Portable electronic devices and mobile phones

Abstract

The present disclosure relates to portable electronic devices and mobile phones. The portable electronic device may include: a housing; a display, the display being at least partially located within the housing; a front cover, the front cover being coupled to the housing and positioned above the display; and a biometric sensor module, the biometric sensor module being configured to illuminate an object through the front cover and capture an image of the object through the front cover. The biometric sensor module may include: a first lens, the first lens being positioned below the front cover; a first light source, the first light source being positioned below the first lens and being configured to project a dot pattern on an object through the first lens; a second light source, the second light source being positioned below the first lens and being configured to illuminate the object with floodlight through the first lens; a second lens, the second lens being positioned below the front cover; and a light sensor, the light sensor being positioned below the second lens and being configured to capture an image of the object.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is a non-provisional patent application of and claims the benefit of U.S. Provisional Patent Application No. 63 / 155,693, entitled “Handheld Electronic Device,” filed on March 2, 2021, U.S. Provisional Patent Application No. 63 / 170,327, entitled “Handheld Electronic Device,” filed on April 2, 2021, and U.S. Provisional Patent Application No. 63 / 208,477, entitled “Handheld Electronic Device,” filed on June 8, 2021, the disclosures of which are hereby incorporated by reference in their entirety. Technical Field

[0003] The presently disclosed subject matter relates generally to handheld electronic devices, and more particularly to mobile telephones. Background Art

[0004] Modern consumer electronic devices come in many shapes and forms and have many uses and functions. For example, smartphones provide users with various ways to interact with others outside the communication range of the phone. Such devices may include many systems for facilitating such interactions. For example, a smartphone may include a touch-sensitive display for providing graphical output and for accepting touch input, a wireless communication system for connecting to other devices to send and receive voice and data content, a camera for capturing photos and videos, etc. However, there are many technical challenges in integrating these subsystems into a compact and reliable product that can withstand daily use. The systems and techniques described herein can address most of these challenges while providing a device with many different functions. Summary of the invention

[0005] A portable electronic device may include: a housing; a display at least partially located within the housing; a front cover coupled to the housing and positioned above the display; and a biometric sensor module configured to illuminate an object through the front cover and capture an image of the object through the front cover. The biometric sensor module may include: a first lens positioned below the front cover; a first light source positioned below the first lens and configured to project a dot pattern on the object through the first lens; a second light source positioned below the first lens and configured to flood illuminate the object through the first lens; a second lens positioned below the front cover; and a light sensor positioned below the second lens and configured to capture an image of the object. The object may be a user's face, and the portable electronic device may be configured to determine a depth map of the user's face using the dot pattern projected onto the user's face, and authenticate the user based at least in part on the depth map of the user's face.

[0006] The first light source may project infrared light, the flood light may be infrared light, and the light sensor may be an infrared light sensor. The first light source may be positioned below a central region of the first lens, and the second light source may be positioned below a peripheral region of the first lens. Light from the first light source passing through the central region of the first lens may appear to be focused on the object, and light from the second light source passing through the peripheral region of the first lens may appear to be out of focus on the object.

[0007] The biometric sensor module may include a housing structure, and the first lens, the first light source, the second lens, the second light source and the light sensor may be at least partially positioned within the housing structure. The second light source may include a radial array of light emitting elements.

[0008] A mobile phone may include: a housing; a display at least partially located within the housing; a front cover coupled to the housing and positioned above the display; and a light emitter located below the front cover and configured to emit light through the front cover. The light emitter may include: a first lens located below the front cover; a first light source located below a central area of ​​the first lens; and a second light source located below a peripheral area of ​​the first lens. The mobile phone may also include a light receiver located below the front cover and including: a second lens located below the front cover and configured to receive light through the front cover; and a light sensor located below the second lens.

[0009] The first light source may be aligned with the optical axis of the first lens, and the second light source may be offset from the optical axis of the first lens. The central area of ​​the first lens may be configured to focus the pattern of light emitted by the first light source onto the object, and the peripheral area of ​​the first lens may be configured to blur the light emitted by the second light source. The pattern of light may be a grid of discrete infrared light points. The light emitted by the second light source may be configured to illuminate the object with infrared flood light. The light receiver may be configured to capture an infrared image of the object while the pattern of light is focused on the object. The light transmitter and the light receiver may be at least partially positioned within the housing structure of the biometric sensor module.

[0010] A portable electronic device may include: a housing; a display at least partially located within the housing; a front cover coupled to the housing and positioned above the display; and a biometric sensor module configured to illuminate a user's face through the front cover and capture an image of the user's face through the front cover. The biometric sensor module may include: a housing structure; a first lens at least partially located within the housing structure; a light sensor positioned below the first lens; a second lens at least partially located within the housing structure; a first light source positioned below the second lens and configured to project a first illumination pattern onto the user's face; and a second light source positioned below the second lens and configured to project a second illumination pattern of light that produces an image of the object when reflected from the object and captured by the light sensor.

[0011] The first illumination pattern may be a set of discrete light spots. The first light source may be an infrared laser light source. The infrared laser light source may be a first infrared laser light source, and the second light source may be a second infrared laser light source. The first infrared laser light source may be a first vertical cavity surface emitting laser, and the second infrared laser light source may be a second vertical cavity surface emitting laser. The first light source may be positioned below a central area of ​​the second lens, the second light source may be positioned below a peripheral area of ​​the second lens, and the peripheral area of ​​the second lens may be configured to blur light emitted by the second light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0013] Figure 1A to Figure 1B An example electronic device is shown;

[0014] Figure 1C to Figure 1D Another exemplary electronic device is shown;

[0015] Figure 2 An exploded view of an exemplary electronic device is shown;

[0016] Figure 3 An exploded view of an exemplary electronic device is shown;

[0017] FIG. 4A to FIG. 4B A portion of an exemplary electronic device is shown;

[0018] Figure 4C shows a partially exploded view of an exemplary electronic device;

[0019] Figure 5 An exemplary cover structure for a speaker port of an exemplary electronic device is shown;

[0020] FIG. 6A to FIG. 6B A partial cross-sectional view showing a speaker configuration for an exemplary electronic device;

[0021] Figure 6C A partial cross-sectional view showing another exemplary speaker configuration for an exemplary electronic device;

[0022] Fig. 7A A partial cross-sectional view showing a microphone configuration for an exemplary electronic device;

[0023] Figure 7B A partial cross-sectional view showing another microphone configuration for an exemplary electronic device;

[0024] Figure 7C Shows Figure 7B An exploded view of the microphone configuration;

[0025] FIG. 8A to FIG. 8C shows a partial view of an exemplary electronic device showing an exemplary speaker port configuration;

[0026] Fig.9A showing a partial view of an exemplary forward-facing sensor area of ​​an exemplary electronic device;

[0027] Fig. 9B A partial cross-sectional view of an exemplary device is shown, illustrating a portion of a forward-facing sensor area of ​​an exemplary electronic device;

[0028] Fig. 9C showing a partial view of an exemplary forward-facing sensor area of ​​another exemplary electronic device;

[0029] FIG. 9D to FIG. 9F A partial cross-sectional view of a forward-facing sensor region of an exemplary electronic device is shown;

[0030] Figure 9G An exemplary forward-facing camera of an exemplary electronic device is shown;

[0031] Figure 9HAn exploded view of a portion of a forward-facing sensor area of ​​an exemplary electronic device is shown;

[0032] FIG. 10A to FIG. 10C shows a partial cross-sectional view of an exemplary electronic device showing an exemplary combined flood illuminator and dot projector configuration;

[0033] Fig.11A A partial cross-sectional view of an exemplary electronic device is shown, illustrating an exemplary ambient light sensor;

[0034] FIG. 11B to FIG. 11C A portion of an exemplary electronic device is shown illustrating the operation of an exemplary ambient light sensor;

[0035] FIG. 12A to FIG. 12B shows an exemplary electrode pattern on an exemplary electronic device;

[0036] FIG. 13A to FIG. 13C shows a partial cross-sectional view of an exemplary electronic device showing an exemplary display potting configuration;

[0037] Fig.13D shows a partial view of an exemplary electronic device showing an exemplary display potting configuration;

[0038] Fig.13E shows a partial cross-sectional view of an exemplary electronic device showing an exemplary display potting configuration;

[0039] Fig.13F shows a partial cross-sectional view of an exemplary electronic device showing an exemplary cover potting configuration;

[0040] FIG. 13G to FIG. 13L A partial cross-sectional view of an exemplary cover for an electronic device is shown;

[0041] Figure 13M shows a partial cross-sectional view of an exemplary electronic device showing an exemplary adhesive for attaching a display to a cover;

[0042] Fig.13N shows a partial cross-sectional view of an exemplary electronic device showing an exemplary configuration for mounting a top module to a housing;

[0043] Fig.14A shows a partial view of an exemplary electronic device;

[0044] FIG. 14B to FIG. 14D An exemplary side-firing antenna window for an electronic device is shown;

[0045] Fig.15 An exemplary antenna feed and ground point for an electronic device is shown;

[0046] Fig.16A A partial view of a housing member for an electronic device is shown;

[0047] Fig. 16B The electronic device includes Fig.16A A partial cross-sectional view of a housing of a housing member;

[0048] Fig. 16C A partial view of a housing member for an electronic device is shown;

[0049] Fig.16D The electronic device includes Fig. 16C A partial cross-sectional view of a housing of a housing member;

[0050] Fig.16E The electronic device includes Fig.16A and Fig. 16C A partial cross-sectional view of a housing of a housing member;

[0051] Fig.17A A portion of an electronic device is shown, illustrating an exemplary arrangement of a camera module in an exemplary electronic device;

[0052] FIG. 17B to FIG. 17C Shows Fig.17A Camera module;

[0053] Fig.17D A portion of an exemplary electronic device is shown with a camera module removed;

[0054] FIG. 17E to FIG. 17F A spring member for use with a camera module of an electronic device is shown;

[0055] Figure 17G A portion of an electronic device is shown, illustrating an exemplary arrangement of components in the device;

[0056] Fig.17H A partial cross-sectional view showing an exemplary mounting configuration of a shield for an electronic device;

[0057] Fig.17I A partial cross-sectional view showing an exemplary mounting configuration for attaching a component to an electronic device;

[0058] Fig.18A A partial cross-sectional view of an exemplary electronic device is shown, illustrating an exemplary depth sensor configuration;

[0059] Fig.18B shows a partial cross-sectional view of an exemplary electronic device illustrating another exemplary depth sensor configuration;

[0060] Fig. 18Cshows a partial cross-sectional view of an exemplary electronic device illustrating another exemplary depth sensor configuration;

[0061] Fig.19A A partial cross-sectional view of an exemplary electronic device is shown, illustrating an exemplary rear camera configuration;

[0062] Fig.19B A partial cross-sectional view of an exemplary electronic device is shown, illustrating an exemplary arrangement of window decorations in a rear cover of the electronic device;

[0063] Fig.19C A partial cross-sectional view of an exemplary electronic device is shown, illustrating another exemplary arrangement of window decoration in a rear cover of the electronic device;

[0064] Fig. 20A A flash module of an exemplary electronic device is shown;

[0065] Fig. 20B Shows Fig. 20A A partial cross-sectional view of a flash module;

[0066] Fig. 20C shows a partial cross-sectional view of another exemplary flash module;

[0067] FIG. 20D to FIG. 20G A partial cross-sectional view of an exemplary flash module for an electronic device is shown;

[0068] Fig.21A An exemplary logic board for an electronic device is shown;

[0069] Fig.21B Shows Fig.21A A partial cross-sectional view of the logic board;

[0070] Fig. 21C shows a partial cross-sectional view of another exemplary logic board;

[0071] Fig.21D shows a partial cross-sectional view of another exemplary logic board;

[0072] Fig.21E shows a partial view of an exemplary fastening configuration for a logic board;

[0073] Fig.21F Shows Fig.21A A partial cutaway view of the logic board, showing Fig.21E The fastening configuration shown;

[0074] FIG. 21G to FIG. 21I Another exemplary logic board is shown;

[0075] Fig.22AA portion of an electronic device is shown wherein a battery is shown separated from a housing;

[0076] Fig. 22B An exemplary adhesive configuration for attaching a battery to a housing of an electronic device is shown;

[0077] Fig. 22C shows a partial cross-sectional view of an adhesive stack for attaching a battery to a housing of an electronic device;

[0078] FIG. 22D to FIG. 22F An exemplary adhesive configuration for attaching a battery to a housing of an electronic device is shown;

[0079] FIG. 22G to FIG. 22H An exemplary battery mounting structure for attaching a battery to an electronic device is shown;

[0080] Fig.23A A partial view of an electronic device is shown showing an exemplary arrangement of a sensor module relative to a housing member;

[0081] FIG. 23B to FIG. 23G illustrates an exemplary configuration of a sensor module having multiple sensing components sharing a common volume; and

[0082] Fig.24 A schematic diagram of an exemplary electronic device is shown. DETAILED DESCRIPTION

[0083] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0084] A mobile phone as described herein may include complex and sophisticated components and systems that facilitate a variety of functions. For example, a mobile phone according to the present disclosure may include a touch-sensitive display and / or a force-sensitive display, multiple cameras (including both forward-facing and rear-facing cameras), a GPS system, a tactile actuator, a wireless charging system, and all necessary computing components and software for operating these (and other) systems and otherwise providing the functionality of the mobile phone.

[0085] Figure 1A and Figure 1B An exemplary electronic device 100 embodied as a mobile phone is shown. Figure 1A The front of the device 100 is shown, and Figure 1BThe back of the device is shown. Although device 100 is a mobile phone, the concepts presented herein may be applicable to any suitable electronic device, including a portable electronic device, a wearable device (e.g., a watch), a laptop computer, a handheld gaming device, a tablet computer, a computing peripheral device (e.g., a mouse, a trackpad, a keyboard), or any other device. Thus, any reference to an "electronic device" encompasses any and all of the foregoing.

[0086] The electronic device 100 includes a cover 102 (e.g., a front cover) such as glass, glass ceramic, ceramic, plastic, sapphire, or other substantially transparent material, component, or assembly attached to a housing 104 (which may include a housing structure defined by one or more housing members). The cover 102 may be positioned above the display 103. The cover 102 may be formed of glass (e.g., chemically strengthened glass), sapphire, ceramic, glass ceramic, plastic, or another suitable material. The cover 102 may be formed as a single piece or integral sheet. The cover 102 may also be formed as a composite of multiple layers of different materials, coatings, and other elements.

[0087] Display 103 may be at least partially positioned within the interior volume of housing 104. Display 103 may be coupled to cover 102, such as via an adhesive or other coupling scheme. Display 103 may include a liquid crystal display (LCD), a light emitting diode, an organic light emitting diode (OLED) display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, or the like. Display 103 may be configured to display graphical output, such as a graphical user interface that a user may view and interact with. Device 100 may also include an ambient light sensor that may determine properties of ambient light conditions surrounding device 100. This document is relative to FIG. 11A to FIG. 11C An exemplary ambient light sensor is described. Device 100 may use information from the ambient light sensor to change, modify, adjust, or otherwise control display 103 (eg, by changing the hue, brightness, saturation, or other optical aspects of the display based on information from the ambient light sensor).

[0088] Display 103 may include or be associated with one or more touch sensing systems and / or force sensing systems. In some cases, components of the touch sensing system and / or force sensing system are integrated with the display stack. For example, the electrode layers of the touch sensor and / or force sensor may be provided in the form of a stack that includes display components (and is optionally attached to or at least visible through the cover 102). The touch sensing system and / or force sensing system may use any suitable type of sensing technology, including capacitive sensors, resistive sensors, surface acoustic wave sensors, piezoelectric sensors, strain gauges, etc. The exterior or external surface of the cover 102 may define an input surface of the device (e.g., a touch-sensitive input surface and / or a force-sensitive input surface). Although both a touch sensing system and a force sensing system may be included, in some cases, the device 100 includes a touch sensing system and does not include a force sensing system.

[0089] Device 100 may also include a forward-pointing camera 106. Forward-pointing camera 106 may be positioned below cover 102 or otherwise covered and / or protected by the cover. Forward-pointing camera 106 may have any suitable operating parameters. For example, forward-pointing camera 106 may include a 12 megapixel sensor (with a pixel size of 1 micron) and a field of view of 80° to 90°. Forward-pointing camera 106 may have a fixed focal length optical element with an aperture number of f / 2.2. Other types of cameras may also be used for forward-pointing camera 106, such as an autofocus camera.

[0090] Forward-pointing camera 106 may be positioned in forward-pointing sensor area 111. Forward-pointing sensor area 111 may be positioned in a notch-like area on the front of device 100. In some cases, as described herein, forward-pointing sensor area 111 may be positioned in or defined by a recessed area (e.g., an area not occupied by a display or a visually active portion of the display) of display 103. In some cases, forward-pointing sensor area 111 includes a mask or other visually opaque component or treatment that defines an opening for the sensor. In some cases, one or more of the sensors or other devices (e.g., forward-pointing camera 106) in forward-pointing sensor area 111 are aligned with a hole formed through one or more layers of display 103 to provide optical access to the sensor. Forward-pointing sensor area 111 may include components such as a flood illuminator module, a proximity sensor module, an infrared light projector, an infrared image capture device, and forward-pointing camera 106.

[0091] Device 100 may also include one or more buttons (e.g., buttons 120 and Figure 1B 116), switches (e.g., switch 118, Figure 1B) and / or other physical input systems. Such input systems may be used to control power state (e.g., button 120), change speaker volume (e.g., button 116), switch between "ring" mode and "silent" mode, etc. (e.g., switch 118).

[0092] Device 100 may also include speaker port 110 to provide audio output to a user (e.g., to the user's ear) during a voice call. In the context of a mobile phone, speaker port 110 may also be referred to as a receiver, receiver port, or earpiece. Device 100 may also include charging port 112 (e.g., a connector for receiving a power cable for providing power to device 100 and charging a battery of device 100). Device 100 may also include audio opening 114. Audio opening 114 may allow for audio to be heard from an internal speaker system (e.g., Figure 2 The sound output by the speaker system 224 of the housing 104 can leave the housing 104. The device 100 can also include one or more microphones. In some cases, the microphones within the housing 104 can be acoustically coupled to the surrounding environment through the audio opening 114.

[0093] The housing 104 may be a multi-piece housing. For example, the housing 104 may be formed of a plurality of housing members 124, 125, 126, 127, 128, and 130 that are structurally coupled together via one or more joint structures 122 (e.g., 122-1 to 122-6). The housing members 124, 125, 126, 127, 128, and 130 together with the joint structure 122 may define a band-like housing structure that defines four side walls (and thus four exterior side surfaces) of the device 100. Thus, both the housing members and the joint structures define portions of the exterior side surfaces of the device 100.

[0094] Shell members 124, 125, 126, 127, 128 and 130 may be formed of conductive materials (e.g., metals such as aluminum, stainless steel, etc.), and joint structure 122 may be formed of one or more polymer materials (e.g., glass reinforced polymer). Joint structure 122 may include two or more molded elements that may be formed of different materials. For example, an inner molded element may be formed of a first material (e.g., a polymer material), and an outer molded element may be formed of a second material that is different from the first material (e.g., a different polymer material). These materials may have different properties, which may be selected based on different functions of the inner molded element and the outer molded element. For example, an inner molded element may be configured to form a main structural connection between shell members, and may have higher mechanical strength and / or toughness than an outer molded element. On the other hand, an outer molded element may be configured to have a specific appearance, surface finish, chemical resistance, waterproof function, etc., and its composition may be selected to give priority to those functions over mechanical strength.

[0095] In some cases, one or more of housing components 124, 125, 126, 127, 128, and 130 (or portions thereof) are configured to operate as antennas (e.g., components configured to transmit and / or receive electromagnetic waves to facilitate wireless communications with other computers and / or devices). To facilitate use of the housing components as antennas, feed lines and ground lines may be conductively coupled to the housing components to couple the housing components to other antennas and / or communications circuits. FIG. 11, described in more detail below, shows exemplary antenna feed lines and ground lines for an exemplary device. In addition, the connector structure 122 may be substantially non-conductive to provide suitable separation and / or electrical isolation between the housing components (which may be used to tune the radiating portion, reduce capacitive coupling between the radiating portion and other structures, etc.). In addition to housing components 124, 125, 126, 127, 128, and 130, the device 100 may also include various internal antenna elements configured to transmit and receive wireless communication signals through various areas of the housing 104. As shown in FIG. Figure 1A As shown, device 100 may include an antenna window 129 that allows radio frequency communication signals to be transmitted through a corresponding area of ​​housing 104 .

[0096] The joint structure 122 can mechanically interlock with the shell components to structurally couple the shell components and form a structural shell assembly. Further details regarding the joint structure 122 and its mechanical integration with the shell components are provided herein.

[0097] The exterior surfaces of the shell members 124, 125, 126, 127, 128, and 130 may have substantially the same color, surface texture, and overall appearance as the exterior surface of the joint structure 122. In some cases, the exterior surfaces of the shell members 124, 125, 126, 127, 128, and 130 and the exterior surface of the joint structure 122 are subjected to at least one common finishing process, such as abrasive blasting, machining, polishing, grinding, etc. Thus, the exterior surfaces of the shell members and the joint structure may have the same or similar surface finish (e.g., surface texture, roughness, pattern, etc.). In some cases, the exterior surfaces of the shell members and the joint structure may be subjected to a two-stage blasting method to produce a target surface finish.

[0098] Figure 1A Also included is an exemplary coordinate system 101 that can define the orientation of the reference device 100 (or other electronic devices described herein). The coordinate system 101 defines a positive x-direction, a positive y-direction, and a positive z-direction. Unless otherwise indicated, references herein to a positive x, positive y, or positive z-direction will be understood to refer generally to the coordinate system 101 and its associated Figure 1A The negative x, y and z directions will be understood as being related to the device 100. Figure 1A The positive x, y, and z directions are opposite to each other as shown in the coordinate system of FIG.

[0099] Figure 1B The back side of the device 100 is shown. The device 100 may include a back cover or rear cover 132 coupled to the housing 104 and defining at least a portion of the outer rear surface of the device 100. The rear cover 132 may include a substrate formed of glass, but other suitable materials (e.g., plastic, sapphire, ceramic, glass ceramic, etc.) may be used alternatively. The rear cover 132 may include one or more decorative layers on the outer surface or inner surface of the substrate. For example, one or more opaque layers may be applied to the inner surface of the substrate (or otherwise positioned along the inner surface of the substrate) to provide a specific appearance to the back side of the device 100. The opaque layer may include a sheet, ink, dye, or a combination of these (or other) layers, materials, etc. In some cases, the opaque layer has a color that substantially matches the color of the housing 104 (e.g., the outer surface of the housing member and the joint structure). The device 100 may include a wireless charging system, whereby the device 100 may be powered and / or its battery recharged by inductive (or other electromagnetic) coupling between the charger and the wireless charging system within the device 100. In such cases, the rear cover 132 may be formed of a material (e.g., glass) that allows and / or facilitates wireless coupling between the charger and the wireless charging system.

[0100] The device 100 may also include a sensor array 134, which may include various types of sensors, including one or more rear-facing cameras, depth sensing devices, flashes, microphones, etc. The sensor array 134 may be at least partially defined by a protrusion 137 extending from the rear of the device 100. The protrusion 137 may define a portion of the rear external surface of the device 100, and may at least partially define a raised sensor array area of ​​the sensor array 134. In some cases, the protrusion 137 may be formed by attaching a material piece (e.g., glass) to another material piece (e.g., glass). In other cases, the rear cover 132 may include a monolithic structure, and the protrusion 137 may be part of the monolithic structure. For example, the rear cover 132 may include a monolithic glass structure (or glass-ceramic structure) defining the protrusion 137 and the surrounding area. In such cases, the protrusion 137 may be an area of ​​increased thickness of the monolithic structure, or it may be molded into a monolithic structure having a substantially uniform thickness (e.g., and may correspond to a recessed area along the inner side of the monolithic structure).

[0101] The device may also include one or more rear-facing devices as part of the sensor array, which may include an ambient light sensor (ALS), a microphone, and / or a depth sensing device configured to estimate the distance between the device 100 and a separate object or target. The sensor array 134 may also include multiple cameras, such as a first camera 138 and a second camera 139. The first camera 138 may include an ultra-wide-angle camera having a 12-megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an f-number of f / 2.4; the second camera 139 may include a wide-angle camera having a 12-megapixel sensor and an f-number of f / 1.6. In some cases, the sensor array 134 may include a telephoto lens having a 12-megapixel sensor with a 3x optical zoom optical stack with an f-number in the range of f / 2.0 to f / 2.8 (e.g., in addition to the first camera 138 and the second camera 139, or instead of one of the first camera or the second camera). One or more of the cameras (e.g., cameras 138, 139) of sensor array 134 may also include optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within device 100 to reduce the effects of "camera shake" on images captured by the camera. These cameras may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly. One or more of these cameras may include autofocus functionality, where one or more lens elements (and / or sensors) may move to focus an image on the sensor.

[0102] like Figure 1B As shown, the cameras of the sensor array 134 may be positioned diagonally relative to the protrusion 137 (e.g., a raised sensor array). For example, a first hole may extend through the rear cover 132 at a position near a first corner region of the sensor array 134, and the first camera 138 may be at least partially positioned in the first hole, and a second hole may extend through the rear cover 132 at a position near a second corner region diagonal to the first corner region of the sensor array 134, and the second camera 139 may be at least partially positioned in the second hole. Thus, the first and second holes, and therefore the first and second cameras, may be positioned along a diagonal path from the first corner to the second corner of the sensor array 134.

[0103] The second camera 139 may have an image sensor with a pixel size between about 1.5 microns and about 2.0 microns, and the first camera 138 may have an image sensor with a pixel size between about 0.8 microns and about 1.4 microns. If a camera with a telephoto lens is provided, it may have an image sensor with a pixel size between about 0.8 microns and about 1.4 microns.

[0104] The sensor array 134, along with associated processors and software, may provide a number of image capture features. For example, the sensor array 134 may be configured to capture a full-resolution video clip of a particular duration each time a user captures a still image. As used herein, capturing a full-resolution image (e.g., a video image or a still image) may refer to capturing an image using all or substantially all of the pixels of an image sensor, or otherwise capturing an image using the maximum resolution of the camera (whether the maximum resolution is limited by hardware or software).

[0105] The captured video clip may be associated with a still image. In some cases, the user may be able to select individual frames from the video clip as representative still images associated with the video clip. Thus, when the user takes a snapshot of a scene, the camera will actually record a short video clip (e.g., 1 second, 2 seconds, etc.), and the user can select a precise frame from the video to use as the captured still image (in addition to simply viewing the video clip as a video).

[0106] The cameras of the sensor array 134 may also have or provide a high dynamic range (HDR) mode in which the camera captures images with a dynamic brightness range that is greater than the brightness range captured when the camera is not in HDR mode. In some cases, the sensor array 134 automatically determines whether to capture an image in HDR mode or non-HDR mode. Such a determination may be based on various factors, such as the ambient light of the scene, the detected brightness range, hue, or other optical parameters in the scene, etc. An HDR image may be generated by capturing multiple images, each using a different exposure or other image capture parameter, and generating a composite image from the multiple captured images.

[0107] Sensor array 134 may also include or be configured to operate in an object detection mode in which a user may select (and / or device 100 may automatically identify) objects within a scene to facilitate processing, displaying, or capturing those objects differently than other portions of the scene. For example, a user may select (or device 100 may automatically identify) a person's face in a scene, and device 100 may focus on the person's face while selectively blurring portions of the scene other than the person's face. Notably, features such as HDR mode and object detection mode may be provided with a single camera (e.g., a single lens and sensor).

[0108] The sensor array may include a flash 136 configured to illuminate a scene to facilitate capturing an image with the sensor array 134. The flash 136 may include one or more light sources, such as one or more light emitting diodes (e.g., 1, 2, 3, 4, or more LEDs). In conjunction with the sensor array 134 or other systems of the device 100, the flash 136 may adjust the color temperature of the light emitted by the light source to match or otherwise adapt to the color temperature within the scene being captured. The device 100 may also be configured to operate the flash 136 and shutter (e.g., a shutter of one or more of the cameras 138, 139) of the sensor array 134 to avoid the consequences of a flash "blink". For example, the device 100 may avoid capturing exposures during moments when the flash 136 is not illuminated or is at low illumination (e.g., which may be caused by discontinuous or pulsed operation of an LED).

[0109] Sensor array 134 may also include microphone 135. Microphone 135 may be acoustically coupled to the external environment through an aperture defined in the rear cover of device 100 (eg, through a portion of the rear cover defining protrusion 137).

