Bonding drive unit and flip chip bonder

Abstract

The present invention relates to a bonding drive device and a flip chip bonding machine. The bonding drive device includes a support platform, a first drive component, a rotary drive component and a holder. The rotary drive component is arranged on the support platform, and the first drive component is arranged on the rotary drive component. The first drive component includes a connecting shaft, and the connecting shaft is used to connect with the adapter shaft. The first drive component can drive the bonding head to approach or move away from the substrate along the first direction; the rotary drive component is connected to the first drive component to drive the first drive component to rotate with the first direction as the axis; the holder is arranged on the support platform, and a through hole for accommodating the adapter shaft and / or the connecting shaft is opened on the holder. The holder can form a high-pressure filling body in the through hole to keep the adapter shaft and the through hole concentric. The bonding drive device can facilitate high-precision bonding between the chip and the substrate. The flip chip bonding machine includes the above-mentioned bonding drive device, which can achieve high-precision bonding between the chip and the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a bonding drive device and a flip chip bonding machine. Background Art

[0002] The flip chip bonder (FCB) is a key piece of equipment in the back-end packaging and testing process of a flip chip production line. Its function is to complete the area array bump interconnection between the chip within the package and the substrate. Flip chip bonding is a packaging method in which the chip (the side with the IC circuitry) is bonded to the substrate with the front side facing down.

[0003] In the flip chip bonding machine in the prior art, the relative position accuracy between the chip and the substrate is low during bonding, making it difficult to achieve high-precision bonding between the chip and the substrate. Summary of the Invention

[0004] Based on this, it is necessary to provide a bonding drive device and a flip chip bonding machine to address the accuracy problem when bonding the chip to the substrate.

[0005] A bonding drive device is connected to the adapter shaft of the bonding head and is used to control the bonding head to approach or move away from the substrate. The bonding drive device includes a support platform, a first drive component, a rotation drive component and a retaining member. The rotation drive component is arranged on the support platform, and the first drive component is arranged on the rotation drive component. The first drive component includes a connecting shaft, and the connecting shaft is used to connect with the adapter shaft. The first drive component can drive the bonding head to approach or move away from the substrate along a first direction; the rotation drive component is connected to the first drive component and is used to drive the first drive component to rotate with the first direction as the axis; the retaining member is arranged on the support platform, and a through hole is opened on the retaining member for accommodating the adapter shaft and / or the connecting shaft. The retaining member can form a high-pressure filling body in the through hole to keep the adapter shaft and the through hole concentric.

[0006] In one embodiment, the adapter shaft is passed through the through hole, and there is a gap between the hole wall of the through hole and the adapter shaft. The retaining member can form a high-pressure filling body with uniform thickness arranged around the adapter shaft in the gap between the hole wall of the through hole and the adapter shaft.

[0007] In one embodiment, the first driving assembly includes a carrier and a first driving member provided on the carrier, the rotation driving assembly is connected to the carrier for driving the carrier to rotate, and the first driving member is connected to the connecting shaft for driving the bonding head to approach or move away from the substrate along a first direction.

[0008] In one embodiment, the first driving component further includes a rotating member sleeved on the connecting shaft, a first thread is provided on the side of the rotating member in contact with the connecting shaft, a second thread is provided on the connecting shaft to cooperate with the first thread, the first driving member is connected to the rotating member to drive the rotating member to rotate with the first direction as the axis, and the second thread is used to cooperate with the first thread when the rotating member rotates, so that the connecting shaft moves along the first direction.

[0009] In one embodiment, the through hole extends along the first direction, and the adapter shaft is coaxially connected to the connecting shaft.

[0010] In one embodiment, the first drive assembly further includes a coupling sleeved on the connecting shaft, the coupling is connected to the connecting shaft, and the coupling is further connected to the adapter shaft.

