Pressure sensor device and method of manufacturing the pressure sensor device

Abstract

A pressure sensor device for measuring the pressure of a fluid comprises at least one pressure sensor arrangement, a pressure port having at least one fluid channel for connecting a volume of the fluid to be measured to the at least one pressure sensor arrangement, at least one housing element attached to the pressure port in a gas-tight manner, the at least one housing element comprising an electrical connector portion for connecting to an electrical connector module opposite the pressure port, at least one wall element comprising at least one gas-tight feedthrough of at least one signal line electrically connected to the at least one pressure sensor arrangement and attached to the at least one housing element in a gas-tight manner between the electrical connector portion and the pressure port, such that the pressure port, the at least one housing element and the at least one wall element enclose a sensor chamber which is gas-tight and EMC shielded, the at least one pressure sensor arrangement being arranged in the sensor chamber.

Description

TECHNICAL FIELD

[0001] The present invention relates to a pressure sensor device and a method for manufacturing the pressure sensor device. BACKGROUND

[0002] Pressure sensors are used for measuring pressure in a fluid. Pressure sensors and their control circuitry are sensitive to corrosion and electromagnetic interference. Pressure sensors have to be protected, in particular for industrial applications with harsh environmental conditions (e.g. with respect to temperature, corrosive environment, electromagnetic noise, vibrations, etc.).

[0003] According to DE 10 2008 054 382 A1 a pressure sensor module is known comprising a pressure sensor element fixed to a first end of a pressure connector passage. A second end of the passage is closed with a media separation diaphragm and filled with a pressure transfer fluid in the passage. A metal substrate plate fixed to the pressure connector and a cylindrical metal housing part form a space containing the pressure sensor element and exhibiting EMC (electromagnetic compatibility) shielding. The cylindrical metal housing part is molded together with an electric connector part of insulating plastic, which electric connector part also comprises electric leads into the space.

[0004] US 6,457,368 B1 shows another pressure sensor. A pressure sensor element is arranged within a hermetically referenced pressure space, which is delimited by both a sensor support welded to a metal bracket part and a metal housing. A tubular dielectric capacitor is brazed in an opening of the metal housing and electric leads providing a sensor output to an electric connector are brazed within the capacitor. The sensor support, the metal bracket part and the metal housing form an inner housing and are electrically insulated from an outer metal housing comprising a pressure connector. The sensor with the hermetically referenced pressure space exhibits corrosion resistance and EMC shielding. However, there is a need to provide a pressure sensor device with reduced manufacturing costs and with improved corrosion resistance and EMC shielding. SUMMARY

[0005] Therefore, it can be a technical object to provide an improved pressure sensor device and an improved method for manufacturing a pressure sensor device with reduced costs, improved corrosion protection and improved EMC shielding.

[0006] In one aspect of the application, a pressure sensor device for measuring a pressure of a fluid is provided, the pressure sensor device comprising: at least one pressure sensor arrangement; a pressure port having at least one fluid channel for connecting a volume of the fluid to be measured to the at least one pressure sensor arrangement; at least one housing element attached to the pressure port in a gas-tight manner, the at least one housing element comprising an electrical connector portion for connecting to an electrical connector module opposite the pressure port; at least one wall element comprising at least one gas-tight feedthrough with at least one signal line electrically connected to the at least one pressure sensor arrangement and attached to the at least one housing element in a gas-tight manner between the electrical connector portion and the pressure port, such that the pressure port, the at least one housing element and the at least one wall element enclose a gas-tight and EMC shielded sensor chamber in which the at least one pressure sensor arrangement is arranged.

