Low density parity check (LDPC) decoder, decoding method and related device

Abstract

Embodiments of the present application provide an LDPC decoder, a decoding method and related equipment. The decoder comprises an optical chip and an electrical chip. The electrical chip is configured to receive a bit sequence transmitted by a channel, determine first probability information according to the bit sequence, and transmit the first probability information to the optical chip through an electrical signal. The optical chip is configured to perform multiplication operation on the first probability information to obtain a first multiplication result. The electrical chip is further configured to update a check node according to the first multiplication result to obtain second probability information, and transmit the second probability information to the optical chip through an electrical signal. The optical chip is further configured to perform multiplication operation on the second probability information to obtain a second multiplication result. The electrical chip is further configured to update a variable node according to the second multiplication result to obtain third probability information, and determine a decoding value of the bit sequence according to the third probability information. According to the embodiments of the present application, the decoding rate can be improved and the power consumption can be reduced in the decoding process.

Description

Technical Field

[0001] This application relates to the field of information processing, and in particular to an LDPC decoder, decoding method, and related equipment. Background Technology

[0002] With the development of communication technology, communication systems are evolving towards larger capacity, higher efficiency, and higher throughput. However, information may be affected by channel noise during transmission, reducing its reliability. Efficiency and reliability are contradictory attributes; for example, to achieve high-efficiency information transmission, the time spent per unit of time needs to be shortened. Therefore, the energy of the information may decrease, making it less resistant to interference during transmission, more prone to errors, and ultimately reducing reliability.

[0003] Channel coding ensures the reliability of information transmission. Low-density parity-check (LDPC) codes, currently the channel coding method with performance closest to the Shannon limit, are playing a crucial role. LDPC codes, proposed by Gallager, are linear block codes with a sparse parity-check matrix, meaning that only a small number of elements in the matrix are "1", while the majority are "0". Utilizing the sparsity of the parity-check matrix, the decoding complexity is linearly related only to the code length, preventing excessive complexity even with long code lengths. Many LDPC decoding algorithms exist; because the belief propagation (BP) algorithm's performance approaches the Shannon limit, it is commonly used for decoding.

[0004] However, the backpropagation (BP) algorithm for LDPC decoding involves a large number of multiplication operations. Currently, the chips used for the BP algorithm in LDPC decoding mainly fall into three categories: Graphical Processing Units (GPUs), Field Programmable Gate Arrays (FPGAs), and Application-Specific Integrated Circuits (ASICs), all based on traditional electronic chip technology. As Moore's Law slows down, traditional electronic chip technology faces problems such as high power consumption and slow speed, which may lead to reduced decoding reliability. Summary of the Invention

[0005] This application discloses a low-density parity-check (LDPC) decoder, decoding method, and related equipment, which can improve the decoding rate and reduce power consumption during the decoding process.

[0006] The first aspect of this application provides a low-density parity-check (LDPC) decoder, which includes an optical chip and an electrical chip connected together. The electrical chip is configured to: receive a bit sequence transmitted through a channel, the bit sequence being encoded according to an LDPC code; determine first probability information based on the bit sequence, and transmit the first probability information to the optical chip via an electrical signal; the optical chip is configured to: convert the first probability information of the electrical signal into first probability information of the optical signal; perform a multiplication operation on the first probability information of the optical signal to obtain a first multiplication result; the electrical chip is further configured to update the check node based on the first multiplication result to obtain second probability information, and transmit the second probability information to the optical chip via an electrical signal; the optical chip is further configured to: convert the second probability information of the electrical signal into second probability information of the optical signal; perform a multiplication operation on the second probability information of the optical signal to obtain a second multiplication result; the electrical chip is further configured to: update the variable node based on the second multiplication result to obtain third probability information; and determine the decoded value of the bit sequence based on the third probability information.

[0007] As can be seen, a large number of multiplication operations (which may be consecutive multiplications) may occur during LDPC decoding (such as the process of updating the check node and the process of updating the variable node). In the embodiments of this application, the optical chip handles the multiplication operations during the decoding process, while the electrical chip controls the optical chip by transmitting information to the optical chip through electrical signals, so that the optical chip can obtain the corresponding multiplication result. The optical chip then converts the obtained multiplication result into an electrical signal and transmits it to the electrical chip, which then performs the other operations in the decoding process except for the multiplication operation. Since the optical chip requires a short clock cycle and is fast to perform multiplication operations, completing LDPC decoding through the interaction between the optical chip and the electrical chip can improve decoding efficiency and reduce power consumption.

[0008] According to the first aspect, in one possible implementation, the electrical chip is further configured to: multiply the first probability information by a first preset coefficient and transmit the first probability information after multiplication to the optical chip via an electrical signal; multiply the second probability information by a second preset coefficient and transmit the second probability information after multiplication to the optical chip via an electrical signal.

[0009] Optionally, the electronic chip is specifically used to: divide the first multiplication result by a first preset coefficient, and update the verification node according to the first multiplication result after the division operation to obtain second probability information; divide the second multiplication result by a second preset coefficient, and update the variable node according to the second multiplication result after the division operation to obtain third probability information.

[0010] Optionally, the optical chip is specifically used to: convert the optical signal resulting from the first multiplication of the optical signal into the first multiplication result of the electrical signal through a receiver, and transmit the first multiplication result of the electrical signal to the electrical chip; and convert the second multiplication result of the optical signal into the first multiplication result of the electrical signal through a receiver, and transmit the first multiplication result of the electrical signal to the electrical chip.

[0011] As can be seen, to avoid the first and second probability information being too small and affecting the computational accuracy of the optical chip, the first and second probability information can be multiplied by preset coefficients before being transmitted to the optical chip. This improves the computational accuracy of the optical chip. Furthermore, multiplying by preset coefficients prevents the receiver from failing to receive the first and second multiplication results due to their small values ​​after multiplication on the optical chip, thus preventing the receiver from transmitting the results to the electrical chip. To ensure consistency in the calculation results, after the optical chip performs multiplication on the information multiplied by the preset coefficients, the electrical chip divides the final multiplication result by the corresponding coefficient and performs the appropriate operation based on the result of the division.

[0012] According to the first aspect, in one possible implementation, the optical chip is specifically used to: generate a first input optical signal through a light source; and adjust the first input optical signal according to the first probability information of the electrical signal through an optical multiplier to determine the first probability information of the optical signal.

[0013] Optionally, the optical chip is specifically used to: determine the first refractive index of the optical multiplier based on the first probability information of the electrical signal; and adjust the first input optical signal based on the first refractive index to determine the first probability information of the optical signal.

[0014] It can be seen that the electrical chip transmits the first probability information to the optical chip through electrical signals. It can be considered that the electrical chip controls the optical chip, so that the optical chip converts the first probability information of the electrical signal into the first probability information of the optical signal. Thus, multiplication can be performed on the optical chip to obtain the first multiplication result. The clock cycle required to process the multiplication operation through the optical chip is short and fast. Therefore, using the optical chip to complete the multiplication operation in the LDPC decoding process can improve the decoding efficiency and reduce power consumption.

[0015] According to the first aspect, in one possible implementation, the optical chip is specifically used to: generate a second input optical signal through a light source; and adjust the second input optical signal according to the second probability information of the electrical signal through an optical multiplier to determine the second probability information of the optical signal.

[0016] Optionally, the optical chip is specifically used to: determine the second refractive index of the optical multiplier based on the second probability information of the electrical signal; and adjust the second input optical signal based on the second refractive index to determine the second probability information of the optical signal.

[0017] It can be seen that the electrical chip transmits the second probability information to the optical chip through electrical signals. It can be considered that the electrical chip controls the optical chip, so that the optical chip converts the second probability information of the electrical signal into the second probability information of the optical signal. Thus, multiplication operations can be performed on the optical chip to obtain the second multiplication result. The clock cycle required to process the multiplication operation through the optical chip is short and fast. Therefore, using the optical chip to complete the multiplication operation in the LDPC decoding process can improve the decoding efficiency and reduce power consumption.

[0018] According to the first aspect, in one possible implementation, the optical multiplier includes one or more of the following: a Mach-Zehnder interferometer, a directional coupler, and a microring.

[0019] As can be seen, there are one or more optical multipliers, so there can also be one or more devices to perform multiplication operations. Different optical multipliers can be selected to perform multiplication operations for different situations.

[0020] Secondly, embodiments of this application provide a low-density parity-check (LDPC) decoding method. The method is applied to an LDPC decoder, which includes an optical chip and an electrical chip connected together. The method includes: receiving a bit sequence transmitted through a channel via the electrical chip, the bit sequence being encoded according to a low-density parity-check (LDPC) code; determining first probability information based on the bit sequence via the electrical chip, and transmitting the first probability information to the optical chip via an electrical signal; converting the first probability information of the electrical signal into first probability information of the optical signal via the optical chip; performing a multiplication operation on the first probability information of the optical signal via the optical chip to obtain a first multiplication result; updating the check node based on the first multiplication result via the electrical chip to obtain second probability information, and transmitting the second probability information to the optical chip via an electrical signal; converting the second probability information of the electrical signal into second probability information of the optical signal via the optical chip; performing a multiplication operation on the second probability information of the optical signal via the optical chip to obtain a second multiplication result; updating the variable node based on the second multiplication result via the electrical chip to obtain third probability information; and determining the bit sequence decoding value via the electrical chip based on the third probability information.

[0021] According to the second aspect, in one possible implementation, the first probability information is determined by the electrical chip based on the bit sequence, and the first probability information is transmitted to the optical chip via an electrical signal, including: after determining the first probability information by the electrical chip based on the bit sequence, multiplying the first probability information by a first preset coefficient, and transmitting the first probability information after the multiplication operation to the optical chip via an electrical signal.

[0022] According to the second aspect, in one possible implementation, the second probability information is obtained by updating the verification node based on the first multiplication result using an electrical chip, and the second probability information is transmitted to the optical chip via an electrical signal. This includes: dividing the first multiplication result by a first preset coefficient using an electrical chip, updating the verification node based on the first multiplication result after the division operation to obtain the second probability information, and transmitting the second probability information to the optical chip via an electrical signal.

[0023] According to the second aspect, in one possible implementation, the method is characterized in that the second probability information is obtained by updating the verification node with the electrical chip based on the first multiplication result, and the second probability information is transmitted to the optical chip via an electrical signal, comprising: after obtaining the second probability information by updating the verification node with the electrical chip based on the first multiplication result, multiplying the second probability information by a second preset coefficient, and transmitting the second probability information after the multiplication operation to the optical chip via an electrical signal.

[0024] According to the second aspect, in one possible implementation, the third probability information is obtained by updating the verification node based on the second multiplication result using an electronic chip, including: dividing the second multiplication result by a second preset coefficient using an electronic chip, and updating the variable node based on the second multiplication result after the division operation to obtain the third probability information.

