiment, Fig. 9 The second width W2 is between 0 μm and 30 μm, for example, 0.5 μm, 1 μm, 5 μm or 10 μm, etc., and the first width W1 is greater than the second width W2.

[0088] Please refer back to Figure 5 and Figure 6 , Figure 5 The LED chip is partially cross-sectionally shown, and the topmost structure is the current spreading layer. Figure 5 It can be seen that the LED chip further includes a first current spreading layer 141 and a second current spreading layer 142 .

[0089] Figure 5 As shown, the first current spreading layer 141 is located above the first mesa structure 111 . Fig.12 As shown, the first conducting pad 171 is located above the first current spreading layer 141 . Figure 7 As shown, the jumper conductive block 150 is electrically connected to the top layer of the first mesa structure 111 by connecting the first current spreading layer 141 . Figure 5 As shown, the second current spreading layer 142 is located above the second mesa structure 112. Fig.12 As shown, the second conducting pad 172 is located above the second current spreading layer 142 .

[0090] Figure 6The first current spreading layer 141 , the second current spreading layer 142 , and the top projection of the substrate 100 are shown separately.

[0091] Depend on Figure 6 and Figure 2 Compare and combine Fig.14 It can be seen that the top projection shapes of the first current spreading layer 141 and the top layer of the first mesa structure 111 are similar, and the first current spreading layer 141 falls within the first mesa structure 111. The top projection shapes of the second current spreading layer 142 and the top layer of the second mesa structure 112 are similar, and the second current spreading layer 142 falls within the second mesa structure 112. Therefore, Figure 6 As shown, the first current spreading layer 141 has a notch 1411 corresponding to the inner concave notch 1111 , and the second current spreading layer 142 has two notches 1421 corresponding to the two corner notches 1121 .

[0092] It should be noted that the indentation 1111 is caused by the different top-down projections of the bottom and top layers of the first mesa structure 111, that is, the area corresponding to the indentation 1111 is still part of the first mesa structure 111, and the corresponding first conductive block 151 is located on this part of the bottom layer structure; and the indentation 1411 of the first current spreading layer 141 indicates that there is no corresponding current spreading layer structure at this position. Similarly, the corner indentation 1121 is caused by the different top-down projections of the bottom and top layers of the second mesa structure 112, that is, the area corresponding to the corner indentation 1121 is still part of the second mesa structure 121, and the corner indentation 1121 corresponds to the bottom layer structure of the second mesa structure 112, and the second end of the bridging conductive block 150 is connected to the bottom layer structure corresponding to the corner indentation 1121; and the indentation 1421 of the second current spreading layer 142 indicates that there is no corresponding current spreading layer structure at this position.

[0093] Combination Figure 6 and Figure 8 It can be seen that the top projection of the bridging conductive block 150 has no overlapping portion with the top projection of the second current spreading layer 142. Fig.14 However, the bridging conductive block 150 and the first current spreading layer 141 have an overlapping portion, which means that the bridging conductive block 150 is electrically connected to the first current spreading layer 141, which can also be seen from Figure 7 The overlapping structure can be seen intuitively in the figure.

[0094] Fig.10 The partial cross-sectional structure of the LED chip is shown, and the topmost structure is the first DBR reflective layer 160 , that is, the LED chip also includes the first DBR reflective layer 160 .

[0095] Fig.11A top-down projection of the first DBR reflective layer 160 is shown alone.

[0096] Combination Fig.10 and Fig.11 It can be seen that the first DBR reflective layer 160 covers the first current spreading layer 141 and the second current spreading layer 142 . Fig.12 As shown, the first conductive pad 171 is located on the first DBR reflective layer 160 , and the first conductive pad 171 penetrates the first DBR reflective layer 160 to electrically connect to the bottom layer of the first mesa structure 111 . Fig.12 As shown, the second conductive pad 172 is located on the first DBR reflective layer 160 , and the second conductive pad 172 penetrates the first DBR reflective layer 160 to electrically connect the second current spreading layer 142 .

[0097] In this embodiment, the first DBR reflective layer 160 also serves as a passivation protection layer, which simplifies the structure and improves reliability.

