Multi-channel temperature measurement device and pulsed electric field ablation equipment

Abstract

The present application belongs to the field of pulse electric field ablation technology, and particularly relates to a multi-channel temperature measuring device and a pulse electric field ablation device, wherein the multi-channel temperature measuring device includes multiple temperature measuring sub-boards and a temperature measuring motherboard, the temperature measuring motherboard is provided with a power supply circuit and multiple temperature measuring sub-board interfaces, the multiple temperature measuring sub-boards are connected to the temperature measuring motherboard through the temperature measuring sub-board interfaces, and the multiple temperature measuring sub-boards are respectively provided with multiple sub-temperature measuring circuits; the multiple temperature measuring sub-boards are mutually isolated from each other by high voltage; the multiple sub-temperature measuring circuits are respectively connected to the ablation electrode needle, for monitoring the temperature of the ablation electrode needle and outputting temperature data; the temperature measuring motherboard is respectively connected to the multiple sub-temperature measuring circuits, for receiving temperature data and sending it to the pulse electric field ablation main device to monitor the temperature of the ablation electrode needle in real time. The present application solves the technical problems of the temperature measuring circuit's high voltage resistance and the isolation of the pulse electric field ablation device between multiple channels.

Description

Technical Field

[0001] The present application belongs to the technical field of pulsed electric field ablation, and in particular relates to a multi-channel temperature measurement device and a pulsed electric field ablation device. Background Art

[0002] Pulsed electric field ablation (PEF) is a novel tissue ablation technique that has emerged in recent years. It primarily utilizes the principle of irreversible electroporation (IRE). High-voltage pulsed electric fields are applied to cells, causing irreversible perforation of the cell membrane, leading to gradual cell necrosis and ultimately achieving tissue ablation. Due to the varying electrical properties of tissues, PEF exhibits excellent tissue selectivity. For example, myocardial tissue is more sensitive to high-voltage pulsed electric fields, while neural tissue is more tolerant to pulsed electric fields. Therefore, by rationally selecting the intensity of the high-voltage pulsed electric field, selective tissue ablation can be achieved, such as for tumors located near nerves and blood vessels. In addition to this tissue selectivity, PEF is generally considered a non-thermal ablation technique, meaning that the ablation process does not generate any heat or tissue temperature rise. This eliminates the heat sink effect associated with traditional ablation methods such as radiofrequency, microwave, and cryoablation. Therefore, PEF is considered advantageous for ablating temperature-sensitive tissues, such as tumors near the gallbladder, bile duct, and esophagus.

[0003] However, pulsed electric field ablation (PFA) still generates some tissue heating during the irreversible electroporation (IRE) process. Some literature even suggests that IRE may simply be another form of thermal ablation. In particular, IRE pulse parameters (primarily pulse voltage, pulse width, and pulse interval) directly influence tissue heating and temperature rise. Tissue heating and ambient temperature also affect the ablation range, leading to problems in ablation range prediction and treatment planning. Therefore, the thermal effects of IRE are significant and can cause tissue damage, such as inflammation and denudation.

[0004] The thermal effects generated during IRE ablation can negatively impact treatment range prediction and treatment planning. When ablating tissue near vital organs (such as the gallbladder, bile duct, and esophagus), these thermal effects can have even more serious consequences, potentially putting patients in danger due to, for example, bile fistula. Monitoring and controlling tissue temperature rise during pulsed electric field ablation is crucial for treatment safety and highlighting the advantages of the non-thermal, irreversible electroporation effect. Summary of the Invention

[0005] In view of this, the embodiments of the present application provide a multi-channel temperature measurement device and a pulsed electric field ablation device, aiming to solve the technical problems of high-voltage insulation and isolation between multiple channels of the pulsed electric field ablation device under high-voltage pulse discharge and multiple temperature measurement channels, thereby improving the safety of pulsed electric field ablation treatment and having important clinical application value.

