Interlocking Integrated Flexible Strain Gauge and Monitoring Method

Abstract

This invention discloses a modular integrated flexible strain gauge and its monitoring method, belonging to the field of strain measurement devices. It addresses the problems of limited deformation capacity and narrow coverage of traditional resistive strain gauges. The strain gauge includes a substrate, a sensing portion on the upper surface of the substrate, and a conducting portion. The substrate is approximately rectangular but actually octagonal, designed to prevent edge wear while allowing the modular integrated flexible strain gauge assembly to bend and deform arbitrarily. After monitoring by a specially designed circuit driving system and a specially designed microcontroller, the overall data is imported into a computer to generate contour maps for analysis. This invention provides a modular integrated flexible strain gauge and its monitoring method composed of multiple specially designed strain gauges assembled together. It solves the problem of inaccurately measuring the strain of irregular objects, large objects, and multi-instrument integrated objects.

Description

Technical Field

[0001] This invention patent belongs to the field of strain measurement devices, specifically to conductive flexible strain gauges. Background Technology

[0002] Strain gauges are elements used to measure strain, consisting of a sensitive grid and other components. Currently, strain gauges are divided into two categories: resistance strain gauges and optical strain gauges. Resistance strain gauges work based on the strain effect, which states that when a conductor or semiconductor material undergoes mechanical deformation under external force, its resistance changes accordingly; this phenomenon is called the "strain effect." Semiconductor strain gauges are made of semiconductor materials, and their working principle is based on the piezoresistive effect of semiconductor materials. The piezoresistive effect refers to the phenomenon that the resistivity of a semiconductor material changes when an external force is applied along a certain axis.

[0003] Traditional strain gauges cannot accurately measure the strain of irregular, large, or multi-instrument integrated objects. Therefore, this invention patent has developed a splicable integrated flexible strain gauge suitable for irregular, large, or multi-instrument integrated objects to solve many problems such as measurement difficulties. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a modular, integrated flexible strain gauge that offers precise measurement and broad applicability. This solves the issue of inaccurate strain measurement when measuring irregular objects, large objects, and multi-instrument integrated objects. The technical solution is as follows:

[0005] 1. The substrate is used to support the sensing part, the conducting part, and the cover layer located on the upper surface of the substrate. The sensing part and the conducting part located on the upper surface of the substrate are respectively: the sensing part is a sensitive grid, and the conducting part is a lead wire.

[0006] 2. The base is approximately rectangular, 10mm long, 10mm wide, and 2mm thick, but is actually octagonal. This is to prevent wear on the edges and corners and arbitrary bending deformation of the splicable integrated flexible strain gauge. The shape of a single strain gauge is a square with its four corners removed, so that the splicable integrated flexible strain gauge can deform in multiple directions and angles, no longer restricted to deformation in a single direction.

[0007] 3. The sensing element is a sensitive grid, which is placed parallel to the substrate and bonded to it. Leads are located within the connecting lines between each strain gauge.

[0008] 4. The top layer is a covering layer used to protect the sensing and conducting parts of the individual strain gauges.

[0009] 5. The leads are bonded parallel to the strain gauges and can pass through the connecting wires. The leads are used for signal output and communication between strain gauges. The left and right ends, and top and bottom ends of the connecting wires allow the strain gauges to be interconnected, and the leads can pass through both ends of the connecting wires. Each individual strain gauge has two horizontal connecting wires and one vertical connecting wire. The horizontal connecting wires are located at the top and bottom of the strain gauge, and the vertical connecting wire is located on the left side of the strain gauge. Neither the horizontal nor the vertical connecting wires coincide with the strain gauge.

[0010] 6. Each commonly used model of modular integrated flexible strain gauge is configured with a horizontal circuit drive and a vertical circuit drive. The horizontal circuit drive is connected to all leads on the left side of the commonly used model of modular integrated flexible strain gauge, and the vertical circuit drive is connected to all leads on the bottom side of the commonly used model of modular integrated flexible strain gauge.

[0011] 7. Data from each strain gauge is derived by leads, and the data is controlled in real time by a specially designed circuit drive system and collected by a specially designed microcontroller to accurately locate the position and strain of each strain gauge.

[0012] 8. The data is collected by the microcontroller, imported into the computer for cloud map plotting, and used for analysis. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a single strain gauge structure according to the present invention.

[0014] Figure 2 This is a schematic diagram of a single strain gauge and a covering layer of this invention.

[0015] Figure 3 This is a schematic diagram of the integration of multiple strain gauge components of this invention patent.

[0016] Figure 4 This is a common type of modular integrated flexible strain gauge assembly based on the present invention patent.

[0017] Figure 5 This is a schematic diagram of a common type of splicable integrated flexible strain gauge assembly spliced ​​with a large block substrate.

[0018] Figure 6 This is a schematic diagram of the bending deformation of a single assembly of a commonly used modular integrated flexible strain gauge according to this invention patent.