[0098] refer to Fig.10 and Fig.11 The first conductive pad 171 and the second conductive pad 172 penetrate the first DBR reflective layer 160 , respectively utilizing the first through hole 1601 and the second through hole 1602 of the first DBR reflective layer 160 .

[0099] Please refer back to Figure 1 and Figure 4 The LED chip also includes a built-in current blocking block 132, the built-in current blocking block 132 and the cross-connected current blocking block 130 are in the same layer structure, and the built-in current blocking block 132 is located between the second mesa structure 112 and the second current expansion layer 142. Figure 5 , Figure 7 , Fig.10 and Fig.12 .

[0100] It should be noted that, in the chip structure, the same-layer structure does not refer to the structure located on the same horizontal plane, but refers to: structures that can be formed in the same process. They are formed together on the basis of the structure of the previous process, and they can be formed at different positions.

[0101] Continue to refer Figure 4 The top projection of the built-in current blocking block 132 includes a middle portion 1321 and two side portions 1322 connected to the middle portion 1321, and the middle portion 1321 is circular. The side portions 1322 are symmetrically arranged on both sides of the circle and are ear-shaped structures.

[0102] Please refer back to Figure 7 and Figure 8The LED chip further includes a first conductive block 151, and the first conductive block 151 and the cross-connected conductive block 150 are in the same layer structure. As mentioned above, the top projection of the first mesa structure 111 has an indentation 1111 (the top projection of the first mesa structure 111 is a chamfered rectangle with an indentation 1111). Figure 2 and Figure 8 By comparison, it can be seen that the top projection of the first conductive block 151 falls within the inner concave notch 1111 of the first mesa structure 111. Fig.14 In this embodiment, the top projection of the first conductive block 151 is circular, as shown in FIG. Figure 8 As mentioned above, the top projection of the second mesa structure 112 is a chamfered rectangle with two corner notches 1121, the corner notches 1121 face the first mesa structure 111, and the two corner notches 1121 are symmetrical. The corner notches 1121 match the jumper conductive block 150. The specific matching is to achieve a mutually interlocking matching structure, that is, the top surface of the second mesa structure 112 and the jumper conductive block 150 are staggered, and the bottom surface of the second mesa structure 112 and the jumper conductive block 150 are connected. Fig.12 and Fig.14 .

[0103] Please refer back to Figure 7 and Figure 8 The LED chip further includes a second conductive block 152, which is in the same layer as the crossover conductive block 150. The second conductive block 152 is located above the built-in current blocking block 132 and on the second current spreading layer 142. The second conductive pad 172 is electrically connected to the second current spreading layer 142 by connecting the second conductive block 152. Figure 7 and Figure 8 It can be seen that the top projection of the second conductive block 152 falls within the top projection of the built-in current blocking block 132 .

[0104] Figure 7 As shown, the second conductive block 152 and the built-in current blocking block 132 are separated by the second current spreading layer 142 .

[0105] Figure 8 As shown in FIG. 1 , the second conductive block 152 includes a core 1521 and two wing portions 1522. The two wing portions 1522 are symmetrically located on both sides of the core 1521. Figure 4 and Figure 8 It can be seen that the core 1521 is located above the middle part 1321, and the core 1521 falls inside the middle part 1321; the wing 1522 is located above the side part 1322, and the wing 1522 falls inside the side part 1322, which can also be Fig.14 It can be seen intuitively.

[0106] As mentioned above, the top view projection of the second conductive block 152 falls within the top view projection of the built-in current blocking block 132, so it is possible to prevent the current from being directly injected downward. Fig.14 That is, the coordinated arrangement of the second conductive block 152 and the built-in current blocking block 132 enables the second current spreading layer 142 to fully exert its current spreading function, while preventing the current from being directly injected downward from the second conductive pad 172 on the second conductive block 152 to the mesa structure below the second conductive pad 172 .

