Display panel, display device, and method for manufacturing display panel

Abstract

The present application provides a display panel, a display device, and a method for manufacturing a display panel. The display panel has a display area and a non-display area located on the periphery of the display area. The display panel includes a substrate, a light-emitting device layer, a first barrier, a dam, and a packaging module. The light-emitting device layer is arranged on one side of the substrate and is located in the display area. The dam is arranged on the same side of the substrate and is located in the non-display area. The dam is located on one side of the display area along a first direction, and the first direction is parallel to the plane of the substrate. The first barrier is arranged on the side of the dam facing away from the substrate. The first barrier includes a first portion and a second portion located on the side of the first portion facing away from the substrate. The second portion is arranged at least partially beyond the first portion in the first direction. The packaging module is located on the side of the light-emitting device layer facing away from the substrate. At least part of the film layer of the packaging module extends to the side of the first barrier facing away from the display area via the outer contours of the dam, the first portion, and the second portion.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] OLED (Organic Light Emitting Diode) display is a self-luminous display. Compared with LCD (liquid crystal display), OLED display does not require a backlight, so OLED display is lighter and thinner. In addition, OLED display also has the advantages of high brightness, low power consumption, wide viewing angle, high response speed, and wide operating temperature range, and is increasingly used in various high-performance display fields.

[0003] However, OLED displays are susceptible to corrosion from water and oxygen, which reduces their lifespan. Thin-film encapsulation technology is typically used to block water and oxygen intrusion. However, existing thin-film encapsulation technology is prone to separation or breakage due to stress and other factors during reliability testing, increasing the risk of water vapor intrusion. Summary of the Invention

[0004] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve packaging reliability.

[0005] In a first aspect, embodiments of the present application provide a display panel having a display area and a non-display area located around the display area. The display panel includes a substrate, a light-emitting device layer, a first barrier, a dam, and an encapsulation module. The light-emitting device layer is disposed on one side of the substrate and is located within the display area. The dam is disposed on the same side of the substrate and is located in the non-display area. The dam is located on one side of the display area along a first direction parallel to the plane of the substrate. The first barrier is disposed on a side of the dam facing away from the substrate. The first barrier is located on one side of the display area along the first direction. The first barrier includes a first portion and a second portion located on a side of the first portion facing away from the substrate. The second portion is disposed at least partially beyond the first portion in the first direction.

[0006] The packaging module is located on the side of the light emitting device layer away from the substrate, and at least part of the film layer of the packaging module extends to the side of the first blocking portion away from the display area via the outer contour of the dam, the first part and the second part.

[0007] In some embodiments, the second portion includes a first protrusion, an orthographic projection of the first protrusion on the substrate is located outside an orthographic projection of the first portion on the substrate;

[0008] The packaging module includes a first inorganic layer, the first inorganic layer includes a first sub-segment and a second sub-segment connected to each other, the first sub-segment is located on a side of the second portion facing the substrate, and an orthographic projection of the first sub-segment on the substrate is located within an orthographic projection of the first protrusion on the substrate;

[0009] The thickness of at least part of the first sub-segment is smaller than the thickness of the second sub-segment.

[0010] In some embodiments, the first sub-segment includes a first segment attached to the first protrusion, a second segment attached to the first portion and connected to the first segment, and a third segment connected to the second segment and arranged opposite to the first segment in the thickness direction of the substrate, and the thickness of at least one of the first segment, the second segment and the third segment is less than the thickness of the second sub-segment.

[0011] In some embodiments, the thicknesses of the first segment, the second segment, and the third segment are all smaller than the thickness of the second subsegment.

[0012] In some embodiments, the packaging module further includes a first organic layer disposed on a side of the first inorganic layer facing away from the substrate, and the first organic layer is located on a side of the first blocking portion facing the display area.

[0013] In some embodiments, the encapsulation module further includes a second inorganic layer located on a side of the first organic layer facing away from the substrate;

[0014] The first sub-segment encloses a first accommodation space. The second inorganic layer includes a third sub-segment and a fourth sub-segment connected to each other. The third sub-segment is located in the first accommodation space.

[0015] In some embodiments, the thickness of at least a portion of the third subsegment is less than the thickness of the fourth subsegment.

[0016] In some embodiments, the first protrusion is located on a side of the first portion facing away from the display area.

[0017] In some embodiments, the second portion further includes a second protrusion, and the second protrusion is located on a side of the first portion close to the light-emitting device layer.

[0018] In some embodiments, the first protrusion and the second protrusion are distributed axially symmetrically.

[0019] In some embodiments, the display panel further includes a pixel definition layer, the pixel definition layer includes a plurality of first openings, and the plurality of light-emitting layers of the light-emitting device layer are accommodated in the first openings;

[0020] The pixel definition layer includes an inorganic material, and the dam includes a third part. The third part is provided in the same layer and material as the pixel definition layer and is laminated to the first inorganic layer.

[0021] In some embodiments, the pixel definition layer includes at least one of silicon nitride and silicon oxide.

[0022] In some embodiments, the display panel also includes a limiting portion located in the display area and arranged on the side of the pixel definition layer facing away from the substrate, the limiting portion includes a first sub-portion and a second sub-portion located on the side of the first sub-portion facing away from the substrate, the first sub-portion is arranged in the same layer and material as the first portion, and the second sub-portion is arranged in the same layer and material as the second portion.

[0023] In some embodiments, the second subsection is disposed at least partially beyond the first subsection in the first direction.

[0024] In some embodiments, the light-emitting device layer further includes a first electrode layer disposed on a side of the light-emitting layer facing away from the substrate, the first electrode layer including a plurality of first electrodes;

[0025] The defining portion forms a plurality of second openings, the material of the first sub-portion and / or the second sub-portion includes a metal material, and two adjacent first electrodes are connected to each other through the defining portion.

[0026] In some embodiments, the material of the first subsection includes a metallic material, and the material of the second subsection includes an inorganic material.

[0027] In a second aspect, an embodiment of the present application provides a display device, comprising the display panel in any of the aforementioned embodiments.

