A thin film type thermal conductive material with vertical filament arrangement and preparation method thereof

Abstract

The invention discloses a thin film type thermal conductive material with vertical filament arrangement and a preparation method thereof, the method comprising the following steps: step S1: using laser cutting to cut a first piece of thin film material into a thin film hollow material with a strip-shaped pattern; step S2: spraying an adhesive material on the thin film hollow material, aligning a second piece of the cut thin film hollow material and stacking it on the first thin film hollow material, performing the thin film material laser cutting-spraying adhesive material-aligning and stacking operations repeatedly until the stacking reaches a desired height and solidifies to obtain a stacked thin film hollow material; step S3: using a multi-wire cutting machine to longitudinally cut the thin film stacked thin film hollow material to obtain the thin film after cutting.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal conductive materials, and in particular to a thin film thermal conductive material with vertical filament arrangement and a preparation method thereof. Background Art

[0002] At present, it is common to see products that use a lot of two-dimensional thin film materials for heat dissipation and heat transfer. The horizontal thermal conductivity of these thin film materials is generally high. During the heat conduction process, the horizontal direction can quickly transfer the heat, but the vertical direction will hinder the heat transfer, which makes the heat transfer have certain obstacles. But in fact, the thermal conductivity in the vertical direction is also very important. It can enable the heat on the chip to be quickly transferred to the heat dissipation components or the housing in the vertical direction to prevent heat concentration.

[0003] In addition, in the preparation of some components, these thin film materials are also required to be arranged in a vertical filamentary shape. Therefore, for thin film thermal conductive materials, how to prepare a structure with a vertical filamentary arrangement and good thermal conductivity is particularly critical. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a thin film type thermal conductive material arranged in a vertical filament shape, such as Figure 4 As shown, it is obtained by stacking at least two layers of thin film hollow materials 1 with strip patterns; an adhesive material 2 is provided between the thin film hollow materials 1.

[0005] In some embodiments, the aspect ratio of the strip-shaped pattern is (70-80):1; preferably, the aspect ratio of the strip-shaped pattern is 75:1.

[0006] In some embodiments, the spacing distance between the strip-shaped patterns is 0.2-0.4 mm; preferably, the spacing distance between the strip-shaped patterns is 0.3 mm.

[0007] The applicant found in the experiment that the prepared thin film type thermal conductive material with vertical filament arrangement can greatly reduce its thermal resistance in the vertical direction, especially when the thin film material is cut into a thin film hollow material with a strip pattern, the aspect ratio of the strip pattern is limited to (70-80): 1, and the spacing between the strip patterns is 0.2-0.4 mm. The thermal resistance of the prepared thin film type thermal conductive material in both the horizontal and vertical directions is small, which can be reduced to 0.2 cm 2 K / W, it is speculated that the reason may be that a higher thermal conductivity orientation can be formed at this time.

[0008] In some embodiments, the thickness of the adhesive material is 30 to 50 um; preferably, the thickness of the adhesive material is 35 to 45 um; more preferably, the thickness of the adhesive material is 40 um.

[0009] In some embodiments, the bonding material is selected from one or a combination of polytetrafluoroethylene rubber, silicone rubber, and nitrile rubber.

[0010] In some preferred embodiments, the bonding material is silicone rubber.

[0011] In some more preferred embodiments, the silicone rubber is Platinum catalyzed silicone rubber, selected from 00-10, 00-20, 00-30 00-35, 00-50, 5. One or a combination of GEL.

[0012] In some preferred embodiments, the silicone rubber is 00-20, purchased from Smooth-On, Inc.

[0013] The applicant found that the The 00-20 adhesive material is not only conducive to the stacking of thin film hollow materials, but also does not affect the thermal conductivity of the material.

[0014] A second aspect of the present invention provides a method for preparing a thin film type thermal conductive material with vertical filament arrangement, comprising the following steps:

[0015] Step S1: using laser cutting to cut the first film material into a film hollow material with strip patterns;

[0016] Step S2: spraying adhesive material on the thin film hollow material, aligning and stacking the second cut thin film hollow material on the first thin film hollow material, and repeating the thin film material laser cutting-spraying adhesive material-aligning and stacking operations until the stacking reaches the required height and solidifies to obtain a stacked thin film hollow material;

[0017] Step S3: Use a multi-wire cutting machine to longitudinally cut the thin film stacked thin film hollow material to obtain the hollow material after cutting.

