Loudspeaker module and earphone

Abstract

The application discloses a loudspeaker module and earphone, and relates to the technical field of electronic products, and the loudspeaker module is small in size and good in sound quality. The loudspeaker module comprises a first loudspeaker unit and a second loudspeaker unit, the first loudspeaker unit comprises a first shell and a first diaphragm group, the first diaphragm group is arranged in the first shell and separates the first shell into a first front cavity and a first rear cavity, the first shell comprises a first cover plate, the first cover plate is opposite to the first diaphragm group, a first front cavity is defined between the first cover plate and the first diaphragm group, and a first groove recessed towards the first diaphragm group is arranged on the outer surface of the first cover plate; the second loudspeaker unit is located on the side of the first cover plate away from the first front cavity, and the size of the second loudspeaker unit in the depth direction of the first groove is greater than the depth size of the first groove.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a speaker module and headphones. Background Technology

[0002] In the use of electronic products, headphones have become an essential accessory to allow users to hear the sound information provided by the electronic products without disturbing others. However, due to the limited space inside the headphones, the structure of the speaker module is greatly restricted, resulting in poor sound quality, which needs further improvement. Summary of the Invention

[0003] This application provides a speaker module and headphones with good sound quality and small size.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides a loudspeaker module, which includes a first loudspeaker unit and a second loudspeaker unit. The first loudspeaker unit includes a first housing and a first diaphragm assembly. The first diaphragm assembly is disposed within the first housing and divides the first housing into a first front cavity and a first rear cavity. The first housing includes a first cover plate, which is opposite to the first diaphragm assembly and defines a first front cavity between the first cover plate and the first diaphragm assembly. A first groove is provided on the outer surface of the first cover plate that is recessed toward the first diaphragm assembly. The second loudspeaker unit is located on the side of the first cover plate away from the first front cavity, and the dimension of the second loudspeaker unit along the depth direction of the first groove is greater than the depth dimension of the first groove.

[0006] The speaker module provided in this application, by providing a first groove on the first cover plate and placing the second speaker unit within the first groove, allows for a more compact structure and a smaller overall size. Furthermore, since the dimension of the second speaker unit along the depth direction of the first groove is greater than the depth dimension of the first groove, only a portion of the second speaker can be placed within the first groove, reducing its depth and consequently the height of the first side plate, thus reducing the height dimension (i.e., the axial dimension) of the first speaker unit. This avoids interference between the first speaker unit and other structures within the earphones when assembling the speaker module, facilitating its installation within the limited space of the earphones. Additionally, when assembling the second speaker unit onto the first speaker unit, the first groove allows for initial positioning of the second speaker unit, reducing assembly difficulty and improving efficiency.

[0007] In one possible design of the first aspect, a second groove is provided on the side surface of the first diaphragm assembly facing the first cover plate, recessed towards the first rear cavity, and the vibration center of the first diaphragm assembly is located within the second groove. The vibration center of the first diaphragm assembly is the position where its amplitude is maximum. This avoids interference between the first diaphragm assembly and the first groove during vibration, preventing the first groove from affecting the amplitude of the first diaphragm assembly, thus increasing the amplitude of the first diaphragm assembly, thereby increasing the frequency response of the first speaker module and improving the sound quality of the first speaker unit.

[0008] In one possible design of the first aspect, the vibration center of the first diaphragm assembly is located on the central axis of the second groove. That is, the central axis of the second groove passes through the vibration center of the first diaphragm assembly. This avoids interference between the first diaphragm assembly and the first groove during vibration, prevents the first groove from affecting the amplitude of the first diaphragm assembly, and helps to increase the amplitude of the first diaphragm assembly, thereby increasing the frequency response of the first speaker module and improving the sound quality of the first speaker unit.

[0009] In one possible design of the first aspect, the orthographic projection of the second groove on the first diaphragm assembly lies within the orthographic projection of the first groove on the first diaphragm assembly, or the orthographic projection of the second groove on the first diaphragm assembly coincides with the orthographic projection of the first groove on the first diaphragm assembly. This avoids interference between the first diaphragm assembly and the first groove during vibration, prevents the first groove from affecting the amplitude of the first diaphragm assembly, and helps to increase the amplitude of the first diaphragm assembly, thereby increasing the frequency response of the first speaker module and improving the sound quality of the first speaker unit.

[0010] In one possible design of the first aspect, the second speaker unit has a first outer surface located within a first groove and facing the bottom wall of the groove. The electrical connection terminals of the second speaker unit are disposed on other outer surfaces besides the first outer surface. Therefore, by disposing the electrical connection terminals on other outer surfaces besides the first outer surface located within the first groove and facing the bottom wall of the groove, the height of the speaker module can be reduced. Furthermore, the difficulty of electrical connection between the electrical connection terminals and the motherboard can be reduced, improving assembly efficiency. Additionally, the contact area between the first outer surface and the bottom wall of the first groove can be increased, enhancing the connection strength between the first and second speaker units and preventing interference between the electrical connection terminals and the connection between the first outer surface and the bottom wall of the first groove. In another possible design of the first aspect, the electrical connection terminals of the second speaker unit are entirely located outside the first groove. This further reduces the difficulty of electrical connection between the electrical connection terminals and the motherboard.

[0011] In one possible design of the first aspect, the first cover plate is a magnetically conductive element. This reduces magnetic interference between the first magnetic circuit system and the second magnetic circuit system.

[0012] In one possible design of the first aspect, a vent is provided on the first diaphragm assembly, connecting the first front cavity and the first rear cavity. This generates an acoustic short-circuit effect, achieving frequency response adjustment. Simultaneously, the vent balances the air pressure between the first front cavity and the first rear cavity, simplifying the airflow structure of the first speaker unit, reducing or eliminating air pressure between the earphone and the eardrum, mitigating the blockage effect, and alleviating or eliminating user discomfort.

[0013] In one possible design of the first aspect, the first diaphragm assembly is further provided with a first damping element, which covers the vent hole. The first damping element can be a damping mesh or a damping membrane. This increases the acoustic impedance, thereby improving the audio performance of the first loudspeaker unit.

[0014] In one possible design of the first aspect, the first damping element is disposed on the side surface of the first dome facing the first front cavity, and / or the first damping element is disposed on the side surface of the first dome facing the first rear cavity.

[0015] In one possible design of the first aspect, the diameter of the vent is less than or equal to 1.0 mm. This reduces audio leakage between the first front cavity and the first rear cavity, which helps improve the sound quality of the first speaker unit.

[0016] In one possible design of the first aspect, the diameter of the vent is less than or equal to 0.5 mm. This further reduces audio leakage between the first front cavity and the first rear cavity, which is beneficial to improving the sound quality of the first speaker unit.

[0017] In one possible design of the first aspect, the central axis of the vent coincides with the central axis of the first dome. That is, the central axis of the vent coincides with the central axis of the first diaphragm assembly.

[0018] In one possible design of the first aspect, the first speaker unit has a first sound outlet, and the second speaker unit has a second sound outlet, with the sound outlet direction of the first sound outlet being consistent with that of the second sound outlet. This ensures that the acoustic paths of both the first and second speaker units are unobstructed while reducing the phase difference between the sound waves output by the two speaker units, thereby improving the sound quality of the speaker module.

[0019] In one possible design approach of the first aspect, the central axis of the first sound outlet coincides with the central axis of the second sound outlet. This makes the acoustic path of the first speaker unit highly similar to that of the second speaker unit, effectively avoiding mutual interference between the sound wave resonance peaks output by the first and second speaker units due to differences in acoustic path structures. This helps reduce phase distortion and phase aberration, resulting in a better combination of the two speaker units and thus improving the overall sound quality of the speaker module.

[0020] In one possible design of the first aspect, the second speaker unit includes a second housing and a second diaphragm assembly. The second diaphragm assembly is disposed within the second housing and divides the second housing into a second front cavity and a second rear cavity. The vibration direction of the second diaphragm assembly is perpendicular to the vibration direction of the first diaphragm assembly. This design minimizes the space occupied by the second speaker unit in the radial direction of the first speaker unit. When assembling the speaker module into the headphones, interference between the first speaker unit and other structures within the headphones can be avoided, facilitating the assembly of the speaker module into headphones with limited space.

[0021] In one possible design of the first aspect, the second speaker unit includes a second housing and a second diaphragm assembly. The second diaphragm assembly is disposed within the second housing and divides the second housing into a second front cavity and a second rear cavity. The vibration direction of the second diaphragm assembly is consistent with the vibration direction of the first diaphragm assembly. Thus, by placing the second speaker unit horizontally within the first recess, the overall height of the speaker module can be reduced.

[0022] In one possible design embodiment of the first aspect, the vibration center axis of the second diaphragm group coincides with the vibration center axis of the first diaphragm group. The "vibration center axis of the first diaphragm group" as described in this application is a straight line passing through the vibration center of the first diaphragm group and perpendicular to it, wherein the vibration center of the first diaphragm group is the position where its amplitude is maximum. The "vibration center axis of the second diaphragm group" is a straight line passing through the vibration center of the second diaphragm group and perpendicular to it, wherein the vibration center of the second diaphragm group is the position where its amplitude is maximum.

[0023] This allows the acoustic path of the first speaker unit to be highly similar to that of the second speaker unit, effectively avoiding mutual interference between the sound wave resonance peaks output by the first and second speaker units caused by different acoustic path structures. This helps to reduce phase distortion and phase aberration, resulting in a better combination of the two speaker units and thus improving the overall sound quality of the speaker module.

[0024] In one possible design of the first aspect, the second loudspeaker unit includes a second housing, a second diaphragm assembly, a reed, a drive rod, a second magnetic circuit system, and a second voice coil. The second diaphragm assembly is disposed within the second housing to divide the space within the second housing into a second front cavity and a second rear cavity. The reed, drive rod, second magnetic circuit system, and second voice coil are all located within the second rear cavity. The drive rod is fixed to the second diaphragm assembly. The reed, drive rod, second magnetic circuit system, and second voice coil cooperate to drive the second diaphragm assembly to vibrate. The central axis of the drive rod coincides with the vibration central axis of the second diaphragm assembly.

[0025] In one possible design of the first aspect, a sound outlet tube is provided on the outer surface of the second speaker unit, and the sound outlet tube has a sound outlet channel communicating with the second sound outlet. In this way, the sound signal of the second speaker unit can be transmitted to the sound outlet through the sound outlet channel, thereby shortening the distance between the second speaker module and the sound outlet when the speaker module is assembled into the headphones. This helps to reduce the sound interference between the first speaker unit and the second speaker unit and improves the sound quality of the speaker module.

