A high-layer PCB milling cutter and processing technology

Abstract

The present invention discloses a milling cutter for high- and multi-layer PCBs and a machining process. The milling cutter includes at least one bidirectional chip removal cutting segment, comprising an upper chip removal segment and a lower chip removal segment. The upper chip removal segment is disposed below the lower chip removal segment, with the cutting edge of the upper chip removal segment removing chips from bottom to top, while the cutting edge of the lower chip removal segment removes chips from top to bottom. This invention can effectively solve the problems of whitening and burring board edges during CNC machining.

Description

Technical Field

[0001] The present invention relates to the technical field of milling cutters, and in particular to a high-layer PCB milling cutter and a processing technology thereof. Background Art

[0002] During the CNC milling process for HDI or PCBs, the milling cutter exerts a horizontal force tangential to the cutter's outer diameter and a force perpendicular to the board surface, acting toward chip removal. This force perpendicular to the board surface can pull and fracture the outermost fiberglass layer, causing whitening and burrs along the board's edges. Existing milling cutters typically employ double-edged or single-edged designs to mitigate this problem, with a small helix angle to reduce vertical pulling forces, but this has been limited in effectiveness. Furthermore, with the increasingly harsh operating environments of automotive products, the reliability requirements for PCB materials are increasing, and with the increasing variety of filler materials, the issues of whitening and burrs along the board's edges are becoming increasingly prominent. Summary of the Invention

[0003] The problem to be solved by the present invention is to provide a high-layer PCB milling cutter and a processing technology, which can effectively solve the problems of whitening and burrs on the board edges during CNC processing.

[0004] The present invention provides a technical solution to solve the above problems: a high-layer PCB milling cutter, comprising at least one bidirectional chip removal cutting segment, the bidirectional chip removal cutting segment comprising an upper chip removal segment and a lower chip removal segment, the upper chip removal segment being arranged at the lower end of the lower chip removal segment, the chip removal direction of the cutting edge of the upper chip removal segment being from bottom to top, and the chip removal direction of the cutting edge of the lower chip removal segment being from top to bottom.

[0005] Preferably, when there are multiple bidirectional chip removal cutting segments, two adjacent bidirectional chip removal cutting segments have an intersection area, and the width of the intersection area is 0.2-1.5 mm.

[0006] Preferably, the length of the upper chip removal section is 0.5 mm-1.5 mm.

[0007] Preferably, the length of the lower chip removal section is 0.5 mm-1.5 mm.

[0008] Another object of the present invention is to provide a processing technology for processing a gong plate using a high-layer PCB milling cutter as described in any one of the above, the processing technology includes

[0009] Before CNC machining, the plates are stacked in sequence in the form of 1pnl processing plate + 1 recycled pad;

[0010] If the thickness of the processed board is less than 1.0mm, add a 0.5-1.0mm thick partition between two adjacent processed boards;

[0011] The CNC forming method follows a two-step forming method. The first processing uses a conventional dense-tooth milling cutter for roughing; the second processing uses a high-layer PCB milling cutter for fine grinding to remove burrs and flashes, so that the surface of the copper clad laminate CNC processing is smooth and free of flashes or the finished product has no ink-covered substrate and no burrs.

[0012] Preferably, the recovery pad has a thickness of 0.2-1.5 mm, corresponding to the thickness of the intersection between the two bidirectional chip removal cutting sections.

[0013] Preferably, the separator is low-density cardboard or recycled cardboard.

[0014] Preferably, the allowance of the first processing is 0.05-0.15 mm, which facilitates the control and effective removal of burrs in the second processing and ensures dimensional stability.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] 1. Through the optimized design of the tool, the problem of whitening and burrs on the plate edge during CNC machining can be effectively solved;

[0017] 2. By adding a recovery pad in the intersection area, the intersection area is ensured not to directly act on the workpiece, thus preventing instability in the intersection area and achieving multi-laminate and multi-section processing;

[0018] 3. Secondary processing can effectively ensure the quality and efficiency of CNC processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0020] Figure 1 It is a schematic diagram of the milling cutter structure of the present invention;

[0021] Figure 2 It is a schematic diagram of milling cutter processing of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of a conventional milling cutter.

[0023] The attached drawings are marked as follows: 1. Upper chip removal section, 2. Lower chip removal section, 3. Intersection area. DETAILED DESCRIPTION

[0024] The following will describe the embodiments of the present invention in detail with reference to the accompanying drawings and examples, so that the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0025] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Therefore, the terms "first" and "second" may explicitly or implicitly refer to one or more of these features. Throughout the description of the present invention, "several" means two or more, unless otherwise specifically defined.

