Sensor pairing automatic detection device

By designing an automatic sensor pairing detection device, a single-chip microcomputer and operational amplifier are used to simultaneously acquire and amplify multiple sets of sensor signals, and the display screen shows the results in real time. This solves the problem of complex and long-cycle sensor pairing tests, and improves production efficiency and product quality.

CN115046577BActive Publication Date: 2025-11-07SICHUAN JIUYUAN INTELLIGENT FIRE EQUIP CO LTD
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Patent Information

Application Number
CN202210743042.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-28
Publication Date
2025-11-07
Estimated Expiration
2042-06-28

AI Technical Summary

Technical Problem

The sensor pairing test process is complex and time-consuming, resulting in low production efficiency.

Method used

Design an automatic sensor pairing detection device, which uses components such as a microcontroller, operational amplifier and display screen, and connects to a test board via a serial cable to realize the simultaneous acquisition and amplification of multiple sensor signals. The display screen shows the test results in real time, simplifying the voltage adjustment process.

Benefits of technology

It improves the efficiency of sensor pairing testing and production efficiency, simplifies the operation process, and enhances product quality and the reliability of test results.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of sensor pairing automatic detection equipment, it is related to weak signal data acquisition equipment field, solve the process complex and long cycle of the current voltage table measurement mode test sensor pairing, to cause the problem of low production efficiency, including the single-chip microcomputer group with electric connection in box, operational amplifier, power supply, box is embedded with the display screen group of electric connection with single-chip microcomputer group, box is equipped with the switch of electric connection with operational amplifier, power supply, operational amplifier is equipped with the same serial port line extending to outside, test board is connected on serial port line;The application utilizes test hole group to connect multiple sensors, so that operational amplifier simultaneously collects the signal of multiple sensor pairing, to save test time, in the process of testing, if sensor does not satisfy preset voltage, operating personnel can replace matching sensor, so it is not necessary to repeatedly adjust the supply voltage of potentiometer, to improve production efficiency.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of weak signal data acquisition equipment, more particularly to the technical field of sensor pairing automatic detection equipment. BACKGROUND

[0002] The sensor is a re-packaging form of the sensor. The most basic unit of the sensor is packaged by a reasonable electronic circuit and an external packaging structure to make it have some independent functional components that we need. It is usually divided into several categories such as heat-sensitive sensor, light-sensitive sensor, gas-sensitive sensor, force-sensitive sensor, magnetic-sensitive sensor, humidity-sensitive sensor, sound-sensitive sensor, radiation-sensitive sensor, color-sensitive sensor, and taste-sensitive sensor, and video sensor according to its basic sensing function. There are also resonant sensors, wideband sensors, waterproof sensors, high-temperature sensors, low-temperature sensors, and other special functional sensors.

[0003] At present, the sensor pairing test adopts a voltmeter measurement method, and the power supply voltage of the potentiometer needs to be adjusted during the test to meet the test requirements. Since the voltmeter measurement method can only test one sensor at a time, the operator needs to adjust the power supply voltage of the potentiometer every time a sensor is tested, which makes the test process complex and long, thus resulting in low production efficiency. SUMMARY

[0004] The present application aims to solve the technical problem of the complex and long process of testing sensor pairing by using the voltmeter measurement method, thereby resulting in low production efficiency. The present application provides a sensor pairing automatic detection equipment.

[0005] In order to achieve the above-mentioned purpose, the present application specifically adopts the following technical solutions:

[0006] A sensor pairing automatic detection equipment, comprising a box body, a single-chip microcomputer set, an operational amplifier, and a power supply electrically connected in the box body, a display screen set electrically connected with the single-chip microcomputer set is embedded on the box body, a switch electrically connected with the operational amplifier is arranged on the box body, a serial port line extending to the outside is arranged on the power supply and the operational amplifier, a test board is connected to the serial port line, and a test block set is arranged on the test board.

[0007] Further, the test block set comprises a plurality of test blocks uniformly distributed on the test board, the test block comprises two groups of needle sleeve sets symmetrically arranged along the transverse center line of the test board, and an interface connected with the serial port line is arranged on the test board.

[0008] Further, the display screen set comprises two display screens symmetrically arranged along the transverse center line of the box body, a debugging rod is arranged between the two display screens, and the debugging rod is electrically connected with the display screens.

[0009] Further, the box body is provided with a heat dissipation fan, and the heat dissipation fan is arranged above the switch.

[0010] Further, the box body is provided with a storage shell, and a shielding cover is hinged to the storage shell.

[0011] Further, the box body is provided with a heat dissipation hole away from the storage shell.

[0012] Further, the lower surface of the box body is provided with two groups of supporting columns.

[0013] Further, a handle is hinged to the box body, and a soft sleeve is arranged on the handle.