[0025] According to the second aspect, in one possible implementation, the optical chip includes a light source and an optical multiplier. The optical chip converts the first probability information of an electrical signal into the first probability information of an optical signal, including: generating a first input optical signal through the light source; and adjusting the first input optical signal according to the first probability information of the electrical signal through the optical multiplier to determine the first probability information of the optical signal.

[0026] According to the second aspect, in one possible implementation, determining the first probability information of the optical signal by adjusting the first input optical signal based on the first probability information of the electrical signal using an optical multiplier includes: determining the first refractive index of the optical multiplier based on the first probability information of the electrical signal; and adjusting the first input optical signal based on the first refractive index to determine the first probability information of the optical signal.

[0027] According to the second aspect, in one possible implementation, the optical chip includes a light source and an optical multiplier. The optical chip converts the second probability information of an electrical signal into the second probability information of an optical signal, including: generating a second input optical signal through the light source; and adjusting the second input optical signal according to the second probability information of the electrical signal through the optical multiplier to determine the second probability information of the optical signal.

[0028] According to the second aspect, in one possible implementation, the second probability information of the optical signal is determined by adjusting the second input optical signal according to the second probability information of the electrical signal using an optical multiplier, including: determining the second refractive index of the optical multiplier according to the second probability information of the electrical signal; and adjusting the second input optical signal according to the second refractive index to determine the second probability information of the optical signal.

[0029] According to the second aspect, in one possible implementation, the optical multiplier includes one or more of the following: a Mach-Zehnder interferometer, a directional coupler, and a microring.

[0030] Thirdly, embodiments of this application provide an electronic device, the device comprising: a decoder as described in any of the first aspects above, and discrete components coupled to the decoder.

[0031] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the LDPC decoding method flow of any one of the second aspects described above.

[0032] The solutions provided in the second to fourth aspects above are used to implement or cooperate with the implementation of the decoder provided in the first aspect above, and therefore can achieve the same or corresponding beneficial effects as the first aspect, which will not be elaborated here.

[0033] In summary, the solution provided in this application can improve the decoding rate and reduce power consumption during the decoding process. Attached Figure Description

[0034] The accompanying drawings used in the embodiments of this application are described below.

[0035] Figure 1 This is a schematic diagram of the architecture of a communication system provided in an embodiment of this application;

[0036] Figure 2 This is a schematic diagram of the functional modules of a communication system provided in an embodiment of this application;

[0037] Figure 3A This is a flowchart illustrating a BP algorithm for LDPC decoding provided in an embodiment of this application;

[0038] Figure 3B This is a schematic diagram of a Tanner diagram provided in an embodiment of this application;

[0039] Figure 4 This is a schematic diagram of the structure of an LDPC decoder provided in an embodiment of this application;

[0040] Figure 5This is a schematic diagram of the structure of an LDPC decoder with a cascaded directional coupler provided in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of the structure of an LDPC decoder for a cascaded Mach-Zehnder interferometer provided in an embodiment of this application;

[0042] Figure 7 This is a schematic diagram of the structure of a cascaded micro-ring LDPC decoder provided in an embodiment of this application;

[0043] Figure 8 This is a schematic diagram of the structure of an LDPC decoder for a hybrid multiplier provided in an embodiment of this application;

[0044] Figure 9 This is a schematic diagram of another LDPC decoder provided in an embodiment of this application;

[0045] Figure 10 This is a flowchart illustrating an LDPC decoding method provided in an embodiment of this application. Detailed Implementation

[0046] The embodiments of this application are described below with reference to the accompanying drawings.

[0047] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0048] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0049] First, some of the terms used in this application will be explained to facilitate understanding by those skilled in the art.

[0050] 1. Shannon Limited

[0051] The Shannon limit or Shannon capacity of a communication channel is the theoretical maximum information transmission rate for a channel with a specific noise level. The well-known Shannon theorem gives the formula: C = Blog2(1 + S / N), where C is the achievable link speed (channel capacity), B is the link bandwidth, S is the average signal power, N is the average noise power, and the signal-to-noise ratio (S / N) is usually expressed in decibels (dB), where decibels = 10lg(S / N). The Shannon limit is its limiting value.

[0052] In 1984, Shannon published "A Mathematical Theory of Communication," proving that channel coding can guarantee the reliability of information transmission.

[0053] 2. Channel coding

[0054] The purpose of channel coding is to improve the transmission quality of digital communication systems. Due to noise and interference in real-world channels, there are differences between the transmitted bit sequence and the received bit sequence after transmission through the channel; these differences are called errors. The greater the channel noise and interference, the greater the probability of bit sequence errors. Channel coding can process the bit sequence accordingly, giving the system a certain degree of error correction and interference resistance, which can greatly reduce the occurrence of bit errors during transmission, thereby improving data transmission efficiency and reducing the bit error rate.

[0055] Channel coding involves adding redundant bits to the transmitted bit sequence according to certain rules in order to correct errors that may occur during transmission and to recover the original bit sequence with the lowest possible error probability.

[0056] 3. Channel Decoding

[0057] Channel decoding is the process of recovering and correcting errors from received symbolic messages (such as bit sequences). The fundamental requirement of any decoding rule is to minimize the errors in the decision result obtained by the receiver. Decoding rules can include the minimum error probability criterion and the maximum likelihood decoding criterion.

[0058] 4. Low-density parity-check (LDPC) codes

[0059] LDPC codes are block error-correcting codes with sparse parity-check matrices proposed by Robert Gallager of MIT in his 1963 doctoral dissertation. Applicable to almost all channels, they have become a hot research topic in the coding community in recent years. Their performance approaches the Shannon limit, and they are simple to describe and implement, easy to theoretically analyze and study, simple to decode, and can be parallelized, making them suitable for hardware implementation.

[0060] LDPC codes are essentially linear block codes, and their parity-check matrix H is a sparse matrix, meaning that the number of non-zero elements in the matrix is ​​much smaller than the number of zero elements. It is this sparsity of the parity-check matrix that ensures that the decoding complexity and minimum code distance both increase linearly with the code length.

[0061] The encoded bit sequence satisfies H*c T =0. After transmission through the channel, the bit sequence c is susceptible to noise and other interference, which can easily lead to bit errors. Therefore, the received information is c'. Then, H*c' T =0 will no longer hold true. We need to decode to find and correct any errors in c'. This continues until H*c' is satisfied. T =0 or the maximum number of checks has been reached.

[0062] 5. Decoding Algorithm for LDPC Codes

[0063] LDPC code decoding algorithms fall into three main categories: hard-decision decoding, soft-decision decoding, and hybrid decoding.

[0064] Hard-decision decoding first demodulates the received real-number sequence using a demodulator, then performs hard-decision operations to obtain a hard-decision 0,1 sequence, and finally sends the resulting hard-decision sequence to a hard-decision decoder for decoding. While this method has very low computational complexity, the hard-decision operation loses a significant portion of the channel information, resulting in very low channel information utilization. Hard-decision decoding has the lowest channel information utilization and decoding complexity among the three major decoding methods. Common hard-decision decoding algorithms include bit-flipping (BF) and one-step majority-logic (OSMLG) decoding algorithms.

[0065] Soft-decision decoding can be viewed as infinite-bit quantization decoding. It fully utilizes the received channel information (soft information), greatly improving channel information utilization. Soft-decision decoding utilizes not only the symbols but also the amplitude values ​​of the channel information. This full utilization of channel information significantly improves decoding performance, allowing iterative decoding to fully exploit the received channel information and ultimately achieve excellent error rate performance. Soft-decision decoding has the highest channel information utilization and decoding complexity among the three major types of decoding. The most commonly used soft-decision decoding algorithm is the belief propagation (BP) algorithm, also known as the sum-product (SP) decoding algorithm.

[0066] Hybrid decoding combines the features of soft-decision and hard-decision decoding. It is a type of reliability-based decoding algorithm that, based on hard-decision decoding, uses partial channel information to calculate reliability. Commonly used hybrid decoding algorithms include weighted bit-flip (WBF) and weighted OSMLG (WMLG) decoding algorithms.

[0067] 6. Belief Propagation (BP) Algorithm

[0068] The Backpropagation (BP) algorithm, also known as the SP algorithm, is a general message passing algorithm that describes the information calculation formulas at variable nodes and check nodes. The BP algorithm is an iterative decoding algorithm based on Tanner graphs. During the iteration process, reliability information, i.e., the "message," is passed back and forth between variable nodes and check nodes through the edges of the Tanner graph. After multiple iterations, it tends to a stable value, and then the optimal decision is made based on this value. The logarithmic domain BP algorithm uses the log-likelihood ratio for message passing, reducing the multiplication operations in the decoding algorithm. While the logarithmic domain BP algorithm reduces multiplication operations, it introduces a complex hyperbolic sine function, increasing computational complexity. The minimum sum algorithm is used to further simplify the logarithmic domain BP algorithm by replacing the hyperbolic sine function with a minimum value. This simplifies the algorithm, but the performance of the simplified algorithm is somewhat reduced.

[0069] 7. Tanner diagram

[0070] In 1981, Tanner proposed the concept of using a graph model to describe codewords, thus mapping the parity-check matrix of LDPC codes to a bipartite graph known as the Tanner graph. LDPC codes constructed using the Tanner graph can significantly reduce decoding complexity through parallel decoding.

[0071] Tanner graphs are bidirectional graphs used to represent LDPC codes. A Tanner graph contains two types of vertices: n codeword bit nodes (also called bit nodes), corresponding to the columns of the parity-check matrix; and m parity-check equation vertices (also called parity nodes), corresponding to the rows of the parity-check matrix. A Tanner graph can represent the parity-check matrix of an LDPC code, where each row represents a parity-check equation and each column represents a codeword bit. Elements of 1 in the parity-check matrix indicate the existence of an edge connecting a bit node and a parity node in the Tanner graph. This edge is called an adjacent edge between the two nodes, and the nodes at both ends of an adjacent edge are called adjacent nodes. The number of adjacent edges for each node is called its degree.

[0072] Please see Figure 1 , Figure 1 This is a schematic diagram of the architecture of a communication system provided in an embodiment of this application. Figure 1 It can be seen that the communication system may include at least one network device 101, which communicates with one or more terminal devices (e.g., Figure 1 The terminal devices 102 and 103 shown communicate with each other. The network device 101 can be a base station, a device integrating a base station and a base station controller, or other devices with similar communication functions.

