A overlapping phase change heat sink chassis and manufacturing method thereof

Abstract

The present invention discloses an overlapping phase-change heat spreader chassis and a manufacturing method thereof, including an upper side plate, a lower side plate, a left side plate, a right side plate, a substrate, a flat heat spreader, a cover plate, an L-shaped heat spreader, an outer shell, a capillary core layer and an inner shell. The beneficial effects of the present invention are as follows: the heat spreaders used are of two types: a modular flat heat spreader and an L-shaped heat spreader. The flat heat spreader has a high thermal conductivity in the plane direction, and the L-shaped heat spreader has a high thermal conductivity in the vertical direction. Grooves are arranged on both sides of the substrate of the structural member containing the heat spreader in the heat spreader chassis, wherein the modular flat heat spreaders are embedded and placed, arranged at intervals on the front side and overlapped on the back side; and at the corners of the two heat spreader structural members in vertical contact, an L-shaped heat spreader is embedded on the inner side, and the flat heat spreader is overlapped on the back side, so as to realize the continuity of the conduction and heat dissipation channel of the phase-change heat spreader, and ensure the high thermal conductivity and heat dissipation performance of the phase-change heat spreader chassis.

Description

Technical Field

[0001] The invention relates to a chassis, in particular to an overlapped phase change heat spreader chassis and a manufacturing method thereof, belonging to the technical field of electronic equipment chassis. Background Art

[0002] Phase change vapor chamber is a highly efficient heat transfer device with high thermal conductivity, good temperature equalization performance, and reversible flow direction. Phase change vapor chamber has become one of the most effective technologies for solving the heat dissipation problem of high current density electronic devices and equipment, and has been widely used in electronic equipment chassis.

[0003] Generally speaking, a phase change vapor chamber consists of a shell, a heat absorbing core, and a steam chamber. The phase change vapor chamber contains a phase change heat transfer medium, which evaporates and absorbs heat at a certain temperature, and condenses and releases heat at a lower temperature to achieve rapid heat conduction.

[0004] The phase change heat spreader chassis in the prior art directly uses the chassis structure as the shell of the heat spreader, and performs micro-channel processing, sintering powder composite core, welding molding, filling working fluid and other processes on the chassis structure. It is also necessary to intersperse quality inspections in different processes before the heat spreader chassis can be completed. In the entire production process, the production cost and production time of the heat spreader account for most of the cost and production cycle of the heat spreader chassis. Based on this, how to reduce the production and processing cycle, process complexity, and quality control cost of the phase change heat spreader chassis has become a factor that the heat spreader chassis designer needs to consider. Summary of the invention

[0005] The purpose of the present invention is to provide a lapped phase change heat sink chassis and a manufacturing method thereof in order to solve at least one of the above technical problems.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions: a lap-jointed phase change heat sink chassis, comprising

[0007] A side panel assembly, which constitutes the main structure of the chassis and includes an upper side panel, a lower side panel, a left side panel and a right side panel which are vertically connected in pairs by welding;

[0008] Wherein, each side panel of the side panel assembly comprises:

[0009] A base plate, which is located in the middle of each side plate and has overlapping grooves on both sides;

[0010] A heat spreader, which is arranged and clamped in the overlapping grooves provided on the substrate, and includes a flat heat spreader clamped in the overlapping grooves provided on the outer side of the substrate, a flat heat spreader clamped in the overlapping grooves provided on the inner side of the substrate, and an L-shaped heat spreader;

[0011] The cover plates constitute the two side plate surfaces of each side plate of the side plate assembly, and the cover plates are respectively located on the two sides of the base plate.

[0012] As a further solution of the present invention: the heat spreader includes an outer shell and an inner shell, the inner surfaces of the outer shell and the inner shell are covered with copper powder particles and sintered to form a capillary core layer, and a phase change medium is injected between the outer shell and the inner shell.

[0013] As a further solution of the present invention: the phase change working fluid includes but is not limited to pure water, ethanol, R134a, R1233Za, the materials of the outer shell and the inner shell are copper and aluminum alloys compatible with the working fluid, and the capillary core layer includes but is not limited to grooves, powder sintering and copper mesh forms.

[0014] As a further solution of the present invention: solder paste reflow soldering is used for soldering between the temperature balancing plate of each side plate of the side plate assembly and the base plate, and between the base plate and the cover plate.

