Thin-film capacitor inverter compatible with air-cooling heat dissipation and water-cooling heat dissipation

Abstract

The invention discloses a thin-film capacitor inverter compatible with air cooling and water cooling heat dissipation, and belongs to the technical field of inverters, the inverter comprises an internal complete machine assembly, a compatible case and a cooling module, the cooling module comprises an air cooling structure assembly and a water cooling structure assembly; the internal complete machine assembly is used as an electrical function assembly of the thin-film capacitor inverter and is integrally installed in the compatible case. And the compatible case internally provided with the internal complete machine assembly is combined and mounted with different cooling modules to form the thin-film capacitor inverters with different cooling modes. According to the modular design, the compatible case can be combined with different cooling modules according to different application environments to form thin-film capacitor inverters with different cooling modes, and the adaptability of the thin-film capacitor inverters is improved.

Description

Technical Field

[0001] This invention relates to the field of frequency converter technology, and more specifically to a thin-film capacitor inverter compatible with both air-cooled and water-cooled heat dissipation. Background Technology

[0002] Inverters, as core devices in power electronic systems, are widely used in new energy power generation, electric vehicles, industrial drives, and rail transportation. As inverters develop towards higher power density and higher integration, their internal core components, such as power modules, thin-film capacitors, and busbars, generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it will cause the device temperature to rise, affecting system efficiency, shortening lifespan, and even leading to equipment failure. Therefore, the design of the heat dissipation structure is crucial for the reliability of the inverter.

[0003] Currently, inverters are typically equipped with a single heat dissipation structure. However, this existing design pattern of "one model corresponding to one heat dissipation method" has the following problems:

[0004] First, the structural design is rigid and lacks adaptability. The inverter's heat dissipation structure is usually integrated with the chassis structure, making it difficult to change once finalized. When the user's actual application scenario changes (such as moving the equipment from a temperate region to a tropical high-temperature region, increasing the load rate, or needing to upgrade the heat dissipation capacity based on the original air-cooled chassis), the original single heat dissipation structure often becomes a bottleneck restricting the equipment's performance. Switching to a different heat dissipation method requires completely replacing the inverter with one that uses a different cooling method, or redesigning and extensively modifying the entire inverter structure, which is costly, time-consuming, and makes it difficult to quickly respond to market demands.

[0005] Secondly, serialized development is inefficient and material costs are high. To meet the diverse needs of different customers for air-cooled, water-cooled, or hybrid cooling, manufacturers often need to develop two or more sets of inverter chassis molds and bills of materials with different structures for the same electrical platform. This leads to increased R&D investment, extended production cycles, and complicated material management, making it difficult to achieve platform-based and modular product design.

[0006] Finally, the layout of internal components is constrained. When designing existing inverters, if compatibility with different heat dissipation methods is considered, the chassis structure often limits the layout of internal components (such as film capacitors, power modules, busbars, etc.), making it difficult to maintain consistent electrical performance and electromagnetic compatibility across different heat dissipation solutions, thus increasing the complexity of design verification.

[0007] In summary, the existing inverter heat dissipation structure design lacks flexibility and compatibility, and cannot easily configure, switch or combine air cooling and water cooling on the same chassis platform according to actual needs, which limits the environmental adaptability, operational reliability and serialization development efficiency of the equipment.

[0008] Therefore, there is an urgent need to develop an inverter structure that can be compatible with both air cooling and water cooling to solve the above problems. Summary of the Invention

[0009] In view of the above problems, the present invention is proposed to provide a thin-film capacitor inverter that is compatible with both air cooling and water cooling, thereby overcoming or at least partially solving the above problems.

[0010] To achieve the above objectives, the present invention adopts the following technical solution: A thin-film capacitor inverter compatible with both air-cooled and water-cooled heat dissipation, comprising: The system comprises an internal assembly, a compatible chassis, and a cooling module, wherein the cooling module includes an air-cooled structural assembly and a water-cooled structural assembly; the internal assembly, as the electrical functional component of the thin-film capacitor inverter, is installed as a whole inside the compatible chassis; the compatible chassis, which houses the internal assembly, is combined with different cooling modules to form thin-film capacitor inverters with different cooling methods.

[0011] Preferably, the internal assembly includes an electrically connected thin-film capacitor, a power module, a busbar, a Hall element, and an embedded PCB board, wherein the thin-film capacitor, power module, busbar, and Hall element are mounted on a single electrical board.

[0012] Preferably, the thin-film capacitor has a square structure and is horizontally arranged on top of the internal assembly.

[0013] Preferably, the compatible chassis includes a semi-enclosed shell and a front cover. The front cover is mounted and fixed to the front of the semi-enclosed shell. The rear panel of the semi-enclosed shell is provided with mounting posts for fixing the internal components and heat dissipation vents.

[0014] Preferably, the shell of the semi-enclosed structure adopts an integrated sheet metal design.

[0015] Preferably, the bottom of the semi-enclosed housing is provided with a waterproof connector for connecting the incoming and outgoing lines.

