A temperature and voltage acquisition method, a temperature and voltage acquisition component, and a battery module

Abstract

A temperature and voltage acquisition method, a temperature and voltage acquisition component, and a battery module belong to the field of battery technology. The first end of the acquisition piece is set as a shell structure with an opening, and the second end of the acquisition piece is set as a buffer deformation structure; the temperature sensor is set in the shell structure, and a nickel layer is set on the outer wall of the shell structure surrounding the opening; the shell structure provided with the nickel layer is welded to the circuit board to seal the temperature sensor in the shell structure. When the temperature and voltage of the battery cell in the battery module are acquired, the second end of the acquisition piece can be connected to the pole of the battery cell, and the temperature and voltage of the battery cell are transmitted to the temperature sensor and the nickel layer at the first end through the second end, and then the temperature signal and the voltage signal are transmitted to the circuit board through the temperature sensor and the nickel layer. Using the temperature and voltage acquisition method provided by the present application, the battery module structure can be simplified and the probability of temperature jump and voltage jump when acquiring signals can be reduced.

Description

Technical Field

[0001] The present application relates to the field of battery technology, and in particular to a temperature and voltage acquisition method, a temperature and voltage acquisition component, and a battery module. Background Art

[0002] As the electric vehicle industry continues to develop, the packaging technology for electric vehicle power battery systems is also constantly improving. Automation and modularization of power battery system packaging are gradually becoming the mainstream of development. The battery module is the most important component of a power battery system. Currently, power battery modules primarily collect battery module status information, such as battery module voltage and temperature, through FPC connectors. This information is then transmitted to a battery management system connected to the FPC connector.

[0003] While this method is effective in collecting battery module status information, it does have certain drawbacks. Low-voltage data acquisition from the module often results in voltage and temperature jumps. The temperature and voltage acquisition components are complex to set up, and the acquisition circuits are prone to short circuits and open circuits. Summary of the Invention

[0004] Based on the above-mentioned deficiencies, the present application provides a temperature and voltage acquisition method, a temperature and voltage acquisition component and a battery module to partially or completely improve the problems of voltage jump and temperature jump in the related art.

[0005] This application is implemented as follows:

[0006] In a first aspect, an example of the present application provides a temperature and voltage acquisition method, which uses an acquisition sheet to transmit the temperature signal and voltage signal of the battery cell to a circuit board; the first end of the acquisition sheet is provided with a temperature sensor and a nickel-plated layer, and the temperature sensor and the nickel-plated layer are used to connect to the circuit board;

[0007] Temperature and voltage acquisition methods include:

[0008] The temperature sensor and nickel-plated layer at the first end are connected to the circuit board, and the second end is connected to the pole of the battery cell, so that the temperature and voltage of the battery cell are simultaneously transmitted to the temperature sensor and nickel-plated layer through the second end, and then transmitted to the circuit board.

[0009] In the above implementation process, a temperature sensor and a nickel-plated layer are simultaneously set at the first end of the acquisition piece, the temperature sensor and the nickel-plated layer are connected to the circuit board, and the second end of the acquisition piece is connected to the pole of the battery cell. When only one acquisition piece is set, the voltage signal and temperature signal of the battery cell can be collected at the same time, and the collected voltage signal and temperature signal can be transmitted to the circuit board at the same time.

[0010] This example provides a temperature and voltage acquisition method that uses the same acquisition chip to simultaneously collect temperature and voltage signals, eliminating the need for separate voltage and temperature acquisition chips. Furthermore, this method simplifies or even eliminates wiring harness connections, eliminating the need for wiring harness isolation plates. This prevents short circuits or open circuits caused by complex wiring harness connections, thereby reducing the likelihood of temperature and voltage jumps during acquisition.