[0011] In one embodiment, the rotation drive assembly includes a DD motor disposed on the support platform, and the DD motor is connected to the carrier to drive the first drive assembly and the bonding head to rotate.

[0012] In one embodiment, the rotary drive assembly further includes a circular grating disposed on the support platform, and the DD motor is provided with at least two rotary reading heads spaced apart from each other, and the rotary reading heads cooperate with the circular grating to position the rotation of the first drive assembly.

[0013] In one embodiment, the high-pressure filling body is a high-pressure gas, and the retaining member can form a high-pressure air gap with a uniform thickness that surrounds the connecting shaft in the gap between the through-hole wall and the adapter shaft.

[0014] A flip chip bonding machine, comprising:

[0015] A bonding head, used for picking up a chip;

[0016] The bonding drive device as described in any one of the above embodiments, wherein the bonding drive device is connected to the bonding head to control the relative position of the chip and the substrate;

[0017] a second driving assembly connected to the bonding driving device and configured to drive the bonding driving device to move along a second direction;

[0018] a third driving assembly connected to the bonding driving device and configured to drive the bonding driving device to move along a third direction;

[0019] The first direction, the second direction and the third direction intersect with each other in pairs.

[0020] In one embodiment, the flip chip bonding machine further includes a carrier for carrying the substrate and the chip, a control device, and a visual inspection device provided on the carrier, wherein the visual inspection device is used to detect the relative position of the chip and the substrate, the visual inspection device is electrically connected to the control device to transmit the inspection result to the control device, and the control device is electrically connected to the rotation drive component, the first drive component, the second drive component, and the third drive component to control the relative position of the chip and the substrate.

[0021] The aforementioned bonding drive device, via a first drive assembly, can move the bond head toward or away from the substrate along a first direction. It is understood that the bond head is used to grasp and secure the chip. Thus, the first drive assembly can bring the chip closer to the substrate and bond it to the substrate.

[0022] Furthermore, since the rotary drive assembly can cause the first drive assembly to rotate about the first direction as the axis, the angular position between the chip and the substrate can be adjusted by the rotary drive assembly to further ensure that the chip and the substrate are accurately aligned, thereby ensuring that the bonding drive device can achieve high-precision bonding.

[0023] Furthermore, a high-pressure filler within the retaining element can maintain concentricity between the adapter shaft and the via hole. Thus, when the rotary drive assembly drives the bond head in the first direction, causing radial runout or a tendency for radial runout on the adapter shaft, the high-pressure filler can restore the adapter shaft to its pre-runout position. Alternatively, the high-pressure filler can prevent radial runout of the connecting shaft by providing high-pressure support. This further facilitates high-precision bonding between the chip and substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic axial view of a flip chip bonding machine provided in one embodiment;

[0025] Figure 2 for Figure 1 A schematic axial view of part of the structure of the flip chip bonding machine shown;

[0026] Figure 3 for Figure 1 A cross-sectional view of a bonding drive device in the flip chip bonding machine shown;

[0027] Figure 4 for Figure 1 An axial schematic diagram of another portion of the flip chip bonding machine shown;

[0028] Figure 5 This is a partial enlarged view of point A in Figure 2;

[0029] Figure 6 for Figure 3 Axial schematic diagram of the rotating parts and connecting shaft;

[0030] Figure 7 for Figure 2 A schematic diagram of the axial side of the third drive assembly;

[0031] Figure 8 for Figure 7 The diagram shows an axial schematic diagram of the linear motor stator and the linear motor mover in the third drive assembly.

