Electroplating apparatus and method for flexible electrodes

Abstract

The present application relates to the technical field of medical devices, and particularly relates to a plating device and method for flexible electrodes, which comprises: a first inner groove, a bottom plate of the bottom of which is provided with a plurality of through holes; the first inner groove is filled with liquid metal, a cathode panel is placed in the liquid metal and connected to a negative electrode; a second inner groove is located below the first inner groove, and is internally filled with plating solution, an anode panel is placed in the plating solution and connected to a positive electrode; an electrode to be plated passes through the through holes, and has a part to be plated at the lower end, the part to be plated is immersed in the plating solution and connected to the plating solution and the anode panel, and the upper end of the electrode to be plated is immersed in the liquid metal and connected to the cathode panel through the liquid metal. The beneficial effect is that the first inner groove filled with liquid metal and the second inner groove filled with plating solution are used in combination, so that the flexible electrode can be selectively partially plated, the uniformity of the electrical conductivity of the small flexible electrode is improved when no auxiliary common connection electrode is made, and the electrical conductivity of the electrode is uniformly controllable.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of medical devices, in particular to a plating device and method for flexible electrodes. BACKGROUND

[0002] Deep brain stimulation (DBS), superficial brain stimulation cortex electroencephalogram (ECoG) array, etc., are to activate deep and superficial neurons of the brain by stimulating electrodes to stimulate the corresponding brain area, correct or inhibit abnormal discharge of the brain, reduce disease symptoms, or record and extract activity signals of the brain, and through computer algorithm processing, realize the movement control of mechanical arms, wheelchairs and corresponding objects by thought, etc.

[0003] The electrode material of the invasive probe is a relatively stable metal such as platinum-titanium alloy, platinum-iridium alloy, stainless steel, tungsten wire, and a probe formed thereof. The elastic modulus of metals and semiconductor materials such as platinum, tungsten and silicon is much greater than that of nerve tissue, and the texture is hard. Long-term implantation into brain tissue leads to scar formation. It affects the accuracy of electrode stimulation and signal acquisition. With the development of technology, flexible electrodes based on flexible film and flexible circuit have emerged. Flexible film electrodes are soft, have good biocompatibility, reduce scar caused by brain tissue shear damage, and enable the electrode to be used for a relatively long period of time. As a stable and reliable material, it is a good electrode material that has been used by people for a long time and has undergone clinical trials. The flexible microelectrode is currently a sheet-shaped electrode formed of flexible PI (polyimide). Although it is flexible, the elastic modulus in the width direction is still relatively large, and it is also easy to cause brain tissue damage and scar formation.

[0004] The existing electro-growth technology does not have a better electrical contact method for plating small and flexible electrodes. Some micro-particle plating methods can only form a plating layer on the entire surface of the micro-particle. It cannot selectively form a metal or alloy wrapping layer on the part that needs to be plated, and cannot guarantee the uniformity of the electro-grown metal (alloy). SUMMARY

[0005] Based on the existing problems, the present application provides a plating device and method for flexible electrodes, which aims to solve the technical problems that the prior art cannot achieve selective plating of small and flexible electrodes, especially when it is not convenient to make auxiliary common connection electrodes, and the plating clamping and uniform plating of microelectrodes.

[0006] A plating device for flexible electrodes is used to grow a plating layer on the plating part of the electrode to be plated to form a flexible electrode, comprising:

[0007] A first inner groove, a bottom plate is fixed to the bottom surface of the first inner groove, and a plurality of through holes are formed in the bottom plate;

[0008] The first inner groove is filled with liquid metal, and a cathode panel is placed in the liquid metal, and the cathode panel is connected to the negative pole of the power supply through a wire protected by an insulating layer;

[0009] The second inner groove is located below the first inner groove, and the second inner groove is filled with electroplating liquid, and an anode panel is placed in the electroplating liquid;

[0010] The anode panel is connected to the positive pole of the power supply through a wire protected by an insulating layer;

[0011] The to-be-electroplated electrode passes through the through hole, the lower end of the to-be-electroplated electrode has the to-be-electroplated part, the to-be-electroplated part is immersed in the electroplating liquid and is connected to the anode panel through the electroplating liquid, and the upper end of the to-be-electroplated electrode is immersed in the liquid metal and is connected to the cathode panel through the liquid metal.