[0073] The terminal device in this application embodiment is a device with communication function, which can be a user equipment, access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication device, user agent, or user device. The terminal device can also be a cellular phone, cordless phone, session initiation protocol (SIP) phone, wireless local loop (WLL) station, personal digital assistant (PDA), handheld device with wireless communication function, computing device or other processing device connected to a wireless modem, vehicle-mounted device, wearable device, terminal device in future 5G networks, or terminal device in future evolved public land mobile network (PLMN), etc., and this application embodiment does not limit it to these categories.

[0074] By way of example and not limitation, in this embodiment, the terminal device can also be a wearable device. Wearable devices, also known as wearable smart devices, are a general term for devices that utilize wearable technology to intelligently design and develop everyday wearables, such as glasses, gloves, watches, clothing, and shoes. Wearable devices are portable devices that are worn directly on the body or integrated into the user's clothing or accessories. Wearable devices are not merely hardware devices, but also achieve powerful functions through software support, data interaction, and cloud interaction. Broadly speaking, wearable smart devices include those that are feature-rich, large in size, and can achieve complete or partial functions without relying on a smartphone, such as smartwatches or smart glasses, as well as those that focus on a specific type of application function and require the use of other devices such as smartphones, such as various smart bracelets and smart jewelry for vital sign monitoring.

[0075] Furthermore, in this embodiment, the terminal device can also be a terminal device in an Internet of Things (IoT) system. IoT is an important component of future information technology development, and its main technical feature is connecting objects to networks through communication technologies, thereby realizing an intelligent network of human-machine interconnection and machine-to-machine interconnection. In this embodiment, IoT technology can achieve massive connectivity, deep coverage, and low terminal power consumption through technologies such as narrowband (NB).

[0076] In addition, in this embodiment, the terminal device may also include sensors such as smart printers, train detectors, and gas stations. Its main functions include collecting data (for some terminal devices), receiving control information and downlink data from network devices, and sending electromagnetic waves to transmit uplink data to network devices.

[0077] The network device in this application embodiment can be a device for communicating with terminal devices. The network device can be a base station (BTS) in a global system for mobile communications (GSM) or code division multiple access (CDMA) system, a base station (NodeB, NB) in a wideband code division multiple access (WCDMA) system, an evolved base station (eNB or eNodeB) in an LTE system, a radio controller in a cloud radio access network (CRAN) scenario, or a relay station, access point, vehicle-mounted device, wearable device, or a network device in a future 5G network or a network device in a future evolved PLMN network, etc. The embodiments of this application are not limited.

[0078] The network device in this application embodiment can be a device in a wireless network, such as a radio access network (RAN) node that connects a terminal to the wireless network. Examples of RAN nodes include: base stations, next-generation base stations (gNBs), transmission reception points (TRPs), evolved Node Bs (eNBs), home base stations, baseband units (BBUs), or access points (APs) in a WiFi system. In a network architecture, the network device may include a centralized unit (CU) node, a distributed unit (DU) node, or a RAN device comprising both CU and DU nodes.

[0079] In this embodiment, the terminal device or network device includes a hardware layer, an operating system layer running on top of the hardware layer, and an application layer running on top of the operating system layer. The hardware layer includes hardware such as a central processing unit (CPU), a memory management unit (MMU), and memory (also called main memory). The operating system can be any one or more computer operating systems that implement business processing through processes, such as Linux, Unix, Android, iOS, or Windows. The application layer includes applications such as browsers, address books, word processing software, and instant messaging software. Furthermore, this embodiment does not specifically limit the specific structure of the execution entity of the method provided in this embodiment, as long as it can communicate according to the method provided in this embodiment by running a program that records the code of the method provided in this embodiment. For example, the execution entity of the method provided in this embodiment can be a terminal device or a network device, or a functional module in the terminal device or network device that can call and execute a program.

[0080] Furthermore, various aspects or features of this application can be implemented as methods, apparatus, or articles of manufacture using standard programming and / or engineering techniques. The term "article of manufacture" as used herein encompasses a computer program accessible from any computer-readable device, carrier, or medium. For example, computer-readable media may include, but are not limited to: magnetic storage devices (e.g., hard disks, floppy disks, or magnetic tapes), optical discs (e.g., compact discs (CDs), digital versatile discs (DVDs), etc.), smart cards, and flash memory devices (e.g., erasable programmable read-only memory (EPROMs), cards, sticks, or key drives, etc.). Additionally, the various storage media described herein may represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media capable of storing, containing, and / or carrying instructions and / or data.

[0081] The technical solutions of this application embodiment can be applied to various communication systems, such as: Global System for Mobile Communication (GSM) system, Code Division Multiple Access (CDMA) system, Wideband Code Division Multiple Access (WCDMA) system, General Packet Radio Service (GPRS), Long Term Evolution (LTE) system, LTE Frequency Division Duplex (FDD) system, LTE Time Division Duplex (TDD) system, Universal Mobile Telecommunications System (UMTS) system, Enhanced Data Rate for GSM Evolution (EDGE) system, and Worldwide Interoperability for Microwave Access (WiMAX) system. The technical solutions of this application can also be applied to other communication systems, such as public land mobile network (PLMN) systems, 5th generation (5G) systems, or communication systems after 5G, or new radio (NR), etc. The 5G mobile communication system described in this application includes non-standalone (NSA) 5G mobile communication systems and / or standalone (SA) 5G mobile communication systems. The technical solutions provided in this application can also be applied to future communication systems, such as 6th generation mobile communication systems. The communication system can also be a PLMN network, a device-to-device (D2D) network, a machine-to-machine (M2M) network, an IoT network, or other networks.

[0082] It should be noted that when a network device transmits a signal, it acts as the encoding end; when it receives a signal, it acts as the decoding end. The same applies to terminal devices: when a terminal device transmits a signal, it acts as the encoding end; when it receives a signal, it acts as the decoding end. Furthermore, the encoding end is the transmitter of information and / or data, and the decoding end is the receiver of information and / or data. The decoding end may include an LDPC decoder, which performs channel decoding.

[0083] Please see Figure 2 , Figure 2 This is a schematic diagram of the functional modules of a communication system provided in an embodiment of this application. From Figure 2 It can be seen that the communication system 200 may include one or more of the following functional modules: source 201, source encoder 202, channel encoder 203, modulator 204, channel 205, demodulator 206, channel decoder 207, source decoder 208, and sink 209. Among these, source 201, source encoder 202, channel encoder 203, and modulator 204 belong to the transmitting end; channel 205 belongs to the transmission channel; and demodulator 206, channel decoder 207, source decoder 208, and sink 209 belong to the receiving end.

[0084] Source 201 is the source of information or information sequence. It can refer to any sender, including users and electronic devices. They can generate electrical signals such as sound, data, text, images, and codes.

[0085] The main function of the source encoder 202 is to convert analog signals such as user voice and electronic devices such as text, charts, and images into digital signals, a process known as analog-to-digital (A / D) conversion. The source and source encoder can be housed in the same physical unit or installed separately.

[0086] The channel encoder 203 is used to send the wideband digital signal into the transmission channel after multiplexing multiplexed digital signals into a wideband digital signal. Based on the characteristics of various transmission channels and the requirements for the transmitted digital signal (such as error correction capability and reduction of bit errors), redundant information is added to the information to be transmitted to correct errors that may occur during transmission and to recover the original information with the lowest possible error probability. Specifically, the channel encoder 203 can be an LDPC encoder. LDPC codes have performance close to the Shannon limit and are simple to describe and implement, so LDPC codes can be used for channel coding to obtain the corresponding coded codewords. In this application, the coded codewords are sometimes referred to as a bit sequence or information sequence.

[0087] Modulator 204 is used to transform the encoded digital signal into a signal suitable for transmission over a communication channel according to channel characteristics. The modulation process involves regularly changing the amplitude, frequency, phase, or combinations thereof of a high-frequency sinusoidal oscillation (called the carrier wave) in accordance with the digital pulses to be transmitted. For example, it transforms binary pulses into waveforms suitable for transmission over a communication channel. Common modulation methods may include one or more of the following: Frequency-shift keying (FSK), Phase-shift keying (PSK), Amplitude-shift keying (ASK), etc.

[0088] Channel 205 refers to the channel for transmitting signals. Based on signal characteristics, channels can be categorized as analog or digital channels; based on the transmission medium, they can be divided into wired channels (open wire, cable, fiber optic channels, etc.) and wireless channels (shortwave ionospheric, scattering channels, microwave line-of-sight channels, and satellite long-range free-space constant-parameter channels). Among these channels, open wire and cable can be used to transmit low-rate digital baseband signals, while other channels require digital modulation. Digital signals that are only channel-coded without modulation can be transmitted via open wire or cable; this unmodulated digital signal is called a digital baseband signal, and the communication method of directly transmitting the digital baseband signal into the channel is called baseband transmission. Modulated digital signals are called digital frequency band signals, and the communication method of transmitting the modulated digital frequency band signal into the channel is called digital frequency band transmission.

[0089] Interference can be any factor that causes signal distortion during transmission. Generally, interference can be divided into additive interference and multiplicative interference. Additive interference is unwanted electromagnetic signals generated by various other sources and superimposed on the useful signal. It mainly includes random noise, impulse interference, and sinusoidal interference. Random noise mainly includes thermal noise, cosmic noise, and internal noise of electronic devices, etc. Multiplicative interference is signal distortion caused by various imperfections in channel characteristics. These distortions cannot be simply viewed as superimposed on the signal, but rather as multiplying the signal by certain distortion factors. The main factors causing multiplicative interference are channel-induced attenuation, amplitude and phase distortion, frequency drift and phase jitter, and nonlinear distortion. It is understandable that these interferences are distributed throughout various stages of the channel.

[0090] Demodulator 206 is used to recover the original wideband digital signal from the digital frequency band signal. Demodulation is the reverse process of modulation. There are several ways to demodulate a modulated waveform to recover the original digital signal. The specific method chosen depends on the required demodulation accuracy and the permissible equipment complexity.

[0091] The channel decoder 207 is used to detect or correct errors. It is understandable that interference and noise during signal transmission can cause bit errors in the received signal. Decoding and error correction are necessary to recover the original signal. While the channel encoder 203 uses LDPC codes for channel encoding, the channel decoder 207 can specifically be an LDPC decoder, also using the BP algorithm for LDPC codes for channel decoding.

[0092] The LDPC decoder includes an optical chip and an electrical chip. The electrical chip receives the bit sequence transmitted from the channel, determines first probability information based on the bit sequence, and transmits this first probability information of the electrical signal to the optical chip. This first probability information is the information passed from the variable node to the check node. After receiving the first probability information, the optical chip converts the first probability information of the electrical signal into the first probability information of the optical signal, performs a multiplication operation to obtain a first multiplication result, and transmits this first multiplication result back to the electrical chip. After receiving the first multiplication result, the electrical chip updates the check node based on the first multiplication result to obtain second probability information, and transmits this second probability information of the electrical signal to the optical chip. This second probability information is the information passed from the check node to the variable node. After receiving the second probability information, the optical chip converts the second probability information of the electrical signal into the second probability information of the optical signal, performs a multiplication operation to obtain a second multiplication result, and loads this second multiplication result back into the electrical chip. After receiving the second multiplication result, the electronic chip updates the variable nodes according to the second multiplication result to obtain the third probability information, and then determines the decoding result of the above bit sequence according to the third probability information.

