Heat-conducting cold plate, heat-conducting board card and chassis

Abstract

The present invention relates to a heat-conducting cold plate, a heat-conducting board card and a chassis. The heat-conducting cold plate includes: a cold plate body and a heat sink assembled in the cold plate body. The heat sink includes a thermoelectric cooler and a heat insulation plate for preventing heat exchange on both sides of the cold plate body. The cold end of the thermoelectric cooler is used to maintain a low temperature on one side of the cold plate body, and the hot end is used to transfer high temperature to the other side of the cold plate body. The present invention combines the principle of a traditional cold plate with that of thermoelectric refrigeration, enabling the cold plate itself to have a temperature-holding function and achieving a better temperature rise control effect.

Description

Technical Field

[0001] The present invention belongs to the field of heat dissipation of electronic components, and particularly relates to a heat-conducting cold plate, a heat-conducting board card having the heat-conducting cold plate, and a chassis having the heat-conducting board card. Background Art

[0002] The existing chassis mainly includes components such as a chassis housing, a board card, a locking strip, a card ejector, and a panel. The main structure of the board card includes a cold plate, a PCB board, a card ejector, a rear cover, etc. The PCB board is attached to the cold plate and the cold plate provides a heat transfer channel. With the improvement of integration, the heat dissipation of the board card is getting higher and higher, and the temperature of the board card device relying on the traditional cold plate for heat transfer increases accordingly, and the reliability of the device decreases. Summary of the Invention

[0003] To solve the above problems, the present invention provides a heat-conducting cold plate with a new structure, a heat-conducting board card having the heat-conducting cold plate, and a chassis having the heat-conducting board card, so as to realize reliable heat dissipation on the cold plate by using the thermoelectric refrigeration technology.

[0004] The object of the present invention and the technical problem to be solved are achieved by the following technical solutions. A heat-conducting cold plate according to the present invention includes: a cold plate and a heat sink assembled in the cold plate. The heat sink includes a thermoelectric cooler and a heat insulation plate for preventing heat exchange on both sides of the cold plate. The cold end of the thermoelectric cooler is used to maintain the low temperature inside the cold plate, and the hot end is used to transfer the high temperature to the outside of the cold plate.

[0005] The object of the present invention and the technical problem to be solved can also be further achieved by the following technical measures.

[0006] For the aforementioned heat-conducting cold plate, the cold plate includes an outer cold plate and an inner cold plate. The heat insulation plate is used to prevent heat exchange between the outer cold plate and the inner cold plate. The cold end of the thermoelectric cooler contacts the inner cold plate to maintain the low temperature, and the hot end contacts the outer cold plate to transfer the high temperature.

[0007] For the aforementioned heat-conducting cold plate, the outer edge of the heat insulation plate protrudes beyond the outer edge of the inner cold plate to prevent heat exchange between the inner cold plate and the outer cold plate.

[0008] The object of the present invention and the technical problem to be solved are achieved by the following technical solutions. A heat-conducting board card according to the present invention includes a cold plate and a PCB board fixed to the cold plate through a rear cover. The cold plate is the aforementioned heat-conducting cold plate, and the PCB board is attached to the side of the cold plate that maintains the low temperature.

[0009] The object of the present invention and the technical problem to be solved can also be further achieved by the following technical measures.

[0010] The foregoing heat-conducting board card, wherein the cold plate includes an outer cold plate and an inner cold plate, the heat insulation plate is used to prevent heat exchange between the outer cold plate and the inner cold plate, the cold end of the thermoelectric cooler contacts the inner cold plate to maintain a low temperature, the hot end contacts the outer cold plate to transfer high temperature, and the PCB board contacts the inner cold plate.

[0011] The foregoing heat-conducting board card, wherein the inner cold plate, the heat sink and the PCB board are all located in a receiving groove on one side of the outer cold plate.

[0012] The foregoing heat-conducting board card, wherein there are multiple thermoelectric coolers, which are evenly distributed on the heat insulation plate or distributed at positions corresponding to the heat-generating components on the PCB board.

[0013] The foregoing heat-conducting board card, and a plurality of heat-conducting bosses for contacting the heat-generating components on the PCB board are further provided on the inner cold plate.

[0014] The foregoing heat-conducting board card, wherein the rear cover can prevent external high temperature from being transferred to the PCB board.