[0018] In some preferred embodiments, the method for preparing the vertically filamentarily arranged thin film thermally conductive material comprises the following steps:

[0019] Step S1: Using laser cutting, the first film material is cut into a film hollow material with strip patterns, such as Figure 2 As shown;

[0020] Step S2: spraying adhesive material on the thin film hollow material, aligning and stacking the second cut thin film hollow material on the first thin film hollow material, repeating the thin film material laser cutting-spraying adhesive material-aligning and stacking operations until the stacking reaches the required height, and placing at room temperature for 8 to 10 hours to solidify, thereby obtaining a stacked thin film hollow material;

[0021] Step S3: Use a diamond wire multi-wire cutting machine to longitudinally cut the thin film stacked thin film hollow material, and control the thickness of the cut stacked thin film hollow material by adjusting the diamond wire spacing, and obtain the obtained product after cutting, such as Figure 3 , 4 shown.

[0022] In some embodiments, the film material in step S1 is a film-type thermal conductive material, including but not limited to natural graphite sheets, super conductive graphite sheets, composite graphite sheets, carbon fibers, etc. Figure 1 shown.

[0023] In some preferred embodiments, the thin film material in step S1 is a graphite sheet.

[0024] The graphite sheet can be purchased commercially, including but not limited to LD-RG017 purchased from Foshan Xinshi Intelligent Technology Co., Ltd.

[0025] In some embodiments, the height of the stacked thin film hollow material in step S3 is 3 to 5 cm; preferably, the thickness of the stacked thin film hollow material in step S3 is 4 cm.

[0026] In some embodiments, the longitudinal cutting distance of the multi-wire cutting machine in step S3 is 0.35 to 2 mm; preferably, the longitudinal cutting distance of the multi-wire cutting machine in step S3 is 1.2 mm. Beneficial effect: The present invention provides a thin film type thermal conductive material with vertical filament arrangement and a preparation method thereof, which is obtained by stacking at least two layers of thin film hollow materials with strip patterns. By limiting the aspect ratio of the strip patterns and the spacing distance between the strip patterns, the prepared thin film type thermal conductive material has a small thermal resistance in the horizontal and vertical directions, which can be reduced to 0.2 cm 2 K / W, can be arranged in vertical filaments in new components, and has excellent thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the structure of the film material;

[0028] Figure 2 It is a schematic diagram of the structure of a thin film hollow material with a strip-shaped pattern;

[0029] Figure 3 A schematic diagram of the structure of a thin film hollowing material with longitudinally cut thin films stacked;

[0030] Figure 4 A schematic diagram of the structure of a thin film type thermal conductive material arranged in vertical filaments;

[0031] Figure numerals: 1 thin film hollow material, 2 adhesive material, 3 longitudinal cutting direction. DETAILED DESCRIPTION

[0032] Example 1

[0033] The present embodiment 1 provides a thin film type thermal conductive material with vertical filament arrangement, which is obtained by stacking at least two layers of thin film hollow materials with strip patterns; an adhesive material is provided between the thin film hollow materials.

[0034] The aspect ratio of the strip pattern is 75:1.

[0035] The spacing distance between the strip patterns is 0.3 mm.

[0036] The thickness of the bonding material is 40 um.

[0037] The bonding material is 00-20, purchased from Smooth-On, Inc.

[0038] The method for preparing a thin film type thermal conductive material with vertical filament arrangement comprises the following steps:

[0039] Step S1: using laser cutting to cut the first film material into a film hollow material with strip patterns;

[0040] Step S2: spraying adhesive material on the thin film hollow material, aligning and stacking the second cut thin film hollow material on the first thin film hollow material, and repeating the thin film material laser cutting-spraying adhesive material-aligning and stacking operations until the stacking reaches the required height, and placing at room temperature for 9 hours to solidify, thereby obtaining a stacked thin film hollow material;

[0041] Step S3: Use a diamond wire multi-wire cutting machine to longitudinally cut the thin film stacked thin film hollow material, and control the thickness of the cut stacked thin film hollow material by adjusting the diamond wire spacing to obtain the product after cutting.

