Nozzle position detection method and device, electronic equipment and storage medium

Abstract

The present disclosure provides a nozzle position detection method and device, electronic equipment and storage medium. The method is applied to a wafer processing device, which includes a tray, a nozzle and multiple groups of transceivers. The nozzle is arranged above the tray and used to spray a liquid column to the surface of the wafer. The transceiver includes a corresponding receiver and transmitter. The receiver and transmitter are arranged on a circumference. The plane where the circumference is located is higher than the tray. The center of the circumference is located on the vertical line of the plane where the tray is located. The vertical line passes through the center of the tray. The method includes: placing the wafer on the surface of the tray. The center of the wafer is located on the vertical line. The transmitter emits a light beam. According to the light beam receiving result of the receiver corresponding to the transmitter, it is determined whether the nozzle deviates from the vertical line. The present disclosure detects the nozzle position through the corresponding receiver and transmitter and monitors in real time. It is beneficial to find the nozzle deviation in time. Then, the nozzle position is calibrated in time. The yield of semiconductor devices is improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing, and more particularly to a nozzle position detection method, apparatus, electronic device, and storage medium. Background Technology

[0002] In semiconductor wet processing, maintaining the uniformity of wafer surface treatment is a crucial factor affecting the yield and reliability of semiconductor devices. In monolithic wet processing, a processing solution is typically sprayed from a nozzle towards the center of the wafer to etch or clean it, while the wafer is rotated around its center to ensure uniform distribution of the processing solution across the wafer surface. However, when the sprayed processing solution deviates from the wafer center, it cannot be evenly distributed across the wafer surface, resulting in reduced uniformity of the wafer surface treatment and consequently, lower semiconductor device yield.

[0003] Therefore, a method is needed to detect whether the nozzle position has deviated. Summary of the Invention

[0004] This disclosure provides a nozzle position detection method, apparatus, electronic device, and storage medium for detecting whether the nozzle position deviates.

[0005] In a first aspect, this disclosure provides a nozzle position detection method applied to a wafer processing apparatus. The wafer processing apparatus includes a tray, a nozzle, and multiple transceivers. The nozzle is disposed above the tray and is used to spray a liquid column onto the wafer surface. The transceiver includes a corresponding receiver and a transmitter. The receiver and transmitter are disposed on a circumference, the plane of which the circumference is located is higher than the tray, and the center of the circumference is located on a perpendicular line to the plane of the tray, with the perpendicular line passing through the center of the tray. The nozzle position detection method includes: providing a wafer placed on the surface of the tray, with the center of the wafer located on the perpendicular line; controlling the transmitter to emit a light beam; and determining whether the nozzle position deviates from the perpendicular line based on the light beam reception result of the receiver corresponding to the transmitter.

[0006] In some embodiments, the lines connecting the transmitter and receiver of each transceiver group intersect with a perpendicular line; controlling the transmitter to emit a beam of light, and determining whether the nozzle is deviated based on the beam reception result of the receiver corresponding to the transmitter, includes: when the nozzle is in the open state, controlling each transmitter to emit a beam of light toward the wafer surface, obtaining the position of the beam received by the receiver corresponding to each transmitter; and determining whether the nozzle position is deviated based on the position of the beam received by the receiver of each transceiver group.

[0007] In some embodiments, the transmitter of each transceiver group is at the same height from the tray surface; the transmitter of each transceiver group emits a beam of light at the same incident angle to the wafer surface; determining whether the nozzle position is deviated based on the position of the beam received by the receiver of each transceiver group includes: detecting whether the position of the beam received by the receiver of each transceiver group is within a predetermined first height range from the tray surface; if the position of the beam received by each receiver is within the first height range, it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated.

[0008] In some embodiments, the method further includes: calculating a first height range based on the refractive index of the liquid column, the height of the emitter from the tray surface, the incident angle, and a preset error value.

[0009] In some embodiments, the transmitter of each transceiver emits a beam of light onto the wafer surface, and the projection of the reflected beam formed on the wafer surface intersects at the center of the wafer.

[0010] In some embodiments, the transmitter of each transceiver emits a beam of light toward the center of the wafer surface.

[0011] In some embodiments, the receivers of each group of transceivers are at the same height; based on the position of the beam received by the receivers of each group of transceivers, it is determined whether the height from the position of the beam received by each receiver to the tray surface is within a predetermined first height range, including: obtaining the beam receiving coordinates collected by the receivers of each group of transceivers; if the beam receiving coordinates collected by the receivers are all within the predetermined coordinate range, it is determined that the height from the position of the beam received by each receiver to the tray surface is within the first height range; otherwise, it is determined that the height from the position of the beam received by each receiver to the tray surface is not within the first height range; wherein, the coordinate range represents the position coordinates collected by the receiver when the beam emitted at the incident angle toward the wafer surface passes through the liquid column and reaches the receiver.

[0012] In some embodiments, a shield is provided on the nozzle; the shield is located on the line connecting the transmitter and the corresponding receiver of each transceiver group; controlling the transmitter to emit a beam of light, and determining whether the nozzle position deviates from the center of the wafer based on the reception result of the receiver corresponding to the transmitter, including: controlling each transmitter to emit a beam of light to the corresponding receiver; if each receiver does not receive a beam of light, it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated.