[0026] In one possible design of the first aspect, the speaker module further includes a microphone unit, which is fixed to the second speaker unit or the first speaker unit. Thus, by integrating the microphone unit into the speaker module, the speaker module's functionality is diversified, and during assembly, the microphone unit, the first speaker unit, and the second speaker unit can be assembled as a whole into the headphones, simplifying the assembly process and improving assembly efficiency.

[0027] In one possible design of the first aspect, the microphone unit and the electrical connection terminal are located on different sides of the second housing. This avoids interference between the microphone unit and the electrical connection terminal.

[0028] In one possible design of the first aspect, the microphone unit is located on the second housing and near the second sound outlet.

[0029] In one possible design of the first aspect, the outer surface of the second speaker unit is recessed inward to form a third groove, and at least a portion of the microphone unit is accommodated within the third groove. This allows for a more compact speaker module structure, which helps to reduce the overall size of the speaker module.

[0030] In one possible design of the first aspect, the first speaker unit is a moving coil speaker and the second speaker unit is a moving iron speaker.

[0031] In one possible design of the first aspect, the height of the second speaker unit is less than or equal to 4.5 mm.

[0032] Secondly, this application provides an earphone, including: a shell and a speaker module, wherein a sound outlet is formed on the shell; the speaker module is a speaker module as described in any of the above technical solutions, the speaker module is disposed inside the shell, and the sound signal generated by the first speaker unit and the sound signal generated by the second speaker unit are both output from the sound outlet.

[0033] Understandably, the beneficial effects that the headphones described in the second aspect above can achieve can be referenced to the beneficial effects in the first aspect and any of its possible design embodiments, which will not be repeated here. Attached Figure Description

[0034] Figure 1 This application provides schematic diagrams of the structure of headphones according to some embodiments;

[0035] Figure 2 for Figure 1 The diagram shows the exploded structure of the headphones.

[0036] Figure 3 for Figure 1 A schematic diagram of a cross-sectional structure of the speaker module inside the earphone shown.

[0037] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure of the core of the speaker module shown;

[0038] Figure 5 Cross-sectional views of a portion of the structure of the earphone provided in other embodiments of this application;

[0039] Figure 6a A three-dimensional structural schematic diagram of a speaker module provided in other embodiments of this application;

[0040] Figure 6b for Figure 6a The diagram shows the assembly of the speaker module and the headphones.

[0041] Figure 7 for Figure 6a A perspective view of the first speaker unit in the speaker module shown;

[0042] Figure 8 for Figure 7 An exploded view of the first speaker unit shown in the diagram;

[0043] Figure 9a for Figure 7 A cross-sectional view of the first speaker unit shown;

[0044] Figure 9b for Figure 9a An enlarged view of region A in the sectional view shown;

[0045] Figure 9c for Figure 9a An enlarged view of region B in the sectional view shown;

[0046] Figure 10 for Figure 6a A perspective view of the second speaker unit in the speaker module shown;

[0047] Figure 11 for Figure 10 A cross-sectional view of the second speaker unit shown;

[0048] Figure 12 for Figure 6a A cross-sectional view of the speaker module shown;

[0049] Figure 13 for Figure 11 A perspective view of the second diaphragm assembly of the second speaker unit shown in the image;

[0050] Figure 14 for Figure 11 An enlarged view of region C in the sectional view shown;

[0051] Figure 15 for Figure 11 A schematic diagram of the reed structure of the second speaker unit shown;

[0052] Figure 16 for Figure 11 A schematic diagram of the second magnetic circuit system of the second speaker unit shown in the figure;

[0053] Figure 17a A perspective view of a speaker module provided in other embodiments of this application;

[0054] Figure 17b for Figure 17a A cross-sectional view of the speaker module shown;

[0055] Figure 18a A cross-sectional view of a second speaker unit in a speaker module provided for other embodiments of this application;

[0056] Figure 18b for Figure 18a The diagram shows the assembly structure of the second speaker unit and the microphone unit.

[0057] Figure 19a A perspective view of a speaker module provided in other embodiments of this application;

[0058] Figure 19b for Figure 19a A cross-sectional view of the speaker module shown;

[0059] Figure 19cPartial cross-sectional view of the headphone structure provided in some embodiments of this application;

[0060] Figure 20a A cross-sectional view of a first speaker unit provided for other embodiments of this application;

[0061] Figure 20b for Figure 20a A perspective view of the first diaphragm assembly of the first loudspeaker unit shown in the figure;

[0062] Figure 20c for Figure 20a An exploded view of the first magnetic circuit system in the first loudspeaker unit shown in the figure;

[0063] Figure 21a A perspective view of a speaker module provided in other embodiments of this application;

[0064] Figure 21b for Figure 21a The speaker unit shown is a cross-sectional view.

[0065] Figure label:

[0066] 100. Headphones;

[0067] 1. Outer shell; 10. Accommodating space; 11. Front shell; 101. First accommodating cavity; 110. Sound outlet; 111. Main body; 112. Extension; 1121. Limiting rib; 12. Rear shell; 102. Second accommodating cavity; 121. Cover; 122. Rod; 1221. Charging contact; 13. Contact sleeve;

[0068] 2. Motherboard;

[0069] 3. Battery;

[0070] 4. Speaker module; 41. Housing; 411. Front cavity; 412. Rear cavity; 41a. Sound outlet channel; 42. Core; 420a. Diaphragm; 420b. Voice coil; 420c. Magnetic circuit system; 420d. Frame;

[0071] 4a. First loudspeaker unit; C1. First front cavity; C2. First rear cavity; 401. First sound outlet; 43. First housing; 431. Speaker frame; 431a. Leakage hole; 431b. Second damping element; 4311. First cone; 4311a. First bottom wall; 4311b. First side wall; 4312. Second cone; 4312a. Second bottom wall; 4312b. Second side wall; 4312c. Annular groove; 432. Cover; 4321. First cover plate ; 4321a, First groove; 4322, First side plate; 4323, Flanged edge; 44, First diaphragm assembly; 441, First connecting part; 442, First surround; 443, First dome; 444, Second groove; 445, Vent hole; 446, First damping element; 45, First voice coil; 46, First magnetic circuit system; 461, First center magnet; 462, Center magnetic yoke; 463, Clearance hole; 4631, First clearance hole; 4632, Second clearance hole;

[0072] 4b. Second loudspeaker unit; D1. Second front cavity; D2. Second rear cavity; 402. Second sound outlet; 47. Second housing; 471. First outer surface; 473. Stepped portion; 47a. First housing portion; 47b. Second housing portion; 48. Second diaphragm assembly; 481. Second connecting portion; 482. Second surround; 483. Second dome; 49. Second magnetic circuit system; 491. Magnetic guide portion; 492. Magnet portion; 492a. First magnet portion; 492b. Second magnet portion; 4b1. Reed; 4b11. First sheet; 4b12. Second sheet; 4b13. Connecting sheet; 4b14. Support body; 4b2. Drive rod; 4b3. Second voice coil; 4b4. Sound outlet tube; 4b41. Sound outlet channel; 4b5. Electrical connection terminal; 4b6. Third groove;

[0073] 4c. Microphone unit. Detailed Implementation

[0074] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0075] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0076] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0077] This application provides an earphone that can be used with electronic products such as mobile phones, tablets, and laptops to receive sound information provided by the electronic products and output it to the user. By using the earphone with electronic products, the sound from the electronic products can be prevented from disturbing others. The earphone can be wireless or wired.

[0078] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the earphone 100 provided in some embodiments of this application. Figure 2 yes Figure 1 An exploded view of the headphone 100. The headphone 100 can be either a bean-shaped headphone or a stem-shaped headphone. Figure 1 and Figure 2 The illustrated earphone 100 is a wireless earphone as an example. The earphone 100 may include a housing 1, a motherboard 2, a battery 3, and a speaker module 4.

[0079] Understandable, Figure 1 , Figure 2 The accompanying drawings below only schematically illustrate some of the components included in the earphone 100; the actual shape, size, position, and construction of these components are not subject to change. Figure 1 , Figure 2 As well as the accompanying drawings below. Furthermore, when the earphone 100 is a wired earphone, the wired earphone may not include the battery 3.

[0080] The outer shell 1 has a housing space 10, which serves as a carrier for the functional components of the earphone 100, protecting the functional components located within the housing space 10. Furthermore, when a user wears the earphone 100, the earphone 100 contacts the user's ear through the outer shell 1. Therefore, to improve the user's comfort when wearing the earphone 100, the outer shell 1 can be shaped to fit the shape of the human ear.

[0081] Since the outer shell 1 is directly exposed to the external environment and comes into contact with the user's ear, or the earphone 100 comes into contact with other external structures through the outer shell 1, it is inevitable that the outer surface of the outer shell 1 will suffer from scratches, corrosion, and other problems. To avoid this technical problem, the outer shell 1 can have certain properties such as wear resistance, corrosion resistance, and scratch resistance, or a layer of functional material for wear resistance, corrosion resistance, and scratch resistance can be coated on the outer surface of the outer shell 1.

[0082] The inner circumferential surface of the outer shell 1 is a curved surface extending circumferentially along the outer shell 1. In some examples, the inner circumferential surface of the outer shell 1 is an arcuate surface extending circumferentially along the outer shell 1. As another example, the inner circumferential surface of the outer shell 1 is an elliptical arcuate surface extending circumferentially along the outer shell 1. In other examples, the inner circumferential surface of the outer shell 1 can also be a combination of an arcuate surface and an elliptical arcuate surface, as long as the inner circumferential surface of the outer shell 1 is curved. This design ensures that the overall shape of the outer shell 1 fits the human ear while increasing the volume of the accommodating space 10 inside the outer shell 1, so that more functional devices can be integrated into the earphone 100.

[0083] In some embodiments, the outer shell 1 can be a structural unit, that is, the outer shell 1 can be a one-piece molded part, and the one-piece molded outer shell 1 has higher structural strength.

[0084] In other embodiments, the outer casing 1 may also be formed by assembling multiple parts. Please continue reading. Figure 1 and Figure 2 In this embodiment, the outer shell 1 may include a front shell 11 and a rear shell 12. The front shell 11 faces the user's ear when the earphone 100 is in use, and the rear shell 12 faces away from the user's ear. The outer shell 1 is formed by assembling the front shell 11 and the rear shell 12. This facilitates the separate processing of the front shell 11 and the rear shell 12, simplifies the mold structure of the front shell 11 and the rear shell 12, reduces the molding difficulty of the front shell 11 and the rear shell 12, and consequently reduces the manufacturing difficulty of the outer shell 1. Specifically, the front shell 11 can be fixedly connected to the rear shell 12 by a snap-fit ​​method. The front shell 11 can also be connected to the rear shell 12 by screws. Alternatively, in other embodiments, the front shell 11 can also be fixedly connected to the rear shell 12 by glue or tape.

