A board separating machine

Abstract

The application discloses a board splitting machine which is used for splitting a to-be-split circuit board into a plurality of sub-circuit boards, and comprises a board splitting device, wherein the board splitting device comprises a limiting mechanism and a punching mechanism; the limiting mechanism is used for limiting the to-be-split circuit board; and the punching mechanism is arranged at one side of the board surface of the circuit board limited by the limiting mechanism, and is used for punching the to-be-split circuit board limited by the limiting mechanism, so as to split the to-be-split circuit board into a plurality of sub-circuit boards. In this way, through cooperation of the limiting mechanism and the punching mechanism, the effect of manually breaking the to-be-split circuit board is simulated, and the problem of insufficient precision in the process of splitting the circuit board by a cutter is solved.

Description

Technical Field

[0001] This invention relates to the field of automation technology, and in particular to a PCB depaneling machine. Background Technology

[0002] Printed circuit boards (PCBs), also known as circuit boards, provide electrical connections for electronic components. In the manufacturing process, PCBs offer cheaper and faster mass production compared to other wiring methods because components are installed and wired in a single operation. A large number of PCBs can be manufactured simultaneously, with layout performed only once.

[0003] In the mass production of circuit boards, multiple smaller circuit boards need to be printed on a single large circuit board. The large circuit board is then divided into these smaller circuit boards for batch processing. In existing technologies, to avoid damaging the circuit structure, the process of dividing the circuit boards requires high precision. It is impossible to use cutting tools for this process; instead, boards must be manually broken apart, resulting in low efficiency in batch processing.

[0004] Therefore, the aforementioned problems in the existing technology still need to be solved. Summary of the Invention

[0005] The main objective of this invention is to propose a board splitting machine that aims to solve the problem of low efficiency in manual board splitting during the circuit board splitting process.

[0006] To achieve the above objectives, the present invention proposes a board splitting machine for splitting a circuit board into multiple sub-circuit boards, including a limiting mechanism and a punching mechanism. The limiting mechanism is used to limit the circuit board to be split. The punching mechanism is located on one side of the board surface of the board to be split, which is limited by the limiting mechanism, and is used to punch the board to be split, which is limited by the limiting mechanism, to punch and break the circuit board into multiple sub-circuit boards.

[0007] Preferably, the board splitting device includes a first board splitting device, which includes a first limiting mechanism and a first punching and breaking mechanism, wherein the first limiting mechanism is used to limit the first end of the board to be split; the first punching and breaking mechanism is used to punch the second end of the board to be split, so that the sub-board located at the second end is broken off from the board to be split.

[0008] Preferably, the first limiting mechanism includes a pressure plate cylinder, and a first pressing block is provided on the output shaft of the pressure plate cylinder. The first pressing block is used to press and limit the first end of the circuit board to be divided under the drive of the pressure plate cylinder.

[0009] Preferably, the first punching and splitting mechanism includes a first punching and splitting cylinder, and a second pressing block is provided on the output shaft of the first punching and splitting cylinder. The second pressing block is used to punch the second end of the circuit board to be split under the drive of the first punching and splitting cylinder.

[0010] Preferably, a rolling element is provided on one side of the second pressing block facing the circuit board to be divided, and the rolling element is used to roll the circuit board to be divided during the pressing process of the second pressing block.

[0011] Preferably, the circuit board to be divided has multiple rows of small circuit boards to be divided integrally arranged in the length direction and multiple columns in the width direction, and there are seams at the adjacent points of the multiple small circuit boards in the width and length directions; the sub-circuit board broken off by the first punching and breaking mechanism each time includes a row of small circuit boards; the first board separating device also includes a first punching and breaking blade, wherein the first punching and breaking blade is located below the first punching and breaking mechanism; during the process of the first punching and breaking mechanism punching the sub-circuit board, the first punching and breaking blade abuts against the seam of a row of small circuit boards.

[0012] Preferably, the blade of the first punching cutter has an acute angle with the plane on which the circuit board to be divided is located.