[0013] Secondly, this disclosure provides a nozzle position detection device applied to a wafer processing apparatus. The wafer processing apparatus includes a tray, a nozzle, and multiple transceivers. The nozzle is positioned above the tray and is used to spray a liquid column onto the wafer surface. The transceiver includes a corresponding receiver and a transmitter, which are arranged on a circumference. The plane of the circumference is higher than the tray, and the center of the circumference is located on a perpendicular line to the plane of the tray, with the perpendicular line passing through the center of the tray. The nozzle position detection device includes: a first processing module for ensuring that the wafer is placed on the tray surface with its center on the perpendicular line; and a second processing module for controlling the transmitter to emit a light beam and determining whether the nozzle position deviates from the perpendicular line based on the light beam reception result of the receiver corresponding to the transmitter.

[0014] In some embodiments, the lines connecting the transmitter and receiver of each transceiver group intersect with a vertical line; the second processing module is specifically used to control each transmitter to emit a beam of light toward the wafer surface when the nozzle is in the open state, and to obtain the position of the receiver corresponding to each transmitter receiving the beam of light; the second processing module is specifically used to determine whether the nozzle position is deviated based on the position of the receiver receiving the beam of light of each transceiver group.

[0015] In some embodiments, the transmitter of each transceiver group is at the same height from the tray surface; the transmitter of each transceiver group emits a beam of light at the same incident angle toward the wafer surface; the second processing module is further configured to detect, based on the position of the receiver of each transceiver group receiving the beam, whether the height of the position of the receiver receiving the beam from the tray surface is within a predetermined first height range; the second processing module is further configured to determine that the nozzle position has not deviated if the height of the position of the receiver receiving the beam from the tray surface is within the first height range; otherwise, determine that the nozzle position has deviated.

[0016] In some embodiments, the nozzle position detection device further includes a calculation module for calculating a first height range based on the refractive index of the liquid column, the height of the emitter from the tray surface, the incident angle, and a preset error value.

[0017] In some embodiments, the transmitter of each transceiver emits a beam of light onto the wafer surface, and the projection of the reflected beam formed on the wafer surface intersects at the center of the wafer.

[0018] In some embodiments, the transmitter of each transceiver emits a beam of light toward the center of the wafer surface.

[0019] In some embodiments, the receivers of at least two sets of transceivers are at the same height; the second processing module is further configured to acquire the beam receiving coordinates collected by the receivers of multiple sets of transceivers; the second processing module is further configured to determine that if the beam receiving coordinates collected by the receivers are all within a predetermined coordinate range, the height from the position of the beam received by each receiver to the tray surface is within a first height range; otherwise, the height from the position of the beam received by each receiver to the tray surface is determined not to be within the first height range; wherein, the coordinate range represents the position coordinates collected by the receiver when the beam emitted at the incident angle toward the wafer surface passes through the liquid column and reaches the receiver.

[0020] In some embodiments, a shield is provided on the nozzle; the shield is located on the line connecting the transmitter and the corresponding receiver of each transceiver group; the second processing module is specifically used to control each transmitter to emit a beam of light to the corresponding receiver; the second processing module is also specifically used to determine that the nozzle position has not deviated if each receiver does not receive a beam of light; otherwise, determine that the nozzle position has deviated.

[0021] Thirdly, this disclosure provides an electronic device, including: a processor and a memory communicatively connected to the processor; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the method as described in the first aspect.

[0022] Fourthly, this disclosure provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method as described in the first aspect.

[0023] The nozzle position detection method, apparatus, electronic device, and storage medium disclosed herein are applied to a wafer processing apparatus. The wafer processing apparatus includes a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and are used to spray a liquid column onto the wafer surface. Each transceiver includes a corresponding receiver and transmitter, which are arranged on a circumference. The plane of the circumference is higher than the tray, and the center of the circumference lies on a perpendicular line to the plane of the tray, passing through the center of the tray. The method includes: placing a wafer on the tray surface, with the center of the wafer located on the perpendicular line; controlling the transmitter to emit a light beam; and determining whether the nozzle deviates from the perpendicular line based on the light beam received by the receiver corresponding to the transmitter. This disclosure, through the corresponding receiver and transmitter, can detect and monitor the nozzle position in real time, facilitating timely detection of nozzle deviation and subsequent nozzle position calibration, thereby improving the yield of semiconductor devices. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0025] Figure 1 This is a schematic diagram of a typical wafer processing scenario;

[0026] Figure 2 A schematic diagram illustrating the processing result of nozzle offset according to an embodiment of this disclosure;

[0027] Figure 3 A flowchart of a nozzle position detection method provided in this embodiment of the disclosure;

[0028] Figure 4 A top view of a wafer processing apparatus provided in an embodiment of this disclosure;

[0029] Figure 5 A schematic diagram of a nozzle position detection method provided in an embodiment of this disclosure;

[0030] Figure 6 A flowchart of another nozzle position detection method provided in this disclosure embodiment;

[0031] Figure 7 A front view of another wafer processing apparatus provided in an embodiment of this disclosure;

[0032] Figure 8 A top view of another wafer processing apparatus provided in an embodiment of this disclosure;

[0033] Figure 9 This is a schematic diagram of the structure of a nozzle position detection device provided in an embodiment of the present disclosure;

[0034] Figure 10 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this disclosure.