[0011] In combination with the first aspect, in a first possible implementation manner of the first aspect of the present application, the first end is a shell structure, the shell structure has an opening and a first outer wall surrounding the opening; the first outer wall is provided with a nickel plating layer;

[0012] Methods for connecting the temperature sensor and nickel plating to the circuit board include:

[0013] A first soldering pad and a second soldering pad surrounding the first soldering pad are provided on the circuit board; a temperature sensor is soldered to the first soldering pad; a housing structure is provided to cover the temperature sensor, and a first outer wall is soldered to the second soldering pad;

[0014] Optionally, a copper plating layer, a nickel plating layer and a tin plating layer are sequentially electroplated on the first outer wall;

[0015] Optionally, the collection sheet is an aluminum sheet;

[0016] Optionally, the second end has a buffer deformation section;

[0017] Optionally, the circuit board includes a PCB;

[0018] Optionally, the temperature sensor comprises an NTC.

[0019] In the above implementation, the first section is configured as a housing structure, and an opening is provided in the housing structure to facilitate placement of the temperature sensor within the housing structure. A nickel-plated layer is formed on the first outer wall of the housing structure surrounding the opening. The first outer wall is welded to the circuit board to seal the temperature sensor within the housing structure while also enabling voltage signal transmission through the nickel-plated layer. The temperature sensor and the nickel-plated layer are respectively welded to the first and second solder pads on the circuit board, enabling the temperature signal and voltage signal transmitted from the second end connected to the pole to be transmitted to the circuit board.

[0020] The temperature sensor is enclosed in a housing structure, which can prevent the temperature sensor from coming into contact with water in the air, and to a certain extent, can avoid temperature jumps during temperature acquisition.

[0021] Furthermore, a copper plating layer, a nickel plating layer and a tin plating layer are formed in sequence on the first outer wall of the shell structure, which can improve the conductivity and adhesion of the first end surface of the collection piece, increase the hardness of the plating surface, and enable better welding of the first outer wall and the second soldering pad in the circuit board.

[0022] Furthermore, a buffer deformation section is provided at the second end for connection with the pole of the battery cell, which can buffer the impact force generated by the vibration of the battery module, making the connection between the acquisition piece and the pole and circuit board of the battery cell more firm, reducing the probability of open circuit and short circuit, and thereby reducing the probability of voltage jump and temperature jump during temperature and voltage acquisition.

[0023] Furthermore, by using an NTC to collect temperature signals, the approximate temperature of the collected battery cell can be obtained through the NTC's RT characteristics. Furthermore, placing the NTC inside the housing structure can prevent contact between the NTC and water in the air, thereby preventing silver migration in the NTC and reducing the probability of temperature jumps when using the temperature acquisition component to collect battery cell temperature.

[0024] In a second aspect, an example of the present application provides a temperature and voltage acquisition component, including:

[0025] A busbar having a first connecting portion and a second connecting portion connected to each other; the first connecting portion is used to connect to the pole of the battery cell, and the second connecting portion includes a first collecting piece;

[0026] The first collection piece has a first buffer section and a protective section; the protective section is a shell structure, the shell structure has a first opening and a first outer wall surrounding the first opening; the temperature sensor is disposed inside the shell structure through the first opening;

[0027] circuit board; the first outer wall is sealedly connected to the front of the circuit board, and the temperature sensor is respectively connected to the circuit board and the housing structure;

[0028] Optionally, the temperature sensor is an NTC;

[0029] Optionally, the collection sheet is an aluminum sheet;

[0030] Optionally, the circuit board includes a PCB.

[0031] In the above implementation process, the temperature and voltage acquisition component provided in the example of the present application includes a bus and a circuit board. The first connecting portion of the bus is used to connect to the pole of the battery cell. The second connecting portion of the bus is provided with a first acquisition piece having a first buffer section and a protective section to transfer the temperature of the battery cell to the first acquisition piece; the temperature sensor at the protective section is connected to the circuit board to transmit the temperature signal at the first acquisition piece to the circuit board; and the protective section encloses the temperature sensor in a shell structure. The shell structure can prevent the temperature sensor from contacting water in the air, and the first buffer section can absorb the impact force generated by the vibration of the battery module, which can avoid temperature jumps during acquisition to a certain extent.

