A composite layer structure for reducing stress of rotating anode target track layer and substrate layer and preparation method thereof, and target disk

Abstract

The present invention relates to the technical field of rotating anode targets, and in particular to a composite layer structure for reducing the stress of a rotating anode target track layer and a substrate layer, and a preparation method thereof, and a target disk. The composite layer structure includes a substrate layer and a track layer; the upper surface of the substrate layer is covered with a transition layer, and the upper surface of the transition layer is covered with a track layer; the thermal expansion coefficient of the transition layer is between the thermal expansion coefficient of the substrate layer and the thermal expansion coefficient of the track layer; in terms of mass percentage, the transition layer includes the following components: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, 5% to 20% Z; T is one or a combination of two of Re and Ta; Z is one or a combination of Nb, Hf, and Ti. The present invention can effectively reduce the occurrence of cracking and splitting of the track layer, increase the room temperature fracture toughness of the composite layer structure, reduce the generation of cracks in the target disk with the composite layer structure, thereby increasing the service life of the target disk and improving the quality of the target disk.

Description

Technical Field

[0001] The invention relates to the technical field of rotating anode targets, and in particular to a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer, a preparation method thereof, and a target disk. Background Art

[0002] CT (Computed Tomography), or electronic computer tomography, can perform non-invasive high-resolution imaging of the human body and clearly display the information of the lesions inside the human body. It has become an indispensable and important means of modern medical diagnosis and modern social health care. The CT tube is the X-ray source generating device in the CT machine, which can be called the "core" of CT. The rotating anode target, as the source of X-rays of the CT tube, can be called the "heart" of the CT tube.

[0003] The structure of the target disk of the rotating anode target used in common CT tubes is as follows: a thin layer of tungsten-rhenium alloy is set on the top as the track layer, and the track layer is compounded with the TZM molybdenum alloy matrix layer, and the back of the molybdenum alloy target surface layer is welded with graphite as a heat storage layer. When working, the anode target generates X-rays under the bombardment of high-energy electron beams, but the efficiency of energy conversion is very low, and the excess energy is converted into heat energy and accumulated on the target surface. The focal temperature of the track layer (WRe layer) reaches above 2300℃, and the target temperature reaches above 1300℃. Under the action of continuous thermal cycles and such high working temperatures, due to the different thermal expansion coefficients of the track layer (WRe layer) and the TZM molybdenum alloy matrix layer, there is a large thermal stress between the track layer (WRe layer) and the TZM molybdenum alloy matrix layer, which makes the track layer (WRe layer) prone to cracking and cracking, and then causes the failure of the anode target disk.

[0004] The Chinese invention patent application with application number CN201210497167.4 and publication date of April 24, 2013 discloses a method for preparing a molybdenum-titanium alloy target, which comprises the following steps: (1) fully mixing molybdenum powder, titanium powder and a forming agent to obtain a molybdenum-titanium alloy powder; (2) cold pressing the molybdenum-titanium alloy powder obtained in step (1) to obtain a preform; (3) vacuum hot pressing the preform obtained in step (2), cooling and cutting to obtain a molybdenum-titanium alloy target. This scheme adopts a powder metallurgy method, which has low cost and high yield, and effectively reduces the cost of molybdenum-titanium alloy targets; this method is pollution-free and does not produce any waste, waste acid and other pollutants. However, this scheme does not solve the problem that there is a large thermal stress between the track layer and the molybdenum alloy substrate layer, which causes the track layer to be prone to cracking and cracking, thereby causing the failure of the anode target disk. Summary of the invention

[0005] In order to solve the problem in the above-mentioned prior art that there is a large thermal stress between the track layer and the molybdenum alloy substrate layer, which causes the track layer to be prone to cracking and splitting, thereby causing the anode target disk to fail.

[0006] The present invention provides a composite layer structure for reducing the stress of a rotating anode target track layer and a substrate layer, which comprises a substrate layer and a track layer; the upper surface of the substrate layer is covered with a transition layer, and the upper surface of the transition layer is covered with a track layer;

[0007] The thermal expansion coefficient of the transition layer is between the thermal expansion coefficient of the base layer and the thermal expansion coefficient of the track layer; the transition layer comprises the following components by mass percentage: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, and 5% to 20% Z;

[0008] The T is one or a combination of two of Re and Ta; and the Z is one or a combination of one or more of Nb, Hf and Ti.

[0009] In one embodiment, the base layer is made of TZM molybdenum alloy, and the track layer is made of tungsten-rhenium alloy.

[0010] In one embodiment, the base layer includes the following components by mass percentage: 0.1% to 1% Ti, 0.05% to 0.2% Zr, 0.01% to 0.2% C, 98.6% to 99.84% Mo; the track layer includes the following components: 80% to 99% W, 1% to 20% Re.

[0011] In one embodiment, the thickness of the transition layer is (0.2-1.2) mm.

[0012] The present invention also provides a method for preparing the composite layer structure for reducing the stress of the rotating anode target track layer and the substrate layer as described above, which comprises the following steps:

[0013] S100, weighing raw materials: weighing the raw materials of the track layer, transition layer and base layer respectively according to a certain mass;

[0014] S200, preparing the composite layer structure of the track layer, transition layer and base layer; wherein the transition layer is prepared by arc melting, powder metallurgy, 3D printing or plastic processing.

[0015] In one embodiment,

[0016] S200, preparing the composite layer structure of the track layer, transition layer and base layer:

[0017] S210, preparing a transition layer by arc melting method:

[0018] S211, using W metal strips, Mo metal strips, T metal strips, and Z metal strips as electrodes to prepare a transition layer alloy material by an arc melting method;

[0019] S212, subjecting the alloy material obtained in S211 to a heat treatment, and then to a warm treatment;

[0020] S213, performing surface forming processing on the alloy material obtained in S212 according to size requirements to obtain a transition layer with a certain shape;

[0021] S220, preparing the track layer and the base layer respectively by powder metallurgy;

[0022] S230, stacking the three layers of materials of the track layer, the transition layer and the base layer, and subjecting them to a pressurized, heated and composite treatment in a vacuum or argon or hydrogen environment to obtain the product.

[0023] In one embodiment,

[0024] S200, preparing the composite layer structure of the track layer, transition layer and base layer:

[0025] S210, preparing a transition layer by arc melting method:

[0026] S211, using W metal strips, Mo metal strips, T metal strips, and Z metal strips as electrodes to prepare a transition layer alloy material by arc melting; the arc melting process is performed under an argon atmosphere at a voltage of 5 to 50 V and a current of 100 to 1000 A;

[0027] S212, subjecting the alloy material obtained in S211 to a hot working treatment, and then to a warm working treatment; wherein the hot working temperature is 1600-1800° C., and the warm working temperature is 600-1200° C.;

[0028] S213, performing surface forming processing on the alloy material obtained in S212 according to size requirements to obtain a transition layer with a certain shape;

[0029] S220, preparing the track layer and the base layer respectively by powder metallurgy;

[0030] S230, stacking the track layer, transition layer and base layer, and performing pressurized heating composite treatment in a vacuum or argon or hydrogen environment, to obtain; wherein the pressurized pressure in the pressurized heating composite treatment is 0.01MPa~50MPa, heating to 1500℃~2500℃, keeping the temperature for 10min~100min, and then cooling, to obtain; wherein the whole process of S230 is carried out in a vacuum or argon or hydrogen environment, the vacuum degree in the vacuum environment is ≤100Pa, and the pressure in the argon or hydrogen environment is (1~1.2)×105 Pa.

