Display panel, display device and preparation method of display panel

Abstract

The application discloses a display panel, a display device and a preparation method of the display panel. The display panel has a display area and a frame area arranged around the display area. The display panel comprises a substrate and an isolation part arranged on the substrate and located in the frame area. The isolation part comprises a first part and a second part located on the side of the first part facing the substrate. The orthographic projection area of the first part on the substrate is larger than the orthographic projection area of the second part on the substrate. According to the embodiment of the application, the isolation part is arranged in the frame area, and the isolation part comprises the first part and the second part. The isolation part is relatively high, and at least part of the first part is suspended. The problem that water vapor spreads to the display area can be solved, and the sealing performance of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Flat panel displays, such as liquid crystal display (LCD) panels, organic light-emitting diode (OLED) panels, and display panels using light-emitting diode (LED) devices, are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] OLED panels use organic light-emitting materials to emit light. These materials are particularly sensitive to water and oxygen. Water and oxygen intrusion can cause the materials to absorb water and swell, resulting in film peeling and other problems such as poor sealing. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the sealing performance of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel having a display area and a border area surrounding the display area. The display panel includes: a substrate; and an isolation portion disposed on the substrate and located in the border area. The isolation portion includes a first portion and a second portion located on the side of the first portion facing the substrate. The orthographic projection area of ​​the first portion on the substrate is greater than the orthographic projection area of ​​the second portion on the substrate.

[0006] According to the first aspect of this application, the isolation section surrounds the display area in a closed ring shape.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the number of isolation portions is two or more, and the two or more isolation portions are spaced apart in the direction away from the display area.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the isolation portion further includes a third portion located on the side of the second portion facing the substrate, wherein the orthographic projection area of ​​the third portion on the substrate is greater than the orthographic projection area of ​​the second portion on the substrate.

[0009] According to any of the foregoing embodiments of the first aspect of this application, it further includes: a pixel definition layer disposed on a substrate, the pixel definition layer including a pixel definition portion located in the display area and a pixel opening formed by the pixel definition portion, and the third portion being disposed on the same layer and made of the same material as the pixel definition portion.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the pixel definition layer further includes a through-hole disposed therethrough, the through-hole being located in the border area.

[0011] According to any of the foregoing embodiments of the first aspect of this application, a plurality of through holes are spaced apart in the frame area.

[0012] According to any of the foregoing embodiments of the first aspect of this application, at least some of the pixel definition layers between two adjacent vias are reused as a third portion.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the material of the pixel definition layer includes inorganic materials.

[0014] According to any of the foregoing embodiments of the first aspect of this application, it further includes: a raised portion located on the side of the pixel definition portion away from the substrate, the raised portion including a first sub-part and a second sub-part located on the first sub-part facing the pixel definition portion, the first sub-part and the first sub-part being disposed in the same layer and with the same material, and the second sub-part and the second sub-part being disposed in the same layer and with the same material.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection area of ​​the first sub-part on the substrate is greater than the orthographic projection area of ​​the second sub-part on the substrate.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the orthogonal projection area of ​​the pixel definition portion on the substrate is greater than the orthogonal projection area of ​​the second sub-part on the substrate.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes:

[0018] The light-emitting unit is located at the pixel opening;

[0019] The first electrode layer includes a first electrode located on the side of the light-emitting unit away from the substrate.

[0020] The materials of the first sub-section and / or the second sub-section include metallic materials. The first electrodes on two adjacent light-emitting units are connected to each other through a raised portion.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the material of the second sub-part includes metallic materials, and the material of the first sub-part includes inorganic materials.

[0022] According to any of the foregoing embodiments of the first aspect of this application, it further includes an encapsulation layer, which includes a first inorganic layer, an organic layer located on the side of the first inorganic layer away from the substrate, and a second inorganic layer located on the side of the organic layer away from the first inorganic layer. The first inorganic layer includes a plurality of encapsulation portions disposed independently of each other, and each encapsulation portion is located within the space enclosed by each isolation portion.

[0023] According to any of the foregoing embodiments of the first aspect of this application, a dam is further included, the dam is disposed on the substrate and located in the border area, the dam is disposed around the display area, and the isolation portion is located on the side of the dam facing and / or away from the display area.

[0024] According to any of the foregoing embodiments of the first aspect of this application, two or more dams are distributed at intervals along the direction from the display area to the border area.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the number of isolation sections located on the side of the dam facing and / or away from the display area is 1 to 15.

[0026] According to any of the foregoing embodiments of the first aspect of this application, it further includes an encapsulation layer, comprising a first inorganic layer, an organic layer located on the side of the first inorganic layer away from the substrate, and a second inorganic layer located on the side of the organic layer away from the first inorganic layer, wherein the organic layer is located within the space enclosed by the dam.

[0027] An embodiment of the second aspect of this application provides a display device that includes a display panel of any of the above embodiments.

[0028] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, the display panel having a display area and a border area surrounding the display area, the manufacturing method comprising:

[0029] A second submaterial layer is disposed on the substrate;

[0030] A first sub-material layer is disposed on the side of the second sub-material layer that faces away from the substrate;

[0031] The first sub-material layer and the second sub-material layer are patterned to form an isolation portion located in the border area. The first sub-material layer forms a first portion of the isolation portion, and the second sub-material layer forms a second portion of the isolation portion. The orthogonal projection area of ​​the first portion on the substrate is greater than the orthogonal projection area of ​​the second portion on the substrate.