[0014] Further, the soft sleeve is provided with anti-skid particles.

[0015] Further, a supporting plate for placing a test board is hinged to the box body.

[0016] The beneficial effects of the present application are as follows:

[0017] 1. In the present application, a plurality of sensors are connected by a test hole group, so that the operational amplifier simultaneously collects the signals of the paired sensors, thereby saving test time. During the test, if the sensor does not meet the preset voltage, the operator can replace the matching sensor, so there is no need to repeatedly adjust the power supply voltage of the potentiometer, and the process of testing the sensor pairing is also simple, thereby improving the production efficiency.

[0018] 2. In the present application, the test block group includes a plurality of test blocks uniformly distributed on the test plate. The test block includes two groups of needle sleeve groups symmetrically arranged along the transverse center line of the test plate, and one sensor is inserted on each group of needle sleeve groups. Therefore, there are two sensor pairs on one test block, and multiple test blocks can simultaneously test the pairing of multiple sensors. Since the voltage on the test block is preset, when the pairing is unsuccessful, the sensor that meets the preset condition only needs to be replaced, thereby improving the production efficiency.

[0019] 3. In the present application, the box body is embedded with a display screen group electrically connected with the single-chip microcomputer group. The display screen group can display the information converted by the single-chip microcomputer group in a timely manner, so that the operator can know the sensor that does not meet the preset voltage in a timely manner, so as to replace it in a timely manner, thereby improving the product quality.

[0020] 4. In the present application, the operational amplifier can amplify the weak signal collected by itself, and the amplified signal is converted by the single-chip microcomputer group, and the voltage is identified to see whether it meets the preset voltage. The display screen can display the identification result, so that the operator can know the pairing result of multiple sensors in a timely manner, thereby achieving the purpose of multiple sensor pairing test.

[0021] 5. In the application, the same serial port line extending to the outside is arranged on the power supply and the operational amplifier, the test board is connected to the serial port line, the test block group is arranged on the test board, so that the power supply can supply power to the test board at any time during the operation of the test board, and the operational amplifier can collect the matching signals of the sensors on the test block group at any time.

[0022] 6. In the application, the display screen group includes two display screens arranged symmetrically along the transverse center line of the box body, the two display screens can display the information whether the sensors on the test block group are successfully matched in time, and the debugging rod is arranged between the two display screens and electrically connected with the display screens, so that the operating personnel can select the required information according to the specific situation.

[0023] 7. In the application, the heat dissipation fan on the box body can dissipate heat in time, so as to avoid the temperature of the single-chip microcomputer group, the operational amplifier and the power supply being too high during the operation, thereby ensuring the service life of the operational amplifier, the single-chip microcomputer group, the operational amplifier and the power supply.

[0024] 8. In the application, the storage shell is arranged on the box body, and the shielding cover is hinged to the storage shell, so that the operating personnel can open the shielding cover and place the required items in the storage shell during the test, so that the storage shell plays a storage role, and the operating personnel can also get the required items for the test in the shortest time and distance.

[0025] 9. In the application, because the single-chip microcomputer group, the operational amplifier and the power supply generate heat during operation, the heat dissipation hole is arranged on the side of the box body away from the storage shell, which is beneficial to the discharge of heat and the entry of external air into the box body, so as to achieve the effect of timely heat dissipation and ensure the service life of the parts in the box body.

[0026] 10. In the application, the two groups of supporting columns are arranged on the lower surface of the box body, which can effectively support the box body, so that the box body remains stable during the test of the sensors, and the side view result of the sensor matching is avoided to be affected.

[0027] 11. In the application, the handle is hinged to the box body, which can facilitate the operating personnel to move the box body, and the soft sleeve is arranged on the handle, which can avoid the direct friction between the palm of the operating personnel and the handle, thereby improving the comfort of the operating personnel during the movement of the box body.

[0028] 12. In the application, the anti-skid particles are arranged on the soft sleeve, so that the soft sleeve and the palm of the operating personnel generate friction, which increases some friction while ensuring comfort, and avoids the change of the position of the handle held by the palm of the operating personnel after sweating.

[0029] 13. In the present application, the box is hinged with a support plate for placing the test plate, which can facilitate the stability of the operator during the test of the sensor, and also facilitate the insertion or extraction of the sensor. BRIEF DESCRIPTION OF DRAWINGS

[0030] Fig. 1 is a structural schematic diagram of the present application;

[0031] Fig. 2 is a structural schematic diagram of the test plate;

[0032] Fig. 3 is a connection schematic diagram of the display screen and the box;

[0033] Fig. 4 is a connection schematic diagram of the box and the switch;

[0034] Fig. 5 is a structural schematic diagram of the heat dissipation hole;

[0035] Fig. 6 is a circuit diagram of the operational amplifier;

[0036] Fig. 7 is a circuit diagram of the single-chip microcomputer;

[0037] Reference signs: 11 box, 111 support column group, 112 support plate, 113 reserved hole, 12 test plate, 121 test block, 122 needle sleeve group, 123 interface, 13 debugging rod, 14 display screen, 15 power supply, 16 operational amplifier, 17 handle, 171 soft sleeve, 172 anti-slip particles, 18 heat dissipation fan, 19 switch, 20 single-chip microcomputer group, 21 serial port line, 22 heat dissipation hole, 23 storage shell, 231 shielding cover. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0039] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.