[0032] By using an NTC to collect temperature signals, the approximate temperature of the cell can be obtained through the NTC's RT characteristics. Furthermore, placing the NTC inside the housing structure can prevent contact between the NTC and water in the air, thereby preventing silver migration in the NTC and reducing the chance of temperature jumps when using the temperature acquisition component to collect the cell's temperature.

[0033] In combination with the second aspect, in a first possible implementation manner of the second aspect of the present application, the buffer segment is an arched structure.

[0034] Since the two ends of the first buffer section are respectively connected to the bus and the protective section, when the battery module (including multiple battery cells) vibrates, the first buffer section with an arched structure can absorb the force generated by the vibration impact, thereby making the connection between the first collection piece and the bus and the circuit board more secure, and stably transmitting the temperature of the battery cell to the first collection piece, thereby enabling the temperature sensor to stably transmit the temperature signal to the circuit board (the first collection piece provided with the first buffer section can have good contact with the battery cell and the circuit board and conduct heat evenly) to obtain the temperature signal of the battery cell.

[0035] In combination with the second aspect, in a second possible implementation manner of the second aspect of the present application, the inner wall of the shell structure is further thermally connected to a thermal pad, and the temperature sensor is thermally connected to the thermal pad.

[0036] In the above implementation process, a thermal pad is provided on the inner wall of the shell structure, and the temperature sensor is thermally connected to the inner wall of the shell through the thermal pad. Since the thermal pad usually has good thermal conductivity and certain elasticity, the thermal contact between the temperature sensor and the inner wall of the shell is better, further reducing the probability of temperature jump during temperature acquisition.

[0037] In combination with the second aspect, in a third possible implementation of the second aspect of the present application, the first outer wall is provided with a nickel layer to simultaneously transmit the temperature signal and the voltage signal to the circuit board through the first acquisition sheet;

[0038] Alternatively, the second connecting part is connected to a nickel sheet, and the nickel sheet is spaced apart from the collection sheet; the nickel sheet has a second buffer section and a connecting section; the second buffer section is an arched structure, and the connecting section has a support foot; an end of the second buffer section away from the support foot is used to connect to the second connecting part, and the support foot is used to connect to the circuit board to transfer the voltage of the battery cell to the circuit board.

[0039] In the above implementation process, a nickel layer is provided on the first outer wall of the first acquisition piece so that the voltage signal and the temperature signal can be transmitted to the circuit board at the same time by using the first acquisition piece. A nickel layer for voltage signal acquisition and a temperature sensor for temperature acquisition are provided at the protective section of the first acquisition piece at the same time, and the nickel layer and the temperature sensor are connected to the circuit board, and then the temperature and voltage signals of the battery cell are transmitted to the circuit board at the same time by using the same acquisition piece, which can avoid the need to separately provide a voltage acquisition nickel sheet and a temperature acquisition sheet. In addition, the temperature and voltage acquisition assembly provided in this example can also simplify the wiring harness connection setting or even avoid wiring harness connection, eliminate the need to provide a wiring harness isolation plate, and avoid short circuits or open circuits caused by complex wiring harness connection relationships, thereby reducing the probability of temperature jumps and voltage jumps during acquisition.

[0040] Alternatively, a nickel sheet can be placed at the second connection portion to collect voltage signals. A second buffer segment can be provided at the nickel sheet to absorb the force generated by vibration and impact of the battery module, thereby strengthening the connection between the nickel sheet, the cell busbar, and the circuit board, reducing the probability of open circuits and short circuits, and further reducing the probability of voltage jumps during voltage collection.

[0041] In combination with the second aspect, in a fourth possible implementation manner of the second aspect of the present application, the first outer wall is laminated and provided with a copper layer, a nickel layer and a tin layer.

