Wafer position abnormality detection system, method and semiconductor device

Abstract

The present invention discloses a wafer position anomaly detection system, method, and semiconductor device. The system includes: a control unit, a first detection component and a video acquisition module disposed in a first chamber. The first detection component is disposed corresponding to the wafer transmission path and is used to detect whether the wafer has fallen from the transmission device. The control unit is used to: monitor the detection signal of the first detection component in real time to see if it is abnormal. When the detection signal of the first detection component is detected to be normal, the control unit controls the transmission device to execute the set wafer transmission process and controls the video acquisition module to remain in a dormant state. When the detection signal of the first detection component is detected to be abnormal, the control unit controls the transmission device to stop operation, controls multiple video acquisition modules to start capturing images of the interior of the first chamber and transmit image information, and simultaneously transmits an alarm signal. The present invention can improve the detection accuracy of wafer abnormal position determination and reduce fault handling time.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor manufacturing equipment, and more specifically, relates to a wafer position anomaly detection system, method and semiconductor equipment. Background Art

[0002] Semiconductor manufacturing equipment, such as etchers, features a vacuum transfer system that connects the process chamber and the LoadLock (atmospheric vacuum transfer) chamber. This system houses a vacuum transfer robot, which moves wafers back and forth between the process chamber and the LoadLock chamber. While handling wafers, the robot can drift or even fall. Therefore, laser sensors are typically installed at the gate valves of each chamber. As the robot removes and places wafers from each chamber, these laser sensors detect whether the wafer's position on the robot is offset from a calibrated reference position. If the offset exceeds a set threshold, an alarm sounds, interrupting the transfer.

[0003] However, the existing method of detecting abnormal wafer position using laser sensors can only detect the abnormal position of the wafer on the robot when the robot takes and places the wafer at a certain workstation and passes the laser sensor. It cannot detect the abnormal wafer falling that occurs when the vacuum robot carries the wafer and moves in the vacuum transfer chamber, and it cannot detect the actual position of the wafer when an abnormality such as falling occurs in the transfer chamber. Summary of the Invention

[0004] The purpose of the present invention is to propose a wafer position anomaly detection system, method and semiconductor equipment to realize anomaly detection such as wafer falling in the transfer chamber, improve the detection accuracy of wafer position anomaly judgment, and reduce fault handling time.

[0005] In a first aspect, the present invention provides a wafer position anomaly detection system for use in semiconductor process equipment. The semiconductor process equipment includes a first chamber and a second chamber. A wafer transfer port communicating with the second chamber is provided on a sidewall of the first chamber. A transfer device is provided in the first chamber for transferring wafers between the first chamber and the second chamber. The system includes:

[0006] a control unit, and a first detection component and a video acquisition module disposed in the first chamber, wherein the first detection component, the video acquisition module, and the transmission device are respectively connected to the control unit;

[0007] The first detection component is arranged corresponding to the transmission path of the wafer and is used to detect whether the wafer falls from the transmission device;

[0008] The control unit is used for:

[0009] monitoring in real time whether the detection signal of the first detection component is abnormal; when the detection signal of the first detection component is detected to be normal, controlling the transmission device to execute a set wafer transmission process and controlling the video acquisition module to remain in a dormant state;

[0010] When the detection signal of the first detection component is detected to be abnormal, the transmission device is controlled to stop operation, and the multiple video acquisition modules are controlled to start image acquisition of the interior of the first chamber and send image information, and an alarm signal is sent at the same time.

[0011] Optionally, the system includes multiple groups of first detection components, each group of the first detection components includes a first laser transmitter and a first laser receiver;

[0012] The first laser emitter and the first laser receiver of the same group are oppositely arranged on opposite side walls of the first chamber;

[0013] The heights of the first laser transmitter and the first laser receiver on the side wall are lower than the lower edge of the film transmission port and higher than the bottom of the first chamber;

[0014] The multiple laser beams generated by the first laser emitters of the multiple groups of the first detection components are respectively located in different areas below the wafer movement path, and the laser beams are not blocked by the transmission device.

[0015] Optionally, the first chamber is a transfer chamber, and the second chamber includes an atmospheric vacuum conversion chamber and multiple groups of process chambers, at least one group of the process chambers being sequentially distributed along a side of the transfer chamber adjacent to the atmospheric vacuum conversion chamber;

[0016] The plurality of groups of the first detection components include a plurality of groups of first sub-detection components and a plurality of groups of second sub-detection components, and the first sub-detection components and the second sub-detection components each include the first laser emitter and the first laser receiver;

[0017] The transfer chamber includes a plurality of side walls, and a plurality of groups of the first sub-detection components are at least arranged at both ends of the side wall that interfaces with the atmospheric vacuum conversion chamber and at both ends of the side wall opposite to the atmospheric vacuum conversion chamber, and a plurality of groups of the second sub-detection components are at least arranged at both ends of two side walls adjacent to the atmospheric vacuum conversion chamber;

[0018] Multiple groups of the first sub-detection components are used to detect whether the wafer has fallen from the transmission device along a first direction, and multiple groups of the second sub-detection components are used to detect whether the wafer has fallen from the transmission device along a second direction perpendicular to the first direction.