[0015] As a further solution of the present invention: at least three overlapping grooves for placing the planar heat spreader are provided on the two side surfaces of the substrate, and the overlapping grooves provided on the two side surfaces of the substrate are staggered.

[0016] As a further solution of the present invention: the L-shaped heat spreader is respectively installed at the four right angles of the upper side plate, the lower side plate, the left side plate and the right side plate, and a groove for embedding the L-shaped heat spreader is opened on the inner plate surface at the mutually perpendicular corners of the chassis structure, and a groove for embedding the flat heat spreader is opened on the outer plate surface at the corners of the chassis structure.

[0017] As a further solution of the present invention: the planar heat spreaders are arranged at intervals on both sides of the substrate and overlapped to form an L-shaped, S-shaped or U-shaped path.

[0018] As a further solution of the present invention: the cover plate includes but is not limited to a flat plate structure, and the surface of the cover plate can be processed with structures such as heat dissipation teeth, bosses and guide rails.

[0019] A lapped phase change heat sink chassis, the manufacturing method of which comprises the following steps:

[0020] Step 1: Make the heat spreader into a flat heat spreader and an L-shaped heat spreader of customized standard specifications in advance, so as to be used in the subsequent production of the phase change chassis. The flat heat spreader, the cover plate, and the L-shaped heat spreader are respectively composed of an outer shell and an inner shell, and are prepared separately; then, the inner surface of the shell is covered with copper powder particles, and sintered into a capillary core layer; the shell is welded and connected, the working fluid is injected, and the injection hole is sintered and sealed;

[0021] Step 2: The four structural parts of the upper side plate, the lower side plate, the left side plate and the right side plate of the chassis are separated into three components: a heat spreader, a base plate and a cover plate. Three or more grooves arranged in a staggered manner are opened on the plate surfaces on both sides of the base plate to embed the heat spreader, thereby ensuring the continuity of heat transfer of the heat spreader, and the base plate and the cover plate are welded together using solder paste reflow soldering;

[0022] Step 3. Use L-shaped heat spreaders at the four right angles connecting the upper side panel, lower side panel, left side panel and right side panel of the chassis. Specially, grooves are provided at the corners of the chassis structural parts that are perpendicular to each other, and the L-shaped heat spreaders are embedded in the grooves, and the module is made to fit tightly against the inner walls of the adjacent side panels. Correspondingly, since the flat heat spreaders on the inner panels of the upper side panel, lower side panel, left side panel and right side panel are arranged in an array at intervals, there will be intervals between the L-shaped heat spreaders, so that the heat conduction of the heat spreader at this location is not continuous. Therefore, grooves are respectively opened at the back of the interval between the flat heat spreaders and the L-shaped heat spreaders of two intersecting vertical chassis structural parts, and the flat heat spreaders are embedded in the fitting grooves, so that the L-shaped heat spreader is overlapped with the flat phase change heat spreader on the inner panel, thereby improving the heat dissipation efficiency of the phase change heat spreader chassis in the vertical direction.

[0023] The beneficial effects of the present invention are as follows: the heat spreaders used include two types: modular flat heat spreaders and L-shaped heat spreaders. The flat heat spreaders have high thermal conductivity in the plane direction, and the L-shaped heat spreaders have high thermal conductivity in the vertical direction. Grooves are arranged on both sides of the substrate of the structural member containing the heat spreader in the heat spreader chassis, in which the modular flat heat spreaders are embedded and placed with the front sides arranged at intervals and the back sides overlapped; and at the corners of the two heat spreader structural members in vertical contact, the L-shaped heat spreaders are embedded on the inner side, and the flat heat spreaders are overlapped on the back side, so as to realize the continuity of the conduction and heat dissipation channel of the phase change heat spreader, and ensure the high thermal conductivity and heat dissipation performance of the phase change heat spreader chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of an L-shaped vapor chamber according to the present invention;

[0026] Figure 3 This is a schematic diagram of the planar heat sink structure of the present invention;

[0027] Figure 4 This is a schematic diagram of the structure of the heat spreader chassis parts of the present invention;

[0028] Figure 5 This is a schematic diagram of the overlapping structure of the planar heat sink of the present invention;

[0029] Figure 6 This is a schematic diagram of the overlapping structure of the L-shaped temperature equalizing plate of the present invention;

[0030] Figure 7 This is a schematic diagram of the installation structure at the corner of the L-shaped temperature equalizing plate of the present invention;

[0031] Figure 8 It is a schematic diagram of the heat spreader distribution installation structure of the present invention.