[0015] Compared with the prior art, the present invention has obvious advantages and beneficial effects. By means of the above technical solutions, the present invention can achieve quite high technical progressiveness and practicability, and has wide utilization value in the industry. It has at least the following advantages:

[0016] The present invention combines the principles of traditional cold plates and thermoelectric refrigeration, and designs a new type of heat-conducting cold plate to achieve better temperature rise control effects. The thermoelectric refrigeration heat dissipation of the present invention has the advantages of small volume, light weight, no noise, reliable operation, fast cooling speed, and simple operation by adjusting the current to change the heat dissipation power consumption.

[0017] When the cold plate of the present invention is in use, the cold end of the thermoelectric cooler is attached to the inner cold plate, and the hot end of the thermoelectric cooler is attached to the outer cold plate. According to the principle of thermoelectric refrigeration, the inner cold plate maintains a constant low temperature, so that the heat-generating components of the PCB board are kept at a low temperature, and the heat of the heat-conducting board card is transferred to the outer cold plate and then transferred to the chassis shell for heat dissipation. Description of the Drawings

[0018] Figure 1 It is a schematic diagram of the existing chassis heat dissipation structure;

[0019] Figure 2 It is the front view of the chassis heat dissipation structure of Embodiment 1 of the present invention after removing the front panel;

[0020] Figure 3 It is a schematic diagram of the composition of the shell heat dissipation part of the chassis heat dissipation structure of Embodiment 1 of the present invention;

[0021] Figure 4 It is a cross-sectional view of the shell heat dissipation part of the chassis heat dissipation structure of Embodiment 1 of the present invention;

[0022] Figure 5 Cross-sectional view of the heat insulation part of the housing of the chassis heat dissipation structure according to Embodiment 1 of the present invention;

[0023] Figure 6 Enlarged view of the joint of the housing of the chassis heat dissipation structure according to Embodiment 1 of the present invention;

[0024] Figure 7 Schematic diagram of the board composition of the chassis heat dissipation structure according to Embodiment 2 of the present invention;

[0025] Figure 8 Schematic diagram of the cold plate composition of the chassis heat dissipation structure according to Embodiment 2 of the present invention;

[0026] Figure 9 Cross-sectional view of the cold plate of the chassis heat dissipation structure according to Embodiment 2 of the present invention;

[0027] Figure 10 Front view of the cold plate of the chassis heat dissipation structure according to Embodiment 2 of the present invention;

[0028] Figure 11 Exploded view of the board of the chassis heat dissipation structure according to Embodiment 2 of the present invention;

[0029] Figure 12 Schematic diagram of the composition of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0030] Figure 13 Schematic diagram of the housing structure of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0031] Figure 14 Schematic diagram of the composition of the housing part of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0032] Figure 15 Cross-sectional view of the housing part of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0033] Figure 16 Another cross-sectional view of the housing part of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0034] Figure 17 Cross-sectional view of the chassis heat dissipation structure according to Embodiment 3 of the present invention;

[0035] Figure 18 Schematic diagram of the chassis heat dissipation structure according to Embodiment 4 of the present invention;

[0036] Figure 19 Schematic diagram of the board composition according to Embodiment 4 of the present invention;

[0037] Figure 20 Schematic diagram of the chassis heat dissipation structure according to Embodiment 5 of the present invention;

[0038] Figure 21Schematic diagram of the heat exchanger according to Embodiment 5 of the present invention;

[0039] Figure 22 Cross-sectional view of the heat exchanger according to Embodiment 5 of the present invention.

[0040]

Description of Main Component Symbols

[0041] 1: Chassis housing 11: Upper housing 12: Lower housing

[0042] 13: Left housing 14: Right housing 2: Circuit board

[0043] 21: Rear cover 22: PCB board 23: Cold plate

[0044] 231: Outer cold plate 232: Inner cold plate 2321: Heat conduction boss

[0045] 233: Heat sink 3: Locking strip 4: Extractor

[0046] 5: Panel 6: Heat insulation board 7: Inner housing

[0047] 8: Thermoelectric cooler 81: Cold end 82: Hot end

[0048] 9: Outer housing 100: Upper cover plate 101: Lower cover plate

[0049] 102: Left cover plate 103: Right cover plate 104: Fan

[0050] 105: Fan mounting plate 106: Air inlet 107: Heat dissipation fins

[0051] 108: Heat dissipation housing 109: Upper plate 110: Lower plate

[0052] 111: Left plate 112: Right plate 113: Front plate

[0053] 114: Rear plate 115: Inner heat dissipation fan 116: Outer heat dissipation fan

[0054] 117: Outer cavity cold air inlet 118: Heat exchange cavity partition 119: Cold end heat exchange fins

[0055] 120: Heat dissipation plate 121: Hot end heat exchange fins Detailed Embodiment

[0056] To further elaborate on the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific embodiments, structures, features, and effects of the chassis heat dissipation structure proposed according to the present invention as follows.

