Thermal interface material structures for directing heat in three dimensions

Abstract

A thermal interface material (TIM) structure for guiding heat in a three-dimensional space including a TIM sheet (100). The TIM sheet (100) includes a lower portion (102) along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion (102) and the first side portion, the first fold positioning the first side portion substantially perpendicular to the lower portion (102); and a second fold between the first side portion and the first upper portion, positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion (102).

Description

Technical Field

[0001] The field of the invention is data processing, or more specifically, methods and systems for thermal interface material structures that direct heat in three-dimensional space. Background Art

[0002] The development of the EDVAC computer system in 1948 is often cited as the beginning of the computer age. Since that time, computer systems have evolved into extremely complex devices. Today's computers are much more complex than early systems (such as the EDVAC). Computer systems typically include a combination of hardware and software components, application programs, operating systems, processors, buses, memory, input / output devices, etc. As advances in semiconductor processing and computer architecture have driven computers to higher and higher performance, more complex computer software has evolved to take advantage of the higher performance of the hardware, resulting in today's computer systems being much more powerful than they were just a few years ago.

[0003] These advances in computer systems have led to a need for more efficient thermal management within such complex systems. In order to obtain optimal performance from certain components (particularly central and graphics processing units), heat must be removed quickly and efficiently from these components and nearby areas. However, such components are often located near other components that generate relatively less heat, which also require fast and efficient heat removal. Furthermore, to complicate matters, different components may have different load requirements to maintain an operational temperature. Summary of the invention

[0004] A thermal interface material structure for guiding heat in three-dimensional space may include: a thermal interface material (TIM) sheet, including: a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first folded portion located between the lower portion and the first side portion, positioning the first side portion to be substantially perpendicular to the lower portion; and a second folded portion between the first side portion and the first upper portion, positioning the first upper portion to be substantially perpendicular to the first side portion and substantially parallel to the lower portion.

[0005] Advantages provided by this embodiment of a thermal interface material structure for guiding heat in three-dimensional space include providing thermal interconnection between a heat exchanger and / or heat sink and components at different heights relative to a circuit board. Advantages also include providing thermal interconnection between components with different load requirements. The three-dimensional shape of the TIM sheet allows for precise placement and retention of the TIM during manufacturing. The larger surface area provides continuous heat transfer and heat diffusion. The three-dimensional TIM sheet is highly compressible, highly conductive, and provides a range of gap filling capabilities for small gaps under low loads. Finally, the TIM sheet is easy to assemble, easy to reprocess, and easy to replace. These advantages are achieved by using a single TIM sheet that is folded to provide thermal interconnection between at least two planes within a system.

[0006] In an optional embodiment, the TIM sheet may further include: a second side portion along the second side plane; a second upper portion along the upper plane; a third fold between the lower portion and the second side portion, the third fold positioning the second side portion substantially perpendicular to the lower portion; and a fourth fold between the second side portion and the second upper portion, positioning the second upper portion substantially perpendicular to the second side portion and substantially parallel to the lower portion. This provides the advantage of extending the thermal interconnect to an additional portion of the TIM sheet to another portion of the upper plane.

[0007] In an optional embodiment, the thermal interface material structure for guiding heat in three-dimensional space may further include a gap filling pad in thermal contact with the first upper portion. This provides the advantage of ensuring reliable thermal contact with components above and below the upper portion of the TIM sheet, such as a heat sink and a heat exchanger.

[0008] In an alternative embodiment, the upper portion of the TIM sheet may include additional alternating folds that create adjacent layers of the TIM sheet, or a curled upper portion. This provides the advantage of additional gap filling for different types of gaps while maintaining thermal interconnection with the TIM sheet.

[0009] A thermal interface material structure for directing heat in three-dimensional space may include a system comprising: a circuit board comprising a first component having a first load requirement and a second component having a second load requirement; a heat exchanger; and a heat sink that is in thermal contact with the first component, wherein the heat sink includes a cavity that exposes the second component; and a thermal interface material (TIM) sheet comprising: a lower portion that is located between the second first component and the heat exchanger and is in thermal contact with the second first component and the heat exchanger; a first upper portion that is positioned between the heat sink and the heat exchanger and the second component and is in thermal contact with the heat sink, the heat exchanger and the second component; and a first side portion that connects the lower portion to the first upper portion.