[0013] Preferably, the circuit board to be divided has multiple rows of segmented small circuit boards integrated in the length direction and multiple columns in the width direction, and there are seams between the multiple small circuit boards at the adjacent points in the width and length directions; the sub-circuit board broken off by the first punching and bending mechanism each time includes a row of small circuit boards; the board separating device also includes a second board separating device, which includes a second limiting mechanism and a second punching and bending mechanism, wherein the second limiting mechanism is used to limit the sub-circuit board; the second punching and bending mechanism is used to punch the seam between the row of small circuit boards in the sub-circuit board.

[0014] Preferably, the second limiting mechanism includes a limiting groove, the second punching mechanism includes a second punching cylinder, and the output shaft of the second punching cylinder is provided with a second punching blade, wherein: the limiting groove is disposed below the first punching mechanism and is used to receive the sub-circuit board that falls after being punched by the first punching mechanism, so that the sub-circuit board is limited in the limiting groove; the first wall of the limiting groove has an opening, and the sub-circuit board is at least partially exposed from the opening; the blade of the second punching blade is located in the opening and is used to break the seam under the drive of the second punching cylinder.

[0015] Preferably, the second wall of the limiting groove has a clearance position, the second wall is opposite to the first wall, and a baffle for limiting the sub-circuit board is provided between the first wall and the second wall; a material box is provided below the limiting groove; during the process of the second punching and breaking cutter breaking the seam, the second punching and breaking cutter enters through the opening and exits through the clearance position; the side of the small circuit board away from the seam is limited by the baffle during the punching and breaking process, and the side of the small circuit board close to the seam moves towards the clearance position during the punching and breaking process; after the second punching and breaking cutter completes the punching and breaking, the small circuit board falls into the material box through the clearance position.

[0016] Preferably, a guide plate is provided below the first punching and breaking mechanism, and a guide groove is provided between the limiting groove and the first punching and breaking mechanism; when the first punching and breaking mechanism breaks the sub-circuit board from the circuit board to be divided, the sub-circuit board falls into the guide groove under the guidance of the guide plate, and falls into the limiting groove under the guidance of the guide groove and is limited by the limiting groove.

[0017] Preferably, the depaneling machine further includes a feeding device and a working platform; the first depaneling device is disposed on the working platform, and the working platform is provided with a feeding guide rail for transporting the circuit board to be depaneled to the first depaneling device; the feeding device is disposed above the working platform, and the feeding device is used to store the circuit board to be depaneled and place the circuit board to be depaneled on the feeding guide rail.

[0018] Preferably, a driving device is provided below the working platform. The driving device includes a motion guide rail and a driving plate that moves along the motion guide rail. The feeding guide rail is provided with a strip-shaped through hole along the transport direction of the circuit board to be divided. The upper end of the driving plate extends into the feeding guide rail through the strip-shaped through hole. When the driving plate moves along the motion guide rail, it drives the circuit board to be divided located on the feeding guide rail to move toward the first dividing device.

[0019] Preferably, the feeding device includes a storage bin, the cross-section of which is adapted to the circuit board to be divided, and the storage bin is used to vertically stack multiple circuit boards to be divided; the bottom of the storage bin is provided with a first switch and a second switch, wherein the first switch is located above the second switch; when the second switch is opened, the last circuit board to be divided at the bottom of the storage bin falls onto the feeding guide rail, and the first switch remains closed when the second switch is open to limit the other circuit boards to be divided above from falling; when the second switch is closed, the first switch is opened to allow the circuit boards to be divided above the storage bin to fall downwards as a whole.

[0020] Preferably, the first switch is disposed on the side wall of the storage hopper; wherein, the first switch includes a first switch cylinder and a pressure head disposed on the output shaft of the first switch cylinder, the side wall of the storage hopper has a through hole, and the pressure head extends into the storage hopper through the through hole; when the first switch is closed, the pressure head, driven by the first switch cylinder, squeezes the circuit board to be divided to restrict the falling of the circuit board to be divided.

[0021] Preferably, the second switch is disposed at the bottom of the storage bin; wherein the second switch includes a second switch cylinder and a limiting plate connected to the second switch cylinder; when the second switch is closed, the second switch cylinder drives the end of the limiting plate to extend into the bottom opening of the storage bin to restrict the circuit board to be divided from falling from the bottom opening.

