Display panel and display device
By setting a metal structure with an increased height in the non-display area of the OLED display panel, a larger capacitance is formed to store electrostatic charge, which solves the problem of electrostatic release damage to the substrate in the evaporation process and improves the packaging reliability.
Patent Information
- Application Number
- CN202210752347.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-28
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2042-06-28
AI Technical Summary
In the evaporation process of OLED display panels, the problem of electrostatic release damages the substrate, resulting in a reduction in packaging reliability.
A metal structure is provided in the non-display area of the display panel, and by increasing the height of most of the metal structures, the vertical distance between it and the mask plate is reduced, thereby forming a larger capacitance to store electrostatic charges and reducing the risk of electrostatic release.
By increasing the amount of stored charge of the capacitor, the risk of static electricity is reduced, the metal structure is prevented from being damaged by electrostatic damage, and cracks are avoided to extend to the display area, thereby improving packaging reliability.
Smart Images

Figure CN115101567B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of display technologies, and particularly to a display panel and a display device. Background Art
[0002] Organic Light-Emitting Diode (OLED) has many advantages such as self-luminescence, fast response time, wide viewing angle, low cost, simple manufacturing process, good resolution, and high brightness, and can meet the new requirements of consumers for display products. In the manufacturing process of an OLED display panel, the evaporation process is a very important and key technology. This process usually uses a mask plate as a mold. For example, after the organic material volatilizes at high temperature, it deposits on the substrate through the hollow mask pattern on the mask plate in the form of material molecules to form the required pattern, which serves as the organic light-emitting layer in the OLED. There is a problem in the prior art that the substrate is damaged by electrostatic discharge during the evaporation process. Summary of the Invention
[0003] Embodiments of the present invention provide a display panel and a display device to solve the problem that the substrate is damaged by electrostatic discharge during the evaporation process.
[0004] In a first aspect, an embodiment of the present invention provides a display panel, including: The display panel includes a display area and a non-display area;
[0005] The display panel includes a substrate, a metal structure on one side of the substrate, and a first insulating layer. The metal structure and the first insulating layer are located in the non-display area, and the first insulating layer is located on the side of the metal structure away from the substrate;
[0006] The first insulating layer has a hollow area that penetrates the first insulating layer in a direction perpendicular to the plane where the substrate is located; the metal structure includes a first part and a second part that are connected to each other; in a direction perpendicular to the plane where the substrate is located, the first part overlaps with the hollow area, and the second part overlaps with the first insulating layer; wherein,
[0007] In a direction perpendicular to the plane where the substrate is located, the maximum distance from the surface of at least part of the first part away from the substrate to the substrate is a first distance, and the maximum distance from the surface of the second part away from the substrate to the substrate is a second distance, and the first distance is greater than the second distance.
[0008] In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including the display panel provided in any embodiment of the present invention.
[0009] The display panel and the display device provided by the embodiments of the present invention have the following beneficial effects: The non-display area includes a metal structure. The first part of the metal structure is exposed by the hollow area of the first insulating layer, and the second part of the metal structure is covered by the first insulating layer. It is set that the vertical distance from the surface of at least part of the first part away from the substrate to the substrate is greater than the vertical distance from the surface of the second part away from the substrate to the substrate, which is equivalent to increasing the height of part of the first part. In the evaporation process of manufacturing the display panel, the mask plate is attached to the panel to be evaporated. Since the height of at least part of the first part is increased, for example, the vertical distance between this part of the first part and the mask plate can be made smaller, and the capacitance formed by the overlap of the mask plate and the metal structure becomes larger. When the capacitance formed between the mask plate and the metal structure becomes larger, the amount of charge that the capacitance can store becomes more. The charge generated during the attachment and separation of the mask plate and the panel to be evaporated will be stored in the large capacitance, thereby reducing the risk of electrostatic discharge and preventing the metal structure from being damaged by electrostatic discharge. It is also possible to avoid the extension of cracks generated due to damage of the metal structure into the display area, thereby improving the packaging reliability. Description of the Drawings
[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0011] Figure 1 Schematic diagram of a display panel provided by an embodiment of the present invention;
[0012] Figure 2 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0013] Figure 3 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0014] Figure 4 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0015] Figure 5 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0016] Figure 6 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0017] Figure 7 Top view schematic of the cushion structure in another display panel provided by an embodiment of the present invention;
[0018] Figure 8Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0019] Figure 9 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0020] Figure 10 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0021] Figure 11 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0022] Figure 12 Another top - view schematic diagram of a cushion structure in a display panel provided by an embodiment of the present invention;
[0023] Figure 13 Another top - view schematic diagram of a display panel provided by an embodiment of the present invention;
[0024] Figure 14 Another top - view schematic diagram of a display panel provided by an embodiment of the present invention;
[0025] Figure 15 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0026] Figure 16 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0027] Figure 17 Another schematic diagram of a display panel provided by an embodiment of the present invention;
[0028] Figure 18 Schematic diagram of a display device provided by an embodiment of the present invention. Detailed implementation manners
[0029] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0030] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.
[0031] Various modifications and variations can be made to the present invention without departing from the spirit or scope thereof, which will be apparent to those skilled in the art. Accordingly, the present invention is intended to cover modifications and variations of the present invention that fall within the scope of the corresponding claims (claimed technical solutions) and their equivalents.
[0032] It should be noted that the embodiments provided in the embodiments of the present invention can be combined with each other without conflict.
[0033] In the process of vapor-depositing an organic layer, a mask plate is attached to a substrate to be vapor-deposited. After the vapor-deposition process, the mask plate needs to be separated from the substrate, and static electricity is easily generated when the mask plate is separated from the substrate. When manufacturing a panel, the number of film layers that need to be vapor-deposited on the substrate is about 10 or more. After each vapor-deposition, the mask plate and the substrate go through a separation process. The continuous attachment and separation process of the mask plate and the substrate causes static charges to accumulate continuously. When the charges accumulate to a certain amount, static electricity discharge will occur between the mask plate and the substrate, causing damage to the product.
