Isolated transceiver package structure and packaging method

Abstract

The application discloses an isolated transceiver packaging structure and a packaging method, and the isolated transceiver packaging structure comprises a lead unit, a transceiver chip (41), a first isolation chip (42), a second isolation chip (43) and a plastic package body (7), the lead unit comprises a first base island (11), a second base island (12) and a pin (2), the front surface area of the first base island (11) is larger than that of the second base island (12), the transceiver chip (41) and the first isolation chip (42) are fixed on the front surface of the first base island (11) through an adhesive layer (5), and the second isolation chip (43) is fixed on the front surface of the second base island (12) through the adhesive layer (5). The isolated transceiver packaging structure and the packaging method can solve the problems that the existing capacitor type isolator packaging structure cannot integrate a transceiver and has low reliability.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit packaging, in particular to a capacitor isolation type transceiver packaging structure and packaging method adopting a similar SOW16 outline. BACKGROUND

[0002] RS485, CAN and I2C communication buses are widely used in the fields of intelligent manufacturing and electric vehicles. The traditional bus transceiver does not contain an isolation structure, which leads to three problems in use. Firstly, if the high voltage is connected to the external node of the communication structure, the use end circuit will be burned out and electric shock will occur. Secondly, when the communication nodes are far apart, the reference ground of each node is the local ground, which may have a large potential difference, thereby affecting normal communication. Thirdly, when the reference ground of the communication node is connected by a ground wire, the ground wire and the ground may form a loop, which will couple common-mode noise and ground loop current, causing the communication system to fail.

[0003] Therefore, it is necessary to isolate the communication interface inside and outside the node to overcome the above three problems. The general isolation method is to access the communication node circuit through a discrete isolator. This method has a large circuit area and complex circuit design. Integrating the isolator and the transceiver into the same device can reduce the circuit area and reduce the complexity of the circuit design. Capacitive isolators have high voltage resistance, high transmission rate, low transmission delay, strong anti-electromagnetic interference ability, wide operating temperature range and many other advantages. Integrating capacitive isolators and bus transceivers into one package will meet the needs of communication node isolation in emerging fields such as intelligent manufacturing and electric vehicles, and has considerable market potential. However, the existing capacitive isolator uses a packaging structure that cannot integrate the transceiver. At the same time, for SOW16 wide-body SOP16 packaging, the wide-body design provides a larger creepage distance, making the product more resistant to voltage. However, for packaging, an excessively large base island area will pose a serious risk of delamination of the plastic package, which cannot meet the requirements of product reliability in the fields of electric vehicles and intelligent manufacturing. SUMMARY

[0004] In one aspect, the purpose of the present application is to provide an isolation type transceiver packaging structure that can solve the problem of the existing capacitive isolator packaging structure that cannot integrate the transceiver and has low reliability.

[0005] In order to achieve the above object, the application provides an isolated transceiver packaging structure, which comprises a lead unit, a transceiver chip, a first isolation chip, a second isolation chip and a plastic package body, the lead unit comprises a first base island, a second base island and a pin, the first base island and the second base island are oppositely arranged, and the first base island and the second base island have a gap therebetween, the front surface area of the first base island is larger than that of the second base island, the transceiver chip and the first isolation chip are fixed on the front surface of the first base island through an adhesive layer, the second isolation chip is fixed on the front surface of the second base island through an adhesive layer, the first isolation chip and the second isolation chip are connected in series through a bonding wire, the transceiver chip is connected with the first isolation chip through a bonding wire, and the second isolation chip and the transceiver chip are both connected with the pin through a bonding wire, the first base island, the second base island, the transceiver chip, the first isolation chip and the second isolation chip are all located in the plastic package body, and the inner end of the pin is located in the plastic package body; the lead unit further comprises two connecting ribs, and the two connecting ribs are arranged on the two sides of the plastic package body respectively.