[0007] The present invention provides a pressure sensor device with a sensor chamber that is hermetically sealed and EMC shielded, which protects at least one pressure sensor arrangement arranged within the sensor chamber from corrosion and electromagnetic interference. A pressure port, at least one part of the housing element and at least one wall element define the border of the sensor chamber. The wall element can for example be embodied as a carrier plate. Furthermore, the wall element is arranged between the pressure port and the electrical connector part of the housing element. This means that only a part of the housing element provides a wall for the sensor chamber. The remaining part of the housing element does not provide a wall for the sensor chamber. In this remaining part the housing element can be connected to the electrical connector module. Thus, the wall element is arranged between the electrical connector part of the housing element and the pressure port. The housing element is attached to the wall element and the pressure port in a hermetically sealed manner. This means that the connection between the wall element and the housing element is such that no fluid can enter the sensor chamber through the connection between the wall element and the housing element. Also, the connection between the housing element and the pressure port is configured such that it is hermetically sealed, i.e. no fluid can pass through the connection between the pressure port and the housing element into the sensor chamber. Furthermore, the pressure port, the housing element and the wall element are made of a material that does not allow a fluid to pass through into the sensor chamber. The pressure port, the housing element and the wall element are made of an electrically conductive material such that electrical interference is shielded from the sensor chamber. Furthermore, the wall element, the housing element and the pressure port can be arranged such that they completely enclose the sensor chamber. The pressure sensor arrangement can measure the pressure of a fluid via at least one fluid channel arranged in the pressure port. The fluid channel connects the volume comprising the fluid that shall be measured for pressure with the interior of the pressure chamber. The pressure sensor arrangement is attached to an end of the fluid channel that is arranged within the sensor chamber. The pressure sensor arrangement encloses the fluid channel such that no fluid can enter the sensor chamber through the fluid channel. The electrical signals from the pressure sensor arrangement are fed back through the at least one wall element via at least one hermetic feedthrough. The hermetic feedthrough comprises at least one signal line that extends through the wall element. The hermetic feedthrough is attached to the wall element in a hermetically sealed manner. A first end portion of the signal line that is arranged within the sensor chamber is electrically connected to the pressure sensor arrangement. A second end portion of the signal line that is outside the pressure chamber is connectable to an electrical connector module that can provide the electrical signals to provide information about the pressure in the fluid to be measured. Thus, the present invention provides a hermetically sealed and EMC shielded sensor chamber. The sensor chamber is easy to manufacture, because the hermetically sealed connections between the housing element and the wall element and between the housing element and the pressure port are easy to produce. This provides a pressure sensor device with a modular design that has reduced manufacturing costs.

[0008] The at least one lead of the hermetic feedthrough is configured to transmit at least one electrical signal from the at least one pressure sensor arrangement and to the at least one pressure sensor arrangement.

[0009] The gas-tight feedthrough can further comprise a supply line for providing a voltage or current supply for the pressure sensor device, and a ground line for grounding. The supply line can be configured in the same way as at least the signal line.

[0010] In an example, the at least one housing element can be a cylindrical housing, wherein the housing element is preferably welded to the pressure port.

[0011] By providing a cylindrical housing as a housing element, the sensor chamber can easily be formed by gas-tightly sealing a part of the cylindrical housing and the pressure port with a wall element. The cylindrical housing can easily be arranged around the pressure sensor device arranged on the pressure port. The wall element closing a part of the cylindrical housing can easily close the sensor chamber.

[0012] The housing element can preferably be welded to the pressure port. This is particularly useful if the housing element is a cylindrical housing. However, the housing element can also have other shapes and still can be welded to the pressure port.

[0013] In another example, the at least one housing element and / or the at least one wall element can be made of a stainless steel sheet, preferably manufactured by deep drawing. The at least one wall element can also be manufactured by stamping.

[0014] By manufacturing the housing element and / or the wall element from a stainless steel sheet, preferably by deep drawing, a cost-effective housing element and / or wall element with excellent EMC shielding properties can be provided.

[0015] For example, the at least one housing element and the at least one wall element can be manufactured as separate parts, wherein the at least one wall element is preferably welded to the at least one housing element.

[0016] Providing the at least one housing element and the at least one wall element as separate parts improves the modularity of the pressure sensor device and simplifies the manufacturing of the sensor chamber. Furthermore, different materials can be chosen for the wall element and the housing element.

[0017] In another example, the at least one housing element and the at least one wall element can be manufactured as one-piece parts.

[0018] If the housing element and the wall element are provided as one-piece parts, the number of components of the pressure sensor device is reduced. This reduces the manufacturing time and thus the costs of the pressure sensor device.

[0019] The at least one gas-tight feedthrough can for example be a transistor outline header attached to the at least one wall element.