[0040] Embodiment 1

[0041] As Figs. 1-7As shown, the embodiment provides a sensor pairing automatic detection device, which comprises a box body 11, a single-chip microcomputer set 20, an operational amplifier 16 and a power supply 15 electrically connected in the box body 11, a display screen set electrically connected with the single-chip microcomputer set 20 embedded on the box body 11, a switch 19 electrically connected with the operational amplifier 16 arranged on the box body 11, a serial port line 21 extending to the outside world arranged on the power supply 15 and the operational amplifier 16, a test board 12 connected with the serial port line 21, and a test block set arranged on the test board 12.

[0042] In the embodiment, the test hole set is connected with multiple groups of sensors, so that the operational amplifier 16 can simultaneously collect the signals of multiple groups of sensor pairs, thereby saving the test time. During the test, if the sensor does not meet the preset voltage, the operator can replace the matching sensor, so that the power supply voltage of the potentiometer does not need to be repeatedly adjusted, and the process of testing the sensor pairing is also simple, thereby improving the production efficiency. The operator turns on the switch 19 to make the box body 11 in the running state, and then inserts different sensors on the test block set, so that each test block 121 has two groups of paired sensors. Since the serial port line 21 is connected with the power supply 15 and the operational amplifier 16, the test board 12 is powered on at the same time, the operational amplifier 16 amplifies the collected signals, the amplified information is A / D converted by the single-chip microcomputer set 20, and whether the preset voltage is met is determined, and then the information is sent to the display screen set. If the preset voltage is not met, the two sensor pairs are not successful, and the same voltage sensor only needs to be replaced. Since multiple groups of sensors are inserted on the test block set, multiple groups of sensor pairing signals can be tested at one time, thereby improving the production efficiency. Since the voltage is preset, the operator does not need to repeatedly adjust the power supply voltage of the potentiometer, so that the process of testing the sensor pairing becomes simple.

[0043] Specifically, since the display screen set is electrically connected with the single-chip microcomputer set 20, the operator can set the preset voltage through the display screen set in advance, so that the single-chip microcomputer set 20 can determine after A / D conversion, and the determination result is displayed on the display screen set, so that the operator can know the pairing result in time.

[0044] Specifically, since one end of the serial port line 21 is connected with the power supply 15 and the operational amplifier 16 at the same time, and the other end is connected with the test board 12, and the test block set is arranged on the test board 12, so that the power supply 15 can supply power to the test board 12 at any time during the operation of the test board 12, and the operational amplifier 16 can collect the pairing signals of the sensors on the test block set at any time.

[0045] Specifically, the operational amplifier 16 can be selected but is not limited to the operational amplifier 16 with the model of LM324.

[0046] Specifically, the microcontroller group 20 can be selected, but is not limited to, the microcontroller group 20 with model number STC12C5A60S2.

[0047] Specifically, the display panel can be selected from, but is not limited to, an LCD1604A LCD screen.

[0048] Example 2

[0049] like Figs. 1-7 As shown, based on Embodiment 1, the test block group includes multiple test blocks 121 evenly distributed on the test board 12. The test block 121 includes two sets of needle sleeve groups 122 symmetrically arranged along the transverse center line of the test board 12. The test board 12 is provided with an interface 123 connected to the serial cable 21.

[0050] Furthermore, the display assembly includes two display screens 14 symmetrically arranged along the transverse centerline of the housing 11, with an adjustment rod 13 provided between the two display screens 14, and the adjustment rod 13 is electrically connected to the display screens 14.

[0051] In this embodiment, the test block group includes multiple test blocks 121, and each test block 121 includes two sets of needle sleeve groups 122. When testing sensor pairing, one sensor is inserted into each set of needle sleeve groups 122, so there are two paired sensors on one test block 121. Multiple test blocks 121 can test the pairing status of multiple sets of sensors simultaneously. Since the voltage on the test block 121 is preset, the display screen group can quickly display the pairing information after A / D conversion by the microcontroller group 20. Once a pairing failure message appears, the operator only needs to replace the sensor with one that meets the preset conditions. Therefore, it not only improves production efficiency but also improves product quality and ensures the reliability of the test results.

