Display device and packaging method and packaging equipment thereof

Abstract

The present invention relates to a display device and a packaging method and packaging equipment thereof. The packaging method comprises the following steps: providing a display substrate and a packaging cover plate, wherein a sealing glue frame is provided on the packaging cover plate; setting a filling glue at a temperature of T°C in the sealing glue frame on the packaging cover plate, wherein 35≤T≤80; performing a process of aligning and pressing the side of the packaging cover plate provided with the filling glue with the display substrate; and curing the sealing glue frame and the filling glue between the packaging cover plate and the display substrate after the aligning and pressing process. Thus, by heating the filling glue separately before dripping the filling glue in the sealing glue frame, the viscosity of the filling glue is reduced after heating, thereby improving the fluidity of the glue, so that the filling glue is easy to spread over the entire packaging area during the pressing process, thereby solving the problem of bubbles left when the filling glue is not fully filled during packaging. The method has no effect on the sealing glue frame, and the sealing glue frame has good impact resistance, thereby improving the packaging effect and improving the performance of the display device.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device and a packaging method and packaging equipment thereof. Background Art

[0002] OLED (Organic Light-Emitting Diode), also known as organic electric laser display, organic light-emitting semiconductor. OLED is a current-type organic light-emitting device, which is a phenomenon of luminescence caused by the injection and recombination of carriers, and the luminescence intensity is proportional to the injected current. Under the action of the electric field, the holes generated by the anode and the electrons generated by the cathode of the OLED will move, inject into the hole transport layer and the electron transport layer respectively, and migrate to the light-emitting layer. When the two meet in the light-emitting layer, energy excitons are generated, thereby exciting the light-emitting molecules to finally produce visible light. OLED has many advantages such as self-luminescence, low driving voltage, high luminous efficiency, foldable, rollable, fast response speed, large viewing angle, high contrast, etc., which can meet consumers' new demands for display technology. More and more display manufacturers around the world have invested in research and development, which has greatly promoted the industrialization process of OLED.

[0003] At present, the biggest problem restricting the development of the OLED industry and the biggest defect of OLED is the short life of OLED. There are many factors that affect the life of OLED devices. According to the factors that affect OLED devices, the influencing factors can be divided into two types: internal factors and external factors. Among them, the main reason for the short life of OLED is that the electrodes and organic materials that constitute OLED devices are very sensitive to water vapor and oxygen. Therefore, it is particularly important to effectively encapsulate OLED and prevent water vapor and oxygen from entering the interior of OLED to extend the life of OLED and ensure the performance of OLED devices.

[0004] Encapsulation is the key to the effectiveness of OLED. OLED encapsulation mainly includes the following methods: Thin-Film Encapsulation (TFE), desiccant encapsulation, UV glue encapsulation (also known as Dam only encapsulation), UV glue and filling glue encapsulation (also known as Dam&Fill encapsulation), glass glue encapsulation (also known as Frit encapsulation), etc. Among them, Dam&Fill encapsulation has been increasingly used in the OLED industry due to its simple process, suitability for large-size encapsulation, high encapsulation flexibility, good stability and reliability, and can effectively reduce production costs. However, the traditional Dam&Fill encapsulation process often has the problem of residual bubbles. Summary of the invention

[0005] Based on this, it is necessary to provide a packaging method for a display device that can avoid residual bubbles.

[0006] A method for packaging a display device comprises the following steps:

[0007] Providing a display substrate and a packaging cover plate, wherein a sealing glue frame is provided on the packaging cover plate;

[0008] A filling glue having a temperature of T°C is provided in the sealing glue frame on the packaging cover plate, wherein 35≤T≤80;

[0009] Performing an alignment and pressing process on the side of the packaging cover plate provided with the filling glue and the display substrate; and

[0010] The sealant frame and the filling glue between the packaging cover plate and the display substrate after the alignment and pressing process are cured.