[0020] Transistor outline header is a standard header widely used for mounting and / or packaging semiconductor, sensor or other microelectromechanical system (MEMS) components. They are manufactured in large quantities, making the costs relatively low. Furthermore, transistor outline headers are simple and space-saving feedthroughs for sensor output signals.

[0021] For example, the transistor outline header can preferably be made of Kovar material, which can be easily welded to stainless steel by resistance welding, for example to a wall element of a pressure sensor device.

[0022] In an example, the hermetic feedthrough can comprise a ground line which is not galvanically isolated from the hermetic feedthrough. The ground line can be electrically connected to the pressure sensor device and attached in the same way as the at least one signal line.

[0023] In another example, a single signal line of the at least two signal lines of the transistor outline header can not be galvanically isolated from the hermetic feedthrough, thus allowing an electrical ground connection.

[0024] The pressure sensor device can further comprise, for example, at least one printed circuit board arranged within the sensor chamber, wherein the printed circuit board electrically connects the at least one signal line to the at least one pressure sensor device, and wherein the first flexible printed circuit connector electrically connects the at least one pressure sensor device to the at least one printed circuit board within the sensor chamber.

[0025] The at least one printed circuit board can condition the output of the pressure sensor device for further processing. The printed circuit board provides the conditioned signal to the signal line. Thus, the signal line is electrically connected to the printed circuit board. Furthermore, the printed circuit board is electrically connected to the pressure sensor device. This means that the signal line is electrically connected to the pressure sensor device via the printed circuit board. By arranging the printed circuit board within the sensor chamber, the printed circuit board can also be protected from corrosion and electromagnetic interference.

[0026] The flexible printed circuit connector can be foldable, for example.

[0027] The at least one support component can be arranged within the sensor chamber, for example, wherein the at least one printed circuit board is attached to the at least one support component.

[0028] The support component can support the printed circuit board in the sensor chamber, such that the printed circuit board is fixed within the sensor chamber. Furthermore, the support component can arrange the printed circuit board at a predetermined position within the sensor chamber. The support component can be made of an electrically insulating material, for example a plastic material.

[0029] In an example, the at least one printed circuit board can comprise components and / or circuits for temperature compensation, signal amplification or testing, a converter, a controller and / or an electromagnetic interference (EMI) filter.

[0030] The pressure sensor device can for example further comprise at least one electrical connector module attached to the electrical connector portion, wherein the further flexible printed circuit connector electrically connects the at least one signal line to the at least one electrical connector module outside the sensor chamber.

[0031] In an example, the electrical connector module is attached to the electrical connector portion of the at least one housing element by a local deformation, for example a crimping. By connecting the electrical connector module to the at least one signal line outside the sensor chamber, for example a second end portion of the at least one signal line, using the flexible printed circuit connector, the distance between the electrical connector module and the signal line can vary. This allows for higher tolerances in the manufacturing of the components of the pressure sensor device. The flexible printed circuit connector can compensate for the tolerances of the manufactured components. Furthermore, this provides flexibility in the selected components for assembling the pressure sensor device.

[0032] Furthermore, the hermetic feedthrough can be implemented as a standard interface structure of the pressure sensor device. Different output configurations of the electrical connector module can be employed by the layout of the further flexible printed circuit connector. This can reduce assembly costs and reduce the complexity of the required compensation device.

[0033] In another aspect of the application, a method for manufacturing a pressure sensor device for measuring a pressure of a fluid is provided, wherein the method comprises at least the steps of: electrically connecting a signal line of a hermetic feedthrough of a wall element to a pressure sensor device mounted on a fluid channel of a pressure port for connecting a volume of the fluid to be measured; arranging a housing element, which is preferably a cylindrical housing, around the pressure sensor device and the wall element; and attaching the housing element to the pressure port and the wall element, respectively, in a hermetically sealed manner, preferably by welding, such that the pressure port, the housing element and the wall element encapsulate the pressure sensor device in a hermetically sealed and EMC shielded sensor chamber.

[0034] Effects and further embodiments of the method according to the application are analogous to the effects and embodiments of the pressure sensor device according to the above description. Therefore, reference is made to the above description of the pressure sensor device.