[0010] Advantages provided by such embodiments of thermal interface material structures for directing heat in three-dimensional space include providing thermal interconnections between heat exchangers and components at different heights relative to a circuit board. Advantages also include providing thermal interconnections between components with different load requirements. These advantages are achieved by using a single TIM sheet that is folded to provide thermal interconnections between circuit board components, heat sinks, and heat exchangers at different planes within a system.

[0011] In an optional embodiment, the system includes a heat sink positioned between and in thermal contact with the second component and the first upper portion, wherein the heat sink includes a cavity exposing the first component, and wherein the first side portion connects the lower portion to the first upper portion through the cavity in the heat sink. This provides the advantage of providing a heat spreader between the second component and the TIM sheet.

[0012] In an optional embodiment, the TIM sheet further comprises a gap filler pad between and in thermal contact with the first upper portion and the heat exchanger. This provides the advantage of ensuring reliable thermal contact with the heat sink and the heat exchanger above and below the upper portion of the TIM.

[0013] In an optional embodiment, the TIM sheet may further include a second upper portion positioned between and in thermal contact with the heat sink and the heat exchanger, and a second side portion connecting the lower portion to the second upper portion through a cavity in the heat sink. This provides the advantage of an additional portion of the TIM that extends the thermal interconnection to another portion of the upper plane between the heat sink and the heat exchanger.

[0014] In an optional embodiment, the thermal interface material structure for directing heat in three-dimensional space may further include an upper portion having additional alternating folds that create adjacent layers of the TIM sheet, or a coiled upper portion. This provides the advantage of additional gap filling for different types of gaps while maintaining thermal interconnection with the TIM sheet.

[0015] A method for forming a thermal interface material structure that conducts heat in a three-dimensional space may include: placing a TIM sheet between an upper forming tool and a lower forming tool; pressing the upper forming tool to the lower forming tool to produce a first fold and a second fold in the TIM sheet, wherein the first fold is between a lower portion of the TIM sheet and a first side portion of the TIM sheet, wherein the first fold positions the first side portion of the TIM sheet to be substantially perpendicular to the lower portion of the TIM sheet, wherein the second fold is between the first side portion of the TIM sheet and a first upper portion of the TIM sheet, and wherein the second fold positions the first upper portion of the TIM sheet to be substantially perpendicular to the first side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet.

[0016] Advantages provided by this embodiment for forming a thermal interface material structure for directing heat in three-dimensional space include forming a three-dimensional TIM sheet that provides thermal interconnections between a heat exchanger and / or heat sink and components at different heights relative to a circuit board. Advantages also include forming a TIM sheet that provides thermal interconnections between components with different load requirements. These advantages are achieved by folding a single TIM sheet to provide thermal interconnections between at least two planes within a system.

[0017] In an optional embodiment, the method for forming a thermal interface material structure that guides heat in a three-dimensional space may further include pressing an upper forming tool to a lower forming tool to compress an upper portion of the TIM sheet without compressing a lower portion of the TIM sheet. This provides the advantage of forming a three-dimensional TIM sheet without unnecessary compression and avoiding degradation of the lower portion, which can be used to thermally contact components with higher heat generation and lower load requirements.

[0018] In an optional embodiment, pressing the upper forming tool to the lower forming tool further creates a third fold and a fourth fold in the TIM sheet, wherein the third fold is between the lower portion of the TIM sheet and the second side portion of the TIM sheet, wherein the third fold positions the second side portion of the TIM sheet substantially perpendicular to the lower portion of the TIM sheet, wherein the fourth fold is between the second side portion of the TIM sheet and the second upper portion of the TIM sheet, and wherein the fourth fold positions the second upper portion of the TIM sheet substantially perpendicular to the second side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet. This provides the advantage of extending the thermal interconnect to an additional portion of the TIM sheet to another portion of the upper plane.

[0019] In an alternative embodiment, pressing the upper forming tool to the lower forming tool creates additional folds to create adjacent layers of TIM sheets adjacent and substantially parallel to the first upper portion, or the first upper portion is coiled into a roll. This provides the advantage of additional gap filling for different types of gaps while maintaining thermal interconnection with the TIM sheet.