[0011] The applicant has found through research that the reason why the general Dam&Fill packaging technology is prone to the problem of residual bubbles is that the viscosity of the filling glue is too high and cannot be fully diffused in the sealant frame. Heating can reduce the viscosity of the filling glue, making it easy to flow and diffuse, but heating will cause the sealant frame to be heated, thereby reducing its viscosity and impact resistance, and the sealant frame will be damaged by the filling glue. If the viscosity of the sealant frame is to be improved, it is necessary to perform ultraviolet curing to a certain extent, but the ultraviolet rays will also irradiate the filling glue at the same time, causing the viscosity of the filling glue to increase, which is not conducive to the diffusion of the filling glue, resulting in easy generation of bubbles, and it is difficult to take into account both the full diffusion of the filling glue and the impact resistance of the sealant frame. The packaging method of the present invention preheats the filling glue to 35°C to 80°C before setting the filling glue in the sealant frame. The viscosity of the filling glue is reduced after heating, which improves the fluidity of the glue, so that the filling glue can easily cover the entire packaging area during the pressing process, thereby solving the problem of bubbles left when the filling glue is not fully filled during Dam&Fill packaging. Moreover, the method has no effect on the sealant frame, does not reduce the viscosity of the sealant frame, and has good impact resistance, thereby ensuring both sufficient diffusion of the filling glue and the impact resistance of the sealant frame, improving the packaging effect, improving the performance of the display device, and extending the life of the display device. The packaging method of the present invention solves the bubble problem caused by insufficient diffusion of the filling glue in the traditional packaging technology, and also ensures the impact resistance of the sealant frame, avoiding the problem of damage and defects caused by the impact of the filling glue on the sealant frame, and ensuring the packaging effect of the display device.

[0012] In one of the embodiments, the viscosity of the filling glue at T°C is 50 mPa·s to 510 mPa·s.

[0013] In one of the embodiments, before setting the filling glue at a temperature of T°C in the sealing glue frame on the packaging cover plate, the filling glue is preheated to T°C.

[0014] In one embodiment, 50≤T≤80.

[0015] In one embodiment, before the step of setting a filling glue at a temperature of 35° C. to 80° C. in the sealing glue frame on the packaging cover plate, the following steps are also included:

[0016] The sealant frame on the packaging cover is pre-cured.

[0017] In one embodiment, the sealant frame is formed by UV glue, and the pre-curing process comprises:

[0018] The sealant frame is irradiated with UV light, the wavelength of the light source is 330nm-400nm, the curing time is 20-60 seconds, and the curing intensity is 100-130J / cm 2 .

[0019] In one embodiment, the alignment and pressing step is performed under vacuum conditions, and the air pressure is less than or equal to -2000Pa.

[0020] In one embodiment, the curing step includes:

[0021] The sealing glue frame and the filling glue are heated to above 80° C. to solidify them.

[0022] In one of the embodiments, the filling glue is dispensed in an array arrangement in the sealing glue frame on the packaging cover.

[0023] The present invention also provides a packaging device, comprising:

[0024] A filling glue dispensing device is used to preheat the filling glue to 35°C to 80°C, and then place the filling glue in a sealing glue frame on the packaging cover plate; the filling glue dispensing device includes a glue storage mechanism and a heating mechanism, the glue storage mechanism has a storage cavity for storing the filling glue and a glue outlet communicated with the storage cavity, and the heating mechanism is connected to the glue storage mechanism to heat the filling glue in the storage cavity;

[0025] A pressing device, used for aligning and pressing the side of the packaging cover plate provided with the filling glue with the display substrate; and

[0026] The curing device is used to cure the sealant frame and the filling glue between the packaging cover plate and the display substrate after alignment and pressing.

[0027] In one embodiment, the heating mechanism is coated on the outside of the glue storage mechanism.

[0028] The present invention also provides a display device, which is prepared according to the above packaging method. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of a filling glue dispensing device according to an embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of an OLED substrate in Example 1 of the present invention;

[0031] Figure 3 Schematic diagram of the structure of the packaging cover plate in Example 1 of the present invention.