[0042] In the above implementation process, a copper layer, a nickel layer and a tin layer are sequentially provided on the first outer wall connected to the circuit board. While simultaneously collecting voltage and temperature signals through the first acquisition sheet, the conductivity and adhesion of the first outer wall of the first acquisition sheet can be improved, the hardness of the coating surface can be increased, and the first outer wall and the circuit board can be better connected.

[0043] In combination with the second aspect, in a fifth possible implementation of the second aspect of the present application, the temperature and voltage acquisition component further includes a buffer pad; the buffer pad has a first surface and a second surface arranged opposite to each other, the first surface is arranged on the back side of the circuit board, and the second surface is used to be arranged on the surface of the battery cell to support the circuit board on the battery cell.

[0044] In the above implementation, a buffer pad is provided on the back of the circuit board. The buffer pad has a certain elasticity and can absorb the impact force generated by the vibration of the battery module. When the circuit board is placed on the battery cell through the buffer pad, the buffer pad can further strengthen the connection between the first collecting member of the circuit board and the battery cell, further reducing temperature jumps.

[0045] In combination with the second aspect, in a sixth possible implementation of the second aspect of the present application, the temperature and voltage acquisition component further includes a battery management system; and the circuit board is signal-connected to the battery management system.

[0046] In the above implementation process, the circuit board is connected to the battery management system signal to obtain the collected voltage and temperature information and determine the usage status of the battery module (including multiple battery cells).

[0047] In a third aspect, an example of the present application further provides a battery module, comprising:

[0048] The temperature and voltage acquisition component provided in the second aspect;

[0049] Multiple battery cells; the battery cells have a top cover and an electrode column, the electrode column protrudes from the top cover; the first connecting portion is connected to the electrode column, and the circuit board is arranged on the top cover.

[0050] In the above implementation process, in the battery module provided in this example, the temperature and voltage acquisition component can collect the temperature signal and voltage signal of the battery cell, absorb the impact force generated by the vibration of the battery module, and reduce the probability of temperature jump and voltage jump during acquisition.

[0051] The battery module provided in this example eliminates the need for a wiring harness isolation plate and has a simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art.

[0053] Figure 1 A schematic diagram of the structure of the battery module provided for this application example;

[0054] Figure 2 A first structural diagram of a temperature and voltage acquisition component provided as an example of this application;

[0055] Figure 3 A second structural diagram of the temperature and voltage acquisition component provided in the example of this application;

[0056] Figure 4 A schematic structural diagram of the first acquisition sheet provided in this application example;

[0057] Figure 5A first cross-sectional schematic diagram of a protection segment provided as an example of this application;

[0058] Figure 6 A second cross-sectional schematic diagram of the protection segment provided in the example of this application;

[0059] Figure 7 A schematic diagram of the structure of the circuit board provided for this application example;

[0060] Figure 8 Schematic diagram of the structure of the nickel sheet provided as an example in this application.

[0061] Icons: 1-battery module; 10-temperature and voltage acquisition component; 11-bus; 111-first connecting part; 112-second connecting part; 12-first acquisition piece; 121-first buffer section; 122-protective section; 123-first outer wall; 124-temperature sensor; 125-thermal pad; 126-nickel layer; 13-circuit board; 131-first soldering pad; 132-second soldering pad; 14-nickel sheet; 141-second buffer section; 142-connecting section; 143-support leg; 15-buffer pad; 20-battery cell; 21-top cover; 22-electrode column. DETAILED DESCRIPTION

[0062] The embodiments of the present application will be described in detail below with reference to the examples, but it will be understood by those skilled in the art that the following examples are merely illustrative of the present application and should not be considered as limiting the scope of the present application. In the examples, if specific conditions are not specified, the conditions are carried out according to conventional conditions or manufacturer recommendations. The reagents or instruments used are not specified by the manufacturer and are conventional products that can be purchased commercially.

[0063] As the electric vehicle industry continues to develop, the packaging technology of electric vehicle power battery systems is also constantly improving. Automation and modularization of power battery system packaging are gradually becoming the mainstream of development.