[0006] In a preferred embodiment, a first through hole is formed on the first base island and / or the second base island, the first through hole is located in the plastic package body, and the first through hole has plastic sealing material constituting the plastic package body.

[0007] In a preferred embodiment, a second through hole is formed on the pin, the second through hole is located in the plastic package body, and the second through hole has plastic sealing material constituting the plastic package body.

[0008] In a preferred embodiment, a non-through indentation is arranged on the back surface of the first base island and / or the second base island.

[0009] In a preferred embodiment, the surface of the lead unit is subjected to roughening treatment.

[0010] In a preferred embodiment, the gap width between the first base island and the second base island is 0.65-0.75 mm.

[0011] In a preferred embodiment, a pressing rib is arranged on the first base island and / or the second base island, the pressing rib is located on the side surface of the first base island or the second base island and protrudes from the first base island or the second base island.

[0012] The isolation type transceiver packaging structure provided by the application can solve the problems of the prior art, i.e., the capacitor type isolator packaging structure cannot integrate a transceiver, and the reliability is low.

[0013] In another aspect, the application further provides an isolation type transceiver packaging method, which can solve the problems of the prior art, i.e., the capacitor type isolator packaging structure cannot integrate a transceiver, and the reliability is low.

[0014] The isolation type transceiver packaging method provided by the application comprises the following steps:

[0015] S10, forming a lead frame, wherein the lead frame comprises a plurality of lead units arranged in a matrix on a frame substrate, and the lead units are the lead units of the isolation type transceiver packaging structure described above;

[0016] S20, mounting a transceiver chip on the front surface of the first base island of the lead unit, and performing pre-curing, then mounting a first isolation chip and a second isolation chip on the front surfaces of the first base island and the second base island respectively, and performing curing treatment;

[0017] S30, connecting the transceiver chip and the first isolation chip by using a bonding wire, connecting the first isolation chip and the second isolation chip by using a bonding wire, and connecting the transceiver chip and the second isolation chip with the pins of the lead unit respectively by using a bonding wire;

[0018] S40, performing plasma cleaning on the lead frame after bonding;

[0019] S50, placing the lead frame in a plastic packaging mold, and forming a plastic package by using an injection molding method;

[0020] S60, performing pin cutting, pin bending and device separation on the lead frame after plastic packaging by using a stamping method.

[0021] Preferably, in step S30, when the first isolation chip and the second isolation chip are connected by using a bonding wire, an optical detection method is used to monitor the integrity of the welding points in the bonding process.

[0022] Preferably, in step S40, the lead frame after bonding is cleaned by using plasma cleaning with argon-hydrogen mixed gas.

[0023] The isolation type transceiver packaging method provided by the application forms a lead frame comprising a plurality of lead units, each of which has a first base island and a second base island with different areas, installs a transceiver chip and a first isolation chip on the first base island, and installs a second isolation chip on the second base island, so as to realize the integration of the transceiver and the isolator in one packaging structure; meanwhile, the first isolation chip and the second isolation chip are connected in series through bonding wires to form an enhanced isolation structure, thereby improving the reliability of the isolation type transceiver packaging structure. Therefore, the isolation type transceiver packaging method provided by the application can solve the problems of the existing capacitive isolator packaging structure, such as the inability to integrate a transceiver and low reliability. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a schematic diagram (top view) of the isolation type transceiver packaging structure of the preferred embodiment provided by the application;

[0025] Figure 2 is a schematic diagram (top view) of the isolation type transceiver packaging structure of the preferred embodiment provided by the application; Figure 1 is a schematic diagram of the cross-sectional structure along the A-A direction in

[0026] Figure 3 is a schematic diagram (bottom view, not separated from the lead frame base) of the lead unit provided by the application;