[0034] The inventor considered that there is an electrode contact area in the non-display area, and a metal structure is provided in the electrode contact area. The metal structure can be used as a power supply structure for a common electrode, and the common electrode extending from the display area to the non-display area is in contact with the metal structure. The metal structure in the electrode contact area is usually arranged along the direction of surrounding the display area, and the area of the metal structure is relatively large. When the mask plate is attached to the substrate, a capacitor is formed when the metal structure overlaps with the mask plate. If a large amount of static charges accumulated during the continuous attachment and separation process of the mask plate and the substrate are discharged statically in the overlapping area between the metal structure and the mask plate, the metal structure in the non-display area will be severely damaged. After the metal structure in the non-display area is damaged, cracks will occur. If the cracks extend from the non-display area to the display area, the packaging reliability will become poor, seriously affecting the service life of the display panel. Therefore, how to prevent the static electricity discharge in the vapor-deposition process from damaging the film layer structure in the non-display area to improve the packaging reliability is an urgent problem to be solved at present.
[0035] To solve the problems existing in the related art, an embodiment of the present invention provides a display panel, which improves the film layer structure in the non-display area and increases the height of the metal structure at some positions. Then, in the vapor-deposition process, the vertical distance between the metal structure at the higher position and the mask plate becomes smaller, so that the amount of charge that can be stored between the two becomes more or the static electricity can be dissipated quickly, reducing the risk of static electricity discharge, preventing cracks from occurring after the metal structure is damaged, and thus improving the packaging reliability.
[0036] Figure 1 A schematic diagram of a display panel provided by an embodiment of the present invention is as Figure 1 shown, the display panel includes a display area AA and a non-display area NA.
[0037] The display panel includes a substrate 10, a metal structure 20 on one side of the substrate 10, and a first insulating layer 30. The metal structure 20 and the first insulating layer 30 are located in the non-display area, and the first insulating layer 30 is located on the side of the metal structure 20 away from the substrate 10.
[0038] The first insulating layer 30 has a hollowed-out area K. In the direction e perpendicular to the plane of the substrate 10, the hollowed-out area K penetrates through the first insulating layer 30. The metal structure 20 includes a first part 21 and a second part 22 that are interconnected. In the direction e perpendicular to the plane of the substrate 10, the first part 21 overlaps with the hollowed-out area K, and the second part 22 overlaps with the first insulating layer 30. In other words, the hollowed-out area K exposes the first part 21, and the second part 22 is covered by the first insulating layer 30. Among them,
[0039] In the direction e perpendicular to the plane of the substrate 10, the maximum distance from the surface on the side of at least part of the first part 21 away from the substrate 10 to the substrate 10 is a first distance h1, and the maximum distance from the surface on the side of the second part 22 away from the substrate 10 to the substrate 10 is a second distance h2. The first distance h1 is greater than the second distance h2. In other words, the vertical distance from the surface on the side of at least part of the first part 21 away from the substrate 10 to the substrate 10 is greater than the vertical distance from the surface on the side of the second part 22 away from the substrate 10 to the substrate 10. In other words, taking the plane of the substrate 10 as the reference plane, the height of at least part of the first part 21 relative to the substrate 10 is greater than the height of the second part 22 relative to the substrate 10.
[0040] In the display panel provided by the embodiment of the present invention, the non-display area NA includes the metal structure 20. The first part 21 of the metal structure 20 is exposed by the hollowed-out area K of the first insulating layer 30, and the second part 22 of the metal structure 20 is covered by the first insulating layer 30. The vertical distance from the surface on the side of at least part of the first part 21 away from the substrate 10 to the substrate 10 is set to be greater than the vertical distance from the surface on the side of the second part 22 away from the substrate 10 to the substrate 10, which is equivalent to increasing the height of part of the first part 21. In the evaporation process of manufacturing the display panel, the mask plate is attached to the panel to be evaporated. Since the height of at least part of the first part 21 is increased, for example, the vertical distance between this part of the first part 21 and the mask plate can be made smaller, and the capacitance formed by the overlap of the mask plate and the metal structure 20 becomes larger. When the capacitance formed between the mask plate and the metal structure 20 becomes larger, the amount of charge that the capacitance can store becomes more. The charge generated during the attachment and separation of the mask plate and the panel to be evaporated will be stored in the large capacitance, thereby reducing the risk of electrostatic discharge and preventing the metal structure 20 from being damaged by electrostatic discharge. It is also possible to avoid the crack of the metal structure 20 extending into the display area AA due to being damaged, thereby improving the packaging reliability.
[0041] In some embodiments,Figure 2 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown as Figure 2 shown. The display area AA includes a light-emitting device 40 and a pixel defining layer 50 on one side of the substrate 10. The pixel defining layer 50 is used to separate adjacent light-emitting devices 40. The light-emitting device 40 includes a stacked first electrode 41, a light-emitting layer 42, and a second electrode 43. The second electrodes 43 of multiple light-emitting devices 40 are interconnected to form a common electrode 43C; the common electrode 43C extends from the display area AA to the non-display area NA, and the common electrode 43C contacts the first branch 21 at the position where the hollow area K is located. Optionally, the first electrode 41 is a reflective anode, the second electrode 43 is a transmissive cathode, and the light-emitting layer 42 at least includes a light-emitting material layer. In this embodiment, the area where the metal structure 20 is located is an electrode contact area, and the common electrode 43C contacts the metal structure 20 within the electrode contact area. The metal structure 20 located in the non-display area NA can serve as a power supply structure for the common electrode 43C. By arranging the metal structure 20 along the direction surrounding the display area AA, the uniformity of the voltage signals on the second electrode 43 at each position within the display area AA can be improved.
