Electronic device, balance bar and method of manufacturing the same

Abstract

The embodiment of the present application provides an electronic device, a balance bar and a preparation method thereof. By including the resin balance bar in the key of the electronic device, the purpose of keyboard vibration and noise reduction is achieved, the keyboard noise problem is improved, and the problem that the existing keyboard has relatively large noise during use due to the collision and resonance of the balance bar and the assembly groove of the keyboard substrate is solved.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the terminal technical field, in particular to an electronic device, a balance bar and a preparation method thereof. BACKGROUND

[0002] The tablet PC is a kind of small, portable terminal device, wherein, in the hardware device of the tablet PC, the keyboard is one of important input ports, and the performance of the keyboard greatly influences the experience of the user.

[0003] At present, in the keyboard of the tablet PC, in order to balance the problem that the large-size keys (such as shift key, enter key, space key, etc.) are unevenly stressed when in use, a pair of balance bars is often installed under the keycap of the large-size key, the balance bar is often made of stainless steel, the two ends of the balance bar are rotatably connected with the assembly slot arranged on the base plate of the keyboard, the balance bar can play a role of transmitting stress, and the even stress when the keycap is struck is ensured, so that the whole plane of the keycap moves almost simultaneously.

[0004] However, during the process of striking the keyboard, the balance bar collides with the assembly slot on the base plate of the keyboard, noise is generated, in addition, when the tablet PC plays music, the balance bar and the base plate of the keyboard resonate, and finally the keyboard generates relatively large noise during use, therefore, how to overcome the problem of keyboard resonance noise has become a problem to be solved for the tablet PC. SUMMARY

[0005] The embodiment of the present application provides an electronic device, a balance bar and a preparation method thereof, achieves the purpose of reducing vibration and noise of the keyboard, improves the problem of keyboard noise, and solves the problem that the existing keyboard generates relatively large noise during use due to the collision and resonance of the balance bar and the assembly slot of the keyboard base plate.

[0006] The first aspect of the embodiment of the present application provides an electronic device, at least comprising: a keyboard device, the keyboard device comprising a keyboard base plate and a plurality of keys arranged on the keyboard base plate,

[0007] Each of the keys comprises: a keycap and at least one rebounding component, the rebounding component is respectively connected with the keycap and the keyboard base plate;

[0008] At least part of the plurality of keys further comprises: at least one balance bar, the two ends of each of the balance bars are rotatably connected with the assembly slot arranged on the keyboard base plate, and the balance bar is rotatably connected with the keycap;

[0009] The balance bar is a resin balance bar.

[0010] The electronic device provided by the embodiment of the present application sets the balance bar as a resin balance bar, so that the collision between metals is changed into the collision between resin and metal, thereby reducing the noise generated by the collision between the balance bar and the inner wall of the assembly groove, achieving the purpose of reducing vibration and noise of the keyboard, improving the keyboard noise problem, and solving the problem that the existing keyboard has relatively large noise during use due to the collision and resonance between the balance bar and the assembly groove of the keyboard substrate.

[0011] In addition, when the balance bar is a resin balance bar, the structure of the keyboard substrate, the rebound assembly and the keycap in the keyboard device does not change, so in the embodiment of the present application, in addition to replacing the material of the balance bar, the purpose of reducing vibration and noise is achieved without changing the structure of the keyboard device, and the balance bar process and assembly can be continuously produced and assembled, thereby improving the assembly and production efficiency.

[0012] In addition, the weight of the resin balance bar is lower than that of stainless steel, so the overall weight of the keyboard is reduced, which is beneficial to the light weight of the electronic device.

[0013] In a possible implementation, the material of the resin balance bar includes, in terms of mass fraction, 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent and 5-12 parts of adhesive. In this way, the balance bar prepared meets the requirements of high stiffness, high toughness and high wear resistance, so that the resin balance bar can replace the stainless steel balance bar.

[0014] In a possible implementation, the resin material is one or more of polyether ether nitrile, polyether ether ketone, polyimide, polycarbonate, fluorine-containing resin and aromatic heterocyclic resin material.

[0015] In a possible implementation, the carbon fiber is one or more of short carbon fiber, long carbon fiber, glass fiber and carbon nanotube.

[0016] In a possible implementation, the adhesive is one or more of epoxy resin glue, acrylic resin glue, urea-formaldehyde resin glue, polyimide glue and furan resin glue.

