Display panel and manufacturing method thereof, display device and spliced ​​display device

Abstract

The present invention provides a display panel and a preparation method thereof, a display device and a spliced ​​display device. The display panel includes: a color film substrate, an array substrate and a first conductive part; a display area and a peripheral area are formed on the display panel, and the peripheral area surrounds the display area; the color film substrate is opposite to the array substrate; the array substrate includes a pixel circuit and a second conductive part, the pixel circuit is located in the display area, and the second conductive part is located in the peripheral area; the second conductive part is connected to the pixel circuit; the pixel circuit and the second conductive part are located on the side of the array substrate facing the color film substrate; the first conductive part is located on the side of the array substrate and the side of the color film substrate, the first end of the first conductive part is located on the side of the color film substrate, the second end is located on the side of the array substrate, and the first conductive part is connected to the second conductive part. The technical solution provided by the embodiment of the present invention can reduce the width of the peripheral area, which is conducive to achieving a narrow frame and increasing the screen-to-body ratio.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, a display device and a spliced ​​display device. Background Art

[0002] In the related technologies, with the continuous integration and development of display technology and control technology, super-large screens, multi-screen displays, and clear and realistic display effects have made industries such as command monitoring, business centers, high-end conferences, and private theaters flock to super-large display screens. However, in the field of large-screen display system engineering, since the production cost of super-large display screens above 100 inches is much higher than that of large-size display screens such as 55 inches, and due to process and equipment limitations, the maximum size of a single LCD screen is 110 inches, therefore, display devices composed of multiple screens spliced ​​together have appeared.

[0003] However, since the liquid crystal in the LCD panel is fluid, a sealant is needed to seal the liquid crystal in a specific area, and the area where the sealant is used cannot be used for display. In addition, a certain distance needs to be reserved for the display panel grinding in the glass cutting process to ensure that the pixel area of ​​the display panel can display normally. This causes a "seam" that cannot be completely eliminated in the spliced ​​LCD screen. How to reduce the width of the "seam" is a technical problem that needs to be solved. Summary of the invention

[0004] The present invention provides a display panel and a manufacturing method thereof, a display device and a spliced ​​display device to solve the deficiencies in the related art.

[0005] The invention provides a display panel and a manufacturing method thereof, a display device and a spliced ​​display device.

[0006] According to a first aspect of an embodiment of the present invention, there is provided a display panel, comprising: a color filter substrate, an array substrate and a first conductive portion, wherein a display area and a peripheral area are formed on the display panel, wherein the peripheral area surrounds the display area;

[0007] The color filter substrate is opposite to the array substrate; the array substrate comprises a pixel circuit and a second conductive portion, the pixel circuit is located in the display area, and the second conductive portion is located in the peripheral area; the second conductive portion is connected to the pixel circuit; the pixel circuit and the second conductive portion are located on a side of the array substrate facing the color filter substrate;

[0008] The first conductive part is located on the side of the array substrate and the side of the color film substrate, the first end of the first conductive part is located on the side of the color film substrate, the second end is located on the side of the array substrate, and the first conductive part is connected to the second conductive part.

[0009] In one embodiment, the distance between the first end of the first conductive portion and the second end of the first conductive portion is smaller than the distance between the first surface of the color filter substrate away from the array substrate and the second surface of the array substrate away from the color filter substrate.

[0010] In one embodiment, the first conductive portion is located between a first central axis of a side surface of the color filter substrate and a second central axis of a side surface of the array substrate, and the first central axis and the second central axis are respectively perpendicular to a direction from the first end of the first conductive portion to the second end of the first conductive portion.

[0011] In one embodiment, the first conductive part is prepared by a transfer process, the distance between the first end of the first conductive part and the first central axis is a first distance, the distance between the second end of the first conductive part and the second central axis is a second distance, and the first distance is the same as the second distance.

[0012] In one embodiment, the display panel further includes a chip-on-film, wherein the chip-on-film is bound to the first conductive portion, and the chip-on-film is electrically connected to the first conductive portion.

[0013] In one embodiment, the display panel further includes a conductive film layer, wherein the conductive film layer is located between the first conductive portion and the chip-on-film, and the first conductive portion is electrically connected to the chip-on-film through the conductive film layer.

[0014] In one embodiment, the number of the first conductive parts is multiple, and the conductive film layer covers all the first conductive parts;

[0015] The plurality of first conductive portions include a plurality of central conductive portions and a plurality of edge conductive portions, wherein the central conductive portions are located in the middle of the plurality of first conductive portions, and the edge conductive portions are located at the edges of the plurality of first conductive portions;

[0016] The chip-on-film is connected to the plurality of central conductive portions through the conductive film layer.

[0017] In one embodiment, the display panel further includes a printed circuit board, wherein the printed circuit board is located on a side of the chip-on-film away from the array substrate and is connected to the chip-on-film.

[0018] In one embodiment, the width of the chip-on-film on one side of the printed circuit board is smaller than the width of the chip-on-film on one side of the array substrate.

[0019] In one embodiment, a polarizer is attached to each of the light emitting side of the color filter substrate and the light incident side of the array substrate.

[0020] In one embodiment, the display panel further includes a first polarizer and a second polarizer, wherein the first polarizer is located on a side of the color filter substrate away from the array substrate, and the second polarizer is located on a side of the array substrate away from the color filter substrate;

[0021] The color film substrate comprises a first edge and a second edge, the first edge is located at a first side of the color film substrate, the second edge is located at a second side of the color film substrate, the second side is the remaining side except the first side, and the first conductive portion is located at the first side of the color film substrate;

[0022] The distance between the third edge of the first polarizer located on the first side and the first edge is 0.05 to 1.7 mm, and the third edge is parallel to the first edge; the distance between the fourth edge of the first polarizer located on the second side and the second edge is 0 to 0.1 mm, and the fourth edge is parallel to the second edge;

[0023] The array substrate comprises a fifth edge and a sixth edge, the fifth edge is located at the first side of the array substrate, and the sixth edge is located at the second side of the array substrate;

[0024] The distance between the seventh edge of the second polarizer on the first side and the fifth edge is 0.1 to 1.7 mm, and the seventh edge is parallel to the fifth edge; the distance between the eighth edge of the second polarizer on the second side and the sixth edge is 0 to 0.1 mm, and the eighth edge is parallel to the sixth edge.

[0025] In one embodiment, the display panel further includes a first light shielding layer, a second light shielding layer, a first water and oxygen barrier layer, and a second water and oxygen barrier layer;

[0026] The color filter substrate comprises a first edge region and a first central region, the first edge region surrounds the first central region; the projection of the first polarizer on the color filter substrate is located in the first central region;

[0027] The first light shielding layer is located on the side of the color film substrate facing the first polarizer, is located in the first edge region, and covers the side of the first polarizer; the first water and oxygen barrier layer covers the first light shielding layer;

[0028] The array substrate comprises a second edge region and a second central region, the second edge region surrounds the second central region; the projection of the second polarizer on the array substrate is located in the second central region;

[0029] The second light shielding layer is located on a side of the array substrate facing the second polarizer, is located in the second edge region, and covers a side surface of the second polarizer; the second water and oxygen barrier layer covers the second light shielding layer.

[0030] In one embodiment, the color filter substrate includes a third light-shielding layer and a fourth light-shielding layer;

[0031] The peripheral region includes a first sub-region and a second sub-region, the first sub-region is located between the display area and the first conductive portion, and the second sub-region is a region of the peripheral region excluding the first sub-region;

[0032] The projection of the third light shielding layer on the array substrate is located in the first sub-region, and the projection of the fourth light shielding layer on the array substrate is located in the second sub-region;

[0033] The width of the third light-shielding layer is 0.6-1.0 mm, and the width of the fourth light-shielding layer is 0.25-0.5 mm.

[0034] According to a second aspect of an embodiment of the present invention, there is provided a display device, comprising: a light emitting module and the above-mentioned display panel;

[0035] The display panel is located at the light emitting side of the light emitting module, and the array substrate is located between the color filter substrate and the light emitting module.

[0036] In one embodiment, the light emitting module includes a back panel, a middle frame, an optical film layer and a light panel;

[0037] The back panel includes a bottom plate and side walls; the light panel is located on the side of the bottom plate facing the display panel and includes a plurality of light sources; the middle frame is arranged around the plurality of light sources and is fixedly connected to the side walls, and the middle frame is located between the bottom plate and the optical film layer.

[0038] In one embodiment, the projection of the optical film layer on the color filter substrate is located within the projection of the array substrate on the color filter substrate, and the projection of the middle frame on the array substrate is located within the projection of the optical film layer on the array substrate.

[0039] In one embodiment, the display device further includes a fifth light shielding layer and a metal layer;

[0040] The fifth light shielding layer is located on a side surface of the color filter substrate and a side surface of the array substrate;

[0041] The metal layer covers the fifth shading layer and is located on the side of the light-emitting module. When the display panel also includes a first polarizer, the first end of the metal layer is located on the side of the first polarizer away from the color film substrate and is located in the peripheral area, and the second end of the metal layer is located on the side of the light-emitting module away from the display panel.

[0042] In one embodiment, on the first side of the optical film layer, in the first direction, the distance between the edge of the optical film layer and the metal layer is a third distance, the distance between the middle frame and the edge of the optical film layer is a fourth distance, the first direction is parallel to the surface of the optical film layer facing the display panel, the third distance is the same as the fourth distance, and the third distance is 0.3-0.5 mm;

[0043] On the second side of the optical film layer, in the first direction, the distance between the edge of the optical film layer and the metal layer is the fifth distance, and the distance between the middle frame and the edge of the optical film layer is the sixth distance, and the sixth distance is greater than the fifth distance and is the same; the fifth distance is 0.1 to 0.3 mm, and the sixth distance is 0.3 to 0.5 mm.

[0044] In one embodiment, on the first side of the bottom plate, the middle frame includes a first side surface and a second side surface, the first side surface is connected to the second side surface, the first side surface is an inclined plane, the first side surface is inclined from the peripheral area to the display area, and the second side surface extends along a second direction, and the second direction is perpendicular to the surface of the optical film layer facing the display panel;

[0045] When the display panel includes a chip-on-film, the chip-on-film includes a chip and a flexible circuit board, and the chip is fixed on the flexible circuit board;

[0046] The display panel further includes a printed circuit board, which is located at a side of the chip-on-film away from the array substrate and is connected to the chip-on-film.

[0047] In one embodiment, on the first side of the bottom plate, the side wall includes a first vertical extension portion, a first horizontal extension portion, and a second vertical extension portion, the first vertical extension portion is connected to the bottom plate and extends along a second direction, the first horizontal extension portion is located between the first vertical extension portion and the second vertical extension portion, the extension direction of the first horizontal extension portion is perpendicular to the second direction and extends in a direction from the display area to the peripheral area, and the second vertical extension portion extends along the second direction;

[0048] The light emitting module further includes a support block, which is located at the connection between the first vertical extension portion and the first horizontal extension portion and between the first vertical extension portion and the printed circuit board, and is used to support the printed circuit board.

[0049] In one embodiment, the light emitting module further comprises a protection plate for protecting the printed circuit board;

[0050] The protection plate is located at a side of the printed circuit board away from the supporting block, and the protection plate, the middle frame and the back plate are fixed together.

