A thermal energy assembly including a heat pump assembly and a chiller assembly and a method thereof

Abstract

A heat pump assembly (100) is arranged to be connected to a thermal energy loop (300), the thermal energy loop comprising a heat pipe (302) configured to allow a thermal fluid at a first temperature to flow therethrough and a cold pipe (304) configured to allow a thermal fluid at a second temperature to flow therethrough, the second temperature being lower than the first temperature; and a chiller assembly (200) is arranged to be connected to a thermal energy loop (300), the thermal energy loop comprising a heat pipe (302) configured to allow a thermal fluid at a first temperature to flow therethrough and a cold pipe (304) configured to allow a thermal fluid at a second temperature to flow therethrough.

Description

Technical Field

[0001] The invention relates to distributing heating and / or cooling via a thermal energy circuit including a thermal fluid from a thermal power plant to a thermal device. More specifically, the invention relates to a heat pump assembly, a chiller assembly and a thermal energy assembly. The invention also relates to a method for controlling a heat pump assembly, a chiller assembly and a thermal energy assembly. Background Art

[0002] Nowadays, it is common practice in many parts of the world to provide heating and hot water to houses and buildings via an energy grid. An example of such an energy grid is a district heating grid, which includes a system of conduits and valves for distributing hot water to houses and buildings, so that the houses can be heated when needed via a thermal device (i.e. a heat exchanger) connected to the district heating grid. Alternatively, according to another example, instead of using hot water to provide space heating, gas can be provided to the houses and buildings via the system. By using gas, typically fossil fuel gas, the houses can be heated by using a thermal device in the form of a gas burner. In addition to space heating, the hot water or gas can be used to prepare hot tap water.

[0003] Similar systems can be used to cool houses and buildings. However, the general principle of these systems is the other way around. Instead of providing heat, for example by providing hot water, the heat is collected inside the house and transported away from the house. However, district cooling networks (that is, a network of pipes and valves connecting several properties for cooling purposes) using water as a heat carrier are still rare. Instead, it is common practice to use electrical energy to run the air conditioning system, which is disadvantageous at least from an environmental point of view.

[0004] Even if it is known how to add thermal devices, such as heat exchangers or heat pumps, to the distribution system after a new building is built and controlled, these devices can be further improved. For example, the heating and cooling needs of a building are dynamic, which can cause problems if the thermal devices cannot effectively provide the required heating or cooling. In the case of heat pumps / chillers, this means that more electricity is required to meet the heating / cooling demand. This is certainly not desirable, as it not only causes unnecessary environmental impacts, but is also more costly for the end customer.

[0005] Prior art systems for providing heating via a heating / cooling grid lack the dynamic adaptability to allow the thermal device to operate efficiently over a wide range of heating / cooling loads, an area that manufacturers of such systems continually strive to improve. Summary of the invention

[0006] In view of the above, it is an object of the present invention to provide a solution to at least some of the above problems and to improve the prior art heating / cooling systems.

[0007] According to a first aspect, a heat pump assembly is provided, which is arranged to be connected to a thermal energy circuit. The thermal energy circuit includes a heat pipe configured to allow a hot fluid of a first temperature to flow through it and a cold pipe configured to allow a hot fluid of a second temperature to flow through it, the second temperature being lower than the first temperature. The heat pump assembly includes a hot heating circuit, which includes a hot heating circuit inlet that can be connected to the heat pipe and a hot heating circuit outlet that can be connected to the cold pipe. The hot heating circuit is configured to transfer the hot fluid from the hot heating circuit inlet to the hot heating circuit outlet, and the hot heating circuit further includes a hot heating circuit flow controller, which is configured to control the flow of the hot fluid from the hot heating circuit inlet to the hot circuit outlet. The heat pump assembly further includes a heat pump and a heat pump circuit, which includes a heat pump circuit inlet connected to the hot heating circuit at a first connection point, a heat pump circuit outlet connected to the hot heating circuit at a second connection point, and a heat pump control pump, which is configured to control the flow of hot fluid from the heat pump circuit inlet through the heat pump on its heat extraction side to the heat pump circuit outlet. The heat pump assembly further includes a heat pump assembly controller configured to control the heat pump assembly based on a parameter associated with an efficiency of the heat pump assembly, wherein the heat pump circuit and the thermal heating circuit partially overlap, wherein the overlap is between the first connection point and the second connection point.

[0008] The heat pump circuit with heat pump control pump provides adaptability for providing appropriate hot fluid flow to the heat pump.The hot fluid in the heat pump circuit can be circulated with a flow corresponding to the hot heating circuit, or with a slower flow or with a higher flow.The temperature of the hot fluid can also be controlled in this way, because the heat pump cools the hot fluid in each channel through its heat extraction side, and if the heat pump circuit recirculates a part of the cooled hot fluid from the heat pump circuit outlet to the heat pump circuit inlet, this will reduce the temperature of the hot fluid to be applied to the heat pump.Naturally, the opposite situation can be achieved by reducing the flow in the heat pump circuit.By also considering the efficiency of the heat pump assembly running under the control of the heat pump assembly, it can be more appropriately adapted to the change of the heat demand applied to the heat pump assembly.For example, if the heat load placed on the heat pump is low for a period of time, the flow of the hot fluid can be reduced accordingly.

[0009] The parameter associated with the efficiency of the heat pump assembly may include a signal indicating the electrical power consumption of the heat pump assembly, wherein the heat pump assembly controller is configured to control the heat pump control pump based on the parameter. The electrical power consumption provides an accurate measure of how the heat pump assembly performs. In particular, in an iterative process, the most favorable thermal fluid flow rate can be found by monitoring how changes in the thermal fluid flow rate of the heat pump control pump affect the electrical power consumption.

[0010] This parameter associated with the efficiency of the heat pump assembly may also include a signal indicative of the electrical power consumption of the heat pump assembly, wherein the heat pump assembly controller is configured to control the heat circuit flow controller based on this parameter. Thus an even further improved adaptability of the heat pump assembly to various heat loads may be achieved.

[0011] The parameters associated with the efficiency of the heat pump assembly may further include the electrical power consumption of the heat pump and the heat pump control pump, thereby allowing the heat pump circuit as a whole to be adapted to achieve improved efficiency of the heat pump. For example, a certain flow increase may achieve a reduction in the electrical power consumption of the heat pump, but the increase in the electrical power consumption of the heat pump control pump is higher than the reduction in the heat pump. The heat pump assembly controller may therefore take this into account and therefore avoid such a situation, whereby the total electrical power consumption may be reduced and the efficiency of the heat pump assembly may be improved for a given heat load.

