Inkjet printing apparatus and method for inspecting inkjet head using inkjet printing apparatus

Abstract

An inkjet printing device and a method for inspecting an inkjet head using the inkjet printing device are provided. The inkjet printing device includes: an inspection stage unit on which an inspection substrate is located; an inkjet head unit including at least one inkjet head that ejects ink containing a solvent and dipoles dispersed in the solvent on the inspection stage unit; and a particle counting inspection unit that is disposed to be spaced apart from the inkjet head unit in one direction. The particle counting inspection unit includes: a first heat treatment unit disposed on the top of the inspection stage unit; and a first sensing unit disposed on the bottom of the inspection stage unit and measuring the number of dipoles ejected onto the inspection substrate.

Description

Technical Field

[0001] The present invention relates to an inkjet printing apparatus and a method for inspecting an inkjet head using the inkjet printing apparatus. Background Art

[0002] As multimedia develops, display devices become more and more important. In response to this, various types of display devices such as organic light emitting diode (OLED) displays, liquid crystal displays (LCD), etc. are being used.

[0003] Devices for displaying images of display devices include display panels (such as OLED display panels and LCD panels). Among them, light emitting diode (LED) display panels may include light emitting elements. For example, LEDs include OLEDs using organic materials as fluorescent materials, inorganic LEDs using inorganic materials as fluorescent materials, etc. Summary of the invention

[0004] Technical issues

[0005] The present invention is directed to providing an inkjet printing apparatus capable of performing a printing process of printing with ink using an inkjet head device and an inspection process of the inkjet head device as a connection process.

[0006] The present invention is also directed to providing an inkjet printing apparatus capable of adjusting errors such as the number of dipoles, the amount of ink, etc., occurring during a printing process while performing the process.

[0007] The scope of the present invention is not limited to the above-mentioned objects, and other objects not described can be clearly understood from the following description by those skilled in the art.

[0008] Technical Solution

[0009] One aspect of the present invention provides an inkjet printing device, which includes: an inspection table unit, on which an inspection substrate is placed; an inkjet head unit, including at least one inkjet head, and the at least one inkjet head is configured to spray ink on the inspection table unit, wherein the ink contains a solvent and dipoles dispersed in the solvent; and a particle counting inspection unit, which is arranged to be separated from the inkjet head unit in one direction, wherein the particle counting inspection unit includes: a first heat treatment unit, which is arranged above the inspection table unit; and a first sensing unit, which is arranged below the inspection table unit and is configured to measure the number of dipoles sprayed onto the inspection substrate.

[0010] The inkjet printing apparatus may further include a second sensing unit configured to measure a position of the first ink ejected from the inkjet head and applied onto the inspection substrate.

[0011] The first sensing unit may measure the number of dipoles disposed in a region corresponding to a location of the first ink.

[0012] The first sensing unit may measure the number of dipoles remaining on the inspection substrate after the solvent is removed by the first heat treatment unit.

[0013] The particle count inspection unit may further include a light irradiation unit disposed above the inspection stage unit and emitting light toward the inspection stage unit, and the first sensing unit may include a camera unit for photographing a lower surface of the inspection substrate.

[0014] The camera unit may generate image data by photographing an area corresponding to the location of the first ink.

[0015] The second sensing unit may measure an area of ​​the first ink, and the first sensing unit may calculate a dipole pattern using the image data and measure the area of ​​the dipole pattern.

[0016] The particle count inspection unit may measure the number of dipoles by comparing the area of ​​the first ink with the area of ​​the dipole pattern.

[0017] The particle counting check unit may compare the measured number of dipoles with a reference setpoint value.

[0018] The inkjet printing apparatus may further include an ink supply device for supplying ink to the inkjet head unit, wherein the particle count inspection unit may control the ink supply device according to a result of comparison of the measured number of dipoles with a reference set value.

[0019] The inkjet printing apparatus may further include a stage moving unit configured to move the inspection stage unit in one direction.

[0020] The first heat treatment unit may radiate light within an infrared band.

[0021] Another aspect of the present invention provides an inkjet printing device, which includes: an inspection table unit, on which an inspection substrate is placed; a table unit, which is arranged separately from the inspection table unit and on which a target substrate is placed; an inkjet head unit, which is arranged above the inspection table unit and the table unit, and includes a plurality of inkjet heads configured to eject ink, wherein the ink contains a solvent and dipoles dispersed in the solvent; a first heat treatment unit, which is arranged above the table unit and configured to radiate a first light; a first sensing unit, which is configured to measure the position of the ink applied to the inspection substrate; and a particle counting inspection unit, which is configured to inspect the number of dipoles contained in the ink applied to the inspection substrate, wherein the particle counting inspection unit includes: a second heat treatment unit, which is arranged above the inspection table unit and configured to radiate a second light; and a second sensing unit, which is arranged above the inspection table unit and configured to measure the number of dipoles contained in the ink applied to the inspection substrate.

[0022] The second sensing unit may measure the number of dipoles remaining on the inspection substrate after the solvent is removed by the second heat treatment unit.

[0023] The inkjet printing apparatus may further include an ink supply device configured to supply ink to the inkjet head unit, wherein the particle count inspection unit may control the ink supply device according to a result of comparing the measured number of dipoles with a reference set value.

[0024] Another aspect of the present invention provides a method for inspecting an inkjet head, the method comprising the following steps: ejecting ink onto an inspection substrate, the ink containing a solvent and a plurality of dipoles dispersed in the solvent; inspecting the discharge amount of the ink applied to the inspection substrate; removing the solvent contained in the ink applied to the inspection substrate; and measuring the number of dipoles remaining on the inspection substrate.

[0025] The step of inspecting the discharge amount of the ink may include measuring a diameter and an area of ​​the ink applied to the inspection substrate.

[0026] The step of measuring the number of dipoles may include counting the dipole pattern by photographing the inspection substrate from below the inspection substrate and measuring the area of ​​the dipole pattern.

[0027] The step of measuring the number of dipoles may include measuring the number of dipoles by comparing the measured area of ​​the ink with the measured area of ​​the dipole pattern.

[0028] Multiple dipoles retained on the inspection substrate may be arranged regardless of orientation.

[0029] Additional specific details of other embodiments of the invention are included in the detailed description and accompanying drawings.

[0030] Beneficial Effects

[0031] The inkjet printing apparatus according to the embodiment may include an inkjet head device, a discharge amount inspection unit, and a particle count inspection unit to perform an inspection process on an inspection substrate while performing a printing process on a target substrate. Therefore, the time required for the inspection process can be shortened, and errors can be detected and compensated in real time while performing the printing process. Therefore, the state of the inkjet head device can be inspected at high speed, and the quality of the target substrate can be improved.

[0032] In addition, the inkjet printing apparatus may include a particle count inspection unit to measure the number of dipoles remaining after the solvent contained in the ink is dried using the second heat treatment unit. Therefore, the number of dipoles can be measured without being affected by the characteristics of the solvent, and thus the measurement error rate can be reduced and the test reliability can be improved.

[0033] The effects according to the embodiments of the present invention are not limited to the above-exemplified contents, and more various effects are included in the specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is a schematic perspective view of an inkjet printing apparatus according to an embodiment.

[0035] Figure 2 is a schematic plan view of an inkjet printing apparatus according to an embodiment.

[0036] Figure 3 is a schematic cross-sectional view of an inspection table unit according to an embodiment.

[0037] Figure 4 is a schematic plan layout of a discharge amount inspection unit and an inspection stand unit according to the embodiment.

[0038] Figure 5 is a schematic cross-sectional layout of a discharge amount inspection unit and an inspection stand unit according to an embodiment.

[0039] Figure 6 is a schematic diagram showing ink applied to an inspection substrate according to the embodiment.

[0040] Figure 7 is a schematic cross-sectional layout of a particle count inspection unit and an inspection stage unit according to an embodiment.

[0041] Figure 8 is a schematic plan layout of an inkjet head unit and an inspection stage unit according to an embodiment.

[0042] Fig. 9 is a bottom view of an inkjet head unit according to an embodiment.

[0043] Fig.10is a schematic diagram illustrating ejection of ink from an inkjet head according to an embodiment.

[0044] Fig.11 is a schematic cross-sectional view illustrating an inkjet head unit inspected by a third sensing unit of the inkjet head device according to an embodiment.

[0045] Fig.12 is a cross-sectional view of a first heat treatment unit according to an embodiment.

[0046] Fig.13 is a schematic diagram illustrating driving of a heat treatment unit according to an embodiment.

[0047] Fig.14 is a plan view of a stage unit according to the embodiment.

[0048] Fig.15 is a schematic diagram showing an ink supply device according to an embodiment.

[0049] Fig.16 is a flowchart of a printing method using an inkjet printing apparatus according to an embodiment.

[0050] Fig.17 It is shown Fig.16 Detailed flowchart of an example of operation S100.

[0051] Fig.18 and Fig.19 It is shown Fig.16 Schematic diagram of operation S100 in FIG.

[0052] Fig. 20 It is shown Fig.16 Detailed flowchart of an example of operation S200.

[0053] Fig.21 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S200 .

[0054] Figure 22 to Figure 24 It is shown Fig.21 FIG. 1 is a schematic diagram of operation S200 .

[0055] Fig.25 It is shown Fig.16 Detailed flowchart of an example of operation S300.

[0056] Fig.26 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S300 .

[0057] Figures 27 to 31 It is shown Fig.26 FIG. 1 is a schematic diagram of operation S300 .

[0058] Fig.32 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S400 .

[0059] Fig.33 is a schematic diagram of a light emitting element according to an embodiment.

[0060] Fig.34 is a plan view of a display device manufactured by the method according to an embodiment.

[0061] Fig.35 It is along Fig.34 A partial cross-sectional view of the display device taken along line II'. DETAILED DESCRIPTION

[0062] The advantages and features of the present invention and the methods for achieving the same will be clearly understood with reference to the accompanying drawings and embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. The embodiments are provided to fully explain the present embodiments and fully explain the scope of the present embodiments to those skilled in the art. The scope of the present embodiments is limited only by the claims.

[0063] When an element or a layer is referred to as being formed "on" another element or another layer, the description includes the meaning that the element or the layer is directly formed on the other element or the other layer, or another element or another layer is interposed between the two elements or the two layers. Throughout the specification, the same reference numerals refer to the same elements.

[0064] It should be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components are not limited by these terms. The terms are only used to distinguish one component from another component. Therefore, it should be understood that the first component to be described below may be the second component within the technical scope of the present invention.

[0065] Hereinafter, embodiments will be described with reference to the accompanying drawings.

[0066] Figure 1 is a schematic perspective view of an inkjet printing apparatus according to an embodiment. Figure 2 is a schematic plan view of an inkjet printing apparatus according to an embodiment.

[0067] The inkjet printing device 1000 according to the embodiment can eject a predetermined ink onto a target substrate and align particles (e.g., particles such as dipoles) dispersed in the ink on the target substrate. Here, the inkjet printing device 1000 may include a plurality of inspection units to eject a predetermined amount of ink and maintain the same number of particles in the ink in each process. The inspection unit can inspect the amount of ink ejected from the inkjet printing device 1000 and the number of particles contained in the ink, and feed back the inspection result, thereby improving the reliability of the inkjet printing device 1000.

[0068] A first direction D1, a second direction D2, and a third direction D3 are defined in the drawings. The first direction D1 and the second direction D2 are coplanar and perpendicular to each other, and the third direction D3 is perpendicular to each of the first direction D1 and the second direction D2.

[0069] Reference Figure 1 and Figure 2 , the inkjet printing apparatus 1000 according to the embodiment may include an inkjet head device 300 , a discharge amount inspection unit 100 , a particle count inspection unit 600 , a stage unit 500 , and an inspection stage unit 200 .

[0070] The stage unit 500 provides a space in which a target substrate SUB is placed. The target substrate SUB may be placed on the stage unit 500 while performing a printing process.

[0071] The overall planar shape of the stage unit 500 may follow the planar shape of the target substrate SUB. For example, when the target substrate SUB has a rectangular shape, the overall shape of the stage unit 500 may be a rectangular shape, and when the target substrate SUB has a circular shape, the overall shape of the stage unit 500 may be a circular shape. In the drawings, a rectangular stage unit 500 having long sides disposed in the first direction D1 and short sides disposed in the second direction D2 is shown.

[0072] The stage unit 500 may include a base frame 510 , a stage 520 disposed on the base frame 510 , and a probe unit 550 disposed on the base frame 510 .

[0073] A detailed description will be given below of the structure of the stage unit 500 with reference to other drawings.

[0074] The inkjet head device 300 is used to print ink I (see Figure 5 When the inkjet printing apparatus 1000 is driven, the inkjet head device 300 may eject a predetermined ink I onto a target substrate SUB.

[0075] The inkjet printing apparatus 1000 may further include an ink supply unit such as an ink cartridge, and the ink I supplied from the ink supply unit may be ejected (discharged) toward a target substrate SUB through the inkjet head device 300 .