[0035] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0036] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure.

[0037] In semiconductor manufacturing, maintaining the uniformity of wafer surface treatment is a crucial factor affecting the yield and reliability of semiconductor devices. In monolithic wet processing, a processing solution is typically sprayed from a nozzle towards the center of the wafer to etch or clean it, while the wafer is rotated around its center to ensure uniform distribution of the processing solution across the wafer surface. However, when the sprayed processing solution deviates from the wafer center, it cannot be evenly distributed across the wafer surface, resulting in reduced surface uniformity and consequently, lower semiconductor device yield.

[0038] For example, Figure 1 This is a schematic diagram of a typical wafer processing scenario. Figure 1 The wafer processing apparatus shown includes a tray and a nozzle, wherein, Figure 1 The tray shown is a circular tray. The wafer is placed on the tray, with its center aligned with the center of the tray. A nozzle is located above the tray, spraying a processing solution onto the wafer. Figure 1 The direction of the sprayed processing liquid is shown as an example of the direction perpendicular to the wafer surface. The wafer is rotated by driving a tray, wherein... Figure 1 Taking counter-clockwise rotation as an example, the continuously sprayed processing solution is distributed onto the surface of the wafer during its rotation.

[0039] When the nozzle sprays the processing fluid in the direction of the center of the wafer, the processing fluid will be distributed more evenly on the surface of the wafer. Figure 2 This is a schematic diagram illustrating the processing result of nozzle offset according to an embodiment of this disclosure. When the direction of the sprayed processing liquid from the nozzle deviates from the center of the wafer, the rotating wafer will cause turbulence in the liquid flow, resulting in uneven coverage of the processing liquid on the wafer surface, and consequently, uneven processing degree on the wafer surface. Figure 2 The study demonstrates how nozzle position deviation can lead to spin maps, over-etching or low cleanliness in the wafer's central area, resulting in yield loss.

[0040] Therefore, there is a need to provide a method for detecting whether the nozzle position has deviated. The nozzle position detection method, apparatus, electronic device, and storage medium provided in this disclosure, through correspondingly set receivers and transmitters, can detect and monitor the nozzle position in real time, which is beneficial for timely detection of nozzle deviation, thereby enabling timely calibration of the nozzle position and improving the yield of semiconductor devices.

[0041] The technical solutions of this disclosure and how they solve the aforementioned technical problems will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0042] Example 1

[0043] Figure 3 This is a flowchart illustrating a nozzle position detection method provided in an embodiment of the present disclosure. The method is executed by a nozzle position detection device, but can also be a wafer processing device integrating a nozzle position detection device. The method can be implemented by a computer program, such as application software; or by a physical device integrating or installing a related computer program, such as a chip.

[0044] This method is applied to a wafer processing apparatus. The wafer processing apparatus includes a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and are used to spray liquid jets onto the wafer surface. The transceivers include corresponding receivers and transmitters. The receivers and transmitters are arranged on a circumference, with the plane of the circumference higher than the tray. The center of the circumference is located on a perpendicular line to the plane of the tray, and the perpendicular line passes through the center of the tray.

[0045] like Figure 3 As shown, the method includes:

[0046] S100, Provides a wafer placed on the surface of a tray, with the center of the wafer located on a vertical line;

[0047] S200: Control the transmitter to emit a beam, and determine whether the nozzle deviates from the vertical line based on the beam reception result of the receiver corresponding to the transmitter.

[0048] Among them, the tray can be as follows: Figure 1 For the circular tray shown, step S100 involves aligning the center of the wafer with the center of the circular tray in the vertical direction. When the tray is square, step S100 involves aligning the center of the wafer with the center of the square tray in the vertical direction. The tray can also be a triangle, pentagon, or other polygon, as long as it can stably support the wafer. The center of the tray is determined according to its shape.

[0049] Furthermore, when the center of the wafer and the center of the tray are aligned vertically, the wafer also rotates around its own center as the tray rotates around its own center. If the center of the wafer and the center of the tray are not aligned vertically, it is not convenient to control the center of rotation of the wafer to be the center of the wafer.

[0050] Further, in step S200, regarding the direction of the emitted beam, in a first feasible implementation, the emitter emits a beam towards the wafer surface, which is reflected by the wafer surface and received by the corresponding receiver. The deviation of the aiming position is determined based on the receiver's reception result. In a second feasible implementation, the emitter directly emits a beam towards the corresponding receiver in step S200, and the deviation of the aiming position is determined based on the receiver's reception result. This embodiment of the present disclosure, through the correspondingly configured receiver and emitter, can detect and monitor the nozzle position in real time, which is beneficial for timely detection of nozzle deviation and timely calibration of the nozzle position, thereby improving the yield of semiconductor devices.

[0051] Figure 4 This is a top view of a wafer processing apparatus provided in an embodiment of the present disclosure. Figure 5 This is a schematic diagram of a nozzle position detection method provided in an embodiment of this disclosure. The following is in conjunction with... Figure 4 and Figure 5 The nozzle position detection method corresponding to the first feasible implementation of the direction of the emitted beam from the transmitter will be described.