[0017] In a possible implementation, the reinforcing agent is one or more of carbon black, nano titanium powder and nano zinc oxide.

[0018] In a possible implementation, the wear-resistant agent is one or more of polytetrafluoroethylene (PTFE), nylon, polyurea and epoxy resin.

[0019] The second aspect of the present application provides a preparation method of a balance bar, the method comprising:

[0020] The carbon fiber, the resin material, the reinforcing material, the wear-resistant agent and the adhesive are provided.

[0021] The balance bar is prepared by mixing 30-50 parts of the carbon fiber, 20-40 parts of the resin material, 3-10 parts of the reinforcing material, 5-15 parts of the wear-resistant agent and 5-12 parts of the adhesive.

[0022] In a possible implementation, when the carbon fiber is long fiber, the step of preparing the balance bar by mixing 30-50 parts of the carbon fiber, 20-40 parts of the resin material, 3-10 parts of the reinforcing material, 5-15 parts of the wear-resistant agent and 5-12 parts of the adhesive includes:

[0023] The resin material, the reinforcing material, the wear-resistant agent and the adhesive are mixed to form a prepreg;

[0024] The carbon fiber is immersed in the prepreg to form a prepreg tape;

[0025] The prepreg tape is hot-pressed at a temperature of 240-300 DEG C for a preset time to obtain the balance bar.

[0026] In a possible implementation, when the carbon fiber is long fiber, the step of preparing the balance bar by mixing 30-50 parts of the carbon fiber, 20-40 parts of the resin material, 3-10 parts of the reinforcing material, 5-15 parts of the wear-resistant agent and 5-12 parts of the adhesive includes:

[0027] The carbon fiber, the resin material, the reinforcing material, the wear-resistant agent and the adhesive are mixed;

[0028] The mixture of the carbon fiber, the resin material, the reinforcing material, the wear-resistant agent and the adhesive is hot-pressed at a temperature of 240-300 DEG C for a preset time to obtain the balance bar.

[0029] The third aspect of the present application provides a balance bar prepared by the preparation method. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 A perspective structural schematic diagram of an electronic device is provided for an embodiment of the present application;

[0031] Figure 2 An exploded schematic diagram of a keyboard device in an electronic device is provided for an embodiment of the present application;

[0032] Figure 3 An exploded schematic diagram of one key on an electronic device is provided for an embodiment of the present application;

[0033] Figure 4 for Figure 3 An enlarged diagram showing the explosion of the middle button;

[0034] Figure 5 A side view of one of the buttons of an electronic device provided in an embodiment of this application;

[0035] Figure 6 This is a schematic diagram of the assembly of a balance bar and keycaps for an electronic device provided in an embodiment of this application;

[0036] Figure 7A A flowchart illustrating a method for preparing a balance bar according to an embodiment of this application;

[0037] Figure 7B A flowchart illustrating a method for preparing a balance bar according to an embodiment of this application;

[0038] Figure 8 A schematic diagram showing the four points of a button with a balance bar installed in an electronic device according to an embodiment of this application, and the forces acting on them;

[0039] Figure 9 for Figure 8 The displacement decrease curves of the four points on the button after point A is subjected to force;

[0040] Figure 10 The displacement decrease curves of four points on the existing button with a stainless steel balance bar after force is applied at point A;

[0041] Figure 11 The displacement decrease curves of the button with resin balance bar provided in this embodiment and the existing button with stainless steel balance bar after being subjected to force at point B are shown.

[0042] Figure 12 The displacement decrease curves of the button with resin balance bar provided in this embodiment and the existing button with stainless steel balance bar after being subjected to force at point C are shown.

[0043] Figure 13 The displacement descent curves of the button with resin balance bar provided in this embodiment and the existing button with stainless steel balance bar after being subjected to force at point D are shown.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100 - Electronic device; 10 - Display screen; 20 - Main unit; 21 - Mounting part; 30 - Keyboard device;

[0046] 31, 31a, 31b, 31c - Buttons; 311 - Keycap; 3111 - Locking block; 3112 - Locking slot; 3113 - Back side;

[0047] 312 - springing assembly; 3121 - upper scissor leg; 3122 - lower scissor leg; 32 - keyboard substrate; 32a - contact;

[0048] 321a, 321b - assembly slot; 321c - partition; 321d - assembly plate; 322 - clamping piece; 323 - circuit board;

[0049] 324 - metal backplane; 33 - balance bar; 331a - first end 331b - second end. DETAILED DESCRIPTION

[0050] The electronic device can be a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), and the like mobile terminal, fixed terminal or foldable device with a keyboard. Or the electronic device can be a keyboard.