[0076] The ink I may be provided in a solution state or a colloidal state. The ink I may include a solvent SV (see Figure 5 ) and the multiple dipoles DP contained in the solvent SV (see Figure 5). For example, the solvent SV may be acetone, water, alcohol, toluene, propylene glycol (PG), propylene glycol methyl acetate (PGMA), etc. The solvent SV may be a material that evaporates or volatilizes at room temperature or by heating. A plurality of dipoles DP may be dispersed in the solvent SV. The dipole DP may be a solid material that ultimately remains on the target substrate SUB or the inspection substrate ISUB after the solvent SV is removed.

[0077] The dipole DP may be an object having a first polarity at one end and a second polarity different from the first polarity at the other end. For example, one end of the dipole DP may have a positive polarity, and the other end of the dipole DP may have a negative polarity. The dipole DP having different polarities at both ends may receive electric force (e.g., attraction and repulsion) when placed in an electric field, so that the orientation of the dipole DP may be controlled.

[0078] The dipole DP may have a shape extending in one direction. The dipole DP may have a shape such as a nanorod shape, a nanowire shape, a nanotube shape, etc. As the dipole DP included in the ink I according to the embodiment, a semiconductor nanorod may be applied, one end of which is doped with a first conductive type (e.g., p-type) impurity and the other end of which is doped with a second conductive type (e.g., n-type) impurity.

[0079] The inkjet head device 300 may include a first support member 310, an inkjet head unit 330, and a first light H radiated therefrom. 11 and H 12 (See Fig.12 ) of the stage unit 500. The inkjet head unit 330 and the first heat treatment unit 370 may be mounted on the first support member 310. The first support member 310 may include a first horizontal support portion 311 and a first vertical support portion 312. The inkjet head unit 330 and the first heat treatment unit 370 may be spaced apart from the stage unit 500 by a predetermined distance in the third direction D3.

[0080] The discharge amount inspection unit 100 may include a first sensing unit 150 to inspect the discharge amount and impact position of the ink I ejected from the inkjet head device 300. The discharge amount inspection unit 100 may include a second support 110 and the first sensing unit 150. The second support 110 may include a second horizontal support portion 111 and a second vertical support portion 112.

[0081] The particle count inspection unit 600 may include a second sensing unit 640 to inspect the number of particles contained in the ink I ejected from the inkjet head device 300. The particle count inspection unit 600 may include a third support member 610, a second sensing unit 640 mounted on the third support member 610 to radiate the second light H2 (see Figure 7) and a second sensing unit 640 disposed below the second heat treatment unit 630. The particle count inspection unit 600 may further include a light irradiation unit 650 disposed on the third support 610. The third support 610 may include a third horizontal support portion 611 and a third vertical support portion 612.

[0082] The inspection station unit 200 provides a space in which an inspection substrate ISUB is placed. The inspection substrate ISUB may be an inspection target substrate capable of inspecting (or testing) the inkjet head device 300 based on the ink I ejected from the inkjet head device 300. For example, the inkjet printing apparatus 1000 according to the present embodiment may perform a printing process on a target substrate SUB, and then may also use the inkjet head device 300 to eject ink I onto the inspection substrate ISUB placed on the inspection station unit 200 while the target substrate SUB is moving, and may use the discharge amount inspection unit 100 and the particle count inspection unit 600 to inspect the ink I applied to the inspection substrate ISUB. That is, the inkjet printing apparatus 1000 according to the present embodiment may perform a printing test process on the inspection substrate ISUB while performing a printing process on the target substrate SUB. Feedback of the result of inspecting the ink I ejected onto the inspection substrate ISUB may be used to adjust the setting value of the inkjet printing apparatus 1000.

[0083] The plane shape of the inspection stage unit 200 may be a rectangular shape. In the drawings, a rectangular inspection stage unit 200 having a long side disposed in the first direction D1 and a short side disposed in the second direction D2 is shown. However, the shape of the inspection stage unit 200 is not limited thereto and may be changed according to the plane shape of the inspection substrate ISUB.

[0084] The inkjet head device 300 may further include a third sensing unit 350. The third sensing unit 350 may be mounted on the first support member 310. The third sensing unit 350 may check an alignment state of the ink I ejected from the inkjet head device 300, an amount of the ejected ink I, etc. In addition, the third sensing unit 350 may check an inkjet head 335 (see FIG. 1 ) included in the inkjet head unit 330. Figure 8 ) in the nozzle NZ (see Fig.10 ) is blocked, which will be described below.

[0085] The particle count inspection unit 600, the discharge amount inspection unit 100, and the inkjet head device 300 of the inkjet printing apparatus 1000 may be sequentially disposed in the second direction D2. The particle count inspection unit 600, the discharge amount inspection unit 100, and the inkjet head device 300 may be disposed spaced apart from each other in the second direction D2.

[0086] The inkjet printing apparatus 1000 may further include a stage moving unit RR that moves the stage unit 500 and / or the inspection stage unit 200. The stage unit 500 and the inspection stage unit 200 may be disposed on the stage moving unit RR. The stage moving unit RR may include a first track RR1 and a second track RR2 extending in the second direction D2, and may reciprocate the stage unit 500 and / or the inspection stage unit 200 in the second direction D2. The inkjet printing apparatus 1000 may perform a printing process on the entire area of ​​the target substrate SUB while the stage unit 500 moves in the second direction D2. In addition, the inspection stage unit 200 may inspect the inkjet head device 300 based on the ink I ejected from the inkjet head device 300 while moving in the second direction D2 between the inkjet head device 300, the particle count inspection unit 600, and the discharge amount inspection unit 100.

[0087] Figure 1 and Figure 2 The inkjet printing apparatus 1000 shown in FIG. 1 is used to describe an example of the configuration of the inkjet printing apparatus 1000 according to the embodiment, and the structure and arrangement of the inkjet printing apparatus 1000 are not limited to the embodiment of the present invention. Figure 1 and Figure 2 The structure and arrangement of the inkjet printing device 1000 shown in FIG. The inkjet printing device 1000 may include more components and may have the same Figure 1 and Figure 2 The structure of the inkjet printing apparatus 1000 shown in FIG. 1 is different from that of the inkjet printing apparatus 1000 shown in FIG.

[0088] Figure 3 is a schematic cross-sectional view of an inspection table unit according to an embodiment.

[0089] Reference Figures 1 to 3 The inspection stage unit 200 may be disposed on the first track RR1 and the second track RR2 , and may move in the second direction D2 on the first track RR1 and the second track RR2 , and may reciprocate between the inkjet head device 300 and the particle count inspection unit 600 .

[0090] The inspection stage unit 200 according to the embodiment may include an adsorption device 210 and an upper substrate 220 .

[0091] The upper substrate 220 may have a planar shape extending in the first direction D1. An inspection substrate ISUB may be placed on the upper substrate 220. In an exemplary embodiment, the inspection substrate ISUB may be glass, a film, etc., but its type is not particularly limited. Preferably, the inspection substrate ISUB may be an organic film or a transparent glass substrate.

[0092] The upper substrate 220 may be disposed on the adsorption device 210. When the inspection substrate ISUB is placed on the upper substrate 220, the adsorption device 210 may be used to move the inspection substrate ISUB in the third direction D3 and fix the inspection substrate ISUB to the upper substrate 220.

[0093] The upper substrate 220 may include a transparent material so that the second sensing unit 640 of the particle count inspection unit 600 to be described below may be disposed below the upper substrate 220 to measure the inspection substrate ISUB. At least a portion of the upper substrate 220 includes a transparent material, and thus the second sensing unit 640 may be disposed below an area overlapping the transparent area, and may measure the number of dipoles DP disposed on the inspection substrate ISUB placed on the second sensing unit 640. A detailed description thereof will be given below with reference to other drawings.

[0094] The adsorption device 210 may include a first adsorption device 211 and a second adsorption device 212. The first adsorption device 211 and the second adsorption device 212 may be disposed under both ends of the upper substrate 220 and may extend in the second direction D2. The first adsorption device 211 and the second adsorption device 212 may be disposed under the periphery of the upper substrate 220 and driven in the third direction D3. In an exemplary embodiment, the adsorption device 210 may be a vacuum device, a clamp device, etc., but the present invention is not limited thereto.

[0095] The inspection stage unit 200 may further include a plurality of rollers WR1 and WR2. Since the plurality of rollers WR1 and WR2 rotate on the upper substrate 220, the inspection substrate ISUB may be rolled in the first direction D1. Therefore, the inspection substrate ISUB may be placed on and / or removed from the upper substrate 220 by the plurality of rollers WR1 and WR2.

[0096] Figure 4 is a schematic plan layout of a discharge amount inspection unit and an inspection stand unit according to the embodiment. Figure 5 is a schematic cross-sectional layout of a discharge amount inspection unit and an inspection stand unit according to an embodiment.

[0097] Reference Figure 1 , Figure 4 and Figure 5 , the discharge amount inspection unit 100 may include a second support member 110 and a first sensing unit 150 .

[0098] The discharge amount inspection unit 100 can analyze the ink I ejected from the inkjet head device 300 onto the inspection substrate ISUB and applied onto the inspection substrate ISUB, and inspect the discharge amount and impact position of the ink I ejected from the inkjet head device 300. A detailed description of a process of ejecting the ink I from the inkjet head device 300 onto the inspection substrate ISUB (or target substrate SUB) will be given below with reference to other drawings.

[0099] The second support member 110 may include a second horizontal support portion 111 extending in the horizontal direction and a second vertical support portion 112 connected to both ends of the second horizontal support portion 111 and extending in a third direction D3 as a vertical direction. The extending direction of the second horizontal support portion 111 may be the same as the first direction D1 as the long side direction of the inspection table unit 200.

[0100] The first sensing unit 150 may be disposed above the inspection stage unit 200. The first sensing unit 150 may be installed on the second support 110 at a predetermined distance from the inspection stage unit 200. The first sensing unit 150 may move on the second horizontal supporting portion 111 of the second support 110 in the first direction D1.

[0101] The separation distance between the first sensing unit 150 and the inspection stage unit 200 can be adjusted within a certain range, within which, when the inspection substrate ISUB is placed on the inspection stage unit 200, the first sensing unit 150 can have a certain interval from the inspection substrate ISUB to ensure a process (inspection) space.

[0102] The discharge amount inspection unit 100 may include a plurality of first sensing units 150 . Figure 1 and Figure 4 It is shown that four first sensing units 150 are provided, but the present invention is not limited thereto. The first sensing unit 150 may be spaced apart from the inspection stage unit 200 to detect a predetermined material provided on the inspection stage unit 200.

[0103] Each of the first sensing units 150 may include a first moving portion 151 connected to the second support 110 and movable in a horizontal direction, a first supporting portion 153 disposed on one surface of the first moving portion 151 , and a first sensor unit 155 disposed on the first supporting portion 153 .

[0104] The first moving portion 151 may be installed on the second horizontal supporting portion 111 of the second support member 110, and move in the first direction D1 which is an extending direction of the second horizontal supporting portion 111. Since the first moving portion 151 moves in the first direction D1, the first supporting portion 153 installed on the first moving portion 151 may also move in the first direction D1.

[0105] The first support portion 153 may be installed on the first moving portion 151. The first support portion 153 may be disposed on the lower surface of the first moving portion 151 and may have a shape extending in the second direction D2. One end of the first support portion 153 may be connected to the first moving portion 151, and the other end in the second direction D2 may be connected to the first sensor unit 155.

[0106] The first sensor unit 155 may be disposed above the inspection stage unit 200. The first sensor unit 155 may be installed on the first support portion 153 at a predetermined distance from the inspection stage unit 200. The first sensor unit 155 may be disposed above the inspection stage unit 200 to detect a predetermined material applied to the inspection substrate ISUB placed on the inspection stage unit 200. The predetermined material applied to the inspection substrate ISUB may include ink I including a solvent SV and dipoles DP dispersed in the solvent SV. Since the first moving portion 151 moves in the first direction D1, the first sensor unit 155 may detect or photograph the predetermined material applied to each region of the inspection substrate ISUB.

[0107] In an exemplary embodiment, the first sensor unit 155 may be a high-resolution camera. When the first sensor unit 155 is a high-resolution camera, the first sensor unit 155 may be disposed above the inspection substrate ISUB on which the ink I is applied, and may photograph the inspection substrate ISUB disposed thereunder to measure the diameter or position of the material applied to the inspection substrate ISUB and the error therebetween. However, the first sensor unit 155 is not limited to a high-resolution camera as long as it is a device capable of detecting the material applied to the inspection substrate ISUB.

[0108] Figure 6 is a schematic diagram showing ink applied to an inspection substrate according to the embodiment.

[0109] In the following, reference will be made to Figures 4 to 6 A method of inspecting the discharge amount of the ink I applied to the upper surface of the inspection substrate ISUB using the discharge amount inspection unit 100 is described.

[0110] Even when the printing process is repeated several times, the ink I ejected from the inkjet head device 300 must be the same amount of ink I ejected onto the target substrate SUB to the same position. Therefore, before the ink I is ejected from the inkjet head device 300 onto the target substrate SUB, a process of checking whether the same amount of ink I is ejected onto the inspection substrate ISUB to the same position may be performed, and the setting value of the inkjet printing apparatus 1000 may be adjusted according to the result of the check.