[0110] Figure 1C and Figure 1D Another exemplary electronic device 140 embodied as a mobile phone is shown. The electronic device 140 may have many of the same or similar external components as the electronic device 100. Thus, Figure 1A and Figure 1B The descriptions and details of such components (e.g., displays, buttons, switches, housings, covers, charging ports, connector structures, etc.) also apply to Figure 1C and Figure 1D Corresponding parts shown.

[0111] Although Figure 1B The device 100 in FIG. 1 is shown as including a sensor array 134 having two cameras, but as shown in FIG. Figure 1D The device 140 shown includes a sensor array 141, which includes three cameras (e.g., Figure 3 140). The sensor array 141 may be located in a sensor array area defined by a protrusion 151 in the rear cover of the device 140. The protrusion 151 may have a Figure 1B The protrusion 137 in is of the same or similar construction.

[0112] First camera 142 may include a 12 megapixel sensor and a telephoto lens with 3x optical zoom and an f / 2.8 aperture number; second camera 144 may include a 12 megapixel sensor and a wide angle lens with an f / 1.5 aperture number; and third camera 146 may include a 12 megapixel sensor and an ultra wide angle camera with a wide field of view (e.g., 120° FOV) and an f / 1.8 aperture number. One or more of the cameras of sensor array 141 may also include optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within device 100 to reduce the effects of "camera shake" on images captured by the camera. These cameras may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly.

[0113] The first camera 142 may include an image sensor with a pixel size between about 0.8 microns and about 1.4 microns. The second camera 144 may include an image sensor with a pixel size between about 1.6 microns and about 2.3 microns. The third camera 146 may include an image sensor with a pixel size between about 0.8 microns and about 1.4 microns.

[0114] For example, a Wide camera with a 12-megapixel sensor and an f / 1.6 aperture number may have an image sensor with a pixel size between about 1.5 microns and about 2.0 microns; an Ultra Wide camera with a 12-megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an f / 2.4 aperture number may have an image sensor with a pixel size between about 0.8 microns and about 1.4 microns; and a Telephoto lens with a 12-megapixel sensor with a 3x optical zoom optical stack with an f / 2.0 to f / 2.8 aperture number may have an image sensor with a pixel size between about 0.8 microns and about 1.4 microns. One or more of these cameras may include autofocus functionality, in which one or more lens elements (and / or sensors) may move to focus an image on the sensor.

[0115] Sensor array 141 may also include a depth sensing device 149 configured to estimate the distance between the device and a separate object or target. Depth sensing device 149 may use lasers and time-of-flight calculations or other types of depth sensing components or techniques to estimate the distance between the device and a separate object or target.

[0116] Device 140 may also include a flash 148 configured to illuminate a scene to facilitate capturing an image with a camera of sensor array 141. Flash 148 is configured to illuminate a scene to facilitate capturing an image with sensor array 141. Flash 148 may include one or more light sources, such as one or more light emitting diodes (e.g., 1, 2, 3, 4, or more LEDs).

[0117] Sensor array 141 may also include microphone 150. Microphone 150 may be acoustically coupled to the external environment through a hole defined in the rear cover of device 140 (eg, through a portion of the rear cover defining protrusion 151).

[0118] Other details regarding the sensor array, individual cameras of the sensor array, and / or flash described with respect to device 100 may apply to the sensor array, individual cameras, and / or flash of device 140, and such details will not be repeated here to avoid redundancy.

[0119] Figure 2 An exploded view of an exemplary electronic device is shown. Specifically, Figure 2 An exploded view of the device 200 is shown, illustrating various components of the device 200 and exemplary arrangements and configurations of these components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 2 The device 200 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0120] like Figure 2 As shown, the device 200 includes a cover 202 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 202 may be formed of a glass or glass-ceramic material. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 202. In some cases, the cover 202 may include a sheet or optical processing element of chemically strengthened glass or glass-ceramic, the sheet having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings. In some cases, the cover 202 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 202 to form a compressive stress layer along the outer surface of the cover 202.

[0121] The cover 202 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 210. As described in more detail below, the edges or sides of the cover 202 can be surrounded by a protective flange or lip of the housing 210 without a gap component between the edge of the cover 202 and the corresponding flange of the housing 210. This configuration can allow impacts or forces applied to the housing 210 to be transferred to the cover 202 without directly transferring shear stresses through the display 203 or the frame 204.

[0122] like Figure 2 As shown, the display 203 is attached to the inner surface of the cover 202. The display 203 may include a borderless organic light emitting diode (OLED) display that measures 13.7 cm (5.4 inches) corner to corner. The perimeter or inactive area of ​​the display 203 may be reduced to allow a very thin device border around the active area of ​​the display 203. In some cases, the display 203 allows a border area of ​​1.5 mm or thinner. In some cases, the display 203 allows a border area of ​​1 mm or thinner. In an exemplary implementation, the border area is about 0.9 mm. The display 203 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, the display 203 has a pixel density of about 475 PPI. The display 203 may have an integrated (on-cell) touch sensing system. For example, the electrode array integrated into the OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. The electrodes may be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the exterior surface of cover 202. In some cases, display 203 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, device 200 may include one or more touch and / or force sensing layers positioned between display 203 and cover 202.

[0123] The display 203 (also referred to as the display stack) may include an always-on display (AOD) function. For example, the display 203 may be configured to allow a subset of a specified area or pixels to be displayed when the device 200 is powered on, so that the graphical content is visible to the user even when the device 200 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications, and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always-on graphical output. Although some battery power may be consumed when displaying a persistent or always-on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 203. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution to reduce the power consumption of the display 203.

[0124] like Figure 2As shown, the device 200 may also include a frame member 204 (also referred to simply as frame 204) positioned below the cover 202 and extending around at least one outer perimeter of the display 203. The perimeter of the frame 204 may be attached to the lower surface or inner surface of the cover 202. A portion of the frame 204 may extend below the display 203 and may attach the cover 202 to the housing 210. Because the display 203 is attached to the lower surface or inner surface of the cover 202, the frame 204 may also be described as attaching both the display 203 and the cover 202 to the housing 210. The frame 204 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 204 may support elements of the display stack, provide anchor points for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 204 includes one or more metallic or conductive elements that provide shielding between device components, such as between a display stack (including a display component and a touch sensor component) and other components such as a tactile actuator 222, a speaker system 224, etc.

[0125] The cover 202, display stack 203, and frame member 204 can be part of the top module 201 of the device 200. The top module 201 can be assembled as a subassembly, which can then be attached to the housing member. For example, as described herein, the display 203 can be attached to the cover 202 (e.g., via a transparent adhesive), and the frame member 204 can be attached to the cover around the perimeter of the display stack 203 (e.g., via an adhesive). The top module 201 can then be attached to the housing member of the device 200 by mounting and adhering the frame member 204 to the boss defined by the housing member.

[0126] The device 200 also includes a speaker module 250, which is configured to output sound via a speaker port. The speaker port may be positioned in a recess 251 of the cover 202 and / or at least partially defined by the recess. As described herein, the decorative member may be at least partially positioned in the recess 251 to facilitate the output of sound while also inhibiting debris, liquids, or other materials or contaminants from entering the device 200. The output from the speaker module 250 may pass through an acoustic path at least partially defined by the speaker module 250 itself and the decorative member. In some cases, a portion of the acoustic path (e.g., between the speaker module 250 and the decorative member) is defined by the housing 210 and / or a molded material coupled to the housing 210. For example, a molded material (e.g., a fiber reinforced polymer) may be molded against a metal portion of the housing 210 (e.g., the housing member 213 described herein). The molded material may also form one or more joint structures that also structurally join the housing members together (e.g., joint structure 218). A channel (e.g., a tubular tunnel) can be defined through the molded material to more generally acoustically couple the speaker module 250 to the trim and / or recessed portion 251 to direct sound from the speaker module 250 to the exterior of the device 200. In some cases, a portion of the channel extending through the molded material is defined by the housing member itself, as described herein with reference to FIG. 6A to FIG. 6B described.

[0127] like Figure 2 As shown, the device 200 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 200 includes a front camera 206, which includes a high-resolution camera sensor. The front camera 206 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The device 200 also includes a facial recognition sensor 252, which includes an infrared light projector and an infrared light sensor that are configured to sense a depth point array or area along the user's face. The depth point array can be characterized as a unique feature or biometric identifier that can be used to identify the user and unlock the device 200 or authorize functions on the device 200, such as purchasing a software application or using a payment function provided by the device 200.

[0128] The device 200 may also include one or more other sensors or components. For example, the device 200 may include a front light illuminator element for providing a flash or illumination to the front camera 206. The device 200 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting exposure aspects of the front camera 206 and / or for controlling the operation of a display.

[0129] Figure 2 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 2 As shown, these elements can be part of the sensor array 260. In this example, the sensor array 260 includes a first camera 261 having a 12-megapixel image sensor and a wide-angle lens with an aperture number of f / 1.6. The first camera 261 also includes a dual photodiode sensor with an APS+ sensor format. The sensor array 260 also includes a second camera 262 having a 12-megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture number of f / 2.4. The sensor array 260 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. The sensor array 260 is also characterized by an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, the sensor array 260 also includes a microphone, an ambient light sensor, a depth sensor, and / or other sensors suitable for sensing along the rear surface of the device 200.

[0130] like Figure 2 As shown, cameras 261 and 262 can be aligned with camera covers 263 and 264, respectively. Covers 263, 264 can be formed of glass, glass ceramic, or sapphire materials and can provide transparent windows through which cameras 261, 262 can capture photographic images. In other cases, covers 263, 264 are optical lenses that filter, amplify, or otherwise condition the light received by the respective cameras 261, 262. Other sensing or transmitting elements of sensor array 260 can transmit and / or receive signals through areas of rear cover 272 or through separate covers coupled to rear cover 272. As shown in FIG. Figure 2 As shown, covers 263, 264 may extend beyond the outer surface of cover 272, and may define recesses along the inner side of cover 272, so that lenses or other elements of cameras 261 and 262 may extend into the corresponding recesses. In this way, device 200 may accommodate larger lenses or other elements of cameras 261, 262 than may be accommodated if recesses are not provided.

[0131] The device 200 also includes a battery 230. The battery 230 provides power to the device 200 and its various systems and components. The battery 230 may include a 4.45V lithium-ion battery encapsulated in a foil or other encapsulating element (e.g., a soft pack). The battery 230 may be attached to the device 200 (e.g., to the base 219) using one or more adhesives and / or other attachment techniques. In one example, the battery 230 may be attached to the base 219 or another structure of the device 200 using two layers of adhesive, wherein the first adhesive adheres to the battery 230 and the second adhesive, and the second adhesive adheres to the first adhesive and the base 219 (or other structures of the device 200). The first adhesive and the second adhesive may have different properties, such as different stiffness (e.g., Young's modulus), different adhesive properties, etc. For example, in some cases, the first adhesive is configured to adhere to the material of the battery 230 (e.g., with an adhesive strength greater than a threshold), and the second adhesive is configured to adhere to the base 219 or other structure of the device (e.g., with an adhesive strength greater than a threshold). In such cases, the first adhesive may not form a sufficiently strong bond with the base 219, and the second adhesive may not form a sufficiently strong bond with the battery 230, but the first adhesive and the second adhesive may form a sufficiently strong bond with each other. Thus, by using two different adhesives (e.g., in the described layered configuration) to ultimately secure the battery 230 to the base 219, the overall strength and / or security of the attachment may be greater than when a single adhesive is used.

[0132] Battery 230 may be recharged via charging port 232 (e.g., from a power cord inserted into charging port 232 through charging access opening 226) and / or via wireless charging system 240. Battery 230 may be coupled to charging port 232 and / or wireless charging system 240 via battery control circuitry that controls power provided to the battery and power provided by the battery to device 200. Battery 230 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0133] The charging system 240 may include a coil inductively coupled to an output coil or a transmission coil of a wireless charger. The coil may provide current to the device 200 to charge the battery 230 and / or power the device. In this example, the charging system 240 includes a coil assembly 242, which includes a plurality of turns of a wound conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 242 also includes or is associated with an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help position the device 200 relative to a separate wireless charging device or other accessory. In some specific implementations, the magnet array also helps to radially position, orient, or "rotate" the device 200 relative to a separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to a separate charging device in a specific orientation or a set of discrete orientations to help position the device 200 relative to a separate charging device or other accessory. This function may be described as self-aligning or self-positioning wireless charging. like Figure 2 As shown, the device 200 also includes a magnetic reference 244 for helping to position a separate wireless charging device or accessory. In one example, the magnetic reference 244 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 200 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. In addition, by magnetically coupling the cable or power cord to the rear surface of the device 200, the charging device or other accessory can be more securely coupled to the device 200.

[0134] In some implementations, the wireless charging system 240 includes an antenna or other element that detects the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna that is suitable for receiving and / or sending wireless communications between the device 200 and the wireless charger or other accessory. In some cases, the device 200 is suitable for performing wireless communications to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the status of the device, the amount of charge held by the battery 230, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0135] The device 200 may also include a speaker system 224. The speaker system 224 may be positioned in the device 200 so that the corresponding port 235 is aligned with or otherwise close to the audio output of the speaker system 224. Therefore, the sound output by the speaker system 224 leaves the housing 210 via the corresponding port 235. The speaker system 224 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 224 may include a left speaker and a right speaker aligned with the left port 225 and the right port 235, respectively, so as to produce stereo sound.

[0136] The device 200 may also include a tactile actuator 222. The tactile actuator 222 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the tactile actuator 222 may have a profile or housing shape that facilitates physical integration with the battery 230 and other components of the device 200 so as to minimize space and / or maximize the size of the battery.

[0137] When the coil is energized, the coil can cause the mass to move, which causes a force to be applied to the device 200. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an external surface of the device 200. The tactile actuator 222 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 222, other types of tactile actuators can be used.

[0138] The device 200 also includes a logic board 220 (also referred to herein as a circuit board assembly). The logic board 220 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 220 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 220 may include a device for a subscriber identity module (SIM). The logic board 220 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 220 may include a device for an electronic SIM. The logic board 220 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0139] The logic board 220 may also include wireless communication circuitry that may be coupled to housing members 211, 212, 213, 214, 215, or 216 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members to provide wireless communication. The logic board 220 may also include components such as accelerometers, gyroscopes, near field communication circuitry and / or antennas, compasses, and the like. In some implementations, the logic board 220 may include a magnetometer suitable for detecting and / or locating accessories. For example, the magnetometer may be suitable for detecting magnetic (or non-magnetic) signals generated by accessories of the device 200 or other devices. The output of the magnetometer may include a directional output that may be used to display directional markings or other navigation guidance on the display 203 to guide the user toward the location of the accessory or other device.

[0140] The device 200 may also include one or more pressure transducers that may be operable to detect changes in external pressure in order to determine changes in altitude. The pressure sensors may be disposed outside and / or positioned within the water-tight interior volume of the housing 210. The output of the pressure sensors may be used to track stairs climbed, positions (e.g., floors) of a multi-story structure, movements performed during an activity in order to estimate physical exertion or calories burned, or other relative movement of the device 200.

[0141] The logic board 220 may also include global positioning system (GPS) electronics that may be used to determine the location of the device 200 relative to one or more satellites (e.g., a global navigation satellite system (GNSS)) in order to estimate the absolute location of the device 200. In some implementations, the GPS electronics may be operable to utilize dual frequency bands. For example, the GPS electronics may estimate the location of the device 200 using L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands.

[0142] Housing 210 may also include a base 219 that may be attached to housing 210. Base 219 may be formed of metal and may serve as a structural mounting point for components of device 200. Base 219 may define an opening corresponding to the size of coil assembly 242 of wireless charging system 240 such that base 219 does not shield wireless coil assembly 242 or otherwise adversely affect inductive coupling between the coil of charging system 240 and an external wireless charger or accessory.

[0143] like Figure 2As shown, the housing may include a cover 272 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 200. The cover 272 may be formed of a glass (or glass-ceramic) substrate having a portion having a thickness of less than 1 mm. In some cases, the sheet substrate has a portion less than 0.80 mm. In some cases, the glass substrate has a portion of approximately 0.60 mm or thinner. The cover 272 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera cover 263, 264. The cover 272 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a rough appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 272 to provide the desired optical effect and final color for the device 200.

[0144] Similar to that described above with respect to cover 202, cover 272 can be at least partially positioned within an opening defined in housing 210. Also similar to that described above with respect to cover 202, the edges or sides of cover 272 can be surrounded by a protective flange or lip of housing 210 without intervening features between the edges of cover 272 and the corresponding flanges of housing 210. Cover 272 is typically chemically strengthened using an ion exchange process to form a compressive stress layer along the exterior surface of cover 272.

[0145] As described above, the housing 210 may include housing members 211, 212, 213, 214, 215, and 216 that are structurally joined together via a joint structure 218. The joint structure 218 (e.g., the material of the joint structure) may extend over the inner surface of the housing member. More specifically, a portion of the joint structure 218 may contact, cover, encapsulate, and / or engage with a retention feature of the housing member extending from the inner surface of the housing member.

[0146] The housing members 211, 212, 213, 214, 215 and 216 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 211, 212, 213, 214, 215 and 216 may provide a sturdy and impact-resistant sidewall for the device 200. In this example, the housing members 211, 212, 213, 214, 215 and 216 define a flat sidewall extending around the periphery of the device 200. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 210. The housing members 211, 212, 213, 214, 215 and 216 may each have a flange portion or lip extending around the respective sides of the front cover 202 and the rear cover 272 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 202 and the rear cover 272. This can allow forces or impacts applied to the housing 210 to be transferred to the front cover 202 and the rear cover 272 without affecting the display or other internal structural elements, which can improve the drop performance of the device 200.

[0147] like Figure 2 As shown, the device 200 includes multiple antennas that can be suitable for wireless communication using a 5G communication protocol. Specifically, the device 200 may include a (side-transmitting) antenna array 282, which is configured to send and receive wireless communication signals through an antenna window 283 or waveguide formed along the side wall of the housing 210 or otherwise integrated with the side wall. The side-transmitting antenna array 282 can be coupled to the logic board 220 via a flexible circuit element or other conductive connector, as described herein. The device 200 may also include a rear antenna module 284, which may include one or more (rear-transmitting) antenna arrays, which are configured to send and receive wireless communication signals through the cover 272. The antenna module 284 can be attached to the back surface or bottom surface of the logic board 220.

[0148] The antenna module 284 may include multiple antenna arrays. For example, the antenna module 284 may include one or more millimeter wave antenna arrays. In the case where the antenna module 284 includes multiple millimeter wave antenna arrays (each antenna array may include one or more radiating elements), the multiple millimeter wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module 284 may also include one or more ultra-wideband antennas.

[0149] Each of these antenna arrays (e.g., antenna array 284 and the millimeter wave array of antenna module 282) may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 200 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing components 211, 212, 213, 214, 215, and 216 may be adapted to operate as antennas for a MIMO wireless communication scheme (or other wireless communication schemes).

[0150] Figure 3 An exploded view of an exemplary electronic device is shown. Specifically, Figure 3 An exploded view of device 300 is shown, illustrating various components of device 300 and exemplary arrangements and configurations of those components. Figure 1A and Figure 1B The description of the various components and elements of the apparatus 100 may also apply to Figure 3 The device 300 is shown. For the sake of clarity, redundant descriptions of some components are not repeated herein.

[0151] like Figure 3 As shown, the device 300 includes a cover 302 (e.g., a front cover) that may be formed of glass, ceramic, or other transparent substrates. In this example, the cover 302 may be formed of glass or glass-ceramic materials. The glass-ceramic material may include an amorphous phase and a crystalline phase or a non-amorphous phase of one or more materials, and may be formulated to improve the strength or other properties of the cover 302. In some cases, the cover 302 may include a sheet or optical processing element of a chemically strengthened material having one or more coatings, the one or more coatings including an anti-reflective (AR) coating, an oleophobic coating, or other types of coatings. In some cases, the cover 302 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 302 to form a compressive stress layer along the outer surface of the cover 302.

[0152] The cover 302 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 310. As described in more detail below, the edges or sides of the cover 302 can be surrounded by a protective flange or lip of the housing 310 without a gap component between the edge of the cover 302 and the corresponding flange of the housing 310. This configuration can allow impacts or forces applied to the housing 310 to be transferred to the cover 302 without directly transferring shear stresses through the display 303 or the frame 304.

[0153] like Figure 3 As shown, the display 303 is coupled to the inner surface of the cover 302. The display 303 may include a borderless organic light emitting diode (OLED) display that measures 16.97 cm (6.68 inches) corner to corner. The perimeter or inactive area of ​​the display 303 may be reduced to allow a very thin device border around the active area of ​​the display 303. In some cases, the display 303 allows a border area of ​​1.5 mm or thinner. In some cases, the display 303 allows a border area of ​​1 mm or thinner. In an exemplary implementation, the border area is about 0.9 mm. The display 303 may have a relatively high pixel density of about 450 pixels per inch (PPI) or greater. In some cases, the display 303 has a pixel density of about 458 PPI. The display 303 may have an integrated (on-cell) touch sensing system. For example, the electrode array integrated into the OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. The electrodes may be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the exterior surface of cover 302. In some cases, display 303 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, device 300 may include one or more touch and / or force sensing layers positioned between display 303 and cover 302.

[0154] The display 303 may include an always on display (AOD) function. For example, the display 303 may be configured to allow a subset of a specified area or pixels to be displayed when the device 300 is powered on, so that the graphical content is visible to the user even when the device 300 is in low power or sleep mode. This may allow the time, date, battery status, recent notifications and other graphical content to be displayed in low power or sleep mode. The graphical content may be referred to as a persistent or always on graphical output. Although some battery power may be consumed when displaying a persistent or always on graphical output, the power consumption is generally less than the power consumption during normal or full power operation of the display 303. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution to reduce the power consumption of the display 303.

[0155] like Figure 3 As shown, the device 300 may also include a frame 304, which is positioned below the cover 302 and extends around the outer periphery of the display 303. The periphery of the frame 304 may be attached to the lower surface or inner surface of the cover 302. A portion of the frame 304 may extend below the display 303 and may attach the cover 302 to the housing 310. Because the display 303 is attached to the lower surface or inner surface of the cover 302, the frame 304 may also be described as attaching both the display 303 and the cover 302 to the housing 310. The frame 304 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 304 may support elements of the display stack, provide an anchor point for the flexible circuit, and / or be used to mount other components and device elements. In some cases, the frame 304 includes one or more metal or conductive elements that provide shielding between device components, such as providing shielding between the display stack (including the display component and the touch sensor component) and other components such as the tactile actuator 322, the speaker system 324, etc.

[0156] The cover 302, the display or display stack 303, and the frame member 304 can be part of the top module 301 of the device 300. The top module 301 can be assembled as a subassembly, which can then be attached to the housing member. For example, as described herein, the display 303 can be attached to the cover 302 (e.g., via a transparent adhesive), and the frame member 304 can be attached to the cover around the perimeter of the display stack 303 (e.g., via an adhesive). The top module 301 can then be attached to the housing member of the device 300 by mounting and adhering the frame member 304 to the boss defined by the housing member.

[0157] The device 300 also includes a speaker module 350 configured to output sound via a speaker port. The speaker port may be positioned in and / or at least partially defined by a recess 351 of the cover 302. As described herein, a decorative member may be at least partially positioned in the recess 351 to facilitate the output of sound while also inhibiting debris, liquid, or other materials or contaminants from entering the device 300. The output from the speaker module 350 may pass through an acoustic path at least partially defined by the speaker module 350 itself and the decorative member. In some cases, a portion of the acoustic path (e.g., between the speaker module 350 and the decorative member) is defined by the housing 310 and / or a molded material coupled to the housing 310. For example, a molded material (e.g., a fiber reinforced polymer) may be molded against a metal portion of the housing 310 (e.g., a housing member 313 described herein). The molded material may also form one or more joint structures that also structurally join the housing members together (e.g., joint structure 318). A port may be defined through the molded material to more generally acoustically couple the speaker module 350 to the trim and / or recess 351 to direct sound from the speaker module 350 to the exterior of the device 300. In some cases, a portion of the port extending through the molded material is defined by the housing member itself, as described herein with reference to FIG. 6A to FIG. 6B described.

[0158] like Figure 3 As shown, the device 300 also includes one or more cameras, light emitters and / or sensing elements configured to transmit signals, receive signals or otherwise operate along the front surface of the device. In this example, the device 300 includes a front camera 306, which includes a high-resolution camera sensor. The front camera 306 may have a 12-megapixel resolution sensor with optical elements that provide a fixed focus and an 85° field of view. The front camera 306 may have an aperture number of f / 2.2. The device 300 also includes a facial recognition sensor 352, which includes an infrared light projector and an infrared light sensor that are configured to sense a depth point array or area along the user's face. The depth point array can be characterized as a unique feature or biometric identifier that can be used to identify the user and unlock the device 300 or authorize functions on the device 300, such as purchasing software applications or using payment functions provided by the device 300.

[0159] The device 300 may also include one or more other sensors or components. For example, the device 300 may include a front light illuminator element for providing a flash or illumination to the front camera 306. The device 300 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting exposure aspects of the front camera 306 and / or for controlling the operation of a display.

[0160] Figure 3 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 3 As shown, these elements may be integrated into the sensor array 360. In this example, the sensor array 360 includes a first camera 361 having a 12 megapixel image sensor and a wide-angle lens with an aperture of f / 1.6. The first camera 361 may also include a sensor shift mechanism that allows image stabilization and / or optical focusing. In some cases, the image sensor moves relative to one or more fixed elements of the optical lens assembly. The sensor array 360 also includes a second camera 362 having a 12 megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture of f / 2.2. The sensor array 360 may also include a third camera 363 having a 12 megapixel image sensor and a telephoto optical lens assembly that achieves 2.5x optical zoom. The third camera 363 may also have an aperture of f / 2.4.

[0161] Sensor array 360 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. Sensor array 360 also features an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, sensor array 360 also includes microphones, ambient light sensors, and other sensors suitable for sensing along the back surface of device 300.

[0162] The sensor array 360 may also include a depth sensor 365 that is capable of estimating the distance to an object positioned behind the device 300. The depth sensor module 365 may include an optical sensor that uses time of flight or other optical effects to measure the distance between the device 300 and an external object. The depth sensor 365 may include one or more optical emitters suitable for emitting one or more light beams that can be used to estimate the distance. In some cases, the one or more light beams are coherent light beams with substantially uniform wavelengths / frequency. Coherent light sources may facilitate depth measurement using time of flight, phase shift or other optical effects. In some cases, the depth sensor 365 uses sound output, radio output or other types of output that can be used to measure the distance between the device 300 and one or more external objects. The depth sensor 365 may be positioned near a window 371 (e.g., an area of ​​the rear cover 372 or other components covering the components of the sensor array 360), through which the depth sensor 365 can send and / or receive signals (e.g., laser, infrared light, visible light, etc.).

[0163] like Figure 3 As shown, cameras 361, 362, 363 can be aligned with camera covers 366, 367, 368, respectively. Covers 366, 367, 368 can be formed of glass or sapphire materials and can provide transparent windows through which cameras 361, 362, 363 can capture photographic images. In other cases, covers 366, 367, 368 are optical lenses that filter, amplify, or otherwise adjust the light received by the corresponding cameras 361, 362, 363. Other sensing or transmitting elements of sensor array 360 can transmit and / or receive signals through areas of rear cover 372 or through a separate cover (e.g., 369) coupled to rear cover 372. As shown in FIG. Figure 3 As shown, covers 366, 367, 368 may extend beyond the outer surface of cover 372 and may define recesses along the inner side of cover 372 so that lenses or other elements of cameras 361, 362, 363 may extend into the corresponding recesses. In this way, device 300 may accommodate larger lenses or other elements of cameras 361, 362, 363 than may be accommodated if recesses are not provided.

