Temperature and pressure integrated sensor

By combining the design of the housing, core fixing parts, and probes, the problems of complex structure, difficult processing, and easy wire loosening of existing integrated temperature and pressure sensors are solved, achieving the effects of easy processing, good stability, and high detection accuracy.

CN224189278UActive Publication Date: 2026-05-01GUANGZHOU ANDI ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU ANDI ELECTRONIC TECH CO LTD
Filing Date
2025-08-11
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing integrated temperature and pressure sensors have complex structures, are difficult to manufacture, have easily loosened wires, low detection accuracy, and limited probe length.

Method used

It adopts a combination design of housing, core fixing component, probe, ceramic capacitor, flexible circuit board and end button. The medium channel and the wire channel are coaxially connected. The probe is fixedly connected to the wire channel. The wire is fixed by multiple wire grooves. The sealing component is used to ensure the sealing performance. The probe can be processed separately to meet the detection requirements.

Benefits of technology

This technology enables the sensor to be easy to manufacture and has good stability, reduces manufacturing costs, improves detection accuracy and probe length, and avoids the problem of wires coming loose.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of sensors, and discloses and provides a temperature and pressure integrated sensor which comprises a shell, the shell comprises a containing part with a hollow cavity and a cylindrical installation part, and a first medium channel and a wire channel are formed in the installation part in the axial direction of the installation part; the core body fixing piece is in a disc shape, a medium containing cavity is formed in one side of the core body fixing piece, a positioning supporting part extending in the axial direction of the core body fixing piece is arranged on the other side of the core body fixing piece, and a second medium channel penetrating in the axial direction is further formed in the core body fixing piece; one end of the probe is closed, and the other end of the probe is open; a ceramic capacitor, a flexible circuit board, a temperature sensor and a terminal button. The pressure detection element of the ceramic capacitor and the temperature sensor are integrated together, so that the ceramic capacitor has the advantages of being easier to process, rapid to assemble and better in stability, and the manufacturing cost and the application cost are effectively reduced.
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Description

Temperature and pressure integrated sensor Technical Field

[0001] This application relates to the field of sensor technology, specifically to a temperature and pressure integrated sensor. Background Technology

[0002] Ceramic pressure components, also known as ceramic capacitors, generally integrate ceramic capacitors and thermistors into one unit. The thermistor is encapsulated by injection molding and extends out of the fluid in the form of a probe. It is a temperature and pressure integrated sensor that can simultaneously collect pressure and temperature data. It also has corrosion resistance and is suitable for most fluid media with weak corrosiveness.

[0003] For example, patent application CN102980714A describes a middle plate assembly consisting of a disc-shaped element and a tubular probe. The disc-shaped element and the tubular probe have hollow cavities to house the temperature sensor and its wires, which are then filled with filler material for fixation. This avoids the problem of the temperature sensor being directly exposed to the fluid. However, the temperature probe is separate from the outer shell, requiring a separate sealing structure between them, resulting in a complex structure that is difficult to manufacture.

[0004] For example, patent application CN 212721864 U includes a connector to accommodate a ceramic capacitor, a hollow bump to accommodate a temperature sensor, and wiring channels on the housing and a transmission channel on the connector. This allows the temperature sensor wire to run along the two channels, bypassing the side of the ceramic capacitor, and finally connecting to the circuit board. In this configuration, the probe is integrated with the housing, eliminating the need for a sealing structure, but several problems exist. First, the wiring channels and transmission channels are nearly perpendicular, causing the sensor wire to bend almost 90 degrees at the connection point without any other fixing structure. This means the wire cannot be securely contained within the channels, leading to issues like jumpers and loosening. Second, the bump is integrally formed with the housing. If made of metal, the protrusion length cannot be too long, as drilling, turning, or milling are difficult during processing, limiting its length and preventing it from fully penetrating the fluid, resulting in lower detection accuracy. Summary of the Invention

[0005] This application provides a temperature and pressure integrated sensor to solve the problems existing in the prior art.