[0019] Figure 7 This is a schematic diagram of multiple sets of commonly used modular integrated flexible strain gauges according to this invention patent.

[0020] Figure 8 This is a schematic diagram of the bending deformation of multiple sets of commonly used splicable integrated flexible strain gauges according to this invention patent.

[0021] Figure 9 This is a schematic diagram of a single-unit circuit driving system for a commonly used, modular, integrated flexible strain gauge according to this invention patent.

[0022] In the diagram: 1. Substrate; 2. Lead wire; 3. Strain gauge; 4. Lateral connecting line; 5. Longitudinal connecting line; 6. Cover layer; 7. Microcontroller; 8. Lateral circuit drive system; 9. Longitudinal circuit drive system. Detailed Implementation

[0023] To enable those skilled in the art to better understand this invention, the technical solution of this invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] like Figure 1 , Figure 2 As shown, a single splicable integrated flexible strain gauge consists of a substrate 1, lead wires 2, strain gauges 3, transverse connecting lines 4, longitudinal connecting lines 5, and a cover layer 6.

[0025] 1. The rubber pad 1 is rectangular; the sensing part is the strain gauge 3;

[0026] 2. Horizontal connecting line 4, vertical connecting line 5, as shown Figure 1 , Figure 3 As shown, each strain gauge can be connected to the others, and can be combined into different shapes to correspond to different measurement environments;

[0027] 3. The leads at both ends pass horizontally through the strain gauge, and the connecting wires can pass through the leads at both ends.

[0028] 4. The strain gauge 3 is placed parallel to the substrate 1;

[0029] 5. The strain gauge 3 and the substrate 1 are bonded together by adhesive.

[0030] 6. After connection and assembly, all horizontal leads are connected to the horizontal circuit driver 8, and all vertical leads are connected to the vertical circuit driver 9. The horizontal and vertical circuit drivers are connected to the special microcontroller 7 to form a closed loop. For example... Figure 9 As shown.

[0031] 7. Data from each strain gauge is derived by leads, and the data is controlled in real time by a specially designed circuit drive system and collected by a specially designed microcontroller to accurately locate the position and strain of each strain gauge.

[0032] 8. The data is collected by the microcontroller, imported into the computer for cloud map plotting, and used for analysis.

[0033] The above provides a detailed description of the splicable integrated flexible transformer provided by this invention patent.

Claims

1. A modular, integrated flexible strain gauge, characterized in that: The substrate, the sensing portion located on the upper surface of the substrate, and the conducting portion are included. The substrate is octagonal to prevent wear of the edges and corners and arbitrary bending deformation of the splicable integrated flexible strain gauge. The sensing portion is a sensitive grid. The sensitive grid is placed parallel to the substrate and is bonded to the substrate. The top layer is a covering layer used to protect the individual strain gauge circuitry; a. Substrate: Used to support the sensing and conducting parts and the covering layer located on the upper surface of the substrate; b. The sensing and conducting parts located on the upper surface of the substrate: the sensing part is a sensitive grid, and the conducting part is a lead wire; c. Shape: The base is octagonal to prevent wear on the edges and corners, and to allow the modular integrated flexible strain gauge to be bent and deformed arbitrarily; d. Connection section: The lead wires are located in the connection lines between each strain gauge; there are two horizontal connection lines and one vertical connection line for each individual strain gauge; the horizontal connection lines are located at the top and bottom of the strain gauge, and the vertical connection line is located on the left side of the strain gauge. Neither the horizontal nor the vertical connection lines coincide with the strain gauge. e. Covering layer: Used to protect the sensing and conducting parts of an individual strain gauge; f. A single assembly of modular integrated flexible strain gauges consists of 12 × 6 strain gauges, each of which can be disassembled and reassembled into a combination shape suitable for the environment; each single assembly of modular integrated flexible strain gauges is equipped with horizontal circuit drive and vertical circuit drive. Lead wires are used for signal output and mutual conduction between strain gauges; there are two horizontal connecting wires, located above and below the strain gauge; there is one vertical connecting wire, located to the left of the strain gauge; the left and right ends and the top and bottom ends of the connecting wires can connect the strain gauges to each other, and the lead wires can pass through both ends of the connecting wires. The shape of a single strain gauge is a square with its four corners removed, in order to enable the splicable integrated flexible strain gauge to deform in multiple directions and angles, no longer restricted to deformation in a single direction.

2. The modular integrated flexible strain gauge according to claim 1, characterized in that, The base is 10mm long, 10mm wide, and 2mm thick.

3. The modular integrated flexible strain gauge according to claim 1, characterized in that, The sensitive gate and lead are located above the substrate and bonded to the substrate.

4. The modular integrated flexible strain gauge according to claim 1, characterized in that, The monitoring method is as follows: S1. Data from each strain gauge is derived by leads, and the circuit-driven system controls the data in real time. The microcontroller collects the time-controlled data to accurately locate the position and strain of each strain gauge. S2. The time control data is collected by a microcontroller, imported into a computer for cloud map drawing, and used for analysis.

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