[0022] The board splitting machine provided by this invention is used to split a circuit board into multiple sub-circuit boards. It includes a splitting device comprising a limiting mechanism and a punching mechanism. The limiting mechanism is used to limit the circuit board to be split; the punching mechanism is located on one side of the circuit board limited by the limiting mechanism to punch and break the circuit board into multiple sub-circuit boards. Thus, through the cooperation of the limiting mechanism and the punching mechanism, the effect of manually breaking the circuit board is simulated, solving the problem of insufficient precision in the process of cutting circuit boards with a tool. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the circuit board to be divided by the depaneling machine provided by the present invention;

[0025] Figure 2 This is a schematic diagram of the depaneling machine provided by the present invention;

[0026] Figure 3 for Figure 2 A schematic diagram of part A in the middle;

[0027] Figure 4 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided by the present invention;

[0028] Figure 5 for Figure 4 A schematic diagram of Part B;

[0029] Figure 6 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided by the present invention;

[0030] Figure 7 for Figure 6 A schematic diagram of section C;

[0031] Figure 8 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided by the present invention;

[0032] Figure 9 for Figure 8 A schematic diagram of section D;

[0033] Figure 10 A bottom view of at least a portion of the mechanism of the depaneling machine provided by the present invention;

[0034] Figure 11 for Figure 10 A bottom view of section E in the middle;

[0035] Figure 12 This is a partial schematic diagram of at least some components of the depaneling machine provided by the present invention;

[0036] Figure 13 This is a partial schematic diagram of at least some of the mechanisms of the depaneling machine provided by the present invention;

[0037] Figure 14 This is a schematic diagram of the depaneling machine provided by the present invention;

[0038] Figure 15 for Figure 14 A schematic diagram of section G in the middle;

[0039] Figure 16 This is a schematic diagram of the PCB separator provided by the present invention after removing the feeding device;

[0040] Figure 17 This is another schematic diagram of the PCB separator provided by the present invention after removing the feeding device;

[0041] Figure 18 for Figure 17 A schematic diagram of section F in the middle;

[0042] Figure 19 This is a schematic diagram illustrating the state changes of the circuit board to be divided during the first punching and bending process of the PCB splitter provided by the present invention.

[0043] Figure 20 This is a schematic diagram illustrating the state changes of the circuit board to be divided during the second punching and bending process of the PCB splitter provided by the present invention.

[0044] Figure 21 This is a schematic diagram of the feeding device in the PCB separator provided by the present invention;

[0045] Figure 22 This is a cross-sectional view of the bottom of the feeding device of the PCB separator provided by the present invention;

[0046] Figure 23 This is a partial bottom view of the feeding device for the PCB depaneling machine provided by the present invention.

[0047] Explanation of icon numbers:

[0048]

[0049]

[0050] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0053] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0054] Printed circuit boards (PCBs), also known as circuit boards, provide electrical connections for electronic components. In the manufacturing process, PCBs offer cheaper and faster mass production compared to other wiring methods because components are installed and wired in a single operation. A large number of PCBs can be manufactured simultaneously, with layout performed only once.

[0055] Please see Figure 1 , Figure 1 This is a schematic diagram of the circuit board to be divided by the depaneling machine provided in the embodiments of this application. In the process of mass production of circuit boards, such as... Figure 1 As shown, multiple small circuit boards 111 need to be printed on a complete circuit board 100 to be divided, and then the circuit board 100 to be divided is divided into multiple small circuit boards 111 to achieve batch processing. Currently, in order to avoid damaging the circuit structure on the circuit board, the operation of dividing the circuit board requires high processing precision. It is impossible to divide the board by cutting with a tool, and it can only be done by manually breaking the board, resulting in low efficiency of batch processing of circuit boards.

[0056] Therefore, in order to solve this problem, this application provides a board splitting machine, which aims to solve the problem of low efficiency of manual board splitting during the circuit board splitting process.

[0057] The specific implementation methods of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0058] like Figure 1 As shown in the embodiment of this application, the board splitting machine is used to split a circuit board 100 to be split into multiple sub-circuit boards 110. It includes a board splitting device, which includes a limiting mechanism and a punching mechanism. The limiting mechanism is used to limit the circuit board 100 to be split. The punching mechanism is located on one side of the board surface of the circuit board limited by the limiting mechanism, and is used to punch the circuit board 100 to be split by the limiting mechanism to punch and break the circuit board 100 to be split into multiple sub-circuit boards 110.