[0111] The first sensing unit 150 may be disposed above the inspection substrate ISUB to measure the NZ for each nozzle using the ink I applied to the upper surface of the inspection substrate ISUB (see FIG. Fig.10 ). The discharge amount for each nozzle NZ can be measured by detecting the diameter of the ink I applied to the inspection substrate ISUB. In addition, the first sensing unit 150 can be disposed above the inspection substrate ISUB to measure the application position for each nozzle NZ using the ink I applied to the upper surface of the inspection substrate ISUB. The first sensing unit 150 can measure the error by comparing the reference set value with the diameter and the application position of the ink I.

[0112] As described above, in an exemplary embodiment, the first sensor unit 155 of the first sensing unit 150 may include a high-resolution camera. When the first sensor unit 155 includes a high-resolution camera, the high-resolution camera may photograph the upper surface of the inspection substrate ISUB on which the ink I is applied at the upper portion of the inspection substrate ISUB and generate image data. The first sensing unit 150 may analyze the image data generated by the first sensor unit 155 and calculate the diameter and application position of the ink I applied to the upper surface of the inspection substrate ISUB to measure the diameter and application position of the ink I.

[0113] In addition, the first sensing unit 150 can measure the area S1 of the ink I using the diameter of each drop of ink I (see Fig.31 ), in order to count the number of particles contained in the ink I using a particle count inspection unit 600 to be described below. Data on the area of ​​the ink I measured by the first sensing unit 150 may be transmitted to the particle count inspection unit 600.

[0114] The first sensing unit 150 may measure a diameter W of the ink I applied to the upper surface of the inspection substrate ISUB. I1 and W I2 And measure the interval P between two spots of ink I I1 and P I2 . The measured diameter W of ink I I1 and W I2 and the measured interval P I1 and P I2 A comparison is made with a reference set value, and the discharge amount of the ink I ejected from the inkjet head device 300 and the position of the ink discharge member of the inkjet head device 300 may be adjusted to be close to the reference set value according to the comparison result.

[0115] Specifically, the diameter W of the ink I measured by the first sensing unit 150 may be I1 and W I2 and the interval P I1 and P I2The measured data is transmitted to the inkjet head device 300, and the ink discharge member of the inkjet head device 300 can be aligned based on the transmitted data. A detailed description of the method of aligning the ink discharge member of the inkjet head device 300 will be given below with reference to other drawings.

[0116] like Figure 6 As shown in FIG. 1 , the diameter W of the ink I ejected from the inkjet head device 300 and applied to the upper surface of the inspection substrate ISUB is I1 and W I2 and the interval P I1 and P I2 The first sensing unit 150 may detect such an error.

[0117] The discharge amount inspection unit 100 can measure the diameter W of the ink I applied to the upper surface of the inspection substrate ISUB. I1 and W I2 , to adjust the number of dipoles DP dispersed in the ink I ejected once. I1 and W I2 When the diameter W of the inkjet printing apparatus 1000 is different from each other, the reliability of the product manufactured using the inkjet printing apparatus 1000 may be reduced. Therefore, the discharge amount inspection unit 100 can detect such an error and adjust the amount of ink I ejected from the inkjet head device 300 to match the diameter W of the ink I. I1' and W I2' , therefore, the number of dipoles DP contained in the ink I ejected once can be maintained.

[0118] The process of inspecting the first sensing unit 150 and aligning the inkjet head device 300 may be repeated so that the diameter W of the ink I is I1' and W I2' and the interval P I1' and P I2' The reference setting value matches or is close to the reference setting value. The reference setting value may be a "characteristic value" required by the inkjet head device 300 that ejects the ink I including the dipole DP when driving the inkjet printing apparatus 1000. For example, the reference setting value may include the amount of ink I ejected from each nozzle NZ of the inkjet head device 300, the application position of the ink I, the number of dipoles DP contained in the ink I, etc.

[0119] Figure 7 is a schematic cross-sectional layout of a particle count inspection unit and an inspection stage unit according to an embodiment.

[0120] Reference Figure 1 and Figure 7 , the particle count inspection unit 600 may include a third support member 610 , a second heat treatment unit 630 , and a second sensing unit 640 .

[0121] The particle count inspection unit 600 may inspect the number of dipoles DP included in the ink I ejected from the inkjet head device 300 and applied onto the inspection substrate ISUB.

[0122] The third support member 610 may include a third horizontal support portion 611 extending in the horizontal direction and a third vertical support portion 612 connected to both ends of the third horizontal support portion 611 to extend in a third direction D3 as a vertical direction. The extending direction of the third horizontal support portion 611 may be the same as the first direction D1 as the long side direction of the inspection table unit 200.

[0123] The second heat treatment unit 630 may be disposed above the inspection stage unit 200. The second heat treatment unit 630 may be installed on the third support 610 at a predetermined distance from the inspection stage unit 200. The second heat treatment unit 630 may be installed on the third horizontal support portion 611 of the third support 610. Although not shown, the second heat treatment unit 630 may include a separate moving member to move in the first direction D1 and / or the third direction D3 on the third support 610.

[0124] The separation distance between the second heat treatment unit 630 and the inspection stage unit 200 can be adjusted within a certain range, within which, when the inspection substrate ISUB is placed on the inspection stage unit 200, the second light H2 radiated from the second heat treatment unit 630 can be ensured to be radiated to the entire area of ​​the inspection substrate ISUB at a certain interval from the inspection substrate ISUB.

[0125] The second heat treatment unit 630 may generate heat energy by irradiating the inspection substrate ISUB to which the ink I is applied with the second light H2. The second heat treatment unit 630 may include a device for generating heat. The device for generating heat is not specifically limited. In an exemplary embodiment, the second light H2 may include light in an infrared (IR) band, and the second heat treatment unit 630 may include an IR irradiation device. Due to the heat energy generated by the second heat treatment unit 630 by irradiating the inspection substrate ISUB with the second light H2, the solvent SV of the ink I applied to the upper surface of the inspection substrate ISUB may be removed by volatilization or evaporation. Therefore, a plurality of dipoles DP may remain on the inspection substrate ISUB.

[0126] The second sensing unit 640 may be disposed under the inspection stage unit 200. The second sensing unit 640 may be disposed under the inspection stage unit 200 at a predetermined distance from the inspection substrate ISUB.

[0127] The second sensing unit 640 may include a camera. Hereinafter, a case where the second sensing unit 640 is a camera unit 640 will be described. When the second sensing unit 640 includes a camera, the second sensing unit 640 may be disposed below the inspection substrate ISUB, and may photograph the bottom surface (lower surface) of the inspection substrate ISUB to generate image data. When the inspection substrate ISUB includes a transparent material, the image data generated by the second sensing unit 640 by photographing from below the inspection substrate ISUB may include a plurality of dipoles DP.

[0128] The light irradiation unit 650 may be disposed above the inspection stage unit 200 to irradiate the inspection stage unit 200 with light. That is, the light irradiation unit 650 may irradiate the inspection substrate ISUB with light on the inspection substrate ISUB. The light irradiated by the light irradiation unit 650 may be light in the visible light band.

[0129] When the light irradiation unit 650 disposed above the inspection substrate ISUB irradiates the inspection substrate ISUB with light, the second sensing unit 640 disposed below the inspection substrate ISUB may generate image data by photographing a partial area of ​​the inspection substrate ISUB on which a plurality of dipoles DP are disposed. The image data generated by the second sensing unit 640 may be an image represented by light and dark. The dark area may be an area corresponding to the plurality of dipoles DP.

[0130] The particle count inspection unit 600 may be configured to measure and transmit the area S1 of the ink I measured and transmitted by the first sensing unit 150 as described above (see FIG. Fig.31 ) and the area S2 of the region corresponding to the dipole DP measured from the image data (see Fig.31 ) for comparison. The particle count inspection unit 600 can calculate the number of dipoles based on the area S1 of the ink I and the area S2 of the region corresponding to the dipole DP, and compare the calculated number of dipoles with the reference setting value. The ink supply device 400 (see FIG. 1 ) to be described below can be adjusted according to the result of the comparison between the number of dipoles and the reference setting value. Fig.15 ) to secondarily adjust the number of dipoles DP supplied to the inkjet head device 300.

[0131] Figure 8 is a schematic plan layout of an inkjet head unit and an inspection stage unit according to an embodiment. Fig. 9 is a bottom view of an inkjet head unit according to an embodiment.

[0132] Figure 8 3 is a plan view of the inkjet head device 300 viewed from a third direction D3 (eg, from above). It should be noted that Fig. 9 This is a bottom view of the inkjet head unit 330 as viewed from below.

[0133] Reference Figure 1 and Figure 8 , the inkjet head device 300 according to the embodiment may include a first support member 310 , an inkjet head unit 330 , a first heat treatment unit 370 , and a third sensing unit 350 .

[0134] The first support member 310 may include a first horizontal support portion 311 extending in the horizontal direction and a first vertical support portion 312 connected to both ends of the first horizontal support portion 311 to extend in a third direction D3 as a vertical direction. The extension direction of the first horizontal support portion 311 may be the same as the first direction D1, which is the extension direction of the second horizontal support portion 111 described above.

[0135] The inkjet head unit 330 is used to eject the ink I including the dipole DP onto the target substrate SUB and / or the inspection substrate ISUB. The inkjet head unit 330 may be disposed above the stage unit 500. Figure 8 Although not shown in the drawing, the inkjet head unit 330 may be disposed above the inspection stage unit 200 while performing a process of inspecting the ink I applied onto the inspection substrate ISUB.

[0136] The inkjet head unit 330 may be mounted on the first horizontal support portion 311 of the first support member 310. The inkjet head unit 330 may be mounted on the first horizontal support portion 311 and disposed to protrude toward one side thereof from the first horizontal support portion 311. For example, the inkjet head unit 330 may be disposed to protrude toward one side thereof from the first horizontal support portion 311 in the second direction D2.

[0137] The first heat treatment unit 370 may be used to heat the first light H1 (see Fig.12 ) irradiates the target substrate SUB and / or inspection substrate ISUB onto which the ink I is applied, and removes the solvent SV of the ink I by volatilization or evaporation.

[0138] The first heat treatment unit 370 may be mounted on the first horizontal support portion 311 of the first support member 310. The first heat treatment unit 370 may be mounted on the first horizontal support portion 311 and disposed to protrude from the first horizontal support portion 311 toward the other side opposite to the one side. For example, the first heat treatment unit 370 may be disposed to protrude from the first horizontal support portion 311 in a direction opposite to the second direction D2. Therefore, the first horizontal support portion 311 of the first support member 310 may be disposed between the inkjet head unit 330 and the first heat treatment unit 370.

[0139] In the following, reference will be made to Figure 8 and Fig. 9 The inkjet head unit 330 of the inkjet head device 300 according to the embodiment is described in detail.

[0140] The inkjet head unit 330 may be mounted on the first horizontal supporting portion 311 of the first supporting member 310 at a predetermined distance from the stage unit 500 and / or the inspection stage unit 200. The separation distance between the inkjet head unit 330 and the stage unit 500 and / or the inspection stage unit 200 may be adjusted within a certain range in which, when a target substrate SUB is placed on the stage unit 500 or an inspection substrate ISUB is placed on the inspection stage unit 200, the inkjet head unit 330 has a certain interval from the target substrate SUB and / or the inspection substrate ISUB to ensure a space for a printing process.

[0141] The inkjet head unit 330 may be connected to a separate ink storage (not shown) to receive the ink I, and eject the ink I onto the target substrate SUB and / or the inspection substrate ISUB through an inkjet head 335 to be described below.

[0142] Although one inkjet head unit 330 is shown in the drawings, the present invention is not limited thereto. For example, in a process of providing multiple types of inks I onto a target substrate SUB, the same number of inkjet head units 330 having the same type as the type of ink I may be disposed on the target substrate SUB.

[0143] The inkjet head unit 330 may include a head base 331 , a plurality of clamp units 333 disposed on a bottom surface of the head base 331 , and at least one inkjet head 335 disposed on the clamp unit 333 and including a plurality of nozzles NZ.

[0144] The head base 331 of the inkjet head unit 330 may be mounted on the first horizontal support portion 311 of the first support member 310. The head base 331 may be spaced apart from the stage unit 500 by a predetermined interval in the third direction D3. The head base 331 may have a shape extending in the first direction D1. The head base 331 may further include a moving member that moves in the extending direction of the first horizontal support portion 311 (i.e., the first direction D1).

[0145] A plurality of clamp units 333 may be arranged on a surface of the head base 331 (e.g., the bottom surface of the head base 331). At least one inkjet head 335 is arranged on each clamp unit 333. A plurality of clamp units 333 may be arranged spaced apart from each other in one direction. A plurality of clamp units 333 may be arranged in one direction and arranged in one column or multiple columns. The accompanying drawings show that the clamp units 333 are arranged in two columns, and the clamp units 333 in each column are arranged alternately. However, the present invention is not limited thereto, and the clamp units 333 may be arranged in a larger number of columns, and are arranged to overlap each other without being arranged alternately. The shape of the clamp unit 333 is not specifically limited, and the clamp unit 333 may have, for example, a quadrilateral shape.

