Input device, method for manufacturing the same, and electronic computer having the input device

Abstract

The present invention provides an input device, which is applied to an electronic computer. The electronic computer includes a housing. The housing has a top surface and a frame that is recessed inward from the top surface. The input device includes a keyboard module, a protective pad, and an adhesive layer. The keyboard module is disposed within the frame and includes a plurality of key structures. The protective pad includes a first covering portion covering the keyboard module and a second covering portion covering the top surface of the housing. The first covering portion includes a plurality of receiving grooves, and each receiving groove includes a top wall and a surrounding wall extending downward from the periphery of the top wall. The top wall has a first surface facing the keyboard module, the second covering portion has a second surface facing the housing, the first surface has a first gluing area, and the second surface has a second gluing area. The adhesive layer is located within the first gluing area and the second gluing area. The present disclosure also provides a manufacturing method of the input device and an electronic computer having the input device.

Description

Technical Field

[0001] The present invention relates to an input device with a protective pad. Background Art

[0002] With the rapid development of technology, the booming development of electronic devices has brought a lot of convenience to human life. Therefore, how to make the operation of electronic devices more user-friendly is an important issue. For example, common electronic devices in daily life are notebook computers, mobile phones, satellite navigation devices, etc. Due to the substantial improvement in the storage capacity and processor computing efficiency of these electronic devices, the functions they possess have become increasingly powerful and complex. In order to operate these electronic devices efficiently, manufacturers of electronic devices use input devices such as mice, trackballs, keyboards, and touchpads to control these electronic devices. Among them, the keyboard allows users to directly input text and symbols into the electronic device, and the touchpad allows users to move the cursor on the screen by touching the touchpad with their fingers and sliding on the touchpad, and can also make the electronic device execute specific functions by pressing the touchpad.

[0003] In existing keyboards, most of the keys are made by plastic injection molding, and the touch feeling during use is not good. In addition, there are gaps between each key of the existing keyboard, and it is easy for dust, small debris, or liquid to enter the inside of the keyboard. It is not only not easy to clean but also easily causes further damage to the keyboard. Taking the keyboard of a notebook computer as an example, important electronic components are usually configured below the keyboard, and when foreign objects or liquid enter, it is easy to affect the overall normal operation. In view of this, there are already flexible protective pads on the market that can be detachably covered on the keyboard, or the flexible protective pads are directly attached to the keyboard, thereby covering the gaps between adjacent two keys, achieving a certain degree of dust-proof and waterproof technical effects, and the flexible protective pads can also give users a better pressing feel when pressing the keys.

[0004] However, when the flexible protective pad is detachably covered on the keyboard, it cannot be completely sealed with the keyboard, so there are still gaps between the edge of the flexible protective pad and the keyboard, and foreign objects or liquid can still enter through the edge of the flexible protective pad. Moreover, although the flexible protective pad can be effectively sealed with the keyboard when directly attached to the keyboard, the colloid between the flexible protective pad and the keyboard will cause the problem of poor pressing feel of the keys. Therefore, how to improve the above problems is the focus of concern for relevant personnel in this field. Summary of the Invention

[0005] One of the purposes of the present invention is to provide an input device, which can prevent foreign objects from entering the inside of the device, has a better use feel, and has a simple manufacturing method, effectively reducing the manufacturing cost.

[0006] Another object of the present invention is to provide a manufacturing method of an input device. The input device completed by this manufacturing method can prevent foreign objects from entering the interior of the device, has a better tactile feel, and the manufacturing method is simple, effectively reducing the manufacturing cost.

[0007] Other objects and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

[0008] To achieve one or part or all of the above objects or other objects, the present invention provides an input device applied to an electronic computer. The electronic computer includes a housing having a top surface and a frame recessed inward from the top surface. The input device includes a keyboard module, a protective pad, and an adhesive layer. The keyboard module is disposed within the frame and includes a plurality of key structures. The protective pad includes a first covering portion and a second covering portion. The first covering portion covers the keyboard module, and the second covering portion covers the top surface of the housing. The first covering portion includes a plurality of receiving grooves for receiving these key structures. Each receiving groove includes a top wall and a surrounding wall extending downward from the peripheral edge of the top wall. The top wall has a first surface facing the keyboard module, and the second covering portion has a second surface facing the housing. The first surface has a first adhesive area, and the second surface has a second adhesive area. The adhesive layer is disposed on the first surface and the second surface and is located within the first adhesive area and the second adhesive area. The protective pad is attached to the housing and the keyboard module through the adhesive layer.