[0031] In one embodiment, S200, preparing the composite layer structure of the track layer, transition layer and base layer by powder metallurgy:

[0032] S210, laying the raw material powder of the track layer, the raw material powder of the transition layer and the raw material powder of the matrix layer in a mold respectively, and obtaining a composite compact by cold isostatic pressing;

[0033] S220, sintering the composite green sheet at 1500-2500° C. in a vacuum or hydrogen or argon environment to obtain a sintered composite green sheet;

[0034] S230, subjecting the sintered composite blank obtained in S220 to a heat treatment at 1600-1800° C., and then to a warm treatment at 600-1200° C.;

[0035] S240, performing surface forming processing on the product obtained in S230 according to size requirements to obtain a composite layer structure with a certain shape.

[0036] In one embodiment, S200, preparing the composite layer structure of the track layer, transition layer and base layer by 3D printing:

[0037] S210, mixing the raw material powder of the track layer, the raw material powder of the transition layer, and the raw material powder of the base layer respectively, and preparing a track layer with a certain shape, a transition layer with a certain shape, and a base layer with a certain shape respectively by 3D printing;

[0038] S220, pressurizing and compounding the prepared track layer, transition layer and base layer at high temperature to obtain a composite layer structure.

[0039] The present invention also provides a target disk, wherein the composite layer structure for reducing the stress of the rotating anode target track layer and the substrate layer as described above is arranged above the heat storage layer of the target disk.

[0040] Based on the above, compared with the prior art, the composite layer structure provided by the present invention for reducing the stress of the rotating anode target track layer and the substrate layer has the following beneficial effects:

[0041] The present invention sets a transition layer between the base layer and the track layer, and the thermal expansion coefficient of the transition layer material is between the thermal expansion coefficient of the base layer and the thermal expansion coefficient of the track layer, which can effectively improve the thermal stress of the interface, reduce the occurrence of cracking and cracking in the track layer, and thus improve the quality of the target disk; at the same time, the conventional track layer and base layer have the defect of relatively low toughness, which makes the product more prone to cracks and faster crack propagation under continuous hot and cold shocks. The present invention adopts a specific transition layer material, and the composite layer structure prepared by combining the transition layer with the track layer and the base layer can consume more energy in the crack propagation process, thereby increasing the room temperature fracture toughness of the composite layer structure, reducing the occurrence of cracks in the target disk with the composite layer structure, thereby improving the service life of the target disk and improving the quality of the target disk.

[0042] Other features and beneficial effects of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other beneficial effects of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. The positional relationships described in the drawings in the following description are based on the directions in which the components are drawn in the diagrams, unless otherwise specified.

[0044] Figure 1 A schematic structural diagram of the first target plate structure provided by the present invention in the front view direction;

[0045] Figure 2 A schematic diagram of the structure of the first target plate structure provided by the present invention in a top view;

[0046] Figure 3 for Figure 2 AA section view;

[0047] Figure 4 for Figure 3 A partial enlarged view of point B;

[0048] Figure 5 A cross-sectional view of the connection interface between the transition layer and the substrate layer and the track layer in the second target disc structure provided by the present invention;

[0049] Figure 6A schematic diagram of the structure of the substrate layer in the top view of the second target plate structure provided by the present invention;

[0050] Figure 7 for Figure 6 Sectional view at C in the middle;

[0051] Figure 8 A cross-sectional view of the connection interface between the transition layer and the substrate layer and the track layer in the third target disc structure provided by the present invention;

[0052] Fig. 9 A schematic diagram of the structure in a top view of a substrate layer covered with a transition layer in a third target plate structure provided by the present invention;

[0053] Fig.10 for Fig. 9 The cross-section at D in the middle;

[0054] Fig.11 A cross-sectional view of the connection interface between the transition layer, the substrate layer and the track layer in the fourth target disc structure provided by the present invention;

[0055] Fig.12 for Fig.11 A partial enlarged view of

[0056] Fig.13 A cross-sectional view of the connection interface between the transition layer, the substrate layer and the track layer in the fifth target disc structure provided by the present invention;

[0057] Fig.14 for Fig.13 A partial enlarged view of

[0058] Fig.15 A cross-sectional view of the connection interface between the transition layer, the substrate layer and the track layer in the sixth target disc structure provided by the present invention;

[0059] Fig.16 A cross-sectional view of the connection interface between the transition layer, the substrate layer and the track layer in the seventh target disc structure provided by the present invention;

[0060] Fig.17 for Fig.16 A partial enlarged view of

[0061] Fig.18 This is a schematic diagram of the structure of the substrate layer in the top view of the eighth target plate structure provided by the present invention.

[0062] Fig.19 A schematic diagram of the structure in a top view of a base layer covered with a transition layer in an eighth target plate structure provided by the present invention;

[0063] Fig. 20 for Fig.19 The cross-section at E in the middle;

[0064] Fig.21 A schematic diagram of the structure of a first test sample provided by the present invention;

[0065] Fig. 22 A schematic diagram of the structure of a second test specimen provided by the present invention;

[0066] Fig.23 A schematic diagram of the testing process of the room temperature fracture toughness test provided by the present invention.

[0067] Reference numerals:

[0068] 100 transition layer 200 base layer 300 heat storage layer

[0069] 210 inclined surface 211 inner ring 212 outer ring

[0070] 220 first concavoconvex surface 221 first protrusion 222 first concave groove

[0071] 110 second concavo-convex surface 111 second protrusion 112 second concave groove

[0072] 400 track layers DETAILED DESCRIPTION

[0073] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments; the technical features designed in different implementation modes of the present invention described below can be combined with each other as long as they do not conflict with each other; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0074] In the description of the present invention, it should be noted that all terms used in the present invention (including technical terms and scientific terms) have the same meanings as those generally understood by ordinary technicians in the field to which the present invention belongs, and cannot be understood as limiting the present invention; it should be further understood that the terms used in the present invention should be understood to have the same meanings as these terms in the context of this specification and in the relevant fields, and should not be understood in an idealized or overly formal sense, unless explicitly defined in the present invention.