[0006] In one embodiment, a temperature and pressure integrated sensor is provided, comprising: a housing, the housing including a receiving portion having a hollow cavity and a cylindrical mounting portion, wherein a first medium channel and a wire channel are respectively formed on the mounting portion along the axial direction of the mounting portion;

[0007] The core fixing component is disc-shaped. A medium receiving cavity is provided on one side of the core fixing component, and a positioning support part extending along the axial direction of the core fixing component is provided on the other side. A second medium channel extending along the axial direction is also provided on the core fixing component.

[0008] The probe is hollow, with one end closed and the other end open.

[0009] Ceramic capacitors, flexible circuit boards, temperature sensors, and terminals;

[0010] The mounting ends of the core fixing component, ceramic capacitor, flexible circuit board, and end button are sequentially embedded within the receiving portion of the housing. The outer extension of the dielectric receiving cavity is in contact with the detection surface of the ceramic capacitor. The flexible circuit board is disposed on the back side of the ceramic capacitor. The second dielectric channel is coaxially connected to the first dielectric channel. The positioning support is wholly or partially embedded in the wire channel. The open end of the probe is fixedly connected to the outer end of the wire channel. The temperature sensor is disposed within the probe. The wire of the temperature sensor is sequentially arranged along the surface of the wire channel, the positioning support, and the core fixing component, and is connected to the flexible circuit board.

[0011] In one embodiment, the probe includes an integrally formed extension and a fixing part, the extension and the fixing part being hollow inside, the outer end of the extension being closed, and the outer diameter of the fixing part being larger than the outer diameter of the extension; a probe fixing position is constructed at the outer end of the first medium channel, the probe fixing position being a circular hole with a diameter larger than that of the wire channel; the fixing part and the probe fixing position are interference-fitted.

[0012] In one embodiment, the core fixing member is provided with a first groove and a second groove, and the positioning support is provided with a third groove; the first groove is disposed on the outer peripheral surface of the core fixing member and extends through the core fixing member along its axial direction, the second groove is disposed on the end face of the core fixing member and extends from the first groove to the third groove, and the third groove is disposed along the axial direction of the positioning support and extends through the outer end of the positioning support; the wire of the temperature sensor inside the probe sequentially extends through the wire channel, the third groove, the second groove and the first groove, thereby connecting to the flexible circuit board.

[0013] In one solution, the integrated temperature and pressure sensor also includes:

[0014] A thin sheet-like connector; at least two connecting grooves are also provided on the outer peripheral surface of the core fixing member, the connecting grooves are radially recessed relative to the outer peripheral surface of the core fixing member, and pass through both ends of the core fixing member along the axial direction of the core fixing member; one end of the connector is fixedly connected to the connecting groove, and the other end is fixedly connected to the mounting end of the end button.

[0015] In one embodiment, at least one of the connecting grooves is arranged to coincide with the first groove in the radial direction of the core fixing member.

[0016] In one embodiment, the connector is an adhesive patch.

[0017] In one embodiment, the hollow cavity of the probe is filled with thermally conductive silicone grease.

[0018] In one embodiment, a first sealing element is provided between the dielectric receiving cavity and the ceramic capacitor, a second sealing element is provided at the connection between the second dielectric channel and the first dielectric channel, and a third sealing element is sleeved on the side of the mounting portion adjacent to the receiving portion.

[0019] The beneficial effects of this application are:

[0020] This application provides a method to integrate a pressure sensing element of a ceramic capacitor with a temperature sensor, which has the advantages of being easier to process, faster to assemble, and more stable, effectively reducing manufacturing and application costs. The specific effects can be seen in specific implementation methods and different scenarios. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is an external schematic diagram of an embodiment of this application;

[0023] Figure 2 is a cross-sectional schematic diagram of an embodiment of this application;

[0024] Figure 3 is an explosion diagram of one embodiment of this application;

[0025] Figure 4 is a schematic diagram showing the internal structure of the sensor in a cross section in the embodiment of Figure 3;