[0012] In a second aspect, a chiller assembly is provided, which is arranged to be connected to a thermal energy circuit. The thermal energy circuit includes a heat pipe configured to allow a hot fluid at a first temperature to flow through it and a cold pipe configured to allow a hot fluid at a second temperature to flow through it, the second temperature being lower than the first temperature. The chiller assembly includes a hot cooling circuit, the hot cooling circuit includes a hot cooling circuit inlet connectable to the cold pipe and a hot cooling circuit outlet connectable to the hot pipe, the hot cooling circuit is configured to transfer the hot fluid from the hot cooling circuit inlet to the hot cooling circuit outlet, the hot cooling circuit further includes a hot cooling circuit flow controller, the hot cooling circuit flow controller is configured to control the flow of the hot fluid from the hot cooling circuit inlet to the hot cooling circuit outlet. The chiller assembly further includes a chiller and a chiller circuit, the chiller circuit includes a chiller circuit inlet connected to the hot cooling circuit at a first connection point, a chiller circuit outlet connected to the hot cooling circuit at a second connection point, and a chiller control pump, the chiller control pump is configured to control the flow of the hot fluid from the chiller circuit inlet through the chiller on its heat generating side to the chiller circuit outlet. The chiller assembly includes a chiller assembly controller configured to control the chiller assembly based on a parameter associated with an efficiency of the chiller assembly.The chiller circuit and the hot cooling circuit partially overlap, wherein the overlap is between the first connection point and the second connection point.

[0013] The chiller loop with chiller control pump provides adaptability for providing appropriate hot fluid flow to the chiller.The hot fluid in the chiller loop can be circulated with a flow corresponding to the hot cooling loop, or with a slower flow or with a higher flow.The temperature of the hot fluid can also be controlled in this way, because the chiller heats the hot fluid in each channel passing through its heat extraction side, and if the chiller loop recirculates a part of the heated hot fluid from the chiller loop outlet to the chiller loop inlet, this will cause the temperature of the hot fluid to be applied to the chiller to rise.Naturally, the opposite situation can be achieved by reducing the flow in the chiller loop.By also considering the efficiency of the chiller assembly running under the control of the chiller assembly, it can be more appropriately adapted to the change of the heat demand applied to the chiller assembly.For example, if the heat load built into the chiller for a period of time is low, the flow of the hot fluid can be reduced accordingly.

[0014] The parameter associated with the efficiency of the chiller assembly may include a signal indicative of the electrical power consumption of the chiller assembly, wherein the chiller assembly controller is configured to control the chiller control pump based on the parameter. The electrical power consumption provides an accurate measure of how well the chiller assembly is performing. In particular, during an iterative process, the most favorable thermal fluid flow rate may be found by monitoring how changes in the thermal fluid flow rate of the chiller control pump affect the electrical power consumption.

[0015] The parameter associated with the efficiency of the chiller assembly may include a signal indicative of the electrical power consumption of the chiller assembly, wherein the chiller assembly controller is configured to control the thermal cooling circuit flow controller based on the parameter. Thus, an even further improved adaptability of the heat pump assembly to various heat loads may be achieved.

[0016] The parameters associated with the efficiency of the chiller assembly may further include the electrical power consumption of the chiller and the chiller control pump, thereby allowing the chiller circuit as a whole to be adapted to achieve its improved efficiency. For example, a certain flow increase may achieve a reduction in the electrical power consumption of the chiller, but the increase in the electrical power consumption of the chiller control pump is higher than the reduction in the chiller. The chiller assembly controller may therefore take this into account and thus avoid such a situation, whereby the total electrical power consumption may be reduced and the efficiency of the chiller assembly may be improved for a given heat load.

[0017] A third aspect provides a thermal energy assembly. The thermal energy assembly comprises at least one heat pump assembly according to the first aspect and at least one chiller assembly according to the second aspect. Thus, a thermal energy assembly is provided, wherein each heat pump assembly and / or chiller assembly can be more accurately controlled in response to dynamic and changing loads. Therefore, the thermal energy assembly as a whole becomes more energy-efficient, because each heat pump assembly and / or chiller assembly can control the flow of the thermal fluid by itself to reduce the electrical power consumption of its components, which generally improves the electrical power consumption of the entire thermal energy assembly, provides higher flexibility and facilitates the overall control of the thermal energy assembly.

[0018] In addition, the hot heating circuit outlet can be connected to the hot cooling circuit inlet, and the hot cooling circuit outlet can be connected to the hot heating circuit inlet. The hot fluid can thus circulate between the heat pump assembly and the chiller assembly, which takes advantage of the opposite heating / cooling effects that the respective assemblies have on the hot fluid. The thermal energy assembly can thus reduce the need to extract heated / cooled hot fluid from the thermal energy circuit, and even become self-sustaining in some cases.

[0019] The heat pump assembly controller, in conjunction with the chiller assembly controller, may be configured to control the thermal energy assembly based on parameters associated with the efficiency of the thermal energy assembly.

[0020] The parameter associated with the efficiency of the thermal energy assembly may include a signal indicative of electrical power consumption of the thermal energy assembly, the heat pump assembly controller together with the chiller assembly controller being configured to control the heat pump control pump and the chiller control pump based on the parameter.

[0021] A fourth aspect provides a method for controlling the heat pump assembly provided according to the first aspect. The method comprises:

[0022] Determine the parameters associated with the efficiency of the heat pump components,

[0023] By controlling the heat pump control pump to adjust the flow in the heat pump circuit,

[0024] determining parameters associated with the efficiency of the heat pump assembly after adjustment,

[0025] determining a change in the efficiency of the heat pump assembly based on the parameter determined before and after the adjustment, and

[0026] Based on the determined changes, the flow in the heat pump circuit is adjusted by controlling the heat pump control pump.The heat pump assembly is thus provided with a thermal fluid flow that achieves improved electrical efficiency and thus reduces electrical power consumption for a given heat load.

[0027] In a fifth aspect of the present disclosure, a method for controlling a cooling machine assembly according to the second aspect is provided. The method comprises:

[0028] Determine the parameters associated with the efficiency of the chiller components,

[0029] By controlling the chiller control pump to adjust the flow in the chiller circuit,

[0030] determining parameters associated with the efficiency of the chiller component after adjustment,

[0031] determining a change in the efficiency of the chiller component based on the parameter determined before and after the adjustment, and

[0032] Based on the determined changes, the flow in the chiller circuit is adjusted by controlling the chiller control pump.The chiller assembly is thus provided with a thermal fluid flow that achieves improved electrical efficiency and thus reduces electrical power consumption for a given thermal load.