[0042] Optionally, the common electrode 43C is fabricated by a sputtering process, and the organic layer in the light-emitting device 40 is fabricated by an evaporation process before the process of the common electrode 43C. The organic layer fabricated by the evaporation process at least includes a light-emitting material layer, a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, etc. Therefore, in the evaporation process, the common electrode 43C has not covered the position of the hollow area K of the first insulating layer 30 in the non-display area NA, so the hollow area K of the first insulating layer 30 faces the non-opening area on the mask plate during the evaporation process. The mask plate is made of a metal material. At this time, the mask plate overlaps with the exposed first branch 21 of the hollow area K, and static electricity release is likely to occur and damage the first branch 21. With the design of the embodiment of the present invention, the height of at least part of the first branch 21 is increased, so that when the hollow area K of the first insulating layer 30 faces the non-opening area on the mask plate, the vertical distance between the first branch 21 and the mask plate becomes smaller, thereby increasing the capacitance formed between the two, and thus being able to reduce the risk of static electricity release and prevent the metal structure 20 from being damaged by static electricity release. It is also possible to avoid the crack of the metal structure 20 due to damage from extending into the display area AA, thereby improving the packaging reliability.
[0043] Among them, the metal structure 20 is disposed on the same layer as the first electrode 41. That is to say, the metal structure 20 and the first electrode 41 are made of the same material, and the metal structure 20 and the first electrode 41 are fabricated in the same process.
[0044] In some embodiments, the material of the first insulating layer 30 is an organic material. Optionally, the material of the first insulating layer 30 is the same as that of the pixel defining layer 50. The first insulating layer 30 and the pixel defining layer 50 are disposed on the same layer.
[0045] In some embodiments, Figure 3 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown in Figure 3 As shown, in the direction e perpendicular to the plane of the substrate 10, the maximum distance from the surface of the first insulating layer 30 on the side away from the substrate 10 to the substrate 10 is the third distance h3; wherein, the first distance h1 is greater than the third distance h3. That is to say, taking the plane of the substrate 10 as the reference plane, at least part of the height of the first branch 21 is higher than the height of the first insulating layer 30. In some embodiments, the vertical distance between at least part of the first branch 21 and the mask plate in the evaporation process can be reduced, so that the capacitance formed by the overlap of the mask plate and the metal structure 20 becomes larger, so that the amount of charge that the capacitance can store becomes more, the risk of electrostatic discharge can be reduced, and the metal structure 20 can be prevented from being damaged by electrostatic discharge.
[0046] In other embodiments, after the height of part of the first branch 21 is increased, in the evaporation process, the part of the first branch 21 with a larger height can contact the mask plate, while the first insulating layer 30 with a smaller height will not contact the mask plate. At this time, the metal film layer in the display panel contacts the mask plate made of metal material. On the one hand, the contact area between the non-metal film layer in the panel to be evaporated and the mask plate can be reduced, and the static electricity generated by the separation of the mask plate and the panel to be evaporated can be reduced. On the other hand, the first branch 21 with a larger height contacts the mask plate, and the static electricity on the metal structure 20 can be introduced onto the mask plate through the first branch 21 in contact with the mask plate, so as to conduct away the static electricity on the panel and prevent a large amount of static electricity charges from accumulating on the panel. In this way, the risk of electrostatic discharge in the evaporation process can also be reduced.
[0047] In some embodiments, Figure 4 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown in Figure 4 As shown, the non-display area NA includes a first support pillar 61. The first support pillar 61 is located on the side of the first insulating layer 30 away from the substrate 10, and the first support pillar 61 is in contact with the first insulating layer 30. When manufacturing the display panel provided by this embodiment, the first support pillar 61 in the non-display area NA in the evaporation process can be used to support the mask plate. In this way, the contact area between the mask plate and the non-display area NA of the panel to be evaporated in the evaporation process can be reduced, and the static electricity generated by the contact friction and separation of the mask plate and the panel to be evaporated can be reduced. That is, the amount of electric charge accumulated during the multiple lamination and separation processes of the mask plate and the panel to be evaporated can be reduced, so that the risk of electrostatic discharge can be reduced, and the metal structure 20 can be prevented from being damaged by electrostatic discharge.
[0048] In some embodiments, Figure 5 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown in Figure 5As shown, the display area AA includes a pixel defining layer 50 on one side of the substrate 10 and a second support pillar 62, and the second support pillar 62 is located on the side of the pixel defining layer 50 away from the substrate 10; in the direction e perpendicular to the plane of the substrate 10, the height h4 of the first support pillar 61 is less than the height h5 of the second support pillar 62. From Figure 5 It can be seen that the common electrode 43C is located on the side of the support pillar away from the substrate 10, that is, the manufacturing process of the common electrode 43C is after the manufacturing processes of the first support pillar 61 and the second support pillar 62. Optionally, the first support pillar 61 and the second support pillar 62 are made of the same material. During manufacturing, support pillars with the same height are first fabricated, and then the support pillars in the non-display area NA are thinned to form the first support pillar 61 with a smaller height. In the process of vapor-depositing the organic layer, the second support pillar 62 supports the mask plate opposite to the display area AA, which can ensure the uniformity of vapor-depositing the organic material in the display area AA. In the vapor-deposition process, the first support pillar 61 supports the mask plate opposite to the non-display area NA, which can reduce the contact area between the mask plate and the non-display area NA of the panel to be vapor-deposited, reduce the static electricity generated by the contact friction separation between the mask plate and the panel to be vapor-deposited, and thus reduce the amount of electric charge accumulated during multiple processes of fitting and separating the mask plate and the panel to be vapor-deposited, thereby reducing the risk of static electricity release.
[0049] In some embodiments, the support pillars in the non-display area NA are thinned to form the first support pillar 61 with a smaller height, which can reduce the height difference between the first part 21 with an increased height and the first support pillar 61, and is conducive to realizing the design that the first part 21 with an increased height is basically equal in height to the first support pillar 61.
