An electronic device whole machine heat dissipation structure and a vehicle-mounted double-spindle machine

Abstract

The application provides an electronic device whole machine heat dissipation structure and a vehicle-mounted double-spindle machine, wherein the electronic device whole machine heat dissipation structure comprises a fixed panel, a circuit board and an electric element; the machine cover comprises a middle frame and a cover plate, the middle frame is installed between the fixed panel and the cover plate, the machine cover and the fixed panel form an internal accommodating space covering the circuit board; a first heat dissipation member is installed outside the cover plate; the cover plate is provided with at least one opening; the first heat dissipation member is provided with a plurality of heat dissipation units and a plurality of heat dissipation through holes, and is further provided with at least one heat conduction structure corresponding to the opening and in contact with the electric element. The electronic device whole machine heat dissipation structure provided by the application adds heat dissipation members in all directions of the whole machine cover and sets a fitting structure, fills the heat conduction structure passing through the fitting structure between the circuit board and the heat dissipation member on the fixed panel in the whole machine cover, overcomes the problems that the heat conduction of the whole machine shell is poor and the traditional heat dissipation structure cannot effectively dissipate heat in all directions of the whole machine, and improves the continuous duration and service life of the stable work of the vehicle-mounted double-spindle machine.

Description

Technical Field

[0001] This invention belongs to the field of vehicle electronic device protection and heat dissipation technology, and more specifically, it relates to an electronic device heat dissipation structure particularly suitable for vehicle electronic devices and a vehicle dual-spindle machine using the same. Background Technology

[0002] Currently, with the increasing popularity of automobiles, the accompanying in-vehicle electronic devices, such as in-vehicle dual-spindle units for playing audio and / or video, are also being widely used. Existing in-vehicle dual-spindle units have poor thermal conductivity in their protective casings, and their heat dissipation structures cannot effectively limit the overall heat generation of the unit. This reduces the continuous stable operation time of the in-vehicle dual-spindle units, thereby decreasing their product lifespan and user experience.

[0003] Therefore, the poor thermal conductivity of the protective shell of traditional vehicle-mounted dual-spindle machines and the poor heat dissipation effect of the heat dissipation structure on the whole machine are technical problems that urgently need to be solved in this field. Summary of the Invention

[0004] In order to solve the technical problems of poor thermal conductivity of the protective shell of the existing vehicle-mounted dual-spindle machine and poor heat dissipation effect of the heat dissipation structure on the whole machine, the present invention proposes a heat dissipation structure for the whole machine of electronic devices suitable for vehicle-mounted electronic devices and a vehicle-mounted dual-spindle machine using the same.

[0005] To solve the above problems, the technical solution adopted by the present invention is: to provide a heat dissipation structure for an electronic device, comprising:

[0006] Fixed panel;

[0007] The circuit board is mounted on a fixed panel and contains multiple electrical components.

[0008] The cover includes a middle frame and a cover plate. One end of the middle frame is mounted to a fixed panel, and the cover plate is mounted to the other end of the middle frame away from the fixed panel. The cover and the fixed panel form an internal housing space that covers the circuit board.

[0009] The first heat sink is mounted on the outside of the cover plate on the side away from the fixed panel;

[0010] The cover plate has at least one opening;

[0011] The first heat sink has multiple heat dissipation units on the side away from the fixed panel;

[0012] The first heat sink has multiple heat dissipation holes, and the other side of the first heat sink near the fixed panel has at least one corresponding opening and a heat-conducting structure that contacts the electrical components.

[0013] Furthermore, one side of the mid-frame is open, and the mid-frame has multiple ventilation holes; it also includes:

[0014] At least one second heat sink is installed at the opening and closes the internal accommodating space;

[0015] The second heat sink has multiple heat dissipation units on the side away from the circuit board;

[0016] The second heat sink has multiple heat-conducting structures on the other side of the circuit board.

[0017] Preferably, the first heat sink is a heat sink panel, the second heat sink is a heat sink side plate, and the heat sink unit is a heat sink fin.

[0018] Furthermore, the thermally conductive structure includes:

[0019] A heat-conducting boss is installed on the opposite side of the heat dissipation panel, near the fixed panel. The heat-conducting boss extends into the opening and contacts the electrical components.

[0020] Furthermore, the heat-conducting structure also includes:

[0021] Multiple thermal conductive elements are installed between the circuit board and the heat dissipation panel. One end of the thermal conductive element contacts the circuit board and / or electrical components, and the other end of the thermal conductive element extends out of the opening and contacts the heat dissipation panel.

[0022] Preferably, the thermally conductive component is a thermally conductive silicone sheet.

[0023] Preferably, the circuit board is a PCBA board, and the electrical components include a chip with a CPU.

[0024] Preferably, the fixed panel and the middle frame are made of aluminum alloy sheet metal parts.

[0025] Preferably, the surfaces of the fixed panel and the middle frame are covered with an insulating varnish layer.

[0026] The present invention also provides a vehicle-mounted dual-spindle machine, including the above-mentioned electronic device heat dissipation structure.