[0019] Optionally, the system includes multiple video acquisition modules, which are respectively arranged in different top areas of the first chamber, and the multiple video acquisition modules all shoot images of different areas in the first chamber diagonally downward, and the shooting areas of the multiple video acquisition modules at least cover the area of ​​the wafer transmission path in the first chamber.

[0020] Optionally, the system further comprises a plurality of lighting modules, wherein the plurality of lighting modules are respectively arranged in different areas within the first chamber;

[0021] The control unit is further configured to control the plurality of lighting modules to turn on when detecting that the detection signal of the first detection component is abnormal.

[0022] Optionally, the system further includes a plurality of second detection components disposed in the first chamber, and the second detection components are used to detect whether there is a deviation in the relative position between the wafer and the transmission device when the transmission device transfers the wafer to the wafer transfer port position.

[0023] Optionally, each group of the second detection components includes a second laser emitter and a second laser receiver, which are relatively arranged above and below the film transmission port;

[0024] Two groups of the second detection components are correspondingly arranged at each film transmission port position, and the laser beams of the second laser emitters of the two groups of the second detection components pass through the left and right side areas of the film transmission port from top to bottom respectively.

[0025] In a second aspect, the present invention provides a method for detecting wafer position anomaly, using the wafer position anomaly detection system described in the first aspect, the method comprising:

[0026] S1: receiving in real time a first detection signal uploaded by the first detection component;

[0027] S2: Determine whether the first detection signal is abnormal. If not, control the transmission device to perform a normal wafer transmission process and control the video acquisition module to remain in a dormant state. If yes, execute step S3;

[0028] S3: Control the transmission device to stop operation;

[0029] S4: Control the plurality of video acquisition modules to start capturing images of the interior of the first chamber and send image information, and send an alarm signal at the same time.

[0030] Optionally, the wafer position abnormality detection system further includes a plurality of lighting modules, and the plurality of lighting modules are respectively arranged in different areas within the first chamber;

[0031] Before executing step S4, the method further includes:

[0032] Step S5: controlling the plurality of light modules to turn on.

[0033] Optionally, after executing step S4, the method further includes:

[0034] Step S6: monitor whether the alarm information is eliminated. If so, initialize the first detection signal of the first detection component and convert the video acquisition module to a dormant state, then return to step S1; otherwise, return to step S4.

[0035] Optionally, the system further comprises a plurality of second detection components disposed in the first chamber, the second detection components being used to detect whether there is a deviation in the relative position between the wafer and the transfer device when the transfer device transfers the wafer to the wafer transfer port;

[0036] The wafer position abnormality detection method further includes:

[0037] Step S7: receiving in real time the second detection signal uploaded by the second detection component;

[0038] Step S8: determining whether the second detection signal is abnormal; if not, controlling the transmission device to perform a normal wafer transmission process; if so, executing step S11;

[0039] S9: Control the transmission device to stop and send an alarm message indicating abnormal wafer position to the user system.

[0040] In a third aspect, the present invention provides a semiconductor process equipment, comprising the wafer position anomaly detection system described in the first aspect.

[0041] The beneficial effects of the present invention are:

[0042] The present invention provides a first monitoring component and a video acquisition module connected to a control unit in the transmission chamber, wherein the first detection component is provided corresponding to the transmission path of the wafer and is used to detect whether the wafer has fallen from the transmission device. When the laser sensor detection signal is normal, the control unit controls the video acquisition module to remain in a dormant state and controls the transmission device to execute a normal transmission process. When the laser sensor signal is abnormal, it indicates that the position of the wafer and the transmission device is abnormal or a wafer drop abnormality has occurred. At this time, the control unit controls the video acquisition module to start image acquisition in the process chamber and upload it to the user system, while issuing an alarm signal. This system can achieve all-round abnormality detection of wafer drop abnormalities. The operator can quickly determine the abnormal fault point through the alarm information and video images displayed by the user system, and formulate a fault solution based on this, effectively improving troubleshooting efficiency and reducing downtime. In addition, the video acquisition module remains in a dormant state under normal circumstances and is only activated when a wafer position abnormality occurs. At this time, the normal operation process of the equipment has stopped. The subsequent wafer position recognition and processing calculation of the video signal and the normal operation processing of the machine will not occur simultaneously, which can effectively ensure that the controller has sufficient computing power when the machine is operating normally.

[0043] The system of the present invention has other features and advantages that will be apparent from or will be described in detail in the accompanying drawings and subsequent detailed description incorporated herein, which together serve to explain the specific principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, in which like reference numerals generally represent like components.

[0045] Figure 1a-Figure 1c A schematic diagram of a wafer position anomaly detection system according to prior art 1 is shown.

[0046] Figure 2 A schematic diagram of a wafer position anomaly detection system according to prior art 2 is shown.

[0047] Figure 3 A schematic diagram of a wafer position anomaly detection system according to embodiment 1 of the present invention is shown.

