Display panel, display device and preparation method of display panel

Abstract

The application provides a display panel, a display device and a preparation method of the display panel, and is applied to the display field to solve the problem that the binding terminal and the connecting lead wire are exposed externally without protection, are easily impacted by foreign matters and corroded by water and oxygen, and line defects occur. The display panel comprises a back plate, a first binding terminal group, a protection structure and a flexible circuit board. The back plate comprises opposite first and second main surfaces. The first binding terminal group comprises a plurality of first binding terminals and is arranged on the first main surface. The first main surface comprises a binding area, and at least part of the first binding terminal group is located in the binding area. The protection structure is arranged around the edge of the binding area. The flexible circuit board is arranged on one side of the first main surface, is connected with the first binding terminal group, and is connected with the side away from the first main surface of the protection structure corresponding to the first binding terminal group.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a display device and a preparation method of the display panel. BACKGROUND

[0002] The improvement of pixel density and PPI (Pixels Per Inch) resolution of LED (Light Emitting Diode) display devices is one of the research hotspots in the related technical field.

[0003] The LED display device includes a display panel. At present, in order to simplify the overall process flow of manufacturing the display panel, the double-sided array process of the back plate in the display panel is simplified into a single-sided array process, then a connecting lead is formed by coating a film on the side edge and by laser etching, the connecting lead connects the front side circuit and the back side circuit of the display panel, the back side circuit is extended into a binding terminal and the connecting lead with a certain length in proportion, and the FPC (Flexible Printed Circuit) is directly connected with the binding terminal through a binding process, so as to realize the input and output of signals and voltages. SUMMARY

[0004] The present application provides a display panel, a display device and a preparation method of the display panel, so as to solve the problem that the binding terminal and the connecting lead are exposed without protection, are easily bumped by foreign matters and are easily corroded by water and oxygen, and the line is not good.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0006] The first aspect of the present application provides a display panel, comprising a back plate, a first binding terminal group, a protection structure and a flexible circuit board, the back plate comprises a first main surface and a second main surface opposite to each other, the first binding terminal group comprises a plurality of first binding terminals, and the first binding terminal group is arranged on the first main surface. The first main surface comprises a binding area, and at least a part of the first binding terminal group is located in the binding area. The protection structure is arranged around the edge of the binding area. The flexible circuit board is arranged on one side of the first main surface, the flexible circuit board is connected with the first binding terminal group, and the protection structure corresponding to the first binding terminal group is away from the side of the first main surface.

[0007] In the display panel provided by some embodiments of the present application, the protective structure is arranged around the edge of the binding area on the first main surface, so as to enclose the periphery of the first binding terminal group located in the first binding area, and the side of the first binding terminal group away from the back plate is connected with the protective structure through the flexible circuit board to form an enclosure, so that the first binding terminal group in the binding area is located in the closed space formed by the back plate, the protective structure and the flexible circuit board, and the first binding terminal group in the binding area is effectively prevented from being damaged by impact or water and oxygen corrosion, thereby affecting the effect of the first binding terminal group.

[0008] In some embodiments, the back plate further comprises a plurality of side surfaces connecting the first main surface and the second main surface, and at least one side surface is a selected side surface. The first binding terminal group is arranged at a side edge close to the selected side surface. At least one end of the first binding terminal group away from the selected side surface is located in the binding area.

[0009] In some embodiments, the display panel further comprises a connecting lead group connected with the protective layer, the connecting lead group comprising a plurality of connecting leads, the connecting lead group being arranged on the selected side surface and the first main surface, and each connecting lead being connected with a first binding terminal; or the connecting lead group being arranged on the selected side surface and the first main surface and extending to the binding area, and each connecting lead being located in the binding area as a first binding terminal. The protective layer covers the connecting lead group and a part of the first binding terminal group close to the selected side surface. The protective structure is connected with the part of the protective layer covering the first binding terminal group.

[0010] In some embodiments, the flexible circuit board comprises a plurality of conductive pads, the plurality of conductive pads being connected with the first binding terminal group, and the peripheral region of the plurality of conductive pads being connected with the protective structure.

[0011] In some embodiments, the protective structure is a thermosetting adhesive. Further, the viscosity of the thermosetting adhesive ranges from 100 cp to 1000 cp, for example.

[0012] In some embodiments, further comprising a conductive film located in the enclosed area of the protective structure, and the flexible circuit board is connected with the first binding terminal group through the conductive film.

[0013] In some embodiments, further comprising a plurality of light emitting devices arranged on the side of the second main surface of the back plate and a protective film arranged on the side of the plurality of light emitting devices away from the second main surface.

[0014] In some embodiments, a second binding terminal group comprising a plurality of second binding terminals is arranged on the second main surface of the back plate. The second binding terminal group is positionally corresponding to the first binding terminal group in the thickness direction of the back plate. The connecting lead further extends to the second main surface of the back plate, and each connecting lead is connected with a second binding terminal.

[0015] In some embodiments, the number of the first binding terminal groups is plural, the number of the protection structures is consistent with the number of the first binding terminal groups, and the number of the flexible circuit boards is consistent with the number of the first binding terminal groups. At least two first binding terminal groups are arranged at the side edges close to the same selected side surface, and the at least two first binding terminal groups are arranged side by side. At least a part of each first binding terminal group is located in a binding area, each flexible circuit board is connected with a first binding terminal group, and the protection structure corresponding to the first binding terminal group is connected to the side away from the first main surface.

[0016] The second aspect of the present application provides a display device, comprising the display panel as described above.

[0017] The display device has the same beneficial effects as the display panel provided by the first aspect of the present application, which will not be repeated here.

[0018] The third aspect of the present application provides a method for manufacturing a display panel, comprising: providing a back plate. The back plate comprises: opposite first and second main surfaces, and the first main surface comprises a binding area. A first binding terminal group is formed on the first main surface, the first binding terminal group comprises a plurality of first binding terminals, and at least a part of the first binding terminal group is located in the binding area. A protection structure is formed, which is formed on the first main surface of the back plate or on the side surface of the flexible circuit board that is attached to the first binding terminal group. A flexible circuit board is bound, which is connected with the first binding terminal group and connected with the protection structure corresponding to the first binding terminal group, and the protection structure is arranged around the edge of the binding area where the first binding terminal group is located.

[0019] The method for manufacturing the display panel has the same beneficial effects as the display panel provided by the first aspect of the present application, which will not be repeated here.

[0020] In some embodiments, the protection structure is formed by: forming the protection structure on the first main surface, and the protection structure is arranged around the edge of the binding area. Further, the flexible circuit board is bound by: attaching a conductive film to the side of the first binding terminal group away from the back plate, the conductive film covers at least a part of the first binding terminal group, and the conductive film is located in the enclosed area of the protection structure. The flexible circuit board is attached to the side of the conductive film away from the back plate, and the flexible circuit board is attached to the protection structure.

[0021] In some embodiments, the side surface of the flexible circuit board that is attached to the first set of bonding terminals has a protection structure region, and the protection structure region corresponds to the bonding region after the flexible circuit board is bonded. Further, the protection structure is formed by forming a protection structure on the side surface of the flexible circuit board that is attached to the first set of bonding terminals, and the protection structure surrounds the edge of the protection structure region. Further, the flexible circuit board is bonded by attaching a conductive film to the side of the first set of bonding terminals that is away from the back plate, the conductive film covers at least a portion of the first set of bonding terminals, and the conductive film is located in the bonding region. The flexible circuit board is attached to the side of the conductive film that is away from the back plate, and the protection structure is attached to the edge of the bonding region.

[0022] In some embodiments, attaching the conductive film to the side of the flexible circuit board that is away from the back plate includes connecting the flexible circuit board and the conductive film by a pre-pressing process. The conductive film and the protection structure are cured by a high-temperature process.

[0023] In some embodiments, the back plate further includes a plurality of side surfaces connecting the first main surface and the second main surface, and at least one of the side surfaces is a selected side surface. The first set of bonding terminals is disposed at a side edge close to the selected side surface. At least one end of the first set of bonding terminals that is away from the selected side surface is located in the bonding region. Further, the manufacturing method further includes, before the protection structure is formed, forming a set of connecting leads on the selected side surface and the first main surface of the back plate, each connecting lead being connected to one of the first bonding terminals. A protection layer is formed on the side of the set of connecting leads that is away from the back plate, and the protection layer covers the set of connecting leads and a portion of the plurality of first bonding terminals that is close to the selected side surface. Further, in the step of bonding the flexible circuit board, the protection structure is connected to the portion of the protection layer that is located on the first main surface.