[0006] The first aspect of an embodiment of the present application provides a multi-channel temperature measurement device, which is connected to a pulsed electric field ablation main device. The pulsed electric field ablation main device includes multiple ablation electrode needles with temperature sensors, a main control unit and a high-voltage pulse generating unit. The multi-channel temperature measurement device includes: a temperature measurement motherboard and multiple temperature measurement sub-boards. The temperature measurement motherboard is provided with a power supply circuit and multiple temperature measurement sub-board interfaces. Each of the temperature measurement sub-boards is pluggably connected to the temperature measurement motherboard through the temperature measurement sub-board interface to transmit signals. Each of the temperature measurement sub-boards is provided with a sub-temperature measurement circuit. The power supply circuit is used to power each of the sub-temperature measurement circuits, and each of the temperature measurement sub-boards is electrically isolated from each other; multiple sub-temperature measurement circuits are respectively connected to the temperature sensors of the ablation electrode needles, for monitoring the temperature of the ablation electrode needles and outputting temperature data; the temperature measurement motherboard is respectively connected to each of the sub-temperature measurement circuits, for receiving the temperature data and sending it to the main control unit, so as to realize real-time monitoring of the temperature of the ablation electrode needles.

[0007] In one embodiment, the sub-temperature measurement circuit includes a temperature measurement front-end unit, a microcontroller unit, an isolation communication unit and an isolation power supply unit; the temperature measurement front-end unit is connected to the temperature measurement sensor, and is used to obtain the temperature value of the ablation electrode needle according to the output of the temperature measurement sensor and output the temperature data; the microcontroller unit is connected to the temperature measurement front-end unit, and is used to receive the temperature data, and is also used to give a cold end compensation value to the temperature measurement front-end unit to improve the measurement accuracy of the temperature measurement front-end unit; the isolation communication unit is connected to the microcontroller unit and the temperature measurement motherboard, and is used for isolated communication between the sub-temperature measurement circuit and the temperature measurement motherboard; the isolation power supply unit is connected to the temperature measurement motherboard, and is used to provide the working voltage required by the temperature measurement front-end unit, the microcontroller unit and the isolation communication unit.

[0008] In one embodiment, the temperature measurement front-end unit includes a digital temperature measurement chip, the first input pin and the second input pin of the digital temperature measurement chip are used to connect to the temperature measurement sensor, and the digital temperature measurement chip is connected to the microcontroller unit to convert the signal output by the temperature measurement sensor into the temperature data and send it to the microcontroller unit.

[0009] In one embodiment, the temperature measurement front-end unit also includes a first transient voltage suppression diode, a second transient voltage suppression diode, a first filter capacitor and a second filter capacitor; the first transient voltage suppression diode and the first filter capacitor are respectively connected in series between the first input pin and the ground, and the second transient voltage suppression diode and the second filter capacitor are respectively connected in series between the second input pin and the ground.

[0010] In one embodiment, the isolation communication unit includes a first high-voltage isolation optocoupler and a second high-voltage isolation optocoupler; the output end of the first high-voltage isolation optocoupler is connected to the microcontroller unit, and the input end of the first high-voltage isolation optocoupler is connected to the temperature measurement motherboard through the temperature measurement sub-board interface; the input end of the second high-voltage isolation optocoupler is connected to the microcontroller unit, and the output end of the second high-voltage isolation optocoupler is connected to the temperature measurement motherboard through the temperature measurement sub-board interface; the temperature measurement motherboard performs isolated communication with the sub-temperature measurement circuit through the isolation communication unit.

[0011] In one embodiment, the isolated power supply unit includes an isolated power supply chip and a first linear voltage regulator chip; the isolated power supply chip is connected to the power supply circuit of the temperature measurement motherboard, and is used to receive and output the input voltage from the temperature measurement motherboard; the first linear voltage regulator chip is used to stabilize the output voltage of the isolated power supply chip and output it to provide a first voltage source for the sub-temperature measurement circuit; the isolated power supply chip and the first linear voltage regulator chip are coupled using magnetic isolation.

[0012] In one embodiment, the isolated power supply unit further includes a second linear voltage regulator chip; the second linear voltage regulator chip is used to stabilize the output voltage of the isolated power supply chip and output it to provide a second voltage source for the sub-temperature measurement circuit.