[0048] Figure 4 A schematic diagram showing the position distribution of a second laser sensor, a video acquisition module and a lighting module in a transmission chamber in a wafer position anomaly detection system according to embodiment 1 of the present invention is shown.

[0049] Figure 5a and Figure 5bA schematic diagram of the detection area of ​​the second laser sensor in the transmission chamber in a wafer position anomaly detection system according to embodiment 1 of the present invention is shown.

[0050] Figure 6-Figure 8 A schematic diagram shows the layout of a second laser sensor, a video acquisition module, and a lighting module in other implementations of a wafer position anomaly detection system in Example 1 of the present invention.

[0051] Figure 9 A schematic diagram of information interaction of a wafer position anomaly detection system according to embodiment 1 of the present invention is shown.

[0052] Figure 10 A flow chart of a wafer position abnormality detection method according to embodiment 2 of the present invention is shown. DETAILED DESCRIPTION

[0053] like Figure 1a-Figure 1c As shown, the wafer position anomaly detection scheme of prior art 1 is a common method for detecting wafer position anomalies during vacuum transfer. It primarily employs two sets of laser sensors installed at the gate valve connecting the process chamber or atmospheric vacuum conversion chamber to the vacuum transfer chamber. Each set of laser sensors consists of a laser transmitter and a laser receiver, mounted on the upper and lower sides of the gate, respectively. The laser transmitter emits laser light to the laser receiver in real time. If the laser receiver receives the laser light normally, the laser sensor transmits a signal in real time to the robot controller. When the robot carrying the wafer passes through the laser sensor, the wafer blocks the laser signal, preventing the laser receiver from receiving the laser light. The laser sensor stops transmitting signals to the robot controller. When the wafer completely passes the laser sensor position, the laser receiver re-receives the laser signal, and the laser sensor resumes transmitting signals to the robot controller. The robot controller calculates the relative position deviation between the wafer and the robot based on the changes in the laser sensor signal. If the deviation exceeds the set value or the laser signal is abnormal, the robot controller issues an alarm to the transfer system controller, which interrupts the robot transfer task and alerts the user of the wafer position anomaly.

[0054] This solution can only detect abnormal conditions when a wafer passes the laser sensor while the robot is placing or retrieving a wafer at a specific workstation. It cannot detect the actual position of the wafer within the transfer chamber, for example, if it has fallen. For example, when the robot is removing a wafer from a workstation, the laser sensor detects that the wafer has significantly deviated from the robot as it passes by. After the robot makes an emergency stop, the wafer may fall or break. Because the robot has already brought the wafer into the TM chamber, the laser sensor can no longer detect the wafer. Maintenance personnel must then determine the wafer's status and position through the chamber's observation port. This process is time-consuming and cannot accurately determine the wafer's status, increasing the time required to resolve the issue.

[0055] Furthermore, the current system is unable to detect wafer drops that occur when the vacuum robot carries wafers within the vacuum transfer chamber. If a wafer drops while the robot is rotating or extending its arm, the laser sensor will only detect the absence of the wafer when the robot places the wafer at a specific workstation. This inability to detect the wafer drop immediately could lead to the wafer being crushed and shattered, making resolution more difficult.

[0056] The solution adopted by the second existing technology is to use a video acquisition module and a video data processing module to replace the laser sensor, and obtain the position of the wafer in real time through the video acquisition module. By comparing the real-time wafer position with the preset calibration position, when a difference in the wafer position is detected, an alarm is issued to interrupt the transmission. At the same time, the position of the wafer in the transmission system can be accurately determined. Figure 2 As shown in the figure, it includes a transfer chamber 24, multiple process chambers 25, a semiconductor equipment front module 22, a robot 20 and an atmospheric vacuum conversion chamber 23. This solution not only installs 4 video acquisition modules 21 in the vacuum transfer chamber 24, but also installs 1 video acquisition module 21 in each of the 2 atmospheric vacuum conversion chambers 23, and 2 video acquisition modules 21 in the semiconductor equipment front module 22.

[0057] This solution utilizes eight video acquisition modules for real-time monitoring and control. This requires real-time processing of image data, resulting in enormous amounts of video and computational data. This places extremely high demands on the control system's processing power, and the high computational effort can easily slow down the system's processing capabilities during normal operation. Furthermore, poor lighting conditions within the transfer chamber hinder image acquisition, necessitating an increase in the number or size of observation windows within the chamber, which in turn complicates chamber vacuum control. Furthermore, as semiconductor equipment becomes increasingly compact, the size of vacuum transfer chambers and atmospheric vacuum transfer chambers decreases, leading to a reduction in the number of observation windows. Compared to highly integrated semiconductor transfer systems, this solution's video acquisition modules cannot be mounted externally or provided with background fill lighting, resulting in unclear images.

[0058] The present invention provides a wafer position anomaly detection system for semiconductor vacuum transmission. By providing a detection component and a video-assisted module, it can detect anomalies such as wafer drops within the transmission chamber. This increases the detection area for wafer anomalies within the vacuum transmission chamber and improves the accuracy of abnormal position determination. This in turn improves problem-solving efficiency and reduces troubleshooting time.

