A display module, a preparation method thereof, and a display device

Abstract

Embodiments of the present invention disclose a display module, a preparation method of the display module, and a display device, including a display panel, where the display panel includes a photosensitive area; the display module further includes a grid-shaped heat conduction structure located on the non-light-emitting side of the display panel and covering at least part of the photosensitive area. The technical solution provided by the embodiments of the present invention is used to improve the display quality and ensure the uniformity of the display brightness.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technologies, and in particular, to a display module, a preparation method of the display module, and a display device. Background Art

[0002] With the development of display technologies, the requirements for display quality are getting higher and higher. Currently, various display devices on the market usually have a fingerprint recognition function, such as mobile phones, tablet computers, and smart wearable devices. In existing display devices based on optical fingerprint recognition technology, the thin-film transistor devices in the fingerprint recognition area are affected by light, and their performance will also deteriorate, resulting in uneven display of the display device, thereby reducing the display quality. Summary of the Invention

[0003] The present invention provides a display module, a preparation method of the display module, and a display device to improve the display quality and ensure the uniformity of display brightness.

[0004] In a first aspect, an embodiment of the present invention provides a display module, including a display panel, and the display panel includes a photosensitive area;

[0005] The display module further includes a grid-shaped heat conduction structure located on the non-light-emitting side of the display panel and covering at least a part of the photosensitive area.

[0006] In a second aspect, an embodiment of the present invention further provides a preparation method of a display module for preparing the display module described in the first aspect, and the preparation method includes:

[0007] Prepare a display panel, and the display panel includes a photosensitive area;

[0008] Prepare a grid-shaped heat conduction structure on the non-light-emitting side of the display panel, and the grid-shaped heat conduction structure covers at least a part of the photosensitive area.

[0009] In a third aspect, an embodiment of the present invention further provides a display device, including the display module described in the first aspect.

[0010] In the technical solution of the embodiment of the present invention, by providing that the display panel in the display module includes a photosensitive area, the photosensitive structure on the non-light-emitting side of the display panel can sense the optical signal containing the information of the detected object through the photosensitive area. Exemplarily, the photosensitive area is the light-transmitting area for fingerprint recognition, which enables photosensitive structures such as fingerprint recognition units on the side of the photosensitive area away from the display panel to obtain fingerprint information by sensing the optical signal; then, on the non-light-emitting side of the display panel 10, a grid-shaped heat-conducting structure covering at least part of the photosensitive area is provided to block the influence of external light on the components in the display panel through the photosensitive area, reduce the difference in the light-emitting brightness at different areas of the display panel, improve the uniformity of the display light-emitting brightness, and ensure that the display panel has a high display quality.

[0011] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0013] Figure 1 It is a top view structural schematic diagram of a display module provided by an embodiment of the present invention;

[0014] Figure 2 It is a cross-sectional structural schematic diagram of a display module provided by an embodiment of the present invention;

[0015] Figure 3 It is another cross-sectional structural schematic diagram of a display module provided by an embodiment of the present invention;

[0016] Figure 4 It is a structural schematic diagram of the overlap between the grid lines and thin-film transistors in the photosensitive area of a display module provided by an embodiment of the present invention;

[0017] Figure 5 It is another structural schematic diagram of the overlap between the grid lines and thin-film transistors in the photosensitive area of a display module provided by an embodiment of the present invention;

[0018] Figure 6 It is yet another structural schematic diagram of the overlap between the grid lines and thin-film transistors in the photosensitive area of a display module provided by an embodiment of the present invention;

[0019] Figure 7 It is yet another cross-sectional structural schematic diagram of a display module provided by an embodiment of the present invention;

[0020] Figure 8 Schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0021] Figure 9 Schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0022] Figure 10 Schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0023] Figure 11 Schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0024] Figure 12 Schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0025] Figure 13 Flowchart of a method for manufacturing a display module provided by an embodiment of the present invention;

[0026] Figure 14 Flowchart of another method for manufacturing a display module provided by an embodiment of the present invention;

[0027] Figure 15 Schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention before the testing stage;

[0028] Figure 16 Schematic structure diagram of a display device provided by an embodiment of the present invention. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present invention are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0031] Figure 1 FIG. 4 is a top view structural schematic diagram of a display module provided by an embodiment of the present invention. Figure 2 FIG. 5 is a cross-sectional structural schematic diagram of a display module provided by an embodiment of the present invention, in combination with Figure 1 and Figure 2 as shown, it includes a display panel 10, and the display panel 10 includes a photosensitive area 101; the display module further includes a grid-shaped heat conduction structure 20 located on the non-light-emitting side of the display panel 10 and covering at least part of the photosensitive area 101.

[0032] Referring to Figure 1 as shown, the embodiment of the present invention does not specifically limit whether the display panel 10 is a flexible display panel or a rigid display panel. The photosensitive area 101 can be located at any position of the display panel 10, and the shape of the photosensitive area 101 can be any shape. The embodiment of the present invention does not make specific limitations on this.