[0009] In an embodiment of the present invention, the first surface of the top wall of each of the above-mentioned receiving grooves is orthogonally projected onto a reference plane to form a first rectangular pattern, and the first adhesive area is orthogonally projected onto the reference plane to form a second rectangular pattern. The first rectangular pattern has a plurality of first sides, and the second rectangular pattern has a plurality of second sides. These first sides correspond to these second sides, and there is a gap between each first side and the corresponding second side.

[0010] In an embodiment of the present invention, the spacing of the above-mentioned gaps is greater than 0 millimeter (mm) and less than or equal to 0.2 millimeter.

[0011] In an embodiment of the present invention, the above-mentioned adhesive layer is pad-printed onto the first surface and the second surface through a pad-printing module, thereby defining the first adhesive area on the first surface and the second adhesive area on the second surface.

[0012] In an embodiment of the present invention, the above-mentioned pad-printing module includes a support frame, at least one guide rod, and a plurality of pad-printing heads. At least one guide rod is movably disposed on the support frame. These pad-printing heads are movably disposed on at least one guide rod. At least one guide rod moves relative to the support frame along a first axial direction and simultaneously drives these pad-printing heads to move along the first axial direction, and each pad-printing head moves relative to at least one guide rod along a second axial direction or a third axial direction. The first axial direction, the second axial direction, and the third axial direction are not parallel to each other.

[0013] In an embodiment of the present invention, the above-mentioned support frame includes a first support portion and a second support portion which are disposed opposite to each other. The first support portion has a first limit opening, and the second support portion has a second limit opening. Each pad printing head has a third limit opening. The first limit opening and the second limit opening respectively extend along a first axial direction, and the third limit opening extends along a third axial direction. At least one guide rod extends along a second axial direction and passes through the first limit opening, the second limit opening and the third limit opening. These pad printing heads are located between the first support portion and the second support portion.

[0014] In an embodiment of the present invention, these above-mentioned pad printing heads respectively have a pad printing surface for attaching a gluing layer.

[0015] In an embodiment of the present invention, the material of the above-mentioned protection pad includes rubber material, silica gel material or plastic material.

[0016] To achieve one or part or all of the above-mentioned purposes or other purposes, the present invention also provides a manufacturing method of an input device. The input device is applied to an electronic computer. The electronic computer includes a housing which has a top surface and a frame recessed inward from the top surface. The manufacturing method of the input device includes the following steps: providing a keyboard module, the keyboard module including a plurality of key structures; providing a protection pad, the protection pad including a first covering portion and a second covering portion. The first covering portion includes a plurality of accommodating grooves for accommodating these key structures. Each accommodating groove includes a top wall and a surrounding wall extending downward from the periphery of the top wall. The top wall has a first surface facing the keyboard module, and the second covering portion has a second surface facing the housing; providing a pad printing module, the pad printing module including a plurality of pad printing heads; disposing the keyboard module in the frame of the housing; adjusting the positions of these pad printing heads of the pad printing module; transferring a gluing layer onto the first surface and the second surface through these pad printing heads of the pad printing module, thereby defining a first gluing area on the first surface and a second gluing area on the second surface; covering the first covering portion of the protection pad on the keyboard module and covering the second covering portion on the top surface of the housing, so that the protection pad is attached to the housing and the keyboard module through the gluing layer.

[0017] In an embodiment of the present invention, the above-mentioned adjustment of the positions of these pad printing heads of the pad printing module is based on the distribution positions of these accommodating grooves of the protection pad and the depth of each accommodating groove.

[0018] In an embodiment of the present invention, these pad printing heads of the pad printing module are moved and adjusted along the first axial direction or the second axial direction according to the distribution position of the protection pad, and these pad printing heads of the pad printing module are moved and adjusted along the third axial direction according to the depth of each accommodating groove of the protection pad. The first axial direction, the second axial direction and the third axial direction are not parallel to each other.

[0019] In one embodiment of the present invention, the adhesive layer is formed on the pad printing heads of the pad printing module by applying glue or dipping glue.