[0027] BRIEF DESCRIPTION OF DRAWINGS

[0028] 11-first base island; 12-second base island; 2-lead pin; 3-continuous rib; 41-transceiver chip; 42-first isolation chip; 43-second isolation chip; 5-adhesive layer; 6-bonding wire; 7-plastic package; 81-first through hole; 82-second through hole; 83-non-through indentation; 84-pressing rib; 85-inter-pin rib. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the present application more clear and explicit, the present application is further described in detail below in combination with specific embodiments and with reference to the drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of the known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0030] The layer structure diagrams according to the embodiments of the present application are shown in the drawings. The drawings are not drawn to scale, in which some details are enlarged for the purpose of clarity, and some details can be omitted. The shapes of various regions, layers shown in the drawings, and their relative sizes and positional relationships can deviate due to manufacturing tolerances or technical limitations in practice, and regions / layers with different shapes, sizes, relative positions can be additionally designed by those skilled in the art according to actual needs.

[0031] Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0032] In the description of the present application, it should be noted that the terms "first", "second" are only for the purpose of description, and cannot be understood or implied as indicating or implying relative importance.

[0033] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0034] The isolation transceiver packaging structure and packaging method provided by the present application will be described in detail below in combination with the drawings, specific embodiments and application scenarios.

[0035] Reference Figure 1 As shown, the basic embodiment of the isolation transceiver packaging structure provided by the present application includes a lead unit, a transceiver chip 41, a first isolation chip 42, a second isolation chip 43, and a plastic package 7.

[0036] The lead unit is formed on a lead frame substrate by etching or other processes, as shown in Figure 1 、 Figure 3 As shown, the lead unit includes a first base island 11, a second base island 12, and a pin 2. The main function of the first base island 11 and the second base island 12 is to carry the chip and ensure the relative stability of the chip position during product packaging process, facilitating processing. The first base island 11 and the second base island 12 are arranged oppositely, and there is a gap between the first base island 11 and the second base island 12. The front area of the first base island 11 is larger than the front area of the second base island 12. As shown in Figure 2 As shown, the pin 2 is used to establish electrical connection inside and outside the plastic package 7, and transmit energy and signals. The number of pins 2 is determined according to the chip, for example, Figure 1 16 pins 2 are shown in

[0037] In combination with Figure 2As shown, the transceiver chip 41 and the first isolation chip 42 are fixed on the front side of the first base island 11 through the adhesive layer 5, and the second isolation chip 43 is fixed on the front side of the second base island 12 through the adhesive layer 5. The adhesive layer 5 is used to fix the transceiver chip 41, the first isolation chip 42, and the second isolation chip 43 on the base island and form an electrical connection. The material of the adhesive layer 5 can be conductive silver paste or conductive DAF.

[0038] The first isolation chip 42 and the second isolation chip 43 each contain an isolation capacitor structure. The first isolation chip 42 and the second isolation chip 43 are connected in series through the bonding wire 6 to form an enhanced isolation structure. The transceiver chip 41 is connected to the first isolation chip 42 through the bonding wire 6, and the second isolation chip 43 and the transceiver chip 41 are each connected to the pin 2 through the bonding wire 6. The bonding wire 6 is used to form an electrical connection between the pin 2 and the chip to realize the product function. The number and position of the bonding wire 6 can be changed according to the product design and functional requirements.

[0039] The first base island 11, the second base island 12, the transceiver chip 41, the first isolation chip 42, and the second isolation chip 43 are located in the plastic package 7, and the inner end of the pin 2 is located in the plastic package 7. The size of the plastic package 7 can be 10.3mmX7.5mmX2.3mm. The plastic package 7 wraps the first base island 11, the second base island 12, the transceiver chip 41, the first isolation chip 42, and the second isolation chip 43, which can provide good insulation properties, meet the isolation requirements of the product, and also isolate dust, pollution, or water vapor from the outside, providing a good environment for the normal operation of the chip and ensuring the reliability of the product.