[0075] The present invention provides Figure 1-4A composite layer structure for reducing the stress of the rotating anode target track layer 400 and the base layer 200 is shown, which is a base layer 200-transition layer 100-track layer 400 composite layer structure, that is, it includes a base layer 200 and a track layer 400; the upper surface of the base layer 200 is covered with the transition layer 100, and the upper surface of the transition layer 100 is covered with the track layer 400;

[0076] The thermal expansion coefficient of the transition layer 100 is between the thermal expansion coefficient of the base layer 200 and the thermal expansion coefficient of the track layer 400; the transition layer 100 comprises the following components by mass percentage: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, 5% to 20% Z; the T is selected from one or a combination of Re and Ta; the Z is selected from one or a combination of Nb, Hf, and Ti;

[0077] Specifically, the W component can be 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%; the Mo component can be 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%; the T component can be 5%, 10%, 15%, 20%; the Z component can be 5%, 10%, 15%, 20%; it should be noted that: the W component is in the range of 20% to 70%, the Mo component is in the range of 10% to 50%, the T component is in the range of 5% to 20%, and the Z component is in the range of 5% to 20%, which are all feasible, including but not limited to the embodiments and the above schemes;

[0078] Wherein, the base layer 200 is made of TZM molybdenum alloy, and the base layer 200 includes the following components by mass percentage: 0.1% to 1% Ti, 0.05% to 0.2% Zr, 0.01% to 0.2% C, and 98.6% to 99.84% Mo (i.e., the balance is Mo);

[0079] Specifically, the Ti component can be 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1.0%; the Zr component can be 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.1%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.2%; the C component can be 0.01%, 0.02%, 0.03% %, 0.04%, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.1%, 0.11%, 0.12%, 0.13%, 0.14%, 0.15%, 0.16%, 0.17%, 0.18%, 0.19%, 0.2%; the balance is Mo; it should be noted that: the Ti component is in the range of 0.1% to 1%, the Zr component is in the range of 0.05% to 0.2%, and the C component is in the range of 0.01% to 0.2%, including but not limited to the embodiments and the above-mentioned scheme;

[0080] Wherein, the track layer 400 is made of tungsten-rhenium alloy, and the track layer 400 includes the following components: 80% to 99% W, 1% to 20% Re;

[0081] Specifically, the W component can be 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%; the Re component can be 1%, 2%, 2%, 2%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%; it should be noted that: the W component is within the range of 80% to 99%, and the Re component is within the range of 1% to 20%, including but not limited to the embodiments and the above scheme;

[0082] also,

[0083] The present invention also provides a method for preparing the composite layer structure for reducing the stress of the rotating anode target track layer 400 and the substrate layer 200 as described above, which comprises the following steps:

[0084] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0085] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200; wherein the transition layer 100 is prepared by arc melting, powder metallurgy, 3D printing or plastic processing.

[0086] Specifically:

[0087] (1) Arc melting method:

[0088] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0089] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200:

[0090] S210, preparing a transition layer 100 by arc melting method:

[0091] S211, using W metal strips, Mo metal strips, T metal strips, and Z metal strips as electrodes, and preparing transition layer 100 alloy material by arc melting method; wherein, during the arc melting process, the voltage is set to 5-50V, the current is set to 100-1000A, and the arc melting process is carried out in an argon atmosphere, and the gas pressure is slightly positive, that is, the gas pressure is (0.1-1.1)×10 5 Pa;

[0092] S212, subjecting the alloy material obtained in S211 to a hot working treatment, and then to a warm working treatment; wherein the hot working temperature is 1600-1800° C., and the warm working temperature is 600-1200° C.;

[0093] S213, performing surface forming processing on the alloy material obtained in S212 according to size requirements to obtain a transition layer 100 with a certain shape;

[0094] S220, preparing the track layer 400 and the base layer 200 respectively by powder metallurgy;

[0095] Preparation of track layer 400: cold isostatic pressing of raw material powder of track layer 400 at room temperature, the pressure of cold isostatic pressing is 100-300 MPa, and the pressure is maintained for 10-60 min; then sintering at 2000-2700°C in vacuum or hydrogen environment, the holding time is 60-600 min, the vacuum degree in vacuum environment is ≤100 Pa, and the pressure in hydrogen atmosphere environment is (1-1.2)×10 5 Pa; then plastic processing is performed at a processing temperature of 1000-1600°C, and finally machining is performed to obtain a track layer 400 having a certain shape;

[0096] Preparation of the substrate layer 200: cold isostatic pressing the raw material powder of the substrate layer 200 at room temperature, the pressure of the cold isostatic pressing is 100-300 MPa, and the pressure is maintained for 10-60 min; then sintering at 1800-2300° C. in a vacuum or hydrogen environment, the holding time is 60-600 min, the vacuum degree in the vacuum environment is ≤100 Pa, and the pressure in the hydrogen atmosphere environment is (1-1.2)×10 5 Pa; and then plastic processing is performed at a processing temperature of 600 to 1400°C, and finally machining is performed to obtain a base layer 200 having a certain shape;

[0097] S230, stacking the track layer 400, the transition layer 100 and the base layer 200, and performing a pressurized heating composite treatment in a vacuum or argon or hydrogen environment to obtain the composite material; wherein the pressurized pressure in the pressurized heating composite treatment is 0.01MPa~50MPa, heating by electricity or using an external heat source to raise the temperature to 1500℃~2500℃, keeping the temperature for 10min~100min, and then cooling to obtain the composite material; S230 is carried out in a vacuum or argon or hydrogen environment throughout the process, the vacuum degree in the vacuum environment is ≤100Pa, and a slightly positive pressure is adopted in the argon or hydrogen environment, that is, the pressure is (1~1.2)×10 5 Pa.

[0098] (2) Powder metallurgy method:

[0099] S100, weighing raw materials: weighing the raw materials of the track layer, transition layer and base layer respectively according to a certain mass;

[0100] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200 by powder metallurgy:

[0101] S210, laying the raw material powder of the track layer 400, the raw material powder of the transition layer 100 and the raw material powder of the base layer 200 in a mold respectively, and obtaining a composite compact by cold isostatic pressing, wherein the pressure of the cold isostatic pressing is 100-300 MPa, and the pressure is maintained for 5-30 minutes;

[0102] S220, sintering the composite green sheet at 1500-2500°C in a vacuum or hydrogen or argon environment to obtain a sintered composite green sheet; wherein the vacuum degree in the vacuum environment is ≤100Pa, and the pressure in the hydrogen or argon environment is slightly positive, that is, the pressure is (1-1.2)×10 5 Pa;

[0103] S230, subjecting the sintered composite blank obtained in S220 to a heat treatment at 1600-1800° C., and then to a warm treatment at 600-1200° C.;

[0104] S240, performing surface forming processing on the product obtained in S230 according to size requirements to obtain a composite layer structure with a certain shape.

[0105] (3) 3D printing method:

[0106] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0107] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200 by 3D printing method:

[0108] S210, mixing the raw material powder of the track layer 400, the raw material powder of the transition layer 100, and the raw material powder of the base layer 200, respectively, and preparing the track layer 400 with a certain shape, the transition layer 100 with a certain shape, and the base layer 200 with a certain shape by 3D printing, respectively; wherein the laser power is 50 to 3000 W, the printing rate is 1 to 500 mm / min, and the layer thickness is 10 to 100 μm;

[0109] S220, the prepared track layer 400, transition layer 100 and base layer 200 are pressurized and compounded at high temperature to obtain a composite layer structure; wherein the pressurization pressure is 0.01MPa-50MPa, and the temperature is raised to 1500℃-2500℃ by electric heating or external heat source, and the temperature is kept for 10min-100min, and then cooled to obtain the composite layer structure; S220 is carried out in a vacuum or argon or hydrogen environment, and the vacuum degree in the vacuum environment is ≤100Pa, and the argon or hydrogen environment is slightly positive pressure, that is, the pressure is (1-1.2)×10 5 Pa.