[0051] In the embodiments of the present application, a notebook computer is taken as an example to illustrate the above electronic device.

[0052] Figure 1 A perspective structural schematic diagram of a notebook computer is shown, referring to Figure 1 As shown, the electronic device 100 can include a display screen 10 and a host body 20, and the display screen 10 and the host body 20 are rotatably connected, for example, the display screen 10 and the host body 20 can be connected through a rotating shaft; or the display screen 10 and the host body 20 can be rotatably connected through a hinge structure; or in some examples, the display screen 10 and the host body 20 can be independent devices, for example, the display screen 10 and the host body 20 can be detachable, when in use, the display screen 10 is placed on the host body 20, and after use, the display screen 10 and the host body 20 can be separated from each other.

[0053] It should be noted that in order to realize the display effect of the display screen 10, the display screen 10 and the host body 20 are electrically connected, for example, the display screen 10 and the host body 20 can be electrically connected through a contact, or the display screen 10 and the host body 20 are electrically connected through a flexible printed circuit (FPC), or the display screen 10 and the host body 20 are electrically connected through a wire.

[0054] Referring to Figure 1As shown, in order to enable input in the electronic device, the electronic device 100 may further include a keyboard device 30, which may be mounted on the main unit 20, for example, as shown in the figure. Figure 2 As shown, the main unit 20 has a mounting part 21, the keyboard is mounted on the mounting part 21 of the main unit 20, the keyboard device 30 is electrically connected to the control unit inside the main unit 20, and the keyboard device 30 serves as an input device for the electronic device 100.

[0055] Figure 2 The structure of the keyboard device 30 is shown, see [link]. Figure 2 As shown, the keyboard device 30 may include: a keyboard base plate 32 and a plurality of keys 31 disposed on the keyboard base plate 32. The types of keys 31 can refer to existing keyboards; for example, the plurality of keys 31 include numeric keys, function keys (such as Delete keys, Insert keys, etc.), and letter keys, etc. See also Figure 2 As shown, some keys 31 are smaller in size, while others are larger, such as the space key 31a, the Enter key 31b, and the Shift key 31c.

[0056] To implement the input function of button 31, see [link / reference]. Figure 2 As shown, the keyboard base plate 32 is provided with contact 32a. When the key 31 is pressed, the contact 32a is triggered to realize the input function.

[0057] Figure 3 A schematic diagram showing the disassembly of one of the Enter buttons 31b of the electronic device 100. Figure 4 China Figure 3 An enlarged diagram of the split button 31. It should be noted that... Figure 4 The keyboard substrate 32 shown is the portion of the keyboard substrate 32 corresponding to one of the keys 31, that is, Figure 4 Only a portion of the keyboard board 32 is shown in the image. Figure 4 In particular Figure 2 Let's take one of the Enter keys, 31b, as an example for explanation.

[0058] See Figure 4 As shown, each key 31 may include: a keycap 311 and at least one spring-loaded component 312, for example, Figure 4 In this example, there are two spring-loaded components 312. Of course, in some examples, there may be one or more spring-loaded components 312. The spring-loaded components 312 are connected to the keycap 311 and the keyboard base plate 32 respectively. The spring-loaded components 312 are used to drive the keycap 311 to reset after the finger leaves the keycap 311 after pressing the keycap 311.

[0059] In the embodiments of this application, see Figure 4As shown, each rebounding assembly 312 includes an upper scissor leg 3121 and a lower scissor leg 3122, the upper scissor leg 3121 and the lower scissor leg 3122 are cross-connected and rotatable, one end of the upper scissor leg 3121 and the lower scissor leg 3122 is connected with the keyboard substrate 32, the other end of the upper scissor leg 3121 and the lower scissor leg 3122 is connected with the keycap 311, and the upper scissor leg 3121 and the lower scissor leg 3122 have elasticity, when the end of the upper scissor leg 3121 and the lower scissor leg 3122 connected with the keycap 311 is compressed, after the external force is removed, the upper scissor leg 3121 and the lower scissor leg 3122 reset the keycap 311 by relying on the elastic force of the upper scissor leg 3121 and the lower scissor leg 3122.

[0060] In the embodiment of the present application, the material of the upper scissor leg 3121 and the lower scissor leg 3122 can be plastic. The cooperation relationship of the upper scissor leg 3121 and the lower scissor leg 3122 can refer to the scissor legs in the existing keys.