[0040] As shown in the drawings, Figure 1 , Figure 3 In the present application, the lead unit further comprises a web 3, and the number of the web 3 is two, and the two webs 3 are arranged on the two sides of the plastic package 7. In this embodiment, by arranging the web 3 on the lead unit, the removal of the inter-pin web 85 between the pins 2 during the manufacturing process of the packaging structure is facilitated, the lead unit can be combined with the lead frame, and other processes are facilitated. Preferably, the web 3 is a ring-shaped web.

[0041] The isolation type transceiver packaging structure provided by the above basic embodiment realizes the integration of the transceiver and the isolator in one packaging structure by arranging the first base island 11 and the second base island 12 on the lead unit, and making the front area of the first base island 11 larger than the front area of the second base island 12, so that the transceiver chip 41 and the first isolation chip 42 can be simultaneously mounted on the first base island 11, and the second isolation chip 43 is mounted on the second base island 12; meanwhile, the first isolation chip 42 and the second isolation chip 43 are connected in series through the bonding wire 6, forming an enhanced isolation structure, and improving the reliability of the isolation type transceiver packaging structure.

[0042] In order to further improve the reliability of the isolation type transceiver packaging structure, in the present application, as shown in Figure 1 , a first through hole 81 is arranged on the first base island 11 and / or the second base island 12, the first through hole 81 is located in the plastic package body 7, and the first through hole 81 has plastic sealing material constituting the plastic package body 7. The number of the first through hole 81 arranged on the first base island 11 or the second base island 12 can be 2-4. In the present embodiment, by arranging the first through hole 81, the upper and lower parts of the plastic package body 7 can be connected together through the first through hole 81, so as to inhibit the relative movement trend between the plastic package body 7 and the lead 2 near the first through hole 81 due to the difference in the thermal expansion coefficient, reduce the delamination probability of the plastic package body 7 at the first base island 11 and the second base island 12, and improve the reliability of the packaging.

[0043] As shown in Figure 1 , in a preferred embodiment, four first through holes 81 are arranged on the first base island 11, one first through hole 81 is arranged at each end of the transceiver chip 41 and the first isolation chip 42 mounted on the first base island 11, two first through holes 81 are arranged on the second base island 12, and the two first through holes 81 are respectively located at the two ends of the second isolation chip 43.

[0044] Further preferably, a second through hole 82 is arranged on the lead 2 of the isolation type transceiver packaging structure, the second through hole 82 is located in the plastic package body 7, and the second through hole 82 has plastic sealing material constituting the plastic package body 7. As shown in Figure 1 , one second through hole 82 can be arranged on each lead 2. In the present embodiment, by arranging the second through hole 82 on the lead 2, the plastic package bodies 7 on the upper and lower sides of the lead 2 can be connected together, so as to reduce the delamination probability of the plastic package body 7 at the lead 2.

[0045] Referring to Figure 3As shown, in a preferred embodiment of the present invention, non-penetrating indentations 83 are provided on the back side of the first base island 11 and / or the second base island 12. The non-penetrating indentations 83 provided on the first base island 11 or the second base island 12 are preferably arranged in a matrix. By providing non-penetrating indentations 83 on the back side of the first base island 11 or the second base island 12, the encapsulant 7 and the back side of the first base island 11 or the second base island 12 can be interlocked, thereby reducing the risk of encapsulant delamination on the back side of the base island.

[0046] To further reduce the probability of delamination of the molding compound 7 due to thermal stress and improve product reliability, in a preferred embodiment of the present invention, the surface of the lead unit is roughened. For example, the surface of the lead unit, which is composed of the first base island 11, the second base island 12, the pin 2, and the connecting rib 3, is roughened. The roughening method can be brown oxidation or micro-etching. The roughened surface of the lead unit allows the surfaces of the molding compound 7 and the lead unit to mesh with each other, increasing the coefficient of friction between them, thereby reducing the probability of delamination due to thermal stress and improving product reliability.