[0093] The source decoder 208 is used to restore the digital signal to an information form acceptable to the receiver. The source decoding at the receiver is the reverse process of the source encoding at the transmitter, i.e., D / A conversion.

[0094] The sink 209 is the receiver of information or information sequence, and like the source 201, it can be a user or an electronic device. The source 201 and the sink 209 can be separate devices or a composite device that can also perform two-way communication with a telephone.

[0095] It is understandable that the functional modules of the transmitting end can be located in the encoding end device, and the functional modules of the receiving end can be located in the decoding end device. For example, the channel encoder 203 can be... Figure 1 The network device 101 shown, or the chip configured in the network device 101, the channel decoder 207 can be Figure 1 The terminal device 102 shown may be a chip configured in the terminal device 102; alternatively, the functional module of the transmitting end may be... Figure 1The terminal device 102 shown, or the chip configured in the terminal device 102, may have a receiving end functional module located in... Figure 1 The network device 101 shown or the chip configured in the network device 101.

[0096] Please see Figure 3A , Figure 3A This is a flowchart illustrating a BP algorithm for LDPC decoding provided in an embodiment of this application. From Figure 3A As can be seen, before the decoding iteration, the LDPC decoder receives the posterior probability soft information. This posterior probability soft information can be sent by the demodulator, i.e., the information transmitted in the channel, specifically a bit sequence of length N. The LDPC decoder can then use this bit sequence as the information from the 0th variable node to the check node, or it can determine the information from the 0th variable node to the check node based on the bit sequence. The message from the 0th variable node to the check node can be understood as the initial channel information.

[0097] During the iteration process, based on the Tanner diagram, the LDPC decoder can first update each check node. Updating a check node can be done by iterating through it, which involves obtaining information passed from the iterating check node to the variable node. Then, based on the iteration results of the check nodes, each variable node is updated. Updating a variable node can also be done by iterating through it, which involves obtaining information passed from the iterating variable node to the check node. The check node is then updated based on the updated variable node results, and the updated check node results are used to update the variable nodes again. This process is repeated multiple times until the iteration termination condition is met.

[0098] After each update of the check node and / or variable node, the LDPC decoder can use the updated variable node and / or updated check node to determine the iteration termination condition. If the iteration termination condition is met based on the updated variable node and / or updated check node, the decoding process ends, and the decoding result is determined from the variable node and check node of the last iteration. If the updated variable node and / or updated check node do not meet the iteration termination condition, the next iteration process begins, until the number of iterations reaches a preset maximum value.

[0099] For example, suppose the parity check matrix H of the transmitted bit sequence C = (C0, C1, C2, C3, C4, C5, C6, C7, C8, C9) is as shown in formula (1):

[0100]

[0101] Then the bit sequence C must satisfy the linear equation system H*C T =0. After transmission through the channel, the bit sequence Y = (Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8, Y9) received by the LDPC decoder may contain errors, therefore H*Y T The condition = 0 is no longer valid; the error needs to be identified and corrected using decoding methods. Please refer to [link to documentation]. Figure 3B , Figure 3B This is a schematic diagram of a Tanner diagram provided in an embodiment of this application. From Figure 3B As can be seen, X0, X1, ..., X9 are called variable nodes, representing 10 bits, which are the unknown variables to be solved by the decoder. f0, f1, f2, f3, and f4 in the diagram are called check nodes, representing each check equation in the thread equation set. Elements of "1" in the check matrix H represent the connections between variable nodes and check nodes in the Tanner diagram.

[0102] The decoding iteration process involves transmitting information between variable nodes and check nodes. In the Tanner graph, information can be transmitted between variable nodes and check nodes when there is a connection between them. The LDPC decoder can use the bit sequence Y as the information from the 0th variable node to the check node, or the LDPC can determine the information from the 0th variable node to the check node based on the bit sequence Y. That is, for check node f0, it can receive information transmitted from variable nodes X3, X4, X7, and X8. Similarly, for check node f1, it can receive information transmitted from variable nodes X1, X3, X6, and X9; for check node f2, it can receive information transmitted from variable nodes X0, X1, X5, and X7; for check node f3, it can receive information transmitted from variable nodes X0, X2, X6, and X8; and for check node f4, it can receive information transmitted from variable nodes X2, X4, X5, and X9. Each check node processes the received information and then transmits the processed information to its adjacent variable node. That is, variable node X0 can receive information from verification nodes f2 and f3; variable node X1 can receive information from verification nodes f1 and f2; variable node X2 can receive information from verification nodes f3 and f4; variable node X3 can receive information from verification nodes f0 and f1; variable node X4 can receive information from verification nodes f0 and f4; variable node X5 can receive information from verification nodes f2 and f4; variable node X6 can receive information from verification nodes f1 and f3; variable node X7 can receive information from verification nodes f0 and f2; variable node X8 can receive information from verification nodes f0 and f3; and variable node X9 can receive information from verification nodes f1 and f4. Each variable node then processes the received information. Finally, the processed information is decoded and judged. If the verification equation is satisfied, the decoding ends. Otherwise, the decoding is repeated multiple times until the maximum number of decoding attempts is reached.

[0103] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of an LDPC decoder 400 provided in an embodiment of this application. The LDPC decoder 400 can be located in any electronic device, for example... Figure 1 The network equipment and terminal equipment shown are described. The LDPC decoder 400 can specifically be a chip, chipset, or a circuit board with a chip or chipset mounted on it. The chip, chipset, or circuit board with a chip or chipset mounted on it can operate with the necessary software drivers.

[0104] The LDPC decoder 400 may include an electrical chip 401 and an optical chip 402, which are connected by a metal wire. This means that signal transmission between the electrical chip 401 and the optical chip 402 can be achieved through the metal wire. It can be understood that a chip that processes and transmits signals using current is called an electrical chip; a chip that processes and transmits signals using light is called an optical chip. The optical chip 402 may include a light source 402A, an optical multiplier 402B, and a receiver 402C. Specifically, the light source 402A may be one or more laser sources used to generate single or multiple optical signals of different wavelengths. The receiver 402C may be one or more photodiodes or photodetectors used to convert the optical signals into electrical signals. The optical multiplier 402B may consist of a waveguide and metal electrodes. The waveguide structure may specifically be one or more of the following: a directional coupler, a Mach-Zehnder interferometer, and a microring. This can be understood as the optical multiplier specifically being a multiplier with a directional coupler structure, a multiplier with a Mach-Zehnder interferometer structure, and / or a multiplier with a microring structure.

[0105] Electrical chip 401 receives a bit sequence transmitted from the channel. This bit sequence is encoded using LDPC code. First probability information is then determined based on the bit sequence and transmitted to optical chip 402 via an electrical signal. Furthermore, the electrical signal is transmitted through a metal wire, allowing electrical chip 401 to transmit the first probability information to optical chip 402 via the metal wire.

[0106] For example, in the BP algorithm, two conditional probabilities q are first defined. i,j (0) and q i,j (1), where i represents the row of the parity-check matrix of the LDPC code, and j represents the column of the parity-check matrix of the LDPC code. Initially, the decoder only receives the output information from the channel, without any prior information from the parity-check node. Therefore, the electrical chip 401 of the LDPC decoder 400 determines the probability P that the j-th bit in the bit sequence output by the channel is 0. j (0) is assigned to q i,j (0), the probability P of setting the bit to 1 j (1) Assign the value to q i,j (1) Where, P j (1)=1-P j (0).

[0107] Then, the electrical chip 401 can be based on q i,j(1) Determine the first probability information, which can be the information from the variable node to the check node. It is understandable that in a Tanner graph, when there is a connection between a variable node and a check node, information can be passed between them. Furthermore, in the BP algorithm implemented by the LDPC decoder 400, the first probability information can be |1-2q|. i,j (1)|. Furthermore, the first probability information may include positive or negative S, where S is used to indicate [1-2q i,j Is (1) a positive or negative number? That is, Where, j′∈R i \j represents set R i The set after excluding j is set R. i This represents the set of columns containing each element "1" in the i-th row of the check matrix. For example, if the check matrix is ​​as shown in formula (1), it can be seen from formula (1) that: R0 = {3,4,7,8}, R3 = {0,2,6,8}, therefore R0\3 = {4,7,8,9}, R3\0 = {2,6,8}. Next, the electrical chip 401 loads the calculated first probability information onto the optical chip 402 via electrical signals in the form of voltage or ohmic heat. That is, the electrical chip 401 loads |1-2q| onto the optical chip 402 via electrical signals. i,j (1) Transmitted to optical chip 402.

[0108] Understandably, because q i,j (1) has a range of values ​​[0,1], then |1-2q i,j (1) The range of | can also be [0,1].

[0109] In one possible implementation, the electrical chip 401 is specifically used to multiply the first probability information by a first preset coefficient, and then transmit the first probability information after the multiplication operation to the optical chip 402 through an electrical signal.

[0110] For example, in the BP algorithm, the first probability information (i.e., |1-2q) is taken into account. i,jThe value range of (1)|) is [0,1]. Multiplying multiple numbers between 0 and 1 may result in a very small final multiplication result. That is, the multiplication result calculated on the optical chip 402 will be weak in the optical signal, so that the receiver 403 cannot detect it. Therefore, before loading the first probability information onto the optical chip 402, the electrical chip 401 multiplies the first probability information by a coefficient to amplify it. The amplified first probability information is then loaded onto the optical chip 402. After the optical chip 402 has completed the multiplication operation, it is divided by the corresponding preset coefficient. The preset coefficient can be a value set manually based on experience or a value that is easy to calculate. For example, the preset coefficient can be a power of 2, because in binary digital circuits, multiplication and division of coefficients can be achieved simply by shifting bits, which has a low computational cost. For example, let the first probability information be X. Multiplying X by a coefficient a yields Y. To facilitate detection by receiver 403, Y needs to be amplified to a range close to 1, for example, the range of Y is (0.5, 1). If X1 ∈ (0.5, 1], then Y1 = X1 * 2 0 Therefore, the coefficient a1 = 1; if X2 ∈ (0.25, 0.5], then Y2 = X2 * 2 1 Therefore, the coefficient a2 = 2; if X3 ∈ (0.125, 0.25], then Y3 = X3 * 2 2 Therefore, the coefficient a3 = 4; if X4 ∈ (0.0625, 0.125], then Y4 = X4 * 2 3 Therefore, the coefficient a3 = 8.