[0059] In this embodiment, a limiting mechanism is used to limit at least a portion of the circuit board 100 to be divided, and a punching and breaking mechanism is disposed on one side of the surface of the circuit board to be divided, so that the punching and breaking mechanism can punch and break the circuit board 100 to be divided, which is limited by the limiting mechanism, thereby punching and breaking the circuit board 100 to be divided into multiple sub-circuit boards 110. In this way, by cooperating with the limiting mechanism and the punching and breaking mechanism, the effect of manually breaking the circuit board 100 to be divided is simulated, solving the problem of insufficient precision in the process of cutting the circuit board with a tool.

[0060] It should be noted that the limiting mechanism and the punching mechanism can be implemented in various ways. This application does not limit the implementation method. For ease of understanding, a specific implementation method is provided below.

[0061] Please see Figures 1 to 3 ,in, Figure 2 This is a schematic diagram of the board splitter provided in an embodiment of this application. Figure 3 for Figure 2 A schematic diagram of part A. (See diagram below.) Figures 1 to 3 As shown, the board splitting device includes a first board splitting device 10, which includes a first limiting mechanism 200 and a first punching and breaking mechanism 300. The first limiting mechanism 200 is used to limit the first end of the board to be split 100; the first punching and breaking mechanism 300 is used to punch the second end of the board to be split 100 so that the sub-board 110 located at the second end is broken off from the board to be split 100.

[0062] In this embodiment, the limiting mechanism and the punching and breaking mechanism can cooperate in various ways. In one implementation, the first limiting mechanism 200 limits the first end of the circuit board 100 to be divided. At this time, the second end, which is not yet limited by the first limiting mechanism 200, is a free end. Therefore, when the first punching and breaking mechanism 300 punches the second end of the circuit board 100 to be divided, the sub-circuit board 110 located at the second end is broken off from the circuit board 100 to be divided. Thus, through the cooperation between the first limiting mechanism 200 and the first punching and breaking mechanism 300, the punching and breaking of the circuit board 100 to be divided is achieved.

[0063] It should be noted that, based on the above working principle, the first limiting mechanism 200 and the first punching mechanism 300 can be implemented in various ways, and the embodiments of this application do not limit them. For ease of understanding, a preferred specific implementation is provided as follows.

[0064] Please see Figure 4 and Figure 5 ,in, Figure 4 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided in the embodiments of this application; Figure 5 for Figure 4 A schematic diagram of part B. (See diagram below.) Figure 4 and Figure 5 As shown, the first limiting mechanism 200 includes a pressure plate cylinder 210. A first pressing block 220 is provided on the output shaft of the pressure plate cylinder 210. The first pressing block 220 is used to press and limit the first end of the circuit board 100 to be divided under the drive of the pressure plate cylinder 210.

[0065] In this embodiment, optionally, as follows: Figure 5As shown, a support portion 230 is provided on the side of the depaneling machine opposite to the first pressure block 220. The output shaft of the pressure plate cylinder 210 extends and retracts under the drive of the pressure plate cylinder 210. When the output shaft extends, it drives the first pressure block 220 to press the first end of the circuit board 100 to be depaneled against the support portion 230, thereby fixing the first end of the circuit board 100 to be depaneled. When the output shaft retracts, it drives the first pressure block 220 to move away from the circuit board 100 to be depaneled.

[0066] Optionally, the surface of the first pressing block 220 facing the circuit board 100 to be divided may be provided with a soft padding material, such as a rubber pad, or the first pressing block 220 itself may be made of a soft material. Optionally, the first pressing block 220 may also be integrated with the output shaft, or the end of the output shaft of the pressure cylinder 210 itself constitutes the first pressing block 220. This application does not limit the scope of the embodiments.

[0067] Please see Figure 6 and Figure 7 ,in, Figure 6 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided in the embodiments of this application; Figure 7 for Figure 6 A schematic diagram of section C. (See diagram below.) Figure 6 and Figure 7 As shown, the first punching and breaking mechanism 300 includes a first punching and breaking cylinder 310. A second pressing block 320 is provided on the output shaft of the first punching and breaking cylinder 310. The second pressing block 320 is used to punch the second end of the circuit board 100 to be divided under the drive of the first punching and breaking cylinder 310.