[0028] In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area and a non-display area located around the display area, the manufacturing method comprising:

[0029] forming a dam on one side of the substrate, the dam being located in the non-display area and on one side of the display area along a first direction, wherein the first direction is parallel to the plane where the substrate is located;

[0030] Disposing a predetermined film layer on the same side of the substrate and patterning the predetermined film layer to form a first portion and a second portion that are in contact with each other, wherein the first portion is located on a side of the dam facing away from the substrate, the second portion is located on a side of the first portion facing away from the substrate, and the second portion at least partially extends beyond the first portion in a first direction;

[0031] forming at least a portion of the structure in the light emitting device layer on the same side of the substrate;

[0032] A packaging module is formed on the side of the light emitting device layer away from the substrate, and at least part of the film layer of the packaging module extends to the side of the first blocking portion away from the display area via the outer contours of the dam, the first part and the second part.

[0033] In some embodiments, the dam includes a third portion, and the step of forming the dam on one side of the substrate includes:

[0034] A pixel definition material layer is provided on one side of the substrate, and the pixel definition material layer is patterned to form a pixel definition layer and a third portion, wherein the pixel definition layer includes a plurality of first openings located in the display area;

[0035] The steps of providing a preset film layer on the same side of the substrate and patterning the preset film layer include:

[0036] The predetermined film layer is patterned to form a first sub-portion and a second sub-portion in contact with each other, wherein the first sub-portion is located on a side of the pixel definition layer facing away from the substrate, and the second sub-portion is located on a side of the first sub-portion facing away from the substrate, and the first sub-portion and the second sub-portion together form a plurality of second openings;

[0037] The light-emitting device layer includes a plurality of first electrodes, and the step of forming at least a portion of the structure in the light-emitting device layer on the same side of the substrate includes:

[0038] A first electrode is formed in the second opening.

[0039] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. The display panel is provided with a first barrier portion on the dam, so that the extension length of at least part of the film layer in the packaging module is increased. And because the second portion of the first barrier portion is at least partially beyond the first portion in the first direction, the part of the film layer needs to bend and extend at the corresponding position of the second portion, thereby further increasing the extension length. Furthermore, if cracks appear in part of the film layer in the packaging module, this design will increase the path for the crack to extend to the display area, thereby reducing the risk of the crack extending inward to the display area, thereby improving the reliability of the packaging module and meeting the packaging needs of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 is a structural diagram of a display panel provided in an embodiment of the present application;

[0042] Figure 2 1 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application at position AA;

[0043] Figure 3 1 is a schematic diagram of a cross-sectional structure of a display panel at position BB provided in an embodiment of the present application;

[0044] Figure 4 is a schematic cross-sectional structural diagram of another display panel provided in an embodiment of the present application;

[0045] Figure 5 yes Figure 2 Schematic diagram of the enlarged structure of the middle region Q;

[0046] Figure 6 1 is a schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present application at position AA;

[0047] Figure 7 1 is a schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present application at position AA;

[0048] Figure 8 yes Figure 7 Schematic diagram of the enlarged structure of the middle region P;

[0049] Figure 9 1 is a schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present application at position AA;

[0050] Figure 10 1 is a schematic diagram of a cross-sectional structure of another display panel provided in an embodiment of the present application at position BB;

[0051] Figure 11 is a structural schematic diagram of a display device provided in an embodiment of the present application;

[0052] Figure 12 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0053] Figures 13a-13d This is a schematic diagram of the process structure of a method for manufacturing a display panel provided in an embodiment of the present application;

[0054] Figure 14 This is a schematic diagram of the process structure of a method for manufacturing a display panel provided in an embodiment of the present application;

[0055] Figure 15 This is a schematic diagram of the process structure of a method for manufacturing a display panel provided in an embodiment of the present application;

[0056] Figure 16 This is a schematic diagram of the process structure of a method for preparing a display panel provided in an embodiment of the present application.

[0057] Marking Description:

[0058] 1. Substrate;

[0059] 2. Light-emitting device layer; 21. Light-emitting unit; 211. Light-emitting layer; 212. Second electrode;

[0060] 3. First blocking portion; 31. First portion; 32. Second portion; 321. First protrusion; 322. Second protrusion;

[0061] 4. Encapsulation module; 41. First inorganic layer; 411. First subsegment; 411a. First segment; 411b. Second segment; 411c. Third segment; 412. Second subsegment; 42. First organic layer; 43. Second inorganic layer; 431. Third subsegment; 431a. Fourth segment; 431b. Fifth segment; 431c. Sixth segment; 432. Fourth subsegment;

[0062] 5. a second blocking portion;

[0063] 6. pixel definition layer; 61. first opening;

[0064] 7. Dam; 71. Part III;

[0065] 8. First electrode layer; 81. First electrode;

[0066] 9. Limiting portion; 91. First sub-portion; 92. Second sub-portion; 93. Second opening;

[0067] AA, display area; NA, non-display area;

[0068] A1, first accommodation space; A2, second accommodation space;

[0069] X, first direction; Y, thickness direction. DETAILED DESCRIPTION

[0070] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0071] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0072] Organic light-emitting diodes (OLEDs) are current-mode organic light-emitting devices that emit light through carrier injection and recombination, and can be used as light-emitting elements in display panels. However, when exposed to moisture and air, OLEDs experience rapid performance degradation, reducing the reliability and lifespan of display panels. Therefore, effective packaging methods are needed to limit the impact of water and oxygen penetration on OLEDs.

[0073] Conventional technology typically places an encapsulation module over the light-emitting element, covering it to prevent the intrusion of water and oxygen. However, due to the poor elasticity of some film layers within the encapsulation module, cracks can form under the influence of external forces and other factors. If these cracks extend into the location of the light-emitting element, the encapsulation module's barrier to water and oxygen will be compromised, leading to poor encapsulation and other issues.