[0035] In an example, the step of "electrically connecting a signal line of a hermetic feedthrough of a wall element to a pressure sensor device" can comprise the substep of electrically connecting a first flexible printed circuit connector to the pressure sensor device inside the sensor chamber, preferably by brazing or fusion welding.

[0036] Furthermore, the step "electrically connecting the signal line of the gas-tight feedthrough of the wall element to the pressure sensor device" can for example comprise the sub-steps: mounting a printed circuit board on the support member, the printed circuit board comprising a first flexible printed circuit connector; attaching the support member to the pressure port, preferably by an adhesive.

[0037] The method can for example further comprise the steps of electrically connecting the electrical connector module to the signal line outside the sensor chamber, preferably via a further flexible printed circuit connector; and attaching the electrical connector module to the housing element such that the wall element is arranged between the electrical connector module and the pressure port. BRIEF DESCRIPTION OF DRAWINGS

[0038] Further features, details and advantages of the present application result from the wording of the claims and the following description of exemplary embodiments on the basis of the drawings. The drawings show:

[0039] Figure 1a , Figure 1b is a schematic view of a pressure sensor device;

[0040] Figures 2a-2e is a schematic view of a sub-assembly of a pressure sensor device;

[0041] Figure 3a , Figure 3b is a schematic view of a sub-assembly connected to a pressure port;

[0042] Figure 4 is a schematic view of all sub-assemblies of a pressure sensor device;

[0043] Figure 5 is a schematic view of another exemplary embodiment of a pressure sensor device; and

[0044] Figure 6 is a flow chart of a method of manufacturing a pressure sensor device. DETAILED DESCRIPTION

[0045] According to Figure 1a The entire pressure sensor device is denoted by reference numeral 10.

[0046] The pressure sensor device 10 comprises a pressure port 12, at least one housing element 14 and an electrical connector module 16.

[0047] The pressure port 12 is configured to be attached to a pressure port connector (not shown) which provides fluid communication with a fluid to be measured.

[0048] A housing element 14 is attached to the pressure port 12. The housing element 14 is shaped as a cylindrical housing and comprises an electrical connector portion 15. An electrical connector module 16 is attached to the electrical connector portion 15 of the housing element 14. The attachment of the electrical connector module 16 to the housing element 14 can be made by means of a crimping, i.e. by means of a local deformation of the electrical connector portion 15.

[0049] The electrical connector module 16 is configured to provide electrical signals from the pressure sensor device 10. Furthermore, the electrical connector module 16 can comprise an electrical cable.

[0050] Figure 1b A cross-sectional view along the longitudinal axis 13 of the pressure sensor device 10 is shown.

[0051] The pressure sensor device 10 comprises a sensor chamber 46 which is hermetically sealed and EMC shielded. The housing element 14, the pressure port 12 and the wall element 32 delimit the sensor chamber 46. In this example, the wall element 32 provides a top wall of the sensor chamber 46. The pressure port 12 provides a bottom wall of the sensor chamber 46. A portion of the housing element 14 provides a side wall surrounding the sensor chamber 46 and connects the wall element 32 to the pressure port 12. The side wall extends around the longitudinal axis 13 of the pressure sensor device 10.

[0052] The housing element 14 is attached to the pressure port 12 in a hermetically sealed manner. Furthermore, the housing element 14 is attached to the wall element 32 in a hermetically sealed manner. The attachment of the housing element 14 to the pressure port 12 and the attachment of the housing element 14 to the wall element 32 can be made by means of welding, in particular laser welding.

[0053] The wall element 32 is attached to the housing element 14 between the electrical connector portion 15 and the pressure port 12. In this example, the housing element 14 is a cylindrical housing and the wall element 32 is inserted into the cylindrical housing. The wall element 32 is attached to an inner wall of the cylindrical housing. The wall element 32 spaces the electrical connector portion 15 of the housing element 14 from a portion of the housing element 14 which is assigned to the side wall of the sensor chamber 46.

[0054] The pressure sensor arrangement 24 and the printed circuit board 26 are arranged in the sensor chamber 46. The printed circuit board 26 and the pressure sensor arrangement 24 are electrically connected to each other via a first flexible printed circuit connector 28.