[0085] The front shell 11 can be made of materials including but not limited to hard plastic, metal, and a combination of plastic and metal. To achieve a lightweight design for the Headphones 100, the front shell 11 can be made of hard plastic.

[0086] Please see Figure 2 A first receiving cavity 101 is formed inside the front shell 11, and the side of the first receiving cavity 101 adjacent to the rear shell 12 is open. A sound outlet 110 communicating with the first receiving cavity 101 is formed on the front shell 11, and the sound of the earphone 100 can be conducted to the outside of the earphone 100 through the sound outlet 110.

[0087] Specifically, the front housing 11 may include a main body 111 and an extension 112. The extension 112 may be located on one side of the main body 111 and extend in a direction away from the main body 111. See also Figure 2 The first receiving cavity 101 can be formed inside the main body 111, and the extension 112 can form the sound outlet 110. It is understood that in some other embodiments, the front shell 11 may not include the extension 112, but instead the sound outlet 110 is directly formed on the wall of the main body 111.

[0088] To improve user comfort when wearing the headphones 100, the headphones 100 may also be provided with a contact sleeve 13, which can be used to contact the user's ear. For example, the contact sleeve 13 may surround the outer peripheral surface of the extension 112, and the contact sleeve 13 may be similar in shape to the human ear canal to improve the fit of wearing the headphones 100. At the same time, the contact sleeve 13 may be made of flexible materials such as silicone and rubber to improve user comfort when wearing the headphones 100.

[0089] Please see Figure 2 A limiting rib 1121 can be formed on the outer peripheral surface of the extension 112, so that when the contact sleeve 13 surrounds the outer peripheral surface of the extension 112, the limiting rib 1121 can abut against the contact sleeve 13, thereby limiting the contact sleeve 13 and reducing the probability of the contact sleeve 13 falling off the extension 112 naturally. Of course, in order to reduce costs, the earphone 100 may not include the contact sleeve 13.

[0090] It should be noted that all directional indications (such as forward, backward, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0091] The material of the back cover 12 can be the same as that of the front cover 11. Of course, the material of the back cover 12 can also be different from that of the front cover 11. In order to achieve the lightweight design of the earphone 100, the material of the back cover 12 can be hard plastic.

[0092] Please continue reading. Figure 2 The rear shell 12 may include a cover 121 and a rod 122. The cover 121 may be connected to the front shell 11, and the rod 122 may be disposed on the side of the cover 121 away from the front shell 11. A second receiving cavity 102 may be formed inside the cover 121, and the side of the second receiving cavity 102 adjacent to the front shell 11 is open, so that the second receiving cavity 102 can communicate with the first receiving cavity 101, and the second receiving cavity 102 and the first receiving cavity 101 can together form the receiving space 10 of the outer shell 1.

[0093] The cover 121 and the rod 122 can be an integral structure, meaning they form a single unit. This simplifies the manufacturing process of the back cover 12 and improves the connection strength between the cover 121 and the rod 122. However, this application is not limited to this; the cover 121 and the rod 122 can also be separate structures, connected by adhesive, snap-fit, screws, or welding. The rod 122 can be provided with charging contacts 1221 to allow external power to charge the earphone 100.

[0094] Please continue reading. Figure 2 The motherboard 2, battery 3 and speaker module 4 are housed within the accommodating space 10.

[0095] The motherboard 2 integrates a main control chip, a Bluetooth chip, etc., and can be used for charging management, signal transmission, etc. Specifically, the motherboard 2 can be installed in the second receiving cavity 102. A space communicating with the second receiving cavity 102 can be formed inside the rod body 122. A corresponding charging line can be set in this space, and the charging line electrically connects the charging contact 1221 to the motherboard 2 inside the second receiving cavity 102.

[0096] Motherboard 2 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. Motherboard 2 can use FR-4 dielectric substrates, Rogers dielectric substrates, or a hybrid of FR-4 and Rogers dielectric substrates, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrates are a type of high-frequency board.

[0097] Battery 3 is used to provide power to electronic components such as motherboard 2 and speaker module 4 inside the earphone 100. Battery 3 can be located on the side of motherboard 2 near the first receiving cavity 101.

[0098] The speaker module 4 can be installed within the accommodating space 10, located on the side of the battery 3 near the sound outlet 110. Specifically, the speaker module 4 can be installed within the first accommodating cavity 101. The assembly method between the speaker module 4 and the housing 1 includes, but is not limited to, snap-fit, threaded connection, or adhesive bonding. The speaker module 4 is electrically connected to the mainboard 2 to obtain audio electrical signals such as music and voice, and the speaker module 4 can convert the audio electrical signals into sound signals, supporting external audio playback.

[0099] It is understood that, in addition to housing the motherboard 2, battery 3, and speaker module 4, the accommodating space 10 can also be used to install functional devices such as antennas, communication units, and sensors to enable wireless connection between the earphone 100 and other electronic devices. It is also understood that, in some other embodiments, the battery 3, motherboard 2, antenna, communication unit, and sensors may also be housed within the space of the rod 122; this application does not limit this.

[0100] Please see Figure 3 , Figure 3 for Figure 1 The diagram shows a cross-sectional view of the speaker module 4 inside the earphone 100. In this embodiment, the speaker module 4 includes a housing 41 and a core 42. The housing 41 can be separate from the housing of the earphone 100, or it can be part of the same housing as the earphone 100; no specific limitation is made here. The core 42 is disposed inside the housing 41 and divides the internal space of the housing 41 into a front cavity 411 and a rear cavity 412. The housing 41 is provided with a sound outlet channel 41a. This sound outlet channel 41a communicates with the front cavity 411. When the core 42 is working, it can drive the air in the front cavity 411 to vibrate. The vibrating air in the front cavity 411 is discharged through the sound outlet channel 41a, which can form sound. The sound outlet channel 41a communicates with the front cavity 411. Figure 1 The sound outlet 110 on the earphone 100 is connected, thereby further exporting the sound to the outside of the earphone 100 so that it can be heard by the user.

[0101] Please see Figure 4 , Figure 4 for Figure 3 The diagram shows a cross-sectional view of the core 42 of the speaker module 4. The core 42 includes a diaphragm 420a, a voice coil 420b fixedly connected to the diaphragm 420a, a magnetic circuit system 420c disposed on one side of the diaphragm 420a, and a frame 420d for mounting the diaphragm 420a and the magnetic circuit system 420c. When this core 42 is applied... Figure 3When the speaker module 4 is shown, the core 42 is fixed to the inner wall of the housing 41 by the frame 420d. The diaphragm 420a divides the housing 41 into a front cavity 411 and a rear cavity 412. The voice coil 420b, the magnetic circuit system 420c, and the frame 420d are located in the rear cavity 412. The diaphragm 420a and the inner wall of the housing 41 form the front cavity 411 of the speaker module 4. When energized, the voice coil 420b generates an induced magnetic field and is displaced by the magnetic force of the magnetic circuit system 420c, driving the diaphragm 420a to vibrate. This vibrates the air in the front cavity 411 to form sound waves, which are output through the sound outlet channel 41a.

[0102] In this embodiment, the core 42 is a moving-coil loudspeaker, which is inexpensive, technologically mature, and performs well. However, moving-coil loudspeakers have a large vibrating mass and poor transient characteristics. The asymmetrical distribution of mass distribution, diaphragm compliance, and BL electromagnetic driving force will produce varying degrees of rocking vibration and segmented vibration at different frequencies, resulting in severe peaks and valleys in the high-frequency response and low high-frequency extension.

[0103] To address the technical issue of low high-frequency extension in moving-coil loudspeakers, please refer to [link / reference needed]. Figure 5 , Figure 5 This is a cross-sectional view of a portion of the structure of an earphone 100 provided in some other embodiments of this application. In this embodiment, the speaker module 4 includes a first speaker unit 4a and a second speaker unit 4b, which are spaced apart within the housing 1 along the sound output direction of the earphone 100. Figure 5 The direction indicated by the middle arrow is the sound output direction of the earphone 100. The sound signals generated by the first speaker unit 4a and the second speaker unit 4b are both output outwards through the sound outlet 110 on the housing 1. The first speaker unit 4a and the second speaker unit 4b have different sound frequencies. Specifically, the first speaker unit 4a can be a woofer, and the second speaker unit 4b can be a tweeter. For example, the first speaker unit 4a can be a moving-coil speaker, and the second speaker unit 4b can be a balanced armature speaker, a planar voice coil 420b speaker, etc.

[0104] In this embodiment, by providing a speaker module 4 including a first speaker unit 4a and a second speaker unit 4b within the earphone 100, the difference in the sound emission frequencies of the first speaker unit 4a and the second speaker unit 4b can be utilized to enable the earphone 100 to have good sound performance in different frequency ranges, thereby improving the sound output effect of the speaker module 4. However, the first speaker module 4 in this embodiment occupies a large space, which is not conducive to its assembly within the space-constrained earphone 100.

[0105] To resolve the above technical issues, please refer to [link / reference]. Figure 6a , Figure 6a This is a three-dimensional structural schematic diagram of a speaker module 4 provided in some embodiments of this application. It is understood that... Figure 6a The accompanying drawings below only schematically illustrate some of the components included in the speaker module 4. The actual shape, size, location, and construction of these components are not subject to change. Figure 6a As well as the limitations of the accompanying figures below.

[0106] The speaker module 4 in this embodiment includes a first speaker unit 4a and a second speaker unit 4b. The sound emission frequency of the first speaker unit 4a is lower than that of the second speaker unit 4b. In this example, the first speaker unit 4a is a moving-coil speaker, and the second speaker unit 4b is a moving-iron speaker. It is understood that in other embodiments, the second speaker unit 4b may also be a planar voice coil speaker or a piezoelectric ceramic speaker unit.

[0107] Please see Figures 6a-6b , Figure 6b for Figure 6a The diagram shows the assembly of the speaker module 4 and the earphone 100. The first speaker unit 4a is connected to the second speaker unit 4b, and the speaker module 4 is fixed inside the earphone 100's outer shell 1 via the first speaker unit 4a. Therefore, the first speaker unit 4a and the second speaker unit 4b can be integrated into a single unit, making the speaker module 4 more compact and reducing its space requirements. Furthermore, the speaker module 4 can be assembled entirely within the earphone 100, simplifying the assembly process and improving assembly efficiency.