[0016] Preferably, the air-cooled structural component includes an air-cooled heat sink, a cooling fan, and an air-cooled chassis base. The air-cooled heat sink is located in the middle of the air-cooled chassis base, and the cooling fan is located at the bottom of the air-cooled chassis base. The air-cooled chassis base is used to combine and fix with a compatible chassis that houses the internal components to form an air-cooled thin-film capacitor inverter.

[0017] Preferably, the water-cooled structural component includes a water-cooled radiator and a water-cooled chassis base, wherein the water-cooled radiator is disposed in the middle of the water-cooled chassis base, and the bottom of the water-cooled chassis base is provided with a water outlet and a water inlet. The water-cooled chassis base is used to combine and fix with a compatible chassis on which internal complete components are installed to form a water-cooled thin-film capacitor inverter.

[0018] As can be seen from the above technical solution, compared with the prior art, the present invention discloses a thin-film capacitor inverter that is compatible with both air cooling and water cooling, which has the following beneficial effects: This invention can quickly realize different heat dissipation methods for thin-film capacitor inverters according to different application scenarios, through modularly designed compatible chassis and different cooling components.

[0019] The air-cooled and water-cooled compatible chassis disclosed in this invention maximizes space utilization and minimizes external dimensions while fully considering heat dissipation, thereby reducing the product's space ratio and increasing power density. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the internal assembly structure provided in an embodiment of the present invention; Figure 2 This is a structural schematic diagram of the internal assembly structure from another angle, provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the internal component circuit connection structure provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the overall structure of a compatible chassis with internal components installed, provided in an embodiment of the present invention. Figure 5 This is an exploded view of the internal components and compatible chassis provided in an embodiment of the present invention; Figure 6 This is an exploded view of the compatible chassis housing and front cover structure provided in an embodiment of the present invention; Figure 7 This is an exploded view of the air-cooled structural component provided in an embodiment of the present invention; Figure 8 An exploded view of the air-cooled heat dissipation thin-film capacitor inverter structure, which consists of air-cooled structural components and a compatible chassis, as provided in an embodiment of the present invention. Figure 9 This is a schematic diagram of the bottom structure of a wind-cooled thin-film capacitor inverter provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of the overall appearance structure of the air-cooled heat dissipation thin-film capacitor inverter provided in this embodiment of the invention; Figure 11 This is an exploded view of the water-cooled structural component provided in an embodiment of the present invention; Figure 12 An exploded view of the water-cooled heat dissipation thin-film capacitor inverter structure, which consists of water-cooled structural components and a compatible chassis, as provided in an embodiment of the present invention. Figure 13 This is a schematic diagram of the bottom structure of a water-cooled thin-film capacitor inverter provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of the overall appearance structure of the water-cooled heat dissipation thin-film capacitor inverter provided in an embodiment of the present invention.

[0022] In the diagram, 100 is the internal assembly, 101 is the film capacitor, 102 is the power module, 1031 is the first Hall element, 1032 is the second Hall element, 1033 is the third Hall element, 104 is the busbar, and 105 is the embedded PCB board.

[0023] 200-Compatible chassis, 201-Shell, 202-Front cover, 203-Fan vent, 204-Mounting post, 205-Waterproof connector.

[0024] 300 - Air-cooled structural components, 301 - Air-cooled heatsink, 302 - Air-cooled chassis base, 303 - Cooling fan.

[0025] 400-Water-cooled structural components, 401-Water-cooled radiator, 402-Water-cooled chassis base, 403-Water inlet, 404-Water outlet. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] This invention discloses a thin-film capacitor inverter compatible with both air cooling and water cooling. The entire compatible inverter consists of different cooling components, including an internal main unit 100, a compatible chassis 200, an air-cooled structural component 300, and a water-cooled structural component 400. The specific structure of the invention will be further described below.

[0028] refer to Figures 1-3In this embodiment of the invention, the internal assembly 100 comprises a film capacitor 101, a power module 102, a busbar 104, a Hall element (Hall sensor), and an embedded PCB board 105. The film capacitor 101, power module 102, busbar 104, and Hall device are mounted on an electrical board, and the embedded PCB board is fixed on top of this electrical board. The Hall device includes a first Hall element (CT1) 1031, a second Hall element (CT2) 1032, and a third Hall element (CT3) 1033. In this embodiment, the film capacitor 101 has a square design and is placed horizontally on top of the internal assembly 100. (See reference...) Figure 3 The power module 102 consists of several IGBTs (Insulated-Gate Bipolar Transistors) and several diodes D. P(+) and N(-) represent DC input, CT represents Hall element, C represents film capacitor, UVW represents AC output, and the same symbol in the middle represents the IGBT power module. They are connected by conductive busbars to form a complete logic function circuit.