[0164] The device 300 also includes a battery 330. The battery 330 provides power to the device 300 and its various systems and components. The battery 330 may include a 4.40V lithium-ion battery encapsulated in a foil or other encapsulating element. The battery 330 may include a wound electrode configuration, sometimes referred to as a "jelly roll" or folded electrode configuration. The battery 330 may be recharged via a charging port 332 (e.g., from a power cord inserted into the charging port 332 through the charging access opening 326) and / or via a wireless charging system 340. The battery 330 may be coupled to the charging port 332 and / or the wireless charging system 340 via a battery control circuit that controls the power provided to the battery and the power provided by the battery to the device 300. The battery 330 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0165] The wireless charging system 340 may include a coil inductively coupled to an output or transmission coil of the wireless charger. The coil may provide current to the device 300 to charge the battery 330 and / or power the device. In this example, the wireless charging system 340 includes a coil assembly 342, which includes multiple turns of conductive wire or other conduit configured to generate an electric current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 342 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may help to position the device 300 relative to the separate wireless charging device or other accessory. In some embodiments, the magnet array also helps to radially position, orient, or "rotate" the device 300 relative to the separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to the separate charging device in a specific orientation or a set of discrete orientations to help position the device 300 relative to the separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 3 As shown, the device 300 also includes a magnetic reference 344 for assisting in positioning a separate wireless charging device or accessory. In one example, the magnetic reference 344 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 300 and the separate wireless charging device or other accessory can be maintained relative to an absolute position or a single position. In addition, by magnetically coupling the cable or power cord to the rear surface of the device 300, the charging device or other accessory can be more securely coupled to the device 300.

[0166] In some implementations, the wireless charging system 340 includes an antenna or other element that detects the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna that is suitable for receiving and / or sending wireless communications between the device 300 and the wireless charger or other accessory. In some cases, the device 300 is suitable for performing wireless communications to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the status of the device, the amount of charge held by the battery 330, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0167] The device 300 may also include a speaker system 324. The speaker system 324 may be positioned in the device 300 so that the corresponding port 325 is aligned with or otherwise close to the audio output of the speaker system 324. Therefore, the sound output by the speaker system 324 leaves the housing 310 via the corresponding port 325. The speaker system 324 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker. The speaker system 324 may include a left speaker and a right speaker aligned with the left port and the right port 325, respectively, to produce stereo sound.

[0168] The device 300 may also include a haptic actuator 322. The haptic actuator 322 may include a movable mass and an actuation system configured to move the mass to produce a tactile output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnets may be or may include recycled magnetic materials. As described herein, the haptic actuator 322 may have a profile or housing shape that facilitates physical integration with the battery 330 and other components of the device 300 so as to minimize space and / or maximize the size of the battery.

[0169] When the coil is energized, the coil can cause the mass to move, which results in a force being exerted on the device 300. The movement of the mass can be configured to cause a vibration, pulse, tap, or other tactile output detectable via an external surface of the device 300. The tactile actuator 322 can be configured to move the mass linearly, but other movements (e.g., rotation) are also contemplated. As an alternative or in addition to the tactile actuator 322, other types of tactile actuators can be used.

[0170] The device 300 also includes a logic board 320 (also referred to herein as a circuit board assembly). The logic board 320 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 320 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 320 may include a device for a subscriber identity module (SIM). The logic board 320 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 320 may include a device for an electronic SIM. The logic board 320 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0171] The logic board 320 may also include wireless communication circuitry that may be coupled to housing members 311, 312, 313, 314, 315, or 316 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members or structures to provide wireless communication. The logic board 320 may also include components such as accelerometers, gyroscopes, near field communication circuitry and / or antennas, compasses, and the like. In some implementations, the logic board 320 may include a magnetometer suitable for detecting and / or locating an accessory. For example, the magnetometer may be suitable for detecting magnetic (or non-magnetic) signals generated by an accessory of the device 300 or other device. The output of the magnetometer may include a directional output that may be used to display directional markings or other navigation guidance on the display 303 to guide the user toward the location of the accessory or other device.

[0172] The device 300 may also include one or more pressure transducers that may be operable to detect changes in external pressure in order to determine changes in altitude. The pressure sensors may be disposed outside and / or positioned within the water-tight interior volume of the housing 310. The output of the pressure sensors may be used to track stairs climbed, positions (e.g., floors) of a multi-story structure, movements performed during an activity in order to estimate physical exertion or calories burned, or other relative movement of the device 300.

[0173] The logic board 320 may also include global positioning system (GPS) electronics that may be used to determine the location of the device 300 relative to one or more satellites (e.g., a global navigation satellite system (GNSS)) in order to estimate the absolute location of the device 300. In some implementations, the GPS electronics may be operable to utilize dual frequency bands. For example, the GPS electronics may estimate the location of the device 300 using L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands.

[0174] Housing 310 may also include a base 319 that may be attached to housing 310. Base 319 may be formed of metal and may serve as a structural mounting point for components of device 300. Base 319 may define an opening corresponding to the size of coil assembly 342 of wireless charging system 340 such that base 319 does not shield wireless coil assembly 342 or otherwise adversely affect inductive coupling between the coil of wireless charging system 340 and an external wireless charger or accessory.

[0175] like Figure 3As shown, the housing may include a cover 372 (e.g., a rear cover or back cover) that may define substantially the entire rear surface of the device 300. The cover 372 may be formed of glass, glass ceramic, or other materials having a portion less than 1 mm thick. In some cases, the substrate has a portion less than 0.80 mm. In some cases, the substrate has a portion of approximately 0.60 mm or thinner. The cover 372 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera covers 366, 367, 368. The cover 372 may be machined (e.g., ground) into a final shape to provide a desired surface finish before being polished and / or textured. The texture may be specifically configured to provide a rough appearance while also resisting the accumulation of collected skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 372 to provide the desired optical effect and final color for the device 300.

[0176] Similar to what is described above with respect to cover 302, cover 372 can be at least partially positioned within an opening defined in housing 310. Also similar to what is described above with respect to cover 302, the edges or sides of cover 372 can be surrounded by a protective flange or lip of housing 310 without a gap component between the edge of cover 372 and the corresponding flange of housing 310. Cover 372 can be chemically strengthened using an ion exchange process to form a compressive stress layer along the outer surface of cover 372. In some cases, (rear) cover 372 is formed of the same or similar material as (front) cover 302.

[0177] As described above, housing 310 may include housing members 311, 312, 313, 314, 315, and 316 that are structurally joined together via joint structure 318. Joint structure 318 (e.g., the material of the joint structure) may extend over the inner surface of the housing members. More specifically, a portion of joint structure 318 may contact, cover, encapsulate, and / or engage with a retention feature of the housing member extending from the inner surface of the housing member.

[0178] The housing members 311, 312, 313, 314, 315 and 316 may also be referred to herein as housing segments, and may be formed of aluminum, stainless steel or other metal or metal alloy materials. As described herein, the housing members 311, 312, 313, 314, 315 and 316 may provide a sturdy and impact-resistant sidewall for the device 300. In this example, the housing members 311, 312, 313, 314, 315 and 316 define a flat sidewall extending around the periphery of the device 300. The flat sidewall may include rounded or chamfered edges of the upper and lower edges of the sidewalls defining the housing 310. The housing members 311, 312, 313, 314, 315 and 316 may each have a flange portion or lip extending around the respective sides of the front cover 302 and the rear cover 372 and at least partially covering the respective sides. There may be no gap material or elements between the flange portion or lip and the corresponding side surfaces of the front cover 302 and the rear cover 372. This can allow forces or impacts applied to the housing 310 to be transferred to the front cover 302 and the rear cover 372 without affecting the display or other internal structural elements, which can improve the drop performance of the device 300.

[0179] like Figure 3 As shown, the device 300 includes multiple antennas that can be suitable for wireless communication using a 5G communication protocol. Specifically, the device 300 may include a (side-transmitting) antenna array 382, ​​which is configured to send and receive wireless communication signals through an antenna window 383 or waveguide formed along the side wall of the housing 310 or otherwise integrated with the side wall. The side-transmitting antenna array 382 can be coupled to the logic board 320 via a flexible circuit element or other conductive connector, as described herein. The device 300 may also include a rear antenna module 384, which may include one or more (rear-transmitting) antenna arrays, which are configured to send and receive wireless communication signals through the cover 372. The antenna module 384 can be attached to the back surface or bottom surface of the logic board 320.

[0180] The antenna module 384 may include multiple antenna arrays. For example, the antenna module 384 may include one or more millimeter wave antenna arrays. In the case where the antenna module 384 includes multiple millimeter wave antenna arrays (each of which may include one or more radiating elements), the multiple millimeter wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module 384 may also include one or more ultra-wideband antennas.

[0181] Each of these antenna arrays (e.g., antenna array 384 and the millimeter wave array of antenna module 382) may be adapted to perform millimeter wave 5G communications and may be adapted to use or be used with beamforming or other techniques to adapt signal reception depending on the use case. Device 300 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing components 311, 312, 313, 314, 315, and 316 may be adapted to operate as antennas for a MIMO wireless communication scheme (or other wireless communication scheme).

[0182] FIG. 4A to FIG. 4B A partial view of an exemplary electronic device 400 is shown. FIG. 4A to FIG. 4B The portion shown in may correspond to Figure 1A 4-4 in FIG. 4 , but the same or similar regions may exist on other exemplary devices described herein. Electronic device 400 may correspond to or be an embodiment of electronic device 100 , 200 , or 300 or any other device described herein. FIG. 4A to FIG. 4B An exemplary configuration of a speaker port 401 and a forward-facing sensor area is shown.

[0183] The device 400 includes a cover 402 and a housing member 404, which may correspond to or be other embodiments of the covers described herein, such as covers 102, 202, 302, and which may correspond to or be other embodiments of the housing members described herein, such as housing members 127, 213, 313, and which may define at least a portion of the four side surfaces of the device. Figure 4C As shown, the cover 402 may define a front surface 432, a rear surface 434, and a peripheral side surface 436 extending from the front surface 432 to the rear surface 434. The peripheral side surface 436 is at least partially surrounded by the wall 407 of the housing 404 ( Figure 4C ).

[0184] The cover 402 defines a notch 406 along an edge of the cover 402. The notch 406 (also referred to as a recess or cutout) may be along a top edge of the cover 402 to define a space between the edge of the cover 402 and the housing member 404, which defines a top side of the device 400. The space between the edge of the cover 402 and the housing member 404 may be referred to as a speaker port opening. A first side of the speaker port opening may be defined by a wall 407 of the housing member, and a second side of the speaker port opening may be defined by the notch 406 of the front cover 402. The notch 406 may define at least three sides of the speaker port opening, including a third side and a fourth side of the speaker port opening, as shown. FIG. 4A to FIG. 4C shown.

[0185] The recess 406 can at least partially define an acoustic path for the device. For example, sound from a speaker positioned within the device can pass through the space defined by the recess (e.g., between the peripheral side surface of the cover 402 and the wall of the housing 404). Because the speaker port 401 is near the top of the device, the speaker port 401 is ultimately disposed at an area of ​​the device 400 that can be held against a user's ear during a phone call or other use.

[0186] The device 400 may include a speaker port cover structure 405 (also referred to as an acoustic port cover). The speaker port cover structure 405 may be at least partially positioned in the recess 406 and between an edge portion of the cover 402 (in which the recess 406 is defined) and the housing member 404. The speaker port cover structure 405 may include a decorative member 408 and a mesh member 410. The decorative member 408 may be adjacent to the edge of the cover 402 and adjacent to the housing member 404. The front surface of the decorative member 408 may be flush with the front exterior surface 432 of the cover 402. In some cases, there is no gap component or material between the decorative member 408 and the cover 402 or between the decorative member 408 and the housing member 404. As described herein, the speaker port cover structure 405 provides a cover over a portion of the acoustic path in the device 400 that guides sound from the speaker module to the speaker port 401. In some cases, the speaker port cover structure 405 also covers an acoustic path coupled to a microphone within the device, as described in more detail herein.

[0187] The mesh member 410 may be configured to allow sound to pass through while inhibiting dust, liquid or other contaminants from entering the device 400. The mesh member 410 may be a metal mesh, a polymer mesh, etc. The mesh member 410 may be an integral structure having holes or gaps formed therethrough (e.g., a perforated or molded polymer sheet), or it may be formed by a plurality of separate members (e.g., a woven fabric or a metal mesh). In some cases, an area between about 30% and about 40% of the mesh member 410 may be open (e.g., an opening or perforation defined by a mesh may constitute an area between about 30% and about 40% of the mesh member 410). In this way, sound may pass through the mesh member 410 without excessive attenuation or other acoustic impacts.

[0188] FIG. 4A to FIG. 4BAlso shown is an exemplary arrangement of components in a forward-pointing sensor array 411 that may be at least partially surrounded by an active area 415 of a display. Forward-pointing sensor array 411 includes a forward-pointing camera 412, a proximity sensor 414, a combination flood illuminator and dot projector 416 (e.g., for projecting flood illumination and dot patterns onto an object such as a user's face), and an infrared light sensor 418 (e.g., for capturing an image of the object illuminated by the flood illuminator and dot projector). Each of the components in forward-pointing sensor array 411 may be positioned below cover 402 and may transmit and / or receive light through cover 402. In some cases, areas of cover 402 above particular components of forward-pointing sensor array 411 have a mask that is visually opaque but transparent to particular wavelengths of light utilized by the underlying sensor. For example, in some implementations, combination flood illuminator and dot projector 416 and infrared light sensor 418 are covered with a visually opaque infrared transparent coating or material.

[0189] Forward sensor array 411 may be located in a portion of the front inactive display area of ​​the device. For example, the lines shown enclosing forward camera 412, proximity sensor 414, combined flood illuminator and dot projector 416, and infrared light sensor 418 may indicate a boundary between active area 415 of the display and an area that does not include a display or is not configured to produce graphical output. Forward sensor array 411 may include a visually opaque mask, ink, coating, or other material.

[0190] Figure 4B Another view of device 400 is shown, showing additional details of forward sensor array 411 and speaker port 401. In some cases, speaker port 401, and more specifically trim 408 and mesh member 410, may be positioned outside of glue line 426. Glue line 426 may adhere cover 402 (and / or top module) of the device to underlying structure (e.g., housing member 404), and may define a seal that inhibits dust, liquid, or other contaminants or debris from entering the device. Because speaker port 401 is outside of glue line 426, other seals and sealing techniques may be used to inhibit dust, liquid, or other contaminants or debris from entering the device via speaker port 401.

[0191] As described above, the speaker port cover structure 405 can provide acoustic access to both the speaker module and the microphone. In some cases, the divider 424 can be positioned in the speaker port cover structure 405 (e.g., relative to the speaker module). Figure 4C ) to increase the acoustic spacing and / or isolation between the acoustic paths to the microphone and to the speaker. Figure 4BAs shown, area 422 of speaker port cover structure 405 can correspond to the acoustic path of the microphone (e.g., acoustic input path), and area 420 of speaker port cover structure 405 can correspond to the acoustic path of the speaker (e.g., acoustic output path). Spacer 424 can be a piece of metal, plastic, or any other suitable material.

[0192] Figure 4C A partial exploded view of device 400 is shown, showing additional detail of the integration of speaker port cover structure 405 with cover 402, housing member 404, and other device components. Figure 4C The mesh member 410 is shown separated from the trim 408. The mesh member 410 can be coupled to the trim 408 via an adhesive, a weld, a bracket, a fastener, an interference fit, a latching structure, etc. The divider 424 can also be fixed in the cavity of the trim 408 (e.g., below the mesh member 410). The divider 424 can be fixed to the trim 408 via a weld, an adhesive, a fastener, an interference fit, a latching structure, etc. The divider 424 can provide a barrier between the acoustic path to the microphone and the acoustic path to the speaker.

[0193] After the trim 408 is assembled with the mesh member 410 and optionally the divider 424, the trim 408 can be attached to the cover 402 via an adhesive member 430. The adhesive member 430 (e.g., a liquid adhesive, an adhesive foam, a pressure sensitive adhesive ("PSA"), a heat sensitive adhesive ("HSA"), etc.) can be adhered to the top side of the flange 428 of the trim and the underside of the cover 402. After the trim 408 is adhered to the cover 402 via the adhesive member 430, the cover 402 along with other top module components such as a display can be attached to the frame member 427 via an adhesive 426. The trim 408, and specifically the flange 428, can be captured between the underside of the cover 402 and the frame member 427. In addition, the adhesive 426 can contact and / or at least partially surround the bottom side of the flange 428 and other surfaces of the trim 408, thereby contributing to the strength and stability of the trim 408 in the device.

[0194] Figure 5An exemplary cover structure 510 for use in a speaker port is shown, as described herein. The cover structure 510 defines a flange 514 and a recessed area 512. The recessed area 512 may include holes that may be defined by a mesh member such as the mesh member 410, or may be defined as a hole through the material of the cover structure 510 itself (e.g., by laser forming, drilling, or otherwise forming a hole through the wall structure of the cover structure 510). The recessed area may be recessed relative to the frame area 513 surrounding the recessed area. In some cases, the recessed area corresponds to a thinned area of ​​the cover structure 510. For example, the thickness between the top (outer) surface of the recessed area and the bottom (inner) surface of the recessed area may be less than the thickness between the top (outer) surface of the frame area 513 and the bottom (inner) surface of the frame area 513. In the case where the recessed area is part of the cover structure 510 itself, the recessed area may have a minimum thickness between about 20 microns and about 40 microns (e.g., 25 microns, 30 microns, 35 microns, etc.). The recessed area 512 may have a width dimension (e.g., dimension 515). Dimension 515 may be about 0.4 mm, about 0.5 mm, about 0.6 mm, about 0.7 mm, or any other suitable dimension. The recessed area may be surrounded by the frame area 513, as described above. The thickness of the frame area 513 may be between about 0.3 mm and about 0.6 mm. The holes in the mesh and / or defined as passing through the cover structure 510 may have a diameter (or other opening size) between about 90 microns and about 110 microns (e.g., about 90 microns, about 100 microns, about 105 microns, about 110 microns, etc.). The web defining the holes (e.g., the material of the cover structure located between the holes) may have a minimum thickness between about 20 microns and about 40 microns (e.g., 25 microns, 30 microns, 35 microns, etc.).

[0195] Figure 5 An exemplary pattern of holes is shown. In other examples, the one-piece cover structure can have holes with different patterns and / or holes of different sizes or shapes (e.g., square holes, pentagonal holes, etc.). For example, a first corner of the perforated area (e.g., near the top side of the device) can have a first lowest (e.g., smallest) radius of curvature, while a second corner (e.g., toward the bottom side of the device) has a second lowest radius of curvature that is different from the first lowest radius of curvature. The same radius of curvature can be mirrored on opposite sides of the perforated area. In this way, the perforated area exhibits asymmetry about a horizontal axis (e.g., at Figure 4B). In some cases, the frame region of the cover structure also exhibits similar asymmetry about the horizontal axis, as defined by the top corner of the frame region having a lower minimum radius of curvature than the bottom corner of the frame region. The lowest (e.g., minimum) thickness of the frame region (e.g., the distance between the perforated region and the outer periphery of the cover structure) may be between about 0.2 mm and about 0.3 mm. In some cases, the lowest thickness of the frame region (e.g., the distance between the perforated region and the outer periphery of the cover structure) may be between about 0.05 mm and about 0.2 mm.

[0196] In some cases, the perforated region can have corners with substantially equal radii of curvature. For example, a first corner of the perforated region (e.g., near the top side of the device) can have a first lowest radius of curvature, and a second corner (e.g., toward the bottom side of the device) can have a second lowest radius of curvature that is the same as the first lowest radius of curvature. The same radius of curvature can be mirrored on opposite sides of the perforated region. In this way, the perforated region is symmetrical about a horizontal axis (e.g., at Figure 4B In some cases, the frame region exhibits asymmetry about a horizontal axis, or it can be substantially symmetrical (e.g., having four corners with substantially the same radius of curvature).

[0197] The corners of the perforated regions and frame regions as described above may have a constant radius of curvature (eg, they may define a portion of a circle) or a variable radius of curvature (eg, they may define a non-circular spline).

[0198] Fig. 6A A partial cutaway view of device 400 is shown, showing an acoustic path through the device and to (and through) speaker port 401. Device 400 includes speaker module 620, which may correspond to or be an embodiment of speaker module 250, 350, or any other speaker module described herein. Device 400 also includes cover 402, display 610, frame member 611 coupled to the interior surface of front cover 402, and back cover 604. Speaker module 620 may be positioned below an active area of ​​display 610 (e.g., an area of ​​display 610 configured to display graphical output to a user).

[0199] The rear cover 604 is attached to the housing structure via an adhesive 608. The housing structure may be formed by or include the housing member 404 and the molded member 607. The molded member 607 may be a polymer material (e.g., a fiber reinforced polymer) molded against the housing member 404 and / or other housing members and / or components of the device 400. In some cases, the molded member 607 is integral with one or more joint structures and / or joining elements (e.g., joint structures 122, 218, 318, joining elements 1416, 1418, 1420, 1422, 1424, and 1426, or any other joint structure / joint element described herein) of the device 400. Thus, the molded member 607 may define at least a portion of the exterior surface of the housing structure, as well as a portion of the acoustic path, as described herein.

[0200] The speaker module 620 may be coupled to the molding member 607. For example, a portion of the speaker module 620 may be inserted into a hole defined by the molding member 607. Fig. 6A A portion of the speaker module 620 positioned in the hole of the molded member 607 is shown, wherein the sealing member 632 (attached to the speaker module 620) forms a seal between the speaker module 620 and the surface of the hole. The sealing member 632 can form a seal between the acoustic path (e.g., defined by the path portions 628, 630, and 634) and other areas within the device 400. Specifically, in some cases, water, liquids, or contaminants cannot be prevented from entering the acoustic path through the speaker port 401. Therefore, the seal between the speaker module 620 and the molded member 607 can help prevent any water, liquid, or other contaminants that have entered the acoustic path from escaping into other areas of the device 400, and can also help prevent acoustic losses when sound passes through the acoustic path. The barrier 622 (e.g., a mesh or other material that allows sound to pass through) can be positioned in the speaker module 620 and between the speaker driver 624 and the speaker port 401. The barrier 622 can help inhibit liquid or contaminants from contacting or gathering on the speaker driver 624. The speaker driver 624 may be or may include a speaker diaphragm, and may generate sound that is directed through an acoustic path to the speaker port 401. More specifically, the sound from the speaker driver 624 may pass through the first path portion 628, the second path portion 630, and the third path portion 634, and ultimately pass through the speaker port 401 (e.g., through the mesh member 410 or through other holes or openings provided in the speaker port 401).

[0201] As described above, the acoustic path can be defined by path portions 628, 630, and 634. A first path portion 628 can be defined by the speaker module 620, which can extend from the speaker driver 624 to the second path portion and can be configured to direct sound from the speaker driver 624 to the speaker port opening. At least a portion of the first path portion 628 can extend below the active area of ​​the display 610. At least a portion of the first path portion 628 can extend below the active area of ​​the display 610. At least a portion of the first path portion 628 can extend below the forward sensor array 411 ( FIG. 4A to FIG. 4B ) extends below. The second path portion 630 can be defined by the molded member 607. In some cases, the second path portion 630 is formed as a result of the molding process of the molded member 607, while in some cases, it is formed after the molding process (e.g., it is drilled or otherwise machined after the molded member 607 is molded against the shell member 404 and cured). The third path portion 634 can be defined by the shell member 404. More specifically, at least one side or surface of the third path portion 634 can be defined by the shell member 404. In some cases, the other side or surface of the third path portion 634 (e.g., the opposite side or surface of the third path portion 634) can be defined by another component or structure of the device 400, such as the frame member 611 of the top module (e.g., a frame member attached to the cover 402 and used to couple the cover 402 to the molded member 607 and / or other device components or structures).

[0202] Figure 6B A partial cross-sectional view of the device 400 is shown, showing the speaker module 620 detached from the molded member 607, and illustrating the manner in which the speaker module 620 can be coupled to the molded member 607 and sealed against the molded member.

[0203] The speaker module 620 can be coupled to the molded member 607 by a translation indicated by arrow 648. The translation can be substantially horizontal (as shown), which can correspond to the speaker module 620 being moved in the positive y-direction (e.g., toward the housing member 404, which can correspond to, for example, Figure 2 lateral translation of the housing member 213).

[0204] When the speaker module 620 is inserted into the hole defined in the molding member 607, the end surface 646 of the speaker module can contact the surface 644 of the molding member 607. The contact between the end surface 646 and the surface 644 can be used as a reference to define the y position of the speaker module 620 in the device. Even if the end surface 646 does not contact the surface 644, the end surface 646 and the surface 644 can together define the maximum y position of the speaker module 620 in the device and can help inhibit the free movement of the speaker module 620.

[0205] Similarly, the molded member 607 may define a hole having a sealing surface 640, and the sealing member 632 contacts the hole to seal the acoustic path. The sealing member 632 (which may be a polymer material such as rubber, silicone (e.g., molded liquid silicone rubber), foam, etc.) may deform against the sealing surface 640 to define a seal. The speaker module 620 may also define a flange portion 633 that acts as a hard stop between the speaker module 620 and the molded member 607. The flange portion 633 may define the maximum z position of the speaker module 620 within the system and / or inhibit movement of the speaker module 620 in the z direction. Figure 6B The vertical position or vertical direction in the z direction may be referred to as the z position or z direction (e.g., the direction extending approximately vertically from the rear cover of the device to the front cover). In some cases, the flange portion 633 may prevent the sealing member 632 from causing the speaker module 620 to be forced too far downward or upward (e.g., in the positive z direction or negative z direction) due to the force generated by the deflection and / or deformation of the sealing member 632. The flange portion 633 may extend above the interface between the sealing member 632 and the speaker module 620, so that the flange portion 633 acts as a hard stop in the z direction before the sealing member 632 reaches maximum deformation or deflection. For example, a force that would tend to move the speaker module 620 in the z direction or misalign it will cause the flange portion 633 to interfere with the molded member 607 or other structure, thereby inhibiting further movement of the speaker module 620 and limiting its position in the z direction (e.g., rather than allowing the force to continue to deform the sealing member 632 and create a greater degree of misalignment).

[0206] Figure 6C Another exemplary speaker module 650 and molded member 655 that may be used in an apparatus as described herein is shown. Figure 6C As shown, the end face of the speaker module 650 can be coupled to the corresponding face of the molded member 655 so that the outlet of the speaker module 650 is communicated with the hole in the molded member 655 to guide the sound through the acoustic path defined by the molded member 655. The sealing member 652 can be positioned between the end face of the speaker module 650 and the corresponding face of the molded member 655 to provide an acoustic and / or environmental (e.g., liquid, debris) seal. The sealing member 652 can be a compliant material (e.g., foam, elastomeric gasket). In some cases, the sealing member 652 is or includes an adhesive, such as an adhesive film, PSA, HSA, etc. The speaker module 650 can be fixed to the device using fasteners, brackets, etc., and in the case where the sealing member 652 is or includes an adhesive, the speaker module 650 can be fixed at least partially by the adhesive.

[0207] As described above, speaker port 401 may provide acoustic access to both an internal speaker and an internal microphone. In some cases, a device may include one or more structures configured to provide acoustic separation between the acoustic paths of the speaker and microphone. One exemplary structure is a partition 424 ( Figure 4B , Figure 4C ). Fig. 7A A partial cutaway view of device 400 is shown, illustrating the acoustic path through speaker port 401 to microphone module 700 . Fig. 7A An exemplary guide member 714 (or simply guide 714 ) is shown that can define a portion of the acoustic path from the speaker port 401 to the microphone module 700 .

[0208] Specifically, microphone module 700 may be coupled to the underside of cover 402 and / or the top module. In some cases, as shown, microphone module 700 is coupled to substrate 702, which in turn is coupled to a portion of frame member 706 or other components of the top module (e.g., via adhesive 704). Substrate 702 may define a hole 712 that allows microphone module 700 to be acoustically coupled to an acoustic path defined as passing through frame member 706. Diaphragm 713 may be positioned above hole 712 (e.g., covering the hole) to inhibit the passage of water and / or other contaminants while allowing sound to pass. One or more additional diaphragms may also be incorporated into microphone module 700. The diaphragm (including diaphragm 713) may be a mesh, screen, foam, etc., and may be formed of any suitable material such as a polymer, metal, etc.

[0209] The frame member 706 can define a first path portion 710 of the acoustic path to guide sound from the speaker port 401 to the microphone module 700. The frame member 706 can correspond to or be an embodiment of the frame member 204, 304, 611, or any other frame member described. In other cases, the frame member 706 is a separate component coupled to the cover 402 and / or a separate frame or structural component of the device.

[0210] The guide 714 can be positioned at the end of the first path portion 710 and can define the second path portion 708 of the acoustic path. The guide 714 can be formed of a compliant material such as an elastomer and can be sealed against the frame member 706 (e.g., in close contact with the frame member 706) to help define the acoustic path and inhibit acoustic interference between the acoustic path and other areas of the device. In other words, the guide 714 can be sealed against the frame member 706 to provide acoustic isolation to the acoustic path and the microphone module 700 more generally.