[0059] The present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention may be implemented in various forms and is not limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present invention more thorough and complete and to fully convey the scope of the present invention to those skilled in the art.

[0060] Example 1

[0061] like Figure 3 As shown, this embodiment provides a wafer position anomaly detection system, which is applied to semiconductor process equipment. The semiconductor process equipment includes a first chamber and a second chamber. A wafer transfer port 15 communicating with the second chamber is provided on a side wall of the first chamber. A transfer device is provided in the first chamber for transferring wafers between the first chamber and the second chamber. The system includes:

[0062] A control unit and a first detection component 6 and a video acquisition module 7 disposed in the first chamber, wherein the first detection component 6, the video acquisition module 7 and the transmission device are respectively connected to the control unit;

[0063] The first detection component 6 is provided corresponding to the transmission path of the wafer and is used to detect whether the wafer has fallen from the transmission device;

[0064] The control unit is used to:

[0065] Monitor in real time whether the detection signal of the first detection component 6 is abnormal. When the detection signal of the first detection component 6 is normal, control the transmission device to execute the set wafer transmission process and control the video acquisition module 7 to remain in a dormant state;

[0066] When the detection signal of the first detection component 6 is detected to be abnormal, the transmission device is controlled to stop the action, and the multiple video acquisition modules 7 are controlled to start capturing images of the interior of the first chamber and send image information, and at the same time send an alarm signal.

[0067] Preferably, the system of this embodiment includes multiple groups of first detection components 6, each group of first detection components 6 includes a first laser emitter 61 and a first laser receiver 62;

[0068] The first laser emitter 61 and the first laser receiver 62 of the same group are oppositely arranged on opposite side walls of the first chamber;

[0069] The height of the first laser emitter 61 and the first laser receiver 62 on the side wall is lower than the lower edge of the film transmission port 15 and higher than the bottom of the first chamber;

[0070] The multiple laser beams generated by the first laser emitters 61 of the multiple groups of first detection components 6 are respectively located in different areas below the wafer moving path, and the laser beams are not blocked by the transmission device.

[0071] Specifically, the control unit monitors the detection signal status of each first laser receiver 62 in real time. When the detection signal from the first laser receiver 62 is normal, the control unit controls the video module 7 to remain in a dormant state and not perform image acquisition and processing. If the laser trigger feedback is abnormal, the control unit activates the video acquisition module 7, identifies the dropped wafer, and locates the abnormal location. Once the problem is resolved, the laser sensor signal is reinitialized, and the detection signal from the first laser receiver returns to normal, the control unit controls the video acquisition module 7 to enter a dormant state again, thus achieving dynamic control of the video acquisition module 7. This means that video signal processing and normal machine operation are not performed simultaneously, effectively ensuring that the controller has sufficient processing power when the machine is operating normally.

[0072] In this embodiment, the first chamber is a transfer chamber 1, and the second chamber includes an atmospheric vacuum conversion chamber 2 and multiple groups of process chambers 3, at least one group of process chambers 3 being sequentially distributed along a side of the transfer chamber 1 adjacent to the atmospheric vacuum conversion chamber 2; the transfer device is a robot 4;

[0073] The multiple groups of first detection components 6 include multiple groups of first sub-detection components and multiple groups of second sub-detection components, and the first sub-detection components and the second sub-detection components each include a first laser emitter 61 and a first laser receiver 62;

[0074] The transfer chamber 1 includes multiple side walls, multiple sets of first sub-detection components are at least arranged at both ends of the side wall connected to the atmospheric vacuum conversion chamber 2 and at both ends of the side wall opposite to the atmospheric vacuum conversion chamber 2, and multiple sets of second sub-detection components are at least arranged at both ends of the two side walls adjacent to the atmospheric vacuum conversion chamber 2;

[0075] The plurality of first sub-detection components are used to detect whether the wafer has fallen from the transmission device along a first direction, and the plurality of second sub-detection components are used to detect whether the wafer has fallen from the transmission device along a second direction perpendicular to the first direction.

[0076] Specifically, if Figure 3 As shown, in this embodiment, the transmission chamber 1 has four sidewalls: a first sidewall 11, a second sidewall 12, a third sidewall 13, and a fourth sidewall 14. Four sets of first monitoring assemblies 6 are mounted on these four sidewalls. The laser emitter 61 and laser receiver 62 of each set of first monitoring assemblies 6 are symmetrically arranged on two opposing sidewalls of the transmission chamber, below the lower edge of the gate valve 15 and above the chamber bottom. A laser beam is formed between the emitter 61 and receiver 62 to monitor the status of the area through which the laser beam passes.