[0032] According to an embodiment of the third aspect of this application, in the step of patterning a first sub-material layer and a second sub-material layer to form an isolation portion located in the border region, the first sub-material layer forms a first portion of the isolation portion, the second sub-material layer forms a second portion of the isolation portion, and the orthogonal projection area of ​​the first portion on the substrate is larger than the orthogonal projection area of ​​the second portion on the substrate:

[0033] A photoresist layer is formed on the side of the first submaterial layer away from the substrate, and the first portion is formed by exposure, development, and etching.

[0034] The second sub-material layer is further etched to form a second portion, so that the projected area of ​​the second portion on the substrate is smaller than the projected area of ​​the first portion on the substrate.

[0035] According to any of the foregoing embodiments of the third aspect of this application, the step of forming the second sub-material layer on the substrate further includes:

[0036] A pixel definition material layer is disposed on a substrate, and the pixel definition material layer is patterned to form a pixel definition layer. The pixel definition layer includes a pixel definition portion located in the display area, a pixel opening formed by the pixel definition portion, and a third portion located on the side of the second portion facing the substrate.

[0037] In the step of setting the second sub-material layer on the substrate, the second sub-material layer is set on the side of the pixel definition layer away from the substrate.

[0038] According to any of the foregoing embodiments of the third aspect of this application, in the step of patterning a first sub-material layer and a second sub-material layer to form an isolation portion located in the border area, the first sub-material layer forming a first portion of the isolation portion, the second sub-material layer forming a second portion of the isolation portion, and the orthogonal projection area of ​​the first portion on the substrate being greater than the orthogonal projection area of ​​the second portion on the substrate: a raised portion located on the side of the pixel definition portion away from the substrate is also formed.

[0039] In the display panel provided in this application embodiment, the display panel includes a substrate and an isolation portion disposed on the substrate. The isolation portion includes a first portion and a second portion, making the isolation portion relatively high. The second portion is located on the side of the first portion facing the substrate, and the orthographic projection area of ​​the first portion on the substrate is larger than the orthographic projection area of ​​the second portion on the substrate. When a functional layer is disposed on the isolation portion, it can cause the functional layer to break between the first portion and the second portion. Alternatively, the isolation portion is relatively high, making it difficult for the material to be continuous on both sides of the isolation portion, thereby improving the problem of moisture diffusion along the functional layer. The isolation portion is located in the bezel area rather than the display area, which can isolate moisture in the bezel area and improve the impact of moisture on the organic materials of the display area. Therefore, by providing an isolation portion in the bezel area, and the isolation portion including a first portion and a second portion, the isolation portion being relatively high, and the orthographic projection area of ​​the first portion on the substrate being larger than the orthographic projection area of ​​the second portion on the substrate, the problem of moisture spreading to the display area can be improved, and the sealing performance of the display panel can be enhanced. Attached Figure Description

[0040] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0041] Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application;

[0042] Figure 2 yes Figure 1 Sectional view at point BB;

[0043] Figure 3 In another embodiment Figure 1 Sectional view at point BB;

[0044] Figure 4 In yet another embodiment Figure 1 Sectional view at point BB;

[0045] Figure 5 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application;

[0046] Figure 6 This is a flowchart illustrating a step in a method for manufacturing a display panel according to an embodiment of this application.

[0047] Figures 7 to 15 This is a schematic diagram illustrating the fabrication process of a display panel fabrication method provided in this application embodiment.

[0048] Explanation of reference numerals in the attached figures:

[0049] 10. Display panel;

[0050] 100. Substrate;

[0051] 200. Isolation Department; 210. First Division; 220. Second Division; 230. Third Division;

[0052] 300, Pixel definition layer; 310, Pixel definition section; 320, Pixel opening; 330, Through-hole;

[0053] 400. Elevated section; 410. First sub-section; 420. Second sub-section;

[0054] 500, Light-emitting unit; 510, First light-emitting unit; 520, Second light-emitting unit; 530, Third light-emitting unit;

[0055] 600, First electrode layer; 610, First electrode; 611, First sub-electrode; 612, Second sub-electrode; 613, Third sub-electrode;

[0056] 710. Embankment; 720. Leveling layer;

[0057] 800, Encapsulation layer; 810, First inorganic layer; 811, First encapsulation part; 812, Second encapsulation part; 813, Third encapsulation part; 820, Organic layer; 830, Second inorganic layer;

[0058] 900, Pixel electrode layer; 910, Pixel electrode;

[0059] AA, display area; NA, border area. Detailed Implementation

[0060] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0061] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0062] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0063] In electronic devices such as mobile phones and tablets, it is necessary to integrate light-sensing components such as front-facing cameras, infrared light sensors, and proximity sensors on one side of the display panel. In some embodiments, a light-transmitting display area can be provided on the aforementioned electronic device, and the light-sensing components can be placed behind the light-transmitting display area, thereby achieving a full-screen display of the electronic device while ensuring that the light-sensing components function properly.

[0064] The display panel includes an array substrate, a light-emitting device layer disposed on the array substrate, and an encapsulation layer for encapsulating the light-emitting device layer. In related technologies, the light-emitting device layer includes light-emitting units, which include organic light-emitting materials, and the encapsulation layer also includes organic materials. When the display panel is not properly encapsulated, moisture may seep into the organic materials. On the one hand, the moisture will diffuse within the organic materials to the display area, affecting the display of the panel; on the other hand, the organic materials may absorb water and expand, causing the film layer to peel off, thus leading to problems such as poor sealing.