[0033] It can be understood that the photosensitive area 101 can be a light-transmitting area for fingerprint recognition, so that photosensitive structures such as fingerprint recognition units on the side of the photosensitive area 101 away from the display panel 10 can obtain fingerprint information by sensing light signals. Since external light can enter the display panel 10 through the photosensitive area 101, this will cause a large difference in the performance of the thin-film transistors corresponding to the photosensitive area 101 in the display panel 10 and the performance of the thin-film transistors in other areas, resulting in a difference in the display and emission brightness of the display panel, and even the phenomenon of uneven display.

[0034] Continue to refer to Figure 2, along the thickness direction Z of the display module, by setting the grid-shaped heat conduction structure 20 to overlap with at least part of the photosensitive area 101, the grid-shaped heat conduction structure 20 can block external light, avoiding the irradiation of the thin-film transistors in the photosensitive area 101 by external light and affecting the performance of the thin-film transistors. At the same time, since the grid-shaped heat conduction structure 20 is grid-shaped, light can still pass through the photosensitive area 101, without affecting the accuracy of the photosensitive structure in obtaining optical signals. It should be noted that the specific shape of the grid-shaped heat conduction structure 20 can be selectively set according to actual situations, and the embodiments of the present invention do not limit this. Considering that external light mainly generates leakage current by irradiating the active layer or gate metal layer of the thin-film transistor, resulting in a decline in the performance of the thin-film transistor and other reasons, the shape of the grid-shaped heat conduction structure 20 can be set according to the specific film layer structure of one or more thin-film transistors covered by the photosensitive area 101 to block the irradiation of external light on the active layer or gate metal layer of the thin-film transistor, improving the working stability of the thin-film transistors in the photosensitive area 101, and further making the light emission of the display panel 10 more uniform and improving the display quality.

[0035] In addition, since a large amount of heat is generated when the display panel 10 emits light for display, heat conduction can also be carried out by setting the grid-shaped heat conduction structure 20 to include materials capable of conducting heat, improving the heat dissipation performance of the display panel 10, and further improving the service life of the display panel 10.

[0036] It should be noted that since the grid-shaped heat conduction structure 20 is disposed on the non-light-emitting side of the display panel, the grid-shaped heat conduction structure 20 cannot be seen from the top view. Therefore Figure 1 in, the grid-shaped heat conduction structure 20 is shown by a dotted line, and here it is only for showing the grid-shaped heat conduction structure 20.

[0037] In the embodiments of the present invention, by setting the display panel in the display module to include a photosensitive area, the photosensitive structure on the non-light-emitting side of the display panel can sense the optical signal containing the information of the detected object through the photosensitive area. Exemplarily, the photosensitive area is the light-transmitting area for fingerprint recognition, which can enable photosensitive structures such as fingerprint recognition units on the side of the photosensitive area away from the display panel to obtain fingerprint information by sensing optical signals; then on the non-light-emitting side of the display panel 10, a grid-shaped heat conduction structure covering at least part of the photosensitive area is provided to block the influence of external light on the devices in the display panel through the photosensitive area, reducing the difference in the light emission brightness at different areas of the display panel, improving the uniformity of the display light emission brightness, and ensuring that the display panel has a high display quality.

[0038] Optionally, the grid-shaped heat conduction structure 20 includes an anisotropic heat conduction structure.

[0039] Among them, the anisotropic thermal conductive structure includes but is not limited to copper, aluminum, silicon, graphite or graphene-based composite materials, so that the grid-like thermal conductive structure 20 has a high thermal conductivity, can quickly transfer and disperse the heat generated by the display panel 10, increase the heat dissipation area, thereby achieving rapid heat dissipation, avoiding excessive heat from affecting the stability of various devices in the display panel, and improving the life of the display panel.

[0040] Optional, Figure 3 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention, combined with Figure 1 and Figure 3 As shown, the grid-like heat-conducting structure 20 includes grid lines 21; the display panel 10 also includes a driving circuit 11 and a light-emitting element 12, the driving circuit 11 is used to drive the light-emitting element 12 to emit light; the driving circuit 11 includes a thin film transistor T, and along the thickness direction Z of the display module, the grid lines 21 overlap with the thin film transistor T.

[0041] The material of the grid lines 21 includes but is not limited to metals, such as copper, aluminum or others.

[0042] The light-emitting element 12 includes a stacked anode layer 121, a light-emitting layer 122, and a cathode layer 123. In addition to the functional film layers shown above, the light-emitting element 12 may also include an auxiliary light-emitting layer, which is used to promote the recombination of carriers in the light-emitting layer. For example, the auxiliary light-emitting layer may include a hole injection layer, a hole transport layer, a resistance blocking layer, a hole blocking layer, a hole transport layer, and a hole injection layer. One or more layers are not limited here. The light-emitting element 12 includes but is not limited to one or more of a red light-emitting element, a green light-emitting element, a blue light-emitting element, a white light-emitting element, a yellow light-emitting element, a cyan light-emitting element, and a magenta light-emitting element. In addition, the light-emitting element 12 includes but is not limited to OLED, Mini LED, or Mico LED, etc.