[0110] The present invention also provides the following embodiments and comparative examples:

[0111] The formulas of the embodiments and comparative examples provided by the present invention (unit: mass percentage, %) are shown in Table 1 below:

[0112] Table 1

[0113]

[0114]

[0115] According to the formulation in Table 1, the raw material components in the examples and comparative examples were prepared according to the following preparation method: Figure 1-4 The composite layer structure of the track layer 400, the transition layer 100 and the substrate layer 200 shown is a composite layer structure for reducing the stress of the rotating anode target track layer 400 and the substrate layer 200:

[0116] (1) Arc melting method:

[0117] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0118] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200:

[0119] S210, preparing a transition layer 100 by arc melting method:

[0120] S211, using W metal strips, Mo metal strips, T metal strips, and Z metal strips as electrodes, and preparing transition layer 100 alloy material by arc melting method; wherein, the voltage is 30 V, the current is 600 A, the atmosphere is argon, and the pressure is 0.6×10 5 Pa;

[0121] S212, subjecting the alloy material obtained in S211 to hot working treatment, and then to warm working treatment; wherein the hot working temperature is 1750°C, and the warm working temperature is 1000°C.

[0122] S213, performing surface forming processing on the alloy material obtained in S212 according to size requirements to obtain a transition layer 100 with a certain shape.

[0123] S220, preparing the track layer 400 and the base layer 200 respectively by powder metallurgy:

[0124] Preparation of track layer 400: cold isostatic pressing of the raw material powder of track layer 400 at room temperature, the pressure of cold isostatic pressing is 200 MPa, and the pressure is maintained for 30 minutes; then sintering at 2500°C in a hydrogen environment, the holding time is 300 minutes, and the pressure in the hydrogen atmosphere environment is 1.1×10 5 Pa; then plastic processing is performed at a processing temperature of 1300°C, and finally machining is performed to obtain a track layer 400 having a certain shape;

[0125] Preparation of the substrate layer 200: The raw material powder of the substrate layer 200 is subjected to cold isostatic pressing at room temperature, the pressure of the cold isostatic pressing is 200 MPa, and the pressure is maintained for 30 minutes; then, it is sintered at 2000°C in a hydrogen environment, and the holding time is 300 minutes. The pressure in the hydrogen atmosphere is 1.1×10 5 Pa; and then plastic processing is performed at a processing temperature of 1000°C, and finally machining is performed to obtain a base layer 200 having a certain shape;

[0126] S230, prepare a composite layer structure of the track layer 400, the transition layer 100 and the base layer 200: stack the three layers of materials, apply a pressure of 30 MPa during the pressurized heating composite treatment, heat to 2200°C in a vacuum hot pressing furnace, keep warm for 60 minutes, and then cool, with the vacuum degree equal to 0.1 Pa throughout the process.

[0127] (2) Powder metallurgy method:

[0128] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0129] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200 by powder metallurgy:

[0130] S210, laying the raw material powder of the track layer 400, the raw material powder of the transition layer 100 and the raw material powder of the base layer 200 in a mold respectively, and obtaining a composite compact by cold isostatic pressing, wherein the cold isostatic pressing pressure is 220 MPa, and the pressure is maintained for 30 minutes.

[0131] S220, sintering the composite green sheet at 2100°C in a hydrogen atmosphere to obtain a sintered composite green sheet, wherein the hydrogen atmosphere pressure is 1.1×10 5 Pa;

[0132] S230, subjecting the sintered composite blank obtained in S220 to a heat treatment at 1800° C., and then to a warm treatment at 1200° C.;

[0133] S240, performing surface forming processing on the product obtained in S230 according to size requirements to obtain a composite layer structure with a certain shape.

[0134] (3) 3D printing method:

[0135] S100, weighing raw materials: weighing raw materials of the track layer 400, the transition layer 100 and the base layer 200 respectively according to a certain mass;

[0136] S200, preparing the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200 by 3D printing method:

[0137] S210, mixing the raw material powder of the track layer 400, the raw material powder of the transition layer 100, and the raw material powder of the base layer 200, respectively, and preparing the track layer 400 with a certain shape, the transition layer 100 with a certain shape, and the base layer 200 with a certain shape by 3D printing, respectively, wherein the laser power is 500 W, the printing rate is 120 mm / min, and the layer thickness is 50 μm;

[0138] S220, pressurize and compound the prepared track layer 400, transition layer 100 and base layer 200 at high temperature to obtain a composite layer structure; wherein, the pressurization pressure is 30MPa, and the temperature is raised to 2300°C by electric heating, kept warm for 60 minutes, and then cooled to obtain the composite layer structure; S220 is carried out in a vacuum environment throughout, and the vacuum degree in the vacuum environment is 0.1Pa.

[0139] The products prepared in the embodiment and the comparative example were tested for relevant indicators under the same test conditions and test methods. The test results are shown in Table 2 below.

[0140] Table 2

[0141]

[0142]

[0143] In Table 2, the specifications and dimensions of the first test specimen of Comparative Example 1 are as follows: Fig.21 As shown, the spline length L1 = 50 mm, the spline width W = 10 mm, the track layer 400 thickness H1 = 5 mm, the base layer 200 thickness H2 = 5 mm, and the wire cutting seam depth H3 = 4 mm;

[0144] The specifications and dimensions of the second test strips in the embodiments and comparative examples 2-5 are as follows: Fig. 22 As shown, the spline length L2 = 50 mm, the spline width W = 10 mm, the track layer 400 thickness H4 = 5 mm, the transition layer 100 thickness H5 = 2 mm, the base layer 200 thickness H6 = 3 mm, and the wire cutting seam depth H7 = 4 mm;

[0145] In Table 2, the room temperature fracture toughness and elongation test items are as follows: Fig.23 As shown in the test schematic diagram of room temperature fracture toughness, during the test, the span L3 between the two fulcrums is 40 mm; the test process is: place the test spline on the two fulcrums, apply pressure to the wire cutting seam in the middle of the spline, record the force value when the spline breaks and convert it to obtain the room temperature fracture toughness value.

[0146] In Table 2, the test items for the crack area ratio after the target disk has been working for a certain period of time are as follows: the target disk with the above-mentioned composite layer structure (i.e. Figure 1-4After the target disc shown in the figure works for a certain period of time under the conditions of voltage 100KV, current 300mA and speed 10000 rpm, the cracks appearing on the surface of the track surface after use are observed and recorded, and the ratio of the crack area to the total area is defined as the crack area ratio; wherein, the overall dimensions of the target discs used in the embodiment and the comparative example are consistent: the heat storage layer 300 (graphite) has a thickness of 32mm and a radius of 140mm; the substrate layer 200 has a thickness of 13mm and a radius of 140mm; the transition layer 100 has a thickness of 0.5mm, an outer diameter of 140mm and an inner diameter of 100mm; the track layer 400 has a thickness of 1.2mm, an outer diameter of 140mm and an inner diameter of 100mm.