[0211] The guide 714 can define a corner or turn of the acoustic path to the microphone, and a portion of the guide 714 can extend at least partially into a cavity defined at least in part by the trim 408. For example, in an implementation that includes a divider such as divider 424, the cavity in the trim 408 can be defined on three sides by the trim 408 and on a fourth side by the divider. Fig. 7A The topmost portion of the guide shown) can extend into the cavity so that sound entering through the mesh member 410 is guided along the acoustic path to the microphone, and so that sound from other sources (e.g., the speaker module) is suppressed from entering the acoustic path. Generally speaking, the divider 424 can define two separate cavities or volumes along the underside of the speaker port cover structure, and the guide 714 can extend into one of those cavities or volumes, while the speaker module is in acoustic communication with the other cavity or volume. This can provide a measure of the acoustic isolation between the speaker and the microphone.

[0212] Figure 7B A partial cross-sectional view of the device 400 is shown, illustrating the acoustic path through the speaker port 401 to another exemplary microphone module 720. Figure 7B shown, and similar to Fig. 7A , the microphone module 720 can be coupled to the underside of the cover 402 and / or the top module. In some cases, as shown, the microphone module 720 is coupled to a substrate 722, which in turn is coupled to a mounting plate 724. The mounting plate 724 defines a base portion 725 and a waveguide 726 extending from the base portion 725. The waveguide 726 extends into a hole formed in the frame member 706 (or other component of the top module) and defines a portion of the acoustic path, which is defined from the speaker port 401 to the microphone module 720. More specifically, the acoustic path can be at least partially defined by the guide 714, the channel defined through the frame member 706, and the waveguide 726.

[0213] A sealing member 727, such as an O-ring, can define a seal between the waveguide 726 and the frame member 706 (or any other component into which the waveguide 726 extends). The interface between the waveguide 726 and the aperture helps align the microphone module 720 with the frame member 706. In addition, the sealing member 727 also helps form an acoustic and environmental seal between the acoustic path defined through the frame member 706 and the microphone module 720. For example, the sealing member 727 can inhibit water or other contaminants that may enter the acoustic path (e.g., through the speaker port 401) from escaping the acoustic path and entering other internal areas of the device. The sealing member 727 can also provide a retaining force due to friction between the sealing member 727 and the surface of the aperture in the frame member 706 (optionally assisted by compression of the sealing member 727 between the frame member 706 and the waveguide 726). The sealing member 727 can be retained by a lip, channel, and / or groove defined by the waveguide 726, such as Figure 7B shown.

[0214] In some cases, mounting plate 724 is adhered to frame member 706. Where an adhesive is used, it may be positioned between and adhered to base portion 725 and frame member 706. Alternatively or in addition, mounting plate 724 (and thus microphone module 720 and substrate 722) may be secured to frame member 706 using brackets, fairings, fasteners, etc. In some cases, friction relative to sealing member 727 is sufficient to hold mounting plate 724 to frame member 706.

[0215] A substrate 722 to which the microphone module 720 may be soldered, adhered, or otherwise secured may be secured to a mounting plate 724 via an adhesive 728 (e.g., PSA, HSA, adhesive foam, etc.). The substrate 722 may be a circuit board (e.g., a rigid or flexible circuit board) and may include conductive traces that interconnect the microphone module 720 with other circuitry of the device.

[0216] The diaphragm 729 may be positioned over the hole in the substrate 722 (e.g., covering the hole) to inhibit water and / or other contaminants from entering the microphone module 720 while allowing sound to pass through. The diaphragm 729 may be a mesh, screen, foam, etc., and may be formed of any suitable material such as a polymer, metal, etc. The diaphragm 729 may be positioned in place using a compliant stack 730, which may include one or more layers of adhesive, foam, and / or other materials. The compliant stack 730 may adhere or be adhered to both the base portion 725 of the mounting plate 724 and the substrate 722.

[0217] Figure 7C Shows Figure 7B 1 is an exploded view of the microphone subassembly, showing additional details of the components of the microphone subassembly. Figure 7B As shown, the sealing member 727 can be positioned around the waveguide 726, which defines a lip (as shown), a groove, a slot or other retaining feature that holds the sealing member 727 in place on the waveguide 726. The base portion 725 of the mounting plate 724 is fixed to the substrate 722 (e.g., a circuit board and / or a circuit board assembly) via an adhesive 728 (e.g., HSA, PSA, adhesive foam, etc.). The adhesive 728 can define a hole in which the diaphragm 729 and the compliant stack 730 can be positioned. As described above, the diaphragm 729 can be positioned above the hole 731, which extends through the substrate 722 and provides acoustic access to the microphone module 720. In some cases, the surface defining the hole 731 is considered to be part of the acoustic path extending from the speaker port 401 to the microphone module 720.

[0218] The microphone module 720 may include conductive pads 732 that are conductively coupled (e.g., soldered) to corresponding conductive pads on the substrate 722 to facilitate communication coupling between the microphone module 720 and other circuits. The microphone module 720 also includes a microphone sensor element 733. Figure 7C As shown, microphone sensor element 733 is positioned proximate aperture 731 , but in other cases it may be positioned elsewhere in microphone module 720 .

[0219] Fig. 8A Shows Fig. 7A 714, showing how the guide 714 can be integrated with the cover 402 and the frame 706. Specifically, the guide 714 can be positioned below the trim 408 and against the frame member 706 in the area where the first path portion through the frame member 706 ends. As shown, an adhesive 800 (e.g., PSA, HSA, adhesive foam, etc.) can adhere the guide 714 to the frame member 706.

[0220] FIG. 8B to FIG. 8C Other exemplary configurations of guides and / or acoustic separators that may be used to acoustically isolate a speaker from a microphone are shown. Figure 8B 810 is shown separated from the frame member 811. The frame member 811 (which can be an embodiment of the frame member 706) defines an output port 809 at the end of the acoustic path portion defined by the frame member 811. Optionally, before the frame member 811 is attached to the cover 810, the microphone can be placed along the bottom surface of the frame member (e.g., Fig. 7A 814 is coupled to the frame member 811. The guide member 814 can be attached to the frame member 811 using an adhesive 816. The guide member 814 can be similar to Fig. 7AThe manner of the middle guide member 714 defines a nozzle portion extending into a recess defined below the decorative member 812. The guide member 814 may be attached to the frame member 811 before the frame member 811 is coupled to the cover 810.

[0221] Figure 8C An acoustic isolation structure 824 is shown that can be positioned below the trim 822. The acoustic isolation structure 824 may include a first channel 826 for conveying sound to the microphone module and a second channel 828 for conveying sound to the speaker module. The first channel 826 and the second channel 828 may define portions of the acoustic path to the microphone module and the speaker module, respectively. The acoustic isolation structure may be adhered or otherwise attached to the cover 820 and / or the frame member 821, and may be attached after the frame member 821 is coupled to the cover 820.

[0222] Fig.9A A portion of device 900 is shown. Device 900 may correspond to or be an implementation of device 100, 140, 200, 300, or any other device described herein. Device 900 is shown without a cover and / or display so that internal components of device 900 are visible. Fig.9A An outer shell 904 is shown, as well as a frame member 906 of the top module (or a representation of where the frame member would be located).

[0223] Fig.9A A forward sensor area 901 is generally shown. With the exception of ambient light sensor 922, components of forward sensor area 901 can be outside the active area of ​​the display. Forward sensor area 901 (which can also be referred to as a notch due to the manner in which it extends downward into the display area) can have a width 903 that is less than about 60%, less than about 50%, or less than about 40% of the width of display area 902. In some cases, one or more of the components in forward sensor area 901 provide multiple functions, thereby allowing the width of forward sensor area 901 to be minimized or reduced. In some cases, width 903 of forward sensor area 901 is about 30 millimeters or less.

[0224] Device 900 includes a front-facing camera 908, a proximity sensor 912, a combined flood illuminator and dot projector 918 (e.g., a biometric sensor module), and an infrared light sensor (or camera) 920 in front-facing sensor area 901. Device 900 also includes an ambient light sensor 922 positioned within active display area 902 of device 900. Fig.9A Also shown is an exemplary positioning of a microphone module 910, which can be attached to the underside of the frame member 906. The microphone module 910 can communicate with an acoustic guide 914 in a speaker port of the device 900, as described herein.

[0225] The combined flood illuminator and dot projector 918 (which may correspond to or be an embodiment of the combined flood illuminator and dot projector 416) may be or may include a biometric sensor module. The combined flood illuminator and dot projector 918 may project infrared flood illumination of an object, as well as a pattern of infrared dots or points of light. An infrared light sensor (or camera 920) may use the projected flood illumination and dot pattern to capture an image of an object (e.g., a user's face). The image captured by the sensor 920 may be used to authenticate the user, as described above. In addition, by combining the flood illuminator and dot projector into a single module, valuable space may be saved in the forward sensor area 901, thereby allowing a larger amount of active display area to be provided.

[0226] Fig. 9B Shown along Fig.9A 9B-9B in FIG. 9B , showing an exemplary configuration of a forward-pointing camera 908. Forward-pointing camera 908 may include a lens assembly 923 and an image sensor 924, both of which are contained within housing 921. Camera 908 may be an autofocus camera, wherein lens assembly 923 is configured to extend, retract, or otherwise change length or position within housing 921 to focus an image on image sensor 924. In such cases, the front surface of lens assembly 923 may be configured to move vertically as indicated by arrow 928.

[0227] In situations where the front surface of lens assembly 923 moves toward and / or away from cover 929 (e.g., the front cover of device 900), it may not be feasible to mount lens assembly 923 directly to the interior surface of cover 929. Fig. 9B An exemplary configuration for mounting an autofocus camera to the inside of cover 929 is shown. For example, housing 921 may be coupled to mounting bracket 925 (e.g., via adhesive, welding, soldering, brazing, fasteners, etc.). Mounting bracket 925 may be attached to the interior surface of cover 929, such as via adhesive 927, fasteners, etc. Mounting bracket 925 may have a height that provides sufficient clearance between lens assembly 923 and the interior surface of cover 929 to facilitate the necessary movement of the front of lens assembly 923 (indicated by arrow 928).

[0228] Mounting bracket 925 and adhesive 927 may extend completely around the perimeter of the lens assembly. In this way, mounting bracket 925 and adhesive 927 inhibit dust or other contaminants from entering housing 921 and prevent light from display 926 (or other light sources) from entering lens assembly 923 and potentially adversely affecting images captured by the camera or otherwise interfering with the operation of the camera.

[0229] Although Fig. 9BAn auto focus camera is shown, but the same or similar configuration may also be used for a fixed focus camera. In such cases, the lens assembly may not be configured to move vertically, but may be maintained at a fixed length and / or position within the housing.

[0230] Fig.9A An exemplary device 900 is shown in which components of the forward-facing sensor area are positioned in a "notch" area outside of the active area of ​​the display. In such cases, the display may define a notch-like depression or shape to accommodate the forward-facing sensor area such that the display stack is not positioned between the sensor and the cover (e.g., the sensor is not covered by the display). In other exemplary devices, the display defines one or more additional holes, openings, or interruptions in addition to or in lieu of the "notch" to accommodate one or more components of the forward-facing sensor area. For example, Fig. 9C and Fig.9D An exemplary electronic device 930 is shown in which a forward-pointing camera 932 is positioned below an aperture formed through a display stack 934. The display stack 934 may also define a cutaway region or notch where other components of the forward-pointing sensor region may be positioned (e.g., microphone module, flood and dot projectors, infrared light sensor, etc.).

[0231] In some cases, area 933 of display stack 934 extending around (or partially around) front-pointing camera 932 is an active portion of the display. For example, area 933 may generate graphical output. In other cases, area 933 is an inactive area of ​​display stack 934 (e.g., this area of ​​the display stack may not be capable of generating graphical output, or it may be capable of generating graphical output but is configured to remain inactive). In the case where area 933 is an inactive area of ​​the display, paint, ink, dye, mask, layer, etc. may be positioned on top of the display in this area so that area 933 has a visual appearance that matches other areas of the front-pointing sensor area.

[0232] Boundary 931 may extend around camera 932 to visually indicate that camera 932 is within the forward sensor area and to provide vertical symmetry for the forward sensor area. Fig. 9C The border shown above and to the right of camera 932 in FIG. 9 may not exist. Border 931 may be paint, ink, dye or other structure or material.

[0233] Fig.9D Shows Fig. 9C930, showing an exemplary configuration of a camera 932 and a display stack 934. Camera 932 (which may be an autofocus or fixed focus camera) may include a lens assembly 937 and an image sensor 938, both of which are contained in a housing 939. Camera 932 may also include a shield 936 attached to housing 939 and display stack 934 (e.g., using adhesive 940). Shield 936 and adhesive 940 may extend completely around the perimeter of the lens assembly. In this way, shield 936 and adhesive 940 inhibit dust or other contaminants from entering housing 939. In addition, shield 936 extends almost completely to (and optionally contacts) the interior surface of cover 935 (which may be an embodiment of cover 102, or any other front cover described herein), thereby shielding lens assembly 937 from light emitted from the side of display 934, which may otherwise enter lens assembly 937 and may adversely affect the image captured by the camera or otherwise interfere with the operation of the camera.

[0234] Fig.9D The camera 932 is shown positioned in a hole in the display stack 934 such that the display stack surrounds a wall portion of the shield 936 (as shown by having portions of the display stack 934 on both the left and right sides of the shield 936). The same or similar shield configurations may also be used for implementations in which the camera 932 is not positioned in a hole in the display stack 934. In such implementations, the portion of the display stack 934 shown in FIG. Fig.9D The left side portion may not be present and / or it may be replaced by a different structural component.

[0235] Fig.9EA partial cutaway view of another exemplary configuration of a forward-pointing camera is shown. Camera 942 (which may be an autofocus or fixed focus camera) may include a lens assembly 941 and an image sensor 951, both of which are contained in a housing 943. Camera 942 may also include a shield 944 that is attached to housing 943 and optionally to a display stack 946 (e.g., using adhesive 945) and optionally to a frame or other component of a top module of the device. In some cases, shield 944 is not attached to display stack 946. Camera 942 also includes a ring member 947 that is attached to shield 944 (e.g., via adhesive 945) and to an interior surface of cover 949 (which may be an embodiment of cover 102, or any other front cover described herein). Ring member 947 may extend completely around the periphery of the lens assembly and may be adhered to an interior surface of cover 949 via adhesive 948 (e.g., PSA, HSA, adhesive foam, etc.). In this way, ring member 947 and adhesive 948 inhibit the ingress of dust or other contaminants into housing 943. Additionally, because ring member 947 adheres to or otherwise contacts an interior surface of cover 949, ring member 947 shields lens assembly 941 from light emitted from the sides of display 946 that might otherwise enter lens assembly 941 and potentially adversely affect images captured by the camera or otherwise interfere with the operation of the camera. Fig.9E The camera configuration may be implemented in a device having a hole through its display stack to accommodate the camera (eg, Fig. 9C ), or in devices where the camera is positioned outside the outer periphery of the display (as shown in Fig.9A ). In the former case, component 950 may represent a portion of display stack 946, while in the latter case, component 950 may represent a frame or other component of a top module of the device.

[0236] Fig.9F A partial cutaway view of another exemplary configuration of a forward-facing camera 952 is shown. Camera 952, which may be an autofocus or fixed focus camera, may include a lens assembly 953 and an image sensor 962, both contained within a housing 954. Camera 952 may also include a shroud 956 attached to housing 954 and optionally to a display stack 958 (e.g., using adhesive 957) and optionally to a frame or other component of a top module of the device. In some cases, shroud 956 is not attached to display stack 958.

[0237] like Fig.9FAs shown, shield 956 does not contact cover 961 or otherwise extend toward the cover sufficiently to shield lens assembly 953 from light that may leak from the edge of display stack 958. Therefore, shield 959 can be applied to the edge of display stack 958. Shield 959 can be a paint, ink, dye, film, or other material or component that is opaque or otherwise blocks or reduces light from leaving display stack 958 through the edge. In some cases, any edge of display stack 958 near an optical device (such as a lens assembly, image sensor, light sensor, etc.) can include a shield similar to shield 959 along that edge.

[0238] Fig.9F The camera configuration may be implemented in a device having a hole through its display stack to accommodate the camera (eg, Fig. 9C ), or in devices where the camera is positioned outside the outer periphery of the display (as shown in Fig.9A 958). In the former case, component 960 may represent a portion of display stack 958, while in the latter case, component 960 may represent a frame or other component of the top module of the device. In the case where component 960 represents a portion of display stack 958, the edge of the portion of the display stack exposed to camera 952 may include a shield similar to shield 959. In such a case, shield 959 may be a single integral component, such as a film, paint, ink, dye, etc., that extends along the continuous edge of the display stack.

[0239] Fig. 9B and FIG. 9D to FIG. 9F An exemplary lens configuration including mitigation for preventing or limiting the effects of light contaminants (e.g., dust) on the operation of the camera is shown. For example, Fig. 9B A mounting bracket is described that is attached to the interior surface of the cover to seal the camera; Fig.9D A shroud extending around the perimeter of the lens assembly to block light is described; Fig.9E A ring member 947 is depicted attached to the interior surface of the cover to seal the camera; and Fig.9F Describes a paint or other coating applied to the edges of a display stack to reduce or prevent light leakage.

[0240] The camera may also or alternatively be at least partially encapsulated by a curable material to help prevent or limit light leakage and other contamination. Figure 9G A portion of a device with a forward-facing camera is shown, showing a camera (such as 9A to 9F962 may be at least partially enclosed. Specifically, forward-pointing camera 962 (which may be an embodiment of camera 908, 932, 942, 952, or any other forward-pointing camera described herein) may be positioned in a forward-pointing sensor area of ​​the device. Camera 962 may be positioned in a gap or space between frame member 964 (which may be a polymer, metal, laminate stack, or other member or component of the top module) and display stack 963. Frame member 964 and / or display stack 963 may define a curve or contour to at least partially surround or frame camera 962. Gap 969 may be defined between camera 962 and frame member 964 and display stack 963.

[0241] Camera 962 may be attached to or otherwise positioned proximate to an interior surface of the cover. Figure 9G The device is shown with the cover removed for ease of illustration, but it should be understood that the cover can be positioned over the camera 962, display stack 963, and frame member 964 (e.g., as if the cover was placed directly on the page).

[0242] To at least partially encapsulate camera 962, curable material may be introduced into the spaces (e.g., spaces 968 and 967) between display stack 963 and frame member 964 and into gap 969. The curable material may be introduced into the space between display stack 963 and frame member 964 (e.g., spaces 968 and 967). The curable material may be introduced into the space between display stack 963 and frame member 964 by passing through a back member of the top module such as a plate (e.g., metal plate 1314, Fig.13A ) is introduced into the curable material through one or more holes (e.g., holes 965, 966) formed in the cover. The curable material can flow along the interior surface of the cover, through spaces 967 and 968, and into gap 969. In some cases, one of holes 965, 966 is used as an injection port, and the other is used as an exhaust (or vacuum) port to help draw the curable material to the desired location. The curable material may at least partially surround the camera and may be adjacent to (and optionally adhere to) the housing, shield, ring member, or other parts of the camera, as well as contact (and optionally adhere to) the interior surface of the cover and any other parts in contact therewith. The curable material can then be cured to form a seal around the camera 962. As described above, the curing material can help seal the camera 962 from light and contaminants. The curable material can be an epoxy resin, glue, a thermosetting polymer, etc.

[0243] Figure 9H A partially exploded view of the device is shown, illustrating exemplary techniques for aligning and / or securing forward-facing camera 972 with the top module. Figure 9HCover 970 and frame member 978 are shown defining camera aperture 976. Frame member 978 may be an assembly including multiple components or materials and may be configured to attach to cover 970 and provide structural rigidity to the top module and to attach the top module to other components of the device. Frame member 978 may include other holes, openings, features, etc. to accommodate or attach to other top module components (including, for example, components of the forward sensor array), but for simplicity, Figure 9H Only the camera hole 976 is shown.

[0244] The camera 972 may be attached to the frame member 978 via adhesives, fasteners, brackets, or any other suitable technique. The lens assembly, shield, or other portion of the camera 972 may extend through the hole 976 in the frame member 978 and may be attached to or otherwise proximate to the interior surface of the cover 970, such as with respect to the Fig. 9B and FIG. 9D to FIG. 9F As shown and described. The frame member 978 may include either or both of an alignment ring 974 or an alignment pin 975. The alignment ring 974 may be attached to the frame member 978 so that the hole through the alignment ring 974 is appropriately positioned relative to the hole 976. The camera 972 may be attached to the alignment ring 974 or otherwise fixed against the alignment ring. The alignment ring 974 may be configured to contact the camera 972 and position the camera 972 in a fixed position relative to the alignment ring 974, thereby establishing and fixing the position of the camera 972 in the device. For example, a shield or other cylindrical component of the camera 972 may contact the inner surface of the hole through the alignment ring 974 to establish and fix the relative position of the camera 972 and the frame member 978 (at least in a plane parallel to the cover 970). Alternatively or in addition, the frame member 978 may include an alignment pin 975 protruding from the frame member 978. The camera 972 can define an alignment pin receiver 973 (e.g., a blind hole formed in the camera 972) into which the alignment pin 975 extends. When the camera 972 is assembled to the frame member 978, the interface between the alignment pin 975 and the alignment pin receiver 973 establishes and fixes the relative position of the camera 972 to the frame member 978 (at least in a plane parallel to the cover 970).

[0245] Fig. 10A Shown along Fig.9A A partial cross-sectional view of the device 900 as viewed along line 10A-10A in FIG. Fig. 10A An exemplary arrangement of combined flood illuminator and dot projector 918 and infrared light sensor 920 is shown beneath cover 1000 (eg, corresponding to cover 102 or any other cover described herein).

[0246] Infrared light sensor 920 may include lens assembly 1012 (also referred to as a second lens) and a light receiver, such as sensor element 1018. Lens assembly 1012 may include one or more lens elements, and may focus an image onto a light receiver (e.g., sensor element 1018) to capture an object illuminated by a flood and / or dot pattern projected by combined flood illuminator and dot projector 918. In some cases, infrared light sensor 920 generates a depth map of the user's face (or other object) based on the way the dot pattern is reflected off the user's face. Sensor element 1018 may be coupled to substrate 1016, and lens assembly 1012, sensor element 1018, and substrate 1016 may all be included in housing 1014. Housing 1014 may also include components of combined flood illuminator and dot projector 918.

[0247] The combination of flood illuminator and dot projector 918 includes lens assembly 1002 (also referred to as first lens), dot pattern light source 1004 (also referred to as first light source and / or light emitter), and flood illuminator light source 1006 (also referred to as second light source and / or light emitter). Lens assembly 1002 may include one or more lens elements. Dot pattern light source 1004 may generate and / or emit a pattern of light (e.g., a pattern of dots or dots of infrared light) that can be projected onto an object through lens assembly 1002. The dot pattern may be a grid of discrete dots of light, or a group of discrete dots of light in another arrangement.

[0248] Point pattern light source 1004 can be positioned relative to optical axis 1007 of lens assembly 1002 so that the points are substantially in focus and / or the point pattern maintains a pattern of discrete points or points of infrared light. In some cases, point pattern light source 1004 is aligned with optical axis 1007 of lens assembly 1002 or otherwise positioned below a central region of lens assembly 1002, such as Fig. 10A In some cases, dot pattern light source 1004 includes a plurality of discrete light generating elements. In other cases, a pattern or mask is provided over one or more light generating elements to generate a pattern of dots.

[0249] Flood illumination light source 1006 may be configured to produce a more uniform flood light (compared to the dot pattern of dot pattern light source 1004). To produce the flood light, flood illumination light source 1006 may be offset from optical axis 1007 of lens assembly 1002 so that it is positioned below a peripheral region of lens assembly 1002 (e.g., a region around the periphery of lens assembly 1002 and around a central region of lens assembly 1002). For example, Fig. 10A As shown, flood illumination light source 1006 can be offset from optical axis 1007 by a distance 1010. In some cases, flood illumination light source 1006 can also be positioned at a different height relative to lens assembly 1002 than dot pattern light source 1004. For example, FIG. 10A to FIG. 10C 1002 (e.g., it may be mounted on spacer 1005 or otherwise positioned closer to lens assembly 1002). In other cases, the flood illumination light source may be positioned lower than the dot pattern light source 1004 (e.g., further away from lens assembly 1002). The positioning of dot pattern light source 1004 and flood illumination light source 1006 may be relative to the focal plane of lens assembly 1002. For example, in some cases, dot pattern light source 1004 is positioned at or in the focal plane of lens assembly 1002, and flood illumination light source 1006 is offset from (e.g., not in) the focal plane of lens assembly 1002. In other cases, dot pattern light source 1004 and flood illumination light source 1006 are offset from the focal plane of lens assembly 1002 by different distances.

[0250] By positioning flood illumination light source 1006 away from optical axis 1007 (and optionally closer to or further away from lens assembly 1002 than point pattern light source 1004), light emitted by flood illumination light source 1006 may be blurred or otherwise projected in a diffuse pattern, even though the light emitted by flood illumination light source 1006 is one or more point light sources. More specifically, light passing through lens assembly 1002 at a certain distance from the optical axis (e.g., near the outer periphery of a lens element in lens assembly 1002) may not appear to be focused, but may be blurred and / or diffuse, thereby producing a flood-like illumination pattern. In some cases, when the device is held within a particular distance from the user's face (e.g., between about 6 inches and about 4 feet, or any other suitable range of distances), the illumination pattern generated by flood illumination light source 1006 (as projected by lens assembly 1002) may substantially uniformly illuminate the user's face with infrared flood light. In this way, infrared light sensor 920 can capture an image of the user's face (e.g., an infrared image) for purposes such as authentication. More specifically, the infrared flood light is reflected by the user's face to produce an image of the user's face via light sensor 920 (and more specifically, sensor element 1018).

[0251] Fig. 10B Dot pattern illumination light source 1004 is shown projecting a dot pattern through lens assembly 1002, as shown by illumination pattern 1020. For example, a central region of lens assembly 1002 may focus a pattern of light emitted by dot pattern illumination light source 1004 onto an object.

[0252] Fig. 10C Flood illumination source 1006 is shown projecting a diffuse, flood-like illumination pattern along an off-axis path through lens assembly 1002, as shown by illumination pattern 1022. Fig. 10B and Fig. 10COnly one illumination pattern is shown each, but it should be understood that two illumination patterns can be generated simultaneously. In some cases, the illumination patterns are generated in an alternating pattern so that each illumination pattern is incident on the object for a period of time while the other illumination pattern is not incident on the object.

[0253] In some cases, flood illumination light source 1006 includes a plurality of light emitting elements, such as an array of light emitting elements positioned in a radial array, wherein each light emitting element is offset from optical axis 1007. Both flood illumination light source 1006 and point pattern illumination light source 1004 can be or include one or more infrared laser light sources, such as vertical cavity surface emitting laser ("VCSEL") modules, or any other suitable light generating elements. As described above, VCSEL modules can generate light in the infrared spectrum. In some cases, the light generated by flood illumination light source 1006 and point pattern illumination light source 1004 is generally not visible to the naked human eye.

[0254] Fig.11A Shown along Fig.9A 1A-11A in FIG. 1A and illustrating an exemplary configuration of an ambient light sensor 922. The ambient light sensor 922 may include a light sensor module having a light sensing element 1110 and a light-transmissive covering element 1112 (e.g., glass, polymer, sapphire, or other light-transmissive material) in a housing 1114. The light-transmissive covering element 1112 (e.g., a diffuser) may be configured to diffuse light to produce more uniform illumination on the light sensing element 1110. The light sensing element 1110 may be a photosensitive system or component and may detect various characteristics of light, including intensity, color, color temperature, etc.

[0255] Housing 1114 may be attached to support 1108, which in turn may be attached to layer 1104 (e.g., display layer) beneath display component 1102. Support 1108 may be attached to layer 1104, for example, via an adhesive. Layer 1104 may be part of a display stack that includes both layer 1104 and display component 1102, or it may be a separate component. Display component 1102 may include one or more display layers that produce graphical output visible through cover 1100, and one or more electrode layers that provide touch and / or force sensing functionality. As shown with respect to FIG. FIG. 11B to FIG. 11C and FIG. 12A to FIG. 12B Describing in more detail, ambient light sensor 922 may be configured to detect ambient light (eg, light external to the device) through display 1102 and cover 1100 .