[0024] In some embodiments, forming the protection structure on the first main surface includes coating a material of the protection structure on the first main surface. The material of the protection structure is cured by ultraviolet light and high temperature to obtain the annular structure. The time for ultraviolet curing is less than 5 minutes, and the temperature range for high-temperature curing is 85°C to 250°C, and the time for high-temperature curing is 30 minutes to 60 minutes.

[0025] In some embodiments, forming the protection structure on the first main surface includes coating a material of the protection structure on the first main surface. The material of the protection structure is cured by high temperature to obtain the annular structure. The temperature range for high-temperature curing is 85°C to 250°C, and the time for high-temperature curing is 30 minutes to 60 minutes. BRIEF DESCRIPTION OF DRAWINGS

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] FIG. 1A A structural diagram of the first main surface of a display panel provided in some embodiments of the present invention;

[0028] FIG. 1B A cross-sectional structural diagram of a display panel provided for some embodiments of the present invention;

[0029] FIG. 1C Another cross-sectional view of the display panel provided for some embodiments of the present invention;

[0030] FIG. 1D A positional relationship diagram of the first binding terminal group and the binding area provided for some embodiments of the present invention;

[0031] FIG. 1E Another positional relationship diagram between the first binding terminal group and the binding area provided for some embodiments of the present invention;

[0032] FIG. 2A A structural diagram of the first main surface of a display panel provided in other embodiments of the present invention;

[0033] FIG. 2B A cross-sectional structural diagram of a display panel provided for other embodiments of the present invention;

[0034] FIG. 2C A structural diagram of the second main surface of a display panel provided in other embodiments of the present invention;

[0035] FIG. 3A A structural diagram of the first main surface of a display panel provided in other embodiments of the present invention;

[0036] FIG. 3B A cross-sectional structural diagram of a display panel provided for other embodiments of the present invention;

[0037] FIG. 4 A structural diagram of the first main surface of a display panel provided in other embodiments of the present invention;

[0038] FIG. 5A A flowchart illustrating a method for manufacturing a display panel according to some embodiments of the present invention;

[0039] FIG. 5BA flowchart illustrating a method for manufacturing a display panel according to other embodiments of the present invention;

[0040] FIG. 5C A flowchart for forming a protective structure;

[0041] FIG. 6 for FIG. 5B A cross-sectional view of the display panel corresponding to steps S1-4 in the middle section;

[0042] FIG. 7A for FIG. 5B A structural diagram of the second main surface of the display panel corresponding to steps S1-5;

[0043] FIG. 7B for FIG. 5B A cross-sectional view of the display panel corresponding to steps S1-5 in the middle section;

[0044] FIG. 8A for FIG. 5B A structural diagram of the second main surface of the display panel corresponding to step S3;

[0045] FIG. 8B for FIG. 5B A cross-sectional view of the display panel corresponding to step S3;

[0046] FIG. 9A This is a structural diagram of the first main surface of the display panel corresponding to step S4-1a;

[0047] FIG. 9B This is a cross-sectional view of the display panel corresponding to step S4-1a;

[0048] FIG. 10 for FIG. 5A A cross-sectional view of the display panel corresponding to step S4;

[0049] FIG. 11 for FIG. 2B Enlarged structural diagram at point G;

[0050] FIG. 12 A flowchart illustrating a method for manufacturing a display panel according to some embodiments of the present invention;

[0051] FIG. 13A for FIG. 12 The structural diagram of the flexible circuit board corresponding to step S3-1b;

[0052] FIG. 13B for FIG. 12 A cross-sectional view of the flexible circuit board corresponding to step S3-1b.

[0053] FIG. 14A This is a structural diagram of the first main surface of the display panel corresponding to step S4-1b;

[0054] FIG. 14B A cross-sectional structure diagram of the display panel corresponding to step S4-1b. DETAILED DESCRIPTION

[0055] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art fall within the scope of protection of the present disclosure.

[0056] Unless otherwise required by context, the term "comprises" in the specification and claims is to be construed as open, inclusive, meaning "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to mean that the specific feature, structure, material or characteristic being described in connection with this embodiment or example includes in at least one embodiment or example of the present disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any appropriate way in any one or more embodiments or examples.

[0057] Hereinafter, the terms "first", "second" are only used for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0058] The use of "adapted for" or "configured for" herein means open and inclusive language that does not exclude devices adapted for or configured for performing additional tasks or steps.

[0059] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or there can be an intermediate layer between the layer or element and the other layer or substrate.

[0060] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0061] Currently, improving the pixel density and PPI (Pixels Per Inch) resolution of display devices is one of the research hotspots in related technical fields. Inorganic light-emitting diodes with a size of about 50μm-500μm after miniaturization can be used as pixels to directly realize display functions due to their small particle size, and have a wide range of application prospects.

[0062] In some embodiments, the display device includes a display panel, which includes a backplate, multiple bonding terminals, multiple connecting leads, an FPC (Flexible Printed Circuit), and multiple light-emitting devices, wherein the light-emitting devices are miniaturized inorganic light-emitting diodes. Multiple connecting leads are disposed on the sides of the backplate, and multiple light-emitting devices are disposed on the front of the backplate. The connecting leads on the sides connect the front and back circuits of the backplate, thereby enabling the FPC located on the back to transmit signals and voltages to the multiple light-emitting devices, controlling the light-emitting devices to emit light.

[0063] In some embodiments of the related technology, multiple bonding terminals are disposed on the front and back of the backplane. The bonding terminals on the front are used to connect the lines on the front of the backplane, and the bonding terminals on the back are used to connect the FPC. Connecting leads connect the bonding terminals on the front and the bonding terminals on the back. The FPC transmits signals to the light-emitting device through the bonding terminals on the back, the connecting leads and the bonding terminals on the front, thereby realizing signal transmission on the front and back of the backplane.

[0064] In some embodiments, the array layer is formed on the front surface of the back plate by an array process, the array layer including a plurality of signal lines and a plurality of binding terminals, the array layer being provided with a plurality of light emitting devices on a side away from the back plate, the plurality of signal lines being electrically connected to the light emitting devices. The side surface of the back plate is provided with a plurality of connecting leads, one end of the connecting leads being connected to the binding terminals on the front surface, the other end extending to the back surface of the back plate as binding terminals on the back surface, and being connected to the FPC, the FPC transmitting control signals to the plurality of light emitting devices through the connecting leads and the binding terminals on the front surface, so as to control the display image of the display panel.

[0065] In some examples, the binding terminals and the connecting leads are obtained by laser etching a metal layer, the etched surface of the metal layer being exposed, and if no protection is provided, the exposed surface is prone to be scratched and corroded. For example, the binding terminals on the back surface of the back plate, or the part of the connecting leads extending to the back surface of the back plate as the binding terminals, are connected to the FPC, the binding terminals are partially exposed, are not completely isolated from the outside, and no protection structure is provided, and the exposed part is prone to be scratched and corroded, which finally causes line defects and affects the normal operation of the display panel.

[0066] Some embodiments of the present application provide a display panel 10, as shown in FIGS. 1A-2C , the display panel 10 comprising a back plate 1, a first binding terminal group 2, and a flexible circuit board 4.

[0067] The back plate 1 comprises opposite first and second main surfaces 1a and 1b. Exemplarily, the first main surface 1a is the back surface of the back plate 1, corresponding to the non-display side of the display panel 10, and the second main surface 1b is the front surface of the back plate, corresponding to the display side of the display panel 10.

[0068] The first binding terminal group 2 comprises a plurality of first binding terminals 21 arranged on the first main surface 1a, the first main surface 1a comprising a binding area BN, and at least part of the first binding terminal group 2 being located in the binding area BN.

[0069] In some examples, as shown in FIG. 2B , FIG. 3B , the first binding terminal group 2 is configured to be electrically connected to the flexible circuit board 4.

[0070] In other examples, the first binding terminal group 2 is configured to be electrically connected to an integrated circuit chip 4' (IC).

[0071] As shown in FIG. 2A , FIG. 2BAs shown, the flexible circuit board 4 is disposed on one side of the first main surface 1a. The flexible circuit board 4 is connected to the first bonding terminal group 2. For example, the flexible circuit board 4 includes a plurality of conductive contacts, each of which is connected to a first bonding terminal 21.

[0072] For example, such as FIG. 1A , FIG. 2A , FIG. 2C As shown, the first main surface 1a and the second main surface 1b of the back plate 1 are, for example, rectangular in shape.

[0073] For example, the material of the back plate 1 is a rigid material such as glass, quartz, or plastic.