[0065] To address the aforementioned issues, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel and the display device.

[0066] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0067] Please see Figures 1 to 3 , Figure 1 This is a top view schematic diagram of a display panel 10 provided according to an embodiment of this application. Figure 2 yes Figure 1 Sectional view at point BB.

[0068] like Figure 1 and Figure 2 As shown, the display panel 10 provided in the first aspect of this application includes a display area AA and a border area NA surrounding the display area AA. The display panel 10 includes a substrate 100 and an isolation portion 200. The isolation portion 200 is disposed on the substrate 100 and located in the border area NA. The isolation portion 200 includes a first portion 210 and a second portion 220 located on the side of the first portion 210 facing the substrate 100. The orthographic projection area of ​​the first portion 210 on the substrate 100 is greater than the orthographic projection area of ​​the second portion 220 on the substrate 100.

[0069] In the display panel 10 provided in this embodiment, the display panel 10 includes a substrate 100 and an isolation portion 200 disposed on the substrate 100. The isolation portion 200 includes a first portion 210 and a second portion 220, making the isolation portion 200 relatively high. The second portion 220 is located on the side of the first portion 210 facing the substrate 100, and the orthographic projection area of ​​the first portion 210 on the substrate 100 is larger than the orthographic projection area of ​​the second portion 220 on the substrate 100. In the display panel 10, when the functional layer is disposed on the isolation portion 200, since the orthographic projection area of ​​the first portion 210 on the substrate 100 is larger than the orthographic projection area of ​​the second portion 220 on the substrate 100, the first portion 210 is partially suspended, making it difficult for the functional layer to climb the slope, which may cause the functional layer to break between the first portion 210 and the second portion 220. Alternatively, if the functional layer is not thick enough to be continuous on both sides of the isolation section 200, it can also cause the functional layer to break, thereby improving the problem of moisture or cracks spreading along the functional layer and improving the reliability of the package.

[0070] The isolation portion 200 is located in the bezel area NA rather than the display area AA, which can isolate moisture and cracks in the bezel area NA and improve the impact of moisture intrusion on the organic material of the display area AA. Therefore, by providing the isolation portion 200 in the bezel area NA, and the isolation portion 200 including the first portion 210 and the second portion 220, the problem of moisture and cracks spreading to the display area AA can be improved, and the sealing performance of the display panel 10 can be enhanced.

[0071] There are various ways to set the substrate 100. For example, the substrate 100 can be an array substrate 100. The substrate 100 includes a substrate and a driving circuit layer disposed on the substrate. The driving circuit layer can be located in the display area AA. The isolation portion 200 can be directly formed on the substrate.

[0072] Optionally, the display panel 10 also includes a functional layer disposed on the substrate 100. The functional layer includes a first part and a second part disposed on both sides of the isolation portion 200 along the direction from the display area AA to the border area NA. The first part is located in the display area AA. Since the first part and the second part are blocked by the isolation portion 200, the problem of moisture spreading from the second part to the first part and affecting the performance of the functional layer in the display area AA can be improved, thereby improving the sealing performance of the display panel 10.

[0073] Optionally, the functional layer may also include a third part, which is located on the side of the isolation portion 200 away from the substrate 100, and the third part is spaced apart from the first part and the second part, that is, the third part is not continuous with the first part and the second part, which can improve the problem of moisture or cracks spreading from the second portion 220 to the third part, or moisture spreading from the third part to the first part.

[0074] Optionally, the display panel 10 further includes a light-emitting structure layer disposed on the substrate 100 and located in the display area AA. The light-emitting structure layer includes a pixel definition layer 300, which includes a pixel definition portion 310 and a pixel opening 320 formed by the pixel definition portion 310. A light-emitting unit 500 is disposed within the pixel opening 320. The display panel 10 further includes an encapsulation layer 800 for encapsulating the light-emitting structure layer. The encapsulation layer 800 may include a first inorganic layer 810, an organic layer 820, and a second inorganic layer 830 sequentially stacked in a direction away from the light-emitting structure layer.

[0075] Optionally, the aforementioned functional layer can be a first inorganic layer 810, which may break at the isolation portion 200, thereby improving the problem of moisture or cracks spreading along the first inorganic layer 810 to the display area AA and improving the encapsulation reliability of the display panel 10.

[0076] In other embodiments, the functional layer may also be an organic light-emitting material layer generated during the fabrication of the light-emitting unit 500, such that at least part of the organic light-emitting material layer used to fabricate the light-emitting unit 500 can break at the isolation portion 200, thereby improving the problem of moisture spreading along the organic light-emitting material layer into the light-emitting unit 500 and improving the sealing performance of the display panel 10.

[0077] The display panel 10 has a length direction, a width direction, and a thickness direction. The isolation portion 200 can be configured in various shapes. For example, the isolation portion 200 can extend in a strip shape along the length direction and be located on one side of the display area AA in the width direction, or the isolation portion 200 can extend in a strip shape along the width direction and be located on one side of the display area AA in the length direction.

[0078] In other embodiments, please continue to refer to Figure 1 The isolation section 200 surrounds the display area AA in a closed ring shape.

[0079] In these alternative embodiments, the isolation portion 200 is arranged in a ring shape, which allows the functional layer to break at different positions around the display area AA, thereby better improving the problem of moisture spreading to the display area AA and improving the sealing performance of the display panel 10.