[0032] Figure numerals: 10, flip chip bonding machine; 100, bonding drive device; 110, support table; 111, through hole; 120, rotation drive assembly; 121, DD motor; 130, first drive assembly; 131, first drive member; 132, connecting shaft; 132a, second thread; 133, rotating member; 134, coupling member; 136, carrier; 140, retaining member; 200, bonding head; 210, adapter shaft; 300, second drive assembly; 400, third drive assembly; 410, linear motor stator; 420, linear motor mover; 430, linear reading head; 440, cross roller guide; 500, carrier; 510, vibration isolator; 600, visual inspection device; 700, base; 20, substrate; 30, working surface. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0037] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] See Figure 1 , Figure 1An axial side schematic diagram of a flip chip bonding machine in one embodiment of the present invention is shown. The flip chip bonding machine 10 provided in one embodiment of the present invention is used to encapsulate a chip (not shown, the same below) and a substrate 20. The flip chip bonding machine 10 includes a bonding head 200, a bonding drive device 100 and a carrier 500. The chip and the substrate 20 are both arranged on the carrier 500. The bonding head 200 is used to pick up the chip. The bonding drive device 100 is connected to the bonding head 200 to control the relative position of the chip and the substrate 20 so that the chip can be encapsulated with the substrate 20 in the expected position. In this way, the accuracy of the bonding between the chip and the substrate 20 is ensured. The bonding drive device 100 can be specifically connected to the adapter shaft 210 of the bonding head 200 to control the bonding head 200 to approach or move away from the substrate 20.

[0040] See also Figure 2 and Figure 3 In one embodiment, the bonding drive device 100 includes a support platform 110, a first drive assembly 130, a rotation drive assembly 120, and a holder 140. The rotation drive assembly 120 is disposed on the support platform 110. The first drive assembly 130 is disposed on the rotation drive assembly 120. The first drive assembly 130 includes a connecting shaft 132. The connecting shaft 132 is used to connect to the adapter shaft 210. The first drive assembly 130 can drive the bonding head 200 to move closer to or away from the substrate 20 along a first direction. It can be understood that the first direction mentioned above refers to Figure 2 and Figure 3 The Z-axis of the bonding drive device 100 is configured to move the bond head 200 toward or away from the substrate 20 along a first direction via the first drive assembly 130. It is understood that the bond head 200 is used to grasp and secure the chip. Thus, the first drive assembly 130 can move the chip toward and bond it to the substrate 20.

[0041] The rotation drive assembly 120 is connected to the first drive assembly 130 to drive the first drive assembly 130 to rotate about a first axis. The rotation drive assembly 120 can adjust the angular position between the chip and the substrate 20 to further ensure accurate alignment of the chip and the substrate 20. This ensures that the bonding drive device 100 can achieve high-precision bonding.

[0042] The retaining member 140 is disposed on the support platform 110. A through hole 111 is defined in the retaining member 140 for accommodating the adapter shaft 210 and / or the connecting shaft 132. The retaining member 140 can form a high-pressure filler within the through hole 111 to maintain concentricity between the adapter shaft 210 and the through hole 111. This concentricity refers to the alignment of the central axis of the adapter shaft 210 with the central axis of the through hole 111. Thus, the high-pressure filler within the retaining member 140 can maintain concentricity between the adapter shaft 210 and the through hole 111. Consequently, when the rotary drive assembly 120 drives the bond head 200 in the first direction, causing radial runout or a tendency for radial runout to occur in the adapter shaft 210, the high-pressure filler can restore the adapter shaft 210 to its pre-radial runout position, or prevent radial runout of the adapter shaft 210 by providing high-pressure support. This further facilitates high-precision bonding between the chip and the substrate 20.

[0043] In the above embodiment, since the first drive assembly 130 is disposed on the rotary drive assembly 120, and the rotary drive assembly 120 is connected to the first drive assembly 130 to drive the first drive assembly 130 to rotate, it can drive the bond head 200 connected to the first drive assembly 130 and the chip grasped by the bond head 200. In other words, through the cooperation of the rotary drive assembly 120 and the first drive assembly 130, the bond drive device 100 can simultaneously move the chip along the first direction and rotate about the first direction.