[0020] The foregoing and other objects, features, and advantages of the present invention will become apparent from the following more particular description of exemplary embodiments of the present invention as illustrated in the accompanying drawings wherein like reference numerals generally represent like parts of exemplary embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A diagram is presented depicting an exemplary thermal interface material (TIM) sheet for directing heat in three-dimensional space in accordance with an embodiment of the present invention.

[0022] Figure 2 Figures are presented depicting an exemplary system having a TIM structure for directing heat in three-dimensional space according to embodiments of the present invention.

[0023] Figure 3 Figures are presented depicting an exemplary system having a TIM structure for directing heat in three-dimensional space according to embodiments of the present invention.

[0024] Figure 4 Diagrams are presented depicting exemplary TIM structures for guiding heat in three-dimensional space in accordance with embodiments of the present invention.

[0025] Figure 5 A diagram is presented depicting an exemplary TIM sheet for directing heat in three-dimensional space in accordance with an embodiment of the present invention.

[0026] Figure 6An exemplary system for forming a TIM sheet for directing heat in three dimensions according to an embodiment of the present invention is presented.

[0027] Figure 7 An exemplary system for forming a TIM sheet for directing heat in three dimensions according to an embodiment of the present invention is presented.

[0028] Figure 8 A flow chart is presented that illustrates an exemplary method for creating a thermal interface material structure that directs heat in three-dimensional space in accordance with an embodiment of the present invention. DETAILED DESCRIPTION

[0029] Figure 1 A diagram is provided depicting an exemplary thermal interface material (TIM) sheet for directing heat in three-dimensional space in accordance with an embodiment of the present invention. Figure 1 As shown, the TIM sheet (100) includes a lower portion (102), two upper portions (upper portion A (104A), upper portion B (104B)) and two side portions (side portion A (106A), side portion B (106B)).

[0030] The TIM sheet (100) is a single, continuous sheet of thermally conductive material. The TIM sheet can be a single material type, such as a graphite TIM sheet. Alternatively, the TIM sheet can be a composite material, such as a particle or fiber filled silicone and / or acrylate TIM sheet. In addition, the TIM sheet can be a cured or partially cured elastomeric matrix filled with any number of thermally conductive materials, such as silicone. Such thermally conductive materials can include ceramic particles, such as but not limited to aluminum nitride, boron, nitride, zinc oxide, or aluminum oxide. Such thermally conductive materials can also include metal particles or metal electroplated particles, such as but not limited to aluminum, copper, silver, gold or tungsten, and particle fillers containing a range of carbon forms, including, for example, graphite flakes, carbon fibers, carbon nanotubes or crystalline diamond particles. Non-silicone elastomeric matrices with the filler arrays cited above can also be used for TIM pads. Folded TIM sheets can be produced from a polymer phase change material matrix filled with the above-mentioned particle material group. Folded TIM sheets can also be made of metals, such as but not limited to indium or aluminum-clad indium. Additionally, the TIM sheet may be compressible in that when pressure is applied to the TIM sheet, the thickness of the TIM sheet may be reduced.

[0031] like Figure 1As shown, the lower portion (102) of the TIM sheet is along a lower plane. The side portions (side portion A (106A), side portion B (106B)) are along two sides that are substantially parallel to each other. The fold between the lower portion (102) and the side portions (side portion A (106A), side portion B (106B)) positions the side portions (side portion A (106A), side portion B (106B)) substantially perpendicular to the lower portion (102) and substantially parallel to the other side portion. The upper portion (upper portion A (104A), upper portion B (104B)) is along an upper plane that is substantially parallel to the lower plane. The folded portion between the side portions (side portion A (106A), side portion B (106B)) and the upper portion (upper portion A (104A), upper portion B (104B)) positions the upper portion (upper portion A (104A), upper portion B (104B)) substantially perpendicular to the side portions (side portion A (106A), side portion B (106B)) and substantially parallel to the lower portion (102).