[0055] The pressure sensor arrangement 24 comprises at least one pressure-sensitive element, for example a piezo-resistive sensor element or a piezo-electric sensor element. Preferably, the pressure-sensitive element is made of thin-film or thick-film technology. However, other technologies, for example MEMS sensor chip arrangements, can also be used.

[0056] The printed circuit board 26 can include signal conditioning electronics for conditioning the output of the pressure sensor device 24. The signal conditioning electronics can include components or circuits for temperature compensation, signal amplification, or testing, transducers, controllers, or EMI filters.

[0057] The pressure port 12 includes a fluid passage 18 having a first end 20 and a second end 22 opposite the first end 20. The first end 20 is configured to be connected in fluid communication with a fluid to be measured. The second end 22 is disposed inside the pressure sensor apparatus 10 in the sensor chamber 46. The pressure sensor device 24 covers and hermetically seals the second end 22.

[0058] The wall element 32 includes a hermetic feedthrough 34. The hermetic feedthrough 34 includes at least one signal line 36 extending through the wall element 32. The at least one signal line 36 of the hermetic feedthrough 34 can be connected to the hermetic feedthrough 34 in an electrically conductive manner to provide an electrical ground. Additional signal lines 36 of the hermetic feedthrough 34 can be connected to the hermetic feedthrough 34 in an electrically insulating manner.

[0059] A first end portion 38 of the signal line 36 is disposed within the sensor chamber 46. A second end portion 40 of the signal line 36 is disposed on an opposite side of the wall element 32 outside of the sensor chamber 46. The first end portion 38 is connected to the printed circuit board 26. In this example, the first end portion 38 of the signal line 36 is inserted into the electrical connector 56 of the printed circuit board 26.

[0060] The second end portion 40 of the signal line 36 is electrically connected to the electrical connector module 16 via the additional flexible printed circuit connector 42.

[0061] Figure 2a An exploded view of a first subassembly of the pressure sensor apparatus 10 is shown. The first subassembly includes the support member 30, the printed circuit 26 having the first flexible printed circuit connector 28, the hermetic feedthrough 34, and the wall element 32. Figures 2b to 2e An assembly process of the first subassembly of the pressure sensor apparatus 10 is shown.

[0062] The hermetic feedthrough 34 is configured as a transistor outline header. It is apparent that the first end portion 38 of the signal line 36 is longer than the second end portion 40 of the signal line 36. The first end portion 38 and the second end portion 40 of the signal line 36 protrude from the hermetic feedthrough 34 in opposite directions.

[0063] The wall element 32 includes an aperture 50 having a shape and size corresponding to the shape and size of the hermetic feedthrough 34. The wall element 32 further includes a flange 48 extending around the wall element 32.

[0064] The support component 30 comprises a receiving portion 31 having radial and axial bearing surfaces for the printed circuit board 26, wherein the receiving portion 31 has a size and shape corresponding to the printed circuit board 26. The receiving portion 31 is configured to receive the printed circuit board 26. Further, the support component 30 comprises an opening 33. The opening 33 has a shape allowing feeding through the first flexible printed circuit connector 26 from the printed circuit board 26.

[0065] The printed circuit board 26 comprises at least one electronic module 52 configured to condition signals from the pressure sensor device 24. Further, the printed circuit board 26 comprises an electrical connector 56 adapted to receive and connect to the first end portion 38 of the hermetic feedthrough 34.

[0066] According to Figure 2b , the hermetic feedthrough 34 is inserted into the aperture 50 and fixed therein. The connection between the hermetic feedthrough 34 and the aperture 50, e.g. by brazing or soldering, is in a gas-tight manner. One of these lines is a ground line 36’ which is not electrically isolated from the hermetic feedthrough 34.

[0067] Figure 2c The printed circuit board 26 attached to the receiving portion 31 of the support component 30 is shown. The attachment of the printed circuit board 26 can be performed by, e.g., adhesive bonding.

[0068] The first flexible printed circuit connector 28 is attached to the printed circuit board 26 with one end region. The other end region of the first flexible printed circuit connector 28 comprises an electrical connector 54.