[0044] And, combined with Figure 1 It can be understood that the movement of the bonding head 200 loaded with the chip along the first direction, that is, the movement of the bonding head 200 along the Z-axis, can bring the chip into contact with the substrate 20 and provide pressure for the bonding between the chip and the substrate 20. In other words, the movement of the chip in the Z-axis direction determines whether the chip can contact the substrate 20 and the pressure of the bonding between the chip and the substrate 20. In other words, during the bonding process between the chip and the substrate 20, the positional accuracy of the chip relative to the substrate 20 in the Z-axis direction has less influence on the bonding accuracy than the shaking of the chip relative to the substrate 20 around the Z-axis. In other words, compared with the shaking of the chip in the radial direction of the Z-axis, the former has less influence on the bonding accuracy between the chip and the substrate 20.

[0045] It is understandable that the rotary drive assembly 120 will inevitably cause the driven structure to produce radial shaking when it is rotating. If the first drive assembly 130 is arranged on the support table 110, the rotary drive assembly 120 is arranged on the first drive assembly 130, that is, the weight of the rotary drive assembly 120 and the bond head 200 is borne by the first drive assembly 130, and the rotary drive assembly 120 and the bond head 200 are driven to move in the Z-axis direction. When the rotary drive assembly 120 experiences radial shaking, since the source of the shaking is the rotary drive assembly 120 and the rotary drive assembly 120 is arranged on the first drive assembly 130, the shaking at this time is more difficult to control, and it is difficult to avoid the radial shaking from being transmitted to the chip.

[0046] In contrast to placing the rotary drive assembly 120 on the first drive assembly 130, in the above embodiment, the first drive assembly 130 is placed on the rotary drive assembly 120, and the rotary drive assembly 120 is placed on the support platform 110. Since the rotary drive assembly 120 is the source of radial wobble, placing the rotary drive assembly 120 on the support platform 110 can reduce radial wobble to a certain extent, thereby reducing the impact of radial wobble on chip position.

[0047] Furthermore, in conjunction with the above, since chip wobble in the Z-axis direction has less impact on the bonding accuracy between the chip and the substrate 20 than chip wobble in the radial direction of the Z-axis, by arranging the connection between the rotation drive assembly 120 and the first drive assembly 130 as described in the above embodiment, the overall accuracy of the bonding drive device 100 in controlling the chip position can be improved.

[0048] Furthermore, by placing the first drive assembly 130 on the rotary drive assembly 120, the factor affecting the position of the bond head 200 controlled by the bond drive device 100 is primarily the radial wobble of the rotary drive assembly 120. Thus, combined with the retaining and supporting function of the holder 140 on the adapter shaft 210, the impact of radial wobble on the chip position can be further reduced.

[0049] Please refer again Figure 1 and Figure 2In one embodiment, the flip chip bonding machine 10 further includes a second drive assembly 300, a third drive assembly 400, a visual inspection device 600 and a control device (not shown, the same below). The second drive assembly 300 is connected to the bonding drive device 100 for driving the bonding drive device 100 to move in the second direction. The third drive assembly 400 is connected to the bonding drive device 100 for driving the bonding drive device 100 to move in the third direction. The first direction, the second direction and the third direction intersect with each other in pairs. In this way, the bonding head 200 can reach any position within the travel range of the flip chip bonding machine 10 through the cooperation of the first drive assembly 130, the second drive assembly 300 and the third drive assembly 400, so that the chip can reach a suitable bonding position. Specifically, the first direction, the second direction and the third direction can also be arranged vertically in pairs to facilitate the control of the position of the bonding head 200.

[0050] Regarding the second and third directions mentioned above, see Figure 2 , the second direction mentioned above refers to Figure 2 X-axis direction; the third direction mentioned above refers to Figure 2 Center Y-axis direction.

[0051] Specifically, the bonding drive device 100 may be provided on the second drive assembly 300 , and the second drive assembly 300 may be provided on the third drive assembly 400 .