[0107] In this embodiment, as mentioned above, the first DBR reflective layer 160 has a first through hole 1601 and a second through hole 1602 penetrating the first DBR reflective layer 160, and the second through hole 1602 is located above the middle of the core 1521 of the second conductive block 152. Figure 8 , Fig.10 and Fig.11 This structure can be intuitively compared to Fig.14 This structure design is directly derived from the conventional method of directly connecting the corresponding conductive structure to the end of the conductive structure. This structure ensures that the second conductive pad 172 is directly connected to the center of the core 1521 of the second conductive block 152, thereby ensuring that the current injection can be diffused from the middle of the second conductive block 152 to the surroundings (especially the two sides), and the two wings 1522 can also better assist the corresponding current diffusion effect, so the current diffusion effect is better and the chip reliability is higher.

[0108] Fig.12 As shown in FIG. 1 , the LED chip further includes a second DBR reflective layer 180 . The second DBR reflective layer 180 is located on the back side of the substrate 100 .

[0109] In the top view, the distances from the first conductive block 151 to the first conductive pad 171 and the second conductive pad 172 are equal. Figure 8 and Fig.13 , or you can directly refer to Fig.14 .

[0110] Fig.13 and Fig.14 It is shown that in the top view projection, the distances from the second conductive block 152 to the two bridging conductive blocks 150 are equal, or in other words, the top view projection of the second conductive block 152 falls on the common bisector of the first conductive pad 171 and the second conductive pad 172. This also means that the second through hole 1602 of the first DBR reflective layer 160 is set in the middle position in its width direction. Such a structure also ensures that the current injection can be diffused from the middle to both sides, the current diffusion effect is better, and the chip reliability is higher.

[0111] Fig.13The top projection of the first conductive pad 171, the second conductive pad 172 and the substrate 100 is shown separately, from which it can be seen that the first conductive pad 171 adopts a convex design (protruding toward the second conductive pad 172 side), and Figure 8 It can be seen that in the top view projection, the first conductive pad 171 and the second conductive pad 172 do not overlap with the position of the bridging conductive block 150. Fig.14 .

[0112] In this embodiment, the length direction of the cross-connected current blocking block 130 is perpendicular to the length direction of the built-in current blocking block 132 . In other embodiments, the two length directions may also be parallel.

[0113] The LED chip provided in this embodiment has a structural design so that there is no overlapping between the top projection of the jumper conductive block 150 and the top projection of the first conductive pad 171 and the second conductive pad 172, thereby preventing chip leakage caused by damage to the protective passivation layer (i.e., the first DBR reflective layer 160), that is, reducing leakage channels and improving product reliability.

[0114] Furthermore, the top projection of the jumper conductive block 150 has no overlapping part with the top projection of the second current spreading layer 142 (on the contrary, the jumper conductive block 150 is connected to the bottom layer of the second mesa structure 112 below the second current spreading layer 142). In this structure, the jumper conductive block 150 is located at the edge of the core particle. In the process of grabbing the LED chip, the LED chip will not fail due to the damage of the middle jumper conductive block by the ejector pin, thereby improving the reliability of the product.

[0115] There is an overlapping portion between the top projection of the bridging conductive block 150 and the top projection of the first current spreading layer 141 , thereby achieving a corresponding good electrical connection structure.

[0116] The LED chip provided in this embodiment is designed with two jumper conductive blocks 150. When a single jumper conductive block 150 is damaged, it will not cause the core particle to fail, making the product more reliable. At the same time, the two jumper conductive blocks 150 are distributed on both sides of the core particle, which can further avoid the above-mentioned LED chip failure caused by the middle jumper conductive block being damaged by the ejector pin, and further improve the reliability of the product.

[0117] The LED chip provided in this embodiment has the first through hole 1601 of the first DBR reflective layer 160 opened above the middle position of the top projection of the first conductive block 151, and the second through hole 1602 of the first DBR reflective layer 160 opened above the middle position of the top projection of the second conductive block 152. Figure 8 and Fig.11 , or you can directly refer to Fig.14, which can make the corresponding current diffusion (expansion) effect better and the product performance better.

[0118] The LED chip provided in this embodiment sets the first width W1 to be larger than the second width W2, which can better protect the bridging structure at the groove, achieve better leakage prevention and better electrical connection, and further improve reliability.

[0119] Another embodiment of the present invention provides another LED chip, please refer to Figures 15 to 19 ,in Fig.19 It is a schematic diagram of the top view projection of each structure of the entire LED chip. Fig.12 , because the cross-sectional structure of the LED chip of this embodiment is basically the same as the cross-sectional structure of the LED chip of the previous embodiment.