[0043] The thin film transistor T includes an active layer 111, a gate 112, a source 113 and a drain 114. Along the thickness direction Z of the display module, the grid line 21 can overlap with each film layer in the thin film transistor T to reduce the influence of external light on the performance of the thin film transistor T, and avoid the performance difference between the thin film transistor T in the photosensitive area 101 and the thin film transistor in the non-photosensitive area, thereby affecting the uniformity of the display luminous brightness.

[0044] It should be noted that the driving circuit 11 may include a plurality of thin film transistors T. Figure 3 The schematic structural diagram of a thin film transistor is only exemplarily shown. The thin film transistor T may be a driving transistor or a switching transistor, which is not limited in the embodiment of the present invention.

[0045] Optional, Figure 4Schematic diagram of the overlapping structure of grid lines and thin-film transistors in the photosensitive area of a display module provided by an embodiment of the present invention. Refer to Figure 3 and Figure 4 As shown, the thin-film transistor T includes an active layer 111 and a gate 112; along the thickness direction Z of the display module, the grid line overlaps with the active layer 111 and / or the gate 112.

[0046] Specifically, when the thin-film transistor T is in the off state, light irradiation will cause the channel region of the thin-film transistor T to absorb external light energy and cause transitions, and the formed electron-hole pairs will cause an increase in the leakage current under the action of the source-drain electric field, thus affecting the stable operation of the thin-film transistor T. In the thickness direction Z of the display module, the overlapping region of the active layer 111 and the gate 112 in the thin-film transistor T is the channel region. Therefore, by making the grid line 21 overlap with the active layer 111 and / or the gate 112, that is, in the plane perpendicular to the display module, the projected area of the grid line 21 is greater than or equal to the projected area of the active layer 111 and / or the gate 112, so as to block the external light from irradiating the thin-film transistor T, thereby improving the performance of the thin-film transistor T and reducing the performance difference between the photosensitive area 101 of the display panel and the thin-film transistors in other areas. Moreover, since the grid line only overlaps with the active layer 111 and / or the gate 112, it will not affect the overall light transmittance of the entire display panel 10, thereby improving the light emission uniformity of the display panel while ensuring that the display panel 10 has high display quality.

[0047] Exemplarily, taking the driving circuit 11 as a 7TIC (i.e., including seven thin-film transistors and one storage capacitor) circuit as an example, Figure 4 Exemplarily shows the circuit schematic diagram of the metal layer where the active layer 111 of the thin-film transistor T in the driving circuit 11 is located and the metal layer where the gate 112 is located. It can be understood that the overlapping position of the metal layer where the active layer 111 is located and the metal layer where the gate 112 is located corresponds to a thin-film transistor T. On this basis, the grid line 21 overlaps with both the active layer 111 and the gate 112, making the shape of the grid line 21 similar to the routing shapes of the active layer 111 and the gate 112 of the thin-film transistor T in the driving circuit 11, presenting a grid-like shape. And since the grid line 21 does not block the entire driving circuit 11, it can avoid the external light from irradiating the active layer 111 and the gate 112 of the thin-film transistor T and affecting its working stability without reducing the light transmittance of the display panel 10.

[0048] In other embodiments, the grid line 21 can also only overlap with the active layer 111 (refer to Figure 5 as shown) or only overlap with the gate 112 (refer to Figure 6 as shown), both of which can reduce the influence of light irradiation on the performance of the thin-film transistor T and improve the uniformity of light emission of the display panel. It can be understood thatFigures 4 to 6 Only an exemplary structural schematic diagram in which the grid lines overlap both the active layer 111 and the gate 112 is shown. According to the different specific circuit structures of the driving circuit 11, the number of thin film transistors T in the driving circuit 11 and the structure of the gates of the thin film transistors T will be different. Thus, the structure of the grid lines 21 will also be different, which can be selectively set according to the actual situation, and the embodiments of the present invention do not make specific limitations in this regard.

[0049] Optionally, Figure 7 This is a cross-sectional structural schematic diagram of another display module provided by the embodiments of the present invention. As Figure 7 shown, the display panel 10 further includes a support structure 13 located on the non-light-emitting side of the display panel 10. A via hole 131 is provided in the support structure 13. The via hole 131 penetrates the support structure 13 and extends along the thickness direction Z of the display module. The via hole 131 at least partially overlaps with the photosensitive area 101; at least a part of the grid-shaped heat conduction structure 20 is disposed in the via hole 131.