[0050] In some embodiments, the vertical distance from the surface of at least part of the first part 21 on the side away from the substrate 10 to the substrate 10 is equal to the vertical distance from the surface of the first support pillar 61 on the side away from the substrate 10 to the substrate 10, so that at least part of the first part 21 can be in contact with the mask plate during the vapor-deposition process. On the one hand, it can reduce the contact area between the non-metal film layer in the panel to be vapor-deposited and the mask plate, and reduce the static electricity generated by the separation of the mask plate and the panel to be vapor-deposited. On the other hand, the static electricity on the metal structure 20 can be conducted to the mask plate through the first part 21 in contact with the mask plate, thereby conducting away the static electricity on the panel and preventing a large amount of static charge from accumulating on the panel. In this way, the risk of static electricity release during the vapor-deposition process can also be reduced.
[0051] In some embodiments, Figure 6 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown in Figure 6As shown, the non-display area NA further includes a cushion layer structure 70, and the cushion layer structure 70 is located between the substrate 10 and the metal structure 20; along the direction e perpendicular to the plane where the substrate 10 is located, at least a part of the first branch 21 overlaps with the cushion layer structure 70, and the orthographic projection of this part of the first branch 21 on the substrate 10 covers the orthographic projection of the cushion layer structure 70 on the substrate 10. The cushion layer structure 70 overlapping with the first branch 21 can raise the first branch 21 to increase the vertical distance from the surface on the side of the first branch 21 away from the substrate 10 to the substrate 10. The setting of the cushion layer structure 70 makes the vertical distance between the first branch 21 overlapping with it and the mask plate smaller during the evaporation process, so that the capacitance formed by the overlap of the mask plate and the metal structure 20 becomes larger, and thus the amount of charge that the capacitance can store becomes more, which can reduce the risk of electrostatic discharge and prevent the metal structure 20 from being damaged by electrostatic discharge.
[0052] As Figure 6 shown, along the direction e perpendicular to the plane where the substrate 10 is located, the cushion layer structure 70 does not overlap with the first insulating layer 30. Such a setting can utilize the cushion layer structure 70 to only raise the first branch 21 and prevent the cushion layer structure 70 from raising part of the first insulating layer 30.
[0053] In some embodiments, as Figure 6 shown, the minimum length of the cushion layer structure 70 in the first direction x is d1, where the first direction x is parallel to the plane where the substrate 10 is located, and d1 > 5 μm. The display panel includes an array layer, the array layer is located between the substrate 10 and the light-emitting device, the array layer includes a stacked metal layer and an insulating layer, and metal lines are provided in the array layer. The line width of the metal lines is generally 3 - 5 μm. In the embodiment of the present invention, the length of the cushion layer structure 70 in the first direction x is greater than the line width of the conventional metal lines. Figure 7 This is a top view schematic diagram of the cushion layer structure in another display panel provided by the embodiment of the present invention. Figure 7 The first direction x and the second direction y perpendicular to each other are schematically shown. As Figure 7 shown, the minimum length of the cushion layer structure 70 in the first direction x is d1, and the minimum length of the cushion layer structure 70 in the second direction y is d2. The first direction x and the second direction y are both parallel to the plane where the substrate 10 is located; wherein, d1 > 5 μm, d2 > 5 μm. It can be understood that the length of the cushion layer structure 70 in any direction parallel to the plane where the substrate 10 is located is not less than 5 μm. Compared with the conventional metal lines in the display panel, the cushion layer structure 70 can be considered as a block structure with a certain area and relatively large size. The cushion layer structure 70 is not easily planarized by the film layers in the array layer, so that the cushion layer structure 70 can be used to raise the first branch 21.
[0054] In some embodiments, d1 ≥ 10 μm, d2 ≥ 10 μm, then the area of the cushion layer structure 70 is at least 100 μm2 In this embodiment, the cushion layer structure 70 has a relatively large area. Neither the inorganic layer nor the organic layer formed after the process of the cushion layer structure 70 can planarize the cushion layer structure 70. The cushion layer structure 70 causes a convex structure to be formed in the region where it is located. When the first part 21 is stacked on the side of the cushion layer structure 70 away from the substrate 10, the height of the first part 21 can be raised, so that the vertical distance from the surface of the first part 21 on the side away from the substrate 10 to the substrate 10 is greater than the vertical distance from the surface of the second part 22 on the side away from the substrate 10 to the substrate 10.
[0055] In some embodiments, Figure 8 Another schematic diagram of a display panel provided by an embodiment of the present invention is shown in Figure 8 As shown, the display panel includes a semiconductor layer 11, a first metal layer 12, a second metal layer 13, and a third metal layer 14 on one side of the substrate 10. Insulating layers are provided between the semiconductor layer 11 and the first metal layer 12, and between other adjacent metal layers. The display panel includes an array layer 80 on one side of the substrate 10. The array layer 80 includes pixel circuits. The pixel circuits include transistors T and storage capacitors Cst. Among them, the active layer of the transistor T is located in the semiconductor layer 11, the gate of the transistor T is located in the first metal layer 12, and the source and drain of the transistor are located in the third metal layer 14. One plate of the storage capacitor Cst is located in the first metal layer 12, and the other plate is located in the second metal layer 13. The display panel includes at least data lines, scan lines, light emission control lines, reset signal lines, and power supply signal lines. The data lines, scan lines, light emission control lines, reset signal lines, and power supply signal lines are respectively provided in the first metal layer 12, the second metal layer 13, and the third metal layer 14.