[0256] Layer 1104 may be an opaque mask layer that defines aperture 1105. Aperture 1105 may define the smallest aperture in an optical system that includes ambient light sensor 922, and thus may be a limiting factor in the amount and angle of light that can enter ambient light sensor 922. The area of ​​aperture 1105 may be smaller than the area of ​​light sensing element 1110.

[0257] Layer 1104 may be formed of any suitable material, such as metal (e.g., metal plate or foil), polymer, ink, etc. In some cases, the position of aperture 1105 is tightly controlled relative to display component 1102, such that aperture 1105 is aligned with a known set of pixels defined by display component 1102. Thus, as described below, the device may specifically compensate for light generated by pixels above and / or near aperture 1105. By forming the aperture in layer 1104 as part of the display stackup, a high degree of accuracy may be achieved between the position of aperture 1105 and the intended pixel. In contrast, if the light limiting aperture of the system is positioned in ambient light sensor 922, the accuracy of the alignment between ambient light sensor 922 and aperture 1105 will depend on the accuracy of the assembly of ambient light sensor 922 to the display stackup, which may be less accurate than that achievable by forming the aperture in a layer of the display stackup itself. Furthermore, because layer 1104 is part of the display stackup, it may be securely held to other layers of the display stackup, such as via an adhesive (e.g., an adhesive extending along the entire or substantially the entire area of ​​the display stackup between layer 1104 and an adjacent layer of the display stackup). This coupling between layer 1104 and an adjacent layer of the display stackup provides a stable, durable alignment between aperture 1105 and pixels above and / or near aperture 1105. Furthermore, by forming a minimal aperture (e.g., aperture 1105) in a layer of the display stackup, rather than as a separate component that may become loose or otherwise more likely to shift relative to the display stackup, the alignment between apertures 1105 may remain stable during extensive use.

[0258] In some cases, ambient light sensor 922 is positioned near an edge or border of the active area of ​​the display stack in order to reduce the amount of light from the display that can enter the ambient light sensor. For example, ambient light sensor 922 (and more specifically aperture 1105) may be positioned approximately 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any other suitable distance from the edge of the active area of ​​the display (e.g., within 100 mm of the active area). Fig.11A The hole 1105 is in the y direction of the device (in Fig.11A ) may have a dimension between about 0.25 mm and about 0.75 mm, and in the x-direction of the device (in Fig.11A ) may have a size between about 5.0 mm and about 7.0 mm.

[0259] FIG. 11B to FIG. 11CA partial front view of the device 900 is shown, showing an exemplary operation of the ambient light sensor 922. As described above, the ambient light sensor 922 detects and / or senses ambient light (e.g., the color, color temperature, intensity, or other properties of light in the environment outside the device 900) through the display stack and through one or more electrode layers on or integrated with the display stack. However, the display stack emits light in order to generate a graphical output. Because the ambient light sensor 922 detects light conditions through the display, the light from the display may interfere with or prevent an accurate reading of the ambient light conditions. Therefore, the ambient light sensor 922 may be configured to capture measurements during the time when the pixels above the ambient light sensor 922 are not illuminated. Specifically, when generating a graphical output, the display may generate a vertical blanking interval 1122, which is a horizontal area of ​​the display where the pixels are not illuminated or generate light. The vertical blanking interval 1122 scrolls vertically along the display area (e.g., from the top of the display to the bottom of the display). Thus, ambient light sensor 922 may be configured to capture measurements or samples for a duration that includes the time when vertical blanking interval 1122 is positioned over ambient light sensor 922. Although the present discussion refers to vertical blanking interval 1122 by way of example, other types of blanking intervals may be used, including areas of inactive pixels included in a frame of a graphics output solely for the purpose of providing an inactive area for ambient light sensing.

[0260] Fig. 11B Device 900 is shown with display 1102 generating graphical output 1120 and a vertical blanking interval 1122 moving downward as indicated by arrow 1124. At this point in time, vertical blanking interval 1122 is not positioned over ambient light sensor 922. Instead, display pixels over ambient light sensor 922 are active and / or generating light (e.g., to output graphical output 1120). Thus, during this time, ambient light sensor 922 may be inactive or otherwise not capturing or using ambient light measurements.

[0261] Fig. 11CDevice 900 is shown when vertical blanking interval 1122 is positioned directly above ambient light sensor 922. When vertical blanking interval 1122 is positioned above ambient light sensor 922, ambient light sensor 922 may capture measurements during that time (or otherwise activate or use readings captured during that time). In some cases, a sensing window of ambient light sensor 922 (e.g., the time that ambient light sensor 922 is actively measuring or using measurements of light passing through a display) is greater than vertical blanking interval 1122. For example, the sensing window may begin and / or end when at least some of the pixels above ambient light sensor 922 are active. In some cases, the time that vertical blanking interval 1122 is above ambient light sensor 922 is greater than about 70% (or greater than about 80%, greater than about 85%, or any other suitable value) of the sensing window of ambient light sensor 922. Device 900 may synchronize the operation of the ambient light sensor with the timing and / or position of vertical blanking interval 1122 to allow ambient light measurements to be captured at the appropriate time. The operation of ambient light sensor 922 may be intermittent, such that it actively captures measurements only during a sensing window and is inactive at other times. In other cases, the operation of ambient light sensor 922 captures measurements more continuously, but device 900 and / or ambient light sensor 922 only uses values ​​captured during a sensing window.

[0262] In some cases, device 900 also compensates for light emitted by the display in an area surrounding ambient light sensor 922. For example, even when measurements are captured via vertical blanking interval 1122, light from nearby active pixels (e.g., a subset of pixels of the display) may be incident on or otherwise detectable by ambient light sensor 922, giving an inaccurate measurement of ambient light conditions. Thus, for ambient light measurements captured during a particular sensing window, device 900 and / or ambient light sensor 922 may subtract or otherwise modify the light measurements based, at least in part, on light emitted by pixels in area 1125 surrounding ambient light sensor 922. Area 1125 may correspond to an n×m grid of pixels and may be positioned above ambient light sensor 922 (optionally centered above ambient light sensor 922). In some cases, the pixel grid is 256×256 pixels centered about the center of aperture 1105, but other sizes and alignments are possible depending on, for example, the size of the ambient light sensor, the size of the pixels, the location of the ambient light sensor relative to the active area of ​​the display, the degree to which light from nearby pixels can be detected by the ambient light sensor, etc. The size of region 1125 can be larger than aperture 1105. Thus, region 1125 includes a first subset of pixels positioned over aperture 1105 and a second subset of pixels positioned away from aperture 1105.

[0263] Using the aforementioned techniques, the ambient light sensor 922 receives light that passes through the front cover 1100 and through the display 1102 (e.g., the display layer of the display 1102), and when the blanking interval is positioned above the ambient light sensor 922, an output corresponding to the received ambient light is generated. The device can then determine an ambient light value based at least in part on the output. The device can change the display parameters of the display stack based at least in part on the ambient light value. For example, the device can change the brightness, color temperature, etc., or determine whether to activate or deactivate the entire display (e.g., turn the display on or off).

[0264] As described above, ambient light sensor 922 may also capture ambient light measurements via one or more electrode layers on or integrated with the display stackup. These electrode layers may be used for any of a variety of purposes, such as touch sensing, force sensing, display functionality, etc. Although the electrodes may appear transparent to the naked eye, they may interfere with the light sensing function of ambient light sensor 922 (e.g., by blocking, obstructing, attenuating, or otherwise interfering with ambient light detected by ambient light sensor 922). FIG. 12A to FIG. 12B An exemplary arrangement of electrodes on the electrode layer is shown to reduce or eliminate the effect of the electrodes on the ambient light sensing function.

[0265] Fig. 12A Corresponds to Fig.9A Area 12-12 in FIG. 1 shows an exemplary electrode pattern above the ambient light sensor 922. Specifically, Fig. 12A 1 shows how electrodes may be co-located in an area above ambient light sensor 922. For example, electrodes in an area outside of ambient light sensor 922, such as electrodes 1200-1 and 1202-1, may be arranged to be separated from one another, and electrodes along portion 1204 of the display corresponding to or including ambient light sensor 922, such as electrodes 1200-2 and 1202-2, may be co-located (e.g., stacked or overlapped with one another). Fig. 12A As shown, the electrodes in portion 1204 of the display are co-located along the entire length of the display (e.g., from the top of the display to the bottom of the display). In implementations where the electrodes are alternatively or also positioned horizontally or in a different direction, the electrodes extending above ambient light sensor 922 can also be co-located along the entire display. In some cases, all of the electrodes in the display are co-located in the manner shown in portion 1204.

[0266] Fig. 12BAn example is shown where electrodes positioned over ambient light sensor 922 are co-located with each other where they are over ambient light sensor 922, but are spaced apart from each other in other areas of the display. For example, where electrodes 1200-3 and 1202-3 are positioned over ambient light sensor 922, they are co-located, but they protrude apart in an area outside of ambient light sensor 922 such that they are spaced apart.

[0267] Electrodes 1200-n and 1202-n may be positioned on different substrates or the same substrate. In some cases, electrode 1200-n is positioned on the top surface of the substrate and electrode 1202-n is positioned on the bottom surface of the same substrate. In some cases, electrodes 1200-n and 1202-n are positioned on the same surface of the same substrate. In some cases, electrodes 1200-n and 1202-n are each positioned on different substrates.

[0268] Although FIG. 12A to FIG. 12B Two sets of electrodes are shown, but there may be more sets of electrodes than shown. In addition, for illustrative purposes, electrodes 1200-n and 1202-n are shown as different electrodes, but in one implementation, they can be different electrodes in a single set of otherwise identical electrodes. As described above, the electrodes can provide a variety of different types of functionality, including touch and / or force sensing (e.g., capacitive sensing, resistive sensing, etc.), display functionality, etc. The electrodes can be formed of any suitable material, such as indium tin oxide (ITO), transparent conductive oxide (TCO), conductive polymers, nanowire layers (e.g., silver nanowires), etc.

[0269] Fig.13A Shown along Figure 1A 13A-13A of the exemplary electronic device 1300. The electronic device 1300 may correspond to or be an embodiment of the electronic device 100, 140, 200, 300, or any other device described herein.

[0270] Device 1300 may include housing member 1302, which may correspond to or be an embodiment of housing member 130. Housing member 1302 may also represent other housing members of the devices described herein, such as housing members 124, 125, 126, 127, and 128. Housing member 1302 may define an exterior side surface 1303 of device 1300. Device 1300 may also include cover 1304, which may correspond to or be an embodiment of housing member 130. Figure 1A to Figure 1B1304 can define a front exterior surface 1306 of device 1300, which can be planar. In some cases, cover 1304 defines a chamfer 1305 that extends around the perimeter of planar front exterior surface 1306 and between an edge of front exterior surface 1306 and an edge of side surface 1307 of cover 1304. Device 1300 can also include a rear cover 1309, which can correspond to or be an embodiment of rear cover 132 (or any other rear cover described herein).

[0271] The cover 1304 can be positioned over a display stack 1308, which can correspond to or be Figure 1A 103 (or any other display described herein). Display stack 1308 can be coupled to cover 1304 along the interior surface of cover 1304 via adhesive 1310, which can be a transparent adhesive. Adhesive 1310 can have a thickness, such as about 100 microns, 200 microns, about 300 microns, about 400 microns, etc.

[0272] The display stack 1308 may include a display element 1312 that may be configured to generate a graphical output. The display element 1312 may be an OLED display and may include multiple layers and / or other components that facilitate generating a graphical output, including, for example, a substrate, an anode, a cathode, one or more organic layers, an emissive layer, an adhesive, etc. In some cases, the display element 1312 may include an integrated (on-cell) touch sensing system, as described above. For example, an electrode array integrated into an OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. In other cases, a separate touch and / or force sensing system may be included above or below the display element 1312 (each display element may include, for example, a capacitive electrode layer, a compliance layer, etc.). Although an OLED display is described, the display element may be any suitable type of display, such as an LCD display, an active layer organic light emitting diode (AMOLED) display, an organic electroluminescent (EL) display, an electrophoretic ink display, etc.

[0273] The display stackup 1308 may include various electrically active layers and components that need to be electrically interconnected to other electronic components, processors, circuit elements, and the like. Because such layers (e.g., anode and cathode layers of an OLED display) may be sandwiched between other layers of the display stackup 1308, a flexible circuit element 1322 (e.g., a flexible circuit board) may be wrapped around the sides of the display stackup 1308 (forming a loop) to electrically couple the electrically active layers of the display stackup 1308 to more accessible circuit elements 1320 of the display stackup 1308. More specifically, the flexible circuit element 1322 may include conductive traces that interconnect electronic components within the display element 1312 (e.g., cathode and anode layers, electrode layers of touch and / or force sensors, on-cell touch sensing layers, and the like) to other electrical traces, connectors, processors, or other electronic components mounted on the circuit element 1320. The circuit element 1320 may be a rigid or flexible circuit board. In some cases, a first encapsulation structure (e.g., epoxy, foam, or other material or component) can be provided in loop region 1316 between the sides of display stack 1308 and flexible circuit element 1322 to help provide structure to flexible circuit element 1322 and to help prevent flexible circuit element 1322 from deforming due to impact or other damage. In some cases, a first encapsulation structure 1317 (also referred to as a potting material) can be disposed within loop region 1316 to help provide structure to flexible circuit element 1322 at loop region 1316 and to help prevent flexible circuit element 1322 from deforming due to drops, impacts, etc. For example, if device 1300 is dropped onto housing member 1302, housing member 1302 can force frame member 1324 against loop region 1316 of flexible circuit element 1322. First encapsulation structure 1317 can help prevent such impacts from causing flexible circuit element 1322 to break, crush, bend, deform, or otherwise damage at loop region 1316.

[0274] In some cases, in addition to or in lieu of providing first encapsulation structure 1317 in loop region 1316, second encapsulation structure 1340 may be provided in region 1357 between frame member 1324 and loop 1335 of flexible circuit element 1322. Loop 1335 may define a convex outer surface and a concave inner surface, such as Fig.13A Second encapsulation structure 1340 can be epoxy, foam, or other material or composition, and can be integral with first encapsulation structure 1317 (e.g., they can both be formed during a single injection process of a single curable material), or it can be different from first encapsulation structure 1317 (e.g., the first encapsulation structure and the second encapsulation structure can be introduced separately, such as in two subsequent injection operations).

[0275] Second encapsulation structure 1340 can provide several benefits. For example, second encapsulation structure 1340 can strengthen loop 1335 of flexible circuit element 1322. More specifically, second encapsulation structure 1340 can reduce the likelihood that flexible circuit element 1322 will be deformed or otherwise damaged due to an impact or other type of impact event. Second encapsulation structure 1340 can also improve the bond strength between cover 1304, display stack 1308, and frame member 1324. For example, second encapsulation structure 1340 can have adhesive properties so that second encapsulation structure 1340 adheres to flexible circuit element 1322, cover 1304, and frame member 1324, thereby bonding these components together through adhesive bonding. The physical shape of frame member 1324 and loop 1335 of flexible circuit element 1322 can also provide a mechanical interlock that holds frame member 1324 and display stack 1308 to cover 1304. For example, frame member 1324 defines flange portion 1329 that forms an undercut area that is filled and / or engaged by second encapsulation structure 1340. Similarly, second encapsulation structure 1340 wraps under loop 1335 to engage the flexible circuit element and, more generally, the display stack 1308. Due to the manner in which second encapsulation structure 1340 engages these components, the adhesion between second encapsulation structure 1340 and cover 1304 helps hold frame member 1324 and display stack 1308 to cover 1304.

[0276] In some cases, the additional attachment security provided by second encapsulation structure 1340 can facilitate the use of less adhesive 1326 to attach frame member 1324 to cover 1304, and thereby allow a thinner adhesive layer 1310, which ultimately reduces the overall thickness of the display stack and can provide more space for other components (e.g., a battery) inside the device and / or allow the device to be made thinner. More specifically, the increased attachment strength provided by second encapsulation structure 1340 can facilitate the use of a smaller adhesive area for adhesive 1326, and thus flange portion 1329 can extend a smaller distance toward the display (e.g., it is shorter in the left-to-right direction, such as Fig.13A By making flange portion 1329 smaller in this direction, the display stack can be placed closer to cover 1304 without loop 1335 contacting or being too close to flange portion 1329, thereby allowing a thinner adhesive layer 1310 to be formed between display element 1312 and cover 1304.

[0277] The encapsulation structures may also provide an environmental seal that supplements the seal provided by adhesive 1326. For example, if an impact or other damage could compromise the adhesion between adhesive 1326 and cover 1304 and / or frame member 1324, the first and second encapsulation structures may continue to inhibit or prevent liquids or other contaminants from reaching and damaging the display stack or other sensitive components of the device.

[0278] In addition to the display element 1312 and the touch and / or force sensing components, the display stack 1308 may include other components, such as support layers and shielding layers, as well as adhesive layers for holding the various components of the display stack 1308 together. For example, the display stack 1308 may include a first metal plate 1314 that supports the display element 1312 and imparts structural support, rigidity, and flatness to the display element 1312. The first metal plate 1314 may have the same or substantially the same front area as the display element 1312 (e.g., the front area of ​​the first metal plate 1314 may be greater than 90% of the front area of ​​the display element 1312). The display stack may also include a second metal plate 1318 that supports the circuit element 1320. The second metal plate 1318 may have a smaller front area than the first metal plate 1314 and may have similar dimensions to the circuit element 1320. The front facing area of ​​both circuit element 1320 and second metal plate 1318 may be less than 50% of the front facing area of ​​display element 1312 , and optionally less than 30% of the front facing area of ​​display element 1312 .

[0279] Display stack 1308 may also include other layers and components. For example, display stack 1308 may include adhesives between various layers and components in display stack 1308. More specifically, display stack 1308 may include adhesives between display element 1312 and first metal plate 1314, adhesives between first metal plate 1314 and second metal plate 1318, and adhesives between second metal plate 1318 and circuit element 1320. Of course, other layers, sheets, substrates, adhesives, and / or other components may also be included in display stack 1308.

[0280] The cover 1304 can be attached to the frame member 1324. The frame member 1324 can be formed of or include a polymer material and can extend around all or substantially all of the perimeter of the cover 1304. The frame member 1324 can at least partially enclose and / or otherwise be coupled to the backplate 1328. The backplate 1328 can be formed of or include metal, ceramic, plastic, or any other suitable material. The backplate 1328 can provide shielding and structural support for the device and can protect the display stack 1308 by forming an at least partially enclosed area in which the display stack 1308 is positioned. The backplate 1328 can be at least partially enclosed in the frame member 1324, or it can be attached to the frame member 1324 in any other suitable manner.

[0281] The frame member 1324 can be attached to the housing member 1302. For example, the frame member 1324 can be attached to a boss 1323 or other feature defined by the housing member, such as Fig.13A As shown. Boss 1323 may extend from the inner side of shell member 1302. Boss 1323 may be part of the unitary structure of shell member 1302 (for example, the shell member may be formed by molding, machining or otherwise forming a single piece of material to define boss 1323 and other features and / or surfaces of shell member 1302). Frame member 1324 may be attached to shell member 1302 via adhesive 1325, which may be located between boss 1323 and frame member 1324 and in contact with both. Adhesive 1325 may be any suitable adhesive, including pressure sensitive adhesive (PSA), heat sensitive adhesive (HSA), adhesive film, epoxy resin, etc. In some cases, the boss or other feature to which frame member 1324 is attached acts as a reference surface for frame member 1324. Thus, the alignment (e.g., flushness) of the front exterior surface 1306 of the cover 1304 with the upper portion 1332 (e.g., the front exterior surface) of the shell member 1302 can be defined or established by the position of the boss (relative to the upper portion 1332) and the position of the bottom surface of the frame member 1324 (relative to the front exterior surface 1306 of the cover 1304).

[0282] The cover 1304 can be attached to the frame member 1324 via an adhesive 1326. The frame member 1324 can define a recessed area 1327 (which defines a bonding surface), and the adhesive 1326 can be placed in the recessed area 1327. The recessed area 1327 can provide a trough-like volume for the adhesive 1326 while also allowing the flange portion 1329 of the frame member 1324 to contact the underside of the cover 1304. The direct contact between the flange portion 1329 of the frame member 1324 and the cover 1304 can provide a rigid connection between the cover 1304 and the frame member 1324, and can ensure that forces applied to the cover 1304 are transferred to the structural frame member 1324. Although the recessed area 1327 is defined by a single flange portion 1329 (e.g., on the right side of the recessed area 1327), other configurations are possible, such as a recessed area defined by two flange portions or other sidewall-like features (e.g., a channel defined by two walls).

[0283] The housing member 1302 can be specifically configured to allow for tight coupling between it and components including the cover 1304, the display stack 1308, and the frame member 1324. Specifically, the housing member 1302 can define a recessed area 1330 (also referred to simply as a recessed portion) along an interior surface of the housing member 1302 that is adjacent to or proximate to the frame member 1324. The recessed area 1330 can be formed into the housing member 1302 in any suitable manner. For example, the recessed area 1330 can be machined into the housing member 1302, or the housing member 1302 can be molded or cast, and the recessed area 1330 can be formed as part of the casting or molding process.

[0284] The recessed area 1330 can correspond to a portion of the housing member 1302 that is thinner than other portions of the housing member 1302. For example, the housing member 1302 can define an upper portion 1332 and a lower portion 1334 that have a greater thickness than the portion of the housing member 1302 that defines the recessed area 1330 (e.g., Fig.13A from left to right as shown).

[0285] The recessed area 1330 can be configured such that an interior surface of the housing member 1302 that is directly opposite the frame member 1324 is disposed a target distance from the frame member 1324. The target distance can be selected such that deformation or deflection of the housing member 1302 along the sidewall (e.g., due to the device 1300 being dropped or otherwise subjected to predictable misuse or damage) does not contact the frame member 1324 and / or the display stack 1308. More specifically, the recessed area 1330 allows the device 1300 to accommodate a certain amount of deformation of the sidewall of the housing member 1302 without the housing member 1302 contacting the frame member 1324. For example, the interior surface of the recessed area 1330 can be spaced apart from the outer peripheral surface 1331 of the frame member 1324 by approximately 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, or any other suitable distance. In some cases, the distance between the inner surface of recessed area 1330 and the outer surface of frame member 1324 is greater than the shell deformation resulting from standard tests such as a side impact test (e.g., where device 1300 is dropped from a specific height (e.g., 1m, 2m, or 3m) onto a specific surface (e.g., the edge of a triangular prism)).

[0286] In some cases, the height of recessed region 1330 (e.g., Fig.13A 1324) (and optionally the combined height of recessed area 1330 and additional recessed area 1336) is equal to or greater than the height of frame member 1324. As such, recessed area 1330 (and optionally additional recessed area 1336) is large enough that frame member 1324 can extend at least partially into recessed area 1330 during an impact or drop event (e.g., an event that deforms or deflects shell member 1302) without frame member 1324 contacting shell member 1302. This can help prevent damage to the frame-cover interface and help prevent cover 1304 from separating from frame member 1324 (e.g., by preventing or reducing the amount of force applied to frame member 1324 by shell member 1302 during an impact, drop, etc.). In some cases, the height of recessed region 1330 (and recessed region 1330 optionally in combination with additional recessed region 1336 ) extends from boss 1323 to a height or position at or above a bottom surface of cover 1304 .

[0287] In some cases, the distance between the inner surface of recessed area 1330 and the outer surface of frame member 1324 is greater than the distance between side surface 1307 and interior side surface 1333 of cover 1304. Thus, for example, deformation or deflection of shell member 1302 toward cover 1304 and frame member 1324 may result in side surface 1307 of cover 1304 contacting interior side surface 1333 of frame member 1324 before shell member 1302 (and specifically the inner surface of recessed area 1330) contacts frame member 1324. Thus, by forming recessed area 1330 that establishes a greater distance between shell member 1302 and frame member 1324 than the distance between shell member 1302 and cover 1304, the risk of contact between shell member 1302 and frame member 1324 during deformation or deflection of shell member 1302 may be reduced.

[0288] The side surface 1307 of the cover 1304 can be adjacent to the interior side surface 1333 of the shell member 1302 (or adjacent to the interior side surface 1333 without a gap component, as described herein). In some cases, there is no gap component or other material between the side surface 1307 of the cover 1304 and the interior side surface 1333 of the shell member 1302. This construction provides several structural and aesthetic advantages. For example, the lack of a bezel or other gap component or material between these surfaces provides a clean, frameless appearance for the front of the device 1300. Specifically, the front-facing surface of the device 1300 can be defined only by the upper portion 1332 of the shell member 1302 and the front exterior surface 1306 of the cover 1304. Although the side surface 1307 of the cover 1304 can be adjacent to the interior side surface 1333 of the shell member 1302, in some cases, there can be an air gap between these surfaces. In some cases, an adhesive or sealing material may be positioned between side surface 1307 of cover 1304 and interior side surface 1333 of housing member 1302. In such cases, the adhesive or sealing material may be the only material between these surfaces, may be in contact with both surfaces, and may have a thickness of less than about 0.5 mm, 0.3 mm, 0.1 mm, 0.05 mm, or any other suitable thickness.

[0289] The proximity between the side surface 1307 of the cover 1304 and the interior side surface 1333 of the shell member 1302 can define a load path through the upper portion 1332 of the shell member 1302 and into the cover 1304. For example, a force applied to the exterior side surface 1303 of the shell member 1302 can be directed into the cover 1304 at the interface between the side surface 1307 of the cover 1304 and the interior side surface 1333 of the shell member 1302. (Where the interior side surface 1333 abuts the side surface 1307 of the cover 1304, the load may be transferred or directed directly into the cover 1304, whereas where an air gap exists between the interior side surface 1333 and the side surface 1307 of the cover 1304, the force may initially cause the gap to close such that the interior side surface 1333 contacts the side surface 1307.) The rigidity and structural integrity of the cover 1304 may help prevent or reduce deformation of the housing member 1302 during a drop or other impact event to the exterior side surface 1303, thereby protecting the internal components of the device 1300 from damage caused by the housing member 1302 contacting them. By limiting the load path through the cover 1304 and by configuring the housing member 1302 to include the recessed area 1330, the device 1300 may be designed to omit the frame member 1324 from the load path during many impact events (e.g., a drop of the device 1300). For example, if the housing member 1302 is not in the load path, the device 1300 may be designed to omit the frame member 1324 from the load path during many impact events (e.g., a drop of the device 1300). Fig. 6A As shown, recessed area 1330 ensures that frame member 1324 is spaced a suitable distance from shell member 1302. In addition, no portion of frame member 1324 is between shell member 1302 and cover 1304. Thus, frame member 1324 can be positioned so that even if shell member 1302 is impacted, deformed, deflected, or otherwise damaged (up to a certain amount of deformation or deflection), the frame member does not contact or is impacted by shell member 1302.

[0290] In some cases, rear cover 1309 interfaces with lower portion 1334 of housing member 1302 in that lower portion 1334 may contact a side surface of rear cover 1309 , thereby defining a load path through lower portion 1334 and into rear cover 1309 .

[0291] In some cases, housing member 1302 may include additional recessed area 1336. Additional recessed area 1336 may be configured so that housing member 1302 in that area is configured to be at a distance from components in display stack 1308, touch and / or force sensing components, antennas, or other electronic components of device 1300. Specifically, since housing member 1302 may be formed of metal, the metal may be capacitively coupled to other electronic components. By increasing the distance between the metal of housing member 1302 and the electronic components, capacitive coupling may be reduced to an acceptable level. Therefore, additional recessed area 1336 may be configured so that the distance between additional recessed area 1336 and another electronic component is greater than about 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any other suitable distance. In some cases, recessed area 1330 may be more recessed than additional recessed area 1336 (and therefore correspond to a thinner portion of housing member 1302).

[0292] Fig. 13B Another exemplary embodiment of the device 1300 is shown, showing another configuration of the second encapsulation structure. For simplicity, Fig. 13B The housing member 1302 and the rear cover 1309 are omitted. Fig. 13B As shown, the second encapsulation structure 1358 does not fill the entire area 1357. Instead, the second encapsulation structure 1358 is positioned in the corner area where the flange portion 1329 of the frame member 1324 meets the cover 1304. Therefore, the second encapsulation structure 1358 contacts and adheres to both the frame member 1324 and the cover 1304, thereby contributing to the bond strength between these components. This specific implementation also provides an air gap between the loop 1335 and the frame member 1324.

