Method for manufacturing laminated structure, laminated structure, and inkjet composition kit

Abstract

A laminated structure capable of improving the leak-proof properties of materials is provided. The laminated structure of the present invention comprises: a first substrate, a first layer disposed on the surface of the first substrate, and a second layer disposed on the surface of the first layer on the side opposite to the first substrate side. The first layer is a photocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second layer is a photocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition and the second composition are different compositions.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a laminated structure using an inkjet apparatus. Furthermore, this invention relates to laminated structures. Additionally, this invention relates to inkjet composition kits used for coating applications using an inkjet apparatus. Background Technology

[0002] Methods for coating compositions using inkjet devices are known. For example, in the manufacture of electronic components, the following method is used: using an inkjet device, coating an inkjet composition on the surface of a substrate, and then curing the composition by light or heat.

[0003] Patent Document 1 below discloses a curable composition for inkjet printing comprising (A) a multi-branched oligomer or polymer having an olefinic unsaturated group, (B) a photopolymerization initiator, and (C) a thermosetting compound.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: WO2019 / 189186A1 Summary of the Invention

[0007] The technical problem to be solved by the present invention

[0008] In electronic components such as semiconductor devices and printed circuit boards, a cured layer formed by curing an inkjet composition is disposed. This cured layer is often used as a bonding agent layer to join two components together.

[0009] In addition, there have been attempts to use inkjet compositions for applications different from bonding applications.

[0010] For example, if it is possible to form a region surrounded by a cured layer, with a metal layer formed inside the region, or to form an isolation wall with a cured layer so that the bottom filling material does not permeate and diffuse, it is beneficial for the miniaturization and cost reduction of electronic components.

[0011] In the aforementioned applications, it is necessary to prevent materials (e.g., materials used to form the metal layer and underfill materials, etc.) from leaking out from unexpected places.

[0012] The object of this invention is to provide a method for manufacturing a laminated structure that improves the leak-proof properties of materials, a laminated structure, and a composition kit for inkjet printing. Furthermore, this invention also aims to provide an apparatus for manufacturing said laminated structure.

[0013] Technical means to solve technical problems

[0014] According to a broad aspect of the present invention, a method for manufacturing a laminated structure is provided, comprising: a first photocuring step in which light is irradiated onto the surface of a first composition applied by inkjet printing to a first substrate to form a first photocured layer obtained by photocuring the first composition; and a second photocuring step in which light is irradiated onto the surface of the first photocured layer opposite to the first substrate side to a second composition applied by inkjet printing to form a second photocured layer obtained by photocuring the second composition.

[0015] The first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition and the second composition are different compositions.

[0016] In a particular embodiment of the method for manufacturing a laminated structure according to the present invention, the method comprises: a second coating step of applying a second composition to the surface of the first photocurable layer opposite to the first substrate side by inkjet printing; and in the second photocuring step, irradiating the second composition applied in the second coating step with light.

[0017] In a particular embodiment of the method for manufacturing the laminated structure according to the present invention, the second coating process and the second photocuring process are performed multiple times in the thickness direction of the first photocurable layer.

[0018] In a specific embodiment of the method for manufacturing a laminated structure according to the present invention, the method comprises: a step of heating a first and a second photocurable layer, wherein the first photocurable layer and the second photocurable layer are heated to form a first photocurable and thermocurable layer obtained by thermal curing the first photocurable layer, and a second photocurable and thermocurable layer obtained by thermal curing the second photocurable layer.

[0019] In a specific embodiment of the method for manufacturing a laminated structure according to the present invention, the method may or may not include: a step for heating a first and a second photocurable layer, which heats the first and the second photocurable layers to form a first photocurable and thermocurable layer obtained by thermally curing the first photocurable layer, and a second photocurable and thermocurable layer obtained by thermally curing the second photocurable layer.

[0020] When the process for heating the first and second photocurable layers is included, the manufacturing method further includes a third photocuring step: irradiating light onto a third composition coated by inkjet printing on a surface opposite to the first substrate side to form a third photocurable layer obtained by photocuring the third composition.

[0021] Without the step of heating the first and second photocurable layers, the manufacturing method includes a third photocuring step: irradiating light onto a third composition coated by inkjet printing on a surface opposite to the first substrate side to form a third photocurable layer obtained by photocuring the third composition.

[0022] The third composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second and third compositions are different compositions.

[0023] In a particular embodiment of the method for manufacturing the laminated structure according to the present invention, the first composition and the third composition are the same composition.

[0024] In a particular embodiment of the method for manufacturing the laminated structure involved in this invention,

[0025] When the manufacturing method includes the step of heating the first and second photocurable layers, it further includes a planarization step, after the step of heating the first and second photocurable layers, a planarization process is performed on the surface of the second photocurable layer opposite to the first substrate side.

[0026] In the absence of the step for heating the first and second photocurable layers, the manufacturing method includes a planarization step, after the second photocuring step, performing a planarization process on the surface of the second photocurable layer opposite to the first substrate side.

[0027] The planarization process is a grinding process.

[0028] In a particular embodiment of the method for manufacturing a laminated structure according to the present invention, the method comprises: a placement step in which a second substrate is placed on the surface of the third photocurable layer opposite to the side of the first substrate.

[0029] In a particular embodiment of the method for manufacturing the laminated structure involved in this invention,

[0030] When the process of heating the first and second photocurable layers is included, the manufacturing method includes: heating the third photocurable layer to form a third photocurable and thermocurable layer obtained by thermocuring the third photocurable layer, and a process of heating the third photocurable layer.

[0031] Without the step of heating the first and second photocurable layers, the manufacturing method includes: heating the first, second, and third photocurable layers to form a first photocurable layer obtained by thermal curing the first photocurable layer, a second photocurable layer obtained by thermal curing the second photocurable layer, and a third photocurable layer obtained by thermal curing the third photocurable layer, and heating the first, second, and third photocurable layers.

[0032] According to a broad aspect of the present invention, a method for manufacturing a laminated structure is provided, comprising: a second photocuring step of irradiating light onto a second composition coated on the surface of a first substrate by inkjet printing to form a second photocurable layer obtained by photocuring the second composition;

[0033] The manufacturing method may or may not include: a step of heating the second photocurable layer to form a second photocurable and thermocurable layer obtained by heat curing the second photocurable layer;

[0034] When the process for heating the second photocurable layer is included, the manufacturing method includes a first photocuring step: irradiating light onto a first composition coated by inkjet printing on a surface opposite to the first substrate side to form a first photocurable layer obtained by photocuring the first composition.

[0035] Without the step of heating the second photocurable layer, the manufacturing method includes a first photocuring step: irradiating light onto a first composition coated on the surface of the second photocurable layer opposite to the first substrate side by inkjet printing, thereby forming a first photocurable layer obtained by photocuring the first composition.

[0036] The first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition and the second composition are different compositions.

[0037] In a specific embodiment of the method for manufacturing a laminated structure according to the present invention, the method comprises: a step of heating the second photocurable layer to form a second photocurable and thermocurable layer obtained by thermocuring the second photocurable layer; and a step of heating the second photocurable layer.

[0038] In the first photocuring process, light is irradiated onto the surface of the first composition that is coated on the second photocurable and thermocurable layer by inkjet printing, opposite to the side of the first substrate, to form a first photocurable layer obtained by photocuring the first composition.

[0039] In a particular embodiment of the method for manufacturing the laminated structure involved in this invention,

[0040] When the process for heating the second photocurable layer is included, the manufacturing method further includes a planarization process, after the process for heating the second photocurable layer, a planarization process is performed on the surface of the second photocurable layer opposite to the first substrate side.

[0041] In the absence of the step for heating the second photocurable layer, the manufacturing method includes a planarization step, after the second photocuring step, a planarization process for the surface of the second photocurable layer opposite to the first substrate side.

[0042] The planarization process is a grinding process.

[0043] In a particular embodiment of the method for manufacturing the laminated structure involved in this invention,

[0044] When the process of heating the second photocurable layer is included, the manufacturing method includes: heating the first photocurable layer to form a first photocurable and thermocurable layer obtained by thermocuring the first photocurable layer; and a process of heating the first photocurable layer.

[0045] Without the step of heating the second photocurable layer, the manufacturing method includes: heating the first photocurable layer and the second photocurable layer to form a first photocurable and thermocurable layer obtained by thermal curing the first photocurable layer and a second photocurable and thermocurable layer obtained by thermal curing the second photocurable layer, and a step of heating the first and second photocurable layers.

[0046] In a particular embodiment of the method for manufacturing a laminated structure according to the present invention, the method comprises: a placement step in which a second substrate is placed on the surface of the first photocurable layer opposite to the side of the first substrate.

[0047] In a particular embodiment of the method for manufacturing the laminated structure according to the present invention, the surface roughness of the second substrate is smaller than that of the first substrate.

[0048] According to a broad aspect of the present invention, a laminated structure is provided, comprising: a first substrate, a first layer disposed on a surface of the first substrate, and a second layer disposed on a surface of the first layer opposite to the first substrate side, wherein the first layer and the second layer are combined as follows: the first layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photoinitiator, and a thermocuring agent, and the second layer is a photocurable layer or a combination of a photocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photoinitiator, and a thermocuring agent; or, the first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photoinitiator, and a thermocuring agent, and the second layer is a photocurable layer or a combination of a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photoinitiator, and a thermocuring agent.

[0049] The first composition is a different composition from the second composition.

[0050] In a particular embodiment of the laminated structure of the present invention, the first layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition of a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition of a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent.

[0051] In one particular embodiment of the laminated structure involved in this invention, the second layer has a polished surface.

[0052] In one particular embodiment of the laminated structure of the present invention, the laminated structure comprises: a second substrate disposed on the surface of the second layer on the side opposite to the first layer.

[0053] In a particular embodiment of the laminated structure of the present invention, the first layer is a photocurable and thermocurable layer of the first composition, and the second layer is a photocurable and thermocurable layer of the second composition.

[0054] In a particular embodiment of the laminated structure involved in this invention, the thickness of the second layer is greater than the thickness of the first layer.

[0055] In a specific embodiment of the laminated structure of the present invention, the thickness of the first layer is 0.1 μm to 10 μm and the thickness of the second layer is 1 μm to 1000 μm.

[0056] In a particular embodiment of the laminated structure of the present invention, the laminated structure comprises: a third layer disposed on a surface of the second layer opposite to the side of the first layer, the third layer being a photocurable layer or a photocurable and thermocurable layer comprising a third composition comprising a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator and a thermosetting agent, wherein the second composition and the third composition are different compositions.

[0057] In a particular embodiment of the laminated structure involved in this invention, the first composition and the third composition are the same composition.

[0058] In one particular embodiment of the laminated structure of the present invention, the laminated structure includes a second substrate disposed on the surface of the third layer on the side opposite to the second layer.

[0059] In a particular embodiment of the laminated structure of the present invention, the surface roughness of the first substrate is smaller than that of the second substrate.

[0060] In a particular embodiment of the laminated structure involved in this invention, the third layer is a photocurable and thermocurable layer of the third composition.

[0061] In a particular embodiment of the laminated structure involved in this invention, the thickness of the second layer is greater than the thickness of the third layer.

[0062] In a particular embodiment of the laminated structure involved in this invention, the thickness of the third layer is 0.1 μm to 10 μm.

[0063] In a particular embodiment of the laminated structure of the present invention, the first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition comprising a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition comprising a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent.

[0064] According to a broad aspect of the present invention, an inkjet composition kit is provided, which is an inkjet composition kit having a first composition and a second composition, wherein the first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the first composition and the second composition are different compositions.

[0065] In one particular embodiment of the inkjet composition kit of the present invention, the inkjet composition kit has a first container and a second container, wherein the first container contains the first composition and the second container contains the second composition.

[0066] Invention Effects

[0067] In the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, the leakage resistance of the material can be improved due to the aforementioned configuration. Attached Figure Description

[0068] [ Figure 1 ] Figure 1 (a) to (c) are cross-sectional views illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention.

[0069] [ Figure 2 ] Figure 2 (d) to (f) are cross-sectional views illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention.

[0070] [ Figure 3 ] Figure 3 (g) and (h) are cross-sectional views illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention.

[0071] [ Figure 4 ] Figure 4 This is a flowchart illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention.

[0072] [ Figure 5 ] Figure 5 This is a flowchart illustrating the various steps of the manufacturing method of the laminated structure according to the second embodiment of the present invention.

[0073] [ Figure 6 ] Figure 6 This is a flowchart illustrating the various steps of the manufacturing method of the laminated structure according to the second embodiment of the present invention.

[0074] [ Figure 7 ] Figure 7 This is a cross-sectional view of a laminated structure manufactured by the manufacturing method of the laminated structure according to the second embodiment.

[0075] [ Figure 8 ] Figure 8 This is a flowchart illustrating the steps of the manufacturing method of the laminated structure according to the third embodiment of the present invention.

[0076] [ Figure 9 ] Figure 9 This is a flowchart illustrating the steps of the manufacturing method of the laminated structure according to the third embodiment of the present invention.

[0077] [ Figure 10 ] Figure 10 This is a cross-sectional view of a laminated structure manufactured by the manufacturing method of the laminated structure according to the third embodiment.

[0078] [ Figure 11 ] Figure 11 It means Figures 1-3 A schematic diagram of a portion of an example of the apparatus used in the manufacturing method of the stacked structure shown.

[0079] [ Figure 12 ] Figure 12 It means Figures 1-3 A schematic diagram of other examples of the apparatus used in the manufacturing method of the illustrated laminated structure.

[0080] [ Figure 13 ] Figure 13 This is a schematic cross-sectional view of the inkjet composition kit according to the first embodiment of the present invention.

[0081] [ Figure 14 ] Figure 14 This is a cross-sectional view showing an electronic component obtained using the stacked structure according to the first embodiment of the present invention. Detailed Implementation

[0082] The present invention will now be described in detail.

[0083] The method for manufacturing a laminated structure according to the present invention (1) includes: a first photocuring step (photocuring step for the first composition) in which a first composition coated on the surface of a first substrate by inkjet printing is irradiated with light to form a first photocurable layer obtained by photocuring the first composition. The method for manufacturing a laminated structure according to the present invention (1) includes: a second photocuring step (photocuring step for the second composition) in which a second composition coated on the surface of the first photocurable layer opposite to the first substrate side is irradiated with light to form a second photocurable layer obtained by photocuring the second composition.