[0111] The optical chip 402 can convert the first probability information of the electrical signal into the first probability information of the optical signal, perform a multiplication operation on the first probability information of the optical signal to obtain the first multiplication result, convert the first multiplication result of the optical signal into the first multiplication result of the electrical signal, and transmit the first multiplication result of the electrical signal to the electrical chip 401.

[0112] Specifically, the optical chip 402 includes a light source 420A, one or more optical multipliers 402B, and a receiver 402C. The light source 402A generates an input optical signal and transmits the first input optical signal to the optical multiplier 402B. The optical multiplier 402B adjusts the first input optical signal according to the first probability information of the electrical signal to determine the first probability information of the optical signal, and performs a multiplication operation on the first probability information of the optical signal to obtain a first multiplication result. In one possible implementation, the optical chip 402 is used to perform a multiplication operation on the first probability information multiplied by a first preset coefficient to obtain the first multiplication result.

[0113] Optionally, the optical multiplier 402B includes a waveguide and metal electrodes. The light source transmits a first input optical signal to the waveguide of the optical multiplier 402B. When the first probability information of the electrical signal is applied to the metal electrodes of the optical multiplier 402B, the metal electrodes can change the refractive index of the waveguide. Furthermore, the metal electrodes can change the refractive index of the waveguide through an electric field or ohmic heat, thereby determining the first refractive index of the optical multiplier. The optical chip 402 can adjust the energy of the first input optical signal transmitted on the waveguide according to the first refractive index to determine the first probability information of the optical signal. The first probability information of the optical signal is then multiplied to obtain a first multiplication result. The receiver 402C converts the first multiplication result of the optical signal into a first multiplication result of the electrical signal and transmits the first multiplication result of the electrical signal to the electrical chip 401.

[0114] Optionally, when the waveguide material is doped silicon, after the first probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the electric field generated by the metal electrode can change the carrier concentration of the waveguide in the optical multiplier 402B. When the carrier concentration of the waveguide changes, the refractive index of the waveguide also changes. Thus, the first refractive index of the optical multiplier can be determined by changing the carrier concentration of the waveguide. Therefore, the optical chip 402 can determine the first probability information of the optical signal by adjusting the energy of the first input optical signal transmitted on the waveguide according to the first refractive index, and then perform a multiplication operation on the first probability information of the optical signal to obtain the first multiplication result. Finally, the receiver 402C converts the first multiplication result of the optical signal into the first multiplication result of the electrical signal and transmits the first multiplication result of the electrical signal to the electrical chip 401.

[0115] Optionally, when the waveguide material is silicon-doped, after the first probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the metal electrode can generate ohmic heat. Based on the thermo-optical effect of the waveguide, the relationship between ohmic heat and refractive index can be determined. Therefore, the first refractive index of the optical multiplier 402B can be determined by changing the ohmic heat of the waveguide. Thus, the optical chip 402 can adjust the energy of the first input optical signal transmitted on the waveguide according to the first refractive index to determine the first probability information of the optical signal. Then, the first probability information of the optical signal is multiplied to obtain the first multiplication result. Finally, the receiver 402C converts the first multiplication result of the optical signal into the first multiplication result of the electrical signal and transmits the first multiplication result of the electrical signal to the electrical chip 401.

[0116] Optionally, when the waveguide material is lithium niobate, after the first probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the electric field generated by the metal electrode can produce an electro-optic effect. Thus, the first refractive index of the optical multiplier 402B can be determined by changing the electric field loaded on the waveguide. Therefore, the optical chip 402 can determine the first probability information of the optical signal by adjusting the energy of the input optical signal transmitted on the waveguide according to the first refractive index, and then perform a multiplication operation on the first probability information of the optical signal to obtain the first multiplication result. Finally, the receiver 402C converts the first multiplication result of the optical signal into the first multiplication result of the electrical signal and transmits the first multiplication result of the electrical signal to the electrical chip 401.

[0117] For example, in the backpropagation (BP) algorithm, the first probability could be |1-2q|. i,j (1) The optical chip 402 can be based on |1-2q i,j (1) The electrical signal is used to determine the first refractive index of the optical multiplier 402B, and then the input optical signal is adjusted according to the first refractive index to determine |1-2q. i,j (1)| optical signal, finally |1-2q i,j (1)|The first multiplication result is obtained by performing multiplication in the form of optical signals. Where, j′∈R i \j represents set R i The set after excluding j is set R. i Let Ri represent the set of columns containing each element "1" in the i-th row of the parity check matrix. If the parity check matrix H is as shown in formula (1), it can be seen from formula (1) that R0 = {3, 4, 7, 8}, then R0\3 = {4, 7, 8}. Therefore, for j′∈Ri 0\3 Specifically, the result of the first multiplication can be |1-2q|. 0,4 (1)|*|1-2q 0,7 (1)|*|1-2q 0,8 (1)|.

[0118] After the optical chip 402 calculates the first multiplication result, it is received by the receiver 402C and transmitted to the electrical chip 401. Further, when the receiver 402C is specifically a photodiode, the photodiode converts the first multiplication result of the optical signal into the first multiplication result of the electrical signal, and then transmits the first multiplication result of the electrical signal to the electrical chip 401. It can be understood that since only the photoelectric conversion is performed through the photodiode, the electrical signal also carries the first multiplication result.

[0119] The electronic chip 401 is specifically used to update the check node based on the first multiplication result to obtain the second probability information. The second probability information can include first information and second information. The first information represents information where bits are 0 in a bit sequence of length j, and the second information represents information where bits are 1 in a bit sequence of length j. For example, in the BP algorithm, let the first multiplication result be I, and the first information be r. i,j (0), the second information is r i,j (1), then r i,j (0) = 0.5 + S * 0.5 * I, r i,j (1) = 0.5 - S * 0.5 * I. Where S is used to represent [1-2q] i,j (1)] Is it a positive or negative number?

[0120] It should be noted that when the second probability information does not need to be transmitted to the optical chip 402 in real time, the electrical chip 401 can store the second probability information. The second probability information is the information transmitted from the verification node to the variable node, which can be interpreted in the same way as the information from the variable node to the verification node, and will not be elaborated here.

[0121] In one possible implementation, when the first multiplication result received by the electrical chip 401 is the result obtained by the optical chip 402 multiplying the first probability information by a first preset coefficient, the electrical chip 401 needs to divide the first multiplication result by the first preset coefficient, and then update the verification node based on the first multiplication result after the division to obtain the second probability information. For example, suppose the first probability information after multiplying by the first preset coefficient is Y1 = X1 * a 1 Y2 = X2 * a 2 Y3 = X3 * a 4 Y4 = X4 * a 4 If the first multiplication result is Y1*Y2*Y3*Y4, then the electrical chip 401 needs to restore the first multiplication result to X1*X2*X3*X4. Therefore, the electrical chip 401 needs to divide the first multiplication result by the first preset coefficient, that is, (Y1*Y2*Y3*Y4) / (a1*a2*a3*a4).

[0122] Once the second probability information is determined, the electrical chip 401 transmits the second probability information of the electrical signal to the optical chip 402. Furthermore, the electrical chip 401 can transmit the second probability information of the electrical signal to the optical chip 402 via a metal wire.

[0123] Furthermore, to prevent the second probability information from being too small, resulting in a multiplication of the second probability information that the receiver 403 cannot detect, the electrical chip 401 needs to multiply the second probability information by a second preset coefficient and transmit the second probability information of the multiplied electrical signal to the optical chip 402.

[0124] For example, in the BP algorithm, in order to update the variable node, the electronic chip 401 needs to convert the first information r in the second probability information. i,j (0) and second information r i,j (1), and the probability P that the bit is 0. j (0) and the probability P of bit 1 j (1) Multiply by the second preset coefficient and then transmit to the optical chip 402.

[0125] The optical chip 402 can convert the second probability information of the electrical signal into the second probability information of the optical signal, then perform a multiplication operation on the second probability information of the optical signal to obtain the second multiplication result, convert the second multiplication result of the optical signal into the second multiplication result of the electrical signal, and transmit the second multiplication result of the electrical signal to the electrical chip 401.

[0126] Specifically, the optical chip 402 includes a light source 420A, one or more optical multipliers 402B, and a receiver 402C. The optical multiplier 402B adjusts the second input optical signal according to the second probability information of the electrical signal to determine the optical signal with the second probability information, and performs a multiplication operation on the second probability information of the optical signal to obtain a second multiplication result. In one possible implementation, the optical chip 402 is used to perform a multiplication operation on the second probability information of the electrical signal multiplied by a second preset coefficient to obtain a second multiplication result. Further, the second probability information includes first information, a first probability with a bit of 0, second information, and a second probability with a bit of 1. The optical multiplier 402B adjusts the second input optical signal according to the first information and the first probability of the electrical signal to determine the first information and the first probability of the optical signal, performs a multiplication operation on the first information and the first probability of the optical signal to obtain a multiplication result of the first information and the first probability, and the optical multiplier 402B adjusts the second input optical signal according to the second information and the second probability of the electrical signal to determine the second information and the second probability of the optical signal, performs a multiplication operation on the second information and the second probability of the optical signal to obtain a multiplication result of the second information and the second probability. In one possible implementation, the optical chip 402 is used to convert the first information, second information, first probability, and second probability of the electrical signal multiplied by a second preset coefficient into the first information, second information, first probability, and second probability of the optical signal, and perform a multiplication operation to obtain a second multiplication result. The second multiplication result includes the multiplication result of the first information and the first probability, and the multiplication result of the second information and the second probability.

[0127] Specifically, when the waveguide material is doped silicon, after the second probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the electric field generated by the metal electrode can change the carrier concentration of the waveguide in the optical multiplier 402B. When the carrier concentration of the waveguide changes, the refractive index of the waveguide also changes. Therefore, the second refractive index of the optical multiplier 402B can be determined by changing the carrier concentration of the waveguide. Thus, the optical chip 402 can adjust the energy of the second input optical signal transmitted on the waveguide according to the second refractive index to determine the optical signal with second probability information. Then, the second probability information of the optical signal is multiplied to obtain the second multiplication result. Finally, the receiver 402C converts the second multiplication result of the optical signal into the second multiplication result of the electrical signal and transmits the second multiplication result of the electrical signal to the electrical chip 401.