[0032] Embodiments including a lower portion (102), a single side portion (e.g., side portion (106A)), and a single upper portion (e.g., upper portion A (104A)) have the following advantages: using a single TIM sheet, thermal interconnection is provided between components on different planes at different working heights of the addressing hardware, while being less complex to form because only two folds of TIM material are required. Embodiments including a lower portion (102), two upper portions (upper portion A (104A), upper portion B (104B)), and two side portions (side portion A (106A), side portion B (106B)) have the following advantages: using a single TIM sheet, thermal interconnection is provided between components on multiple different planes at different working heights of the addressing hardware.

[0033] Although Figure 1 The TIM sheet (100) is shown as having four folds, each at a 90 degree angle, but other embodiments include different numbers of folds at different angles. Such embodiments may also provide a TIM sheet that thermally connects two layers in three dimensions.

[0034] Figure 2A diagram is given depicting an exemplary system having a TIM structure for directing heat in three-dimensional space according to an embodiment of the present invention. The exemplary system includes a heat exchanger (200), a TIM sheet (100), a heat sink (202), and a circuit board (204). The heat sink (202) includes a heat sink cavity (208). The circuit board (204) includes a plurality of components below the heat sink (202), including a processing unit (206) visible through the heat sink cavity (208). Although depicted as being completely surrounded by the heat sink (202), the heat sink cavity (208) may be only partially surrounded by the heat sink (202).

[0035] The circuit board (204) is a collection of electronic components that are typically connected to layers of conductive and non-conductive substrates. Some components on the circuit board (204) require or benefit from thermal contact with a heat sink. Figure 2 A heat sink (202) is shown located on top of the circuit board, and although Figure 2 Not visible in the figure, the heat sink (202) is in thermal contact with a plurality of components on the circuit board (204) either directly or via a TIM (eg, TIM sheet, TIM grease, etc.).

[0036] The heat sink (202) is a plate of thermally conductive material that transfers heat away from components on the circuit board (204) that are thermally connected to the heat sink (202) and toward the heat exchanger (200). The heat exchanger (200) is a mechanism that transfers and dissipates heat from the heat sink (202) and processing unit (206) to a fluid medium, such as a cold plate. The heat exchanger (200) can be liquid or air cooled. Figure 2 As shown, the heat exchanger may be used in conjunction with a heat sink (202). Alternatively, the heat exchanger (200) may be used without a heat sink, with the TIM sheet (100) placed between the heat exchanger (200) and components of the circuit board (204).

[0037] Different components on the circuit board (204), such as the processing unit (206), may have different heat removal and load requirements. In particular, the processing unit (206) may generate more heat than other components (not shown) on the circuit board and have smaller load requirements than other components on the circuit board (204). The cavity in the heat sink (202) brings the heat exchanger (200) closer to the processing unit (206) to more effectively remove heat from the processing unit (206). The cavity in the heat sink (202) also allows the load on the processing unit (206) to be different from the load on other components placed in thermal contact with the heat sink.

[0038] To accommodate the above-described configuration of the circuit board (204), the heat sink (202), and the heat exchanger (200), the TIM sheet (100) provides thermal interconnection between the processing unit (206), the heat sink (202), and the heat exchanger (200). The bottom of the lower portion of the TIM sheet (100) is in thermal contact with the processing unit (206). The top of the lower portion of the TIM sheet (100) is in thermal contact with the heat exchanger (200). The bottom of the upper portion of the TIM sheet (100) is in thermal contact with the heat sink (202). Finally, the top of the upper portion of the TIM sheet (100) is in thermal contact with the heat exchanger (200) (optionally, with the heat sink (202)). Figure 4 and Figure 5 and discussed in the related text). The side portions of the TIM sheet (100) provide thermal interconnections between each other portion of the TIM sheet (100) and components in thermal contact with those portions of the TIM sheet (100).

[0039] The load requirement of a component (e.g., processing unit (206)) refers to the limit (maximum or minimum) on the amount of pressure applied to the component for optimal function or to avoid negative impact on function. Since two components on circuit board (204) may have different load requirements, a single component may not be able to provide the load. Figure 2 As shown, some components of the circuit board (204) are loaded by the heat sink (202), while the processing unit (206) is loaded by the heat exchanger (200) and the TIM sheet (100). This configuration provides different load levels for different components on the circuit board (204).