[0084] The method (2) for manufacturing a laminated structure according to the present invention includes: a second photocuring step (photocuring step for the second composition) in which a second composition coated on the surface of a first substrate by inkjet printing is irradiated with light to form a second photocurable layer obtained by photocuring the second composition. The method (2) for manufacturing a laminated structure according to the present invention may or may not include: a step for heating the second photocurable layer to form a second photocurable and thermocurable layer obtained by heat curing the second photocurable layer. The method (2) for manufacturing a laminated structure according to the present invention, when including the step for heating the second photocurable layer, includes a first photocuring step (photocuring step for the first composition) in which a first composition coated on the surface of the second photocurable and thermocurable layer opposite to the first substrate is irradiated with light to form a first photocurable layer obtained by photocuring the first composition. The manufacturing method (2) of the laminated structure of the present invention, without the step of heating the second photocurable layer, includes a first photocuring step (photocuring step for the first composition) in which a first composition coated on the surface opposite to the first substrate side of the second photocurable layer by inkjet printing is irradiated with light to form a first photocurable layer obtained by photocuring the first composition.

[0085] In the manufacturing methods (1) and (2) of the laminated structure involved in this invention, the first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. In the manufacturing methods (1) and (2) of the laminated structure involved in this invention, the first composition and the second composition are different compositions.

[0086] In the manufacturing methods (1) and (2) of the laminated structure involved in this invention, the leak-proof properties of the material can be improved due to the aforementioned configuration.

[0087] The manufacturing method (1) of the laminated structure preferably includes a first coating step (coating step for the first composition) in which a first composition is applied to the surface of a first substrate by inkjet printing. The manufacturing method (1) of the laminated structure preferably includes a second coating step (coating step for the second composition) between the first photocuring step and the second photocuring step, in which a second composition is applied to the surface of the first photocurable layer opposite to the first substrate side by inkjet printing. In the second coating step, the second composition is preferably applied to the surface of the first photocurable layer opposite to the first substrate side by inkjet printing. The second photocurable layer is preferably in contact with the first photocurable layer.

[0088] The manufacturing method (2) of the laminated structure preferably includes a second coating step (coating step for the second composition) in which the second composition is coated onto the surface of the first substrate by inkjet printing. The manufacturing method (2) of the laminated structure preferably includes a first coating step (coating step for the first composition) between the second photocuring step and the first photocuring step, in which the first composition is coated onto the surface of the second photocurable layer opposite to the first substrate by inkjet printing. In the first coating step, the first composition is preferably coated onto the surface of the second photocurable layer opposite to the first substrate by inkjet printing. The first photocurable layer is preferably in contact with the second photocurable layer.

[0089] In this specification, the first coating step and the first photocuring step are collectively referred to as the first photocurable layer forming step (photocurable layer forming step for the first composition). Furthermore, in this specification, the second coating step and the second photocuring step are collectively referred to as the second photocurable layer forming step (photocurable layer forming step for the second composition).

[0090] Therefore, the manufacturing method (1) of the laminated structure preferably includes a first photocurable layer forming step, which involves inkjet coating a first composition onto the surface of a first substrate and irradiating the coated first composition with light to form a first photocurable layer obtained by photocuring the first composition. The manufacturing method (1) of the laminated structure preferably includes a second photocurable layer forming step, which involves inkjet coating a second composition onto the surface of the first photocurable layer opposite to the first substrate side and irradiating the coated second composition with light to form a second photocurable layer obtained by photocuring the second composition.

[0091] Furthermore, the manufacturing method (2) of the laminated structure preferably includes a second photocurable layer forming step, which involves inkjet coating a second composition onto the surface of a first substrate and irradiating the coated second composition with light to form a second photocurable layer obtained by photocuring the second composition. The manufacturing method (2) of the laminated structure preferably includes a first photocurable layer forming step, which involves inkjet coating a first composition onto the surface of the second photocurable layer opposite to the first substrate side and irradiating the coated first composition with light to form a first photocurable layer obtained by photocuring the first composition.

[0092] The laminated structure of the present invention comprises: a first substrate, a first layer disposed on the surface of the first substrate, and a second layer disposed on the surface of the first layer on the side opposite to the substrate side. In the laminated structure of the present invention, the combination of the first layer and the second layer is either the following first combination A or the following combination B. Combination A: The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent; and the second layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent. Combination B: The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent. In the laminated structure of the present invention, the first composition and the second composition are different compositions.

[0093] In the laminated structure of the present invention, the aforementioned configuration improves the leak-proof properties of the material.

[0094] The inkjet composition kit of the present invention is an inkjet composition kit having a first composition and a second composition. In the inkjet composition kit of the present invention, the first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent, and the second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. In the inkjet composition kit of the present invention, the first composition and the second composition are different compositions.

[0095] The inkjet composition kit of the present invention, having the aforementioned configuration, can improve the leak-proof properties of the material.

[0096] The inventors have discovered a technical problem in conventional inkjet compositions: poor shape retention of the cured layer, leading to material leakage to the periphery of the cured layer. Specifically, they have discovered that, particularly when the inkjet composition is a photocurable composition, the photopolymerization reaction is easily inhibited on the surface of the composition coated by the inkjet apparatus due to the influence of oxygen in the air. Furthermore, if the surface of the inkjet composition is covered with powder such as debris, sufficient light cannot irradiate the powdered areas, hindering the photopolymerization reaction. In such cases, the inventors have discovered that the inkjet composition cannot cure sufficiently, resulting in reduced shape retention of the cured layer.

[0097] Furthermore, the inventors discovered that when using a composition containing a highly photoreactive compound alone, the curing shrinkage becomes greater, which easily reduces the adhesion between the substrate and the cured layer, and the material easily leaks out between the substrate and the cured layer.

[0098] Furthermore, the inventors have discovered that, in conventional inkjet compositions, when there are layers of cured material with different compositions stacked together, it is difficult to sufficiently improve the interlayer bonding force, and material tends to leak out from areas with lower interlayer bonding force.

[0099] Conventional methods for improving the adhesion between a substrate and a cured layer include treating the substrate surface with a chemical solution or physically damaging the substrate surface to create an uneven surface, and applying a primer. However, in these methods, the properties of the substrate surface in the areas not coated with the inkjet composition can change, leading to issues such as reduced conductivity when connecting components. Furthermore, the bonding strength between the primer and the cured layer can also decrease.

[0100] Furthermore, to reduce the impact of oxygen in the air, the development of devices capable of coating compositions simultaneously with nitrogen or the like is underway. However, there are issues with the increased size or cost of such devices.

[0101] Regarding the new technical problem discovered by the inventors, conventional methods have been insufficient to improve the leak-proof properties of materials.

[0102] In contrast, in the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, even without surface treatment of the substrate and even without using a device capable of nitrogen replacement, the shape retention of the cured layer formed by curing the first composition and the second composition can be improved, and the bonding force with the substrate and the interlayer bonding force can be improved.

[0103] In the method for manufacturing the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, the shape retention of the cured layer formed by the first and second compositions can be improved by using specific first and second compositions. Furthermore, in the method for manufacturing the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, the adhesion between the substrate and the cured layer of the first composition can be improved by using specific first and second compositions, and the interlayer adhesion between the cured layer of the first composition and the cured layer of the second composition can be improved.

[0104] Therefore, in the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, materials (e.g., materials for forming the metal layer and underfill materials, etc.) are less likely to leak out from between the substrate and the cured layer. For example, when material is disposed inside the region surrounded by the cured layer, the material is less likely to leak out from the inside of that region to the outside. Furthermore, for example, when material is disposed outside the region surrounded by the cured layer, the material is less likely to leak out from the outside of that region to the inside.

[0105] In the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, the shape retention of the photocurable layer of the first composition and the photocurable and thermocurable layer of the second composition can be improved.

[0106] Furthermore, in the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, since the strength of the cured layer is good, damage to the cured layer can be effectively suppressed, and powder such as debris can be effectively suppressed from adhering to the cured layer.

[0107] (Manufacturing method of laminated structures)

[0108] Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that, for ease of illustration, the size, thickness, and shape of the figures in the following drawings may differ from the actual size, thickness, and shape.

[0109] Figure 1 (a)~(c) Figure 2 (d)~(f) and Figure 3 (g) and (h) are cross-sectional views illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention. Figure 4 This is a flowchart illustrating each step of the manufacturing method of the laminated structure according to the first embodiment of the present invention. Figures 1-4 The manufacturing method of the laminated structure involved in the first embodiment is the manufacturing method of the laminated structure (1).

[0110] exist Figures 1-3 In order to manufacture a laminated structure, an apparatus 10 is used, comprising a platform 11, a first ejector section 12, a first light irradiation section 13, a second ejector section 14, and a second light irradiation section 15. The first ejector section 12 is a part for ejecting a first composition and is an inkjet head. The second ejector section 14 is a part for ejecting a second composition and is also an inkjet head. Therefore, the apparatus 10 is an inkjet apparatus. The first light irradiation section 13 is disposed between the first ejector section 12 and the second ejector section 14. The second light irradiation section 15 is disposed on the side of the second ejector section 14 opposite to the side of the first light irradiation section 13. The first light irradiation section 13 and the second light irradiation section 15 can irradiate with ultraviolet light.

[0111] <First photocurable layer formation process ( Figure 4 S1 and S2)>

[0112] First, such as Figure 1 As shown in (a), a first substrate 3 is disposed on the surface of platform 11. The first substrate 3 is fixed to the surface of platform 11. The first substrate 3 is adsorbed onto platform 11. Next, a first composition 1 is coated on the surface of the first substrate 3 by inkjet printing (first coating step). The first composition 1 is coated by the first ejection section 12. The first composition 1 is coated onto a given position of the first substrate 3. The first composition 1 is partially coated on the surface of the first substrate 3.

[0113] Next, as Figure 1 (b) shows that the moving platform 11 is moved until the coated first composition 1 is located below the first light irradiation unit 13. Alternatively, the inkjet device can be moved instead of the moving platform 11. The first composition 1 is irradiated with light (ultraviolet light) by the first light irradiation unit 13, forming a first photocured layer 1A obtained by photocuring the first composition (first photocuring process).

[0114] After the first photocuring process, it is determined whether the first photocurable layer formation process needs to be repeated. Figure 4 (S3). In the case of repeating the first photocurable layer formation process, the first composition is coated on the surface side of the first photocurable layer opposite to the first substrate side.

[0115] <Second UV-cured layer formation process ( Figure 4 (S4 and S5)

[0116] Next, as Figure 1(c) The platform 11 is moved until the first photocurable layer 1A is below the second ejection section 14. Alternatively, the inkjet unit can be moved instead of the platform 11. The second composition 2 is coated onto the surface of the first photocurable layer 1A opposite to the first substrate 3 using inkjet printing (second coating step). The second composition 2 is coated by the second ejection section 14.

[0117] Next, as Figure 2 As shown in (d), the moving platform 11 is moved until the coated second composition 2 is located below the second light irradiation unit 15. Alternatively, the inkjet device can be moved instead of the moving platform 11. The second composition 2 is irradiated with light (ultraviolet light) by the second light irradiation unit 15, forming a second photocured layer 2A obtained by photocuring the second composition (second photocuring process).

[0118] After the second photocuring process, it is determined whether the second photocurable layer formation process needs to be repeated. Figure 4 (S6). When repeating the second photocurable layer formation process, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first substrate side.

[0119] Figure 2 (e) and (f) are diagrams illustrating the second step in the formation of the second photocurable layer. For example... Figure 2 As shown in (e), the moving platform 11 is moved until the second photocurable layer 2A is located below the second ejection section 14. Alternatively, the inkjet unit can be moved instead of the moving platform 11. The second composition 2 is coated onto the surface of the second photocurable layer 2A opposite to the first substrate 3 using inkjet printing. That is, the second composition 2 is coated onto the surface of the first photocurable layer 1A opposite to the first substrate 3 (second coating step). The second composition 2 is coated by the second ejection section 14.

[0120] Next, as Figure 2 As shown in (f), the moving platform 11 is moved until the coated second composition 2 is located below the second light irradiation unit 15. Alternatively, the inkjet device can be moved instead of the moving platform 11. The second composition 2 is irradiated with light (ultraviolet light) by the second light irradiation unit 15, forming a second photocured layer 2A obtained by photocuring the second composition (second photocuring process).

[0121] The second photocurable layer formation process is performed twice in the thickness direction of the first photocurable layer. Figure 1 (c) and Figure 2 (d) Figure 2 (e) Figure 2(f). By performing the second photocurable layer formation process multiple times in the thickness direction of the first photocurable layer, the thickness of the second photocurable layer can be increased. The second photocurable layer formation process can be performed two or more times, or three or more times.

[0122] By performing the second photocurable layer formation process multiple times in the thickness direction of the first photocurable layer, it is possible to obtain... Figure 3 (g) shows a laminated structure 4A comprising a first substrate 3, a first photocurable layer 1A, a second photocurable layer 2A, and the thickness of the second photocurable layer 2A being greater than the thickness of the first photocurable layer 1A.

[0123] <Process for heating the first and second photocurable layers ( Figure 4 S7)>

[0124] Next, the first photocurable layer 1A and the second photocurable layer 2A are heated to form the first photocurable and thermocurable layer 1B obtained by heat curing the first photocurable layer 1A and the second photocurable and thermocurable layer 2B obtained by heat curing the second photocurable layer 2A (the process of heating the first and second photocurable layers).

[0125] In this way, a laminated structure 4B having a first substrate 3, a first photocurable layer 1B, and a second photocurable layer 2B can be obtained.

[0126] Figure 5 , 6 This is a flowchart illustrating each step of the manufacturing method of the laminated structure according to the second embodiment of the present invention. The manufacturing method of the laminated structure according to the second embodiment is a manufacturing method (1) for a laminated structure. Figure 7 This is a cross-sectional view of a laminated structure manufactured by the manufacturing method of the laminated structure according to the second embodiment.

[0127] <First photocurable layer formation process ( Figure 5 S1 and S2)>

[0128] In the manufacturing method of the laminated structure according to the second embodiment, the first photocurable layer formation step is performed in the manufacturing method of the laminated structure according to the first embodiment. Figure 1 (a) and (b) are performed in the same manner as the first photocurable layer formation process.

[0129] After the first photocuring process, it is determined whether the first photocurable layer formation process needs to be repeated. Figure 5 (S3). In the case of repeating the first photocurable layer formation process, the first composition is coated on the surface side of the first photocurable layer opposite to the first substrate side.

[0130] <Second UV-cured layer formation process ( Figure 5 (S4 and S5)

[0131] In the manufacturing method of the laminated structure according to the second embodiment, the second photocurable layer formation step is performed in the manufacturing method of the laminated structure according to the first embodiment. Figure 1 (c) and (d) are performed in the same manner as the second photocurable layer formation process.