[0108] Please see Figure 6a The first speaker unit 4a has a first sound outlet 401, and the sound signal generated by the first speaker unit 4a is transmitted to the sound outlet 110 through the first sound outlet 401. The second speaker unit 4b has a second sound outlet 402, and the sound signal generated by the second speaker unit 4b is transmitted to the sound outlet 110 through the second sound outlet 402. Please refer to [link / reference]. Figures 6a-6b The sound emission direction of the first sound outlet 401 is the same as that of the second sound outlet 402. Figure 6a and Figure 6b The dashed arrow indicates the sound output direction of the first speaker unit 4a, and the solid arrow indicates the sound output direction of the second speaker unit 4b. Specifically, the sound output directions of the first sound outlet 401 and the second sound outlet 402 both face the sound outlet 110. This ensures that the acoustic paths of both the first speaker unit 4a and the second speaker unit 4b are unobstructed while reducing the phase difference between the sound waves output by the two speaker units, thereby improving the sound quality of the speaker module 4.

[0109] In some embodiments, please refer to Figure 6a The arrangement direction of the first speaker unit 4a and the second speaker unit 4b is consistent with the sound emission direction of the first sound outlet 401. Please refer to [link / reference]. Figure 6b The central axis O1 of the first sound outlet 401 coincides with the central axis O2 of the second sound outlet 402. In this embodiment, the first sound outlet 401 includes a plurality of spaced-apart sub-sound outlets 401a; for example, the first sound outlet 401 includes four spaced-apart sub-sound outlets 401a. In this embodiment, the central axis of the first sound outlet 401 is the central axis of the shape formed by the plurality of sub-sound outlets 401a. Figure 6b In the example, the central axis O1 of the first sound outlet 401 coincides with the central axis of the first speaker unit 4a. This makes the acoustic path of the first speaker unit 4a highly similar to that of the second speaker unit 4b, effectively avoiding mutual interference between the sound wave resonance peaks output by the first speaker unit 4a and the second speaker unit 4b due to different acoustic path structures. This helps reduce phase distortion and phase aberration, resulting in a better combination of the two speaker units and thus improving the overall sound quality of the speaker module 4.

[0110] Please see Figures 7-9a , Figure 7 for Figure 6a A perspective view of the first speaker unit 4a in the speaker module 4 shown. Figure 8 yes Figure 7 An exploded view of the first speaker unit 4a shown in the figure. Figure 9a for Figure 7 The diagram shows a cross-sectional view of the first loudspeaker unit 4a. In this embodiment, the first loudspeaker unit 4a includes a first housing 43, a first diaphragm assembly 44, a first voice coil 45, and a first magnetic circuit system 46.

[0111] Please see Figures 8-9a The first housing 43 includes a frame 431 and a cover 432. The frame 431 serves as a "support skeleton" for the first speaker unit 4a, supporting the first diaphragm assembly 44, the first voice coil 45, and the first magnetic circuit system 46. The first speaker unit 4a can be fixed to the housing 1 of the headphone 100 by means of the frame 431.

[0112] Please see Figures 8-9aThe basin stand 431 includes a first basin body 4311 and a second basin body 4312. The first basin body 4311 includes a first bottom wall 4311a and a first side wall 4311b. The first bottom wall 4311a is formed into a circular plate structure, and the first side wall 4311b is formed into a cylindrical structure. The first side wall 4311b is arranged around the outer edge of the first bottom wall 4311a. The second basin body 4312 includes a second bottom wall 4312a and a second side wall 4312b. The second bottom wall 4312a is formed into an annular plate structure. The inner edge of the second bottom wall 4312a is arranged around the outer peripheral surface of the first side wall 4311b, and the inner surface of the second bottom wall 4312a is flush with the end face of the first side wall 4311b that is away from the first bottom wall 4311a. The second sidewall 4312b is formed into a cylindrical structure and is disposed around the outer edge of the second bottom wall 4312a. The inner circumferential surface of the second sidewall 4312b is provided with an annular groove 4312c that is recessed in the direction away from the central axis of the basin frame 431. The annular groove 4312c extends in a ring along the circumference of the basin frame 431 and penetrates to the end face of the second sidewall 4312b away from the second bottom wall 4312a.

[0113] The first basin 4311 and the second basin 4312 are an integral structure, that is, the basin frame 431 is a single unit. This helps to improve the connection strength of the basin frame 431. Of course, this application is not limited to this; the first basin 4311 and the second basin 4312 can also be separate structures, and the first basin 4311 and the second basin 4312 can be connected by means of snap-fit, threaded connection, adhesive, or welding. The material of the basin frame 431 includes, but is not limited to, metal, plastic, and a combination of metal and plastic. It is understood that the basin frame 431 is used to support the first diaphragm assembly 44 and fix the first magnetic circuit system 46. While meeting this requirement, the basin frame 431 can also have other design shapes, and is not limited to this embodiment.

[0114] Please see Figures 8-9a The cover 432 includes a first cover plate 4321 and a first side plate 4322. The first cover plate 4321 is generally formed into a circular plate structure, and the first side plate 4322 is disposed around the outer edge of the first cover plate 4321. The end of the first side plate 4322 away from the first cover plate 4321 has an outwardly folded flange 4323. The cover 432 is fixedly connected to the inner circumferential surface of the annular groove 4312c by means of the flange 4323, so as to define a receiving cavity between the cover 432 and the tray 431. It is understood that in other embodiments, the cover 432 may also be fixed to the end face of the second side wall 4312b away from the second bottom wall 4312a.

[0115] Please see Figures 8-9aThe outer surface of the first cover plate 4321 is provided with a first groove 4321a that is recessed toward the interior of the first housing 43. (See also...) Figure 6a Along the axial direction of the first speaker unit 4a, a portion of the second speaker unit 4b is located within the first groove 4321a. Specifically, the dimension of the second speaker unit 4b in the depth direction of the first groove 4321a is greater than the depth dimension of the first groove 4321a. Thus, one portion of the second speaker unit 4b can be located within the first groove 4321a, and the other portion of the second speaker unit 4b can be located outside the first groove 4321a.

[0116] Therefore, by providing a first groove 4321a on the first cover plate 4321 and placing the second speaker unit 4b within the first groove 4321a, the structure of the speaker module 4 can be made more compact, reducing the height dimension h of the speaker module 4. Simultaneously, since the depth dimension h0 of the second speaker unit 4b in the first groove 4321a is greater than the depth dimension h1 of the first groove 4321a, only a portion of the second speaker unit 4b can be placed within the first groove 4321a, reducing the depth dimension h1 of the first groove 4321a, thereby reducing the height dimension h2 of the first side plate 4322, and consequently reducing the height dimension h3 of the first speaker unit 4a. Thus, when assembling the speaker module 4 into the earphone 100, interference between the first speaker unit 4a and other structures within the earphone 100 can be avoided, facilitating the assembly of the speaker module 4 within the space-constrained earphone 100. Furthermore, when assembling the second speaker unit 4b onto the first speaker unit 4a, the assembly position of the second speaker unit 4b can be initially positioned by the first groove 4321a, which helps to reduce assembly difficulty and improve assembly efficiency.

[0117] It should be noted that you should refer to [link / reference]. Figure 9a and combined Figure 6a In this application, "the height dimension h of the speaker module 4" refers to the dimension of the speaker module 4 extending along the central axis O of the first speaker unit 4a. "The depth dimension h1 of the first groove 4321a" refers to the distance between the opening and the bottom wall of the first groove 4321a. "The height dimension h2 of the first side plate 4322" refers to the dimension of the first side plate 4322 extending along the central axis O of the first speaker unit 4a. "The height dimension h3 of the first speaker unit 4a" refers to the dimension of the first speaker unit 4a extending along its central axis O, which is also the axial dimension of the first speaker unit 4a.

[0118] Please see Figure 8The first sound outlet 401 of the first speaker unit 4a can be formed on the first cover plate 4321. Specifically, the first sound outlet 401 includes a plurality of sub-sound outlets 401a spaced apart circumferentially in the first groove 4321a. The sub-sound outlets 401a can be circular holes, elliptical holes, elongated holes, arc-shaped holes, etc. The central axes of the plurality of sub-sound outlets 401a are all located on the same circumference. It is understood that in other embodiments, the first sound outlet 401 can also be formed as an annular hole.

[0119] In some embodiments, please refer to Figure 9a The first groove 4321a is located in the middle of the first cover plate 4321, and the central axis of the first groove 4321a can coincide with the central axis of the first cover plate 4321. This facilitates the opening of the first sound outlet 401 on the first cover plate 4321. It is understood that in other embodiments, the central axis of the first groove 4321a may not coincide with the central axis of the first cover plate 4321. The specific position of the first groove 4321a can be adjusted and designed according to the actual assembly situation, as long as it can be easily assembled into the earphone 100 and avoid interference between the speaker module 4 and the internal structure of the earphone 100. Similarly, the specific position of the second speaker module 4b in the first groove 4321a can also be adjusted and designed according to the actual assembly situation, as long as it can be easily assembled into the earphone 100 and avoid interference between the speaker module 4 and the internal structure of the earphone 100.

[0120] The first diaphragm assembly 44 is the main body that drives the air movement within the first front cavity C1 of the first loudspeaker unit 4a. Optionally, the vibration center of the first diaphragm assembly 44 is located on the central axis of the first sound outlet 401. That is, the central axis of the first sound outlet 401 passes through the vibration center of the first diaphragm assembly 44. This helps to reduce phase distortion and phase aberration. It should be noted that in this application, "vibration center of the first diaphragm assembly 44" refers to the position where the amplitude of the first diaphragm assembly 44 is the largest.

[0121] Please see Figure 9aThe first diaphragm assembly 44 divides the receiving cavity within the housing 41 into a first front cavity C1 and a first rear cavity C2. The first voice coil 45 and the first magnetic circuit system 46 are both located in the first rear cavity C2. The first sound outlet 401 communicates with the first front cavity C1. The first diaphragm assembly 44 is opposite to the first cover plate 4321. That is, the projection of the first cover plate 4321 along the central axis of the first diaphragm assembly 44 onto the first diaphragm assembly 44 overlaps with the first diaphragm assembly 44. The first cover plate 4321 and the first diaphragm assembly 44 define the aforementioned first front cavity C1. The first groove 4321a is recessed from the outer surface of the first cover plate 4321 toward the first front cavity C1, and the second speaker unit 4b is located on the side of the first cover plate 4321 away from the first front cavity C1. In this way, the second speaker unit 4b can be located on the side of the first diaphragm assembly 44 away from the first magnetic circuit system 46, which helps to increase the distance between the second speaker unit 4b and the first magnetic circuit system 46, thereby helping to reduce the magnetic interference between the first speaker unit 4a and the second speaker unit 4b.