[0020] To achieve one, part, or all of the above-mentioned purposes or other purposes, the present invention also provides an electronic computer, including a housing and an input device. The housing has a top surface and a frame recessed inward from the top surface. The input device includes a keyboard module, a protective pad, and an adhesive layer. The keyboard module is disposed in the frame, and the keyboard module includes a plurality of key structures. The protective pad includes a first covering portion and a second covering portion, the first covering portion covering the keyboard module, and the second covering portion covering the top surface of the housing. The first covering portion includes a plurality of accommodating grooves for accommodating these key structures, each accommodating groove including a top wall and a surrounding wall extending downward from the periphery of the top wall, the top wall having a first surface opposite to the keyboard module, the second covering portion having a second surface opposite to the housing, the first surface having a first adhesive region, and the second surface having a second adhesive region. The adhesive layer is disposed on the first surface and the second surface and is located within the first adhesive region and the second adhesive region. The protective pad is attached to the housing and the keyboard module via the adhesive layer.

[0021] The input device of the embodiment of the present invention uses a pad printing module to pad print the adhesive layer on a specific position of the protective pad and defines a first adhesive area and a second adhesive area. Since the first adhesive area is only located on the first surface (first covering portion) of the top wall of the accommodating groove, and the surrounding wall of the accommodating groove is a non-adhesive area, when the protective pad is attached to the shell and the keyboard module through the adhesive layer, only the upper surface of the key structure of the keyboard module is glued to the protective pad, and there is no adhesive layer around the key structure (such as the skirt of the key structure), thereby ensuring that the key structure will not be affected by the adhesive layer during the process of being pressed and moved, and has a better feel when used. Furthermore, the input device manufacturing method of the embodiment of the present invention can adjust the position of the pad printing rubber heads of the pad printing module according to the distribution position of the accommodating grooves of the protective pad and the depth of each accommodating groove, so that the pad printing module can accurately and evenly pad print the adhesive layer on the specific position of the protective pad, effectively simplifying the manufacturing process and reducing the manufacturing cost.

[0022] In order to make the above and other objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The figure is a schematic diagram of the appearance structure of an electronic computer according to one embodiment of the present invention.

[0024] Figure 2 for Figure 1 Schematic diagram of the exploded components of the input device shown.

[0025] Figure 3 The bottom view schematic diagram of the protection pad shown Figure 2 in

[0026] Figure 4 along Figure 2 the sectional view schematic diagram of the AA line segment shown

[0027] Figure 5 The bottom view schematic diagram of the pad printing module according to an embodiment of the present invention

[0028] Figure 6 is Figure 5 the schematic diagram of the actuation mode of the pad printing module shown

[0029] Figure 7 is Figure 5 the schematic diagram of another actuation mode of the pad printing module shown

[0030] Figure 8 is Figure 5 the schematic diagram of yet another actuation mode of the pad printing module shown

[0031] Figure 9 The schematic diagram of the manufacturing method flow of the input device according to an embodiment of the present invention

[0032] Explanation of reference numerals:

[0033] 1: Electronic computer

[0034] 10: Housing

[0035] 11: Screen

[0036] 12: Processor

[0037] 100: Top surface

[0038] 101: Frame

[0039] 2: Input device

[0040] 21: Keyboard module

[0041] 22: Protection pad

[0042] 23: Glue layer

[0043] 210: Key structure

[0044] 221: First covering part

[0045] 222: Second covering part

[0046] 2100: Upper surface

[0047] 2210: Accommodating groove

[0048] 3: Pad printing module

[0049] 31: Support frame

[0050] 32: Guide rod

[0051] 33: Pad printing rubber head

[0052] 311: First support part

[0053] 312: Second support part

[0054] 3110: First limit opening

[0055] 3120: Second limit opening

[0056] 330: Third limit opening

[0057] A, B: Areas

[0058] A1: First axial direction

[0059] A2: Second axial direction

[0060] A3: Third axial direction

[0061] D1: First side

[0062] D2: Second side

[0063] F1: First surface

[0064] F2: Second surface

[0065] G: Gap

[0066] P1: First rectangular pattern

[0067] P2: Second rectangular pattern

[0068] R1: First gluing area

[0069] R2: Second gluing area

[0070] RP: Reference plane

[0071] S1 to S7: Steps

[0072] W1: Top wall

[0073] W2: Surrounding wall Detailed implementation manners

[0074] Please refer to Figure 1 and Figure 4 , Figure 1 which is a schematic diagram of the external structure of an electronic computer according to an embodiment of the present invention. Figure 2 is Figure 1 a schematic exploded view of the components of the input device shown in the figure. Figure 3is Figure 2 a bottom view schematic diagram of the protective pad shown. Figure 4 is a schematic cross-sectional view along the Figure 2 AA line segment shown. As Figure 1 and Figure 2 shown, the electronic computer 1 of this embodiment is, for example, a notebook computer, but the present invention is not limited thereto. The electronic computer 1 includes a housing 10, a screen 11, a processor 12, and an input device 2. The processor 12 is disposed within the housing 10 and is used to process the electronic signals of the electronic computer 1. The housing 10 has a top surface 100 and a frame 101 that is recessed inward from the top surface 100.

[0075] As Figures 1 to 4 shown, the input device 2 of this embodiment includes a keyboard module 21, a protective pad 22, and an adhesive layer 23. The keyboard module 21 is disposed within the frame 101 of the housing 10 of the electronic computer 1. The keyboard module 21 includes a plurality of key structures 210. In this embodiment, the keyboard module 21 is electrically connected to the processor 12 of the electronic computer 1. These key structures 210 can be classified into general keys, numeric keys, function keys, etc., which are respectively pressed by the user's finger to cause the keyboard module 21 to generate corresponding key input signals to the electronic computer 1, thereby causing the electronic computer 1 to execute corresponding functions. For example, general keys are used to input symbols such as English letters, numeric keys are used to input numbers, and function keys are used to provide various shortcut functions, such as F1 to F12, etc., or multiple keys such as the large and long space bar (Space) or shift key (Shift).

[0076] As Figures 1 to 4As shown, the protective pad 22 of this embodiment includes a first covering portion 221 and a second covering portion 222. The first covering portion 221 of the protective pad 22 covers the keyboard module 21, and the second covering portion 222 covers the top surface 100 of the housing 10. The first covering portion 221 includes a plurality of accommodating grooves 2210 for accommodating these key structures 210 of the keyboard module 21, that is, each accommodating groove 2210 is used to accommodate the corresponding key structure 210, and the configuration of each accommodating groove 2210 will vary with the configuration of the accommodated key structure 210. Each accommodating groove 2210 includes a top wall W1 and a surrounding wall W2 extending downward from the periphery of the top wall W1, and the top wall W1 has a first surface F1 facing the keyboard module 21. The second covering portion 222 of the protective pad 22 has a second surface F2 facing the housing 10, that is, the second surface F2 of the second covering portion 222 and the top surface 100 of the housing 10 face each other. In this embodiment, a first gluing area R1 is provided on the first surface F1 of the top wall W1 of each accommodating groove 2210, and a second gluing area R2 is provided on the second surface F2 of the second covering portion 222. It should be particularly noted that the area of the second gluing area R2 is approximately equal to the area of the second surface F2. In addition, the material of the protective pad 22 of this embodiment is, for example, rubber material, silica gel material or plastic material, but the present invention does not limit the type of material of the protective pad 22.

[0077] As Figure 4 shown, the gluing layer 23 of this embodiment is disposed on the first surface F1 of the top wall W1 of each accommodating groove 2210 and on the second surface F2 of the second covering portion 222, and the gluing layer 23 is located within the first gluing area R1 of the first surface F1 and within the second gluing area R2 of the second surface F2. The protective pad 22 can be attached to the housing 10 and the keyboard module 21 of the electronic computer 1 through the gluing layer 23. After the protective pad 22 is attached to the housing 10 and the keyboard module 21, the protective pad 22 only has the gluing layer 23 at the first gluing area R1 and the second gluing area R2. That is to say, the gluing layer 23 is located between the first surface F1 of the top wall W1 of each accommodating groove 2210 and the upper surface 2100 of the corresponding key structure 210 and between the second surface F2 of the second covering portion 222 and the top surface 100 of the housing 10.