[0057] Please refer to Figure 2-6, which is a schematic diagram of each part of the chassis heat dissipation structure according to Embodiment 1 of the present invention. The chassis heat dissipation structure includes a chassis housing 1 and a circuit board 2 assembled in the chassis housing 1. The chassis housing 1 includes an upper housing 11, a lower housing 12, a left housing 13, and a right housing 14. There are multiple circuit boards 2 arranged in the chassis housing 1 in the left-right direction. Each circuit board 2 is in contact with the upper housing 11 and the lower housing 12. At least one of the upper housing 11 and the lower housing 12 is further provided with a plurality of thermoelectric coolers 8. The hot end 82 of the thermoelectric cooler 8 faces the inside of the chassis housing 1, and the cold end faces the outside of the chassis housing, so as to realize the cooling of the circuit board 2 in the chassis housing 1.

[0058] In a semiconductor, when any two different conductors form an electric couple and are connected to direct current, obvious heat absorption or heat release phenomena will occur at the corresponding joints of the electric couple. The thermoelectric cooler 8 of the present invention applies this characteristic of the electric couple. Through the power supply on the chassis housing 1, the cold end 81 of the thermoelectric cooler 8 generates a heat absorption phenomenon, and the hot end 82 generates a heat release phenomenon.

[0059] In this embodiment, only the upper housing 11 in the chassis housing 1 is provided with a thermoelectric cooler 8. In other embodiments, not only one of the upper housing 11 and the lower housing 12 is provided with a thermoelectric cooler 8, but at least one of the left housing 13 and the right housing 14 is also provided with a thermoelectric cooler 8.

[0060] To prevent the heat released by the hot end 82 of the thermoelectric cooler 8 from returning to the chassis housing again, the chassis housing 1 of the present invention further includes a heat insulation plate 6. Specifically, the chassis housing 1 is a sandwich structure composed of an outer housing 9, an inner housing 7, and a heat insulation plate 6. The heat insulation plate 6 is located between the inner housing 7 and the outer housing 9. The thermoelectric cooler 8 is located in a positioning groove 61 opened on the heat insulation plate 6, and its hot end 82 is attached to the outer housing 9, and the cold end is attached to the inner housing 7, so that the inner housing 7 maintains a constant low temperature, and the heat of the circuit board 2 is transferred to the outer housing 9 for heat dissipation. The heat insulation plate 6 can prevent heat exchange between the inner and outer housings.

[0061] In this embodiment, only the upper housing 11 is provided with a thermoelectric cooler 8, that is, the upper housing 11 includes an outer housing 9, an inner housing 7, and a heat insulation plate 6, and the heat insulation plate 6 of the upper housing 11 is provided with a positioning groove 61, and the thermoelectric cooler 8 is located in the positioning groove. The lower housing 12, the left housing 13, and the right housing 14 all include an outer housing 9, an inner housing 7, and a heat insulation plate 6, and the heat insulation plate 6 is not provided with a positioning groove 61 and no thermoelectric cooler 8. However, in other embodiments, according to needs, a thermoelectric cooler 8 can also be provided in the heat insulation plate 6 of the lower housing 12, the left housing 13, and the right housing 14.

[0062] In this embodiment, to enhance the heat insulation ability of the chassis housing 1 and avoid the heat exchange between the inner and outer housings, in the upper housing 11, lower housing 12, left housing 13, and right housing 14 that make up the chassis housing 1 of the present invention, a stepped surface matching method with three layers of steps is adopted at the docking positions, so that the docking surfaces of the outer housing 9 part, heat insulation plate 6 part, and inner housing 7 part are staggered in sequence to form three layers of steps, making the docking of different parts of the chassis housing 1 more tightly and reliably. Specifically, please refer to Figure 6 , stepped structures 101 are provided at both ends of the upper housing 11. The stepped structure 101 is formed by a groove 1011 at the bottom of the outer housing 9, a staggered part 1012 between the bottom surface of the outer housing 9 and the edge of the heat insulation plate 6, and a staggered part 1013 between the heat insulation plate 6 and the edge of the inner housing. In the upper housing 11, the extension lengths in the left-right direction from the outer housing 9, heat insulation plate 6 to the inner housing 7 gradually decrease, so that stepped structures 101 for mating with the left housing 13 and right housing 14 to achieve step-by-step docking are respectively formed at the left and right ends of the upper housing 11. Correspondingly, the upper ends of the left housing 13 and right housing 14 have three-level steps 102 that gradually rise from the inner housing 7, heat insulation plate 6 to the upper end surface of the outer housing 9. The three-level steps 102 are adaptively docked with the stepped structure 101 to achieve the tight docking of different housing parts.