[0074] For example, such as FIG. 2B , FIG. 3B As shown, the thickness of the backplate 1 in the third direction Z is 0.3 mm to 1 mm. For example, the thickness of the backplate 1 in the third direction Z is 0.3 mm, 0.5 mm or 1 mm.

[0075] As a possible design, such as FIG. 2A , FIG. 3A As shown, the back panel 1 also includes a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b, at least one side surface 1c being a selected side surface 1cc. A bonding area BN is located on the side near the selected side surface 1cc, and a first bonding terminal group 2 is disposed on the side near the selected side surface 1cc. The first main surface 1a of the display panel 10 includes a central area BB and at least one bonding area BN surrounding the central area BB.

[0076] In some examples, such as FIG. 3A As shown, the first main surface 1a of the display panel 10 includes a central area BB and a bonding area BN located on one side of the central area BB. The bonding area BN is located on the side of the first main surface 1a near the selected side surface 1cc. Multiple first bonding terminals 21 in the first bonding terminal group 2 are arranged sequentially and spaced apart along the first direction X where the selected side surface 1cc connects to the first main surface 1a. FIG. 1A , FIG. 2A As shown, the first bonding terminal 21 extends along the second direction Y, which is perpendicular to the first direction, and the ends of the plurality of first bonding terminals 21 away from the selected side surface are flush.

[0077] It should be noted that the binding area BN is an area provided on the first main surface la of the back plate 1 for binding of the flexible circuit board 4, and within the binding area BN, the conductive pads 41 of the flexible circuit board 4 are electrically connected with the first binding terminals 21, and outside the binding area BN, no binding is performed. At least a part of the first binding terminal group 2 is located in the binding area BN, including: at least one end of the first binding terminal group 2 away from the selected side surface lccc is located in the binding area BN, and exemplary embodiments include the following cases. For the purpose of clearly showing the positional relationship between the first binding terminal group and the binding area, FIG. 1D and FIG. 1E A partial enlarged view of the upper left corner of the first main surface la of the back plate is shown, and only the back plate 1, the first binding terminal 21 and the connecting lead 51 are retained.

[0078] In some embodiments, as shown in FIG. 1D , the plurality of first binding terminals 21 are all located in the binding area BN in the second direction Y perpendicular to the side edge of the first main surface la approached by the plurality of first binding terminals 21.

[0079] In other embodiments, as shown in FIG. 1E , the plurality of first binding terminals 21 are partially located in the binding area BN in the second direction Y perpendicular to the side edge of the first main surface la approached by the plurality of first binding terminals 21. Specifically, one end of the plurality of first binding terminals 21 in the second direction Y, which is close to the side edge of the first main surface la approached by the binding area BN, is located outside the binding area BN, and extends to the selected side surface lccc.

[0080] As shown in FIGS. 1A-1C , the flexible circuit board 4 is electrically connected with the plurality of first binding terminals 21 in the first binding terminal group 2, and the surface of the plurality of first binding terminals 21 away from the back plate 1 is covered by the flexible circuit board 4, which can form protection, and the two opposite sides of the first binding terminal 21 in the direction perpendicular to the extension direction of the first binding terminal 21, and the end of the first binding terminal 21 away from the selected side surface lccc are exposed, and the exposed part of the metal in the first binding terminal 21 is easy to be corroded by water and oxygen, which affects the contact stability with the flexible circuit board 4 and affects the signal transmission.

[0081] In some embodiments, as shown in FIG. 2A and FIG. 2B , the display panel 10 further comprises a protection structure 3, and the protection structure 3 is provided on the first main surface la of the back plate 1 and surrounds the edge of the binding area BN.

[0082] At least a part of the first binding terminal group 2 is located in the binding area BN, that is, the protection structure 3 surrounds at least a part of the first binding terminal group 2. The flexible circuit board 4 is connected with the side of the protection structure 3 corresponding to the first binding terminal group 2 away from the first main surface la.

[0083] In some examples, the protection structure 3 is arranged around the edge of the binding area BN, which means that the protection structure 3 is a closed structure, for example, the protection structure 3 is in a frame shape, the protection structure 3 is, for example, a closed ring, a quadrilateral or a polygon, the binding area BN has a boundary line, the protection structure 3 has a certain width, the protection structure 3 can be arranged along the boundary line of the binding area BN, cover the boundary line of the binding area BN, or the protection structure 3 is arranged outside the boundary line of the binding area BN, or the protection structure 3 is arranged inside the boundary line of the binding area BN. The above describes an exemplary structure of the protection structure 3, as long as the protection structure 3 is adjacent to the boundary line of the binding area BN and is a closed structure.

[0084] In some examples, as shown in FIG. 2, the protection structure 3 is in contact with one end of the plurality of first binding terminals 21 away from the selected side surface 1cc, or the protection structure 3 is not in contact with one end of the plurality of first binding terminals 21 away from the selected side surface 1cc, and there is a certain distance between the two. FIG. 2B

[0085] The flexible circuit board 4 is connected to the side of the protection structure 3 corresponding to the first binding terminal group 2 away from the first main surface 1a, so that the flexible circuit board 4, the protection structure 3 and the first main surface 1a of the back plate 1 form a closed space, and the components in the closed space, such as at least part of the first binding terminal group 2, are enclosed.

[0086] As a possible design, as shown in FIG. 2 and FIG. 3, FIG. 2A FIG. 2B The protection structure 3 is in a frame shape, and the protection structure 3 includes a first structure 31 away from the selected side surface 1cc and a second structure 32 close to the selected side surface 1cc, wherein part of the second structure 32 is located on the side of the first binding terminal group 2 (or the connecting lead group 5) away from the back plate 1 and between the first binding terminal group 2 and the flexible circuit board 4, and the first structure 31 is located on the first main surface 1a and between the flexible circuit board 4 and the back plate 1.

[0087] In some embodiments, the thickness d3 of the part of the second structure 32 between the flexible circuit board 4 and the first binding terminal group 2 in the third direction Z is less than the thickness d4 of the first structure 31 in the third direction Z, and the distance d5 between the side surface of the part of the second structure 32 between the flexible circuit board 4 and the first binding terminal group 2 away from the first main surface 1a and the first main surface 1a in the third direction Z is the same as or approximately the same as the thickness d4 of the first structure 31 in the third direction Z, that is, the sum of the thickness d3 of the part of the second structure 32 between the flexible circuit board 4 and the first binding terminal group 2 and the thickness d6 of the first binding terminal is the same as or approximately the same as the thickness d4 of the first structure 31 in the third direction Z, so that the flatness of the flexible circuit board 4 can be ensured.​​

[0088] The display panel 10 provided by some embodiments of the present application, by setting the protection structure 3 around the edge of the binding area BN of the first main surface 1a of the display panel 10, the part of the first binding terminal group 2 located in the binding area BN is surrounded, and the side of the protection structure 3 away from the first main surface 1a of the display panel 10 is provided with a flexible circuit board 4, thereby fully surrounding the part of the first binding terminal group 2 located in the binding area BN, forming a closed structure, which can effectively isolate the part of the first binding terminal group 2 located in the binding area BN from the outside, for example, from physical damage caused by bumping with other components, or from rust caused by long-term exposure to humid air, etc. It can be understood that by setting the protection structure 3, the first binding terminal group 2 obtains better anti-bumping and anti-oxygen effects, avoiding bumping damage or corrosion of the first binding terminal group 2 to affect its connection performance, thereby making the circuit connection of the display panel 10 more reliable, and further ensuring that the display panel 10 can work normally for a long time in various use environments (for example, in a humid environment) and ensuring the picture display quality of the display panel 10.

[0089] In some embodiments, as shown in FIGS. 1A-2C The display panel 10 further comprises a connection lead group 5 and a protection layer 6, the connection lead group 5 comprises a plurality of connection leads 51, as shown in FIG. 1C The connection lead group 5 is arranged on the selected side surface 1cc and the first main surface 1a, and each connection lead 51 is connected with a first binding terminal 21. FIG. 1B The connection lead group 5 is arranged on the selected side surface 1cc and the first main surface 1a, and extends to the binding area BN, and each connection lead 51 located in the binding area BN is the first binding terminal 21.

[0090] The first binding terminal 21 mentioned in the present disclosure refers to a metal electrode arranged separately on the first main surface 1a of the back plate 1, as shown in FIG. 1C Or, as shown in FIG. 1B The first binding terminal 21 is the part of the connection lead 51 located in the binding area BN.

[0091] In some embodiments, the connection lead 51 comprises a first metal layer, a second metal layer and a third metal layer arranged in layers, forming a sandwich structure, wherein the first metal layer and the third metal layer have stronger corrosion resistance than the second metal layer, for example, the first metal layer and the third metal layer are titanium, and the second metal layer is copper.