[0033] A sixth aspect provides a method for controlling a thermal energy component according to the third aspect. The method comprises:

[0034] determining a parameter associated with the efficiency of the heat pump assembly and / or a parameter associated with the efficiency of the chiller assembly,

[0035] adjusting the flow in the heat pump circuit and / or the flow in the chiller circuit by controlling a heat pump control pump of the heat pump assembly and / or by controlling a chiller control pump of the chiller assembly,

[0036] determining a parameter associated with the adjusted efficiency of the heat pump assembly and / or a parameter associated with the adjusted efficiency of the chiller assembly,

[0037] determining a change in the efficiency of the heat pump assembly based on the parameter determined before and after the adjustment and / or determining a change in the efficiency of the chiller assembly based on the parameter determined before and after the adjustment, and

[0038] Based on the determined corresponding changes, the flow in the heat pump circuit and / or in the chiller circuit is adjusted by controlling the heat pump control pump of the heat pump assembly and / or the chiller control pump of the chiller assembly. Thus, an improved thermal energy assembly is provided, which can reduce electrical power consumption by controlling the heat pump assembly and / or the chiller assembly control pump, thereby achieving a more ideal thermal fluid flow rate for a given thermal load.

[0039] According to a seventh aspect, a non-transitory computer-readable storage medium is provided, on which instructions are stored, which, when executed on a device having processing capabilities, are used to implement the method for controlling a heat pump component according to the fourth aspect and / or the method for controlling a chiller component according to the fifth aspect and / or the method for controlling a thermal energy component according to the sixth aspect.

[0040] Generally, unless otherwise explicitly defined herein, all terms used in the claims should be interpreted according to their ordinary meaning in the art. Unless otherwise explicitly stated, all references to "one / an / the [element, device, component, means, step, etc.]" will be interpreted openly as referring to at least one example of the element, device, component, means, step, etc. Unless explicitly stated otherwise, the steps of any method disclosed herein do not have to be performed in the exact order disclosed. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and other objects, features and advantages of the present invention will be better understood through the following illustrative and non-limiting detailed description of preferred embodiments of the present invention with reference to the accompanying drawings, in which like reference numerals are used for similar elements, wherein:

[0042] Figure 1 The heat pump assembly is schematically shown.

[0043] Figure 2 The cooler assembly is schematically shown.

[0044] Figure 3 The thermal components are shown schematically.

[0045] Figure 4 A heat pump / chiller assembly controller is schematically shown.

[0046] Figure 5 A flow chart of a method for controlling a heat pump assembly is presented.

[0047] Figure 6 A flow chart of a method for controlling a chiller assembly is presented.

[0048] Figure 7 A flow chart of a method for controlling a thermal energy component is presented. DETAILED DESCRIPTION

[0049] The present invention will now be described more fully below with reference to the accompanying drawings, in which currently preferred embodiments of the present invention are shown. However, the present invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to achieve thoroughness and completeness, and to fully convey the scope of the present invention to the skilled person.

[0050] Figure 1Schematically illustrates a heat pump assembly 100 for distributing heat from a thermal energy loop 300 preferably to a building 600. The building 600 may be any type of building suitable for connection to the thermal energy loop 300, such as a residential building, a commercial or office building, an apartment building, a detached house or an industrial building. The thermal energy loop 300 may be a regional heating network or a regional cooling network known in the art. The regional heating network (or regional cooling network) may include a supply conduit for providing a heating (or cooling) medium from a thermal power plant (not shown) and a return conduit for transporting the cooled heating medium (or heated cooling medium) to the thermal power plant. The heating (or cooling) medium may be any fluid such as water suitable for heating (or cooling) in a thermal power plant and transported by a supply conduit and a return conduit. The heating (or cooling) medium will be referred to as a "thermal fluid" hereinafter. The thermal power plant may be a geothermal power plant, an electric drive plant for heating (or cooling) fluids, or may be driven by the combustion of fuels such as gas or oil. The thermal power plant is configured to heat (or cool) a heating (or cooling) medium and pump it through a thermal energy loop 300. For a district heating network, the supply conduit is considered to be a hot conduit 302 and the return conduit is considered to be a cold conduit 304. For a district cooling network, the supply conduit is considered to be a cold conduit 304 and the return conduit is considered to be a hot conduit 302.

[0051] As an alternative to a district heating network or a district cooling network, the thermal energy circuit 300 may be a combined district heating and cooling network as previously disclosed, for example, in WO 2017 / 076868 filed by E.ON Sverige AB. In this case, the hot conduit 302 and the cold conduit 304 should not be considered as a supply conduit and a return conduit, but rather as a hot conduit and a cold conduit 304 as disclosed in WO 2017 / 076868.

[0052] Thus, the thermal energy circuit 300 comprises a hot conduit 302 and a cold conduit 304 for distributing thermal energy to or between thermal devices 100 , 200 , 400 connected to a distribution grid.

[0053] The thermal devices 100, 200, 400 are configured to extract heat from and / or deposit heat in the thermal fluid of the thermal energy loop 300. Thus, each of the thermal devices 100, 200, 400 is configured to distribute heating and / or cooling within the building 600. Each of the thermal devices 100, 200, 400 may serve one building 600 or multiple buildings 600. A particular building may include one thermal device 100, 200, 400. A particular building may include more than one thermal device 100, 200, 400.

[0054] Each thermal device 100, 200, 400 may be implemented as a heat pump assembly 100 that extracts heat from the thermal fluid of the thermal energy loop 300, a cooling machine 200 (e.g., Figure 2 ), or a thermal energy component 400 (such as Figure 3 shown).

[0055] As further shown, each building may include several heat loads 602, 604, 606. For example, the heat pump assembly 100 may be configured to provide heat to produce comfort heating. This may be achieved in a variety of ways, such as through water-to-water heating, water-to-air heating, etc. In addition, the heat pump assembly 100 may be configured to provide hot tap water through a heat exchanger provided for this purpose. The chiller 200 may be configured to provide comfort cooling, provide cooling for office equipment such as a server room, and / or be used to chill water, just to name a few examples.

[0056] Each of these heat loads 602, 604, 606, 702, 704, 706 can change dynamically, which naturally affects the thermal device 100, 200, 400. For example, the heat output required to maintain a certain preferred indoor temperature of the building 600 can change rapidly as the weather changes. Regardless of the conditions under which the thermal device 100, 200, 400 needs to operate, it is desirable that the heat pump assembly 100 and the chiller 200, respectively, operate as efficiently as possible.

[0057] Figure 1 The heat pump assembly 100 shown includes a hot heating circuit 102. The hot heating circuit 102 is connected to the thermal energy circuit 300 via a hot heating circuit inlet 104 connected to a hot conduit 302 and a hot heating outlet 106 connected to a cold conduit 304. The hot heating circuit inlet 104 draws hot fluid from the hot conduit 302, while the hot heating circuit outlet 106 returns the hot fluid to the cold conduit 304.