[0052] like Figure 4 As shown, the lines connecting the transmitter and receiver of each transceiver group intersect the vertical line. Figure 4 Taking 6 transceivers as an example, this embodiment does not limit the number of transceivers. Figure 4 Hollow circles represent receivers, and solid circles represent transmitters. Each group of receivers and transmitters can be arranged at equal intervals (e.g., ...). Figure 4 (As shown), they can also be arranged at unequal intervals; receivers of multiple transceivers can be arranged adjacently or distributed (e.g. Figure 4 (As shown); This embodiment does not limit the arrangement of the receiver and transmitter.

[0053] Further, in step S200, controlling the transmitter to emit a beam, and determining whether the nozzle is deviated based on the beam reception result of the receiver corresponding to the transmitter, includes:

[0054] S210. When the nozzle is in the open state, control each transmitter to emit a beam of light toward the wafer surface, and obtain the position of the receiver corresponding to each transmitter receiving the beam of light.

[0055] S220. Determine whether the nozzle position is deviated based on the position of the beam received by the receiver of each transceiver group.

[0056] Specifically, taking the beam path of a set of transmitters and receivers as an example, the principle of step S220 will be explained. (Refer to...) Figure 5The enlarged view shows that when the nozzle is closed, the incident light strikes point D on the wafer surface and is reflected by the wafer surface, producing a second reflected light. When the nozzle is open, due to the refraction of the liquid column, the incident light enters the liquid column at point A with an incident angle ∠1, reaches point B with an exit angle ∠2, is reflected by the wafer surface, and exits at point F with both incident angle ∠2 and exit angle ∠1, producing a first reflected light.

[0057] Combining fundamental physical concepts such as refraction and reflection, it can be deduced that the first and second reflected rays are parallel. Therefore, with Figure 5 The upper end of the wafer processing device shown is the zero reference point. When the beam paths of a set of transmitters and receivers pass through the liquid column, the distance between the point where the receiver receives the emitted light and the zero reference point is 'a'; when the beam paths of a set of transmitters and receivers do not pass through the liquid column, the distance between the point where the receiver receives the emitted light and the zero reference point is 'b'. Since 'a' and 'b' are not equal, the position where the receiver receives the beam can be used as a basis for judging whether the nozzle position has deviated.

[0058] Among them, you can choose Figure 5 The lower end or tray surface of the wafer processing device shown is used as the zero reference point. Accordingly, distances a and b are related to parameters such as the incident angle of the incident light, the refractive index of the liquid column, and the horizontal distance between the emitter and the receiver.

[0059] Furthermore, when the beam paths of the transmitter and receiver pass through the liquid column, the beam path may first be refracted twice by the liquid column and then reflected by the wafer surface; it may also be reflected by the wafer surface first and then refracted twice by the liquid column; or it may first be refracted once by the liquid column, then reflected by the wafer surface, and then refracted a second time by the liquid column. The propagation mode of the beam path described above is related to the deviation distance of the nozzle from the vertical.

[0060] By applying fundamental physical concepts such as refraction and reflection, it can be deduced that regardless of the order in which refraction and reflection occur, when the beam paths of the transmitter and receiver pass through the liquid column, the distance from the position where the receiver receives the beam to the zero reference point is the same. Specifically, when the nozzle deviates from the direction... Figure 5 In the horizontal direction shown, the beam paths of the transmitter and receiver still pass through the liquid column, and the distance between the point where the receiver receives the emitted light and the zero reference point remains 'a'.

[0061] In practical applications, the nozzle may deviate in certain specific directions with a relatively high probability. In some embodiments, a set of transceivers is used to detect the nozzle position. Assume that when the beam paths of a set of transmitters and receivers pass through a liquid column, the distance between the receiver's position and the zero reference point is 'a'; when the beam paths of a set of transmitters and receivers do not pass through a liquid column, the distance between the receiver's position and the zero reference point is 'b'. By selecting a set of transceivers in the direction where the probability of nozzle deviation is low, if the distance between the receiver's position and the zero reference point is 'a', it can be determined with a high probability that the nozzle has not deviated, while the probability of deviation in the same direction is low; if the distance between the receiver's position and the zero reference point is 'b', then the nozzle has definitely deviated. This selective placement of transceivers based on the preferred direction of nozzle deviation is beneficial for improving detection efficiency and reducing the number of transceivers required.

[0062] In some embodiments, multiple sets of transceivers are used to detect the nozzle position. If the distance between the position of the received beam from the zero reference point and the receiver of each transceiver is 'a', it indicates that the nozzle has not deviated. If the distance between the position of the received beam from the zero reference point and the receiver of at least one transceiver is 'b', it indicates that the nozzle has deviated. Using multiple sets of transceivers to detect the nozzle position eliminates the need to pre-determine the preferred direction of nozzle deviation, reducing the implementation difficulty of the nozzle position detection method, making it easier to implement, and further improving the efficiency and accuracy of nozzle deviation detection.

[0063] Furthermore, when multiple transceivers are configured, in practical applications, the mounting height of the transmitter relative to the tray surface, the mounting height of the receivers relative to the tray surface, and the incident angle can be adjusted according to the structure of the wafer processing device. This embodiment does not limit whether the mounting positions and incident angles of each transceiver are consistent, as long as the beam emitted by the transmitter can be received by the corresponding receiver, and the position of the receiver receiving the beam is significantly different depending on whether the beam path passes through the liquid column or not.