[0026] Figure 5 is a schematic diagram of the core fixing member in one embodiment of this application;

[0027] Figure 6 is a schematic diagram of the core fixing member from another perspective in one embodiment of this application;

[0028] Labels for each item in the figure:

[0029] 1. Housing; 101. Receiving part; 102. Mounting part; 103. First medium channel; 104. Probe fixing position; 105. Wire channel; 2. Core fixing part; 201. Positioning support part; 202. Second medium channel; 203. Medium receiving cavity; 204. First wire groove; 205. Second wire groove; 206. Third wire groove; 207. Connecting groove; 3. Probe; 301. Extension part; 302. Fixing part; 4. Ceramic capacitor; 5. Flexible circuit board; 6. Temperature sensor; 7. End button; 8. First seal; 9. Second seal; 10. Third seal; 11. Connector. Detailed Implementation

[0030] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application. Similarly, the following examples are only some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] To achieve the objectives of this invention, the following embodiments are proposed in this application.

[0032] In some embodiments, please refer to Figures 1, 2, 3, and 4, a temperature and pressure integrated sensor is provided, comprising: a housing 1, the housing 1 including a receiving portion 101 with a hollow cavity and a cylindrical mounting portion 102, the mounting portion 102 having a first medium channel 103 and a wire channel 105 respectively constructed along the axial direction of the mounting portion 102; a core fixing member 2, the core fixing member 2 being disc-shaped, having a medium receiving cavity 203 on one side of the core fixing member 2 and a positioning support portion 201 extending along the axial direction of the core fixing member 2 on the other side, the core fixing member 2 also having a second medium channel 202 extending along the axial direction; a probe 3, which is hollow with one end closed and the other end open; a ceramic capacitor 4; a flexible circuit board 5; a temperature sensor 6; and a terminal button 7. The mounting ends of the core fixing component 2, ceramic capacitor 4, flexible circuit board 5, and end button 7 are sequentially embedded in the receiving portion 101 of the housing 1. The outer extension of the dielectric receiving cavity 203 is in contact with the detection surface of the ceramic capacitor 4. The flexible circuit board 5 is disposed on the back side of the ceramic capacitor 4. The second dielectric channel 202 is coaxially connected to the first dielectric channel 103. The open end of the probe 3 is fixedly connected to the outer end of the wire channel 105, and the temperature sensor 6 is disposed inside the probe 3.

[0033] The mounting part 102 is used to connect to the part to be tested during application. It is generally provided with a threaded connection. The probe 3 is inserted into the medium to directly detect the temperature of the medium and transmit the signal to the flexible circuit board 5 to complete the information acquisition. The medium can enter the medium-filling cavity 203 through the first medium channel 103 and the second medium channel 202, and then come into contact with the ceramic capacitor 4 to directly detect the pressure of the medium, thereby simultaneously detecting the temperature and pressure of the medium.

[0034] In this embodiment, the wire of the temperature sensor 6 is sequentially arranged along the surface of the wire channel 105, the positioning support 201, and the core fixing member 2, and is connected to the flexible circuit board 5. This allows the wire of the temperature sensor 6 to reach the flexible circuit board 5 by following the surface of the core fixing member 2 and bypassing it. On one hand, its path does not involve the dielectric cavity and does not affect the sealing performance. More importantly, the positioning support 201 provides support and positioning for the wire at the near-vertical bend between the lead channel and the core fixing member 2, preventing the wire from becoming loose or skipped during use, thus affecting the overall quality of the sensor.

[0035] Meanwhile, in this example, the positioning support 201 of the core fixing part 2 is fully or partially embedded in the wire channel 105, which forms a positioning effect on the core fixing part 2 in the radial direction of the sensor, making the structure more robust. During the assembly process, the assembly direction and position can also be judged by whether the positioning support 201 and the wire channel 105 are properly matched, which is beneficial for assembly.

[0036] In this example, temperature sensor 6 can be an NTC element, which features faster response, higher accuracy, and greater durability.