[0032] Description of reference numerals:

[0033] The filling glue dispensing device 100 , the glue storage mechanism 110 , the heating mechanism 120 , the glue outlet 111 , the glue inlet 112 , the OLED substrate 200 , the packaging cover plate 300 , the sealing glue frame 301 , and the filling glue 302 . DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the present invention, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be fixed connection, detachable connection, or integrated; it can be mechanical connection or electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In the present invention, unless otherwise clearly defined and limited, the first feature "on" or "below" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. It should be noted that when an element is referred to as "fixed on" or "set on" another element, it can be directly on the other element or there can be an element in the middle. When an element is considered to be "connected" to another element, it may be directly connected to another element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0037] A packaging method for a display device according to an embodiment of the present invention comprises the following steps S1 to S4:

[0038] S1. Provide a display substrate and a packaging cover plate, wherein a sealing frame is provided on the packaging cover plate;

[0039] S2. Filling glue with a temperature of T°C is set in the sealing glue frame on the package cover, where 35≤T≤80;

[0040] S3, aligning and pressing the side of the packaging cover plate provided with the filling glue with the display substrate;

[0041] S4, curing the sealant frame and the filling glue between the packaging cover plate and the display substrate after the alignment and pressing process.

[0042] The applicant has found through research that the reason why the general Dam&Fill packaging technology is prone to residual bubbles is that the viscosity of the filling glue is too high and cannot be fully diffused in the sealant frame. Heating can reduce the viscosity of the filling glue, making it easier to flow and diffuse, but heating will cause the sealant frame to be heated as well, thereby reducing its viscosity and impact resistance, and the sealant frame will be damaged by the filling glue. If the viscosity of the sealant frame is to be increased, it needs to be cured by ultraviolet light to a certain extent, but ultraviolet rays will also irradiate the filling glue at the same time, causing the viscosity of the filling glue to increase, which is not conducive to the diffusion of the filling glue, resulting in the easy generation of bubbles. It is difficult to take into account both the full diffusion of the filling glue and the impact resistance of the sealant frame at the same time.

[0043] The packaging method of the present invention preheats the filling glue to 35°C to 80°C before dripping the filling glue in the sealing glue frame. The viscosity of the filling glue decreases after heating, which improves the fluidity of the glue, so that the filling glue can easily cover the entire packaging area during the pressing process, thereby solving the problem of bubbles left by the filling glue when the Dam&Fill packaging is not fully filled. Moreover, the method has no effect on the sealing glue frame and will not reduce the viscosity of the sealing glue frame. The sealing glue frame has good impact resistance, thereby ensuring both the sufficient diffusion of the filling glue and the impact resistance of the sealing glue frame, improving the packaging effect, improving the performance of the display device, and extending the life of the display device. The packaging method of the present invention solves the bubble problem caused by insufficient diffusion of the filling glue in the traditional packaging technology, and also ensures the impact resistance of the sealing glue frame, avoiding the problem of damage and defects caused by the impact of the filling glue on the sealing glue frame, and ensuring the packaging effect of the display device.

[0044] In a specific example, the viscosity of the T℃ filling glue is 50mPa·s~510mPa·s, which can better cover the entire packaging area and solve the problem of incomplete filling of the filling glue and bubbles during Dam&Fill packaging.

[0045] In a specific example, before setting the filling glue at a temperature of T°C in the sealing glue frame on the package cover, the filling glue is preheated to T°C. Further, it can be 50°C to 80°C, preferably 50 to 70°C, and the heating time is 1 to 60 seconds. Heating the filling glue to this temperature range can effectively reduce its viscosity and improve its fluidity, so that the filling glue is easy to flow and diffuse so that it can better fill the sealing glue frame, thereby improving the packaging effect.