[0052] See also Figure 4 and combined Figure 1 In one embodiment, a visual inspection device 600 is provided on the carrier 500. The visual inspection device 600 is used to detect the relative position of the chip and the substrate 20. The visual inspection device 600 is electrically connected to the control device to transmit the inspection results to the control device. The control device is electrically connected to the rotation drive component 120, the first drive component 130, the second drive component 300 and the third drive component 400 to control the relative position of the chip and the substrate 20. It can be understood that the control device is capable of receiving the inspection results of the visual inspection device 600, that is, the control device is capable of obtaining information on the relative position of the chip and the substrate 20. In this way, the control device is capable of controlling the first drive component 130, the second drive component 300 and the third drive component 400 to control the position of the chip relative to the substrate 20. In addition, the control device is also capable of controlling the rotation drive component 120 so that the chip can be aligned with the substrate 20 in the direction of rotation around the Z axis. For the direction of rotation of the above-mentioned chip around the Z axis, refer to Figure 2 The angle θ in .

[0053] See also Figure 3 and combined Figure 5In one embodiment, the adapter shaft 210 is inserted into the through hole 111. A gap exists between the wall of the through hole 111 and the adapter shaft 210. The retaining member 140 can form a high-pressure filling body (not shown, the same below) disposed around the adapter shaft 210 within the gap between the wall of the through hole 111 and the adapter shaft 210, and having a uniform thickness. The above-mentioned uniform thickness means that the shortest distance between the side of the high-pressure filling body close to the wall of the through hole 111 and the side close to the adapter shaft 210 at any point is equal.

[0054] In the above embodiment, the high-pressure filling body has a uniform thickness. When the adapter shaft 210 has a tendency to wobble radially, the high-pressure filling body at a certain location has a tendency to reduce in thickness, and the pressure there will increase to resist the above tendency. In this way, when the adapter shaft 210 has a tendency to wobble radially, the high-pressure filling body can support the adapter shaft 210 so that the adapter shaft 210 remains concentric with the through hole 111. Moreover, when the adapter shaft 210 actually displaces in the radial direction, the adapter shaft 210 can also be quickly reset under the action of the high-pressure filling body. In other words, since the high-pressure filling body can maintain a uniform thickness, the adapter shaft 210 and the through hole 111 can remain concentric. The above-mentioned radial direction refers to the direction that intersects the Z axis on a plane perpendicular to the Z axis. Both the X axis and the Y axis can be understood as the radial direction.

[0055] It should be understood that in some embodiments, the connecting shaft 132 may be provided through the through hole 111. In this case, the retaining member 140 can form a high-pressure filling body with uniform thickness, surrounding the connecting shaft 132, between the wall of the through hole 111 and the connecting shaft 132. The support method of the high-pressure filling body is the same as in the above embodiment and will not be repeated here.

[0056] Similarly, in other embodiments, the connecting shaft 132 and the adapter shaft 210 may be both passed through the through hole 111 . In this case, the setting position and working principle of the high-pressure filling body are the same as those in the above embodiments and will not be repeated.

[0057] In one embodiment, the high-pressure filler is a high-pressure gas. The retaining member 140 is capable of forming a uniformly thick high-pressure air gap surrounding the adapter shaft 210 within the gap between the via hole 111 and the adapter shaft 210. This high-pressure gas maintains the adapter shaft 210 concentric with the via hole 111. It will be appreciated that in this embodiment, the retaining member 140 is an air-bearing sleeve.

[0058] In other embodiments, the high-pressure filling body may also be high-pressure oil or similar high-pressure filling body.

[0059] Please refer again Figure 3In one embodiment, the first drive assembly 130 includes a carrier 136 and a first drive member 131 disposed on the carrier 136. The rotation drive assembly 120 is connected to the carrier 136 to drive the carrier 136 to rotate. Because the first drive member 131 is connected to the bond head 200 via the connecting shaft 132 and is disposed on the carrier 136, the rotation drive assembly 120 can align the bond head 200 and the chip loaded on the bond head 200 with the substrate 20 at an angle θ via the carrier 136, the first drive member 131, and the connecting shaft 132.

