Chip positioning device and method of use
The combined structure of the reference positioning mechanism and the movable positioning arm solves the problems of large size, heavy weight and complicated operation of existing chip positioning devices, and realizes accurate positioning and flexible installation of chips.
Patent Information
- Application Number
- CN202210730353.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-24
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2042-06-24
AI Technical Summary
Existing chip positioning devices are large in size, heavy in weight, high in cost, difficult to move flexibly, and complicated to operate, making it difficult to achieve precise positioning.
A compact and lightweight chip positioning device was designed, which adopts a combined structure of a reference positioning mechanism, a movable positioning block and a movable positioning arm. The chip can be precisely positioned through the guide side and the positioning knob, which simplifies the installation process.
The precise positioning of the chip is achieved. The device is small in size, light in weight, easy to maneuver, and simple to operate. It reduces the requirements for the installation environment and improves the accuracy and flexibility of positioning.
Smart Images

Figure CN114980561B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of chip testing technology, and in particular to a chip positioning device and a method for using the same. Background Art
[0002] In the early stages of chip mass production, chip parameters need to be tested. During this testing, different CPU chips must be replaced on the same motherboard to ensure consistency in the peripheral hardware environment. Later, when the motherboard is repaired, abnormal CPU chips must also be replaced. This often presents difficulties in soldering and positioning when replacing CPUs.
[0003] Prior art typically utilizes large, dedicated rework stations for chip positioning. These stations utilize optical positioning and projection to adjust the alignment errors between the CPU chip and the motherboard, enabling the placement of the CPU chip. However, these rework stations are large and heavy, making them difficult to maneuver and expensive. Furthermore, they require a high installation space and require multiple optical positioning adjustments, making operation cumbersome. Summary of the Invention
[0004] The objects of the present invention include, for example, providing a chip positioning device which is compact, lightweight, requires a small installation space, has good maneuverability, a simple structure, is easy to operate, and can ensure accurate positioning of the chip.
[0005] The embodiments of the present invention can be implemented as follows:
[0006] In a first aspect, the present invention provides a chip positioning device, comprising:
[0007] A reference positioning mechanism, used for detachably positioning and assembling on the mainboard;
[0008] A movable positioning block is provided with a guide side for contacting the edge of the chip;
[0009] A movable positioning arm, wherein both ends of the movable positioning arm are respectively connected to the reference positioning mechanism and the movable positioning block;
[0010] In which, the movable positioning arm has a switchable locking state and unlocking state, and the movable positioning arm is used to adjust the relative position between the movable positioning block and the reference positioning mechanism in the unlocking state, and fix the movable positioning block and the reference positioning mechanism in the locking state, and the guide side is used to align with the edge of the mounting silk screen on the mainboard, so that the chip is aligned along the guide side and attached to the mounting silk screen.
[0011] The present invention provides a chip positioning device that guides the chip by providing a movable positioning block. A reference positioning mechanism and a movable positioning arm are used to adjust and fix the relative position of the movable positioning block. This simplifies the installation and positioning structure, creating a simple CPU chip mounting platform. During placement, the chip can be accurately aligned and attached to the placement screen along the guiding side of the movable positioning block, achieving accurate chip placement. Compared to existing technologies, the chip positioning device provided by the present invention is compact, lightweight, requires minimal installation space, offers excellent maneuverability, is simple in structure, and is easy to operate, while ensuring precise chip positioning.
[0012] In an optional embodiment, the guide side edge includes a first guide edge and a second guide edge that are adjacent to each other, and the first guide edge and the second guide edge are respectively used to conflict with adjacent side edges on the chip.
[0013] The chip positioning device provided by the present invention realizes the limitation of the chip in at least two dimensions by providing the first guide edge and the second guide edge, thereby further ensuring the accuracy during the chip mounting process.
[0014] In an optional embodiment, the movable positioning block is L-shaped, and the first guide edge and the second guide edge are arranged at a right angle.
[0015] The chip positioning device provided by the present invention provides an L-shaped movable positioning block so that the first guide edge and the second guide edge are arranged at right angles, which is more suitable for conventional rectangular CPU chips, making the CPU chip mounting process more convenient and accurate.
[0016] In an optional embodiment, a first positioning knob and a second positioning knob are respectively provided at both ends of the movable positioning arm, and the first positioning knob is detachably connected to the reference positioning mechanism for fixing the movable positioning arm and the reference positioning mechanism in a tightened state, and the second positioning knob is detachably connected to the movable positioning block for fixing the movable positioning arm and the movable positioning block in a tightened state.
[0017] The chip positioning device provided by the present invention realizes the position adjustment of the movable positioning block by setting the structure of the movable positioning arm and the positioning knob, thereby enabling manual adjustment and avoiding a complex power supply environment. The operation is simple and only the positioning knob needs to be manually tightened or loosened, making the adjustment process very convenient.
[0018] In an optional embodiment, a slide hole is provided on the movable positioning arm, and the first positioning knob and / or the second positioning knob is passed through the slide hole so that the first positioning knob and / or the second positioning knob can slide freely along the slide hole when loosened.