[0037] In some embodiments, referring to Figures 5 and 6, the probe 3 includes an integrally formed extension 301 and a fixing part 302. The extension 301 and fixing part 302 are hollow inside. The outer end of the extension 301 is closed, and the outer diameter of the fixing part 302 is larger than the outer diameter of the extension 301. A probe fixing position 104 is constructed at the outer end of the first medium channel 103. The probe fixing position 104 is a circular hole with a diameter larger than that of the wire channel 105. The fixing part 302 and the probe fixing position 104 are interference-fitted to form a fixing and sealing function. With this configuration, the probe 3 can be machined and assembled separately, rather than being machined integrally with the housing. This greatly reduces the manufacturing difficulty, and the separately machined probe 3 can meet longer size requirements, thereby satisfying detection needs.

[0038] In some embodiments, referring to Figures 6 and 7, the core fixing member 2 is provided with a first groove 204 and a second groove 205, and the positioning support part 201 is provided with a third groove 206. The first groove 204 is disposed on the outer peripheral surface of the core fixing member 2 and extends through the core fixing member 2 axially. The second groove 205 is disposed on the end face of the core fixing member 2 and extends from the first groove 204 to the third groove 206. The third groove 206 is disposed along the axial direction of the positioning support part 201 and extends through the outer end of the positioning support part 201. The wire of the temperature sensor 6 inside the probe 3 extends sequentially along the wire channel 105, the third groove 206, the second groove 205, and the first groove 204, thereby connecting to the flexible circuit board 5. The portion of the temperature sensor 6 passing through the core fixing member 2 can be embedded in the third groove 206, the second groove 205, and the first groove 204 respectively, thereby hiding and protecting the wire. The positioning effect of the grooves makes the wire more stable and secure, which is beneficial to improving the stability of the sensor.

[0039] In some embodiments, as shown in Figures 4 to 6, the integrated temperature and pressure sensor further includes: a thin-film connector 11; at least two connecting grooves 207 are provided on the outer peripheral surface of the core fixing member 2, the connecting grooves 207 being radially recessed relative to the outer peripheral surface of the core fixing member 2 and extending through both ends of the core fixing member 2 along its axial direction; one end of the connector 11 is fixedly connected to the connecting groove 207, and the other end is fixedly connected to the mounting end of the end button 7. Thus, the core fixing member 2 and the end button 7 are relatively fixed together by the connector 11 and the connecting groove 207, and the connector 11 is embedded in the connecting groove 207 in the radial direction of the sensor, without occupying more radial space, which helps to improve the compactness of the sensor.

[0040] In some alternative embodiments, the connector 11 is selected as an adhesive patch, which directly adhesively connects the core fixing member 2 to the end button 7. For example, three connecting grooves 207 are provided around the core fixing member 2, and three connectors 11 are used to connect to the end button 7. Compared with the snap-fit ​​connection method, the snap-fit ​​not only occupies the limited space inside the sensor, but is also prone to deformation and failure during assembly. The adhesive method used in this application is not only structurally reliable, but also lower in cost.

[0041] In some embodiments, as shown in FIG5, at least one connecting groove 207 is arranged to coincide with the first wire groove 204 in the radial direction of the core fixing member 2. In this way, after the connecting member 11 is attached to the first wire groove 204, it can also restrict part of the wire of the temperature sensor 6 passing through the first wire groove 204 within the groove, thereby improving its stability.

[0042] In some embodiments, the hollow cavity of probe 3 is filled with thermally conductive silicone grease, which facilitates the more efficient transfer of the temperature of the medium to the temperature sensor 6, thereby improving the accuracy of temperature detection.

[0043] In some embodiments, as shown in Figures 2 to 4, a first sealing element 8 is provided between the dielectric receiving cavity 203 and the ceramic capacitor 4, a second sealing element 9 is provided at the connection between the second dielectric channel 202 and the first dielectric channel 103, and a third sealing element 10 is fitted on the side of the mounting part 102 adjacent to the receiving part 101. The first to third sealing elements 10 form a seal for the dielectric, preventing leakage.