[0013] In one embodiment, each of the temperature measuring sub-boards is provided with a temperature measuring interface, the temperature measuring interface is used to connect the sub-temperature measuring circuit with the ablation electrode needle, and the temperature measuring interface is led out through a connector; the multi-channel temperature measuring device also includes a shielding cover, which wraps up the multiple temperature measuring sub-boards and the temperature measuring mother board, and the shielding cover has multiple jacks reserved, and insulating material is provided at the jacks, and the jacks are used to lead out the interface of the temperature measuring mother board and the temperature measuring sub-board to the outside.

[0014] In one embodiment, the temperature measurement motherboard also includes a fiber optic transceiver and a fiber optic interface; the fiber optic transceiver is connected to each of the sub-temperature measurement circuits, and is used to convert the temperature data from an electrical signal into an optical signal, and transmit the temperature data to the main control unit through the fiber optic interface.

[0015] A second aspect of the embodiments of the present application provides a pulsed electric field ablation device, including the multi-channel temperature measurement device provided by the first aspect of the embodiments of the present application.

[0016] The beneficial effects of the embodiments of the present application are as follows: multiple temperature measurement sub-boards are connected to the temperature measurement motherboard via the temperature measurement sub-board interface, and multiple sub-temperature measurement circuits are respectively provided on the multiple temperature measurement sub-boards. The sub-temperature measurement circuits are used to monitor the temperature of the ablation electrode needles and output temperature data. The temperature measurement motherboard receives the temperature data and sends it to the main control unit for real-time monitoring of the temperature of the ablation electrode needles. The temperature measurement motherboard and temperature measurement sub-boards of the multi-channel temperature measurement device adopt a mother-and-child board design, which can monitor the temperature of multiple ablation electrode needles in real time. The mother-and-child board design facilitates the control and installation of the multiple temperature measurement sub-boards.

[0017] In addition to monitoring the temperature of the ablation electrode needles involved in discharge through the multi-channel isolated sub-temperature measurement circuit, the remaining temperature measurement circuit channels can also be used to monitor the temperature of the electrodes of all remaining channels at the same time, which can more sensitively monitor tissue temperature and improve the safety of tissue ablation treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 A schematic diagram of the principle of a multi-channel temperature measurement device provided in one embodiment of the present application;

[0020] Figure 2 A schematic diagram of the principle of a sub-temperature measurement circuit provided in one embodiment of the present application;

[0021] Figure 3 A schematic diagram of the circuit principle of a temperature measurement front-end unit provided in one embodiment of the present application;

[0022] Figure 4 A schematic diagram of the circuit principle of an isolated communication unit provided in one embodiment of the present application;

[0023] Figure 5 A schematic diagram of the circuit principle of an isolated power supply unit provided in one embodiment of the present application;

[0024] Figure 6 A schematic diagram of the principle of a multi-channel temperature measurement device provided in another embodiment of the present application;

[0025] Figure 7A schematic diagram of the principle of a multi-channel temperature measurement device provided in another embodiment of the present application;

[0026] Figure 8 A schematic diagram showing the principle of a multi-channel temperature measurement device provided in an embodiment of the present application provided with a shielding cover;

[0027] Figure 9 A schematic diagram illustrating the principle of insulation treatment of the jack of the shielding cover provided in one embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0029] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0030] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0032] like Figure 1As shown, the first aspect of the embodiment of the present application provides a multi-channel temperature measuring device 10, which is connected to a pulsed electric field ablation main device. The pulsed electric field ablation main device includes a plurality of ablation electrode needles with temperature sensors, a main control unit, and a high-voltage pulse generating unit. The high-voltage pulse generating unit is used to generate high-voltage pulses, and release high-voltage pulse energy through the ablation electrode needle or catheter to perform tissue ablation treatment. The temperature sensor is generally located at the tip of the ablation electrode needle or the catheter electrode. In order to prevent the high-voltage pulse energy from damaging the circuit, the temperature measuring circuit needs to be isolated at high voltage, and the isolation voltage needs to reach several thousand volts. The multi-channel temperature measuring device 10 includes a temperature measuring motherboard 100 and a plurality of temperature measuring sub-boards 200. In one embodiment, a maximum of 32 temperature measuring sub-boards 200 can be provided.