[0027] Compared with the prior art, the electronic device heat dissipation structure provided by the present invention adds heat dissipation components in all directions of the outer casing and sets clearance structures at the corresponding heat dissipation components in the outer casing. By filling the space between the circuit board mounted on the fixed panel inside the outer casing and the heat dissipation components with a heat-conducting structure that passes through the clearance structure, the problems of poor thermal conductivity of the protective shell and the inability of traditional heat dissipation structures to effectively limit the heat generation of the vehicle-mounted dual-spindle machine in all directions are overcome, thereby improving the continuous stable operation time and service life of the vehicle-mounted dual-spindle machine. Attached Figure Description

[0028] Figure 1 An exploded structural diagram of an embodiment of the heat dissipation structure for an electronic device provided by the present invention;

[0029] Figure 2 A three-dimensional structural diagram of the first heat sink component in an embodiment of the heat dissipation structure for an electronic device provided by the present invention. Figure 1 ;

[0030] Figure 3 A three-dimensional structural diagram of the first heat sink component in an embodiment of the heat dissipation structure for an electronic device provided by the present invention. Figure 2 ;

[0031] Figure 4 A front view of the first heat sink component in an embodiment of the heat dissipation structure of the electronic device provided by the present invention. Figure 1 ;

[0032] Figure 5 A front view of the first heat sink component in an embodiment of the heat dissipation structure of the electronic device provided by the present invention. Figure 2 .

[0033] The main markings in the attached figures are as follows:

[0034] 1-Fixed panel; 11-Bracket; 12-Support column; 2-Circuit board; 21-Electrical component; 3-Middle frame; 31-Opening; 32-Ventilation hole; 33-Plug-in mounting port; 4-Cover plate; 41-Opening; 5-First heat sink; 51-Heat dissipation through hole; 52-Mounting hole; 53-Positioning column; 6-Heat dissipation unit; 7-Heat-conducting boss; 8-Heat-conducting component; 9-Second heat sink. Detailed Implementation

[0035] To make the technical problem to be solved, the technical solution and the beneficial effects of the present invention clearer, the following description is provided in conjunction with the appendix. Figure 1-5 The present invention will be further described in detail with reference to embodiments.

[0036] Please refer to the following: Figure 1The electronic device heat dissipation structure provided by the present invention includes: a fixed panel 1, preferably made of aluminum alloy sheet metal; a circuit board 2, mounted on the fixed panel 1, on which multiple electrical components 21 are mounted; in this embodiment, the circuit board 2 is a PCBA board, and the electrical components 21 include chips with CPUs; as a preferred embodiment, the circuit board 2 is mounted on the fixed panel 1 via a bracket 11 and a support column 12; a housing, which includes a middle frame 3 and a cover plate 4, one end of the middle frame 3 is mounted on the fixed panel 1, and the cover plate 4 is mounted on the other end of the middle frame 3 away from the fixed panel 1, the housing and the fixed panel 1 forming an internal accommodating space covering the circuit board 2; in this embodiment, the cover plate 4 has at least one opening 41, which is preferably a rectangular opening 41, but can also be a circular or other shaped opening 41, to allow space and maintain gas flow between the internal accommodating space and the external environment of the housing; the middle frame 3 has multiple plug-in mounting ports 33 for fixing and mounting plugs that match the electrical components 21. In a preferred embodiment, the fixed panel 1 and the middle frame 3 are made of aluminum alloy sheet metal parts, and the surfaces of the fixed panel 1 and the middle frame 3 are covered with an insulating paint layer made by spray painting process.

[0037] Please refer to the following: Figure 2-5 The overall heat dissipation structure of the electronic device also includes a first heat sink 5. In this embodiment, the first heat sink 5 is a heat dissipation panel; in other embodiments, the first heat sink 5 can also be a heat dissipation block. The side of the first heat sink 5 away from the fixed panel 1 is installed on the outside of the cover plate 4, and the side of the first heat sink 5 away from the fixed panel 1 is provided with multiple heat dissipation units 6. In this embodiment, the heat dissipation units 6 are heat dissipation fins arranged in parallel intervals; in other embodiments, the heat dissipation units 6 can also be heat dissipation windows or heat dissipation cavities, or water-cooled heat dissipation channels. The first heat sink 5 is provided with multiple heat dissipation through holes 51. In this embodiment, the heat dissipation through holes 51 are rectangular through holes arranged in parallel intervals; in other embodiments, the heat dissipation through holes 51 can also be arc-shaped or other shaped through holes. The other side of the first heat sink 5 near the fixed panel 1 is provided with at least one corresponding opening 41 that contacts the electrical component 21. As a preferred embodiment, the side of the first heat sink 5 near the fixed panel 1 is provided with multiple mounting holes 52 and positioning posts 53, and the outside of the cover plate 4 is provided with multiple connecting holes and positioning grooves corresponding to the multiple mounting holes 52 and positioning posts 53.