[0051] In one embodiment, the protection plate includes a first protection portion and a second protection portion, the first protection portion is connected to the second protection portion, the first protection portion extends along the second direction, the printed circuit board is located between the first protection portion and the supporting block, and the second protection portion extends in a direction perpendicular to the second direction and is located on a side of the printed circuit board away from the display panel;

[0052] The middle frame includes a first supporting portion, a second supporting portion and a third supporting portion, the second supporting portion is located between the first supporting portion and the third supporting portion, the first supporting portion is located on the bottom plate, the extension direction of the first supporting portion is perpendicular to the second direction, the second supporting portion extends along the second direction, and the third supporting portion is used to support the optical film layer;

[0053] The light emitting module further includes a first fastener, the first fastener passing through the second vertical extension portion, the third supporting portion and the first protecting portion;

[0054] A first supporting point of the third supporting portion on the optical film layer, a second supporting point of the second supporting portion on the third supporting portion, and a contact point between the third supporting portion and the first fastener are vertices of a mechanical triangle.

[0055] In one embodiment, the third supporting portion includes a third side surface, a fourth side surface and a fifth side surface, the third side surface, the fourth side surface and the fifth side surface face the optical film layer, the fourth side surface is located between the third side surface and the fifth side surface, the third side surface is a plane for supporting the optical film layer, the angle between the fourth side surface and the surface of the optical film layer facing the middle frame is an acute angle, and the fifth side surface is a convex arc surface;

[0056] The width of the third side surface in the first direction is 0.2 to 0.3 mm, and the first direction is perpendicular to the second direction; the angle between the fourth side surface and the surface of the optical film layer facing the middle frame is 23 to 33 degrees; the radius of the spherical surface where the convex arc surface is located is 10 to 15 mm;

[0057] The second supporting portion includes a sixth side surface, the sixth side surface is located on a side of the second supporting portion facing the optical film layer, and the sixth side surface is a plane.

[0058] In one embodiment, the light emitting module further includes a first reflective film layer, and the first reflective film layer is located on a surface of the middle frame facing the optical film layer;

[0059] The first reflective film layer covers the fifth side surface, a portion of the fourth side surface, and a portion of the sixth side surface;

[0060] On a side of the middle frame close to the optical film layer, there is a gap between the first reflective film layer and the third side surface, and on a side of the middle frame close to the bottom plate, there is a gap between the first reflective film layer and the first supporting portion;

[0061] The first reflective film layer is a reflective sticker or a white film layer.

[0062] In one embodiment, on a side of the middle frame close to the optical film layer, the distance between the first reflective film layer and the third side surface is 2.5 to 5 mm, and on a side of the middle frame close to the bottom plate, the distance between the first reflective film layer and the first supporting portion is less than or equal to 2 mm.

[0063] In one embodiment, the number of the middle frames is 4; the 4 middle frames are adjacent to each other and enclose a quadrilateral; and two adjacent middle frames are fixedly connected.

[0064] In one embodiment, the light-emitting module further comprises an embedded corner block, and the embedded corner block is used to fix and connect two adjacent middle frames;

[0065] The embedded corner block comprises a first connecting portion and a second connecting portion, the first connecting portion is connected to the second connecting portion, and an extending direction of the first connecting portion intersects with an extending direction of the second connecting portion;

[0066] The first connection portion is fixedly connected to one of the two adjacent middle frames, and the second connection portion is fixedly connected to the other of the two adjacent middle frames.

[0067] In one embodiment, in two adjacent middle frames, one of the middle frames includes a first groove, and the other middle frame includes a second groove;

[0068] The first connection portion is located in the first groove, and the depth of the first groove is the same as the thickness of the first connection portion. The second connection portion is located in the second groove, and the depth of the second groove is the same as the thickness of the second connection portion.

[0069] In one embodiment, in two adjacent middle frames, one of the middle frames includes a first positioning hole, and the other middle frame includes a second positioning hole;

[0070] The first connection portion includes a first positioning column, and the second connection portion includes a second positioning column. The first positioning column is located in the first positioning hole, and the second positioning column is located in the second positioning hole.

[0071] In one embodiment, there is an opening between two adjacent middle frames on a side close to the bottom plate.

[0072] In one embodiment, the light emitting module further includes a second reflective film layer, the second reflective film layer is located at the connection between two adjacent middle frames, and the width of the second reflective film layer increases in the direction from the optical film layer to the bottom plate.

[0073] In one embodiment, the plurality of light sources are arranged in an array, and the light source array formed by the plurality of light sources is symmetrical.

[0074] In one embodiment, the light source array includes M rows of light sources arranged along a first direction and N rows of light sources arranged along a third direction, where M and N are integers greater than 6 respectively; the first direction intersects the third direction;

[0075] In the first direction, the lamp distance between the first light source and the second light source is the first lamp distance, the lamp distance between the second light source and the third light source is the second lamp distance, the lamp distance between the N-2th light source and the N-1th light source is the second lamp distance, the lamp distance between the N-1th light source and the Nth light source is the first lamp distance, and the lamp distance between two adjacent light sources in the remaining light sources is the third lamp distance; the second lamp distance is greater than the third lamp distance, and the third lamp distance is greater than the first lamp distance;

[0076] In the third direction, the lamp distance between the first light source and the second light source is the fourth lamp distance, the lamp distance between the second light source and the third light source is the fifth lamp distance, the lamp distance between the N-2th light source and the N-1th light source is the fifth lamp distance, the lamp distance between the N-1th light source and the Nth light source is the fourth lamp distance, and the lamp distance between two adjacent light sources among the remaining light sources is the third lamp distance; the fifth lamp distance is greater than the third lamp distance, and the third lamp distance is greater than the fourth lamp distance.

[0077] In one embodiment, in any one of the first direction and the third direction, the distance between the side of the first reflective film layer on the second supporting portion facing the optical film layer and the light source adjacent to the second supporting portion is a seventh distance, the distance between the side of the first reflective film layer on the second supporting portion facing the optical film layer and the edge of the optical film layer adjacent to the middle frame is an eighth distance, the projection of the surface of the second supporting portion facing the optical film layer on the optical film layer is a projection point, the acute angle between the line connecting the light source adjacent to the second supporting portion and the projection point and the second direction is a first angle, the second direction is perpendicular to the surface of the optical film layer facing the display panel; the acute angle between the connecting point between the second supporting portion and the third supporting portion and the light source adjacent to the second supporting portion and the second direction is a second angle, and the reflectivity of the surface of the third supporting portion facing the optical film layer, the luminous flux per unit angle at different light-emitting angles of the light source, the seventh distance, the eighth distance, the first angle and the second angle satisfy the following relationship:

[0078]

[0079] Among them, a is the value of the seventh distance, b is the value of the eighth distance, α is the value of the first angle, β is the value of the second angle, x is the luminous flux, and r is the luminous angle.

[0080] In one embodiment, the display device further includes a third reflective film layer, which is located on a side of the light board facing the optical film layer and is pressed on the bottom end of the first supporting portion.

[0081] In one embodiment, the top surface of the middle frame is coated with hot melt adhesive / optical curing adhesive, and the hot melt adhesive / optical curing adhesive is used to fix the edge of the optical film layer to the top surface of the middle frame;

[0082] When the display panel also includes a second polarizer, and the second polarizer is located on a side of the array substrate away from the color film substrate, an optical curing adhesive is coated on an edge of the second polarizer, and the optical curing adhesive is used to fix the array substrate and the color film substrate on the optical film layer.

[0083] In one embodiment, the hot melt adhesive comprises a resin material, and the light transmittance of the hot melt adhesive is 80% to 99.5%;

[0084] The optical curing adhesive comprises a resin material, and the light transmittance of the optical curing adhesive is 80% to 99.5%.

[0085] In one embodiment, the optical film layer includes a transparent glass plate, a light diffusion film and a brightness enhancement film. The light diffusion film is located on a side of the transparent glass plate away from the array substrate, and the brightness enhancement film is located on a side of the transparent glass plate facing the array substrate.

[0086] According to a third aspect of an embodiment of the present invention, there is provided a spliced ​​display device, comprising at least two display devices, at least one of the at least two display devices being the above-mentioned display device.

[0087] According to a fourth aspect of an embodiment of the present invention, a method for manufacturing a display panel is provided, wherein a display area and a peripheral area are formed on the display panel, wherein the peripheral area surrounds the display area; the manufacturing method comprises:

[0088] forming an array substrate, the array substrate comprising a pixel circuit and a second conductive portion, the pixel circuit being located in the display area, the second conductive portion being located in the peripheral area; the second conductive portion being connected to the pixel circuit;

[0089] forming a color film substrate;

[0090] Aligning the array substrate with the color filter substrate, wherein the pixel circuit and the second conductive portion are located on a side of the array substrate facing the color filter substrate;

[0091] A first conductive portion is formed on the side of the array substrate and the side of the color film substrate, a first end of the first conductive portion is located on the side of the color film substrate, a second end is located on the side of the array substrate, and the first conductive portion is connected to the second conductive portion.

[0092] In one embodiment, forming a first conductive portion on a side surface of the array substrate and a side surface of the color filter substrate includes:

[0093] preparing the first conductive portion;

[0094] The first conductive portion is transferred to the side surface of the array substrate and the side surface of the color filter substrate by using a transfer process.

[0095] According to the above embodiments, in this embodiment, since the first conductive part is provided on the side of the array substrate and the side of the color film substrate, and the first conductive part is connected to the pixel circuit through the second conductive part, the pixel circuit can be connected to the chip for controlling the pixel circuit through the first conductive part, and since the first conductive part is located on the side of the array substrate and the side of the color film substrate, it is possible to avoid occupying the space in the peripheral area on the array substrate, and the width of the peripheral area can be reduced, which is conducive to achieving a narrow frame and improving the screen-to-body ratio. When the display panel is applied to a display device in a spliced ​​display device, the seam between two adjacent display devices in the spliced ​​display device can be reduced.

[0096] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0097] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0098] Figure 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention.

[0099] Figure 2 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0100] Figure 3 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0101] Figure 4 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0102] Figure 5 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0103] Figure 6 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0104] Figure 7 FIG. 4 is a schematic diagram of the structure of another display panel according to an embodiment of the present invention.

[0105] Figure 8 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0106] Fig. 9 Schematic diagram of a light path of a display device according to an embodiment of the present invention.

[0107] Fig.10 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0108] Fig.11 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0109] Fig.12 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0110] Fig.13 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0111] Fig.14 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0112] Fig.15 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0113] Fig.16 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0114] Fig.17 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0115] Fig.18 FIG. 4 is a schematic diagram showing the structure of a display device according to an embodiment of the present invention.

[0116] Fig.19 1 is a schematic diagram of a curve showing the relationship between luminous intensity and luminous angle according to an embodiment of the present invention.

[0117] Fig. 20 The figure is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0118] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0119] An embodiment of the present invention provides a display panel 1. The display panel 1, such as Figure 1As shown, the display panel 1 includes a color filter substrate 11, an array substrate 12 and a first conductive portion 13. A display area AA and a peripheral area NA are formed on the display panel 1, and the peripheral area NA surrounds the display area AA.

[0120] In this embodiment, if Figure 1 As shown, the color filter substrate 11 is opposite to the array substrate 12. The array substrate 12 includes a pixel circuit (not shown) and a second conductive portion 14. The pixel circuit is located in the display area AA, and the second conductive portion 14 is located in the peripheral area NA. The second conductive portion 14 is connected to the pixel circuit, and the pixel circuit and the second conductive portion 14 are located on the side of the array substrate 12 facing the color filter substrate 11.