[0064] In some embodiments, multiple transceivers are provided, with each transceiver having the same transmitter height above the tray surface; and each transceiver having the same incident angle for emitting a beam of light toward the wafer surface.

[0065] In step S220, based on the position of the beam received by the receivers of each transceiver group, it is determined whether the nozzle position has deviated, including:

[0066] S221. Based on the position of the beam received by the receiver of each transceiver group, detect whether the height from the position of the beam received by each receiver to the surface of the tray is within a predetermined first height range.

[0067] S222. If the height from the position of the received beam to the tray surface of each receiver is within the first height range, then it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated.

[0068] The position of the beam received by the receiver is measured using the tray surface as the zero reference point. Based on the foregoing analysis, it is known that the distance from the position of the receiver receiving the beam to the zero reference point differs when the beam path passes through the liquid column compared to the distance when the beam path does not pass through the liquid column. Furthermore, based on the foregoing analysis, it is also known that when the beam paths of the transmitter and receiver pass through the liquid column, the distance from the position of the receiver receiving the beam to the zero reference point is the same regardless of the order in which the beam path refracts with the liquid column and reflects with the wafer surface. Therefore, a predetermined first height range can be used as a basis for determining whether the nozzle position has deviated.

[0069] In one optional method for obtaining the first height range, the first height range is calculated based on the refractive index of the liquid column, the height from the transmitter to the tray surface, the incident angle, and a preset error value. The first height is a definite numerical value, calculated from the refractive index of the liquid column, the height from the transmitter to the tray surface, and the incident angle. Considering the influence of the liquid film formed by the etching solution or cleaning solution on the wafer surface on the beam path, and errors in the transceiver's manufacturing process, a preset error value is used to calculate the first height range based on the first height.

[0070] In another alternative method for obtaining the first height range, the distance between the position of the beam received by the receiver and the zero reference point is tested multiple times when the nozzle is open, provided that the nozzle position is not deviated. The first height range is determined based on the results of multiple tests.

[0071] In some embodiments, a second height range may also be predetermined. This second height range is the distance from the position where the receiver receives the beam when the beam path does not pass through the liquid column to the zero reference point. Optionally, the tray surface is used as the zero reference point. If it is detected that the height from the position where at least one receiver receives the beam to the tray surface is within the predetermined second height range, it is determined that the nozzle position has deviated; otherwise, it is determined that the nozzle position has not deviated.

[0072] In one optional method for obtaining the second height range, the second height range is calculated based on the height from the transmitter to the tray surface, the incident angle, and a preset error value. The second height is calculated from the height from the transmitter to the tray surface and the incident angle, and is a fixed numerical value. Considering errors in practical applications, such as transceiver manufacturing errors, a preset error value is used to calculate the second height range based on the second height.

[0073] In another alternative method for obtaining the first height range, the distance between the position of the beam received by the receiver and the zero reference point is tested multiple times with the nozzle closed, and the second height range is determined based on the results of multiple tests.

[0074] In practical applications, depending on the range of the position of the light beam received by the receiver, the deviation of the nozzle position can be determined by either the first height range or the second height range; alternatively, the first height range and the second height range can be used simultaneously to determine the deviation of the nozzle position.

[0075] In some embodiments, multiple transceivers are provided, with the transmitter of each transceiver at the same height from the tray surface; the incident angle of the beam emitted by the transmitter of each transceiver to the wafer surface is the same, and the receivers of each transceiver are at the same height; in step S221, based on the position of the beam received by the receiver of each transceiver, it is detected whether the height of the position of the beam received by each receiver from the tray surface is within a predetermined first height range, including:

[0076] S2211. Obtain the beam receiving coordinates collected by the receivers of each group of transceivers;

[0077] S2212. If the beam receiving coordinates collected by the receiver are all within the predetermined coordinate range, it is determined that the height from the position of the beam received by each receiver to the surface of the tray is within the first height range; otherwise, it is determined that the height from the position of the beam received by each receiver to the surface of the tray is not within the first height range; wherein, the coordinate range represents the position coordinates collected by the receiver when the beam emitted at the incident angle to the wafer surface reaches the receiver after passing through the liquid column.

[0078] In this method, the beam receiving coordinates of the receiver are referenced to the origin set by the receiver itself. One optional method for obtaining the predetermined coordinate range involves calculating the predetermined coordinate range of the beam receiving coordinates based on the relative relationship between the origin and the receiver's installation position, the relative relationship between the receiver's installation position and the tray surface, and a first height range. Another optional method involves repeatedly testing the coordinates of the position where the receiver receives the beam while the nozzle is open, assuming the nozzle position remains unchanged, and determining the predetermined coordinate range of the beam receiving coordinates based on the results of these multiple tests.

[0079] In some embodiments, when the height of the beam received by each receiver from the tray surface is the same, the beam receiving coordinate readings collected by each receiver are consistent. Further, taking as an example that the closer the distance of the beam received by the receiver to the tray surface, the larger the beam receiving coordinate reading collected by the receiver. Figure 4It can be seen that when the beam paths of the transmitter and receiver pass through the liquid column, the beam receiving coordinate reading collected by the receiver is less than the reading collected by the receiver when the beam paths of the transmitter and receiver do not pass through the liquid column.