[0040] Figure 3 A diagram is given depicting an exemplary system having a TIM structure for directing heat in three-dimensional space according to an embodiment of the present invention. Specifically, Figure 3 Shown fully assembled Figure 2 The invention relates to an element of a heat exchanger (200) in which a TIM sheet (100) is placed between a heat exchanger (200) and a heat sink (202) attached to a circuit board (204). The heat exchanger (200) is in thermal contact with a processing unit (206) via the TIM sheet (100) and through a heat sink cavity (208).

[0041] Figure 4 A diagram is given depicting an exemplary TIM structure for guiding heat in three-dimensional space according to an embodiment of the present invention. Figure 4 As shown, the TIM structure (400) includes a lower portion (102), two upper portions (upper portion A (104A), upper portion B (104B)) and two side portions (side portion A (106A), side portion B (106B)) of the TIM sheet.

[0042] Figure 4 The TIM structure (400) further includes two gap filling pads (gap filling pad A (402A), gap filling pad B (402B)). The gap filling pads (gap filling pad A (402A), gap filling pad B (402B)) are in thermal contact with the first upper portion (upper portion A (104A), upper portion B (104B)) of the TIM sheet. The gap filling pads (gap filling pad A (402A), gap filling pad B (402B)) are located between the TIM sheet and a heat exchanger such as a cold plate. The gap filling pads (gap filling pad A (402A), gap filling pad B (402B)) can be used to create sufficient thermal contact between the upper portion (upper portion A (104A), upper portion B (104B)) of the TIM sheet and the heat exchanger. Embodiments of the TIM structure including gap-filling pads (gap-filling pad A (402A), gap-filling pad B (402B)) have the advantage of providing adjustable thermal contact points between the upper portion of the TIM sheet (upper portion A (104A), upper portion B (104B)) and the heat exchanger. The gap-filling pads (gap-filling pad A (402A), gap-filling pad B (402B)) can be made of a variety of different thermally conductive materials.

[0043] Figure 5 A diagram is given depicting an exemplary TIM sheet for guiding heat in three-dimensional space according to an embodiment of the present invention. Figure 5 As shown, the TIM sheet (100) includes a lower portion (102), two upper portions (upper portion A (104A), upper portion B (104B)) and two side portions (side portion A (106A), side portion B (106B)). Figure 5 As shown, the upper portions (upper portion A (104A), upper portion B (104B)) of the TIM sheet (500) include additional alternating folds, thereby creating adjacent layers of TIM sheet (500) above the upper portions (upper portion A (104A), upper portion B (104B)).

[0044] Embodiments that include alternating folds that create adjacent layers of a TIM sheet have the advantage of providing adjustable thermal contact points between the upper portions of the TIM sheet (upper portion A (104A), upper portion B (104B)) and the heat exchanger. Further, using the alternating folds of the TIM sheet itself as gap fillers provides a continuous thermal interconnect that effectively transfers heat from the upper portions of the TIM sheet (upper portion A (104A), upper portion B (104B)) to the heat exchanger.

[0045] In a similar embodiment, one or more upper portions (upper portion A (104A), upper portion B (104B)) of the TIM sheet may be coiled. The upper portions (upper portion A (104A), upper portion B (104B)) may be rolled into a spiral cylinder on a shaft. Embodiments including coiled upper portions have the advantage of filling cylindrical gaps that may exist between heat sinks, upper portions of TIM sheets, and heat exchangers.

[0046] Figure 6 An exemplary system for forming a TIM sheet for directing heat in three-dimensional space according to an embodiment of the present invention is presented. Figure 6 As shown, the system includes an upper forming tool (602) and a lower forming tool (604), with the TIM sheet (100) placed between the upper forming tool (602) and the lower forming tool (604). Figure 6 Depicted are a forming tool and TIM sheet (100) prior to joining and forming.