[0032] In the figure: 1. upper side plate, 2. lower side plate, 3. left side plate, 4. right side plate, 5. base plate, 6. flat heat spreader, 7. cover plate, 8. L-shaped heat spreader, 9. outer shell, 10. capillary core layer, 11. inner shell. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1

[0035] like Figures 1 to 8 As shown, a lap-jointed phase change heat sink chassis includes

[0036] A side panel assembly, which constitutes the main structure of the chassis, and includes an upper side panel 1, a lower side panel 2, a left side panel 3 and a right side panel 4 which are vertically connected in pairs by welding;

[0037] Wherein, each side panel of the side panel assembly comprises:

[0038] The base plate 5 is located in the middle of each side plate and has overlapping grooves on both sides;

[0039] A heat spreader, which is arranged and clamped in the overlapping grooves provided on the substrate 5, and includes a planar heat spreader 6 clamped in the overlapping grooves provided on the outer side of the substrate 5, and a planar heat spreader 6 and an L-shaped heat spreader 8 clamped in the overlapping grooves provided on the inner side of the substrate 5;

[0040] The cover plates 7 constitute the two side plate surfaces of each side plate of the side plate assembly, and the cover plates 7 are respectively located on the two sides of the base plate 5 .

[0041] In an embodiment of the present invention, the heat spreader includes an outer shell 9 and an inner shell 11, the inner surfaces of the outer shell 9 and the inner shell 11 are covered with copper powder particles and sintered to form a capillary core layer 10, and a phase change medium is injected between the outer shell 9 and the inner shell 11.

[0042] In an embodiment of the present invention, the phase change working fluid includes but is not limited to pure water, ethanol, R134a, R1233Za, the materials of the outer shell 9 and the inner shell 11 are copper and aluminum alloys compatible with the working fluid, and the capillary core layer 10 includes but is not limited to grooves, powder sintering and copper mesh forms.

[0043] In the embodiment of the present invention, solder paste reflow soldering is used between the temperature balancing plate of each side plate of the side plate assembly and the substrate 5 , and between the substrate 5 and the cover plate 7 , so as to reduce contact thermal resistance.

[0044] In the embodiment of the present invention, at least three overlapping grooves for placing the planar heat spreader 6 are provided on the two side surfaces of the substrate 5, and the overlapping grooves provided on the two side surfaces of the substrate 5 are staggered, thereby reducing the thermal transfer resistance between the array-shaped planar heat spreaders 6 on the two side surfaces of the substrate 5 and ensuring the heat transfer continuity of the planar heat spreader 6.

[0045] Embodiment 2

[0046] like Figures 1 to 8 As shown, a lap-jointed phase change heat sink chassis includes

[0047] A side panel assembly, which constitutes the main structure of the chassis, and includes an upper side panel 1, a lower side panel 2, a left side panel 3 and a right side panel 4 which are vertically connected in pairs by welding;

[0048] Wherein, each side panel of the side panel assembly comprises:

[0049] The base plate 5 is located in the middle of each side plate and has overlapping grooves on both sides;

[0050] A heat spreader, which is arranged and clamped in the overlapping grooves provided on the substrate 5, and includes a planar heat spreader 6 clamped in the overlapping grooves provided on the outer side of the substrate 5, and a planar heat spreader 6 and an L-shaped heat spreader 8 clamped in the overlapping grooves provided on the inner side of the substrate 5;

[0051] The cover plates 7 constitute the two side plate surfaces of each side plate of the side plate assembly, and the cover plates 7 are respectively located on the two sides of the base plate 5 .