[0068] In this embodiment, optionally, the output shaft of the first punching cylinder 310 performs a telescopic movement under the drive of the first punching cylinder 310. When the output shaft extends, it drives the second pressing block 320 to punch the second end of the circuit board 100 to be divided, thereby realizing the punching and bending of the circuit board 100 to be divided, so that the second end of the circuit board 100 to be divided is bent relative to the first end, and the sub-circuit board 110 located at the second end is broken off from the circuit board 100 to be divided.

[0069] Optionally, since the second pressing block 320 will rub against the circuit board 100 to be divided during the process of punching and bending the circuit board 100, in order to prevent the second pressing block 320 from scratching the circuit board, a soft pad or rolling structure can be provided on the second pressing block 320. For ease of understanding, the embodiments of this application further provide the following preferred solutions.

[0070] Please see Figure 7 ,like Figure 7As shown, a rolling element 330 is provided on the side of the second pressing block 320 facing the circuit board 100 to be divided. The rolling element 330 is used to roll relative to the circuit board 100 to be divided during the stamping process of the second pressing block 320.

[0071] In this embodiment, since the second pressing block 320 is provided with a rolling element 330, the rolling element 330 can roll during the process of the second pressing block 320 pressing the circuit board 100 to be divided, thereby protecting the circuit board from scratches by the second pressing block 320 during the punching process. It should be noted that the specific implementation of the rolling element 330 is not limited in this embodiment. Preferably, as... Figure 7 As shown, the rolling element 330 includes a roller 331, a rotating shaft 332, and a mounting position 333. The roller 331 is disposed on the mounting position 333 and is rotatably connected to the second pressure block 320 via the rotating shaft 332. Thus, when the second pressure block 320 presses the circuit board, the roller 331 contacts the circuit board 100 to be divided. During the pressing process, the roller 331 rotates relative to the second pressure block 320 via the rotating shaft 332. This lubricates the friction between the second pressure block 320 and the circuit board 100 to be divided during the pressing process, thereby protecting the circuit board from scratches.

[0072] It should be noted that, optionally, a sub-circuit board 110 may include only one small circuit board 111, or it may include multiple small circuit boards 111. When the sub-circuit board 110 includes only one small circuit board 111, the above structure can meet the requirements of the board separation operation. Further, as... Figure 1 As shown, if the sub-circuit board 110 includes multiple small circuit boards 111, then other mechanisms need to be further set to separate the multiple small circuit boards 111 on the sub-circuit board 110.

[0073] Optionally, the circuit board 100 to be divided may have multiple rows of smaller circuit boards 111 integrally arranged in the length direction and multiple columns in the width direction, with seams between the smaller circuit boards 111 at their adjacent locations in the width and length directions. For example... Figure 1 As shown, the circuit board 100 to be divided has two rows of circuit boards integrally arranged in the length direction and eight columns of circuit boards to be divided in the width direction. Figure 7As shown, the first limiting mechanism 200 limits the first end of the circuit board 100 to be divided during the stamping process, and the first punching and breaking mechanism 300 punches and breaks off the sub-circuit board 110. It can be seen that each time the first punching and breaking mechanism 300 breaks off the sub-circuit board 110, it includes a row of small circuit boards 111. To further divide the sub-circuit board 110 into multiple small circuit boards 111, various methods can be adopted, including but not limited to: Method 1: Dividing the sub-circuit board 110 into multiple small circuit boards 111 simultaneously with breaking it off using the first board-separating device 10. Method 2: Additionally setting a second board-separating device 20 to further divide the sub-circuit board 110 into small circuit boards 111. For ease of understanding, detailed explanations are provided below.

[0074] Method 1: The first board splitting device 10 splits the sub-circuit board 110 into multiple small circuit boards 111 while simultaneously breaking off the sub-circuit board 110.

[0075] Please see Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of at least a portion of the structure of the depaneling machine provided in the embodiments of this application; Figure 9 for Figure 8 A schematic diagram of section D. (See diagram below.) Figure 8 and Figure 9 As shown, the first board splitting device 10 also includes a first punching and bending blade 400, wherein the first punching and bending blade 400 is located below the first punching and bending mechanism 300; during the process of the first punching and bending mechanism 300 punching the sub-circuit board 110, the first punching and bending blade 400 abuts against the seam of a row of small circuit boards 111.