[0012] Further, the top end of the first inner groove is provided with a sealing cover plate, and the sealing cover plate seals the top end of the first inner groove;

[0013] The space above the liquid level of the liquid metal in the first inner groove is filled with inert gas.

[0014] Further, the bottom plate is a fluorine rubber plate;

[0015] The diameter of the through hole is smaller than the diameter of the to-be-electroplated electrode;

[0016] The bottom plate is fixed to the bottom surface of the first inner groove by a pressing frame.

[0017] Further, it further comprises a first outer groove, and the first outer groove is embedded in the first inner groove;

[0018] The bottom surface of the first outer groove is provided with an opening, and the opening of the bottom surface of the first outer groove exposes the through hole to the bottom surface of the first outer groove;

[0019] The top end of the first outer groove is provided with a first outer groove upper cover.

[0020] Further, a first temperature adjusting device is arranged between the first outer groove and the first inner groove, and the first temperature adjusting device is used to control the liquid metal to be in a first temperature state.

[0021] Further, it further comprises a second outer groove, and the second outer groove is embedded in the second inner groove;

[0022] A liquid is injected between the second outer groove and the second inner groove, and a second temperature adjusting device is arranged;

[0023] The second temperature adjusting device is used to adjust the temperature of the liquid to control the electroplating liquid to be in a second temperature state.

[0024] Further, the top end of the second outer groove is provided with a second outer groove upper cover;

[0025] A plurality of through holes are arranged on the second outer groove upper cover for the electrodes to be plated to pass through.

[0026] Further, an acid-base sensor is arranged in the plating solution.

[0027] Further, the plating layer is platinum, gold, silver, platinum-iridium alloy or platinum-titanium alloy.

[0028] A plating method of a flexible electrode, using the plating device of the flexible electrode as described above, comprising the following steps:

[0029] Step A1, the first inner groove is turned over and placed on a platform, so that the bottom surface of the first inner groove faces upward, and the through holes are inserted with the electrodes to be plated;

[0030] Step A2, the first inner groove is turned over again, so that the top end of the first inner groove faces upward, and the cathode panel is placed horizontally in the liquid metal after the liquid metal is injected into the first inner groove;

[0031] Step A3, the first inner groove is located above the second inner groove filled with the plating solution, and the part to be plated of the lower end of the electrode to be plated is ensured to be immersed in the plating solution;

[0032] Step A4, the cathode panel is connected to the negative pole of the power supply through the insulating wire, and the anode panel located in the plating solution is connected to the positive pole of the power supply through the insulating wire;

[0033] Step A5, the power supply is turned on, and the part to be plated of the electrode to be plated is plated and maintained for a predetermined time;

[0034] Step A6, after the predetermined time is reached, the power supply is turned off, and the electrode with the plating layer grown is taken out.

[0035] The beneficial technical effect of the present application is that the plating device is used, the first inner groove is used instead of the plating hanger, the plurality of small electrode leads on the electrode to be plated are uniformly electrically connected with the cathode through the liquid metal, especially when the electrode auxiliary common connection electrode is not made, the bottom plate is inserted into the electrode to be plated, the first inner groove filled with the liquid metal and the second inner groove filled with the plating solution are used in cooperation, so that the flexible electrode can be selectively partially plated, the uniformity of the conductivity of the small flexible electrode is improved, and the conductivity of the electrode is uniformly controllable. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 It is a whole structure schematic view of the plating device of the flexible electrode of the present application;

[0037] Figure 2 It is a structure schematic view of the first inner groove of the plating device of the flexible electrode of the present application;