[0074] In order to solve the above problems, the present invention provides a display panel. Figures 1 to 3 The display panel has a display area AA and a non-display area NA located around the display area AA. The display panel includes a substrate 1, a light-emitting device layer 2, a first barrier 3, a dam 7, and an encapsulation module 4. The light-emitting device layer 2 is disposed on one side of the substrate 1 and located within the display area AA. The dam 7 is disposed on the same side of the substrate 1 and located in the non-display area NA. The dam 7 is located on one side of the display area AA along a first direction X, which is parallel to the plane of the substrate 1. Specifically, the dam 7 can be disposed around the display area AA.

[0075] The first barrier 3 is arranged on the side of the dam 7 facing away from the substrate 1 , and includes a first portion 31 and a second portion 32 located on the side of the first portion 31 facing away from the substrate 1 . The second portion 32 is arranged in the first direction X at least partially beyond the first portion 31 .

[0076] The packaging module 4 is located on the side of the light-emitting device layer 2 away from the substrate 1 . At least part of the film layer of the packaging module 4 extends to the side of the first barrier portion 3 away from the display area AA via the outer contours of the dam 7 , the first portion 31 and the second portion 32 .

[0077] The display panel is divided into a display area AA and a non-display area NA. The display area AA refers to the area with display function. The shape and size of the display area AA are not limited in the embodiment of the present application. For example, the display area AA can be a square or circular structure. The non-display area NA is arranged around the display area AA. The non-display area NA refers to the area that does not have the function of the display area AA. Various signal lines are usually arranged in the non-display area NA for driving and realizing different functions.

[0078] The light emitting device layer 2 is located on one side of the substrate 1 and includes a plurality of light emitting units 21 for achieving display effects. For example, the light emitting device layer 2 includes a red light emitting unit for emitting red light, a green light emitting unit for emitting green light, and a blue light emitting unit for emitting blue light.

[0079] The encapsulation module 4 is provided to cover the light-emitting device layer 2 to prevent moisture from entering the interior of the light-emitting device layer 2. The light-emitting device layer 2 is located within the display area AA. A portion of the encapsulation module 4 is located within the display area AA and covers the light-emitting device layer 2, while another portion is located within the non-display area NA. This reduces the risk of moisture, oxygen, and other pollutants from the non-display area NA of the display panel penetrating into the display area AA. The encapsulation module 4 may include multiple different film layers, and the present embodiment does not limit the number or types of film layers within the encapsulation module 4.

[0080] The dam 7 is disposed in the non-display area NA and is co-located with the light-emitting device layer 2. The dam 7 restricts some of the film layers in the encapsulation module 4 to the side of the dam 7 facing the display area AA. The first barrier 3 is disposed on the side of the dam 7 facing away from the substrate, i.e., the first barrier 3 is also located within the non-display area NA. The dam 7 can be formed by stacking multiple film layers. For example, the dam 7 can be formed by stacking inorganic layers and metal layers.

[0081] Because the dam 7 is located on one side of the display area along the first direction X, the first barrier 3 is also located on one side of the display area AA along the first direction X. For example, the first direction X is perpendicular to the thickness direction Y of the display panel. The first barrier 3 includes a first portion 31 and a second portion 32. The second portion 32 is located on a side of the first portion 31 facing away from the substrate 1. That is, in the thickness direction Y, the second portion 32 and the substrate 1 are located on either side of the first portion 31.

[0082] The second portion 32 is disposed at least partially beyond the first portion 31 in the first direction X. In other words, the orthographic projection of the second portion 32 on the substrate 1 is at least partially located outside the orthographic projection of the first portion 31 on the substrate 1. The second portion 32 may be disposed beyond the first portion 31 on a side close to the display area AA, or may be disposed beyond the first portion 31 on a side away from the display area AA, and this is not limited in this embodiment of the present application.

[0083] It should be noted that the orthographic projection of the second portion 32 on the substrate 1 can completely cover and extend beyond the first portion 31, or the orthographic projection of the second portion 32 on the substrate 1 can only overlap with a portion of the structure of the first portion 31, and this is not limited in this embodiment of the present application. Furthermore, the size of the second portion 32 in the first direction X can be greater than the size of the first portion 31 in the first direction X, or can be equal to or smaller than the size of the first portion 31 in the first direction X.

[0084] At least a portion of the film layer of the encapsulation module 4 extends through the outer contours of the dam 7, the first portion 31, and the second portion 32 to the side of the first barrier portion 3 facing away from the light-emitting device layer 2. Specifically, at least a portion of the film layer in the encapsulation module 4 is located within the display area AA and covers the light-emitting device layer 2. This portion of the film layer extends from the display area AA into the non-display area NA and reaches the dam 7. It then extends along the dam 7 to the location of the first portion 31 of the first barrier portion 3. The film layer then extends along the outer contour of the first portion 31 away from the substrate 1 to the second portion 32. It then continues to extend along the outer contour of the second portion 32. Because the second portion 32 at least partially extends beyond the first portion 31 in the first direction X, the film layer bends and extends where the second portion 32 extends beyond the first portion 31. This increases the extension length of the film layer at the second portion 32. Finally, the film layer reaches the side of the first portion 31 facing away from the light-emitting device layer 2, continues to extend along the outer contours of the first portion 31 and the dam 7, and ultimately leaves the first barrier portion 3 and the dam 7.

[0085] In the embodiment of the present application, a first barrier portion 3 is added to the dam 7, thereby increasing the extension length of at least a portion of the film layer in the packaging module 4. Furthermore, because the second portion 32 of the first barrier portion 3 at least partially extends beyond the first portion 31 in the first direction X, the portion of the film layer needs to bend and extend at the position corresponding to the second portion 32, thereby further increasing the extension length. Furthermore, if a crack appears in a portion of the film layer in the packaging module 4, this design increases the path for the crack to extend to the display area AA, thereby reducing the risk of the crack extending inward to the display area AA, thereby improving the reliability of the packaging module 4 and meeting the packaging requirements of the display panel.

[0086] It should be noted that the number of the dams 7 can be multiple, and the multiple dams 7 are arranged side by side. On this basis, in addition to the first blocking portion 3, the display panel can also include Figure 4 As shown, it includes a second barrier portion 5 having the same structure as the first barrier portion 3 or even more barrier portions. The first barrier portion 3 can be located on the side of the second barrier portion 5 close to the display area or on the side of the second barrier portion 5 away from the display area, which is not limited in this embodiment of the present application.

