Laminated coil component

Abstract

The laminated coil component of the present invention comprises: a base body formed by laminating multiple layers of insulator in a lamination direction; an external terminal formed on the bottom surface of the base body; a coil portion disposed within the base body, the coil axis being perpendicular to the bottom surface; and a through-hole connection portion disposed within the base body for electrically connecting the end of the coil portion to the external terminal. Coil patterns and through-hole patterns are formed in the multiple layers respectively. The through-hole connection portion is formed by joining the multiple through-hole patterns together in the lamination direction. When viewed from the lamination direction, the through-hole pattern of at least one first layer is offset relative to the through-hole patterns of other second layers. When viewed from the lamination direction, the distance between the through-hole pattern of the first layer and the coil pattern of the first layer is more separated than the distance between the through-hole pattern of the second layer and the coil pattern of the first layer.

Description

Technical Field

[0001] This invention relates to laminated coil components. Background Technology

[0002] Currently, as a laminated coil component, the laminated coil component described in Japanese Patent Application Publication No. 2015-19108 is known. This laminated coil component includes: a body made of an insulator, external terminals formed on the bottom surface of the body, and a coil portion disposed within the body. The ends of the windings of the coil portion are connected to the external terminals via leads that are conductive in the lamination direction. In this laminated coil component, a coil pattern is printed on the upper surface of the insulator sheet. Furthermore, the leads consist of via pads printed on the upper surface of the sheet and via conductors filled with conductors in through holes penetrating the sheet. The via conductors are offset in a manner where their center lines are not aligned. Summary of the Invention

[0003] Here, in the laminated coil component, unlike printing via pads on the upper surface of the insulating sheet, sometimes the via pattern itself is formed on the sheet, and multiple via patterns are joined together in the lamination direction, thereby forming a via connection. In the laminated coil component of Patent Document 1, this structure involves the via pads of each layer extending themselves in the lamination direction as via patterns and joining with via patterns of other layers. In this case, the via connection becomes a structure in which via patterns of the same shape extend in a straight, continuous manner along the lamination direction at the same location. Here, with such a straight via connection, the volume of the conductor in the via connection increases, potentially causing product deformation. Furthermore, when the distance between the coil pattern and the via pattern is close, the stray capacitance between them increases, resulting in a decrease in the self-resonant frequency (SRF).

[0004] The purpose of this invention is to provide a laminated coil component that can suppress product deformation and improve self-resonant frequency.

[0005] The laminated coil component of the present invention comprises: a base body formed by laminating multiple layers of insulator in a lamination direction; an external terminal formed on the bottom surface of the base body; a coil portion disposed within the base body, with the coil axis perpendicular to the bottom surface; and a through-hole connection portion disposed within the base body for electrically connecting the end of the coil portion to the external terminal. Coil patterns and through-hole patterns are formed in the multiple layers respectively. The through-hole connection portion is formed by joining the multiple through-hole patterns together in the lamination direction. When viewed from the lamination direction, the through-hole pattern of at least one first layer is offset relative to the through-hole patterns of other second layers. When viewed from the lamination direction, the distance between the through-hole pattern of the first layer and the coil pattern of the first layer is more separated than the distance between the through-hole pattern of the second layer and the coil pattern of the first layer.

[0006] The laminated coil component of this invention includes a coil portion with its coil axis perpendicular to the bottom surface and an external terminal formed on the bottom surface of the substrate. Therefore, it is necessary to electrically connect the end of the coil portion, positioned high above the bottom surface, to the external terminal on the bottom surface via a through-hole connection. The through-hole connection is formed by joining multiple through-hole patterns together in the lamination direction, which easily increases the volume of the conductor. In contrast, in this invention, when viewed from the lamination direction, the through-hole pattern of at least one first layer is offset relative to the through-hole patterns of other second layers. By arranging the through-hole patterns in this offset manner, conductivity in the lamination direction can be ensured, and the volume of the conductor generated by joining multiple through-hole patterns can be suppressed. This suppresses the increase in the volume of the conductor in the through-hole connection and suppresses product deformation. Furthermore, when viewed from the lamination direction, the distance between the through-hole pattern and the coil pattern of the first layer is more separated than the distance between the through-hole pattern and the coil pattern of the second layer. With this structure, in the first layer, the through-hole pattern can be positioned as far away as possible from the coil pattern within the same layer. Therefore, the influence of stray capacitance between the through-hole pattern and the coil pattern can be suppressed, thereby increasing the self-resonant frequency. Through the above methods, product deformation can be suppressed, and the self-resonant frequency can be improved.

[0007] Alternatively, when viewed from the stacking direction, the via connection portion does not have an area where all via patterns overlap. This prevents the conductor in the via connection portion from being continuous in the stacking direction, thus suppressing the conductor volume.