[0038] Figure 3The schematic diagram of the through hole structure of the bottom plate of the electroplating device for the flexible electrode without inserting the electrode;

[0039] Figure 4 The schematic diagram of the through hole structure of the bottom plate of the electroplating device for the flexible electrode after inserting the electrode;

[0040] Figure 5 The schematic diagram of the first inner groove in the step flow of the electroplating method for the flexible electrode;

[0041] Figure 6 The schematic diagram of the bottom plate inserted with the electrode in the step flow of the electroplating method for the flexible electrode;

[0042] Figure 7 The schematic diagram of the first inner groove after turning over in the step flow of the electroplating method for the flexible electrode;

[0043] Figure 8 The schematic diagram of the electroplating in the step flow of the electroplating method for the flexible electrode;

[0044] Figure 9 The schematic diagram of the cleaning of the electrode in the step flow of the electroplating method for the flexible electrode;

[0045] Figure 10 The schematic diagram of the taking out of the electrode in the step flow of the electroplating method for the flexible electrode;

[0046] Figure 11 The schematic diagram of the cutting of the electrode in the step flow of the electroplating method for the flexible electrode;

[0047] Figure 12 The schematic diagram of the cross section of the flexible electrode formed by the electroplating device and method for the flexible electrode.

[0048] Wherein, 1-second outer groove; 2-second temperature adjusting device; 3-electrode to be electroplated; 4-first outer groove; 5-first temperature adjusting device; 6-first inner groove; 7-cathode panel; 8-power supply; 9-sealing cover plate; 10-first outer groove upper cover; 11-anode panel; 12-second outer groove upper cover; 13-acid-base degree sensor; 14-second inner groove; 15-liquid; 16-platform; 17-liquid metal; 18-electroplating liquid; 63-bottom plate; 66-through hole. DETAILED DESCRIPTION

[0049] With reference to the drawings and specific embodiments, the present application will be further described, but not as a limitation of the present application.

[0050] It should be noted that the embodiments and features in the present application can be combined with each other without conflict.

[0051] With reference to the drawings and specific embodiments, the present application will be further described, but not as a limitation of the present application.

[0052] With reference to the drawings and specific embodiments, the present application will be further described, but not as a limitation of the present application. Figures 1-4 The present application provides a plating device for flexible electrode, which is used for growing plating layer on the plating part of the electrode to be plated (3) to form a flexible electrode, comprising:

[0053] The first inner groove (6) is fixed with a bottom plate (63) at the bottom surface, and the bottom plate (63) is provided with a plurality of through holes (66);

[0054] The first inner groove (6) is filled with liquid metal, and the cathode panel (7) is placed in the liquid metal, and the cathode panel (7) is connected to the negative pole of the power supply (8) through the conductive wire with insulation layer protection;

[0055] The second inner groove (14) is located below the first inner groove (6), and the second inner groove (14) is filled with plating liquid (18), and the anode panel (11) is placed in the plating liquid (18);

[0056] The anode panel (11) is connected to the positive pole of the power supply (8) through the conductive wire with insulation layer protection;

[0057] The electrode to be plated (3) passes through the through hole (66), and the lower end of the electrode to be plated (3) has a plating part to be plated, which is immersed in the plating liquid (18) and connected to the anode panel (11) through the plating liquid (18), and the upper end of the electrode to be plated (3) is immersed in the liquid metal and connected to the cathode panel (7) through the liquid metal.

[0058] The electrode to be plated of the present application can be an electrode with electrode lead (such as 4-electrode) and multi-contact electrode part, i.e. conductive part (31) after etching by laser or the like. Specifically, the electrode to be plated is formed by combining the flexibility of quartz glass fiber or optical fiber and the oxide semiconductor layer patterned on the outer surface of the quartz glass fiber or optical fiber. That is, the core of the electrode to be plated is a glass fiber or an optical fiber, which can include an inner core and an outer core, and the outer core wraps the inner core. The surface of the core is patterned to form a conductive part, and the core is, for example, quartz glass. Because of the insulating property of the core, the core will not be plated with a plating layer, and only the outer surface of the conductive part will be plated with a plating layer, achieving selective plating. The conductive part formed by etching by laser or the like can be etched to form multiple conductive parts around the core, forming multi-contact, thereby achieving multi-contact growth of the plating layer.