[0092] The protection layer 6 covers the connection lead group 5 and a part of the first binding terminal group 2 close to the selected side surface 1cc. The protection structure 3 is connected with the part of the first binding terminal group 2 covered by the protection layer 6.

[0093] Exemplarily, the protection structure 3 is in a frame shape, for example, a closed ring shape, a quadrilateral shape or a polygonal shape, and a width of one side of the protection structure 3 close to the protection layer 6 is larger to be in contact with the protection layer 6.

[0094] Exemplarily, the material of the protection layer 6 is an insulating material. For example, the material of the protection layer 6 is ink.

[0095] By arranging the protection layer 6, the connection lead group 5 and the part of the first binding terminal group 2 close to the selected side surface 1cc are protected, and since the protection structure 3 is in contact with the part of the protection layer 6 covering the first binding terminal group 2, the part of the first binding terminal group 2 outside the binding area BN is also protected and isolated from the outside, avoiding physical damage caused by collision with other components or rust caused by long-term exposure to humid air. In combination with the protection structure 3, the first binding terminal group 2 is completely surrounded in the closed space formed by the back plate 1, the protection structure 2, the protection layer 6 and the flexible circuit board 4, so that not only the binding area BN is sealed, but also the part of the first binding terminal group 2 outside the binding area BN is covered by the part of the protection structure 3 in contact with the protection layer 6, so that the first binding terminal group 2 obtains better anti-collision and anti-oxygen effects, avoiding the collision damage or corrosion of the first binding terminal group 2 to affect its effect, so that the circuit connection of the display panel 10 is more reliable, and the display panel 10 can work normally for a long time in various use environments (for example, high humidity environment) and ensure the picture display quality of the display panel 10.

[0096] Exemplarily, each of the plurality of connection leads includes a first portion on the first major surface la and a second portion on the selected side surface 1cc. Each connection lead extends from the selected side surface 1cc to the first major surface la and is electrically connected to one of the first binding terminals 21 of the first binding terminal group 2.

[0097] Exemplarily, the number of the plurality of connection leads is equal to the number of the plurality of first binding terminals 21. Each connection lead extends from the selected side surface 1cc to the first major surface la and is electrically connected to one of the first binding terminals 21, so as to electrically connect the first binding terminals 21 from the first major surface la to the opposite second major surface lb of the back plate 1.

[0098] In some embodiments, as shown in FIG. 2A , FIG. 13A , FIG. 13B Exemplarily, the flexible circuit board 4 includes a plurality of conductive pads 41 connected to the first binding terminal group 2, and the peripheral area of the plurality of conductive pads 41 is in contact with the protection structure 3.

[0099] Exemplarily, as shown in FIG. 2AAs shown, each conductive contact patch 41 is electrically connected with a first binding terminal 21, the size of the conductive contact patch 41 in the first direction X is smaller than the size of the first binding terminal 21 in the first direction X, and / or the size of the conductive contact patch 41 in the second direction Y is smaller than the size of the first binding terminal 21 in the second direction Y. In the connected conductive contact patch 41 and first binding terminal 21, the orthographic projection of the conductive contact patch 41 on the first binding terminal 21 is located within the contour line of the first binding terminal 21.

[0100] The plurality of conductive contact patches 41 are connected with the first binding terminal group 2, and one conductive contact patch 41 corresponds to one first binding terminal 21 to realize signal transmission. The peripheral area of the plurality of conductive contact patches 41 is connected with the protection structure 3, which can be understood as surrounding the plurality of conductive contact patches 41, and the protection structure 3 forms a closed structure with the flexible circuit board 4 and the back plate 1, and the plurality of conductive contact patches 41 are enclosed in the closed structure, thereby realizing the protection effect of the plurality of conductive contact patches 41, and the protection structure 3 is arranged at the periphery of the plurality of conductive contact patches 41, without affecting the contact surface of the conductive contact patch 41 and the first binding terminal 21, thereby ensuring the connection performance of the conductive contact patch 41 and the first binding terminal 21. The closed structure formed between the protection structure 3, the flexible circuit board 4 and the back plate 1 has the same effect on the plurality of conductive contact patches 41 as the effect on the part of the first binding terminal group 2 located in the binding area BN, which will not be described here.

[0101] In some embodiments, as shown in FIG. 2B , FIG. 3B The protection structure 3 is a thermosetting adhesive.

[0102] The thermosetting adhesive can be cured by heating. The thermosetting adhesive is used as the material of the protection structure 3, and is arranged around the edge of the binding area. When the flexible circuit board 4 is bound, it can be understood that the thermosetting adhesive will overflow a certain distance outward under the action of pressure as the distance between the flexible circuit board 4 and the back plate 1 shortens, and the single-side width of the thermosetting adhesive after binding will increase compared to the shape of the thermosetting adhesive before binding. For example, as shown in FIG. 3A The single-side width d2 of the part of the thermosetting adhesive extending in the first direction X increases by no more than 100 μm, the single-side width d1 of the part of the thermosetting adhesive extending in the second direction Y increases by no more than 100 μm, and the thickness of the thermosetting adhesive in the third direction Z decreases accordingly. Compared to the hard material, the thermosetting adhesive does not increase the thickness of the display panel 10 in the third direction Z, and the thermosetting adhesive plays a protection effect on the first binding terminal 2 in the binding area while also playing an auxiliary effect on the binding connection between the flexible circuit board 4 and the back plate 1. Moreover, the thermosetting adhesive overflow can also be connected with the protection layer 6 to protect the part of the first binding terminal group 2 located outside the binding area BN.

[0103] Exemplarily, the protective structure 3 is a UV glue or a ring system glue.

[0104] In some embodiments, the viscosity of the thermosetting glue ranges from 100 cp to 1000 cp.

[0105] As a possible design, the ring glue protective structure 3 has the characteristics of low water permeability (<50 g / m2*Day, water permeability of no more than 50 grams per square meter per day), low dielectric constant (dielectric constant less than 4 under 1 MHz environment), and super flexibility.

[0106] Further, the protective structure 3 is a high-temperature-resistant material, for example, which will not be carbonized in the temperature range of 0-350°C.

[0107] In some embodiments, as shown in FIG. 2B , FIG. 3B The display panel 10 further includes a conductive film 7 located in the enclosed area of the protective structure 3, and the flexible circuit board 4 is connected to the first binding terminal group 2 through the conductive film 7.

[0108] Exemplarily, the conductive film 7 is arranged on the side of the first binding terminal group 2 away from the first main surface 1a, that is, the conductive film 7 overlaps and contacts the plurality of first binding terminals 21 in the first binding terminal group 2, and the conductive film 7, for example, is in the form of a strip and is arranged at the middle position of the first binding terminal group 2, as shown in FIG. 2B , FIG. 3B The conductive film 7 is located in the enclosed area of the protective structure 3, that is, the conductive film 7 is located in the binding area BN.

[0109] Exemplarily, the conductive film 7 is an ACF (Anisotropic Conductive Film). By using the ACF to connect the flexible circuit board 4 and the first binding terminal group 2, the conduction between the first binding terminal group 2 and the flexible circuit board 4 is ensured, and at the same time, the non-conduction between the plurality of first binding terminals 21 in the first binding terminal group 2 is isolated, thereby avoiding causing a short circuit.

[0110] As a possible design, as shown in FIG. 2C The second main surface 1b of the display panel 10 includes a display area AA and a peripheral area AN arranged on at least one side of the display area AA.

[0111] In some embodiments, as shown in FIG. 2B , FIG. 3BAs shown, the display panel 10 also includes a second bonding terminal group 2', which includes a plurality of second bonding terminals 21', disposed on the second main surface 1b of the back panel 1. The second bonding terminal group 2' corresponds to the first bonding terminal group 2 in the thickness direction (third direction Z) of the back panel 1. Connecting leads also extend to the second main surface 1b of the back panel 1, and each connecting lead is connected to one second bonding terminal 21'.

[0112] In some examples, the connection between each connecting lead and a second bonding terminal 21' is such that the orthographic projection of the portion of each connecting lead on the second main surface 1b onto the second main surface 1b at least partially overlaps with the orthographic projection of the second bonding terminal 21' to which the connecting lead is connected onto the second main surface 1b. In other words, the connecting lead covers a portion of its corresponding second bonding terminal 21', thereby achieving the connection. In this way, each connecting lead and its corresponding second bonding terminal 21' have a large contact area, so that the connecting lead and the second bonding terminal 21' can make sufficient contact, which is beneficial to signal transmission.