[0078] As Figure 4As shown, the first surface F1 of the top wall W1 of each receiving groove 2210 in this embodiment is orthogonally projected onto a reference plane RP to form a first rectangular pattern P1, and the first bonding region R1 located on the first surface F1 of the top wall W1 of each receiving groove 2210 is orthogonally projected onto the above reference plane RP to form a second rectangular pattern P2. The first rectangular pattern P1 has a plurality of first sides D1 adjacent to each other, and the second rectangular pattern P2 has a plurality of second sides D2 adjacent to each other. These first sides D1 of the first rectangular pattern P1 correspond to the second sides D2 of the second rectangular pattern P2, and there is a gap G between each first side D1 and the corresponding second side D2, that is, there are four gaps G between the first rectangular pattern P1 and the second rectangular pattern P2. The regions of the above gaps G corresponding to the first surface F1 of the top wall W1 of each receiving groove 2210 are non-bonding regions. That is to say, the bonding layer 23 is only disposed on a partial first surface F1 of the top wall W1 of each receiving groove 2210 to form a first bonding region R1, and the partial first surface F1 surrounding the first bonding region R1 does not have the bonding layer 23. The spacing of the above gaps G is greater than 0 mm and less than or equal to 0.2 mm. In this embodiment, the spacing of these gaps G is, for example, 0.2 mm, but the present invention is not limited thereto. In other embodiments, the bonding layer 23 is, for example, disposed on the entire first surface F1 of the top wall W1 of each receiving groove 2210 without the above gaps G.

[0079] It should be specifically noted that the above bonding layer 23 is pad-printed onto the first surface F1 of the top wall W1 of each receiving groove 2210 and the second surface F2 of the second covering portion 222 through a pad-printing module, thereby defining a first bonding region R1 on the first surface F1 of the top wall W1 and defining a second bonding region R2 on the second surface F2 of the second covering portion 222. The detailed structure and operation mode of the above pad-printing module will be described in the following paragraphs.

[0080] As can be seen from the above, since the bonding layer 23 is only disposed on a partial first surface F1 (first bonding region R1) of the top wall W1 of each receiving groove 2210 and the second surface F2 of the second covering portion 222, when the protective pad 22 is attached to the housing 10 of the electronic computer 1 and the keyboard module 21 through the bonding layer 23, only the upper surface 2100 of each key structure 210 of the keyboard module 21 contacts the bonding layer 23, and there is no bonding layer 23 in other parts of the keyboard module 21. Therefore, during the process of pressing and moving each key structure 210, it will not be affected by the bonding layer 23 and has a better use feel.

[0081] Please refer to Figures 5 to 8 , Figure 5 which is a bottom view schematic diagram of a pad-printing module according to an embodiment of the present invention. Figure 6 isFigure 5 Schematic diagram of the actuation mode of the pad printing module shown Figure 7 is Figure 5 Another schematic diagram of the actuation mode of the pad printing module shown Figure 8 is Figure 5 Another schematic diagram of the actuation mode of the pad printing module shown. It should be noted in particular that Figures 6 to 8 only shows Figure 5 the schematic of the actuation of only a part of the structure of the pad printing module shown

[0082] As Figures 5 to 8 shown, the pad printing module 3 of this embodiment includes a support frame 31, at least one guide rod 32, and a plurality of pad printing heads 33. In this embodiment, the pad printing module 3 has a plurality of guide rods 32, and these guide rods 32 are movably arranged on the support frame 31. A plurality of pad printing heads 33 are arranged on each guide rod 32, and these pad printing heads 33 are movably arranged on each guide rod 32. It should be noted in particular that the present invention does not limit the number of the guide rods 32 and the pad printing heads 33, and the number of the guide rods 32 and the pad printing heads 33 can be increased or decreased according to the actual requirements

[0083] As Figures 5 to 8 shown, the support frame 31 of the pad printing module 3 of this embodiment includes a first support portion 311 and a second support portion 312 which are arranged opposite to each other. The first support portion 311 of the support frame 31 has a first limit opening 3110, the second support portion 312 has a second limit opening 3120, and each pad printing head 33 has a third limit opening 330. In this embodiment, the first limit opening 3110 of the first support portion 311 and the second limit opening 3120 of the second support portion 312 respectively extend along the first axial direction A1, the third limit opening 330 of each pad printing head 33 extends along the third axial direction A3, each guide rod 32 extends along the second axial direction A2 and passes through the first limit opening 3110, the second limit opening 3120, and the third limit opening 330, and these pad printing heads 33 are located between the first support portion 311 and the second support portion 312