[0132] After the second photocuring process, it is determined whether the second photocurable layer formation process needs to be repeated. Figure 5 (S6). When repeating the second photocurable layer formation process, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first substrate side.

[0133] <Process for heating the first and second photocurable layers ( Figure 6 S8)>

[0134] After the second photocuring process, a determination is made as to whether a process for heating the first and second photocured layers is required. Figure 6 (S7). In the case of performing the process of heating the first and second photocurable layers, the first photocurable layer and the second photocurable layer are heated to form a first photocurable and heat-curable layer obtained by heat curing the first photocurable layer and a second photocurable and heat-curable layer obtained by heat curing the second photocurable layer (the process of heating the first and second photocurable layers).

[0135] By performing a process for heating the first and second photocurable layers, a laminated structure having a first substrate, a first photocurable layer, and a second photocurable layer can be obtained.

[0136] Planarization process ( Figure 6 S10)>

[0137] In the case of performing the process of heating the first and second photocurable layers, after the process of heating the first and second photocurable layers, a determination is made as to whether a planarization process needs to be performed. Figure 6 (S9). Without performing the process for heating the first and second photocurable layers, after the second photocuring process, a determination is made as to whether a planarization process should be performed. Figure 6 (S9). In this embodiment, as a planarization process, it is determined whether to perform a grinding process.

[0138] When performing the process of heating the first and second photocurable layers and then performing the planarization process, after the process of heating the first and second photocurable layers, the surface of the second photocurable layer opposite to the first substrate side is planarized (planarization process). When not performing the process of heating the first and second photocurable layers but performing the planarization process, the surface of the second photocurable layer opposite to the first substrate side is planarized (planarization process).

[0139] The third photocurable layer formation process ( Figure 6 (S11 and S12)

[0140] The third photocurable layer formation process is performed using the third composition in the same manner as the first photocurable layer formation process or the second photocurable layer formation process.

[0141] When performing the steps for heating the first and second UV-cured layers, the third composition is applied by inkjet printing to the surface of the second UV-cured layer opposite to the first substrate side (third coating step (coating step for the third composition)). When not performing the steps for heating the first and second UV-cured layers, the third composition is applied by inkjet printing to the surface of the second UV-cured layer opposite to the first substrate side (third coating step (coating step for the third composition)). The third composition is applied by a given ejection section of the inkjet device. It should be noted that when the first and third compositions are the same composition, in the third coating step, the first composition is essentially applied by inkjet printing to the surface of the second UV-cured layer or the surface of the second UV-cured layer opposite to the first substrate side.

[0142] Next, the third composition is irradiated with light (ultraviolet light) by a given light irradiation unit provided by the inkjet apparatus to form a third photocured layer obtained by photocuring the third composition (third photocuring process (photocuring process for the third composition)). When the first composition and the third composition are the same composition, in the third photocuring process, the third photocured layer is essentially formed by irradiating the first composition with light (ultraviolet light) by a given light irradiation unit provided by the inkjet apparatus.

[0143] After the third photocuring process, it is determined whether the third photocurable layer formation process needs to be repeated. Figure 6 (S13). When repeating the third photocurable layer formation process, the third composition is applied to the surface side of the formed third photocurable layer opposite to the first substrate side.

[0144] It should be noted that, in the specification, the third coating process and the third photocuring process are collectively referred to as the third photocurable layer forming process (the third composition photocurable layer forming process).

[0145] Configuration process ( Figure 6 S14)>

[0146] After the formation of the third photocurable layer, a second substrate is disposed on the surface of the third photocurable layer opposite to the side of the first substrate (disposal process).

[0147] <The process for heating the third UV-cured layer, or the process for heating the first, second, and third UV-cured layers ( Figure 6 S15)>

[0148] When performing the step of heating the first and second UV-cured layers, after the configuration step, the third UV-cured layer is heated to form a third UV- and heat-cured layer (step of heating the third UV-cured layer). When not performing the step of heating the first and second UV-cured layers, after the configuration step, the first, second, and third UV-cured layers are heated to form a first, second, and third UV- and heat-cured layer (step of heating the first, second, and third UV-cured layers). The first UV- and heat-cured layer is a layer obtained by heat curing the first UV-cured layer. The second UV- and heat-cured layer is a layer obtained by heat curing the second UV-cured layer. The third UV- and heat-cured layer is a layer obtained by heat curing the third UV-cured layer.

[0149] In this way, one can obtain such Figure 7 As shown, a stacked structure 4D is provided in sequence with a first substrate 3, a first photocurable layer 1D, a second photocurable layer 2D, a third photocurable layer 6D, and a second substrate 7.

[0150] Figure 8 , 9 This is a flowchart illustrating each step of the manufacturing method of the laminated structure according to the third embodiment of the present invention. The manufacturing method of the laminated structure according to the third embodiment is a manufacturing method (2) of a laminated structure. Figure 10 This is a cross-sectional view of a laminated structure manufactured by the manufacturing method of the laminated structure according to the third embodiment.

[0151] <Second UV-cured layer formation process ( Figure 8 S1 and S2)>

[0152] In the method for manufacturing the laminated structure according to the third embodiment, in addition to coating the second composition on the surface of the first substrate, a second photocurable layer is formed in the method for manufacturing the laminated structure according to the first embodiment. Figure 1 (c) and (d) are performed in the same manner as the second photocurable layer formation process.

[0153] Specifically, the second composition is applied to the surface of the first substrate by inkjet printing (second coating step). The second composition is applied to a given location on the first substrate. The second composition is partially applied to the surface of the first substrate.

[0154] Next, the coated second composition is irradiated with light (ultraviolet light) to form a second photocured layer obtained by photocuring the second composition (second photocuring process).

[0155] After the second photocuring process, it is determined whether the second photocurable layer formation process needs to be repeated. Figure 8 (S3). In the case of repeating the second photocurable layer formation process, the second composition is applied to the surface side of the formed second photocurable layer opposite to the first substrate side.

[0156] <Process for heating the second photocurable layer ( Figure 8 S5)>

[0157] After the second photocuring process, a determination is made as to whether a process for heating the second photocured layer is required. Figure 8 (S4). In the case of performing a process for heating the second photocurable layer, the second photocurable layer is heated to form a second photocurable and thermocurable layer obtained by thermocuring the second photocurable layer (process for heating the second photocurable layer).

[0158] Planarization process ( Figure 9 S7)>

[0159] In the case of performing the step of heating the second photocurable layer, after the step of heating the second photocurable layer, a determination is made as to whether a planarization process should be performed. Figure 9 S6). Without performing the step of heating the second photocurable layer, after the second photocuring step, a determination is made as to whether a planarization step should be performed. Figure 9 (S6).

[0160] When performing the step of heating the second UV-curable layer and the planarization step, after the step of heating the second UV-curable layer, the surface of the second UV-curable layer opposite to the first substrate side is planarized (planarization step (planarization step for the second UV-curable layer)). When not performing the step of heating the second UV-curable layer but performing the planarization step, the surface of the second UV-curable layer opposite to the first substrate side is planarized (planarization step (planarization step for the second UV-curable layer)).

[0161] <First photocurable layer formation process ( Figure 9 (S8 and S9)

[0162] When performing the step of heating the second photocurable layer, the first composition is applied to the surface of the second photocurable layer opposite to the first substrate side using inkjet printing (first coating step). When not performing the step of heating the second photocurable layer, the first composition is applied to the surface of the second photocurable layer opposite to the first substrate side using inkjet printing (first coating step).

[0163] Next, while performing the step of heating the second photocurable layer, light is irradiated onto the surface of the second photocurable layer opposite to the first substrate side, which is coated by inkjet printing, to form a first photocurable layer obtained by photocuring the first composition (first photocuring step). Alternatively, without performing the step of heating the second photocurable layer, light is irradiated onto the surface of the second photocurable layer opposite to the first substrate side, which is coated by inkjet printing, to form a first photocurable layer obtained by photocuring the first composition (first photocuring step).

[0164] After the first photocuring process, it is determined whether the first photocurable layer formation process needs to be repeated. Figure 9 (S10). When repeating the first photocurable layer formation process, the first composition is applied to the surface side of the formed first photocurable layer opposite to the first substrate side.

[0165] Configuration process ( Figure 9 S11)>

[0166] After the formation of the first photocurable layer, a second substrate is disposed on the surface of the first photocurable layer opposite to the first substrate side (disposal step).

[0167] <The process for heating the first photocurable layer, or the process for heating the first and second photocurable layers ( Figure 9 S12)>

[0168] When performing the step of heating the second UV-curable layer, after the configuration step, the first UV-curable layer is heated to form a first photocurable and thermocurable layer (step of heating the first UV-curable layer). When not performing the step of heating the second UV-curable layer, after the configuration step, both the first UV-curable layer and the second UV-curable layer are heated to form a first photocurable and thermocurable layer and a second photocurable and thermocurable layer (step of heating the first and second UV-curable layers). The first photocurable and thermocurable layer is a layer obtained by thermocuring the first UV-curable layer. The second photocurable and thermocurable layer is a layer obtained by thermocuring the second UV-curable layer.

[0169] In this way, one can obtain such Figure 10 As shown, a laminated structure 4E is provided in sequence with a first substrate 3, a second photocurable layer 2E, a first photocurable layer 1E, and a second substrate 7.

[0170] <Further details regarding the manufacturing methods of laminated structures>

[0171] Further details regarding the first, second, and third photocurable layer formation processes:

[0172] The manufacturing method (1) of the laminated structure may or may not include the first coating step. The manufacturing method (2) of the laminated structure may or may not include the second coating step. The laminated structure (1) preferably includes the first coating step, the first photocuring step, the second coating step, and the second photocuring step in sequence. The laminated structure (2) preferably includes the second coating step, the second photocuring step, the first coating step, and the first photocuring step in sequence. The manufacturing method (1) of the laminated structure may or may not include the third coating step. The manufacturing method (1) of the laminated structure may or may not include the third photocuring step. The manufacturing method (1) of the laminated structure may or may not include the third photocuring step. The manufacturing method (1) of the laminated structure may or may not include the third photocurable layer formation step.

[0173] In the manufacturing methods (1) and (2) of the laminated structure, a first photocurable layer can be formed by irradiating the entire coated first composition with light after applying a first composition to a specific area. Alternatively, in the manufacturing methods (1) and (2) of the laminated structure, a first photocurable layer can be formed by irradiating the coated first composition with light after applying several drops of the first composition. Or, in the manufacturing methods (1) and (2) of the laminated structure, a first photocurable layer can be formed by irradiating the coated first composition with light after applying one drop of the first composition.

[0174] In the manufacturing methods (1) and (2) of the laminated structure, the first photocurable layer formation process can be as follows: Figure 1 As shown, the process is performed only once in the thickness direction of the first substrate. In the manufacturing methods (1) and (2) of the laminated structure, the first photocurable layer formation process can also be performed multiple times in the thickness direction of the first substrate. That is, in the manufacturing methods (1) and (2) of the laminated structure, the first coating process and the first photocuring process can be performed only once in the thickness direction of the first substrate, or the first coating process and the first photocuring process can be performed multiple times. By performing the first photocurable layer formation process multiple times in the thickness direction of the first substrate, the thickness of the first photocurable layer can be increased.

[0175] In the manufacturing method (1) of the laminated structure, the first photocurable layer formation step is performed before the second photocurable layer formation step. In the manufacturing method (2) of the laminated structure, the second photocurable layer formation step is performed before the first photocurable layer formation step. In the manufacturing method (1) of the laminated structure, both the first and second photocurable layer formation steps are performed before the third photocurable layer formation step.

[0176] In the manufacturing methods (1) and (2) of the laminated structure, a second photocurable layer can be formed by irradiating the entire coated second composition with light after applying the second composition to a specific area. Alternatively, in the manufacturing methods (1) and (2) of the laminated structure, a second photocurable layer can be formed by irradiating the coated second composition with light after applying several drops of the second composition. Or, in the manufacturing methods (1) and (2) of the laminated structure, a second photocurable layer can be formed by irradiating the coated second composition with light after applying one drop of the second composition.

[0177] In the manufacturing method (1) of the laminated structure, the second photocurable layer forming process can be performed only once in the thickness direction of the first photocurable layer. In the manufacturing method (1) of the laminated structure, the second photocurable layer forming process can also be performed as follows: Figure 1, 2 As shown, the process is performed multiple times in the thickness direction of the first photocurable layer. That is, in the manufacturing method (1) of the laminated structure, the second coating step and the second photocuring step can each be performed only once in the thickness direction of the first photocurable layer, or multiple times. In the manufacturing method (2) of the laminated structure, the second photocurable layer forming step can be performed only once in the thickness direction of the first substrate. In the manufacturing method (2) of the laminated structure, the second photocurable layer forming step can also be performed multiple times in the thickness direction of the first substrate. In the manufacturing method (2) of the laminated structure, the second coating step and the second photocuring step can each be performed only once in the thickness direction of the first substrate, or multiple times. By performing the second photocurable layer forming step multiple times in the thickness direction of the first photocurable layer or the thickness direction of the first substrate, the thickness of the second photocurable layer can be increased. Preferably, the second photocurable layer forming step is performed multiple times in the thickness direction of the first photocurable layer or the thickness direction of the first substrate. It should be noted that the number of times the second photocurable layer formation process is repeated can be appropriately changed depending on the thickness of the second photocurable layer.

[0178] In the manufacturing methods (1) and (2) of the laminated structure, a third photocurable layer can be formed by irradiating the entire coated third composition with light after applying the third composition to a specific area. In the manufacturing methods (1) and (2) of the laminated structure, a third photocurable layer can be formed by irradiating the coated third composition with light after applying several drops of the third composition. In the manufacturing methods (1) and (2) of the laminated structure, a third photocurable layer can be formed by irradiating the coated third composition with light after applying one drop of the third composition.

[0179] In the manufacturing methods (1) and (2) of the laminated structure, the third photocurable layer forming process can be performed only once in the thickness direction of the second photocurable layer. Alternatively, in the manufacturing methods (1) and (2) of the laminated structure, the third photocurable layer forming process can be performed multiple times in the thickness direction of the second photocurable layer. That is, in the manufacturing methods (1) and (2) of the laminated structure, the third coating process and the third photocuring process can each be performed only once in the thickness direction of the second photocurable layer, or they can be performed multiple times. By performing the third photocurable layer forming process multiple times in the thickness direction of the second photocurable layer, the thickness of the third photocurable layer can be increased.

[0180] In the manufacturing methods (1) and (2) of the laminated structure, the light irradiation in the first, second and third light curing steps is preferably ultraviolet irradiation.