[0146] The inkjet head unit 330 may further include a plurality of head driving units AM1 and AM2 capable of moving each of the gripper units 333 in one direction and in another direction. The plurality of head driving units AM1 and AM2 may adjust the position of each gripper unit 333 and the interval between the gripper units 333. By adjusting the interval between the gripper units 333 using the head driving units AM1 and AM2, the impact position of the ink I ejected from the inkjet head 335 provided on the gripper unit 333 may be adjusted.

[0147] The inkjet heads 335 are disposed on the jig unit 333. At least one inkjet head 335 may be disposed on the jig unit 333. In an exemplary embodiment, two inkjet heads 335 may form one group and may be disposed on one jig unit 333. However, the number of inkjet heads 335 included in one group is not limited thereto, and the number of inkjet heads 335 included in one group may be, for example, one to five.

[0148] In addition, although it is illustrated in the drawings that one inkjet head unit 330 includes a plurality of gripper units 333 and inkjet heads 335 , the numbers of gripper units 333 and inkjet heads 335 included in the inkjet head unit 330 are not limited thereto.

[0149] Fig.10 is a schematic diagram illustrating ejection of ink from an inkjet head according to an embodiment.

[0150] Reference Fig.10 , the inkjet head 335 may include an inner tube IP and a plurality of nozzles NZ. Each nozzle NZ located in the bottom surface of the inkjet head 335 may be connected to the inner tube IP of the inkjet head 335. The inkjet head 335 may receive ink I from the head base 331 through the inner tube IP, and the received ink I may flow through the inner tube IP and may be ejected through each nozzle NZ. The ink I ejected through each nozzle NZ may be supplied to the upper surface of the target substrate SUB and / or the inspection substrate ISUB.

[0151] The amount of ink I ejected through the nozzle NZ may be adjusted according to a voltage applied to each nozzle NZ. In an embodiment, the amount of ink I ejected once from each nozzle NZ may be in the range of 1 to 50 picoliters (pl), but the present invention is not limited thereto.

[0152] Fig.11 is a schematic cross-sectional view illustrating an inkjet head unit inspected by a third sensing unit of the inkjet head device according to an embodiment.

[0153] Reference Figure 1 , Figure 8 and Fig.11, the third sensing unit 350 may be mounted on the first support member 310. The third sensing unit 350 may be used to check the alignment degree of the ink discharge member included in the inkjet head unit 330, the amount of the ejected ink I, etc. In addition, the third sensing unit 350 may check whether the nozzle NZ of the inkjet head 335 is clogged.

[0154] The third sensing unit 350 may include a sensor moving part 351 , a sensor supporting part 353 disposed on one surface of the sensor moving part 351 , and a third sensor unit 355 disposed on the sensor supporting part 353 .

[0155] The sensor moving part 351 may be installed on the first horizontal supporting part 311. The sensor moving part 351 may be movable in the first direction D1 which is the extending direction of the inkjet head unit 330. The sensor moving part 351 may be used to move the third sensor unit 355 in the first direction D1 which is the extending direction of the inkjet head unit 330.

[0156] The sensor support portion 353 may be disposed below the sensor moving portion 351 and have a shape extending in the second direction D2. One end of the sensor support portion 353 may be connected to the sensor moving portion 351, and the third sensor unit 355 may be disposed on an upper surface of the other end in the second direction D2. The third sensing unit 350 may be disposed to protrude substantially from the first support member 310 in the second direction D2. For example, similar to the inkjet head unit 330, the third sensing unit 350 may be disposed to protrude toward one side of the first horizontal support portion 311 in the second direction D2.

[0157] The third sensor unit 355 is disposed on an upper surface of the sensor supporting portion 353. The third sensor unit 355 may be disposed under the inkjet head 335 to face the inkjet head 335.

[0158] The third sensor unit 355 may be moved in the extending direction of the inkjet head unit 330 by the sensor moving part 351. The third sensor unit 355 may be moved in the extending direction of the inkjet head unit 330 under the inkjet head unit 330 to check the position or alignment state of the inkjet head 335 provided on the bottom surface of the inkjet head unit 330. In addition, the third sensor unit 355 may monitor the amount of ink I ejected from the inkjet head 335, stains or dried ink I generated on the inkjet head 335, and the like.

[0159] The drawings show that the third sensor unit 355 includes one detection member, but the present invention is not limited thereto. The third sensor unit 355 may have one of various shapes to check the alignment degree of the inkjet head 335. For example, when the inkjet head 335 is arranged in a plurality of columns, the third sensor unit 355 may also include a plurality of detection members, and the plurality of detection members may be arranged in a plurality of columns.

[0160] In the following, reference will be made to Fig. 9 and Fig.11 A method is described in which a third sensing unit inspects an inkjet head unit and drives the inkjet head unit based on a result of the inspection.

[0161] Reference Fig. 9 and Fig.11 Before the inkjet head 335 ejects ink I onto the target substrate SUB or the inspection substrate ISUB, the third sensing unit 350 may check an alignment degree of the inkjet head 335 of the inkjet head unit 330, stains generated on the inkjet head 335, and the like.

[0162] In particular, each inkjet head 335 may further include dummy nozzles DN located on both sides of the lower surface of the inkjet head 335. The third sensing unit 350 may measure the alignment state of the inkjet head 335 using the detected positions of the dummy nozzles DN. For example, the third sensing unit 350 may detect the positions of the dummy nozzles DN located on both sides of the lower surface of each inkjet head 335, and measure the intervals HP1 and HP2 between the positions of the dummy nozzles DN of the inkjet heads 335 disposed adjacent to each other. The alignment state of the inkjet head 335 may be indirectly measured using the measured intervals HP1 and HP2 between the dummy nozzles DN.

[0163] The inkjet head unit 330 may align the inkjet head 335 based on the information measured by the first sensing unit 150 and the third sensing unit 350. In particular, the inkjet head unit 330 may align the inkjet head 335 based on the diameter W of the ink I applied to the inspection substrate ISUB measured by the first sensing unit 150 of the discharge amount inspection unit 100. I1 and W I2 and interval P I1 and P I2 And the alignment state of the inkjet head 335 measured by the third sensing unit 350 of the inkjet head device 300 drives the head driving units AM1 and AM2 to realign the clamp unit 333 and the inkjet head 335 .

[0164] The first head driving unit AM1 may be located on the clamp unit 333 in the first direction D1. The first head driving unit AM1 may be a driving unit for moving the clamp unit 333 and the inkjet head 335 in the first direction D1 so as to align the clamp unit 333 and the inkjet head 335. The second head driving unit AM2 may be located on the clamp unit 333 in the second direction D2. The second head driving unit AM2 may be a driving unit for moving the clamp unit 333 and the inkjet head 335 in the second direction D2 so as to align the clamp unit 333 and the inkjet head 335.

[0165] Meanwhile, the third sensing unit 350 may monitor the state of the inkjet head 335, the amount of the ejected ink I, etc. Although not shown in the drawings, the inkjet head device 300 may further include a cleaning unit for cleaning the nozzles NZ of the inkjet head 335. Among the processes of the inkjet printing apparatus 1000, the cleaning unit may perform a process of cleaning the inkjet head 335 based on the information detected by the third sensing unit 350. For example, when the third sensing unit 350 detects stains generated on the inkjet head 335 or clogging of the nozzles NZ, the cleaning unit may perform a process of cleaning the nozzles NZ of the inkjet head 335.

[0166] Fig.12 is a cross-sectional view of a first heat treatment unit according to an embodiment. Fig.13 is a schematic diagram illustrating driving of a heat treatment unit according to an embodiment.

[0167] Reference Figure 1 , Figure 8 and Fig.12 The first heat treatment unit 370 may include a base portion 371 and first heat treatment units 373 and 375 that radiate the first light H1. The first light H1 may include 1-1 light H 11 and 1-2 light H 12 , and the first heat treatment units 373 and 375 may include radiating 1-1 light H 11 The first main heat treatment unit 373 and radiate 1-2 light H 12 The first auxiliary heat treatment unit 375 is provided.

[0168] The base portion 371 may be mounted on the first horizontal supporting portion 311 of the first support member 310 and disposed to protrude toward the other side of the first horizontal supporting portion 311 in the second direction D2.

[0169] The base portion 371 may have a shape extending in the first direction D1, and may provide a space in which the first main heat treatment unit 373 and the first auxiliary heat treatment unit 375 are disposed. The base portion 371 may further include a moving member for covering one side (e.g., one side extending in the first direction D1) of the target substrate SUB.

[0170] The first main heat-treatment unit 373 and the first auxiliary heat-treatment unit 375 may be disposed under the base portion 371. The first main heat-treatment unit 373 and the first auxiliary heat-treatment unit 375 may be disposed under the base portion 371 at a predetermined distance from the target substrate SUB. The first main heat-treatment unit 373 and the first auxiliary heat-treatment unit 375 may be spaced apart from the target substrate SUB by a predetermined distance so that other members disposed on the target substrate SUB are not damaged by the first light H1 radiated from the first main heat-treatment unit 373 and the first auxiliary heat-treatment unit 375.

[0171] The first main heat treatment unit 373 can be provided by using 1-1 light H 11 The target substrate SUB disposed thereunder is irradiated to generate heat energy. The first main heat treatment unit 373 may include a device for generating heat. For example, the first main heat treatment unit 373 may include an IR irradiation device. 1-1 Light H 11 Infrared light may be included, and the first main heat treatment unit 373 may include an IR irradiation device. 11 The thermal energy generated by irradiating the target substrate SUB may remove the solvent SV of the ink I applied to the upper surface of the target substrate SUB.

[0172] A shielding device may be further provided on the first main heat treatment unit 373. The shielding device may be used to partially shield the I-I light H radiated from the first main heat treatment unit 373. 11 To prevent damage to the target substrate SUB.

[0173] The first auxiliary heat treatment unit 375 can be 1-2 light H 12 The target substrate SUB disposed thereunder is irradiated to transmit power to the dipole DP disposed on the target substrate SUB. For example, the first auxiliary heat treatment unit 375 may include an ultraviolet (UV) lamp. 1-2 light H 12 Ultraviolet light may be included, and the first auxiliary heat treatment unit 375 may include a UV lamp. The dipole DP disposed on the target substrate SUB may be heated by the first auxiliary heat treatment unit 375 with 1-2 light H 12 The energy generated by irradiating the target substrate SUB is biased and aligned.

[0174] Reference Figure 1 , Figure 8 and Fig.13, ink I including a solvent SV and a dipole DP may be applied to an upper surface of a target substrate SUB placed on the stage unit 500 and moved in a direction opposite to the second direction D2 to pass through the inkjet head unit 330. The target substrate SUB that has passed through the inkjet head unit 330 may move in a direction opposite to the second direction D2 to pass through the first heat treatment unit 370.

[0175] The solvent SV of the ink I may be removed, and only the dipole DP may remain on the upper surface of the target substrate SUB passing through the first heat treatment unit 370. The solvent SV may be removed from the ink I applied to the upper surface of the target substrate SUB in the overlapping region of the first main heat treatment unit 373. That is, when the stage unit 500 moves in the direction opposite to the second direction D2, the solvent SV included in the ink I applied to the upper surface of the target substrate SUB may be sequentially removed in the second direction D2.

[0176] Therefore, since the stage unit 500 passes through the first heat treatment unit 370 in the direction opposite to the second direction D2, the 1-1 light H 11 The ink I may be sequentially radiated onto the target substrate SUB in the second direction D2. Therefore, when the stage unit 500 moves in a direction opposite to the second direction D2 and passes through the first heat treatment unit 370, the solvent SV of the ink I applied onto the target substrate SUB may be sequentially removed while the stage unit 500 moves. Fig.13 As shown in , the solvent SV (dashed line area) may be removed so that the dipole DP may be disposed in a partial area of ​​the target substrate SUB passing through the first heat treatment unit 370 .

[0177] Meanwhile, although not shown in the drawings, the stage unit 500 may further include a control device for detecting the temperature of the upper portion of the target substrate SUB and adjusting the temperature. When the temperature on and around the target substrate SUB rises to a certain level due to the first light H1 radiated from the first heat treatment unit 370, the control device may control the temperature of the target substrate SUB to decrease.

[0178] In the inkjet head device 300 according to the present embodiment, the inkjet head unit 330 may be disposed on one side of the first support 310 in one direction, and the first heat treatment unit 370 may be disposed on the other side of the first support 310 in one direction. The target substrate SUB placed on the stage unit 500 may sequentially pass through the inkjet head unit 330 and the first heat treatment unit 370 while moving in one direction. Therefore, while the printing process is performed by the inkjet head unit 330, a process of drying the solvent SV contained in the ink I may be simultaneously performed. Therefore, the time for performing the printing process may be reduced, and the process efficiency may be improved.

[0179] Fig.14 is a plan view of a stage unit according to the embodiment.