[0033] Among them, the temperature measurement motherboard 100 is provided with a power supply circuit 120 and multiple temperature measurement sub-board interfaces 110. Each temperature measurement sub-board 200 is pluggably connected to the temperature measurement motherboard 100 through the temperature measurement sub-board interface 110 to transmit signals. Each temperature measurement sub-board 200 is provided with a sub-temperature measurement circuit 210. The power supply circuit 120 is used to power each sub-temperature measurement circuit 210. The multiple temperature measurement sub-boards 200 are electrically isolated from each other by high voltage and can withstand high voltages of more than 3kV. Each sub-temperature measurement circuit 210 is connected to the temperature sensor of the ablation electrode needle, which is used to monitor the temperature of the ablation electrode needle and output temperature data. The temperature measurement motherboard 100 is connected to each sub-temperature measurement circuit 210, which is used to receive temperature data and send it to the main control unit of the pulsed electric field ablation main device to realize real-time monitoring of the temperature of the ablation electrode needle.

[0034] The multi-channel temperature measurement device 10 provided in the first aspect of the embodiment of the present application is connected to the temperature measurement motherboard 100 through a temperature measurement motherboard interface 110 via multiple temperature measurement sub-boards 200. Each temperature measurement sub-board 200 is respectively provided with multiple sub-temperature measurement circuits 210. The sub-temperature measurement circuits 210 are used to monitor the temperature of the ablation electrode needle and output temperature data. The temperature measurement motherboard 100 receives the temperature data and sends it to the main control unit to monitor the temperature of the ablation electrode needle in real time. The temperature measurement motherboard 100 and the temperature measurement sub-board 200 of the multi-channel temperature measurement device 10 adopt a mother-and-child board design, which can monitor the temperature of multiple ablation electrode needles in real time, and the mother-and-child board design facilitates the control and installation of the number of temperature measurement sub-boards 200.

[0035] In addition to monitoring the temperature of the ablation electrode needles involved in discharge through the multi-channel isolated sub-temperature measurement circuit 210, the remaining temperature measurement circuit channels can also be used to monitor the temperature of the ablation electrode needles of all remaining channels at the same time, which can more sensitively monitor tissue temperature and improve the safety of tissue ablation treatment.

[0036] See also Figure 2In one embodiment, the sub-temperature measurement circuit 210 includes a temperature measurement front-end unit 211 , a microcontroller unit 212 , an isolated communication unit 213 , and an isolated power supply unit 214 .

[0037] The temperature measurement front-end unit 211 is connected to the temperature sensor of the ablation electrode needle. The temperature measurement front-end unit 211 is used to obtain the temperature value of the ablation electrode needle according to the sensor signal output by the temperature sensor and output temperature data;

[0038] The microcontroller unit 212 is connected to the temperature measurement front-end unit 211 and is used to receive temperature data. The microcontroller unit 212 is also used to assign a cold junction compensation value to the temperature measurement front-end unit 211 to improve the measurement accuracy of the temperature measurement front-end unit 211. Cold junction compensation is achieved by measuring the ambient temperature of the pulsed electric field ablation main device and transmitting this ambient temperature to the temperature measurement motherboard 100 through the main control unit, and ultimately to each temperature measurement sub-board 200. The temperature measurement sub-board 200 assigns the cold junction compensation value to the temperature measurement front-end unit 211 through its respective microcontroller unit 212, thereby improving the temperature measurement accuracy of the temperature measurement front-end unit 211.

[0039] The isolated communication unit 213 is connected to the microcontroller unit 212 and the temperature measurement motherboard 100. The isolated communication unit 213 is used for isolated communication between the sub-temperature measurement circuit 210 and the temperature measurement motherboard 100, that is, the sub-temperature measurement circuit 210 and the temperature measurement motherboard 100 transmit communication data through the isolated communication unit 213, including the transmission of temperature data, the transmission of cold end compensation value setting information, etc., and it is an isolated communication method to prevent high voltage conduction between the sub-temperature measurement circuit 210 and the temperature measurement motherboard 100 due to the communication connection, thereby damaging the circuit.