[0293] Fig. 13C Another exemplary embodiment of the device 1300 is shown, showing another configuration of the second encapsulation structure. For simplicity, Fig. 13C The housing member 1302 and the rear cover 1309 are omitted. Fig. 13CAs shown, second encapsulation structure 1343 extends around a portion of loop 1335, and compliant member 1342 is positioned between flexible circuit element 1322 (or other component of display stack 1308) and back plate 1328. Compliant member 1342 can be less rigid (e.g., more flexible and / or compressible) than second encapsulation structure 1343. Compliant member 1342 can absorb energy from impact, compression, or other force events that may tend to force flexible circuit element 1322 and back plate 1328 together, thereby reducing the amount or strength of the force that ultimately contacts flexible circuit element 1322. Compliant member 1342 can be a compliant polymer, foam, elastomer, silicone, or any other suitable material. In some cases, compliant member 1342 is an adhesive and adheres to flexible circuit element 1322 and / or back plate 1328. In some cases, compliant member 1342 is adhered to flexible circuit element 1322 and / or backsheet 1328 with a separate adhesive (eg, PSA, HSA, adhesive film, liquid adhesive, etc.).

[0294] Fig.13D Shows FIG. 13A to FIG. 13C A portion of an electronic device is shown illustrating the location of an encapsulation structure and another view of how potting material may be introduced into the area around loop 1335 of flexible circuit element 1322 to form the encapsulation structure. Fig.13D The frame members 1324 and back plate 1328 are shown schematically with the cover 1304 and display stack 1308 removed. The dashed lines show an exemplary location of the loop 1335 of the display with the display stack 1308 and cover 1304 attached. Fig.13D The cover and display are shown removed, but in some implementations, potting material is introduced with those components attached to frame member 1324 .

[0295] In some cases, encapsulation material 1360 (which may correspond to or produce an FIG. 13A to FIG. 13C The first encapsulation structure and / or the second encapsulation structure) can be introduced into the region 1357 via the injection port 1362. The potting material can be understood as being introduced into the injection port 1362 in a direction away from the page by an injection device behind the frame member 1324. In other words, as Fig.13D The frame member 1324 is shown to be flipped during the injection process.

[0296] Potting material 1360 may be a curable polymer (such as epoxy) that may be introduced as a liquid or other flowable state and then allowed to cure. While the potting material is being introduced, vent port 1361 may allow air to be drawn from region 1357 ( Fig.13A) escape. In some cases, a vacuum or negative pressure is applied to the exhaust port 1361 to help the potting material 1360 flow into the desired location. Since the loop 1335 of the flexible circuit element 1322 can be open at its ends, the potting material can flow into the loop area 1316 ( Fig.13A ), while the encapsulation material 1360 is introduced through the injection port 1362.

[0297] Barrier structures 1363, 1364, 1365, 1366, and 1367 may define the walls of a volume in which potting material 1360 is positioned. The barrier structures may be positioned between (and may contact and / or be sandwiched by) the display stack and backplate 1328, or the cover 1304 and backplate 1328, or any other suitable component or structure. The barrier structures may include adhesives, foams, glues, structural portions of frame members, etc., and may have other functions in addition to serving as a barrier to potting material 1360. For example, barrier structure 1363 may correspond to frame member 1324 and adhesive 1326, and barrier structures 1364 and 1356 may correspond to adhesive structures (e.g., adhesive foams) for coupling frame member 1324 and / or backplate 1328 to the cover and / or display stack. Barrier structures 1366 and 1367 may correspond to adhesives that bridge gaps between barrier structures 1364 and 1365 and / or between other components of the device.

[0298] In some implementations, barrier structures (such as barrier structures 1363 and 1364) define a channel segment that extends along the corner region 1347 of the frame member 1324. During the injection process, the potting material 1360 can travel within the channel segment along the corner region 1347 and extend at least partially along the sides (e.g., along the long sides of the device and / or display) of the frame member 1324. In some cases, a portion of the barrier structures 1363 and / or 1364 (or a different component or material) can define an optional barrier 1371 that blocks the channel segment or otherwise defines a blind end of the channel segment, thereby limiting the flow path of the potting material 1360 during its introduction, ultimately helping to define the shape of the structure that results when the potting material 1360 hardens or cures.

[0299] FIG. 13A to FIG. 13CAn exemplary device configuration is shown that includes a frame member 1324 that is attached to the cover (and optionally coupled to a back plate 1328), and to the housing member (e.g., via adhesive 1325) to secure the top module to the housing and / or other components of the device. The frame member 1324 can be formed of or include plastic, metal, and / or other materials, and can be formed separately from other components of the top module (e.g., cover, display stack, etc.) and then assembled with these components to form the top module. Fig.13E An exemplary embodiment of the device 1300 is shown in which a molded frame member 1370 is used in place of the frame member 1324. More specifically, after the display stack 1308 is attached to the cover 1304, the molded frame member 1370 can be formed by molding a moldable material in place and allowing the material to cure or otherwise harden to define the molded frame member 1370. For example, the display stack 1308 can be attached to the cover 1304 to form a subassembly. The subassembly can then be placed in a mold that defines at least a portion of the shape of the molded frame member 1370, and the moldable material (e.g., a polymer, a reinforced polymer, a thermoplastic polymer, a thermosetting polymer, an epoxy resin, etc.) can be introduced into the mold. The material flows against the cover 1304 and the display stack 1308 (including against and around the loop 1335) and can be adhered or bonded to those components via mechanical or chemical bonding (or both). The material is allowed to cure or otherwise harden to form molded frame member 1370, and the subassembly with molded frame member 1370 is removed from the mold. Optionally, a backplane is also incorporated into the mold and at least partially encapsulated in molded frame member 1370. The top module can then be attached to housing member 1302 by attaching molded frame member 1370 to housing member 1302 with adhesive 1325 (or via any other attachment technique).

[0300] Fig.13E Also shown is loop region 1316 that has been filled with potting material 1317. In some cases, potting material 1317 is part of molded frame member 1370. For example, when moldable material for molded frame member 1370 is introduced into the mold, the material may also flow into loop region 1316, thereby defining an integral (monolithic) structure that serves as both a molded frame member and potting in loop region 1316. In some cases, potting material 1317 is a separate material from the material of molded frame member 1370 and is introduced into loop region 1316 separately from the material that forms molded frame member 1370 (e.g., before or after molded frame member 1370 is in place).

[0301] The molded frame members 1370 can provide a number of advantages and benefits by combining the functions of a frame member and a potting material into a single component that can be manufactured in a single operation. For example, the molded frame members 1370 can perform the structural functions of a separate frame member, including providing structural rigidity to the top module and providing a structural attachment member to secure the cover 1304 to the housing member 1302 (or any other suitable structural component of the device). In addition, the molded frame members 1370 can self-adhere to the cover 1304 during the molding operation, thereby reducing assembly operations and time compared to frame members that are manufactured separately and then must be attached to the cover 1304. In addition, the molded frame members 1370 can perform bonding with the potting material 1340 ( Fig.13A ) or 1343( Fig. 13C )The same stabilizing function is achieved without the need for an additional potting operation (as would be the case if the potting material was introduced after the frame members were formed and attached).

[0302] Although Fig.13E Only a portion of molded frame member 1370 positioned proximate loop 1335 of the display is shown, but molded frame member 1370 can extend around the entire perimeter of the top module, effectively defining a frame along all four sides of the interior surface of cover 1304, and optionally at least partially encapsulating the display stack along multiple sides of the display stack. In some cases, molded frame member 1370 extends around less than the entire perimeter of the top module.

[0303] Fig.13E Other components, features, or other details of the device 1300 shown are similar to those of the FIG. 13A to FIG. 13C are the same or similar to those shown and described, and those descriptions apply equally to Fig.13E those components, features or other details shown.

[0304] Fig.13F Another exemplary configuration of a device is shown that may enable the use of a thinner adhesive to attach the display stack to the cover. For example, Fig.13F A partial cross-sectional view of a device is shown having a cover 1378 having a thinned outer region 1380. Except for the thinned outer region 1380, the cover 1378 can be the same or similar to the cover 1304, and for the sake of brevity, these details are not repeated here. The cover 1378 can be attached to the frame member 1374 via an adhesive 1376 positioned in a recessed region 1375 of the frame member 1374 (which defines a bonding surface). The frame member 1374, adhesive 1376, and recessed region 1375 can be the same or similar to the frame member 1324, adhesive 1326, and recessed region 1327, and for the sake of brevity, these details are not repeated here.

[0305] The thinned outer region 1380 may extend along one or more edges of the cover 1378. For example, the thinned outer region 1380 may extend along one edge of the cover 1378, and specifically, along an edge of the cover 1378 that is proximate to the display stack 1382 of the flexible circuit element 1373. In some cases, the thinned outer region 1380 may extend along two, three, or four sides of the cover 1378. For example, in the case of a substantially rectangular cover, the thinned outer region 1380 may extend around the entire outer perimeter of the cover 1378 (e.g., the thinned outer region 1380 may extend around a display area of ​​the cover 1378, where the display area corresponds to a central area of ​​the cover 1378 through which a display is visible and / or generates a graphical output). The display stack 1382 and the flexible circuit element 1373 may be the same or similar to the display stack 1308 and the flexible circuit element 1322, and for the sake of brevity, these details are not repeated here.

[0306] The thinned outer region 1380 can facilitate the use of a thinner adhesive (e.g., an optically clear or transparent adhesive) layer 1383 to attach the display stack 1382 to the cover 1378. More specifically, the thinned outer region 1380 can allow the flange portion 1379 (similar to Fig.13A The flange portion 1329 of the cover 1378 is positioned further toward the outer surface of the cover 1378 (e.g., higher in the vertical direction, such as Fig.13F 1378) such that display stack 1382, and therefore flexible circuit element 1373, can also be positioned further toward the exterior surface of cover 1378 without causing flexible circuit element 1373 to contact or otherwise interfere with flange portion 1379. Thus, the thickness of adhesive 1383 can be made thinner (e.g., relative to adhesive 1310), resulting in an overall height of display stack 1382 and cover 1378 that is less than the height of a device that does not include a cover having a thinned exterior region (e.g., the overall height can be less than Fig.13A 1359). In some cases, adhesive 1383 has a thickness of about 150 microns, about 125 microns, about 100 microns, or about 75 microns.

[0307] The thinned outer region 1380 of the cover 1378 may have a thickness 1381 of about 400 microns, and the main portion of the cover 1378 (e.g., the portion to which the display stack 1382 is attached and includes the graphically active area of ​​the device) may have a thickness of about 600 microns. In some cases, the thinned outer region 1380 is about 100 microns, about 200 microns, or about 300 microns thinner than the main portion of the cover 1378. The thickness 1381 may be between about 375 microns and about 425 microns, and the thickness of the main portion may be between about 575 microns and about 625 microns.

[0308] The cover 1378 can define a transition region extending from the thinned outer region 1380 to a main portion of the cover 1378. For example, Fig.13F As shown, the transition region defines a curved portion of the bottom surface of the cover 1378 extending from the thinned outer region 1380 to the main portion of the cover 1378. The transition region (e.g., the surface of the transition region) can have a continuous curve (as shown), or can have another shape or configuration. For example, the transition surface can be completely or partially flat, and can resemble a chamfered surface. FIG. 13G to FIG. 13L Other exemplary shapes for the thinned outer region of the cover are shown.

[0309] FIG. 13G to FIG. 13L Exemplary configurations for thinned outer regions of the cover are shown. For example, Figure 13G A cover having a thinned outer region 1380-G is shown, similar to Fig.13F The thinned outer region 1380-G is shown. In this example, the thinned outer region 1380-G includes or is defined by a flat region 1384-G at an outer portion of the thinned outer region 1380-G and a curved region 1385-G extending from the flat region 1384-G to a corner or edge 1386-G. The corner or edge 1386-G may represent the edge where the main portion 1389-G of the cover (e.g., the flat surface to which the display stack is attached) meets the curved region and may appear as a discontinuity or distinct vertex. The curved region 1385-G may define a concave surface shape, while the corner or edge 1386-G may define a pointed convex feature. Where the cover including the thinned outer region 1380-G is attached to a frame member, as shown Fig.13F As shown, the adhesive may be positioned solely on the flat region 1384-G, solely on the curved region 1385-G, or on at least a portion of both the flat region and the curved region. In addition, the frame member (or other component) may contact the cover on the flat region 1384-G and / or the curved region 1385-G.

[0310] Fig.13HA cover having a thinned outer region 1380-H is shown. In this example, the thinned outer region 1380-H includes or is defined by: a flat region 1384-H at an outer portion of the thinned outer region 1380-H and a first curved region 1385-H extending from the flat region 1384-H to a second curved region 1386-H. Compared to the corner 1386-G (which may appear as a distinct vertex or edge), the second curved region 1386-H defines a curved profile. The first curved region 1385-H may define a curved concave surface shape, and the second curved region 1386-H may define a curved convex surface shape. In some cases, the absolute values ​​of the radii of curvature of the first curved region and the second curved region are the same, while in other cases, they are different from each other. The two curved regions that define the transition between the main portion 1389-H of the cover and the thinned outer region can help eliminate sharp features (or other features) that can act as stress concentration features, thereby increasing the provision of a strong cover that resists fracture or other damage. Where a cover comprising a thinned outer region 1380-H is attached to a frame member, such as Fig.13F As shown, the adhesive may be positioned on the surface of either (or both) the flat region 1384-H and / or the curved regions 1385-H, 1386-H. In addition, the frame member (or other component) may contact the cover on the surface of either (or both) the flat region 1384-H and / or the curved regions 1385-H, 1386-H.

[0311] Fig.13I A cover having a thinned outer region 1380-I is shown. In this example, the thinned outer region 1380-I includes or is defined by: a flat region 1384-I at an outer portion of the thinned outer region 1380-I and a stepped region 1385-I defining a discontinuous transition from the thinned outer region 1380-I to a main portion 1389-I of the cover. The stepped region 1385-I may define two substantially 90 degree corners, thereby creating a stepped surface that is substantially perpendicular to the surface of the flat region 1384-I and the main portion 1389-I of the cover (and the outer surface of the cover), as shown in FIG. Fig.13I In other examples, the corners, and therefore the stepped surface, may have different angles. For example, the angle between the flat region 1384-I and the stepped surface may be about 80 degrees, and the angle between the stepped surface and the main portion 1389-I of the cover may be about 100 degrees, thereby creating a stepped surface that is about 80 degrees relative to the flat region 1384-I (and the outer surface of the cover). In the case where the cover including the thinned outer region 1380-I is attached to a frame member, such as Fig.13FAs shown, the adhesive may be positioned on the surface of the flat region 1384-I and / or the stepped surface of the stepped region 1385-I. In addition, the frame member (or other component) may contact the surface of the flat region 1384-I and / or the cover on the stepped surface of the stepped region 1385-I.

[0312] Fig.13J A cover having a thinned outer region 1380-J is shown. In this example, the thinned outer region 1380-J includes or is defined by a curved transition region 1387-J extending from a main portion 1389-J of the cover to an outer peripheral edge of the thinned outer region 1380-J. The curved transition region 1387-J may define a continuous concave curved profile that may meet the main portion 1389-J of the cover at a corner or edge 1319-J. More specifically, the corner or edge 1319-J may represent an edge where the main portion 1389-J of the cover (e.g., a flat surface to which the display stack is attached) meets the curved transition region 1387-J and may appear as a discontinuous or distinct vertex. The curved transition region 1387-J may have a constant radius of curvature (e.g., it defines a portion of a circle) or a variable radius of curvature (e.g., it may define a non-circular spline). Where a cover comprising thinned outer region 1380-J is attached to a frame member, such as Fig.13F As shown, the adhesive can be positioned on the surface of the curved transition region 1387-J. In addition, the frame member (or other component) can contact the cover on the surface of the curved transition region 1387-J.

[0313] Figure 13K A cover is shown having a thinned outer region 1380-K. In this example, the thinned outer region 1380-K includes or is defined by a flat transition region 1387-K extending from a main portion 1389-K of the cover to an outer peripheral edge of the thinned outer region 1380-K. The flat transition region 1387-K may define a substantially flat surface that may meet the main portion 1389-K of the cover at a corner or edge 1319-K. More specifically, the corner or edge 1319-K may represent an edge where the main portion 1389-K of the cover (e.g., a flat surface to which the display stack is attached) meets the flat transition region 1387-K and may appear as a discontinuity or distinct vertex. Where a cover including a thinned outer region 1380-K is attached to a frame member, such as Fig.13F As shown, the adhesive can be positioned on the surface of the flat transition region 1387-K. Additionally, the frame member (or other component) can contact the cover on the surface of the flat transition region 1387-K.

[0314] Figure 13LA cover is shown having a thinned outer region 1380-L, wherein the thinned outer region is inset from the outer peripheral edge of the cover. More specifically, the thinned outer region 1380-L includes or is defined by a recess 1390 formed between a main portion 1389-L and a peripheral ridge 1388 of the cover. The thickness of the cover at the main portion 1389-L and at the peripheral ridge 1388 (e.g., the thickness corresponding to the thickest dimension in these locations) can be equal, or they can be different. In the case where the cover including the thinned outer region 1380-L is attached to a frame member, such as Fig.13F As shown, the adhesive can be positioned on the surface of the peripheral ridge 1388 and / or recessed portion 1390. In addition, the frame member (or other component) can contact the cover on the surface of the peripheral ridge 1388 and / or recessed portion 1390.

[0315] As mentioned above, FIG. 13F to FIG. 13L The reduced thickness areas of the cover shown in can allow the display stack to be positioned closer to the interior surface of the cover, such as by allowing the use of a thinner adhesive or other layer between the display stack and the cover. In some cases, the specific thicknesses of the thinned areas and primary areas of the cover may depend at least in part on a target thickness for the adhesive layer between the display stack and the cover, or other dimensions and / or other shapes or configurations of the display stack. FIG. 13F to FIG. 13L In each of the covers shown, the thickness 1399 of the thinned outer region may be approximately 400 microns, and the thickness of the main portion of the cover (e.g., the portion to which the display stack is attached and includes the graphically active area of ​​the device) may have a thickness of approximately 600 microns. In some cases, the thickness 1399 of the thinned outer region may be approximately 100 microns, approximately 200 microns, or approximately 300 microns thinner than the main portion of the cover. Thickness 1399 may be between approximately 375 microns and approximately 425 microns, and the thickness of the main portion may be between approximately 575 microns and approximately 625 microns. In some cases, thickness 1399 may be approximately 10%, approximately 20%, approximately 30%, approximately 40%, or approximately 50% thinner than the thickness of the main portion of the cover. Thickness 1399 may correspond to a thickness dimension of the cover as measured between the thinnest portions of the thinned outer region, such as FIG. 13G to FIG. 13L shown.

[0316] FIG. 13F to FIG. 13LThe illustrated cover can be formed in a variety of ways. For example, the cover (including the thinned outer region 1380) can be formed by molding (e.g., heating glass or another transparent material and applying a mold or press to produce the desired shape), machining (e.g., grinding, polishing, or otherwise removing material from a sheet to form the desired shape), and / or additive manufacturing (e.g., adhering, bonding, or otherwise attaching a first glass sheet to a second glass sheet to form the desired shape). Combinations of these processes can also be used to form the cover and produce the thinned outer region.

[0317] Figure 13M An exemplary cover and frame member configuration is shown in which the adhesive 1321 attaching the display stack 1392 to the bottom or interior surface of the cover 1304 defines an angled ramp surface 1391 that deflects a portion of the display stack 1392 downward (e.g., away from the front cover) to help prevent or reduce the risk of contact between the display stack and the frame member 1324. The angled ramp surface 1391 can be configured to deflect the loop 1337 of the flexible circuit element of the display stack and a portion of the layered area 1339 of the display stack 1392 (optionally including an active area of ​​a display configured to produce a graphical output). The angled ramp surface 1391 can be integral with the remainder of the adhesive layer attaching the display stack 1392 to the cover 1304 (e.g., the angled ramp surface 1391 can be a thickened area of ​​the adhesive 1321). In some cases, adhesive 1321 is a liquid optically clear adhesive (LOCA) that is dispensed onto cover 1304 and / or display stack 1392 to define a portion (e.g., region 1393) of substantially uniform thickness that is positioned over the active area of ​​the display and angled ramp surface 1391.

[0318] The angled ramp surface 1391 is configured to deflect a portion of the loop 1337 and the layered region 1339 of the display stack 1392 away from the cover 1304 (e.g., as Figure 13M Angled ramp surface 1391 can have a curved or flat surface (eg, a surface that contacts display stack 1392), and can have a maximum thickness between about 100 microns and about 200 microns.

[0319] Fig.13N Another exemplary configuration for attaching a cover and display stack to housing member 1302 is shown. Fig.13NIn the example shown, the display stack 1396 is attached to the interior surface of the cover 1304 via an adhesive 1394 (e.g., an optically clear adhesive). The mounting plate 1397 is attached to the display stack 1396 via an adhesive 1395 and / or other attachment techniques (e.g., fasteners, brackets, etc.). The mounting plate 1397 is attached to the housing member 1302 to secure the cover 1304 and the display stack 1396 (also referred to as a top module) to the housing member 1302. More specifically, the mounting plate 1397 can be attached to the boss 1323 of the housing member 1302 via an adhesive 1398 (e.g., HSA, TSA, adhesive foam, epoxy, etc.). In some cases, the attachment between the mounting plate 1397 and the boss 1323 using the adhesive 1398 can be the only attachment between the top module and the housing member 1302. In other cases, the top module is further secured to the housing member 1302 in other ways as well, such as with fasteners (eg, screws, bolts, rivets), interlocking features, latching features, brackets, and the like.

[0320] The boss 1323 may be part of a single integral structure that also defines the sidewalls of the housing member 1302. For example, the housing member 1302 may be formed of metal, plastic, etc., and may define the sidewalls of the housing as well as the boss 1323. In other cases, the boss 1323 may be a distinct component attached to or otherwise integrated with a portion of the housing member 1302 that defines the sidewalls. For example, the boss 1323 may be part of a polymer material (e.g., a fiber reinforced polymer) molded against a metal housing structure. Other configurations and constructions of the boss 1323 are also contemplated.

[0321] Fig.13N The configuration shown, in which mounting plate 1397 is used to attach the top module to housing member 1302, allows the top module to be mounted without a frame member (e.g., without a housing member). FIG. 13A to FIG. 13C , Fig.13F and Figure 13M 1324) is attached to housing member 1302 without the frame member 1324 shown. The lack of a frame member can provide greater clearance between the display loop and / or other portions of the display stack 1396 and other components of the device (e.g., housing member 1302). Alternatively, the display loop can be positioned closer to housing member 1302, thereby facilitating a larger active area for the display screen, a smaller device, or both. In addition, by omitting the frame member, the display stack 1396 can be positioned closer to the interior surface of the cover 1304 because no portion of the frame member (e.g., the lack of a flange) interferes with or otherwise limits the vertical positioning of the display stack 1396 relative to the cover 1304. More generally, as Fig.13N As shown, removing frame members can produce a more space efficient device in the x, y, and / or z directions.

[0322] Although Fig.13N Only a portion of mounting plate 1397 and housing member 1302 is shown near the loop of display stack 1396, but the same or similar configuration of housing 1302 (including boss 1323), mounting plate 1397, and adhesive 1398 can extend around the entire perimeter of the top module, effectively defining an adhesive mounting area along all four sides of the device. In some cases, mounting plate 1397 and adhesive 1398 extend around less than the entire perimeter of the top module.

[0323] As described above, a device as described herein may include one or more antenna groups including elements configured to communicate via 5G wireless protocols (including millimeter wave and / or 6 GHz communication signals). Fig.14A A portion of an electronic device 1400 is shown, with components removed to better illustrate an exemplary antenna group for 5G wireless communications. 5G communications may be implemented using a variety of different communication protocols. For example, 5G communications may use a communication protocol that utilizes a frequency band below 6 GHz (also referred to as a sub-6 GHz spectrum). As another example, 5G communications may use a communication protocol that utilizes a frequency band above 24 GHz (also referred to as a millimeter wave spectrum). In addition, the specific frequency bands of any given 5G implementation may be different from other implementations. For example, different wireless communication providers may use different frequency bands in the millimeter wave spectrum (e.g., one provider may use a frequency of about 28 GHz to implement a 5G communication network, while another provider may use a frequency of about 39 GHz to implement). A specific antenna group implemented in a device as described herein may be configured to allow communication via one or more frequency bands in the frequency bands that implement 5G communications.

[0324] Fig.14A The device 1400 in the embodiment includes at least two groups of antennas, each group of antennas is configured to operate using a different communication protocol to provide 5G communication. For example, the first antenna group includes multiple antennas that communicate via a sub-6 GHz spectrum, and the second antenna group includes multiple antennas that communicate via a millimeter wave spectrum.

[0325] As described above, housing members of a device such as a mobile phone may be adapted to function as an antenna. In device 1400, for example, housing 1450 may include housing members 1401, 1403, 1405, 1407, 1409, and 1411. These housing members may be formed of metal or another conductive material and may be electrically coupled to a communication circuit (as described in more detail herein) to enable portions of the housing members to send and / or receive wireless communications. Housing members 1401, 1403, 1405, 1407, 1409, and 1411 may be coupled together with engagement elements 1416, 1418, 1420, 1422, 1424, and 1426 to form the housing members into a single structural housing component. For simplicity, engagement elements 1416, 1418, 1420, 1422, 1424, and 1426 are shown as separate components, but some of the engagement elements may be continuous (eg, engagement elements 1416 and 1418 may be part of a continuous molded polymer structure).

[0326] The joining element can mechanically and / or structurally couple the shell members together and provide electrical isolation between adjacent shell members to facilitate the use of the shell members as radiating antennas. More specifically, relative to mechanical coupling, the joining element can be firmly attached to adjacent shell members (e.g., via mechanical interlocking between the joining element and the shell member and / or via an adhesive or chemical bonding between the joining element and the shell member). Relative to the electrical isolation function, the joining element can provide the necessary electrical isolation between the antenna and another conductive component (e.g., another conductive shell member that acts as an antenna or a non-radiating structural member) to reduce the attenuation of the antenna performance (e.g., due to capacitive coupling between the antenna and another conductive component). The joining element can be formed of or include a non-conductive material and / or a dielectric material, such as a polymer, fiber-reinforced nylon, epoxy resin, etc. Therefore, the joining element may be referred to as a non-conductive joining element in this article.

[0327] The engaging element can be formed by a molding process. For example, the housing member can be placed in a mold or otherwise maintained in a fixed position relative to each other so that the gap is defined between adjacent housing members. Then one or more polymer materials can be injected into the gap (and optionally engaged with a retaining structure and / or interlocking features defined in the housing member) so that the polymer material at least partially fills the gap and is allowed to solidify or otherwise harden to form the engaging element. In some cases, the engaging element can be formed by a variety of different materials. For example, the inner portion of the engaging element can be formed by a first material (for example, a polymer material), and the outer portion of the engaging element (for example, the portion of the outer surface of the housing that it defines) can be formed by a second material different from the first material. These materials can have different properties, and these properties can be selected based on the different functions of the inner portion and the outer portion of the engaging element. For example, the inner element can be configured to form a main structure connection between the housing members, and can have a higher mechanical strength and / or toughness than the outer material. On the other hand, the outer material can be configured to have a specific appearance, surface finish, chemical resistance, waterproof function, etc., and its composition can be selected to give priority to those functions over mechanical strength. The engagement elements may be formed from fiber reinforced polymer, epoxy, or any other suitable material.

[0328] In device 1400, at least three sections of the housing are adapted to function as antennas for communicating via the sub-6 GHz spectrum. More specifically, the housing member may be adapted to function as an antenna by conductively coupling a ground line and a feed line to specific locations on the housing member (which is conductive and may be formed of or include metal). The specific locations of the ground line and the feed line on the housing member may, in part, define the specific wavelength to which the antenna is tuned.

[0329] Device 1400 includes an exemplary configuration of a first group of antennas for communicating via a sub-6 GHz spectrum. The first group of antennas includes a first sub-6 GHz antenna 1402, a second sub-6 GHz antenna 1404, a third sub-6 GHz antenna 1406, and a fourth sub-6 GHz antenna 1408. In this exemplary configuration, the first sub-6 GHz antenna 1402, the second sub-6 GHz antenna 1404, and the third sub-6 GHz antenna 1406 are defined by sections of a housing member, while the fourth sub-6 GHz antenna 1408 is a conductive trace (e.g., on a circuit board) or other radiating element positioned within the device. The four antennas of the first group of antennas can be configured to operate according to a 4x4 MIMO (multiple-input, multiple-output) scheme.

[0330] The antennas defined by the sections of the housing member may be similar to each other in structure and function. Therefore, to avoid redundancy, only the first sub-6 GHz antenna 1402 will be described in detail. However, it should be understood that the description is also applicable to the second sub-6 GHz antenna 1404 and the third sub-6 GHz antenna 1406.