[0038] In this embodiment, the heat-conducting structure includes a heat-conducting protrusion 7 installed on the other side of the heat dissipation panel near the fixed panel 1. This protrusion 7 extends from the heat dissipation panel outside the cover plate 4 into the opening 41 and extends towards the fixed panel 1 until it contacts the circuit board 2 and / or electrical component 21. Preferably, it is inserted into or welded to the heat dissipation panel via a snap-fit ​​structure, for contacting the electrical component 21 and conducting heat to the heat dissipation panel and heat dissipation fins. In a preferred embodiment, the heat-conducting structure further includes a plurality of heat-conducting elements 8 installed between the circuit board 2 and the heat dissipation panel. One end of each heat-conducting element 8 contacts the circuit board 2 and / or electrical component 21, and the other end contacts the heat dissipation panel, for enhancing the heat conduction effect between the electrical component 21 and the heat dissipation panel. In this embodiment, the heat-conducting element 8 is a thermally conductive silicone sheet filled, welded, or bonded between the circuit board 2, electrical component 21, and heat dissipation panel. In other embodiments, the thermally conductive silicone sheet can be replaced by other thermally conductive adhesives or metal heat-conducting elements 8.

[0039] In this embodiment, the middle frame 3 has an opening 31 on one side, and the middle frame 3 is provided with a plurality of ventilation holes 32. The ventilation holes 32 are preferably circular, but rectangular or other shapes can also be used. It also includes at least one second heat sink 9, which is installed at the opening 31 of the middle frame 3 and, together with the middle frame 3 and the fixed panel 1, forms the aforementioned internal accommodating space (i.e., the second heat sink 9 closes the opening 31 of the middle frame 3, essentially forming part of the hood and a side wall of the middle frame 3). The second heat sink 9 is a heat dissipation side plate. Alternatively, a heat sink can be used; the side of the second heat sink 9 away from the circuit board 2 (equivalent to an outer side of the hood or middle frame 3) is provided with multiple heat dissipation units 6 as described above, to enhance the heat dissipation effect of the hood in the lateral direction (i.e., the side perpendicular to the fixed panel 1 and the cover plate 4); the other side of the second heat sink 9 near the circuit board 2 is provided with multiple heat-conducting structures as described above, which extend from the second heat sink 9 toward the circuit board 2 until they contact the electrical component 21, so as to realize heat conduction from the electrical component 21 to the second heat sink 9 and its heat dissipation units 6. As a more preferred embodiment, multiple openings 31 are provided on multiple side walls of the middle frame 3, and multiple second heat sinks 9 are correspondingly provided to achieve heat dissipation effects in multiple directions (the direction of the cover plate 4 and multiple directions among the four side walls of the middle frame 3).

[0040] The present invention also provides a vehicle-mounted dual-spindle machine (not shown in the figure), which includes the above-mentioned heat dissipation structure for the entire electronic device.

[0041] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat dissipation structure for an electronic device, characterized in that, include: Fixed panel; A circuit board, mounted on the fixed panel, is equipped with multiple electrical components; The cover includes a middle frame and a cover plate. One end of the middle frame is mounted to the fixed panel, and the cover plate is mounted to the other end of the middle frame away from the fixed panel. The cover and the fixed panel form an internal accommodating space that covers the circuit board. A first heat sink is mounted on the outside of the cover plate on the side away from the fixed panel. The cover plate has at least one opening; The first heat sink has multiple heat dissipation units on the side away from the fixed panel; The first heat sink is provided with multiple heat dissipation holes, and the other side of the first heat sink near the fixed panel is provided with at least one heat-conducting structure corresponding to the opening and in contact with the electrical component; The middle frame has an open side and multiple ventilation holes; it also includes: At least one second heat dissipation element is located at the opening and closes the internal receiving space; The second heat sink has multiple heat sink units on the side away from the circuit board; The second heat sink has multiple heat-conducting structures on the other side near the circuit board; The first heat sink is a heat sink panel, the second heat sink is a heat sink side plate, and the heat sink unit is a heat sink fin. The thermally conductive structure includes: A heat-conducting boss is installed on the other side of the heat dissipation panel near the fixed panel. The heat-conducting boss extends into the opening and contacts the electrical component. Multiple heat-conducting components are installed between the circuit board and the heat dissipation panel. One end of each heat-conducting component is in contact with the circuit board and / or the electrical components, and the other end of each heat-conducting component extends out of the opening and is in contact with the heat dissipation panel.

2. The heat dissipation structure for the entire electronic device as described in claim 1, characterized in that: The thermally conductive component is a thermally conductive silicone sheet.

3. The overall heat dissipation structure of the electronic device as described in claim 1 or 2, characterized in that, The circuit board is a PCBA board, and the electrical components include a chip with a CPU.

4. The overall heat dissipation structure of the electronic device as described in claim 1 or 2, characterized in that, The fixed panel and the middle frame are made of aluminum alloy sheet metal parts.

5. The overall heat dissipation structure of the electronic device as described in claim 1 or 2, characterized in that, The fixed panel and the middle frame are covered with an insulating varnish layer.

6. A vehicle-mounted dual-spindle machine, characterized in that, Includes the overall heat dissipation structure of electronic devices as described in any one of claims 1-5.

Images