[0122] Please continue reading. Figures 8-9a The first diaphragm assembly 44 includes: a first connecting portion 441, a first folded ring 442, and a first dome 443 surrounded by the first folded ring 442. The first connecting portion 441 has an annular sheet-like structure. For example, the first connecting portion 441 has a circular annular sheet-like structure. See also... Figure 9b , Figure 9b for Figure 9a Enlarged view of region A. The first connecting part 441 is stacked on the inner bottom wall of the annular groove 4312c, directly opposite the cover 432, and can be sandwiched between the inner bottom wall of the annular groove 4312c and the flanged part 4323 of the first cover 432. The connection methods between the first connecting part 441 and the annular groove 4312c include, but are not limited to, adhesive bonding, snap-fitting, welding, or screw connection. The connection methods between the first connecting part 441 and the flanged part 4323 include, but are not limited to, adhesive bonding, snap-fitting, welding, or screw connection.

[0123] Please see Figures 8-9a The outer peripheral edge of the first fold ring 442 is connected to the inner peripheral edge of the first connecting portion 441. The cross-sectional shape of the first fold ring 442 is arc-shaped or approximately arc-shaped. The circumferential extension trajectory of the first fold ring 442 along the frame 431 is circular or rectangular. The first fold ring 442 may protrude towards the first cover plate 4321. This allows the first fold ring 442 to deform under external force, enabling the first dome 443 to vibrate relative to the first connecting portion 441 along the central axis of the first diaphragm assembly 44. Of course, it is understood that the first fold ring 442 may also protrude away from the first cover plate 4321. Please refer to... Figure 8The first dome 443 has a circular flat plate structure, and its outer peripheral edge is connected to the inner peripheral edge of the first fold ring 442. In this embodiment, the first dome 443 is formed as a planar dome. It is understood that in other embodiments, the first dome 443 may also be formed as an arc-shaped dome that arches towards the direction of the first cover plate 4321.

[0124] In some examples, the first diaphragm assembly 44 is a single molded part. That is, the first connecting part 441, the first folded ring 442, and the first dome 443 are a single integral structure. This configuration helps to improve the structural strength of the first diaphragm assembly 44 and facilitates its manufacturing. Of course, this application is not limited to this; the first connecting part 441, the first folded ring 442, and the first dome 443 can also be independently molded parts, with the first connecting part 441 and the first folded ring 442 connected by adhesive, and the first folded ring 442 and the first dome 443 connected by adhesive. The material of the first diaphragm assembly 44 includes, but is not limited to, metal, plastic, plant fiber, and animal fiber.

[0125] In some embodiments, please refer to Figure 9c , Figure 9c for Figure 9a An enlarged view of region B in the middle section. A vent 445 is provided on the first diaphragm assembly 44, connecting the first front cavity C1 and the first rear cavity C2. Specifically, the vent 445 is formed on the first dome 443. For example, the central axis of the vent 445 coincides with the central axis of the first dome 443. Thus, by providing the vent 445 on the first diaphragm assembly 44, the sound waves generated by the vibration of the first diaphragm 420a can enter the first rear cavity C2 from the first front cavity C1 through the vent 445, and simultaneously, the sound waves generated by the vibration of the first diaphragm 420a can enter the first front cavity C1 from the first rear cavity C2 through the vent 445. That is, the two sound waves are in opposite directions, causing partial cancellation and producing an acoustic short-circuit effect, thereby achieving the purpose of adjusting the frequency response. Meanwhile, the vent 445 can balance the air pressure between the first front cavity C1 and the first rear cavity C2, which not only simplifies the air passage structure of the first speaker unit 4a, but also reduces or eliminates the air pressure between the earphone 100 and the eardrum, reduces the blockage effect, and alleviates or eliminates the user's discomfort.

[0126] In some embodiments, the diameter of the vent 445 is less than or equal to 1 mm. Further, the diameter of the vent 445 can be less than 0.5 mm. This reduces audio leakage between the first front cavity C1 and the first rear cavity C2, which is beneficial for improving the sound quality of the first speaker unit 4a.

[0127] Building upon this, to further improve the sound quality of the first speaker unit 4a, a first damping element 446 is provided on the first diaphragm assembly 44. (See also...) Figure 9cA first damping element 446 is disposed on the first dome 443 and covers the vent hole 445. The first damping element 446 may be bonded or welded to the surface of the first dome 443 facing the first front cavity C1. The first damping element 446 may be a damping mesh or a damping membrane, but is not limited thereto. In this way, by covering the vent hole 445 with the first damping element 446, the acoustic impedance can be increased, thereby improving the audio performance of the first speaker unit 4a.

[0128] It is understood that in other embodiments, the first damping element 446 may also be bonded or welded to the surface of the first dome 443 facing the first rear cavity C2. Alternatively, the surface of the first dome 443 facing the first front cavity C1 and the surface of the first dome 443 facing the first rear cavity C2 may simultaneously be provided with the first damping element 446 for covering the vent 445. In this way, the purpose of increasing acoustic impedance can also be achieved.

[0129] The first voice coil 45 is used in conjunction with the first magnetic circuit system 46 to synchronously drive the first diaphragm assembly 44 to vibrate, thereby pushing the air in the first front cavity C1 of the first speaker unit 4a to generate sound. (See also...) Figures 8-9a The first voice coil 45 is formed into a ring shape and is connected to the surface of the first dome 443 opposite to the first cover 432. The connection between the first voice coil 45 and the first dome 443 includes, but is not limited to, adhesive bonding.

[0130] The first magnetic circuit system 46 is fixed to the frame 431 and is located in the first rear cavity C2. The first magnetic circuit system 46 is used to cooperate with the first voice coil 45 to drive the first diaphragm assembly 44 to vibrate synchronously.

[0131] Please see Figures 8-9a The first magnetic circuit system 46 includes a first central magnet 461, which can be a magnet or a magnetic steel. The first central magnet 461 is formed into a cylindrical structure. The first central magnet 461 can be fixed to the first bottom wall 4311a of the first basin 4311. The outer peripheral wall of the first central magnet 461 is spaced apart from the inner peripheral wall of the first basin 4311 to define a gap K1 between the first central magnet 461 and the first basin 4311. The first voice coil 45 can extend into the gap K1. In order to improve the magnetic flux intensity of the first magnetic circuit system 46, the first side wall 4311b of the first basin 4311 can be set as a magnetic conductor to constrain the outward diffusion of magnetic lines of force. For example, the material of the first side wall 4311b can be a yoke made of stacked silicon steel sheets. When the first voice coil 45 is energized, the first voice coil 45 drives the first diaphragm assembly 44 to vibrate under the action of the magnetic field in the gap K1.

[0132] It is understood that in other embodiments, the first magnetic circuit system 46 may further include a first side magnet. The first side magnet may be a magnet or a magnetic steel. The first side magnet is formed in a ring shape, surrounding the outer periphery of the first central magnet 461 and spaced apart from the first central magnet 461. In this way, a magnetic gap can be defined between the first side magnet and the first central magnet 461, which is beneficial to improving the magnetic flux intensity of the first magnetic circuit system 46.

[0133] Based on the above embodiments, in order to increase the magnetic flux intensity, please refer to... Figures 8-9a The first magnetic circuit system 46 also includes a central magnetic yoke 462, which can be a yoke made of stacked silicon steel sheets. The central magnetic yoke 462 is formed into a circular flat plate structure. The central magnetic yoke 462 is disposed on the surface of the first central magnet 461 near the first diaphragm assembly 44 by means of adhesive bonding, snap-fit, threaded connection, etc. In this way, by constraining the magnetic lines of force by the central magnetic yoke 462, the magnetic flux intensity in the aforementioned gap K1 can be increased, thereby improving the driving strength of the first diaphragm assembly 44. It is understood that in some other embodiments, the first magnetic circuit system 46 may not include the central magnetic yoke 462.

[0134] Please see Figures 10-11 , Figure 10 for Figure 6a A perspective view of the second speaker unit 4b shown in the figure. Figure 11 for Figure 10 The diagram shows a cross-sectional view of the second speaker unit 4b. In this embodiment, the second speaker unit 4b can be a moving iron tweeter. The second speaker unit 4b may include: a second housing 47, a second diaphragm assembly 48, a reed 4b1, a transmission rod 4b2, a second magnetic circuit system 49, and a second voice coil 4b3.

[0135] Understandable, Figures 10-11 The accompanying drawings below only schematically illustrate some components of the second speaker unit 4b; the actual shape, size, location, and construction of these components are not subject to change. Figure 10 , Figure 11 As well as the limitations of the accompanying figures below.

[0136] The second housing 47 serves as a carrier for the various components within the second speaker unit 4b, protecting the second diaphragm assembly 48, reed 4b1, transmission rod 4b2, second magnetic circuit system 49, and second voice coil 4b3, among others. Furthermore, the second speaker unit 4b is fixedly connected to the first speaker unit 4a via the second housing 47.

[0137] Please refer to Figures 10-11The second housing 47 is generally formed into a cubic structure. A second sound outlet 402 is formed on the second housing 47, through which the sound of the second speaker unit 4b can be emitted. In some embodiments, the second housing 47 is provided with a sound outlet tube 4b4, which is a hollow structure, and a sound outlet channel 4b41 communicating with the second sound outlet 402 is formed inside the sound outlet tube 4b4. In this way, the sound signal of the second speaker unit 4b can be transmitted to the sound outlet 110 through the sound outlet channel 4b41, thereby shortening the distance between the second speaker module 4 and the sound outlet 110 when the speaker module 4 is assembled into the earphone 100. This helps to reduce the sound interference between the first speaker unit 4a and the second speaker unit 4b, and improves the sound quality of the speaker module 4. It is understood that in other embodiments, the second speaker unit 4b may not include the sound outlet tube 4b4.

[0138] In some embodiments, the sound outlet tube 4b4 and the second housing 47 are integrally formed, meaning that the sound outlet tube 4b4 and the second housing 47 are a single-piece structure. This improves the connection strength between the sound outlet tube 4b4 and the second housing 47, simplifies the structure of the second speaker unit 4b, and reduces assembly difficulty. In other embodiments, the sound outlet tube 4b4 and the second housing 47 can also be separate structures, with the sound outlet tube 4b4 attached to the second housing 47 by means of adhesive bonding, snap-fitting, threaded connection, or other methods.