[0084] As Figure 6 shown, each guide rod 32 of this embodiment can move relative to the support frame 31 along the first axial direction A1, and thus simultaneously drive these pad printing heads 33 arranged on these guide rods 32 to move along the first axial direction A1. As Figure 7 shown, each pad printing head 33 can move relative to the guide rod 32 along the second axial direction A2. As Figure 8As shown, each pad printing head 33 can move relative to the guide rod 32 along the third axial direction A3. In this embodiment, the first axial direction A1, the second axial direction A2, and the third axial direction A3 are, for example, perpendicular to each other. That is to say, each guide rod 32 can move back and forth relative to the support frame 31 along the first axial direction A1, each pad printing head 33 can move left and right relative to the guide rod 32 along the second axial direction A2, and each pad printing head 33 can move up and down relative to the guide rod 32 along the third axial direction A3. It should be particularly noted that in Figures 6 to 8 the guide rod 32 and the pad printing head 33 shown in dashed lines represent the starting positions of the guide rod 32 and the pad printing head 33 before movement.

[0085] As can be seen from the above, under the structural design of the pad printing module 3 in this embodiment, the pad printing module 3 can move and adjust the positions of these pad printing heads 33 according to the distribution positions of these accommodation grooves 2210 of the protection pad 22 and the depth of each accommodation groove 2210. For example, according to the distribution positions of these accommodation grooves 2210 of the protection pad 22, these pad printing heads 33 are adjusted to move along the first axial direction A1 or the second axial direction A2, and according to the depth of each accommodation groove 2210 of the protection pad 22, these pad printing heads 33 are adjusted to move along the third axial direction A3.

[0086] As Figure 5 shown, and please also refer to Figure 3 and Figure 4 . These pad printing heads 33 in this embodiment respectively have pad printing surfaces 331 for the adhesive layer 23 to adhere to. For example, the adhesive layer 23 is adhered to these pad printing surfaces 331 by means of brushing glue or dipping glue. In this embodiment, the object positions to be pad printed and glued by these pad printing heads 33 in area A are the first covering part 221 of the protection pad 22, that is, the first surface F1 of the top wall W1 of each accommodation groove 2210, and the object positions to be pad printed and glued by these pad printing heads 33 in area B are the second covering part 222 of the protection pad 22, that is, the second surface F2 of the second covering part 222. The areas of the pad printing surfaces 331 of these pad printing heads 33 are different according to the different objects to be pad printed and glued. The areas of the pad printing surfaces 331 of these pad printing heads 33 in area A can vary according to the area size of the first surface F of the top wall W1 of each accommodation groove 2210, and the pad printing surfaces 331 of these pad printing heads 33 in area B can vary according to the area size of the second surface F2 of the second covering part 222.

[0087] It should be specifically noted that the first gluing area R1 on the first surface F1 of the top wall W1 of each accommodating groove 2210 is defined by the pad printing surface 331 of the corresponding pad printing head 33 in area A, and the second gluing area R2 on the second surface F2 of the second covering part 222 is defined by the configuration formed by the pad printing surfaces 331 of these pad printing heads 33 in area B. However, the present invention is not limited thereto. In other embodiments, the second gluing area R2 can also be defined on the second surface F2 of the second covering part 222 only by the pad printing surface 331 of a single pad printing head 33.

[0088] Please refer to Figure 9 , which is a schematic flowchart of the manufacturing method of an input device according to an embodiment of the present invention. As Figure 9 shown, and please also refer to Figures 2 to 8 , the manufacturing method of the input device in this embodiment includes the following steps: First, as shown in step S1, a keyboard module 21 is provided. The keyboard module 21 includes a plurality of key structures 210. Then, as shown in step S2, a protective pad 22 is provided. The protective pad 22 includes a first covering part 22 and a second covering part 222. The first covering part 221 includes a plurality of accommodating grooves 2210 for accommodating these key structures 210. Each accommodating groove 2210 includes a top wall W1 and a surrounding wall W2 extending downward from the periphery of the top wall W1. The top wall W1 has a first surface F1 facing the keyboard module 21, and the second covering part has a second surface F2 facing the housing 10. Then, as shown in step S3, a pad printing module 3 is provided. The pad printing module 3 includes a plurality of pad printing heads 33. Then, as shown in step S4, the keyboard module 21 is disposed in the frame 101 of the housing 10. Then, as shown in step S5, the positions of these pad printing heads 33 of the pad printing module 3 are adjusted, that is, the positions of these pad printing heads 33 are moved and adjusted according to the distribution positions of these accommodating grooves 2210 of the protective pad 22 and the depth of each accommodating groove 2210. Then, as shown in step S6, the gluing layer 23 is pad printed on the first surface F1 and the second surface F2 through these pad printing heads 33 of the pad printing module 3, thereby defining a first gluing area R1 on the first surface F1 and a second gluing area R2 on the second surface F2. Then, as shown in step S7, the first covering part 221 of the protective pad 22 is covered on the keyboard module 21 and the second covering part 222 is covered on the top surface 100 of the housing 10, so that the protective pad 22 is attached to the housing 10 and the keyboard module 21 through the gluing layer 23.