[0180] Reference Figure 1 , Figure 2 and Fig.14 , the stage unit 500 may include a base frame 510 , a stage 520 , a probe unit 550 , and an aligner 580 .

[0181] The base frame 510 may support members included in the stage unit 500. For example, the stage 520 and the probe unit 550 may be disposed on the base frame 510.

[0182] In the inkjet printing apparatus 1000, the base frame 510 may be disposed on the first rail RR1 and the second rail RR2, and may reciprocate in the second direction D2. Although not shown in the drawings, a predetermined moving member may be disposed on the lower surface of the base frame 510, and the moving member may be fastened to the first rail RR1 and the second rail RR2 to move the base frame 510 in one direction. The base frame 510 may move according to the process sequence of the inkjet printing apparatus 1000, and during the process of the inkjet printing apparatus 1000, each unit or device may be driven according to the movement of the base frame 510.

[0183] The stage 520 may be disposed on the base frame 510 . The stage 520 may provide a space in which the target substrate SUB is placed. In addition, an aligner 580 may be disposed on the stage 520 .

[0184] The overall planar shape of the stage 520 may follow the planar shape of the target substrate SUB. For example, when the target substrate SUB is rectangular in plan view, the planar shape of the stage 520 may have a rectangular shape as shown in the drawings, and when the target substrate SUB is circular in plan view, the stage 520 may also have a circular planar shape.

[0185] The aligner 580 may be installed on the stage 520 to align the target substrate SUB placed on the stage 520. The aligner 580 may be provided on each side of the stage 520, and an area surrounded by a plurality of aligners 580 may be an area in which the target substrate SUB is placed. The drawings show that two aligners 580 are provided on each side of the stage 520, and a total of eight aligners 580 are provided on the stage 520, but the present invention is not limited thereto, and the number and arrangement of the aligners 580 may vary according to the shape or type of the target substrate SUB.

[0186] The probe unit 550 may be disposed on the base frame 510. The probe unit 550 may be used to form an electric field on a target substrate SUB disposed on the stage 520. The probe unit 550 may extend in the second direction D2, and the extension length of the probe unit 550 may cover the width of the entire target substrate SUB in the second direction D2. The size and shape of the probe unit 550 may vary according to the size and shape of the target substrate SUB.

[0187] The probe unit 550 may include a probe driving unit 553 , a probe pad 558 connected to the probe driving unit 553 and capable of contacting the target substrate SUB, and a plurality of probe fixtures 551 connected to the probe pad 558 and transmitting an electrical signal.

[0188] The probe driving unit 553 may be disposed on the base frame 510 to move the probe pad 558. In an exemplary embodiment, the probe driving unit 553 may move the probe pad 558 in a horizontal direction and a vertical direction (e.g., a first direction D1 as a horizontal direction and a third direction D3 as a vertical direction). The probe pad 558 may be connected to or separated from the target substrate SUB by driving the probe driving unit 553. Among the processes of the inkjet printing apparatus 1000, in the process of forming an electric field on the target substrate SUB, the probe driving unit 553 may be driven to connect the probe pad 558 to the target substrate SUB, and in the remaining processes, the probe driving unit 553 may be re-driven to separate the probe pad 558 from the target substrate SUB.

[0189] The probe pad 558 may form an electric field on the target substrate SUB using an electric signal transmitted from the probe fixture 551. The probe pad 558 may be connected to the target substrate SUB to transmit an electric signal and form an electric field on the target substrate SUB. For example, the probe pad 558 may contact an electrode or a power pad of the target substrate SUB, and an electric signal of the probe fixture 551 may be transmitted to the electrode or the power pad. An electric field may be formed on the target substrate SUB using the electric signal transmitted to the target substrate SUB.

[0190] However, the present invention is not limited thereto, and the probe pad 558 may be a member that forms an electric field using an electric signal transmitted from the probe fixture 551. That is, when the probe pad 558 forms an electric field by receiving an electric signal, the probe pad 558 may not be connected to the target substrate SUB.

[0191] The shape of the probe pad 558 is not particularly limited, and in an exemplary embodiment, the probe pad 558 may have a shape extending in one direction to cover the width of the entire target substrate SUB in the second direction D2.

[0192] The probe fixture 551 may be connected to the probe pad 558 and to a separate voltage applying device. The probe fixture 551 may transmit an electrical signal transmitted from the voltage applying device to the probe pad 558 to form an electric field on the target substrate SUB. The electrical signal transmitted to the probe fixture 551 may be a voltage (e.g., an alternating current (AC) voltage) for forming an electric field.

[0193] Although it is shown in the drawing that four probe fixtures 551 are provided, the probe unit 550 may include a greater number of probe fixtures 551 to form an electric field having a higher density on the target substrate SUB.

[0194] The probe unit 550 according to the embodiment is not limited thereto. Although the probe unit 550 is shown in the drawings as being included in the stage unit 500 and disposed on the base frame 510, in some cases, the probe unit 550 may be provided as a separate device. As long as the stage unit 500 may include a device capable of forming an electric field to form an electric field on the target substrate SUB, its structure or arrangement is not limited.

[0195] Fig.15 is a schematic diagram showing an ink supply device according to an embodiment.

[0196] The ink supply device 400 may be used to supply the prepared ink I to the inkjet head device 300. When the dipoles DP in the ink I are manufactured in a dispersed state, the prepared ink I may be stored or transferred to be supplied to the inkjet head device 300 of the inkjet printing apparatus 1000. As shown in the drawings, the ink supply device 400 may be connected to the inkjet head device 300.

[0197] Reference Fig.15 The ink supply device 400 may include an ink tank 410 , an ink agitator 420 , an ink storage 430 , and a circulation pump 450 .

[0198] The ink tank 410 may be used to store the prepared ink I and supply the prepared ink I to the ink agitator 420. The shape of the ink tank 410 is not particularly limited, and in an exemplary embodiment, the ink tank 410 may be an ink cartridge, an ink container, etc. Although not shown in the drawings, the ink tank 410 may further include a pneumatic forming device capable of transmitting pressure for supplying the ink I to the ink agitator 420.

[0199] The ink agitator 420 may be used to agitate the ink I supplied from the ink tank 410, redisperse the dipole DP, and transfer the ink I to the ink storage 430. The dipole DP may include a material having a relatively high specific gravity to settle or sink over time in the prepared ink I. The ink agitator 420 may agitate the ink I to redisperse the dipole DP settled in the ink I before the ink I is supplied to the ink storage 430.

[0200] In an exemplary embodiment, the ink agitator 420 may include a stirring device 425 to disperse the dipole DP in the ink I. The type of the stirring device 425 is not specifically limited. For example, the stirring device 425 may be a magnetic stirrer, a propeller stirrer, etc. In the drawings, a magnetic stirrer is shown, and the stirring device 425 may redisperse the dipole DP in the ink I supplied from the ink tank 410.

[0201] The ink storage 430 may supply the ink I supplied from the ink agitator 420 to the inkjet head device 300. The ink storage 430 may perform substantially the same function as that of the ink tank 410, and may receive the ink I through the ink agitator 420 agitating the prepared ink I. Therefore, the ink storage 430 may supply the ink I including the dipole DP having a relatively high degree of dispersion to the inkjet head device 300. The inkjet head device 300 may control the number or degree of dispersion of the dipole DP contained in the ink I ejected once from the inkjet head 335 by receiving the ink I through the ink storage 430 without directly receiving the ink I from the ink tank 410. That is, the uniform quality of the ink I can be maintained according to the process of the inkjet printing apparatus 1000.

[0202] The circulation pump 450 may have one end connected to the inkjet head device 300 and the other end connected to the ink agitator 420 to circulate the ink I in the inkjet printing apparatus 1000. During the process of the inkjet printing apparatus 1000, when the number of dipoles DP applied to the inspection substrate ISUB measured by the particle count inspection unit 600 is less than a reference set value, the circulation pump 450 may be driven and may transfer the ink I of the inkjet head device 300 to the ink agitator 420. That is, the circulation pump 450 may receive information about the number of dipoles DP measured by the particle count inspection unit 600, and may circulate the ink I in the ink agitator 420, the ink storage 430, and the inkjet head device 300 so as to maintain the quality of the ink I supplied to the inkjet head device 300. Therefore, the ink I may be supplied to the inkjet head device 300 using feedback of the information provided from the particle count inspection unit 600.

[0203] The inkjet printing apparatus 1000 according to the embodiment may include a first sensing unit 150, a second sensing unit 640, and a third sensing unit 350. The first sensing unit 150, the second sensing unit 640, and the third sensing unit 350 may inspect and monitor the state of the inkjet head 335 included in the inkjet head unit 330 in real time using the inspection substrate ISUB while performing a printing process of printing with the ink I on the target substrate SUB. In particular, the first sensing unit 150, the second sensing unit 640, and the third sensing unit 350 may each perform an operation of comparing the measured information with a reference set value, and thus, the components of the inkjet printing apparatus 1000 may be controlled. For example, data including information on the discharge amount of the ink I measured by the first sensing unit 150, information on the number of particles of the dipole DP measured by the second sensing unit 640, and information on the degree of alignment of the inkjet head 335 measured by the third sensing unit 350 may be transmitted to the inkjet head device 300. The inkjet head device 300 may receive the above information, adjust the alignment state of the inkjet head 335 ejecting the ink I or clean the nozzle NZ, and adjust the degree of dispersion of the dipoles DP in the supplied ink I.

[0204] Therefore, the inkjet printing apparatus 1000 according to the embodiment may include at least one sensing unit 150, 350 or 640 to detect in real time an error that may occur during the process of the inkjet printing apparatus 1000. Each of the sensing units 150, 350 and 640 may detect an error and a defect that may occur during the process, and may compensate for the error and the defect while performing the process. Therefore, in the inkjet printing apparatus 1000, even when the process is repeated several times, the quality of the target substrate SUB including the finally manufactured dipole DP may be maintained.

[0205] In addition, the inkjet head device 300 of the inkjet printing apparatus 1000 according to the embodiment may include a first heat treatment unit 370 and an inkjet head unit 330, and the first heat treatment unit 370 and the inkjet head unit 330 may be sequentially arranged in one direction. Therefore, in the inkjet printing apparatus 1000, while performing a process after the ink I is ejected onto the target substrate SUB and the solvent SV of the ink I is removed, the movement of the target substrate SUB may be minimized. Therefore, the process time of the inkjet printing apparatus 1000 may be reduced, and specifically, the ink I may be ejected onto the target substrate SUB, and then may continuously pass through the first heat treatment unit 370 to volatilize the solvent SV, thereby preventing misalignment of the dipole DP.

[0206] In addition, the particle count inspection unit 600 of the inkjet printing apparatus 1000 according to the embodiment may include a second heat treatment unit 630 to directly measure the number of dipoles DP remaining after the solvent SV of the ink I applied to the inspection substrate ISUB is dried using the second heat treatment unit 630. On the other hand, in a method of indirectly calculating the number of dipoles DP by measuring the area or volume of the ink I applied to the inspection substrate ISUB without removing the solvent SV, the area or volume of the ink I may not be accurately calculated due to a measurement time difference caused by the volatility characteristics of the solvent SV. Therefore, compared with the measurement error rate of indirectly calculating (or measuring) the number of dipoles DP by the area or volume of the ink I, the measurement error rate of the number of dipoles DP measured using the particle count inspection unit 600 can be reduced, thereby improving the reliability of the inspection.

[0207] Hereinafter, a printing method using the inkjet printing apparatus 1000 according to the above-described embodiment will be described. In the following embodiment, descriptions of components identical to those of the already described embodiment will be omitted or simplified, and differences therebetween will be mainly described.

[0208] Fig.16 is a flowchart of a printing method using an inkjet printing apparatus according to an embodiment. Fig.17 It is shown Fig.16 Detailed flowchart of an example of operation S100. Fig.18 and Fig.19 It is shown Fig.16 Schematic diagram of operation S100 in FIG. Fig. 20 It is shown Fig.16 Detailed flowchart of an example of operation S200. Fig.21 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S200 . Figure 22 to Figure 24 It is shown Fig.21 FIG. 1 is a schematic diagram of operation S200 . Fig.25 It is shown Fig.16 Detailed flowchart of an example of operation S300. Fig.26 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S300 . Figures 27 to 31 It is shown Fig.26 FIG. 1 is a schematic diagram of operation S300 . Fig.32 It is shown Fig.16 FIG. 1 is a schematic diagram of operation S400 .

[0209] Reference Fig.16, the printing method using the inkjet printing apparatus 1000 according to the embodiment includes the following steps: operation S100 of ejecting ink containing a dipole onto an inspection substrate; operation S200 of providing a target substrate and inspecting the discharge amount of the ink applied to the inspection substrate; and operation S300 of ejecting ink onto the target substrate on which an electric field is formed, drying the ink applied to the inspection substrate, and inspecting the number of dipoles provided on the inspection substrate. The printing method using the inkjet printing apparatus 1000 may further include an operation S400 of ejecting the target substrate after performing the operation S300 of ejecting ink onto the target substrate on which an electric field is formed, drying the ink applied to the inspection substrate, and inspecting the number of dipoles provided on the inspection substrate.