[0056] As shown in Figure 8 The insulating layer between the semiconductor layer 11 and the first metal layer 12, the insulating layer between the first metal layer 12 and the second metal layer 13, and the insulating layer between the second metal layer 13 and the third metal layer 14 include an inorganic insulating layer 16. The insulating layer between the third metal layer 14 and the metal structure 20 includes an organic insulating layer 17. Referring to the relevant descriptions in the above Figure 7 embodiment, in the embodiment of the present invention, the cushion layer structure 70 has a relatively large area, that is, each cushion layer part 70B has a relatively large area. Neither the inorganic layer nor the organic layer formed after the process of the cushion layer part 70B can planarize the cushion layer part 70B, so that a convex structure is formed in the region where the finally formed cushion layer structure 70 is located. When the first part 21 is stacked on the side of the cushion layer structure 70 away from the substrate 10, the height of the first part 21 can be raised, so that the vertical distance from the surface of the first part 21 on the side away from the substrate 10 to the substrate 10 is greater than the vertical distance from the surface of the second part 22 on the side away from the substrate 10 to the substrate 10.
[0057] In another embodiment, Figure 9 which is another schematic diagram of a display panel provided by an embodiment of the present invention, as Figure 9 shown, the display panel includes a semiconductor layer 11, a first metal layer 12, a second metal layer 13, a third metal layer 14, and a fourth metal layer 15 on one side of the substrate 10. Insulating layers are provided between the semiconductor layer 11 and the first metal layer 12, and between other adjacent metal layers. Among them, the active layer of the transistor T is located in the semiconductor layer 11, the gate of the transistor T is located in the first metal layer 12, and the source and drain of the transistor are located in the third metal layer 14. One plate of the storage capacitor Cst is located in the first metal layer 12, and the other plate is located in the second metal layer 13. The display panel at least includes data lines, scan lines, light emission control lines, reset signal lines, and power supply signal lines. The data lines, scan lines, light emission control lines, reset signal lines, and power supply signal lines are respectively provided in the first metal layer 12, the second metal layer 13, the third metal layer 14, and the fourth metal layer 15.
[0058] As Figure 9 shown, the insulating layer between the semiconductor layer 11 and the first metal layer 12, the insulating layer between the first metal layer 12 and the second metal layer 13, and the insulating layer between the second metal layer 13 and the third metal layer 14 include an inorganic insulating layer 16. The insulating layer between the third metal layer 14 and the fourth metal layer 15, and the insulating layer between the fourth metal layer 15 and the metal structure 20 include an organic insulating layer 17. In the embodiment of the present invention, the cushion structure 70 has a relatively large area, that is, each cushion portion 70B has a relatively large area. The inorganic layer or organic layer fabricated after the process of the cushion portion 70B cannot planarize the cushion portion 70B, resulting in a convex structure in the region where the final formed cushion structure 70 is located. When stacking the first portion 21 on the side of the cushion structure 70 away from the substrate 10, the height of the first portion 21 can be elevated, so that the vertical distance from the surface of the first portion 21 away from the substrate 10 to the substrate 10 is greater than the vertical distance from the surface of the second portion 22 away from the substrate 10 to the substrate 10.
[0059] In the embodiment of the present invention, the cushion structure 70 includes at least one cushion portion; among them, at least one cushion portion is located in the semiconductor layer 11, and / or at least one cushion portion is located in at least one metal layer. In some embodiments, the cushion structure 70 includes one cushion portion, and this cushion portion is located in the semiconductor layer 11 or any one of the metal layers. In other embodiments, the cushion structure 70 includes two or more cushion portions, and the cushion portions are respectively located in the semiconductor layer or the metal layer. The embodiment of the present invention fabricates the cushion structure 70 using the existing film layers in the display panel, without adding new process steps, which can simplify the process and reduce costs.
[0060] In one embodiment, as Figure 8 shown, the cushioning portion 70B includes a first cushioning portion 70B1 located on the first metal layer 12, a second cushioning portion 70B2 located on the second metal layer 13, and a third cushioning portion 70B3 located on the third metal layer 14; in the direction e perpendicular to the plane of the substrate 10, the first cushioning portion 70B1, the second cushioning portion 70B2, and the third cushioning portion 70B3 overlap each other, and an insulating layer is provided between adjacent cushioning portions 70B. In this embodiment, the three metal layers in the display panel are used to fabricate the cushioning structure 70, and the three stacked cushioning portions 70B can make the overall thickness of the cushioning structure 70 relatively thick. When the first sub-portion 21 is stacked on the side of the cushioning structure 70 away from the substrate 10, the height of the first sub-portion 21 can be raised, so that the vertical distance from the surface of the first sub-portion 21 on the side away from the substrate 10 to the substrate 10 is greater than the vertical distance from the surface of the second sub-portion 22 on the side away from the substrate 10 to the substrate 10.
[0061] In another embodiment, as Figure 9 shown, the cushioning portion 70B includes a third cushioning portion 70B3 of the third metal layer 14 and a fourth cushioning portion 70B4 located on the fourth metal layer 15. In the direction e perpendicular to the plane of the substrate 10, the fourth cushioning portion 70B4 intersects with the third cushioning portion 70B3. Optionally, the first metal layer 12 and the second metal layer 13 are made of the same material, the third metal layer 14 and the fourth metal layer 15 are made of the same material, and the thickness of the third metal layer 14 and the fourth metal layer 15 is greater than the thickness of the first metal layer 12 and the second metal layer 13. In one embodiment, the materials for fabricating the third metal layer 14 and the fourth metal layer 15 include metal titanium and metal aluminum. The third metal layer 14 and the fourth metal layer 15 have a three-layer structure of titanium / aluminum / titanium stacked. The thickness of the third metal layer 14 and the fourth metal layer 15 is about 0.8 μm, so that after the fourth cushioning portion 70B4 and the third cushioning portion 70B3 are stacked, the film layer under the first sub-portion 21 can be thickened by about 1.6 μm. In this embodiment, the first sub-portion 21 raised by the cushioning structure 70 can reach a height substantially flush with the first insulating layer 30, thereby reducing the vertical distance between some of the first sub-portions 21 and the mask plate in the evaporation process, increasing the capacitance formed by the overlapping of the mask plate and the metal structure 20, so that the amount of charge that the capacitance can store becomes larger, reducing the risk of electrostatic discharge, and preventing the metal structure 20 from being damaged by electrostatic discharge.