[0331] The first sub-6 GHz antenna 1402 may be defined by a portion of the housing member 1401, and more specifically, by a portion of the housing member 1401 proximate the engagement element 1416. To transmit and receive electromagnetic signals from the first sub-6 GHz antenna 1402, a ground line and a feed line may be conductively coupled to the housing member 1401. For example, the ground line may be conductively coupled to the location 1412, and the feed line may be conductively coupled to the location 1410.

[0332] The portion of the housing member 1401 that serves as the first sub-6 GHz antenna 1402 may define structural features 1413 and 1414. These features may extend from the inside of the housing member 1401 and toward the interior volume of the device 1400. The features 1413, 1414 may have several functions, including defining the physical mounting locations of the ground wire and the feed wire, and defining an interlocking feature with which the material of the engaging element engages and / or is encapsulated to form a structural coupling between the housing members. Although the features 1413, 1414 are not necessarily identical, the features 1413, 1414 may be used to define the physical mounting locations of the ground wire and the feed wire. Fig.14A 1401 and 1407, other housing members may include similar features proximate to the engaging elements.

[0333] As described above, the second sub-6 GHz antenna 1404 and the third sub-6 GHz antenna 1406 may have the same or similar structure as the first sub-6 GHz antenna 1402. In some cases, the first sub-6 GHz antenna, the second sub-6 GHz antenna, and the third sub-6 GHz antenna are each configured to communicate via different frequency bands. Therefore, the exact shape, length, or other physical features of each of these antennas may be different from each other.

[0334] As described above, the fourth sub-6 GHz antenna 1408, which is part of the first set of antennas operating according to the 4×4 MIMO scheme, is a conductive trace or other radiating element positioned within the device. However, in some cases, a portion of the first housing member 1401 near the engagement element 1426 may be configured to act as a fourth sub-6 GHz antenna. In this case, the first housing member 1401 may include structural features similar to the structural features of the first sub-6 GHz antenna 1402 (e.g., features 1413, 1414), and the ground wire and feed line may be similarly coupled to this area of ​​the first housing member 1401 to facilitate the transmission and reception of electromagnetic signals.

[0335] Although sub-6 GHz antennas 1402, 1404, 1406, and 1408 may be used to communicate via the sub-6 GHz spectrum, device 1400 may also (or alternatively) include antennas for communicating via the millimeter wave spectrum. Device 1400 may include, for example, a first millimeter wave antenna 1432 and a second millimeter wave antenna 1434. Compared with antennas of other spectrums, millimeter wave antennas may be more directional and more susceptible to attenuation due to occlusion. For example, with respect to attenuation, if a user places his or her hand on a millimeter wave antenna, communication via the antenna may suffer a stop or stop completely. With respect to orientation, if the millimeter wave antenna is pointed away from a cellular tower by more than a certain angle, the antenna may stop being able to communicate effectively with the cellular tower. In order to mitigate these effects, the device may include multiple millimeter wave antennas strategically positioned to enable wireless communication in multiple different locations, positions, orientations, etc. For example, in device 1400, the first millimeter wave antenna 1432 may be configured as a rear transmit antenna (e.g., it primarily sends and receives electromagnetic signals in a direction perpendicular to the rear surface of the device). The second millimeter wave antenna 1434 can be configured as a side-transmitting antenna (e.g., it transmits and receives electromagnetic signals primarily in a direction perpendicular to the side surface of the device). It should be understood that a directional millimeter wave antenna need not be oriented directly toward another antenna in order to communicate, but can tolerate slight misalignment (e.g., + / - 15 degrees, + / - 30 degrees, or another value).

[0336] return Fig.14A , the first (rear-transmitting) millimeter wave antenna 1432 can be coupled to the logic board 1436 (which can be an embodiment of the logic board 220, 320, or any other logic board described herein). In some cases, the first millimeter wave antenna 1432 (which can be or can include a passive antenna board) is directly surface mounted to the logic board 1436. The first millimeter wave antenna 1432 may include antenna arrays for two different frequencies (e.g., 28 GHz and 39 GHz, but other frequencies are also possible). Each antenna array may include four antenna elements, and each antenna element may have two different polarizations. By including two (or more, such as four) different antenna arrays, rather than using the same antenna element for two different frequency bands, the first millimeter wave antenna 1432 may have a greater total bandwidth than an antenna that uses the same antenna element to communicate on two (or more) frequency bands. The greater bandwidth of the first millimeter wave antenna 1432 may allow for greater tolerance in positioning the antenna 1432 in the device 1400 while still providing sufficient antenna performance. Additionally, a multiple millimeter wave antenna array of the first millimeter wave antenna 1432 may be used in a diversity configuration to improve wireless communication functionality and reliability.

[0337] The device 1400 may also include antenna circuitry in a system-in-package (SiP) component 1438. The SiP component 1438 (referred to herein as SiP 1438) may include components such as one or more processors, memory, analog-to-digital converters, filters, amplifiers, power control circuitry, etc. The SiP 1438 may be coupled to the logic board 1436 and may be positioned above the first millimeter wave antenna 1432. The antenna elements in the first millimeter wave antenna 1432 may be conductively coupled to the SiP 1438 so that the SiP 1438 may process signals received via the first millimeter wave antenna 1432 and cause the first millimeter wave antenna 1432 to transmit signals.

[0338] Fig. 14B For along Fig.14A A partial cross-sectional view of device 1400 as viewed along line 14B-14B in FIG. The cross-sectional view shows exemplary details of a second (side-emitting) millimeter wave antenna 1434 of device 1400. Side-emitting antenna 1434 (also referred to as an antenna module) is secured to device 1400 ( Fig.14A ) is disposed within housing 1450 (e.g., secured to housing member 1407) and is configured to send and receive electromagnetic signals through one or more openings 1457 in a side wall of housing member 1409. Opening 1457 may extend through the side wall of housing member 1409 and may at least partially define an antenna window for side-transmitting antenna 1434.

[0339] The side transmitting antenna 1434 includes an antenna array 1466, which includes a plurality of directional antenna elements. The antenna array 1466 may include antenna elements for two different frequencies (e.g., 28 GHz and 39 GHz, but other frequencies are also possible). For example, two antenna elements may be provided for each frequency, and each antenna element may have two different polarizations. Of course, other configurations of antenna elements are also possible. For example, the antenna array 1466 may include four antenna elements for each frequency.

[0340] The antenna array 1466 may include or be coupled to antenna circuitry in a SiP component. The SiP component may include components such as one or more processors, memory, analog-to-digital converters, filters, amplifiers, power control circuitry, etc. The SiP may be conductively coupled to the logic board 1436 (e.g., via a flexible circuit element). The antenna elements in the antenna array 1466 may be conductively coupled to the SiP so that the SiP may process signals received via the antenna array 1466 and cause the antenna array 1466 to transmit signals.

[0341] The sidewalls of the housing member 1409 can be configured to act as waveguides for guiding electromagnetic signals into and out of the antenna array 1466. The waveguides can be defined by passages or holes 1459 through the sidewalls of the housing member 1409. The passages 1459 can be defined in part by walls extending from the exterior side surfaces of the sidewalls of the housing member 1409 to the interior surfaces of the housing member 1409. As shown, the walls are angled so that the openings 1459 on the exterior side surfaces are offset from the openings on the interior surfaces of the housing. More specifically, the center of the opening in the exterior side surface of the sidewall can be vertically offset from the center of the opening in the interior side of the housing member 1409.

[0342] The vertical offset of the opening is defined (relative to Fig. 14B 1457) can be aligned with the outer shell 1409 in a substantially non-horizontally aligned channel, which allows the internal components of the side-transmitting antenna 1434 to be offset from the central axis of the device 1400 while also allowing the opening 1457 in the outer side surface to be vertically centered in the outer side surface. For example, the height 1452 of the housing member 1409 above the opening 1457 can be the same as the height 1454 of the housing member 1409 below the opening 1457. By aligning the opening 1457 with the middle of the side surface (e.g., in the middle in a vertical direction), the structural integrity (e.g., stiffness, strength, etc.) of the housing member 1409 can be higher than if the opening 1457 was vertically offset from the center of the side surface (e.g., because the amount of housing material above the opening 1457 will be different than the amount below, resulting in one side being weaker than the other). In addition, the central alignment of the opening 1457 provides the device 1400 with an overall symmetrical and balanced appearance.

[0343] The side-firing antenna 1434 may include a cover element 1462 (also referred to as an insert) within a portion of the channel 1459. The insert 1462 may be an insert of plastic, glass, or other material (e.g., a non-conductive material) and may be adhered to the antenna array 1466 via an adhesive. The insert 1462 may be placed into the channel 1459 or may be formed in place by, for example, injecting a polymer material into the channel 1459 and allowing the polymer material to cure or otherwise harden.

[0344] The device 1400 may also include a covering element 1456 that is positioned in the channel 1459 and defines a portion of the outer side surface of the device 1400 (e.g., in conjunction with the outer side surface of the housing member 1409). The covering element 1456 may be formed of glass, sapphire, glass ceramic, plastic, or any other suitable material (e.g., a non-conductive material). The thickness of the covering element 1456 may be determined at least in part based on the material used and the effect of the material (and size) on the electromagnetic signal passing through the channel 1459. For example, in order to achieve the same or similar electromagnetic performance, the thickness of the covering element 1456 may be greater when formed of glass than when formed of sapphire. If the covering element 1456 is formed of sapphire, a spacer layer (e.g., plastic, epoxy, or other suitable material) may be included between the covering element 1456 and an adhesive (e.g., adhesive 1460) that secures the cover to the device 1400.

[0345] The covering element 1456 may include a mask layer 1458, which may be applied to the back surface or the front surface of the covering element 1456. As shown, the mask layer 1458 is applied to the back surface of the covering element 1456. The mask layer 1458 may be an ink, dye, film, paint, coating or other material, and may be visible through the covering element 1456. The mask layer 1458 may be opaque. The mask layer 1458 may also be a single layer, or may include multiple sublayers. The covering element 1456 may be fixed to the housing member 1409 via an adhesive 1460. The adhesive 1460 may also adhere the covering element 1456 to the insert 1462. The outer surface of the covering element 1456 may be substantially flush with the adjacent surface of the housing member 1409 (e.g., the surface defining the height 1452, 1454).

[0346] The side transmitting antenna 1434 may also include a dielectric cap 1464. The dielectric cap 1464 may be positioned on the antenna array 1466 and optionally conductively coupled to the antenna array. In some cases, the dielectric cap 1464 may be considered to be part of the antenna array 1466. The shape and material (e.g., the dielectric properties of the material) of the dielectric cap 1464 may contribute to the bandwidth of the side transmitting antenna 1434. For example, the bandwidth of the side transmitting antenna 1434 with the dielectric cap 1464 may be greater than the bandwidth of the side transmitting antenna without the dielectric cap 1464.

[0347] Fig. 14C A portion of a side transmitting antenna 1434 is shown separated from the device 1400, and Fig.14D Shows Fig. 14C A partial cross-sectional view of the portion of the side transmitting antenna 1434 is shown. Fig. 14C and Fig.14DAs shown, the dielectric cap 1464 may include a loading block feature 1470. The loading block feature 1470 may be conductively coupled to an antenna element 1478 in the side-transmitting antenna 1434, such as Fig.14D For example, through-holes or other conductive conduits 1472 in a circuit board 1471 or other substrate may conductively couple the loading block features 1470 to the antenna elements 1478. The loading block features 1470 may at least partially define the radiation pattern of the corresponding antenna elements 1478 to which they are coupled.

[0348] The dielectric cap 1464 and the integral loading block feature 1470 may be formed of epoxy or other suitable moldable material. For example, the dielectric cap 1464 may be formed by molding epoxy against the antenna array 1466. The epoxy used to form the dielectric cap 1464 may have a dielectric constant between about 4 and about 6.

[0349] The side-transmitting antenna 1434 may also include a cap member 1474 that at least partially encapsulates an antenna element 1478 , and a potting material 1476 in the antenna array 1466 and that at least partially encapsulates the antenna element 1478 .

[0350] As described above, portions of a device's metal or conductive housing can be used as antenna elements to send and receive wireless signals. More specifically, portions of a device's metal or conductive housing can be used as radiating elements of an antenna. For example, Fig.14A An exemplary device 1400 is shown that uses a metal housing member to define antenna elements for use in the sub-6 GHz spectrum. Fig.14A In addition to the sub-6 GHz antenna described above, the metal housing structure can also be used to define antenna elements for other frequencies and / or protocols. Fig.15 is a schematic diagram of a portion of a housing 1500 formed from a plurality of conductive housing components joined together using joining elements. Fig.15 Also schematically shown are exemplary connection points on the housing member at which feed lines and / or ground lines may be conductively coupled to the housing member to carry electromagnetic signals from the housing member to other antenna circuits (and from the antenna circuits to the housing member).

[0351] like Fig.15As shown, housing 1500 may include a first housing member 1502 that defines a portion of a first side surface 1542 and a first corner surface 1550 and a portion of a second side surface 1544. First housing member 1502 is structurally coupled to second housing member 1504 via a first engagement element 1514. As described above, engagement elements such as engagement element 1514 may be formed of a polymer material (e.g., a fiber reinforced polymer) that may structurally engage the housing members while also providing sufficient electrical isolation between the housing members to allow the housing members to function as antenna elements.

[0352] The housing 1500 also includes a second housing member 1504 that defines a portion of a second side surface 1544 and is structurally coupled to a third housing member 1506 via a second engagement element 1516. The third housing member 1506 defines a portion of a second side surface 1544 and a second corner surface 1552.

[0353] Third housing member 1506 further defines a portion of a third side surface 1546 of the housing and is structurally connected to fourth housing member 1508 via third joining element 1518. Fourth housing member 1508 further defines a portion of third side surface 1546, a third corner surface 1554, and a portion of fourth side surface 1548.

[0354] The fourth housing member 1508 is coupled to the fifth housing member 1510 via the fourth joining element 1520. The fifth housing member 1510 defines a portion of the fourth side surface 1548 and is coupled to the sixth housing member 1512 via the fifth joining element 1522. The sixth housing member 1512 defines a portion of the fourth side surface 1548, a fourth corner surface 1556, and a portion of the first side surface 1542. The sixth housing member 1512 is structurally connected to the first housing member 1502 via the sixth joining element 1525.

[0355] Each of the engagement elements of the housing 1500 may define a portion of the exterior surface of the housing 1500. Thus, the exterior surface of the housing 1500 may be completely or substantially completely defined by the housing components and the engagement elements.

[0356] To operate as an antenna element, the housing member of housing 1500 can be conductively coupled to an antenna circuit, an electrical ground plane, etc. The specific location of the connection points on the housing member and the size and shape of the housing member can at least partially define the parameters of the antenna element. Exemplary antenna parameters can include resonant frequency, range, radiation pattern, efficiency, bandwidth, directivity, gain, etc.

[0357] Fig.15Exemplary locations of connection points of the feed and ground wires to the housing components are shown. For example, the feed and ground wires may be conductively coupled to the first housing component 1502 at connection points 1524-1, 1524-2, thereby facilitating wireless communication via the first housing component 1502.

[0358] The feed line and the ground line may be conductively coupled to the second housing member 1504 at connection points 1528-1, 1528-2 and optionally at connection points 1526-1, 1526-2. The portion of the second housing member 1504 between or near the connection points 1526-1, 1526-2 may function as one antenna element, while the portion of the second housing member 1504 between or near the connection points 1528-1, 1528-2 may function as another independent antenna element (e.g., although defined by the same housing member 1502, the other antenna element may send and receive electromagnetic signals independently of the antenna element located between the connection points 1526-1, 1526-2). Although Fig.15 Connection points 1526-1, 1526-2 are shown, but in some implementations such as Fig.14A In device 1400, these connection points may be omitted, which uses conductive elements on the circuit board in that corner of the device as antenna elements rather than using housing components.

[0359] The feed and ground wires can be conductively coupled to the third housing member 1506 at connection points 1530-1, 1530-2, and conductively coupled to the fourth housing member 1508 at connection points 1532-1, 1532-2 and connection points 1534-1, 1534-2. The fourth housing member 1508 can define different antenna element configurations depending on which feed and ground wires are used at a given time. For example, in a first mode, the connection points 1532-1, 1532-2 are used so that the fourth housing member 1508 is configured to communicate via a first communication protocol (or frequency), and in a second mode, the connection points 1534-1, 1534-2 are used so that the fourth housing member 1508 is configured to communicate via a second communication protocol (of a frequency) different from the first communication protocol.

[0360] The feed line and the ground line can be conductively coupled to the fifth housing member 1510 at the connection points 1536-1, 1536-2 and at the connection points 1538-1, 1538-2. Similar to the configuration of the second housing member 1504, the portion of the fifth housing member 1510 between or near the connection points 1536-1, 1536-2 can act as one antenna element, and the portion of the fifth housing member 1510 between or near the connection points 1538-1, 1538-2 can act as another independent antenna element (for example, although defined by the same housing member 1510, the other antenna element can send and receive electromagnetic signals independently of the antenna element located between the connection points 1536-1, 1536-2). The feed line and the ground line can also be conductively coupled to the sixth housing member 1512 at the connection points 1540-1, 1540-2.

[0361] As described above, the housing components of the device housing described herein can be used to form multiple groups of antennas, where each group of antennas communicates via a different communication protocol or frequency band. For example, the housing may define multiple antennas in a first MIMO antenna array or group (e.g., for a 4G communication protocol) and multiple antennas in a second MIMO antenna array (e.g., for a 5G communication protocol). In one non-limiting exemplary configuration, the antenna elements defined by connection points 1524, 1530, 1532, 1534, and 1540 may be configured to operate as part of a first MIMO antenna array (e.g., for a 4G communication protocol), while the antenna elements defined by connection points 1526 (if provided), 1528, 1536, and 1538 may be configured to operate as part of a second MIMO antenna array (e.g., for a 5G communication protocol). For any given antenna group, it is not necessary that the antenna elements in the group are all housing components. For example, a second MIMO antenna array or group may use internal antennas (e.g., antennas 1408, Fig.14A ) as one of the antennas in a 4×4 MIMO array.

[0362] As described above, the conductive housing components that can act as the radiating structure of the antenna or antenna system can be coupled together in structure via a bonding element. The bonding element can be formed of a polymer material or other dielectric material, and the bonding element can provide sufficient electrical isolation between the housing components to facilitate the use of the housing components as the radiating structure of the antenna. In some cases, the bonding element includes one, two or more molded elements that are molded into the gaps between the housing components and bonded to the housing components. Since the bonding element structurally holds the housing components together, it is preferred to perform a strong bond between the bonding element and the housing components. Therefore, the housing component may include or define a structure and / or feature portion to which the bonding element is bonded so as to hold the bonding element to the housing component, thereby holding the housing components together.

[0363] Fig.16A An exemplary housing component 1600 is shown that includes a feature with which an engagement element may engage. Fig.16A The portion of the housing member shown may correspond generally to Fig.14A Area 16A-16A in.

[0364] Housing member 1600 may be formed from or include a conductive material, such as stainless steel, aluminum, a metal alloy, etc., and may be conductively coupled to an antenna circuit (e.g., via a feed line and / or ground line, as described above) to serve as a radiating structure for the device. Fig.16A The portion of the housing member 1600 shown may abut and / or engage the engagement element, such as Fig. 16B shown.

[0365] The housing member 1600 defines a first interlocking feature 1602 that extends inwardly (e.g., toward the interior of the device) from a sidewall 1601 defined by the housing member 1600. The first interlocking feature 1602 can extend from an inner side 1605 of the housing member 1600, where the inner side 1605 is opposite the outer side 1603.

[0366] The sidewall 1601 can define an exterior surface of a device of which the housing member 1600 is a part. The first interlocking feature 1602 can define a first hole 1604 and one or more second holes 1606. When the engagement element is formed by injecting or otherwise molding a moldable material against the housing member 1600, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1602 and can flow into and optionally through the first hole 1604 and the second hole 1606. By at least partially encapsulating the interlocking feature 1602 and flowing into and / or through the first hole 1604 and the second hole 1606, the engagement element can be structurally interlocked with the housing member 1600, thereby securely retaining the engagement element to the housing member 1600.

[0367] The housing member 1600 may also define a second interlocking feature, such as a recess 1610, which may be a recess, a cavity, or other similar feature that is recessed relative to the end surface 1608 of the housing member 1600. The end surface 1608 of the housing member 1600 may be a portion of the housing member 1600 that extends closest to another housing member to which the housing member 1600 is coupled via an engagement element. The end surface 1608 may be offset from the end surface 1609 defined by the first interlocking feature 1602. More specifically, the end surface 1609 may be recessed relative to the end surface 1608 (e.g., in a direction perpendicular to the end surfaces 1608, 1609).

[0368] The recess 1610 may have a depth between about 100 microns and about 1000 microns, and may have a width between about 100 microns and about 400 microns (e.g., Fig.16A ) and a length between about 750 microns and about 3000 microns (e.g., as shown in FIG. Fig.16A Dimensions from top to bottom shown). In some cases, the housing member 1600 may also define holes along the end surface 1608 and / or the end surface 1609. The holes may be formed on the end surfaces 1608 and / or 1609, and may also be formed on the surface of the recess 1610. The holes may be a different structure from the recess 1610. For example, the recess 1610 may have a length dimension greater than about 1000 microns and a width dimension greater than about 100 microns, while the hole may have a length and / or width dimension less than about 10 microns. Similarly, the recess 1610 may have a depth greater than about 100 microns, while the hole may have a depth less than about 10 microns. In some cases, the holes are formed by chemical etching, sandblasting, laser or plasma etching, etc. The material of the joining element may extend or flow into the hole during the formation of the joining element, and engage and / or interlock with the hole to fix the joining element to the housing member 1600. In some cases, the holes are formed after the recess 1610 is formed, so that the holes exist on the surface of the recess 1610. In other cases, the holes are formed before the recess 1610 is formed, so that the surface of the recess 1610 does not contain holes, or has a different surface morphology and / or topography than the end surface on which the holes are formed (for example, the end surface 1608 may have holes by chemical etching, while the recess 1610 may have machine marks of a machining process). In some cases, the maximum dimension of the hole (for example, length, width, depth) is at least one order of magnitude smaller than the maximum dimension of the recess 1610 (for example, length, width, depth).

[0369] The housing member 1600 may define a flange portion 1607 that is adjacent to and / or extends along a peripheral side of a top module (which may include a cover member, a display, a touch sensing component, etc.). In some cases, a second interlocking feature 1610 (e.g., a recess, as shown) is positioned in the flange portion 1607 to strengthen the portion of the joint along the side of the top module. More specifically, the flange portion 1607 may define a cantilever that extends away from the first interlocking feature 1602, and the second interlocking feature 1610 may provide a supplemental interlocking engagement with a joining element to help prevent or limit the flange portion 1607 from interlocking with the joining element (e.g., Fig. 16B The flange may be moved in a certain direction (e.g., Fig.16AIn the embodiment of the present invention, the second interlocking feature 1610 can be an elongated recess or channel having a longitudinal axis extending parallel to the outer side surface of the shell member (for example, in the same direction as the flange extends from the first interlocking feature 1602).

[0370] When the moldable material flows into place (e.g., between the shell member 1600 and another shell member) to form a joint element, the moldable material can flow into the recess 1610 and at least partially fill the recess, thereby forming a corresponding protrusion in the moldable material. When the moldable material is subsequently cured or otherwise hardened, the protrusion and recess 1610 of the joint element interlock with each other. The interlock between the recess 1610 and the protrusion can help prevent the separation of the joint element and the shell member 1600. In addition, the position of the recess 1610 relative to the external surface defined by the sidewall 1601 can help improve the structural rigidity of the joint, and help maintain the alignment (and mechanical coupling) between the shell member 1600, the joint element and the adjacent shell member in the case of a drop or other impact event. For example, although the first interlocking feature 1602 can provide basic structural strength to the interface between the joint element and the shell member 1600, its position is more inward (e.g., relatively closer to the internal volume of the shell) than the recess 1610. In contrast, a more outwardly positioned recess 1610 (eg, relatively closer to the exterior surface of the housing member 1600) may improve the strength and stability of the alignment between the exterior surface of the housing member and the engagement element.

[0371] Fig. 16B is along Fig.16A A partial cross-sectional view of housing member 1600 (joined to another housing member 1616 via joining element 1612) as viewed along line 16B-16B in FIG. Fig.16A The engagement elements and housing member 1616 are not shown, but if such components are present, then Fig. 16B 16B-16B.) Engagement element 1612 may be positioned between and in contact with end surface 1608 of housing member 1600 and corresponding end surface 1617 of housing member 1616. Engagement element 1612 may also extend into and interlock with recess 1610 of housing member 1600 and recess 1614 defined by housing member 1616. In addition to the mechanical interlock between engagement element 1612 and recesses 1610, 1614 (and / or other retaining structures and / or interlocking features), the moldable material of engagement element 1612 may form a chemical bond or other adhesive bond with the material of housing members 1600, 1616.

[0372] The outer surfaces of the engaging element 1612 and the shell members 1600, 1616 may define a smooth, continuous outer surface 1613 of the shell. For example, any gaps, seams, or other interruptions along the outer surface 1613 of the shell between the engaging element 1612 and the shell members 1600, 1616 may not be detectable via touch and / or the naked eye. For example, a fingernail sliding along the outer surface 1613 may not hook the seam between the engaging element 1612 and the shell members 1600, 1616. In some cases, any gaps, seams, or other interruptions between the engaging element 1612 and the shell members 1600, 1616 may be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in depth, length, offset, and / or other dimensions). The interlock between the engagement element 1612 and the recesses 1610, 1614 can help prevent or inhibit relative movement between the housing components 1600, 1616 and the engagement element 1612, such as these components in a vertical direction (eg, Fig. 16B Thus, the recesses 1610, 1614 can help maintain a substantially seamless texture and appearance between the engagement element 1612 and the housing members 1600, 1616.

[0373] Fig. 16C Another exemplary housing member 1620 is shown including a feature with which an engagement element may engage. Housing member 1620 may be formed from or include a conductive material, such as stainless steel, aluminum, a metal alloy, etc., and may be conductively coupled to an antenna circuit (e.g., via a feed line and / or a ground line, as described above) to act as a radiating structure of the device. Fig. 16C The portion of the housing member 1620 shown may abut and / or engage the engagement element, such as Fig.16D shown.

[0374] The housing member 1620 defines a first interlocking feature 1622 that extends inwardly (e.g., toward the interior of the device) from a sidewall 1621 defined by the housing member 1620. The first interlocking feature 1622 can extend from the inner side of the housing member 1620 (e.g., similar to the inner side 1605, Fig.16A ), where the inner side is opposite to the outer side (e.g., similar to the outer side 1603, Fig.16A ).

[0375] The sidewall 1621 can define an exterior surface of a device of which the housing member 1620 is a part. The first interlocking feature 1622 can define a first hole 1624 and one or more second holes 1626. When the engagement element is formed by injecting or otherwise molding a moldable material against the housing member 1620, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1622 and can flow into and optionally through the first hole 1624 and the second hole 1626. By at least partially encapsulating the interlocking feature 1622 and flowing into and / or through the first hole 1624 and the second hole 1626, the engagement element can be structurally interlocked with the housing member 1620, thereby securely retaining the engagement element to the housing member 1620.

[0376] The housing member 1620 may further define a protruding feature 1630, which may be a post, a pin, or have any other suitable shape or configuration that protrudes or extends from an end surface 1628 of the housing member 1620. The end surface 1628 of the housing member 1620 may be the portion of the housing member 1620 that, other than the protruding feature 1630, extends closest to another housing member to which the housing member 1620 is coupled via a joining element.

[0377] The protruding feature 1630 can be FIG. 16A to FIG. 16B 1620 and the recessed portion in the moldable material formed around the protruding feature 1630. For example, when the moldable material flows into place (e.g., between the shell member 1620 and another shell member) to form the joining element, the moldable material can flow around the protruding feature 1630 to at least partially encapsulate the protruding feature 1630. When the moldable material is subsequently cured or otherwise hardened, the protruding feature 1630 and the recessed portion in the moldable material formed around the protruding feature 1630 interlock with each other. The interlock between the protruding feature 1630 and the moldable material can help prevent separation of the joining element and the shell member 1620. In addition, the position of the protruding feature 1630 relative to the outer surface defined by the sidewall 1621 can help improve the structural rigidity of the joint and help maintain the alignment (and mechanical coupling) between the shell member 1620, the joining element, and the adjacent shell members in the event of a drop or other impact event. For example, while first interlocking feature 1622 can provide substantial structural strength to the interface between the engagement element and housing member 1620, it is positioned more inwardly (e.g., relatively closer to the interior volume of the housing) than protruding feature 1630. In contrast, protruding feature 1630 positioned more outwardly (e.g., relatively closer to the exterior surface of housing member 1620) can improve the strength and stability of the alignment between the exterior surface of the housing member and the engagement element.