[0052] In the embodiment of the present invention, the L-shaped heat spreader 8 is respectively installed at the four right angles of the upper side plate 1, the lower side plate 2, the left side plate 3 and the right side plate 4, and a groove for embedding the L-shaped heat spreader 8 is opened on the inner side plate surface at the mutually perpendicular corners of the chassis structure, and a groove for embedding the flat heat spreader 6 is opened on the outer side plate surface at the corner of the chassis structure. The flat heat spreaders 6 on the inner side plate surfaces of the upper side plate 1, the lower side plate 2, the left side plate 3 and the right side plate 4 are all arranged in an array at intervals, and there will be intervals between them and the L-shaped heat spreader 8, so that the heat conduction of the heat spreader at this location is not continuous, so grooves are opened on the outer side plate surfaces at the corners, and the flat heat spreader 6 is embedded in the fitting grooves, so that the heat spreaders on both sides are overlapped, thereby improving the heat dissipation efficiency of the phase change heat spreader chassis in the vertical direction.

[0053] In the embodiment of the present invention, the planar heat spreaders 6 are arranged at intervals on both sides of the substrate 5 and overlapped to form an L-shape, an S-shape, or a U-shape.

[0054] In the embodiment of the present invention, the cover plate 7 includes but is not limited to a flat plate structure, and the surface of the cover plate 7 can be processed with structures such as heat dissipation teeth, bosses, and guide rails.

[0055] Embodiment 3

[0056] A lapped phase change heat sink chassis, the manufacturing method of which comprises the following steps:

[0057] Step 1: Make the heat spreader into a flat heat spreader 6 and an L-shaped heat spreader 8 of custom standard specifications in advance, so as to prepare for the subsequent production of the phase change chassis. The flat heat spreader 6, the cover plate 7, and the L-shaped heat spreader 8 are respectively composed of an outer shell 9 and an inner shell 11, and are prepared separately; then, the inner surface of the shell is covered with copper powder particles, and sintered into a capillary core layer 10; the shell is welded and connected, the working medium is injected, and the injection hole is sintered and sealed;

[0058] Step 2: The four structural parts of the upper side plate 1, the lower side plate 2, the left side plate 3 and the right side plate 4 constituting the chassis are separated into three components: a heat spreader, a base plate 5 and a cover plate 7. Three or more grooves arranged in a staggered manner are provided on the two side surfaces of the base plate 5 for embedding the heat spreader to ensure the continuity of heat transfer of the heat spreader, and the base plate 5 and the cover plate 7 are welded together by solder paste reflow soldering;

[0059] Step 3. Use L-shaped heat spreader 8 at the four right angles where the upper side panel 1, lower side panel 2, left side panel 3, and right side panel 4 of the chassis are connected to each other. Grooves are specially provided at the corners of the chassis structural parts that are perpendicular to each other, and the L-shaped heat spreader 8 is embedded in the grooves, and the module is made to fit tightly against the inner walls of the two adjacent side panels. Correspondingly, since the planar heat spreaders 6 on the inner side panels of the upper side panel 1, lower side panel 2, left side panel 3, and right side panel 4 are arranged in an array at intervals, there will be intervals between the L-shaped heat spreader 8, so that the heat conduction of the heat spreader at this location is not continuous. Therefore, grooves are respectively opened at the back of the interval between the planar heat spreaders 6 and the L-shaped heat spreader 8 of two intersecting vertical chassis structural parts, and the planar heat spreader 6 is embedded in the fitting grooves, so that the L-shaped heat spreader 8 is overlapped with the flat phase change heat spreader on the inner panel surface, thereby improving the heat dissipation efficiency of the phase change heat spreader chassis in the vertical direction.

[0060] Working principle: The flat vapor chamber 6 and the L-shaped vapor chamber 8 are made into standard parts of the vapor chamber chassis, and a vapor chamber chassis with a continuous closed loop on four sides of a three-dimensional phase change conduction path is produced by embedding the vapor chamber into a substrate, overlapping the vapor chamber on both sides, and welding.

[0061] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0062] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A lap-jointed phase change heat sink chassis, characterized in that: include A side panel assembly, constituting the main structure of the chassis, and comprising an upper side panel (1), a lower side panel (2), a left side panel (3) and a right side panel (4) which are vertically connected in pairs by welding; Wherein, each side panel of the side panel assembly comprises: A base plate (5) is located in the middle of each side plate, and has overlapping grooves on both sides thereof. The two sides of the base plate (5) have at least three overlapping grooves for placing the planar heat spreader (6), and the overlapping grooves on the two sides of the base plate (5) are arranged in a staggered manner; A heat spreader is arranged and inserted into the overlapping grooves provided on the substrate (5), and comprises a planar heat spreader (6) inserted into the overlapping grooves provided on the outer side of the substrate (5), and a modular planar heat spreader (6) and an L-shaped heat spreader (8) inserted into the overlapping grooves provided on the inner side of the substrate (5); The cover plates (7) constitute the two side plate surfaces of each side plate of the side plate assembly, and the cover plates (7) are respectively located on the two sides of the base plate (5).