[0121] In this embodiment, if Figure 1 As shown, the first conductive part 13 is located on the side of the array substrate 12 and the side of the color film substrate 11, the first end E1 of the first conductive part 13 is located on the side of the color film substrate 11, the second end E2 of the first conductive part 13 is located on the side of the array substrate 12, and the first conductive part 13 is connected to the second conductive part 14.

[0122] In this embodiment, since the first conductive portion 13 is provided on the side of the array substrate 12 and the side of the color film substrate 11, and the first conductive portion 13 is connected to the pixel circuit through the second conductive portion 14, the pixel circuit can be connected to the chip for controlling the pixel circuit through the first conductive portion 13, and since the first conductive portion 13 is located on the side of the array substrate 12 and the side of the color film substrate 11, it can avoid occupying the space located in the peripheral area NA on the array substrate 12, and can reduce the width of the peripheral area NA, which is conducive to achieving a narrow frame and improving the screen-to-body ratio. When the display panel 1 is applied to a display device in a spliced ​​display device, the splicing seam between two adjacent display devices in the spliced ​​display device can be reduced.

[0123] The display panel 1 provided by the embodiment of the present invention is briefly introduced above. The display panel 1 provided by the embodiment of the present invention is introduced in detail below.

[0124] The embodiment of the present invention further provides a display panel 1. The display panel 1, such as Figure 1 and Figure 2 As shown, the display panel 1 includes a display area AA and a peripheral area NA, and the peripheral area NA surrounds the display area AA.

[0125] In this embodiment, if Figure 1 As shown, the display panel 1 further includes a color filter substrate 11 , an array substrate 12 , a liquid crystal layer 18 , a second conductive portion 14 , a first conductive portion 13 , a conductive film layer 15 , a chip on film (COF) 16 and a printed circuit board 17 .

[0126] like Figure 1As shown, the color filter substrate 11 is opposite to the array substrate 12 , and the liquid crystal layer 18 is located between the color filter substrate 11 and the array substrate 12 .

[0127] In this embodiment, if Figure 1 As shown, the array substrate 12 includes a pixel circuit (not shown) and a second conductive portion 14. The pixel circuit is located in the display area AA, and is used to control the deflection angle of the liquid crystal molecules in the liquid crystal layer 18, thereby controlling the intensity of light passing through the liquid crystal layer 18. The second conductive portion 14 is located in the peripheral area NA, and the second conductive portion 14 is connected to the pixel circuit. The material of the second conductive portion 14 can be a metal material, such as copper, but is not limited thereto. The pixel circuit and the second conductive portion 14 are located on the side of the array substrate 12 facing the color film substrate 11. The second conductive portion 14 can be prepared in the process of preparing the pixel circuit. For example, the second conductive portion 14 can be in the same layer as the source or drain of the transistor in the pixel circuit, and can be formed in the same process step.

[0128] In this embodiment, the pixel circuit can drive the pixel to emit light under the control of the gate drive signal and the data drive signal. Generally, the gate drive signal can be provided by a gate drive chip, and the data drive signal can be provided by a data drive chip. Therefore, the display panel 1 also needs to be provided with a gate drive chip and a data drive chip.

[0129] In this embodiment, if Figure 3 As shown, the display panel 1 is rectangular and includes four sides, two first sides S1 and two second sides S2, wherein a gate driving chip is set on one of the two first sides S1, and a data driving chip is set on the other first side S1, and the two second sides S2 may not be set with a gate driving chip and a data driving chip.

[0130] In this embodiment, in order to reduce the width of the peripheral area NA, the gate driver chip and the data driver chip are respectively fixed on the flexible circuit board, and the gate driver chip and the data driver chip are respectively electrically connected to the pixel circuit through the flexible circuit board. Then, the gate driver chip and the data driver chip are respectively set to the side of the display panel 1 away from the pixel circuit by bending the flexible circuit board. Among them, the flexible circuit board fixed with the gate driver chip or the data driver chip can be called a flip chip film 16. Since the scheme of setting the gate driver chip to the side of the display panel 1 away from the pixel circuit is similar to the scheme of setting the data driver chip to the side of the display panel 1 away from the pixel circuit, in order to avoid content redundancy, the following is an example of setting the gate driver chip to the side of the display panel 1 away from the pixel circuit.

[0131] In this embodiment, if Figure 4 As shown, the gate driver chip 161 is fixed on the flexible circuit board 162, and the gate driver chip 161 is fixed on the flexible circuit board 162 to form a flip chip film 16. Figure 4 yes Figure 3 Enlarged schematic diagram of part A.

[0132] In this embodiment, if Figure 1 As shown, the first conductive part 13 is located on the side of the array substrate 12 and the side of the color film substrate 11, the first end E1 of the first conductive part 13 is located on the side of the color film substrate 11, the second end E2 is located on the side of the array substrate 12, and the first conductive part 13 is connected to the second conductive part 14. In this way, the chip-on-film 16 can be electrically connected to the pixel circuit through the first conductive part 13 and the second conductive part 14.

[0133] In this embodiment, if Figure 1 and Figure 5 As shown, the distance L between the first end E1 of the first conductive portion 13 and the second end E2 of the first conductive portion 13 is smaller than the distance between the first surface F1 of the color filter substrate 11 away from the array substrate 12 and the second surface F2 of the array substrate 12 away from the color filter substrate 11. That is, the length of the first conductive portion 13 is smaller than the distance between the first surface F1 and the second surface F2. Figure 5 for Figure 4 Schematic diagram of the enlarged portion B.

[0134] In this embodiment, if Figure 5 As shown, the first conductive part 13 is located between the first central axis J1 of the side of the color filter substrate 11 and the second central axis J2 of the side of the array substrate 12, and the first central axis J1 and the second central axis J2 are respectively perpendicular to the direction in which the first end E1 of the first conductive part 13 points to the second end E2 of the first conductive part 13. That is, the first central axis J1 and the second central axis J2 are respectively perpendicular to the extension direction of the first conductive part 13. In this way, the electrical contact between the first conductive part 13 and the second conductive part 14 can be ensured to be uniform.

[0135] In this embodiment, if Figure 5 As shown, the distance between the first end E1 of the first conductive portion 13 and the first central axis J1 is a first distance D1, and the distance between the second end E2 of the first conductive portion 13 and the second central axis J2 is a second distance D2, and the first distance D1 is the same as the second distance D2.

[0136] In this embodiment, the material of the first conductive part 13 is a metal material, such as silver. The first conductive part 13 and the second conductive part 14 are formed in different process steps. The first conductive part 13 can be prepared by a transfer process.

[0137] In this embodiment, the thickness of the color filter substrate 11 and the thickness of the array substrate 12 can be substantially the same, both of which are 0.7 mm, and the distance L between the first end E1 of the first conductive part 13 and the second end E2 of the first conductive part 13 is 0.6 mm, that is, the length of the first conductive part 13 is 0.6 mm. The first distance D1 between the first end E1 of the first conductive part 13 and the first central axis J1 is 0.1 mm, and the second distance D2 between the second end E2 of the first conductive part 13 and the second central axis J2 is 0.1 mm. In this way, the electrical contact between the first conductive part 13 and the second conductive part 14 can be ensured to be uniform.

[0138] In this embodiment, if Figure 1 As shown, the conductive film layer 15 is located between the first conductive part 13 and the COF 16, the COF 16 is bound to the first conductive part 13 through the conductive film layer 15, and the COF 16 is electrically connected to the first conductive part 13. That is, the first conductive part 13 is electrically connected to the COF 16 through the conductive film layer 15. The conductive film layer 15 can be an anisotropic conductive film (ACF), but is not limited thereto.

[0139] In this embodiment, if Figure 5 As shown, the number of the first conductive parts 13 is multiple. The conductive film layer 15 can cover all the first conductive parts 13. The multiple first conductive parts 13 include multiple central conductive parts 131 and multiple edge conductive parts 132, the central conductive parts 131 are located in the middle W1 of the multiple first conductive parts 13, and the edge conductive parts 132 are located at the edge W2 of the multiple first conductive parts 13. In this embodiment, the chip-on-film 16 is connected to the multiple central conductive parts 131 through the conductive film layer 15. There may be 15 edge conductive parts 132 on both sides of the multiple central conductive parts 131, but it is not limited to this. When coating the conductive film layer 15, the boundary of the edge conductive part 132 away from the central conductive part 131 can be used as a reference, so that it can be avoided that part of the central conductive part 131 that plays a conductive role is not covered by the conductive film layer 15 and does not play a conductive role.

[0140] In this embodiment, if Figure 6 As shown, the conductive portion 163 of the COF 16 is electrically connected to the corresponding first conductive portion 13. It should be noted that at the edge W2 of the plurality of first conductive portions 13, some first conductive portions 13 (edge ​​conductive portions 132) may be missing, but this does not affect the electrical connection between the COF 16 and the pixel circuit.

[0141] In this embodiment, when the COF 16 is bound to the first conductive portion 13, the binding can be performed in a manner that the conductive portion 163 of the COF 16 exceeds the second end E2 of the first conductive portion 13 by a specified distance in the direction from the first end E1 of the first conductive portion 13 to the second end E2, so as to ensure that the conductive portion 163 of the COF 16 can be electrically connected to the corresponding first conductive portion 13 under the condition of process error. The specified distance can be 0.1 mm, but is not limited thereto.

[0142] In this embodiment, if Figure 1 and Figure 4 As shown, the printed circuit board 17 is located on the side of the COF 16 away from the array substrate 12 and is connected to the COF 16. A control chip may be bound to the printed circuit board 17, and the control chip is electrically connected to the gate drive chip on the COF 16 through the printed circuit board 17. The control chip is used to control the gate drive chip.

[0143] In this embodiment, if Figure 4 As shown, the width of the chip-on-film 16 on the side of the printed circuit board 17 is smaller than the width on the side of the array substrate 12. In this way, more assembly space can be reserved for the protection plate 89 used to protect the printed circuit board 17, ensuring the fixing strength of the protection plate 89. The protection plate 89 can be screwed to other nearby structures, for example, the protection plate 89 can be screwed to the middle frame 82 in the light-emitting module.

[0144] In this embodiment, if Figure 7 As shown, the display panel 1 further includes a first polarizer 71, a second polarizer 72, a first light shielding layer (not shown), a second light shielding layer (not shown), a first water and oxygen barrier layer (not shown) and a second water and oxygen barrier layer (not shown).

[0145] In this embodiment, if Figure 7 As shown, the first polarizer 71 is located on the side of the color filter substrate 11 away from the array substrate 12, and the second polarizer 72 is located on the side of the array substrate 12 away from the color filter substrate 11. The first polarizer 71 and the second polarizer 72 are used to eliminate the influence of ambient light on the display screen. That is, a polarizer is attached to each of the light-emitting side of the color filter substrate 11 and the light-entering side of the array substrate 12.

[0146] In this embodiment, if Figure 7 As shown, the color film substrate 11 includes a first edge G1 and a second edge G2. The first edge G1 is located on the first side S1 of the color film substrate 11, and the second edge G2 is located on the second side S2 of the color film substrate 11. The second side S2 is the remaining side except the first side S1. The first conductive portion 13 is located on the first side S1 of the color film substrate 11.

[0147] In this embodiment, the distance between the third edge G3 of the first polarizer 71 located on the first side S1 and the first edge G1 is 0.05 to 1.7 mm, for example, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.9 mm, 1.5 mm or 1.7 mm, and the third edge G3 is parallel to the first edge G1. The distance between the fourth edge G4 of the first polarizer 71 located on the second side S2 and the second edge G2 is 0 to 0.1 mm, for example, 0 mm, 0.5 mm or 0.1 mm, and the fourth edge G4 is parallel to the second edge G2.