[0077] like Figure 4As shown, the four groups of first monitoring components 6 are divided into two groups of first sub-monitoring components and two groups of second sub-detection components. Among them, the two groups of first sub-monitoring components include two groups of first laser emitters 61 and first laser receivers 62. The two first laser emitters 61 are respectively arranged on the first side wall 11, and are respectively located on both sides below the two gate valves 15 of the atmospheric vacuum conversion chamber. In terms of position selection, the two first laser emitters 61 can be offset a certain distance toward the third side wall 13 and the fourth side wall 14 based on the center position below the gate valve 15 according to the size of the manipulator 4 and the movement path of the fingers of the manipulator 4, to ensure that the laser beam emitted by the first laser emitter 41 is not blocked by the manipulator 4. On the wafer movement path, the specific position of the first laser emitter 61 needs to be determined according to the actual development of the equipment. The two laser receivers 62 in the two groups of first sub-monitoring components are respectively arranged on both sides below the second side wall 12, and each laser receiver 62 is opposite to a laser receiver 61, as shown in FIG. Figure 5a As shown, the laser beams of the two first laser transmitters 61 are received by the two second laser transmitters 62 from area 1 and area 2 respectively, so that the two second laser receivers 62 can be used to monitor Figure 5a The wafer drop is abnormal in the shown area 1 and area 2. The positions of the first laser emitter 61 and the first laser receiver 62 in the first self-detection component can be interchanged.

[0078] The two groups of second sub-monitoring components also include two groups of first laser emitters 61 and first laser receivers 62. The two groups of first laser emitters 61 and first laser receivers 62 are respectively arranged on the third side wall 13 and the fourth side wall 14. Among them, three gate valves 15 docking with the process chamber 3 are respectively provided on the third side wall 13 and the fourth side wall 14. In terms of position selection, the first laser emitter 61 in a group of second self-detection components is arranged on the third side wall 13, directly below the center position of the lower edge of a gate valve 15 closest to the first side wall 11, and the corresponding first laser receiver 62 is arranged on the fourth side wall 14, directly below the center position of the lower edge of a gate valve 15 closest to the first side wall 11, as shown in FIG. Figure 5b As shown, the laser beam of the first laser emitter 61 of the second sub-detection component passes through area 4 and is received by the first laser receiver opposite, thereby being able to monitor Figure 5b The first laser emitter 61 in the other set of second self-detection components is set directly below the center of the lower edge of a gate valve 15 on the third side wall 13 closest to the second side wall 12, and the corresponding laser receiver 62 is set directly below the center of the lower edge of a gate valve 15 on the fourth side wall 14 closest to the second side wall 12; this set of second sub-detection components can monitor Figure 5bThe wafers in the middle area 3 fall abnormally. The positions of the first laser emitter 61 and the second laser receiver 62 in the two sets of second sub-detection components can be interchanged and are both set between the lower edge of the gate valve 15 and the bottom surface of the chamber. Figure 5a indivual Figure 5b It can be seen that the arrangement of the above four groups of first monitoring components can detect wafer drop anomalies in all areas in the transfer chamber 1 where wafers may drop.

[0079] In this embodiment, the system includes multiple video acquisition modules 7, which are respectively arranged in different top areas of the first chamber. The multiple video acquisition modules 7 all shoot images of different areas in the first chamber diagonally downward, and the shooting areas of the multiple video acquisition modules 7 at least cover the area of ​​the wafer transmission path in the first chamber.

[0080] Specifically, if Figure 3 and Figure 4 As shown, two video acquisition modules 7 are fixed to two corners of the top of the transfer chamber 1 and cross-shoot diagonally downward, complementing each other's monitoring area and capable of capturing the entire transfer chamber's internal environmental conditions, thereby covering the area of ​​the wafer transfer path within the transfer chamber 1. The video acquisition module 7 may include a camera, which needs to be protected to adapt to a vacuum environment.

[0081] In this embodiment, the system further includes a plurality of lighting modules 8, and the plurality of lighting modules 8 are respectively arranged in different areas within the first chamber;

[0082] The control unit is further configured to control the plurality of lighting modules 8 to turn on when detecting that the detection signal of the first detection component 6 is abnormal.

[0083] Specifically, since the lighting conditions in the transmission chamber 1 are poor, it is not conducive to image acquisition by the video acquisition module 7. In this embodiment, two lighting modules 8 are used to provide supplementary lighting for the environment in the chamber during video acquisition. The position and number of the lighting modules 8 can be installed, increased or decreased according to the actual light intensity of the chamber. For example, in this embodiment, two lighting modules 8 are respectively installed on the second side wall 12 and the third side wall 13. The use of lighting modules 8 is beneficial to improving the video clarity and image quality of the video acquisition module 7, and facilitates the identification of the wafer position in the image.

[0084] In this embodiment, the system further includes a plurality of second detection components 5 disposed in the first chamber, and the second detection components 5 are used to detect whether there is a deviation in the relative position between the wafer and the transmission device when the transmission device transmits the wafer to the wafer transfer port 15 position.

[0085] Among them, each group of second detection components 5 includes a second laser emitter and a second laser receiver, and are relatively arranged above and below the film transmission port 15; two groups of second detection components 5 are correspondingly arranged at each film transmission port 15 position, and the laser beams of the second laser emitters of the two groups of second detection components 5 pass through the left and right side areas of the film transmission port 15 from top to bottom respectively.