[0181] The ultraviolet irradiance and irradiation time in the first, second, and third photocuring steps can be appropriately varied according to the composition of the first, second, and third compositions, as well as the coating thickness of the compositions. For example, the ultraviolet irradiance in the first, second, and third photocuring steps can be 1000 mW / cm². 2 The above can also be 5000mW / cm 2 The above can be 10000mW / cm 2 The following can also be 8000mW / cm 2 The irradiation time of ultraviolet light in the first, second, and third photocuring processes can be, for example, more than 0.01 seconds, more than 0.1 seconds, less than 400 seconds, or less than 100 seconds.

[0182] Other details regarding the heating process:

[0183] The manufacturing method (1) of the laminated structure may or may not include the step of heating the first and second photocurable layers. The manufacturing method (1) of the laminated structure may or may not include the step of heating the third photocurable layer. The manufacturing method (1) of the laminated structure may or may not include the step of heating the first, second and third photocurable layers. The manufacturing method (2) of the laminated structure may or may not include the step of heating the second photocurable layer. The manufacturing method (2) of the laminated structure may or may not include the step of heating the first photocurable layer. The manufacturing method (2) of the laminated structure may or may not include the step of heating the first and second photocurable layers. From the viewpoint of improving the strength of the cured layers of the first and second compositions, the manufacturing method (1) of the laminated structure preferably includes the step of heating the first and second photocurable layers. From the viewpoint of improving the strength of the cured layer of the third composition, the method (1) for manufacturing the laminated structure preferably includes the step of heating the third UV-cured layer. From the viewpoint of improving the strength of the cured layers of the first, second, and third compositions, the method (1) for manufacturing the laminated structure preferably includes the step of heating the first, second, and third UV-cured layers. From the viewpoint of improving the strength of the cured layer of the second composition, the method (2) for manufacturing the laminated structure preferably includes the step of heating the second UV-cured layer. From the viewpoint of improving the strength of the cured layer of the first composition, the method (2) for manufacturing the laminated structure preferably includes the step of heating the first UV-cured layer. From the viewpoint of improving the strength of the cured layers of the first and second compositions, the method (2) for manufacturing the laminated structure preferably includes the step of heating the first and second UV-cured layers.

[0184] In the method (1) for manufacturing the laminated structure, the step of heating the first and second photocurable layers is performed after the step of forming the second photocurable layer. In the method (1) for manufacturing the laminated structure, the step of heating the first and second photocurable layers is preferably performed before the step of forming the third photocurable layer, and more preferably before the step of heating the third photocurable layer. In the method (1) for manufacturing the laminated structure, the step of heating the first and second photocurable layers can be performed after the step of forming the third photocurable layer. In the method (1) for manufacturing the laminated structure, the step of heating the third photocurable layer can be performed before or after the configuration step. In the method (2) for manufacturing the laminated structure, the step of heating the second photocurable layer is performed after the step of forming the second photocurable layer. In the manufacturing method (2) of the second laminated structure, the step of heating the second photocurable layer is preferably performed before the formation step of the first photocurable layer, and more preferably before the step of heating the first photocurable layer. In the manufacturing method (2) of the laminated structure, the step of heating the first photocurable layer can be performed before or after the configuration step.

[0185] In the heating process, it is preferable to heat each of the configured photocurable layers simultaneously.

[0186] The heating temperature and heating time of each heating step can be appropriately varied according to the composition of the first, second, and third compositions, as well as the coating thickness of the compositions. For example, the heating temperature in each heating step can be above 100°C, above 120°C, below 250°C, or below 200°C. The heating time in each heating step can be, for example, above 5 minutes, above 30 minutes, below 600 minutes, or below 300 minutes.

[0187] Other details regarding the planarization process:

[0188] The manufacturing method (1) of the laminated structure may or may not include the planarization process. The manufacturing method (2) of the laminated structure may or may not include the planarization process. When manufacturing a laminated structure having a first substrate and a second substrate, the manufacturing methods (1) and (2) of the laminated structure preferably include the planarization process. By performing the planarization process, even if the thickness of the cured layer disposed between the second photocurable layer (or the second photocurable and thermocurable layer) and the second substrate is small, the adhesion between the cured layer and the second substrate can be improved.

[0189] In the method (1) for manufacturing the laminated structure, the planarization process can be performed before or after the process for heating the first and second photocurable layers. In the method (1), it is preferable to perform planarization on the surface of the second photocurable layer opposite to the first substrate side after the process for heating the first and second photocurable layers. In the method (2) for manufacturing the laminated structure, the planarization process can be performed before or after the process for heating the second photocurable layer. In the method (2), it is preferable to perform planarization on the surface of the second photocurable layer opposite to the first substrate side after the process for heating the second photocurable layer. In these cases, the bonding force between the substrate and the cured layer can be improved, and because the strength of the cured layer can be increased, it is possible to suppress situations such as the cured layer peeling off from the first substrate or damage to the cured layer during planarization.

[0190] Examples of planarization processes include grinding. Examples of grinding processes include cutting grinding based on diamond grinding discs and chemical mechanical polishing.

[0191] From the viewpoint that the planarization process is easy to perform, the planarization process is preferably a grinding process. From the viewpoint that the planarization process is particularly easy, the grinding process is preferably a cutting grinding process based on machining with a diamond grinding wheel, and more preferably a combination of cutting grinding process based on machining with a diamond grinding wheel and chemical mechanical polishing process.

[0192] Examples of devices that can be used in the planarization process (grinding process) include the "Planarization Device" manufactured by Keylink and the "DFS8910" manufactured by DISCO.

[0193] The absolute value of the difference between the maximum and minimum height of the surface of the second photocurable layer (or the second photocurable layer) after planarization is preferably 5 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less. If the absolute value of the difference is below the upper limit, it can further effectively suppress poor bonding and further effectively suppress the tilting of the component bonded to the planarized surface. It should be noted that the absolute value of the difference can be 0.5 μm or more.

[0194] Other details regarding the configuration process:

[0195] The manufacturing methods (1) and (2) of the laminated structure may or may not include the configuration step. The manufacturing method (1) of the laminated structure preferably includes a configuration step in which a second substrate is disposed on the surface of the third photocurable layer opposite to the first substrate side. It should be noted that in the manufacturing method (1) of the laminated structure, if the step for heating the third photocurable layer is performed before the configuration step, the second substrate is disposed on the surface of the third photocurable layer opposite to the first substrate side in the configuration step. The manufacturing method (2) of the laminated structure preferably includes a configuration step in which a second substrate is disposed on the surface of the first photocurable layer opposite to the first substrate side. It should be noted that in the manufacturing method (2) of the laminated structure, if the step for heating the first photocurable layer is performed before the configuration step, the second substrate is disposed on the surface of the first photocurable layer opposite to the first substrate side in the configuration step.

[0196] The method for configuring the second substrate is not particularly limited.

[0197] The first substrate and the second substrate can be the same substrate or different substrates.

[0198] The substrate in contact with the cured layer of the second composition is preferably a substrate with an uneven surface, or a substrate with a primer coating. In this case, the adhesion to the cured layer of the second composition can be further improved, and the effects of the present invention can be further effectively realized. Furthermore, long-term reliability can be improved. Methods for forming an uneven surface on the substrate include using a brush and sandblasting.

[0199] The surface roughness of the substrate in contact with the cured layer of the first composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. In the method (2) for manufacturing the laminated structure, the substrate in contact with the cured layer of the first composition is the second substrate, and the substrate in contact with the cured layer of the second composition is the first substrate. Therefore, in the method (2) for manufacturing the laminated structure, the surface roughness of the second substrate is preferably smaller than the surface roughness of the first substrate.

[0200] The surface roughness refers to the surface roughness of the area in contact with the cured layer of the first composition, the second composition, or the third composition. Furthermore, the surface roughness refers to the arithmetic mean roughness Ra measured in accordance with JIS B0601:1994.

[0201] The surface roughness of the substrate in contact with the cured layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, more preferably 1000 nm or less, and more preferably 500 nm or less.

[0202] The absolute value of the difference between the surface roughness of the substrate in contact with the cured layer of the first composition and the surface roughness of the substrate in contact with the cured layer of the second composition is preferably 50 nm or more, more preferably 100 nm or more, more preferably 900 nm or less, and more preferably 800 nm or less.

[0203] In the manufacturing method (1) of the laminated structure, the first substrate is preferably a ceramic substrate or a silicon substrate, more preferably a silicon substrate. In the manufacturing method (1) of the laminated structure, the second substrate is preferably a glass substrate.

[0204] In the manufacturing method (2) of the laminated structure, the first substrate is preferably a ceramic substrate or a silicon substrate, more preferably a ceramic substrate. In the manufacturing method (2) of the laminated structure, the second substrate is preferably a glass substrate.

[0205] (device)

[0206] This specification also discloses an apparatus for manufacturing the laminated structure. The apparatus includes: a platform, a first ejector for ejecting the first composition, a second ejector for ejecting the second composition, and a first light irradiation unit disposed between the first and second ejector portions. When the first composition and the third composition are different compositions, the apparatus preferably includes a third ejector for ejecting the third composition.

[0207] The first ejection section is preferably an inkjet head, the second ejection section is preferably an inkjet head, and the third ejection section is preferably an inkjet head. The device is preferably an inkjet device.

[0208] The following describes in detail a device that does not have a third ejection section, but the third ejection section may be configured to be the same as the first ejection section or the second ejection section.

[0209] The device may have only one first ejector for ejecting the first composition, or it may have two or more. Similarly, the device may have only one second ejector for ejecting the second composition, or it may have two or more. When the device has multiple first and second ejector sections, the manufacturing efficiency of the laminated structure can be improved.

[0210] From the viewpoint of improving the manufacturing efficiency of the laminated structure, the device preferably includes a second light irradiation unit disposed on the side of the first ejector portion opposite to the first light irradiation unit, or disposed on the side of the second ejector portion opposite to the first light irradiation unit. In this case, the second light irradiation unit may be disposed on the side of the first ejector portion opposite to the first light irradiation unit, or on the side of the second ejector portion opposite to the first light irradiation unit, or on both sides of the first ejector portion opposite to the first light irradiation unit and the second ejector portion opposite to the first light irradiation unit.

[0211] However, the apparatus may also lack the second light irradiation unit. In the absence of the second light irradiation unit, the first light irradiation unit is used to perform the first photocuring process and the second photocuring process.

[0212] Preferably, both the first and second light irradiation units can irradiate ultraviolet light. The first light irradiation unit is preferably a first ultraviolet irradiation unit, and the second light irradiation unit is preferably a second ultraviolet irradiation unit.

[0213] Examples of the first and second ultraviolet irradiation units include light-emitting diodes (UV-LEDs) that generate ultraviolet light.

[0214] Furthermore, the device can be as follows: Figure 11 As shown in (a), it includes a first ink container 16 storing the first composition and a first circulation flow section 17, which can be used as follows: Figure 11 As shown in (b), the device includes a second ink tank 18 storing the second composition and a second circulation path 19. A first circulation path 17 connects the first ink tank 16 and the first ejection section 12. The first composition flows within the first circulation path 17. Furthermore, the second circulation path 19 connects the second ink tank 18 and the second ejection section 14. The second composition flows within the second circulation path 19.

[0215] The first circulation flow path section 17 includes a buffer tank 17A and a pump 17B. However, as Figure 12 As shown in (a), the first circulation flow path section 17X may also not have a buffer tank and a pump. Preferably, the first circulation flow path section includes the buffer tank and the pump. Furthermore, in addition to the buffer tank and the pump, the first circulation flow path section may also include a flow meter, a thermometer, a filter, a liquid level sensor, etc.

[0216] The second circulation flow section 19 includes a buffer tank 19A and a pump 19B. However, as... Figure 12 As shown in (b), the second circulation flow path section 19X may also be without a buffer tank and a pump. Preferably, the second circulation flow path section includes the buffer tank and the pump. Furthermore, in addition to the buffer tank and the pump, the second circulation flow path section may also include a flow meter, a thermometer, a filter, a liquid level sensor, etc.

[0217] When buffer tanks 17A and 19A or pumps 17B and 19B are provided, the buffer tanks 17A and 19A and the pumps 17B and 19B are preferably disposed between the ejection sections 12 and 14 and the ink tanks 16 and 18, respectively. The buffer tanks 17A and 19A are closer to the ejection sections 12 and 14 than the pumps 17B and 19B. The pumps 17B and 19B are closer to the ink tanks 16 and 18 than the buffer tanks 17A and 19A. The first composition is temporarily stored in the buffer tank 17A. The second composition is temporarily stored in the buffer tank 19A.

[0218] Regarding the circulation method of the first and second compositions, the compositions can be circulated using their own weight or by pressurizing or depressurizing using pumps. Various combinations of these methods can also be used. Examples of pumps include cylindrical pulsation-free pumps, propeller pumps, gear pumps, and diaphragm pumps. From the viewpoint of improving circulation efficiency and further improving the formation accuracy of the cured layer, the first and second circulation flow paths preferably include pumps that transfer the first and second compositions within the first and second circulation flow paths.

[0219] From the viewpoint of further improving the formation accuracy of the cured layer, the first and second circulation flow paths preferably include buffer tanks in which the first and second compositions are temporarily stored.

[0220] While heating and circulating the first and second compositions, the temperature of the first and second compositions can be adjusted by introducing heaters into the first and second ink cans or by using heaters in the first and second circulation paths.

[0221] The first circulation flow path is preferably a circulation flow path for circulating the first composition at a temperature of 30°C or higher, more preferably a circulation flow path for circulating it at a temperature of 40°C or higher, more preferably a circulation flow path for circulating it at a temperature of 100°C or lower, and more preferably a circulation flow path for circulating it at a temperature of 90°C or lower. In this case, the viscosity of the first composition can be optimized, and the ejectibility of the first composition can be improved.

[0222] The second circulation flow path is preferably a circulation flow path for circulating the second composition at a temperature of 30°C or higher, more preferably a circulation flow path for circulating it at a temperature of 40°C or higher, more preferably a circulation flow path for circulating it at a temperature of 100°C or lower, and more preferably a circulation flow path for circulating it at a temperature of 90°C or lower. In this case, the viscosity of the second composition can be optimized, and the ejectibility of the second composition can be improved.

[0223] In the ejection nozzle of the ejection section, it is preferable to maintain an appropriate pressure with minimal pressure fluctuations (pulsations) within that range. When using a pump or the like, it is preferable to install an attenuator between the pump and the ejection section to suppress pump pulsation. Examples of such attenuators include buffer tanks for temporarily storing the first and second compositions, and diaphragm dampers.