[0089] In summary, for the input device according to the embodiment of the present invention, the pad printing module transfers the glue layer to a specific position on the protection pad and defines the first glue area and the second glue area. Since the first glue area is only located on the first surface (the first covering part) of the top wall of the accommodating groove, and the surrounding wall of the accommodating groove is a non-glued area, when the protection pad is attached to the housing and the keyboard module through the glue layer, only the upper surface of the key structure of the keyboard module is glued to the protection pad, and there is no glue layer around the key structure (such as the skirt of the key structure). Therefore, during the process of pressing and moving the key structure, it will not be affected by the glue layer and has a better tactile feeling. Furthermore, for the manufacturing method of the input device according to the embodiment of the present invention, the positions of the pad printing heads of the pad printing module can be adjusted according to the distribution positions of these accommodating grooves on the protection pad and the depth of each accommodating groove, so that the pad printing module can accurately and uniformly transfer the glue layer to the specific position on the protection pad, effectively simplifying the manufacturing process and reducing the manufacturing cost.

[0090] The above are only the preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited thereby. That is, all simple equivalent changes and modifications made according to the claims of the present invention and the content of the invention description still fall within the scope covered by the patent of the present invention. In addition, any embodiment or claim of the present invention does not have to achieve all the purposes or advantages or features disclosed by the present invention. In addition, the abstract part and the title are only used to assist in the search of patent documents and are not used to limit the claims of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limits of the number of elements.

Claims

1. An input device is applied to an electronic computer. The electronic computer includes a housing having a top surface and a frame recessed inward from the top surface. The input device includes: A keyboard module configured within the frame. The keyboard module includes a plurality of key structures; A protective pad including a first covering portion and a second covering portion. The first covering portion covers the keyboard module, and the second covering portion covers the top surface of the housing. The first covering portion includes a plurality of accommodating grooves for accommodating the plurality of key structures. Each accommodating groove includes a top wall and a surrounding wall extending downward from the periphery of the top wall. The top wall has a first surface facing the keyboard module, and the second covering portion has a second surface facing the housing. Wherein the first surface has a first bonding area, and the second surface has a second bonding area; and An adhesive layer is disposed on the first surface and the second surface and within the first bonding area and the second bonding area. The protective pad is attached to the housing and the keyboard module through the adhesive layer. Wherein the adhesive layer is pad-printed on the first surface and the second surface through a pad-printing module, thereby defining the first bonding area on the first surface and the second bonding area on the second surface. Wherein the pad-printing module includes: A support frame; At least one guide rod movably disposed on the support frame; and A plurality of pad-printing rubber heads movably disposed on the at least one guide rod; Wherein the at least one guide rod moves along a first axial direction relative to the support frame and simultaneously drives the plurality of pad-printing rubber heads to move along the first axial direction, and each pad-printing rubber head moves along a second axial direction or a third axial direction relative to the at least one guide rod. The first axial direction, the second axial direction, and the third axial direction are not parallel to each other.

2. The input device according to claim 1, wherein a first rectangular pattern is formed on a reference plane by the orthographic projection of the first surface of the top wall of each accommodating groove, and a second rectangular pattern is formed on the reference plane by the orthographic projection of the first bonding area. The first rectangular pattern has a plurality of first sides, and the second rectangular pattern has a plurality of second sides. The plurality of first sides correspond to the plurality of second sides, and there is a gap between each first side and the corresponding second side.