[0019] The chip positioning device provided by the present invention provides a slide hole so that the movable positioning arm will not fall out when the positioning knob is loosened, thereby ensuring a relatively loose adjustment scale while also achieving rapid positioning.
[0020] In an optional embodiment, there are two movable positioning arms, and the two movable positioning arms include a first screw micrometer and a second screw micrometer, one end of the first screw micrometer is connected to the reference positioning mechanism, and the other end is connected to the movable positioning block, for adjusting the position of the movable positioning block along a first direction; one end of the second screw micrometer is connected to the reference positioning mechanism, and the other end is connected to the movable positioning block, for adjusting the position of the movable positioning block along a second direction, wherein the first direction and the second direction are perpendicular to each other.
[0021] The chip positioning device provided by the present invention realizes position adjustment of the movable positioning block through a spiral micrometer structure, which can improve the accuracy of adjustment and thus further improve the chip mounting accuracy.
[0022] In an optional embodiment, the reference positioning mechanism or the movable positioning block is provided with a first slide groove arranged along the first direction and a second slide groove arranged along the second direction, the end of the first screw micrometer is slidably set in the second slide groove, and the end of the second screw micrometer is slidably set in the first slide groove.
[0023] The chip positioning device provided by the present invention, by providing the first slide groove and the second slide groove, does not interfere with each other when adjusting the first direction and the second direction, thereby ensuring the reliability and accuracy of the adjustment.
[0024] In an optional embodiment, the movable positioning block is further provided with scale marks, which are distributed correspondingly along the guide side edges and are used to mark the size of the portion of the chip that interferes with the guide side edges.
[0025] The chip positioning device provided by the present invention can accurately control the alignment process by setting scale marks, thereby further improving positioning accuracy.
[0026] In an optional embodiment, the reference positioning mechanism includes a first positioning block, a second positioning block and a third positioning block arranged at intervals, the first positioning block is connected to the second positioning block, the second positioning block is connected to the third positioning block, the movable positioning arm is connected to the second positioning block, and the first positioning block, the second positioning block and the third positioning block are arranged in a triangle and are positioned and assembled on the main board.
[0027] The chip positioning device provided by the present invention realizes three-point positioning by means of the first positioning block, the second positioning block and the third positioning block arranged in a triangular shape, thereby ensuring the reliability of the reference, thereby ensuring the fixation reliability of the mobile positioning block, and further improving the positioning accuracy.
[0028] In an optional embodiment, the bottoms of the first positioning block, the second positioning block, and the third positioning block are all provided with positioning bosses, and the positioning bosses are used to align and assemble with the fan positioning holes on the mainboard.
[0029] The chip positioning device provided by the present invention realizes positioning by directly aligning the positioning boss with the fan positioning hole, thereby avoiding additional drilling on the mainboard, ensuring the integrity of the mainboard structure, and achieving a better positioning effect.
[0030] In an optional embodiment, a first distance adjustment component is provided between the first positioning block and the second positioning block, and the first distance adjustment component is connected to both the first positioning block and the second positioning block for adjusting the distance between the first positioning block and the second positioning block;
[0031] A second distance adjustment component is further provided between the second positioning block and the third positioning block. The second distance adjustment component is connected to both the second positioning block and the third positioning block for adjusting the distance between the second positioning block and the third positioning block.
[0032] The chip positioning device provided by the present invention, by providing a distance adjustment component, allows the relative distances between the first positioning block, the second positioning block and the third positioning block to be adjusted, thereby enabling the chip positioning device to be suitable for different motherboards, and adaptively adjusting the relative positions between the three positioning blocks according to the sizes of various structures on the motherboard, thereby improving the applicability of the chip positioning device.
[0033] In an optional embodiment, the first distance adjustment assembly includes a first adjustment arm, a first adjustment knob, and a second adjustment knob, the first adjustment arm is arranged between the first positioning block and the second positioning block, the first adjustment knob and the second adjustment knob are both arranged on the first adjustment arm, and the first adjustment knob is detachably connected to the first positioning block for fixing the first adjustment arm and the first positioning block in a tightened state, and the second adjustment knob is detachably connected to the second positioning block for fixing the second adjustment arm and the second positioning block in a tightened state;
[0034] The second distance adjustment assembly includes a second adjustment arm, a third adjustment knob and a fourth adjustment knob. The second adjustment arm is arranged between the second positioning block and the third positioning block. The third adjustment knob and the fourth adjustment knob are both arranged on the second adjustment arm, and the third adjustment knob is detachably connected to the second positioning block for fixing the second adjustment arm and the second positioning block in a tightened state. The fourth adjustment knob is detachably connected to the third positioning block for fixing the second adjustment arm and the third positioning block in a tightened state.
[0035] The chip positioning device provided by the present invention realizes position adjustment by setting an adjustment arm and an adjustment knob, has good reliability, can be manually adjusted, avoids a complex power supply environment, and is simple to operate. The positioning knob can be manually tightened or loosened, making the adjustment process very convenient.