[0064] The battery module in the power battery system is the most important. At present, the power battery module basically collects the status information of the battery module through the FPC connector, such as the voltage information and temperature information of the battery module, and transmits the collected battery module status information to the battery management system connected to the FPC connector.

[0065] The inventors discovered that when using existing methods to collect low-voltage signals from modules, voltage and temperature jumps often occur. After analyzing the causes of these frequent voltage and temperature jumps, the inventors concluded that existing collection circuits are prone to short circuits and open circuits, which in turn lead to temperature and voltage jumps.

[0066] Based on this, the inventor provides a battery module 1 and a temperature and voltage acquisition component 10 .

[0067] See also Figure 1 The battery module 1 includes a temperature and voltage acquisition component 10 and a battery cell 20. Figure 2 and Figure 3 The temperature and voltage acquisition component 10 includes a busbar 11 , a first connection portion 111 of the busbar 11 is connected to the battery cell 20 , and a second connection portion 112 of the busbar 11 is connected to the first acquisition piece 12 .

[0068] See also Figure 4 The first acquisition piece 12 includes a first buffer section 121 and a protective section 122. The protective section 122 is a shell structure having a first outer wall 123 surrounding the edge of the first opening. The temperature sensor 124 is disposed within the shell structure through the first opening. The first outer wall 123 is sealed to the circuit board 13 to obtain temperature signals of the battery cells 20 in the battery module 1.

[0069] Since the first buffer section 121 can buffer the impact force generated by the vibration of the battery module 1, the protection section 122 can prevent the temperature sensor 124 from contacting water vapor in the air, thereby reducing the probability of temperature jump during acquisition.

[0070] The temperature and voltage acquisition component 10 and the battery cell 20 in the battery module 1 provided by the example of this application are further described in detail below in conjunction with the accompanying drawings.

[0071] The temperature and voltage acquisition component 10 includes a bus bar 11 , a first acquisition chip 12 and a circuit board 13 .

[0072] This application does not limit the specific configuration of the bus 11, and relevant personnel can make corresponding adjustments as needed.

[0073] In some possible implementations, the first connection portion 111 in the busbar 11 has multiple connection positions and can be connected to multiple battery cells 20 .

[0074] The second connection portion 112 in the busbar 11 has multiple connection positions, which can be connected to multiple first acquisition pieces 12, or can also be connected to a voltage acquisition piece for separately acquiring voltage signals.

[0075] Furthermore, in order to facilitate the connection between the battery cell 20 and the first collecting plate 12 , a plurality of pads may be provided at the first connecting portion 111 and the second connecting portion 112 of the busbar 11 to facilitate welding.

[0076] The first collecting piece 12 has a first buffer section 121 and a protection section 122 , and the protection section 122 is a shell structure.

[0077] The present application does not limit the specific configuration of the first acquisition piece 12, and relevant personnel can make corresponding adjustments as needed.

[0078] In some possible implementations, the first collecting sheet 12 may be an aluminum sheet, and the first buffer section 121 in the aluminum sheet is S-shaped along the thickness direction of the aluminum sheet. Alternatively, please continue to refer to Figure 4 The first buffer section 121 in the aluminum sheet is an arched structure.

[0079] In some possible implementations, the protection section 122 is a rectangular shell structure having a first opening portion, so that the temperature sensor 124 can be placed in the shell structure through the first opening portion.

[0080] For further information, see Figure 5 To facilitate connecting the protective section 122 of the housing structure to the circuit board 13 and thereby sealing the first opening, the first outer wall 123 of the housing structure surrounding the edge of the opening can be configured as a flanged structure. When the housing structure is connected to the circuit board 13, the flanged edge can be aligned with the circuit board 13, thereby sealing the temperature sensor 124 within the housing structure.

[0081] Furthermore, this application does not limit how the protective segment 122 is connected to the circuit board 13, nor the specific configuration of the temperature sensor 124. In some possible embodiments, the flange surrounding the first opening of the housing structure can be welded to the circuit board 13. Furthermore, corresponding welding process holes can be provided at the flange to improve welding quality. Laser welding, ultrasonic welding, or soldering can be used for welding.