[0063] Preferably, heat dissipation fins 107 are provided around the chassis housing 1. The heat dissipation fins are respectively distributed on the outer surfaces of the upper housing 11, lower housing 12, left housing 13, and right housing 14 and extend along the front-rear direction (i.e., the direction in which the board is inserted) of the chassis housing 1.

[0064] The chassis housing of the present invention can achieve heat conduction and heat dissipation by contacting with the constant temperature panel. For example, when the chassis housing is placed in a constant temperature structure, through contact, the chassis housing transfers the high temperature to the constant temperature structure to achieve heat dissipation.

[0065] Please refer to Figure 7-11, which is a schematic diagram of the structures of various parts of the circuit board of the chassis heat dissipation structure according to Embodiment 2 of the present invention. The circuit board 2 includes a cold plate 23 and a PCB board 22 fixed in a receiving groove 2311 on one side of the cold plate 23 through a rear cover 21. The cold plate 23 includes a sandwich structure composed of an outer cold plate 231, an inner cold plate 232, and heat sinks. Wherein, a receiving groove 2311 is provided on one side of the outer cold plate 231. The heat sinks 233 and the inner cold plate 232 are sequentially stacked in the receiving groove 2311, and the heat sinks 233 are pressed and positioned in the receiving groove 2311 of the outer cold plate 231 by the inner cold plate 232. The heat sinks 233 include a heat insulation plate 6 and a thermoelectric cooler 8 located in a positioning groove 61 on the heat insulation plate 6. There are a plurality of the thermoelectric coolers 8, which are evenly distributed on the heat insulation plate 6 or distributed on the heat insulation plate 6 according to the arrangement of the heat generating components on the PCB board. The hot end 82 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 81 is in contact with the inner cold plate 232 to reduce the temperature of the PCB board in contact with the inner cold plate 232.

[0066] In this embodiment, to prevent heat conduction between the inner cold plate and the outer cold plate, the outer edge of the heat insulation plate 6 protrudes beyond the outer edge of the inner cold plate 232. Preferably, there is a clearance fit between the outer edges of the heat insulation plate 6 and the inner cold plate 232 and the wall of the receiving groove 2311, and the clearance between the outer edge of the inner cold plate 232 and the wall of the receiving groove is greater than the clearance between the outer edge of the heat insulation plate 6 and the wall of the receiving groove. That is, due to the different cross-sectional areas among the inner cold plate, the heat insulation plate, and the outer cold plate of the present invention, contact between the inner cold plate and the outer cold plate can be avoided, and the inner cold plate and the outer cold plate rely on different areas and the heat insulation plate to achieve heat isolation.

[0067] In this embodiment, a plurality of heat conducting bosses 2321 for contacting the heat generating components on the PCB board are further provided on the surface of the inner cold plate 232 facing the PCB board. The provision of the heat conducting bosses 2321 can enhance the heat dissipation of the heat generating components and accelerate the heat dissipation rate.

[0068] In this embodiment, the outer cold plate 231 is fixed to the rear cover 21 by screws. A positioning protrusion 2312 is formed by the inward protrusion of the groove wall of the receiving groove 2311 of the outer cold plate 231. A screw hole is provided on the positioning protrusion 2312. The outer cold plate 231 and the rear cover 21 are fixed by screws passing through the screw holes. Preferably, the side wall of the positioning protrusion 2312 located in the receiving groove 2311 is an arc-shaped structure. Avoidance grooves 2313 for avoiding the positioning protrusion 2312 are provided on both the inner cold plate 232 and the heat insulation plate 6 located in the receiving groove 2311. The cooperation between the avoidance groove 2313 and the positioning protrusion 2312 can realize the positioning of the placement position and placement direction of the inner cold plate 232 and the heat insulation plate 6 in the outer cold plate 231. There is a gap between the edge of the inner cold plate 232 and the positioning protrusion 2312. Preferably, there are 6 positioning protrusions 2312 in total, including 4 at the four corners of the receiving groove 2311 and 2 in the middle of the two long sides of the receiving groove 2311, but it is not limited thereto.

[0069] In other embodiments of the present invention, in order to maintain a low temperature inside the board 2 and prevent external high temperature from being transferred to the board 2 through the rear cover, the rear cover 21 also has a heat insulation function, such as the rear cover 21 is made of a heat insulation material or a heat insulation plate 6 is further provided inside the rear cover 21. Preferably, the rear cover 21 is a sandwich structure, which includes an outer rear cover, an inner rear cover, and a heat insulation plate 21 sandwiched between the outer and inner rear covers.