[0008] Alternatively, the multiple through-hole patterns can be classified into at least three types: a first through-hole pattern, a second through-hole pattern, and a third through-hole pattern, which are positioned at offset positions when viewed from the stacking direction. The coil section forms a winding by combining multiple coil patterns in each layer. Therefore, multiple layers have multiple types of coil patterns. For such multiple types of coil patterns, by properly arranging the through-hole patterns, which are classified into at least three types, it is easy to position the through-hole patterns away from the coil patterns in each layer.

[0009] Alternatively, the second and third through-hole patterns can be connected in the stacking direction via the first through-hole pattern, and when viewed from the stacking direction, the second and third through-hole patterns do not overlap. In this case, it is easy to construct a structure that ensures conductivity through the first through-hole pattern and suppresses the volume of the conductor at the through-hole connection.

[0010] Alternatively, it can be a layered pattern in which the second and third through-hole patterns are alternately arranged with the first through-hole pattern in between. By using such a repeating layered pattern, the variation in the combination of coil patterns and through-hole patterns in each layer can be simplified. Therefore, it is possible to regularly form layers with combinations such as placing through-hole patterns away from coil patterns, and it is also possible to reduce the number of tools (masks, etc.) used for pattern making.

[0011] Alternatively, one of the second and third through-hole patterns can be arranged continuously, with the first through-hole pattern in between. For example, by employing a coil pattern that can improve the winding efficiency of the coil section, and in the case of a stacked pattern where the second and third through-hole patterns are adjacent, by intentionally employing the stacked pattern as described above, it is possible to suppress conductor volume and ensure conductivity.

[0012] Alternatively, when viewed from the stacking direction, the through-hole connection portion has an area where all the through-hole patterns overlap. By adopting such a structure, it is possible to simplify the variation of the combination of coil patterns and through-hole patterns in each layer, and reduce the number of tools (masks, etc.) used for pattern making.

[0013] Alternatively, the coil pattern and the via pattern can be configured as the same layer, at least two consecutive layers. In this case, the electrode cross-sectional area of ​​the coil portion can be increased, and the Q value can be improved. In addition, the via pattern configuration is also set to be the same for each consecutive layer, thereby suppressing the increase in the number of tools (masks, etc.) used for pattern making.

[0014] According to the present invention, a laminated coil component capable of suppressing product deformation and increasing self-resonant frequency can be provided. Attached Figure Description

[0015] Figure 1This is a perspective view showing the stacked coil component according to the first embodiment of the present invention.

[0016] Figure 2 It is an omission Figure 1 The diagram shows a three-dimensional representation of the structure of the internal conductors of the stacked coil component.

[0017] Figure 3 Viewed from the short side Figure 2 The side view of the stacked coil component shown.

[0018] Figure 4 It is viewed from the negative side of the long side Y towards the positive side. Figure 2 The side view of the stacked coil component shown.

[0019] Figure 5 A, Figure 5 B. Figure 5 C Figure 5 D、 Figure 5 E, Figure 5 F is a diagram showing the structure of each type of layer.

[0020] Figure 6 This is a schematic diagram showing the stacking order of the layers used to form the coil section.

[0021] Figure 7 This is a side view of the stacked coil component according to the second embodiment, viewed from the short side direction.

[0022] Figure 8 This is a schematic diagram illustrating the layer stacking order in the second embodiment.

[0023] Figure 9 This is a perspective view showing the structure of the internal conductors, omitting the physical body of the stacked coil component involved in the third embodiment.

[0024] Figure 10 This is a side view of the stacked coil component according to the third embodiment, viewed from the short side direction.

[0025] Figure 11 This is a schematic diagram illustrating the layer stacking order in the third embodiment.

[0026] Figure 12 This is a side view of the stacked coil component according to the fourth embodiment, viewed from the short side direction.

[0027] Figure 13 This is a schematic diagram showing the layer stacking order in the fourth embodiment.

[0028] Symbol Explanation

[0029] 1…Laminated coil components

[0030] 2…body

[0031] 3, 4…external terminals

[0032] 6…coil section

[0033] 8… Through-hole connection part

[0034] 21…coil pattern

[0035] 22… Through-hole pattern

[0036] 22A… Central through-hole pattern (first through-hole pattern)

[0037] 22B… Right-hand through-hole pattern (second through-hole pattern)

[0038] 22C… Left-hand through-hole pattern (third through-hole pattern) Detailed Implementation

[0039] (First Implementation)

[0040] Reference Figures 1-3 The laminated coil component according to the first embodiment of the present invention will be described. Figure 1 This is a perspective view showing the stacked coil component 1 according to the first embodiment of the present invention. Figure 2 It is an omission Figure 1 The figure shown is a perspective view of the structure of the internal conductor of the body 2 of the stacked coil component 1. Figure 3 Viewed from the short side Figure 2 The side view of the stacked coil component 1 shown.