[0082] The temperature sensor 124 may be an NTC. When the temperature transmitted to the NTC changes, the resistance value of the NTC also changes, and the change in the resistance value of the NTC can be used to determine the temperature change. The NTC can sensitively detect small temperature differences.

[0083] Alternatively, the temperature sensor 124 may be a PTC thermistor, or other thermistors.

[0084] In order to place the NTC in the sealed space formed by the circuit board 13 and the shell structure, and to transfer the temperature at the shell structure to the NTC in the shell structure, and then transfer the temperature signal to the circuit board 13 through the temperature-resistance characteristics of the NTC, in some possible embodiments, one end of the NTC can be welded to the circuit board 13, and then the shell structure is covered around the NTC, and the first outer wall 123 of the flange structure is welded to the circuit board 13.

[0085] Furthermore, in order to better transfer the temperature of the housing structure to the temperature sensor 124 , a thermal pad 125 may be provided on the inner wall of the housing structure.

[0086] This application does not limit how the temperature voltage acquisition component 10 performs voltage acquisition. In some possible implementations, please refer to Figure 6 , a nickel layer 126 may be provided on the first outer wall 123 .

[0087] When the first outer wall 123 is brought into contact with the circuit board 13 to close the first opening, the temperature and voltage signals transmitted from the first connection portion 111 of the busbar 11 can be simultaneously transmitted to the first collection piece 12 and transmitted from the temperature sensor 124 and the nickel layer 126 at the protective section 122 of the first collection piece 12 to the circuit board 13.

[0088] Furthermore, in order to improve the welding performance between the first outer wall 123 and the circuit board 13 and improve the conductivity at the first outer wall 123 , a copper layer, a nickel layer 126 and a tin layer may be sequentially provided on the first outer wall 123 .

[0089] Furthermore, the example of the present application also provides a temperature and voltage acquisition method for transmitting the temperature and voltage signals of the battery cell 20 to the circuit board 13. The temperature and voltage acquisition method includes:

[0090] The first end of the first collection piece 12 is connected to the circuit board 13 , and the second end of the first collection piece 12 is connected to the pole of the battery cell 20 , so that the temperature and voltage of the battery cell 20 are simultaneously transmitted from the second end to the first end, and then transmitted to the circuit board 13 .

[0091] The first end of the first collection piece 12 is provided with a temperature sensor 124 and a nickel layer 126 . The temperature sensor 124 and the nickel layer 126 are used to connect with the circuit board 13 .

[0092] This application does not limit how the temperature sensor 124 and the nickel layer 126 are simultaneously provided at the first end of the first collection sheet 12. In some possible embodiments, the temperature sensor 124 is embedded within the housing structure, and a copper layer, a nickel layer 126, and a tin layer are sequentially electroplated on the first outer wall 123. Furthermore, a copper layer, a nickel layer 126, and a tin layer can be sequentially electroplated on the surface of the housing structure, that is, the copper layer, the nickel layer 126, and the tin layer are provided on both the inner and outer walls of the housing structure.

[0093] Furthermore, this application does not limit how to connect the temperature sensor 124 and the nickel layer 126 to the circuit board 13. In some possible implementations, please refer to Figure 7 A first soldering pad 131 and a second soldering pad 132 surrounding the first soldering pad 131 can be set on the circuit board 13, and the temperature sensor 124 can be soldered to the first soldering pad 131; the shell structure is covered on the temperature sensor 124, and the first outer wall 123 is soldered to the second soldering pad 132.

[0094] Furthermore, the welding method may be laser welding, ultrasonic welding or soldering.