[0047] Figure 7 An exemplary system for forming a TIM sheet for directing heat in three-dimensional space according to an embodiment of the present invention is presented. Figure 7 As shown, the system includes an upper forming tool (602) and a lower forming tool (604), between which the TIM sheet (100) is pressed. Figure 7 The forming tool and TIM sheet (100) are depicted after engagement and forming. Specifically, pressing the upper forming tool (602) and the lower forming tool (604) has created a fold between the TIM lower portion (102) and the TIM side portions (side portion A (106A), side portion B (106B)), and a fold between the TIM side portions (side portion A (106A), side portion B (106B)) and the TIM upper portion (upper portion A (104A), upper portion B (104B)).

[0048] like Figure 6 As shown, pressing the upper forming tool against the lower forming tool compresses the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet. The embodiment of pressing the upper forming tool against the lower forming tool compresses the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet has the advantage of maintaining the compressible integrity of the lower portion of the TIM sheet during forming of the three-dimensional TIM sheet. Maintaining the integrity of the lower portion of the TIM sheet during forming can result in better performance of the lower portion of the TIM sheet when in thermal contact with a component that generates a large amount of heat.

[0049] The modified forming tool can be used to create an adjacent layer of TIM sheet adjacent to and substantially parallel to the upper portion of the TIM sheet (eg, Figure 5 The modified forming tool can also be used to coil the first upper portion into a roll (as shown). Figure 5 ).

[0050] Before pressing the upper forming tool to the lower forming tool, the TIM sheet may be scored along the intended folding line. Specifically, the TIM sheet may be scored between the lower portion of the TIM sheet and the first side portion of the TIM sheet, and between the first side portion of the TIM sheet and the first upper portion of the TIM sheet. Scoring the TIM sheet before folding has the advantage of accurately guiding the position of the folding portion within the TIM sheet, thereby improving the accuracy of forming the TIM sheet.

[0051] To explain further, Figure 8 A flow chart illustrating another exemplary method for forming a thermal interface material structure for guiding heat in three-dimensional space according to an embodiment of the present invention is given, which includes: a forming tool (800) placing (802) a thermal interface material (TIM) sheet between an upper forming tool and a lower forming tool; and pressing (804) the upper forming tool to the lower forming tool, thereby creating a first fold and a second fold in the TIM sheet, wherein the first fold is between a lower portion of the TIM sheet and a first side portion of the TIM sheet, wherein the first fold positions the first side portion of the TIM sheet to be substantially perpendicular to the lower portion of the TIM sheet, wherein the second fold is between the first side portion of the TIM sheet and the first upper portion of the TIM sheet, and wherein the second fold positions the first upper portion of the TIM sheet to be substantially perpendicular to the first side portion of the TIM sheet and substantially parallel to the lower portion of the TIM sheet.

[0052] Pressing the upper forming tool against the lower forming tool may compress the upper portion of the TIM sheet without compressing the lower portion of the TIM sheet. This has the advantage of maintaining the compressible integrity of the lower portion of the TIM sheet during formation of the three-dimensional TIM sheet.

[0053] It can be understood from the foregoing description that modifications and changes can be made in various embodiments of the present invention without departing from the true spirit of the present invention. The description in this specification is for illustrative purposes only and should not be interpreted as limiting. The scope of the present invention is limited only by the language of the appended claims.

Claims

1. A thermal interface material TIM structure, comprising: Thermal interface material TIM sheet, including: along the lower portion of the lower plane; a first side portion along a first side plane; a first upper portion along the upper plane; a first fold between the lower portion and the first side portion, the first fold positioning the first side portion perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion, the second fold positioning the first upper portion perpendicular to the first side portion and parallel to the lower portion; Wherein, the lower portion of the thermal interface material TIM sheet is not compressed.

2. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material TIM sheet also includes: a second side portion along a second side plane; a second upper portion along said upper plane; a third fold between the lower portion and the second side portion, positioning the second side portion perpendicular to the lower portion; and A fourth fold, between the second side portion and the second upper portion, positions the second upper portion perpendicular to the second side portion and parallel to the lower portion.

3. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material (TIM) structure also includes a gap-filling pad in thermal contact with the first upper portion.

4. The thermal interface material TIM structure according to claim 1, wherein: The first upper portion includes additional alternating folds, thereby creating adjacent layers of the thermal interface material (TIM) sheet.

5. The thermal interface material TIM structure according to claim 1, wherein: The first upper portion is coiled.

6. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material TIM sheet is compressible.

7. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material TIM sheet includes a single material or a composite material.

8. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material TIM sheet includes an elastomer matrix.

9. The thermal interface material TIM structure according to claim 1, wherein: The thermal interface material TIM sheet includes a phase change material matrix.

10. A system comprising: a circuit board including a first component having a first load requirement and a second component having a second load requirement; Heat exchangers; as well as Thermal interface materials Thermal interface materials TIM sheets, including: a lower portion positioned between and in thermal contact with the first component and the heat exchanger; a first upper portion positioned between and in thermal contact with the heat exchanger and the second component; and a first side portion connecting the lower portion to the first upper portion; Wherein, the lower portion of the thermal interface material TIM sheet is not compressed.

11. The system of claim 10, further comprising a heat sink positioned between and in thermal contact with the second component and the first upper portion, wherein: The heat sink plate includes a cavity exposing the first component, and wherein the first side portion connects the lower portion to the first upper portion through the cavity in the heat sink plate.

12. The system of claim 10, further comprising a gap filling pad between and in thermal contact with the first upper portion and the heat exchanger.

13. The system according to claim 10, wherein: The thermal interface material TIM sheet also includes: a second upper portion positioned between and in thermal contact with the heat exchanger and the second component; and A second side portion connects the lower portion to the second upper portion.

14. The system according to claim 10, wherein: The second load requirement is less than the first load requirement.

15. The system according to claim 10, wherein: The first upper portion includes alternating folds creating adjacent layers of the thermal interface material (TIM) sheet.

16. The system of claim 10, wherein: The first upper portion is coiled.

17. A method comprising: Placing a thermal interface material (TIM) sheet between an upper forming tool and a lower forming tool; as well as pressing the upper forming tool to the lower forming tool to create a first fold and a second fold in the thermal interface material (TIM) sheet, wherein the first folded portion is between the lower portion of the thermal interface material TIM sheet and the first side portion of the thermal interface material TIM sheet, wherein the first folded portion positions the first side portion of the thermal interface material TIM sheet to be perpendicular to the lower portion of the thermal interface material TIM sheet, wherein the second folded portion is between the first side portion of the thermal interface material TIM sheet and the first upper portion of the thermal interface material TIM sheet, and wherein the second folded portion positions the first upper portion of the thermal interface material TIM sheet perpendicular to the first side portion of the thermal interface material TIM sheet and parallel to the lower portion of the thermal interface material TIM sheet, wherein the upper forming tool is pressed to the lower forming tool without compressing the lower portion of the thermal interface material TIM sheet.

18. The method according to claim 17, wherein: Pressing the upper forming tool to the lower forming tool compresses the upper portion of the thermal interface material (TIM) sheet.

19. The method according to claim 17, wherein: Pressing the upper forming tool to the lower forming tool also creates a third fold and a fourth fold in the thermal interface material (TIM) sheet, wherein the third fold is between the lower portion of the thermal interface material TIM sheet and the second side portion of the thermal interface material TIM sheet, wherein the third fold positions the second side portion of the thermal interface material TIM sheet perpendicular to the lower portion of the thermal interface material TIM sheet, wherein the fourth folded portion is between the second side portion of the thermal interface material TIM sheet and the second upper portion of the thermal interface material TIM sheet, and wherein the fourth folded portion positions the second upper portion of the thermal interface material TIM sheet to be perpendicular to the second side portion of the thermal interface material TIM sheet and parallel to the lower portion of the thermal interface material TIM sheet.

20. The method according to claim 17, wherein: Pressing the upper forming tool to the lower forming tool creates additional folds, thereby creating an adjacent layer of the thermal interface material (TIM) sheet adjacent to and parallel to the first upper portion.

21. The method of claim 17, further comprising coiling the first upper portion into a roll.

22. The method of claim 17, further comprising: Before pressing the upper forming tool onto the lower forming tool: scoring the thermal interface material TIM sheet between the lower portion of the thermal interface material TIM sheet and the first side portion of the thermal interface material TIM sheet; as well as The thermal interface material (TIM) sheet is scored between the first side portion of the thermal interface material (TIM) sheet and the first upper portion of the thermal interface material (TIM) sheet.

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