[0059] As a preferred embodiment, the cross section of the flexible electrode formed is as shown in Figure 12 The core includes an inner core (32) and an outer core (33), which can be composed of glass fiber or optical fiber. The patterned conductive part (31), such as the oxide semiconductor layer, is formed by plating according to the present application to form a plating layer (34), which is a metal or an alloy.

[0060] By plating with the plating device of the present application, a metal or alloy plating layer is grown on the conductive part, further improving the stability and reliability of the flexible electrode,

[0061] In the process of making the flexible electrode, because the quartz glass fiber or optical fiber is thin, it is difficult to effectively and uniformly electrically connect each conductive part corresponding to the tiny multi-electrode contact during plating. With the plating device of the present application, the conductive part on the quartz glass fiber or optical fiber is electrically connected by means of a liquid conductor, i.e. liquid metal, and the part to be plated, such as the conductive part, is plated in the plating solution. The anode panel is placed horizontally in the plating solution, and the part to be plated of the electrode to be plated is vertically immersed in the plating solution. The anode panel and the electrode to be plated are perpendicular to each other, forming a vertical electric field. That is, the anode panel and the electrode to be plated are arranged vertically, and the electric field around the conductive part to be grown on the electrode to be plated is uniform, ensuring the uniformity of the electrical conductivity of the thin conductive part after plating, achieving selective plating, improving the uniformity of plating, and realizing a multi-contact flexible electrode. In addition, the plating layer increases the electrical conductivity of the flexible electrode, improves the stability and biocompatibility of the formed flexible electrode, and can realize multi-contact combination of electrical stimulation and signal recording on a single thin flexible electrode.

[0062] The electrode to be plated is circular, with conductive parts formed around the circumference.

[0063] The liquid metal can be, for example, mercury, germanium or indium-tin alloy.

[0064] The flexible electrode plated with the electroplating layer is relatively fine and flexible, biocompatible, reduces the generation of local scar of nerve tissue, and maintains the use effect of the flexible electrode.

[0065] Through the electroplating device, the conductivity of the conductive part can be adjusted according to the electro-growth conditions and the selection of metal (alloy) materials under the same length and diameter of the flexible electrode.

[0066] The electroplating layer is metal platinum, platinum-iridium alloy, platinum-titanium alloy, gold, silver or the like, has good conductive performance, and has corrosion resistance.

[0067] The first inner groove is used to replace the electroplating hanger, and the electrical connection problem of the micro-sized electrode to be plated, especially the biological electrode, coated with the electroplating layer.

[0068] The cathode panel (7) is placed in the liquid metal, the cathode panel (7) is below the liquid level of the liquid metal and above the electrode to be plated, the cathode panel (7) has a metallic property close to the liquid metal, and the plane of the cathode panel (7) is horizontally placed to balance the electric field distribution.

[0069] Further, the top end of the first inner groove (6) is provided with a sealing cover plate (9) which seals the top end of the first inner groove (6).

[0070] The space above the liquid level of the liquid metal in the first inner groove (6) is filled with inert gas.

[0071] The sealing cover plate (9) tightly seals the upper edge frame of the first inner groove (6) to avoid gas leakage. Preferably, the sealing cover plate (9) is fixed on the four surrounding edge frames of the top end of the first inner groove (6) by screws, and the sealing cover plate (9) is also combined with a sealing ring to seal the four surrounding edge frames of the top end of the first inner groove (6). The space above the liquid level of the liquid metal in the first inner groove (6) is filled with inert gas, thereby forming a closed space to protect the liquid metal.