[0069] According to Figure 2d , the first sub-assembly is assembled. The wall element 32 is arranged on the support component 30. The inner side of the flange 48 receives a portion of the support component 30. When arranging the wall element 32 on the support component 30, the first end portion 38 of the signal line 36 is connected to the electrical connector 56 of the printed circuit board 26. Further, the first flexible printed circuit connector 28 protrudes through the opening 33. Further, the support component 30 comprises a flange 35 at a side opposite to the side receiving the wall element 32.

[0070] Figure 2e Another view of the first sub-assembly is shown. The second end portion 40 of the signal line 36 protrudes away from the first sub-assembly. Further, the first flexible printed circuit connector 28 extends through the opening 33 of the support component 30.

[0071] Figure 3a and Figure 3b The connection of the first sub-assembly with the second sub-assembly is shown. The second sub-assembly comprises the pressure port 12 and the sensor device 24. The sensor device 24 is assembled on the pressure port 12 forming the second sub-assembly.

[0072] According to Figure 3a , the first flexible printed circuit connector 28 is electrically connected to the pressure sensor device 24. Figure 2e The electrical connector 54 shown in Fig. 6 is electrically connected to the electrical connector of the pressure sensor device 24. Thus, the flexible printed circuit connector 28 electrically connects the printed circuit board 26 to the pressure sensor device 24. Thus, the signal line 36 is electrically connected to the pressure sensor device 24 via the printed circuit board 26 and the flexible printed circuit connector 28. The flange 35 of the support part 30 can be attached to the corresponding receiving area 11 of the pressure port 12. The flange 35 has an outer diameter corresponding to the inner diameter of the receiving area 11.

[0073] In Figure 3b , the first subassembly is connected to the second subassembly. The support part 30 is attached to the axial end face of the pressure port 12.

[0074] Figure 4 A pressure sensor apparatus 10 is shown having a third subassembly comprising an electrical connector module 16 and a further flexible printed circuit connector 42. Furthermore, a housing element 14 is shown.

[0075] The housing element 14 is shaped as a cylindrical housing. The cylindrical housing is arranged around a support part 50 which extends around the pressure sensor device 24. The housing element 14 is attached to the pressure port 12 in a gas-tight manner. The flange 48 of the wall element 32 has an outer diameter corresponding to the inner diameter of the housing element 14. The outer diameter facing surface of the flange 48 is attached to the housing element 14 in a gas-tight manner.

[0076] The housing element 14 and the wall element 32 can be made of stainless steel. Furthermore, the housing element 14 and the wall element 32 can be produced by deep-drawing.

[0077] The attachment of the housing element 14 to the pressure port 12 and the wall element 32 can be carried out, for example, by welding.

[0078] The housing element 14, the wall element 32 and the pressure port 12 define a sensor chamber 46 which is gas-tight to the environment. Furthermore, the housing element 14, the wall element 32 and the pressure port 12 provide an EMC shielding for the sensor chamber 46.

[0079] The support part 30, the pressure sensor device, the printed circuit board, the first end portion of the signal line 36 and the first end portion of the first flexible printed circuit connector are arranged within the sensor chamber 46.

[0080] The other flexible printed circuit connector 42 is attached at one end to the second end portion 40 of the signal line 36. The opposite end of the other flexible printed circuit connector 42 comprises an electrical connector 58 configured to be connected to the electrical connector module 16. By electrically connecting the electrical connector module 16 to the second end portion 40 via the flexible printed circuit connector 42, the electrical connector 16 is electrically connected to the pressure sensor device.

[0081] Alternatively, the electrical connection between the electrical connector module 16 and the second end portion 40 can be established by soldering wires or by metallic spring elements arranged between the second end portion 40 and the electrical connector module 16.

[0082] Figure 5 Another exemplary embodiment of a pressure sensor device 10 for a gauge transmitter is shown. In this example, the wall element 32 comprises an opening 44. A microporous membrane element 45, for example Goretex, is enclosed in this opening 44. The microporous membrane element 45 allows air to enter into a sensor chamber 46, but prevents water, dust or other corrosive fluids and contaminants from entering into the sensor chamber 46. The microporous membrane element 45 can be attached to the opening 44 formed in the wall element 32, for example by adhesive bonding or welding.