[0128] Optionally, when the waveguide material is silicon-doped, after the second probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the metal electrode can generate ohmic heat. Based on the thermo-optical effect of the waveguide, the relationship between ohmic heat and refractive index can be determined. Therefore, the second refractive index of the optical multiplier 402B can be determined by changing the ohmic heat of the waveguide. Thus, the optical chip 402 can adjust the energy of the second input optical signal transmitted on the waveguide according to the second refractive index to determine the optical signal with the second probability information. Then, the second probability information of the optical signal is multiplied to obtain the second multiplication result. Finally, the receiver 402C converts the second multiplication result of the optical signal into the second multiplication result of the electrical signal and transmits the second multiplication result of the electrical signal to the electrical chip 401.

[0129] Optionally, when the waveguide material is lithium niobate, after the second probability information of the electrical signal is loaded onto the metal electrode of the optical multiplier 402B, the electric field generated by the metal electrode can produce an electro-optic effect. Therefore, the second refractive index of the optical multiplier 402B can be determined by changing the electro-optic effect of the waveguide. Thus, the optical chip 402 can adjust the energy of the Dürer input optical signal transmitted on the waveguide according to the second refractive index to determine the optical signal with the second probability information. Then, the second probability information of the optical signal is multiplied to obtain the second multiplication result. Finally, the receiver 402C converts the second multiplication result of the optical signal into the second multiplication result of the electrical signal and transmits the second multiplication result of the electrical signal to the electrical chip 401.

[0130] For example, in the BP algorithm, the second probability information may include the first information r. i,j (0) The first probability P that the bit is 0 j (0), Second information r i,j (1) and the second probability P where bit is 1 j (1). The optical chip 402 can be based on the first information ri,j (0) and the first probability P of bit 0 j (0) Determine the refractive index of the optical multiplier 402B, and then adjust the second input optical signal according to the above refractive index to determine the first information r of the optical signal. i,j (0) and the first probability P j (0), finally the first information r of the optical signal i,j (0) and the first probability P j (0) Perform a multiplication operation to obtain the result of multiplying the first information and the first probability. Furthermore, the optical chip 402 can, based on the second information r i,j (0) and the second probability P where the bit is 0 j (0) Determine the refractive index of the optical multiplier 402B, and then adjust the second input optical signal according to the above refractive index to determine the second information r of the optical signal. i,j (0) and the second probability P j (0), and finally the second information r i,j (0) and the second probability P j (0) Perform multiplication in the form of optical signals to obtain the result of multiplying the second information and the second probability.

[0131] After the optical chip 402 calculates the second multiplication result, it is received by the receiver 402C and transmitted to the electrical chip 401. Further, when the receiver 402C is specifically a photodiode, the photodiode converts the second multiplication result of the optical signal into the second multiplication result of the electrical signal, and then transmits the second multiplication result of the electrical signal to the electrical chip 401. It can be understood that since only the photoelectric conversion is performed through the photodiode, the electrical signal also carries the second multiplication result.

[0132] The electronic chip 401 is also used to update the variable nodes based on the second multiplication result to obtain third probability information, and then determine the decoded value of the bit sequence based on the third probability information. The decoded value indicates whether the decoding decision is successful or whether the decoding count has reached a preset number.

[0133] In one possible implementation, when the second multiplication result received by the electrical chip 401 is obtained by the optical chip 402 multiplying the second probability information by a second preset coefficient, the electrical chip 401 needs to divide the second multiplication result by the second preset coefficient, and then update the variable node according to the second multiplication result after the division to obtain the third probability information. Further, the electrical chip 401 can determine the decoded value of the bit sequence based on the third probability information.

[0134] Specifically, the second multiplication result can include: the multiplication result of the first information and the first probability, and the multiplication result of the second information and the second probability. When the electrical chip 401 receives the second multiplication result of the electrical signal, the process of updating the variable nodes by the electrical chip 401 can be as follows: First, the electrical chip 401 compares the magnitude of the multiplication result of the first information and the first probability with the multiplication result of the second information and the second probability. If the former is greater than the latter, the target bit corresponding to the j-th bit in the channel output bit sequence can be determined to be 0; if the former is less than the latter, the target bit corresponding to the j-th bit in the channel output bit sequence can be determined to be 1; if the former is equal to the latter, the target bit corresponding to the j-th bit in the channel output bit sequence can be either 0 or 1. After updating all variable nodes according to the second multiplication result, third probability information can be obtained. The third probability information can include the target sequence composed of the second multiplication result and the target bit. Then, the electrical chip 401 can determine the decoding value of the bit sequence based on the third probability information, that is, it can perform decoding decision based on the target sequence to obtain the decoding value of the bit sequence. If the decoded value is 0, it means that the decoding decision is successful; if the decoded value is not 0, it means that the decoding is not completed. If the number of decoding attempts has not reached the preset number, the next decoding attempt is required. Therefore, the result of the second multiplication in the third probability information needs to be normalized and then assigned to the first probability information for the next decoding attempt.

[0135] For example, in the BP algorithm, the 401 microcontroller is compared. and The size relationship between these two, if If the probability that the target bit corresponding to the j-th bit in the bit sequence of the channel output is 0 is relatively high, then the target bit corresponding to the j-th bit can be determined as 0; if This indicates that the probability of the target bit corresponding to the j-th bit in the channel output bit sequence being 1 is relatively high, so the target bit corresponding to the j-th bit can be determined as 1. Since the j-th bit can be any bit in the channel output bit sequence, the decoder 400 can determine the target bit corresponding to each bit after decoding all bits. Each target bit can form a target bit sequence f. Decoding and deciding on the target bit sequence f is then performed, i.e., H*f. T The decoder performs the operation. If the decoded value is 0, the decoding decision is successful; if the decoded value is not 0, the decoding is incomplete. If the preset number of decoding attempts has not been reached, another decoding attempt is required. The decoder 400 needs to... After normalization, the value is assigned to q. i,j (0), will After normalization, the value is assigned to q. i,j(1). Then, decoder 400 determines the new q. i,j (0) and q i,j (1) to complete the next decoding.

[0136] It should be noted that the first input optical signal and the second input optical signal can be the same or different, and this application embodiment does not impose any restrictions.

[0137] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of an LDPC decoder with a cascaded directional coupler provided in an embodiment of this application. From... Figure 5 As can be seen, the LDPC decoder 500 includes an electrical chip 501 and an optical chip 502, which transmit information through metal wires. The optical chip 502 includes a light source 502A, an optical multiplier 502B, and a receiver 502C. The optical multiplier 502B includes one or more cascaded directional couplers 503. Each directional coupler 503 includes a first waveguide 503A and a second waveguide 503B, as well as metal electrodes 503C placed on the second waveguide 503B and on one side of the second waveguide 503B. It is understood that the LDPC decoder 500 is a decoder with a three-dimensional integrated wiring structure, meaning that the metal electrodes 503C placed on the second waveguide 503B are located on different planes from the second transmission waveguide 503B.

[0138] The input optical signal generated by light source 502A is transmitted into the first waveguide 503A. When the materials of the first waveguide 503A and the second waveguide 503B are doped silicon, when the electrical chip 501 transmits the electrical signal to the metal electrode 503C, that is, when the electrical chip 501 applies a voltage to the metal electrode 503C, the electric field generated by the metal electrode 503C can change the carrier concentration of the second waveguide 503B. When the carrier concentration changes, the refractive index of the second waveguide 503B also changes. After the refractive index of the second waveguide 503B changes, a portion of the input optical signal transmitted on the first waveguide 503A may couple to the second waveguide 503B. In other words, a portion of the input optical signal originally transmitted on the first waveguide 503A will be lost, equivalent to multiplying the input optical signal originally transmitted on the first waveguide 503A by a coupling coefficient. Therefore, the directional coupler 503 can output a coupled and regulated optical signal.

[0139] In one possible implementation, the input optical signal generated by the light source 502A is transmitted into the first waveguide 503A. When the materials of the first waveguide 503A and the second waveguide 503B are doped silicon, when the electrical chip 501 transmits the electrical signal to the metal electrode 503C, the metal electrode 503C generates ohmic heat when energized. The relationship between ohmic heat and refractive index is determined based on the thermo-optic coefficient of the second waveguide 503B; therefore, the refractive index of the second waveguide 503B can be changed by adjusting the ohmic heat. When the refractive index of the second waveguide 503B changes, a portion of the input optical signal transmitted on the first waveguide 503A may be coupled to the second waveguide 503B, effectively multiplying the original input optical signal transmitted on the first waveguide 503A by a coupling coefficient. Therefore, the directional coupler 503 can output a coupled optical signal.

[0140] In one possible implementation, the input optical signal generated by the light source 502A is input into the first waveguide 503A. When the materials of the first waveguide 503A and the second waveguide 503B are lithium niobate, after the electrical chip 501 transmits the electrical signal to the metal electrode 503C, the metal electrode can generate a voltage. Thus, the metal electrode 503C can generate an electro-optic effect through the applied voltage, and this electro-optic effect can change the refractive index of the second waveguide 503B. When the refractive index of the second waveguide 503B changes, a portion of the input optical signal transmitted on the first waveguide 503A may be coupled to the second waveguide 503B, effectively multiplying the original input optical signal transmitted on the first waveguide 503A by a coupling coefficient. Therefore, the directional coupler 503 can output a coupled and regulated optical signal.

[0141] When multiple directional couplers are connected in series, multiple coupled and adjusted optical signals can be multiplied to obtain a single multiplication result. Therefore, after the electrical chip 501 determines the first probability information based on the bit sequence transmitted from the channel, it transmits this first probability information to the metal electrodes of each directional coupler via metal lines. The input optical signal generated by the light source 502A is transmitted into the first waveguide 503A. Each metal electrode can adjust the first refractive index of the directional coupler according to the first probability information of the corresponding electrical signal. Thus, the directional coupler can adjust the input optical signal based on the first refractive index to determine the first probability information of the corresponding optical signal. When multiple directional couplers output the first probability information of their corresponding optical signals, the optical multiplier 502B can output the optical signal obtained from the multiplication of multiple first probabilities. Similarly, after the electrical chip 501 obtains the second probability information based on the first multiplication result, it transmits the second probability information to the metal electrodes of each directional coupler via metal lines. Each metal electrode can adjust the second refractive index of the directional coupler according to the second probability information of the corresponding electrical signal. Therefore, the directional coupler can adjust the input optical signal based on the second refractive index to determine the optical signal with the corresponding second probability information. When multiple directional couplers output optical signals corresponding to the second probability information, the optical multiplier 502B can output the second multiplication result of the optical signal obtained by multiplying multiple second probabilities.

[0142] Receiver 502C receives the optical signal carrying the multiplication result, performs photoelectric conversion on the optical signal, and then transmits the multiplication result to electrical chip 501 as an electrical signal via a metal wire. Electrical chip 501 performs simple operations on the multiplication result, such as addition, subtraction, and judgment operations. Finally, electrical chip 501 obtains third probability information based on the second multiplication result, determines the decoding result of the bit sequence based on the third probability information, and judges whether the decoding decision is successful or whether the number of decoding attempts has reached a preset number based on the decoding result.