[0210] First, the ink containing dipoles is jetted onto the inspection substrate ( Fig.16 S100 in ).

[0211] Reference Fig.17 The operation S100 of ejecting ink onto the inspection substrate may include the following steps: an operation S110 of disposing the inspection substrate on the inspection stage unit; an operation S120 of moving the inspection stage unit to the inkjet head device; and an operation S130 of ejecting ink containing a dipole onto the inspection substrate.

[0212] First, the inspection substrate is set on the inspection stage unit 200 ( Fig.17 S110 in ).

[0213] In particular, refer to Figure 3 and Fig.17 , the inspection substrate ISUB may be disposed on the upper substrate 220 of the inspection stage unit 200, and the inspection substrate ISUB may be fixed to the upper substrate 220 using the adsorption device 210. Since the adsorption device 210 includes a vacuum device, a clamp device, etc., the inspection substrate ISUB may be fixed to the upper substrate 220.

[0214] Thereafter, the upper surface of the inspection substrate ISUB is subjected to water repellent treatment. The water repellent treatment can be performed by fluorine coating, plasma surface treatment, or the like.

[0215] Next, the inspection table unit is moved to the inkjet head device ( Fig.17 S120 in ).

[0216] In particular, refer to Figure 1 and Fig.18The inspection stage unit 200 on which the inspection substrate ISUB is placed is disposed on the first track RR1 and the second track RR2, and moves in the second direction D2 toward the lower portion of the inkjet head unit 330 of the inkjet head device 300. The inspection stage unit 200 may move so that the inspection substrate ISUB and the inkjet head unit 330 are overlapped in the third direction D3.

[0217] Next, ink is jetted onto the inspection substrate ( Fig.17 S130 in ).

[0218] In particular, refer to Figure 1 , Fig.18 and Fig.19 , the inkjet head unit 330 may eject ink I including the dipole DP onto the upper surface of the inspection substrate ISUB. The inkjet head unit 330 may be connected to a separate ink storage (not shown) to receive the ink I through the inner tube IP. The nozzles NZ of the inkjet head 335 are each connected to the inner tube IP, so that the ink I may be ejected onto the upper surface of the inspection substrate ISUB through the plurality of nozzles NZ.

[0219] As described above, the ink I may include a solvent SV and a plurality of dipoles DP contained in the solvent SV. When no external force acts thereon, the dipoles DP contained in the ink I have a random orientation. Therefore, the orientation of the dipoles DP contained in the ink I applied to the upper surface of the inspection substrate ISUB is not aligned in a specific direction.

[0220] Next, a target substrate is provided and the discharge amount of the ink applied to the inspection substrate is inspected ( Fig.16 S200 in the ).

[0221] Reference Fig. 20 The operation S200 of providing the target substrate and checking the discharge amount of the ink applied to the inspection substrate may include an operation S210 of providing the target substrate on the stage unit and an operation S220 of checking the discharge amount of the ink applied to the inspection substrate. The operation S210 of providing the target substrate on the stage unit and the operation S220 of checking the discharge amount of the ink applied to the inspection substrate may be performed substantially in real time during the printing process (see FIG. Fig. 20 ).

[0222] Reference Fig.21 , the target substrate SUB may be placed on the stage 520 of the stage unit 500 ( Fig. 20 Although not shown, the target substrate SUB may be provided from the outside by a separate substrate transfer device and disposed on the stage 520 of the stage unit 500.

[0223] In addition, while the process of placing the target substrate SUB on the stage unit 500 is performed, the discharge amount inspection unit may inspect the discharge amount of ink applied to the inspection substrate ( Fig. 20 S220 in ).

[0224] The inspection stage unit 200 on which the inspection substrate ISUB is placed may be moved to the discharge amount inspection unit 100 to inspect the discharge amount of the ink I applied to the inspection substrate ISUB. The inspection stage unit 200 may be disposed on the first track RR1 and the second track RR2, and moved from the inkjet head unit 330 in a direction opposite to the second direction D2 to the discharge amount inspection unit 100. The inspection stage unit 200 on which the inspection substrate ISUB is applied is placed on an upper surface of the inspection stage unit 200. The inspection stage unit 200 on which the inspection substrate ISUB is placed may be disposed below the first sensing unit 150 of the discharge amount inspection unit 100.

[0225] Refer again Fig. 20 , operation S210 of providing a target substrate on a stage unit (see Fig. 20 ) may include operation S211 of providing and aligning a target substrate on a stage unit (see Fig. 20 ) and operation S212 of forming an electric field on the target substrate (see Fig. 20 ).

[0226] In particular, refer to Fig. 22 and Fig.23 , the probe driving unit 553 of the probe unit 550 may be operated according to the process operation of the inkjet printing apparatus 1000. The probe unit 550 may further include a probe supporter 530 on which the probe driving unit 553 is disposed.

[0227] In the first state in which the target substrate SUB is not disposed on the stage unit 500, other devices of the probe unit 550 may be disposed on the probe support 530 to be spaced apart from the stage 520. The probe driving unit 553 of the probe unit 550 may be driven in a first direction D1 as a horizontal direction and a third direction D3 as a vertical direction to separate the probe pad 558 from the stage 520.

[0228] Next, in a second state in which the target substrate SUB is placed on the stage unit 500 and an electric field is formed on the target substrate SUB, the probe driving unit 553 of the probe unit 550 may be driven to connect the probe pad 558 to the target substrate SUB. The probe driving unit 553 may be driven in a third direction D3 as a vertical direction and in a first direction D1 as a horizontal direction so that the probe pad 558 may contact the target substrate SUB. The probe fixture 551 of the probe unit 550 may transmit an electrical signal to the probe pad 558, and may form an electric field on the target substrate SUB.

[0229] Meanwhile, the drawing shows that one probe unit 550 is disposed on each side of the stage unit 500, and two probe units 550 are simultaneously connected to the target substrate SUB. However, the present invention is not limited thereto, and a plurality of probe units 550 may be driven individually.

[0230] Refer again Fig. 20 , an operation S220 of checking the discharge amount of the ink applied to the inspection substrate (see Fig. 20 ) may include an operation S221 of checking the discharge amount of ink applied to the inspection substrate (see Fig. 20 ) and operation S222 of correcting the setting value of the inkjet head device (see Fig. 20 ).

[0231] In particular, refer to Fig. 20 , Fig.21 and Fig.24 , the size (diameter) and the coating position of the ink I applied to the upper surface of the inspection substrate ISUB can be measured using the first sensing unit 150 disposed above the inspection substrate ISUB. The diameter W of the ink I applied to the inspection substrate ISUB measured using the first sensing unit 150 can be I1' and W I2' and the interval P between two spots of ink I I1 Compare with reference setpoint.

[0232] When the ink I is measured with a diameter W I1' and W I2' and the interval P between two spots of ink I I1 When the inkjet head 335 is different from the reference setting value, the setting value of the inkjet head device can be corrected by adjusting the position or voltage of the inkjet head 335 so that the ink I having the reference setting value can be ejected. Fig. 9 The inspection method may be repeated several times until each inkjet head 335 ejects at a size (or discharge amount) or position corresponding to a reference set value.

[0233] Next, the ink may be ejected onto the target substrate on which the electric field is formed, the ink applied onto the inspection substrate may be dried, and the number of dipoles ( Fig.16 S300 in the ).

[0234] Reference Fig.25 , ejecting ink onto a target substrate on which an electric field is formed, drying the ink applied onto the inspection substrate, and inspecting the number of dipoles in operation S300 (see Fig.16 ) may include operation S310 of ejecting ink onto a target substrate (see Fig.25) and operation S320 of drying the ink applied to the inspection substrate and inspecting the number of dipoles (see Fig.25 ).

[0235] Reference Fig.26 , the stage unit 500 on which the target substrate SUB is placed may be moved to the inkjet head unit 330, and the inkjet head unit 330 may eject the ink I onto the target substrate SUB ( Fig.25 .

[0236] The stage unit 500 on which the target substrate SUB is placed is disposed on the first track RR1 and the second track RR2, and moves in the direction opposite to the second direction D2 toward the lower portion of the inkjet head unit 330 of the inkjet head device 300. The target substrate SUB may sequentially pass through the inkjet head unit 330 and the first heat treatment unit 370 to move in the direction opposite to the second direction D2 on the lower portion of the inkjet head device 300. Therefore, since the target substrate SUB moves in the direction opposite to the second direction D2, the ink I may be ejected so that the ink I is applied to the upper surface of the target substrate SUB on the lower portion of the inkjet head unit 330, and the solvent SV of the ink I may be passed through the 1-1 light H 11 and 1-2 light H 12 While evaporating, the dipole DP may be aligned on the lower portion of the first heat treatment unit 370 .

[0237] Furthermore, the inspection stage unit 200 on which the inspection substrate ISUB is placed may be moved to the particle count inspection unit 600, and the particle count inspection unit 600 may measure the number of dipoles DP contained in the ink applied onto the inspection substrate ISUB ( Fig.25 320 in the example above).

[0238] The inspection stage unit 200 on which the inspection substrate ISUB is placed may be disposed on the first track RR1 and the second track RR2 and moved in a direction opposite to the second direction D2 to the particle count inspection unit 600. The inspection stage unit 200 may be moved to the particle count inspection unit 600 such that the inspection substrate ISUB is placed between the second heat treatment unit 630 and the second sensing unit 640 of the particle count inspection unit 600.

[0239] Refer again Fig.25 , operation S310 of ejecting ink onto a target substrate (see Fig.25 ) may include operation S311 of ejecting ink containing dipoles onto a target substrate on which an electric field is formed (see Fig.25 ) and operation S312 of drying the ink applied to the target substrate (see Fig.25 ).

[0240] In particular, refer to Figure 26 to Figure 29 , an electric field may be formed on the target substrate SUB by the probe unit 550. Due to the electric field formed on the target substrate SUB, the dipole DP may be oriented in one direction.

[0241] Reference Fig. 27 , the ink I may include a dipole DP ejected from a nozzle NZ of the inkjet head 335. The ink I discharged from the nozzle NZ may be ejected toward a target substrate SUB, and the ink I may be supplied onto the target substrate SUB ( Fig.25 (S311 in ).

[0242] In this case, when the electric field IEL is formed on the target substrate SUB, the dipole DP having the first polarity and the second polarity may receive power until the ink I is supplied from the nozzle NZ to the target substrate SUB. The dipole DP may be oriented due to the power, and, for example, the orientation of the dipole DP may be toward the electric field IEL. The dipole DP may receive the force caused by the electric field IEL until the dipole DP is ejected from the nozzle NZ and reaches the target substrate SUB.

[0243] Next, if Fig.28 As shown in , an electric field E is formed on the target substrate SUB, and a dipole DP is arranged due to the electric field E. The dipole DP may be arranged by dielectrophoresis. In particular, an electric signal is applied from the probe unit 550 to the first electrode 21 and the second electrode 22. The probe unit 550 may be connected to a predetermined pad (not shown) provided on the target substrate SUB, and an electric signal may be applied to the first electrode 21 and the second electrode 22 connected to the pad. In an exemplary embodiment, the electric signal may be an AC voltage, and the AC voltage may have a voltage of ± (10 to 50) V and a frequency of 10 kHz to 1 MHz. When the AC voltage is applied to the first electrode 21 and the second electrode 22, an electric field E is formed between the first electrode 21 and the second electrode 22, and the dielectrophoretic force caused by the electric field E is applied to the dipole DP. The dipole DP may be arranged on the first electrode 21 and the second electrode 22, while the orientation and position are changed due to the dielectrophoretic force.

[0244] Next, if Fig.29 As shown in FIG. 1 , the solvent SV of the ink I applied to the target substrate SUB is dried and removed ( Fig.25 (S312 in ).

[0245] The removal of the solvent SV may be performed by the first heat treatment unit 370 of the inkjet head device 300. As described above, the target substrate SUB to which the ink I ejected from the inkjet head unit 330 is applied may move in the direction opposite to the second direction D2 to be located below the first heat treatment unit 370.

[0246] The first heat treatment unit 370 can be used with 1-1 light H 11 Irradiate the target substrate SUB. As described above, 1-1 light H 11 Can include infrared light. When 1-1 light H 11 When light within the infrared band is included, heat may be generated due to the infrared light within the infrared band, and the solvent SV may be volatilized or evaporated.

[0247] Despite Fig.29 As not shown, but as described above, the first heat treatment unit 370 can also use 1-2 light H including ultraviolet light. 12 When the first heat treatment unit 370 irradiates light in the ultraviolet band, the dipoles DP disposed on the first electrode 21 and the second electrode 22 may be biased and aligned due to the light in the ultraviolet band irradiated by the first heat treatment unit 370. 11 and 1-2 light H 12 A detailed description of the method is given in the above reference Fig.12 Same as described.

[0248] Since the solvent SV is removed from the ink I ejected onto the target substrate SUB, the flow of the dipole DP may be prevented and the bonding force with the electrodes 21 and 22 may be increased. Therefore, the dipole DP may be aligned on the first and second electrodes 21 and 22.