[0147] From the test results in Table 2, we can see that:

[0148] The present invention sets a transition layer 100 between the substrate layer 200 and the track layer 400, and defines the formula of the transition layer 100 material so that the thermal expansion coefficient of the transition layer 100 is between the thermal expansion coefficient of the substrate layer 200 and the thermal expansion coefficient of the track layer 400, so that the thermal stress of the interface can be effectively improved, and the occurrence of cracking and cracking of the track layer 400 can be reduced, thereby improving the quality of the target disk; at the same time, the conventional track layer 400 and the substrate layer 200 have the defect of relatively low toughness, which makes the product more prone to cracks and faster crack propagation under continuous hot and cold shocks. The present invention adopts a specific transition layer 100 material, and its room temperature elongation can reach more than 9%, which is higher than that of the WRe track layer 400 and the TZM molybdenum alloy substrate layer 200; the composite layer structure prepared by the composite transition layer 100 with the WRe track layer 400 and the TZM molybdenum alloy substrate layer 200 can consume more energy in the crack propagation process, so that the room temperature fracture toughness of the composite layer structure reaches 29MPa·m 1 / 2 The above (comparative example 1 without the transition layer 100) only reaches 20 MPa·m 1 / 2 ), so that after the target disc with the composite layer structure has been working for a certain period of time, its crack area ratio is significantly reduced compared with the traditional existing target disc (Comparative Example 1), thereby increasing the service life of the target disc and improving the quality of the target disc.

[0149] In the components of the transition layer 100 of Comparative Examples 2 and 3, the W content exceeds the limit range of the present invention; in the components of the transition layer 100 of Comparative Examples 4 and 5, the Mo content exceeds the limit range of the present invention;

[0150] The W content in the transition layer 100 component of Comparative Example 2 is 80%, which is higher than the range specified in the present invention (20% to 70%). Compared with the embodiment, its room temperature elongation and fracture toughness are significantly reduced, and the target disk crack area ratio is increased.

[0151] Compared with the embodiment, although the room temperature elongation and fracture toughness of the transition layer 100 of Comparative Example 3 are higher, due to the excessively high thermal expansion coefficient of the transition layer 100 (higher than the thermal expansion coefficient of the base layer 200), it fails to significantly relieve the thermal stress, and the crack area ratio of the target disk increases;

[0152] Compared with the embodiment, although the room temperature elongation and fracture toughness of the transition layer 100 of comparative example 4 are higher, due to the excessively high thermal expansion coefficient of the transition layer 100 (basically the same as the thermal expansion coefficient of the base layer 200), it fails to play a significant role in relieving thermal stress, and the crack area ratio of the target disk increases;

[0153] Compared with the examples, the room temperature elongation and fracture toughness of comparative example 5 are significantly reduced, and the target disk crack area ratio is increased.

[0154] It should be noted that:

[0155] In addition to the actual selections embodied in the above specific embodiments, the transition layer 100 includes the following components by mass percentage: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, and 5% to 20% Z, wherein T is one or a combination of two of Re and Ta, and Z is one or a combination of one or more of Nb, Hf, and Ti; the above components are all feasible within the above ratio range, including but not limited to the above embodiment scheme;

[0156] Among them, in addition to the actual selection embodied in the above specific embodiments, preferably, by mass percentage, the base layer 200 includes the following components: 0.1% to 1% Ti, 0.05% to 0.2% Zr, 0.01% to 0.2% C, 98.6% to 99.84% Mo; the track layer 400 includes the following components: 80% to 99% W, 1% to 20% Re; the preferred composition of the above base layer 200 and track layer 400, whose components are feasible within the above ratio range, includes but is not limited to the above embodiment scheme;

[0157] In addition to the actual selections embodied in the above-mentioned specific embodiments, preferably, the preparation of the composite layer structure for reducing the stress of the rotating anode target track layer 400 and the substrate layer 200 can be prepared by arc melting, powder metallurgy, 3D printing, and plastic processing. According to the above-mentioned design concepts, those skilled in the art may also choose other existing preparation methods, including but not limited to the above-mentioned embodiments.

[0158] In this article, “~” is used to indicate a numerical range, and the range indicated by this expression includes two endpoint values.

[0159] W, Mo, Re, Ta, Nb, Hf, Ti, Zr, and C mentioned in this article are the metal elements tungsten, molybdenum, rhenium, tantalum, niobium, hafnium, titanium, zirconium, and carbon, respectively; T and Z mentioned in this article are reference symbols and do not directly represent a certain element.

[0160] In summary, the specific parameters or some common reagents or raw materials in the above embodiments are specific embodiments or preferred embodiments of the present invention, but are not intended to limit the present invention; those skilled in the art can make adaptive adjustments within the scope of the present invention. In addition, unless otherwise specified, the raw materials used may also be conventional commercial products in the art, or may be prepared by conventional methods in the art.

[0161] in addition:

[0162] The present invention provides Figure 1-4 The composite layer structure of the track layer, transition layer and base layer shown in the first target structure. Figure 5-7 The composite layer structure shown in the second target structure is Figure 8-10 The composite layer structure shown in the third target structure is Figure 11-12 The composite layer structure shown in the fourth target structure Figure 13-14 The composite layer structure shown in the fifth target structure is Fig.15 The composite layer structure shown in the sixth target structure is Figure 16-17 The composite layer structure shown in the seventh target structure is Figure 18-20 The composite layer structure eight shown in the eighth target disk structure, the composite layer structure for reducing the stress of the rotating anode target track layer and the substrate layer includes a substrate layer 200 and a track layer 400; the upper surface of the substrate layer 200 is covered with a transition layer 100, and the upper surface of the transition layer 100 is covered with a track layer 400; the thermal expansion coefficient of the transition layer 100 is between the thermal expansion coefficient of the substrate layer 200 and the thermal expansion coefficient of the track layer 400, wherein the transition layer includes the following components: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, 5% to 20% Z; the T is selected from one or two combinations of Re and Ta; the Z is selected from one or more combinations of Nb, Hf, and Ti. It can be seen from the results of the above embodiments that the above scheme can effectively improve the thermal stress of the interface, reduce the occurrence of cracking and cracking of the track layer 400, and thus improve the quality of the target disk.

[0163] Preferably, if Figure 1-4 As shown in the composite layer structure 1, the thickness D of the transition layer 100 is (0.2-1.2) mm. The thickness of the transition layer 100 is controlled within this range. The thickness of the transition layer 100 is set to be moderate, which means that material waste will not be caused by setting it too thick, effectively reducing costs; and it can ensure that the transition layer 100 is thick enough to improve thermal stress.