[0113] Or, such as FIG. 3B As shown, the portion of each connecting lead 51 extending onto the second main surface 1b contacts one end face of the corresponding second bonding terminal 21' near the selected side surface 1cc, thereby achieving electrical connection. There is no overlap between the connecting lead and the second bonding terminal 21'.

[0114] In some embodiments, such as FIG. 2B , FIG. 3B As shown, the display panel 10 also includes a plurality of light-emitting devices 911 and a protective film 92. The plurality of light-emitting devices 911 are disposed on one side of the second main surface 1b of the back panel 1. The protective film 92 is disposed on the side of the plurality of light-emitting devices 911 away from the second main surface 1b.

[0115] In some embodiments, such as FIG. 2C As shown, multiple light-emitting devices 911 are disposed within the display area AA of the display panel 10.

[0116] For example, the display panel 10 includes sub-pixels P of at least three colors, the sub-pixels of the multiple colors including at least a first color sub-pixel, a second color sub-pixel and a third color sub-pixel, the first color, the second color and the third color being three primary colors (e.g., red, green and blue).

[0117] For example, each sub-pixel P includes at least one light-emitting device 911.

[0118] In some examples, the protective film 92 includes a portion covering the plurality of light emitting devices 911 and a portion filling the gap region of the plurality of light emitting devices 2. Exemplarily, the material of the protective film 92 can be black silicone or black resin, etc. The protective film 92 can protect the plurality of light emitting devices 911 from being damaged in the process after the plurality of light emitting devices 911 are formed.

[0119] In some embodiments, as shown in FIG. 2B 、 FIG. 3B The display panel 10 further includes a driving circuit layer 8 disposed on the side of the second main surface 1b of the back plate 1, and the driving circuit layer 8 is located between the back plate 1 and the plurality of light emitting devices 911. The driving circuit layer 8 includes, for example, a plurality of signal lines and the like, and the plurality of signal lines are electrically connected with the plurality of light emitting devices 911 and the second binding terminals 21', configured to receive the electrical signals transmitted by the second binding terminals 21', and drive the plurality of light emitting devices 911 to emit light.

[0120] Exemplarily, the light emitting device includes but is not limited to OLED (Organic Light-Emitting Diode), Mini LED (Mini Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), etc.

[0121] The plurality of second binding terminals 21' are close to the selected side surface 1cc relative to the plurality of light emitting devices 911, and the plurality of second binding terminals 21' are electrically connected with the plurality of light emitting devices 911. Exemplarily, the plurality of light emitting devices 911 are arranged in the display area AA of the second main surface 1b of the display panel 10, and the plurality of second binding terminals 21' are arranged in the peripheral area AN of the second main surface 1b of the display panel 10. The plurality of second binding terminals 21' are electrically connected with the plurality of light emitting devices 911 through the driving circuit layer 8.

[0122] For example, as shown in FIG. 2B and FIG. 3B The plurality of second binding terminals 21' are arranged on the second main surface 1b close to the selected side surface 1cc, that is, the plurality of second binding terminals 21' are closer to the side edge of the four side edges of the second main surface 1b connected with the selected side surface 1cc than the plurality of light emitting devices 911.

[0123] The first binding terminal group 2 is arranged on the first main surface la of the back plate 1 and is configured to be electrically connected with the flexible circuit board 4, i.e., the first binding terminal group 2 is used to bind the flexible circuit board 4. The second binding terminal group 2' is arranged on the second main surface lb of the back plate 1 and is configured to be electrically connected with the plurality of signal lines on the second main surface lb. In some examples, the flexible circuit board 4 is further configured to be electrically connected with the integrated circuit chip 4', which is used to send control signals to control the display panel 10 to display images.

[0124] In some examples, the first main surface la of the back plate 1 has a binding area BN, and at least part of the first binding terminal group 2 is located in the binding area BN, and the first binding terminal group 2 is bound with the flexible circuit board 4 in the binding area. In other examples, as shown in FIG. 2B 、 FIG. 3B The second binding terminal group 2' is electrically connected to the binding area BN of the first main surface la of the display panel 10 through the connection lead group 5 and is bound with the flexible circuit board 4 through the connection lead group 5. Thus, the flexible circuit board 4 can be arranged on the side surface of the display panel 10 opposite to the display surface and is electrically connected to the display surface of the display panel 10 through the second binding terminal group 2', the connection lead group 5 and the first binding terminal group 2, thereby controlling the light emitting device layer 9 to emit light and realizing image display on the display surface of the display panel 10.

[0125] The plurality of second binding terminals 21' corresponds to the number of the plurality of connection leads. One end of each connection lead is electrically connected with one second binding terminal 21', and the other end is electrically connected with one first binding terminal 21. Through the plurality of connection leads in the connection lead group 5, the plurality of first binding terminals 21 in the first binding terminal group 2 and the plurality of second binding terminals 21' in the second binding terminal group 2' can be connected one by one to realize signal transmission.

[0126] In some embodiments, as shown in FIG. 4 The number of the first binding terminal group 2 is a plurality, the number of the protection structure 3 corresponds to the number of the first binding terminal group 2, and the number of the flexible circuit board 4 corresponds to the number of the first binding terminal group 2. Further, the number of the connection lead group 5 corresponds to the number of the first binding terminal group 2, and the relative positions of one first binding terminal group 2, one protection structure 3, one flexible circuit board 4, one connection lead group 5 and one second binding terminal group are in a corresponding relationship.

[0127] For example, as shown in FIG. 3A and FIG. 3BAs shown, the back panel 1 of the display panel 10 includes a selected side surface 1cc, the first main surface 1a has a bonding area BN, the display panel 10 includes a first bonding terminal group 2, a protective structure 3 and a flexible circuit board 4, a plurality of first bonding terminals 21 are disposed on the first main surface 1a of the back panel 1, at least a portion of the first bonding terminal group 2 is located in the bonding area BN, the protective structure 3 is located at the edge of the bonding area BN, and the flexible circuit board 4 is connected to the side of the protective structure 3 away from the first main surface 1a.

[0128] Or, such as FIG. 2A and FIG. 2B As shown, the back panel 1 of the display panel 10 includes two selected side surfaces 1cc, which are arranged opposite to each other. The first main surface 1a of the back panel 1 includes two bonding areas BBN, which are close to the two selected side surfaces 1cc respectively. The display panel 10 includes two first bonding terminal groups 2, two protective structures 3 and two flexible circuit boards 4. At least a portion of each first bonding terminal group 2 is located within the bonding area BN. Each protective structure 3 is located at the edge of a bonding area BN. Each flexible circuit board 4 is connected to a first bonding terminal group 2 and is connected to the side of the protective structure 3 corresponding to the first bonding terminal group 2 away from the first main surface 1a.

[0129] For example, such as FIG. 4 As shown, the back panel 1 of the display panel 10 includes two selected side surfaces 1cc, which are arranged opposite to each other. The first main surface 1a of the back panel 1 includes multiple bonding areas BN, which are respectively close to the two selected side surfaces 1cc. The display panel 10 includes multiple first bonding terminal groups 2, multiple protective structures 3, and multiple flexible circuit boards 4. At least two first bonding terminal groups 2 are disposed on the side near the same selected side surface 1cc, and at least two first bonding terminal groups 2 are arranged side by side, that is, at least two bonding areas BN are arranged side by side. At least a portion of each first bonding terminal group 2 is located within a bonding area BN, each protective structure 3 is located at the edge of a bonding area BN, each flexible circuit board 4 is connected to a first bonding terminal group 2, and the protective structure 3 corresponding to the first bonding terminal group 2 is connected to the side away from the first main surface 1a.

[0130] The protective structure 3 provided in some embodiments of the present invention is applicable to display panels with various different structures. For example, when the display panel 10 includes multiple flexible circuit boards 4, such as... FIG. 4 As shown, the display panel 10 includes four flexible circuit boards 4. Correspondingly, the display panel 10 also includes: four conductive films 7, four protective structures 3, four first bonding terminal groups 2, four connecting lead groups 5, and a driving circuit layer 8 located on the second main surface 1b. The conductive films 7, protective structures 3, first bonding terminal groups 2, and connecting lead groups 5 correspond one-to-one.