[0046] In a specific example, before the step of setting the preheated filling glue in the sealing glue frame on the packaging cover, the following step is also included: pre-curing the sealing glue frame on the packaging cover. In this way, by pre-curing the sealing glue frame, the viscosity of the sealing glue frame can be increased, and its impact resistance can be further improved, thereby improving the packaging effect.

[0047] In a specific example, the sealant frame is formed by UV glue, and the pre-curing process is as follows: irradiating the sealant frame with UV light, the wavelength of the light source is 330nm to 400nm, the curing time is 20 to 60 seconds, and the curing intensity is 100 to 130 J / cm 2 .

[0048] In a specific example, the above-mentioned alignment and pressing process is performed under vacuum conditions, and the air pressure is less than or equal to -2000Pa, so that the bubbles in the filling glue can be better discharged, further improving the packaging effect.

[0049] In a specific example, the curing step includes: heating the sealant frame and the filling glue to above 80° C. to cure them. Preferably, the temperature is 80-90° C. and maintained for 10-60 minutes.

[0050] In a specific example, the preheated filling glue is dispensed in an array arrangement in the sealing glue frame on the packaging cover.

[0051] like Figure 1 As shown, a packaging device according to an embodiment of the present invention includes: a filling glue dispensing device 100, a pressing device (not shown) and a curing device (not shown). The filling glue dispensing device 100 is used to preheat the filling glue to 35°C to 80°C, and then set the above-mentioned filling glue in the sealing glue frame on the packaging cover. The filling glue dispensing device 100 includes a glue storage mechanism 110 and a heating mechanism 120. The glue storage mechanism 110 has a storage cavity for storing the filling glue and a glue outlet 111 connected to the storage cavity. The heating mechanism 120 is connected to the glue storage mechanism 110 for heating the filling glue in the storage cavity.

[0052] The pressing device (not shown) is used to align and press the side of the packaging cover plate provided with the filling glue with the display substrate.

[0053] The curing device (not shown) is used to cure the sealant frame and the filling glue between the package cover plate and the display substrate after alignment and pressing.

[0054] In this way, the filling glue can be stored in the glue storage mechanism 110. The heating mechanism 20 preheats at the beginning of glue dispensing to raise the temperature of the filling glue in the storage cavity to 35°C to 80°C, and then drips it into the sealing glue frame through the glue outlet 111. The filling glue is heated and its viscosity decreases with the increase of temperature, making it easy to flow and diffuse. In this way, in the subsequent pressing process, the filling glue can easily cover the entire packaging area, thereby improving the packaging effect. The heating mechanism 120 can stop heating at the end of glue dispensing, and finally perform curing treatment to complete the packaging. The packaging equipment of the present invention can heat the filling glue separately before dripping the filling glue in the sealing glue frame. After the filling glue is heated, the viscosity decreases, which improves the fluidity of the glue, so that the filling glue can easily cover the entire packaging area during the pressing process, thereby solving the problem of incomplete filling of the filling glue and leaving bubbles during Dam&Fill packaging. Moreover, the device has no effect on the sealant frame and will not reduce the viscosity of the sealant frame. The sealant frame has good impact resistance, thereby ensuring both sufficient diffusion of the filling glue and impact resistance of the sealant frame, improving the packaging effect, improving the performance of the display device, and extending the life of the display device.

[0055] In a specific example, the glue storage mechanism 110 further has a glue inlet 112 communicated with the storage cavity at one end away from the glue outlet 111. Thus, the glue inlet 112 can be used to conveniently inject filling glue into the glue storage cavity of the glue storage mechanism 110.

[0056] In a specific example, the heating mechanism 120 is coated on the outside of the glue storage mechanism 110, so that the heating mechanism 120 can heat the filling glue in the glue storage mechanism 110 more quickly and evenly, accurately and quickly increase the temperature of the filling glue, and reduce the viscosity of the filling glue, thereby better improving the packaging effect. It can be understood that the heating mechanism 120 can be various types of known heating devices such as a heating plate.

[0057] A display device according to an embodiment of the present invention is prepared according to the above packaging method.