[0047] In this invention, the gap width between the first base island 11 and the second base island 12 is preferably 0.65-0.75 mm. Setting the gap width between the first base island 11 and the second base island 12, that is, the distance between the first base island 11 and the second base island 12, to 0.65-0.75 mm can meet the withstand voltage requirements of the enhanced isolation formed by the first isolation chip 42 and the second isolation chip 43 while ensuring the size of the isolated transceiver package structure.

[0048] like Figure 1 As shown, in a further preferred embodiment of the present invention, both the first base island 11 and the second base island 12 are provided with pressing ribs 84. The pressing ribs 84 are located on the side of the first base island 11 or the second base island 12 and protrude from the first base island 11 or the second base island 12, that is, the pressing ribs 84 extend from the side of the first base island 11 or the second base island 12, but are not connected to the lead frame substrate. In this embodiment, by providing pressing ribs 84 on the first base island 11 and the second base island 12, during the bonding process, pressure plates and heating blocks can be used to clamp the pressing ribs 84, thereby avoiding base island shaking and resonance during the bonding process and improving the bonding yield.

[0049] Similar to the technical concept of the isolated transceiver packaging structure provided in the above embodiments, the present invention also provides an isolated transceiver packaging method, comprising the following steps:

[0050] S10, forming a lead frame, which includes a plurality of lead units arranged in a matrix on a frame substrate, the lead units being the lead units of the isolated transceiver package structure described in the above embodiments. The lead frame can be formed by etching, and the frame substrate can be a copper alloy frame substrate. The length of the lead frame can be 238-300 mm, the width can be 70-100 mm, and the thickness can be 0.152-0.254 mm, and 84-144 lead units can be formed therein. By using a matrix multi-row lead frame, the packaging processing efficiency can be improved. The surface of the lead frame can be roughened, and the roughening method can be brown oxidation or micro-etching.

[0051] S20, mounting the transceiver chip 41 on the front surface of the first base island 11 and performing pre-curing, then mounting the first isolation chip 42 and the second isolation chip 43 on the front surfaces of the first base island 11 and the second base island 12 respectively, and performing curing treatment, so that the transceiver chip 41, the first isolation chip 42 and the second isolation chip 43 are firmly fixed on the base island. By pre-curing the transceiver chip 41 mounted on the front surface of the first base island 11, the displacement or falling of the transceiver chip 41 during the mounting of the first isolation chip 42 and the second isolation chip 43 can be avoided, which affects the product quality and packaging yield. The pre-curing condition of the transceiver chip 41 is 145-165℃, and the holding time is 15-30 min; the curing condition is 165-185℃, and the holding time is 1-1.5 h. During pre-curing and curing, N2 protection is required in the oven.

[0052] S30, using the bonding wire 6 to connect the transceiver chip 41 and the first isolation chip 42; using the bonding wire 6 to connect the first isolation chip 42 and the second isolation chip 43; using the bonding wire 6 to connect the transceiver chip 41, the second isolation chip 43 and the pins 2 of the lead units respectively. The material of the bonding wire 6 can be gold, copper and silver alloy, etc. When using the bonding wire 6 for bonding, heat ultrasonic wire bonding is used to form electrical connection between the chips.

[0053] When connecting the transceiver chip 41, the first isolation chip 42 and the second isolation chip 43 with the bonding wire 6, the connection mode of the bonding wire 6 is to bond a metal ball on one chip pad by ball mounting process, and then perform normal wire bonding to bond two pads on the metal ball, so as to avoid damage to the chip caused by two-pad bonding. According to the product design, the above process is repeated to complete the connection of the bonding wire 6. Since the isolation capacitor structure exists, the bonding wire connected between the isolation chips cannot be grounded, and preferably, when using the bonding wire 6 to connect the first isolation chip 42 and the second isolation chip 43, an optical detection method is used to monitor the integrity of the solder joint during the bonding process.