[0139] For the convenience of the description of the embodiments below, an XYZ coordinate system is established. Specifically, the width direction of the second housing 47 is defined as the X-axis direction, the length direction of the second housing 47 is defined as the Y-axis direction, and the height direction of the second housing 47 is defined as the Z-axis direction. It is understood that the coordinate system can be flexibly set according to actual needs, and no specific limitation is made here.

[0140] Please refer to the following: Figures 10-12 , Figure 12 for Figure 6a The diagram shows a cross-sectional view of the speaker module 4. The second housing 47 has a first outer surface 471 located within the first groove 4321a, with the first outer surface 471 facing the bottom wall of the first groove 4321a. In some embodiments, the second speaker unit 4b is attached and fixed to the bottom wall of the first groove 4321a by means of the first outer surface 471. Specifically, the first outer surface 471 can be connected to the bottom wall of the first groove 4321a by means of adhesive, laser welding, screw fixing, etc. It is understood that in other embodiments, the speaker unit 4b can also be fixed to the inner peripheral wall of the first groove 4321a by means of other outer surfaces.

[0141] In some embodiments, the first outer surface 471 is parallel to the bottom wall of the first groove 4321a. This increases the contact area between the first outer surface 471 and the bottom wall of the first groove 4321a, thereby improving the connection strength between the second speaker unit 4b and the first speaker unit 4a.

[0142] In this embodiment, the second speaker unit 4b is placed vertically within the first groove 4321a. That is, the height direction of the second speaker unit 4b is aligned with the extension direction of the central axis O of the first speaker unit 4a. This reduces the size of the second speaker unit 4b in the radial direction of the first speaker unit 4a and reduces the space occupied by the second speaker 4b in the plane perpendicular to the central axis of the first speaker unit 4a. When the speaker module 4 is assembled into the earphone 100, interference between the first speaker unit 4a and other structures within the earphone 100 can be avoided, making it easier to assemble the speaker module 4 within the space-constrained earphone 100.

[0143] It is understood that in other embodiments, the second speaker unit 4b may also be placed horizontally within the first groove 4321a. That is, the height direction of the second speaker unit 4b is perpendicular to the extension direction of the central axis O of the first speaker unit 4a.

[0144] Please see Figure 12 The second speaker unit 4b is provided with an electrical connection terminal 4b5, which includes a positive terminal and a negative terminal. The electrical connection terminal 4b5 is used to realize the electrical connection between the second voice coil 4b3 and the main board 2. The electrical connection terminals of the second speaker unit 4b are disposed on the outer surfaces of the second speaker unit 4b other than the first outer surface 471.

[0145] exist Figures 10-12 In the illustrated embodiment, the first outer surface 471 is the bottom surface of the second speaker unit 4b, and the electrical connection terminal 4b5 is disposed on the side surface of the second speaker unit 4b. It is understood that in other embodiments where the second speaker unit 4b is vertically placed within the first groove 4321a, the electrical connection terminal 4b5 may also be disposed on the top surface of the second speaker unit 4b. It should be noted that in this application, "the bottom surface of the second speaker unit 4b" refers to one side surface in the height direction of the second speaker unit 4b; the surface opposite to the bottom surface is the top surface of the second speaker unit 4b; and the surface between the bottom and top surfaces is the side surface of the second speaker unit 4b.

[0146] Therefore, by placing the electrical connection terminal 4b5 on other outer surfaces besides the first outer surface 471, on the one hand, the dimension h0 of the second speaker unit 4b in the direction extending along the central axis of the first speaker unit 4a can be reduced, thereby reducing the height h of the speaker module 4. This facilitates the assembly of the speaker module 4 into the space-constrained headphone 100, which is beneficial for achieving a miniaturized and refined design of the headphone 100. On the other hand, it reduces the difficulty of electrical connection between the electrical connection terminal 4b5 and the motherboard 2, which is beneficial for improving assembly efficiency. Furthermore, it can also increase the contact area between the first outer surface 471 and the bottom wall of the first groove 4321a, improving the connection strength and preventing the electrical connection terminal 4b5 from interfering with the connection between the first outer surface 471 and the bottom wall of the first groove 4321a.

[0147] In some embodiments, after the electrical connection terminals 4b5 of the second speaker unit 4b are disposed on an outer surface adjacent to or opposite to the first outer surface 471, the dimension of the second speaker unit 4b in the direction extending along the central axis of the first speaker unit 4a can be reduced by about 1.5 mm, thereby reducing the total height of the speaker module 4 by about 1.5 mm. Thus, the height of the second speaker unit 4b can be less than or equal to 4.5 mm, which is beneficial for further reducing the total height of the speaker module 4. For example, the height of the second speaker unit 4b can be 4.5 mm, 4.4 mm, 4.3 mm, 4.2 mm, 4.1 mm, 4.0 mm, 3.8 mm, etc.

[0148] Based on the above embodiments, in order to further reduce the difficulty of electrical connection between electrical connection terminal 4b5 and motherboard 2, please refer to... Figure 12 The electrical connection terminal 4b5 is located outside the first groove 4321a. That is, the side surface of the electrical connection terminal 4b5 near the bottom wall of the first groove 4321a is flush with the groove opening of the first groove 4321a, or it is located on the side of the groove opening of the first groove 4321a away from the bottom wall.

[0149] The material of the second housing 47 includes, but is not limited to, metal, plastic, and a combination of metal and plastic. In some embodiments, the material of the second housing 47 is plastic, which is low in cost and easy to mold, thus reducing the processing cost of the second speaker unit 4b. In other examples, in order to reduce magnetic interference between the first magnetic circuit system 46 and the second magnetic circuit system 49, the material of the second housing 47 can be a magnetically conductive component. For example, the material of the second housing 47 can be low-carbon steel or other metals with magnetic shielding properties.

[0150] The second housing 47 can be a single structural unit or assembled from multiple parts. In some embodiments, please refer to [further details]. Figure 11The second housing 47 includes a first housing portion 47a and a second housing portion 47b. The second housing 47 is formed by assembling the first housing portion 47a and the second housing portion 47b. This facilitates the separate processing of the first housing portion 47a and the second housing portion 47b, simplifies the mold structure of the first housing portion 47a and the second housing portion 47b, reduces the molding difficulty of the first housing portion 47a and the second housing portion 47b, and thus reduces the processing and manufacturing difficulty of the second housing 47.

[0151] Please see Figure 11 The second diaphragm assembly 48 is disposed within the second housing 47. (See also...) Figure 12 The vibration direction of the second diaphragm assembly 48 is perpendicular to the vibration direction of the first diaphragm assembly 44. Specifically, the vibration direction of the first diaphragm assembly 44 is parallel to the Z-axis, and the vibration direction of the second diaphragm assembly 48 is parallel to the X-axis. The second speaker unit 4b divides the space within the second housing 47 into a second front cavity D1 and a second rear cavity D2 by means of the second diaphragm assembly 48.

[0152] Please see Figure 13 , Figure 13 for Figure 10 The image shows a perspective view of the second diaphragm assembly 48 of the second speaker unit 4b. The second diaphragm assembly 48 includes a second connecting portion 481, a second surround 482, and a second dome 483. The second connecting portion 481 is a rounded rectangular ring. (See also...) Figure 14 , Figure 14 for Figure 11 An enlarged view of region C. A stepped portion 473 is provided on the inner circumferential surface of the second housing 47, and a second connecting portion 481 is stacked on the stepped portion 473. The connection between the second connecting portion 481 and the stepped portion 473 includes, but is not limited to, adhesive bonding. Of course, in some other examples, the second housing 47 may not have the stepped portion 473, but instead has an annular cylindrical flange structure on the outer edge of the second connecting portion 481, which connects to the inner circumferential surface of the second housing 47 to fix the second diaphragm assembly 48 inside the second housing 47.

[0153] The second fold ring 482 is disposed on the outer periphery of the second dome 483 and surrounded by the second connecting portion 481. The second fold ring 482 is a rounded rectangular ring. The second fold ring 482 is recessed towards the side closer to the second rear cavity D2 to form an arc-shaped or approximately arc-shaped cross-section. This arrangement can save space in the second front cavity D1. Of course, this application is not limited to this. In other embodiments, the second fold ring 482 may also be recessed towards the side closer to the first front cavity C1 to form an arc-shaped or approximately arc-shaped cross-section.

[0154] The second dome, 483, is rectangular in shape. (See also...) Figure 13The length direction of the second dome 483 is parallel to the Z-axis, the width direction of the second dome 483 is parallel to the Y-axis, and the thickness direction of the second dome 483 is parallel to the X-axis.

[0155] In some examples, the second diaphragm assembly 48 can be a single-piece molded component. That is, the second connecting portion 481, the second folded ring 482, and the second dome 483 are integrally molded and connected as a whole. This configuration not only simplifies the manufacturing process and reduces production costs, but also improves the connection strength between the second connecting portion 481 and the second folded ring 482, as well as between the second folded ring 482 and the second dome 483. Of course, this application is not limited to this. In other embodiments, the second connecting portion 481, the second folded ring 482, and the second dome 483 can also be manufactured independently and then connected by means of adhesive bonding or other methods.

[0156] Please continue reading. Figure 11 The reed 4b1 is disposed within the second rear cavity D2 of the second speaker unit 4b and is used to provide driving force for the vibration of the second diaphragm assembly 48. The material of the reed 4b1 includes, but is not limited to, metal.

[0157] Please see Figure 15 , Figure 15 for Figure 11 The diagram shows the structure of the reed 4b1 of the second speaker unit 4b. The reed 4b1 includes a first plate 4b11, a second plate 4b12, and a connecting plate 4b13.

[0158] The first sheet 4b11 is rectangular in shape. The first sheet 4b11 is arranged parallel to the second diaphragm assembly 48. The second sheet 4b12 is rectangular in shape. The second sheet 4b12 is arranged parallel to the second diaphragm assembly 48, and the second sheet 4b12 is located on the side of the first sheet 4b11 away from the second diaphragm assembly 48. The second sheet 4b12 may have the same dimensions as the first sheet 4b11.

[0159] The second piece 4b12 has a support 4b14 extending beyond the edge of the first piece 4b11 at one end, and the support 4b14 is triangular in shape. In some examples, the support 4b14 and the second piece 4b12 can be integrally molded, that is, the support 4b14 and the second piece 4b12 are connected to form a single structural unit. In other examples, the support 4b14 and the second piece 4b12 can be connected by means of adhesive, snap-fit, welding, or threaded connection.

[0160] The shape of the connecting piece 4b13 includes, but is not limited to, "C" and "V" shapes. The connecting piece 4b13 is connected between the end of the second piece 4b12 away from the support 4b14 and the end of the first piece 4b11 away from the support 4b14.