[0062] In another embodiment, Figure 10 is another schematic diagram of a display panel provided by an embodiment of the present invention, as Figure 10As shown, the cushion structure 70 includes a first cushion portion 70B1 located in the first metal layer 12, a second cushion portion 70B2 located in the second metal layer 13, a third cushion portion 70B3 located in the third metal layer 14, and a fourth cushion portion 70B4 located in the fourth metal layer 15. In the direction perpendicular to the plane where the substrate 10 is located, the fourth cushion portion 70B4 overlaps with the first cushion portion 70B1, the second cushion portion 70B2, and the third cushion portion 70B3. In this embodiment, the cushion structure 70 is fabricated using four metal layers, enabling the height of the cushion structure 70 to be higher than the height of the first insulating layer 30, i.e., achieving the above-mentioned Figure 3 In the embodiment, the first distance h1 is greater than the third distance h3. In this embodiment, the height of a part of the first branch 21 is raised by the cushion structure 70. During the evaporation process, the raised part of the first branch 21 can contact the mask plate, while the first insulating layer 30 with a smaller height will not contact the mask plate. At this time, the metal film layer in the display panel contacts the mask plate made of a metal material. On the one hand, it can reduce the contact area between the non-metal film layer in the panel to be evaporated and the mask plate, and reduce the static electricity generated when the mask plate is separated from the panel to be evaporated. On the other hand, the first branch 21 with a larger height contacts the mask plate, and the static electricity on the metal structure 20 can be conducted to the mask plate through the first branch 21 in contact with the mask plate, thereby conducting away the static electricity on the panel and preventing a large accumulation of static charges on the panel. In this way, it can also reduce the risk of electrostatic discharge during the evaporation process.
[0063] Combined with the above Figure 4 Embodiment, in a display panel where the non-display area NA includes the first support pillar 61, adopting the design of the embodiment of the present invention to fabricate the cushion structure 70 using at least four metal layers can make the height of the cushion structure 70 close to the height of the first support pillar 61. Then, during the evaporation process, the raised first branch 21 can contact the mask plate, greatly reducing the risk of electrostatic discharge during the evaporation process.
[0064] In one embodiment, the thickness of the first metal layer 12 and the second metal layer 13 is approximately 0.3 μm, and the thickness of the third metal layer 14 and the fourth metal layer 15 is approximately 0.8 μm. Then, fabricating the cushion structure 70 using four metal layers can raise the first branch 21 by at least 2.3 μm.
[0065] In another embodiment, Figure 11 is another schematic diagram of a display panel provided by the embodiment of the present invention, as Figure 11As shown, the display panel further includes a light-shielding layer 18, and the light-shielding layer 18 is located between the semiconductor layer 11 and the substrate 10; the light-shielding layer 18 located in the display area AA is used to shield the active layer of the transistor to ensure stable transistor characteristics. The cushion portion includes a fifth cushion portion 70B5 located in the light-shielding layer 18; along the direction e perpendicular to the plane of the substrate 10, the fifth cushion portion 70B5 overlaps with the first cushion portion 70B1, the second cushion portion 70B2, and the third cushion portion 70B3. In this embodiment, the light-shielding layer 18 is also used to fabricate the cushion portion, which can increase the overall thickness of the cushion structure 70 and further increase the height of the first branch 21.
[0066] In another embodiment, the cushion portion includes a sixth cushion portion located in the semiconductor layer; along the direction e perpendicular to the plane of the substrate 10, the sixth cushion portion overlaps with the first cushion portion 70B1, the second cushion portion 70B2, and the third cushion portion 70B3, and no schematic drawing is shown here.
[0067] In another embodiment, Figure 12 is a top view schematic diagram of a cushion structure in another display panel provided by an embodiment of the present invention. The cushion structure 70 includes a cushion portion 70B. As Figure 12 shown, at least one cushion portion 70B includes at least two strip-shaped structures 71 extending in the third direction a and arranged in the fourth direction b, and the third direction a and the fourth direction b intersect with each other. In this embodiment, by setting the width of the strip-shaped structure 71 in the fourth direction b and the distance between adjacent strip-shaped structures 71, the strip-shaped structures 71 are closely arranged. When an insulating layer is fabricated on the cushion portion 70B formed by the strip-shaped structures 71, a surface with undulations can be formed, and the positions where the strip-shaped structures 71 are located will not be planarized, so as to play a role in raising the first branch 21.
[0068] In another embodiment, Figure 13 is a top view schematic diagram of another display panel provided by an embodiment of the present invention, Figure 13 only showing a partial area in the non-display area NA. As Figure 13 shown, the display panel includes a first metal wire M1. The first metal wire M1 includes a strip-shaped structure 71 and a first line segment X1 directly connected to the strip-shaped structure 71; it can be seen that the width of the strip-shaped structure 71 in the fourth direction b is greater than the line width of the first line segment X1. For the sake of clearly showing the structure of the first metal wire M1, Figure 13 the metal structure 20 is not shown. In this embodiment, the strip-shaped structure 71 in the cushion portion 70 is fabricated using the first metal layer M1. When fabricating, the wiring of the first metal wire M1 does not need to avoid the position where the cushion structure 70 is preset to be fabricated, but only needs to increase the line width of this part of the first metal wire M1 to ensure that the strip-shaped structure 71 fabricated at this position is not planarized by the insulating layer.
[0069] Optionally, at least a part of the first line segment X1 overlaps with the first insulating layer 30 in a direction perpendicular to the plane where the substrate 10 is located. If the line width of the overlapping part of the first metal line M1 and the first insulating layer 30 is still small, no large undulation will be formed on the surface after the insulating layer is made on part of the first line segment X.