[0378] In some cases, the housing member 1620 may also define holes along the end surface 1628 and / or the end surface 1629. The holes may be formed on the end surface 1628 and / or 1629, and may also be formed on the surface of the protruding feature 1630. The holes may be a different structure from the protruding feature 1630. For example, the protruding feature 1630 protrudes a distance greater than about 100 microns and may have a length and width dimension greater than about 100 microns, while the hole may have a depth, length and / or width dimension less than about 10 microns. In some cases, the hole is formed by chemical etching, sandblasting, laser or plasma etching, etc. The material of the joining element may extend or flow into the hole during the formation of the joining element, and engage and / or interlock with the hole to fix the joining element to the housing member 1620. In some cases, the hole is formed after the protruding feature 1630 is formed, so that the hole exists on the surface of the protruding feature 1630. In other cases, the surface of protruding feature 1630 is free of pores or has a different surface morphology and / or topography than the end surface on which the pores are formed. In some cases, the maximum dimension (e.g., length, width, depth) of the pores is at least an order of magnitude smaller than the maximum dimension (e.g., length, width, depth) of protruding feature 1630.

[0379] Fig.16D is along Fig. 16C A partial cross-sectional view of housing member 1620 (joined to another housing member 1625 via joining element 1632) as viewed along line 16D-16D in FIG. Fig. 16C The engagement element 1632 and housing member 1625 are not shown, but if such components are present, Fig.16D 16D-16D.) Engagement element 1632 may be positioned between and in contact with housing members 1620, 1625. Engagement element 1632 may also at least partially (and optionally completely) encapsulate protruding feature 1630. As shown in Fig.16D As can be seen in , the protruding feature 1630 can extend and / or be adjacent to two offset surfaces. For example, relative to the housing member 1620, the two offset surfaces include the end surface 1628 and the additional end surface 1629. The protruding feature 1630 can extend a first distance from the end surface 1628 and a second (greater) distance from the additional end surface 1629. A similar structure can be used on the housing member 1625 (e.g., a protruding feature 1636 extending a first distance from the end surface 1638 and a second (greater) distance from the additional end surface 1634). Thus, as Fig.16DAs shown, end surfaces 1628, 1638 can be closer together than additional end surfaces 1629, 1634 (and the ends of protruding features 1630, 1636 can be the portions of shell members 1620, 1625 that are closest together). In addition to the mechanical interlock between engagement element 1632 and protruding features 1630, 1636 (and any other retaining structures and / or interlocking features), the moldable material of engagement element 1632 can form a chemical bond or other adhesive bond with the material of shell members 1620, 1625.

[0380] The outer surfaces of the engaging element 1632 and the shell members 1620, 1625 may define a smooth, continuous outer surface 1623 of the shell. For example, any gaps, seams, or other interruptions along the outer surface 1623 of the shell between the engaging element 1632 and the shell members 1620, 1625 may not be detectable via touch and / or the naked eye. For example, a fingernail sliding along the outer surface 1623 may not hook the seam between the engaging element 1632 and the shell members 1620, 1625. In some cases, any gaps, seams, or other interruptions between the engaging element 1632 and the shell members 1620, 1625 may be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in depth, length, offset, and / or other dimensions). The interlock between the engagement element 1632 and the housing components 1620, 1625 can help prevent or inhibit relative movement between the housing components 1620, 1625 and the engagement element 1632, such as the movement of these components in the vertical direction (eg, Fig.16D Thus, the protruding features 1630, 1636 can help maintain a substantially seamless texture and appearance between the joining element 1632 and the housing members 1620, 1625.

[0381] In some cases, different types of structures can be used to enhance or otherwise increase the strength and / or structural integrity of the coupling between the housing member and the engagement element. Fig.16E An exemplary cross-sectional view of a housing is shown, which includes a coupling element 1643 and a protruding feature 1644 (eg, FIG. 16C to FIG. 16D ) and defining a recessed portion 1649 (as shown FIG. 16A to FIG. 16B1640 and 1641). The use of protruding features 1644 and recessed portions 1649 can help increase the average or overall distance between the closest portions of first shell member 1640 and second shell member 1641. Specifically, because one or both of shell members 1640, 1641 can be used as radiating components of the antenna system, it may be desirable to increase the distance between the shell members to reduce capacitive coupling or other electromagnetic effects caused by the proximity of two conductive components. By positioning the recessed portion opposite the protrusion, the structural benefits of the protrusion (and the recessed portion) can be achieved while also providing a greater distance between the closest surfaces of shell members 1640, 1641 (e.g., compared to a configuration with two protruding features).

[0382] Fig.17A An exemplary arrangement of cameras in a rear-facing sensor array of device 1700 is shown. Fig.17A The device 1700 may correspond to a corner of a device (e.g., device 100, 200) with a cover and display (and optionally other components) removed to show the arrangement of cameras. The device 1700 may include a first camera module 1702 (which may be Figure 1B The first camera 138 and / or Figure 2 261 in the embodiment or otherwise corresponds to the first camera) and the second camera module 1704 (which may be Figure 1B The second camera 139 and / or Figure 2 1704. The first camera module 1702 and the second camera module 1704 may include a camera housing. Fig.17A Any camera shown in FIG. 10A (or elsewhere herein) may include an image stabilization system that helps maintain a clear image (e.g., reducing the effects of camera shake on the image) by sensing movement of the device and moving one or more components of the camera in a manner that at least partially compensates for (and / or counteracts) the movement of the device.

[0383] The device 1700 may also include a support member 1706 (also referred to herein as a camera bracket), to which the first camera module 1702 and the second camera module 1704 may be coupled. The support member (or camera support) 1706 may define a first corresponding camera portion 1780 and a second corresponding camera portion 1781 or a receiver, to which the first corresponding camera module and the second corresponding camera module may be coupled. The first camera portion 1780 and the second camera portion 1781 may be positioned along a diagonal path defined from the first corner region to the second corner region of the rear sensor array. Each camera portion may define an opening for an optical component (e.g., a lens) of its corresponding camera module. The camera portion (e.g., a receiver) may be defined by a flange or sidewall at least partially surrounding the camera module. The support member 1706 may be configured to fix the relative position of the camera module and the depth sensor module.

[0384] In modern consumer electronic devices such as mobile phones, internal space is at a premium, and space-saving component arrangements can have significant positive impacts on various aspects of the device. For example, space-saving or compact component arrangements can free up internal space that can be used to increase the size and capacity of the battery, or can be used to make the device smaller, thinner, and / or lighter. Fig.17A One exemplary configuration of camera modules that reduces the overall footprint of camera modules in a system is shown. Specifically, first camera module 1702 (e.g., a camera housing of the first camera module) defines recesses 1708 at the corners of the module. For example, instead of a convex corner, one of the corners of first camera module 1702 is concave in shape (e.g., recess 1708). This configuration allows a corner of second camera module 1704 (e.g., a corner of the housing of the second camera module) to extend into recess 1708, thereby allowing first camera module 1702 and second camera module 1704 to be positioned closer together than would be possible if first camera module 1702 had conventional convex corners.

[0385] In some cases, first camera module 1702 can have a generally quadrilateral shape with three convex corners and one concave corner. In some cases, first camera module 1702 has a parallelogram shape with three convex corners and one concave corner.

[0386] Fig.17AA first camera module 1702 is shown defining a concave corner, and a portion of a second camera module 1704 positioned in the concave corner of the first camera module 1702 (e.g., a convex corner of the second camera module 1704). In other implementations, the second camera module 1704 may define a concave corner, and the convex corner of the first camera module 1702 may be positioned in the concave corner of the first camera module. In some cases, portions of other components or structures of the electronic device are positioned in the concave corner of the camera module, such as fasteners, mounting posts, batteries, housing members, circuit boards, etc. The device 1700 may also include a frame member 1710 to which the bracket member 1706 may be attached. The frame member 1710 may define a wall structure 1731 ( Fig.17D ), which in turn defines a container region 1723 ( Fig.17D As described herein, one or more cameras (which may be mounted to support member 1706 ) may be positioned in container region 1723 .

[0387] Fig. 17B The first camera module 1702 and the second camera module 1704 and the support member 1706 are shown removed from the device 1700. The support member 1706 can be a structural component that defines the position of the first camera module 1702 and the second camera module 1704 relative to each other. The support member 1706 can be used as a rigid structure to prevent or inhibit the first camera module 1702 and the second camera module 1704 from moving, twisting, or shifting relative to each other during use or misuse of the device 1700. Therefore, the support member 1706 can have a structural configuration that contributes to the rigidity, stiffness and / or strength of the support member 1706. For example, the support member 1706 can define a web portion 1716 (or web 1716) and an outer wall 1714 (also referred to as a rigid wall) along one side of the first camera portion 1780 and along one side of the second camera portion 1781. As shown in FIG. Fig. 17C As shown, the web 1716 is similar to a plate having a thickness, and the rigid wall 1714 extends from the web 1716 along at least one side of the web 1716. Thus, the rigid wall 1714 defines a T-shaped flange extending from opposite sides of the web 1716. This configuration increases the area moment of inertia of the bracket member 1706, thereby increasing its resistance to torsion, bending, flexing or other deflection or deformation. The web 1716 can also define a hole 1713 through which a mounting post and / or fastener can extend to secure components (including the optional bracket member 1706 itself) to the frame member 1710 and / or the device more generally.

[0388] Web 1716 and rigid wall 1714 can define a recessed area of ​​bracket member 1706. In some cases, one or more device components can be positioned in the recessed area defined by these features. For example, flexible circuit element 1711 (eg, conductively coupling first camera module 1702 to another component (e.g., logic board, processor, etc.) Fig.17A ) can be positioned in the recessed area. In such cases, the recessed area, and more specifically the rigid wall 1714, can protect the flexible circuit element 1711.

[0389] Fig. 17C The support member 1706 and the opposing sides of the first camera module 1702 and the second camera module 1704 are shown. As shown, the first lens 1718 of the first camera module 1702 and the second lens 1720 of the second camera module 1704 can extend through the support member 1706 and beyond the bottom surface 1721 of the support member 1706. The lenses 1718, 1720 can extend into corresponding openings in the frame member 1710 and can be proximate to the camera cover (e.g., camera cover 263, 264, Figure 2 The first lens 1718 may have a first field of view, and the second lens 1720 may have a second field of view different from the first field of view.

[0390] Fig.17D Frame member 1710 is shown secured to the housing of device 1700 with bracket member 1706 and first and second camera modules 1702, 1704 removed. Frame member 1710 can define openings 1724 and 1728 into which lenses of first and second camera modules 1702, 1704 can extend. Openings 1724, 1728 can be attached to camera covers such as Figure 2 1706. The frame member 1710 can define mounting posts 1729. The mounting posts 1729 can extend through openings in the bracket member 1706 and can receive fasteners that secure one or more components to the frame member 1710 (e.g., a cover or a cover that extends over the camera module, the bracket member 1706, etc.).

[0391] The frame member 1710 also defines a wall structure 1731 that extends around all or at least a portion of the outer perimeter of the frame member 1710 (and at least partially around the perimeter of the support member 1706 when the support member 1706 is positioned in the container area 1723). Bias springs 1730, 1732 can be coupled to the wall structure 1731 to provide a biasing force on the support member 1706 and help maintain the support member 1706 (and thus the first camera module 1702 and the second camera module 1704) in a target position. For example, the first bias spring 1730 can apply a biasing force on the support member 1706 that tends to push the support member 1706 in the positive y-direction (e.g., toward the top of the device), while the second bias spring 1732 can apply a biasing force that tends to push the support member 1706 in the positive x-direction (e.g., toward the lateral side of the device). These biasing forces can ultimately force the support member 1706 against the wall structure 1731 and help maintain the support member 1706 in that position during use (or misuse) of the device. In addition, the biasing springs 1730, 1732 can provide compliance to the support member 1706, so that an impact or other force acting on the device can cause the support member 1706 to be forced against the biasing springs 1730, 1732. Because the biasing springs 1730, 1732 are flexible and / or compliant, they can absorb some of the energy and allow the support member 1706 to move slightly, rather than the support member 1706 itself absorbing all of the impact and / or energy that could damage the camera module, cause the camera module and / or support member 1706 to be misaligned, etc.

[0392] Fig.17E and Fig.17F A detailed view of the frame member 1710 and the bias spring 1730 is shown, corresponding to Fig.17D 17E-17E in the region 17E-17E in the embodiment of the present invention. The bias spring 1730 may include a beam member defining an attachment region 1735, wherein the beam is attached to the wall structure 1731 (e.g., via welding, adhesive, fasteners, rivets, heat rivets, brazing, soldering, etc.). The beam may also define a compliant portion 1734 extending from the attachment region 1735, which may be curved, and a contact region 1736 extending from the compliant portion 1734. The contact region 1736 may contact the support member 1706 and may apply the biasing force generated by the bias spring 1730 to the support member 1706.

[0393] When the support member 1706 is positioned in the frame member 1710, the compliant portion 1734 can deflect and / or deform (e.g., toward the wall structure 1731). The compliant portion 1734 can have a generally convex curvature toward the wall structure 1731. The convex curvature of the compliant portion 1734 can provide a dynamic fulcrum location along the compliant portion 1734. For example, as Fig.17EAs shown, when the bracket member 1706 has not been installed, the fulcrum location 1737 of the compliant portion 1734 (e.g., the location where the compliant portion 1734 contacts the wall structure 1731 and / or bends against the wall structure) is near the attachment area 1735. Fig.17F As shown, when the support member is installed, the fulcrum position 1739 is further toward the distal end of the bias spring 1730 (e.g., toward the contact area 1736). If the support member 1706 is forced toward the wall structure 1731 (e.g., due to the device falling onto a hard surface), the compliant portion 1734 can be further deflected toward the wall structure 1731, thereby causing the fulcrum position to move even further outward toward the distal end of the bias spring 1730. The dynamic fulcrum position can also correspond to different or changing spring rates of the bias spring 1730. For example, when the fulcrum position moves outward, the spring rate of the bias spring can increase or otherwise change according to the deflection, thereby resulting in greater resistance to further deformation or deflection. In some cases, despite the movement of the fulcrum position, the spring rate can also remain substantially constant. In some cases, when the fulcrum position moves outward, the spring rate can change in a nonlinear manner. A particular spring rate and / or spring rate variation (eg, resulting from a dynamic fulcrum location) may be selected to produce a desired force or movement curve for support component 1706 .

[0394] Although FIG. 17D to FIG. 17F The bias springs are shown as each having two compliant portions, but other examples may have only a single compliant portion (e.g., the bias spring may have one "wing" instead of two "wings" as shown). FIG. 17E to FIG. 17F Bias spring 1730 is described, but the discussion is equally applicable to bias spring 1732. Bias springs 1730, 1732 can be formed of any suitable material, such as metal (e.g., aluminum, steel, titanium), polymer, fiber reinforced polymer (e.g., carbon fiber), and / or composite materials. Bias springs 1730, 1732 can be a single monolithic member (e.g., a single piece of metal), or they can be formed of multiple parts.

[0395] Figure 17G An exemplary arrangement of several components within device 1700 is shown, including several shields positioned over components of device 1700. For example, camera shield 1748 may be positioned over first camera module 1702 and second camera module 1704 of device 1700. In examples where the device includes more or fewer cameras, the same or similar camera shield 1748 may be used. Figure 17G Also shown is a logic board shield 1749 positioned over at least a portion of the main logic board 1750 . Figure 17GAlso shown is a speaker module 1760 , which may be an implementation of speaker module 250 , 350 , or any other speaker module described herein. Speaker module 1760 may include a shroud that at least partially covers speaker module 1760 .

[0396] The shield may be formed of metal, plastic, carbon fiber, or any other material. The shield may be configured to protect the underlying components from physical damage due to contact with other components (e.g., the top module), as well as to provide electromagnetic shielding between components. The shield may be attached to the device in various ways. In some cases, for example, the shield may be attached to the device via fasteners such as screws or bolts.

[0397] Fig.17H Shown along Figure 17G 17H-17H in the partial cross-sectional view of the device 1700, showing an exemplary configuration of the camera shield 1748. As described above, the shield can act as a physical barrier between the components of the device. For example, the camera shield 1748 acts as a barrier between the camera module and the top module, and can help prevent the camera and the top module from contacting each other and potentially being damaged during a drop, impact or other forceful event. Some shields can be designed to have physical compliance or flexibility to help dissipate or reduce energy from an impact. Fig.17H An exemplary configuration for securing the camera shroud 1748 to the device while also providing physical compliance to the camera shroud 1748 is shown. The camera shroud 1748 may have a wrap section such that the camera shroud 1748 has two levels. More specifically, the camera shroud 1748 may define a top portion 1775, a loop portion 1763, and a lower portion 1774. The top portion 1775 may define a clearance hole 1762 to provide a passage for a fastener 1766 (e.g., a screw, bolt, etc.) to pass through to reach a fastening hole 1765 defined through the lower portion 1774. The fastener 1766 may capture a portion of the lower portion 1774 between a flange of the fastener 1766 and a top surface of a mounting post 1767 to secure the camera shroud 1748 to the device. The mounting post 1767 may be attached to a base 1764, which may be a frame, base, plate, or other structure of the device.

[0398] The multi-stage configuration of the camera shroud 1748 (and more specifically, the loop portion 1763) can provide physical compliance to the camera shroud 1748. For example, the loop portion 1763 can act as a spring or other compliant structure that bends when a force is applied to the top portion 1775 (e.g., by a component of the top module), thereby allowing the top portion 1775 to move relative to the lower portion 1774. The bending or flexing of the loop portion 1763 can absorb and / or dissipate energy associated with an impact, or otherwise reduce the magnitude of an impact load or other force caused by contact with the camera shroud 1748.

[0399] Parameters of the loop portion 1763, such as spring constant, stiffness, etc., may be defined by the material and / or dimensions of the loop portion 1763. For example, the thickness of the loop portion may be selective to provide a specific spring constant to the camera shroud 1748. The thickness of the loop portion 1763 may be constant, or it may vary along the length of the loop portion 1763. The thickness of the loop portion 1763 may be the same as or different from the thickness of the top portion 1775 and the lower portion 1774.

[0400] Fig.17I Shown along Figure 17G A partial cross-sectional view of the device 1700 viewed along line 17I-17I in FIG. 17A shows a portion of the device 1700 for attaching a logic board shield 1749 and a speaker module 1760 ( Figure 17G ) is mounted to an exemplary configuration of a device. Fig.17I As shown, the logic board shield 1749 (or the mounting tabs of the logic board itself, such as tab portion 2108, Fig. 21B ) and the mounting tab 1776 of the speaker module 1760 can be fixed to the device via a single fastening assembly. Specifically, the mounting tab 1776 can be captured between the mounting post 1772 and the main fastener 1769.

[0401] Compliant member 1773 may be attached to mounting tab 1776. Compliant member 1773 may be formed of a polymer such as silicone, rubber, etc., and may be compressed or otherwise captured between mounting post 1772 and primary fastener 1769, thereby applying a corresponding compressive force on mounting tab 1776 to secure and substantially secure speaker module 1760. Compliant member 1773 may help inhibit vibrations, oscillations, or other physical forces from being transmitted from speaker module 1760 to other components of device 1700 through mounting post 1772. More specifically, speaker module 1760 is configured to output sound, such as music, notification sounds (e.g., ringtones), voice output for phone calls, audio tracks for videos or movies, etc. Therefore, speaker module 1760 (and more specifically, the diaphragm of speaker module 1760) vibrates in order to produce sound. These vibrations may be harmful to other components of the device. For example, vibrations may cause other components such as fasteners, electrical connectors, etc. to loosen and potentially detach. Vibrations may also contribute to weakening of adhesive joints or cause undesirable friction between components in the device. Thus, compliant member 1773 may help reduce the effects (e.g., amount, amplitude, frequency, etc.) of vibrations from speaker module 1760 on mounting post 1772 and / or primary fastener 1769, and thus reduce the transmission of vibrations to other components of device 1700 (e.g., via tab portion 2108 of the logic board or other mounting tabs to the logic board). Specific properties of the compliant member, such as durometer value, vibration damping characteristics, etc., may be selected based on parameters of expected vibrations from speaker module 1760 (e.g., amplitude and / or frequency of expected vibrations).

[0402] like Fig.17I As shown, both the speaker module 1760 and the logic board shield 1749 can be secured to the device using a single fastening assembly. The primary fastener 1769 can define a threaded post portion 1771 that is threaded into a mounting post 1772, and a threaded hole portion 1770 into which a threaded fastener 1768 (e.g., a screw, bolt, etc.) is threaded. The logic board shield 1749 can be captured between the fastener 1768 and the primary fastener 1769. As described above, the compliance member 1773 can help inhibit the transmission of vibrations from the speaker module 1760 to the logic board shield 1749.

[0403] return Fig.17A, device 1700 may include a barrier wall 1740 (or wall 1740) positioned between a battery 1741 and a camera (including a first camera module 1702 and a second camera module 1704) of device 1700. Wall 1740 may be configured to prevent or inhibit any potential movement of battery 1741 from damaging the camera and / or flexible circuit elements that connect the camera to other circuits of the device. Wall 1740 may be formed of metal, polymer, carbon fiber, etc., and may be attached to a housing member or other component of device 1700 (e.g., via adhesive, welding, fasteners, etc.). In some cases, portions of flexible circuit elements 1711 and 1745 are routed between wall 1740 and the camera. These portions of flexible circuit elements 1711 and 1745 may be coupled to a joint connector 1746, which may be physically and conductively coupled to a corresponding connector on another component of device 1700 (such as a main logic board, etc.). The header connector may thereby conductively couple both first camera module 1702 and second camera module 1704 to other circuitry of device 1700 .

[0404] In order to fit portions of flexible circuit elements 1711 and 1745 between the camera and wall 1740, those portions of flexible circuit elements 1711 and 1745 can be oriented substantially vertically, while other portions of flexible circuit elements 1711 and 1745 can be oriented substantially horizontally. In such cases, the portions of flexible circuit elements 1711 and 1745 between wall 1740 and the camera can be substantially perpendicular to other portions of flexible circuit elements 1711 and 1745 (e.g., portions of flexible circuit element 1711 extending between first camera module 1702 and wall 1740, and portions of flexible circuit element 1745 extending from second camera module 1704 to vertical portions of flexible circuit element 1745 (e.g., portions between wall 1740 and second camera module 1704 itself)).

[0405] Wall 1740 may define one or more recessed portions or bent areas to accommodate portions of battery 1741. For example, battery 1741 may include a flexible pouch in which a battery cell is housed. The flexible pouch may be formed by fusing or attaching two layers of flexible material together around the perimeter of the battery cell. The attached layers may be folded upward against the sides of the battery so that the sides or edges of the battery are irregular or otherwise not completely straight. For example, as Fig.17AAs shown, the battery 1741 defines a protrusion 1742 at the corner of the battery 1741. The protrusion 1742 may correspond to or result from a portion of the soft pack being folded against one side of the battery. In other cases, the protrusion 1742 is an outward protrusion corresponding to an internal recess in the soft pack, which accommodates circuits, additional battery cells, etc. Regardless of the function of the protrusion 1742, the wall 1740 may define one or more recesses into which the protrusion 1742 extends. For example, the first section 1743 of the wall 1740 may be offset relative to the second section 1744 of the wall so that the first section 1743 defines a recess. The second section 1744 of the wall may be located at a position in the y direction of the device that will contact, interfere with, or otherwise be too close to the protrusion 1742. Therefore, the first section 1743 of the wall is positioned farther away from the battery 1741 (e.g., it defines a recess) so that the protrusion 1742 does not contact or otherwise interfere with the wall 1740. In some cases, the lowest distance between the wall 1740 and the battery 1741 is less than about 1 mm. The lowest distance can be defined between the protruding portion 1742 of the battery and the first section 1743 of the wall.

[0406] Fig.18A The device is shown passing through a rearward sensor array (e.g., sensor array 141, Figure 1D ). The depth sensor module may include an emitter assembly 1822 and a sensor assembly 1820. A cover lens 1824 may be disposed on or above the emitter assembly 1822. The emitter assembly 1822 and the sensor assembly 1820 may include a lens assembly, a light emitter, a light sensor, etc...

Claims

1. A portable electronic device, comprising: shell; a display located at least partially within the housing; a front cover coupled to the housing and positioned over the display; and a biometric sensor module configured to illuminate an object through the front cover and capture an image of the object through the front cover, the biometric sensor module comprising: a first lens positioned below the front cover; a first light source positioned below a central region of the first lens and configured to project a dot pattern on the object through the first lens; a second light source positioned below a peripheral region of the first lens and configured to flood-light the object through the first lens; a second lens positioned below the front cover; and A light sensor is positioned below the second lens and configured to capture an image of the object.

2. The portable electronic device according to claim 1, wherein: The object is a user's face; and The portable electronic device is configured to: determining a depth map of the user's face using the pattern of dots projected onto the user's face; and The user is authenticated based at least in part on a depth map of the user's face.

3. The portable electronic device according to claim 1, wherein: The first light source projects infrared light; The flood light is infrared light; and The light sensor is an infrared light sensor.

4. The portable electronic device according to claim 1, wherein: light from the first light source passing through a central region of the first lens appears to be focused on the object; and Light from the second light source that passes through a peripheral area of ​​the first lens appears out of focus on the object.

5. The portable electronic device according to claim 1, wherein: The biometric sensor module includes a housing structure; and The first lens, the first light source, the second lens, the second light source, and the light sensor are at least partially positioned within the housing structure.

6. The portable electronic device according to claim 1, wherein: The second light source comprises a radial array of light emitting elements.

7. A mobile phone, comprising: shell; a display located at least partially within the housing; a front cover coupled to the housing and positioned over the display; a light emitter located below the front cover and configured to emit light through the front cover, the light emitter comprising: a first lens positioned below the front cover; a first light source positioned below a central region of the first lens, the central region being configured to focus a pattern of light emitted by the first light source onto a subject; and a second light source positioned below a peripheral region of the first lens, the peripheral region being configured to obscure light emitted by the second light source; and A light receiver, the light receiver being located below the front cover and comprising: a second lens positioned below the front cover and configured to receive light through the front cover; and A light sensor is positioned below the second lens.

8. The mobile phone according to claim 7, wherein: The first light source is aligned with the optical axis of the first lens; and The second light source is offset from the optical axis of the first lens.

9. The mobile phone according to claim 7, wherein: The pattern of light is a grid of discrete infrared light spots.

10. The mobile phone according to claim 9, wherein: The light emitted by the second light source is configured to illuminate the object with infrared flood light.

11. The mobile phone according to claim 9, wherein: The light receiver is configured to capture an infrared image of the object when the pattern of light is focused on the object.

12. The mobile phone according to claim 7, wherein: The optical transmitter and the optical receiver are at least partially positioned within the housing structure of the biometric sensor module.

13. A portable electronic device comprising: shell; a display located at least partially within the housing; a front cover coupled to the housing and positioned over the display; and a biometric sensor module configured to illuminate a user's face through the front cover and capture an image of the user's face through the front cover, the biometric sensor module comprising: Shell structure; a first lens, the first lens being at least partially located within the housing structure; A light sensor, the light sensor is positioned below the first lens; a second lens, the second lens being at least partially located within the housing structure; a first light source positioned below a central region of the second lens and configured to project a first illumination pattern onto a face of the user; and A second light source is positioned below a peripheral area of ​​the second lens and is configured to project a second illumination pattern of light that, when reflected from the user's face and captured by the light sensor, produces an image of the user's face.

14. The portable electronic device according to claim 13, wherein: The first illumination pattern is a set of discrete light spots.

15. The portable electronic device according to claim 13, wherein: The first light source is an infrared laser light source.

16. The portable electronic device of claim 15, wherein: The infrared laser light source is a first infrared laser light source; and The second light source is a second infrared laser light source.

17. The portable electronic device of claim 16, wherein: The first infrared laser light source is a first vertical cavity surface emitting laser; and The second infrared laser light source is a second vertical cavity surface emitting laser.

18. The portable electronic device of claim 13, wherein: A peripheral area of ​​the second lens is configured to blur light emitted by the second light source.

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