[0050] Among them, the support structure 13 is used to support the display panel 10 and may include a composite film layer structure. For example, the support structure 13 includes a bonding layer, a foam layer, a polyimide layer, and a metal layer stacked. The support structure 13 is pasted on the non-light-emitting side of the display panel 10 through the bonding layer. The bonding layer includes, but is not limited to, grid glue (Embo), which has the functions of fitting and exhausting air and is flexible, and will not affect the flexible design of the display module. The foam layer can be foam, which can not only play a buffering role but also a light-shielding role. The polyimide layer can play a reinforcing role and increase the reliability of the support structure. In other embodiments, the polyimide layer can also be replaced by a graphite layer, and the outer surface of the graphite layer can be coated with polyimide. The material of the metal layer can be one of copper and aluminum or an alloy structure thereof, and the metal layer can play a heat dissipation role. Specifically, the metal layer can be a copper foil or an aluminum foil. In addition, the support structure 13 may not include the polyimide layer, and the embodiments of the present invention do not make specific limitations in this regard.

[0051] Specifically, since the support structure 13 has a certain light-shielding effect, for the area where the photosensitive region 101 is located, it is necessary to set vias 131 in the support structure 13 so that light can pass through the vias 131 and enter the photosensitive region 101 to enable the photosensitive structure to obtain optical signals (for example, collect fingerprint information through optical signals). Along the thickness direction Z of the display module, the via 131 and the photosensitive region 101 may partially overlap or completely overlap. The present invention does not limit this in real time. Preferably, the via 131 completely overlaps with the photosensitive region 101 to avoid the situation where the via 131 is small while the photosensitive region 101 is large, resulting in weak light obtained by the photosensitive region 101 and affecting the accuracy of fingerprint collection; or the via 131 is large while the photosensitive region 101 is small, causing the external light to irradiate the display panel through the gap between the two and resulting in a decrease in display quality. On this basis, continue to refer to Figure 7 , the grid-shaped heat-conducting structure 20 can be arranged in the via 131 to shield the thin-film transistor T in the photosensitive region 101 overlapping with the via 131 from light, avoid affecting the performance of the thin-film transistor T, reduce the difference in the emission brightness between the photosensitive region 101 and the non-photosensitive region of the display panel, and improve the uniformity of the display brightness.

[0052] It should be noted that Figure 7 only the entire grid-shaped heat-conducting structure 20 is exemplarily shown to be arranged in the via 131. In the thickness direction Z of the display module, the thickness of the grid-shaped heat-conducting structure 20 and the support structure 13 may be the same or different. The embodiments of the present invention do not limit this and can be selectively set according to actual situations.

[0053] In other embodiments, only part of the grid-shaped heat-conducting structure 20 is arranged in the via 131 and completely covers the via 131, and part of the grid-shaped heat-conducting structure 20 is located outside the via 131 and covers the gap between the grid-shaped heat-conducting structure 20 and the support structure 13 (which can be referred to Figure 8 shown), so that the grid-shaped heat-conducting structure 20 can completely cover the via 131 in the thickness direction Z of the display module to prevent external light from entering the display panel 10 through the gap between the grid-shaped heat-conducting structure 20 and the support structure 13 and affecting the stability of the devices in the display panel 10.

[0054] Or, in another alternative embodiment, Figure 9 is a schematic cross-sectional structure diagram of another display module provided by the embodiments of the present invention. As shown in Figure 9 , the grid-shaped heat-conducting structure 20 is arranged on the side of the support structure 13 away from the display panel 10.

[0055] Specifically, in the thickness direction Z of the display module, when the grid-shaped heat conduction structure 20 is arranged on the side of the support structure 13 away from the display panel 10, it can overlap with part of the support structure 13, so that while the grid-shaped heat conduction structure 20 completely covers the via hole 131 to block external light, it can also be stably fixed in the display module, thereby improving the reliability of the display module, and at the same time ensuring that the brightness of the display panel 10 is more uniform when displaying light, and improving the display quality. In addition, arranging the grid-shaped heat conduction structure 20 on the side of the support structure 13 away from the display panel 10 can also make the setting of the grid-shaped heat conduction structure 20 no longer limited by the shape and size of the via hole 131, improving the flexibility of setting the grid-shaped heat conduction structure 20, and then simplifying the manufacturing process of the display module.

[0056] Optionally, on the basis of Figures 7 to 9 the corresponding embodiment, along the thickness direction Z of the display module, when the thickness of the grid-shaped heat conduction structure 20 is inconsistent with that of the support structure 13, or when the grid-shaped heat conduction structure 20 is arranged on the side of the support structure 13 away from the display panel 10, a transparent adhesive material can be filled in the via hole 131. The transparent adhesive material includes water glue, such as glue materials with high light transmittance such as OCA or OCR, and the embodiments of the present invention do not limit this. In this way, by filling the transparent adhesive material in the via hole 131, while ensuring light transmission, the transparent adhesive material filled in the via hole 131 can play a certain supporting role for the grid-shaped heat conduction structure 20, thereby being beneficial to the bonding stability between the grid-shaped heat conduction structure 20 and the display panel 10 or the support structure 13.