[0061] As shown, the upper scissor leg 3121 and the lower scissor leg 3122 can be connected with the keyboard substrate 32 through clamping, for example, referring to Figure 4 As shown, the keyboard substrate 32 is provided with a clamping piece 322, and the upper scissor leg 3121 and the lower scissor leg 3122 are provided with buckles (not shown), and the upper scissor leg 3121 and the lower scissor leg 3122 are connected with the clamping piece 322 on the keyboard substrate 32 through the buckles.

[0062] As shown, the upper scissor leg 3121 and the lower scissor leg 3122 can be connected with the keyboard substrate 32 through clamping, for example, referring to Figure 6 ).

[0063] In the embodiment of the present application, in order to balance the uniform stress of the large-size keys 31 (such as the space key 31a, the Enter key 31b and the Shift key 31c and other large-size keys 31) during use, referring to Figure 4 As shown, at least part of the plurality of keys 31 further includes at least one balance bar 33, for example, Figure 2 The space key 31a, the Enter key 31b and the Shift key 31c and other large-size keys 31 in

[0064] In the embodiment of the present application, referring to Figure 4As shown, the number of balance bars 33 is two, of course, in some other examples, the number of balance bars 33 can also be one, or the number of balance bars 33 can also be three, the following examples are specifically described with two balance bars 33.

[0065] Referring to Figure 4 As shown, the two ends of each balance bar 33 are respectively rotatably connected with the assembly grooves 321a and 321b provided on the keyboard substrate 32, for example, referring to Figure 4 As shown, the keyboard substrate 32 is provided with the assembly grooves 321a and 321b, and the first end 331a of the balance bar 33 is rotatably connected in the assembly groove 321a (see Figure 5 As shown), the second end 331b of the balance bar 33 is rotatably connected in the assembly groove 321b. The balance bar 33 can rotate longitudinally around the assembly grooves 321a and 321b.

[0066] Referring to Figure 5 As shown, when the number of balance bars 33 is two, the first ends 331a of the two balance bars 33 are respectively clamped in the two assembly grooves 321a, wherein the two assembly grooves 321a are separated by a partition 321c, so that the first ends 331a of the two balance bars 33 do not interfere or collide with each other when rotating in the assembly grooves 321a.

[0067] In the embodiments of the present application, referring to Figure 5 As shown, the keyboard substrate 32 can include a metal base plate 324 and a circuit board 323, which can be a printed circuit board 323 (PCB), wherein the metal base plate 324 plays a supporting role, Figure 2 The contact 32a in the above is specifically provided on the circuit board 323, and the contact 32a is electrically connected with the circuit board, and the metal base plate 324 is provided with a protruding assembly plate 321d (see Figure 4 The assembly plate 321d is provided with an opening to form an assembly groove 321a (321b). Wherein, the assembly plate 321d can be integrally formed with the metal base plate 324, or the assembly plate 321d can be fixed on the metal base plate 324 by clamping, welding or fasteners and the like.

[0068] Referring to Figure 6 As shown, the balance bar 33 is rotatably connected with the keycap 311, for example, the back surface 3113 of the keycap 311 is provided with a clamping block 3111, and two oppositely arranged clamping blocks 3111 define a clamping groove 3112, the balance bar 33 is clamped into the clamping groove 3112, and the balance bar 33 can rotate in the clamping groove 3112, referring to Figure 6 As shown, each balance bar 33 corresponds to two clamping grooves 3112 provided on the back surface of the keycap 311.

[0069] Of course, in some examples, the number of card slots 3112 includes but is not limited to two. By setting the balance bar 33 so that the keycap 311 is forced at a certain position, the entire keycap 311 can be lowered as a whole, ensuring that the keycap 311 is evenly stressed when in use.

[0070] Wherein the keycap 311 can be a plastic keycap, and the clamping block 3111 and the keycap 311 can be integrally formed, or the clamping block 3111 and the keycap 311 can be connected by welding or clamping.