[0058] In order to establish and control the flow of thermal fluid through the thermal heating loop 102, a thermal heating loop flow controller 108 is provided. The thermal heating loop flow controller 108 preferably includes a thermal heating loop circulation pump 108a, and may further include a first and optionally a second thermal heating loop control valve 108b, 108c. In response to a parameter indicating the efficiency of the heat pump assembly 100, preferably indicating its electrical power consumption, the thermal heating loop flow controller 108 can be controlled to achieve the flow of thermal fluid in the thermal heating loop 102. It can also be controlled to achieve the desired flow rate to achieve the desired temperature and / or temperature drop of the thermal fluid between the heating loop inlet 104 and the heating loop outlet 106 of the thermal heating loop 102. It can also be controlled to achieve the flow of thermal fluid into / out of the thermal energy loop 300 to maintain the desired temperature difference between the hot conduit 302 and the cold conduit 304.

[0059] Figure 1 The heat pump assembly 100 is further shown to include a heat pump 110. The heat pump is configured to extract heat from the thermal fluid distributed from the thermal energy loop 300 through the thermal heating loop 102. Heat pumps are well known to those skilled in the art and will not be described in further detail herein. Figure 1 Only one heat pump 110 is shown, but it should be understood that several heat pumps 110 may be connected to each thermal heating loop 102 .

[0060] The heat pump 110 may include a heat extraction side 110a and a heat release side 110b. The heat extraction side 110a is connected to a heat pump circuit 112. The heat pump circuit 112 is in turn connected to the thermal heating circuit 102 at a first connection point 118 via a heat pump circuit inlet 114 and at a second connection point 120 via a heat pump circuit outlet 116. The heat pump circuit 112 and the thermal heating circuit 102 partially overlap, so that the overlap is between the first connection point 118 and the second connection point 120. The first and second connection points 118, 120 may be spaced apart on the thermal heating circuit 102 by a distance corresponding to at least five diameters of the thermal heating circuit 102. The separation of the first and second connection points 118, 120 helps control recirculation in the heat pump circuit 112 while reducing the risk of accidental recirculation.

[0061] The heat pump circuit 112 further comprises a heat pump control pump 122 configured to control the flow of the thermal fluid from the heat pump circuit inlet 114 through the heat extraction side 110a of the heat pump 110. The heat pump control pump 122 allows a specific control of the flow of the thermal fluid through the heat pump 110. Thus, the thermal fluid can be independently circulated at a higher flow rate or a lower flow rate than in the thermal heating circuit 102, thereby allowing the thermal fluid flow rate in the heat pump circuit 112 to be adapted to the operating conditions of the heat pump 110.

[0062] Adjusting the flow rate through the heat pump 110 affects the amount of thermal energy that can be extracted therefrom. For a given heat extraction, a lower flow rate of thermal fluid through the heat pump 110 will cause a greater temperature drop between the heat pump circuit inlet 114 and the heat pump circuit outlet 116 than a higher flow rate of thermal fluid would produce. It is generally preferred that the thermal fluid have a low temperature drop across the heat pump 110, as this allows heat to be extracted evenly across the heat extraction side 110a. However, the preferred flow rate and temperature differential may vary depending on the operating conditions of the heat pump 110, as determined by the heat loads 602, 604, 606 placed thereon.

[0063] Typically, it is desirable to achieve as high a coefficient of performance (COP) as possible for the heat pump assembly 100 / cooler assembly 200. That is, the relationship between the heat generated / removed and the energy consumption of the heat pump assembly 100 / cooler assembly 200 should be as high as possible. The COP of the heat pump assembly 100 or the cooler assembly 200 is not only affected by the performance of the heat pump 110 / cooler 200 itself, but also by the performance required of all other energy consuming devices of the assembly 100, 200. For example, the heat pump control pump 122 and the thermal heating loop controller 108 require power to achieve the required flow and therefore affect the overall COP of the heat pump assembly 100.

[0064] It is therefore desirable to be able to control the flow of thermal fluid not only in the thermal heating circuit 102 but also in particular through the heat pump circuit 112 to the heat pump 110. It is also desirable to perform this control in response to the efficiency of the heat pump assembly 100, preferably the electrical power consumption.

[0065] More directly controlling the supply of thermal fluid to the heat pump in response to the efficiency of the heat pump 110 improves the correspondence with the supply required by the heat pump 110 to achieve an improved COP for each given heat load condition. The COP also depends on the temperature difference of the internal refrigerant within the heat pump 110, and it is desirable to maintain as low a temperature difference as possible between the heat extraction side 110a and the heat release side 110b, because this requires less power to achieve the flow of refrigerant in the heat pump 110, and the solution provided here also takes this into account.

[0066] A heat pump assembly controller 124 is provided to control the heat pump assembly 100 to achieve improved efficiency. The controller 124 may include a control unit 500, which will be referred to below. Figure 4 It is further described.

[0067] The heat pump assembly controller 124 is configured to control the heat pump assembly 100 based on a parameter associated with the efficiency of the heat pump assembly 100. In one embodiment, the parameter may include a signal indicating the electrical power consumption of the heat pump assembly 100, and wherein the heat pump assembly controller 124 is configured to control the heat pump control pump 122 based on the parameter. Therefore, the heat pump control pump 122 is controlled to reduce the electrical power consumption of the heat pump 110 and / or the thermal heating circuit controller 108 and / or the heat pump control pump 122, thereby reducing the electrical power consumption while the heat pump 110 meets the thermal loads 602, 604, 606. For example, if one thermal load increases, this will affect the operation of the heat pump 110 and may change the conditions under which its condenser / evaporator operates most efficiently. If the heat pump 110 is restricted to operate under suboptimal conditions, the heat pump 110 will consume more electrical power to meet the thermal loads 602, 604, 606. This is detected by the heat pump assembly controller 124 which controls the heat pump control pump 122 and / or the thermal heating loop flow controller 108 in order to find an alternative thermal fluid flow rate that reduces the electrical power consumption of the heat pump assembly 100 .

[0068] Additionally, the temperatures of the hot conduit 302 and the cold conduit 304 may change dynamically, which may also affect the performance of the heat pump assembly 100, which may be compensated for by providing a heat pump loop 112 and a heat pump assembly controller 124 that may control components of the heat pump assembly 100 to achieve a new thermal fluid flow at which the heat pump 110 operates more efficiently and, therefore, reduces the power consumption of the assembly 100.

[0069] In one embodiment, the heat pump assembly controller 124 is configured to control the heat circuit flow controller 108 based on a parameter, which may include a signal indicative of the power consumption of the heat pump assembly 100 .

[0070] In one embodiment, the parameter may include a signal indicative of only the electrical power consumption of the heat pump 110 and the heat pump control pump 122 .

[0071] Now turn to Figure 2 , which schematically illustrates a chiller assembly 200 for distributing heat from a building 600 to a thermal energy loop 300. Since many features are related to Figure 1 The embodiments described have in common that Figure 2 For some common features, please refer to Figure 1 Description.