[0060] See also Figure 3 and combined Figure 6 In one embodiment, the first drive assembly 130 further includes a rotating member 133 sleeved on the connecting shaft 132. A first thread is provided on the side of the rotating member 133 that contacts the connecting shaft 132 (not shown in the figure, the same below). A second thread 132a is provided on the connecting shaft 132 to cooperate with the first thread. The first driving member 131 is connected to the rotating member 133 to drive the rotating member 133 to rotate. The second thread 132a is used to cooperate with the first thread when the rotating member 133 rotates, so that the connecting shaft 132 moves along the first direction. It can be understood that the first thread is an internal thread structure, and the second thread 132a is an external thread structure that cooperates with the above-mentioned internal thread.

[0061] Furthermore, the through hole 111 extends along the first direction. The adapter shaft 210 is concentrically connected to the connecting shaft 132. In combination with the above embodiment, the high-pressure filler can maintain the adapter shaft 210 and the through hole 111 concentrically. Because the connecting shaft 132 and the adapter shaft 210 are concentrically connected, the retaining member 140 can maintain the connecting shaft 132 and the through hole 111 concentrically during movement of the connecting shaft 132. In other words, the retaining member 140 can guide the movement of the connecting shaft 132 to ensure that the connecting shaft 132 moves in the first direction.

[0062] It should be understood that other guiding structures may be provided as required to guide the movement of the connecting shaft 132 .

[0063] Specifically, the first driving member 131 is connected to the rotating member 133 and can drive the rotating member 133 to rotate. Since the connecting shaft 132 and the rotating member 133 are meshed and transmitted through the first thread and the second thread 132a, when the rotating member 133 rotates, it can drive the connecting shaft 132 to move along the first direction. It can be understood that the central axis of the connecting shaft 132 is parallel to the first direction, that is, the central axis of the connecting shaft 132 is parallel to the Z axis. The connecting shaft 132 can be, for example, a lead screw, and the rotating member 133 can be a ball spline. It can be understood that in this embodiment, the rotating member 133 as a ball spline is the active member, and the connecting shaft 132 as a lead screw is the driven member. Such a setting can not only reduce the installation space in the carrier 136, but also improve the accuracy of the movement of the first driving component 130 in the Z axis direction.

[0064] In some embodiments, the connecting shaft 132 can be set as the active member and the rotating member 133 as the driven member. In this case, the rotating member 133 can be connected to the adapter shaft 210 to drive the bond head to move. That is, the first driving member 131 is connected to the connecting shaft 132 to drive the connecting shaft 132 to rotate. When the connecting shaft 132 rotates, it can be engaged with the above-mentioned thread to make the rotating member 133 move along the first direction. It can be understood that in this embodiment, although the name of the rotating member 133 includes "rotation", the rotating member 133 is not actually used to directly drive the bond head 200 to rotate, but is used to drive the bond head 200 to move in the first direction.

[0065] See also Figure 5 and combined Figure 3 In one embodiment, the first drive assembly 130 further includes a coupling 134 sleeved on the connecting shaft 132. The coupling 134 is connected to the connecting shaft 132, and the coupling 134 is also connected to the adapter shaft 210. The coupling 134 is used to drive the adapter shaft 210 to move synchronously with the connecting shaft 132 when the connecting shaft 132 moves along the first direction. In other words, the coupling 134 is used to connect the connecting shaft 132 and the adapter shaft 210 so that the two move synchronously as a whole. With such a configuration, the connecting shaft 132 can drive the adapter shaft 210 to move up and down synchronously when moving along the first direction, thereby controlling the position of the bonding head 200 in the Z-axis direction and providing pressure when the chip is bonded to the substrate 20.