[0087] In some embodiments, see Figure 2 、 Figure 3 and Figure 5 The second portion 32 includes a first protrusion 321. The orthographic projection of the first protrusion 321 on the substrate 1 is located outside the orthographic projection of the first portion 31 on the substrate 1. The packaging module 4 includes a first inorganic layer 41. The first inorganic layer 41 includes a first subsegment 411 and a second subsegment 412 that are interconnected. The first subsegment 411 is located on the side of the second portion 32 facing the substrate 1, and the orthographic projection of the first subsegment 411 on the substrate 1 is located within the orthographic projection of the first protrusion 321 on the substrate 1. The thickness of at least a portion of the first subsegment 411 is less than the thickness of the second subsegment 412.

[0088] The encapsulation module 4 includes a first inorganic layer 41. Part of this layer is located within the display area AA and covers the light-emitting device layer 2. The remaining portion is located within the non-display area NA. At the location of the first barrier 3, the first inorganic layer 41 follows the outer contours of the first portion 31 and the second portion 32, extending from the side of the first barrier 3 closest to the display area AA to the side of the first barrier 3 farther from the display area AA.

[0089] The first protrusion 321 is a structure in the second part 32 that extends beyond the first part 31. The first protrusion 321 is located on the side of the orthographic projection of the first part 31 on the substrate 1 in the first direction X. The first protrusion 321 can be located on the side of the first part 31 close to the display area AA, or on the side of the first part 31 away from the display area AA. Since the first protrusion 321 protrudes from the first part 31 in the first direction X, the first protrusion 321 and the first part 31 can jointly form a second accommodating space A2, wherein the first sub-segment 411 in the first inorganic layer 41 is located in the second accommodating space A2. Figure 5 In the figure, the second accommodation space A2 is indicated by a dotted box.

[0090] The second sub-segment 412 is connected to the first sub-segment 411 . The second sub-segment 412 includes two parts, one of which is located on the side of the second part 32 facing away from the substrate 1 , and the other part is offset from the orthographic projection of the second part 32 on the substrate 1 and is arranged adjacent to the orthographic projection of the second part 32 on the substrate 1 .

[0091] The first inorganic layer 41 is typically formed by chemical vapor deposition or other methods. During the preparation of the first inorganic layer 41, the first protrusion 321 obstructs the deposition of material within the second accommodating space A2, reducing the thickness of at least a portion of the first subsegment 411 formed within the second accommodating space A2. This can make it difficult for the material within the second accommodating space A2 to be continuously formed, resulting in the first subsegment 411 being divided into multiple independent sections.

[0092] Furthermore, since the thickness of at least part of the first sub-segment 411 is relatively small, it may even break, which will increase the difficulty of extending the crack inward at the first sub-segment 411. Therefore, when a crack appears in the first inorganic layer 41, the existence of the first sub-segment 411 can further reduce the difficulty of the crack extending inward to the display area AA, thereby improving the packaging reliability of the packaging module 4.

[0093] In some embodiments, the first sub-segment 411 includes a first segment 411a that is attached to the first protrusion 321, a second segment 411b that is attached to the first portion 31 and connected to the first segment 411a, and a third segment 411c that is connected to the second segment 411b and is arranged opposite to the first segment 411a in the thickness direction Y. The thickness of at least one of the first segment 411a, the second segment 411b and the third segment 411c is less than the thickness of the second sub-segment 412.

[0094] The first segment 411a and the third segment 411c are both connected to the second sub-segment 412, and the second segment 411b connects the first segment 411a and the third segment 411c into one. The second segment 411b is located on one side of the first part 31 in the first direction X and is arranged in contact with the first part 31. The second segment 411b has a first end and a second end in the thickness direction Y, and the first end is located on the side of the second end away from the substrate 1. The first segment 411a is connected to the first end, and the third segment 411c is connected to the second end.

[0095] During the preparation process, the reaction gas diffuses into the second storage space A2 and adsorbs on the surfaces of the first protrusion and the first portion 31, where it undergoes a chemical reaction, forming the first segment 411a, the second segment 411b, and the third segment 411c. During this process, the first protrusion blocks the reaction gas from entering the second storage space A2, resulting in at least one of the first segment 411a, the second segment 411b, and the third segment 411c having a thickness less than that of the second sub-segment 412. Alternatively, the thickness of each of the first segment 411a, the second segment 411b, and the third segment 411c is less than that of the second sub-segment 412.

[0096] In some embodiments, see Figure 1 and Figure 6 The packaging module 4 further includes a first organic layer 42 disposed on a side of the first inorganic layer 41 facing away from the substrate 1 . The first organic layer 42 is located on a side of the first barrier portion 3 facing the display area AA.

[0097] Inorganic materials have a strong barrier to water and oxygen, but their inherent elasticity is low and they are prone to fracture. While organic materials have a poor barrier to water and oxygen, their presence can reduce the risk of inorganic materials fracturing. Therefore, in this embodiment, a first organic layer 42 is added to the first inorganic layer 41 to improve the packaging effect and reliability of the packaging module 4.

[0098] The first organic layer 42 can be arranged to cover the light-emitting device layer 2. The first organic layer 42 is located on the side of the first barrier portion 3 facing the display area AA in the first direction X. Similar to the dam 7, the first barrier portion 3 can also limit the first organic layer 42. Therefore, the first barrier portion 3 can increase the height of the display panel at the corresponding position of the dam 7, thereby further reducing the risk of the first organic layer 42 flowing over the dam 7 and simplifying the manufacturing difficulty of the packaging module 4.

[0099] It should be noted that the presence of the first organic layer 42 reduces the risk of cracks forming in the display area AA of the encapsulation module 4. However, on the side of the first barrier 3 away from the display area AA, the first organic layer 42 is absent from the encapsulation module 4. Therefore, the first inorganic layer 41 there is more susceptible to cracks under external forces. The presence of the first barrier 3 reduces the risk of cracks extending inward toward the display area AA, thereby improving the reliability of the encapsulation module 4.