[0161] The spring 4b1 can be a single molded part. That is, the first piece 4b11, the second piece 4b12, and the connecting piece 4b13 are connected as a whole. This arrangement not only simplifies the manufacturing process and reduces production costs, but also improves the connection strength between the first piece 4b11 and the connecting piece 4b13, as well as between the second piece 4b12 and the connecting piece 4b13. Of course, this application is not limited to this. In other embodiments, the first piece 4b11, the second piece 4b12, and the connecting piece 4b13 can also be manufactured independently and then connected by means of gluing or welding.

[0162] Please continue reading. Figure 11 The transmission rod 4b2 is rod-shaped and connects the support body 4b14 and the second dome 483. The transmission rod 4b2 is perpendicular to the second sheet body 4b12. Through the connection of the transmission rod 4b2, the vibration of the reed 4b1 can be transmitted to the second diaphragm assembly 48, thereby causing the second speaker unit 4b to produce sound.

[0163] The material of the transmission rod 4b2 includes, but is not limited to, metal or rigid plastic. The connection method between the transmission rod 4b2 and the second sheet 4b12 includes, but is not limited to, adhesive bonding, welding, snap-fitting, or threaded connection. The connection method between the transmission rod 4b2 and the second diaphragm assembly 48 includes, but is not limited to, adhesive bonding, welding, snap-fitting, or threaded connection.

[0164] Please see Figure 16 and combined Figure 11 , Figure 16 for Figure 11 The diagram shows the structure of the second magnetic circuit system 49 of the second speaker unit 4b. The second magnetic circuit system 49 is located within the second rear cavity D2 of the second speaker unit 4b. The second magnetic circuit system 49 includes a magnetically conductive part 491 and two magnet parts 492.

[0165] The magnetic guide portion 491 is rectangular and annular. The axis of the magnetic guide portion 491 is the same as the axis of the second speaker unit 4b. The first sheet 4b11 is supported on one side surface of the magnetic guide portion 491 adjacent to the second diaphragm assembly 48. The connection between the first sheet 4b11 and the magnetic guide portion 491 includes, but is not limited to, adhesive bonding or snap-fitting.

[0166] Two magnet portions 492 are disposed within the magnetically conductive portion 491 and are arranged opposite to each other. The shape of the magnet portions 492 includes, but is not limited to, a cuboid, a cylinder, or an irregular shape. The magnetization directions of the two magnet portions 492 are opposite. For an example, please refer to [reference needed]. Figure 11For ease of description, one of the two magnet portions 492 is referred to as "first magnet portion 492a", and the other magnet portion 492 is referred to as "second magnet portion 492b". The end of the first magnet portion 492a closest to the second magnet portion 492b is the S pole, and the end of the first magnet portion 492a furthest from the second magnet portion 492b is the N pole. The end of the second magnet portion 492b closest to the first magnet portion 492a is the N pole, and the end of the second magnet portion 492b furthest from the first magnet portion 492a is also the N pole. In this way, a magnetic circuit can be formed between the first magnet portion 492a and the second magnet portion 492b.

[0167] Please continue reading. Figure 12 The second piece 4b12 extends from one axial end of the magnetic conductive part 491 to the other axial end of the magnetic conductive part 491 so that the support 4b14 is located outside the magnetic conductive part 491, and the second piece 4b12 is located between the two magnet parts 492.

[0168] The second voice coil 4b3 is located on one side of the magnetic conductor 491 adjacent to the connecting plate 4b13 in the axial direction, and the second voice coil 4b3 surrounds the outer periphery of the second plate 4b12.

[0169] When the second voice coil 4b3 is energized, it generates a magnetic field, which magnetizes the second plate 4b12 located within it, creating magnetic poles. This creates a driving force between the second voice coil 4b3 and the magnet portion 492, causing the second plate 4b12 to vibrate along the interval between the two magnet portions 492. The vibration of the second plate 4b12 drives the transmission rod 4b2 to vibrate, which in turn drives the second diaphragm assembly 48 to vibrate. The vibration of the second diaphragm assembly 48 then vibrates the air, generating sound waves that are emitted from the second sound outlet 402.

[0170] In some embodiments, please refer to Figures 17a-17b , Figure 17a A perspective view of the speaker module 4 provided in other embodiments of this application. Figure 17b for Figure 17a The speaker module 4 shown is a cross-sectional view.

[0171] In this embodiment, the speaker module 4 and Figure 6a The difference between the speaker module 4 shown in this embodiment and the speaker module 4 is that the speaker module 4 in this embodiment, in addition to including Figure 6aIn addition to the first speaker unit 4a and the second speaker unit 4b, the speaker module 4 shown also includes a microphone unit 4c. The microphone unit 4c, also referred to as a "microphone" or "voice transducer," is used to convert sound signals into audio electrical signals. For example, when the earbuds of an earphone are used as an audio input device for an electronic device, the microphone unit 4c can capture the user's voice signal and convert it into an audio electrical signal during the user's speech (such as during a phone call or sending a voice message).

[0172] Please see Figures 17a-17b The microphone unit 4c is fixed to the second speaker unit 4b. Exemplarily, the microphone unit 4c can be fixed to the second speaker unit 4b by means of adhesive bonding, welding (e.g., laser welding), screw connection, etc. It is understood that in other embodiments, the microphone unit 4c can also be fixed to the first speaker unit 4a. Therefore, by integrating the microphone unit 4c onto the speaker module 4, the function of the speaker module 4 is diversified, which is beneficial to improving the noise reduction performance of the earphone 100. Furthermore, during assembly, the microphone unit 4c, the first speaker unit 4a, and the second speaker unit 4b can be assembled as a whole into the earphone 100, simplifying the assembly steps and improving assembly efficiency.

[0173] For details, please refer to Figure 17a The microphone unit 4c is fixed to the side of the second housing 47 and positioned near the second sound outlet 402. This facilitates the microphone unit 4c in collecting sound signals. In this embodiment, the thickness direction of the microphone unit 4c can be perpendicular to the side of the second housing 47. In other embodiments, the thickness direction of the microphone unit 4c can be parallel to the side of the second housing 47.

[0174] In this embodiment, the microphone unit 4c and the electrical connection terminal 4b5 are located on different sides of the second housing 47. This avoids interference between the microphone unit 4c and the electrical connection terminal 4b5.

[0175] Based on the above embodiments, please refer to Figures 18a-18b , Figure 18a This is a cross-sectional view of the second speaker unit 4b in the speaker module 4 provided in some other embodiments of this application. Figure 18b for Figure 18a The diagram shows the assembly structure of the second speaker unit 4b and the microphone unit 4c. In this embodiment, the second speaker unit 4b and... Figure 17a The difference in the second speaker unit 4b shown is that, in this embodiment, the outer surface of the second speaker unit 4b is recessed inward to form a third groove 4b6. For details, please refer to... Figure 18a The sidewall of the second housing 47 is recessed inward to form a third groove 4b6. (See also...) Figure 18bAt least a portion of the microphone unit 4c can be fixed within the third groove 4b6. This allows for a more compact structure of the speaker module 4, which helps to reduce the overall size of the speaker module 4.

[0176] In some embodiments, please refer to Figures 19a-19b , Figure 19a A perspective view of the speaker module 4 provided in other embodiments of this application. Figure 19b for Figure 19a The speaker module 4 shown is a cross-sectional view. In this embodiment, the speaker module 4 is... Figure 17a The difference in the speaker module 4 shown is that, in this embodiment, the microphone unit 4c of the speaker module 4 is fixed to the first speaker unit 4a. Specifically, the microphone unit 4c can be fixed within the first groove 4321a. For example, the microphone unit 4c can be fixed within the first groove 4321a by means of adhesive bonding, welding (e.g., laser welding), screw connection, etc. This also simplifies the assembly steps and improves assembly efficiency.

[0177] It is understood that in other embodiments, the microphone unit 4c may not be integrated onto the speaker module 4, but rather exist independently of the speaker module 4. See also... Figure 19c , Figure 19c This application provides some assembly diagrams of the speaker module 4 and the earphone 100. In this embodiment, the microphone unit 4c is fixed inside the earphone 100 at a distance from the speaker module 4, and the microphone unit 4c is positioned close to the sound outlet 110 of the earphone 100.

[0178] In some embodiments, please refer to Figures 20a-20b , Figure 20a A cross-sectional view of the first speaker unit 4a provided in some other embodiments of this application. Figure 20b for Figure 20a A perspective view of the first diaphragm assembly 44 of the first loudspeaker unit 4a shown in the figure. The first loudspeaker unit 4a in this embodiment and... Figure 9a The difference between the first speaker unit 4a shown in the figure is that the structure of the first diaphragm assembly 44 of the first speaker unit 4a in this embodiment is different from that of the first speaker unit 4a in the figure. Figure 9a The structure of the first diaphragm assembly 44 of the first loudspeaker unit 4a shown is different.

[0179] Specifically, Figure 9a In the embodiment shown, the first dome 443 of the first diaphragm assembly 44 in the first speaker unit 4a is a planar dome. Figure 20aIn the illustrated embodiment, the surface of the first diaphragm assembly 44 facing the first cover plate 4321 is recessed in a direction away from the first cover plate 4321 to form a second groove 444, and the vibration center of the first diaphragm assembly 44 is located within the second groove 444. Optionally, the vibration center of the first diaphragm assembly 44 is located on the central axis O3 of the second groove 444. It should be noted that the "vibration center of the first diaphragm assembly 44" mentioned in this application refers to the position where the amplitude of the first diaphragm assembly 44 is the largest. In this embodiment, the vibration center of the first diaphragm assembly 44 coincides with the geometric center of the first dome 443. This avoids interference between the first diaphragm assembly 44 and the first groove 4321a during vibration, prevents the first groove 4321a from affecting the amplitude of the first diaphragm assembly 44, and helps to increase the amplitude of the first diaphragm assembly 44, thereby increasing the frequency response of the first speaker module 4 and improving the sound quality of the first speaker unit 4a.

[0180] In some embodiments, the orthographic projection of the second groove 444 on the first diaphragm assembly 44 coincides with the orthographic projection of the first groove 4321a on the first diaphragm assembly 44, or the orthographic projection of the second groove 444 on the first diaphragm assembly 44 is located within the orthographic projection of the first groove 4321a on the first diaphragm assembly 44. This effectively avoids interference between the first diaphragm assembly 44 and the first groove 4321a during vibration.