[0120] refer to Fig.15 The LED chip includes a substrate 100, a first mesa structure 111, a second mesa structure 112, a cross-current blocking block 130 (reference Fig.16 and Fig.19 ), jumper conductive block 150 (reference Fig.17 and Fig.19 )、the first conductive pad 171 (reference Fig.18 and Fig.19 ) and the second conductive pad 172 (reference Fig.18 and Fig.19 ). The first mesa structure 111 is located on the substrate 100 , and the second mesa structure 112 is located on the substrate 100 .

[0121] Fig.15 The top layer of the first mesa structure 111, the top layer of the second mesa structure 112, and the top projection of the substrate 100 are shown separately. The top projection of the top layer of the first mesa structure 111 has a concave notch 1111. The top projection of the top layer of the second mesa structure 112 is a chamfered rectangle with two corner notches 1121, which face the first mesa structure 111 and are symmetrical.

[0122] This embodiment does not separately show the corresponding deep groove projection. The deep groove projection can refer to the previous embodiment. Figure 3 , you can also refer to Fig.19 .

[0123] Fig.16 As shown, there are two cross-current blocking blocks 130 in this embodiment.

[0124] Fig.17 As shown, there are also two jumper conductive blocks 150 .

[0125] Fig.18The top projections of the first conductive pad 171, the second conductive pad 172 and the substrate 100 are shown separately, from which it can be seen that the first conductive pad 171 and the second conductive pad 172 are both convex in design. In addition, a portion of the top projection of the second conductive pad 172 is also sandwiched between the two bridging conductive blocks 150, and the top shape of the first conductive pad 171 and the top shape of the second conductive pad 172 are basically symmetrical. The basic symmetry means that the top shape of the first conductive pad 171 and the top shape of the second conductive pad 172 are both chamfered rectangles with a pair of missing corners, and the difference between them is only that the corresponding missing corners are slightly different, including the size, shape and angle of the missing corners are slightly different, but the overall shape is roughly symmetrical, such as Fig.18 shown.

[0126] In this embodiment, the top projection of the bridging conductive block 150 does not overlap with the top projections of the first conductive pad 171 and the second conductive pad 172. Fig.19 This structural design can be seen directly in the .

[0127] Fig.19 As shown, in this embodiment, the top projections of the two bridging conductive blocks 150 are symmetrical, and a portion of the top projection of the first conductive pad 171 is sandwiched between the two bridging conductive blocks 150 .

[0128] Please refer to the above embodiments. Fig.12 The LED chip of this embodiment also includes a first current spreading layer 141 and a second current spreading layer 142 .

[0129] In this embodiment, the top projection of the bridging conductive block 150 has no overlapping portion with the top projection of the second current spreading layer 142. Fig.19 The top projection of the bridging conductive block 150 and the first current spreading layer 141 have corresponding overlapping parts.

[0130] The LED chip of this embodiment further includes a first DBR reflective layer 160 . The first DBR reflective layer 160 has a first through hole 1601 and a second through hole 1602 , which can be combined with the corresponding contents of the above-mentioned embodiments.

[0131] The LED chip further includes a built-in current blocking block 132 . The top projection of the built-in current blocking block 132 includes a middle portion 1321 and two side portions 1322 connecting the middle portion 1321 .

[0132] The LED chip further includes a first conductive block 151. The top view projection of the first conductive block 151 falls within the inner concave notch 1111 of the first mesa structure 111. Fig.19 This structural design can be seen intuitively in the figure.

[0133] The LED chip further includes a second conductive block 152, the top view projection of which falls within the top view projection of the built-in current blocking block 132. The second conductive block 152 includes a core 1521 and two wing portions 1522, the core 1521 is located above the middle portion 1321, and the core 1521 falls within the middle portion 1321; the wing portions 1522 are located above the side portions 1322, and the wing portions 1522 fall within the side portions 1322, and can also be formed by Fig.19 It can be seen intuitively.

[0134] Please refer to the above embodiments. Fig.12 The LED chip further includes a second DBR reflective layer 180 , which is located on the back side of the substrate 100 .