[0066] Furthermore, since the coupling 134 is sleeved on the connecting shaft 132 , the coupling 134 can guide the movement of the connecting shaft 132 , thereby further improving the movement accuracy of the bond head 200 in the Z-axis direction.

[0067] Furthermore, the connecting shaft 132, the coupling 134 and the adapter shaft 210 may be fixedly connected, that is, when the adapter shaft 210 moves, the three fixedly connected parts are synchronized as a whole, thereby reducing the error accumulation during the movement process.

[0068] The coupling 134 may be, for example, a coupling.

[0069] Please refer again Figure 3 In one embodiment, the rotation drive assembly 120 includes a DD motor 121 mounted on the support platform 110. The DD motor 121 is connected to the carrier 136 to drive the first drive assembly 130 and the bond head 200 to rotate. It is understood that the DD motor 121 can directly drive the carrier 136 to move. This avoids the accumulation of errors during transmission using gear drives, belt drives, and other transmission methods, thereby preventing such accumulated errors from affecting the accuracy of the bond drive device 100 in controlling the chip position.

[0070] In one embodiment, the rotary drive assembly 120 further includes a circular grating (not shown, the same below) mounted on the support platform 110. The DD motor 121 is provided with at least two spaced apart rotary reading heads (not shown, the same below). The rotary reading heads cooperate with the circular grating to position the rotation of the first drive assembly 130.

[0071] For ease of explanation, the following example uses two rotating reading heads. It should be understood that the same principle applies when there are multiple rotating reading heads. Since the DD motor 121 is equipped with two spaced-apart rotating reading heads, the two rotating reading heads coordinate to obtain two different sets of data regarding the rotor rotation of the DD motor 121. This allows the two sets of data to be compared and processed using a built-in algorithm. This prevents the effects of misalignment between the adapter shaft 210 and the rotor during rotor rotation, thereby achieving higher absolute positioning accuracy.

[0072] See also Figure 7 and Figure 8 In one embodiment, the third drive assembly 400 includes a linear motor stator 410, a linear motor mover 420 that slidably engages with the linear motor stator 410, a linear readhead 430, and a grating scale. The second drive assembly 300 is disposed on the linear motor mover 420. The linear motor mover 420 can move along the linear motor stator 410 in the third direction, that is, the linear motor mover 420 can move along the linear motor stator 410 in the Y-axis direction. The linear readhead 430 is disposed on the linear motor mover 420 and, in conjunction with the grating scale, can determine the relative position of the linear motor mover 420.

[0073] Furthermore, the third drive assembly 400 includes a cross-roller guide 440 extending in the same direction as the third direction. The cross-roller guide 440 ensures that the second drive assembly 300 and the structure it supports can accurately move in the third direction. It is understood that movement in the third direction is a short-stroke movement, and the relatively short length of the cross-roller guide 440 provides high linearity, thereby ensuring high absolute positioning accuracy for the bond head 200 in the third direction.

[0074] It should be understood that the second drive assembly 300 also has a similar structural design to the third drive assembly 400. Specifically, the second drive assembly 300 also includes a linear motor stator 410, a linear motor mover 420 that slides with the linear motor stator 410, a cross-roller guide 440, a linear readhead 430, and a grating scale. The location and connection relationship of the relevant components of the second drive assembly 300 are similar to those of the third drive assembly 400 and will not be further described here.

[0075] See also Figure 4 In one embodiment, the carrier 500 is mounted on a base 700, with a vibration isolator 510 positioned between the base and the working surface 30 of the carrier 700. The vibration isolator 510 is used to reduce the impact of external vibrations, thereby improving the accuracy of chip bonding. The working surface 30 can be the ground or other surface of the supporting platform.