[0224] In the first and second coating processes, within the apparatus, after the first and second compositions are moved from the first and second ink tanks to the first and second ejection sections, the first and second compositions that are not ejected from the first and second ejection sections are allowed to flow within the first and second circulation paths and move towards the first and second ink tanks. This allows coating to be performed while the first and second compositions are circulated during the first and second coating processes.

[0225] (Layered structure)

[0226] The laminated structure of the present invention comprises: a first substrate, a first layer (layer X) disposed on the surface of the first substrate, and a second layer (layer Y) disposed on the surface of the first layer on the side opposite to the first substrate side. In the laminated structure of the present invention, the combination of the first layer and the second layer is either combination A or combination B. Combination A: The first layer is a photocurable layer or a photo- and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent; and the second layer is a photocurable layer or a photo- and thermocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. Combination B: The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent. In the laminated structure of the present invention, the first composition and the second composition are different compositions. The laminated structure of the present invention can satisfy either Combination A or Combination B.

[0227] By curing the first composition, a first layer is formed as a cured layer of the first composition. By curing the second composition, a second layer is formed as a cured layer of the second composition. More specifically, by irradiating the first composition with light such as ultraviolet light to cure it, a first layer as a light-cured layer of the first composition is formed. By irradiating the second composition with light such as ultraviolet light to cure it, a second layer as a light-cured layer of the second composition is formed.

[0228] When the laminated structure of the present invention satisfies combination A, the laminated structure of the present invention preferably further satisfies the following configuration. From the viewpoint of further effectively exerting the effects of the present invention, the first layer is preferably a photocurable layer of the first composition, and the second layer is preferably a photocurable layer of the second composition. The first layer (first photocurable layer) is formed as a photocurable layer by heating the photocurable layer (first photocurable layer) of the first composition. The second layer (second photocurable layer) is formed as a photocurable layer by heating the photocurable layer (second photocurable layer) of the second composition.

[0229] When the laminated structure of the present invention satisfies the aforementioned combination B, the laminated structure of the present invention preferably further satisfies the following configuration. From the viewpoint of further effectively exerting the effects of the present invention, the first layer is preferably a photocurable layer of the second composition, and the second layer is preferably a photocurable layer of the first composition. The first layer (second photocurable layer) is formed as a photocurable layer by heating the photocurable layer (second photocurable layer) of the second composition. The second layer (first photocurable layer) is formed as a photocurable layer by heating the photocurable layer (first photocurable layer) of the first composition.

[0230] The second layer preferably has a polished surface.

[0231] The laminated structure may include a third layer (layer Z) disposed on the surface of the second layer opposite to the side of the first layer. The third layer is a photocurable layer comprising a third composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. In the laminated structure, the second composition and the third composition are different compositions. When the laminated structure of the present invention satisfies combination A, the laminated structure of the present invention preferably includes the third layer.

[0232] The laminated structure preferably includes a second substrate disposed on the surface of the second layer opposite to the side of the first layer. When the laminated structure includes the third layer, the laminated structure preferably includes a second substrate disposed on the surface of the third layer opposite to the side of the second layer.

[0233] In the laminated structure, the surface roughness of the substrate in contact with the cured layer of the first composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. Similarly, in the laminated structure, the surface roughness of the substrate in contact with the cured layer of the third composition is preferably smaller than the surface roughness of the substrate in contact with the cured layer of the second composition. Therefore, in combination A, the surface roughness of the first substrate is preferably smaller than the surface roughness of the second substrate in the laminated structure. In combination B, the surface roughness of the second substrate is preferably smaller than the surface roughness of the first substrate in the laminated structure.

[0234] The surface roughness refers to the surface roughness of the area in contact with the cured layer of the first composition, the second composition, or the third composition. Furthermore, the surface roughness refers to the arithmetic mean roughness Ra measured in accordance with JIS B0601:1994.

[0235] In the laminated structure, the surface roughness of the substrate in contact with the cured layer of the second composition is preferably 100 nm or more, more preferably 200 nm or more, more preferably 1000 nm or less, and more preferably 500 nm or less.

[0236] In the laminated structure, the absolute value of the difference between the surface roughness of the substrate in contact with the cured layer of the first composition and the surface roughness of the substrate in contact with the cured layer of the second composition is preferably 50 nm or more, more preferably 100 nm or more, more preferably 900 nm or less, and more preferably 800 nm or less.

[0237] From the viewpoint of further effectively utilizing the effects of the present invention, the thickness of the second layer is preferably thicker than the thickness of the first layer, more preferably 40 μm or more thicker than the thickness of the first layer, and even more preferably 50 μm or more thicker than the thickness of the first layer.

[0238] From the viewpoint of further effectively utilizing the effects of the present invention, the thickness of the second layer is preferably thicker than the thickness of the third layer, more preferably 40 μm or more thicker than the thickness of the third layer, and even more preferably 50 μm or more thicker than the thickness of the third layer.

[0239] From the viewpoint of further effectively utilizing the effects of the present invention, the thickness of the first layer is preferably 0.1 μm or more, more preferably 0.3 μm or more, preferably 10 μm or less, and more preferably 5 μm or less.

[0240] From the viewpoint of further effectively utilizing the effects of the present invention, the thickness of the second layer is preferably 40 μm or more, more preferably 50 μm or more, preferably 1000 μm or less, and more preferably 800 μm or less.

[0241] From the viewpoint of further effectively utilizing the effects of the present invention, the thickness of the third layer is preferably 0.1 μm or more, more preferably 0.3 μm or more, preferably 10 μm or less, and more preferably 5 μm or less.

[0242] In the laminate of the first and second layers, the thickness-to-width ratio (thickness / width) is preferably 0.01 or more, more preferably 0.1 or more, preferably 200 or less, and more preferably 150 or less. If the ratio (thickness / width) is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0243] In the stack of the first layer, the second layer, and the third layer, the thickness-to-width ratio (thickness / width) is preferably 0.01 or more, more preferably 0.1 or more, preferably 200 or less, and more preferably 150 or less. If the ratio (thickness / width) is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0244] In the second layer, the thickness-to-width ratio (thickness / width) is preferably 0.01 or more, more preferably 0.1 or more, preferably 200 or less, and more preferably 150 or less. If the ratio (thickness / width) is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0245] (Inkjet Composition Kit)

[0246] The inkjet composition kit includes the first composition and the second composition. The first composition and the second composition are not mixed in the inkjet composition kit. The first composition is preferably housed in a first container, and the second composition is preferably housed in a second container. The inkjet composition kit is a kit of the first composition and the second composition. The inkjet composition kit is preferably used in a manner where the second composition is applied after the first composition is applied. The inkjet composition kit is preferably used in a manner where the first composition is applied and photocured, followed by the second composition and photocuring. The inkjet composition kit is preferably used to manufacture the laminated structure.

[0247] The inkjet composition kit may include a third composition. In this case, the first composition, the second composition, and the third composition are not mixed. The third composition is preferably housed in a third container. The inkjet composition kit having the third composition is a kit of the first composition, the second composition, and the third composition. Furthermore, when the first photocurable layer (or the first photocurable and thermocurable layer) and the third photocurable layer (or the third photocurable and thermocurable layer) are formed using the same composition, the first composition in the kit of the first composition and the second composition can be used to form the third photocurable layer (or the third photocurable and thermocurable layer).

[0248] Figure 13 This is a schematic cross-sectional view of the inkjet composition kit according to the first embodiment of the present invention.

[0249] The inkjet composition kit 5 has a first container 101, a first composition 1, a second container 102, and a second composition 2. The first container 101 contains the first composition 1. The second container 102 contains the second composition 2.

[0250] In the manufacturing method of the laminated structure, more of the second composition is consumed compared to the first composition. Therefore, in the inkjet composition kit, the amount (volume) of the first composition contained in the first container is preferably greater than the amount (volume) of the first composition contained in the second composition contained in the second container.

[0251] (Composition 1, Composition 2, and Composition 3)

[0252] The following describes in detail the components contained in the first composition, the second composition, and the third composition. It should be noted that, in this specification, "(meth)acrylate" refers to one or both of "acrylate" and "methacrylate".

[0253] The first composition is different from the second composition, and the third composition is different from the second composition. That is, the first composition has a different composition from the second composition, and the third composition has a different composition from the second composition. The first composition and the third composition can be different compositions or the same composition. From the viewpoint of improving the manufacturing efficiency of the laminated structure, it is preferable that the first composition and the third composition are the same composition. That is, it is preferable that the first composition and the third composition have the same composition.

[0254] The first and third compositions comprise a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition comprises a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.

[0255] It should be noted that the first and third compositions may each contain a polyfunctional (meth)acrylate compound, or may not contain one. Furthermore, the second composition may contain a monofunctional (meth)acrylate compound, or may not contain one. When both the first and second compositions contain polyfunctional (meth)acrylate compounds, the polyfunctional (meth)acrylate compounds in the first composition may be the same as those in the second composition. When both the third and second compositions contain polyfunctional (meth)acrylate compounds, the polyfunctional (meth)acrylate compounds in the third composition may be the same as those in the second composition. When both the first and second compositions contain monofunctional (meth)acrylate compounds, the monofunctional (meth)acrylate compounds in the first composition may be the same as those in the second composition. When both the third composition and the second composition contain a monofunctional (meth)acrylate compound, the monofunctional (meth)acrylate compound contained in the third composition may be the same as or different from the monofunctional (meth)acrylate compound contained in the second composition.

[0256] <(meth)acrylate compounds>

[0257] The first composition comprises a monofunctional (meth)acrylate compound. The second composition comprises a polyfunctional (meth)acrylate compound. The third composition comprises a monofunctional (meth)acrylate compound. It should be noted that, in this specification, (meth)acrylate compounds having an epoxy group are not considered epoxy compounds, but rather (meth)acrylate compounds. Only one of the monofunctional (meth)acrylate compounds and the polyfunctional (meth)acrylate compounds may be used, or two or more may be used in combination.

[0258] Examples of monofunctional (meth)acrylate compounds include methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl methacrylate, 4-hydroxybutyl methacrylate, allyl methacrylate, benzyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, 2-methoxyethyl methacrylate, and 2-phenoxy methacrylate. Ethyl methacrylate, methoxydiethylene glycol methacrylate, methoxytriethylene glycol methacrylate, methoxypropylene glycol methacrylate, methoxydipropylene glycol methacrylate, isodecyl methacrylate, isononyl methacrylate, isobornyl methacrylate, dicyclopentadienyl methacrylate, 2-hydroxy-3-phenoxypropyl methacrylate, glyceryl mono(meth)acrylate, 2-ethylhexyl methacrylate, dihydroxycyclopentadienyl methacrylate, dicyclopentenyl methacrylate, dicyclopentenyl methacrylate, dicyclopentoxyethyl methacrylate, dicyclopentyl methacrylate, naphthyl methacrylate, lauryl methacrylate, dodecyl methacrylate, and stearyl methacrylate, etc.

[0259] The multifunctional (meth)acrylate compound can be a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, or a (meth)acrylate compound with more than four functions.

[0260] Examples of the difunctional (meth)acrylate compounds include, for example, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propylene glycol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligomeric polyethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropylene glycol di(meth)acrylate, tricyclodecane di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0261] Examples of trifunctional (meth)acrylate compounds include, for example, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane oxide-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid oxide-modified tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate.

[0262] Examples of the tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, di(trimethylolpropane)tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate.

[0263] Examples of the five-functional (meth)acrylate compounds include, for example, sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0264] Examples of hexafunctional (meth)acrylate compounds include, for example, dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and phosphazene oxide-modified hexa(meth)acrylate.

[0265] Furthermore, examples of the epoxy-containing (meth)acrylate compounds include glyceryl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glyceryl ether.

[0266] From the viewpoint of further effectively utilizing the effects of the present invention, the glass transition temperatures of the homopolymers of the monofunctional (meth)acrylate compounds contained in the first composition and the third composition are preferably -100°C or higher, more preferably -90°C or higher, more preferably less than 0°C, and more preferably -10°C or lower.

[0267] From the viewpoint of further effectively utilizing the effects of the present invention, the glass transition temperature of the homopolymer of the polyfunctional (meth)acrylate compound included in the second composition is preferably 50°C or higher, more preferably 80°C or higher, preferably 200°C or lower, and more preferably 180°C or lower.

[0268] The polymerization method for obtaining the homopolymer is not particularly limited. The homopolymer can be obtained by polymerizing the monofunctional (meth)acrylate compound or the polyfunctional (meth)acrylate compound individually using known methods. In the polymerization method, all of the monofunctional (meth)acrylate compound or all of the polyfunctional (meth)acrylate compound can be polymerized at once, or the monofunctional (meth)acrylate compound or the polyfunctional (meth)acrylate compound can be added stepwise during polymerization.

[0269] The glass transition temperature can be measured according to JIS-K7121 using a differential scanning calorimeter at a heating rate of 10°C / min. Examples of such differential scanning calorimeters include the HITACHI HIGH-TECHSCIENCE "DSC7020".

[0270] From the viewpoint of further effectively realizing the effects of the present invention, the monofunctional (meth)acrylate compounds included in the first and third compositions are preferably compounds in which a group having four or more carbon atoms is bonded to the oxygen atom of the ester structure constituting the acrylic acid structural moiety. The group having four or more carbon atoms can be a branched group or a non-branched group (a group having a straight-chain structure). The monofunctional (meth)acrylate compounds included in the first and third compositions are preferably isodecanyl acrylate, isononyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, or dodecane acrylate. These monofunctional (meth)acrylate compounds are compounds in which a group having four or more carbon atoms is bonded to the oxygen atom of the ester structure constituting the acrylic acid structural moiety.

[0271] From the viewpoint of further effectively utilizing the effects of the present invention, the polyfunctional (meth)acrylate compound included in the second composition is preferably a difunctional or trifunctional (meth)acrylate compound.

[0272] From the viewpoint of further effectively realizing the effects of the present invention, the polyfunctional (meth)acrylate compound included in the second composition is preferably trimethylolpropane triacrylate, 1,6-hexanediol diacrylate or dicyclopentenyldimethylethanol diacrylate.

[0273] In the first composition (100% by weight) or the third composition (100% by weight), the content of the monofunctional (meth)acrylate compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 95% by weight or less, and more preferably 90% by weight or less. If the content of the monofunctional (meth)acrylate compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0274] When the first composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the first composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. When the third composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the third composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, more preferably 30% by weight or less. If the content of the polyfunctional (meth)acrylate compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0275] In the second composition, 100% by weight, the content of the polyfunctional (meth)acrylate compound is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 99% by weight or less, and more preferably 90% by weight or less. If the content of the polyfunctional (meth)acrylate compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0276] When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 50% by weight or less, and more preferably 30% by weight or less. If the content of the monofunctional (meth)acrylate compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0277] When the first composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the first composition is preferably less than the content of the polyfunctional (meth)acrylate compound in 100% by weight of the second composition. When the third composition contains the polyfunctional (meth)acrylate compound, the content of the polyfunctional (meth)acrylate compound in 100% by weight of the third composition is preferably less than the content of the polyfunctional (meth)acrylate compound in 100% by weight of the second composition. In this case, the effects of the invention can be further effectively achieved.