[0071] In the prior art, the material of the balance bar 33 is often stainless steel material, which ensures that the balance bar 33 is wear-resistant and has a certain strength. The metal bottom plate 324 and the assembly plate 321d are often also metal. When the two ends of the balance bar 33 are rotatably arranged in the assembly slot 321a and the assembly slot 321b, during use, as the key 31 moves up and down, the balance bar 33 rotates around the two ends (for example, see the first end 331a and the second end 331b of the balance bar 33 in FIG. 8), so that when the key 31 is struck, the two ends of the balance bar 33 are easy to collide with the slot wall of the assembly slot 321a (321b), producing noise. Figure 4

[0072] In addition, when the notebook computer plays music or video, resonance is easy to occur between the sound and the stainless steel balance bar 33, the metal bottom plate 324, and the assembly plate 321d. During the resonance process, since the balance bar 33 moves relative to the slot wall of the assembly slot 321a, collision occurs between the balance bar 33 and the slot wall of the assembly slot 321a during resonance, producing noise, which eventually makes the noise of the electronic device 100 larger, greatly affecting the use of the user, and reducing the satisfaction of the user to the electronic device 100.

[0073] Therefore, one solution is to wrap a flexible material on the balance bar 33 for shock absorption and protection, for example, a thermoplastic tube is sleeved on the two ends of the balance bar 33. However, the length of the thermoplastic tube sleeved on the balance bar 33 is limited, and the assembly cannot be continuously produced, and the sleeving of the thermoplastic tube on the balance bar 33 is often completed manually, which has low automation. In addition, the thermoplastic tube sleeved on the balance bar 33 needs to be bent to form the shape of the balance bar 33 shown in FIG. 8, so that stress concentration problems exist at the bending part, which is easy to cause deformation, fracture burrs of the thermoplastic tube, and the thermoplastic tube and the balance bar 33 are not tight. Figure 6

[0074] ​​Another solution is to add shock absorption protection at the position where the assembly groove 321a and the assembly groove 321b collide with the balance bar 33, for example, to add a buffer layer (such as foam, Mylar, etc.) at the position where the two ends of the balance bar 33 contact the assembly groove 321a and the assembly groove 321b, but this reduces the gap between the two ends of the balance bar 33 and the assembly groove 321a and the assembly groove 321b, resulting in the key 31 moving up and down not smoothly, the user needs to hit the keyboard with a larger force or the key 31 is not flexible, in addition, the process integration of adding a buffer layer between the two ends of the balance bar 33 and the assembly groove 321a and the assembly groove 321b is low, and often needs to be completed manually, which is low in efficiency and high in cost.

[0075] The third solution is to use plastic material for the assembly plate 321d (see Figure 4 ), so that the inner walls of the assembly groove 321a and the assembly groove 321b are all plastic, so that when the balance bar 33 moves up and down, the collision sound between the balance bar 33 and the plastic is reduced, and when playing music or video, it plays a role in shock absorption and noise reduction, but since the metal bottom plate 324 is metal and the assembly plate 321d is plastic, when they are integrally injection molded, the metal bottom plate 324 and the assembly plate 321d have a small bonding force at the interface due to the difference in materials, and the balance bar 33 is easy to cause the assembly plate 321d and the metal bottom plate 324 to delaminate after moving up and down with the keycap 311.

[0076] To solve the above problems, in the embodiment of the application, the material of the balance bar 33 is changed to a resin material, that is, the balance bar 33 is a resin balance bar, so that the metal-to-metal collision is changed to a resin-to-metal collision, and the noise generated by the collision between the resin and the metal is much smaller than the noise generated by the collision between the metals, so in the embodiment of the application, the keyboard noise problem is improved, and the effect of shock absorption and noise reduction is achieved. In addition, when the balance bar 33 is a resin balance bar, the structure of the keyboard substrate 32, the rebound assembly 312, and the keycap 311 in the keyboard device 30 does not change, so in the embodiment of the application, in addition to replacing the material of the balance bar 33, the purpose of achieving shock absorption and noise reduction without changing the structure of the keyboard device 30 is achieved, and the balance bar process and assembly can be continuously produced and assembled, improving the efficiency of assembly and production.

[0077] In the embodiment of the application, when the balance bar 33 is a resin balance bar, in order to achieve the requirements of high wear resistance, high toughness, and high stiffness of the balance bar 33, therefore, in the embodiment of the application, the material of the balance bar 33 includes, by mass fraction: 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent, and 5-12 parts of adhesive.

[0078] The resin balance bar made of the material mixed by the carbon fiber, the resin material, the reinforcing material and the adhesive realizes the requirements of high wear resistance, high toughness and high strength of the balance bar 33.

[0079] In the embodiments of the present application, the resin material is one or more of polyether ether nitrile, polyether ether ketone, polyimide, polycarbonate, fluorine-containing resin, and aromatic heterocyclic resin material.