[0054] In the use of bonding wire 6 to connect the transceiver chip 41, the second isolation chip 43 and the pin 2, the bonding wire 6 is used to connect the pads on the chip and the corresponding pin by thermal ultrasonic wire bonding. The bonding temperature is 180-220 DEG C, the ultrasonic power is 120-350 mW, the bonding time is 8-54 ms, and the bonding pressure is 0.078-0.294 N. The product quality can be monitored by electrical detection method during the bonding process.

[0055] S40, the lead frame after bonding is plasma cleaned; when the lead frame after bonding is cleaned, the plasma cleaning is preferably carried out by using argon-hydrogen mixed gas plasma cleaning. The ratio of argon and hydrogen in the argon-hydrogen mixed gas is 95:5. The mixed gas of argon and hydrogen can form plasma under the action of radio frequency electric field. The argon-hydrogen mixed gas plasma can remove and reduce the copper oxide on the surface of the lead frame to a certain extent, improve the adhesion of the plastic package and the lead frame, and improve the anti-delamination ability and reliability of the product. During the cleaning process, the flow rate of the mixed gas is 15-25 sccm, the radio frequency power is 300-500 W, and the cleaning time is 230-380 s.

[0056] S50, the lead frame is placed in a plastic sealing mold, and a plastic sealing body 7 is formed by injection molding. Specifically, the lead frame after lead bonding is placed in a plastic sealing mold, and 2 lead frames can be placed at a time. During injection molding, the mold temperature is 165-185 DEG C, the clamping pressure is 1275-1472 kN, the injection pressure is 12.8-23.5 kN, and the forming time is 80-100 s. After injection molding, the plastic sealing material needs to be cured, and the plastic sealing material curing temperature is 150-180 DEG C, and the plastic sealing material curing time is 4-8 hours.

[0057] S60, the lead frame after plastic sealing is subjected to pin cutting, pin bending and device separation by stamping method. Referring to Figure 3 Therefore, the pin cutting is to cut off the middle pin 85 of the fixed pin 2 on the lead frame. After cutting the pin, the pin is bent into the required shape in a special forming mold. After the pin is formed, the connecting rib 3 on the left and right sides of the lead unit is broken, so that the device is separated from the lead frame, and the complete product is obtained.

[0058] In summary, the present application has the following beneficial effects compared with the prior art:

[0059] 1、The present application sets the first base island 11 and the second base island 12, and the area of the first base island 11 is larger than that of the second base island 12, forming an asymmetric double base island design, which solves the problem that the base island packaging structure used in the existing capacitive isolator cannot integrate the transceiver chip.

[0060] 2、The application increases the combination of the plastic package 7 and the lead unit, reduces the probability of delamination, and the product reliability can reach MSL1 (moisture sensitivity level 1) by a series of measures such as opening a through hole on the pin 2, the first base island 11 and the second base island 12, setting a non-through indentation on the back of the first base island 11 and the second base island 12, and roughening the surface of the lead unit.

[0061] 3、The application sets the pressing rib 84 on the first base island 11 and the second base island 12, which facilitates the fixture to fix the base island in the lead bonding process, reduces the bonding failure caused by the shaking and resonance of the base island, and improves the packaging yield.

[0062] 4、The application retains sufficient gap width between the base islands in the limited packaging size, and can meet the packaging requirements of the half-duplex or full-duplex isolated transceiver, which has an isolation voltage >5700V and a maximum transient voltage resistance >8000V.

[0063] The sequence of the above embodiments is only for description, and does not represent the advantages and disadvantages of the embodiments.

[0064] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the application.