[0052] Specifically, the test board 12 has at least ten test blocks 121, and the microcontroller group 20 includes at least two microcontrollers. Therefore, the operator can test the pairing information of 10 sets of sensors at one time, thereby improving production efficiency and reducing the labor intensity of the operator.

[0053] Example 3

[0054] like Figs. 1-7 As shown, based on embodiment 2, the housing 11 is provided with a cooling fan 18, which is located above the switch 19.

[0055] Furthermore, the box body 11 is provided with a storage shell 23, and a cover 231 is hinged to the storage shell 23.

[0056] Furthermore, the side of the housing 11 away from the storage shell 23 is provided with heat dissipation holes 22.

[0057] Furthermore, two sets of support columns 111 are provided on the lower surface of the box body 11.

[0058] Further, the box 11 is hinged with a handle 17, and the handle 17 is provided with a soft sleeve 171.

[0059] Further, the soft sleeve 171 is provided with anti-skid particles 172.

[0060] Further, the box 11 is hinged with a support plate 112 for placing the test plate 12.

[0061] In the embodiment, since the single-chip microcomputer set 20, the operational amplifier 16 and the power supply 15 generate heat during operation, the box 11 is provided with a heat dissipation hole 22 on the side away from the storage shell 23, which is beneficial to the heat dissipation and the entry of external air into the box 11, so as to achieve the effect of timely heat dissipation and ensure the service life of the components in the box 11. In addition, the heat dissipation fan 18 can quickly dissipate heat, so as to avoid the situation that the temperature of the single-chip microcomputer set 20, the operational amplifier 16 and the power supply 15 is too high during operation. When the operator works, the operator can open the shielding cover 231 and place the articles needed in the test process into the storage shell 23, so that the storage shell 23 plays a role of storage, and the operator can easily get the articles needed in the test in the shortest time and distance. The handle 17 on the box 11 can facilitate the operator to move the box 11, and the soft sleeve 171 on the handle 17 can avoid the direct friction between the palm of the operator and the handle 17, so as to improve the comfort of the operator during the movement of the box 11. The anti-skid particles 172 on the soft sleeve 171 can generate friction between the soft sleeve 171 and the palm of the operator, so as to increase some friction while ensuring the comfort, and avoid the change of the position of the handle 17 held by the operator after the palm sweats.

Claims

1. A sensor pairing automatic detection apparatus comprising a case (11), characterized by, The box (11) is provided with an electrically connected single-chip microcomputer group (20), an operational amplifier (16) and a power supply (15). The operational amplifier (16) is used for amplifying the weak signal of the sensor. The single-chip microcomputer group (20) is used for A / D conversion of the amplified signal and judgment of whether the sensor pairing voltage meets the preset value. A display screen group electrically connected with the single-chip microcomputer group (20) is embedded on the box (11). A switch (19) electrically connected with the operational amplifier (16) is arranged on the box (11). The power supply (15) and the operational amplifier (16) are provided with the same serial port line (21) extending to the outside. A test board (12) is connected to the serial port line (21). The test board (12) is provided with a test block group. The test block group is used for simultaneously connecting multiple groups of paired sensors to realize synchronous testing of multiple groups of sensors. The test block group includes multiple test blocks (121) uniformly distributed on the test board (12). The test block (121) includes two groups of needle sleeve groups (122) symmetrically arranged along the transverse center line of the test board (12). Each group of needle sleeve groups (122) corresponds to a sensor, and the two groups of needle sleeve groups (122) form a test interface of a pair of sensors. The test board (12) is provided with an interface (123) connected with the serial port line (21). The display screen group includes two display screens (14) symmetrically arranged along the transverse center line of the box (11). A debugging rod (13) is arranged between the two display screens (14). The debugging rod (13) is electrically connected with the display screen (14).

2. The apparatus according to claim 1, wherein The box (11) is provided with a heat dissipation fan (18) arranged above the switch (19).

3. The apparatus according to claim 1, wherein The box (11) is provided with a storage shell (23). The storage shell (23) is hingedly connected with a shielding cover (231).

4. The apparatus according to claim 1, wherein The side of the box (11) away from the storage shell (23) is provided with a heat dissipation hole (22).

5. The sensor pairing automatic detection device of claim 4, wherein, The lower surface of the box (11) is provided with two groups of support column groups (111).

6. The apparatus of claim 1, wherein, The box (11) is hingedly connected with a handle (17). The handle (17) is provided with a soft sleeve (171).

7. The apparatus of claim 1, wherein, The soft sleeve (171) is provided with anti-slip particles (172).

8. The sensor pairing automatic detection device of claim 7, wherein, The box (11) is hingedly connected with a support plate (112) for placing the test board (12).

9. The apparatus according to claim 1, wherein ​

Citation Information

Patent Citations

  • ICC multifunctional integrated test system

    CN110907806A

  • Sensor pairing automatic detection equipment

    CN217953524U