[0041] like Figure 1 As shown, the laminated coil component 1 includes a body 2 and external terminals 3 and 4. The body 2 is a component formed by laminating multiple layers of insulator in the lamination direction. The body 2 is cuboid in shape. Furthermore, in the following description, the laminated coil component 1 will sometimes be described using XYZ coordinates. Here, the Z-axis direction is defined as the "lamination direction Z" for laminating multiple layers. In addition, the Y-axis direction, which is orthogonal to the lamination direction Z, is defined as the "long side direction Y" of the body 2, and the X-axis direction is defined as the "short side direction X" of the body 2. The upper side in the lamination direction Z is defined as the positive side, and the bottom side is defined as the negative side. One side of the short side direction X and the long side direction Y is defined as the positive side.

[0042] The base body 2 has: a bottom surface 2a and a top surface 2b facing each other in the stacking direction Z; end surfaces 2c and 2d facing each other in the long side direction Y; and side surfaces 2e and 2f facing each other in the short side direction X. End surface 2c is disposed on the negative side in the long side direction Y, and end surface 2d is disposed on the positive side in the long side direction Y. Side surface 2e is disposed on the negative side in the short side direction X, and side surface 2f is disposed on the positive side in the short side direction X. The bottom surface 2a is defined as the surface facing the other electronic device, for example, when the stacked coil component 1 is mounted on other electronic devices (e.g., circuit boards or electronic components not shown). Furthermore, the terms "top" and "bottom" are used herein for convenience and do not limit the posture during use. In addition, the material of the base body 2 is not particularly limited, and the optimal material can be used according to the application of the stacked coil component 1, for example, glass ceramic, ferrite, etc. can also be used.

[0043] External terminals 3 and 4 are terminal electrodes formed on the bottom surface 2a of the substrate 2. External terminals 3 and 4 engage with terminals of other electronic devices when the laminated coil component 1 is mounted. External terminal 3 is formed in the negative region of the bottom surface 2a along the long side direction Y. External terminal 4 is formed in the positive region of the bottom surface 2a along the long side direction Y. External terminals 3 and 4 are arranged separately from each other in the long side direction Y. The material of external terminals 3 and 4 is not particularly limited; optimal materials can be used depending on the application of the laminated coil component 1, for example, silver or copper.

[0044] Next, refer to Figure 2 and Figure 3 The internal structure of base body 2 will be explained. For example... Figure 2 and Figure 3 As shown, the laminated coil component 1 includes: a coil portion 6, a lead portion 7, a through-hole connection portion 8, and a through-hole connection portion 9 (see reference). Figure 3 The coil section 6 is disposed within the body 2 and is a conductor component with the coil axis AX perpendicular to the bottom surface 2a. The coil section 6 has the coil axis AX as the winding center and is composed of a rectangular annular winding pattern. When viewed from the stacking direction Z, the coil section 6 has four sides 11, 12, 13, and 14. Side 11 extends along the short side direction X on the negative side of the long side direction Y. Side 12 extends along the short side direction X on the positive side of the long side direction Y. Side 13 extends along the long side direction Y on the negative side of the short side direction X. Side 14 extends along the long side direction Y on the positive side of the short side direction X.

[0045] like Figure 3As shown, one end of the winding of the coil section 6, located at the positive end in the stacking direction Z, is led out to the negative side in the long side direction Y via the lead-out portion 7. The lead-out portion 7 is connected to the positive end in the stacking direction Z of the through-hole connection portion 8. The through-hole connection portion 8 extends from the lead-out portion 7 to the negative side in the stacking direction Z and is connected to the external terminal 3 from the inside side of the body 2. The other end of the winding of the coil section 6, located at the negative end in the stacking direction Z, is positioned at the positive end in the long side direction Y and is connected to the through-hole connection portion 9. The through-hole connection portion 9 extends to the negative side in the stacking direction Z and is connected to the external terminal 4 from the inside side of the body 2.

[0046] Here, as described above, the base body 2 is formed by stacking multiple layers 20 in the stacking direction Z. These layers 20 are configured as a sheet body before sintering, and after sintering, they are integrated in a manner that makes the boundaries between the layers 20 invisible to the naked eye. Figure 3 For ease of explanation, a portion of layer 20 is shown using imaginary lines. Coil patterns 21 and through-hole patterns 22 are formed in the multiple layers 20. Additionally, lead-out patterns 23 or through-hole patterns 24 for through-hole connection portions 9 are formed through layers 20. Furthermore, the through-hole connection portion 8 is formed by stacking multiple through-hole patterns 22 in the stacking direction Z. The lead-out portion 7 is formed by stacking two lead-out patterns 23 in the stacking direction Z. The through-hole connection portion 8 is formed by joining multiple through-hole patterns 24 together in the stacking direction Z.

[0047] In this embodiment, each pattern 21, 22, 23, and 24 is formed in such a way that it penetrates layer 20 in the stacking direction Z. That is, the positive side of each pattern 21, 22, 23, and 24 in the stacking direction Z reaches the positive side surface 20a of layer 20 in the stacking direction Z, and the negative side of each pattern 21, 22, 23, and 24 in the stacking direction Z reaches the negative side surface 20b of layer 20 in the stacking direction Z. In the sheet state before sintering, the positive side of each pattern 21, 22, 23, and 24 in the stacking direction Z is exposed from the positive side surface 20a of layer 20 in the stacking direction Z, and the negative side of each pattern 21, 22, 23, and 24 in the stacking direction Z is exposed from the negative side surface 20b of layer 20 in the stacking direction Z. Thus, each pattern 21, 22, 23, 24 can be directly joined with other patterns 21, 22, 23, 24 adjacent to each other in the stacking direction Z.