[0164] At the same time, the present invention Figure 1-4 Based on the composite layer structure of the track layer 400, the transition layer 100 and the base layer 200 shown in FIG. 1, the structure is optimized:

[0165] Preferably, if Figure 5-7 Composite layer structure 2. Figure 8-10 Composite layer structure 3. Figure 11-12 Composite layer structure 4. Figure 13-14 Composite layer structure 5. Fig.15 Composite layer structure VI. Figure 16-17 Composite layer structure VII. Figure 18-20 Schematic diagram of the composite structure shown Figure 8 As shown, the upper surface of the base layer 200 is provided with a first concave-convex surface 220, the first concave-convex surface 220 is connected to the lower surface of the transition layer 100, and the lower surface of the transition layer 100 is embedded in the first concave groove 222 on the first concave-convex surface 220, so that a concave-convex connection interface is formed between the transition layer 100 and the base layer 200; and / or, the upper surface of the transition layer 100 is provided with a second concave-convex surface 110, the second concave-convex surface 110 is connected to the lower surface of the track layer 400, and the lower surface of the track layer 400 is embedded in the second concave-convex surface 110. The second concave-convex surface 110 is connected to the lower surface of the track layer 400, and the lower surface of the track layer 400 is embedded in the second concave-convex groove 112 on the second concave-convex surface 110, so that a concave-convex connection interface is formed between the track layer 400 and the transition layer 100.

[0166] like Figure 5-20 As shown, a first concavo-convex surface 220 is provided on the upper surface of the base layer 200, and the base layer 200 is connected to the lower surface of the transition layer 100 through the first concavo-convex surface 220, and the lower surface of the transition layer 100 is adapted to the first concavo-convex surface 220, and the lower surface of the transition layer 100 is embedded in the first concave groove 222 on the first concavo-convex surface 220, and the transition layer 100 and the base layer 200 are tightly fitted and connected, so that a concavo-convex connection interface is formed between the transition layer 100 and the base layer 200; in this way, the area of ​​the connection interface formed between the transition layer 100 and the base layer 200 is significantly increased, which effectively reduces the possibility of interface cracking caused by large thermal stress between the transition layer 100 and the base layer 200, and due to the concavo-convex structural characteristics of the connection interface between the two, the bonding strength between the two can be improved, thereby ultimately improving the bonding strength of the target metal interface.

[0167] Similarly, a second concave-convex surface 110 is provided on the upper surface of the transition layer 100, which is connected to the lower surface of the track layer 400 through the second concave-convex surface 110, and the lower surface of the track layer 400 is adapted to the second concave-convex surface 110. The lower surface of the track layer 400 is embedded in the second concave groove 112 on the second concave-convex surface 110. The track layer 400 and the transition layer 100 are tightly fitted and connected, so that a concave-convex connection interface is formed between the track layer 400 and the transition layer 100, which can improve the bonding strength between the two, thereby ultimately improving the bonding strength of the target disk metal interface.

[0168] It should be noted that, in the preferred composite layer structures 2 and 4-8, the upper surface of the base layer 200 is set as the first concavo-convex surface 220, so that a concavo-convex connection interface is formed between the transition layer 100 and the base layer 200; in the preferred composite layer structure 3, the upper surface of the base layer 200 is set as the first concavo-convex surface 220, so that a concavo-convex connection interface is formed between the transition layer 100 and the base layer 200; and the upper surface of the transition layer 100 is set as the second concavo-convex surface 110 so that a concavo-convex connection interface is formed between the track layer 400 and the transition layer 100. According to the above design concept, the scheme of forming a concavo-convex connection interface between the transition layer 100 and the base layer 200 or the scheme of forming a concavo-convex connection interface between the track layer 400 and the transition layer 100 can be used alone, and the scheme of forming a concavo-convex connection interface between the transition layer 100 and the base layer 200 and between the track layer 400 and the transition layer 100 can also be used, including but not limited to the embodiment scheme.

[0169] Preferably, the outer peripheral portion of the upper surface of the base layer 200 has an annular slope 210 extending from the outer edge toward the center, and the height of the inner ring 211 of the slope 210 is greater than the height of the outer ring 212 of the slope 210; the upper surface of the slope 210 is set as the first concave-convex surface 220, and the first concave-convex surface 220 is connected to the lower surface of the transition layer 100 so that the transition layer 100 covers the upper surface of the slope 210.

[0170] It should be noted that, among the “inner ring 211” and “outer ring 212” described in this article, the direction close to the center of the base layer 200 is “inner”, and the direction away from the center of the base layer 200, that is, the direction close to the outer periphery of the base layer 200 is “outer”; therefore, “the height of the inner ring 211 of the inclined surface 210 is greater than the height of the outer ring 212 of the inclined surface 210” means that the height of the inclined surface 210 gradually decreases along the direction from the center of the base layer 200 to the outer edge of the base layer 200.

[0171] Preferably, the upper surface of the base layer 200 is provided with a plurality of first protrusions 221 and first concave grooves 222 to form a first concave-convex surface 220; and / or, the upper surface of the transition layer 100 is provided with a plurality of second protrusions 111 and second concave grooves 112 to form a second concave-convex surface 110;

[0172] The first protrusion 221 and the second protrusion 111 are one or more combinations of circular convex arc structure protrusions, conical column structure protrusions, angular pyramid column structure protrusions, square column structure protrusions, and trapezoidal column structure protrusions; the second concave groove 112 and the second concave groove 112 are one or more combinations of circular convex arc structure concave grooves, conical column structure concave grooves, angular pyramid column structure concave grooves, square column structure concave grooves, and trapezoidal column structure concave grooves.

[0173] It should be noted that, in the first concave-convex surface 220, the first protrusion 221 and the first concave groove 222 may adopt the same shape structure, for example, Figure 5-7 Composite layer structure 2. Figure 8-10 Composite layer structure 3. Figure 11-12 Composite layer structure 4. Figure 13-14 Composite layer structure 5. Fig.15 Composite layer structure VI. Figure 18-20 Schematic diagram of the composite structure shown Figure 8 The scheme shown; in addition, for example Figure 16-17 In the scheme shown in the seventh composite layer structure, the first protrusion 221 and the first concave groove 222 may also adopt a variety of shape structures (such as a circular convex arc structure, a conical column structure, a pyramid column structure, a square column structure or a trapezoidal column structure) in any combination;

[0174] Similarly, in the second concave-convex surface 110, the second protrusion 111 and the second concave groove 112 can adopt the same shape structure, and the second protrusion 111 and the second concave groove 112 can also adopt any combination of a variety of shape structures (for example, a circular convex arc structure, a conical column structure, a pyramid column structure, a square column structure or a trapezoidal column structure); it should be noted that the shape structure selection of the first protrusion 221, the first concave groove 222, the second protrusion 111 and the second concave groove 112 includes but is not limited to the embodiment scheme.

[0175] It should also be noted that the arrangement of the first protrusions 221 and the first recessed grooves 222 or the arrangement of the second protrusions 111 and the second recessed grooves 112, in addition to the preferred regular alternating arrangement (for example, the composite layer structure II-8 scheme is a regular alternating arrangement), can also adopt any dispersed arrangement, and the scheme of the present invention includes but is not limited to the embodiment scheme.