[0143] It should be noted that the number of cascaded directional couplers can be set according to actual needs. This application embodiment does not impose any restrictions. For example, if it is necessary to calculate the multiplication of 6 numbers, then 6 cascaded directional couplers are required.

[0144] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of an LDPC decoder for a cascaded Mach-Zehnder interferometer provided in an embodiment of this application. Figure 6As can be seen, the LDPC decoder 600 includes an electrical chip 601 and an optical chip 602, which transmit information through a metal wire. The optical chip 602 includes a light source 602A, one or more optical multipliers 602B, and a receiver 602C. The optical multiplier 602B includes one or more Mach-Zehnder interferometers (MZIs) 603. Each MZI 603 includes an input waveguide 603A and an output waveguide 603D, an upper arm 603B and a lower arm 603C, and metal electrodes 603E respectively placed at the upper arm 603B and the lower arm 603C.

[0145] The input optical signal generated by the light source 602A is transmitted into the upper arm 603B and lower arm 603C of the MZI through the input waveguide 603A. When the material of the upper arm 603B and lower arm 603C of the MZI is doped silicon, when the electrical chip 601 transmits the electrical signal to the metal electrode, that is, when the electrical chip 601 applies a voltage to the metal electrode 603E, the electric field generated by the metal electrode 603E may change the concentration of charge carriers in the upper arm 603B and lower arm 603C of the MZI, thereby changing the refractive index of the upper arm 603B and lower arm 603C of the MZI. When the refractive indices of the upper arm 603B and lower arm 603C of the MZI change, the optical signal input from the input waveguide 603A can be coupled into the coupling region formed by the upper arm 603B and lower arm 603C. Therefore, the input optical signal may suffer some loss when it is output from the output waveguide 603D, which is equivalent to the optical signal output from the output waveguide 603D being the optical signal input from the input waveguide 603A multiplied by a coupling coefficient. Thus, the MZI 603 can output a coupled optical signal.

[0146] In one possible implementation, the input optical signal generated by the light source 602A is transmitted into the upper arm 603B and lower arm 603C of the MZI through the input waveguide 603A. When the material of the upper arm 603B and lower arm 603C of the MZI is lithium niobate, when the electrical chip 601 transmits the electrical signal to the metal electrode 603E, the metal electrode 603E can generate an electro-optic effect through the applied voltage, and the electro-optic effect can change the refractive index of the upper arm 603B and lower arm 603C of the MZI. When the refractive indices of the upper arm 603B and lower arm 603C of the MZI change, the optical signal input from the input waveguide 603A will couple into the coupling region formed by the upper arm 603B and lower arm 603C. Therefore, the input optical signal may be partially lost when it is output from the output waveguide, which is equivalent to the optical signal output from the output waveguide 603D being the optical signal input from the input waveguide 603A multiplied by a coupling coefficient. Thus, the MZI 603 can output a coupled optical signal.

[0147] When multiple MZIs are connected in series, multiple coupled and regulated optical signals can be multiplied to obtain a single multiplication result. Therefore, after the electrical chip 501 determines the first probability information based on the bit sequence transmitted from the channel, it transmits the first probability information to the metal electrodes of each MZI via metal lines. The input optical signal generated by the light source 602A is transmitted into the input waveguide 603A of the MZI. Each metal electrode can adjust the first refractive index of the MZI according to the first probability information of the corresponding optical signal. Therefore, the MZI can determine the first probability information of the corresponding optical signal by adjusting the input optical signal according to the first refractive index. When multiple MZIs output the first probability information of their corresponding optical signals, the optical multiplier 602B can output the optical signal of the first multiplication result obtained by multiplying multiple first probability information signals. Similarly, after the electrical chip 601 obtains the second probability information based on the first multiplication result, it transmits the second probability information to the metal electrode of each MZI through the metal line. Each metal electrode can adjust and determine the second refractive index of the MZI according to the second probability information of the corresponding electrical signal. Therefore, the MZI can adjust the input optical signal according to the second refractive index to determine the optical signal with the corresponding second probability information. When multiple MZIs output optical signals with the corresponding second probability information, the optical multiplier 502B can output the second multiplication result of the optical signals obtained by multiplying multiple second probabilities.

[0148] Receiver 602C receives the optical signal carrying the multiplication result, performs photoelectric conversion on the optical signal, and then transmits the multiplication result to electrical chip 601 as an electrical signal via a metal wire. Electrical chip 601 performs simple operations on the multiplication result, such as addition, subtraction, and judgment operations. Finally, electrical chip 601 obtains third probability information based on the second multiplication result, determines the decoding result of the bit sequence based on the third probability information, and judges whether the decoding decision is successful or whether the number of decoding attempts has reached a preset number based on the decoding result.

[0149] It should be noted that the number of cascaded MZIs can be set according to actual needs, and this application embodiment does not impose any restrictions.

[0150] Please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a cascaded micro-ring LDPC decoder provided in an embodiment of this application. From... Figure 7 As can be seen, the LDPC decoder 700 includes an electrical chip 701 and an optical chip 702, which transmit information through a metal wire. The optical chip 702 includes a light source 702A, an optical multiplier 702B, and a receiver 702C. The optical multiplier 702B includes one or more cascaded microrings 703. Each microring 703 includes a first waveguide 703A, a microring resonant cavity 703B, and metal electrodes 703C respectively placed on both sides of the microring 703B.

[0151] The input optical signal generated by the light source 702A is transmitted into the first waveguide 703A. When the materials of the first waveguide 703A and the micro-ring resonator 703B are doped silicon, when the electrical chip 701 transmits the electrical signal to the metal electrode 703C, that is, when the electrical chip 701 applies a voltage to the metal electrode 703C, the electric field generated by the metal electrode 703C can change the concentration of charge carriers on the micro-ring resonator 703B. When the concentration of charge carriers changes, the refractive index of the micro-ring resonator 703B also changes. After the refractive index of the micro-ring resonator 703B changes, a portion of the input optical signal transmitted on the first waveguide 703A may couple to the micro-ring resonator 703B. In other words, a portion of the input optical signal originally transmitted on the first waveguide 703A will be lost, equivalent to multiplying the original input optical signal transmitted on the first waveguide 703A by a coupling coefficient. Therefore, the micro-ring 703 can output a coupled and regulated optical signal.

[0152] In one possible implementation, the optical signal generated by the light source 702A is input into the first waveguide 703A. When the materials of the first waveguide 703A and the micro-ring resonator 703B are lithium niobate, the metal electrode 703C can generate a voltage when the electrical chip 701 transmits the electrical signal to the metal electrode 703C. Thus, the metal electrode 703C can generate an electro-optic effect through an applied electric field, and this electro-optic effect can change the refractive index of the micro-ring resonator 703B. When the refractive index of the micro-ring resonator 703B changes, a portion of the input optical signal transmitted on the first waveguide 703A may be coupled to the micro-ring resonator 703B, effectively multiplying the original input optical signal transmitted on the first waveguide 703A by a coupling coefficient. Therefore, the micro-ring 703 can output a coupled and regulated optical signal.

[0153] When multiple microrings are connected in series, multiple coupled and adjusted optical signals can be multiplied to obtain a single multiplication result. Therefore, after the electrical chip 701 determines the first probability information based on the bit sequence transmitted from the channel, it transmits this first probability information to the metal electrodes of each microring via metal lines. The input optical signal generated by the light source 702A is transmitted into the first waveguide 703A. Each metal electrode can adjust the first refractive index of the directional coupler according to the first probability information of the corresponding electrical signal. Thus, the microrings can adjust the input optical signal based on the first refractive index to determine the first probability information of the optical signal. When multiple microrings output the first probability information carrying the corresponding optical signal, the optical multiplier 702B can output the optical signal obtained from the first multiplication result of multiple first probability information. Similarly, after the electrical chip 701 obtains the second probability information based on the first multiplication result, it transmits the second probability information to the metal electrodes of each directional coupler via metal lines. Each metal electrode can adjust the second refractive index of the microring based on the second probability information of the corresponding electrical signal. Therefore, the microrings can adjust the input optical signal based on the second refractive index to determine the optical signal with the corresponding second probability information. When multiple microrings output optical signals corresponding to the second probability information, the optical multiplier 502B can output the second multiplication result of the optical signal obtained by multiplying multiple second probabilities.

[0154] Receiver 702C receives the optical signal carrying the multiplication result, performs photoelectric conversion on the optical signal, and then transmits the multiplication result to electrical chip 701 as an electrical signal via a metal wire. Electrical chip 701 performs simple operations on the multiplication result, such as addition, subtraction, and judgment operations. Finally, electrical chip 701 obtains third probability information based on the second multiplication result, determines the decoding result of the bit sequence based on the third probability information, and judges whether the decoding decision is successful or whether the decoding count has reached a preset number based on the decoding result.

[0155] Please see Figure 8 , Figure 8 This is a schematic diagram of the structure of an LDPC decoder for a hybrid optical multiplier provided in an embodiment of this application. From... Figure 8 As can be seen, the LDPC decoder 800 includes an electrical chip 801 and an optical chip 802, which are connected by a metal wire. The optical chip 802 includes a light source 802A, an optical multiplier 802B, and a receiver 802C. The optical multiplier 802B includes one or more cascaded directional couplers 803, one or more cascaded MZI 804, and one or more micro-rings 805. That is, the optical multiplier 802B uses a combination of cascaded directional couplers 803, cascaded MZI 804, and micro-rings 805 to perform multiplication operations and obtain one or more multiplication results.

[0156] For a description of the directional coupler 803, please refer to [link / reference]. Figure 5 Further details will not be elaborated here; for a description of MZI804, please refer to [link / reference]. Figure 6 This will not be elaborated upon here; for a description of the Microring 805, please refer to [link / reference needed]. Figure 7 This will not be elaborated upon here.

[0157] Please see Figure 9 , Figure 9 This is a schematic diagram of another LDPC decoder provided in an embodiment of this application. From... Figure 9 It can be seen that the electrical chip and the optical chip can adopt a three-dimensional packaging structure, meaning that the electrical chip and the optical chip are not on the same plane. The optical chip can be placed on top of the electrical chip, or vice versa. The electrical chip and the optical chip are connected by metal wires, meaning that information is transmitted between them through metal wires. This is understandable. Figures 4 to 8 In the structure of the LDPC decoder shown, the optical chip and the electrical chip adopt a planar package structure, therefore, Figures 4 to 8 In the structure of the LDPC decoder shown, both the optical chip and the electrical chip can be used. Figure 9 The 3D packaging structure shown is used to complete LDPC decoding.