[0070] This embodiment utilizes a novel cold plate structure and through a reasonable heat insulation structure design, can effectively control the temperature rise of the board and effectively improve the reliability of the heat dissipation of the electronic device. During use, the cold end of the thermoelectric cooler is attached to the inner cold plate to maintain a low temperature, and the hot end of the thermoelectric cooler is attached to the outer cold plate. According to the principle of thermoelectric cooling, the inner cold plate maintains a constant low temperature, transfers the heat of the board to the outer cold plate, and finally conducts it to the chassis housing.

[0071] Moreover, this embodiment can be used alone or in combination with the housing structure of Embodiment 1 to achieve a better heat dissipation effect.

[0072] Embodiment 1 and Embodiment 2 of the present invention, as well as the combination of Embodiment 1 and Embodiment 2, can all be combined with other heat dissipation structures to achieve a better temperature rise control effect.

[0073] Please refer to Figure 11-17, which is a schematic diagram of the chassis heat dissipation structure of Embodiment 3 of the present invention. In this embodiment, the chassis is a fully enclosed forced air-cooled chassis. In this embodiment, a front panel 5 is provided at the front end of the chassis housing 1, and a rear fan 104 is installed at the rear end. Heat dissipation fins 107 are provided on the outer sides of the four sides of the upper, lower, left, and right of the chassis housing 1. The heat dissipation fins 107 all extend in the front-rear direction of the chassis housing 1. A cover plate is also fixed on the outer sides of the above-mentioned 4 sides. The cover plate and the heat dissipation fins 107 cooperate to form a closed heat dissipation cavity for gas to pass through. The above-mentioned fan 104 can discharge the hot air in the heat dissipation cavity or convey cold air into the heat dissipation cavity to enhance the heat dissipation of the outer periphery of the chassis housing 1. In other embodiments of the present invention, the fan 104 is also in communication with the inside of the chassis housing at the same time, and corresponding air vents are provided on the panel.

[0074] In this embodiment, the cover plate includes an upper cover plate 100 fixed on the outer side of the upper housing 11, a lower cover plate 101 fixed on the outer side of the lower housing 12, a left cover plate 103 fixed on the outer side of the left housing 13, and a right cover plate 104 fixed on the outer side of the right housing 14.

[0075] An air inlet 106 for external gas to enter the heat dissipation cavity is opened on the panel 5, that is, external cold air enters the heat dissipation cavity from the air inlet 106. Under the pumping of the fan 104, the gas in the heat dissipation cavity moves along the heat dissipation fins from the front end to the rear end of the heat dissipation housing and is finally discharged through the fan 104 to complete the heat dissipation work.

[0076] Preferably, there are multiple air inlets 106, and the front ends of the heat dissipation fins on the outer sides of the upper housing 11, the lower housing 12, the left housing 13, and the right housing 14 all have corresponding and communicating air inlets 106.

[0077] In this embodiment, the outer sides of the upper housing 11, the lower housing 12, the left housing 13, and the right housing 14 are all U-shaped structures. The heat dissipation fins 107 are distributed in the grooves of the U-shaped structures. The front and rear ends of the U-shaped grooves are respectively communicated with the air inlet 106 and the fan 104 to realize air intake and exhaust. Positioning protrusions 124 for fixing the panel 5 or the fan 104 are also provided at the front and rear ends of the grooves. The two sides of the U-shaped structures of the upper housing 11 and the lower housing 12 are also turned outwards to form folding edges 125 for fixing with the cover plate.

[0078] In this embodiment, the fan 104 is fixed by the cooperation of the fan mounting plate 105 and the rear end of the chassis housing 1.

[0079] In this embodiment, the chassis housing 1 is the chassis housing with a thermoelectric radiator in Embodiment 1, or the board is the board with a thermoelectric radiator in Embodiment 2, or the chassis housing 1 is the chassis housing with a thermoelectric radiator in Embodiment 1 and the board is the board with a thermoelectric radiator in Embodiment 2. That is, the chassis housing 1 and the board 2 in this embodiment are the structures in Embodiment 1 or Embodiment 2, or can also be a combination of Embodiment 1 and Embodiment 2.