[0176] Preferably, if Figure 5-7 Composite layer structure 2. Figure 8-10As shown in the composite layer structure three, the upper surface of the base layer 200 is a circular structure, and the inclined surface 210 is a circular inclined surface 210; the upper surface of the inclined surface 210 is provided with a plurality of first protrusions 221 distributed in a circular shape and concentric with the circular inclined surface 210, so that a first concave-convex surface 220 is formed on the inclined surface 210; or Figure 18-20 Schematic diagram of the composite structure shown Figure 8 As shown, the upper surface of the inclined surface 210 is provided with first protrusions 221 distributed in a circular spiral shape, so that a first concave-convex surface 220 is formed on the inclined surface 210 .

[0177] Specific as Figure 5-7 Composite layer structure 2. Figure 8-10 As shown in the composite layer structure 3, a first protrusion 221 ( Figure 6 The dotted line indicates the distribution of the first protrusions 221), the first protrusions 221 are distributed in a circular ring shape concentric with the circular bevel 210, and first recessed grooves 222 are formed between adjacent first protrusions 221, and a plurality of first protrusions 221 are distributed in the radial direction of the base layer 200, and the first protrusions 221 and the first recessed grooves 222 are regularly alternately distributed; with such an arrangement, compared with the scheme in which the first recessed grooves 222 and the first protrusions 221 are arbitrarily dispersed, the implemented scheme can further improve the bonding strength between the transition layer 100 and the base layer 200.

[0178] Similarly, if Figure 18-20 Schematic diagram of the composite structure shown Figure 8 As shown, a first protrusion 221 ( Fig.18 The dotted line indicates the distribution of the first protrusions 221), the first protrusions 221 are distributed in a circular spiral shape, and a plurality of first protrusions 221 are distributed in the radial direction of the base layer 200, and first recessed grooves 222 are formed between adjacent first protrusions 221, and the first protrusions 221 and the first recessed grooves 222 are regularly alternately distributed. Such an arrangement can further improve the bonding strength between the transition layer 100 and the base layer 200.

[0179] Preferably, if Figure 5-7 Composite layer structure 2. Figure 8-10 Composite layer structure 3. Figure 18-20 Schematic diagram of the composite structure shown Figure 8 Among the plurality of first protrusions 221 distributed in an annular shape or an annular spiral shape, adjacent first protrusions 221 are distributed equidistantly; and / or, among the plurality of second protrusions 111 distributed in an annular shape or an annular spiral shape, adjacent second protrusions 111 are distributed equidistantly.

[0180] Further preferably, the heights of the first protrusions 221 are all set to be consistent, that is, on the first concave-convex surface 220, the height difference between the highest point of each first protrusion 221 and the lowest point of the first concave groove 222 is the same; and / or, the heights of the second protrusions 111 are all set to be consistent, that is, on the second concave-convex surface 110, the height difference between the highest point of each second protrusion 111 and the lowest point of the second concave groove 112 is the same.

[0181] Preferably, if Figure 8-10 As shown in the composite layer structure 3, the upper surface of the transition layer 100 is provided with a plurality of second protrusions 111 distributed in an annular shape and concentric with the annular inclined surface 210, so that the upper surface of the transition layer 100 forms a second concave-convex surface 110; or, as Figure 18-20 Schematic diagram of the composite structure shown in Figure 0 Figure 8 As shown, the upper surface of the transition layer 100 is provided with second protrusions 111 distributed in a circular spiral shape, so that the upper surface of the transition layer 100 forms a second concave-convex surface 110 .

[0182] Similarly, if Figure 8-10 As shown in the composite layer structure 3, a first protrusion 221 ( Fig. 9 The dotted line indicates the distribution of the second protrusions 111), and the second protrusions 111 are distributed in a circular ring shape concentric with the circular inclined surface 210, and second recessed grooves 112 are formed between adjacent second protrusions 111; in the radial direction, a plurality of second protrusions 111 are distributed, and second recessed grooves 112 are formed between adjacent second protrusions 111, and the second protrusions 111 and the second recessed grooves 112 are regularly alternately distributed. Such an arrangement can further improve the bonding strength between the transition layer 100 and the track layer 400.

[0183] like Figure 18-20 Composite structure diagram Figure 8 As shown, the upper surface of the transition layer 100 is provided with second protrusions 111 distributed in a circular spiral shape, and second recessed grooves 112 are formed between adjacent second protrusions 111; in the radial direction, a plurality of second protrusions 111 are distributed, and second recessed grooves 112 are formed between adjacent second protrusions 111, and the second protrusions 111 and the second recessed grooves 112 are regularly alternately distributed. Such an arrangement can further improve the bonding strength between the transition layer 100 and the base layer 200.

[0184] It should be noted that the first protrusion 221 and the second protrusion 111 in the composite layer structure 3 are both distributed in a circular ring shape. Figure 8The first protrusion 221 and the second protrusion 111 are both distributed in a circular spiral shape; according to the above design concept, the first protrusion 221 can be distributed in a circular spiral shape or a circular shape, and the second protrusion 111 can also be distributed in a circular spiral shape or a circular shape, and the combination of the two includes but is not limited to the embodiment scheme.

[0185] Preferably, the first concavo-convex surface 220 is in a continuous sawtooth shape, a continuous wave shape or a continuous trapezoidal shape; and / or the second concavo-convex surface 110 is in a continuous sawtooth shape, a continuous wave shape or a continuous trapezoidal shape.

[0186] like Figure 5-7 As shown in the composite layer structure 2, the first concave-convex surface 220 is in a continuous sawtooth shape; Figure 8-10 As shown in the composite layer structure 3, the first concave-convex surface 220 and the second first concave-convex surface 220 are both continuous sawtooth-shaped; Figure 11-12 As shown in the composite layer structure 4, the first concave-convex surface 220 is in a continuous wave shape; Figure 13-14 As shown in the composite layer structure 5, the first concave-convex surface 220 is in a continuous trapezoidal shape; Fig.15 As shown in the composite layer structure 6, the first concave-convex surface 220 is in a continuous square shape. Among them, a continuous sawtooth shape is a preferred choice.

[0187] Arranging the first concave-convex surface 220 and / or the second concave-convex surface 110 to be continuous serrated, continuous wavy, continuous trapezoidal or continuous square can effectively increase the density of protrusions and concave grooves in the concave-convex surface, and make full use of the area of ​​the inclined surface 210 to arrange more protrusions and concave grooves. Such a configuration can further improve the bonding strength between the transition layer 100 and the base layer 200, and between the transition layer 100 and the track layer 400.