[0070] In another embodiment, Figure 14 FIG. is a schematic top view of another display panel provided by an embodiment of the present invention, Figure 14 only showing a partial area in the non-display area NA, such as Figure 13 shown, the display panel includes a second metal line M2, and the second metal line M2 includes a strip structure 71 and a second line segment X2 directly connected to the strip structure 71; wherein, the distance between two adjacent strip structures 71 is less than the distance between two adjacent second line segments X2. For the sake of clearly showing the structure of the second metal line M2, Figure 14 the metal structure 20 is not shown in. In this embodiment, the strip structure 71 in the cushion layer 70 is made by using the second metal line M2. When making the second metal line M2, the wiring of the second metal line M2 does not need to avoid the position where the cushion layer structure 70 is preset to be made, but only needs to reduce the distance between the second metal lines M2 arranged at the position where the cushion layer structure 70 is preset to be made on the premise of ensuring no short circuit, that is, densely arranging the second metal lines M2 in a local area to form the cushion layer 70B. Such a setting ensures that the densely arranged second metal lines M2 made at this position are not planarized by the insulating layer.
[0071] In another embodiment, Figure 15 FIG. is a schematic diagram of another display panel provided by an embodiment of the present invention, such as Figure 15 shown, the display panel includes an organic insulating layer 17 on one side of the substrate 10; the cushion layer 70B includes a sub-cushion layer 70Bz in contact with the organic insulating layer 17, and the sub-cushion layer 70Bz has at least one opening V; in a direction e perpendicular to the plane where the substrate 10 is located, the opening V penetrates the sub-cushion layer 70Bz. When manufacturing the display panel, gas will be generated in the organic insulating layer 17 during the high-temperature process. If the gas cannot be discharged, it will cause deformation or cracks in the film layer structure. Making the opening V on the sub-cushion layer 70Bz, the opening V can be used as a gas discharge channel, which can ensure that the gas released by the organic insulating layer 17 during the high-temperature process is discharged smoothly, thereby preventing the film layer structure from deforming or cracking and improving the stability of the module structure.
[0072] In one embodiment, the insulating layer between the third metal layer 14 and the fourth metal layer 15 includes an organic insulating layer 17. When the cushion layer 70B includes a third cushion layer 70B3 located on the third metal layer 14, the third cushion layer 70B3 is a sub-cushion layer 70Bz, and it is provided that the third cushion layer 70B3 has at least one opening V.
[0073] In one embodiment, the insulating layer between the fourth metal layer 15 and the metal structure 20 includes an organic insulating layer 17. When the cushion portion 70B includes a fourth cushion portion 70B4 of the fourth metal layer 15, the fourth cushion portion 70B4 is a sub-cushion portion 70Bz, and the fourth cushion portion 70B4 is provided with at least one opening V.
[0074] In another embodiment, Figure 16 Another schematic diagram of a display panel provided by an embodiment of the present invention, Figure 16 schematically shows a partial position of the non-display area NA, such as Figure 16 shown, the first insulating layer 30 includes a plurality of mutually isolated insulating portions 30B. At the position where the metal structure 20 is located, the portion other than the insulating portion 30B in the plane of the first insulating layer 30 is a hollowed-out area, and it can be seen that the hollowed-out area surrounds the insulating portion 30B. In combination with Figure 2 the embodiment for understanding, the common electrode 43C extends from the display area AA to the non-display area NA, and the common electrode 43C is in contact with the first branch portion 21 at the position where the hollowed-out area is located.
[0075] In another embodiment, Figure 17 Another schematic diagram of a display panel provided by an embodiment of the present invention, Figure 17 schematically shows a partial position of the non-display area NA. As Figure 17 shown, the first insulating layer 30 includes a plurality of mutually isolated hollowed-out areas K, and the portion of the first insulating layer 30 other than the hollowed-out areas K is the insulating portion 30B, and the insulating portion 30B surrounds the hollowed-out areas K. In combination with Figure 2 the embodiment for understanding, the common electrode 43C extends from the display area AA to the non-display area NA, and the common electrode 43C is in contact with the first branch portion 21 at the position where the hollowed-out area K is located.
[0076] Based on the same inventive concept, an embodiment of the present invention further provides a display device, Figure 18 A schematic diagram of the display device provided by an embodiment of the present invention, as Figure 18 shown, the display device includes the display panel 100 provided by any embodiment of the present invention. The structure of the display panel 100 has been described in the above embodiments and will not be repeated here. The display device provided by the embodiment of the present invention is, for example, any device with a display function such as a mobile phone, a tablet computer, a notebook computer, a television, etc.
[0077] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.
[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A display panel, characterized in that, The display panel includes a display area and a non-display area; The display panel includes a substrate, a metal structure on one side of the substrate, and a first insulating layer. The metal structure and the first insulating layer are located in the non-display area, and the first insulating layer is located on the side of the metal structure away from the substrate; The first insulating layer has a hollowed-out area, and in a direction perpendicular to the plane where the substrate is located, the hollowed-out area penetrates the first insulating layer; the metal structure includes a first branch and a second branch connected to each other; in a direction perpendicular to the plane where the substrate is located, the first branch overlaps with the hollowed-out area, and the second branch overlaps with the first insulating layer; wherein, In a direction perpendicular to the plane where the substrate is located, the maximum distance from the surface on the side of at least part of the first branch away from the substrate to the substrate is a first distance, and the maximum distance from the surface on the side of the second branch away from the substrate to the substrate is a second distance, and the first distance is greater than the second distance; The display area includes a light-emitting device on one side of the substrate. The light-emitting device includes a stacked first electrode, a light-emitting layer, and a second electrode. The second electrodes of multiple light-emitting devices are connected to each other to form a common electrode; The common electrode extends from the display area to the non-display area, and the common electrode is in contact with the first branch at the position where the hollowed-out area is located.