[0072] Each building may include several heat loads 702, 704, 706. The chiller assembly 200 may be configured to provide comfort cooling, provide cooling for office equipment such as a server room, and / or be used to chill water, to name a few examples.

[0073] Figure 2 The chiller assembly 200 shown includes a thermal cooling circuit 202. The thermal cooling circuit 202 is connected to the thermal energy circuit 300 via a thermal cooling circuit inlet 204 connected to a cold conduit 304 and a thermal cooling outlet 206 connected to a hot conduit 304. The thermal cooling circuit inlet 204 draws thermal fluid from the cold conduit 304 and the thermal cooling circuit outlet 206 returns the thermal fluid to the hot conduit 304.

[0074] In order to establish and control the flow of thermal fluid through the thermal cooling loop 202, a thermal cooling loop flow controller 208 is provided. The thermal cooling loop flow controller 208 preferably includes a thermal cooling loop circulation pump 208a, and may further include a first and optionally a second thermal cooling loop control valve 208b, 208c. In response to a parameter indicative of the efficiency of the chiller assembly 200, preferably indicative of its electrical power consumption, the thermal cooling loop flow controller 208 may be controlled to achieve the flow of thermal fluid in the thermal cooling loop 202. It may also be controlled to achieve a desired flow rate to achieve a desired temperature and / or temperature drop of the thermal fluid between the cooling loop inlet 204 and the cooling loop outlet 206 of the thermal cooling loop 202. It may also be controlled to achieve a flow rate of thermal fluid into / out of the thermal energy loop 300 to maintain a desired temperature difference between the hot conduit 302 and the cold conduit 304.

[0075] Figure 2 The chiller assembly 200 is further shown to include a chiller 210. The chiller is configured to release heat to the thermal fluid distributed from the thermal energy loop 300 via the thermal cooling loop 202. The chiller 210 is well known to those skilled in the art and will not be described in further detail herein. Figure 2 Only one cooler 210 is shown, but it should be understood that several coolers 210 may be connected to each thermal cooling loop 202 .

[0076] The chiller 210 may include a heat extraction side 210a and a heat release side 210b. The heat release side 210b is connected to a chiller loop 212. The chiller loop 212 is in turn connected to the hot cooling loop 202 via a chiller loop inlet 214 at a first connection point 218 and via a chiller loop outlet 216 at a second connection point 220. The chiller loop 212 and the hot cooling loop 202 partially overlap, so that the overlap is between the first connection point 218 and the second connection point 220. The first and second connection points 218, 220 may be spaced apart on the hot heating loop 202 by a distance corresponding to at least five diameters of the hot heating loop 202. The separation of the first and second connection points 218, 220 helps control recirculation in the chiller loop 212 while reducing the risk of accidental recirculation. The chiller loop 212 further includes a chiller control pump 222, which is configured to control the flow of the hot fluid from the chiller loop inlet 214 through the heat release side 210a of the chiller 210. The chiller control pump 222 allows specific control over the flow of thermal fluid through the chiller 210. Thus, the thermal fluid can be independently circulated at a higher flow rate or a lower flow rate than in the thermal cooling circuit 202, thereby allowing the thermal fluid flow rate in the chiller circuit 212 to be adapted to the operating conditions of the chiller 210.

[0077] Adjusting the flow rate of the thermal fluid through the chiller 210 affects the amount of thermal energy that can be released by it. For a given heat release in the heat release side 210b of the chiller 210, a lower flow rate of the thermal fluid through the chiller 210 will cause a temperature rise between the chiller circuit inlet 214 and the chiller circuit outlet 216 to be greater than the temperature rise that a higher flow rate of the thermal fluid would produce. It is generally preferred that the thermal fluid have a low temperature rise across the chiller 210, as this allows heat to be released evenly across the heat release side 210b. However, the preferred flow rate and temperature differential may vary depending on the operating conditions of the chiller 210, as determined by the heat loads 602, 604, 606 placed thereon.

[0078] It is desirable to be able to control the flow of thermal fluid not only in thermal cooling circuit 202, but particularly through chiller circuit 212 to chiller 210. It is also desirable to perform this control in response to the efficiency of chiller assembly 200, preferably electrical power consumption.

[0079] More direct control of the supply of thermal fluid to the chiller in response to the efficiency of the chiller 210 improves the correspondence with the supply required by the chiller 210 to achieve an improved COP for each given heat load condition. The COP also depends on the temperature difference of the internal refrigerant within the heat pump 210, and it is desirable to maintain as low a temperature difference as possible between the heat extraction side 210a and the heat release side 210b, as this requires less power to achieve the flow of refrigerant in the chiller 210, and the solution provided here also takes this into account.

[0080] A chiller assembly controller 224 is provided to control the chiller assembly 200 to achieve improved efficiency. The controller 224 may include a control unit 500, which will be referred to below. Figure 5 It is further described.

[0081] The chiller assembly controller 224 is configured to control the chiller assembly 200 based on a parameter associated with the efficiency of the chiller assembly 200. In one embodiment, the parameter may include a signal indicating the power consumption of the chiller assembly 200, and wherein the chiller assembly controller 224 is configured to control the chiller control pump 222 based on the parameter. Thus, the chiller control pump 222 is controlled to reduce the energy / power consumption of the chiller 210 and / or the thermal cooling circuit controller 208 and / or the chiller control pump 222, thereby reducing the electrical power consumption while the chiller 210 meets the thermal loads 702, 704, 706. For example, if one thermal load increases, this may affect the operation of the chiller 210 and may change the conditions under which its condenser / evaporator operates most efficiently. If the chiller 210 is restricted to operate under suboptimal conditions, the chiller 210 will consume more power to meet the thermal loads 602, 604, 606. This is detected by the chiller assembly controller 224 which controls the chiller control pump 222 and / or the thermal cooling circuit flow controller 208 in order to find an alternative thermal fluid flow that reduces the electrical power consumption of the chiller assembly 200 .

[0082] Additionally, the temperatures of the hot pipe 302 and the cold pipe 304 may change dynamically, which may also affect the performance of the chiller assembly 200, which may be compensated for by providing a chiller loop 212 and a chiller assembly controller 224 that may control components of the chiller assembly 200 to achieve a new hot fluid flow at which the chiller 210 operates more efficiently and thereby reduces the power consumption of the assembly 200.

[0083] In one embodiment, chiller assembly controller 224 is configured to control heat circuit flow controller 208 based on a parameter, which may include a signal indicative of power consumption of heat pump assembly 200 .

[0084] In one embodiment, the parameter may include a signal indicative of energy consumption of only chiller 210 and chiller control pump 222 .