[0080] In some embodiments, the transmitters of each transceiver group emit a light beam toward the wafer surface, and the projection of the reflected light beam formed on the wafer surface intersects at the center of the wafer. In an alternative embodiment, the transmitters of each transceiver group emit light beams toward the wafer surface all directed toward the center of the wafer, i.e., as shown... Figure 5 As shown. In another optional implementation, the transmitter of each transceiver group can emit a beam of light onto the wafer surface without aiming at the center of the wafer. In this case, the installation position of the receiver needs to be determined through testing or calculation to ensure that the receiver can receive the reflected light from the corresponding transmitter. This embodiment does not limit the position where the beam emitted by the transmitter lands on the wafer surface, as long as the position of the beam received by the receiver can identify whether the beam path passes through the liquid column or not.

[0081] The nozzle position detection method disclosed herein is applied to a wafer processing apparatus, which includes a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and are used to spray a liquid column onto the wafer surface. Each transceiver includes a receiver and a transmitter, which are arranged on a circumference. The plane of the circumference is higher than the tray, and the center of the circumference lies on a perpendicular line to the plane of the tray, passing through the center of the tray. The method includes: placing a wafer on the tray surface, with the center of the wafer on the perpendicular line; controlling the transmitter to emit a light beam; and determining whether the nozzle deviates from the perpendicular line based on the light beam received by the receiver corresponding to the transmitter. This disclosure, through the corresponding receiver and transmitter, can detect and monitor the nozzle position in real time, facilitating timely detection of nozzle deviation and subsequent nozzle position calibration, thereby improving the yield of semiconductor devices.

[0082] Example 2

[0083] Figure 6 A flowchart of another nozzle position detection method provided in an embodiment of this disclosure. Figure 7 A front view of another wafer processing apparatus provided in an embodiment of this disclosure. Figure 8 This is a top view of another wafer processing apparatus provided in an embodiment of this disclosure. The following is in conjunction with... Figures 6 to 8 The method for detecting the nozzle position when the direction of the emitted beam from the transmitter is directly toward the direction of the corresponding receiver in step S200 is explained.

[0084] This method is applied to, for example Figure 7 and Figure 8The wafer processing apparatus shown has obstructions on its nozzles; these obstructions are located on the connection line between the transmitter and the corresponding receiver of each transceiver group. Figure 6 As shown, the method includes the following steps:

[0085] S100, Provides a wafer placed on the surface of a tray, with the center of the wafer located on a vertical line;

[0086] S310, Control each transmitter to send a beam of light to its corresponding receiver;

[0087] S320. If no beam is received by any receiver, it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated.

[0088] Specifically, the obstruction can be installed by extending the obstruction horizontally a certain distance around the nozzle (e.g., Figure 7 As shown, a shield can also be installed obliquely extending a certain distance around the nozzle. In this embodiment, the height of the transmitter and receiver relative to the tray surface is not limited, as long as the line connecting the transmitter and the corresponding receiver passes through the shield. Alternatively, the nozzle's own volume can be used as a shield, eliminating the need for an additional shield and simplifying the structure. However, considering the large size of the nozzle, using it as a shield makes it difficult to detect small deviations in the nozzle in a timely manner.

[0089] Furthermore, based on the principle that two intersecting lines determine a point, when at least two beam paths are blocked by the same obstruction, it indicates that the nozzle position has not deviated. In some embodiments, multiple obstructions can be provided, and correspondingly, each obstruction corresponds to at least two sets of transceivers, whose beam paths intersect at the obstruction. Providing multiple obstructions helps improve the accuracy of nozzle position detection.

[0090] The nozzle position detection method disclosed herein is applied to a wafer processing apparatus, which includes a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and are used to spray a liquid column onto the wafer surface. Each transceiver includes a receiver and a transmitter, which are arranged on a circumference. The plane of the circumference is higher than the tray, and the center of the circumference lies on a perpendicular line to the plane of the tray, passing through the center of the tray. The method includes: placing a wafer on the tray surface, with the center of the wafer on the perpendicular line; controlling the transmitter to emit a light beam; and determining whether the nozzle deviates from the perpendicular line based on the light beam received by the receiver corresponding to the transmitter. This disclosure, through the corresponding receiver and transmitter, can detect and monitor the nozzle position in real time, facilitating timely detection of nozzle deviation and subsequent nozzle position calibration, thereby improving the yield of semiconductor devices.

[0091] Example 3

[0092] The apparatus, device, and computer storage medium provided in this disclosure are described below, and their contents and effects can be referred to the method section of the foregoing embodiments.

[0093] Figure 9 This is a schematic diagram of a nozzle position detection device provided in an embodiment of this disclosure. Figure 9 As shown in the embodiments of this disclosure, the nozzle position detection device is applied to a wafer processing apparatus. The wafer processing apparatus includes a tray, a nozzle, and multiple transceivers. The nozzle is disposed above the tray and is used to spray a liquid column onto the wafer surface. The transceiver includes a receiver and a transmitter, which are disposed on a circumference. The plane of the circumference is higher than the tray, and the center of the circumference is located on a perpendicular line to the plane of the tray. The perpendicular line passes through the center of the tray.