[0100] In some embodiments, see Figure 7 and Figure 8 The packaging module 4 also includes a second inorganic layer 43 located on the side of the first organic layer 42 facing away from the substrate 1. The first sub-segment 411 encloses a first accommodating space A1. The second inorganic layer 43 includes a third sub-segment 431 and a fourth sub-segment 432 that are interconnected. The third sub-segment 431 is located in the first accommodating space A1.

[0101] On the side of the first barrier 3 near the display area AA, the first inorganic layer 41 and the second inorganic layer 43 are located on either side of the first organic layer 42 in the thickness direction Y. The first inorganic layer 41 and the second inorganic layer 43 completely cover the first organic layer 42, thereby reducing the flow of the first organic layer 42. This overlapping arrangement of organic and inorganic layers also improves the encapsulation effect of the encapsulation module 4. On the side of the first barrier 3 away from the display area AA, since the first organic layer 42 is not present, the first inorganic layer 41 and the second inorganic layer 43 are laminated.

[0102] Please also refer to Figure 5 During the fabrication process, the second inorganic layer 43 is formed after the first inorganic layer 41. After the first inorganic layer 41 is formed, the first segment 411a, the second segment 411b, and the third segment 411c located within the second accommodation space A2 together enclose the first accommodation space A1. The third subsegment 431 of the second inorganic layer 43 is formed within the first accommodation space A1. For example, the third subsegment 431 includes a fourth segment 431a attached to the first segment 411a, a fifth segment 431b attached to the second segment 411b, and a sixth segment 431c attached to the third segment 411c.

[0103] In some embodiments, the thickness of at least a portion of the third sub-segment 431 is smaller than the thickness of the fourth sub-segment 432 .

[0104] Similar to the first sub-segment 411, it is also difficult for the reaction gas to enter the first storage space A1, thereby reducing the amount of material deposition in the first storage space A1, and further causing at least part of the thickness of the third sub-segment 431 formed in the first storage space A1 to be smaller than the thickness of the fourth sub-segment 432.

[0105] In the embodiment of the present application, because the second portion 32 is at least partially positioned beyond the first portion 31 in the first direction X, the extension lengths of the first inorganic layer 41 and the second inorganic layer 43 are increased. Furthermore, the first inorganic layer 41 can be formed into a first sub-segment 411 with a relatively small thickness, and the second inorganic layer 43 can be formed into a third sub-segment 431 with a relatively small thickness. Cracks are less likely to extend in the first sub-segment 411 and the third sub-segment 431, thereby reducing the risk of cracks in the first and second inorganic layers 41, 43 in the display area AA and improving the packaging reliability of the packaging module 4.

[0106] In some embodiments, the first protrusion 321 is located on a side of the first portion 31 away from the display area AA.

[0107] From the above content, it can be seen that the existence of the first protrusion 321 can enable the first inorganic layer 41 and the second inorganic layer 43 to form a first sub-segment 411 and a third sub-segment 431 with smaller thicknesses, respectively. The first sub-segment 411 and the third sub-segment 431 can increase the difficulty of crack extension, thereby reducing the risk of crack extension into the display area AA.

[0108] Furthermore, in the embodiment of the present application, the first protrusion 321 is arranged on the side of the first portion 31 away from the display area AA, so that the first sub-segment 411 and the third sub-segment 431 are formed on the side of the first portion 31 away from the display area AA, thereby blocking the crack on the side of the first portion 31 away from the display area AA, further reducing the risk of the crack extending to the display area AA.

[0109] In some embodiments, see Figure 1 and Figure 9 The second portion 32 further includes a second protrusion 322 , and the second protrusion 322 is located on a side of the first portion 31 close to the display area AA.

[0110] The first protrusion 321 and the second protrusion 322 are located on either side of the first portion 31 in the first direction X, meaning that the second portion 32 is larger than the first portion 31 in the first direction X. The design of the second protrusion 322 can further increase the extension length of the first inorganic layer 41 and the second inorganic layer 43. At the same time, at the corresponding position of the second protrusion 322 and on the side of the second protrusion 322 closer to the substrate 1, the local thickness of the first inorganic layer 41 and the second inorganic layer 43 is reduced, thereby further isolating cracks and improving the reliability of the packaging module 4. Optionally, the first protrusion 321 and the second protrusion 322 are distributed axially symmetrically.

[0111] In some embodiments, see Figure 1 、 Figure 3 as well as Figure 9 The display panel further includes a pixel definition layer 6 , which includes a plurality of first openings 61 , wherein the plurality of light-emitting layers 211 of the light-emitting device layer 2 are accommodated in the first openings 61 , and the pixel definition layer 6 includes an inorganic material.

[0112] The dam 7 includes a third portion 71 . The third portion 71 is provided in the same layer and with the same material as the pixel definition layer 6 and is laminated to the first inorganic layer 41 .

[0113] In related art, the inorganic layer in the packaging module 4 primarily overlaps with the metal layer and also with the organic film layer. However, due to material differences, the adhesion between the inorganic layer and the metal or organic film layer in the packaging module 4 is poor, making it easy for the film layers to separate under the influence of external forces.

[0114] In the embodiment of the present application, the first opening 61 in the pixel definition layer 6 is used to define the light-emitting layer 211 in the light-emitting device layer 2. The light-emitting layer 211 is a part of the light-emitting unit 21. Exemplarily, the light-emitting unit 21 further includes a first electrode located on a side of the light-emitting layer 211 facing away from the substrate 1, and a second electrode 212 located on a side of the light-emitting layer 211 facing the substrate 1.

[0115] The pixel definition layer 6 includes an inorganic material, and the third portion 71 of the dam 7 is formed from the same layer and material as the pixel definition layer 6. Therefore, the third portion 71 can be formed in the same process as the pixel definition layer 6, reducing process complexity. Furthermore, the third portion 71 also includes an inorganic material.

[0116] The third portion 71 and the first inorganic layer 41 are both made of inorganic materials and are laminated together. This design can improve the adhesion between the dam 7 and the first inorganic layer 41, reduce the risk of separation between the two, and improve the reliability of the internal structure of the display panel. Optionally, the pixel definition layer 6 includes at least one of silicon nitride and silicon oxide. Furthermore, the first inorganic layer 41 may also include at least one of silicon nitride and silicon oxide.