[0148] In this embodiment, if Figure 7 As shown, the array substrate 12 includes a fifth edge G5 and a sixth edge G6 . The fifth edge G5 is located on the first side S1 of the array substrate 12 , and the sixth edge G6 is located on the second side S2 of the array substrate 12 .

[0149] In this embodiment, the distance between the seventh edge G7 of the second polarizer 72 located on the first side S1 and the fifth edge G5 is 0.1 to 1.7 mm, for example, 0.1 mm, 0.3 mm, 0.4 mm, 0.9 mm, 1.5 mm or 1.7 mm, and the seventh edge G7 is parallel to the fifth edge G5. The distance between the eighth edge G8 of the second polarizer 72 located on the second side S2 and the sixth edge G6 is 0 to 0.1 mm, for example, 0 mm, 0.05 mm or 0.1 mm, and the eighth edge G8 is parallel to the sixth edge G6. The distance between the edge of the above polarizer and the edge of the display panel is not greater than the width of the non-display area of ​​the display panel.

[0150] In this embodiment, the color filter substrate 11 includes a first edge region and a first central region, and the first edge region surrounds the first central region; the projection of the first polarizer 71 on the color filter substrate 11 is located in the first central region. The first light shielding layer is located on the side of the color filter substrate 11 facing the first polarizer 71, and is located in the first edge region, and covers the side of the first polarizer 71. The material of the first light shielding layer can be light shielding ink, but is not limited thereto. The first light shielding layer is used to prevent the light emitted from the light emitting module from leaking from the third edge G3 and the fourth edge G4 of the first polarizer 71 to affect the quality of the display image.

[0151] In this embodiment, the first water-oxygen barrier layer covers the first light shielding layer. The material of the first water-oxygen barrier layer may be a fluorinating agent, but is not limited thereto. The first water-oxygen barrier layer is used to block water and oxygen, protect the first polarizer 71, and prevent the edge of the first polarizer 71 from entering water vapor, causing failure of the microscopic area of ​​the cutting edge.

[0152] In this embodiment, the array substrate 12 includes a second edge region and a second central region, the second edge region surrounds the second central region, and the projection of the second polarizer 72 on the array substrate 12 is located in the second central region. The second light shielding layer is located on the side of the array substrate 12 facing the second polarizer 72, and is located in the second edge region, and covers the side of the second polarizer 72. The material of the second light shielding layer can be light shielding ink, but is not limited thereto. The second light shielding layer is used to prevent the light emitted from the light emitting module from leaking from the seventh edge G7 and the eighth edge G8 of the second polarizer 72 to affect the quality of the display image.

[0153] In this embodiment, the second water-oxygen barrier layer covers the second light shielding layer. The material of the second water-oxygen barrier layer can be a fluorinating agent, but is not limited thereto. The second water-oxygen barrier layer is used to block water and oxygen, protect the second polarizer 72, and prevent the edge of the second polarizer 72 from entering water vapor, causing failure of the microscopic area of ​​the cutting edge.

[0154] In this embodiment, the light leakage problem caused by edge moisture intrusion of the first polarizer 71 and the second polarizer 72 in the high temperature and high humidity reliability test and the light leakage problem caused by high temperature shrinkage of the first polarizer 71 and the second polarizer 72 can be balanced.

[0155] In this embodiment, if Figure 2 As shown, the display panel 1 further includes an alignment mark 21, and the alignment mark 21 is located in the display area AA. For example, the projection of the alignment mark 21 on the array substrate 12 may be located within the projection of the sub-pixel in the first row and the second column on the array substrate 12, but is not limited thereto. Since the alignment mark 21 does not occupy the space of the peripheral area NA, it is beneficial to reduce the width of the peripheral area NA and improve the screen-to-body ratio.

[0156] In this embodiment, if Figure 2 As shown, the peripheral area NA includes a first sub-area Q1 and a second sub-area Q2 . The first sub-area Q1 is located between the display area AA and the first conductive portion 13 . The second sub-area Q2 is an area of ​​the peripheral area NA except the first sub-area Q1 .

[0157] In this embodiment, the color filter substrate 11 includes a third light shielding layer and a fourth light shielding layer. The third light shielding layer and the fourth light shielding layer can be a black matrix in the same layer as the color filter (CF). The projection of the third light shielding layer on the array substrate 12 is located in the first sub-region Q1, and the projection of the fourth light shielding layer on the array substrate 12 is located in the second sub-region Q2.

[0158] In this embodiment, the width of the third shading layer is 0.6-1.0 mm, for example, 0.6 mm, 0.8 mm or 1.0 mm, and the width of the fourth shading layer is 0.25-0.5 mm, for example, 0.25 mm, 0.4 mm or 0.5 mm.

[0159] In this embodiment, since the first conductive portion 13 is provided on the side of the array substrate 12 and the side of the color film substrate 11, and the first conductive portion 13 is connected to the pixel circuit through the second conductive portion 14, the pixel circuit can be connected to the chip for controlling the pixel circuit through the first conductive portion 13, and since the first conductive portion 13 is located on the side of the array substrate 12 and the side of the color film substrate 11, it is possible to avoid occupying the space located in the peripheral area NA on the array substrate 12, and the width of the peripheral area NA can be reduced, which is conducive to achieving a narrow frame and improving the screen-to-body ratio. Moreover, the width of the peripheral area NA can be reduced to less than 1 mm. When the display panel 1 is applied to a display device in a spliced ​​display device, the seam between two adjacent display devices in the spliced ​​display device can be reduced.

[0160] The embodiment of the present invention further provides a display device. Figure 8 and Fig. 9 As shown, the display device includes the above-mentioned display panel 1 and the light-emitting module 8. Figure 8 is a cross-sectional view of the display device at the first side S1, Fig. 9 is a cross-sectional view of the display device at the second side S2.

[0161] In this embodiment, the display panel 1 is located at the light emitting side of the light emitting module 8 , and the array substrate 12 is located between the color filter substrate 11 and the light emitting module 8 .

[0162] In this embodiment, Figure 8 and Fig. 9 As shown, the light emitting module 8 includes a back plate 81 , a middle frame 82 , an optical film layer 83 , a light board 84 , a first reflective film layer 85 , a third reflective film layer 86 , a second fastener 88 , a protective plate 89 and a support block 810 .

[0163] In this embodiment, if Figure 8 and Fig. 9 As shown, the back plate 81 includes a bottom plate 811 and a side wall 812. The light board 84 is located on the side of the bottom plate 811 facing the display panel 1, and includes a plurality of light sources 841. The middle frame 82 is arranged around the plurality of light sources 841 and is fixedly connected to the side wall 812. The middle frame 82 is located between the bottom plate 811 and the optical film layer 83.

[0164] In this embodiment, if Fig.10 and Fig.11 As shown, the projection of the optical film layer 83 on the color filter substrate 11 is located within the projection of the array substrate 12 on the color filter substrate 11, and the projection of the middle frame 82 on the array substrate 12 is located within the projection of the optical film layer 83 on the array substrate 12. Fig.10 yes Figure 8 Enlarged schematic diagram of part C1. Fig.11 yes Fig. 9 Schematic diagram of the enlarged portion C2.

[0165] In this embodiment, if Figure 8 to Figure 10 As shown, the display device further includes a fifth light shielding layer 1001 and a metal layer 1002 .

[0166] In this embodiment, the fifth light shielding layer 1001 is located on the side of the color filter substrate 11 and the side of the array substrate 12. The material of the fifth light shielding layer 1001 can be black ultraviolet curing glue, but is not limited thereto. The fifth light shielding layer 1001 is used to prevent light leakage from the side of the color filter substrate 11 and the side of the array substrate 12.

[0167] In this embodiment, if Figure 8 to Figure 10 As shown, the metal layer 1002 covers the fifth light shielding layer 1001 and is located on the side of the light emitting module 8, the first end of the metal layer 1002 is located on the side of the first polarizer 71 away from the color filter substrate 11 and located in the peripheral area NA, and the second end of the metal layer 1002 is located on the side of the light emitting module 8 away from the display panel 1. The metal layer 1002 is used for light shielding and preventing electromagnetic interference. The material of the metal layer 1002 can be aluminum, but is not limited thereto.

[0168] In this embodiment, the metal layer 1002 can be a black aluminum foil tape. Since the first end of the metal layer 1002 is attached to the side of the first polarizer 71 away from the color filter substrate 11 and is located in the peripheral area NA, it can be ensured that the metal layer 1002 will not come apart in a high temperature and high humidity environment.

[0169] In this embodiment, if Fig.10 As shown, on the first side S1 of the optical film layer 83, in the first direction X, the distance between the edge of the optical film layer 83 and the metal layer 1002 is a third distance D3, and the distance between the middle frame 82 and the edge of the optical film layer 83 is a fourth distance D4. The first direction X is parallel to the surface of the optical film layer 83 facing the display panel 1. The third distance D3 and the fourth distance D4 may be the same, and the third distance D3 is 0.3 to 0.5 mm. For example, the third distance D3 may be 0.3 mm, 0.4 mm or 0.5 mm. In this way, space can be reserved for the expansion of the light-emitting film group in a high temperature and high humidity environment to prevent the metal layer 1002 from debonding.

[0170] In this embodiment, if Fig.11As shown, on the second side S2 of the optical film layer 83, in the first direction X, the distance between the edge of the optical film layer 83 and the metal layer 1002 is the fifth distance D5, and the distance between the middle frame 82 and the edge of the optical film layer 83 is the sixth distance D6, and the sixth distance D6 may be greater than the fifth distance D5. The fifth distance D5 is 0.1 to 0.3 mm, for example, the fifth distance D5 is 0.1 mm, 0.2 mm or 0.3 mm. The sixth distance D6 is 0.3 to 0.5 mm, for example, the sixth distance D6 may be 0.3 mm, 0.4 mm or 0.5 mm. In this way, space can be reserved for the expansion of the light-emitting film group in a high temperature and high humidity environment to prevent the metal layer 1002 from debonding.

[0171] It should be noted that the projection of the optical film layer 83 on the array substrate 12 covers the display area AA and a portion of the peripheral area NA.

[0172] In this embodiment, if Figure 8 As shown, on the first side S1 of the bottom plate 811, the middle frame 82 includes a first side surface K1 and a second side surface K2, the first side surface K1 is connected to the second side surface K2, the first side surface K1 is an inclined plane, the first side surface K1 is inclined from the peripheral area NA to the display area AA, and the second side surface K2 extends along the second direction Z, and the second direction Z is perpendicular to the surface of the optical film layer 83 facing the display panel 1.

[0173] In this embodiment, if Figure 8 As shown, the flip chip 16 is attached to the first side surface K1 and the second side surface K2, wherein the gate driver chip 161 is located at the connection between the first side surface K1 and the second side surface K2, and the flexible circuit board 162 is attached to the first side surface K1 and the second side surface K2. The acute angle between the first side surface K1 and the second direction Z is greater than the acute angle between the flip chip 16 and the second direction Z.

[0174] In this embodiment, if Figure 8 As shown, the printed circuit board 17 is located on a side of the COF 16 away from the array substrate 12 , and is connected to the COF 16 .