[0040] The isolated power supply unit 214 is connected to the temperature measurement motherboard 100 and is used to provide the operating voltage required by the temperature measurement front-end unit 211, the microcontroller unit 212, and the isolated communication unit 213. The isolated power supply unit 214 uses an isolated method to achieve the power connection between the temperature measurement motherboard 100 and the sub-temperature measurement circuit 210, preventing high voltage conduction between the sub-temperature measurement circuit 210 and the temperature measurement motherboard 100 due to the power supply connection, which could damage the circuit.

[0041] See also Figure 3 In one embodiment, the temperature measurement front-end unit 211 includes a digital temperature measurement chip U4. The first input pin T-, i.e., the third pin of U4, and the second input pin T+, i.e., the fourth pin of U4, are used to connect to the temperature sensor. The digital temperature measurement chip U4 is connected to the microcontroller unit 212 using a serial peripheral interface (SPI) communication method, and is used to convert the signal output by the temperature sensor into temperature data and send it to the microcontroller unit 212. Figure 3 The SPI communication pins include pins 9, 10, 11, and 12 of the digital temperature measurement chip U4, and the SPI communication pins are used to connect to the microcontroller unit 212.

[0042] See also Figure 3 Furthermore, in one embodiment, the temperature measurement front-end unit 211 further includes a first transient voltage suppressor diode D3, a second transient voltage suppressor diode D4, a first filter capacitor C11, and a second filter capacitor C18. The first transient voltage suppressor diode D3 and the first filter capacitor C11 are respectively connected in series between the first input pin T- and ground SSGND, and the second transient voltage suppressor diode D4 and the second filter capacitor C18 are respectively connected in series between the second input pin T+ and ground SSGND. The first transient voltage suppressor diode D3 and the second transient voltage suppressor diode D4 are used to prevent transient high-voltage pulses from interfering with the normal operation of the temperature measurement circuit, thereby improving the stability of the temperature measurement front-end unit 211.

[0043] See also Figure 3 It can be understood that the input terminals TC_N and TC_P are derived from the first input pin T- and the second input pin T+, and the input terminals TC_N and TC_P serve as the input terminals of the temperature measurement front-end unit 211, receiving the sensor signal output from the temperature measurement sensor of the ablation electrode needle. Figure 3 The temperature measurement front-end unit 211 also includes a resistor R13 and a resistor R17, and the resistor R13 and the resistor R17 are used for current limiting protection.

[0044] See also Figure 4 In one embodiment, the isolated communication unit 213 includes a first high-voltage isolation optocoupler U2 and a second high-voltage isolation optocoupler U3.

[0045] The output terminal USART1_RX of the first high-voltage isolation optocoupler U2, i.e., the 4th pin of U2, is used to connect to the microcontroller unit 212. The input terminal RX of the first high-voltage isolation optocoupler U2, i.e., the 1st pin of U2, is connected to the temperature measurement motherboard 100 through the temperature measurement daughter board interface 110, or is further connected to the main control unit of the pulsed electric field ablation main device through the temperature measurement motherboard 100. The first high-voltage isolation optocoupler U2 is used for isolated communication between the temperature measurement motherboard 100 and the microcontroller unit 212. Further, see Figure 4 The second pin of the first high-voltage isolation optocoupler U2 is connected to the voltage source VCC_5V through the resistor R2, the fourth pin of the first high-voltage isolation optocoupler U2 is also connected to the voltage source SVCC_3.3V through the pull-up resistor R1, the third pin of the first high-voltage isolation optocoupler U2 is connected to the voltage source SVCC_5V, the fifth pin of the first high-voltage isolation optocoupler U2 is grounded SGND, and a capacitor C9 is also connected in series between the third and fifth pins of the first high-voltage isolation optocoupler U2.