[0058] The display device prepared by the packaging method of the present invention solves the problem of bubbles left by insufficient filling of the filling glue during packaging because the filling glue is well spread over the entire packaging area during the pressing process, and the impact resistance of the sealing glue frame is good, which not only ensures the full diffusion of the filling glue but also ensures the impact resistance of the sealing glue frame, improves the packaging effect, thereby improving the performance of the display device and extending the life of the display device. The packaging method of the present invention solves the bubble problem caused by insufficient diffusion of the filling glue in the traditional packaging technology, and also ensures the impact resistance of the sealing glue frame, avoids the problem of damage and defects caused by the sealing glue frame being impacted by the filling glue, ensures the packaging effect of the display device, and the prepared display device has good performance and life.

[0059] Example 1

[0060] Step 1: Figure 2 and Figure 3 As shown, an OLED substrate 200 and a package cover plate 300 are provided. The package cover plate 300 has a sealant frame 301 and is pre-cured: the sealant frame is irradiated with UV light, the wavelength of the light source is 330nm, the curing time is 20 seconds, and the curing intensity is 120J / cm 2 .

[0061] The OLED substrate 200 and the package cover plate 300 are transparent substrates. The sealant frame 301 is coated with UV glue and pre-cured to improve the viscosity of the sealant frame 301, so that the sealant frame 301 is not easily damaged or defective by the impact of the filling glue.

[0062] Step 2: preheat the filling glue and apply the filling glue 302 to the area inside the sealing glue frame 301 of the packaging cover plate 300 .

[0063] The filling glue is a liquid transparent desiccant. Before dispensing, the heating mechanism 20 is turned on to heat the filling glue. The heating temperature of the filling glue is controlled at 35-40°C. The viscosity of the filling glue decreases to 510mPa·s as the temperature increases, and it is easy to flow and diffuse, so that the filling glue can fully fill the sealing glue frame 301, thereby improving the packaging effect.

[0064] Step 3: Send the OLED substrate 200 and the packaging cover plate 300 to the packaging station for vacuuming.

[0065] The air is exhausted by the exhaust device until the air pressure reaches -2000 Pa, so that the bubbles in the filling glue 302 can be discharged.

[0066] Step 4: Align and press the OLED substrate 200 and the packaging cover plate 300.

[0067] The camera is used to observe the overlap of the alignment marks of the OLED substrate 200 and the packaging cover plate 300 until the alignment marks of the OLED substrate 200 and the packaging cover plate 300 are completely and accurately overlapped and then pressed together.

[0068] Step 5: Inflate and take out the pressed OLED substrate 200 and the packaging cover plate 300.

[0069] The pressed OLED substrate 200 and the package cover plate 300 are lifted up by a robot arm and taken out.

[0070] Step 6: Curing the sealing glue frame 301 and the filling glue 302.

[0071] The sealing glue frame 301 and the filling glue 302 are heated to 80° C. in an oven to solidify them, thereby completing the packaging of the OLED display device.

[0072] Packaging effect test: water vapor transmission rate WVTR [g / m 3 24h](100umt):85℃ / 85%RH=258 (hours required for water vapor transmission to reach 100umt)

[0073] Example 2

[0074] Step 1: Figure 2 and Figure 3 As shown, an OLED substrate 200 and a package cover plate 300 are provided. The package cover plate 300 has a sealant frame 301 and is pre-cured: the sealant frame is irradiated with UV light, the wavelength of the light source is 330nm, the curing time is 20 seconds, and the curing intensity is 120J / cm 2 .

[0075] The OLED substrate 200 and the package cover plate 300 are transparent substrates. The sealant frame 301 is coated with UV glue and pre-cured to improve the viscosity of the sealant frame 301, so that the sealant frame 301 is not easily damaged or defective by the impact of the filling glue.

[0076] Step 2: preheat the filling glue and apply the filling glue 302 to the area inside the sealing glue frame 301 of the packaging cover plate 300 .