[0278] When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably less than the content of the monofunctional (meth)acrylate compound in 100% by weight of the first composition. When the second composition contains the monofunctional (meth)acrylate compound, the content of the monofunctional (meth)acrylate compound in 100% by weight of the second composition is preferably less than the content of the monofunctional (meth)acrylate compound in 100% by weight of the third composition. In this case, the effects of the invention can be further effectively achieved.

[0279] <Epoxy Compounds>

[0280] The first composition contains an epoxy compound. The second composition contains an epoxy compound. The third composition contains an epoxy compound. The epoxy compounds contained in the first composition, the second composition, and the third composition may be the same or different. Only one type of epoxy compound may be used, or two or more may be used in combination.

[0281] Examples of such epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenolic varnish type epoxy compounds, biphenyl type epoxy compounds, biphenyl phenolic varnish type epoxy compounds, bisphenol type epoxy compounds, naphthyl type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthyl ether type epoxy compounds, and epoxy compounds having a triazine core in the skeleton.

[0282] From the viewpoint of further effectively realizing the effects of the present invention, the epoxy compounds contained in the first composition and the third composition are preferably bisphenol A type epoxy compounds or dicyclopentadiene type epoxy compounds, respectively.

[0283] From the viewpoint of further effectively realizing the effects of the present invention, the epoxy compound included in the second composition is preferably a bisphenol A type epoxy compound or a dicyclopentadiene type epoxy compound.

[0284] In the first composition (100% by weight) or the third composition (100% by weight), the content of the epoxy compound is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 90% by weight or less, and more preferably 70% by weight or less. If the content of the epoxy compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0285] In the second composition (100% by weight), the content of the epoxy compound is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 90% by weight or less, and more preferably 70% by weight or less. If the content of the epoxy compound is above the lower limit and below the upper limit, the effects of the present invention can be further effectively achieved.

[0286] Photopolymerization initiators

[0287] The first composition contains a photopolymerization initiator. The second composition contains a photopolymerization initiator. The third composition contains a photopolymerization initiator. The photopolymerization initiators contained in the first composition, the second composition, and the third composition may be the same or different. Only one photopolymerization initiator may be used, or two or more may be used in combination.

[0288] Examples of photopolymerization initiators include photoradical polymerization initiators and photocationic polymerization initiators. Preferably, the photopolymerization initiator is a photoradical polymerization initiator. Only one type of photopolymerization initiator may be used, or two or more may be used in combination.

[0289] The aforementioned photoradical polymerization initiator is a compound used to generate free radicals through light irradiation, thereby initiating a free radical polymerization reaction. Examples of such photoradical polymerization initiators include benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkyl phenyl ketone compounds such as 2-hydroxy-2-methyl-1-phenyl-propane-1-one; acetophenone compounds such as 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholine. 1-Linol-propane-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, 1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]-1-butanone, N,N-dimethylaminoacetophenone and other aminoacetophenone compounds; 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthracene Anthraquinone compounds such as quinones; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyl oxime)], Oxime esters such as ethanone and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyl oxime); and titanoceramic compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrolo-1-yl)phenyl)titanium. The photoradical polymerization initiator can be a single type or a combination of two or more types.

[0290] Photopolymerization initiation aids can be used in conjunction with the aforementioned photoradical polymerization initiator. Examples of such photopolymerization initiation aids include ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiation aids may also be used. Only one photopolymerization initiation aid may be used, or two or more may be used in combination.

[0291] In addition, titanium cyclopentadienyl compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals) that have absorption in the visible light region can also be used to promote photoreaction.

[0292] Examples of photocationic polymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzoin tosylates. Only one photocationic polymerization initiator may be used, or two or more may be used in combination.

[0293] In the first composition, 100% by weight, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, and more preferably 20% by weight or less.

[0294] In the second composition, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, and more preferably 20% by weight or less, in 100% by weight of the second composition.

[0295] In the third composition, the content of the photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, preferably 30% by weight or less, and more preferably 20% by weight or less, in 100% by weight of the composition.

[0296] <Thermosetting Agent>

[0297] The first composition contains a thermosetting agent. The second composition contains a thermosetting agent. The third composition contains a thermosetting agent. The thermosetting agents contained in the first composition, the second composition, and the third composition may be the same or different. Only one thermosetting agent may be used, or two or more may be used in combination.

[0298] Examples of thermosetting agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazole linen compounds, phenolic compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts can also be used as thermosetting agents. Other thermosetting agents may also be used.

[0299] The amine compound refers to a compound having one or more primary to tertiary amino groups. Examples of such amine compounds include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, acylhydrazides, and guanidine derivatives. Furthermore, epoxide addition polyamines (reaction products of epoxides and polyamines), Michael addition polyamines (reaction products of α,β-unsaturated ketones and polyamines), Mannich addition polyamines (condensations of polyamines, formalin, and phenols), thiourea addition polyamines (reaction products of thiourea and polyamines), and ketone-capped polyamines (reaction products of ketones and polyamines [ketimines]).

[0300] Examples of aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0301] Examples of alicyclic polyamines include mensen diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0302] Examples of such aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xyleneamine, m-xyleneamine, p-xyleneamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylenebis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0303] Examples of such acylhydrazides include carbodiacylhydrazides, adipic acid acylhydrazides, sebacyl acylhydrazides, dodecyl diacid acylhydrazides, and isophthalic acid acylhydrazides.

[0304] Examples of guanidine derivatives include dicyandiamide, 1-o-tribiguanidine, α-2,5-dimethylguanidine, α,ω-diphenyldiguanidine, α,α-biguanidinylguanidinyl diphenyl ether, p-chlorophenyldiguanidine, α,α-hexamethylenebis[ω-(p-chlorophenol)]biguanidine, phenyldiguanidinyl oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0305] Examples of such phenolic compounds include polyphenolic compounds. Examples of such polyphenolic compounds include phenol, cresol, ethylphenol, butanol, octol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, phenolic varnish resins containing a naphthalene skeleton, phenolic varnish resins containing a phenylenedimethyl skeleton, phenolic varnish resins containing a dicyclopentadiene skeleton, and phenolic varnish resins containing a fluorene skeleton.

[0306] Examples of such acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl succinic anhydride, chlorendic acid anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, methylcyclohexene tetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0307] In the first composition, 100% by weight, the content of the thermosetting agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight or less.

[0308] In the second composition, 100% by weight, the content of the thermosetting agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight or less.

[0309] In the third composition, 100% by weight, the content of the thermosetting agent is preferably 0.1% by weight or more, more preferably 1% by weight or more, preferably 50% by weight or less, and more preferably 40% by weight or less.

[0310] <Curing Accelerator>

[0311] The first composition may or may not contain a curing accelerator. The second composition may or may not contain a curing accelerator. The third composition may or may not contain a curing accelerator. The curing accelerators contained in the first composition, the second composition, and the third composition may be the same or different. Only one type of curing accelerator may be used, or two or more may be used in combination.

[0312] Examples of curing accelerators include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphorus salts, organometallic salts, phosphorus compounds, and urea compounds.

[0313] When the first composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the first composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.

[0314] When the second composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the second composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.

[0315] When the third composition contains the curing accelerator, the content of the curing accelerator in 100% by weight of the third composition is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 10% by weight or less, and more preferably 8% by weight or less.

[0316] (solvent)

[0317] The first composition may or may not contain a solvent. The second composition may or may not contain a solvent. The third composition may or may not contain a solvent. The solvents contained in the first composition, the second composition, and the third composition may be the same or different. Only one solvent may be used, or two or more solvents may be used in combination.

[0318] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the first composition and making it less prone to voids in the cured layer of the first composition, the lower the solvent content in the first composition, the better.

[0319] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the second composition and making it less prone to voids in the cured layer of the second composition, the lower the solvent content in the second composition, the better.

[0320] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the third composition and making it less prone to voids in the cured layer of the third composition, the lower the solvent content in the third composition, the better.

[0321] Examples of solvents include water and organic solvents.

[0322] From the viewpoint of further improving the removability of residues, the solvent is preferably an organic solvent.

[0323] Examples of organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolves, methyl cellosolves, butyl cellosolves, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether, etc., glycol ethers, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, esters such as propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum solvents such as petroleum ether and naphtha.

[0324] When the first composition contains the solvent, the solvent content in 100% by weight of the first composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. The first composition most preferably does not contain the solvent.

[0325] When the second composition contains the solvent, the solvent content in 100% by weight of the second composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. The second composition most preferably does not contain the solvent.

[0326] When the third composition contains the solvent, the solvent content in 100% by weight of the third composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. The third composition most preferably does not contain the solvent.

[0327] (filler)

[0328] The first composition may or may not contain filler. The second composition may or may not contain filler. The third composition may or may not contain filler. The filler contained in the first composition, the filler contained in the second composition, and the filler contained in the third composition may be the same or different. Only one type of filler may be used, or two or more types may be used in combination.

[0329] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the first composition and making it less prone to voids in the cured layer of the first composition, the lower the filler content in the first composition, the better. Furthermore, the lower the filler content in the first composition, the better it can suppress the occurrence of ejection defects caused by the inkjet device.

[0330] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the second composition and making it less prone to voids in the cured layer of the second composition, the lower the filler content in the second composition, the better. Furthermore, the lower the filler content in the second composition, the better it can suppress the occurrence of ejection defects caused by the inkjet device.

[0331] From the viewpoint of further improving the thickness accuracy of the cured layer (photocurable layer or photo- and thermo-curable layer) of the third composition and making it less prone to voids in the cured layer of the third composition, the lower the filler content in the third composition, the better. Furthermore, the lower the filler content in the third composition, the better it can suppress the occurrence of ejection defects caused by the inkjet device.

[0332] Examples of fillers include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

[0333] When the first composition contains the filler, the filler content is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less in 100% by weight of the first composition. Most preferably, the first composition does not contain the filler.

[0334] When the second composition contains the filler, the filler content in 100% by weight of the second composition is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less. The second composition most preferably does not contain the filler.

[0335] When the third composition contains the filler, the filler content in 100% by weight of the third composition is preferably 30% by weight or less, more preferably 10% by weight or less, and even more preferably 1% by weight or less. The third composition most preferably does not contain the filler.

[0336] (Other ingredients)

[0337] The first composition, the second composition, and the third composition may each contain other components. These other components are not particularly limited and may include coupling agents and other binding aids, pigments, dyes, leveling agents, defoamers, and polymerization inhibitors.

[0338] (Other details and electronic components)

[0339] In the case of the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, since the leakage prevention of the material can be improved, it can be suitably used to form partition materials and dams in electronic components. However, the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention can also be used for purposes other than this. For example, in the manufacturing method of the laminated structure, the laminated structure, and the inkjet composition kit of the present invention, the first layer and the second layer can also be used to form a coating agent.

[0340] Figure 14 This is a cross-sectional view showing an electronic component obtained using the stacked structure according to the first embodiment of the present invention. Figure 14 (a) is a top view of the electronic component. Figure 14 (b) is along Figure 14 (a) is a cross-sectional view of line II.

[0341] Electronic component 80 includes a laminated structure 4C. The laminated structure 4C includes: a first substrate 3, a first photocurable layer (first layer) 1B, a second photocurable layer (second layer) 2B, an underfill material 60, solder balls 65, and a semiconductor chip 70. The first photocurable layer 1B is formed by photocuring and thermally curing the first composition. The second photocurable layer 2B is formed by photocuring and thermally curing the second composition.

[0342] On the surface of the substrate 3, the first photocurable and thermocurable layer 1B and the second photocurable and thermocurable layer 2B are arranged in a frame shape. Inside the frame-shaped area, a bottom filler material 60, solder balls 65, and a semiconductor chip 70 are disposed.

[0343] Electronic components 80 can be obtained by flowing bottom filler material 60 into the inner side of the frame-shaped region. In this invention, due to the use of specific first composition and specific second composition, the bottom filler material 60 is less likely to leak out to the outer side of the frame-shaped region when and after flowing into the inner side of the frame-shaped region.

[0344] The present invention will now be specifically described by way of examples and comparative examples. The present invention is not limited to the examples described below.

[0345] The following materials have been prepared.

[0346] (Monofunctional (meth)acrylate compounds)

[0347] Isodecyl acrylate (manufactured by Osaka Organic Chemicals Co., Ltd., "IDAA", glass transition temperature of homopolymer is -68°C)

[0348] Isononyl acrylate (manufactured by Osaka Organic Chemicals Co., Ltd., "INAA", glass transition temperature of homopolymer is -60°C)

[0349] (Multifunctional (meth)acrylate compounds)

[0350] Trimethylolpropane triacrylate (TMPTA, manufactured by Daicel Allnex, with a glass transition temperature of 58°C for the homopolymer)

[0351] 1,6-Hexanediol diacrylate (DAICL ALLNEX "HDDA", glass transition temperature of homopolymer 98°C)

[0352] (Epoxy compounds)

[0353] Dicyclopentadiene type epoxy compound (DIC Company "HP7200L")

[0354] Bisphenol A type epoxy compound (DIC Company "EXA-850CRP")

[0355] (Photopolymerization initiator)

[0356] 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (IGMresins, “Omnirad 379EG”)

[0357] (Thermosetting agent)

[0358] Aromatic amine compound (ADEKA "EH-105L")

[0359] (Substrate)

[0360] Silicon wafer (surface roughness Ra in the area in contact with the composition: 0.5 nm)

[0361] Surface roughness Ra of the glass substrate (in the area in contact with the composition: 1 nm)

[0362] Ceramic substrate (surface roughness Ra in the area in contact with the composition: 380 nm)

[0363] Inkjet unit:

[0364] An inkjet device is prepared having the following components: a platform with vacuum adsorption function, a first ejector section, a second ejector section, and a first ultraviolet irradiation unit (LED) disposed between the first ejector section and the second ejector section.

[0365] (Examples 1-8 and Comparative Examples 1-3)

[0366] Preparation of Composition 1:

[0367] The components shown in Tables 1 to 3 were combined in the amounts shown in Tables 1 to 3 to obtain the first composition.

[0368] Preparation of the second composition:

[0369] The components shown in Tables 1 to 3 were combined in the amounts shown in Tables 1 to 3 to obtain the second composition.