[0181] In this embodiment, to avoid interference between the first diaphragm assembly 44 and the first magnetic circuit system 46 during vibration, please refer to... Figure 20a The first magnetic circuit system 46 is provided with a clearance hole 463, which is formed as a through hole penetrating both ends of the first magnetic circuit system 46 along its axial direction. For details, please refer to [link / reference]. Figure 20c , Figure 20c for Figure 20a The exploded view shows the first magnetic circuit system 46 in the first speaker unit 4a shown. The clearance hole 463 includes a first clearance hole 4631 and a second clearance hole 4362. The first clearance hole 4631 passes through both axial ends of the central magnetic yoke 462, and the second clearance hole 4362 passes through both axial ends of the first central magnet 461. The first clearance hole 4631 and the second clearance hole 4362 are connected. This simplifies the manufacturing process of the first magnetic circuit system 46 and reduces the manufacturing difficulty.

[0182] In some embodiments, the orthographic projection of the second groove 444 on the first diaphragm assembly 44 coincides with the orthographic projection of the clearance hole 463 on the first diaphragm assembly 44, or the orthographic projection of the second groove 444 on the first diaphragm assembly 44 is located within the orthographic projection of the clearance hole 463 on the first diaphragm assembly 44. This effectively prevents interference between the first diaphragm assembly 44 and the first magnetic circuit system 46 during vibration.

[0183] Based on this, please refer to Figure 20aThe frame 431 has a leakage hole 431a, which communicates with the clearance hole 463. Specifically, the leakage hole 431a is formed on the first bottom wall 4311a of the frame 431. In this way, the leakage hole 431a connects the first rear cavity C2 with the outside of the first rear cavity C2, thereby achieving air pressure balance between the internal space and the external space of the first rear cavity C2, which facilitates the vibration of the first diaphragm 420a and helps improve sound quality.

[0184] For further information, please refer to [link / reference]. Figure 20a The frame 431 is provided with a second damping element 431b, which covers the leakage hole 431a. Specifically, the second damping element 431b can be bonded or welded to the outer surface of the first bottom wall 4311a. The second damping element 431b can be a damping mesh or a damping membrane, but is not limited to these. In this way, by covering the leakage hole 431a with the second damping element 431b, the acoustic impedance can be increased, thereby improving the audio performance of the first speaker unit 4a. It is understood that in other embodiments, the leakage hole 431a can also be provided at other locations on the frame 431, as long as the communication between the inner and outer spaces of the first rear cavity C2 can be achieved. Alternatively, the frame 431 may not have a leakage hole 431a.

[0185] In some embodiments, please refer to Figures 21a-21b , Figure 21a A perspective view of the speaker module 4 provided in other embodiments of this application. Figure 21b for Figure 21a The speaker unit shown is a cross-sectional view. In this embodiment, speaker module 4 and... Figure 6a The difference in the speaker module 4 shown is that, in this embodiment, the second speaker unit 4b is placed horizontally within the first groove 4321a. Figure 6a The second speaker unit 4b in the speaker module 4 shown is vertically placed within the first groove 4321a. That is, in this embodiment, the vibration direction of the second diaphragm assembly 48 of the second speaker unit 4b is consistent with the vibration direction of the first diaphragm assembly 44 of the first speaker unit 4a. Figure 6a In the speaker module 4 shown, the vibration direction of the second diaphragm group 48 of the second speaker unit 4b is perpendicular to the vibration direction of the first diaphragm group 44 of the first speaker unit 4a. Thus, by placing the second speaker unit 4b horizontally within the first groove 4321a, the overall height of the speaker module 4 can be reduced. In this embodiment, the specific positions of the first groove 4321a on the first cover plate 4321 and the specific positions of the second speaker unit 4b within the first groove 4321a can also be adjusted according to actual assembly needs to avoid interference between the speaker module 4 and other structures within the earphone 100.

[0186] Please see Figure 21b One side of the second housing 47 forms the first outer surface 471 of the second speaker unit 4b, and the electrical connection terminal 4b5 of the second speaker unit 4b is disposed on the outer surface opposite to the first outer surface 471. The electrical connection terminal 4b5 and the second sound outlet 402 are formed on the same surface of the second speaker unit 4b. It can be understood that in other embodiments in which the second speaker unit 4b is horizontally placed in the first recess 4321a, the electrical connection terminal 4b5 may also be disposed on the top or bottom surface of the second speaker unit 4a.

[0187] exist Figures 21a-21b In the illustrated embodiment, the vibration center axis of the second diaphragm group 48 coincides with the vibration center axis of the first diaphragm group 44. The "vibration center axis of the first diaphragm group 44" mentioned in this application is a straight line passing through the vibration center of the first diaphragm group 44 and perpendicular to it, wherein the vibration center of the first diaphragm group 44 is the position where its amplitude is maximum. The "vibration center axis of the second diaphragm group 48" is a straight line passing through the vibration center of the second diaphragm group 48 and perpendicular to it, wherein the vibration center of the second diaphragm group 48 is the position where its amplitude is maximum. For details, please refer to... Figure 21b In this embodiment, the vibration center of the first vibration module coincides with the geometric center of the first dome 443, and the vibration center of the second diaphragm group 48 is the intersection of the central axis O4 of the transmission rod 4b2 and the second dome 483. The vibration center axis of the second diaphragm group 48 coincides with the central axis O4 of the transmission rod 4b2. In this embodiment, the central axis O4 of the transmission rod 4b2 coincides with the vibration center axis of the first diaphragm group 44.

[0188] In this way, by aligning the vibration center axis of the second vibration module with the vibration center axis of the first diaphragm group 44, the acoustic path of the first speaker unit 4a and the acoustic path of the second speaker unit 4b can be made highly similar. This effectively avoids the mutual interference between the sound wave resonance peaks output by the first speaker unit 4a and the second speaker unit 4b caused by the different acoustic path structures. It is beneficial to reduce phase distortion and phase aberration, and can achieve a better effect of combining the two speaker units, thereby improving the overall sound quality of the speaker module 4.

[0189] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0190] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A speaker module, characterized by The loudspeaker comprises: a first loudspeaker unit comprising a first housing and a first diaphragm group, the first diaphragm group being arranged in the first housing and separating the first housing into a first front cavity and a first rear cavity, the first housing comprising a first cover plate opposite to the first diaphragm group, the first cover plate and the first diaphragm group defining the first front cavity therebetween, the first cover plate having a first groove recessed towards the first diaphragm group on an outer surface thereof, and the first cover plate having a first sound hole; a second loudspeaker unit located on a side of the first cover plate away from the first front cavity, the second loudspeaker unit being horizontally arranged in the first groove, a height direction of the second loudspeaker unit being perpendicular to an extension direction of a central axis of the first loudspeaker unit, a size of the second loudspeaker unit in a depth direction of the first groove being greater than a depth of the first groove, and a size of the second loudspeaker unit in the depth direction of the first groove being less than a height of the second loudspeaker unit; the second loudspeaker unit comprising a second housing and a second diaphragm group, the second diaphragm group being arranged in the second housing, a vibration direction of the second diaphragm group being consistent with a vibration direction of the first diaphragm group, and a vibration central axis of the second diaphragm group being coincident with a vibration central axis of the first diaphragm group; the second loudspeaker unit comprising a second sound hole, a sound emission direction of the second sound hole being consistent with a sound emission direction of the first sound hole.

2. The speaker module of claim 1, wherein, a side surface of the first diaphragm group facing the first cover plate is provided with a second groove recessed towards the first rear cavity, and a vibration center of the first diaphragm group is located in the second groove.

3. The speaker module of claim 1, wherein, the second loudspeaker unit has a first outer surface located in the first groove and facing a groove bottom wall of the first groove, and electrical connection terminals of the second loudspeaker unit are arranged on other outer surfaces of the second loudspeaker unit except the first outer surface.

4. The speaker module of claim 3, wherein, the electrical connection terminals of the second loudspeaker unit are located outside the first groove as a whole.

5. The loudspeaker module of any one of claims 1-4, wherein, the first cover plate is a magnetic conductive member.

6. The loudspeaker module of any one of claims 1-4, wherein, an air passage is formed in the first diaphragm group, the air passage being in communication with the first front cavity and the first rear cavity.

7. The speaker module of claim 6, wherein, a first damping member is further arranged on the first diaphragm group, the first damping member covering the air passage.

8. The speaker module of claim 6, wherein, a hole diameter of the air passage is less than or equal to 1.0 mm.

9. The loudspeaker module of any one of claims 1-4, 7, 8, wherein, a central axis of the first sound hole is coincident with a central axis of the second sound hole.

10. The loudspeaker module of any one of claims 1-4, 7, 8, wherein, the second loudspeaker unit comprises a second housing, a second diaphragm group, a reed, a transmission rod, a second magnetic circuit system and a second voice coil, the second diaphragm group being arranged in the second housing to divide a space in the second housing into a second front cavity and a second rear cavity, the reed, the transmission rod, the second magnetic circuit system and the second voice coil being located in the second rear cavity, the transmission rod being fixed to the second diaphragm group, the reed, the transmission rod, the second magnetic circuit system and the second voice coil cooperating to drive the second diaphragm group to vibrate, and a vibration central axis of the second diaphragm group being coincident with a central axis of the transmission rod.

11. The loudspeaker module of any one of claims 1-4, 7, 8, wherein, An outer surface of the second speaker unit is provided with a sound outlet pipe, and the sound outlet pipe has a sound outlet channel in communication with the second sound outlet hole.

12. The loudspeaker module of any one of claims 1-4, 7, 8, wherein, The second speaker unit is further provided with a microphone unit fixed on the second speaker unit or the first speaker unit.

13. The speaker module of claim 12, wherein, An outer surface of the second speaker unit is inwardly recessed to form a third recess, and at least a part of the microphone unit is accommodated in the third recess.

14. An earphone, characterized by The application further relates to a speaker module and a mobile phone. The shell comprises a front shell and a rear shell, the front shell is provided with a first accommodating cavity, and the front shell is provided with a sound outlet hole in communication with the first accommodating cavity; the rear shell comprises a cover body and a rod body connected to each other, the cover body is connected to the front shell, the cover body is provided with a second accommodating cavity, and the second accommodating cavity is in communication with the first accommodating cavity to jointly form a containing space; The speaker module is the speaker module according to any one of claims 1-13, the speaker module is arranged in the shell, and sound signals generated by the first speaker unit and the second speaker unit are output through the sound outlet hole. A main board is arranged in the second accommodating cavity, and the speaker module is electrically connected to the main board. A battery is arranged in the containing space, the speaker module is arranged on a side of the battery close to the sound outlet hole, the battery and the main board are arranged in a stack mode, and the battery is arranged on a side of the main board close to the first accommodating cavity.

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