[0135] In this embodiment, the length direction of the cross-connected current blocking block 130 is parallel to the length direction of the built-in current blocking block 132 .

[0136] For more information about the structure, properties and advantages of the LED chip provided in this embodiment, please refer to the corresponding content of the aforementioned embodiment.

[0137] Different from the above-mentioned embodiment, Fig.15 The corner notch 1121 of this embodiment has a more special shape, which allows the second mesa structure 112 to be divided into three parts with different average widths. Fig.15 In FIG. 3 , the three different parts are shown divided by dotted lines.

[0138] Different from the above-mentioned embodiment, the top projection of the jumper conductive block 150 of this embodiment has a first finger 1504, a knot 1502 and a second finger 1505. The knot 1502 crosses the groove, the outer end of the first finger 1504 is the first end, and the outer end of the second finger 1505 is the second end. The knot 1502 falls within the top projection of the jumper current blocking block 130.

[0139] Different from the above-mentioned embodiment, the width of the knot 1502 of this embodiment is greater than both the width of the first finger 1504 and the width of the second finger 1505, while the width of the finger 1504 can be equal to the width of the second finger 1505. This width structure design is helpful for optimizing the structure and improving the reliability.

[0140] Fig.15 The corner gap 1121 and Fig.17 The jumper conductive blocks 150 cooperate with each other, so that in the present application, the corresponding jumper series conductive effect is stronger and the reliability is further improved.

[0141] Different from the previous embodiment, the bisector of the knot 1502 and the bisector of the first finger 1504 in this embodiment coincide with the first straight line (not shown), the bisector of the second finger 1505 is the second straight line (not shown), the first straight line is parallel to the second straight line, and the second finger 1505 connects the outer corner of the knot 1502 (the outer corner refers to the corner facing the edge). Together, they define Fig.17 The top projection shape of the jumper conductive block 150 is shown in FIG. The jumper conductive block 150 of this special shape also has various advantages of the above-mentioned embodiments, and further strengthens the series conductive connection function.

[0142] It should be noted that the coincidence of the above-mentioned bisectors is a coincidence under design, and actual products should also coincide under ideal conditions. However, due to factors such as process, some actual products may have certain deviations, which should be understood in this field.

[0143] In other embodiments, the bisector of the knot and the bisector of the second finger may coincide with the first straight line, the bisector of the first finger may be the second straight line, the first straight line may be parallel to the second straight line, and the first finger may be connected to the inner corner of the knot (the inner corner refers to the corner facing the middle area).

[0144] Different from the above-mentioned embodiment, in this embodiment, a common bisector of the middle portion 1321 and the side portion 1322 is a third straight line (not shown), and the third straight line is parallel to the first straight line.

[0145] Similar to the above embodiment, Fig.19 , the top projection of the cross-current blocking block 130 has a head 1301 and a tail 1302. In the top projection, the junction 1502 falls within the head 1301, the first finger 1504 is located within the tail 1302, and the second finger 1505 has no overlapping portion with the cross-current blocking block 130. The width of the head 1301 is more than 1.5 times the width of the tail 1302, for example, it can be 1.5 times, 2 times or 2.5 times, etc. Fig.19 As further shown in the top view projection, the portion of the head 1301 that does not overlap with the knot 1502 has a first width ( Fig.19 ), the portion of the tail 1302 that does not overlap with the first finger 1504 has a second width ( Fig.19 Not marked in the figure), the first width is greater than the second width, and reference may be made to the corresponding contents of the foregoing embodiment.

[0146] Another embodiment of the present invention provides another LED chip, please refer to Figure 20 to Figure 22 ,in Fig. 22 It is a schematic diagram of the top view projection of each structure of the entire LED chip. Fig.12, because the cross-sectional structure of this embodiment is basically the same as the cross-sectional structure of the previous embodiment.

[0147] Most of the structures of the LED chips provided in this embodiment are similar to Figures 15 to 19 The LED chips shown are the same, and therefore, reference may be made to the corresponding contents of the aforementioned embodiments.