[0080] Please refer to Figure 18 and Figure 19 , which is a schematic diagram of the chassis heat dissipation structure of Embodiment 4 of the present invention. In this embodiment, the chassis is a forced air cooling chassis. In this embodiment, a cooling fan 126 is installed at the bottom of the chassis housing 1. The air outlet / air inlet of the cooling fan 126 communicates with the lower housing 12 of the chassis housing 1, so as to send external air into the chassis housing 1 through the opening at the lower housing 12 or discharge the air in the chassis housing from the opening at the lower housing 12. And a plurality of air outlet holes / air inlet holes 127 are evenly distributed on the upper housing 11 of the chassis housing 1. The air in the chassis housing 1 is discharged from the air outlet holes 127 on the upper housing 11 or the external cold air enters the chassis housing through the air inlet holes.

[0081] In this embodiment, the boards 2 are arranged in the left - right direction in the chassis housing 1, so that the air passes between adjacent boards 2, taking away the heat dissipated by the boards 2.

[0082] In this embodiment, the board 2 is the board structure described in Embodiment 2. That is, the board 2 includes a cold plate 23 and a PCB board 22 fixed in the receiving groove 2311 on one side of the cold plate 23 through a rear cover 21. The cold plate 23 includes a sandwich structure composed of an outer cold plate 231, an inner cold plate 232 and heat sinks. Wherein, a receiving groove 2311 is provided on one side of the outer cold plate 231, and the heat sinks 233 and the inner cold plate 232 are sequentially stacked in the receiving groove 2311, and the heat sinks 233 are pressed and positioned in the receiving groove 2311 of the outer cold plate 231 by the inner cold plate 232. The heat sinks 233 include a heat insulation plate 6 and a thermoelectric cooler 8 located in the positioning groove 61 on the heat insulation plate 6. There are multiple thermoelectric coolers 8, which are evenly distributed on the heat insulation plate 6 or distributed on the heat insulation plate 6 according to the arrangement of the heat - generating components on the PCB board. And the hot end 82 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 81 is in contact with the inner cold plate 232 to reduce the temperature of the PCB board in contact with the inner cold plate 232.

[0083] In this embodiment, the other side of the outer cold plate 231 is also provided with heat dissipation fins 107 extending in the up - down direction. The air sent into the chassis housing 1 by the cooling fan 126 flows upward along the heat dissipation fins on the outside of the outer cold plate 231 and is finally discharged from the air outlet holes 127 on the upper housing 11 to achieve the purpose of heat dissipation.

[0084] In this embodiment, the chassis housing 1 can also be the structure in Embodiment 1, that is, when the insertion direction of the board is defined as the axial direction, at least one of the four axial faces of the chassis housing 1 is provided with a thermoelectric refrigeration structure.

[0085] In this embodiment, heat dissipation fins are also provided on the outer periphery of the chassis housing around the card board (i.e., the outside of the front, rear, left, and right four housings), and the heat dissipation fan 126 can simultaneously provide power for the air between the heat dissipation fins to enhance heat dissipation at the chassis housing.

[0086] This embodiment can also be combined with the chassis heat dissipation structure in Embodiment 3. At this time, the heat dissipation fan can simultaneously dissipate heat from the boards inside the chassis housing and the chassis housing itself. That is, the heat dissipation fan can send air into or extract air from the heat dissipation cavity composed of the cover plate and the heat dissipation fins on the chassis housing, and can also send air into or extract air from the chassis. Air vents communicating with the heat dissipation cavity and the inside of the chassis housing are provided on the panel.

[0087] Please refer to Figure 20-22 , which is a schematic diagram of the chassis heat dissipation structure of Embodiment 5 of the present invention. In this embodiment, the chassis heat dissipation structure is an internal circulation forced air cooling chassis. The heat dissipation chassis structure includes a chassis housing 1 and a heat dissipation housing 108. An internal heat exchange cavity 129 and an external heat exchange cavity 130 are formed in the heat dissipation housing 108. The internal heat exchange cavity 129 is a closed cavity, and at least one side of the external heat exchange cavity 130 is open. The chassis housing 1 is fixed in the internal heat exchange cavity 129, and an internal heat dissipation fan 115 is provided at the bottom of the chassis housing 1. The internal heat dissipation fan 115 conveys air into the chassis housing 1.

[0088] A heat exchanger is also provided on one side of the chassis housing 1. The heat exchanger cooperates with the chassis housing 1 to divide the space in the internal heat exchange cavity 129 into upper and lower parts. The air in the upper space A enters the lower space B after heat exchange through the heat exchanger. The internal heat dissipation fan 115 extracts the air in the lower space B and sends it into the chassis housing 1, and then is discharged from the upper opening of the chassis housing 1 into the upper space A.

[0089] In this embodiment, the gap between adjacent boards 2 extends in the vertical direction, and the air sent into the chassis housing 1 by the internal heat dissipation fan 115 flows along the gap between adjacent boards and is discharged from the top of the chassis housing. Preferably, the above boards 2 are arranged in the front-rear direction or the left-right direction.