[0046] The input terminal USART1_TX of the second high-voltage isolation optocoupler U3 is connected to the microcontroller unit 212, and the output terminal TX of the second high-voltage isolation optocoupler U3 is connected to the temperature measurement motherboard 100 through the temperature measurement daughter board interface 110, or further connected to the main control unit of the pulsed electric field ablation main device through the temperature measurement motherboard 100. The second high-voltage isolation optocoupler U3 is used for isolated communication between the temperature measurement motherboard 100 and the microcontroller unit 212. Further, see Figure 4 The second pin of the second high-voltage isolation optocoupler U3 is connected to the voltage source VCC_5V through the resistor R6 and the switch tube Q1, the fourth pin of the second high-voltage isolation optocoupler U3 is also connected to the voltage source VCC_5V through the pull-up resistor R5, the third pin of the second high-voltage isolation optocoupler U3 is connected to the voltage source VCC_5V, the fifth pin of the second high-voltage isolation optocoupler U3 is grounded GND, and a capacitor C10 is also connected in series between the third and fifth pins of the second high-voltage isolation optocoupler U3.

[0047] Furthermore, the temperature measurement motherboard 100 adopts a universal asynchronous receiver transmitter (UART) communication method, and the temperature measurement motherboard 100 performs isolated communication with the microcontroller unit 212 of the sub-temperature measurement circuit 210 through the isolated communication unit 213.

[0048] The optically isolated communication unit 213 is implemented by the first isolation optocoupler U3 and the second isolation optocoupler U4 to prevent high voltage conduction between the sub-temperature measurement circuit 210 and the temperature measurement motherboard 100 due to the communication connection, thereby preventing the circuit from being damaged.

[0049] See also Figure 5 In one embodiment, the isolated power supply unit 214 includes an isolated power supply chip IC1 and a first linear voltage regulator chip V2. The isolated power supply chip IC1 is connected to the power supply circuit 120 of the temperature measurement motherboard 100 and is configured to receive and output the input voltage, i.e., the voltage source VCC_5V, from the temperature measurement motherboard 100. The first linear voltage regulator chip V2 is configured to regulate the output voltage of the isolated power supply chip IC1 and output it to provide the first voltage source SVCC_5V to the sub-temperature measurement circuit 210. The isolated power supply chip IC1 and the first linear voltage regulator chip V2 are magnetically coupled via a magnetic isolation coupling coil T1.

[0050] See also Figure 5Specifically, the input terminals 1, 2, and 3 of the magnetic isolation coupling coil T1 are connected to the 6th, 5th, and 4th pins of the isolated power supply chip IC1, respectively. The output terminal 5 of the magnetic isolation coupling coil T1 is grounded to SGND. The output terminals 4 and 6 of the magnetic isolation coupling coil T1 are connected to the input terminal VIN of the first linear voltage regulator chip V2 through diodes D2 and D1, respectively. Diodes D2 and D1 are used to prevent reverse flow. The output voltage of the isolated power supply chip IC1 is output as a voltage source VCC_SIN through the magnetic isolation coupling coil T1. For further information, see [Referring to the reference text of the embodiment of the present invention] Figure 5 A filter capacitor C1 and a filter capacitor C2 are further provided between the input terminal VIN of the first linear voltage regulator chip V2 and the ground SGND, and a filter capacitor C6 is further provided between the output terminal VOUT of the first linear voltage regulator chip V2 and the ground SGND.

[0051] In some embodiments, the isolated power supply chip IC1 and the first linear voltage regulator chip V2 are coupled in a magnetic isolation manner using a magnetic isolation chip.

[0052] See also Figure 5 In one embodiment, the isolated power supply unit 214 further includes a second linear voltage regulator chip V1. The second linear voltage regulator chip V1 is used to stabilize the output voltage of the isolated power supply chip IC1, that is, the voltage source VCC_SIN output through the magnetic coupling coil T1, and then output it to provide a second voltage source SVCC_3.3V to the sub-temperature measurement circuit 210.