[0057] In addition, without special explanation, hereinafter, an example will be given with the grid-shaped heat conduction structure 20 in the display module arranged in the via hole 131 of the support structure 13 for exemplary illustration.

[0058] Optionally, Figure 10 is a schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention. As Figure 10 shown, the support structure 13 includes a metal support layer 132; the grid-shaped heat conduction structure 20 includes grid lines 21, and the reflectivity α1 of the grid lines 21 and the reflectivity α2 of the metal support layer 132 satisfy |α1 - α2| / α1 ≤ 30%.

[0059] It can be understood that during the light-emitting display stage of the display panel 10, some of the light emitted by the light-emitting element 12 propagates downward. When passing through the support structure 13, since the metal support layer 132 of the support structure 13 has a certain reflection effect on light, and there is no support structure 13 at the via 131, the light passes through the via 131 and shoots outside the display panel 10. In this way, the light reflection degrees at the photosensitive region 101 and the non-photosensitive region overlapping with the via 131 are inconsistent, thus affecting the uniformity of the display luminance of the display panel 10.

[0060] Specifically, continue to refer to Figure 10 As shown, by setting the grid-shaped heat-conducting structure 20 to include grid lines 21, where the material of the grid lines 21 includes metals (such as copper, aluminum, or an alloy structure of both), which can have a certain reflection effect on light. At this time, the light reflected by the grid lines 21 is G1, and the light reflected by the metal support layer 132 in the support structure 13 is G2. Set the reflectivity α1 of the grid lines 21 and the reflectivity α2 of the metal support layer 132 to satisfy |α1 - α2| / α1 ≤ 30%, that is, the ratio of the difference between the reflectivity α1 of the grid lines 21 and the reflectivity α2 of the metal support layer 132 to the reflectivity α1 of the grid lines 21 does not exceed 30%. This can make the reflectivity α1 of the grid lines 21 close to the reflectivity α2 of the metal support layer 132, so that the influence of the reflected light on the thin-film transistors corresponding to the via 131 region and the support structure 13 region in the thickness direction Z of the display module is less different, thereby making the display luminance of the display panel 10 more uniform and improving the display quality.

[0061] Optionally, Figure 11 is a schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention. As Figure 11 shown, the display module further includes a first bonding layer 22 located on the side of the grid-shaped heat-conducting structure 20 away from the display panel 10, and the first bonding layer 22 covers part of the grid-shaped heat-conducting structure 20.

[0062] Among them, the first bonding layer 22 includes but is not limited to an optical glue layer. When the glue layer includes an optical glue, the optical glue can be transparent, and its materials include but are not limited to optically clear adhesive (OCA), optically clear resin (OCR), or pressure sensitive adhesive (PSA), etc. The embodiments of the present invention do not make any limitations in this regard. At the same time, the first bonding layer 22 can be a single-layer or multi-layer structure, and the embodiments of the present invention do not make specific limitations in this regard either.

[0063] It can be understood that the first adhesive layer 22 may be a residual structure of the display panel 10 during the testing process. When testing the display panel 10, for example, different test light sources are used to irradiate the display panel 20 to test the brightness non-uniformity level of the display panel 20 when it is exposed to external light, and to quantify the impact of this brightness non-uniformity on the display image quality, so as to evaluate and improve the quality of the display panel. At this time, in order to prevent light from affecting the performance of devices such as thin-film transistors in the display panel 10 through the photosensitive area 101, it is usually necessary to block the light in the photosensitive area 101. For example, a light-blocking structure such as a black light-blocking tape is adhered to the grid-shaped heat-conducting structure 20 to block the test light source. After the test is completed, this light-blocking structure needs to be peeled off to ensure that the photosensitive area 101 can transmit light, facilitating the photosensitive structure to obtain optical signals. It should be noted that the material of the light-blocking structure adhered to the first adhesive layer 22 is not specifically limited in the embodiments of the present invention. Considering that the display panel 10 will also be placed in a high-temperature environment during the testing of the display panel 10, the light-blocking structure can also include a heat-conducting material to facilitate rapid heat dissipation and avoid affecting the performance of the display panel 10. Among them, the heat-conducting material of the light-blocking structure can be the same as or different from the heat-conducting material in the grid-shaped heat-conducting structure 20, and the embodiments of the present invention do not limit this.

[0064] Thus, during the process of peeling off the light-blocking structure adhered to the grid-shaped heat-conducting structure 20 during the testing process, it is inevitable that residual adhesives will be left, that is, the first adhesive layer 22, resulting in the presence of the first adhesive layer 22 on the side of the grid-shaped heat-conducting structure 20 away from the display panel 10. It should be noted that the embodiments of the present invention do not make any limitations on the thickness of the first adhesive layer 22. In the thickness direction Z of the display module, the position where the first adhesive layer 22 overlaps with the grid-shaped heat-conducting structure 20 can be any position, or there can be multiple first adhesive layers 22 overlapping with the grid-shaped heat-conducting structure 20, and the present invention does not specifically limit this in real time. Figure 11 It is only shown exemplarily.