[0086] Specifically, if Figure 3 As shown, each film transfer port 15 is provided with two sets of second detection components 5. The second laser emitters and second laser receivers of the two sets of second detection components 5 are respectively installed on the upper and lower sides of the film transfer port 15. The two second laser emitters emit lasers to the second laser receivers in real time. If the second laser receivers receive the lasers normally, the second laser receivers will emit laser detection signals and transmit them to the control unit in real time. When the robot 4 carries the wafer through the two laser beams of the second detection components 5 at the film transfer port 15, the wafer will block the laser signals. The second laser receiver located below the film transfer port 15 cannot receive the lasers emitted by the second laser emitters above the film transfer port 15. The second laser sensor stops emitting laser detection signals to the control unit. When the wafer completely passes the laser sensor position, the laser receiver receives the laser signal again and the laser sensor re-sends the detection signal to the control unit. The control unit can calculate the relative position deviation between the wafer and the robot 4 through the change process of the laser detection signal of the second laser receiver in the second detection component 5. If the deviation value is greater than the set value or the laser signal is abnormal, the control unit will interrupt the robot 4 transmission task and alarm the user to inform the user of the abnormal wafer position.

[0087] It should be noted that the number and position of the first laser sensor 6, the video acquisition module 7, and the lighting module 8 in this embodiment are not limited to the above-mentioned method. When the structures of the transmission chamber 1 and the process chamber 3 are different, the number and position of the first detection component 6, the video acquisition module 7, and the lighting module 8 can be adjusted according to the specific structure of the transmission chamber 1. In other implementations of this embodiment, such as Figure 6 As shown, when the space inside the transfer chamber 1 is large, the number of first detection components 6 can be increased accordingly to increase the detection coverage area of ​​the wafer drop area. At the same time, an additional video acquisition module 7 can be set on the top of the chamber near the robot 4 to avoid the video image acquisition blind area. When the structure of the transfer chamber 1 and the process chamber 3 changes, such as Figure 7As shown, when the four side walls of the transfer chamber 1 are relatively short, the side walls are of substantially the same length, and three side walls are connected to the process chamber 3, a corresponding laser sensor can be respectively set just below each film transfer port 15 of the side wall, two video acquisition modules 7 are respectively set at two opposite corners of the top of the transfer chamber 1, and two lighting modules 8 are respectively set at the other two opposite corners of the top of the transfer chamber 1. When the transfer chamber 1 is an irregular polygon, as shown in FIG. Figure 8 The pentagon shown can be used to adjust the setting positions of the first laser emitter 61 and the first laser receiver 62 accordingly to ensure that the first laser receiver 62 on a certain side wall can receive the laser beam of the first laser emitter 61 on the opposite side wall. Similarly, the position of the video acquisition module 7 and the position of the lighting module 8 also need to be adjusted accordingly, such as Figure 8 In the figure, two video acquisition modules 7 are arranged at the angle of the two side walls opposite to the atmospheric vacuum conversion chamber 2, and shoot in different directions respectively. Two lighting modules 8 are respectively arranged at the top of the two sides of the side walls close to the atmospheric vacuum conversion chamber 2.

[0088] like Figure 9 As shown, the control unit in this embodiment may include a transmission system controller, a manipulator 4 controller thereof and a video controller, and each controller is respectively provided with a corresponding software program, wherein the transmission system controller is used to control the transmission process of the entire machine, the first detection component 6, the second detection component 5, the video acquisition module 7 and the lighting module 8 are all connected to the transmission system controller, the manipulator 4 controller is used to control the manipulator 4 to perform corresponding actions of taking, placing and transporting wafers to corresponding positions according to the instructions issued by the transmission system controller, the video controller is used to control the start or sleep state of the video acquisition module 7 according to the instructions issued by the transmission system controller, and to process the collected image when the video acquisition module 7 is working, and identify and calibrate the circular wafer in the image through the existing image recognition algorithm, and then upload it to the transmission system controller, and the transmission system controller uploads the image of the calibrated wafer position to the user system and issues a related alarm of wafer position abnormality.

[0089] Example 2

[0090] This embodiment provides a wafer position abnormality detection method, using the wafer position abnormality detection system of embodiment 1, such as Figure 10 As shown, the method includes:

[0091] S1: receiving in real time the first detection signal uploaded by the first detection component 6;

[0092] S2: Determine whether the first detection signal is abnormal. If not, control the transmission device to execute a normal wafer transmission process and control the video acquisition module to remain in a dormant state. If so, execute step S3;

[0093] S3: Control the transmission device to stop action;

[0094] S4: Control multiple video acquisition modules to start capturing images of the interior of the first chamber and send image information, and send an alarm signal at the same time.

[0095] In this embodiment, the wafer position anomaly detection system further includes a plurality of lighting modules, and the plurality of lighting modules are respectively arranged in different areas within the first chamber;

[0096] Before executing step S4, the method further includes:

[0097] Step S5: Control multiple lighting modules to turn on.

[0098] Before image acquisition, the lighting module is turned on to illuminate the environment in the transmission chamber 1 to improve the quality and clarity of image acquisition, thereby improving the accuracy of image recognition of abnormal positions of wafers.