[0044] The above are merely optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

[0045] The above are merely optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A temperature and pressure integrated sensor, characterized in that, The system includes: a housing, comprising a receiving portion having a hollow cavity and a cylindrical mounting portion, wherein a first dielectric channel and a wire channel are respectively formed along the axial direction of the mounting portion; a core fixing component, the core fixing component being disc-shaped, having a dielectric receiving cavity on one side and a positioning support portion extending along the axial direction of the core fixing component on the other side, and a second dielectric channel extending through the core fixing component along the axial direction; a probe, which is hollow and closed at one end and open at the other; a ceramic capacitor, a flexible circuit board, a temperature sensor, and a terminal button; wherein the core fixing component, the ceramic capacitor, and the... The flexible circuit board and the mounting end of the terminal button are sequentially embedded in the receiving part of the housing. The outer extension of the dielectric receiving cavity is in contact with the detection surface of the ceramic capacitor. The flexible circuit board is disposed on the back side of the ceramic capacitor. The second dielectric channel is coaxially connected to the first dielectric channel. The positioning support is wholly or partially embedded in the wire channel. The open end of the probe is fixedly connected to the outer end of the wire channel. The temperature sensor is disposed inside the probe. The wire of the temperature sensor is sequentially arranged along the surface of the wire channel, the positioning support, and the core fixing member, and is connected to the flexible circuit board.

2. The integrated temperature and pressure sensor according to claim 1, characterized in that: The probe includes an integrally formed extension and a fixing part. The extension and the fixing part are hollow inside. The outer end of the extension is closed. The outer diameter of the fixing part is larger than the outer diameter of the extension. The outer end of the first medium channel is provided with a probe fixing position. The probe fixing position is a circular hole with a diameter larger than that of the wire channel. The fixing part and the probe fixing position are interference-fitted.

3. The integrated temperature and pressure sensor according to claim 2, characterized in that, The core fixing member is provided with a first groove and a second groove, and the positioning support is provided with a third groove; the first groove is provided on the outer peripheral surface of the core fixing member and extends through the core fixing member along the axial direction of the core fixing member, the second groove is provided on the end face of the core fixing member and extends from the first groove to the third groove, and the third groove is provided along the axial direction of the positioning support and extends through the outer end of the positioning support; the wire of the temperature sensor inside the probe sequentially extends through the wire channel, the third groove, the second groove and the first groove, thereby connecting to the flexible circuit board.

4. The integrated temperature and pressure sensor according to claim 3, characterized in that, Also includes: A thin sheet-like connector; at least two connecting grooves are also provided on the outer peripheral surface of the core fixing member, the connecting grooves are radially recessed relative to the outer peripheral surface of the core fixing member, and pass through both ends of the core fixing member along the axial direction of the core fixing member; one end of the connector is fixedly connected to the connecting groove, and the other end is fixedly connected to the mounting end of the end button.

5. The integrated temperature and pressure sensor according to claim 4, characterized in that, At least one of the connecting grooves is arranged to coincide with the first groove in the radial direction of the core fixing member.

6. The integrated temperature and pressure sensor according to claim 4, characterized in that, The connector is an adhesive patch.

7. The integrated temperature and pressure sensor according to claim 1, characterized in that, The hollow cavity of the probe is filled with thermally conductive silicone grease.

8. The integrated temperature and pressure sensor according to claim 1, characterized in that, A first sealing element is provided between the dielectric receiving cavity and the ceramic capacitor, a second sealing element is provided at the connection between the second dielectric channel and the first dielectric channel, and a third sealing element is sleeved on the side of the mounting part adjacent to the receiving part.

Citation Information

Patent Citations

  • Combination pressure / temperature in a compact sensor assembly

    CN102980714A

  • Novel ceramic pressure and temperature integrated sensor

    CN212721864U