[0048] Figure 4 It is viewed from the negative side of the long side Y towards the positive side. Figure 2 The side view of the laminated coil component 1 is shown. Furthermore, in the following description, for ease of explanation, it will sometimes be referred to as... Figure 4Using the viewpoint shown as a reference, the negative side of the short side direction X is called "right" and the positive side is called "left". In addition, sometimes, using the position of the through hole pattern 22 as a reference, the negative side of the long side direction Y is called "paper surface" and the positive side is called "depth".

[0049] The multiple through-hole patterns 22 are classified into three types: a central through-hole pattern 22A (first through-hole pattern) positioned at the center in the short-side direction X, a right-side through-hole pattern 22B (second through-hole pattern) positioned to the right, and a left-side through-hole pattern 22C (third through-hole pattern) positioned to the left. These three types of through-hole patterns 22A, 22B, and 22C have the same length in the short-side direction X, but their positions in the short-side direction X differ from each other. Therefore, viewed from the stacking direction Z, the through-hole patterns 22A, 22B, and 22C are positioned at offset positions. Furthermore, the through-hole patterns 22A, 22B, and 22C are not offset in the long-side direction Y (see reference). Figure 3 ).

[0050] The layered pattern is described. If described in order from the positive side to the negative side of the layering direction Z, the layered pattern consists of a central through-hole pattern 22A, a right-hand through-hole pattern 22B, another central through-hole pattern 22A, and a left-hand through-hole pattern 22C, and this layered pattern is repeated. That is, the layered pattern in which the right-hand through-hole pattern 22B and the left-hand through-hole pattern 22C are alternately arranged with the central through-hole pattern 22A in between is repeated.

[0051] The left end of the right-side through-hole pattern 22B is positioned at the center of the central through-hole pattern 22A. The right end of the left-side through-hole pattern 22C is positioned at the center of the central through-hole pattern 22A. Therefore, when viewed from the stacking direction Z, the left end of the right-side through-hole pattern 22B and the right end of the left-side through-hole pattern 22C are aligned, thus they are arranged in a manner that prevents them from overlapping when viewed from the stacking direction Z. Therefore, the central through-hole pattern 22A is necessarily interposed between the right-side through-hole pattern 22B and the left-side through-hole pattern 22C, thereby ensuring the electrical connection of the through-hole connection portion 8.

[0052] Furthermore, by adopting such a structure, when viewed from the stacking direction Z, the through-hole connection portion 8 can be a structure in which not all through-hole patterns 22 overlap. Specifically, if a boundary line BL is set at the end position of each through-hole pattern 22A, 22B, 22C, it is divided into four regions E1, E2, E3, and E4 from right to left. In region E1, only the right-hand through-hole pattern 22B exists. In region E2, the central through-hole pattern 22A and the right-hand through-hole pattern 22B exist, but the left-hand through-hole pattern 22C does not exist. In region E3, the central through-hole pattern 22A and the left-hand through-hole pattern 22C exist, but the right-hand through-hole pattern 22B does not exist. In region E4, only the left-hand through-hole pattern 22C exists. As described above, each of regions E1, E2, E3, and E4 is a region excluding at least one through-hole pattern 22, and is not a region where all three types of through-hole patterns 22 are stacked. Thus, in the through-hole connection portion 8, not all through-hole patterns 22 overlap.

[0053] Next, refer to Figure 5 A, 5B, 5C, 5D, 5E, 5F and Figure 6 The shape of the pattern in each layer 20 will be described. Furthermore, in the following description, "central position" refers to the position on the center line CL that extends through the coil axis AX and is parallel to the long side direction Y (see reference). Figure 5 A).

[0054] The laminated coil component 1 involved in this embodiment, in addition to the above, Figure 5 In addition to the six types of layers 20 shown in the order of A, 5B, 5C, 5D, 5E, and 5F (types 1 to 6), there is also a type of layer 20 not shown that has a right-hand through-hole pattern 22B and through-hole pattern 24, which will be described later.

[0055] like Figure 5 As shown in Figure A, layer 20 of type 1 has: a coil pattern 21A, a lead-out pattern 23, and a central through-hole pattern 22A. The coil pattern 21A has the entire length of edges 12, 13, and 14, with only the left end of edge 11 on the paper side. (As shown in Figure A) Figure 5 As shown in Figure B, layer 20 of type 2 has a left-hand coil pattern 21B and a right-hand through-hole pattern 22B. The left-hand coil pattern 21B has the entire length of the left side 14 and only has the left ends of the sides 11 and 12. Figure 5 As shown in C, layer 20 of type 3 has a coil pattern 21C and a central through-hole pattern 22A. The coil pattern 21C has the entire length of the edges 11, 13, and 14, and for the edge 12 on the depth side, the center is empty with only the left and right ends. The coil pattern 21C has a left-right symmetrical shape.