[0072] Further, the inert gas is high-purity nitrogen.

[0073] Further, the bottom plate (63) is a fluorine rubber plate.

[0074] The diameter of the through hole (66) is smaller than the diameter of the electrode (3) to be plated.

[0075] The bottom plate (63) is fixed to the bottom surface of the first inner groove (6) by the pressing frame (64).

[0076] The material of the bottom plate (63) is fluorine rubber, and a through hole smaller than the diameter of the electrode to be plated is reserved on the rubber, so that the electrode to be plated is inserted into the fluorine rubber bottom plate (63) in a transition fit, and the electrode to be plated is fastened by the elasticity of the fluorine rubber, solving the mechanical fixing problem of the electrode to be plated with small size, especially the flexible electrode to be plated. In addition, the sealing problem of liquid metal leakage is solved by the elastic wrapping of the fluorine rubber through hole to the electrode to be plated.

[0077] Preferably, the diameter of the through hole (66) is 5mm.

[0078] Preferably, the through holes (66) are arranged in an array on the bottom plate (63).

[0079] The bottom plate (63) is tightly pressed on the bottom surface of the first inner groove (6) by the pressing frame (64) around the bottom plate (63), and is fastened by screws, further preventing the leakage of liquid metal.

[0080] Further, it also includes a first outer groove (4), and the first outer groove (4) is embedded in the first inner groove (6).

[0081] The bottom surface of the first outer groove (4) is provided with an opening, and the through hole (66) is exposed on the bottom surface of the first outer groove (4).

[0082] The top end of the first outer groove (4) is provided with a first outer groove cover (10).

[0083] The first outer groove (4) is preferably 150mm long, 150mm wide and 120mm high, and the size can be enlarged or reduced according to the situation.

[0084] Preferably, the opening of the first outer groove (4) is a square opening. Preferably, the size of the square opening is 110mm×110mm. The size of the square opening is smaller than the size of the bottom surface of the first inner groove (6), so that the first inner groove (6) will not fall out of the opening of the first outer groove (4).

[0085] The material is polyvinylidene fluoride (PVDF), polyvinylidene fluoride (PVDF) or polyether ether ketone (PEEK).

[0086] The thickness of the first inner groove (6) is preferably 5mm, and the material is preferably polytetrafluoroethylene (PDFE) or polyether ether ketone (PEEK).

[0087] The first inner groove (6) is preferably 120mm long, 120mm wide and 100mm high, and the size is mainly considered for the use of a small amount of liquid metal each time. That is, the size of the first inner groove (6) is selected according to the amount of liquid metal used.

[0088] Further, the first temperature adjusting device (5) is arranged between the first outer tank (4) and the first inner tank (6), and is used for controlling the liquid metal to be in a first temperature state.

[0089] The first temperature adjusting device (5) comprises a refrigerator, a heater and a temperature sensor, and is used for adjusting the temperature so that the liquid metal (17) is in a first constant temperature state. The refrigerator is a semiconductor refrigerator, and the heater is a PTC ceramic heating device.

[0090] Further, the second outer tank (1) is arranged in the second outer tank (1), and the second inner tank (14) is arranged in the second outer tank (1).

[0091] The second outer tank (1) and the second inner tank (14) are filled with the liquid (15), and the second temperature adjusting device (2) is arranged between the second outer tank (1) and the second inner tank (14).

[0092] The second temperature adjusting device (2) is used for adjusting the temperature of the liquid (15) so that the electroplating liquid (18) is in a second temperature state.

[0093] Specifically, the liquid (15) is water.

[0094] Further, the second outer tank (1) is provided with a second outer tank upper cover (12) at the top end.

[0095] The second outer tank upper cover (12) is provided with a plurality of perforations for the to-be-electroplated electrodes (3) to pass through.

[0096] Further, the electroplating liquid (18) is further provided with a pH sensor (13).