[0036] In an optional embodiment, a first adjustment sliding hole is provided on the first adjustment arm, and the first adjustment knob and / or the second adjustment knob is inserted into the first adjustment sliding hole;
[0037] The second adjustment arm is provided with a second adjustment sliding hole, and the third adjustment knob and / or the fourth adjustment knob are inserted into the second adjustment sliding hole.
[0038] The chip positioning device provided by the present invention plays a role in limiting the position of the adjusting knob in the loosened state by providing the adjusting sliding hole, thereby achieving adjustment while also preventing the knob from falling off the adjusting arm.
[0039] In a second aspect, an embodiment of the present invention provides a method for using a chip positioning device, which is applicable to the aforementioned chip positioning device, and the method includes:
[0040] Positioning and assembling the reference positioning mechanism on the main board;
[0041] Adjusting the movable positioning arm to an unlocked state;
[0042] Adjust the position of the movable positioning block according to the mounting screen on the mainboard so that the guide side of the movable positioning block is aligned with the edge of the mounting screen;
[0043] Adjusting the movable positioning arm to a locked state;
[0044] Align the chip along the guide side and attach it to the mounting screen. BRIEF DESCRIPTION OF THE DRAWINGS
[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.
[0046] Figure 1 A schematic structural diagram of a chip positioning device provided by a first embodiment of the present invention at a first viewing angle;
[0047] Figure 2 A schematic structural diagram of the chip positioning device provided by the first embodiment of the present invention at a second viewing angle;
[0048] Figure 3 A schematic structural diagram of the chip positioning device provided by the first embodiment of the present invention from a third viewing angle;
[0049] Figure 4 A schematic structural diagram of the chip positioning device provided by the first embodiment of the present invention at a fourth viewing angle;
[0050] Figure 5 This is a schematic structural diagram of a chip positioning device provided by the second embodiment of the present invention.
[0051] Icons: 100-chip positioning device; 110-reference positioning mechanism; 111-first positioning block; 113-second positioning block; 115-third positioning block; 117-positioning boss; 130-movable positioning block; 131-guide side; 133-first guide side; 135-second guide side; 137-first slide groove; 139-second slide groove; 150-movable positioning arm; 151-first positioning knob; 153-second positioning knob; 155-slide hole; 157-first micrometer screw; 159-second micrometer screw; 170-first distance adjustment assembly; 171-first adjustment arm; 173-first adjustment knob; 175-second adjustment knob; 177-first adjustment slide hole; 190-second distance adjustment assembly; 191-second adjustment arm; 193-third adjustment knob; 195-fourth adjustment knob; 197-second adjustment slide hole. DETAILED DESCRIPTION
[0052] The technical solutions in the embodiments of the present invention will be described below in conjunction with the accompanying drawings of the embodiments of the present invention. Generally, the components of the embodiments of the present invention described and shown in the accompanying drawings can be arranged and designed in various different configurations.
[0053] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.
[0054] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.
[0055] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the product of the invention is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.
[0056] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.
[0057] As disclosed in the background, conventional chip positioning typically utilizes a large, dedicated rework station. This optical positioning system adjusts the CPU and motherboard soldering alignment errors based on the distance between the optical projections, enabling the placement of the CPU chip. However, this technology has several drawbacks: 1. The device is large, heavy, and costly, making it difficult to maneuver; 2. It requires a specific three-voltage power supply, placing strict demands on the installation site; and 3. It requires multiple optical positioning adjustments, making operation cumbersome.
[0058] In order to solve the above problems, the present invention provides a novel chip positioning device and method of use. It should be noted that the features in the embodiments of the present invention can be combined with each other without conflict.
[0059] See also Figures 1 to 4 This embodiment provides a chip positioning device 100, which is compact, lightweight, requires a small installation space, has good maneuverability, a simple structure, is easy to operate, and can ensure accurate positioning of the chip.
[0060] The chip positioning device 100 provided in this embodiment is used to align and fit the chip on the mainboard, and includes a reference positioning mechanism 110, a movable positioning block 130 and a movable positioning arm 150. The reference positioning mechanism 110 is used to be detachably positioned and assembled on the mainboard to achieve reference positioning. The movable positioning block 130 is provided with a guide side 131 for contacting the edge of the chip. The two ends of the movable positioning arm 150 are respectively connected to the reference positioning mechanism 110 and the movable positioning block 130, wherein the movable positioning arm 150 has a switchable locking state and an unlocking state, and the movable positioning arm 150 is used to adjust the relative position between the movable positioning block 130 and the reference positioning mechanism 110 in the unlocking state, and to fix the movable positioning block 130 and the reference positioning mechanism 110 in the locking state. The guide side 131 is used to align with the edge of the mounting screen on the mainboard, so that the chip is aligned and fit on the mounting screen along the guide side 131.