[0175] In this embodiment, if Figure 8As shown, on the first side S1 of the bottom plate 811, the side wall 812 of the back plate 81 includes a first vertical extension portion H1, a first horizontal extension portion H2 and a second vertical extension portion H3. The first vertical extension portion H1 is connected to the bottom plate 811 of the back plate 81 and extends along the second direction Z. The first horizontal extension portion H2 is located between the first vertical extension portion H1 and the second vertical extension portion H3. The extension direction of the first horizontal extension portion H2 is perpendicular to the second direction Z, that is, the first horizontal extension portion H2 extends along the first direction X, and the first horizontal extension portion H2 extends in the direction from the display area AA to the peripheral area NA, and the second vertical extension portion H3 extends along the second direction Z. The first horizontal extension portion H2 cooperates with the protection plate 89 to provide a placement space for the printed circuit board 17.

[0176] In this embodiment, if Figure 8 As shown, the support block 810 is located at the connection between the first vertical extension portion H1 and the first horizontal extension portion H2, and between the first vertical extension portion H1 and the printed circuit board 17, for supporting the printed circuit board 17. The material of the support block 810 can be hard foam, for supporting the printed circuit board 17 and playing a buffering role.

[0177] In this embodiment, if Figure 8 As shown, the protection plate 89 is located on a side of the printed circuit board 17 away from the support block 810, and is used to protect the printed circuit board 17. The protection plate 89, the middle frame 82 and the back plate 81 are fixed together.

[0178] In this embodiment, if Figure 8 As shown, the protection plate 89 includes a first protection portion 891 and a second protection portion 892, the first protection portion 891 is connected to the second protection portion 892, the first protection portion 891 extends along the second direction Z, the printed circuit board 17 is located between the first protection portion 891 and the support block 810, and the extension direction of the second protection portion 892 is perpendicular to the second direction Z, that is, the second protection portion 892 extends along the first direction X, and the second protection portion 892 is located on the side of the printed circuit board 17 away from the display panel 1.

[0179] In this embodiment, if Figure 8 As shown, the middle frame 82 includes a first support portion 821, a second support portion 822 and a third support portion 823. The second support portion 822 is located between the first support portion 821 and the third support portion 823. The first support portion 821 is located on the bottom plate 811. The extension direction of the first support portion 821 is perpendicular to the second direction Z, that is, the first support portion 821 extends along the first direction X, the second support portion 822 extends along the second direction Z, and the third support portion 823 is used to support the optical film layer 83.

[0180] In this embodiment, the first fastener passes through the second vertical extension portion H3, the third support portion 823 and the first protection portion 891, fixes the second vertical extension portion H3, the third support portion 823 and the first protection portion 891 together, and then fixes the back plate 81, the middle frame 82 and the protection plate 89 together. The first fastener can be a screw, but is not limited thereto.

[0181] In this embodiment, if Figure 8 As shown, the first supporting point of the third supporting portion 823 on the optical film layer 83, the second supporting point of the second supporting portion 822 on the third supporting portion 823, and the contact point between the third supporting portion 823 and the first fastener are vertices of the mechanical triangle 91, that is, the first supporting point, the second supporting point, and the contact point between the third supporting portion 823 and the first fastener form a mechanical triangle relationship, thereby ensuring the overall strength and stability of the structure.

[0182] In this embodiment, if Fig. 9 As shown, on the second side S2 of the bottom plate 811, the side K7 of the middle frame 82 adjacent to the metal layer 1002 is a plane, and the side K7 of the middle frame 82 adjacent to the metal layer 1002 extends along the second direction Z. The side wall 812 of the back plate 81 is fixed to the middle frame 82 by a second fastener 88, wherein the second fastener 88 may be a screw.

[0183] In this embodiment, if Fig.12 As shown, the third supporting portion 823 includes a third side surface K3, a fourth side surface K4 and a fifth side surface K5, the third side surface K3, the fourth side surface K4 and the fifth side surface K5 face the optical film layer 83, the fourth side surface K4 is located between the third side surface K3 and the fifth side surface K5, the third side surface K3 is a plane for supporting the optical film layer 83, and extends along the first direction X, the angle between the fourth side surface K4 and the surface of the optical film layer 83 facing the middle frame 82 is an acute angle, and the fifth side surface K5 is a convex arc surface.

[0184] In this embodiment, the width of the third side surface K3 in the first direction X is 0.2-0.3 mm, for example 0.2 mm, 0.25 mm and 0.3 mm. In this way, the effective width of the glue bearing surface when the middle frame 82 and the optical film layer 83 are bonded can be guaranteed.

[0185] In this embodiment, the angle between the fourth side surface K4 and the surface of the optical film layer 83 facing the middle frame 82 is 23 degrees to 33 degrees. For example, the angle between the fourth side surface K4 and the surface of the optical film layer 83 facing the middle frame 82 is 23 degrees, 30 degrees or 33 degrees.

[0186] In this embodiment, the radius of the spherical surface where the convex arc surface is located is 10-15 mm. For example, the radius of the spherical surface where the convex arc surface is located is 10 mm, 12.5 mm or 15 mm.

[0187] In this embodiment, if Fig.12 As shown, the second supporting portion 822 includes a sixth side surface K6, which is located on the side of the second supporting portion 822 facing the optical film layer 83, and is a plane. The length of the sixth side surface K6 in the second direction Z is 14.5 mm, but is not limited thereto.

[0188] In this embodiment, the third side surface K3 and the fifth side surface K5 of the middle frame 82 facing the optical film layer 83 are transitioned through the rounded corners of the fourth side surface K4, which can ensure uniform light transition and avoid bright lines.

[0189] In this embodiment, the distance between the surface of the light board 84 facing the optical film layer 83 and the surface of the optical film layer 83 facing the light board 84 is 30 mm, but it is not limited thereto.

[0190] In this embodiment, if Fig.10 and Fig.11 As shown, the display device further includes a first adhesive layer 1003 and a second adhesive layer 1004 .

[0191] In this embodiment, if Fig.10 and Fig.11 As shown, the first adhesive layer 1003 is located between the middle frame 82 and the optical film layer 83, and the thickness of the first adhesive layer 1003 is 0.15 to 0.25 mm, for example, the thickness of the first adhesive layer 1003 can be 0.15 mm, 0.20 mm or 0.25 mm. The material of the first adhesive layer 1003 can be a water-based adhesive, such as a hot melt adhesive or an optical curing adhesive, but not limited thereto. For example, the top surface of the middle frame 82 can be coated with a hot melt adhesive, and the hot melt adhesive is used to fix the edge of the optical film layer 83 to the top surface of the middle frame 82, wherein the third side surface K3 is the top surface of the middle frame 82. The hot melt adhesive or the optical curing adhesive includes a resin material, and the light transmittance of the hot melt adhesive or the optical curing adhesive is 80% to 99.5%, for example, the light transmittance of the hot melt adhesive or the optical curing adhesive is 80%, 90%, 95% or 99.5%, but not limited thereto. The optical curing adhesive can be a UV curing adhesive, but not limited thereto.

[0192] In this embodiment, if Fig.10 and Fig.11As shown, the second adhesive layer 1004 is located between the optical film layer 83 and the display panel 1, and the thickness of the second adhesive layer 1004 is 0.1 to 0.2 mm, for example, the thickness of the second adhesive layer 1004 can be 0.1 mm, 0.15 mm or 0.2 mm. The material of the second adhesive layer 1004 can be a water-based glue, for example, an optical curing glue. That is, the edge of the second polarizer 72 is coated with an optical curing glue. Since the second polarizer 72 is fixed on the array substrate 12, the array substrate 12 and the color film substrate 11 are fixed together, and therefore, the optical curing glue is used to fix the array substrate 12 and the color film substrate 11 on the optical film layer 83. The optical curing glue includes a resin material, and the light transmittance of the optical curing glue is 80% to 99.5%, for example, the light transmittance of the optical curing glue is 80%, 90%, 95% or 99.5%, but not limited thereto. Among them, the optical curing glue can be a UV curing glue, but not limited thereto.

[0193] In this embodiment, during the preparation of the first adhesive layer 1003, the glue coating speed of the glue coating machine can be set to 40-50 mm / s, the glue width can be set to 0.6-0.8 mm, and the glue thickness can be set to 0.2-0.4 mm. For example, the glue coating speed of the glue coating machine can be set to 40 mm / s, 45 mm / s, or 50 mm / s, the glue width can be set to 0.6 mm, 0.7 mm, or 0.8 mm, and the glue thickness can be set to 0.2 mm, 0.3 mm, or 0.4 mm.

[0194] In this embodiment, during the preparation of the second adhesive layer 1004, the glue coating speed of the glue coating machine can be set to 60-80 mm / s, the glue width can be set to 0.6-0.8 mm, and the glue thickness can be set to 0.2-0.3 mm. For example, the glue coating speed of the glue coating machine can be set to 60 mm / s, 70 mm / s, or 80 mm / s, the glue width can be set to 0.6 mm, 0.65 mm, 0.7 mm, or 0.8 mm, and the glue thickness can be set to 0.2 mm, 0.3 mm, or 0.4 mm.

[0195] In this embodiment, the display panel 1 , the optical film layer 83 , and the middle frame 82 can be assembled and fixed by means of water-based glue bonding using automated equipment (glue coating machine).

[0196] In this embodiment, the optical film layer 83 may include a light-transmitting glass plate, a light-diffusing film and a light-enhancing film. The light-diffusing film is located on the side of the light-transmitting glass plate away from the array substrate 12, and the light-enhancing film is located on the side of the light-transmitting glass plate facing the array substrate 12. One side of the light-diffusing film is bonded to the top surface of the middle frame 82 by hot-melt adhesive. The light-enhancing film and the light-diffusing film may be directly formed on both sides of the light-transmitting glass plate by coating, or the light-enhancing film and the light-diffusing film may be formed separately, and then the light-enhancing film and the light-diffusing film are respectively fixed or bonded to both sides of the light-transmitting glass plate.

[0197] In this embodiment, if Figure 8 , Fig. 9 and Fig.12 As shown, the first reflective film layer 85 is located on the surface of the middle frame 82 facing the optical film layer 83. The first reflective film layer 85 covers the fifth side K5, part of the fourth side K4 and part of the sixth side of the middle frame 82. The first reflective film layer 85 can be a reflective sticker to reduce costs. Of course, the first reflective film layer 85 can also be a white film layer prepared by a baking paint process.

[0198] In this embodiment, the reflective sticker is a composite material, and includes a reflective material layer and a transparent diffusion layer, wherein the reflective material layer is close to the middle frame 82, and the transparent diffusion layer is far away from the middle frame 82. The reflectivity of the reflective material layer is 75%, but not limited thereto.

[0199] In this embodiment, if Figure 8 , Fig. 9 , Fig.12 and Fig.13 As shown, there is a gap between the first reflective film layer 85 and the third side surface K3 on the side of the middle frame 82 close to the optical film layer 83. In this way, the phenomenon of bright edges on the edge of the image caused by the reduced travel of the light near the optical film layer 83 after reflection can be avoided.

[0200] In this embodiment, if Fig.13 As shown, on the side of the middle frame 82 close to the optical film layer 83, the distance D7 between the first reflective film layer 85 and the third side surface K3 is 2.5 to 5 mm. For example, the distance D7 between the first reflective film layer 85 and the third side surface K3 is 2.5 mm, 3 mm, or 5 mm.