[0097] Further, the material of the core of the flexible electrode is glass fiber, and the material of the to-be-electroplated part of the flexible electrode is an oxide semiconductor; and the to-be-electroplated part is arranged on the outer surface of the core.

[0098] The electroplating layer is platinum, gold, silver, platinum-iridium alloy or platinum-titanium alloy.

[0099] Referring to Figures 5-11 The application further provides a flexible electrode electroplating method using the flexible electrode electroplating device.

[0100] Step A1, the first inner tank (6) is turned over and placed on a platform (16), so that the bottom surface of the first inner tank (6) faces upward, and the through holes (66) are inserted with the to-be-electroplated electrodes (3).

[0101] Step A2, the first inner tank (6) is turned over again, so that the top end of the first inner tank (6) faces upward, and the liquid metal (17) is injected into the first inner tank (6), and then the cathode panel (7) is horizontally arranged in the liquid metal.

[0102] Step A3, the first inner tank (6) is located above the second inner tank (14) filled with the electroplating solution (18), and the lower end of the electrode (3) to be electroplated is ensured to be immersed in the electroplating solution (18);

[0103] Step A4, the cathode panel (7) is connected to the negative pole of the power supply (8) through an insulating wire, and the anode panel located in the electroplating solution (18) is connected to the positive pole of the power supply (8) through an insulating wire.

[0104] Step A5, the power supply (8) is turned on, and the electrode (3) to be electroplated is electroplated for a predetermined time.

[0105] Step A6, after the predetermined time is reached, the power supply (8) is turned off, and the electrode with the electroplated layer is taken out.

[0106] In step A1, specifically, referring to Figures 5-6 , first, the first inner tank (6) is turned over and placed on a platform (16) so that the bottom surface of the first inner tank (6) faces upward, and the through holes (66) are filled with the electrodes (3) to be electroplated.

[0107] Specifically, after the electrodes (3) to be electroplated are inserted, that is, after step A1 and before step A2, the inserted electrodes (3) to be electroplated are placed in a chamber type plasma cleaning chamber for cleaning, and the cleaning includes cleaning the sealing cover plate (9).

[0108] Step A2, in which, referring to Figure 7 , the first inner tank (6) is turned over again so that the top end of the first inner tank (6) faces upward, and the cathode panel (7) is placed horizontally in the liquid metal (17) after the liquid metal (17) is injected into the first inner tank (6). Specifically, after the first inner tank (6) is turned over again, the first inner tank (6) is fixed inside the first outer tank (4), and then the liquid metal (17) is injected. After the liquid metal (17) is injected, the top end of the first inner tank (6) is sealed with the sealing cover plate (9), and the gas is pumped out and high-purity nitrogen is injected.

[0109] Then, the first temperature adjusting device (5) is turned on to heat or cool the liquid metal to a first temperature state and maintain the first temperature state.

[0110] In step A2, the electroplating solution is added to the second inner tank (14), and the second temperature adjusting device (2) is turned on to adjust the temperature so that the temperature of the liquid (15) reaches a second temperature state and is maintained, so that the temperature of the electroplating solution is maintained at the second temperature state.

[0111] The electrode taken out in step A6 is a flexible electrode plated with an electroplated layer.

[0112] In step A6, the flexible electrode is also cleaned, dried, and the electrical parameters of the electrode site are measured, such as conductivity, etc.

[0113] The cleaning is shown in Fig. 2, wherein a cleaning tank (19) is filled with cleaning solution, and the flexible electrode is cleaned. Figure 9

[0114] As shown in Fig. 6, after cleaning and drying, the first inner tank (6) is flipped again and placed on a platform (16) so that the bottom of the first inner tank (6) faces upward, and the flexible electrode is removed. Figure 10 Figure 11 As shown in Fig. 6, after step A6, the part reserved for growth is cut off using glass fiber or a light cutting machine, which can be the part of the upper end of the flexible electrode that is not plated with the plating layer.