[0085] exist Figure 3 , a thermal energy component 400 is schematically shown. Figure 4 The illustrated thermal energy assembly 400 includes a heat pump assembly 100 and a chiller assembly 200. However, it should be appreciated that the thermal energy assembly 400 may include more than one heat pump assembly 100 and / or more than one chiller assembly 200.

[0086] Thermal assembly 400 shows heat pump assembly 100 and chiller assembly 200 connected to thermal energy loop 300, respectively. Figure 3 In the illustrated embodiment, the heat pump assembly 100 and the chiller assembly 200 are connected to each other. The heat pump assembly outlet 106 is connected to the chiller assembly inlet 204 and the heat pump assembly inlet 104 is connected to the chiller assembly outlet 206. This allows the thermal fluid to be distributed between the heat pump assembly 100 and the chiller assembly 200, which is beneficial because the heat demand on the thermal energy loop 300 is reduced. In some cases, the thermal energy assembly 400 can be self-sufficient because the heated thermal fluid from the chiller assembly 200 already has the temperature and flow rate desired by the heat pump assembly 100.

[0087] The thermal assembly 400 may be further provided with a first thermal assembly valve 402 and a second thermal assembly valve 404. The first thermal assembly valve 402 is configured to control the flow of thermal fluid into / out of the hot conduit 304, and the second thermal assembly valve 404 is configured to control the flow of thermal fluid into / out of the cold conduit 304. The first and second thermal assembly valves 402, 404 may thus control how much thermal fluid is consumed / returned to the thermal energy loop 300 which may be useful in the event that a partial or complete thermal fluid redistribution is desired between the heat pump assembly 100 and the chiller assembly 200.

[0088] As further shown, the heat pump assembly 100 and the chiller assembly 200 each include a heat pump assembly controller / chiller assembly controller 124, 224. Figure 3 1 and 2. The respective controllers 124, 224 are shown separately, but it should be appreciated that the controllers 124, 224 may also be formed by a single controller that includes the functionality required to control both the heat pump assembly 100 and the chiller assembly 200.

[0089] The first and second thermal assembly valves 402 , 404 may therefore be controlled by the heat pump assembly controller 124 and / or the thermal chiller controller 224 .

[0090] The heat pump assembly controller 124, together with the chiller assembly controller 224, is configured to control the thermal energy assembly 400 based on a parameter associated with the efficiency of the thermal energy assembly 400. As described above, the parameter preferably includes the electrical power consumption of the heat pump assembly 100 and the chiller assembly 200, for example, to reduce power consumption by improving the environment in which the heat pump assembly 100 and the chiller assembly 200 operate. Specifically, in one embodiment, the parameter may include the power consumption of the heat pump 110 / chiller 210 and the heat pump control pump 122 / chiller control pump 222.

[0091] Steering Figure 4 , wherein a schematic diagram of a heat pump assembly controller 124 / thermal chiller controller 224 is shown. The respective controllers 124, 224 (which may be formed of a single unit as described above) are configured to perform overall control of the functions and operations of the heat pump assembly 100, the chiller assembly 200, and the respective thermal energy assembly 400, and therefore include a control unit 500 that may be associated with a memory 508. The control unit 500 may include a control circuit 502 and an associated processor 504, such as a central processing unit (CPU), a microcontroller, or a microprocessor. The processor 504 is configured to execute program code stored in the memory 508 to perform the functions and operations of the controllers 124, 224.

[0092] The memory 508 may be one or more of a buffer, a flash memory, a hard drive, a removable medium, a volatile memory, a non-volatile memory, a random access memory (RAM), or another suitable device. In a typical arrangement, the memory 508 may include non-volatile memory for long-term data storage and volatile memory used as system memory for the control unit 500. The memory 508 may exchange data with the control unit 500 via a data bus. There may also be accompanying control lines and an address bus located between the memory 508 and the control unit 500.

[0093] The control unit 500 may further include a communication unit 506, which is connected to the control circuit 502 and is configured to allow remote control of the corresponding components (heat pump component 100, chiller component 200 and / or thermal energy component 400). The unit of the component can be a pump, a valve-heat pump, a chiller, a flow controller, etc. The communication path for communication can be wired or wireless. Communication can include data transfer, etc. Data transfer can include but is not limited to downloading and / or uploading data, and receiving or sending messages. Data can be processed by the control unit 500. This processing can include storing data in a memory (e.g., a memory 508 of the control unit 500), performing operations or functions, etc. For each unit of the corresponding component, communication can be separate.

[0094] The functions and operations of the control unit 500 may be embodied in the form of executable logic routines (e.g., lines of code, software programs, etc.) that are stored on a non-transitory computer-readable medium (e.g., memory 508) of the control unit 500 and executed by the control circuit 502 (e.g., using the processor 504). In addition, the functions and operations of the control unit 500 may be stand-alone software applications, or form part of a software application that performs additional tasks associated with the control unit 500. The described functions and operations may be considered as methods that the corresponding device is configured to perform. Likewise, although the described functions and operations may be implemented in software, such functions may also be performed via dedicated hardware or firmware, or some combination of hardware, firmware, and / or software.

[0095] Also refer to Figures 5 to 7 , methods 1000 , 2000 , 3000 for controlling the heat pump assembly 100 , the chiller assembly 200 , and the thermal energy assembly 400 , respectively, will be described.

[0096] The method comprises determining 1001, 2001, 3001, respectively, a parameter associated with the efficiency of the heat pump assembly 100, the chiller assembly 200 or the thermal energy assembly 300. As previously mentioned, the parameter preferably comprises a signal indicating the electrical power consumption of the heat pump assembly 100, the chiller assembly 200 or the thermal energy assembly 400. In one embodiment, the electrical power consumption may be the electrical power consumption of the heat pump control pump 122 and the heat pump 110, the chiller control pump 222 and the chiller 210, and / or the electrical power consumption of both in the thermal energy assembly 400. The parameter may also comprise a signal indicating the current heat delivery of the heat pump 110 or the chiller 210, respectively. This may be beneficial because the control of the corresponding control pumps 122, 222 may be managed in this regard. The heat delivery of the heat pump 110 and the chiller 210 may be determined by monitoring the pressure difference on the compressors of the corresponding devices 110, 210. In the case of knowing the characteristics of the compressor (e.g., by using a compressor map known in the art), the pressure difference may be used to determine the heat added in the evaporator and the heat released in the condenser. This will provide a good measure of the heat delivery of the heat pump 110 / chiller 210 and therefore provide an overall indication of the efficiency of the heat pump assembly 100 , chiller assembly 200 and thermal energy assembly 400 along with their electrical power consumption.

[0097] The electrical power consumption may be measured, for example, by an electrical metering device which may form part of the controller 124, 224 and which, as described above, monitors the Watts / Watt-hours consumed by the components of the respective assembly 100, 200, 400. As will be appreciated by those skilled in the art, other means for measuring electrical power consumption are possible.