[0201] In this embodiment, if Figure 8 , Fig. 9 , Fig.12 and Fig.13 As shown, there is a gap between the first reflective film layer 85 and the first support portion 821 on the side of the middle frame 82 close to the bottom plate 811. In this way, it is convenient to stick the reflective sticker on the middle frame 82, and it is also possible to avoid wrinkling on the side of the reflective sticker close to the bottom plate 811.

[0202] In this embodiment, if Fig.13 As shown, on the side of the middle frame 82 close to the bottom plate 811, the distance D8 between the first reflective film layer 85 and the first support portion 821 is less than or equal to 2 mm. For example, the distance D8 between the first reflective film layer 85 and the first support portion 821 is 0.5 mm, 1 mm or 2 mm.

[0203] In this embodiment, the number of the middle frames 82 is 4. The four middle frames 82 are adjacent to each other and enclose a quadrilateral, for example, the four middle frames 82 enclose a rectangle. Two adjacent middle frames 82 are fixedly connected.

[0204] In this embodiment, Fig.14 As shown, the light emitting module 8 further includes an embedded corner block 1401, and the embedded corner block 1401 is used to fix and connect two adjacent middle frames 82. Therefore, in this embodiment, four embedded corner blocks 1401 may be included.

[0205] In this embodiment, Fig.15 As shown, the embedded corner block 1401 includes a first connection portion P1 and a second connection portion P2, the first connection portion P1 is connected to the second connection portion P2, and the extension direction of the first connection portion P1 intersects with the extension direction of the second connection portion P2. The first connection portion P1 is fixedly connected to one of the two adjacent middle frames 82, and the second connection portion P2 is fixedly connected to the other of the two adjacent middle frames 82.

[0206] In this embodiment, of two adjacent middle frames 82, one middle frame 82 includes a first positioning hole, and the other middle frame 82 includes a second positioning hole. Fig.15 As shown, the first connection part P1 includes a first positioning column P11, and the second connection part P2 includes a second positioning column P21. The first positioning column P11 is located in the first positioning hole, and the second positioning column P21 is located in the second positioning hole. In this way, the middle frame 82 can be assembled and precisely positioned by using the positioning columns and the positioning holes.

[0207] In this embodiment, Fig.15 As shown, the first connection portion P1 includes a first screw hole P12, and the second connection portion P2 includes a second screw hole P22. Thus, two countersunk guide screws can be used to respectively pass through the first screw hole P12 and the second screw hole P22 to lock an embedded corner block 1401 and two middle frames 82 together, thus ensuring that the gap on the inner surface of the corner after the two adjacent middle frames 82 are connected is less than 0.1 mm.

[0208] In this embodiment, of the two adjacent middle frames 82, one middle frame 82 includes a first groove, and the other middle frame 82 includes a second groove. The first connection portion P1 is located in the first groove, and the depth of the first groove is the same as the thickness of the first connection portion P1. The second connection portion P2 is located in the second groove, and the depth of the second groove is the same as the thickness of the second connection portion P2. In this way, when the two adjacent middle frames 82 are fixedly connected by the embedded corner block 1401, the surface of the embedded corner block 1401 away from the middle frame 82 is substantially flush with the surface of the middle frame 82 except the first groove and the second groove, so that the inner wall of the middle frame 82 can be kept as smooth as possible to avoid affecting the uniformity of light output from the light-emitting module 8.

[0209] In this embodiment, if Fig.14As shown, there is an opening 1402 between two adjacent middle frames 82 on the side close to the bottom plate 811. The opening 1402 can be obtained by cutting the bottom edge of the two adjacent middle frames 82 on the side close to the bottom plate 811. Since there is an opening 1402 between the two adjacent middle frames 82 on the side close to the bottom plate 811, it can be avoided that the fluctuation of the size of the side of the middle frame 82 close to the bottom plate 811 affects the assembly gap of the optical reflective surface.

[0210] In this embodiment, if Fig.16 As shown, the light emitting module 8 further includes a second reflective film layer 1601, which is located at the connection between two adjacent middle frames 82, and the width of the second reflective film layer 1601 increases in the direction from the optical film layer 83 to the bottom plate 811. In this way, the phenomenon that the light intensity of the light emitting module 8 is weak at the connection between two adjacent middle frames 82 can be avoided, and the light uniformity can be improved.

[0211] In this embodiment, if Fig. 9 As shown, the third reflective film layer 86 is located on the side of the light board 84 facing the optical film layer 83, and is used to reflect the light emitted by the light source 841 toward the third reflective film layer 86 to the side of the optical film layer 83, thereby improving the light efficiency. The third reflective film layer 86 is located between the light board 84 and the middle frame 82, that is, the third reflective film layer 86 is pressed at the bottom end of the first support portion 821, and the middle frame 82 can play a role in fixing the third reflective film layer 86, thereby preventing the heat generated when the light source 841 emits light from causing the third reflective film layer 86 to warp, resulting in uneven reflected light and affecting the light efficiency.

[0212] In this embodiment, if Fig.17 As shown, multiple light sources 841 are arranged in an array. In this embodiment, the light source 841 array formed by the multiple light sources 841 is symmetrical. Fig.17 A portion of light sources 841 in an array of light sources 841 is shown.

[0213] In this embodiment, if Fig.17 As shown, the array of light sources 841 includes M rows of light sources 841 arranged along the first direction X and N rows of light sources 841 arranged along the third direction Y, where M and N are integers greater than 6 respectively; the first direction X intersects the third direction Y. That is, in the first direction X, each row of light sources 841 includes N light sources 841, and in the third direction Y, each row of light sources 841 includes M light sources 841. In the first direction X, each row of light sources 841 can be located on the same light bar 1701. In this embodiment, M is 8 and N is 14.

[0214] In this embodiment, if Fig.17As shown, in the first direction X, the lamp distance between the first light source 841 and the second light source 841 is the first lamp distance R1, the lamp distance between the second light source 841 and the third light source 841 is the second lamp distance R2, the lamp distance between the N-2th light source 841 and the N-1th light source 841 is the second lamp distance R2, the lamp distance between the N-1th light source 841 and the Nth light source 841 is the first lamp distance R1, and the lamp distance between two adjacent light sources 841 in the remaining light sources 841 is the third lamp distance R3. The second lamp distance R2 is greater than the third lamp distance R3, and the third lamp distance R3 is greater than the first lamp distance R1. Among them, the first lamp distance R1 can be 60mm, the second lamp distance R2 is 85mm, and the third lamp distance R3 is 75mm, but it is not limited thereto.

[0215] Since in the first direction X, the first light source 841 and the N-th light source 841 are adjacent to the middle frame 82, and the surface of the middle frame 82 facing the light source 841 is a reflective surface, the luminous intensity at the position corresponding to the first light source 841 and the N-th light source 841 on the light-emitting module 8 will be smaller. By shortening the lamp distance between the second light source 841 and the first light source 841 and the lamp distance between the N-1-th light source 841 and the N-th light source 841, the luminous intensity at the position corresponding to the first light source 841 and the N-th light source 841 on the light-emitting module 8 can be increased, thereby improving the uniformity of light output from the light-emitting module 8.

[0216] At the same time, since the light reflected by the reflective surface of the middle frame 82 will fall on the position of the light-emitting module 8 corresponding to the second light source 841 and the N-1th light source 841, the light intensity at the position of the light-emitting module 8 corresponding to the second light source 841 and the N-1th light source 841 is enhanced, and the lamp distance between the second light source 841 and the third light source 841 and the lamp distance between the N-2th light source 841 and the N-1th light source 841 are increased. The light intensity at the position of the light-emitting module 8 corresponding to the second light source 841 and the N-1th light source 841 can be reduced, thereby improving the uniformity of light output from the light-emitting module 8.

[0217] In this embodiment, if Fig.17As shown, in the third direction Y, the lamp distance between the first light source 841 and the second light source 841 is the fourth lamp distance R4, the lamp distance between the second light source 841 and the third light source 841 is the fifth lamp distance R5, the lamp distance between the N-2th light source 841 and the N-1th light source 841 is the fifth lamp distance R5, the lamp distance between the N-1th light source 841 and the Nth light source 841 is the fourth lamp distance R4, and the lamp distance between two adjacent light sources 841 in the remaining light sources 841 is the third lamp distance R3; the fifth lamp distance R5 is greater than the third lamp distance R3, and the third lamp distance R3 is greater than the fourth lamp distance R4. Among them, the fourth lamp distance R4 is 62.5mm, and the fifth lamp distance R5 is 82mm, but not limited to this. Similarly, in the third direction Y, the non-uniformly spaced arrangement of the light sources 841 can also improve the uniformity of the light output of the light-emitting module 8.

[0218] In this embodiment, if Fig.18 As shown, in any one direction of the first direction X and the third direction Y, the distance between the side of the first reflective film layer 85 on the second support portion 822 facing the optical film layer 83 and the light source 841 adjacent to the second support portion 822 is a seventh distance Da, the distance between the side of the first reflective film layer 85 on the second support portion 822 facing the optical film layer 83 and the edge of the optical film layer 83 adjacent to the middle frame 82 is an eighth distance Db, the projection of the surface of the second support portion 822 facing the optical film layer 83 on the optical film layer 83 is a projection point Dot, and the light source 841 adjacent to the second support portion 822 is a seventh distance Da. The acute angle between the line connecting the light source 841 of the second support portion 822 and the projection point Dot and the second direction Z is the first angle ∠1, the acute angle between the line connecting the connecting point between the second support portion 822 and the third support portion 823 and the light source 841 adjacent to the second support portion 822 and the second direction Z is the second angle ∠2, and the reflectivity of the surface of the third support portion 823 facing the optical film layer 83, the luminous flux per unit angle at different light-emitting angles of the light source 841, the seventh distance Da, the eighth distance Db, the first angle ∠1 and the second angle ∠2 satisfy the following relationship:

[0219]

[0220] Among them, a is the value of the seventh distance Da, b is the value of the eighth distance Db, α is the value of the first angle ∠1, β is the value of the second angle ∠2, x is the luminous flux per unit angle at different luminous angles of the light source 841, and r is the luminous angle.

[0221] In this embodiment, if Fig.19 As shown, the luminous intensity of the light source 841 decays with the luminous angle. Fig.19 The left side of the diagram shows a curve 1901 showing the relationship between the luminous intensity and the luminous angle of the light source 841 in the polar coordinate system. Fig.19The right side of 1902 shows the relationship curve 1902 between the luminous intensity and the luminous angle of the light source 841 in the rectangular coordinate system. The horizontal axis in the polar coordinate system is the luminous intensity, and the unit is degree. The horizontal axis in the rectangular coordinate system is the luminous angle, and the unit is degree. The vertical axis is the luminous intensity, and the unit is 1. According to the relationship curve 1901 / 1902 between the luminous intensity and the luminous angle, the luminous flux per unit angle at different luminous angles of the light source 841 can be determined.

[0222] In this embodiment, the seventh distance Da can be determined by using the above relationship (1) and the relationship curve 1901 / 1902 between the luminous intensity and the luminous angle. The seventh distance Da can be 15-20 mm, for example, 15 mm, 18 mm or 20 mm.

[0223] It should be noted that the value of the seventh distance Da can also be obtained by an experimental method, which is not limited to the above method.