2. The overlapping phase change vapor chamber chassis according to claim 1, characterized in that: The heat spreader comprises an outer shell (9) and an inner shell (11); the inner surfaces of the outer shell (9) and the inner shell (11) are covered with copper powder particles and sintered to form a capillary core layer (10); and a phase change working medium is injected between the outer shell (9) and the inner shell (11).

3. The overlapping phase change vapor chamber chassis according to claim 2, characterized in that: The phase change working fluid includes, but is not limited to, pure water, ethanol, R134a, and R1233Za. The materials of the outer shell (9) and the inner shell (11) are copper or aluminum alloys that are compatible with the working fluid. The capillary core layer (10) includes, but is not limited to, grooves, powder sintering, and copper mesh forms.

4. The overlapping phase change vapor chamber chassis according to claim 1, characterized in that: Solder paste reflow soldering is used between the heat spreader and the base plate (5) of each side plate of the side plate assembly, and between the base plate (5) and the cover plate (7).

5. The overlapping phase change vapor chamber chassis according to claim 1, characterized in that: The L-shaped heat spreader (8) is respectively installed at four right angles connecting the upper side plate (1), the lower side plate (2), the left side plate (3) and the right side plate (4), and a groove for embedding the L-shaped heat spreader (8) is opened on the inner side plate surface at the corners of the mutually perpendicular chassis structural parts, and a groove for embedding the flat heat spreader (6) is opened on the outer side plate surface at the corners of the chassis structural parts.

6. The overlapping phase change vapor chamber chassis according to claim 1, characterized in that: The planar heat spreaders (6) are arranged at intervals on the two sides of the substrate (5), and the paths after being overlapped are L-shaped, S-shaped, and U-shaped.

7. The overlapping phase change vapor chamber chassis according to claim 1, characterized in that: The cover plate (7) includes but is not limited to a flat plate structure.

8. A method for manufacturing a lapped phase change vapor chamber chassis according to any one of claims 1 to 7, characterized in that: The production method comprises the following steps: Step 1: preparing a planar heat spreader (6) and an L-shaped heat spreader (8) respectively, wherein the planar heat spreader (6) and the L-shaped heat spreader (8) are composed of an outer shell (9) and an inner shell (11), and the inner surfaces of the outer shell (9) and the inner shell (11) are covered with copper powder particles and sintered into a capillary core layer (10), the shells are welded and connected, a working medium is injected, and the injection hole is sintered and sealed; Step 2: The four structural members of the upper side plate (1), the lower side plate (2), the left side plate (3) and the right side plate (4) constituting the chassis are separated into three components, namely, a heat spreader, a base plate (5) and a cover plate (7); three or more grooves arranged in a staggered manner are provided on the two side plates of the base plate (5) for embedding the heat spreader; and the base plate (5) and the cover plate (7) are welded together using solder paste reflow soldering; Step 3: Use an L-shaped heat spreader (8) at the four right angles where the upper side panel (1), the lower side panel (2), the left side panel (3), and the right side panel (4) of the chassis are connected to each other. Grooves are provided at the corners of the chassis structural parts that are perpendicular to each other, and the L-shaped heat spreader (8) is embedded in the grooves, and the module is tightly fitted to the inner walls of the two adjacent side panels. Correspondingly, since the plane heat spreaders (6) on the inner side panels of the upper side panel (1), the lower side panel (2), the left side panel (3), and the right side panel (4) are arranged in an array at intervals, there will be a gap between the L-shaped heat spreader (8), so that the heat conduction of the heat spreader at this location is not continuous. Therefore, grooves are respectively provided at the back of the gap between the plane heat spreaders (6) and the L-shaped heat spreader (8) of two intersecting vertical chassis structural parts, and the plane heat spreader (6) is embedded in the fitting grooves, so that the L-shaped heat spreader (8) and the flat phase change heat spreader on the inner panel surface are overlapped.

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