[0061] When actually mounting the chip, first, the reference positioning mechanism 110 is positioned and assembled on the mainboard to achieve reference positioning, and then the movable positioning arm 150 is adjusted or maintained in an unlocked state. In this state, the movable positioning block 130 can freely adjust its position relative to the reference positioning mechanism 110. At this time, the position of the movable positioning block 130 can be manually adjusted according to the mounting screen for mounting the chip on the mainboard. After adjustment, the movable positioning ratio is adjusted to a locked state to fix the movable positioning block 130, wherein a guide side 131 is provided on the movable positioning block 130. By providing the movable positioning block 130, the chip is guided, and at the same time, the relative position of the movable positioning block 130 is adjusted and fixed by the reference positioning mechanism 110 and the movable positioning arm 150, thereby simplifying the installation and positioning structure and building a simple CPU chip fixing platform. During mounting, the chip can be accurately aligned and fitted on the mounting screen along the guide side 131 of the movable positioning block 130, thereby achieving accurate mounting of the chip. The chip positioning device 100 provided in this embodiment has the advantages of small size, light weight, small installation space, good maneuverability, simple structure, easy operation, and can ensure accurate positioning of the chip.
[0062] In this embodiment, the guide side 131 includes a first guide edge 133 and a second guide edge 135 that are adjacent to each other. The first guide edge 133 and the second guide edge 135 are respectively used to conflict with the adjacent side edges on the chip. Specifically, the first guide edge 133 and the second guide edge 135 are both straight edges. By setting the first guide edge 133 and the second guide edge 135, the chip is limited from at least two dimensions, further ensuring the accuracy of the chip mounting process. Of course, in other preferred embodiments of the present invention, the guide side 131 may also include only the first guide edge 133, so as to guide and limit only the single-side edge of the chip. Alternatively, the guide side 131 may include three or four guide edges, so as to guide and limit the multiple-side edges of the chip, thereby further ensuring the alignment effect.
[0063] In this embodiment, the movable positioning block 130 is L-shaped, with the first guide edge 133 and the second guide edge 135 arranged at right angles. Specifically, the L-shaped movable positioning block 130 allows the first guide edge 133 and the second guide edge 135 to be arranged at right angles, making it more compatible with conventional rectangular CPU chips and facilitating more convenient and accurate CPU chip placement. Furthermore, the L-shaped movable positioning block 130 in this embodiment leaves the guide edge 131 open, allowing it to accommodate chips of varying sizes.
[0064] In this embodiment, a first positioning knob 151 and a second positioning knob 153 are respectively provided at both ends of the movable positioning arm 150. The first positioning knob 151 is detachably connected to the reference positioning mechanism 110 and is used to fix the movable positioning arm 150 and the reference positioning mechanism 110 in a tightened state. The second positioning knob 153 is detachably connected to the movable positioning block 130 and is used to fix the movable positioning arm 150 and the movable positioning block 130 in a tightened state. By providing the structure of the movable positioning arm 150 and the positioning knob to achieve position adjustment of the movable positioning block 130, manual adjustment can be achieved, avoiding a complex power supply environment. The operation is simple, and the positioning knob can be manually tightened or loosened, making the adjustment process very convenient.
[0065] During actual positioning, after the reference positioning mechanism 110 is positioned and assembled on the mainboard, the first positioning knob 151 and the second positioning knob 153 can be rotated to make the movable positioning block 130 freely movable. In this case, the movable positioning block 130 can be manually aligned with the mounting silk screen on the mainboard, and then the first positioning knob 151 and the second positioning knob 153 can be tightened to keep the movable positioning block 130 and the reference positioning mechanism 110 in a relatively fixed state. Among them, the tightening order of the first positioning knob 151 and the second positioning knob 153 is not specifically limited. It is only necessary to fix the two ends of the movable positioning arm 150 to the movable positioning block 130 and the reference positioning mechanism 110. Since it is only necessary to manually adjust the movable positioning block 130 and tighten the positioning knobs to fix it during actual positioning, compared with a large rework station, no additional power supply is required, the requirements for the installation environment are lower, and the applicability is wider.
[0066] In this embodiment, a slide hole 155 is provided on the movable positioning arm 150, and the first positioning knob 151 and / or the second positioning knob 153 are inserted into the slide hole 155, so that the first positioning knob 151 and / or the second positioning knob 153 can slide freely along the slide hole 155 when loosened. Specifically, the first positioning knob 151 is movably inserted into the slide hole 155, and the second positioning knob 153 is rotatably assembled at the end of the movable positioning arm 150 and spaced apart from the slide hole 155, so that only the first positioning knob 151 can slide freely along the slide hole 155. By providing the slide hole 155, the positioning knob will not fall out of the movable positioning arm 150 even when loosened, thereby ensuring a relatively loose adjustment range while also achieving rapid positioning.
[0067] It is worth noting that in this embodiment, there can be two movable positioning arms 150, and the two movable positioning arms 150 are arranged at intervals and are not parallel to each other. A first positioning knob 151 and a second positioning knob 153 are respectively provided at both ends of each movable positioning arm 150. By providing two movable positioning arms 150, the positioning and fixing strength can be further guaranteed, so that the movable positioning block 130 and the reference positioning mechanism 110 remain relatively fixed.