[0249] Refer again Fig.25 , operation S320 of drying the ink applied to the inspection substrate and inspecting the number of dipoles (see Fig.25 ) may include operation S321 of drying the ink applied to the inspection substrate (see Fig.25 ) and an operation S322 of measuring the number of dipoles provided on the inspection substrate ISUB (see Fig.25 ).

[0250] In particular, refer to Fig.30 and Fig.31 , in operation S320 of drying the ink applied to the inspection substrate and inspecting the number of dipoles, the inspection may be performed using the particle count inspection unit 600 .

[0251] The ink applied to the inspection substrate ISUB may be dried using a second heat treatment unit 630 disposed above the inspection substrate ISUB. Fig.25 (S321 in).

[0252] In particular, the second heat treatment unit 630 disposed above the inspection substrate ISUB may irradiate the inspection substrate ISUB with the second light H2. The second light H2 may include light in the infrared band. The solvent SV of the ink I applied to the inspection substrate ISUB may volatilize or evaporate due to the second light H2 radiated by the second heat treatment unit 630. The solvent SV of the ink I applied to the inspection substrate ISUB is dried so that the dipole DP contained in the ink I may be disposed on the inspection substrate ISUB. The dipole DP disposed on the inspection substrate ISUB may be randomly disposed regardless of the orientation.

[0253] Next, the number of dipoles DP per unit area may be measured using a second sensing unit 640 disposed under the inspection substrate ISUB. Fig.25 (S322 in ).

[0254] In particular, as described above, the second sensing unit 640 may include a camera. The second sensing unit 640 including a camera may generate a signal such as a pulse signal by photographing the bottom surface of the inspection substrate ISUB in the region where the dipole DP is disposed. Fig.31 The image data IMG shown in FIG. The image data IMG generated by the second sensing unit 640 may include a pattern covered by the dipole DP disposed on the upper surface of the inspection substrate ISUB.

[0255] The particle count check unit 600 may calculate a pattern corresponding to the dipole DP using the image data IMG generated by the second sensing unit 640 to measure an area S2 of the pattern covered by the dipole DP, and may compare the measured area S2 of the pattern with the area S1 of the ink I received from the first sensing unit 150. The particle count check unit 600 may measure the number of dipoles DP by comparing the area S1 of the ink I with the area S2 of the pattern covered by the dipole DP based on a result of the comparison.

[0256] The particle count checking unit 600 may compare the measured number of dipoles DP with a reference setting value. According to the result of comparing the number of dipoles with the reference setting value, the number of dipoles DP supplied to the inkjet head device 300 may be adjusted by adjusting the ink supply device 400 to be described below.

[0257] Next, the target substrate ( Fig.16 S400 in the ).

[0258] Reference Fig.32, the target substrate SUB on which the printing process is completed may be set on the stage unit 500 and discharged along the first track RR1 and the second track RR2. The target substrate SUB may be discharged to the outside from the inkjet printing apparatus 1000 by a separate substrate conveying device. When the target substrate SUB is discharged, the inspection stage unit 200 may provide a new inspection substrate ISUB and re-perform the inspection process thereon.

[0259] In the printing method using the inkjet printing apparatus 1000 according to the embodiment, when the printing process is performed on the target substrate SUB, the alignment degree, the discharge amount, and the number of dipoles DP included in the unit ink I of the inkjet head unit 330 can be measured using the inspection substrate ISUB placed on the inspection table unit 200, and the inspection can be performed based on the measured data. The printing process for the target substrate SUB and the inspection process for the inspection substrate ISUB can be performed simultaneously in real time using one inkjet printing apparatus 1000. The inspection result of the inspection substrate ISUB can be fed back to the inkjet head device 300 in real time, so that the state of the inkjet head device 300 can be adjusted and compensated. Therefore, even after the process is repeated several times, the inkjet printing apparatus 1000 can reduce the printing process time by maintaining the quality of the target substrate SUB including the finally manufactured dipole DP and shortening the inspection time.

[0260] Fig.33 is a schematic diagram of a light emitting element according to an embodiment.

[0261] Reference Fig.33 The light emitting element 30 may include a semiconductor crystal doped with impurities of any conductivity type (eg, p-type or n-type). The semiconductor crystal may receive an electrical signal applied from an external power source and emit the electrical signal as light within a specific wavelength band.

[0262] The light emitting element 30 may be a light emitting diode, and in particular, the light emitting element 30 may be an inorganic light emitting diode having a size in micrometers or nanometers and made of an inorganic material. In the case where the light emitting element 30 is an inorganic light emitting diode, when an electric field is formed between two electrodes facing each other in a specific direction, the inorganic light emitting diode may be aligned between two electrodes having polarity formed therein. The light emitting element 30 may emit light in a specific wavelength band by receiving a predetermined electrical signal from the electrode.

[0263] Reference Fig.33, the light emitting element 30 according to the embodiment may include a plurality of conductive semiconductors 31 and 32, an active layer 33, an electrode material layer 37, and an insulating film 38, and the height h of the light emitting element 30 is the sum of the heights of the conductive semiconductors 31 and 32, the active layer 33, and the electrode material layer 37. The plurality of conductive semiconductors 31 and 32 may transmit an electrical signal transmitted to the light emitting element 30 to the active layer 33, and the active layer 33 may emit light in a specific wavelength band.

[0264] In particular, the light emitting element 30 may include a first conductive semiconductor 31, a second conductive semiconductor 32, an active layer 33 disposed between the first conductive semiconductor 31 and the second conductive semiconductor 32, an electrode material layer 37 disposed on the second conductive semiconductor 32, and an insulating film 38 disposed around the outer surface thereof. Fig.33 , the light emitting element 30 is shown as having a structure in which the first conductive semiconductor 31, the active layer 33, the second conductive semiconductor 32, and the electrode material layer 37 are sequentially formed in the longitudinal direction, but the present invention is not limited thereto. The electrode material layer 37 may be omitted, and in some embodiments, the electrode material layer 37 may be provided on at least one of the two side surfaces of the first conductive semiconductor 31 and the second conductive semiconductor 32. When the light emitting element 30 further includes other structures, the following description of the light emitting element 30 may be equally applicable.

[0265] The first conductive semiconductor 31 may be an n-type semiconductor layer. For example, when the light emitting element 30 emits light in the blue band, the first conductive semiconductor 31 may be a semiconductor layer having a chemical formula of In x Al y Ga 1-x-y N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) semiconductor material. For example, the first conductive semiconductor 31 may be at least one of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN doped with n-type impurities. The first conductive semiconductor 31 may be doped with a first conductive dopant, and the first conductive dopant may be, for example, Si, Ge, Se, Sn, etc. The length of the first conductive semiconductor 31 may be in the range of 1.5 μm to 5 μm, but the present invention is not limited thereto.

[0266] The second conductive semiconductor 32 may be a p-type semiconductor layer. For example, when the light emitting element 30 emits light in the blue band, the second conductive semiconductor 32 may be a semiconductor layer having a chemical formula of In x Al y Ga 1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1) semiconductor material. For example, the second conductive semiconductor 32 may be at least one of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN doped with p-type impurities. The second conductive semiconductor 32 may be doped with a second conductive dopant, and the second conductive dopant may be, for example, Mg, Zn, Ca, Ba, etc. The length of the second conductive semiconductor 32 may be in the range of 0.08 μm to 0.25 μm, but the present invention is not limited thereto.

[0267] Meanwhile, although the first conductive semiconductor 31 and the second conductive semiconductor 32 are shown in the drawings as being constructed as one layer, the present invention is not limited thereto. In some cases, the first conductive semiconductor 31 and the second conductive semiconductor 32 may include a greater number of layers depending on the material of the active layer 33 to be described below.

[0268] The active layer 33 may be disposed between the first conductive semiconductor 31 and the second conductive semiconductor 32, and may include a material having a single quantum well structure or a multi-quantum well structure. When the active layer 33 includes a material having a multi-quantum well structure, the active layer 33 may have a structure in which a plurality of quantum layers and a plurality of well layers are alternately stacked. The active layer 33 may emit light by combining electron and hole pairs according to an electrical signal applied through the first conductive semiconductor 31 and the second conductive semiconductor 32. For example, when the active layer 33 emits light in a blue band, the active layer 33 may include materials such as GaN, AlGaN, AlInGaN, and the like. Specifically, when the active layer 33 has a multi-quantum well structure (i.e., a structure in which quantum layers and well layers are alternately stacked), the quantum layers may include materials such as AlGaN or AlInGaN, and the well layers may include materials such as GaN, AlGaN, and the like.

[0269] However, the present invention is not limited thereto, and the active layer 33 may have a structure in which a semiconductor material having a high energy band gap and a semiconductor material having a low energy band gap are alternately stacked, and may include different III-V semiconductor materials according to the wavelength band of the emitted light. The light emitted from the active layer 33 is not limited to light in the blue wavelength band, and in some cases, light in the red wavelength band or the green wavelength band may be emitted. The length of the active layer 33 may be in the range of 0.05 μm to 0.25 μm, but the present invention is not limited thereto.

[0270] Meanwhile, light emitted from active layer 33 may be emitted to side surfaces of light emitting element 30 and side surfaces (or bottom surfaces) located at both ends in the longitudinal direction of light emitting element 30. The direction of light emitted from active layer 33 is not limited to one direction.

[0271] The electrode material layer 37 may be an ohmic contact electrode. However, the present invention is not limited thereto, and the electrode material layer 37 may be a Schottky contact electrode. The electrode material layer 37 may include a conductive metal. For example, the electrode material layer 37 may include at least one of aluminum (Al), titanium (Ti), indium (In), gold (Au), silver (Ag), indium tin oxide (ITO), indium zinc oxide (IZO), and indium tin zinc oxide (ITZO). The electrode material layer 37 may include the same material or different materials, but the present invention is not limited thereto.

[0272] The insulating film 38 may be in contact with the first conductive semiconductor 31, the second conductive semiconductor 32, the active layer 33, and the electrode material layer 37, and formed to surround the outer surface thereof. The insulating film 38 may play a role in protecting the member. For example, the insulating film 38 may be formed to surround the side surface of the member, and both ends of the light emitting element 30 in the longitudinal direction may be formed to be exposed. However, the present invention is not limited thereto.

[0273] The insulating film 38 may include a material having an insulating property (eg, silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum nitride (AlN), aluminum oxide (Al 2 O 3 ) etc.). Therefore, the active layer 33 can prevent electrical disconnection that may occur when the light emitting element 30 is in direct contact with an electrode through which an electrical signal is transmitted. In addition, since the insulating film 38 protects the outer surface of the light emitting element 30 including the active layer 33, a decrease in luminous efficiency can be prevented.

[0274] Although the insulating film 38 is shown in the drawings to be formed to extend in the longitudinal direction of the light emitting element 30 to cover from the first conductive semiconductor 31 to the electrode material layer 37, the present invention is not limited thereto. The insulating film 38 may cover only the first conductive semiconductor 31, the active layer 33, and the second conductive semiconductor 32, or cover a portion of the outer surface of the electrode material layer 37 so that a portion of the outer surface of the electrode material layer 37 may be exposed. The thickness of the insulating film 38 may be in the range of 0.5 μm to 1.5 μm, but the present invention is not limited thereto.

[0275] Fig.34 is a plan view of a display device manufactured by the method according to an embodiment. Fig.35 It is along Fig.34 A partial cross-sectional view of the display device taken along line II'.

[0276] Reference Fig.34, the display device 1 may include a plurality of pixels PX. Each of the pixels PX may include one or more light emitting elements 30 that emit light in a specific wavelength band to display a specific color.

[0277] Each of the plurality of pixels PX may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. The first sub-pixel SPX1 may emit light of a first color, the second sub-pixel SPX2 may emit light of a second color, and the third sub-pixel SPX3 may emit light of a third color. The first color may be red, the second color may be green, and the third color may be blue, but the present invention is not limited thereto, and each of the sub-pixels SPXn may emit light of the same color. In addition, although in Fig.34 4 shows that each of the pixels PX includes three sub-pixels, but the present invention is not limited thereto, and each of the pixels PX may include a larger number of sub-pixels.

[0278] Each of the sub-pixels SPXn of the display device 1 may include an area defined as a light-emitting area and a non-light-emitting area. The light-emitting area is defined as an area in which the light-emitting element 30 included in the display device 1 is disposed and emits light within a specific wavelength band. The non-light-emitting area is an area other than the light-emitting area, and may be defined as an area in which the light-emitting element 30 is not disposed and does not emit light.

[0279] The sub-pixel SPXn of the display device 1 may include a plurality of partitions 41 , 42 , and 43 , a plurality of electrodes 21 and 22 , and a light emitting element 30 .

[0280] The plurality of electrodes 21 and 22 may be electrically connected to the light emitting element 30, and may receive a predetermined voltage so that the light emitting element 30 emits light. In addition, at least a portion of each of the electrodes 21 and 22 may be used to form an electric field in the sub-pixel SPXn to align the light emitting element 30. However, the present invention is not limited thereto, and in some cases, the electric field may be formed by a separate alignment signal applying device.