[0076] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A bonding drive device connected to a transfer shaft of a bonding head for controlling the bonding head to approach or move away from a substrate, characterized in that: The bonding drive device includes a support platform, a first drive assembly, a rotation drive assembly, and a holder. The rotation drive assembly is arranged on the support platform. The first drive assembly is arranged on the rotation drive assembly. The first drive assembly includes a connecting shaft, which is used to connect with the adapter shaft. The first drive assembly can drive the bond head to move closer to or away from the substrate along a first direction. The rotary drive assembly is connected to the first drive assembly and is used to drive the first drive assembly to rotate with the first direction as the axis; The retaining member is arranged on the support platform, and is provided with a through hole for accommodating the adapter shaft and / or the connecting shaft. The retaining member can form a high-pressure filling body in the through hole to keep the adapter shaft and the through hole concentric; Among them, the first driving component also includes a carrier and a first driving member arranged on the carrier, the rotation driving component is connected to the carrier to drive the carrier to rotate, and the first driving member is connected to the connecting shaft to drive the bonding head to approach or move away from the substrate along the first direction.

2. The bonding drive device according to claim 1, wherein: The adapter shaft passes through the through hole, and there is a gap between the hole wall of the through hole and the adapter shaft. The retaining member can form a high-pressure filling body with uniform thickness surrounding the adapter shaft in the gap between the hole wall and the adapter shaft.

3. The bonding drive device according to claim 1, wherein: The first driving component also includes a rotating member sleeved on the connecting shaft, a first thread is provided on the side of the rotating member in contact with the connecting shaft, and a second thread is provided on the connecting shaft to cooperate with the first thread. The first driving member is connected to the rotating member to drive the rotating member to rotate with the first direction as the axis, and the second thread is used to cooperate with the first thread when the rotating member rotates, so that the connecting shaft moves along the first direction.

4. The bonding drive device according to claim 3, characterized in that: The connecting shaft is configured as a lead screw, and the rotating member is configured as a ball spline.

5. The bonding drive device according to claim 3, characterized in that: The through hole extends along the first direction, and the adapter shaft is coaxially connected to the connecting shaft.

6. The bonding drive device according to claim 4, characterized in that: The first drive assembly further includes a coupling sleeved on the connecting shaft, the coupling is connected to the connecting shaft, and the coupling is also connected to the adapter shaft.

7. The bonding drive device according to claim 3, characterized in that: The rotation drive assembly includes a DD motor disposed on the support platform. The DD motor is connected to the carrier and is used to drive the first drive assembly and the bonding head to rotate.

8. The bonding drive device according to claim 7, characterized in that: The rotary drive assembly also includes a circular grating arranged on the support platform. The DD motor is provided with at least two rotary reading heads arranged at intervals. The rotary reading heads cooperate with the circular grating to position the rotation of the first drive assembly.

9. The bonding drive device according to claim 2, wherein: The high-pressure filling body is a high-pressure gas, and the retaining member can form a high-pressure air gap that is arranged around the connecting shaft and has a uniform thickness in the gap between the through-hole wall and the adapter shaft.

10. A flip chip bonding machine, characterized in that: The flip chip bonding machine comprises: A bonding head, used for picking up a chip; The bonding drive device according to any one of claims 1 to 9, wherein the bonding drive device is connected to the bonding head to control the relative position of the chip and the substrate; a second driving assembly connected to the bonding driving device and configured to drive the bonding driving device to move along a second direction; a third driving assembly connected to the bonding driving device and configured to drive the bonding driving device to move along a third direction; The first direction, the second direction and the third direction intersect with each other in pairs.

11. The flip chip bonding machine according to claim 10, wherein: The flip chip bonding machine also includes a carrier for carrying the substrate and the chip, a control device and a visual inspection device arranged on the carrier, the visual inspection device is used to detect the relative position of the chip and the substrate, the visual inspection device is electrically connected to the control device to transmit the inspection result to the control device, and the control device is electrically connected to the rotation drive component, the first drive component, the second drive component and the third drive component to control the relative position of the chip and the substrate.

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