[0080] There are several ways to set the number of isolation sections 200, and the number of isolation sections 200 can be one.

[0081] Alternatively, please continue reading Figure 1 There are two or more isolation sections 200, and the two or more isolation sections 200 are spaced apart in a direction away from the display area AA. Providing multiple isolation sections 200 can further improve the sealing effect of the display panel 10.

[0082] Please see Figure 3 , Figure 3 In another embodiment Figure 1 Sectional view at point BB.

[0083] In some embodiments, such as Figure 1 and Figure 3 As shown, the isolation portion 200 also includes a third portion 230 located on the side of the second portion 220 facing the substrate 100, and the orthogonal projection area of ​​the third portion 230 on the substrate 100 is greater than the orthogonal projection area of ​​the second portion 220 on the substrate 100.

[0084] In these embodiments, the isolation portion 200 is arranged in three segments, with the second portion 220 located between the first portion 210 and the third portion 230. The orthogonal projection area of ​​the second portion 220 on the substrate 100 is smaller than the orthogonal projection areas of the first portion 210 and the third portion 230 on the substrate 100, making it easier for the functional layer to break at the second portion 220.

[0085] In some embodiments, as described above, when the display panel 10 includes the pixel definition layer 300, the third portion 230 can be disposed in the same layer and with the same material as the pixel definition portion 310, so that the third portion and the pixel definition portion 310 can be prepared in the same process step, which can simplify the manufacturing process of the display panel 10 and improve the manufacturing efficiency of the display panel 10.

[0086] The pixel definition layer 300 may also include a through-hole 330 located in the border area NA. By providing the through-hole 330 in the pixel definition layer 300, when moisture is immersed in the pixel definition layer 300 or the layer structure adjacent to the pixel definition layer 300, the moisture can be released to the through-hole 330, thus improving the problem of film structure expansion and deformation caused by moisture intrusion in the pixel definition layer 300 or the layer structure adjacent to the pixel definition layer 300, which leads to the separation of the film structure.

[0087] There are various ways to set the shape and number of through holes 330. The shape of the through hole 330 can be circular, elliptical, polygonal, or other irregular shapes. There can be one or more through holes 330. Multiple through holes 330 can be spaced apart within the border area NA, or multiple through holes 330 can be spaced apart around the display area AA.

[0088] Optionally, at least partially adjacent pixel definition layers 300 between two vias 330 are multiplexed as a third portion 230 to further release water vapor not blocked by the isolation portion 200 through the vias 330.

[0089] There are various ways to set the material of the pixel definition layer 300. For example, the material of the pixel definition layer 300 may include inorganic materials.

[0090] Optionally, the display panel 10 further includes a pixel electrode layer 900, which includes pixel electrodes 910 corresponding to each pixel opening 320. That is, a pixel opening 320 and a light-emitting unit 500 located within the pixel opening 320 are respectively located at the position of the pixel electrode 910. Specifically, the pixel opening 320 is the one that penetrates the pixel definition layer 300 at the position of the pixel electrode 910, while the through-hole 330 is the one that penetrates the pixel definition layer 300 at positions other than the pixel electrode 910.

[0091] Please see Figure 4 , Figure 4 In yet another embodiment Figure 1 Sectional view at point BB.

[0092] In some alternative embodiments, such as Figure 1 and Figure 4 As shown, the display panel 10 also includes a raised portion 400, which is located on the side of the pixel definition portion 310 away from the substrate 100. The raised portion 400 includes a first sub-portion 410 and a second sub-portion 420 located on the first sub-portion 410 facing the pixel definition portion 310. The first sub-portion 410 and the first portion 210 are disposed on the same layer and made of the same material, and the second sub-portion 420 and the second portion 220 are disposed on the same layer and made of the same material.

[0093] In these alternative embodiments, a raised portion 400 is provided on the pixel definition portion 310 of the pixel definition layer 300, resulting in a relatively high combined height of the raised portion 400 and the pixel definition portion 310. When light-emitting material or other charge carrier layers are deposited within the pixel opening 320, these layer structures are prone to breakage at the pixel definition portion 310 and the raised portion 400, thereby mitigating the problem of lateral current crosstalk in the charge carrier layers and improving the display effect of the display panel.

[0094] Furthermore, the first sub-part 410 and the first sub-part 210 are made of the same layer and the same material, so that the first sub-part 410 and the first sub-part 210 can be manufactured in the same process step; the second sub-part 420 and the second sub-part 220 are made of the same layer and the same material, so that the first sub-part 410 and the first sub-part 210 can be manufactured in the same process step, which can simplify the manufacturing process of the display panel 10 and improve the manufacturing efficiency of the display panel 10.

[0095] In some optional embodiments, the projected area of ​​the first sub-part 410 on the substrate 100 is larger than the projected area of ​​the second sub-part 420 on the substrate 100. That is, part of the first sub-part 410 is suspended. The light-emitting material layer and the charge carrier layer have great difficulty climbing at the suspended position. The breakage at the suspended position can block the path between the light-emitting material layer and the charge carrier layer in the adjacent sub-pixel, and better improve the problem of lateral crosstalk of current.

[0096] For example, the first inorganic layer 810 includes multiple independently arranged encapsulation parts, each encapsulation part being located within the space enclosed by the isolation parts 400. That is, the first inorganic layer 810 is broken into multiple independently arranged encapsulation parts, realizing independent encapsulation of each sub-pixel, so that the encapsulation effect of each sub-pixel will not be interfered with by the encapsulation effect of its adjacent sub-pixels, which can further improve the problem of water vapor spreading in the first inorganic layer 810.