[0148] This embodiment and Figures 15 to 19 The embodiment shown differs in two aspects: first, Fig. 20 As shown, the shape of the inner concave notch 1111 formed by the top projection of the first mesa structure 111 in this embodiment is different; second, as Fig.21 As shown, accordingly, the top projection shape of the first conductive block 151 of this embodiment is different. In this embodiment, the top projection of the inner concave notch 1111 is funnel-shaped, while the top projection of the first conductive block 151 is nail-shaped with a round head.

[0149] The first conductive block 151 is also designed to fall within the inner recess 1111 of the first mesa structure 111. Fig. 22 .

[0150] In this embodiment, the indented notch 1111 is located on a bisector (not shown) of the top projection of the first mesa structure, and this bisector also bisects the indented notch 1111 and the first conductive block 151. That is, when the top projection of the first conductive block 151 is a nail shape with a round head, the bisector of the nail shape with a round head is also Figures 15 to 19 The first straight lines described in the illustrated embodiment are parallel. Such a design is also conducive to the expansion of the corresponding current.

[0151] For more information about the structure, properties and advantages of the LED chip provided in this embodiment, please refer to Figures 15 to 19 The corresponding contents of the embodiment shown.

[0152] Another embodiment of the present invention provides another LED chip, please refer to Figure 23 to Figure 26 ,in Fig.26 It is a schematic diagram of the top projection of the various structures of the entire LED chip. In addition, its cross-sectional structure can be combined with the cross-sectional structure of the aforementioned embodiment. Fig.12 .

[0153] Part of the structure of the LED chip provided in this embodiment is the same as that of the aforementioned embodiment, and therefore, reference may be made to the corresponding contents of the aforementioned embodiment.

[0154] In this embodiment, Fig.23 As shown, the top projection of the second mesa structure 112 also forms an inner concave notch 1122 instead of a corner notch, and the number of the inner concave notch 1122 is only one.

[0155] More importantly, if Fig.24 As shown, in this embodiment, there is only one cross-current blocking block 130 , which includes a head portion 1301 and a tail portion 1302 , and the width of the tail portion 1302 is greater than that of the head portion 1301 .

[0156] Correspondingly, such as Fig.25 As shown, there is only one bridging conductive block 150. The bridging conductive block 150 includes a junction 1502, a first end 1506, and a second end 1507. The width of the first end 1506 is greater than the width of the second end 1507, and the width of the second end 1507 is greater than the width of the junction.

[0157] In this embodiment, only one jumper current blocking block 130 and one jumper conductive block 150 are designed, but they are accordingly arranged in the middle position of the entire top-view structure, and their widths are correspondingly increased, which helps to improve their conductive performance and thus improve product reliability.

[0158] For more information about the structure, properties and advantages of the LED chip provided in this embodiment, please refer to the corresponding contents of the aforementioned embodiments.

[0159] Another embodiment of the present invention provides another LED chip, please refer to Figures 27 to 30 ,in Fig.30 It is a schematic diagram of the top projection of the various structures of the entire LED chip. In addition, its cross-sectional structure can be combined with the cross-sectional structure of the aforementioned embodiment. Fig.12 .

[0160] Part of the structure of the LED chip provided in this embodiment is the same as that of the aforementioned embodiment, and therefore, reference may be made to the corresponding contents of the aforementioned embodiment.

[0161] In this embodiment, Fig. 27 As shown, the first mesa structure 111 has a concave notch 1111 in a top view. The difference from the previous embodiment is that the concave notch 1111 in this embodiment is arranged at Fig. 27 At the upper left corner of the top projection of the first mesa structure 111.

[0162] The top projection of the second mesa structure 112 has a corner notch 1121. The position of the corner notch 1121 is different from that of the previous embodiment. It is only arranged at Fig. 27 The lower left corner of the first mesa structure 111 in FIG.

[0163] like Fig.28 As shown, in this embodiment, there is only one cross-connect current blocking block 130, which includes a head 1301 and a tail 1302. Fig.24 On the contrary, in this embodiment, the width of the tail portion 1302 is smaller than the width of the head portion 1301 .

[0164] Correspondingly, such as Fig.29 As shown, there is only one bridging conductive block 150. The bridging conductive block 150 includes a junction 1502, a first finger 1508, and a second finger 1509. The first end 1508 is linear, and the second finger 1509 is not only connected to the lower corner of the junction 1502, but also, in this embodiment, the second finger 1509 itself has a corner structure.