[0042] The film material in step S1 is a graphite sheet, which is purchased from Foshan Xinshi Intelligent Technology Co., Ltd. (LD-RG017).

[0043] The thickness of the stacked thin film hollow material in step S3 is 4 cm.

[0044] In step S3, the longitudinal cutting distance of the multi-wire saw is 1.2 mm.

[0045] Example 2

[0046] This embodiment 2 provides a method for preparing a thin film type thermal conductive material with vertical filament arrangement, and its specific implementation method is the same as that of embodiment 1, except that the aspect ratio of the strip pattern is 70:1; the spacing distance between the strip patterns is 0.2mm; the thickness of the adhesive material is 30um; the thickness of the stacked thin film hollow material in step S3 is 3cm; and the longitudinal cutting distance of the multi-wire cutting machine in step S3 is 0.35mm.

[0047] Example 3

[0048] This embodiment 3 provides a method for preparing a thin film type thermal conductive material with vertical filament arrangement. Its specific implementation method is the same as that of embodiment 1, except that the aspect ratio of the strip pattern is 80:1; the spacing distance between the strip patterns is 0.4mm; the thickness of the adhesive material is 50um; the thickness of the stacked thin film hollow material in step S3 is 5cm; and the longitudinal cutting distance of the multi-wire cutting machine in step S3 is 2mm.

[0049] Example 4

[0050] This embodiment 4 provides a method for preparing a thin-film thermally conductive material with vertical filamentary arrangement. The specific implementation method is the same as that of embodiment 1, except that the aspect ratio of the strip pattern is 100:1.

[0051] Example 5

[0052] This embodiment 5 provides a method for preparing a thin film type thermal conductive material with vertical filament arrangement. The specific implementation method is the same as that of embodiment 1, except that the spacing distance between the strip patterns is 0.1 mm.

[0053] Example 6

[0054] This embodiment 6 provides a method for preparing a thin film type thermal conductive material with vertical filament arrangement. The specific implementation method is the same as that of embodiment 1, except that the spacing distance between the strip patterns is 0.8 mm.

[0055] Performance Testing

[0056] Longitudinal thermal resistance test

[0057] The test method is the steady-state heat flow method, referring to the test standard for thermal conductivity of solid electrical insulation materials (thin) (ASTMD5470-2006), and the DRL-Ⅲ thermal conductivity tester manufactured by Xiangtan Instrument Co., Ltd. is used for measurement. The unit is cm 2 K / W.

[0058] Table 1

[0059]

Claims

1. A thin film type thermal conductive material arranged in vertical filaments, characterized in that: It is obtained by stacking at least two layers of thin film hollow materials with strip-shaped patterns; adhesive material is provided between the thin film hollow materials; The aspect ratio of the strip pattern is 70:1; The spacing between the strip patterns is 0.2 mm; The thickness of the bonding material is 30um; The bonding material is Ecoflex® 00-20; The method for preparing a thin film type thermal conductive material with vertical filament arrangement comprises the following steps: Step S1: using laser cutting to cut the first film material into a film hollow material with strip patterns; Step S2: spraying adhesive material on the thin film hollow material, aligning and stacking the second cut thin film hollow material on the first thin film hollow material, and repeating the thin film material laser cutting-spraying adhesive material-aligning and stacking operations until the stacking reaches the required height, and placing at room temperature for 9 hours to solidify, thereby obtaining a stacked thin film hollow material; Step S3: using a diamond wire multi-wire cutting machine to longitudinally cut the thin film stacked thin film hollow material, and controlling the thickness of the cut stacked thin film hollow material by adjusting the diamond wire spacing, and obtaining the obtained material after cutting; The film material in step S1 is a graphite sheet; The height of the stacked thin film hollow material in step S3 is 3 cm; In step S3, the longitudinal cutting distance of the multi-wire cutting machine is 0.35 mm.

Images