[0131] Specifically, two first binding terminal groups 2 can be arranged side by side along the first direction X at the side edge position of the first major surface 1a close to the selected side surface 1cc, at least a part of each first binding terminal group 2 is located in a binding area BN, and the two first binding terminal groups 2 are spaced apart along the first direction X for arranging the protection structure 3. One end of each group of first binding terminal groups 2 close to the selected side surface 1cc is connected to the part of the group of connection lead groups 5 extending to the first major surface 1a, and the first binding terminal group 2 on the side of the first major surface 1a is led to the side of the second major surface 1b through the group of connection lead groups 5 and is electrically connected to the driving circuit layer 8. Each protection structure 3 is arranged around a group of first binding terminal groups 2. Each protection structure 3 has a conductive film 7 arranged in the enclosed area. Each flexible circuit board 4 is connected to a group of first binding terminal groups 2 through a conductive film 7, and the corresponding protection structure 3 of the first binding terminal group 2 connected to the flexible circuit board 4 is away from the side of the first major surface 1a. The back plate 1 forms a plurality of closed structures with the plurality of protection structures 3 and the plurality of flexible circuit boards 4, respectively, to achieve the protection effect of the first binding terminal group 2 in the enclosed area of each protection structure 3. The closed structure formed by the back plate 1, the protection structure 3 and the flexible circuit board 4 has the same effect as the aforementioned closed structure on the part of the first binding terminal group 2 located in the binding area BN, and will not be described here.

[0132] Some embodiments of the present application also provide a display device 100, as shown in FIG. 2A 、 FIG. 2B 、 FIG. 3A 、 FIG. 3B 、 FIG. 4 The display device 100 includes a display panel 10.

[0133] In some embodiments, the display device 100 further includes an integrated circuit chip 4'.

[0134] Exemplarily, the integrated circuit chip 4' is configured to realize electrical connection with the flexible circuit board 4, a control signal is sent out through the integrated circuit chip 4', a driving signal is transmitted to the connecting lead group 5 through the flexible circuit board 4, and the driving signal is transmitted to the second binding terminal group 2' through the connecting lead group 5. The second binding terminal group 2' is configured to realize electrical connection with the driving circuit layer 8. The driving circuit layer 8, for example, includes a plurality of signal lines and the like, and is coupled with the plurality of light emitting devices 911 and configured to drive the plurality of light emitting devices 911 to emit light. The second binding terminal group 2' transmits the driving signal to the driving circuit layer 8, so as to control the plurality of light emitting devices 911 to emit light, so that the display device 100 displays a picture. It can be understood that the driving circuit layer 8 can also be connected with the pixel driving chip 912, so that the pixel driving chip 912 controls the luminance of the light emitting device 911. Specifically, three light emitting devices 911 can be driven and controlled by one pixel driving chip 912, which is not limited herein.

[0135] Some embodiments of the present application also provide a preparation method of the display panel 10, as shown in the following. FIG. 5A The preparation method includes steps S1-S4.

[0136] S1, providing the back plate 1.

[0137] As shown in the following, FIG. 6 The back plate 1 includes opposite first and second main surfaces 1a and 1b, and the first main surface 1a includes a binding area BN.

[0138] S2, forming the first binding terminal group 2 on the first main surface 1a.

[0139] As shown in the following, FIG. 1D , FIG. 1E The first binding terminal group 2 includes a plurality of first binding terminals 21, and at least a part of the first binding terminal group 2 is located in the binding area BN.

[0140] S3, as shown in the following, FIG. 8A , FIG. 8B forming the protection structure 3. The protection structure is formed on the first main surface of the back plate, or the protection structure is formed on the side surface of the flexible circuit board which is attached to the first binding terminal group.

[0141] S4, as shown in the following, FIG. 2A , FIG. 10 binding the flexible circuit board 4.

[0142] The flexible circuit board 4 is connected with the first binding terminal group 2, and the protection structure 3 corresponding to the first binding terminal group 2 is connected. The protection structure 3 is arranged around the edge of the binding area BN where the first binding terminal group 2 is located.

[0143] Exemplarily, the protective structure 3 is a thermosetting glue.

[0144] In some examples, a dispensing device is used to apply the thermosetting glue on the backboard 1. Further, the viscosity of the thermosetting glue is, for example, 100-1000 cp.

[0145] The present application provides a method for manufacturing the display panel 10. The first binding terminal group 2 located in the binding area BN is enclosed in the closed structure formed by the backboard 1, the protective structure 3, and the flexible circuit board 4, so as to prevent the exposed part of the first binding terminal group 2 from being physically damaged by collision or corroded by water and oxygen in a humid environment, and thus affecting the function of the first binding terminal 2. The specific effects of the closed structure formed by the protective structure 3, the backboard 1, and the flexible circuit board 4 have been described above, and will not be repeated here.

[0146] In some embodiments, as shown in FIG. 5B after step S1 and before step S3, the method further comprises:

[0147] S1-1, as shown in FIG. 6 a driving circuit layer 8 is formed on the second main surface 1b side of the backboard 1.

[0148] Exemplarily, the driving circuit layer 8 includes, for example, a plurality of signal lines and other structures.

[0149] In some embodiments, the backboard 1 further includes a plurality of side surfaces 1c connecting the first main surface 1a and the second main surface 1b, and at least one side surface 1c is a selected side surface 1cc. The first binding terminal group 2 is arranged at the side edge close to the selected side surface 1cc. As shown in FIG. 1D , FIG. 1E at least one end of the first binding terminal group 2 away from the selected side surface 1cc is located in the binding area BN.

[0150] after step S1 and before step S3, the method further comprises:

[0151] S1-2, as shown in FIG. 6 , FIG. 7A a second binding terminal group 21' is formed on the second main surface 1b side of the backboard 1.

[0152] The second binding terminal group 21' is arranged at the side edge close to the selected side surface 1cc of the second main surface 1b.

[0153] In some examples, the second binding terminal group 21' is located in the same film layer as the partial signal lines (e.g. the first signal lines) in the driving circuit layer 8, and the process of forming the second binding terminal group 21' in S1-2 and the process of forming the plurality of first signal lines in S1-1 can be formed in the same pass.

[0154] S1-3, as shown in FIG. 1C, the connection lead group 5 is formed on the selected side surface 1cc and the first main surface 1a of the back plate 1. FIG. 6

[0155] The connection lead group 5 includes a plurality of connection leads 51, each of which is connected with a first binding terminal 21.

[0156] S1-4, as shown in FIG. 1D, a protection layer 6 is formed on the side of the connection lead group 5 away from the back plate 1, and the protection layer 6 covers the connection lead group 5 and a portion of the plurality of first binding terminals 21 close to the selected side surface 1cc. FIG. 6

[0157] In some examples, the first main surface 1a of the display panel 10 includes a middle area BB and at least one binding area BN surrounding the middle area BB.

[0158] Exemplarily, as shown in FIG. 1E, the first main surface 1a of the display panel 10 includes a middle area BB and one binding area BN located on one side of the middle area BB. FIG. 3A Exemplarily, as shown in FIG. 1F, the first main surface 1a of the display panel 10 includes a middle area BB and two binding areas BN located on opposite sides of the middle area BB.

[0159] FIG. 2A Exemplarily, in step S2 and step S1-3, the first binding terminal group 2 and the connection lead group 5 can be manufactured in the same pass manufacturing process, so that the connection leads 51 in the connection lead group 5 extend to the binding areas BN of the first main surface 1a of the back plate 1, and the portions of the connection leads 51 located in the binding areas BN are taken as the first binding terminals 21.

[0160] Exemplarily, in step S2 and step S1-3, the first binding terminal group 2 and the connection lead group 5 can be manufactured in the same pass manufacturing process, so that the connection leads 51 in the connection lead group 5 extend to the binding areas BN of the first main surface 1a of the back plate 1, and the portions of the connection leads 51 located in the binding areas BN are taken as the first binding terminals 21.

[0161] ​​​As a possible implementation, the metal layer is made on the selected side surface 1cc of the back plate 1 and the side edge of the first main surface 1a close to the selected side surface 1cc by a sputtering process, and then a plurality of connection leads 51 on the first main surface 1a and on the selected side surface 1cc are made on the metal layer by, for example, a laser etching process. The plurality of connection leads 51 extend to the first main surface 1a, and each connection lead 51 extends to the part of the binding area BN as a first binding terminal 21. Further, there is a certain interval between the two adjacent first binding terminals 21, and there is a certain interval between the two adjacent connection leads 51; that is, the two adjacent first binding terminals 21 do not contact each other, and the two adjacent connection leads 51 do not contact each other.

[0162] In some embodiments, the metal layer formed by the sputtering process is, for example, a copper layer. Using copper as the material of the metal layer makes it have good conductivity while having lower manufacturing cost.

[0163] As a possible design, the metal layer is a multi-layer structure. For example, the metal layer formed by the sputtering process is, for example, a titanium layer, a copper layer, and a titanium layer formed by sputtering from the back plate 1 in turn from near to far. Further, by forming a titanium layer on the side of the copper layer close to the back plate 1 and the side of the copper layer away from the back plate 1, the copper layer is covered therein. Since the metal titanium has corrosion resistance, it can effectively prevent the copper layer from being oxidized, play a protective effect on the copper layer, and effectively avoid the connection lines made on the metal layer from being corroded, affecting the normal function of the lines.