[0068] In a preferred embodiment of the present invention, the movable positioning block 130 is further provided with scale markings, which are distributed along the guide side 131 and are used to indicate the size of the portion of the chip that interferes with the guide side 131. Specifically, the scale markings can be standard millimeter scale markings. By providing the scale markings, precise control can be achieved during the alignment process, further improving positioning accuracy.
[0069] The reference positioning mechanism 110 includes a first positioning block 111, a second positioning block 113, and a third positioning block 115, which are spaced apart. The first positioning block 111 is connected to the second positioning block 113, which is in turn connected to the third positioning block 115. A movable positioning arm 150 is connected to the second positioning block 113. The first, second, and third positioning blocks 111, 113, 115 are arranged in a triangular configuration and positioned and assembled on the mainboard. The triangular arrangement of the first, second, and third positioning blocks 111, 113, and 115 achieves three-point positioning, ensuring the reliability of the reference, thereby ensuring the securement of the movable positioning block 130 and further improving positioning accuracy.
[0070] In this embodiment, the first positioning block 111, the second positioning block 113, and the third positioning block 115 can be arranged in a right triangle. The second positioning block 113 can be L-shaped and positioned at the right angle of the right triangle. The first positioning block 111 and the second positioning block 113 are respectively positioned at the other two acute angles of the right triangle. The bottoms of the first positioning block 111, the second positioning block 113, and the third positioning block 115 are each provided with a positioning boss 117, which is used to align with the fan positioning hole on the motherboard. Positioning is achieved by directly aligning the positioning boss 117 with the fan positioning hole, avoiding the need for additional holes in the motherboard, ensuring the integrity of the motherboard structure, and achieving better positioning results.
[0071] It is worth noting that in this embodiment, the second positioning block 113 is L-shaped, and the two first positioning knobs 151 are respectively arranged on the two right-angled sides of the second positioning block 113. At the same time, the movable positioning block 130 is also L-shaped, and the two second positioning knobs 153 are respectively arranged on the two right-angled sides of the movable positioning block 130, thereby ensuring that the two movable positioning arms 150 are spaced apart from each other.
[0072] It should be noted that, in this embodiment, the positioning boss 117 is used to align with the fan positioning hole on the motherboard. Normally, the cooling fan on the motherboard has four fan positioning holes distributed in a rectangular shape, so as to ensure that the cooling fan is fixed on the motherboard, wherein the first positioning block 111, the second positioning block 113 and the third positioning block 115 respectively cover the three fan positioning holes distributed in a right-angled triangle. By setting the positioning boss 117, the fan positioning holes on the motherboard can be reasonably utilized, avoiding additional hole opening for positioning, enhancing the applicability of the overall device, and easy disassembly and assembly without destroying the circuit structure on the motherboard.
[0073] It should also be noted that in order to better realize the positioning and assembly of the first positioning block 111, the second positioning block 113 and the third positioning block 115, the positioning boss 117 in this embodiment can be made of a material with a certain elasticity, such as plastic, and the size of the positioning boss 117 can be slightly larger than the size of the fan positioning hole, or be adapted to the size of the positioning boss 117, so as to ensure interference fitting between the positioning boss 117 and the fan positioning hole, thereby achieving a good fixing effect.
[0074] Of course, in other preferred embodiments of the present invention, the first positioning block 111, the second positioning block 113 and the third positioning block 115 can also be fixed to the mainboard in other ways, such as using hot melt glue or UV glue, and can be peeled off by heating or irradiating UV light during the subsequent disassembly process.
[0075] In this embodiment, a first distance adjustment component 170 is provided between the first positioning block 111 and the second positioning block 113, and the first distance adjustment component 170 is simultaneously connected to the first positioning block 111 and the second positioning block 113 for adjusting the distance between the first positioning block 111 and the second positioning block 113; a second distance adjustment component 190 is also provided between the second positioning block 113 and the third positioning block 115, and the second distance adjustment component 190 is simultaneously connected to the second positioning block 113 and the third positioning block 115 for adjusting the distance between the second positioning block 113 and the third positioning block 115. By providing the distance adjustment component, the relative distances between the first positioning block 111, the second positioning block 113 and the third positioning block 115 can be adjusted, so that the chip positioning device 100 can be applied to different motherboards, and the relative positions between the three positioning blocks can be adaptively adjusted according to the size of each structural dimension on the motherboard, thereby improving the applicability of the chip positioning device 100.
[0076] In this embodiment, the first distance adjustment assembly 170 includes a first adjustment arm 171, a first adjustment knob 173 and a second adjustment knob 175. The first adjustment arm 171 is arranged between the first positioning block 111 and the second positioning block 113. The first adjustment knob 173 and the second adjustment knob 175 are both arranged on the first adjustment arm 171, and the first adjustment knob 173 is detachably connected to the first positioning block 111 for fixing the first adjustment arm 171 and the first positioning block 111 in a tightened state. The second adjustment knob 175 is detachably connected to the second positioning block 113 for fixing the first adjustment arm 171 and the second positioning block 113 in a tightened state.