[0097] In some alternative embodiments, the orthographic projection area of ​​the pixel definition portion 310 on the substrate 100 is larger than the orthographic projection area of ​​the second sub-portion 420 on the substrate 100, making it easier for the functional layer to break at the second sub-portion 420.

[0098] In some optional embodiments, the display panel 10 further includes a first electrode layer 600, which includes a first electrode 610 located on the side of the light-emitting unit 500 away from the substrate 100. The first electrode 610 can be an electrode that is disposed across the entire surface, or there can be multiple first electrodes 610, each of which is located on the side of the light-emitting unit 500 away from the substrate 100.

[0099] Optionally, the material of the first sub-part 410 and / or the second sub-part 420 includes a metallic material. When there are multiple first electrodes 610, the first electrodes 610 on two adjacent light-emitting units 500 can be connected to each other through the first sub-part 410 and / or the second sub-part 420. That is, the first electrodes 610 on two adjacent light-emitting units 500 can be electrically connected as surface electrodes through the raised part 400.

[0100] Optionally, the material of the second sub-part 420 includes a metallic material, the second sub-part 420 is closer to the pixel definition part 310, the second sub-part 420 is closer to the first electrode 610, and the material of the second sub-part 420 includes a metallic material, which can ensure the stability of the electrical connection between the first electrodes 610 on two adjacent light-emitting units 500.

[0101] Optionally, when the material of the second sub-part 420 includes a metallic material, as described above, the material of the second sub-part 220 is the same as the material of the second sub-part 420, and the material of the second sub-part 420 also includes a metallic material.

[0102] Optionally, the material of the first sub-part 410 includes an inorganic material, giving the first sub-part 410 good insulation properties. In some optional embodiments, the display panel 10 further includes a dam 710, which is disposed on the substrate 100 and located in the bezel area NA. The dam 710 surrounds the display area AA, and the isolation portion 200 is located on the side of the dam 710 facing and / or away from the display area AA. Optionally, the organic layer 820 is located within the space enclosed by the dam 710. By providing the dam 710, the organic layer 820 in the encapsulation layer 800 can be confined within the dam 710. The isolation portion 200 and the dam 710 are arranged side by side and located on the side of the dam 710 facing and / or away from the display area AA, so that the isolation portion 200 and the dam 710 do not interfere with each other.

[0103] There are multiple ways to set the number of dams 710. The number of dams 710 can be one or more. When the number of dams 710 is two or more, the two or more dams 710 are distributed at intervals along the direction from the display area AA to the border area NA.

[0104] There are various ways to arrange the number of isolation portions 200. For example, the number of isolation portions 200 located on the side of the dam 710 facing and / or away from the display area AA can be 1 to 15. That is, isolation portions 200 are provided on both sides of the dam 710, which can further improve the sealing effect of the display panel 10. When the number of isolation portions 200 on the dam 710 facing or away from the display area AA is within the above range, it can not only improve the sealing performance of the display panel 10, but also prevent the size of the bezel area NA from becoming too large due to an excessive number of isolation portions 200, which would affect the display effect of the display panel 10.

[0105] Optionally, the array substrate 100 includes a planarization layer 720, and a pixel electrode layer 900 is disposed between the planarization layer 720 and the pixel definition layer 300. The dam 710 can be disposed in the same layer and with the same material as the planarization layer 720 to further simplify the manufacturing process of the display panel 10 and improve the manufacturing efficiency of the display panel 10.

[0106] Optional, please continue reading Figure 4 In any of the above embodiments, the light-emitting unit 500 includes a first light-emitting unit 510, a second light-emitting unit 520, and a third light-emitting unit 530. The pixel opening includes a first pixel opening, a second pixel opening, and a third pixel opening. The first light-emitting unit 510 is disposed in the first pixel opening, the second light-emitting unit 520 is disposed in the second pixel opening, and the third light-emitting unit 530 is disposed in the third pixel opening. In one embodiment of this application, the first light-emitting unit 510, the second light-emitting unit 520, and the third light-emitting unit 530 are respectively a red light-emitting unit 500, a green light-emitting unit 500, and a blue light-emitting unit 500, to achieve color display of the display panel 10.

[0107] Please continue reading. Figure 4 The first electrode 610 includes a first sub-electrode 611 located on the side of the first light-emitting unit 510 facing away from the substrate 100, a second sub-electrode 612 located on the side of the second light-emitting unit 520 facing away from the substrate 100, and a third sub-electrode 613 located on the side of the third light-emitting unit 530 facing away from the substrate 100. The first inorganic layer 810 includes a first encapsulation portion 811 located on the side of the first sub-electrode 611 facing away from the substrate 100, a second encapsulation portion 812 located on the side of the second sub-electrode 612 facing away from the substrate 100, and a third encapsulation portion 813 located on the side of the third sub-electrode 613 facing away from the substrate 100.

[0108] There are several ways to prepare the display panel 10. For example, after preparing the planarization layer 720, a pixel definition layer 300 can be prepared on the planarization layer 720, and a raised portion 400 and an isolation portion 200 can be prepared on the pixel definition layer 300 at the same time.