[0164] For example, as shown in FIG. 10 Step S4, the protection structure 3 is connected to the part of the protection layer 6 on the first main surface 1a in the flexible circuit board 4.

[0165] The closed structure formed by the protection structure 3, the back plate 1, and the flexible circuit board 4 isolates the part of the first binding terminal group 2 in the binding area BN from the outside. By setting the protection layer 6, the part of the first binding terminal group 2 outside the binding area BN is surrounded in the closed structure formed by the back plate 1 and the protection layer 6. The protection structure 3 is connected to the part of the protection layer 6 on the first main surface 1a, so that the first binding terminal group 2 is entirely in the aforementioned closed structure, which has the same effect as the aforementioned effect, which will not be repeated here.

[0166] In some embodiments, after S1-4, the preparation method of the display panel further includes:

[0167] S1-5, as shown in FIG. 7A , FIG. 7BAs shown, a plurality of light emitting devices 911 are formed on the side of the driving circuit layer 8 away from the back plate 1.

[0168] Exemplarily, as FIG. 7B shown, a plurality of light emitting devices 911 are transferred to the side of the driving circuit layer 8 away from the back plate 1 by using a die bonding process, the driving circuit layer 8 is coupled with the plurality of light emitting devices 911 and is configured to drive the plurality of light emitting devices 911 to emit light.

[0169] In some examples, the second main surface 1b of the display panel 10 includes a display area AA and at least one peripheral area AN located around the display area AA. The plurality of light emitting devices 911 are located within the display area AA. Exemplarily, the plurality of light emitting devices 911 include sub-pixels P of at least three colors, the plurality of sub-pixels including at least first color sub-pixels, second color sub-pixels and third color sub-pixels, the first color, the second color and the third color being three primary colors (e.g. red, green and blue). Exemplarily, each sub-pixel includes at least one light emitting device 911.

[0170] In some embodiments, as FIG. 5C shown, the step S3 of forming the protection structure 3 includes: S3-1a, forming the protection structure 3 on the first main surface 1a. As FIG. 8A , FIG. 8B shown, the protection structure 3 is arranged around the edges of the binding area BN. The step S4 of binding the flexible circuit board 4 includes:

[0171] S4-1a, as FIG. 9A , FIG. 9B shown, a conductive film 7 is attached on the side of the first binding terminal group 2 away from the back plate 1, the conductive film 7 covers at least a part of the first binding terminal group 2, and the conductive film 7 is located within the enclosed area of the protection structure 3.

[0172] S4-2a, as FIG. 10 shown, the flexible circuit board 4 is attached on the side of the conductive film 7 away from the back plate 1, and the flexible circuit board is attached to the protection structure.

[0173] By arranging the protection structure 3 around the edges of the binding area BN on the first main surface 1a, and then attaching the flexible circuit board 4, the protection structure 3 can be used as a positioning mark. By aligning the edges of the protection structure 3 with the binding area BN of the back plate 1, the position of the area where the flexible circuit board 4 is bound with the first binding terminal 21 can be aligned with the position of the binding area BN of the back plate 1, and the relative position of the flexible circuit board 4 and the first binding terminal group 2 is ensured.

[0174] In some embodiments, the protective structure 3 adopts ultraviolet light curing glue. The protective structure 3 is, for example, tuffy glue (also known as peelable blue glue, peelable protective glue). Step S3-1a, forming the protective structure 3 on the first main surface 1a, includes:

[0175] S3-11a, as shown in FIG. 8A , FIG. 8B , coating the material of the protective structure 3 on the first main surface 1a.

[0176] In some examples, the material of the protective structure 3, i.e. the ultraviolet light curing glue, is coated at the edge of the binding area BN by a dispensing device, so as to be in a closed ring shape.

[0177] S3-12a, ultraviolet light curing and high-temperature curing are performed on the material of the protective structure 3, so as to obtain a ring structure.

[0178] The time of ultraviolet light curing is less than 5 mins, and the temperature range of high-temperature curing is 85℃-250℃, and the time of high-temperature curing is 30 mins-60 mins.

[0179] The protective structure 3 adopts ultraviolet light curing glue, has strong anti-yellowing and moisture resistance, fast curing, no solvent and no pollution, high bonding strength, good optical performance, colorless and transparent glue liquid, and a light transmittance of more than 90% after curing.

[0180] Specifically, the protective structure 3 adopts tuffy glue, and after curing the tuffy glue, insulation, moisture resistance and protection effects can be achieved. The curing time is short, and after curing, excellent moisture resistance can be achieved, and the film forming property is good. The elastic toughness of the cured glue layer is good. The adhesion to the glass substrate is good, and the protective structure 3 can be peeled off completely without any force, and the peeling is easy and complete, without leaving any residue, and without any influence on the bottom layer. That is, when peeling off the protective structure 3, compared with using a hard material as the protective structure, using the thermosetting glue can achieve the protection effect while achieving the protection effect, and when rework is needed, peeling off the protective structure 3 will not damage the plurality of first binding terminals 21 in the first binding terminal group 2.

[0181] In some embodiments, the protective structure 3 is, for example, epoxy system glue. Step S3-1a, forming the protective structure 3 on the first main surface 1a, includes:

[0182] S3-11a, as shown in FIG. 8A , FIG. 8B , coating the material of the protective structure 3 on the first main surface 1a.

[0183] In some examples, the material of the protective structure 3, i.e. the epoxy system glue, is coated at the edge of the binding area BN by a dispensing device, so as to be in a closed ring shape.

[0184] S3-12b, high-temperature curing is performed on the material of the protection structure 3 to obtain a ring-shaped structure.

[0185] The temperature range of the high-temperature curing is 85-250°C, and the time of the high-temperature curing is 30-60 minutes.

[0186] The protection structure 3 adopts an epoxy system adhesive, which has a lower price than other similar products and does not increase the manufacturing cost of the display panel 10. The cured epoxy system adhesive has the characteristics of water resistance, chemical corrosion resistance, strong adhesion, low shrinkage, high dielectric performance, surface leakage resistance, excellent insulation performance, better dimensional stability, and durability.

[0187] In some examples, as shown in FIG. 13A , FIG. 13B , the side surface of the flexible circuit board 4 that is attached to the first binding terminal group 2 has a protection structure area Q, and the protection structure area Q corresponds to the binding area BN after the flexible circuit board 4 is bound.

[0188] Step S3, forming a protection structure 3, as shown in FIG. 12 , includes: S3-1b, as shown in FIG. 13A , FIG. 13B , forming a protection structure 3 on the side surface of the flexible circuit board 4 that is attached to the first binding terminal group 2, and the protection structure 3 is arranged around the edge of the protection structure area Q.

[0189] Step S4, binding the flexible circuit board 4, including:

[0190] S4-1b, as shown in FIG. 14A , FIG. 14B , attaching a conductive film 7 to the side of the first binding terminal group 2 away from the back plate 1, the conductive film 7 covers at least a portion of the first binding terminal group 2, and the conductive film 7 is located in the binding area BN.

[0191] S4-2b, as shown in FIG. 10 , attaching the flexible circuit board 4 to the side of the conductive film 7 away from the back plate 1, and making the protection structure 3 attached to the edge of the binding area BN.

[0192] In some embodiments, in step S4-2a or S4-2b, attaching the flexible circuit board 4 to the side of the conductive film 7 away from the back plate 1 includes:

[0193] S4-2-1, connecting the flexible circuit board 4 and the conductive film 7 through a pre-pressing process.

[0194] S4-2-2, curing the conductive film 7 and the protection structure 3 through a high-temperature curing process.

[0195] Exemplarily, the temperature range of the step S4-2-2 is, for example, 160-190°C.

[0196] In some examples, the protective structure 3 is, for example, a thermosetting adhesive. Further, in the step of pasting the flexible circuit board 4 to the side of the conductive film 7 away from the back plate 1, the thermosetting adhesive between the back plate 1 and the flexible circuit board 4 gradually shortens the distance between the flexible circuit board 4 and the back plate 1. When the thermosetting adhesive is heated and cured under pressure, the protective structure 3 slightly overflows to the periphery, as shown in FIG. 3A , the range of the increase of the single-side width d1 and d2 of the protective structure 3 is less than or equal to 100 um. In this way, the protective structure 3 can be tightly pasted to the back plate and the flexible circuit board 4 after pressing, and the sealing performance is enhanced. Moreover, after the protective structure 3 overflows after pressing, the protective structure 3 can be ensured to be in contact with the protective layer 6.