[0117] In some embodiments, see Figure 9 and Figure 10 The display panel also includes a limiting portion 9 located in the display area AA and arranged on the side of the pixel definition layer 6 facing away from the substrate 1. The limiting portion 9 includes a first sub-portion 91 and a second sub-portion 92 located on the side of the first sub-portion 91 facing away from the substrate 1. The first sub-portion 91 is arranged in the same layer and material as the first portion 31, and the second sub-portion 92 is arranged in the same layer and material as the second portion 32.

[0118] The defining portion 9 is located on the side of the pixel definition layer 6 facing away from the substrate 1. The provision of the defining portion 9 can increase the height of the display panel at the location of the pixel definition layer 6. When the packaging module 4 encapsulates the light-emitting unit 21, the presence of the defining portion 9 can separate at least part of the structure of the packaging module 4 into independently arranged packaging parts, thereby preventing moisture and the like from spreading between the independent packaging parts, further improving the packaging effect.

[0119] In addition, the first sub-section 91 and the first part 31 are provided with the same layer and the same material, so that the first sub-section 91 and the first part 31 can be prepared and formed in the same process; the second sub-section 92 and the second part 32 are provided with the same layer and the same material, so that the second sub-section 92 and the second part 32 can be prepared and formed in the same process, which can simplify the preparation process of the display panel and improve the preparation efficiency.

[0120] In some embodiments, the second sub-portion 92 is disposed at least partially beyond the first sub-portion 91 in the first direction X. The structure of the defining portion 9 is similar to that of the first blocking portion 3. During the preparation of the packaging module 4, at least some of the film layers in the packaging module 4 can be separated by the defining portion 9, thereby forming multiple packaging structures corresponding to the light-emitting units 21, thereby achieving independent packaging of each light-emitting unit 21 and further improving the packaging effect.

[0121] In addition, the presence of the limiting portion 9 can also reduce the risk of lateral leakage of adjacent light-emitting units. Specifically, in the process of preparing the display panel, the pixel definition layer 6 is usually formed first, and then the limiting portion 9 is formed on the pixel definition layer 6, and then the light-emitting layer 211, the hole transport layer (not shown in the figure) and the electron transport layer (not shown in the figure) and other film layers are formed between the adjacent limiting portions 9. Since the second sub-portion 92 of the limiting portion 9 is at least partially beyond the first sub-portion 91 in the first direction X, the second sub-portion 92 is partially suspended relative to the first sub-portion 91, and the light-emitting layer 211, the hole transport layer and the electron transport layer have great difficulty in climbing in the suspended area and breakage occurs, that is, the presence of the limiting portion 9 can separate the light-emitting layer 211, the hole transport layer and the electron transport layer and other film layers, making them into separate structures, thereby reducing the risk of lateral leakage of these film layers.

[0122] In some embodiments, the light-emitting device layer 2 also includes a first electrode layer 8 arranged on the side of the light-emitting layer 211 away from the substrate 1, the first electrode layer 8 includes a plurality of first electrodes 81, the defining portion 9 forms a plurality of second openings 93, the material of the first sub-portion 91 and / or the second sub-portion 92 includes a metal material, and two adjacent first electrodes 81 are connected to each other through the defining portion 9.

[0123] Metal materials are generally conductive, so adjacent first electrodes 81 can transmit signals through the defining portion 9. In the embodiment of the present application, the plurality of first electrodes 81 are separated from each other by the defining portion 9, and are also interconnected by the defining portion 9. That is, the plurality of first electrodes 81 and the defining portion 9 together form a common electrode for driving the light-emitting layer 211 to emit light.

[0124] In some embodiments, the material of the first sub-portion 91 includes a metal material, and the material of the second sub-portion 92 includes an inorganic material.

[0125] The first sub-portion 91 comprises a metal material, so that adjacent first electrodes 81 can be electrically connected through the first sub-portion 91. Furthermore, in the embodiment of the present application, the second sub-portion 92 is further comprised of an inorganic material, so that the second sub-portion 92 can reliably adhere to a portion of the inorganic film layer in the packaging module 4, thereby improving packaging reliability.

[0126] Second, see Figure 11 , an embodiment of the present application provides a display device, comprising a display panel according to any of the aforementioned embodiments.

[0127] It should be noted that the display device provided in the embodiment of the present application has the beneficial effects of the display panel in any of the aforementioned embodiments. Please refer to the aforementioned description of the display panel for details, and the embodiment of the present application will not be repeated here.

[0128] Thirdly, please refer to Figure 1213 , an embodiment of the present application provides a method for manufacturing a display panel, wherein the display panel has a display area AA and a non-display area NA located around the display area AA. The method includes:

[0129] S100: forming a dam on one side of the substrate, the dam being located in the non-display area and on one side of the display area along a first direction, wherein the first direction is parallel to the plane where the substrate is located.

[0130] In step S100, refer to Figure 13a The dam 7 is arranged in the non-display area NA. The arrangement of the dam 7 can isolate part of the film layer in the packaging module on the side of the dam 7 close to the display area AA when the packaging module is subsequently prepared.

[0131] S110: Disposing a preset film layer on the same side of the substrate, and patterning the preset film layer to form a first portion and a second portion that are in contact with each other, wherein the first portion is located on a side of the dam facing away from the substrate, and the second portion is located on a side of the first portion facing away from the substrate, and the second portion at least partially extends beyond the first portion in the first direction.

[0132] In step S110, refer to Figure 13b A predetermined film layer (not shown) is formed on the same side of the substrate 1 as the dam 7. The predetermined film layer is used to form the first portion 31 and the second portion 32. Specifically, the predetermined film layer includes two stacked portions, the materials of which can be the same or different. Because the second portion 32 to be formed by the predetermined film layer needs to extend beyond the first portion 31 in the first direction X, the predetermined film layer needs to be patterned to form the second portion 32 preferentially, rather than the first portion 31, through a process such as etching. The predetermined film layer is then patterned to form the first portion 31 through a process such as etching.