[0080] In the embodiments of the present application, the carbon fiber is one or more of short carbon fiber, long carbon fiber, glass fiber and carbon nanotube.

[0081] In the embodiments of the present application, the adhesive is one or more of epoxy resin adhesive, acrylic resin adhesive, urea-formaldehyde resin adhesive, polyimide adhesive and furan resin adhesive.

[0082] In the embodiments of the present application, the reinforcing agent is one or more of carbon black, nano titanium powder and nano zinc oxide.

[0083] In the embodiments of the present application, the wear-resistant agent is one or more of iron fluorine dragon (PTFE), nylon, epoxy resin and polyurea.

[0084] In the embodiments of the present application, referring to FIG. 1, Figure 7A The preparation method of the balance bar 33 of the resin material includes the following steps:

[0085] S101, providing carbon fiber, resin material, reinforcing material, wear-resistant agent and adhesive;

[0086] The carbon fiber can be one or more of short carbon fiber, long carbon fiber, glass fiber and carbon nanotube, the resin material can be one or more of polyether ether nitrile, polyether ether ketone, polyimide, polycarbonate, fluorine-containing resin and aromatic heterocyclic resin material, the reinforcing material can be carbon black, nano titanium powder and nano zinc oxide, the wear-resistant agent can be one or more of iron fluorine dragon (PTFE), nylon, polyurea and epoxy resin, and the adhesive can be one or more of epoxy resin adhesive, acrylic resin adhesive, urea-formaldehyde resin adhesive and furan resin adhesive.

[0087] S102, preparing the balance bar under a molding process by mixing 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent and 5-12 parts of adhesive.

[0088] It should be noted that the molding process includes but is not limited to molding processes such as molding method, hot pressing method, extrusion method, injection molding method and drawing method. In the embodiments of the present application, 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent and 5-12 parts of adhesive are mixed and subjected to hot pressing, and the material after hot pressing is subjected to bending or polishing to prepare the balance bar 33.

[0089] In the embodiments of the present application, when the carbon fiber is long fiber, the prepreg method is used for preparation, for example, see Figure 7B As shown in the above S102 step, the following steps can be included:

[0090] S1021a, when the carbon fiber is long fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-10 parts of wear-resistant agent and 5-12 parts of adhesive are mixed to prepare a prepreg;

[0091] S1022a, 30-50 parts of carbon fiber are immersed in the prepreg to prepare a prepreg tape;

[0092] S1023a, the prepreg tape is hot-pressed at a temperature of 240-300°C for a preset time (for example, 10 minutes or 9 minutes) to obtain a balance rod.

[0093] When the carbon fiber is long fiber, see Figure 7B As shown in the above S102 step, the following steps can be included:

[0094] S1021b, when the carbon fiber is short fiber, 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent and 5-12 parts of adhesive are mixed;

[0095] S1022b, the mixture of carbon fiber, resin material, reinforcing material, wear-resistant agent and adhesive is hot-pressed at a temperature of 240-300°C for a preset time (for example, 8 minutes or 10 minutes) to obtain a balance rod.

[0096] The preparation of the resin balance rod is introduced below through several embodiments.

[0097] Example One

[0098] 35 parts of polyether ether ketone resin material, 3 parts of carbon black reinforcing agent, 10 parts of polyimide adhesive material, 10 parts of PTFE wear-resistant agent, and 42 parts of short carbon fiber are mixed, hot-pressed at 260°C for 8 minutes to form a balance rod 33.

[0099] It should be noted that in some other embodiments, in addition to hot-pressing, the forming process includes but is not limited to forming processes such as molding, extrusion, injection molding, drawing, etc.

[0100] Through testing, the resin balance rod prepared by the above components in the embodiments of the present application has a collision noise reduction of 5.1 dB compared with the traditional stainless steel balance rod 33 when used in electronic equipment 100. The bending modulus of the balance rod 33 is 35 GPa.

[0101] Example Two

[0102] Mixing 35 parts of polycarbonate plastic particles, 5 parts of carbon black reinforcing agent, 5 parts of polyimide adhesive material, 15 parts of Teflon (PTFE) wear-resistant agent component to make a prepreg, 40 parts of long carbon fibers are fully immersed in the above slurry to make a prepreg tape, and then taken out after hot pressing at 280°C for 10 minutes to make a balance bar 33.