[0197] The preparation method provided by some embodiments of the present application comprises the following steps: pasting the conductive film 7 to the binding area BN, and then connecting the flexible circuit board 4 and the conductive film 7 together through a pre-pressing process. Then, the protective structure 3 is formally cured through a pressing process at a high temperature. In this way, the protective structure 3 slightly overflows to the periphery after being heated. The first binding terminal group 2 in the binding area BN is in a closed structure formed by the back plate 1, the protective structure 3 and the flexible circuit board 4, which can effectively isolate the first binding terminal group 2 in the binding area BN from the outside, and obtain better anti-collision and anti-oxygen effects. The effect of the closed structure is the same as the above-mentioned closed structure, and will not be described here.

[0198] In some embodiments, after the step S4, the method further comprises the following step S5: forming a protective film 92 on the side of the plurality of light emitting devices 911 away from the back plate 1.

[0199] Exemplarily, as shown in FIG. 2B , FIG. 11 , there is a certain interval between the adjacent light emitting devices 911, the protective film 92 fills the interval between the light emitting devices 911 and covers the plurality of light emitting devices 92, and the protective film 92 covers the plurality of second binding terminal groups and the part of the protective layer 6 on the second main surface.

[0200] In some embodiments, in the third direction Z, the end of the protective film 92 close to the selected side surface is flush with the surface of the protective layer 6 away from the selected side surface.

[0201] Exemplarily, a coating process is used to form a black adhesive material on the side of the plurality of light emitting devices 911 away from the back plate 1, and then the black adhesive material is pressed to form the protective film 92.

[0202] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A display panel, characterized in that, include: The backplate includes: a first main surface and a second main surface opposite to each other; A first bonding terminal group includes a plurality of first bonding terminals disposed on the first main surface; the first main surface includes a bonding area, and at least a portion of the first bonding terminal group is located in the bonding area; A protective structure is provided around the edge of the binding area; A flexible circuit board is disposed on one side of the first main surface. The flexible circuit board is connected to the first binding terminal group and is connected to the side of the protective structure corresponding to the first binding terminal group away from the first main surface. The backplate also includes a plurality of side surfaces connecting the first main surface and the second main surface, at least one of the side surfaces being a selected side surface; the first bonding terminal group is disposed on a side edge close to the selected side surface; at least one end of the first bonding terminal group away from the selected side surface is located within the bonding area; The display panel also includes: A connecting lead assembly includes multiple connecting leads, the connecting lead assembly being disposed on the selected side surface and the first main surface; each connecting lead is connected to a first bonding terminal; or, the connecting lead assembly is disposed on the selected side surface and the first main surface and extends to the bonding area, the portion of each connecting lead located in the bonding area serving as the first bonding terminal; A protective layer covers the connecting lead group and a portion of the first bonding terminal group near the selected side surface; The protective structure is connected to the portion of the protective layer that covers the first bonding terminal group; The first bonding terminal group is located within the enclosed space formed by the protective structure, the back plate, and the flexible circuit board.

2. The display panel according to claim 1, characterized in that, The flexible circuit board includes multiple conductive contacts, which are connected to the first bonding terminal group, and the peripheral areas of the multiple conductive contacts are connected to the protective structure.

3. The display panel according to claim 1 or 2, characterized in that, The protective structure is a thermosetting adhesive.

4. The display panel according to claim 3, characterized in that, The viscosity range of the thermosetting adhesive is 100cp to 1000cp.

5. The display panel according to claim 1, characterized in that, Also includes: A conductive film is located within the area enclosed by the protective structure, and the flexible circuit board is connected to the first bonding terminal group through the conductive film.

6. The display panel according to claim 1, characterized in that, Also includes: Multiple light-emitting devices are disposed on one side of the second main surface of the back plate; A protective film is disposed on the side of the plurality of light-emitting devices away from the second main surface.

7. The display panel according to claim 6, characterized in that, Also includes: The second bonding terminal group includes a plurality of second bonding terminals and is disposed on the second main surface of the back plate; the second bonding terminal group corresponds to the first bonding terminal group in the thickness direction of the back plate. The connecting leads also extend to the second main surface of the backplate, and each connecting lead is connected to a second bonding terminal.

8. The display panel according to claim 1 or 2, characterized in that, The number of the first bonding terminal groups is multiple, the number of the protective structures is the same as the number of the first bonding terminal groups, and the number of the flexible circuit boards is the same as the number of the first bonding terminal groups; At least two first bonding terminal groups are disposed on the side near the same selected side surface, and the at least two first bonding terminal groups are arranged side by side; at least a portion of each first bonding terminal group is located in a bonding area, each flexible circuit board is connected to one of the first bonding terminal groups, and the protective structure corresponding to the first bonding terminal group is connected to the side away from the first main surface.

9. A display device, characterized in that, The display panel includes any one of claims 1 to 8.

10. A method for manufacturing a display panel, characterized in that, The preparation method includes: A backplate is provided; the backplate includes: a first main surface and a second main surface opposite to each other, and a plurality of side surfaces connecting the first main surface and the second main surface, at least one of the side surfaces being a selected side surface, and the first main surface including a bonding area; A first bonding terminal group is formed on the first main surface; the first bonding terminal group includes a plurality of first bonding terminals; at least a portion of the first bonding terminal group is located in the bonding area; the first bonding terminal group is disposed on a side edge close to the selected side surface; at least one end of the first bonding terminal group away from the selected side surface is located within the bonding area; A connecting lead group is formed, the connecting lead group including multiple connecting leads, the connecting lead group being disposed on the selected side surface and the first main surface; each connecting lead is connected to a first bonding terminal; or, the connecting lead group is disposed on the selected side surface and the first main surface and extends to the bonding area, the portion of each connecting lead located in the bonding area serving as the first bonding terminal; A protective layer is formed, which covers the connection lead group and a portion of the first bonding terminal group near the selected side surface; A protective structure is formed; the protective structure is formed on the first main surface of the back plate, or the protective structure is formed on the side surface of the flexible circuit board that is in contact with the first bonding terminal group; the protective structure is in contact with the portion of the protective layer covering the first bonding terminal group; A flexible circuit board is bonded; the flexible circuit board is connected to the first bonding terminal group and is connected to the protective structure corresponding to the first bonding terminal group; the protective structure is disposed around the edge of the bonding area where the first bonding terminal group is located; The first bonding terminal group is located within the enclosed space formed by the protective structure, the back plate, and the flexible circuit board.

11. The preparation method according to claim 10, characterized in that, The formation of the protective structure includes: forming a protective structure on the first main surface; the protective structure is disposed around the edge of the bonding area; The bonded flexible circuit board includes: A conductive film is attached to the side of the first bonding terminal group away from the back plate, the conductive film covering at least a portion of the first bonding terminal group, and the conductive film being located within the enclosure area of ​​the protective structure; A flexible circuit board is attached to the side of the conductive film away from the back plate, and the flexible circuit board is attached to the protective structure.

12. The preparation method according to claim 10, characterized in that, The flexible circuit board has a protective structure area on the side surface that is in contact with the first bonding terminal group. After the flexible circuit board is bonded, the protective structure area corresponds to the bonding area. The formation of the protective structure includes: forming a protective structure on the side surface of the flexible circuit board that is in contact with the first bonding terminal group, the protective structure being disposed around the edge of the protective structure area; The bonded flexible circuit board includes: A conductive film is attached to the side of the first bonding terminal group away from the back plate, the conductive film covering at least a portion of the first bonding terminal group, and the conductive film being located within the bonding area; A flexible circuit board is attached to the side of the conductive film away from the backplate, and the protective structure is fitted to the edge of the bonding area.

13. The preparation method according to claim 11 or 12, characterized in that, The process of attaching a flexible circuit board to the side of the conductive film away from the backplate includes: The flexible circuit board is connected to the conductive film through a pre-pressing process; The conductive film and the protective structure are cured using this high-temperature and high-pressure process.

14. The preparation method according to claim 11, characterized in that, A protective structure is formed on the first main surface, including: A protective structure material is coated onto the first main surface; The material of the protective structure is subjected to ultraviolet light curing and high-temperature curing to obtain a ring structure; wherein the ultraviolet light curing time is less than 5 minutes, and the high-temperature curing temperature range is 85℃~250℃, and the high-temperature curing time is 30 minutes~60 minutes; or, The material of the protective structure is cured at high temperature to obtain a ring structure; wherein the high temperature curing temperature range is 85℃~250℃ and the high temperature curing time is 30mins~60mins.

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