2. The display panel according to claim 1, characterized in that, The display area includes a pixel defining layer on one side of the substrate, and the pixel defining layer is used to separate adjacent light-emitting devices.
3. The display panel according to claim 2, characterized in that, The metal structure is provided on the same layer as the first electrode.
4. The display panel according to claim 1, characterized in that, In a direction perpendicular to the plane where the substrate is located, the maximum distance from the surface on the side of the first insulating layer away from the substrate to the substrate is a third distance; wherein, the first distance is greater than the third distance.
5. The display panel according to claim 1, characterized in that, The non-display area includes a first support pillar, and the first support pillar is located on the side of the first insulating layer away from the substrate, and the first support pillar is in contact with the first insulating layer.
6. The display panel according to claim 5, characterized in that, The display area includes a pixel defining layer and a second support pillar on one side of the substrate, and the second support pillar is located on the side of the pixel defining layer away from the substrate; In a direction perpendicular to the plane where the substrate is located, the height of the first support pillar is less than the height of the second support pillar.
7. The display panel according to claim 1, characterized in that, The non-display area further includes a cushioning structure, and the cushioning structure is located between the substrate and the metal structure; in a direction perpendicular to the plane where the substrate is located, at least part of the first branch overlaps with the cushioning structure, and the orthographic projection of this part of the first branch on the substrate covers the orthographic projection of the cushioning structure on the substrate.
8. The display panel according to claim 7, characterized in that, In a direction perpendicular to the plane where the substrate is located, the cushioning structure does not overlap with the first insulating layer.
9. The display panel according to claim 7, characterized in that, The minimum length of the cushioning structure in a first direction is d1, and the minimum length of the cushioning structure in a second direction is d2. The first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are parallel to the plane where the substrate is located; wherein, d1 > 5μm, d2 > 5μm.
10. The display panel according to claim 9, characterized in that, d1 ≥ 10μm, d2 ≥ 10μm.
11. The display panel according to claim 7, characterized in that, The display panel includes a semiconductor layer and a metal layer on one side of the substrate; The cushion layer structure includes at least one cushion layer portion; At least one of the cushion layer portions is located on the semiconductor layer, and / or at least one of the cushion layer portions is located on at least one of the metal layers.
12. The display panel according to claim 11, characterized in that, The metal layer includes a first metal layer, a second metal layer, and a third metal layer that are located on the side of the semiconductor layer away from the substrate and are sequentially away from the semiconductor layer; The cushion layer portion includes a first cushion layer portion located on the first metal layer, a second cushion layer portion located on the second metal layer, and a third cushion layer portion located on the third metal layer; In a direction perpendicular to the plane of the substrate, the first cushion layer portion, the second cushion layer portion, and the third cushion layer portion overlap each other, and an insulating layer is provided between adjacent cushion layer portions.
13. The display panel according to claim 12, characterized in that, The metal layer further includes a fourth metal layer, and the fourth metal layer is located on the side of the third metal layer away from the substrate; the cushion layer portion includes a fourth cushion layer portion located on the fourth metal layer, and in a direction perpendicular to the plane of the substrate, the fourth cushion layer portion overlaps with the first cushion layer portion, the second cushion layer portion, and the third cushion layer portion.
14. The display panel according to claim 12, wherein The metal layer includes a light-shielding layer, and the light-shielding layer is located between the semiconductor layer and the substrate; the cushion layer portion includes a fifth cushion layer portion located on the light-shielding layer; in a direction perpendicular to the plane of the substrate, the fifth cushion layer portion overlaps with the first cushion layer portion, the second cushion layer portion, and the third cushion layer portion; and / or the cushion layer portion includes a sixth cushion layer portion located on the semiconductor layer; in a direction perpendicular to the plane of the substrate, the sixth cushion layer portion overlaps with the first cushion layer portion, the second cushion layer portion, and the third cushion layer portion.
15. The display panel according to claim 11, wherein The metal layer includes a first metal layer, a second metal layer, a third metal layer, and a fourth metal layer that are located on the side of the semiconductor layer away from the substrate and are sequentially away from the semiconductor layer; the third metal layer and the fourth metal layer are made of the same material, and the first metal layer and the second metal layer are made of the same material; The cushion layer portion includes a third cushion layer portion located on the third metal layer and a fourth cushion layer portion located on the fourth metal layer; in a direction perpendicular to the plane of the substrate, the third cushion layer portion and the fourth cushion layer portion overlap.
16. The display panel according to claim 11, wherein At least one of the cushion layer portions includes at least two strip-shaped structures extending in a third direction and arranged in a fourth direction, and the third direction and the fourth direction intersect with each other.
17. The display panel according to claim 16, wherein The display panel includes a first metal wire, and the first metal wire includes the strip-shaped structure and a first line segment directly connected to the strip-shaped structure; wherein, the width of the strip-shaped structure in the fourth direction is greater than the line width of the first line segment.
18. The display panel according to claim 16, wherein The display panel includes a second metal wire, and the second metal wire includes the strip-shaped structure and a second line segment directly connected to the strip-shaped structure; wherein, the distance between adjacent two strip-shaped structures is less than the distance between adjacent two second line segments.
19. The display panel according to claim 11, wherein The display panel includes an organic insulating layer on one side of the substrate; The cushion layer portion includes a sub-cushion layer portion in contact with the organic insulating layer, and the sub-cushion layer portion has at least one opening; in a direction perpendicular to the plane of the substrate, the opening penetrates the sub-cushion layer portion.
20. The display panel according to claim 1, wherein The first insulating layer includes a plurality of mutually isolated insulating portions, and the hollowed-out area surrounds the insulating portions.
21. The display panel according to claim 1, wherein The first insulating layer includes a plurality of mutually isolated hollowed-out areas, and the portion of the first insulating layer other than the hollowed-out areas is an insulating portion, and the insulating portion surrounds the hollowed-out areas.
22. A display device, wherein A display panel according to any one of claims 1 to 21 is included.
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