[0094] like Figure 9 As shown, the nozzle position detection device includes:

[0095] The first processing module 10 is used to place the wafer on the surface of the tray, with the center of the wafer located on a vertical line;

[0096] The second processing module 20 is used to control the transmitter to emit a beam and determine whether the nozzle position deviates from the vertical line based on the beam reception result of the receiver corresponding to the transmitter.

[0097] In some embodiments, the lines connecting the transmitter and receiver of each transceiver group intersect with a vertical line; the second processing module 20 is specifically used to control each transmitter to emit a beam of light toward the wafer surface when the nozzle is in the open state, and to obtain the position of the receiver corresponding to each transmitter receiving the beam of light; the second processing module 20 is specifically used to determine whether the nozzle position is deviated based on the position of the receiver receiving the beam of light of each transceiver group.

[0098] In some embodiments, the transmitter of each transceiver group is at the same height from the tray surface; the incident angle of the beam emitted by the transmitter of each transceiver group towards the wafer surface is the same; the second processing module 20 is further configured to detect, based on the position of the beam received by the receiver of each transceiver group, whether the height of the position of the beam received by each receiver from the tray surface is within a predetermined first height range; the second processing module 20 is further configured to determine that the nozzle position has not deviated if the height of the position of the beam received by each receiver from the tray surface is within the first height range; otherwise, determine that the nozzle position has deviated.

[0099] In some embodiments, the nozzle position detection device further includes a calculation module for calculating a first height range based on the refractive index of the liquid column, the height of the emitter from the tray surface, the incident angle, and a preset error value.

[0100] In some embodiments, the transmitter of each transceiver emits a beam of light onto the wafer surface, and the projection of the reflected beam formed on the wafer surface intersects at the center of the wafer.

[0101] In some embodiments, the transmitter of each transceiver emits a beam of light toward the center of the wafer surface.

[0102] In some embodiments, the receivers of at least two transceivers are at the same height;

[0103] The second processing module 20 is also specifically used to obtain the beam receiving coordinates collected by the receivers of multiple transceivers;

[0104] The second processing module 20 is further configured to determine that if the beam receiving coordinates acquired by the receivers are all within a predetermined coordinate range, the height from the position of the beam received by each receiver to the surface of the tray is within a first height range; otherwise, it is determined that the height from the position of the beam received by each receiver to the surface of the tray is not within the first height range.

[0105] The coordinate range represents the position coordinates of the receiver when the beam of light emitted at the incident angle toward the wafer surface passes through the liquid column and reaches the receiver.

[0106] In some embodiments, a shield is provided on the nozzle; the shield is located on the line connecting the transmitter and the corresponding receiver of each transceiver set;

[0107] The second processing module 20 is specifically used to control each transmitter to transmit a beam of light to the corresponding receiver;

[0108] The second processing module 20 is further configured to determine that the nozzle position has not deviated if each receiver does not receive the light beam; otherwise, determine that the nozzle position has deviated.

[0109] Figure 10 This is a schematic diagram of the structure of an electronic device provided in Embodiment 3 of this disclosure, as shown below. Figure 10 As shown, the electronic device includes:

[0110] The electronic device includes a processor 291 and a memory 292; it may also include a communication interface 293 and a bus 294. The processor 291, memory 292, and communication interface 293 can communicate with each other via the bus 294. The communication interface 293 can be used for information transmission. The processor 291 can invoke logical instructions stored in the memory 292 to execute the methods of the above embodiments.

[0111] Furthermore, the logic instructions in the aforementioned memory 292 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium.

[0112] The memory 292, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as program instructions / modules corresponding to the methods in the embodiments of this disclosure. The processor 291 executes functional applications and data processing by running the software programs, instructions, and modules stored in the memory 292, thereby implementing the methods in the above-described method embodiments.

[0113] The memory 292 may include a program storage area and a data storage area. The program storage area may store the operating system and application programs required for at least one function; the data storage area may store data created based on the use of the terminal device. Furthermore, the memory 292 may include high-speed random access memory and may also include non-volatile memory.

[0114] This disclosure provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the methods provided in the above embodiments.

[0115] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0116] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A nozzle position detection method, characterized in that, An application is made in a wafer processing apparatus, the apparatus comprising a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and are used to spray a liquid column onto the wafer surface. Each transceiver includes a corresponding receiver and a transmitter. The receiver and transmitter are arranged on a circumference, the plane of which is higher than the tray, and the center of the circumference lies on a perpendicular line to the plane of the tray, the perpendicular line passing through the center of the tray. The line connecting the transmitter and receiver of each transceiver group intersects the perpendicular line. The transmitter of each transceiver group is at the same height from the surface of the tray. The method includes: A wafer is placed on the surface of the tray, with the center of the wafer located on the vertical line; Controlling the transmitter to emit a light beam, and determining whether the nozzle position deviates from the vertical line based on the light beam reception result of the receiver corresponding to the transmitter, includes: When the nozzle is in the open state, each transmitter is controlled to emit a light beam toward the wafer surface, and the position of the receiver corresponding to each transmitter receiving the light beam is obtained; the incident angle of the light beam emitted by the transmitters of each group of transceivers toward the wafer surface is the same; Determining whether the nozzle position has deviated based on the position of the beam received by the receivers of each transceiver group includes: detecting whether the height from the position of the beam received by each receiver to the surface of the tray is within a predetermined first height range; if the height from the position of the beam received by each receiver to the surface of the tray is within the first height range, then it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated. The method further includes: calculating the first height range based on the refractive index of the liquid column, the height of the emitter from the surface of the tray, the incident angle, and a preset error value.