[0065] Optionally, continuing to refer to Figure 11 As shown, the display module further includes a second adhesive layer 23 on the side of the grid-shaped heat-conducting structure 20 close to the display panel 10, and the grid-shaped heat-conducting structure 20 is adhered to the display panel 10 through the second adhesive layer 23; the viscosity of the second adhesive layer 23 is greater than that of the first adhesive layer 22.

[0066] Among them, the materials of the second adhesive layer 23 and the first adhesive layer 22 can be the same or different, including but not limited to a transparent optical glue layer, and the embodiments of the present invention do not specifically limit this.

[0067] Specifically, the second adhesive layer 23 should have good adhesion to facilitate good fitting stability between the grid-shaped heat-conducting structure 20 and the display panel 10. At the same time, the viscosity of the second adhesive layer 23 is greater than that of the first adhesive layer 22, so that when the light-shielding structure adhered to the first adhesive layer 22 is peeled off, the fitting stability and firmness between the grid-shaped heat-conducting structure 20 and the display panel 10 will not be affected, thereby further ensuring the reliability of the display panel 10.

[0068] It should be noted that the embodiment of the present invention does not specifically limit the specific thickness value of the second adhesive layer 23 in the thickness direction Z of the display module. On the premise of meeting the process requirements and fitting requirements, the smaller the thickness of the second adhesive layer 23 is set, the better, for example, less than 100um, which is beneficial to the thin and light design of the entire display module.

[0069] Optionally, Figure 12 As shown in the cross-sectional structure schematic diagram of another display module provided by the embodiment of the present invention, Figure 12 As shown, the display module further includes a photosensitive structure 30; the photosensitive structure 30 is located on the side of the grid-shaped heat-conducting structure 20 away from the display panel 10, and along the thickness direction Z of the display module, the photosensitive structure 30 overlaps with the photosensitive area 101.

[0070] Among them, the photosensitive structure 30 includes an optical sensor, etc. Taking the photosensitive structure as an optical fingerprint sensor as an example, the optical fingerprint sensor can be one or more, and the embodiment of the present invention does not make a limit.

[0071] Exemplarily, taking the photosensitive structure 30 as an optical fingerprint sensor as an example, the photosensitive surface of the optical fingerprint sensor is the surface on the side close to the display panel 10, and is used to obtain the light passing through the photosensitive area 101. Specifically, when a finger touches the light-emitting side of the display panel 10, the light beam reflected by the finger surface can be received by the photosensitive structure 30 after passing through the photosensitive area 101, so as to determine the corresponding fingerprint image according to the light signal received by the photosensitive structure 30. Generally, the greater the light transmittance of the photosensitive area 101, the higher the light intensity that the photosensitive structure 30 can sense, which is more beneficial to improving the sensitivity of the photosensitive structure 30. In this way, by setting the photosensitive structure 30 to overlap with the photosensitive area 101 in the thickness direction Z of the display module, the light intensity sensed by the photosensitive structure 30 can be effectively increased, so that when the photosensitive structure 30 receives the light beam, it has a high photosensitive sensitivity.

[0072] It should be noted that the above is an exemplary description and explanation of the display module in the embodiment of the present invention. The other components of the display module are known to those skilled in the art and will not be described in detail here. Those skilled in the art can refer to the records of the prior art for understanding and application.

[0073] Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display module. Figure 13 It is a flowchart of a method for manufacturing a display module provided by an embodiment of the present invention. Combining Figure 1 and Figure 13 as shown, the manufacturing method includes:

[0074] S101. Prepare a display panel, and the display panel includes a photosensitive area.

[0075] S102. Prepare a grid-shaped heat conduction structure on the non-light-emitting side of the display panel, and the grid-shaped heat conduction structure covers at least part of the photosensitive area.

[0076] In an embodiment of the present invention, by preparing a display panel including a photosensitive area, the light in the display panel can be emitted from the photosensitive area, facilitating the external photosensitive structure to obtain the optical signal. Then, a grid-shaped heat conduction structure is prepared on the non-light-emitting side of the display panel, and the grid-shaped heat conduction structure covers at least part of the photosensitive area to block the influence of external light on the devices in the display panel through the photosensitive area, thereby reducing the difference in the emission brightness of different areas of the display panel, improving the uniformity of the display emission brightness, and ensuring that the display panel has high display quality.

[0077] It should be noted that the method for manufacturing the display module according to the embodiment of the present invention is known to those skilled in the art and will not be described in detail here. Those skilled in the art can refer to the records of the prior art for understanding and application.