[0109] Then, a first light-emitting material layer, a first sub-electrode 611 material layer, and a first encapsulation material layer are formed on the substrate 100. At the same time, the first light-emitting material layer, the first sub-electrode 611 layer, and the first encapsulation material layer are patterned to form a first light-emitting unit 510, a first sub-electrode 611, and a first encapsulation portion 811. Specifically, the patterning process to form the first light-emitting unit 510, the first sub-electrode 611, and the first encapsulation portion 811 can be achieved by etching away the first light-emitting material layer, the first sub-electrode 611 layer, and the first encapsulation material layer located in the second pixel opening and the third pixel opening, while retaining the first light-emitting material layer, the first sub-electrode 611 layer, and the first encapsulation material layer in the first pixel opening to form the first light-emitting unit 510, the first sub-electrode 611, and the first encapsulation portion 811.

[0110] Next, a second light-emitting material layer, a second sub-electrode 612 material layer, and a second encapsulation material layer are formed on the substrate 100. Simultaneously, the second light-emitting material layer, the second sub-electrode 612 layer, and the second encapsulation material layer are patterned to form a second light-emitting unit 520, a second sub-electrode 612, and a second encapsulation portion 812. Specifically, the patterning process to form the second light-emitting unit 530, the second sub-electrode 612, and the second encapsulation portion 812 can involve etching away the second light-emitting material layer, the second sub-electrode 612 layer, and the second encapsulation material layer within the third pixel opening, as well as the second light-emitting material layer, the second sub-electrode 612 layer, and the second encapsulation material layer on the side of the first encapsulation portion away from the substrate, while retaining the second light-emitting material layer, the second sub-electrode 612 layer, and the second encapsulation material layer within the second pixel opening, thus forming the second light-emitting unit 520, the second sub-electrode 612, and the second encapsulation portion 812.

[0111] Finally, a third light-emitting material layer, a third sub-electrode 613 material layer, and a third encapsulation material layer are formed on the substrate 100. The third light-emitting material layer, the third sub-electrode 613 material layer, and the third encapsulation material layer on the side of the first encapsulation portion 811 and the second encapsulation portion 812 away from the substrate are etched away. The third light-emitting unit 530, the third sub-electrode 613, and the third encapsulation portion 813 are retained in the third pixel opening. It should be noted that at this time, the third light-emitting material layer, the third sub-electrode 613 material layer, and the third encapsulation material layer in the border area NA do not need to be patterned, which can simplify the manufacturing process. Therefore, at least a portion of the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer fall into the pixel opening 320 to form the third light-emitting unit 530, the third sub-electrode 613, and the third encapsulation portion 813. At least a portion of the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer also fall into the through-hole 330 of the border area NA, between adjacent isolation portions 200, and / or between the isolation portion 200 and the dam 710, and on the dam 710.

[0112] In this embodiment, due to the presence of the isolation portion 200, the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer are separated from each other at the isolation portion 200, thereby improving the problem of water vapor spreading along the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer.

[0113] The second aspect of this application also provides a display device, including the display panel 10 of any of the first aspect embodiments described above. Since the display device provided in the second aspect of this application includes the display panel 10 of any of the first aspect embodiments described above, it has the beneficial effects of the display panel 10 of any of the first aspect embodiments described above, which will not be elaborated further here.

[0114] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0115] Please see Figure 5 , Figure 5 This is a schematic flowchart of a method for preparing a display panel 10 according to an embodiment of the third aspect of this application.

[0116] The third aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the first aspect of the embodiment described above. The display panel 10 has a display area AA and a border area NA surrounding the display area AA. Please refer to... Figures 1 to 4 And see Figure 5 As shown, the preparation method includes:

[0117] Step S01: Deposit a second submaterial layer on the substrate 100.

[0118] Step S02: A first sub-material layer is formed on the side of the second sub-material layer away from the substrate 100.

[0119] Step S03: Pattern the first sub-material layer and the second sub-material layer to form an isolation portion 200 located in the border area NA. The first sub-material layer forms a first portion 210 of the isolation portion 200, and the second sub-material layer forms a second portion 220 of the isolation portion 200. The orthogonal projection area of ​​the first portion 210 on the substrate 100 is greater than the orthogonal projection area of ​​the second portion 220 on the substrate 100.

[0120] A display panel 10 fabricated using the embodiments of this application includes a substrate 100 and an isolation portion 200 disposed on the substrate 100. The isolation portion 200 includes a first portion 210 and a second portion 220. The second portion 220 is located on the side of the first portion 210 facing the substrate 100, and the projected area of ​​the first portion 210 on the substrate 100 is larger than the projected area of ​​the second portion 220 on the substrate 100. In the display panel 10, when a functional layer is deposited on the isolation portion 200, it causes the functional layer to break between the first portion 210 and the second portion 220, thereby improving the problem of moisture diffusion along the functional layer. The isolation portion 200 is located in the bezel area NA rather than the display area AA, which can isolate moisture in the bezel area NA and improve the impact of moisture on the organic material of the display area AA. Therefore, by providing the isolation portion 200 in the bezel area NA, the embodiments of this application can improve the problem of moisture spreading to the display area AA and improve the sealing performance of the display panel 10.

[0121] There are multiple ways to set step S03. In some optional embodiments, such as... Figure 6 As shown, step S03 includes:

[0122] Step S031: A photoresist layer is formed on the side of the first sub-material layer away from the substrate 100, and the first portion 210 is formed by exposure, development and etching.