Claims

1. An isolated transceiver packaging structure, characterized in that... The application relates to a lead unit, a transceiver chip (41), a first isolation chip (42), a second isolation chip (43) and a plastic sealing body (7), the lead unit comprises a first base island (11), a second base island (12) and a pin (2), the first base island (11) and the second base island (12) are oppositely arranged, a gap is arranged between the first base island (11) and the second base island (12), the front surface area of the first base island (11) is larger than that of the second base island (12), the transceiver chip (41) and the first isolation chip (42) are fixed on the front surface of the first base island (11) through an adhesive layer (5), the second isolation chip (43) is fixed on the front surface of the second base island (12) through the adhesive layer (5), the first isolation chip (42) and the second isolation chip (43) are connected in series through bonding wires (6), the transceiver chip (41) is connected with the first isolation chip (42) through the bonding wires (6), the second isolation chip (43) and the transceiver chip (41) are connected with the pin (2) through the bonding wires (6), the first base island (11), the second base island (12), the transceiver chip (41), the first isolation chip (42) and the second isolation chip (43) are located in the plastic sealing body (7), and the inner end of the pin (2) is located in the plastic sealing body (7); the lead unit further comprises webs (3), the number of the webs (3) is two, and the two webs (3) are arranged on the two sides of the plastic sealing body (7), so that the webs (85) between the pins (2) can be cut off in the packaging structure manufacturing process, the lead unit can be combined with a lead frame, and other processes can be processed and operated conveniently.

2. The isolated transceiver package structure of claim 1, wherein, A first through hole (81) is arranged on the first base island (11) and / or the second base island (12), the first through hole (81) is located in the plastic sealing body (7), and the first through hole (81) is filled with plastic sealing material constituting the plastic sealing body (7).

3. The isolated transceiver package structure of claim 1, wherein, A second through hole (82) is arranged on the pin (2), the second through hole (82) is located in the plastic sealing body (7), and the second through hole (82) is filled with plastic sealing material constituting the plastic sealing body (7).

4. The isolated transceiver package structure of claim 1, wherein, Non-penetrating indentations (83) are arranged on the back surfaces of the first base island (11) and / or the second base island (12).

5. The isolated transceiver package structure of claim 1, wherein, The surface of the lead unit is subjected to roughening treatment.

6. The isolated transceiver package structure of claim 1, wherein, The gap width between the first base island (11) and the second base island (12) is 0.65-0.75 mm.

7. The isolated transceiver package structure of claim 1, wherein, Pressing ribs (84) are arranged on the first base island (11) and the second base island (12), the pressing ribs (84) are located on the side surfaces of the first base island (11) or the second base island (12) and protrude from the first base island (11) or the second base island (12).

8. An isolated transceiver packaging method, comprising: The application further discloses a method for manufacturing the lead unit, and the method comprises the following steps: S10, a lead frame is formed, the lead frame comprises a plurality of lead units arranged in a matrix on a frame base material, and the lead unit is the lead unit of the isolation type transceiver package structure according to any one of claims 1-7. S20, mounting the transceiver chip (41) on the front surface of the first base island (11) of the lead unit, and performing pre-curing, then mounting the first isolation chip (42) and the second isolation chip (43) on the front surfaces of the first base island (11) and the second base island (12) respectively, and performing curing treatment; S30, connecting the transceiver chip (41) and the first isolation chip (42) by using the bonding wire (6); connecting the first isolation chip (42) and the second isolation chip (43) in series by using the bonding wire (6); connecting the transceiver chip (41), the second isolation chip (43) and the lead (2) of the lead unit respectively by using the bonding wire (6); S40, performing plasma cleaning on the bonded lead frame; S50, placing the lead frame in a plastic packaging mold, and forming a plastic package (7) by using injection molding method; S60, performing lead cutting, lead bending and device separation on the plastic packaged lead frame by using stamping method.

9. The isolated transceiver package method of claim 8, wherein, In step S30, when the first isolation chip (42) and the second isolation chip (43) are connected in series by using the bonding wire (6), the integrity of the welding point in the bonding process is monitored online by using optical detection method.

10. The isolated transceiver package method of claim 8, wherein, In step S40, the bonded lead frame is cleaned by using argon-hydrogen mixed gas plasma.

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