[0027] In the present invention, unless otherwise specified or limited, the terms "assemble," "connect," and "connect" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integral connection; mechanical connection; direct connection, connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0028] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0029] It should also be understood that the terms used in this description of the embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the embodiments of the present invention. As used in the description of the embodiments of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0030] Example 1

[0031] This embodiment discloses a high-layer PCB milling cutter, including at least one bidirectional chip removal cutting segment, the bidirectional chip removal cutting segment includes an upper chip removal segment and a lower chip removal segment, the upper chip removal segment is arranged at the lower end of the lower chip removal segment, the chip removal direction of the cutting edge of the upper chip removal segment is from bottom to top, and the chip removal direction of the cutting edge of the lower chip removal segment is from top to bottom.

[0032] As a further improvement of this embodiment, when there are multiple bidirectional chip removal cutting segments, two adjacent bidirectional chip removal cutting segments have an intersection area, and the width of the intersection area is 0.2-1.5 mm.

[0033] As a further improvement of this embodiment, the length of the upper chip removal segment is 0.5 mm-1.5 mm.

[0034] As a further improvement of this embodiment, the length of the lower chip removal section is 0.5 mm-1.5 mm.

[0035] Example 2

[0036] This embodiment discloses a processing technology for machining gong plates using a high-layer PCB milling cutter, the processing technology includes:

[0037] Before CNC machining, the plates are stacked in sequence in the form of 1pnl processing plate + 1 recycled pad. The thickness of the recycled pad is 0.2-1.5mm, which corresponds to the thickness of the intersection area between the two bidirectional chip removal cutting sections.

[0038] If the thickness of the processed board is less than 1.0mm, add a 0.5-1.0mm thick partition between two adjacent processed boards;

[0039] The CNC forming method follows a two-step forming method. The first processing uses a conventional dense-tooth milling cutter for roughing. The allowance for the first processing is 0.05-0.15mm, which is convenient for the second processing to control and effectively remove burrs and ensure dimensional stability. The second time, a high-layer PCB milling cutter is used for fine processing to remove burrs and flashes, so that the surface of the copper clad laminate processed by CNC is smooth and free of flashes or the substrate position covered by ink is free of burst burrs in the finished product.

[0040] Wherein, the partition is low-density cardboard or recycled cardboard.

[0041] Using conventional tools (such as Figure 3 When CNC machining is performed on the object (PCB or HDI board), the object being processed (PCB or HDI board) is subjected to an upward force from the milling cutter, and the glass fiber on the top layer of the board is pulled by the force to form fibers and white edges;

[0042] Due to the special spiral angle design of the milling cutter blade of the present invention, the bottom layer of the processed object (PCB or HDI board) is subjected to an upward force, and the top layer is subjected to a downward force. The bottom layer of the processed object and the glass fiber of the bottom layer are simultaneously forced toward the center of the board. After processing, the edge of the board is free of burrs and white edges.

[0043] The above description is merely a description of the preferred embodiment of the present invention and is not to be construed as limiting the scope of the claims. The present invention is not limited to the above embodiment, and variations in the specific structure are permitted. Any variations within the scope of the independent claims of the present invention are also within the scope of protection of the present invention.

Claims

1. A processing technology for machining gong plates using a high-layer PCB milling cutter, characterized in that: The high-layer PCB milling cutter includes multiple bidirectional chip removal cutting segments, each of which includes an upper chip removal segment and a lower chip removal segment. The upper chip removal segment is arranged at the lower end of the lower chip removal segment. The chip removal direction of the cutting edge of the upper chip removal segment is from bottom to top, and the chip removal direction of the cutting edge of the lower chip removal segment is from top to bottom. Two adjacent bidirectional chip removal cutting sections have an intersection area, and the width of the intersection area is 0.2-1.5 mm; The length of the upper chip removal section is 0.5mm-1.5mm; The length of the lower chip removal section is 0.5mm-1.5mm; The processing technology includes: Before CNC machining, the plates are stacked in sequence in the form of one processed plate and one recycled backing plate; If the thickness of the processed board is less than 1.0mm, add a 0.5-1.0mm thick partition between two adjacent processed boards; The CNC forming method is a two-step forming method. The first step is to use a conventional dense-tooth milling cutter for roughing; the second step is to use a high-layer PCB milling cutter for fine grinding to remove burrs and flashes, so that the surface of the copper clad plate CNC machined is smooth and free of flashes and burrs. The thickness of the recovery pad is 0.2-1.5 mm, corresponding to the thickness of the intersection between the two bidirectional chip removal cutting sections.

2. The processing technology according to claim 1, characterized in that: The separator is low-density cardboard or recycled cardboard.

3. The processing technology according to claim 1, characterized in that: The allowance for the first processing is 0.05-0.15mm, which makes it easier for the second processing to control and effectively remove burrs and ensure dimensional stability.

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