[0095] Alternatively, please continue to Figure 5 , the nickel layer 126 is not provided on the first outer wall 123 of the first collecting sheet 12. Figure 3 In some possible implementations, a nickel sheet 14 can be connected to the second connection portion 112 of the busbar 11, and the other end of the nickel sheet 14 can be connected to the circuit board 13. The first connection portion 111 of the busbar 11 transmits the temperature and voltage to the second connection portion 112. At the second connection portion 112, the temperature is transmitted to the temperature sensor 124 on the first acquisition sheet 12, and the voltage is transmitted to the nickel sheet 14. The temperature signal and voltage signal are then transmitted to the circuit board 13 via the temperature sensor 124 and the nickel sheet 14, respectively.

[0096] The present application does not limit the specific configuration of the nickel sheet 14. In order to reduce the probability of voltage jump during acquisition, in some possible implementations, please refer to Figure 8 The nickel sheet 14 has a second buffer section 141 and a connecting section 142. The end of the nickel sheet 14 away from the connecting section 142 is connected to the busbar 11, and the connecting section 142 is connected to the circuit board 13 to transmit the voltage of the battery cell 20 to the circuit board 13.

[0097] This application does not limit how the nickel sheet 14 is connected to the circuit board 13. For some possible implementations, please continue to refer to Figure 8 A leg 143 is provided at the end of the connecting section 142 away from the second buffer section 141, and the leg 143 is welded to the circuit board 13. Furthermore, corresponding welding holes can be provided on the circuit board 13 to facilitate welding the leg 143 to the welding holes of the circuit board 13. Furthermore, laser welding, ultrasonic welding, or soldering can be used to weld the leg 143.

[0098] The present application does not limit the specific configuration of the second buffer section 141. In some possible implementations, the second buffer section 141 has the same structure as the first buffer section 121. Figure 5 The second buffer section 141 and the first buffer section 121 are arch structures.

[0099] The circuit board 13 is used to receive at least the temperature signal and the voltage signal. The present application does not limit the specific type of the circuit board. In some possible implementations, the circuit board 13 is a PCB (Printed Circuit Board); or, the circuit board 13 is an FPC (Flexible Printed Circuit).

[0100] Furthermore, in order to reduce the impact of the vibration of the battery module 1 on the temperature and voltage stability during the acquisition process, in some possible implementations, please continue to refer to Figure 7 The temperature and voltage acquisition component 10 also includes a buffer pad 15 .

[0101] The buffer pad 15 has a first surface and a second surface disposed opposite each other. The first surface is disposed on the back side of the circuit board 13 (the front side of the circuit board 13 is connected to the first acquisition sheet 12 and may also be connected to the nickel sheet 14). When using the temperature and voltage acquisition assembly 10 to collect signals from the battery cell 20, the second surface of the buffer pad 15 can be placed on the surface of the battery cell 20, and the circuit board 13 is then supported on the battery cell 20 by the buffer pad 15. The buffer pad 15 can absorb the impact force generated by the vibration of the battery module 1, thereby further strengthening the connection between the circuit board 13 and the busbar 11 via the first acquisition sheet 12.

[0102] Furthermore, to facilitate timely display of temperature and voltage signals and timely processing or control of battery cells, the temperature and voltage acquisition component 10 also includes a battery management system (BMS battery system, not shown in the figure). The circuit board 13 that receives the temperature and voltage signals is connected to the input terminal signal of the battery management system to transmit the temperature and voltage signals to the battery management system.

[0103] Furthermore, the connection mode may be a wired connection or a wireless connection. The battery management system may be a battery management system unit of the prior art, and this application does not impose any limitation thereto.

[0104] The battery module 1 includes a plurality of battery cells 20 , and the plurality of battery cells 20 may be connected in parallel or in series, which is not limited in this application.

[0105] The battery cell 20 has a top cover 21 and an electrode column 22. Figure 1 , the electrode column 22 protrudes from the top cover 21.

[0106] This application does not limit how the battery cell 20 is connected to the temperature and voltage acquisition component 10, and relevant personnel can make corresponding choices as needed.

[0107] In some possible implementations, the first connection portion 111 of the busbar 11 may be welded to the electrode column 22 of the battery cell 20 , and the circuit board 13 may be placed on the top cover 21 .