[0078] Optionally, Figure 14 It is a flowchart of another method for manufacturing a display module provided by an embodiment of the present invention. As Figure 14 shown, on the basis of Figure 13 , preparing a grid-shaped heat conduction structure on the non-light-emitting side of the display panel includes: before the test stage of the display module, preparing a heat conduction structure on the non-light-emitting side of the display panel, and the heat conduction structure covers at least part of the photosensitive area; the heat conduction structure includes a layered light-shielding heat conduction structure and a grid-shaped heat conduction structure, the layered light-shielding heat conduction structure is located on the side of the grid-shaped heat conduction structure away from the display panel, and the layered light-shielding heat conduction structure covers the grid-shaped heat conduction structure; after the test stage of the display module, peeling off the layered light-shielding heat conduction structure to expose the grid-shaped heat conduction structure. Therefore, the manufacturing method includes:

[0079] S201. Prepare a display panel, and the display panel includes a photosensitive area.

[0080] S202. Before the test phase of the display module, a heat conduction structure is prepared on the non-light-emitting side of the display panel, and the heat conduction structure covers at least part of the photosensitive area; the heat conduction structure includes a layered light-shielding heat conduction structure and a grid-shaped heat conduction structure, the layered light-shielding heat conduction structure is located on the side of the grid-shaped heat conduction structure away from the display panel, and the layered light-shielding heat conduction structure covers the grid-shaped heat conduction structure.

[0081] Specifically, Figure 15 FIG. is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention before the test phase. Referring to Figure 14 and Figure 15 as shown, the heat conduction structure 50 includes a layered light-shielding heat conduction structure 40 and a grid-shaped heat conduction structure 20. The layered light-shielding heat conduction structure 40 is located on the side of the grid-shaped heat conduction structure 20 away from the display panel 10, and the layered light-shielding heat conduction structure 40 covers the grid-shaped heat conduction structure 20; after the test phase of the display module, the layered light-shielding heat conduction structure 40 is peeled off to expose the grid-shaped heat conduction structure 20.

[0082] Among them, the heat conduction material in the layered light-shielding heat conduction structure 40 may be the same as or different from the heat conduction material in the grid-shaped heat conduction structure 20, and the embodiments of the present invention do not limit this.

[0083] Optionally, the layered light-shielding heat conduction structure 40 includes an anisotropic heat conduction structure. The anisotropic heat conduction structure includes, but is not limited to, a heat conduction structure formed by extending graphite into a layered sheet shape. The embodiments of the present invention do not specifically limit this.

[0084] S203. After the test phase of the display module, peel off the layered light-shielding heat conduction structure to expose the grid-shaped heat conduction structure.

[0085] Optionally, continuing to refer to Figure 15 as shown, the layered light-shielding heat conduction structure 40 and the grid-shaped heat conduction structure 20 may be bonded by a first bonding layer 22, and the grid-shaped heat conduction structure 20 and the display panel 10 are bonded by a second bonding layer 23; the viscosity of the second bonding layer 23 is greater than the viscosity of the first bonding layer 22.

[0086] Specifically, before the test phase of the display module, a heat-conducting structure 50 covering at least part of the photosensitive area 101 is prepared on the non-light-emitting side of the display panel. The heat-conducting structure includes a grid-shaped heat-conducting structure 20 and a layered light-shielding and heat-conducting structure 40 located on the side of the grid-shaped heat-conducting structure 20 away from the display panel 10. When the module is tested, the test light source will not irradiate the devices (such as thin-film transistors) in the display panel 10 through the photosensitive area 101, thus not affecting the stability of the devices in the display panel 10. At the same time, since the heat-conducting structure 50 includes heat-conducting materials, it can quickly dissipate the high temperature of the display module during the test process, further ensuring the stability of the display module during operation. And after the test phase of the display module, the layered light-shielding and heat-conducting structure 40 is peeled off to expose the grid-shaped heat-conducting structure 20. At this time, the viscosity of the second adhesive layer 23 needs to be greater than that of the first adhesive layer 22 to ensure that the stability of the bonding of the first adhesive layer 22 is not affected when the layered light-shielding and heat-conducting structure 40 is peeled off. In addition, after the layered light-shielding and heat-conducting structure 40 is peeled off, part of the first adhesive layer 22 remains on the grid-shaped heat-conducting structure 20. At this time, by setting the first adhesive layer 22 and the second adhesive layer 23 as transparent optical adhesives, the light transmittance of the photosensitive area 101 can be prevented from being affected. In this way, the finally obtained display module has uniform display and emission brightness.

[0087] Based on the same inventive concept, an embodiment of the present invention further provides a display device. The display device includes the display module provided in any embodiment of the present invention. Therefore, the display device provided in the embodiment of the present invention includes the technical features of the display module provided in any embodiment of the present invention and can achieve the beneficial effects of the display module provided in any embodiment of the present invention. The same parts can refer to the description of the display module provided in the embodiment of the present invention above and will not be repeated here.