[0133] It should be noted that the second portion 32 can be arranged beyond the first portion 31 on the side close to the display area, or can be arranged beyond the first portion 31 on the side away from the display area, and the embodiment of the present application does not limit this.

[0134] S120: forming at least a portion of the structure in the light-emitting device layer on the same side of the substrate.

[0135] In step S120, refer to Figure 13c The light-emitting device layer 2 is formed in the display area AA, wherein the light-emitting device layer 2 includes a plurality of light-emitting units 21, and the plurality of light-emitting units 21 include but are not limited to red light-emitting units that emit red light, blue light-emitting units that emit blue light, and green light-emitting units that emit green light.

[0136] It should be noted that the light-emitting device layer 2 includes a multi-layer structure, wherein some of the film layers can be formed after step S110, while others can be formed before step S110, and this is not limited in this embodiment of the present application. S130: Forming an encapsulation module on the side of the light-emitting device layer facing away from the substrate, with at least some of the film layers of the encapsulation module extending through the outer contours of the dam, the first portion, and the second portion to the side of the first barrier portion facing away from the display area.

[0137] In step S130, refer to Figure 13d At least a portion of the film layer of the encapsulation module 4 adheres to the dam 7, the first portion 31, and the second portion 32, and extends to the side of the first barrier portion 3 facing away from the display area. During this process, because the second portion 32 at least partially extends beyond the first portion 31 in the first direction X, the corresponding extension length of at least a portion of the film layer in the encapsulation module 4 is increased. Furthermore, if a crack develops in a portion of the film layer in the encapsulation module 4, this design increases the path for the crack to extend to the display area, thereby reducing the risk of the crack extending inward to the display area. This, in turn, improves the reliability of the encapsulation module 4 and meets the encapsulation requirements of the display panel.

[0138] In some embodiments, see Figure 13a and Figure 14 The dam 7 includes a third portion 71. In step S100, the process includes forming a pixel definition material layer on one side of the substrate 1, and patterning the pixel definition material layer to form a pixel definition layer 6 and the third portion 71. The pixel definition layer 6 includes a plurality of first openings 61 located in the display area AA.

[0139] The pixel definition material layer (not shown) can also form the third portion 71 of the dam 7 simultaneously with the pixel definition layer 6, thereby simplifying the manufacturing process. The pixel definition layer 6 is located within the display area AA, and the first opening 61 in the pixel definition layer 6 is used to define the light-emitting layer 211 in the light-emitting device layer 2. Furthermore, optionally, the pixel definition material layer includes an inorganic material, that is, the third portion 71 includes an inorganic material. This design facilitates better adhesion of the inorganic layer in the packaging module to the dam 7, thereby improving the reliability of the packaging module 4.

[0140] See also Figure 15 In step S110, the process includes: patterning the preset film layer to form a first sub-portion 91 and a second sub-portion 92 that are in contact with each other, wherein the first sub-portion 91 is located on the side of the pixel definition layer 6 facing away from the substrate 1, and the second sub-portion 92 is located on the side of the first sub-portion 91 facing away from the substrate 1, and the first sub-portion 91 and the second sub-portion 92 together form a plurality of second openings 93.

[0141] The first subsection 91 and the second subsection 92 are both located within the display area AA and define a plurality of second openings 93 for forming the light-emitting device layer. The second subsection 92 is located on a side of the first subsection 91 facing away from the substrate 1. Optionally, the second subsection 92 is at least partially disposed beyond the first subsection 91 in the first direction X.

[0142] The first sub-section 91 and the first part 31 are provided with the same layer and the same material, and the first sub-section 91 and the first part 31 can be prepared and formed in the same process; the second sub-section 92 and the second part 32 are provided with the same layer and the same material, and the second sub-section 92 and the second part 32 can be prepared and formed in the same process, which can simplify the preparation process of the display panel and improve the preparation efficiency.

[0143] See also Figure 16 The light emitting device layer 2 includes a plurality of first electrodes 81 . In step S120 , the process includes forming the first electrodes 81 in the second openings 93 .

[0144] The plurality of second openings 93 can form a plurality of first electrodes 81, and the first sub-section 91 and the second sub-section 92 can separate and independently form the plurality of first electrodes 81. Optionally, at least one of the first sub-section 91 and the second sub-section 92 comprises a metal material, that is, at least one of the first sub-section 91 and the second sub-section 92 can transmit electrical signals. On this basis, the first sub-section 91 and the second sub-section 92 can achieve mutual conduction between the plurality of first electrodes 81, that is, at least one of the first sub-section 91 and the second sub-section 92 can cooperate with the plurality of first electrodes 81 to form a common electrode.

[0145] It should be noted that after forming the first sub-section 91 and the second sub-section 92, and before forming the first electrode 81, multiple functional film layers such as the hole transport layer, the light-emitting layer 211, and the electron transport layer in the light-emitting unit 21 can be formed in sequence in the first opening 61 and the second opening 93.

[0146] Although the embodiments disclosed in this application are as described above, the contents described are merely embodiments adopted to facilitate understanding of this application and are not intended to limit the present invention. Any person skilled in the art to which this application belongs may make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed in this application. However, the scope of protection of this application shall still be based on the scope defined by the appended claims.

[0147] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the scope of protection of this application.

Claims

1. A display panel, characterized in that: The display panel has a display area and a non-display area located around the display area, and includes: substrate; a light-emitting device layer, disposed on one side of the substrate and located in the display area; a dam, disposed on the same side of the substrate and located in the non-display area, the dam being located on one side of the display area along a first direction, wherein the first direction is parallel to the plane where the substrate is located; a first blocking portion, disposed on a side of the dam facing away from the substrate, the first blocking portion comprising a first portion and a second portion located on a side of the first portion facing away from the substrate, the second portion at least partially extending beyond the first portion in the first direction; an encapsulation module, located on a side of the light-emitting device layer facing away from the substrate, wherein at least a portion of the film layer of the encapsulation module extends through the outer contours of the dam, the first portion, and the second portion to a side of the first blocking portion facing away from the display area; a pixel definition layer, the pixel definition layer comprising a plurality of first openings, the plurality of light-emitting layers of the light-emitting device layer being accommodated in the first openings, the pixel definition layer comprising an inorganic material; A defining portion is located in the display area and is arranged on the side of the pixel definition layer away from the substrate. The defining portion includes a first sub-portion and a second sub-portion located on the side of the first sub-portion away from the substrate. The first sub-portion is arranged in the same layer and material as the first portion, and the second sub-portion is arranged in the same layer and material as the second portion. The defining portion separates at least part of the structure in the packaging module into packaging portions that are independently arranged.