[0108] Furthermore, the busbar 11 can be connected to the electrode posts 22 of multiple battery cells 20 at the same time.

[0109] Alternatively, a buffer pad 15 may be attached between the circuit board 13 and the top cover 21 .

[0110] Furthermore, the battery module 1 includes a housing to facilitate placement of the battery cells 20. A plurality of battery cells 20 are placed in the housing.

[0111] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A temperature and voltage acquisition method, characterized in that: The temperature signal and voltage signal of the battery cell are transmitted to the circuit board by using a collection piece; the first end of the collection piece is provided with a temperature sensor and a nickel-plated layer, and the temperature sensor and the nickel-plated layer are used to connect to the circuit board; The collection sheet is an aluminum sheet; The temperature and voltage acquisition method comprises: The temperature sensor and the nickel-plated layer at the first end are connected to the circuit board, and the second end is connected to the pole of the battery cell, so that the temperature and voltage of the battery cell are simultaneously transmitted to the temperature sensor and the nickel-plated layer through the second end, and then transmitted to the circuit board; the second end has a buffer deformation section; The first end is a shell structure having an opening and a first outer wall surrounding the opening; the first outer wall is provided with the nickel plating layer; The method of connecting the temperature sensor and the nickel-plated layer to the circuit board includes: A first soldering pad and a second soldering pad surrounding the first soldering pad are provided on the circuit board; the temperature sensor is soldered to the first soldering pad; the housing structure is covered on the temperature sensor, and the first outer wall is soldered to the second soldering pad.

2. The temperature and voltage acquisition method according to claim 1, characterized in that: Electroplating the first outer wall in sequence to form a copper plating layer, the nickel plating layer and a tin plating layer; And / or, the circuit board includes a PCB; And / or, the temperature sensor includes an NTC.

3. A temperature and voltage acquisition component, characterized in that: include: A busbar having a first connecting portion and a second connecting portion connected to each other; the first connecting portion is used to connect to the pole of the battery cell, and the second connecting portion includes a first collecting piece; The first collection piece has a first buffer section and a protective section; the protective section is a shell structure, the shell structure has a first opening and a first outer wall surrounding the first opening; the temperature sensor is disposed inside the shell structure through the first opening; circuit board; the first outer wall is sealedly connected to the front of the circuit board, and the temperature sensor is connected to the circuit board and the housing structure respectively; the first outer wall is provided with a nickel layer to simultaneously transmit the temperature signal and the voltage signal to the circuit board through the first acquisition sheet; the first acquisition sheet is an aluminum sheet.

4. The temperature and voltage acquisition component according to claim 3, characterized in that: The temperature sensor is an NTC; and / or the circuit board includes a PCB.

5. The temperature and voltage acquisition component according to claim 3, characterized in that: The buffer section is an arched structure.

6. The temperature and voltage acquisition component according to claim 3, characterized in that: The inner wall of the housing structure is further thermally connected to a thermal pad, and the temperature sensor is thermally connected to the thermal pad.

7. The temperature and voltage acquisition component according to claim 3, characterized in that: The first outer wall is laminated with a copper layer, the nickel layer and a tin layer.

8. The temperature and voltage acquisition component according to claim 3, characterized in that: The temperature and voltage acquisition component also includes a buffer pad; the buffer pad has a first surface and a second surface arranged opposite to each other, the first surface is arranged on the back of the circuit board, and the second surface is used to be arranged on the surface of the battery cell to support the circuit board on the battery cell.

9. The temperature and voltage acquisition component according to claim 3, characterized in that: The temperature and voltage acquisition component also includes a battery management system; the circuit board is signal-connected to the battery management system.

10. A battery module, characterized in that: include: The temperature and voltage acquisition component according to any one of claims 3 to 9; Multiple battery cells; The battery cell has a top cover and an electrode column, and the electrode column protrudes from the top cover; The first connecting portion is connected to the electrode column, and the circuit board is disposed on the top cover.

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