[0090] The heat exchanger includes a heat sink 120 and cold-end heat exchange ribs 119 and hot-end heat exchange ribs 121 distributed on both sides of the heat sink 120, and the heat sink 120 includes an insulation plate 6 and a plurality of thermoelectric coolers 8 fixed on the insulation plate 6, and the hot end 82 of the thermoelectric cooler 8 is close to the hot-end heat exchange rib 121, and the cold end 81 is close to the cold-end heat exchange rib 119, and the cold-end heat exchange rib 119 of the heat exchanger is located in the inner heat exchange cavity 129, and the hot-end heat exchange rib 121 is located in the outer heat exchange cavity 130, and one end of the hot-end heat exchange rib 121 is connected to the external space of the heat dissipation shell 108, and the other end is connected to the external cooling fan 116, and the external cooling fan 116 draws external air to dissipate the heat of the hot-end heat exchange rib 121.

[0091] In this embodiment, a heat exchange chamber partition 118 is also fixed at the lower end of the heat exchanger, and the heat exchange chamber partition 118 supports and fixes the heat exchanger in the heat dissipation shell 108, ensures the space below the cold end heat exchange fins 119, and realizes the isolation of heat transfer between the inner heat exchange chamber 129 and the outer heat exchange chamber 130. In order to increase the space of the inner heat exchange chamber 129, preferably, the outer heat exchange chamber 130 is a space separated from the lower part of one side of the heat dissipation shell 108, and the heat dissipation shell 108 is open at the lower part of this side. The radiator shell 108, the heat exchanger, the heat exchange chamber partition 118 fixed at the bottom of the heat exchanger near the heat dissipation plate 120, and the partition 123 fixed above the heat dissipation plate 120 and between the heat dissipation shell 108 together form a U-shaped outer heat exchange chamber 130, and the outer heat exchange chamber 130 has an outer chamber cold air inlet 117 connected to the outside.

[0092] In this embodiment, the heat dissipation shell 108 includes an upper plate 109, a lower plate 110, a left plate 111, a right plate 112, a front plate 113 and a rear plate 114, wherein there is a gap between the lower part of the left plate 111 and the lower plate 110, the heat exchanger is located on the left side below the heat dissipation shell 108, and the heat exchange cavity partition 118 below the heat dissipation shell 108 is fixed on the lower plate 110, and a partition 123 is also fixed above the heat exchange cavity partition 118, and the partition 123 is fixed on the heat dissipation plate 120 or the position of the cold end heat exchange rib 119 close to the heat dissipation plate 120, thereby the partition 123, the left plate 111, the lower plate 110, the heat exchanger and the heat exchange cavity partition 118 jointly enclose a U-shaped cavity, the hot end heat exchange rib 121 is located in the U-shaped cavity, and the position of the rear plate 114 corresponding to the U-shaped cavity is open to form an external cavity cold air inlet 117. In order to avoid the external heat exchange cavity 130, an avoidance hole is opened at the lower end of the left side of the front plate of the present invention. Preferably, the partition plate 123 and the heat exchange cavity partition plate 118 are both made of low heat transfer materials.

[0093] In this embodiment, one end of the cold-end heat exchange fin 119 is in contact with the heat dissipation plate 120, and the other end is in contact with the chassis housing 1, thereby dividing the space in the internal heat exchange cavity 129 into upper and lower parts. The air in the upper space A is cooled by the cold-end heat exchange fin 119 and then enters the lower space B. Then, it is sent into the chassis housing 1 by the internal heat dissipation fan fixed at the bottom of the chassis housing 1. Finally, it is discharged from the top of the chassis housing 1 to the upper space A through the gap between the circuit boards, taking away the heat between the circuit boards.

[0094] In this embodiment, the bottom of the chassis housing 1 is supported and fixed on the lower plate 110 by a support plate. The support plate 131 on the side of the bottom of the chassis housing 1 away from the heat exchanger, the right housing 14 of the chassis housing 1, and the partition plate 132 between the upper housing 11 of the chassis housing 1 and the upper plate 109 together form the wall body on the right side of the internal heat exchange cavity 129 to prevent the hot air discharged from the upper part of the chassis housing 1 to the upper space A from returning to the lower space B without passing through the heat exchanger, which affects the heat dissipation effect. The wall body on the right side of the internal heat exchange cavity 129 cooperates with the part of the heat dissipation housing on the right side away from the external heat exchange cavity to form a cavity 133.