[0370] (Comparative Example 4)

[0371] Preparation of Composition 1:

[0372] The components shown in Table 3 were combined in the amounts shown in Table 3 to obtain the first composition.

[0373] It should be noted that the second composition was not used.

[0374] (Comparative Example 5)

[0375] Preparation of the second composition:

[0376] The components shown in Table 3 were combined in the proportions shown in Table 3 to obtain the second composition. It should be noted that the first composition was not used.

[0377] (evaluate)

[0378] (1) Shape retention of the UV-cured layer

[0379] (1-1) In Examples 1 to 4 and Comparative Examples 1 to 3, a laminated structure (X) having a photocurable layer was fabricated as described below.

[0380] Fabrication of a laminated structure (X) with a photocurable layer:

[0381] The silicon wafer is adsorbed onto the platform and fixed. The first composition is ejected from the first ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The first composition was photocured by irradiation with 365nm ultraviolet light for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a first layer (photocured layer) with a straight shape of 150μm width, 10mm length and 3μm thickness was formed.

[0382] Next, the second composition is sprayed from the second spray nozzle onto the surface of the first layer (UV-cured layer). 0.1 seconds after spraying, the composition is irradiated by the first UV irradiation unit at an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocurable layer) with a straight line shape of 150 μm width, 10 mm length and 100 μm thickness was formed on the surface of the first layer (photocurable layer).

[0383] Thus, a stacked structure (X) consisting of a substrate (silicon wafer), a first layer (photocurable layer), and a second layer (photocurable layer) is obtained.

[0384] (1-2) In Examples 5 to 8, except for the following changes, a laminated structure (X) having a photocurable layer was fabricated in the same manner as in Example 1.

[0385] In Example 5, a first layer (photocurable layer) with a straight line shape having a width of 300 μm, a length of 10 mm, and a thickness of 3 μm was formed, and a second layer (photocurable layer) with a straight line shape having a width of 300 μm, a length of 10 mm, and a thickness of 100 μm was formed.

[0386] In Example 6, a first layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 3 μm was formed, and a second layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 200 μm was formed.

[0387] In Example 7, a first layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 5 μm was formed, and a second layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 100 μm was formed.

[0388] In Example 8, a first layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 5 μm was formed, and a second layer (photocurable layer) with a straight line shape having a width of 150 μm, a length of 10 mm, and a thickness of 200 μm was formed.

[0389] (1-3) In Comparative Example 4, a laminated structure (X) having a photocurable layer was fabricated as described below.

[0390] Fabrication of a laminated structure (X) with a photocurable layer:

[0391] The silicon wafer is adsorbed onto the platform and fixed. The first composition is ejected from the first ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The first composition was photocured by irradiation with 365nm ultraviolet light for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a first layer (photocurable layer) with a linear shape of 150μm width, 10mm length, and 103μm thickness was formed. This is used as a laminated structure (X) having a photocurable layer.

[0392] (1-4) In Comparative Example 5, a laminated structure (X) having a photocurable layer was fabricated as described below.

[0393] Fabrication of a laminated structure (X) with a photocurable layer:

[0394] The silicon wafer is adsorbed onto the platform and fixed. The second composition is ejected from the second ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiation with 365nm ultraviolet light for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocurable layer) with a linear shape having a width of 150μm, a length of 10mm, and a thickness of 103μm was formed. This is used as a laminated structure (X) having a photocurable layer.

[0395] (1-5) It should be noted that the width and thickness of the first layer (photocurable layer) and the second layer (photocurable layer) in the laminated structure (X) were measured using a laser microscope (Olympus "OLS4100"). In Examples 1-8, the shape of the photocurable layer was maintained.

[0396] (2) Shape retention of light- and heat-cured layers

[0397] Fabrication of a laminated structure (X) with photocurable and thermocurable layers:

[0398] By heating the first and second layers (photocurable layers) of the obtained laminated structure (X) with photocurable layers at 170°C for 1 hour to perform thermocuring, the first and second layers, which are photocurable and thermocurable layers, are obtained. Thus, a laminated structure (X) having a substrate (silicon wafer), a first layer (photocurable and thermocurable layer), and a second layer (photocurable and thermocurable layer) is obtained.

[0399] The first and second layers (photocurable and thermocurable layers) of the laminated structure (X) were cut using a cross-section grinding device (Tegramin 25, Struers). The cross-sections of the first and second layers (photocurable and thermocurable layers) obtained by cutting were observed using an optical microscope (VH-Z100 digital microscope, Keyence), thereby measuring the thickness of the first and second layers respectively.

[0400] [Criteria for Determining the Shape Retention of Light- and Heat-Cured Layers]

[0401] ○: Before and after heating, there was no change in the thickness of each cured layer (the change rate was less than 5%).

[0402] △: Before and after heating, there are slight changes in the thickness of each cured layer (the change rate is greater than 5% but less than 10%).

[0403] ×: Before and after heating, there are changes in the thickness of each cured layer (the change rate is greater than 10%).

[0404] (3) Adhesion of powder

[0405] The silicon wafer is adsorbed onto the platform and fixed. The second composition is ejected from the second ejection section (in Comparative Example 4, the first composition is ejected from the first ejection section). 0.1 seconds after ejection, the silicon wafer is irradiated by the first ultraviolet irradiation section at an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiating it with 365nm ultraviolet light for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocured layer) with a width of 10mm, a length of 10mm, and a thickness of 20μm was formed.

[0406] Next, 100 mg of silica powder (NIPPON SHOKUBAI "Seaho Star KE-P250") was applied to the surface of the UV-cured layer, and nitrogen was sprayed onto the surface of the UV-cured layer at a rate of 400 L / min for 10 seconds. The amount of silica powder remaining on the surface of the UV-cured layer was measured.

[0407] <Criteria for Determining the Adhesion of Powders>

[0408] ○: The amount of residual silica powder is less than 10%.

[0409] ×: The amount of residual silica powder is more than 10%.

[0410] (4) Adhesion to the substrate and interlayer bonding (thermal and cold cycling test)

[0411] The laminated structure (X) with photocurable and thermocurable layers obtained in "(2) Shape retention of photocurable and thermocurable layers" was placed in a temperature cycling tester (Kusumoto Chemical Co., Ltd. "TA530A") and subjected to a total of 100 cycles of thermal cycling test, with "30 minutes at -40°C and 30 minutes at 125°C" as one cycle. After the thermal cycling test, the laminated structure (X) was sprayed with nitrogen at 400 L / min for 10 seconds. It was confirmed whether peeling occurred between the substrate and the first layer (or between the substrate and the second layer in Comparative Example 4), or between the first layer and the second layer.

[0412] Evaluation criteria for adhesion to substrate and interlayer bonding (thermal cycling test)

[0413] ○: No peeling occurred between the substrate and the substrate.

[0414] ×: Delamination occurred between the substrate and the substrate.

[0415] ○: No delamination occurred between layers.

[0416] ×: Delamination occurred between layers.

[0417] (5) Leak-proof properties of the material

[0418] The silicon wafer is adsorbed onto the platform and fixed. The first composition is ejected from the first ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The first composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a first layer (photocurable layer) with a square frame shape having a width of 150 μm, a side length of 10 mm, and a thickness of 3 μm was formed.

[0419] Next, the second composition is sprayed from the second spray nozzle onto the surface of the first layer (UV-cured layer). 0.1 seconds after spraying, the composition is irradiated by the first UV irradiation unit at an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocurable layer) with a square frame shape having a width of 150 μm, a side length of 10 mm, and a thickness of 100 μm was formed on the surface of the first layer (photocurable layer).

[0420] Next, the first and second layers (photocurable layers) were thermocured by heating at 170°C for 1 hour to obtain the first and second layers as photocurable and thermocurable layers. Thus, a laminated structure having a substrate (silicon wafer), a first layer (photocurable and thermocurable layer), and a second layer (photocurable and thermocurable layer) was obtained.

[0421] Production of Material X:

[0422] The following ingredients were mixed using a planetary mixer, and the resulting mixture was dispersed using three rollers to obtain material X.

[0423] 70 parts by weight of bisphenol F type epoxy resin (DIC company "EPICLON 830")

[0424] 30 parts by weight of reactive diluent (ED-529 manufactured by ADEKA)

[0425] 30 parts by weight of thermosetting agent (ADEKA "EH105L")

[0426] 300 parts by weight of fused silica (ADMATEX "SO-C5")

[0427] 3 parts by weight of coupling agent (JNC "S510")

[0428] Carbon black (Mitsubishi Chemical Corporation "MA-600") 0.5 parts by weight

[0429] Material X is filled into the inside of a light and heat-curable layer (a laminate of layer 1 and layer 2) with a square frame shape to a thickness of 50 μm, and material X is heat-cured by heating at 150°C for 1 hour.

[0430] Using an optical microscope (Keyence Digital Microscope VH-Z100), it was confirmed whether material X was exposed to the outside of the light and heat-cured layer.

[0431] It should be noted that in Comparative Example 4, after forming a first layer (photocurable layer) with a square frame shape having a width of 150 μm, a side length of 10 mm, and a thickness of 103 μm on a silicon wafer, the first layer (photocurable layer) was thermally cured by heating at 170°C for 1 hour to obtain a first layer as a photocurable and thermally cured layer. Otherwise, it was evaluated in the same manner as described above.

[0432] Furthermore, in Comparative Example 5, after forming a second layer (photocurable layer) with a square frame shape having a width of 150 μm, a side length of 10 mm, and a thickness of 103 μm on a silicon wafer, the second layer (photocurable layer) was thermally cured by heating at 170°C for 1 hour to obtain a second layer as a photocurable and thermally cured layer. Otherwise, it was evaluated in the same manner as described above.

[0433] <Criteria for Judging the Leak-Proofness of Materials>

[0434] ○: No leak confirmed

[0435] ×: Leakage confirmed

[0436] In Comparative Example 4, during thermosetting, the shape of the photocurable and thermocurable layer (the laminate of the first and second layers) changed, and the thickness of the photocurable and thermocurable layer decreased to approximately 30 μm. Therefore, material X leaked out to the outside of the photocurable and thermocurable layer. Furthermore, in Comparative Examples 1 to 3 and 5, the bonding force between the substrate (silicon wafer) and the first layer, or the bonding force between the first and second layers, was low, and therefore could not withstand the thermal expansion of material X, causing material X to leak out to the outside of the photocurable and thermocurable layer.

[0437] (Examples 9-14)

[0438] Preparation of Composition 1 and Composition 3:

[0439] The components shown in Tables 4 and 5 were combined in the amounts shown in Tables 4 and 5 to obtain the first composition and the third composition.

[0440] Preparation of the second composition:

[0441] The components shown in Tables 4 and 5 were combined in the proportions shown in Tables 4 and 5 to obtain the second composition.

[0442] (evaluate)

[0443] (1) Shape retention of the UV-cured layer

[0444] (1-1) In Example 9, a laminated structure (X) was manufactured as described below.

[0445] Fabrication of the layered structure (X):

[0446] The silicon wafer is adsorbed onto the platform and fixed. The first composition is ejected from the first ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The first composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a first layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm was formed.

[0447] Next, the second composition is sprayed from the second spray nozzle onto the surface of the first layer (UV-cured layer). 0.1 seconds after spraying, the composition is irradiated by the first UV irradiation unit at an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 1000 μm was formed on the surface of the first layer (photocurable layer).

[0448] Next, the third composition (the first composition) is sprayed onto the surface of the second layer (the UV-cured layer) by the first spraying section. 0.1 seconds after spraying, the first ultraviolet irradiation section applies an illuminance of 2000 mW / cm². 2 The third composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a third layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 10 μm was formed.

[0449] Next, using an adhesive (SHIBAURA MECHATRONICS "FTD-7000P"), a glass substrate is bonded to the surface of the third layer, and heated at 170°C for 1 hour, thereby thermally curing the first layer (photocurable layer), the second layer (photocurable layer), and the third layer (photocurable layer).

[0450] Thus, a stacked structure (X) is obtained having a first substrate (silicon wafer), a first layer (photocurable layer), a second layer (photocurable layer), a third layer (photocurable layer), and a second substrate (glass substrate) in sequence.

[0451] (1-2) In Examples 10 and 11, the following operations were further added: In addition to forming a third layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm, a laminated structure (X) was fabricated in the same manner as in Example 9.

[0452] After the formation of the second layer (photocurable layer) and before the ejection of the third composition, the first and second layers (photocurable layers) were thermally cured by heating the substrate (silicon wafer) and the laminate of the first and second layers (photocurable layers) at 170°C for 1 hour. Next, planarization was performed using a planarization apparatus (manufactured by Keylink Corporation) by cutting and grinding the surface of the second layer (photocurable and thermally cured layer) to a depth of 100 μm. It should be noted that in Examples 10 and 11, the absolute value of the difference between the maximum and minimum height of the surface of the second layer after planarization was less than 3 μm.

[0453] Thus, a stacked structure (X) is obtained, consisting of a substrate (silicon wafer), a first layer (photocurable layer), a second layer (photocurable layer), a third layer (photocurable layer), and a second substrate (glass substrate).

[0454] (1-3) In Example 12, a stacked structure (X) was fabricated as described below.

[0455] Fabrication of the layered structure (X):

[0456] The ceramic substrate is adsorbed onto the platform and fixed. The second composition is ejected from the second ejection section. 0.1 seconds after ejection, the first ultraviolet irradiation section provides an illuminance of 2000 mW / cm². 2 The second composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a second layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 1000 μm was formed on the surface of the substrate.

[0457] Next, the first composition is sprayed from the first spraying section onto the surface of the second layer (photocurable layer). 0.1 seconds after spraying, the composition is irradiated by the first ultraviolet irradiation section at an illuminance of 2000 mW / cm². 2 The first composition was photocured by irradiating it with ultraviolet light at a wavelength of 365 nm for 0.2 seconds. Through repeated coating and ultraviolet irradiation, a square frame-shaped first layer (photocurable layer) with a width of 200 μm, a side length of 10 mm, and a thickness of 10 μm was formed on the surface of the second layer (photocurable layer).

[0458] Next, an adhesive (SHIBAURA MECHATRONICS "FTD-7000P") is used to bond the glass substrate to the surface of the first layer, and the first layer (photocurable layer) and the second layer (photocurable layer) are heated at 170°C for 1 hour to thermally cure the first layer (photocurable layer) and the second layer (photocurable layer).

[0459] Thus, a laminated structure (X) is obtained, consisting of a substrate (ceramic substrate), a second layer (photocurable layer), a first layer (photocurable layer), and a substrate (glass substrate) in sequence.