[0123] Step S032: Continue to side-etch the second sub-material layer to form the second portion 220, so that the orthogonal projection area of ​​the second portion 220 on the substrate 100 is smaller than the orthogonal projection area of ​​the first portion 210 on the substrate 100.

[0124] In these alternative embodiments, after etching the first sub-material layer and the second sub-material layer, the second sub-material layer is further etched sideways, that is, the second sub-material layer located on the side of the first sub-part 410 facing the substrate 100 is etched sideways, which can form a second sub-part 420 with a size smaller than the first sub-part 410.

[0125] In some embodiments, before step S01, the method further includes: setting a pixel definition material layer on the substrate 100, and patterning the pixel definition material layer to form a pixel definition layer 300. The pixel definition layer 300 includes a pixel definition portion 310 located in the display area AA, a pixel opening 320 formed by the pixel definition portion 310, and a third portion 230 located on the side of the second portion 220 facing the substrate 100.

[0126] In step S01, a second sub-material layer is provided on the side of the pixel definition layer 300 facing away from the substrate 100.

[0127] Optionally, in step 03, a raised portion 400 is also formed on the side of the pixel definition portion 310 facing away from the substrate 100. A first sub-material layer forms a first sub-portion 410 of the raised portion 400, and a second sub-material layer forms a second sub-portion 420 of the raised portion 400.

[0128] The following is based on Figure 4 Taking the embodiments as an example, and in conjunction with Figures 7 to 15 The preparation method provided in the embodiments of this application is illustrated by example. The preparation method of the display panel 10 provided in the embodiments of this application includes:

[0129] Step 1, as follows Figure 7 As shown, a planarization material layer is provided on the substrate 100, and the planarization material layer is patterned to form a planarization layer 720 and a dam 710.

[0130] Step two, as Figure 8 As shown, a pixel electrode layer 900 is fabricated on a planarization layer 720, and the pixel electrode layer 900 includes a plurality of pixel electrodes 910 arranged in an array.

[0131] Step 3, as Figure 9 As shown, a pixel definition material layer is further disposed on the substrate 100, and the pixel definition material layer is patterned to form a pixel definition portion 310 located in the display area AA and a third portion 230 located in the border area NA.

[0132] The third portion 230 determines the position of the isolation portion 200, and the third portion 230 can be located on the side of the dam 710 facing or away from the display area AA. Optionally, in step three, a through hole 330 located in the border area NA can also be formed on the pixel definition layer 300.

[0133] Step four, as Figure 10 As shown, a second sub-material layer and a first sub-material layer are further disposed on the substrate 100, and the first sub-material layer and the second sub-material layer are patterned to form a raised portion 400 located on the pixel definition portion 310 and a second portion 220 and a first portion 210 located on the third portion 230.

[0134] As described above, the patterning process of the first sub-material layer and the second sub-material layer can be divided into two steps. In the first step, photoresist is applied to the side of the first sub-material layer away from the second sub-material layer. The photoresist is then used to perform a frontal etching of the first sub-material layer away from the second sub-material layer to form the first sub-part 410 and the first sub-part 210. In the second step, the second sub-material layer is further etched from the side to form the second sub-part 420 and the second sub-part 220.

[0135] Step 5, as Figure 11 As shown, a first light-emitting material layer, a first sub-electrode 611 material layer, and a first encapsulation material layer are further disposed on the substrate 100, and the first light-emitting material layer, the first sub-electrode 611 layer, and the first encapsulation material layer are simultaneously patterned to form a first light-emitting unit 510, a first sub-electrode 611, and a first encapsulation part 811.

[0136] Step six, as Figure 12 As shown, a second light-emitting material layer, a second sub-electrode 612 material layer, and a second encapsulation material layer are further disposed on the substrate 100, and the second light-emitting material layer, the second sub-electrode 612 layer, and the second encapsulation material layer are simultaneously patterned to form a second light-emitting unit 520, a second sub-electrode 612, and a second encapsulation portion 812.

[0137] Step seven, as Figure 13 As shown, a third light-emitting material layer, a third sub-electrode 613 material layer, and a third encapsulation material layer are formed on the substrate 100, and a third light-emitting unit, a third sub-electrode, and a third encapsulation part are formed by patterning.

[0138] In step seven, the third light-emitting material layer, the third sub-electrode 613 material layer, and the third encapsulation material layer of the border area NA do not need to be patterned, which simplifies the fabrication process. At least a portion of the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer fall into the pixel opening 320 to form the third light-emitting unit 530, the third sub-electrode 613, and the third encapsulation portion 813. At least a portion of the third light-emitting material layer, the third sub-electrode 613 layer, and the third encapsulation material layer also fall into the through-hole 330 of the border area NA, between adjacent isolation portions 200, and / or between the isolation portion 200 and the dam 710, and on top of the dam 710.

[0139] Step eight, as Figure 14As shown, an organic layer 820 is set in the area enclosed by the dam 710.

[0140] Step nine, as Figure 15 As shown, a second inorganic layer 830 is further disposed on the substrate 100.

[0141] In the embodiments of this application, due to the presence of the isolation portion 200 and the raised portion 400, the third light-emitting material layer, the third sub-electrode 613 layer and the third encapsulation material layer are separated from each other at the isolation portion 200 and the raised portion 400, thereby improving the problem of water vapor spreading along the third light-emitting material layer, the third sub-electrode 613 layer and the third encapsulation material layer.