2. The display panel according to claim 1, wherein: The second portion includes a first protrusion, wherein an orthographic projection of the first protrusion on the substrate is located outside an orthographic projection of the first portion on the substrate; The packaging module includes a first inorganic layer, the first inorganic layer includes a first sub-segment and a second sub-segment connected to each other, the first sub-segment is located on a side of the second portion facing the substrate, and an orthographic projection of the first sub-segment on the substrate is located within an orthographic projection of the first protrusion on the substrate; Wherein, the thickness of at least part of the first sub-segment is smaller than the thickness of the second sub-segment.

3. The display panel according to claim 2, wherein The first sub-segment includes a first segment attached to the first protrusion, a second segment attached to the first part and connected to the first segment, and a third segment connected to the second segment and arranged opposite to the first segment in the thickness direction of the substrate. The thickness of at least one of the first segment, the second segment and the third segment is less than the thickness of the second sub-segment.

4. The display panel according to claim 3, wherein: The thicknesses of the first segment, the second segment, and the third segment are all smaller than the thickness of the second sub-segment.

5. The display panel according to claim 2, wherein: The packaging module further includes a first organic layer disposed on a side of the first inorganic layer facing away from the substrate, and the first organic layer is located on a side of the first blocking portion facing the display area.

6. The display panel according to claim 5, wherein: The packaging module further includes a second inorganic layer located on a side of the first organic layer facing away from the substrate; The first sub-segments enclose a first accommodation space, the second inorganic layer includes a third sub-segment and a fourth sub-segment connected to each other, and the third sub-segment is located in the first accommodation space.

7. The display panel according to claim 6, wherein: The thickness of at least a portion of the third subsection is smaller than the thickness of the fourth subsection.

8. The display panel according to claim 2, wherein: The first protrusion is located on a side of the first portion away from the display area.

9. The display panel according to claim 8, wherein: The second portion further includes a second protrusion, and the second protrusion is located on a side of the first portion close to the display area.

10. The display panel according to claim 9, wherein: The first protrusion and the second protrusion are distributed in an axisymmetric manner.

11. The display panel according to claim 2, wherein: The dam includes a third portion, and the third portion is provided in the same layer and with the same material as the pixel definition layer, and is laminated to the first inorganic layer.

12. The display panel according to claim 11, wherein: The pixel definition layer includes at least one of silicon nitride and silicon oxide.

13. The display panel according to claim 1, wherein The second sub-portion is at least partially disposed beyond the first sub-portion in the first direction.

14. The display panel according to claim 1, wherein The light-emitting device layer further includes a first electrode layer provided on a side of the light-emitting layer away from the substrate, the first electrode layer including a plurality of first electrodes; The defining portion forms a plurality of second openings, the material of the first sub-portion and / or the second sub-portion includes a metal material, and two adjacent first electrodes are connected to each other through the defining portion.

15. The display panel according to claim 1, wherein The material of the first sub-section includes a metal material, and the material of the second sub-section includes an inorganic material.

16. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 15.

17. A method for preparing a display panel, characterized in that: The display panel has a display area and a non-display area located around the display area, and the manufacturing method includes: forming a dam on one side of the substrate, wherein the dam is located in the non-display area and on one side of the display area along a first direction, wherein the first direction is parallel to the plane where the substrate is located; A predetermined film layer is provided on the same side of the substrate, and the predetermined film layer is patterned to form a first barrier portion, wherein the first barrier portion includes a first portion and a second portion that contact each other, wherein the first portion is located on a side of the dam facing away from the substrate, and the second portion is located on a side of the first portion facing away from the substrate, and the second portion at least partially extends beyond the first portion in the first direction; forming at least a portion of the structure in the light emitting device layer on the same side of the substrate; forming a packaging module on a side of the light-emitting device layer away from the substrate, wherein at least a portion of the film layer of the packaging module extends through the outer contours of the dam, the first portion, and the second portion to a side of the first blocking portion away from the display area; The display panel includes: a pixel definition layer, the pixel definition layer comprising a plurality of first openings, the plurality of light-emitting layers of the light-emitting device layer being accommodated in the first openings, the pixel definition layer comprising an inorganic material; A defining portion is located in the display area and is arranged on the side of the pixel definition layer away from the substrate. The defining portion includes a first sub-portion and a second sub-portion located on the side of the first sub-portion away from the substrate. The first sub-portion is arranged in the same layer and material as the first portion, and the second sub-portion is arranged in the same layer and material as the second portion. The defining portion separates at least part of the structure in the packaging module into packaging portions that are independently arranged.

18. The preparation method according to claim 17, characterized in that The dam includes a third part, and the step of forming the dam on one side of the substrate includes: Disposing a pixel definition material layer on one side of the substrate, and patterning the pixel definition material layer to form a pixel definition layer and a third portion, wherein the pixel definition layer includes a plurality of first openings located in the display area; The steps of providing a preset film layer on the same side of the substrate and patterning the preset film layer include: The predetermined film layer is patterned to form a first sub-portion and a second sub-portion in contact with each other, wherein the first sub-portion is located on a side of the pixel definition layer facing away from the substrate, and the second sub-portion is located on a side of the first sub-portion facing away from the substrate, and the first sub-portion and the second sub-portion together form a plurality of second openings; The light-emitting device layer includes a plurality of first electrodes, and the step of forming at least a portion of the structure in the light-emitting device layer on the same side of the substrate includes: A first electrode is formed in the second opening.

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