[0083] Figure 6 A flow chart of a method 100 for manufacturing a pressure sensor device is shown.

[0084] The method 100 comprises a step 102, wherein a hermetically fed signal line is electrically connected to a pressure sensor device. The pressure sensor device is mounted on a fluid passage of a pressure port. The fluid passage is designed to be connected to a volume of a fluid to be measured.

[0085] In a further step 104, a housing element is arranged around the pressure sensor device and the wall element. The housing element can be slidable on the wall element. Further, the housing element can be a preferably cylindrical housing.

[0086] In a further step 106, the housing element is attached to the pressure port and the wall element. The attachment of the housing element to the wall element and the pressure port is performed in a hermetically sealed manner, preferably by welding. Further, the attachment is performed such that the housing element, the wall element and the pressure port enclose the pressure sensor device in a hermetically sealed and EMC shielded sensor chamber.

[0087] The step 102 can comprise an optional step 112, wherein a first flexible printed circuit connector is connected to the pressure sensor device arranged within the sensor chamber. The connection can be preferably performed by soldering or welding, or by using a snap lock device.

[0088] Furthermore, step 102 can comprise further optional sub-steps 114 and 116. In optional sub-step 114, the printed circuit board is mounted on the support member. The printed circuit board can comprise a first flexible printed circuit connector. In another optional sub-step 116, the support member is attached to the pressure port. The attachment of the support member to the pressure port can preferably be performed by adhesive bonding.

[0089] Method 100 can further comprise optional steps 108 and 110. In optional step 108, the electrical connector module is connected to a signal line outside the sensor chamber. The connection between the electrical connector module and the signal line outside the sensor chamber can be performed via a further flexible printed circuit connector.

[0090] According to optional step 110, the electrical connector module can be attached to the housing element such that a wall element is arranged between the electrical connector module and the pressure port. The wall element then spaces the electrical connector portion of the housing element from a portion of the housing element arranged at the sensor chamber.

[0091] The present application is not limited to any one of the above-described embodiments. The present application can be modified in various ways.

[0092] All features and advantages, including constructive details, spatial arrangements and procedural steps, which result from the claims, the description and the drawings, can be essential to the present application in itself and in various combinations.

[0093] List of reference signs

[0094] 10 pressure sensor device

[0095] 11 receiving area

[0096] 12 pressure port

[0097] 13 longitudinal axis

[0098] 14 housing element

[0099] 15 electrical connector portion

[0100] 16 electrical connector module

[0101] 18 fluid channel

[0102] 20 first end

[0103] 22 second end

[0104] 24 pressure sensor arrangement

[0105] 26 printed circuit board

[0106] 28 first flexible printed circuit connector

[0107] 30 support member

[0108] 31 receiving portion

[0109] 32 wall element

[0110] 33 opening

[0111] 34 hermetic feedthrough

[0112] 35 flange

[0113] 36 signal line

[0114] 38 first end portion

[0115] 40 second end portion

[0116] 42 another flexible printed circuit connector

[0117] 46 sensor chamber

[0118] 48 flange

[0119] 50 aperture

[0120] 52 electronic module

[0121] 54 electrical connector

[0122] 56 electrical connector

[0123] 58 electrical connector

Claims

1. A pressure sensor device for measuring the pressure of a fluid, the pressure sensor device (10) comprising: - At least one pressure sensor device (24); - Pressure port (12), the pressure port (12) having at least one fluid channel (18) for connecting the volume of the fluid to be measured to the at least one pressure sensor device (24). - At least one housing element (14) is attached to the pressure port (12) in a hermetically sealed manner, the at least one housing element (14) including an electrical connector portion (15) for connection to an electrical connector module (16) opposite to the pressure port (12). - At least one wall element (32), the at least one wall element (32) including at least one hermetically sealed feedthrough (34) of at least one signal line (36) electrically connected to the at least one pressure sensor device (24), and the at least one wall element (32) being hermetically sealed between the electrical connector portion (15) and the pressure port (12) to the at least one housing element (14), such that the pressure port (12), the at least one housing element (14) and the at least one wall element (32) form a hermetically sealed and EMC-shielded sensor chamber (46), in which the at least one pressure sensor device (24) is arranged. The at least one hermetically sealed feedthrough (34) is a transistor profile header attached to the at least one wall element (32).