3. The input device according to claim 2, wherein the spacing of the gaps is greater than 0 mm and less than or equal to 0.2 mm.

4. The input device according to claim 1, wherein the support frame includes a first support portion and a second support portion disposed opposite to each other. The first support portion has a first limiting opening, and the second support portion has a second limiting opening. Each pad-printing rubber head has a third limiting opening. The first limiting opening and the second limiting opening extend along the first axial direction respectively, and the third limiting opening extends along the third axial direction. The at least one guide rod extends along the second axial direction and passes through the first limiting opening, the second limiting opening, and the third limiting opening. The plurality of pad-printing rubber heads are located between the first support portion and the second support portion.

5. The input device as claimed in claim 1, wherein the plurality of pad printing heads respectively have a pad printing surface for the adhesive layer to adhere to.

6. The input device as claimed in claim 1, wherein the material of the protection pad includes a rubber material, a silica gel material or a plastic material.

7. A manufacturing method of an input device, the input device being applied to an electronic computer, the electronic computer including a housing having a top surface and a frame recessed inward from the top surface, the manufacturing method of the input device comprising the following steps: Providing a keyboard module, the keyboard module including a plurality of key structures; Providing a protection pad, the protection pad including a first covering portion and a second covering portion, the first covering portion including a plurality of receiving grooves for receiving the plurality of key structures, each receiving groove including a top wall and a surrounding wall extending downward from the periphery of the top wall, the top wall having a first surface facing the keyboard module, and the second covering portion having a second surface facing the housing; Providing a pad printing module, the pad printing module including a plurality of pad printing heads; Disposing the keyboard module in the frame of the housing; Adjusting the positions of the plurality of pad printing heads of the pad printing module; Transferring an adhesive layer onto the first surface and the second surface through the plurality of pad printing heads of the pad printing module, thereby defining a first adhesive area on the first surface and a second adhesive area on the second surface; And Covering the first covering portion of the protection pad on the keyboard module and the second covering portion on the top surface of the housing, such that the protection pad adheres to the housing and the keyboard module through the adhesive layer.

8. The manufacturing method of the input device as claimed in claim 7, wherein adjusting the positions of the plurality of pad printing heads of the pad printing module is based on the distribution positions of the plurality of receiving grooves of the protection pad and the depth of each receiving groove.

9. The manufacturing method of the input device as claimed in claim 8, wherein the plurality of pad printing heads of the pad printing module are moved and adjusted along a first axial direction or a second axial direction according to the distribution position of the protection pad, and the plurality of pad printing heads of the pad printing module are moved and adjusted along a third axial direction according to the depth of each receiving groove of the protection pad, and the first axial direction, the second axial direction and the third axial direction are not parallel to each other.

10. The manufacturing method of the input device as claimed in claim 7, wherein the adhesive layer is formed on the plurality of pad printing heads of the pad printing module by a brushing method or a dipping method.

11. An electronic computer, comprising: A housing having a top surface and a frame recessed inward from the top surface; And An input device, comprising: A keyboard module disposed in the frame, the keyboard module including a plurality of key structures; A protective pad includes a first covering portion and a second covering portion. The first covering portion covers the keyboard module, and the second covering portion covers the top surface of the housing. The first covering portion includes a plurality of receiving grooves for receiving the plurality of key structures. Each receiving groove includes a top wall and a surrounding wall extending downward from the periphery of the top wall. The top wall has a first surface facing the keyboard module, and the second covering portion has a second surface facing the housing. Wherein the first surface has a first gluing area, and the second surface has a second gluing area; and A gluing layer is disposed on the first surface and the second surface and within the first gluing area and the second gluing area. The protective pad is attached to the housing and the keyboard module through the gluing layer. Wherein the gluing layer is pad-printed on the first surface and the second surface through a pad-printing module, thereby defining the first gluing area on the first surface and the second gluing area on the second surface. Wherein the pad-printing module includes: A support frame; At least one guide rod movably disposed on the support frame; and A plurality of pad-printing heads movably disposed on the at least one guide rod; Wherein the at least one guide rod moves relative to the support frame along a first axial direction, and simultaneously drives the plurality of pad-printing heads to move along the first axial direction, and each pad-printing head moves relative to the at least one guide rod along a second axial direction or a third axial direction. The first axial direction, the second axial direction and the third axial direction are not parallel to each other.

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