[0053] See also Figure 6 In one embodiment, the temperature measurement motherboard 100 further includes a fiber optic transceiver 130 and a fiber optic interface 140. The fiber optic transceiver 130 is connected to multiple sub-temperature measurement circuits 210 and is used to convert temperature data from electrical signals into optical signals. The temperature data is then transmitted to the main control unit via the fiber optic interface 140. Fiber optic communication offers high transmission speeds, low loss, and strong anti-interference capabilities, further enhancing the anti-interference capabilities of the multi-channel temperature measurement device 10.

[0054] See also Figure 7 In one embodiment, each temperature measurement sub-board 200 is provided with a temperature measurement interface 220, which is used to connect the sub-temperature measurement circuit 210 with the corresponding ablation electrode needle. The temperature measurement interface 220 can be led out through a connector.

[0055] See also Figure 8 The multi-channel temperature measurement device 10 further includes a shielding cover 300. The shielding cover 300 is made of, for example, metal. The shielding cover 300 wraps the multiple temperature measurement sub-boards 200 and the temperature measurement motherboard 100. The shielding cover 300 is provided with multiple jacks, which are provided with insulating materials. The jacks are used to lead out interfaces such as the temperature measurement interface 220 for connecting the temperature measurement motherboard 100 and the temperature measurement sub-board 200 to the outside. Figure 8 The figure shows a schematic diagram of a multi-channel temperature measuring device 10 wrapped with a shielding cover 300. The shielding cover 300 is used to shield the internal circuit of the multi-channel temperature measuring device 10 from external electromagnetic waves and to prevent electromagnetic waves generated inside the multi-channel temperature measuring device 10 from radiating outward.

[0056] In order to ensure the insulation and withstand voltage between the ablation electrode needle and the pulsed electric field ablation main device, an insulating material is provided at the jack to insulate the interfaces of the shielding cover 300. Figure 9 , the insulating material is wrapped around the socket, and the insulating material can be made of materials with higher breakdown voltage such as polytetrafluoroethylene and epoxy.

[0057] A second aspect of the present invention provides a pulsed electric field ablation device, comprising the multi-channel temperature measurement device 10 provided in the first aspect of the present invention. Pulsed electric field ablation utilizes ablation electrodes or catheters to release high-voltage pulse energy for tissue ablation. The multi-channel temperature measurement device 10 prevents high-voltage pulse energy from damaging temperature measurement circuits and enables high-voltage isolation of multiple temperature measurement circuits, with the isolation voltage reaching several thousand volts.

[0058] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A multi-channel temperature measurement device connected to a pulsed electric field ablation main device, wherein the pulsed electric field ablation main device comprises a plurality of ablation electrode needles with temperature sensors, a main control unit, and a high-voltage pulse generating unit, characterized in that: The temperature sensor is located at the tip of the ablation electrode needle, and the multi-channel temperature measurement device includes: A temperature measurement motherboard and multiple temperature measurement daughter boards, wherein the temperature measurement motherboard is provided with a power supply circuit and multiple temperature measurement daughter board interfaces, each of the temperature measurement daughter boards is pluggably connected to the temperature measurement motherboard through the temperature measurement daughter board interfaces to transmit signals, each of the temperature measurement daughter boards is respectively provided with a sub-temperature measurement circuit, the power supply circuit is used to power each of the sub-temperature measurement circuits, and each of the temperature measurement daughter boards is electrically isolated from each other; The plurality of sub-temperature measurement circuits are respectively connected to the temperature measurement sensors of the ablation electrode needles, and are used to monitor the temperatures of the ablation electrode needles and output temperature data; The temperature measurement motherboard is connected to each of the sub-temperature measurement circuits respectively, and is used to receive the temperature data and send it to the main control unit to achieve real-time monitoring of the temperature of the ablation electrode needle; The sub-temperature measurement circuit includes a temperature measurement front-end unit, a microcontroller unit, an isolation communication unit and an isolation power supply unit; The temperature measurement front-end unit is connected to the temperature measurement sensor, and is used to obtain the temperature value of the ablation electrode needle according to the output of the temperature measurement sensor and output the temperature data; The microcontroller unit is connected to the temperature measurement front-end unit, and is used to receive the temperature data and to provide a cold junction compensation value to the temperature measurement front-end unit to improve the measurement accuracy of the temperature measurement front-end unit; The isolation communication unit is connected to the microcontroller unit and the temperature measurement motherboard, and is used for isolation communication between the sub-temperature measurement circuit and the temperature measurement motherboard; The isolated power supply unit is connected to the temperature measurement motherboard and is used to provide the operating voltage required by the temperature measurement front-end unit, the microcontroller unit and the isolated communication unit.