[0088] Exemplarily, Figure 16 is a schematic structural diagram of a display device provided in an embodiment of the present invention. As Figure 16 shown, the display device 200 includes a display module. The display module includes a display panel 10. The display panel 10 includes a photosensitive area 101. The display module further includes a grid-shaped heat-conducting structure 20 located on the non-light-emitting side of the display panel 10 and covering at least part of the photosensitive area 101, and a photosensitive structure 30 located on the side of the grid-shaped heat-conducting structure 20 away from the display panel 10. In the direction perpendicular to the plane of the display panel, the photosensitive structure 30 overlaps with the photosensitive area 101. The display device 200 can be any electronic product with a display function, including but not limited to the following categories: televisions, laptop computers, desktop monitors, tablet computers, digital cameras, mobile phones, smart bracelets, smart glasses, in-vehicle displays, medical devices, industrial control devices, touch interaction terminals, etc.

[0089] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub - combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A display module, characterized in that, It includes a display panel, and the display panel includes a photosensitive area; The display module further includes a grid-shaped heat conduction structure located on the non-light-emitting side of the display panel and covering at least part of the photosensitive area; The display panel further includes a support structure located on the non-light-emitting side of the display panel. A via hole is provided in the support structure. The via hole penetrates the support structure along the thickness direction of the display module, and the via hole overlaps at least part of the photosensitive area; Wherein, the support structure includes a metal support layer; the grid-shaped heat conduction structure includes grid lines; both the metal support layer and the grid lines have a light-shielding effect, and the reflectivity α1 of the grid lines and the reflectivity α2 of the metal support layer satisfy |α1 - α2| / α1 ≤ 30%; 2. The display module according to claim 1, wherein The grid-shaped heat conduction structure includes grid lines; The display panel further includes a driving circuit and a light-emitting element, and the driving circuit is used to drive the light-emitting element to emit light; The driving circuit includes a thin-film transistor. Along the thickness direction of the display module, the grid lines overlap with the thin-film transistor.

3. The display module according to claim 2, wherein The thin-film transistor includes an active layer and a gate; Along the thickness direction of the display module, the grid lines overlap with the active layer and / or the gate.

4. The display module according to claim 1, characterized in that, At least part of the grid-shaped heat conduction structure is disposed in the via hole, or the grid-shaped heat conduction structure is disposed on the side of the support structure away from the display panel.

5. The display module according to claim 1, wherein The display module further includes a first adhesive layer located on the side of the grid-shaped heat conduction structure away from the display panel, and the first adhesive layer covers part of the grid-shaped heat conduction structure.

6. The display module according to claim 5, wherein The display module further includes a second adhesive layer located on the side of the grid-shaped heat conduction structure close to the display panel, and the grid-shaped heat conduction structure is bonded to the display panel through the second adhesive layer; The viscosity of the second adhesive layer is greater than that of the first adhesive layer.

7. The display module according to claim 1, wherein, The grid-shaped heat conduction structure includes an anisotropic heat conduction structure.

8. The display module according to claim 1, wherein The display module further includes a photosensitive structure; The photosensitive structure is located on the side of the grid-shaped heat conduction structure away from the display panel, and along the thickness direction of the display module, the photosensitive structure overlaps with the photosensitive area.

9. A method for manufacturing a display module, which is used to manufacture the display module according to any one of claims 1-8, characterized in that, The manufacturing method includes: Manufacturing a display panel, and the display panel includes a photosensitive area; Manufacturing a grid-shaped heat conduction structure on the non-light-emitting side of the display panel, and the grid-shaped heat conduction structure covers at least part of the photosensitive area.

10. The manufacturing method of the display module according to claim 9, wherein, Manufacturing a grid-shaped heat conduction structure on the non-light-emitting side of the display panel includes: Before the test stage of the display module, manufacturing a heat conduction structure on the non-light-emitting side of the display panel, and the heat conduction structure covers at least part of the photosensitive area; the heat conduction structure includes a layered light-shielding heat conduction structure and the grid-shaped heat conduction structure, the layered light-shielding heat conduction structure is located on the side of the grid-shaped heat conduction structure away from the display panel, and the layered light-shielding heat conduction structure covers the grid-shaped heat conduction structure; After the test stage of the display module, peeling off the layered light-shielding heat conduction structure to expose the grid-shaped heat conduction structure.

11. The manufacturing method of the display module according to claim 10, characterized in that, The layered light-shielding and heat-conducting structure is bonded to the grid-shaped heat-conducting structure through a first bonding layer, and the grid-shaped heat-conducting structure is bonded to the display panel through a second bonding layer; The viscosity of the second bonding layer is greater than that of the first bonding layer.

12. The manufacturing method of the display module according to claim 10, wherein The layered light-shielding and heat-conducting structure includes an anisotropic heat-conducting structure.

13. A display device, characterized in that, A display module according to any one of claims 1-8 is included.

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