[0098] Additionally, the temperature and / or flow rate of the internal thermal fluid of the heat pump 110 / 210 before / after passing through the condenser / evaporator may also be measured to further improve the accuracy of determining the heat delivery of the heat pump 110 and the chiller 210 , respectively.

[0099] Thereafter or in conjunction therewith, the heat pump control pump 122 of the heat pump assembly 100 and the chiller control pump 222 of the chiller assembly 200 are adjusted 1002, 2002, 3002 to change the flow in the heat pump loop 112 and the chiller loop 212, respectively. In the thermal energy assembly 400, the process is the same for each heat pump assembly 100 and the chiller assembly 200, respectively. However, each heat pump assembly 100 and each chiller assembly 200 may include more than one heat pump 110 and chiller 210, respectively. Therefore, each heat pump assembly 100 and each chiller assembly may also include more than one heat pump control pump 122 and chiller control pump 222, respectively, and therefore it is desirable to adjust 1002, 2002, 3002 each control pump 122, 222. It is preferred that each heat pump 110 and chiller 210 have one control pump 122, 222 because this provides the best possible resolution for control. However, one control pump 122 , 222 may be configured to provide thermal fluid to more than one heat pump 110 / chiller 210 .

[0100] The respective methods 1000 , 2000 , 3000 further comprise determining 1003 , 2003 , 3003 parameters associated with the efficiency of the heat pump assembly 100 , the chiller assembly 200 , the thermal energy assembly 400 after adjustment.

[0101] Afterwards, based on the parameters determined before and after the adjustment, changes in the efficiency of the heat pump assembly 100, the chiller assembly 200, and the thermal energy assembly 400 are determined 1004, 2004, and 3004, respectively.

[0102] The heat pump control pump 122 and the chiller control pump 222 of the heat pump assembly 100, the chiller assembly 200, and the thermal energy assembly 400 are then adjusted 1005, 2005, 3005 to control the flow of the thermal fluid based on the determined changes.

[0103] If the electrical power consumption change is increasing and the adjustment 1002, 2002, 3003 is to increase the flow from the heat pump control pump 122 / chiller control pump 222, then the subsequent adjustment would be to control the respective control pump 122, 222 to achieve a decrease in the thermal fluid flow.

[0104] If the increase in flow rate leads to a reduction in power consumption, the flow rate can be further increased until the power consumption begins to rise, so as to find a flow rate as close to the optimum as possible for the heat pump 110 / cooler 210. The methods 1000, 2000, 3000 will be iterated continuously, at predetermined time intervals or as needed, so as to provide each heat pump 110 and cooler 210 with a flow rate and / or temperature of thermal fluid that achieves a reduction in electrical power consumption. Since it is not only the heat pump 110 or the cooler 210 that consumes electrical energy in the heat pump assembly 100, the cooler assembly 200, and the thermal energy assembly 400, the parameter can include the electrical power consumption of the heat pump 110, the heat pump control pump 122, the cooler 210, and the cooler control pump 222.

[0105] The adjusting steps 1002 , 2002 , 3002 , 1005 , 2005 , 3005 of the respective methods 1000 , 2000 , 3000 may include the heat pump assembly controller 124 and the chiller assembly controller 224 controlling the thermal heating loop flow controller 108 and the thermal cooling loop flow controller 208 based on the parameter.

[0106] Due to inherent delays and inertia in the heat pump assembly 100 and chiller assembly 200 before a change in power consumption can be detected, a time delay may be applied after the first adjustment 1002 , 2002 , 3002 and before the adjusted efficiency is determined 1003 , 2003 , 3003 .

[0107] It should be understood that the present invention is not limited to the embodiments shown. Therefore, several modifications and variations can be envisaged within the scope of the present invention, and the scope of the present invention is therefore limited only by the appended claims. For example, it should be recognized that although the above-mentioned embodiments are respectively about a dedicated heat pump 110 and a chiller 210, the teachings of this document can also be applied to a reversible heat pump device, which can be used alternately as a heat pump or a chiller. In such a heat pump device, the heat pump device can switch the heat extraction side and the heat release side as needed, depending on whether the heat pump device is to be used as a heat pump or a chiller, respectively. Applicant E.ON Sverige AB disclosed such a heat pump device in EP 3 569 935 A1.

Claims

1. A heat pump assembly, the heat pump assembly being arranged to be connected to a thermal energy loop, the thermal energy loop comprising a hot conduit configured to allow a hot fluid at a first temperature to flow therethrough and a cold conduit configured to allow a hot fluid at a second temperature to flow therethrough, the second temperature being lower than the first temperature, the heat pump assembly comprising: a hot heating circuit, the hot heating circuit comprising a hot heating circuit inlet connectable to the hot conduit and a hot heating circuit outlet connectable to the cold conduit, the hot heating circuit being configured to transfer a hot fluid from the hot heating circuit inlet to the hot heating circuit outlet, the hot heating circuit further comprising a hot heating circuit flow controller configured to control a flow rate of the hot fluid from the hot heating circuit inlet to the hot circuit outlet; Heat pumps; a heat pump circuit comprising a heat pump circuit inlet connected to the thermal heating circuit at a first connection point, a heat pump circuit outlet connected to the thermal heating circuit at a second connection point, and a heat pump control pump configured to control a flow of a thermal fluid from the heat pump circuit inlet through the heat pump at a heat extraction side thereof to the heat pump circuit outlet; as well as a heat pump assembly controller configured to control the heat pump assembly based on a parameter associated with an efficiency of the heat pump assembly; Wherein the heat pump circuit and the thermal heating circuit partially overlap, wherein the overlap is between the first connection point and the second connection point.

2. The heat pump assembly according to claim 1, wherein: The parameter comprises a signal indicative of electrical power consumption of the heat pump assembly, wherein the heat pump assembly controller is configured to control the heat pump control pump based on the parameter.

3. The heat pump assembly according to claim 1, wherein: The parameter includes a signal indicative of electrical power consumption of the heat pump assembly, wherein the heat pump assembly controller (124) is configured to control the heat circuit flow controller based on the parameter.

4. The heat pump assembly according to claim 2, wherein: The parameters include the electrical power consumption of the heat pump and the heat pump control pump.