[0056] like Figure 5As shown in Figure D, layer 20 of type 4 has a right-hand coil pattern 21D and a left-hand through-hole pattern 22C. The right-hand coil pattern 21D has the entire length of the right-hand side 13 and only has the right-hand ends of the sides 11 and 12. Figure 5 As shown in E, layer 20 of type 5 has a coil pattern 21E and a central through-hole pattern 22A. The coil pattern 21E has the entire length of edges 12, 13, and 14, and for the paper-side edge 11, the center is empty, with only the left and right ends. The coil pattern 21E is a symmetrical shape. Figure 5 As shown in F, layer 20 of type 6 has a central through-hole pattern 22A and a through-hole pattern 24. In addition, layer 20 with through-hole pattern 24 also has a type with a right-hand through-hole pattern 22B.

[0057] exist Figure 5 In layer 20 of type B 2, the coil pattern 21B is positioned to the left, and for the edge 11, a conductor exists only to the left of the center position. Conversely, a through-hole pattern 22B is formed on the right side of the same layer 20. Figure 5 In layer 20 of type D (4), the coil pattern 21D is positioned to the right, and for the edge 11, a conductor exists only to the right of the center position. Conversely, a through-hole pattern 22C is formed to the left in the same layer 20. Therefore, in layers 20 of types 2 and 4, the through-hole pattern 22 can be positioned as far away from the coil pattern 21 as possible. This reduces stray capacitance between the through-hole pattern 22 and the coil pattern 21. As described above, this configuration that maximizes separation between the two is sometimes referred to as an "improved configuration." Furthermore, in layer 20 of type 3, the edge 11 is formed along its entire length, and in layer 20 of type 5, the cutouts of the edge 11 are symmetrical. Therefore, even if the through-hole pattern 22 is positioned closer to either the left or right, it cannot be positioned far away from the coil pattern 21. Therefore, in layers 20 of types 3 and 5, a central through-hole pattern 22A is formed as a pattern to ensure the connectivity of the through-hole connection portion 8. Sometimes, configurations that cannot be performed in the improved configuration, or configurations that are not performed even if they are possible for the improved configuration, are referred to as "normal configurations".

[0058] According to this structure, when viewed from the stacking direction Z, at least one "first layer" via pattern 22 of the plurality of layers 20 can be configured to be offset relative to the other "second layer" via patterns 22. Furthermore, it is possible to achieve a structure where, when viewed from the stacking direction Z, the distance between the "first layer" via pattern 22 and the "first layer" coil pattern 21 is more separated than the distance between the "second layer" via pattern 22 and the "first layer" coil pattern 21. Here, distance refers to the shortest distance between the closest points of the via pattern 22 and the coil pattern 21.

[0059] Specifically, layer 20 of type 2 is considered the "first layer," and layers 3, 4, and 5 are considered the "second layers." Therefore, viewed from the stacking direction Z, the right-hand via pattern 22B of layer 20 of type 2 is offset relative to the via patterns 22A and 22C of layers 20 of types 3, 4, and 5. When viewed from the stacking direction Z, the following relationship holds: compared to the distance between the via patterns 22A and 22C of layers 20 of types 3, 4, and 5 and the coil pattern 21 of layer 20 of type 2, the distance between the right-hand via pattern 22B of layer 20 of type 2 and the coil pattern 21B of layer 20 of type 2 is more separated.

[0060] Considering layer 20 of type 4 as the "first layer" and layers 2, 3, and 5 as the "second layers," when viewed from the stacking direction Z, the left-hand via pattern 22C of layer 20 of type 4 is configured to be offset relative to the via patterns 22A and 22B of layers 20 of types 2, 3, and 5. When viewed from the stacking direction Z, the following relationship holds: compared to the distance between the via patterns 22A and 22B of layers 20 of types 2, 3, and 5 and the coil pattern 21 of layer 20 of type 2, the distance between the left-hand via pattern 22C of layer 20 of type 4 and the coil pattern 21D of layer 20 of type 4 is more separated.

[0061] Furthermore, even if the relationship between "first layer" and "second layer" is reversed, and layers 20 of types 3 and 5 are considered "first layer" and types 2 and 4 are considered "second layer," the above relationship does not hold. However, even if the layers 20 considered as "first layer" and "second layer" are reversed, the above relationship does not need to hold. That is, if the above relationship is satisfied when any type of layer 20 is considered as "first layer," it is included in the structure defined in the claims.