[0077] The second distance adjustment assembly 190 includes a second adjustment arm 191, a third adjustment knob 193 and a fourth adjustment knob 195. The second adjustment arm 191 is arranged between the second positioning block 113 and the third positioning block 115. The third adjustment knob 193 and the fourth adjustment knob 195 are both arranged on the second adjustment arm 191, and the third adjustment knob 193 is detachably connected to the second positioning block 113 for fixing the second adjustment arm 191 and the second positioning block 113 in a tightened state. The fourth adjustment knob 195 is detachably connected to the third positioning block 115 for fixing the second adjustment arm 191 and the third positioning block 115 in a tightened state.
[0078] In this embodiment, position adjustment is achieved by setting an adjustment arm and an adjustment knob, which has good reliability and can be manually adjusted, avoiding a complex power supply environment. The operation is simple and only the positioning knob can be manually tightened or loosened, making the adjustment process very convenient.
[0079] In this embodiment, a first adjustment slide hole 177 is provided on the first adjustment arm 171, and the first adjustment knob 173 and / or the second adjustment knob 175 are passed through the first adjustment slide hole 177. Specifically, the first positioning knob 151 is movably passed through the first adjustment slide hole 177, and the second positioning knob 153 is spaced apart from the first adjustment slide hole 177 and is rotatably set at the end of the first adjustment arm 171.
[0080] The second adjustment arm 191 is provided with a second adjustment hole 197, through which the third adjustment knob 193 and / or the fourth adjustment knob 195 are inserted. Specifically, the fourth positioning knob is movably inserted into the second adjustment hole 197, while the third positioning knob is spaced apart from the second adjustment hole 197 and rotatably mounted at the end of the second adjustment arm 191. The provision of the adjustment hole serves to limit the position of the adjustment knob when it is loosened, allowing adjustment while preventing the knob from falling off the adjustment arm.
[0081] It should be noted that in this embodiment, the first positioning knob 151, the second positioning knob 153, the first adjustment knob 173, the second adjustment knob 175, the third adjustment knob 193, and the fourth adjustment knob 195 are similar in structure and are all bolt-type structures, capable of locking or unlocking by tightening or loosening them, respectively. This manual positioning device has flexible application scenarios and can dynamically adjust the fixed spacing between the first positioning block 111, the second positioning block 113, and the third positioning block 115 in real time according to the different sizes of fan positioning holes on CPUs of different sizes, thereby achieving the positioning reference setting for the soldering of CPUs of different sizes.
[0082] This embodiment also provides a method for using a chip device, which is applicable to the aforementioned chip positioning device 100. The method has simple steps, is easy to operate, and can quickly and accurately achieve chip placement. The method includes the following steps:
[0083] S1: Position and assemble the reference positioning mechanism 110 on the mainboard.
[0084] Specifically, first, adjust first and third positioning blocks 111, 115 to the appropriate fan positioning holes according to the spacing between the fan positioning holes on the motherboard, and then tighten first adjustment knob 173 and fourth adjustment knob 195. Then, position second positioning block 113 over the fan positioning hole reserved for the CPU chip fan on the motherboard. Place second positioning block 113 at a right angle to the fan positioning hole. Then, tighten second adjustment knob 175 and third adjustment knob 193, locking the second positioning block. This ensures that second positioning block 113 remains relatively fixed to the motherboard, thus achieving three-point positioning.
[0085] S2: Adjust the position of the movable positioning block 130 according to the mounting screen on the mainboard so that the guide side 131 on the movable positioning block 130 is aligned with the edge of the mounting screen.
[0086] Specifically, first adjust the movable positioning arm 150 to the unlocked state, that is, the first positioning knob 151 and the second positioning knob 153 are both in the loosened state, and adjust the position of the movable positioning block 130 according to the CPU position silk screen on the motherboard, that is, according to the mounting silk screen, so that the right-angle side of the movable positioning block 130 coincides with the right-angle side corresponding to the CPU position silk screen, thereby adjusting the movable positioning block 130 into place.
[0087] S3: Adjust the movable positioning arm 150 to a locked state.
[0088] Specifically, after the movable positioning block 130 is adjusted into place, the first positioning knob 151 and the second top knob are tightened to lock the movable positioning arm 150 and keep the movable positioning block 130 and the second positioning block 113 relatively fixed.
[0089] S4: Align the chip along the guide side 131 and attach it to the mounting screen.
[0090] Specifically, the right-angled side of the CPU chip is completely overlapped with the right-angled side of the movable positioning block 130, that is, the right-angled side of the chip is aligned with the first guide edge 133 and the second guide edge 135. In this case, the right-angled side of the vertically aligned movable positioning block 130 is slowly lowered until the CPU chip contacts the motherboard, completing the manual positioning and installation of the CPU.