[0077] The filling glue is a liquid transparent desiccant. Before dispensing, the heating mechanism 20 is turned on to heat the filling glue. The heating temperature of the filling glue is controlled at 40-50°C. The viscosity of the filling glue decreases to 256mPa·s as the temperature increases, and it is easy to flow and diffuse, so that the filling glue can fully fill the sealing glue frame 301, thereby improving the packaging effect.

[0078] Step 3: Send the OLED substrate 200 and the packaging cover plate 300 to the packaging station for vacuuming.

[0079] The air is exhausted by the exhaust device until the air pressure reaches -2000 Pa, so that the bubbles in the filling glue 302 can be discharged.

[0080] Step 4: Align and press the OLED substrate 200 and the packaging cover plate 300.

[0081] The camera is used to observe the overlap of the alignment marks of the OLED substrate 200 and the packaging cover plate 300 until the alignment marks of the OLED substrate 200 and the packaging cover plate 300 are completely and accurately overlapped and then pressed together.

[0082] Step 5: Inflate and take out the pressed OLED substrate 200 and the packaging cover plate 300.

[0083] The pressed OLED substrate 200 and the package cover plate 300 are lifted up by a robot arm and taken out.

[0084] Step 6: Curing the sealing glue frame 301 and the filling glue 302.

[0085] The sealing glue frame 301 and the filling glue 302 are heated to 80° C. in an oven to solidify them, thereby completing the packaging of the OLED display device.

[0086] Packaging effect test: WVTR[g / m 3 ·24h] (100umt): 85℃ / 85%RH=285

[0087] Example 3

[0088] Step 1: Figure 2 and Figure 3As shown, an OLED substrate 200 and a package cover plate 300 are provided. The package cover plate 300 has a sealant frame 301 and is pre-cured: the sealant frame is irradiated with UV light, the wavelength of the light source is 330nm, the curing time is 20 seconds, and the curing intensity is 120J / cm 2 .

[0089] The OLED substrate 200 and the package cover plate 300 are transparent substrates. The sealant frame 301 is coated with UV glue and pre-cured to improve the viscosity of the sealant frame 301, so that the sealant frame 301 is not easily damaged or defective by the impact of the filling glue.

[0090] Step 2: preheat the filling glue and apply the filling glue 302 to the area inside the sealing glue frame 301 of the packaging cover plate 300 .

[0091] The filling glue is a liquid transparent desiccant. Before dispensing, the heating mechanism 20 is turned on to heat the filling glue. The heating temperature of the filling glue is controlled at 50-70°C. The viscosity of the filling glue decreases to 90mPa·s as the temperature increases, making it easy to flow and diffuse, so that the filling glue can fully fill the sealing glue frame 301, thereby improving the packaging effect.

[0092] Step 3: Send the OLED substrate 200 and the packaging cover plate 300 to the packaging station for vacuuming.

[0093] The air is exhausted by the exhaust device until the air pressure reaches -2000 Pa, so that the bubbles in the filling glue 302 can be discharged.

[0094] Step 4: Align and press the OLED substrate 200 and the packaging cover plate 300.

[0095] The camera is used to observe the overlap of the alignment marks of the OLED substrate 200 and the packaging cover plate 300 until the alignment marks of the OLED substrate 200 and the packaging cover plate 300 are completely and accurately overlapped and then pressed together.

[0096] Step 5: Inflate and take out the pressed OLED substrate 200 and the packaging cover plate 300.

[0097] The pressed OLED substrate 200 and the package cover plate 300 are lifted up by a robot arm and taken out.

[0098] Step 6: Curing the sealing glue frame 301 and the filling glue 302.

[0099] The sealing glue frame 301 and the filling glue 302 are heated to 80° C. in an oven to solidify them, thereby completing the packaging of the OLED display device.