[0158] Please see Figure 10 , Figure 10 This is a flowchart illustrating an LDPC decoding method provided in an embodiment of this application. This decoding method can be applied to an LDPC decoder, which includes an optical chip and an electrical chip connected together. The method includes, but is not limited to, the following steps:

[0159] S1001, Receive the bit sequence transmitted through the channel via the electronic chip.

[0160] In one possible implementation, the bit sequence is encoded according to a low-density parity-check (LDPC) code.

[0161] S1002. The first probability information is determined by the electrical chip based on the bit sequence, and the first probability information is transmitted to the optical chip through an electrical signal.

[0162] In one possible implementation, after determining the first probability information based on the bit sequence by the electrical chip, the first probability information is multiplied by a first preset coefficient by the electrical chip, and the first probability information after the multiplication operation is transmitted to the optical chip by an electrical signal.

[0163] S1003. The first probability information of the electrical signal is converted into the first probability information of the optical signal through the optical chip.

[0164] In one possible implementation, a first input optical signal is generated by a light source; and a first probability information of the optical signal is determined by adjusting the first input optical signal according to the first probability information of the electrical signal using an optical multiplier.

[0165] In one possible implementation, the first refractive index of the optical multiplier is determined based on the first probability information of the electrical signal; the first input optical signal is adjusted based on the first refractive index to determine the first probability information of the optical signal.

[0166] S1004. The first probability information of the optical signal is multiplied by the optical chip to obtain the first multiplication result.

[0167] S1005. The second probability information is obtained by updating the verification node according to the first multiplication result through the electrical chip, and the second probability information is transmitted to the optical chip through an electrical signal.

[0168] In one possible implementation, the first multiplication result is divided by a first preset coefficient, and the verification node is updated based on the first multiplication result after the division operation to obtain the second probability information. The second probability information is then transmitted to the optical chip via an electrical signal.

[0169] In one possible implementation, after the electronic chip updates the verification node based on the first multiplication result to obtain the second probability information, the second probability information is multiplied by a second preset coefficient, and the second probability information after multiplication is transmitted to the optical chip via an electrical signal.

[0170] S1006. The second probability information of the electrical signal is converted into the second probability information of the optical signal through the optical chip.

[0171] In one possible implementation, a second input optical signal is generated by a light source; and a second probability information of the optical signal is determined by adjusting the second input optical signal according to the second probability information of the electrical signal using an optical multiplier.

[0172] In one possible implementation, the second refractive index of the optical multiplier is determined based on the second probability information of the electrical signal; the second input optical signal is adjusted based on the second refractive index to determine the second probability information of the optical signal.

[0173] S1007. The second probability information of the optical signal is multiplied by the optical chip to obtain the second multiplication result.

[0174] S1008. The third probability information is obtained by updating the variable nodes based on the second multiplication result through the electronic chip.

[0175] In one possible implementation, the second multiplication result is divided by a second preset coefficient using an electronic chip, and the variable node is updated based on the second multiplication result after the division operation to obtain the third probability information.

[0176] S1009. The bit sequence decoding value is determined by the electronic chip based on the third probability information.

[0177] It should be noted that the above Figure 10 For the specific process of the LDPC decoding method and its possible implementations described above, please refer to the above. Figures 1-9 The relevant descriptions in the embodiments are not repeated here.

[0178] This application provides a computer program that includes instructions that, when executed by a processor, cause the processor to perform the aforementioned... Figure 10 The processing method flow of any one of its possible implementations.

[0179] The above are merely a few embodiments of the present invention. Those skilled in the art can make various modifications or variations to the present invention based on the disclosure in the application documents without departing from the spirit and scope of the present invention. For example, the specific shapes or structures of the various components in the accompanying drawings of the embodiments of the present invention can be adjusted according to actual application scenarios.

[0180] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0181] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0182] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0183] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially as a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital versatile discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

Claims

1. A low-density parity-check (LDPC) decoder, characterized in that, The decoder includes an optical chip and an electrical chip, which are connected together. The electrical chip is used for: The receiving channel transmits a bit sequence, which is encoded according to a low-density parity-check (LDPC) code; The first probability information is determined based on the bit sequence, and the first probability information is transmitted to the optical chip via an electrical signal; The optical chip is used for: The first probability information of the electrical signal is converted into the first probability information of the optical signal; The first probability information of the optical signal is multiplied to obtain the first multiplication result; The electrical chip is also used to update the verification node according to the first multiplication result to obtain the second probability information, and to transmit the second probability information to the optical chip through an electrical signal; The optical chip is also used for: The second probability information of the electrical signal is converted into the second probability information of the optical signal; The second probability information of the optical signal is multiplied to obtain a second multiplication result; The electrical chip is also used for: The variable nodes are updated based on the second multiplication result to obtain the third probability information; The decoding value of the bit sequence is determined based on the third probability information.

2. The decoder according to claim 1, characterized in that, The electrical chip is also used for: The first probability information is multiplied by a first preset coefficient, and the first probability information after multiplication is transmitted to the optical chip via an electrical signal. The second probability information is multiplied by a second preset coefficient, and the second probability information after multiplication is transmitted to the optical chip via an electrical signal.

3. The decoder according to claim 2, characterized in that, The electrical chip is specifically used for: Divide the first multiplication result by the first preset coefficient, and update the verification node based on the first multiplication result after the division operation to obtain the second probability information; Divide the second multiplication result by the second preset coefficient, and update the variable node according to the second multiplication result after the division operation to obtain the third probability information.

4. The decoder according to claim 1, characterized in that, The optical chip is specifically used for: The first input light signal is generated by the light source; The first probability information of the optical signal is determined by adjusting the first input optical signal according to the first probability information of the electrical signal using an optical multiplier.

5. The decoder according to claim 4, characterized in that, The optical chip is specifically used for: The first refractive index of the optical multiplier is determined based on the first probability information of the electrical signal; The first probability information of the optical signal is determined by adjusting the first input optical signal based on the first refractive index.

6. The decoder according to claim 1, characterized in that, The optical chip is specifically used for: A second input light signal is generated by a light source; The second probability information of the optical signal is determined by adjusting the second input optical signal according to the second probability information of the electrical signal using an optical multiplier.

7. The decoder according to claim 6, characterized in that, The optical chip is specifically used for: The second refractive index of the optical multiplier is determined based on the second probability information of the electrical signal; The second probability information of the optical signal is determined by adjusting the second input optical signal according to the second refractive index.

8. The decoder according to any one of claims 4 to 7, characterized in that, The optical multiplier includes one or more of the following: a Mach-Zehnder interferometer, a directional coupler, and a microring.

9. A low-density parity-check (LDPC) decoding method, characterized in that, The method is applied to an LDPC decoder, the decoder comprising an optical chip and an electrical chip, the optical chip and the electrical chip being connected together; the method includes: The electronic chip receives a bit sequence transmitted through a receiving channel, the bit sequence being encoded according to a low-density parity-check (LDPC) code; The electrical chip determines the first probability information based on the bit sequence, and transmits the first probability information to the optical chip via an electrical signal. The optical chip converts the first probability information of the electrical signal into the first probability information of the optical signal. The optical chip performs a multiplication operation on the first probability information of the optical signal to obtain a first multiplication result; The second probability information is obtained by updating the verification node based on the first multiplication result using the electrical chip, and then transmitted to the optical chip via an electrical signal. The optical chip converts the second probability information of the electrical signal into the second probability information of the optical signal. The optical chip performs a multiplication operation on the second probability information of the optical signal to obtain a second multiplication result; The third probability information is obtained by updating the variable nodes based on the second multiplication result using the electronic chip; The electronic chip determines the bit sequence decoding value based on the third probability information.

10. The method according to claim 9, characterized in that, The step of determining first probability information based on the bit sequence using the electrical chip and transmitting the first probability information to the optical chip via an electrical signal includes: After the electrical chip determines the first probability information based on the bit sequence, the first probability information is multiplied by a first preset coefficient, and the multiplied first probability information is transmitted to the optical chip via an electrical signal.

11. The method according to claim 10, characterized in that, The step of updating the verification node based on the first multiplication result using the electrical chip to obtain the second probability information, and transmitting the second probability information to the optical chip via an electrical signal, includes: The first multiplication result is divided by the first preset coefficient by the electrical chip, and the verification node is updated according to the first multiplication result after the division operation to obtain the second probability information. The second probability information is then transmitted to the optical chip via an electrical signal.

12. The method according to claim 9, characterized in that, The step of updating the verification node based on the first multiplication result using the electrical chip to obtain the second probability information, and transmitting the second probability information to the optical chip via an electrical signal, includes: After the electronic chip updates the verification node based on the first multiplication result to obtain the second probability information, the second probability information is multiplied by a second preset coefficient, and the second probability information after multiplication is transmitted to the optical chip via an electrical signal.

13. The method according to claim 12, characterized in that, The step of updating the verification node based on the second multiplication result using the electronic chip to obtain the third probability information includes: The second multiplication result is divided by the second preset coefficient by the electronic chip, and the variable node is updated according to the second multiplication result after the division operation to obtain the third probability information.

14. The method according to claim 9, characterized in that, The optical chip includes a light source and an optical multiplier. The step of converting the first probability information of the electrical signal into the first probability information of the optical signal using the optical chip includes: The first input light signal is generated by the light source; The first probability information of the optical signal is determined by adjusting the first input optical signal according to the first probability information of the electrical signal using an optical multiplier.

15. The method according to claim 14, characterized in that, The step of determining the first probability information of the optical signal by adjusting the first input optical signal based on the first probability information of the electrical signal using an optical multiplier includes: The first refractive index of the optical multiplier is determined based on the first probability information of the electrical signal; The first probability information of the optical signal is determined by adjusting the first input optical signal based on the first refractive index.

16. The method according to claim 9, characterized in that, The optical chip includes a light source and an optical multiplier. The optical chip converts the second probability information of the electrical signal into the second probability information of the optical signal, including: A second input light signal is generated by a light source; The second probability information of the optical signal is determined by adjusting the second input optical signal according to the second probability information of the electrical signal using an optical multiplier.

17. The method according to claim 16, characterized in that, The step of determining the second probability information of the optical signal by adjusting the second input optical signal based on the second probability information of the electrical signal using the optical multiplier includes: The second refractive index of the optical multiplier is determined based on the second probability information of the electrical signal; The second probability information of the optical signal is determined by adjusting the second input optical signal according to the second refractive index.

18. The method according to any one of claims 14 to 17, characterized in that, The optical multiplier includes one or more of the following: a Mach-Zehnder interferometer, a directional coupler, and a microring.

19. An electronic device, characterized in that, It includes a decoder as described in any one of claims 1 to 8, and discrete devices coupled to the decoder.

20. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method described in any one of claims 9-18.

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