[0224] In this embodiment, since the first conductive portion 13 is provided on the side of the array substrate 12 and the side of the color film substrate 11, and the first conductive portion 13 is connected to the pixel circuit through the second conductive portion 14, the pixel circuit can be connected to the chip for controlling the pixel circuit through the first conductive portion 13, and since the first conductive portion 13 is located on the side of the array substrate 12 and the side of the color film substrate 11, it is possible to avoid occupying the space located in the peripheral area NA on the array substrate 12, and the width of the peripheral area NA can be reduced, which is conducive to achieving a narrow frame and improving the screen-to-body ratio. Moreover, the width of the peripheral area NA can be reduced to less than 1 mm. Therefore, when the display device is applied to a display device in a spliced ​​display device, the seam between two adjacent display devices in the spliced ​​display device can be reduced.

[0225] An embodiment of the present invention further provides a spliced ​​display device, which includes at least two display devices, at least one of which is the above-mentioned display device.

[0226] In this embodiment, each display device in the spliced ​​display device includes the above-mentioned display device, which may be a liquid crystal display device, but is not limited thereto.

[0227] In this embodiment, since the first conductive portion 13 is provided on the side surface of the array substrate 12 and the side surface of the color film substrate 11, and the first conductive portion 13 is connected to the pixel circuit through the second conductive portion 14, the pixel circuit can be connected to a chip for controlling the pixel circuit through the first conductive portion 13. Furthermore, since the first conductive portion 13 is located on the side surface of the array substrate 12 and the side surface of the color film substrate 11, it is possible to avoid occupying the space located in the peripheral area NA on the array substrate 12, and the width of the peripheral area NA can be reduced. Therefore, the seam between two adjacent display devices in the spliced ​​display device can be reduced.

[0228] Of course, in other embodiments, there may be one, two, or another number of display devices in the spliced ​​display device, including the above-mentioned display devices.

[0229] The embodiment of the present invention further provides a method for preparing a display panel 1, which is used to prepare the above-mentioned display panel 1. Fig. 20 As shown, the method for preparing the display panel 1 includes the following steps 2001-2004:

[0230] In step 2001 , an array substrate 12 is formed. The array substrate 12 includes a pixel circuit and a second conductive portion 14 . The pixel circuit is located in the display area AA, and the second conductive portion 14 is located in the peripheral area NA. The second conductive portion 14 is connected to the pixel circuit.

[0231] In step 2002, a color filter substrate 11 is formed.

[0232] In step 2003 , the array substrate 12 and the color filter substrate 11 are assembled, and the pixel circuit and the second conductive portion 14 are located on a side of the array substrate 12 facing the color filter substrate 11 .

[0233] In this embodiment, after the array substrate 12 and the color film substrate 11 are aligned, before the first conductive portion 13 is formed on the side of the array substrate 12 and the side of the color film substrate 11, impurities such as glass residues on the surface of the second conductive portion 14 can be removed by thermal shock using an ultraviolet laser to enhance the conductivity and adhesion of the contact between the first conductive portion 13 and the second conductive portion 14.

[0234] In step 2004, a first conductive portion 13 is formed on the side of the array substrate 12 and the side of the color film substrate 11. The first end E1 of the first conductive portion 13 is located on the side of the color film substrate 11, and the second end E2 is located on the side of the array substrate 12. The first conductive portion 13 is connected to the second conductive portion 14.

[0235] In this embodiment, in step 2004 , the first conductive portion 13 may be prepared first, and then the first conductive portion 13 may be transferred to the side surface of the array substrate 12 and the side surface of the color filter substrate 11 by using a transfer process.

[0236] In this embodiment, conductive silver paste may be injected into a high-precision screen to form the first conductive portion 13 , and then the first conductive portion 13 may be transferred to the side of the array substrate 12 and the side of the color filter substrate 11 using a silicone pad.

[0237] In this embodiment, after the first conductive portion 13 is transferred to the side surface of the array substrate 12 and the side surface of the color filter substrate 11 by using a silicone pad, the first conductive portion 13 may be thermally cured by using an infrared laser.

[0238] In this embodiment, after the first conductive part 13 is thermally cured by infrared laser, the COF 16 can be bound to the side of the display panel 1 by the conductive film layer 15 under certain temperature, time and pressure.

[0239] In this embodiment, the COF can be bonded to the printed circuit board 17 by using a conductive adhesive under a certain temperature, time, and pressure.

[0240] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

[0241] It should be noted that the display device in this embodiment can be: electronic paper, mobile phone, tablet computer, television, notebook computer, digital photo frame, navigator, or any other product or component with a display function.

[0242] The formation process used in the above process may include, for example, film forming processes such as deposition and sputtering and patterning processes such as etching.

[0243] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0244] In the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0245] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the disclosure disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The description and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0246] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A display panel, characterized in that: include: The color film substrate, the array substrate, the liquid crystal layer and the first conductive part form a display area and a peripheral area on the display panel, wherein the peripheral area surrounds the display area; The color filter substrate is opposite to the array substrate; The liquid crystal layer is located between the color filter substrate and the array substrate; the array substrate comprises a pixel circuit and a second conductive portion, the pixel circuit is located in the display area, and the second conductive portion is located in the peripheral area; the second conductive portion is connected to the pixel circuit; the pixel circuit and the second conductive portion are located on a side of the array substrate facing the color filter substrate; The first conductive part is located on the side of the array substrate and the side of the color filter substrate, the first end of the first conductive part is located on the side of the color filter substrate, the second end is located on the side of the array substrate, and the first conductive part is connected to the second conductive part; The color filter substrate includes a third light-shielding layer and a fourth light-shielding layer; The peripheral region includes a first sub-region and a second sub-region, the first sub-region is located between the display area and the first conductive portion, and the second sub-region is a region of the peripheral region excluding the first sub-region; The projection of the third light shielding layer on the array substrate is located in the first sub-region, and the projection of the fourth light shielding layer on the array substrate is located in the second sub-region; The width of the third light-shielding layer is 0.6-1.0 mm, and the width of the fourth light-shielding layer is 0.25-0.5 mm.

2. The display panel according to claim 1, characterized in that: A distance between a first end of the first conductive portion and a second end of the first conductive portion is smaller than a distance between a first surface of the color filter substrate away from the array substrate and a second surface of the array substrate away from the color filter substrate.

3. The display panel according to claim 1, characterized in that: The first conductive portion is located between a first central axis of a side surface of the color film substrate and a second central axis of a side surface of the array substrate, and the first central axis and the second central axis are respectively perpendicular to a direction from a first end of the first conductive portion to a second end of the first conductive portion.

4. The display panel according to claim 3, characterized in that: The first conductive part is prepared by a transfer process, the distance between the first end of the first conductive part and the first central axis is a first distance, the distance between the second end of the first conductive part and the second central axis is a second distance, and the first distance is the same as the second distance.

5. The display panel according to claim 1, characterized in that: A chip-on-chip film is also included. The chip-on-chip film is bound to the first conductive part, and the chip-on-chip film is electrically connected to the first conductive part.

6. The display panel according to claim 5, characterized in that: It also includes a conductive film layer, which is located between the first conductive part and the chip-on-film. The first conductive part is electrically connected to the chip-on-film through the conductive film layer.

7. The display panel according to claim 6, characterized in that: The number of the first conductive parts is plural, and the conductive film layer covers the first conductive parts; The plurality of first conductive portions include a plurality of central conductive portions and a plurality of edge conductive portions, wherein the central conductive portions are located in the middle of the plurality of first conductive portions, and the edge conductive portions are located at the edges of the plurality of first conductive portions; The chip-on-film is connected to the plurality of central conductive portions through the conductive film layer.

8. The display panel according to claim 5, characterized in that: The system also includes a printed circuit board, which is located on a side of the chip-on-film away from the array substrate and is connected to the chip-on-film.

9. The display panel according to claim 8, characterized in that: The width of the chip-on-film on one side of the printed circuit board is smaller than the width of the chip-on-film on one side of the array substrate.

10. The display panel according to claim 1, characterized in that: A polarizer is attached to each of the light emitting side of the color filter substrate and the light incident side of the array substrate.

11. The display panel according to claim 1, characterized in that: It also includes a first polarizer and a second polarizer, wherein the first polarizer is located on a side of the color filter substrate away from the array substrate, and the second polarizer is located on a side of the array substrate away from the color filter substrate; The color film substrate comprises a first edge and a second edge, the first edge is located at a first side of the color film substrate, the second edge is located at a second side of the color film substrate, the second side is the remaining side except the first side, and the first conductive portion is located at the first side of the color film substrate; The distance between the third edge of the first polarizer located on the first side and the first edge is 0.05 to 1.7 mm, and the third edge is parallel to the first edge; the distance between the fourth edge of the first polarizer located on the second side and the second edge is 0 to 0.1 mm, and the fourth edge is parallel to the second edge; The array substrate comprises a fifth edge and a sixth edge, the fifth edge is located at the first side of the array substrate, and the sixth edge is located at the second side of the array substrate; The distance between the seventh edge of the second polarizer on the first side and the fifth edge is 0.1 to 1.7 mm, and the seventh edge is parallel to the fifth edge; the distance between the eighth edge of the second polarizer on the second side and the sixth edge is 0 to 0.1 mm, and the eighth edge is parallel to the sixth edge.

12. The display panel according to claim 11, characterized in that: It also includes a first light shielding layer, a second light shielding layer, a first water and oxygen barrier layer, and a second water and oxygen barrier layer; The color filter substrate comprises a first edge region and a first central region, the first edge region surrounds the first central region; the projection of the first polarizer on the color filter substrate is located in the first central region; The first light shielding layer is located on a side of the color filter substrate facing the first polarizer, is located in the first edge region, and covers a side surface of the first polarizer; The first water and oxygen barrier layer covers the first light shielding layer; The array substrate comprises a second edge region and a second central region, the second edge region surrounds the second central region; the projection of the second polarizer on the array substrate is located in the second central region; The second light shielding layer is located on a side of the array substrate facing the second polarizer, is located in the second edge region, and covers a side surface of the second polarizer; the second water and oxygen barrier layer covers the second light shielding layer.

13. A display device, characterized in that: include: A light emitting module and a display panel according to any one of claims 1 to 12; The display panel is located at the light emitting side of the light emitting module, and the array substrate is located between the color filter substrate and the light emitting module.

14. The display device according to claim 13, characterized in that: The light-emitting module includes a back panel, a middle frame, an optical film layer and a light panel; The back panel includes a bottom plate and side walls; the light panel is located on the side of the bottom plate facing the display panel and includes a plurality of light sources; the middle frame is arranged around the plurality of light sources and is fixedly connected to the side walls, and the middle frame is located between the bottom plate and the optical film layer.

15. The display device according to claim 14, characterized in that: The projection of the optical film layer on the color film substrate is located within the projection of the array substrate on the color film substrate, and the projection of the middle frame on the array substrate is located within the projection of the optical film layer on the array substrate.

16. The display device according to claim 15, characterized in that: Also includes a fifth light shielding layer and a metal layer; The fifth light shielding layer is located on a side surface of the color filter substrate and a side surface of the array substrate; The metal layer covers the fifth shading layer and is located on the side of the light-emitting module. When the display panel also includes a first polarizer, the first end of the metal layer is located on the side of the first polarizer away from the color film substrate and is located in the peripheral area, and the second end of the metal layer is located on the side of the light-emitting module away from the display panel.

17. The display device according to claim 16, characterized in that: On the first side of the optical film layer, in the first direction, the distance between the edge of the optical film layer and the metal layer is a third distance, and the distance between the middle frame and the edge of the optical film layer is a fourth distance, the first direction is parallel to the surface of the optical film layer facing the display panel, the third distance is the same as the fourth distance, and the third distance is 0.3 to 0.5 mm; On the second side of the optical film layer, in the first direction, the distance between the edge of the optical film layer and the metal layer is the fifth distance, and the distance between the middle frame and the edge of the optical film layer is the sixth distance, and the sixth distance is greater than the fifth distance and is the same; the fifth distance is 0.1 to 0.3 mm, and the sixth distance is 0.3 to 0.5 mm.