[0100] Packaging effect test: WVTR [g / m3·24h] (100umt): 85℃ / 85%RH=328

[0101] Comparative Example 1

[0102] Step 1: Provide an OLED substrate and a package cover plate. The package cover plate has a sealant frame and is pre-cured: irradiate the sealant frame with UV light, the wavelength of the light source is 330nm, the curing time is 20 seconds, and the curing intensity is 120J / cm 2 .

[0103] The OLED substrate and the package cover are transparent substrates. The sealant frame is coated with UV glue and pre-cured to increase the viscosity of the sealant frame, making it less likely to be damaged or defective due to the impact of the filling glue.

[0104] Step 2: Do not preheat the filling glue, and directly apply the filling glue to the area within the sealant frame of the package cover.

[0105] Step 3: Send the OLED substrate and packaging cover to the packaging station for vacuuming.

[0106] Use the vacuum device to evacuate air until the air pressure reaches -2000Pa to expel the bubbles in the filling glue.

[0107] Step 4: Heat the package cover to 60-75°C.

[0108] Step 5: Align and press the OLED substrate and the packaging cover plate.

[0109] The camera is used to observe the overlap of the alignment marks on the OLED substrate and the packaging cover plate, and the OLED substrate and the packaging cover plate are pressed together until the alignment marks on the OLED substrate and the packaging cover plate are completely and accurately overlapped.

[0110] Step 6: Inflate and take out the pressed OLED substrate and packaging cover.

[0111] Use a robotic arm to lift the pressed OLED substrate and packaging cover and take them out.

[0112] Step 7: Curing the sealant frame and the filling glue.

[0113] The sealant frame and the filling glue are heated to 80° C. in an oven to solidify them, thereby completing the packaging of the OLED display device.

[0114] As the package cover is heated, the filling glue is also heated and the sealing glue frame is also heated, so that the viscosity and impact resistance of the filling glue are reduced, and the sealing glue frame is damaged by the filling glue.

[0115] Packaging effect test: WVTR[g / m3 ·24h] (100umt): 85℃ / 85%RH=5

[0116] Comparative Example 2

[0117] Step 1: Provide an OLED substrate and a package cover plate. The package cover plate has a sealant frame and is pre-cured: irradiate the sealant frame with UV light, the wavelength of the light source is 330nm, the curing time is 20 seconds, and the curing intensity is 120J / cm 2 .

[0118] The OLED substrate and the package cover are transparent substrates. The sealant frame is coated with UV glue and pre-cured to increase the viscosity of the sealant frame, making it less likely to be damaged or defective due to the impact of the filling glue.

[0119] Step 2: Do not preheat the filling glue, and directly apply the filling glue to the area within the sealant frame of the package cover.

[0120] Step 3: Send the OLED substrate and packaging cover to the packaging station for vacuuming.

[0121] Use the vacuum device to evacuate air until the air pressure reaches -2000Pa to expel the bubbles in the filling glue.

[0122] Step 4: Align and press the OLED substrate and the packaging cover plate.

[0123] The camera is used to observe the overlap of the alignment marks on the OLED substrate and the packaging cover plate, and the OLED substrate and the packaging cover plate are pressed together until the alignment marks on the OLED substrate and the packaging cover plate are completely and accurately overlapped.

[0124] Step 5: Inflate and take out the pressed OLED substrate and packaging cover.

[0125] Use a robotic arm to lift the pressed OLED substrate and packaging cover and take them out.

[0126] Step 6: Curing the sealant frame and the filling glue.

[0127] The sealant frame and the filling glue are heated to 80° C. in an oven to solidify them, thereby completing the packaging of the OLED display device.

[0128] Since no heating was performed, the viscosity of the filling adhesive was too high and it could not be fully diffused in the sealant frame, resulting in residual bubbles.