[0115] The above merely describes the preferred embodiments of the present application, and is not intended to limit the embodiments and the protection scope of the present application. It should be noted by those skilled in the art that any equivalent substitutions and obvious changes made according to the present application description and drawings should be included in the protection scope of the present application.​​

Claims

1. An electroplating apparatus for a flexible electrode, used to grow an electroplating layer on the electroplating portion of an electrode to be electroplated, thereby forming the flexible electrode, characterized in that, include: A first inner groove, the bottom surface of which is fixed with a base plate, the base plate having several through holes; The first inner tank is filled with liquid metal, and a cathode panel is placed in the liquid metal. The cathode panel is connected to the negative terminal of the power supply through a wire with an insulating layer. The second inner tank is located below the first inner tank. The second inner tank is filled with an electroplating solution, and the anode panel is placed in the electroplating solution. The anode panel is connected to the positive terminal of the power supply via the wire protected by an insulating layer; The electrode to be electroplated passes through the through hole, and the lower end of the electrode to be electroplated has the part to be electroplated. The part to be electroplated is inserted into the electroplating solution and is connected to the anode panel through the electroplating solution. The upper end of the electrode to be electroplated extends into the liquid metal and is connected to the cathode panel through the liquid metal. The base plate is a fluororubber plate, the diameter of the through hole is smaller than the diameter of the electrode to be electroplated, and the electrode to be electroplated is inserted into the fluororubber base plate in a transition fit manner; It also includes a first outer tank, which contains the first inner tank. The bottom surface of the first outer tank has an opening, which exposes the through hole on the bottom surface of the first outer tank. A first temperature regulating device is provided between the first outer tank and the first inner tank. The first temperature regulating device is used to control the liquid metal to be in a first temperature state. It also includes a second outer tank, which contains the second inner tank. Liquid is injected between the second outer tank and the second inner tank, and a second temperature regulating device is provided. The second temperature regulating device is used to regulate the temperature of the liquid to control the electroplating solution to be in a second temperature state. The electrode to be electroplated is formed by combining the flexibility of quartz glass fiber filaments or optical fibers with an oxide semiconductor layer patterned on the surface of the quartz glass fiber filaments or optical fibers.

2. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, A sealing cover is provided at the top of the first inner groove, and the sealing cover seals the top of the first inner groove; The space above the liquid metal surface in the first inner tank is filled with inert gas.

3. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, The base plate is fixed to the bottom surface of the first inner groove by a pressure frame.

4. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, The top of the first outer groove is provided with a first outer groove cover.

5. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, The top of the second outer groove is provided with a second outer groove cover; The second outer tank cover is provided with several perforations for the electrode to be electroplated to pass through.

6. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, The electroplating solution is also equipped with an acid-base sensor.

7. The electroplating apparatus for a flexible electrode as described in claim 1, characterized in that, The electroplating layer is made of platinum, gold, silver, platinum-iridium alloy, or platinum-titanium alloy.

8. A method for electroplating a flexible electrode, characterized in that, An electroplating apparatus using a flexible electrode as described in any one of claims 1-7 includes the following steps: Step A1: Flip the first inner tank over and place it on a platform so that the bottom surface of the first inner tank faces upward, and fill the through hole with the electrode to be electroplated. Step A2: Flip the first inner tank again so that the top of the first inner tank faces upward. After injecting liquid metal into the first inner tank, place the cathode panel horizontally in the liquid metal. Step A3: Position the first inner tank above the second inner tank containing the electroplating solution, ensuring that the portion to be electroplated at the lower end of the electrode is deeply immersed in the electroplating solution. Step A4: Connect the cathode panel to the negative terminal of the power supply via an insulated wire, and connect the anode panel located in the electroplating solution to the positive terminal of the power supply via an insulated wire; Step A5: Turn on the power supply to electroplate the part of the electrode to be electroplated and maintain it for a predetermined time. Step A6: After the predetermined time is reached, turn off the power supply and remove the electrode with the electroplated layer.

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