[0062] Figure 6 The layering sequence of the layers 20 used to form the coil section 6 is shown. Figure 6 The arrows indicate the order from the positive side to the negative side in the Z-direction of the stacking process. For example... Figure 6 As shown, layers 20 of type 1, type 2, type 3, type 4, and type 5 of two-layer quantity are stacked sequentially. Then, the same stacking pattern is repeated starting from type 2. In this configuration, the coil pattern 21 and the through-hole pattern 22 are arranged as the same layer 20, two consecutive layers. That is, two consecutive layers of the same type 20. Furthermore, a coil of one turn is formed using four types of coil patterns 21: 21B, 21C, 21D, and 21E.

[0063] Next, the function and effects of the stacked coil component 1 involved in this embodiment will be explained.

[0064] The laminated coil component 1 according to this embodiment includes: a coil portion 6, whose coil axis AX is perpendicular to the bottom surface 2a; and external terminals 3 and 4 formed on the bottom surface 2a of the body 2. Therefore, it is necessary to electrically connect the end of the coil portion 6, which is positioned high above the bottom surface 2a, to the external terminals 3 of the bottom surface 2a through a through-hole connection portion 8. The through-hole connection portion 8 is formed by joining multiple through-hole patterns 22 together in the lamination direction Z, thus the volume of the conductor can easily increase. In contrast, in this embodiment, when viewed from the lamination direction Z, at least one of the "first layer" through-hole patterns 22 (e.g., the right-hand through-hole pattern 22B or the left-hand through-hole pattern 22C) of the multiple layers 20 is offset relative to the other "second layer" through-hole patterns 22 (e.g., the central through-hole pattern 22A). By arranging the through-hole patterns 22 in this offset manner, conductivity in the lamination direction Z can be ensured, and the volume of the conductor caused by joining multiple through-hole patterns 22 can be suppressed. Therefore, the increase in the volume of the conductor in the through-hole connection portion 8 can be suppressed, and product deformation can be suppressed. Furthermore, when viewed from the stacking direction Z, the distance between the through-hole pattern 22 of the "first layer" (e.g., the right-hand through-hole pattern 22B or the left-hand through-hole pattern 22C) and the coil pattern 21 of the "first layer" (e.g., the left-hand coil pattern 21B or the right-hand coil pattern 21D) is more separated than the distance between the through-hole pattern 22 of the "second layer" (e.g., the central through-hole pattern 22A) and the coil pattern 21 of the "first layer". According to this structure, in the "first layer", the through-hole pattern 22 can be positioned as far away as possible from the coil pattern 21 within the same layer (e.g., refer to...). Figure 5 (Type 2, 4, layer 20). Therefore, the influence of stray capacitance between the through-hole pattern 22 and the coil pattern 21 can be suppressed, and the self-resonant frequency can be improved. Through the above, product deformation can be suppressed and the self-resonant frequency can be improved.

[0065] Viewed from the stacking direction Z, the through-hole connection portion 8 may not have an area where all the through-hole patterns 22 overlap (e.g., Figure 13 (Region E2). Therefore, it is possible to prevent the conductor of the through-hole connection 8 from being continuous in the stacking direction Z, and thus, the volume of the conductor can be suppressed.

[0066] Viewed from the stacking direction Z, the multiple through-hole patterns 22 can be classified into at least three types: a central through-hole pattern 22A, a right-hand through-hole pattern 22B, and a left-hand through-hole pattern 22C, which are arranged in mutually offset positions. The coil section 6 forms a winding by combining multiple coil patterns 21 in each layer 20. Therefore, the multiple layers 20 have multiple types of coil patterns 21 (four types in this embodiment). For such multiple types of coil patterns 21, by properly arranging the through-hole patterns 22A, 22B, and 22C, which are classified into at least three types, it is easy to arrange the through-hole patterns 22 in each layer 20 at a position away from the coil patterns 21.

[0067] The right-side through-hole pattern 22B and the left-side through-hole pattern 22C are connected in the stacking direction Z, separated by the central through-hole pattern 22A. When viewed from the stacking direction Z, the right-side through-hole pattern 22B and the left-side through-hole pattern 22C may not coincide. In this case, it is easy to form a structure that ensures conductivity through the central through-hole pattern 22A and suppresses the volume of the conductor in the through-hole connection portion 8.

[0068] The coil pattern 21 and the through-hole pattern 22 can be configured in the same layer 20, or at least two consecutive layers. In this case, the electrode cross-sectional area of ​​the coil section 6 can be increased, and the Q value can be improved. In addition, the through-hole pattern 22 is also configured the same for each consecutive layer 20, thereby suppressing the increase in the number of tools (masks, etc.) used for pattern making.

[0069] [Second Embodiment]

[0070] Reference Figure 7 and Figure 8 The laminated coil component 1 according to the second embodiment will be described. The difference between the laminated coil component 1 according to the second embodiment and the laminated coil component 1 according to the first embodiment is that the layers 20 of each type are not consecutively arranged in pairs; for each layer 20, other types of layers 20 are laminated adjacently. Therefore, as... Figure 7 As shown, the structure is as follows: a layered pattern consisting of one layer of central through-hole pattern 22A, one layer of right-side through-hole pattern 22B, one layer of central through-hole pattern 22A, and one layer of left-side through-hole pattern 22C. Of course, for the coil pattern, the type can be switched for each layer. Other structures are equivalent to the layered coil component 1 described in the first embodiment.