2. The multi-channel temperature measuring device according to claim 1, characterized in that: The temperature measurement front-end unit includes a digital temperature measurement chip, wherein the first input pin and the second input pin of the digital temperature measurement chip are used to connect to the temperature measurement sensor. The digital temperature measurement chip is connected to the microcontroller unit and is used to convert the signal output by the temperature measurement sensor into the temperature data and send it to the microcontroller unit.

3. The multi-channel temperature measuring device according to claim 2, characterized in that: The temperature measurement front-end unit further includes a first transient voltage suppression diode, a second transient voltage suppression diode, a first filter capacitor and a second filter capacitor; The first transient voltage suppression diode and the first filter capacitor are connected in series between the first input pin and the ground, respectively. The second transient voltage suppression diode and the second filter capacitor are connected in series between the second input pin and the ground, respectively.

4. The multi-channel temperature measuring device according to claim 1, characterized in that: The isolation communication unit includes a first high-voltage isolation optocoupler and a second high-voltage isolation optocoupler; The output end of the first high-voltage isolation optocoupler is connected to the microcontroller unit, and the input end of the first high-voltage isolation optocoupler is connected to the temperature measurement motherboard through the temperature measurement daughterboard interface; The input end of the second high-voltage isolation optocoupler is connected to the microcontroller unit, and the output end of the second high-voltage isolation optocoupler is connected to the temperature measurement motherboard through the temperature measurement daughter board interface; The temperature measurement motherboard performs isolated communication with the sub-temperature measurement circuit through the isolated communication unit.

5. The multi-channel temperature measuring device according to claim 1, characterized in that: The isolated power supply unit includes an isolated power supply chip and a first linear voltage regulator chip; The isolated power supply chip is connected to the power supply circuit of the temperature measurement motherboard, and is used to receive and output the input voltage from the temperature measurement motherboard. The first linear voltage regulator chip is used to stabilize the output voltage of the isolated power supply chip and output it to provide a first voltage source for the sub-temperature measurement circuit. The isolated power supply chip and the first linear voltage regulator chip are coupled using magnetic isolation.

6. The multi-channel temperature measuring device according to claim 5, characterized in that: The isolated power supply unit further includes a second linear voltage regulator chip; The second linear voltage regulator chip is used to stabilize the output voltage of the isolation power supply chip and then output it to provide a second voltage source for the sub-temperature measurement circuit.

7. The multi-channel temperature measuring device according to any one of claims 1 to 6, characterized in that: Each of the temperature measurement sub-boards is provided with a temperature measurement interface, which is used to connect the sub-temperature measurement circuit with the ablation electrode needle, and the temperature measurement interface is led out through a connector; The multi-channel temperature measurement device also includes a shielding cover, which wraps up the multiple temperature measurement sub-boards and the temperature measurement mother board. The shielding cover is provided with multiple jacks, and insulating material is provided at the jacks. The jacks are used to lead out the interfaces of the temperature measurement mother board and the temperature measurement sub-board for connection with the outside.

8. The multi-channel temperature measuring device according to any one of claims 1 to 6, characterized in that: The temperature measurement motherboard also includes an optical fiber transceiver and an optical fiber interface; The optical fiber transceiver is connected to each of the sub-temperature measurement circuits, and is used to convert the temperature data from an electrical signal into an optical signal, and transmit the temperature data to the main control unit through the optical fiber interface.

9. A pulsed electric field ablation device, characterized in that: It comprises the multi-channel temperature measuring device according to any one of claims 1 to 8.

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