[0103] Through testing, when the resin balance bar is used in the electronic device 100, compared with the traditional stainless steel balance bar 33, the collision noise of the resin balance bar provided in the embodiment of the application is reduced by 5.5dB during use. The bending modulus of the balance bar 33 is 113GPa.

[0104] Example Three

[0105] Mixing 30 parts of polyether ether ketone resin material, 5 parts of carbon black reinforcing agent, 10 parts of polyimide adhesive material, 15 parts of Teflon (PTFE) wear-resistant agent component to make a prepreg, 40 parts of long carbon fibers are fully immersed in the above slurry to make a prepreg tape, and then taken out after hot pressing at 260°C for 10 minutes to make a balance bar 33.

[0106] Through testing, when the resin balance bar is used in the electronic device 100, compared with the traditional stainless steel balance bar 33, the collision noise of the resin balance bar provided in the embodiment of the application is reduced by 5.8dB during use. The bending modulus of the balance bar 33 is 126GPa.

[0107] Example Four

[0108] Mixing 35 parts of polycarbonate resin material, 5 parts of silicon reinforcing agent, 8 parts of epoxy adhesive material, 15 parts of Teflon (PTFE) wear-resistant agent component to make a prepreg, 37 parts of long carbon fibers are fully immersed in the above slurry to make a prepreg tape, and then taken out after hot pressing at 260°C for 12 minutes to make a balance bar 33.

[0109] Through testing, when the resin balance bar is used in the electronic device 100, compared with the traditional stainless steel balance bar 33, the collision noise of the resin balance bar provided in the embodiment of the application is reduced by 4.9dB during use. The bending modulus of the balance bar 33 is 94GPa.

[0110] Example Five

[0111] Mixing 40 parts of polycarbonate resin material, 5 parts of silicon reinforcing agent, 10 parts of polyimide adhesive material, 15 parts of PTFE wear-resistant agent component to make a prepreg, 40 parts of long carbon fibers are fully immersed in the above slurry to make a prepreg tape, and then taken out after hot pressing at 300°C for 8 minutes to make a balance bar 33.

[0112] After testing, the resin balance bar provided in the embodiments of the present application, when used in the electronic device 100, has a 5.2 dB reduction in collision noise compared to the conventional stainless steel balance bar 33. The bending modulus of the balance bar 33 is 89 GPa.

[0113] Embodiment Six

[0114] Thirty-five parts of polyether ether ketone resin material, three parts of carbon black reinforcing agent, twelve parts of polyimide adhesive material, twelve parts of nylon wear-resistant agent, and thirty-eight parts of short carbon fiber are thoroughly mixed, heated to 260°C, and hot-pressed for ten minutes to form the balance bar 33.

[0115] After testing, the resin balance bar provided in the embodiments of the present application, when used in the electronic device 100, has a 5.2 dB reduction in collision noise compared to the conventional stainless steel balance bar 33. The bending modulus of the balance bar 33 is 89 GPa.

[0116] Test Example

[0117] The balance bar 33 prepared in Embodiment Three is applied to the keyboard device 30, and the downward force is applied to one of the four points, A, B, C, and D, shown in FIG. 8, for example, on the Enter key 31b in the keyboard device 30, and the downward displacement of the other three points is detected. In the embodiments of the present application, for example, the downward force is applied to the point A, and the time change of the horizontal axis and the downward displacement of the vertical axis are shown in FIG. 9. Figure 3 Figure 8 Figure 9 - Figure 13

[0118] Figure 9 The downward curves of A, B, C, and D corresponding to the application of the force to the point A of the key 31 using the resin balance bar, LA is the downward curve of the point A when the downward force is applied to the point A of the key 31 using the resin balance bar, LB is the downward curve of the point B when the downward force is applied to the point A of the key 31 using the resin balance bar, LC is the downward curve of the point C when the downward force is applied to the point A of the key 31 using the resin balance bar, and LD is the downward curve of the point D when the downward force is applied to the point A of the key 31 using the resin balance bar.

[0119] Figure 10 ​​​La is a falling curve of the key 31 at the A point when a downward force is applied to the A point by using the stainless steel balance bar 33, Lb is a falling curve of the key 31 at the B point when a downward force is applied to the A point by using the stainless steel balance bar 33, Lc is a falling curve of the key 31 at the C point when a downward force is applied to the A point by using the stainless steel balance bar 33, and Ld is a falling curve of the key 31 at the D point when a downward force is applied to the A point by using the stainless steel balance bar 33.