[0188] Among them, the cross section of the first protrusion 221 in the composite layer structure two-3 is triangular, and the first protrusion 221 is distributed in a circular ring shape. By setting a plurality of first protrusions 221 distributed in a circular ring shape, and controlling the distance between adjacent first protrusions 221 so that a first concave groove 222 with a triangular cross section is formed between adjacent first protrusions 221, the first concave-convex surface 220 is distributed in a continuous serrated shape (similarly, the cross section of the second protrusion 111 in the composite layer structure three is triangular, and a first concave groove 222 with a triangular cross section is formed between the second protrusions 111;

[0189] According to the above-mentioned design concept, in addition to the above-mentioned embodiment scheme, the first concave-convex surface 220 or the second concave-convex surface 110 can also be distributed in a continuous serrated shape through other arrangements of the first protrusion 221 or the second protrusion 111. For example, the first concave-convex surface 220 or the second concave-convex surface 110 can also be distributed in a continuous serrated shape by arranging the first protrusion 221 or the second protrusion 111 in a circular spiral shape, including but not limited to the embodiment scheme; similarly, according to the above-mentioned design concept, in the scheme where the first concave-convex surface 220 or the second concave-convex surface 110 is in a continuous wavy shape, a continuous trapezoidal shape or a continuous square shape, the arrangement of the first protrusion 221 or the second protrusion 111 is similar to the embodiment scheme method, and will not be repeated here.

[0190] It should be noted that the first concave-convex surface 220 or the second concave-convex surface 110 may also be in a continuous wave shape, a continuous trapezoidal shape or a continuous square shape through other shape structure settings and arrangements of the first protrusions 221 or the second protrusions 111, including but not limited to the embodiments.

[0191] The present invention further provides a target disk, wherein a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer as described above is arranged above the heat storage layer 300 of the target disk.

[0192] like Figure 1-20 As shown, a base layer 200 is arranged on the upper surface of the heat storage layer 300, a transition layer 100 is covered on the upper surface of the base layer 200 at the inclined surface 210, and a track layer 400 is covered on the transition layer 100; preferably, the heat storage layer 300 is made of graphite. Graphite has the characteristics of large specific heat capacity, small specific gravity, fast heat dissipation, etc. Using graphite as the composite target of the base layer 200 can greatly reduce the weight, improve the thermal capacity, and significantly reduce the cooling time.

[0193] In addition, those skilled in the art should understand that, although there are many problems in the prior art, each embodiment or technical solution of the present invention can be improved in only one or several aspects, without having to solve all the technical problems listed in the prior art or background technology at the same time. Those skilled in the art should understand that the content not mentioned in a claim should not be used as a limitation on the claim.

[0194] Although terms such as substrate layer, track layer, etc. are used more frequently in this article, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention; the terms "first", "second", etc. (if any) in the description and claims of the embodiments of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0195] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A composite layer structure for reducing the stress of a rotating anode target track layer and a substrate layer, comprising a substrate layer and a track layer; characterized in that: The upper surface of the base layer is covered with a transition layer, and the upper surface of the transition layer is covered with a track layer; The thermal expansion coefficient of the transition layer is between the thermal expansion coefficient of the base layer and the thermal expansion coefficient of the track layer; the transition layer comprises the following components by mass percentage: 20% to 70% W, 10% to 50% Mo, 5% to 20% T, and 5% to 20% Z; The T is one or a combination of two of Re and Ta; and the Z is one or a combination of one or more of Nb, Hf and Ti.

2. The composite layer structure for reducing the stress of the rotating anode target track layer and the substrate layer according to claim 1, characterized in that: The base layer is made of TZM molybdenum alloy, and the track layer is made of tungsten-rhenium alloy.

3. The composite layer structure for reducing stress of the rotating anode target track layer and the substrate layer according to claim 2, characterized in that: The matrix layer comprises the following components by mass percentage: 0.1% to 1% Ti, 0.05% to 0.2% Zr, 0.01% to 0.2% C, and 98.6% to 99.84% Mo; The track layer includes the following components: 80% to 99% W, 1% to 20% Re.

4. The composite layer structure for reducing stress of the rotating anode target track layer and the substrate layer according to claim 1, characterized in that: The thickness of the transition layer is (0.2-1.2) mm.

5. A method for preparing a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: S100, weighing raw materials: weighing the raw materials of the track layer, transition layer and base layer respectively according to a certain mass; S200, preparing the composite layer structure of the track layer, transition layer and base layer; wherein the transition layer is prepared by arc melting, powder metallurgy, 3D printing or plastic processing.

6. The method for preparing a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer according to claim 5, characterized in that: S200, preparing the composite layer structure of the track layer, transition layer and base layer: S210, preparing the transition layer by arc melting method: S211, using W metal strips, Mo metal strips, T metal strips, and Z metal strips as electrodes to prepare a transition layer alloy material by an arc melting method; S212, subjecting the alloy material obtained in S211 to a heat treatment, and then to a warm treatment; S213, performing surface forming processing on the alloy material obtained in S212 according to size requirements to obtain a transition layer with a certain shape; S220, preparing the track layer and the base layer respectively by powder metallurgy; S230, stacking the three layers of materials of the track layer, the transition layer and the base layer, and subjecting them to a pressurized, heated and composite treatment in a vacuum or argon or hydrogen environment to obtain the product.

7. The method for preparing a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer according to claim 6, characterized in that: In the S211, the arc melting process is performed at a voltage of 5 to 50 V, a current of 100 to 1000 A, and is performed under an argon atmosphere; In the step S212, the hot working temperature is 1600-1800°C, and the warm working temperature is 600-1200°C; In the S230, the pressure in the pressurized heating composite treatment is 0.01MPa-50MPa, the temperature is raised to 1500°C-2500°C, the temperature is kept for 10min-100min, and then cooled to obtain; wherein, the S230 is performed in a vacuum or argon or hydrogen environment, the vacuum degree in the vacuum environment is ≤100Pa, and the pressure in the argon or hydrogen environment is (1-1.2)×10 5 Pa.

8. The method for preparing a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer according to claim 5, characterized in that: S200, preparing the composite layer structure of the track layer, transition layer and base layer by powder metallurgy: S210, laying the raw material powder of the track layer, the raw material powder of the transition layer and the raw material powder of the matrix layer in a mold respectively, and obtaining a composite compact by cold isostatic pressing; S220, sintering the composite green sheet at 1500-2500° C. in a vacuum or hydrogen or argon environment to obtain a sintered composite green sheet; S230, subjecting the sintered composite blank obtained in S220 to a heat treatment at 1600-1800° C., and then to a warm treatment at 600-1200° C.; S240, performing surface forming processing on the product obtained in S230 according to size requirements to obtain a composite layer structure with a certain shape.

9. The method for preparing a composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer according to claim 5, characterized in that: S200, preparing the composite layer structure of the track layer, transition layer and base layer by 3D printing method: S210, mixing the raw material powder of the track layer, the raw material powder of the transition layer, and the raw material powder of the base layer respectively, and preparing a track layer with a certain shape, a transition layer with a certain shape, and a base layer with a certain shape respectively by 3D printing; S220, pressurizing and compounding the prepared track layer, transition layer and base layer at high temperature to obtain a composite layer structure.

10. A target plate, characterized in that: A composite layer structure for reducing stress of a rotating anode target track layer and a substrate layer as described in any one of claims 1 to 4 is arranged above the heat storage layer of the target disk.

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