[0071] like Figure 8 As shown, layer 20 of type 1, type 2, type 3, type 4, and type 5 are stacked sequentially. Then, the same stacking pattern is repeated starting from type 2. Thus, according to the second embodiment, since the types of through-hole patterns 22 are switched layer by layer, the volume of the conductor in the through-hole connection portion 8 can be further dispersed.

[0072] [Third Embodiment]

[0073] Reference Figures 9-11 The laminated coil component 1 according to the third embodiment will be described. In the first embodiment, a coil of one turn is formed using four types of coil patterns 21. In contrast, the laminated coil component 1 according to the third embodiment, as shown below... Figure 11As shown, the main difference lies in forming a coil of one turn using three different types of coil patterns 21. This improves the coil winding efficiency compared to the first and second embodiments, allowing for a higher number of turns and thus a higher inductance. However, using this coil pattern 21 creates areas where the through-hole pattern 22 cannot conduct electricity. Therefore, in the laminated coil component 1 of the third embodiment, the laminated pattern of the through-hole pattern 22 is investigated (details will be described later).

[0074] like Figure 11 As shown, layer 20 of type 1-1 has a coil pattern 21Az, a lead-out pattern 23, and a central through-hole pattern 22A. The coil pattern 21Az has the entire length of the edges 12 and 13, and only the depth-side end of the left edge 14. Layer 20 of type 2-1 has a left-side coil pattern 21Bz and a right-side through-hole pattern 22B. The left-side coil pattern 21Bz has the entire length of the inner edge 12 and the left edge 14 extending to the paper side, and only the depth-side end of the right edge 13. Layer 20 of type 3-1 has a coil pattern 21Cz and a central through-hole pattern 22A. The coil pattern 21Cz has the entire length of the paper-side edge 11 and has the left and right edges 14 and 13 extending to the depth side. The coil pattern 21Cz is symmetrical. Layer 20 of type 4-1 has a right-hand coil pattern 21Dz and a left-hand through-hole pattern 22C. The right-hand coil pattern 21Dz has the entire length of the depth-side edge 12 and has a right-hand edge 13 extending to the end on the paper side, and only has the depth-side end of the left-hand edge 14.

[0075] Layer 20 of type 2-2 has a coil pattern 21Bz and a central through-hole pattern 22A. Layer 20 of type 3-2 has a coil pattern 21Cz and a right-hand through-hole pattern 22B. Layer 20 of type 4-2 has a coil pattern 21Dz and a central through-hole pattern 22A.

[0076] In the third embodiment, layers 20 of type 1-1, type 2-1, type 3-1, type 4-1, type 2-2, type 3-2, and type 4-2 are stacked sequentially. Then, the same stacking pattern is repeated starting from type 2-1. Here, with three types of coil patterns used as in the third embodiment, a continuous portion (the portion of type 4-1 and type 2-2) is created between the right-hand coil pattern 21Dz and the left-hand coil pattern 21Bz. Assuming that type 2-2 is configured in an improved way, the left-hand through-hole pattern 22C and the right-hand through-hole pattern 22B are adjacent and cannot conduct. However, if the left-hand through-hole pattern 22C and the right-hand through-hole pattern 22B overlap, a region where all through-hole patterns 22 overlap is formed in the stacking direction Z. Therefore, in layer 20 of type 2-2, the central through-hole pattern 22A is intentionally configured as a normal arrangement. Similarly, in layer 20 of type 4-2, a central through-hole pattern 22A is intentionally used as the normal configuration. In addition, in type 3-2, although it is not far from the coil pattern 21Cz and is equivalent to the normal configuration, a right-side through-hole pattern 22B is used in order to suppress the increase in volume between the central through-hole pattern 22A of type 2-2 and type 4-2.

[0077] As a result, the stacked pattern of the through-hole pattern 22 is as follows: Figure 10 As shown. Figure 10 As shown, in the stacked pattern, the right-hand through-hole pattern 22B is continuously arranged with a gap between it and the central through-hole pattern 22A (refer to the "A" portion surrounded by the dashed line). Furthermore, in the third embodiment, the right-hand through-hole pattern 22B is continuous, but the left-hand through-hole pattern 22C can also be continuous.

[0078] As described above, one of the right-side through-hole pattern 22B and the left-side through-hole pattern 22C can be arranged continuously, alternating with the central through-hole pattern 22A. As in the third embodiment, by employing three types of coil patterns 21 that can improve the winding efficiency of the coil section 6, and by creating a stacked pattern with the right-side through-hole pattern 22B and the left-side through-hole pattern 22C adjacent to each other, the conductor volume can be suppressed and conductivity ensured by intentionally setting the stacked pattern as described above. Furthermore, for layers 20 (here, type 2-1, 4-1) that can be configured in a modified way, the effect of reducing stray capacitance can also be obtained by adopting a modified configuration.