[0120] As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position. Figure 9 Figure 10 Figure 10 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position.

[0121] Figure 11 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position. Figure 10 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position.

[0122] Figure 12 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position. Figure 11 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position.

[0123] Figure 13 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position. Figure 11 As shown in FIG. 3, when a force is applied to the A point, the B, C, and D points all keep a downward trend and are basically consistent with the curves in FIG. 2, so compared with the prior art, the resin balance bar provided in the embodiment of the present application can realize synchronous falling of the key 31 at each position.

[0124] In summary, the electronic device 100 provided in the embodiment of the present application uses the resin balance bar in the large-size key 31, so that the keyboard can realize shock absorption and noise reduction, the problem of keyboard noise and resonance noise caused by the collision between the stainless steel balance bar 33 and the inner wall of the assembly groove 321a (321b) is solved, in addition, the resin balance bar has a lower weight than the stainless steel balance bar, so the overall weight of the keyboard is reduced, which is conducive to the lightweight of the electronic device 100.​​

[0125] In the description of the embodiments of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "mount", "connect", "connection" should be understood broadly, for example, can be fixed connection, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0126] The terms "first", "second", "third", "fourth" and the like (if any) in the description of the embodiments of the present application and the claims and the above-described drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence.

[0127] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and not to limit them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, At least including: The keyboard device includes a keyboard base plate and a plurality of keys disposed on the keyboard base plate. Each of the keys includes: a keycap and at least one spring-loaded component, the spring-loaded component being connected to the keycap and the keyboard base plate respectively; At least some of the keys also include: at least one stabilizer bar, with each stabilizer bar having its two ends rotatably connected to a mounting groove on the keyboard base plate, and the stabilizer bar being rotatably connected to the keycap; Furthermore, the balance bar is a resin balance bar; The resin balance bar is made of the following materials in parts by weight: 30-50 parts carbon fiber, 20-40 parts resin material, 3-10 parts reinforcing material, 5-15 parts wear-resistant agent, and 5-12 parts adhesive.

2. The electronic device according to claim 1, characterized in that, The resin material is one or more of the following: polyetherethernitrile, polyetheretherketone, polyimide, polycarbonate, fluorinated resin, and aromatic heterocyclic resin.

3. The electronic device according to claim 2, characterized in that, The carbon fiber is one or more of short carbon fiber, long carbon fiber, glass fiber, and carbon nanotubes.

4. The electronic device according to claim 3, characterized in that, The adhesive is one or more of epoxy resin, acrylic resin, polyimide, urea-formaldehyde resin, and furan resin.

5. The electronic device according to claim 4, characterized in that, The reinforcing material is one or more of carbon black, nano titanium powder, and nano zinc oxide.

6. The electronic device according to any one of claims 1-5, characterized in that, The wear-resistant agent is one or more of Teflon (PTFE), nylon, polyurea, and epoxy resin.

7. A method for manufacturing a balance bar, characterized in that, The method includes: We provide carbon fiber, resin materials, reinforcing materials, abrasion resistant agents, and adhesives. The balance bar is prepared by molding 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent, and 5-12 parts of adhesive.

8. The preparation method according to claim 7, characterized in that, When the carbon fiber is a long fiber, the process of manufacturing the balance bar by combining 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent, and 5-12 parts of adhesive under a molding process includes: Mix 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of abrasion resistant agent and 5-12 parts of adhesive to make a prepreg; 30-50 parts of carbon fiber are impregnated into the prepreg to form a prepreg tape; The balance bar is obtained by hot pressing the prepreg strip at a temperature of 240-300℃ for a preset time.

9. The preparation method according to claim 7, characterized in that, When the carbon fiber is short fiber, the process of manufacturing the balance bar by mixing 30-50 parts of carbon fiber, 20-40 parts of resin material, 3-10 parts of reinforcing material, 5-15 parts of wear-resistant agent, and 5-12 parts of adhesive under a molding process includes: Mix 30-50 parts carbon fiber, 20-40 parts resin material, 3-10 parts reinforcing material, 5-15 parts abrasion resistant agent and 5-12 parts adhesive; The balance bar is prepared by hot pressing a mixture of the carbon fiber, the resin material, the reinforcing material, the wear-resistant agent, and the adhesive at a temperature of 240-300°C for a preset time.

10. A balance bar prepared by any one of the preparation methods described in claims 7-9.

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