[0095] Preferably, heat dissipation fins are further provided on the outer side of the cold plate of the circuit board 2, but it is not limited thereto.

[0096] To enhance the heat dissipation effect, the circuit board 2 in this embodiment can be the circuit board 2 in Embodiment 4, but it is not limited thereto.

[0097] In the heat exchanger of this embodiment, the cold end of the thermoelectric cooler is attached to the cold-end heat exchange fin to maintain a low temperature, and the hot end of the thermoelectric cooler is attached to the hot-end heat exchange fin. According to the principle of thermoelectric refrigeration, the cold-end heat exchange fin maintains a constant low temperature, and the hot air is transformed into cold air after passing through the cold-end heat exchange fin. The external hot-end heat exchange fin is forced to be cooled by a fan. The external heat dissipation fan 116 sucks in cold air through the external cavity air inlet to take away the heat at the hot end of the heat exchanger. The internal air of the internal heat dissipation fan 115 takes away the heat of the circuit board 2 and realizes heat exchange at the cold end of the heat exchanger, and becomes cold air after passing through the heat exchanger and participates in the cycle again.

[0098] The heat dissipation fins in each embodiment of the present invention can be processed and formed by methods such as machining, welding, or profile machining. The heat dissipation fins can be in the shape of a rectangle, a cylinder, an interrupted discontinuous rectangle, a parabola, etc.

[0099] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Although the present invention has been disclosed above with the preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments with equivalent changes within the scope of the technical solution of the present invention by using the disclosed technical content above. However, as long as it does not depart from the content of the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chassis, which includes a chassis housing and a heat conduction board card assembled in the chassis housing, is characterized in that: The heat-conducting board card includes a cold plate and a PCB board fixed to the cold plate through a rear cover. The cold plate includes a cold plate body and a heat sink assembled in the cold plate body. The heat sink includes a thermoelectric cooler and a heat insulation plate for preventing heat exchange on both sides of the cold plate body. The cold end of the thermoelectric cooler is used to maintain a low temperature on one side of the cold plate body, and the hot end is used to transfer high temperature to the other side of the cold plate body; the cold plate body includes an outer cold plate and an inner cold plate, and the heat insulation plate is used to prevent heat exchange between the outer cold plate and the inner cold plate. The cold end of the thermoelectric cooler contacts the inner cold plate to maintain a low temperature, and the hot end contacts the outer cold plate to transfer high temperature; the outer edge of the heat insulation plate protrudes beyond the outer edge of the inner cold plate to prevent heat exchange between the inner cold plate and the outer cold plate; the inner cold plate and the heat insulation plate are located in a receiving groove on one side of the outer cold plate; the PCB board contacts the inner cold plate; the heat-conducting board card contacts the chassis housing and transfers high-temperature heat to the chassis housing; The chassis further includes a heat dissipation housing, which at least includes a closed inner heat exchange cavity and an open outer heat exchange cavity. The chassis housing is located in the inner heat exchange cavity. There is a heat exchanger between the inner heat exchange cavity and the outer heat exchange cavity. The heat exchanger cooperates with a heat exchange cavity partition supported below it to separate the inner heat exchange cavity and the outer heat exchange cavity; the heat exchanger includes a hot end heat exchange fin located in the outer heat exchange cavity, a cold end heat exchange fin located in the inner heat exchange cavity, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate between the inner heat exchange cavity and the outer heat exchange cavity and several thermoelectric coolers. The hot ends of the thermoelectric coolers are closely attached to the hot end heat exchange fins, and the cold ends are closely attached to the cold end heat exchange fins; the heat exchanger also cooperates with the chassis housing to divide the inner heat exchange cavity into an upper space A and a lower space B. An inner heat dissipation fan fixed to the bottom of the chassis housing extracts the gas in the lower space B and sends it into the chassis housing. There is an air outlet above the chassis housing for discharging the gas to the upper space A. At the same time, the gas in the upper space A is cooled by the cold end heat exchange fins and then enters the lower space B again.

2. The chassis according to claim 1, characterized in that: The inner cold plate, the heat sink, and the PCB board are all located in a receiving groove on one side of the outer cold plate.

3. The chassis according to claim 1, characterized in that: There are multiple thermoelectric coolers in the heat sink, which are evenly distributed on the heat insulation plate or distributed at positions corresponding to the heat-generating components on the PCB board.

4. The chassis according to claim 1, wherein: Several heat-conducting bosses for contacting and conducting heat with the heat-generating components on the PCB board are also provided on the inner cold plate.

5. The chassis according to claim 1, characterized in that: The rear cover can prevent external high temperature from being transferred to the PCB board.

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