[0099] In this embodiment, after executing step S4, the method further includes:

[0100] Step S6: monitor whether the alarm information is eliminated. If so, initialize the first detection signal of the first detection component and convert the video acquisition module to a dormant state, then return to step S1; otherwise, return to step S4.

[0101] In this embodiment, the system further includes a plurality of second detection components disposed in the first chamber, the second detection components being used to detect whether there is a deviation in the relative position between the wafer and the transfer device when the robot transfers the wafer to the wafer transfer port position;

[0102] The wafer position abnormality detection method further includes:

[0103] Step S7: receiving in real time the second detection signal uploaded by the second detection component;

[0104] Step S8: determining whether the second detection signal is abnormal; if not, controlling the transmission device to execute a normal wafer transmission process; if so, executing step S9;

[0105] S9: Control the transmission device to stop and send an alarm message of wafer position abnormality to the user system.

[0106] Specifically, after the transmission control system is started, the wafer position abnormality detection system is initialized. When the equipment is in normal working order, the first detection signal of the first laser receiver 62 in each group of the first detection components 6 is normal, and the video acquisition module enters the dormant state and waits to be awakened. When the first detection signal uploaded by any of the first laser receivers 62 is abnormal, for example, during the wafer transportation process, Figure 4If the area 1 shown falls, the laser signal of the corresponding first sub-detection component will be blocked. The transmission system controller detects the signal abnormality, stops the equipment workflow, stops the robot 4, and turns on the two light modules 8 to provide auxiliary lighting for the video acquisition module 7. The two video acquisition modules 7 are controlled to start collecting image information. The video controller collects the image information. Figure 5a Area 1 shown is analyzed specifically to identify the location of the dropped wafer, marking it in the captured image and feeding it back to the transport system controller. Based on the position of the triggered laser sensor group and the video recognition results, the transport system controller issues an alarm and image signal to the user system. The operator can use the alarm information and video images displayed on the user system to quickly determine the abnormal fault point and develop a troubleshooting solution, improving troubleshooting efficiency and reducing downtime. Meanwhile, until the user system alarm is cleared, the video acquisition system remains active and displays the real-time information on the user system. Once the fault is resolved and the equipment returns to normal, the operator clears the user system interface alarm. The transport system controller initializes the sensors and video controller. Once the signals from each laser sensor group are normal, the transport system controller turns off the lighting module 8, and the video controller enters a dormant state. The equipment resumes normal operation and waits for the next startup, without consuming the transport system controller's computing power. The process for detecting abnormal relative position between the wafer and the robot 4 at the wafer transfer port using the second detection component is similar to the above process and will not be detailed here.

[0107] Example 3

[0108] This embodiment provides a semiconductor process equipment, including: the wafer position anomaly detection system of embodiment 1.

[0109] The equipment of this embodiment also includes: a transfer chamber 1, an atmospheric vacuum conversion chamber 2 and multiple process chambers 3 docked with the transfer chamber 1, and a robot 4 for transferring wafers between the atmospheric vacuum conversion chamber 2 and the process chamber 3 is provided in the transfer chamber 1.

[0110] The semiconductor process equipment of this embodiment can effectively monitor abnormal wafer drops from the transmission device. When an abnormal wafer drop occurs, the wafer transmission process can be stopped immediately, the wafer drop position in the transmission chamber 1 can be located through video acquisition, and the video image can be uploaded to the user system while an alarm is issued. The abnormal fault point can be quickly determined through the video image, and a fault solution can be formulated based on this, effectively improving the troubleshooting efficiency and reducing downtime.

[0111] In summary, this invention enables rapid and accurate wafer position anomaly detection across the entire vacuum transfer chamber, expanding the detection area for wafer anomalies within the vacuum transfer chamber and improving the accuracy of abnormal position determination. This in turn improves problem-solving efficiency, reduces troubleshooting time, accelerates equipment capacity recovery, and avoids waiting time losses caused by prolonged equipment outages.

[0112] While various embodiments of the present invention have been described above, the above description is intended to be illustrative, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A wafer position anomaly detection system, applied to semiconductor process equipment, wherein the semiconductor process equipment comprises a first chamber and a second chamber, wherein a wafer transfer port communicating with the second chamber is provided on a side wall of the first chamber, and a transfer device is provided in the first chamber for transferring wafers between the first chamber and the second chamber, wherein: The system comprises: a control unit, and a first detection component and a video acquisition module disposed in the first chamber, wherein the first detection component, the video acquisition module, and the transmission device are respectively connected to the control unit; The first detection component is arranged corresponding to the transmission path of the wafer and is used to detect whether the wafer falls from the transmission device; The control unit is used for: monitoring in real time whether the detection signal of the first detection component is abnormal; when the detection signal of the first detection component is detected to be normal, controlling the transmission device to execute a set wafer transmission process and controlling the video acquisition module to remain in a dormant state; When the detection signal of the first detection component is detected to be abnormal, the transmission device is controlled to stop operation, and the multiple video acquisition modules are controlled to start image acquisition of the interior of the first chamber and send image information, and an alarm signal is sent at the same time.