18. The display device according to claim 14, characterized in that: On the first side of the bottom plate, the middle frame includes a first side surface and a second side surface, the first side surface is connected to the second side surface, the first side surface is an inclined plane, the first side surface is inclined from the peripheral area to the display area, and the second side surface extends along a second direction, and the second direction is perpendicular to the surface of the optical film layer facing the display panel; When the display panel includes a chip-on-film, the chip-on-film includes a chip and a flexible circuit board, and the chip is fixed on the flexible circuit board; The display panel further includes a printed circuit board, which is located at a side of the chip-on-film away from the array substrate and is connected to the chip-on-film.

19. The display device according to claim 18, characterized in that On the first side of the bottom plate, the side wall includes a first vertical extension portion, a first horizontal extension portion and a second vertical extension portion, the first vertical extension portion is connected to the bottom plate and extends along a second direction, the first horizontal extension portion is located between the first vertical extension portion and the second vertical extension portion, the extension direction of the first horizontal extension portion is perpendicular to the second direction and extends in a direction from the display area to the peripheral area, and the second vertical extension portion extends along the second direction; The light emitting module further includes a support block, which is located at the connection between the first vertical extension portion and the first horizontal extension portion and between the first vertical extension portion and the printed circuit board, and is used to support the printed circuit board.

20. The display device according to claim 19, characterized in that The light emitting module further comprises a protection plate for protecting the printed circuit board; The protection plate is located at a side of the printed circuit board away from the supporting block, and the protection plate, the middle frame and the back plate are fixed together.

21. The display device according to claim 20, characterized in that: The protection plate includes a first protection portion and a second protection portion, the first protection portion is connected to the second protection portion, the first protection portion extends along the second direction, the printed circuit board is located between the first protection portion and the support block, and the second protection portion extends in a direction perpendicular to the second direction and is located on a side of the printed circuit board away from the display panel; The middle frame includes a first supporting portion, a second supporting portion and a third supporting portion, the second supporting portion is located between the first supporting portion and the third supporting portion, the first supporting portion is located on the bottom plate, the extension direction of the first supporting portion is perpendicular to the second direction, the second supporting portion extends along the second direction, and the third supporting portion is used to support the optical film layer; The light emitting module further includes a first fastener, the first fastener passing through the second vertical extension portion, the third supporting portion and the first protecting portion; A first supporting point of the third supporting portion on the optical film layer, a second supporting point of the second supporting portion on the third supporting portion, and a contact point between the third supporting portion and the first fastener are vertices of a mechanical triangle.

22. The display device according to claim 21, characterized in that The third supporting portion includes a third side surface, a fourth side surface and a fifth side surface, the third side surface, the fourth side surface and the fifth side surface face the optical film layer, the fourth side surface is located between the third side surface and the fifth side surface, the third side surface is a plane for supporting the optical film layer, the angle between the fourth side surface and the surface of the optical film layer facing the middle frame is an acute angle, and the fifth side surface is a convex arc surface; The width of the third side surface in the first direction is 0.2 to 0.3 mm, and the first direction is perpendicular to the second direction; the angle between the fourth side surface and the surface of the optical film layer facing the middle frame is 23 to 33 degrees; the radius of the spherical surface where the convex arc surface is located is 10 to 15 mm; The second supporting portion includes a sixth side surface, the sixth side surface is located on a side of the second supporting portion facing the optical film layer, and the sixth side surface is a plane.

23. The display device according to claim 22, characterized in that The light-emitting module further includes a first reflective film layer, and the first reflective film layer is located on a surface of the middle frame facing the optical film layer; The first reflective film layer covers the fifth side surface, a portion of the fourth side surface, and a portion of the sixth side surface; On a side of the middle frame close to the optical film layer, there is a gap between the first reflective film layer and the third side surface, and on a side of the middle frame close to the bottom plate, there is a gap between the first reflective film layer and the first supporting portion; The first reflective film layer is a reflective sticker or a white film layer.

24. The display device according to claim 23, characterized in that On the side of the middle frame close to the optical film layer, the distance between the first reflective film layer and the third side surface is 2.5 to 5 mm, and on the side of the middle frame close to the bottom plate, the distance between the first reflective film layer and the first supporting portion is less than or equal to 2 mm.

25. The display device according to claim 23, characterized in that: The number of the middle frames is 4; the 4 middle frames are adjacent to each other and enclose a quadrilateral; and two adjacent middle frames are fixedly connected.

26. The display device according to claim 25, characterized in that The light-emitting module further comprises an embedded corner block, and the embedded corner block is used to fix and connect two adjacent middle frames; The embedded corner block comprises a first connecting portion and a second connecting portion, the first connecting portion is connected to the second connecting portion, and an extending direction of the first connecting portion intersects with an extending direction of the second connecting portion; The first connection portion is fixedly connected to one of the two adjacent middle frames, and the second connection portion is fixedly connected to the other of the two adjacent middle frames.

27. The display device according to claim 26, characterized in that: Of the two adjacent middle frames, one of the middle frames includes a first groove, and the other middle frame includes a second groove; The first connection portion is located in the first groove, and the depth of the first groove is the same as the thickness of the first connection portion. The second connection portion is located in the second groove, and the depth of the second groove is the same as the thickness of the second connection portion.

28. The display device according to claim 26, characterized in that Of the two adjacent middle frames, one of the middle frames includes a first positioning hole, and the other middle frame includes a second positioning hole; The first connection portion includes a first positioning column, and the second connection portion includes a second positioning column. The first positioning column is located in the first positioning hole, and the second positioning column is located in the second positioning hole.

29. The display device according to claim 25, characterized in that There is an opening between two adjacent middle frames on a side close to the bottom plate.

30. The display device according to claim 25, characterized in that The light-emitting module further includes a second reflective film layer, which is located at a connection between two adjacent middle frames, and a width of the second reflective film layer increases in a direction from the optical film layer to the bottom plate.

31. The display device according to claim 23, characterized in that The multiple light sources are arranged in an array, and the light source array formed by the multiple light sources is symmetrical.

32. The display device according to claim 31, characterized in that The light source array includes M rows of light sources arranged along a first direction and N rows of light sources arranged along a third direction, where M and N are integers greater than 6 respectively; the first direction intersects the third direction; In the first direction, the lamp distance between the first light source and the second light source is the first lamp distance, the lamp distance between the second light source and the third light source is the second lamp distance, the lamp distance between the N-2th light source and the N-1th light source is the second lamp distance, the lamp distance between the N-1th light source and the Nth light source is the first lamp distance, and the lamp distance between two adjacent light sources in the remaining light sources is the third lamp distance; the second lamp distance is greater than the third lamp distance, and the third lamp distance is greater than the first lamp distance; In the third direction, the lamp distance between the first light source and the second light source is the fourth lamp distance, the lamp distance between the second light source and the third light source is the fifth lamp distance, the lamp distance between the N-2th light source and the N-1th light source is the fifth lamp distance, the lamp distance between the N-1th light source and the Nth light source is the fourth lamp distance, and the lamp distance between two adjacent light sources among the remaining light sources is the third lamp distance; the fifth lamp distance is greater than the third lamp distance, and the third lamp distance is greater than the fourth lamp distance.

33. The display device according to claim 32, characterized in that: In any one of the first direction and the third direction, the distance between the side of the first reflective film layer on the second supporting portion facing the optical film layer and the light source adjacent to the second supporting portion is the seventh distance, the distance between the side of the first reflective film layer on the second supporting portion facing the optical film layer and the edge of the optical film layer adjacent to the middle frame is the eighth distance, the projection of the surface of the second supporting portion facing the optical film layer on the optical film layer is a projection point, the acute angle between the line connecting the light source adjacent to the second supporting portion and the projection point and the second direction is the first angle, the second direction is perpendicular to the surface of the optical film layer facing the display panel; the acute angle between the connecting point between the second supporting portion and the third supporting portion and the light source adjacent to the second supporting portion and the second direction is the second angle, the reflectivity of the surface of the third supporting portion facing the optical film layer, the luminous flux per unit angle at different light-emitting angles of the light source, the seventh distance, the eighth distance, the first angle and the second angle satisfy the following relationship: Among them, a is the value of the seventh distance, b is the value of the eighth distance, α is the value of the first angle, β is the value of the second angle, x is the luminous flux, and r is the luminous angle.

34. The display device according to claim 21, characterized in that It also includes a third reflective film layer, which is located on a side of the light board facing the optical film layer and is pressed on the bottom end of the first supporting portion.

35. The display device according to claim 14, characterized in that: The top surface of the middle frame is coated with hot melt adhesive / optical curing adhesive, and the hot melt adhesive / optical curing adhesive is used to fix the edge of the optical film layer to the top surface of the middle frame; When the display panel also includes a second polarizer, and the second polarizer is located on a side of the array substrate away from the color film substrate, an optical curing adhesive is coated on an edge of the second polarizer, and the optical curing adhesive is used to fix the array substrate and the color film substrate on the optical film layer.

36. The display device according to claim 35, characterized in that The hot melt adhesive comprises a resin material, and the light transmittance of the hot melt adhesive is 80% to 99.5%; The optical curing adhesive comprises a resin material, and the light transmittance of the optical curing adhesive is 80% to 99.5%.

37. The display device according to claim 14, characterized in that: The optical film layer includes a transparent glass plate, a light diffusion film and a brightness enhancement film. The light diffusion film is located on a side of the transparent glass plate away from the array substrate, and the brightness enhancement film is located on a side of the transparent glass plate facing the array substrate.

38. A splicing display device, characterized in that: It comprises at least two display devices, at least one of which is the display device according to any one of claims 13 to 37.

39. A method for preparing a display panel, characterized in that: A display area and a peripheral area are formed on a display panel, wherein the peripheral area surrounds the display area; the preparation method comprises: forming an array substrate, the array substrate comprising a pixel circuit and a second conductive portion, the pixel circuit being located in the display area, the second conductive portion being located in the peripheral area; the second conductive portion being connected to the pixel circuit; forming a color film substrate; Aligning the array substrate with the color filter substrate, wherein the pixel circuit and the second conductive portion are located on a side of the array substrate facing the color filter substrate; A first conductive portion is formed on the side of the array substrate and the side of the color filter substrate, wherein a first end of the first conductive portion is located on the side of the color filter substrate, a second end of the first conductive portion is located on the side of the array substrate, and the first conductive portion is connected to the second conductive portion; The color filter substrate includes a third light-shielding layer and a fourth light-shielding layer; The peripheral region includes a first sub-region and a second sub-region, the first sub-region is located between the display area and the first conductive portion, and the second sub-region is a region of the peripheral region excluding the first sub-region; The projection of the third light shielding layer on the array substrate is located in the first sub-region, and the projection of the fourth light shielding layer on the array substrate is located in the second sub-region; The width of the third light-shielding layer is 0.6-1.0 mm, and the width of the fourth light-shielding layer is 0.25-0.5 mm.

40. The method according to claim 39, characterized in that The first conductive portion is formed on the side of the array substrate and the side of the color film substrate, comprising: preparing the first conductive portion; The first conductive portion is transferred to the side surface of the array substrate and the side surface of the color filter substrate by using a transfer process.

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