2. The method according to claim 1, characterized in that, The transmitter of each transceiver emits a beam of light onto the wafer surface, and the projection of the reflected beam formed on the wafer surface intersects at the center of the wafer.

3. The method according to claim 2, characterized in that, The transmitter of each transceiver emits a beam of light toward the center of the wafer surface.

4. The method according to claim 1, characterized in that, The receivers of each group of transceivers are at the same height; the step of detecting whether the height from the position of the received light beam by each receiver to the surface of the tray is within a predetermined first height range, based on the position of the light beam received by the receivers of each group of transceivers, includes: Obtain the beam receiving coordinates acquired by the receivers of each group of transceivers; If the beam receiving coordinates collected by the receivers are all within the predetermined coordinate range, then it is determined that the height from the position of the beam received by each receiver to the surface of the tray is within the first height range; otherwise, it is determined that the height from the position of the beam received by each receiver to the surface of the tray is not within the first height range. The coordinate range represents the position coordinates collected by the receiver when the light beam emitted at the incident angle toward the wafer surface passes through the liquid column and reaches the receiver.

5. The method according to claim 1, characterized in that, The nozzle is provided with a shield; the shield is located on the line connecting the transmitter and the corresponding receiver of each transceiver group; The step of controlling the transmitter to emit a light beam and determining whether the nozzle position deviates from the center of the wafer based on the reception result of the receiver corresponding to the transmitter includes: Control each of the transmitters to emit a beam of light to its corresponding receiver; If none of the receivers receives the light beam, it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated.

6. A nozzle position detection device, characterized in that, An apparatus for wafer processing is provided, comprising a tray, nozzles, and multiple transceivers. The nozzles are positioned above the tray and spray liquid jets onto the wafer surface. Each transceiver includes a receiver and a transmitter. The receiver and transmitter are arranged on a circumference, the plane of which is higher than the tray. The center of the circumference lies on a perpendicular line from the plane of the tray, and this perpendicular line passes through the center of the tray. The line connecting the transmitter and receiver of each transceiver intersects the perpendicular line. The transmitters of each transceiver are at the same height from the tray surface. The nozzle position detection device includes: A first processing module is used to place a wafer on the surface of the tray, wherein the center of the wafer is located on the vertical line; The second processing module is used to control the transmitter to emit a light beam, and to determine whether the nozzle position deviates from the vertical line based on the light beam reception result of the receiver corresponding to the transmitter. Specifically, when the nozzle is in the open state, it controls each transmitter to emit a light beam toward the wafer surface, and obtains the position of the receiver corresponding to each transmitter receiving the light beam, wherein the incident angle of the light beam emitted by the transmitter of each group of transceivers toward the wafer surface is the same; and, based on the position of the light beam received by the receivers of each group of transceivers, it determines whether the nozzle position deviates, including: specifically, it further detects whether the height from the position of the light beam received by each receiver to the tray surface is within a predetermined first height range; if the height from the position of the light beam received by each receiver to the tray surface is within the first height range, it is determined that the nozzle position has not deviated; otherwise, it is determined that the nozzle position has deviated. The calculation module is used to calculate the first height range based on the refractive index of the liquid column, the height of the emitter from the surface of the tray, the incident angle, and a preset error value.

7. The nozzle position detection device according to claim 6, characterized in that, The transmitter of each transceiver emits a beam of light onto the wafer surface, and the projection of the reflected beam formed on the wafer surface intersects at the center of the wafer.

8. The nozzle position detection device according to claim 7, characterized in that, The transmitter of each transceiver emits a beam of light toward the center of the wafer surface.

9. The nozzle position detection device according to claim 6, characterized in that, At least two sets of transceivers have receivers of the same height; The second processing module is further configured to obtain the beam receiving coordinates collected by the receivers of each group of transceivers; The second processing module is further configured to determine that if the beam receiving coordinates acquired by the receivers are all within a predetermined coordinate range, the height from the position of the beam received by each receiver to the surface of the tray is within the first height range; otherwise, it is determined that the height from the position of the beam received by each receiver to the surface of the tray is not within the first height range. The coordinate range represents the position coordinates collected by the receiver when the light beam emitted at the incident angle toward the wafer surface passes through the liquid column and reaches the receiver.

10. The nozzle position detection device according to claim 6, characterized in that, The nozzle is provided with a shield; the shield is located on the line connecting the transmitter and the corresponding receiver of each transceiver group; The second processing module is specifically used to control each of the transmitters to emit a light beam to the corresponding receiver; The second processing module is further configured to determine that the nozzle position has not deviated if each receiver fails to receive the light beam; otherwise, determine that the nozzle position has deviated.

11. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory to implement the method as described in any one of claims 1 to 5.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1 to 5.

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