[0091] In summary, this embodiment provides a chip positioning device 100 and method of use. By providing a movable positioning block 130 to achieve chip guidance, and by adjusting and fixing the relative position of the movable positioning block 130 through a reference positioning mechanism 110 and a movable positioning arm 150, the installation and positioning structure is simplified, and a simple CPU chip fixing platform is established. During mounting, the chip can be accurately aligned and attached to the mounting screen along the guide side 131 of the movable positioning block 130, thereby achieving accurate chip mounting. The chip positioning device 100 provided in this embodiment is compact, lightweight, requires minimal installation space, has good maneuverability, is simple in structure, and is easy to operate, while ensuring precise chip positioning.
[0092] See also Figure 5 This embodiment also provides another chip positioning device 100, whose basic structure, principle and technical effects are the same as those of the first embodiment. For the sake of brief description, for parts not mentioned in this embodiment, reference may be made to the corresponding contents in the first embodiment.
[0093] In this embodiment, there are two movable positioning arms 150, each comprising a first micrometer screw 157 and a second micrometer screw 159. One end of the first micrometer screw 157 is connected to the reference positioning mechanism 110, and the other end is connected to the movable positioning block 130, for adjusting the position of the movable positioning block 130 along a first direction. One end of the second micrometer screw 159 is connected to the reference positioning mechanism 110, and the other end is connected to the movable positioning block 130, for adjusting the position of the movable positioning block 130 along a second direction, wherein the first and second directions are perpendicular to each other. Specifically, the first direction is the X-axis direction, and the second direction is the Y-axis direction. By using the micrometer screw structure to adjust the position of the movable positioning block 130, the accuracy of the adjustment can be improved, thereby further improving the chip placement accuracy.
[0094] It should be noted that the basic structure and adjustment principle of the micrometer screw here can refer to the relevant descriptions in the prior art. The micrometer screw also has a self-locking function, that is, it can be locked after adjusting to a preset scale, thereby preventing subsequent actions from interfering with its position.
[0095] In this embodiment, the reference positioning mechanism 110 or the movable positioning block 130 is provided with a first slide groove 137 arranged along the first direction and a second slide groove 139 arranged along the second direction. The end of the first micrometer screw 157 is slidably disposed in the second slide groove 139, and the end of the second micrometer screw 159 is slidably disposed in the first slide groove 137. Specifically, the movable positioning block 130 is provided with the first slide groove 137 and the second slide groove 139, wherein the first slide groove 137 and the second slide groove 139 are not conductive with each other. By providing the first slide groove 137 and the second slide groove 139, there is no mutual interference when adjusting the first direction and the second direction, thereby ensuring the reliability and accuracy of the adjustment.
[0096] When actually adjusting the movable positioning block 130, after the second positioning block 113 completes the positioning assembly, the first screw micrometer 157 and the second screw micrometer 159 can be manually adjusted in sequence according to the mounting silk screen on the mainboard, so that the first guide edge 133 and the second guide edge 135 on the movable positioning block 130 coincide with the right-angled edges of the mounting silk screen respectively. At this time, the adjustment is stopped and the movable positioning block 130 is positioned under the self-locking function of the screw micrometer.
[0097] The chip positioning device 100 provided in this embodiment is adjusted by a screw micrometer, which has higher adjustment accuracy and can more quickly and accurately align the movable positioning block 130 with the mounting screen, further ensuring the accuracy of chip mounting.
[0098] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.
Claims
1. A chip positioning device, characterized in that: include: A reference positioning mechanism, used for detachably positioning and assembling on the mainboard; A movable positioning block (130) is provided with a guide side edge (131) for contacting an edge of a chip; A movable positioning arm (151), the two ends of which are respectively connected to the reference positioning mechanism and the movable positioning block (130); The movable positioning arm (151) has a switchable locking state and unlocking state, and the movable positioning arm is used to adjust the relative position between the movable positioning block (130) and the reference positioning mechanism in the unlocking state, and fix the movable positioning block (130) and the reference positioning mechanism in the locking state, and the guide side edge (131) is used to align with the edge of the mounting screen on the mainboard, so that the chip is aligned along the guide side edge (131) and attached to the mounting screen; The guide side edge (131) comprises a first guide edge (133) and a second guide edge (135) that are adjacently arranged, and the first guide edge (133) and the second guide edge (135) are respectively used to conflict with adjacent side edges on the chip; A first positioning knob (153) and a second positioning knob (155) are respectively provided at both ends of the movable positioning arm (151), and the first positioning knob (153) is detachably connected to the reference positioning mechanism and is used to fix the movable positioning arm (151) and the reference positioning mechanism in a tightened state, and the second positioning knob (155) is detachably connected to the movable positioning block (130) and is used to fix the movable positioning arm (151) and the movable positioning block (130) in a tightened state.
2. The chip positioning device according to claim 1, characterized in that: The movable positioning block (130) is L-shaped, and the first guide edge (133) and the second guide edge (135) are arranged at a right angle.