5. A chiller assembly arranged to be connected to a thermal energy loop, the thermal energy loop comprising a hot conduit configured to allow a hot fluid at a first temperature to flow therethrough and a cold conduit configured to allow a hot fluid at a second temperature to flow therethrough, the second temperature being lower than the first temperature, the chiller assembly comprising: a thermal cooling circuit, the thermal cooling circuit comprising a thermal cooling circuit inlet connectable to the cold conduit and a thermal cooling circuit outlet connectable to the hot conduit, the thermal cooling circuit being configured to transfer a thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet, the thermal cooling circuit further comprising a thermal cooling circuit flow controller configured to control a flow rate of the thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet; Cooling machine; a chiller circuit comprising a chiller circuit inlet connected to the hot cooling circuit at a first connection point, a chiller circuit outlet connected to the hot cooling circuit at a second connection point, and a chiller control pump configured to control the flow of a thermal fluid from the chiller circuit inlet through the chiller on its heat generating side to the chiller circuit outlet, a chiller assembly controller configured to control the chiller assembly based on a parameter associated with an efficiency of the chiller assembly, Wherein the chiller circuit and the hot cooling circuit partially overlap, wherein the overlap is between the first connection point and the second connection point.

6. The chiller assembly according to claim 5, wherein: The parameter comprises a signal indicative of electrical power consumption of the chiller assembly, wherein the chiller assembly controller is configured to control the chiller control pump based on the parameter.

7. The chiller assembly according to claim 5, wherein: The parameter includes a signal indicative of electrical power consumption of the chiller assembly, wherein the chiller assembly controller is configured to control the thermal cooling circuit flow controller based on the parameter.

8. The chiller assembly according to claim 6, wherein: The parameters include the electrical power consumption of the chiller and the chiller control pump.

9. A thermal energy assembly comprising at least one heat pump assembly according to claim 1 and at least one chiller assembly according to claim 5.

10. The thermal energy assembly according to claim 9, wherein: The thermal heating circuit outlet is connected to the thermal cooling circuit inlet, and wherein the thermal cooling circuit outlet is connected to the thermal heating circuit inlet.

11. The thermal energy assembly according to claim 9, wherein: The heat pump assembly controller, in conjunction with the chiller assembly controller, is configured to control the thermal energy assembly based on a parameter associated with an efficiency of the thermal energy assembly.

12. The thermal energy assembly according to claim 11, wherein: The parameter associated with the efficiency of the thermal energy assembly includes a signal indicative of electrical power consumption of the thermal energy assembly, wherein the heat pump assembly controller together with the chiller assembly controller is configured to control the heat pump control pump and the chiller control pump based on the parameter.

13. A method for controlling a heat pump assembly, wherein: The heat pump assembly is arranged to be connected to a thermal energy loop, the thermal energy loop comprising a hot conduit configured to allow a hot fluid at a first temperature to flow therethrough and a cold conduit configured to allow a hot fluid at a second temperature to flow therethrough, the second temperature being lower than the first temperature, the heat pump assembly comprising: a hot heating circuit, the hot heating circuit comprising a hot heating circuit inlet connectable to the hot conduit and a hot heating circuit outlet connectable to the cold conduit, the hot heating circuit being configured to transfer a hot fluid from the hot heating circuit inlet to the hot heating circuit outlet, the hot heating circuit further comprising a hot heating circuit flow controller configured to control a flow rate of the hot fluid from the hot heating circuit inlet to the hot circuit outlet; Heat pumps; a heat pump circuit comprising a heat pump circuit inlet connected to the thermal heating circuit at a first connection point, a heat pump circuit outlet connected to the thermal heating circuit at a second connection point, and a heat pump control pump configured to control a flow of a thermal fluid from the heat pump circuit inlet through the heat pump at a heat extraction side thereof to the heat pump circuit outlet; and a heat pump assembly controller configured to control the heat pump assembly based on a parameter associated with an efficiency of the heat pump assembly; wherein the heat pump circuit and the thermal heating circuit partially overlap, wherein the overlap is between the first connection point and the second connection point, wherein the method comprises: determining parameters associated with the efficiency of the heat pump assembly, adjusting the flow in the heat pump circuit by controlling the heat pump control pump, determining the parameter associated with the efficiency of the heat pump assembly after adjustment, determining a change in the efficiency of the heat pump assembly based on the parameters determined before and after the adjustment, and Based on the determined change, the flow in the heat pump circuit is adjusted by controlling the heat pump control pump.

14. A method for controlling a chiller assembly, the chiller assembly being arranged to be connected to a thermal energy loop, the thermal energy loop comprising a hot conduit configured to allow a hot fluid at a first temperature to flow therethrough and a cold conduit configured to allow a hot fluid at a second temperature to flow therethrough, the second temperature being lower than the first temperature, the chiller assembly comprising: a thermal cooling circuit, the thermal cooling circuit comprising a thermal cooling circuit inlet connectable to the cold conduit and a thermal cooling circuit outlet connectable to the hot conduit, the thermal cooling circuit being configured to transfer a thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet, the thermal cooling circuit further comprising a thermal cooling circuit flow controller configured to control a flow rate of the thermal fluid from the thermal cooling circuit inlet to the thermal cooling circuit outlet; Cooling machine; a chiller circuit comprising a chiller circuit inlet connected to the hot cooling circuit at a first connection point, a chiller circuit outlet connected to the hot cooling circuit at a second connection point, and a chiller control pump configured to control the flow of a thermal fluid from the chiller circuit inlet through the chiller on its heat generating side to the chiller circuit outlet, a chiller assembly controller configured to control the chiller assembly based on a parameter associated with an efficiency of the chiller assembly, wherein the chiller circuit and the hot cooling circuit partially overlap, wherein the overlap is between the first connection point and the second connection point, wherein the method comprises: determining parameters associated with the efficiency of the chiller assembly, adjusting the flow in the chiller circuit by controlling the chiller control pump, determining the parameter associated with the efficiency of the chiller assembly after adjustment, determining a change in the efficiency of the chiller assembly based on the parameters determined before and after the adjustment, and Based on the determined change, the flow in the chiller circuit is adjusted by controlling the chiller control pump.

15. A method for controlling a thermal energy assembly according to claim 9, the method comprising: determining a parameter associated with the efficiency of the heat pump assembly and / or a parameter associated with the efficiency of the chiller assembly, adjusting the flow in the heat pump circuit and / or the flow in the chiller circuit by controlling a heat pump control pump of the heat pump assembly and / or by controlling a chiller control pump of the chiller assembly, determining the parameter associated with the adjusted efficiency of the heat pump assembly and / or the parameter associated with the adjusted efficiency of the chiller assembly, determining a change in the efficiency of the heat pump assembly based on the parameters determined before and after adjustment and / or determining a change in the efficiency of the chiller assembly based on the parameters determined before and after adjustment, and Based on the determined respective changes, the flow in the heat pump circuit and / or in the chiller circuit is adjusted by controlling a heat pump control pump of the heat pump assembly and / or a chiller control pump of the chiller assembly.

16. A non-transitory computer-readable storage medium having instructions stored thereon, which when executed on a device having processing capabilities are used to implement the method for controlling a heat pump assembly according to claim 13 and / or the method for controlling a chiller assembly according to claim 14 and / or the method for controlling a thermal energy assembly according to claim 15.

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