[0129] Packaging effect test: WVTR[g / m 3 ·24h] (100umt): 85℃ / 85%RH=145

[0130] By testing the packaging effect of the above-mentioned embodiments 1 to 3 and comparative examples 1 to 2, it can be seen that the water vapor permeability WVTR (the hours required for water vapor to permeate 100umt) of embodiments 1 to 3 is significantly greater than the water vapor permeability WVTR in comparative examples 1 to 2. The larger the water vapor permeability WVTR value, the better the water vapor barrier effect of the film. Therefore, the water vapor barrier effect of embodiments 1 to 3 is significantly better than that of comparative examples 1 to 2. Therefore, the packaging method of the present invention preheats the filling glue separately before dripping the filling glue in the sealing glue frame. The viscosity of the filling glue is reduced after heating, which improves the fluidity of the glue, so that the filling glue can easily cover the entire packaging area during the pressing process, thereby solving the problem of the filling glue not being fully filled and leaving bubbles during Dam & Fill packaging. Moreover, the method has no effect on the sealing glue frame, does not reduce the viscosity of the sealing glue frame, and has good impact resistance, thereby ensuring both the full diffusion of the filling glue and the impact resistance of the sealing glue frame, improving the packaging effect, improving the performance of the display device, and extending the life of the display device. The packaging method of the present invention solves the bubble problem caused by insufficient diffusion of the filling glue in the traditional packaging technology, ensures the impact resistance of the sealing glue frame, avoids the problem of damage and defects of the sealing glue frame caused by the impact of the filling glue, and ensures the packaging effect of the display device.

[0131] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0132] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for packaging a display device, characterized in that: The following steps are involved: Providing a display substrate and a packaging cover plate, wherein a sealing glue frame is provided on the packaging cover plate; A filling glue having a temperature of T°C is provided in the sealing glue frame on the packaging cover plate, wherein 35≤T≤80; Performing an alignment and pressing process on the side of the packaging cover plate provided with the filling glue and the display substrate; and Curing the sealant frame and the filling glue between the packaging cover plate and the display substrate after the alignment and pressing process; The viscosity of the filling glue at T°C is 50mPa·s to 510mPa·s; Before setting the filling glue at a temperature of T°C in the sealing glue frame on the packaging cover plate, preheating the filling glue to T°C; Before the step of setting a filling glue at a temperature of 35° C. to 80° C. in the sealing glue frame on the packaging cover plate, the following steps are also included: The sealant frame on the packaging cover is pre-cured.

2. The packaging method according to claim 1, characterized in that: 50≤T≤80。 3. The packaging method according to claim 1, characterized in that: The sealant frame is formed by UV glue, and the steps of the pre-curing process are: The sealant frame is irradiated with UV light, the wavelength of the light source is 330nm-400nm, the curing time is 20-60 seconds, and the curing intensity is 100-130J / cm 2 .

4. The packaging method according to any one of claims 1 to 3, characterized in that: The step of alignment and pressing is carried out under vacuum conditions, with the air pressure being less than or equal to -2000Pa.

5. The packaging method according to claim 1, characterized in that: The steps of the curing process include: The sealing glue frame and the filling glue are heated to above 80° C. to solidify them.

6. The packaging method according to claim 1, characterized in that: The filling glue is dripped in the sealing glue frame on the packaging cover plate in an array arrangement.

7. A packaging device, characterized in that: include: A filling glue dispensing device is used to preheat the filling glue to 35°C to 80°C, and then arrange the filling glue in the sealing glue frame on the packaging cover plate, and the viscosity of the filling glue is 50mPa·s to 510mPa·s; the filling glue dispensing device includes a glue storage mechanism and a heating mechanism, the glue storage mechanism has a storage cavity for storing the filling glue and a glue outlet communicated with the storage cavity, and the heating mechanism is connected to the glue storage mechanism to heat the filling glue in the storage cavity; A pressing device, used for aligning and pressing the side of the packaging cover plate provided with the filling glue with the display substrate; and The curing device is used to cure the sealant frame and the filling glue between the packaging cover plate and the display substrate after alignment and pressing.

8. The packaging device according to claim 7, characterized in that: The heating mechanism is coated on the outer side of the glue storage mechanism.

9. A display device, characterized in that: Prepared according to the encapsulation method according to any one of claims 1 to 6.

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