2. The pressure sensor device according to claim 1, wherein, The at least one housing element (14) is a cylindrical housing, wherein the housing element (14) is welded to the pressure port (12).

3. The pressure sensor device according to claim 1 or 2, wherein, The at least one housing element (14) and / or the at least one wall element (32) are made of stainless steel sheet.

4. The pressure sensor device according to claim 3, wherein the at least one housing element (14) and / or the at least one wall element (32) are manufactured by deep drawing.

5. The pressure sensor device according to claim 1 or 2, wherein, The at least one housing element (14) and the at least one wall element (32) are manufactured as separate components, wherein the at least one wall element (32) is welded to the at least one housing element (14).

6. The pressure sensor device according to claim 1 or 2, wherein, The at least one housing element (14) and the at least one wall element (32) are manufactured as a single unit.

7. The pressure sensor device according to claim 1 or 2, wherein, The airtight feeder (34) may include a grounding wire (36') that is not electrically isolated from the airtight feeder (34).

8. The pressure sensor device according to claim 1 or 2, wherein, The pressure sensor device (10) further includes at least one printed circuit board (26) disposed within the sensor chamber (46), wherein the printed circuit board (26) electrically connects at least one signal line (36) to the at least one pressure sensor device (24), and wherein a first flexible printed circuit connector (28) electrically connects at least one pressure sensor device (24) to at least one printed circuit board (26) within the sensor chamber (46).

9. The pressure sensor device according to claim 8, wherein, At least one support member (30) is arranged inside the sensor chamber (46), wherein the at least one printed circuit board (26) is attached to the at least one support member (30).

10. The pressure sensor device according to claim 8, wherein, The at least one printed circuit board (26) includes components and / or circuits for temperature compensation, signal amplification or testing, converters, controllers and / or EMI filters.

11. The pressure sensor device according to claim 1 or 2, wherein, The pressure sensor device (10) further includes at least one electrical connector module (16) attached to the electrical connector portion (15), wherein another flexible printed circuit connector (42) electrically connects the at least one signal line (36) to at least one electrical connector module (16) outside the sensor chamber (46).

12. A method for manufacturing a pressure sensor device for measuring the pressure of a fluid, wherein, The method includes at least the following steps: - A pressure sensor device that electrically connects the signal line of the airtight feedthrough of the wall element to a fluid channel mounted on a pressure port for connecting the volume of the fluid to be measured, wherein the airtight feedthrough is a transistor profile header attached to the wall element. - A housing element, which is a cylindrical housing, is arranged around the pressure sensor device and the wall element; and - The housing element is attached to the pressure port and the wall element in an airtight manner, such that the pressure port, the housing element and the wall element encapsulate the pressure sensor device in an airtight and EMC-shielded sensor chamber; The methods also include: The electrical connector portion of the housing element is separated from the sensor compartment of the housing element by a wall element, and the electrical connector module is attached to the electrical connector portion, such that the wall element is arranged between the electrical connector module and the pressure port.

13. The method according to claim 12, wherein, The step of "electrically connecting the airtight feedthrough signal line of the wall element to the pressure sensor device" includes the following sub-steps: - Electrically connect the first flexible printed circuit connector to the pressure sensor device in the sensor chamber.

14. The method according to claim 13, wherein, The step of "electrically connecting the airtight feedthrough signal line of the wall element to the pressure sensor device" includes the following sub-steps: - A printed circuit board is mounted on a support component, the printed circuit board including a first flexible printed circuit connector; - Attach the support component to the pressure port.

15. The method according to any one of claims 12 to 14, wherein, The method further includes the following steps: - The electrical connector module is electrically connected to the signal line outside the sensor room via another flexible printed circuit connector.

16. The method of claim 12, wherein the housing element is attached to the pressure port and the wall element by welding.

17. The method of claim 13, wherein the first flexible printed circuit connector is electrically connected to the pressure sensor device in the sensor chamber by brazing or fusion welding.

18. The method of claim 14, wherein the support member is attached to the pressure port by an adhesive.

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