[0029] refer to Figures 4-6 In this embodiment of the invention, the compatible chassis 200 includes a shell 201 and a front cover 202. The shell 201 adopts a semi-enclosed high-protection sheet metal structure. The semi-enclosed shell 201 can be an integrated design or a multi-plate welded design. If a welded design is adopted, the welded parts need to be sealed. A heat dissipation vent 203 is provided in the center of the rear plate of the shell 201 to facilitate heat dissipation. A waterproof connector 205 is provided at the bottom of the shell 201 to ensure the sealing of the incoming and outgoing wiring. The rear plate of the shell 201 is also provided with mounting posts 204 for mounting an electrical board (the electrical board is provided with a thin film capacitor 101, a power module 102, a conductor bus 104, and a Hall element). During the installation process, the electrical board is first installed into the cavity of the shell 201, then the embedded PCB board 105 is installed on top of the electrical board, and finally the front cover 202 is fixed to the shell 201 with bolts and other fasteners, and the connection between the front cover 202 and the shell 201 is sealed with sealant.

[0030] The compatible chassis 200 disclosed in this invention can be connected to the air-cooled structural component 300 or the water-cooled structural component 400 via the rear panel to form an air-cooled or water-cooled thin-film capacitor inverter. This allows the thin-film capacitor inverter disclosed in this invention to quickly install different cooling components according to different application scenarios without disassembling the internal structure of the thin-film capacitor inverter, thereby forming thin-film capacitor inverters with different heat dissipation methods.

[0031] refer to Figures 7-10In this embodiment of the invention, the air-cooled structural component 300 consists of an air-cooled heat sink 301, an air-cooled chassis base 302, and a cooling fan 303. The air-cooled heat sink 301 is mounted on the air-cooled chassis base 303, and both the heat sink and the chassis base have air outlets on their tops. The heat sink corresponds to the heat dissipation vent 203 of the compatible chassis. The compatible chassis 200, which houses the internal complete unit components 100, is combined with the air-cooled structural component 300 and fixed using bolts or other fastening mechanisms. This forms an air-cooled inverter without affecting the high protection level of the original compatible chassis and while ensuring the strength of the mechanical connections.

[0032] refer to Figures 11-14 In this embodiment of the invention, the water-cooled structural component 400 consists of a water-cooled radiator 401 and a water-cooled chassis base 402. The bottom of the water-cooled chassis base 402 is provided with a water inlet 403 and a water outlet 404. The water-cooled radiator 401 has a corresponding heat sink 203 of the compatible chassis. The compatible chassis 200, which houses the internal complete unit 100, is combined with the water-cooled structural component 400 and fixed by bolts or other fastening mechanisms. Under the premise of not affecting the high protection level of the original compatible chassis and ensuring the mechanical connection strength, a water-cooled inverter is formed.

[0033] The air-cooled and water-cooled compatible chassis structure disclosed in this invention maximizes space utilization and minimizes external dimensions while fully considering heat dissipation, thereby reducing the product's space ratio and increasing power density.

[0034] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A thin-film capacitor inverter compatible with both air-cooled and water-cooled heat dissipation, characterized in that, include: The system comprises an internal assembly, a compatible chassis, and a cooling module, wherein the cooling module includes an air-cooled structural assembly and a water-cooled structural assembly; the internal assembly, as the electrical functional component of the thin-film capacitor inverter, is installed as a whole inside the compatible chassis; the compatible chassis, which houses the internal assembly, is combined with different cooling modules to form thin-film capacitor inverters with different cooling methods.

2. The thin-film capacitor inverter as described in claim 1, characterized in that, The internal assembly includes electrically connected thin-film capacitors, power modules, busbars, Hall elements, and embedded PCB boards, wherein the thin-film capacitors, power modules, busbars, and Hall elements are mounted on a single electrical board.

3. The thin-film capacitor inverter as described in claim 2, characterized in that, The thin-film capacitor has a square structure and is horizontally positioned on top of the internal assembly.

4. The thin-film capacitor inverter as described in claim 1, characterized in that, The compatible chassis includes a semi-enclosed shell and a front cover. The front cover is fixed to the front of the semi-enclosed shell. The rear panel of the semi-enclosed shell is provided with mounting posts for fixing the internal components and heat dissipation vents.

5. The thin-film capacitor inverter as described in claim 4, characterized in that, The shell of the semi-enclosed structure adopts an integrated sheet metal design.

6. The thin-film capacitor inverter as described in claim 4, characterized in that, The bottom of the semi-enclosed structure housing is provided with a waterproof connector for connecting incoming and outgoing lines.

7. The thin-film capacitor inverter as described in claim 1, characterized in that, The air-cooled structural component includes an air-cooled heat sink, a cooling fan, and an air-cooled chassis base. The air-cooled heat sink is located in the middle of the air-cooled chassis base, and the cooling fan is located at the bottom of the air-cooled chassis base. The air-cooled chassis base is used to combine and fix with a compatible chassis that houses the internal components to form an air-cooled thin-film capacitor inverter.

8. The thin-film capacitor inverter as described in claim 1, characterized in that, The water-cooled structural component includes a water-cooled radiator and a water-cooled chassis base. The water-cooled radiator is located in the middle of the water-cooled chassis base, and the bottom of the water-cooled chassis base is provided with a water outlet and a water inlet. The water-cooled chassis base is used to combine and fix with a compatible chassis that houses the internal components to form a water-cooled thin-film capacitor inverter.

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