[0142] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The display panel has a display area and a frame area surrounding the display area, and comprises: a substrate; an isolation portion disposed on the substrate and located in the frame area, the isolation portion comprising a first sub-portion and a second sub-portion located on a side of the first sub-portion facing the substrate, a projected area of the first sub-portion on the substrate being greater than a projected area of the second sub-portion on the substrate; a pixel definition layer disposed on the substrate, the pixel definition layer comprising a pixel definition portion located in the display area and a pixel opening formed by the pixel definition portion; a light emitting unit located in the pixel opening; a raised portion located on a side of the pixel definition portion away from the substrate and surrounding the light emitting unit in a peripheral direction; an encapsulation layer comprising a first inorganic layer disposed in a direction away from the substrate, the first inorganic layer comprising a plurality of encapsulation portions disposed independently of each other, each of the encapsulation portions being located in a space formed by the raised portion, the display panel further comprising: a first electrode layer comprising a first electrode located on a side of each of the light emitting units away from the substrate, the first electrodes on two adjacent light emitting units being connected to each other through the raised portion, the raised portion comprising a first sub-portion and a second sub-portion located on a side of the first sub-portion facing the pixel definition portion, a material of the second sub-portion comprising a metal material.

2. The display panel of claim 1, wherein, The isolation portion surrounds the display area in a closed ring shape.

3. The display panel of claim 2, wherein a number of the isolation portions is two or more, and the two or more isolation portions are distributed at intervals in a direction away from the display area.

4. The display panel of claim 1, wherein, the isolation portion further comprises a third sub-portion located on a side of the second sub-portion facing the substrate, a projected area of the third sub-portion on the substrate being greater than a projected area of the second sub-portion on the substrate.

5. The display panel of claim 4, wherein, the third sub-portion and the pixel definition portion are disposed in the same layer and are made of the same material.

6. The display panel of claim 5, wherein the pixel definition layer further comprises a through hole disposed therethrough, the through hole being located in the frame area.

7. The display panel of claim 6, wherein a plurality of the through holes are disposed at intervals in the frame area.

8. The display panel of claim 6, wherein the pixel definition layer between at least some adjacent through holes is reused as the third sub-portion.

9. The display panel of claim 5, wherein a material of the pixel definition layer comprises an inorganic material.

10. The display panel of claim 1, wherein a projected area of the first sub-portion on the substrate is greater than a projected area of the second sub-portion on the substrate.

11. The display panel of claim 1, wherein a projected area of the pixel definition portion on the substrate is greater than a projected area of the second sub-portion on the substrate.

12. The display panel of claim 1, wherein a material of the first sub-portion comprises an inorganic material.

13. The display panel of claim 1, wherein ​ Further comprising a packaging layer, the packaging layer comprising an organic layer located on a side of the first inorganic layer facing away from the substrate and a second inorganic layer located on a side of the organic layer facing away from the first inorganic layer.

14. The display panel of claim 1, wherein, Further comprising a dam, the dam being disposed on the substrate and located in the bezel region, the dam being disposed around the display region, the isolation portion being located on a side of the dam facing and / or facing away from the display region.

15. The display panel of claim 14, wherein, The two or more dams are spaced apart along a direction in which the display region points to the bezel region.

16. The display panel of claim 14, wherein, The number of the isolation portions located on a side of the dam facing and / or facing away from the display region is 1-15.

17. A display device comprising: The display panel of any one of claims 1-16.

18. A method for manufacturing a display panel, for manufacturing a display panel, characterized by, The display panel of any one of claims 1-16, the display panel having a display region and a bezel region disposed around the display region, the method comprising: disposing a second sub-material layer on the substrate; disposing a first sub-material layer on a side of the second sub-material layer facing away from the substrate; performing a patterning process on the first sub-material layer and the second sub-material layer to form an isolation portion located in the bezel region, the first sub-material layer forming a first part of the isolation portion, and the second sub-material layer forming a second part of the isolation portion, a projected area of the first part on the substrate being greater than a projected area of the second part on the substrate.

19. The method of claim 18, wherein, In the step of performing a patterning process on the first sub-material layer and the second sub-material layer to form an isolation portion located in the bezel region, the first sub-material layer forming a first part of the isolation portion, and the second sub-material layer forming a second part of the isolation portion, a projected area of the first part on the substrate being greater than a projected area of the second part on the substrate: disposing a photoresist layer on a side of the first sub-material layer facing away from the substrate, and performing exposure, development, and etching to form the first part; continuing to perform a side etching process on the second sub-material layer to form the second part, so that a projected area of the second part on the substrate is less than a projected area of the first part on the substrate.

20. The method of claim 18, wherein, Before the step of disposing a second sub-material layer on the substrate, further comprising: disposing a pixel definition material layer on the substrate, and performing a patterning process on the pixel definition material layer to form a pixel definition layer and a third part, the pixel definition layer comprising a pixel definition portion located in the display region and a pixel opening formed by the pixel definition portion being enclosed, the third part being located on a side of the second part facing the substrate; in the step of disposing a second sub-material layer on the substrate, disposing the second sub-material layer on a side of the pixel definition layer facing away from the substrate.

21. The method of claim 20, wherein, In the step of patterning the first sub-material layer and the second sub-material layer to form the isolation portion located in the frame region, the first sub-material layer forms a first part of the isolation portion, the second sub-material layer forms a second part of the isolation portion, and a projected area of the first part on the substrate is greater than a projected area of the second part on the substrate, a step of further forming a raised portion located on a side of the pixel definition portion away from the substrate is performed.

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