[0460] (1-4) In Examples 13 and 14, the following operation was added: except that a first layer (photocurable layer) with a square frame shape having a width of 200 μm, a side length of 10 mm, and a thickness of 5 μm was formed, a laminated structure (X) was fabricated in the same manner as in Example 12.

[0461] After the formation of the second layer (photocurable layer) and before the ejection of the first composition, the laminate of the substrate (ceramic substrate) and the second layer (photocurable layer) was heated at 170°C for 1 hour, thereby thermally curing the second layer (photocurable layer). Next, planarization was performed using a planarization apparatus (manufactured by Keylink Corporation) by 100 μm cutting and grinding of the surface of the second layer (photocurable and thermocurable layer). It should be noted that in Examples 13 and 14, the absolute value of the difference between the maximum and minimum height of the second layer after planarization was less than 3 μm.

[0462] Thus, a laminated structure (X) is obtained, consisting of a substrate (ceramic substrate), a second layer (photocurable layer), a first layer (photocurable layer), and a substrate (glass substrate) in sequence.

[0463] (1-5) It should be noted that the width and thickness of the first layer (photocurable layer), the second layer (photocurable layer), and the third layer (photocurable layer) in the laminated structure (X) were measured using a laser microscope (Olympus "OLS4100"). In Examples 9-14, the shape of the photocurable layer was maintained.

[0464] (2) Shape retention of light- and heat-cured layers

[0465] The shape retention of the light and heat-cured layers was evaluated in the same manner as in the evaluation of Examples 1-8 and Comparative Examples 1-6, specifically in the evaluation of "(2) Shape retention of the light and heat-cured layers". It should be noted that this evaluation was not performed in Examples 10, 11, 13, and 14, in which planarization treatment was performed.

[0466] [Criteria for Determining the Shape Retention of Light- and Heat-Cured Layers]

[0467] ○: Before and after heating, there was no change in the thickness of each cured layer (the change rate was less than 5%).

[0468] △: Before and after heating, there are slight changes in the thickness of each cured layer (the change rate is greater than 5% but less than 10%).

[0469] ×: Before and after heating, there are changes in the thickness of each cured layer (the change rate is greater than 10%).

[0470] (3) Adhesion of powder

[0471] The adhesion of the powder to the second layer (photocurable layer) was evaluated in the same manner as in the evaluation of Examples 1-8 and Comparative Examples 1-6, specifically in the evaluation of "(3) Powder adhesion".

[0472] <Criteria for Determining the Adhesion of Powders>

[0473] ○: The amount of residual silica powder is less than 10%.

[0474] ×: The amount of residual silica powder is more than 10%.

[0475] (4) Adhesion to the substrate and interlayer bonding (thermal and cold cycling test)

[0476] In addition to using the obtained laminated structure (X), the adhesion to the substrate and the interlayer adhesion were evaluated in the same manner as the evaluation of Examples 1-8 and Comparative Examples 1-6, in the "adhesion to (4) substrate and interlayer adhesion (thermal and cold cycling test)". It should be noted that it was confirmed whether peeling occurred between the substrate and the first layer, between the first layer and the second layer, between the second layer and the third layer, or between the third layer and the substrate.

[0477] Evaluation criteria for adhesion to substrate and interlayer bonding (thermal cycling test)

[0478] ○: No peeling occurred between the substrate and the substrate.

[0479] ×: Delamination occurred between the substrate and the substrate.

[0480] ○: No delamination occurred between layers.

[0481] ×: Delamination occurred between layers.

[0482] (5) Leak-proof properties of the material (interface with the second substrate)

[0483] An injection port for material X is provided in the center of the substrate (glass substrate) of the laminated structure (X) obtained by laser cutting. Next, material X is filled into the inside of a photocurable layer having a square frame shape through the injection port, and heated at 150°C for 1 hour to thermocure material X. Using an optical microscope (Keyence Digital Microscope VH-Z100), it was confirmed in Examples 9-11 whether material X leaked between the second substrate (glass substrate) and the third layer, and in Examples 12-14 whether material X leaked between the second substrate (glass substrate) and the first layer.

[0484] <Criteria for Judging the Leak-Proofness of Materials>

[0485] ○: No leak confirmed

[0486] ×: Leakage confirmed

[0487] The composition and results are shown in Tables 1 to 5 below.

[0488]

[0489]

[0490]

[0491]

[0492]

[0493] Explanation of symbols

[0494] 1…First Composition

[0495] 1A…First UV-cured layer

[0496] 1B, 1D, 1E… First photocurable and thermocurable layer

[0497] 2…Second Composition

[0498] 2A…Second UV-cured layer

[0499] 2B, 2D, 2E… Second photocurable and thermocurable layer

[0500] 3…First substrate

[0501] 4A, 4B, 4C, 4D, 4E…Layered structures

[0502] 5…Inkjet Composition Kit

[0503] 6D…3rd photocurable and thermocurable layer

[0504] 7…Second substrate

[0505] 10… Device

[0506] 11… platform

[0507] 12…First ejection section

[0508] 13…First Light Illumination Section

[0509] 14…Second ejection section

[0510] 15…Second Light Irradiation Section

[0511] 16… First ink can

[0512] 17, 17X… First Circulation Flow Path

[0513] 17A, 19A... buffer tanks

[0514] 17B, ​​19B... Pumps

[0515] 18…Second ink can

[0516] 19, 19X…Second Circulation Flow Path

[0517] 60… Bottom filling material

[0518] 65… Solder ball

[0519] 70… Semiconductor chips

[0520] 80… Electronic Components

[0521] 101…First Container

[0522] 102…Second Container

Claims

1. A method for manufacturing a laminated structure, comprising: The first photocuring process involves irradiating light onto the surface of a first composition coated on a first substrate by inkjet printing to form a first photocured layer obtained by photocuring the first composition; and The second photocuring process involves irradiating light onto the surface of the second composition, which is coated on the first photocurable layer by inkjet printing, opposite to the side of the first substrate, to form a second photocurable layer obtained by photocuring the second composition. The first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition comprises a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition is a different composition from the second composition.

2. The method for manufacturing a laminated structure according to claim 1, comprising: a second coating step of applying a second composition to the surface of the first photocurable layer opposite to the first substrate side using an inkjet printing method. In the second photocuring step, the second composition coated in the second coating step is irradiated with light.

3. The method for manufacturing a laminated structure according to claim 2, wherein, The second coating process and the second photocuring process are performed multiple times in the thickness direction of the first photocurable layer.

4. A method for manufacturing a laminated structure according to any one of claims 1 to 3, comprising: The process for heating the first and second photocurable layers involves heating the first and second photocurable layers to form a first photocurable and thermocurable layer obtained by thermally curing the first photocurable layer, and a second photocurable and thermocurable layer obtained by thermally curing the second photocurable layer.

5. The method for manufacturing a laminated structure according to any one of claims 1 to 3, wherein it comprises or does not comprise: The process for heating the first and second photocurable layers involves heating the first and second photocurable layers to form a first photocurable and thermocurable layer obtained by thermally curing the first photocurable layer, and a second photocurable and thermocurable layer obtained by thermally curing the second photocurable layer. When the process for heating the first and second photocurable layers is included, the manufacturing method further includes a third photocuring step: irradiating light onto a third composition coated by inkjet printing on a surface opposite to the first substrate side to form a third photocurable layer obtained by photocuring the third composition. Without the step of heating the first and second photocurable layers, the manufacturing method includes a third photocuring step: irradiating light onto a third composition coated by inkjet printing on a surface opposite to the first substrate side to form a third photocurable layer obtained by photocuring the third composition. The third composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition and the third composition are different compositions.

6. The method for manufacturing a laminated structure according to claim 5, wherein, The first composition and the third composition are the same composition.

7. The method for manufacturing a laminated structure according to claim 5, wherein, When the manufacturing method includes the step of heating the first and second photocurable layers, it further includes a planarization step, after the step of heating the first and second photocurable layers, a planarization process is performed on the surface of the second photocurable layer opposite to the first substrate side. In the absence of the step for heating the first and second photocurable layers, the manufacturing method includes a planarization step, after the second photocuring step, a planarization process for the surface of the second photocurable layer opposite to the first substrate side. The planarization process is a grinding process.

8. The method for manufacturing a laminated structure according to claim 5, comprising: The configuration process involves configuring a second substrate on the surface of the third photocurable layer opposite to the side of the first substrate.

9. The method for manufacturing a laminated structure according to claim 5, wherein, When the process of heating the first and second photocurable layers is included, the manufacturing method includes: heating the third photocurable layer to form a third photocurable and thermocurable layer obtained by thermocuring the third photocurable layer, and a process of heating the third photocurable layer. Without the step of heating the first and second photocurable layers, the manufacturing method includes: heating the first, second, and third photocurable layers to form a first photocurable layer obtained by thermal curing the first photocurable layer, a second photocurable layer obtained by thermal curing the second photocurable layer, and a third photocurable layer obtained by thermal curing the third photocurable layer, and heating the first, second, and third photocurable layers.

10. A method for manufacturing a laminated structure, wherein, The manufacturing method includes a second photocuring step: irradiating light onto a second composition coated on the surface of a first substrate by inkjet printing to form a second photocurable layer obtained by photocuring the second composition. The manufacturing method may or may not include: a step of heating the second photocurable layer to form a second photocurable and thermocurable layer obtained by heat curing the second photocurable layer; When the process for heating the second photocurable layer is included, the manufacturing method includes a first photocuring step: irradiating light onto a first composition coated by inkjet printing on a surface opposite to the first substrate side to form a first photocurable layer obtained by photocuring the first composition. Without the step of heating the second photocurable layer, the manufacturing method includes a first photocuring step: irradiating light onto a first composition coated on the surface of the second photocurable layer opposite to the first substrate side by inkjet printing, thereby forming a first photocurable layer obtained by photocuring the first composition. The first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition comprises a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition is a different composition from the second composition.

11. The method for manufacturing a laminated structure according to claim 10, comprising: a step of heating the second photocurable layer to form a second photocurable and thermocurable layer obtained by thermocuring the second photocurable layer; In the first photocuring process, light is irradiated onto the surface of the first composition that is coated on the second photocurable and thermocurable layer by inkjet printing, opposite to the side of the first substrate, to form a first photocurable layer obtained by photocuring the first composition.

12. The method for manufacturing a laminated structure according to claim 10, wherein, When the process for heating the second photocurable layer is included, the manufacturing method further includes a planarization process, after the process for heating the second photocurable layer, a planarization process is performed on the surface of the second photocurable layer opposite to the first substrate side. In the absence of the step for heating the second photocurable layer, the manufacturing method includes a planarization process, after the second photocuring step, a planarization process for the surface of the second photocurable layer opposite to the first substrate side. The planarization process is a grinding process.

13. The method for manufacturing a laminated structure according to claim 12, wherein, When the process of heating the second photocurable layer is included, the manufacturing method includes: heating the first photocurable layer to form a first photocurable and thermocurable layer obtained by thermocuring the first photocurable layer; and a process of heating the first photocurable layer. Without the step of heating the second photocurable layer, the manufacturing method includes: heating the first photocurable layer and the second photocurable layer to form a first photocurable and thermocurable layer obtained by thermal curing the first photocurable layer and a second photocurable and thermocurable layer obtained by thermal curing the second photocurable layer, and a step of heating the first and second photocurable layers.

14. A method for manufacturing a laminated structure according to any one of claims 10 to 13, comprising: The configuration process involves configuring a second substrate on the surface of the first photocurable layer opposite to the side of the first substrate.

15. The method for manufacturing a laminated structure according to claim 14, wherein, The surface roughness of the second substrate is smaller than that of the first substrate.

16. A laminated structure comprising: First substrate, The first layer disposed on the surface of the first substrate, and A second layer disposed on the surface of the first layer on the side opposite to the first substrate side, wherein, The combination of the first layer and the second layer is as follows: The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a combination of a photocurable layer and a thermocurable layer comprising a second composition containing a polyfunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent; or The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent, and the second layer is a photocurable layer or a combination of a photocurable layer and a thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent. The first composition is a different composition from the second composition.

17. The laminated structure according to claim 16, wherein, The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermocuring agent.

18. The laminated structure according to claim 17, wherein, The second layer has a polished surface.

19. The laminated structure according to claim 17 or 18, comprising: A second substrate disposed on the surface of the second layer on the side opposite to the first layer.

20. The laminated structure according to claim 17 or 18, wherein, The first layer is a photocurable and thermocurable layer of the first composition. The second layer is a light and heat-cured layer of the second composition.

21. The laminated structure according to claim 17 or 18, wherein, The second layer is thicker than the first layer.

22. The laminated structure according to claim 17 or 18, wherein, The thickness of the first layer is between 0.1 μm and 10 μm. The thickness of the second layer is between 1 μm and 1000 μm.

23. The laminated structure according to claim 17 or 18, comprising: The third layer is disposed on the surface of the second layer on the side opposite to the first layer. The third layer is a photocurable layer or a photocurable and thermocurable layer comprising a third composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition and the third composition are different compositions.

24. The laminated structure according to claim 23, wherein, The first composition and the third composition are the same composition.

25. The laminated structure according to claim 23, comprising: A second substrate disposed on the surface of the third layer on the side opposite to the second layer.

26. The laminated structure according to claim 25, wherein, The surface roughness of the first substrate is smaller than that of the second substrate.

27. The laminated structure according to claim 23, wherein, The third layer is a light and heat-cured layer of the third composition.

28. The laminated structure according to claim 23, wherein, The second layer is thicker than the third layer.

29. The laminated structure according to claim 23, wherein, The thickness of the third layer is between 0.1 μm and 10 μm.

30. The laminated structure according to claim 16, wherein, The first layer is a photocurable layer or a photocurable and thermocurable layer comprising a second composition containing a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second layer is a photocurable layer or a photocurable and thermocurable layer comprising the first composition containing a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent.

31. An inkjet composition kit comprising a first composition and a second composition, wherein, The first composition comprises a monofunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The second composition comprises a multifunctional (meth)acrylate compound, an epoxy compound, a photopolymerization initiator, and a thermosetting agent. The first composition and the second composition are different compositions. The first composition and the second composition are not mixed during use.

32. The inkjet composition kit according to claim 31, wherein the first composition is used to form a first photocurable layer or a first photo- and thermally cured layer, the second composition is used to form a second photocurable layer or a second photo- and thermally cured layer, and the first composition and the second composition are used to form mutually different cured layers.

33. The inkjet composition kit according to claim 31 or 32, comprising a first container and a second container, The first container contains the first composition. The second container contains the second composition.

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