[0165] In this embodiment, only one bridging current blocking block 130 and one bridging conductive block 150 are designed. At the same time, the concave notch 1111 and the corner notch 1121 are arranged at different corners of the product, one at the upper corner and the other at the lower corner, which also helps to expand the current and improve the reliability of the product.

[0166] For more information about the structure, properties and advantages of the LED chip provided in this embodiment, please refer to the corresponding contents of the aforementioned embodiments.

[0167] The embodiment of the present invention further provides an LED chip packaging module (not shown), which may include any one of the LED chips in the aforementioned embodiments. Therefore, the reliability of the LED chip packaging module is improved.

[0168] An embodiment of the present invention further provides a display device, which may include any one of the LED chips in the aforementioned embodiments. The LED chip is used as a backlight source chip of a backlight module of the display device, thereby improving the reliability of the display device.

[0169] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An LED chip, characterized in that: include: substrate; a first mesa structure, wherein the first mesa structure is located on the substrate; a second mesa structure, the second mesa structure being located on the substrate; A bridging conductive block, wherein a first end of the bridging conductive block is electrically connected to a top layer of the first mesa structure, and a second end of the bridging conductive block is electrically connected to a bottom layer of the second mesa structure; A DBR reflective layer, wherein the DBR reflective layer covers the exposed upper surfaces and side surfaces of the first mesa structure and the second mesa structure, and covers a portion of the groove between the first mesa structure and the second mesa structure; A first conductive pad and a second conductive pad, wherein the first conductive pad and the second conductive pad are located above the DBR reflective layer; The top projection of the bridging conductive block has no overlapping portion with the top projections of the first conductive pad and the second conductive pad; There are two bridging conductive blocks, and a portion of the first conductive pad in a top view is sandwiched between the two bridging conductive blocks.

2. The LED chip according to claim 1, characterized in that: There are two bridging conductive blocks, and a portion of the second conductive pad projected from above is sandwiched between the two bridging conductive blocks.

3. The LED chip according to claim 1, characterized in that: Also includes: a first current spreading layer, the first current spreading layer being located above the first mesa structure, the bridging conductive block being electrically connected to a top layer of the first mesa structure by connecting the first current spreading layer; a second current spreading layer, the second current spreading layer being located above the second mesa structure; The top projection of the bridging conductive block has no overlapping portion with the top projection of the second current spreading layer.

4. The LED chip according to claim 3, characterized in that: Also included is a built-in current blocking block, which is located between the second mesa structure and the second current spreading layer.

5. The LED chip according to claim 4, characterized in that: The top projection of the built-in current blocking block includes a middle portion and two side portions connecting the middle portion, and the width of the middle portion is greater than that of the side portions.

6. The LED chip according to claim 4, characterized in that: It also includes a second conductive block, which is located above the built-in current blocking block and on the second current spreading layer, and a top-view projection of the second conductive block falls within a top-view projection of the built-in current blocking block.

7. The LED chip according to claim 6, characterized in that: The second conductive block includes a core and two wings located on both sides of the core; the DBR reflective layer has a first through hole and a second through hole penetrating the DBR reflective layer; and the second through hole is located above the middle of the core of the second conductive block.

8. The LED chip according to claim 1, characterized in that: The top projection of the second mesa structure's top layer is a chamfered rectangle with two corner notches, the corner notches face the first mesa structure, and the two corner notches are symmetrical; the corner notches match the jumper conductive block.

9. The LED chip according to claim 4, characterized in that: It also includes a second conductive block, which is located between the second mesa structure and the second conductive pad, and a top-view projection of the second conductive block is located within a top-view projection of the built-in current blocking block.

10. The LED chip according to claim 1, characterized in that: The first conductive pad and the second conductive pad are convex in design.

11. The LED chip according to claim 1, characterized in that: The top projection of the first mesa structure has a concave notch, and the concave notch is located on the bisector of the top projection of the first mesa structure, and the bisector also bisects the concave notch.

12. An LED chip packaging module, characterized in that: The invention comprises the LED chip according to any one of claims 1 to 11.

13. A display device, characterized in that: The invention comprises the LED chip according to any one of claims 1 to 11.

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