2. The wafer position abnormality detection system according to claim 1, characterized in that: The system includes a plurality of groups of first detection components, each group of the first detection components includes a first laser transmitter and a first laser receiver; The first laser emitter and the first laser receiver of the same group are oppositely arranged on opposite side walls of the first chamber; The heights of the first laser transmitter and the first laser receiver on the side wall are lower than the lower edge of the film transmission port and higher than the bottom of the first chamber; The multiple laser beams generated by the first laser emitters of the multiple groups of the first detection components are respectively located in different areas below the wafer movement path, and the laser beams are not blocked by the transmission device.

3. The wafer position abnormality detection system according to claim 2, characterized in that: The first chamber is a transfer chamber, and the second chamber includes an atmospheric vacuum conversion chamber and multiple groups of process chambers, at least one group of the process chambers being sequentially distributed along a side of the transfer chamber adjacent to the atmospheric vacuum conversion chamber; The plurality of groups of the first detection components include a plurality of groups of first sub-detection components and a plurality of groups of second sub-detection components, and the first sub-detection components and the second sub-detection components each include the first laser emitter and the first laser receiver; The transfer chamber includes a plurality of side walls, and a plurality of groups of the first sub-detection components are at least arranged at both ends of the side wall that interfaces with the atmospheric vacuum conversion chamber and at both ends of the side wall opposite to the atmospheric vacuum conversion chamber, and a plurality of groups of the second sub-detection components are at least arranged at both ends of two side walls adjacent to the atmospheric vacuum conversion chamber; Multiple groups of the first sub-detection components are used to detect whether the wafer has fallen from the transmission device along a first direction, and multiple groups of the second sub-detection components are used to detect whether the wafer has fallen from the transmission device along a second direction perpendicular to the first direction.

4. The wafer position abnormality detection system according to claim 1, wherein: The system includes multiple video acquisition modules, which are respectively arranged in different top areas of the first chamber. The multiple video acquisition modules all capture images of different areas in the first chamber diagonally downward, and the shooting areas of the multiple video acquisition modules at least cover the area of ​​the wafer transmission path in the first chamber.

5. The wafer position abnormality detection system according to claim 1, wherein: The system further includes a plurality of lighting modules, wherein the plurality of lighting modules are respectively disposed in different areas within the first chamber; The control unit is further configured to control the plurality of lighting modules to turn on when detecting that the detection signal of the first detection component is abnormal.

6. The wafer position abnormality detection system according to claim 1, wherein: The system also includes multiple groups of second detection components arranged in the first chamber, and the second detection components are used to detect whether there is a deviation in the relative position between the wafer and the transmission device when the transmission device transmits the wafer to the wafer transfer port position.

7. The wafer position abnormality detection system according to claim 6, characterized in that: Each set of the second detection components includes a second laser transmitter and a second laser receiver, which are arranged above and below the film transmission port relative to each other; Two groups of the second detection components are correspondingly arranged at each film transmission port position, and the laser beams of the second laser emitters of the two groups of the second detection components pass through the left and right side areas of the film transmission port from top to bottom respectively.

8. A wafer position anomaly detection method, utilizing the wafer position anomaly detection system according to any one of claims 1 to 7, characterized in that: The method comprises: S1: receiving in real time a first detection signal uploaded by the first detection component; S2: Determine whether the first detection signal is abnormal. If not, control the transmission device to perform a normal wafer transmission process and control the video acquisition module to remain in a dormant state. If yes, execute step S3; S3: Control the transmission device to stop operation; S4: Control the plurality of video acquisition modules to start capturing images of the interior of the first chamber and send image information, and send an alarm signal at the same time.

9. The wafer position abnormality detection method according to claim 8, characterized in that: The wafer position abnormality detection system further includes a plurality of lighting modules, wherein the plurality of lighting modules are respectively arranged in different areas within the first chamber; Before executing step S4, the method further includes: Step S5: controlling the plurality of light modules to turn on.

10. The wafer position abnormality detection method according to claim 8, characterized in that: After executing step S4, the method further includes: Step S6: monitor whether the alarm signal is eliminated. If so, initialize the first detection signal of the first detection component and convert the video acquisition module to a dormant state, then return to step S1; otherwise, return to step S4.

11. The wafer position abnormality detection method according to claim 8, characterized in that: The system further includes a plurality of second detection components disposed in the first chamber, the second detection components being used to detect whether there is a deviation in the relative position between the wafer and the transmission device when the robot transfers the wafer to the wafer transfer port position; The wafer position abnormality detection method further includes: Step S7: receiving in real time the second detection signal uploaded by the second detection component; Step S8: determining whether the second detection signal is abnormal; if not, controlling the transmission device to perform a normal wafer transmission process; if so, executing step S11; S9: Control the transmission device to stop and send an alarm message indicating abnormal wafer position to the user system.

12. A semiconductor process equipment, characterized in that: A wafer position anomaly detection system comprising the wafer position anomaly detection system according to any one of claims 1 to 7.

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