3. The chip positioning device according to claim 1, characterized in that: A slide hole (157) is provided on the movable positioning arm (151), and the first positioning knob (153) and / or the second positioning knob (155) are inserted into the slide hole (157), so that the first positioning knob (153) and / or the second positioning knob (155) can slide freely along the slide hole (157) in a loosened state.
4. The chip positioning device according to claim 1, characterized in that: There are two movable positioning arms, and the two movable positioning arms include a first screw micrometer and a second screw micrometer, one end of the first screw micrometer is connected to the reference positioning mechanism, and the other end is connected to the movable positioning block (130), and is used to adjust the position of the movable positioning block (130) along a first direction; one end of the second screw micrometer is connected to the reference positioning mechanism, and the other end is connected to the movable positioning block (130), and is used to adjust the position of the movable positioning block (130) along a second direction, wherein the first direction and the second direction are perpendicular to each other.
5. The chip positioning device according to claim 4, characterized in that: The reference positioning mechanism or the movable positioning block (130) is provided with a first slide groove arranged along the first direction and a second slide groove arranged along the second direction, the end of the first screw micrometer is slidably arranged in the second slide groove, and the end of the second screw micrometer is slidably arranged in the first slide groove.
6. The chip positioning device according to claim 1, characterized in that: The movable positioning block (130) is also provided with scale marks, which are distributed correspondingly along the guide side edge (131) and are used to mark the size of the portion of the chip that contacts the guide side edge (131).
7. The chip positioning device according to any one of claims 1 to 6, characterized in that: The reference positioning mechanism comprises a first positioning block (111), a second positioning block (113) and a third positioning block (115) which are arranged at intervals, the first positioning block (111) is connected to the second positioning block (113), the second positioning block (113) is connected to the third positioning block (115), the movable positioning arm is connected to the second positioning block (113), and the first positioning block (111), the second positioning block (113) and the third positioning block (115) are arranged in a triangle and are positioned and assembled on the main board.
8. The chip positioning device according to claim 7, characterized in that: The bottoms of the first positioning block (111), the second positioning block (113) and the third positioning block (115) are all provided with positioning bosses (117), and the positioning bosses (117) are used for alignment and assembly with the fan positioning holes on the mainboard.
9. The chip positioning device according to claim 7, characterized in that: A first distance adjustment component is provided between the first positioning block (111) and the second positioning block (113), and the first distance adjustment component is connected to both the first positioning block (111) and the second positioning block (113) and is used to adjust the distance between the first positioning block (111) and the second positioning block (113); A second distance adjustment component is also provided between the second positioning block (113) and the third positioning block (115), and the second distance adjustment component is connected to both the second positioning block (113) and the third positioning block (115) for adjusting the distance between the second positioning block (113) and the third positioning block (115).
10. The chip positioning device according to claim 9, characterized in that: The first distance adjustment assembly comprises a first adjustment arm (171), a first adjustment knob (173) and a second adjustment knob (175); the first adjustment arm (171) is arranged between the first positioning block (111) and the second positioning block (113); the first adjustment knob (173) and the second adjustment knob (175) are both arranged on the first adjustment arm (171); the first adjustment knob (173) is detachably connected to the first positioning block (111) and is used to fix the first adjustment arm (171) and the first positioning block (111) in a tightened state; the second adjustment knob (175) is detachably connected to the second positioning block (113) and is used to fix the first adjustment arm (171) and the second positioning block (113) in a tightened state.
11. The chip positioning device according to claim 10, characterized in that: The second distance adjustment assembly comprises a second adjustment arm (191), a third adjustment knob (193) and a fourth adjustment knob (195); the second adjustment arm (191) is arranged between the second positioning block (113) and the third positioning block (115); the third adjustment knob (193) and the fourth adjustment knob (195) are both arranged on the second adjustment arm (191); the third adjustment knob (193) is detachably connected to the second positioning block (113) and is used to fix the second adjustment arm (191) and the second positioning block (113) in a tightened state; the fourth adjustment knob (195) is detachably connected to the third positioning block (115) and is used to fix the second adjustment arm (191) and the third positioning block (115) in a tightened state.
12. The chip positioning device according to claim 11, characterized in that: A first adjustment sliding hole (177) is provided on the first adjustment arm (171), and the first adjustment knob (173) and / or the second adjustment knob (175) are inserted into the first adjustment sliding hole (177); A second adjustment sliding hole (197) is provided on the second adjustment arm (191), and the third adjustment knob (193) and / or the fourth adjustment knob (195) are inserted into the second adjustment sliding hole (197).
13. A method for using a chip positioning device, applicable to the chip positioning device according to any one of claims 1 to 12, characterized in that: The method comprises: Positioning and assembling the reference positioning mechanism on the main board; Adjust the position of the movable positioning block according to the mounting screen on the mainboard so that the guide side of the movable positioning block is aligned with the edge of the mounting screen; Adjusting the movable positioning arm to a locked state; Align the chip along the guide side and attach it to the mounting screen.
Citation Information
Patent Citations
Chip positioning device
CN217563879U