[0079] [Fourth Embodiment]

[0080] Reference Figure 12 , Figure 13 The laminated coil component 1 according to the fourth embodiment will be described. The laminated coil component 1 according to the fourth embodiment differs from the third embodiment primarily in that it employs a lamination pattern with a different through-hole pattern 22 than that of the third embodiment. For example... Figure 12 As shown, in the fourth embodiment, the through-hole connection portion 8 is composed of two types of through-hole patterns 22.

[0081] like Figure 13 As shown, in the fourth embodiment, layer 20 of type 1-1, layer 20 of type 2-1, layer 20 of type 3-1, and layer 20 of type 4-2 are stacked sequentially. Then, the same stacking pattern is repeated starting from type 2-1. Comparing the third and fourth embodiments, the fourth embodiment eliminates the need for types 2-2, 3-2, and 4-2, reducing the number of types of layers 20. This reduces the number of masks used for pattern formation.

[0082] As a result, the stacked pattern of the through-hole pattern 22 is as follows: Figure 13 As shown. Figure 12 As shown, the stacked pattern consists of two types of through-hole patterns 22A and 22B. Furthermore, when viewed from the stacking direction Z, the central region E2 among regions E1, E2, and E3 becomes the region where all the through-hole patterns 22 overlap.

[0083] As described above, when viewed from the stacking direction Z, the through-hole connection portion 8 may also have an area E2 where all the through-hole patterns 22 overlap. By adopting such a structure, it is possible to simplify the variation of the combination of coil patterns 21 and through-hole patterns 22 in each layer 20, and reduce the number of tools (masks, etc.) used for pattern making.

[0084] The present invention is not limited to the embodiments described above.

[0085] For example, the specific shape of the coil pattern or the through-hole pattern of each layer is not specifically limited, and can be appropriately changed. In addition, the number of layers or the layer pattern can also be adjusted appropriately.

[0086] Furthermore, the offset of the through-hole pattern is not limited to the embodiments described above. For example, a structure in which four or more types of through-hole patterns are gradually offset to the left in a stepped manner, and gradually offset to the right in a stepped manner at a predetermined height, may also be used. In addition, the number of through-hole patterns offset relative to other through-hole patterns is not particularly limited, and a structure in which only a portion of the through-hole patterns in the whole are offset may also be used. In the most extreme example, a structure in which the through-hole pattern is offset from other through-hole patterns by one layer in a linearly extending through-hole connection portion may also be used.

Claims

1. A laminated coil component, wherein, have: The base body is formed by stacking multiple layers of insulators in the stacking direction; External terminals are formed on the bottom surface of the substrate; A coil section is disposed within the body of the substrate, with the coil axis perpendicular to the bottom surface; as well as A through-hole connection portion, which is provided within the body, electrically connects the end of the coil portion to the external terminal. Coil patterns and through-hole patterns are formed in the multiple layers respectively. The through-hole patterns adjacent to each other in the stacking direction are directly joined together. The through-hole connection portion is formed by joining multiple through-hole patterns together in the stacking direction. Viewed from the stacking direction, the via pattern of at least one first layer of the plurality of layers is offset relative to the via patterns of the other second layers. When viewed from the stacking direction, the distance between the through-hole pattern of the first layer and the coil pattern of the first layer is more distinct than the distance between the through-hole pattern of the second layer and the coil pattern of the first layer.

2. The laminated coil component according to claim 1, wherein, Viewed from the stacking direction, the through-hole connection portion does not have an area where all the through-hole patterns overlap.

3. The laminated coil component according to claim 1 or 2, wherein, The plurality of through-hole patterns are classified into at least three types: a first through-hole pattern, a second through-hole pattern, and a third through-hole pattern arranged at mutually offset positions when viewed from the stacking direction.

4. The laminated coil component according to claim 3, wherein, The second through-hole pattern and the third through-hole pattern are connected in the stacking direction via the first through-hole pattern. Viewed from the stacking direction, the second through-hole pattern and the third through-hole pattern do not overlap.

5. The laminated coil component according to claim 4, wherein, The second through-hole pattern and the third through-hole pattern are alternately arranged in a stacked pattern with the first through-hole pattern as a secondary arrangement.

6. The laminated coil component according to claim 4, wherein, One of the second through-hole pattern and the third through-hole pattern is arranged continuously, with the first through-hole pattern in between.

7. The laminated coil component according to claim 1, wherein, Viewed from the stacking direction, the through-hole connection has an area where all the through-hole patterns overlap.

8. The laminated coil component according to claim 1 or 2, wherein, The coil pattern and the through-hole pattern are configured in the same layer, at least two consecutive layers.

9. The laminated coil component according to claim 3, wherein, The coil pattern and the through-hole pattern are configured in the same layer, at least two consecutive layers.

10. The laminated coil component according to claim 4, wherein, The coil pattern and the through-hole pattern are configured in the same layer, at least two consecutive layers.

Images