[0281] The plurality of electrodes 21 and 22 may include a first electrode 21 and a second electrode 22. The first electrode 21 and the second electrode 22 may be disposed spaced apart from each other. In an exemplary embodiment, the first electrode 21 may be a separate pixel electrode for each sub-pixel SPXn, and the second electrode 22 may be a common electrode commonly connected along each sub-pixel SPXn. One of the first electrode 21 and the second electrode 22 may be an anode electrode of the light emitting element 30, and the other may be a cathode electrode of the light emitting element 30. However, the present invention is not limited thereto, and the opposite is also possible.

[0282] The first electrode 21 and the second electrode 22 may respectively include electrode trunk portions 21S and 22S disposed to extend in the fourth direction D4 and electrode branch portions 21B and 22B branched and extended from the electrode trunk portions 21S and 22S in a fifth direction D5 that is a direction crossing the fourth direction D4.

[0283] In particular, the first electrode 21 may include a first electrode stem portion 21S extending in the fourth direction D4 and at least one first electrode branch portion 21B branched from the first electrode stem portion 21S to extend in the fifth direction D5.

[0284] Both ends of the first electrode trunk portion 21S of any one pixel are separated and terminated from each other between the respective sub-pixels SPXn, and can be placed on substantially the same straight line with the first electrode trunk portion 21S of the adjacent sub-pixel belonging to the same row (e.g., adjacent in the fourth direction D4). Therefore, the first electrode trunk portion 21S disposed on each sub-pixel SPXn can apply different electrical signals to each first electrode branch portion 21B, and the first electrode branch portions 21B can be driven individually.

[0285] The second electrode 22 may include a second electrode trunk portion 22S and a second electrode branch portion 22B, the second electrode trunk portion 22S extending in the fourth direction D4 and arranged to be separated from the first electrode trunk portion 21S to face the first electrode trunk portion 21S, and the second electrode branch portion 22B branching from the second electrode trunk portion 22S and arranged to extend in the fifth direction D5. However, the other end of the second electrode trunk portion 22S may extend to a plurality of sub-pixels SPXn adjacent thereto in the fourth direction D4. Therefore, both ends of the second electrode trunk portion 22S of any one pixel may be connected to the second electrode trunk portion 22S of the adjacent pixel between the respective pixels PX.

[0286] The plurality of spacers may include a third spacer 43 disposed at a boundary between the respective sub-pixels SPXn, and first and second spacers 41 and 42 disposed under the electrodes 21 and 22 , respectively.

[0287] The third spacer 43 may be disposed at a boundary between the respective sub-pixels SPXn. The plurality of sub-pixels SPXn may be divided based on the third spacer 43.

[0288] A plurality of light emitting elements 30 may be disposed between the first electrode branch portion 21B and the second electrode branch portion 22B. At least some of the plurality of light emitting elements 30 may have one end electrically connected to the first electrode branch portion 21B and the other end electrically connected to the second electrode branch portion 22B.

[0289] The plurality of light emitting elements 30 may be spaced apart from each other in the fifth direction D5 and arranged substantially parallel to each other. The interval at which the light emitting elements 30 are spaced apart from each other is not particularly limited.

[0290] The contact electrode 26 may be disposed on each of the first electrode branch portion 21B and the second electrode branch portion 22B. The contact electrode 26 may be substantially disposed on the first insulating layer 51, and at least a portion of the contact electrode 26 may be in contact with or electrically connected to the first electrode branch portion 21B and the second electrode branch portion 22B.

[0291] Reference Fig.34 and Fig.35 , the display device 1 may further include a via layer, and the plurality of electrodes 21 and 22, the separators 41, 42 and 43, and the light emitting element 30 described above may be disposed on the via layer. A circuit element layer (not shown) may be further disposed below the via layer. The via layer may include an organic insulating material to perform a surface planarization function.

[0292] A plurality of spacers 41, 42, and 43 may be disposed spaced apart from each other in each sub-pixel SPXn. The plurality of spacers 41, 42, and 43 may include first and second spacers 41 and 42 disposed adjacent to a central portion of the sub-pixel SPXn and a third spacer 43 disposed at a boundary between the sub-pixels SPXn.

[0293] The first separator 41 and the second separator 42 are spaced apart from each other and disposed to face each other. The first electrode 21 may be disposed on the first separator 41, and the second electrode 22 may be disposed on the second separator 42. Fig.34 and Fig.35 In the embodiment of the present invention, it can be understood that the first electrode branch portion 21B is disposed on the first separator 41 , and the second electrode branch portion 22B is disposed on the second separator 42 .

[0294] The plurality of spacers 41 , 42 , and 43 may include polyimide (PI).

[0295] The plurality of separators 41, 42, and 43 may have a structure in which at least a portion protrudes from the via layer. The separators 41, 42, and 43 may protrude upward from the flat surface on which the light emitting element 30 is disposed, and at least a portion of the protruding portion may have an inclination. As shown in the drawings, the first separator 41 and the second separator 42 may protrude at the same height, and the third separator 43 may have a shape that protrudes to a higher position.

[0296] The first electrode 21 and the second electrode 22 may be disposed on the first separator 41 and the second separator 42, respectively. The first electrode 21 and the second electrode 22 may transmit an electrical signal to the light emitting element 30, and at the same time may reflect light emitted from the light emitting element 30. In an exemplary embodiment, the first electrode 21 and the second electrode 22 may include a conductive material having a high reflectivity. For example, the first electrode 21 and the second electrode 22 may be an alloy including aluminum (Al), nickel (Ni), lanthanum (La), etc. However, the present invention is not limited thereto.

[0297] The first insulating layer 51 is disposed to partially cover the first electrode 21 and the second electrode 22. A portion of each of the first electrode 21 and the second electrode 22 may be exposed through the first insulating layer 51. The first insulating layer 51 may be disposed to partially cover a region in which the first electrode 21 and the second electrode 22 are spaced apart from each other and a portion of opposite sides of the first electrode 21 and the second electrode 22.

[0298] The first insulating layer 51 can protect the first electrode 21 and the second electrode 22 and can insulate the first electrode 21 and the second electrode 22 from each other. In addition, the light emitting element 30 disposed on the first insulating layer 51 can be prevented from directly contacting other members and being damaged.

[0299] The light emitting element 30 may be disposed on the first insulating layer 51. At least one light emitting element 30 may be disposed on the first insulating layer 51 between the first electrode 21 and the second electrode 22.

[0300] The second insulating layer 52 may be partially disposed on the light emitting element 30. The second insulating layer 52 may protect the light emitting element 30 and may perform a function of fixing the light emitting element 30 in the manufacturing process of the display device 1. The second insulating layer 52 may be disposed to surround the outer surface of the light emitting element 30. That is, a portion of the material of the second insulating layer 52 may be disposed between the lower surface of the light emitting element 30 and the first insulating layer 51.

[0301] The contact electrode 26 is disposed on each of the electrodes 21 and 22 and the second insulating layer 52. The contact electrode 26 includes a first contact electrode 26a disposed on the first electrode 21 and a second contact electrode 26b disposed on the second electrode 22. The first contact electrode 26a and the second contact electrode 26b are disposed on the second insulating layer 52 to be separated from each other. Therefore, the second insulating layer 52 can insulate the first contact electrode 26a and the second contact electrode 26b from each other.

[0302] The first contact electrode 26a may contact at least one end of the first electrode 21 and the light emitting element 30 exposed by patterning the first insulating layer 51. The second contact electrode 26b may contact at least the other end of the second electrode 22 and the light emitting element 30 exposed by patterning the first insulating layer 51.

[0303] The contact electrode 26 may include a conductive material. For example, the contact electrode 26 may include ITO, IZO, ITZO, aluminum (Al), etc. However, the present invention is not limited thereto.

[0304] A passivation layer 55 may be formed on the second insulating layer 52 and upper portions of the contact electrode 26 to protect members disposed on the via layer from an external environment.

[0305] Each of the first insulating layer 51, the second insulating layer 52, and the passivation layer 55 described above may include an inorganic insulating material or an organic insulating material. In an exemplary embodiment, the first insulating layer 51 and the passivation layer 55 may include a silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), etc.

[0306] Although the embodiments of the present invention have been described above with reference to the accompanying drawings, it will be appreciated by those skilled in the art that various modifications may be made without departing from the scope of the present invention and without changing the essential features. Therefore, the above embodiments should be considered only as illustrative and not for limiting purposes.

Claims

1. An inkjet printing device, comprising: an inspection table unit, on which an inspection substrate is placed; an inkjet head unit including at least one inkjet head configured to eject ink onto the inspection stage unit, the ink containing a solvent and dipoles dispersed in the solvent; as well as a particle count inspection unit, arranged to be spaced apart from the inkjet head unit in one direction, Wherein, the particle counting inspection unit comprises: a first heat treatment unit, which is arranged above the inspection table unit; and A first sensing unit is disposed under the inspection stage unit and is configured to measure the number of dipoles ejected onto the inspection substrate. 2 . The inkjet printing apparatus according to claim 1 , further comprising a second sensing unit configured to measure a position of the first ink ejected from the inkjet head and applied onto the inspection substrate.

3. The inkjet printing apparatus according to claim 2, wherein: The first sensing unit measures the number of dipoles disposed in a region corresponding to the position of the first ink.

4. The inkjet printing apparatus according to claim 3, wherein: The first sensing unit measures the number of dipoles remaining on the inspection substrate after the solvent is removed by the first heat treatment unit.

5. The inkjet printing apparatus according to claim 2, wherein: The particle count inspection unit further includes a light irradiation unit that is disposed above the inspection stage unit and emits light toward the inspection stage unit, and The first sensing unit includes a camera unit for photographing a lower surface of the inspection substrate.

6. The inkjet printing apparatus according to claim 5, wherein: The camera unit generates image data by photographing an area corresponding to the position of the first ink.

7. The inkjet printing apparatus according to claim 6, wherein: The second sensing unit measures an area of ​​the first ink, and the first sensing unit calculates a dipole pattern using the image data and measures an area of ​​the dipole pattern.

8. The inkjet printing apparatus according to claim 7, wherein: The particle count inspection unit measures the number of dipoles by comparing the area of ​​the first ink with the area of ​​the dipole pattern.

9. The inkjet printing apparatus according to claim 8, wherein: The particle count check unit compares the measured number of dipoles with a reference setpoint value.

10. The inkjet printing apparatus according to claim 9, further comprising an ink supply device for supplying the ink to the inkjet head unit, in, The particle count checking unit controls the ink supply device according to a result of comparison of the measured number of dipoles with the reference set value. 11 . The inkjet printing apparatus according to claim 1 , further comprising a stage moving unit configured to move the inspection stage unit in one direction.

12. The inkjet printing apparatus according to claim 1, wherein: The first heat treatment unit radiates light in the infrared band.

13. An inkjet printing device, comprising: an inspection table unit, on which an inspection substrate is placed; a stage unit provided to be spaced apart from the inspection stage unit and on which a target substrate is placed; an inkjet head unit disposed above the inspection stage unit and the stage unit and including a plurality of inkjet heads configured to eject ink containing a solvent and dipoles dispersed in the solvent; a first heat treatment unit disposed above the stage unit and configured to radiate first light; a first sensing unit configured to measure a position of the ink applied to the inspection substrate; as well as a particle count inspection unit configured to inspect the number of dipoles contained in the ink applied to the inspection substrate, Wherein, the particle count inspection unit includes: a second heat treatment unit, which is disposed above the inspection table unit and is configured to radiate a second light; and A second sensing unit is disposed above the inspection stage unit and is configured to measure the number of dipoles contained in the ink applied onto the inspection substrate.

14. The inkjet printing apparatus according to claim 13, wherein: The second sensing unit measures the number of dipoles remaining on the inspection substrate after the solvent is removed by the second heat treatment unit.

15. The inkjet printing apparatus according to claim 14, further comprising an ink supply device configured to supply the ink to the inkjet head unit, in, The particle count checking unit controls the ink supply device according to a result of comparing the measured number of dipoles with a reference set value.

16. A method for inspecting an inkjet head, the method comprising the following steps: jetting ink on an inspection substrate, the ink comprising a solvent and a plurality of dipoles dispersed in the solvent; inspecting a discharge amount of the ink applied to the inspection substrate; removing the solvent contained in the ink applied onto the inspection substrate; as well as The number of dipoles remaining on the inspection substrate is measured, and the measured number of dipoles is compared with a reference set value to adjust the number of dipoles supplied to the inkjet head.

17. The method according to claim 16, wherein: The step of inspecting the discharge amount of the ink includes measuring a diameter and an area of ​​the ink applied to the inspection substrate.

18. The method according to claim 17, wherein: The step of measuring the number of dipoles includes counting dipole patterns by photographing the inspection substrate from below the inspection substrate and measuring the area of ​​the dipole pattern.

19. The method according to claim 18, wherein: The step of measuring the number of dipoles includes measuring the number of dipoles by comparing the measured area of ​​the ink with the measured area of ​​the dipole pattern.

20. The method according to claim 16, wherein: The plurality of dipoles remaining on the inspection substrate are arranged regardless of orientation.

Images