[0076] In this embodiment, the position of the first punching and bending blade 400 corresponds to the seam between the small circuit boards 111 in the sub-circuit board 110. When the first punching and bending mechanism 300 punches the sub-circuit board 110, the sub-circuit board 110 bends downward in relation to the circuit board 100 to be divided. At this time, the first punching and bending blade 400 corresponding to the seam abuts against the seam between the small circuit boards 111. As the first punching and bending mechanism 300 further punches the sub-circuit board 110, the first punching and bending blade 400 abutting against the seam will break the seam, thereby dividing the sub-circuit board 110 into multiple small circuit boards 111.

[0077] Optionally, such as Figure 1 As shown, two adjacent sub-circuit boards 110 are arranged side by side on the sub-circuit board 110, such as... Figure 9As shown, the second pressing block 320 of the first punching and breaking mechanism 300 is equipped with two rollers 331. One roller 331 is used to punch a small circuit board 111, thereby punching the sub-circuit board 110 off the circuit board 100 to be divided. During this process, the first punching and breaking blade 400 abuts against the seam between the two small circuit boards 111. As the two rollers 331 press the two small circuit boards 111 downward, they drive the two small circuit boards 111 to be broken along the seam. It can be seen that by setting the first punching and breaking blade 400, the circuit board is essentially divided by breaking, avoiding the problem of insufficient precision caused by cutting the circuit board with a blade.

[0078] Optionally, to ensure that the sub-circuit board 110 is broken only along the seam during the above-mentioned punching and bending process, without damaging other parts, the blade of the first punching and bending blade 400 forms an acute angle with the plane containing the circuit board 100 to be divided. This angle forms the travel stroke of the first punching and bending mechanism 300 during the punching and bending of the circuit board 100 to be divided, ensuring that after the first punching and bending mechanism 300 first punches and bends the sub-circuit board 110 off the circuit board 100 to be divided, the blade of the first punching and bending blade 400 then abuts against the seam on the sub-circuit board 110. This prevents the sub-circuit board 110 from breaking due to multiple forces during the punching process.

[0079] In this embodiment, by providing a first punching and bending blade 400 on the first board splitting device 10, the sub-circuit board 110 is pried off from the circuit board 100 to be split, and the first punching and bending blade 400 further divides the sub-circuit board 110 into multiple small circuit boards 111. Thus, the first board splitting device 10 only needs to perform one punching and bending operation to achieve splitting in both length and width directions, directly dividing the circuit board 100 to be split into multiple small circuit boards 111.

[0080] Method 2: An additional second board-splitting device 20 is set up to further divide the sub-circuit board 110 into small circuit boards 111.

[0081] Please see Figure 10 and Figure 11 ,in, Figure 10 This is a bottom view of at least a portion of the mechanisms of the depaneling machine provided in the embodiments of this application. Figure 11 for Figure 10 A bottom view of section E in the middle. (See image below.) Figure 10 Hetong Figure 11 As shown, the second board splitting device 20 includes a second limiting mechanism 500 and a second punching mechanism 600, wherein the second limiting mechanism 500 is used to limit the sub-circuit board 110; the second punching mechanism 600 is used to punch the seam between a row of small circuit boards 111 in the sub-circuit board 110.

[0082] In this embodiment, by setting an additional second board-splitting device 20, a second board-splitting is performed after the first board-splitting device 10 completes the first board-splitting, thereby dividing the circuit board 100 to be divided into multiple small circuit boards 111. The second limiting mechanism 500 is used to limit the sub-circuit boards 110 obtained by the punching and bending of the first board-splitting mechanism. Based on this, the second punching and bending mechanism 600 punches the seams in the limited sub-circuit boards 110, thereby further dividing the sub-circuit boards 110 into multiple small circuit boards 111.

[0083] For ease of understanding, the following embodiments of this application are described using the above-described method two as an example. However, this does not constitute a limitation on the technical solution of this application.

[0084] It should be noted that there are multiple ways to implement the second dividing plate device 20, and this application embodiment does not limit this. For ease of understanding, this application embodiment provides a preferred implementation as follows.

[0085] Please see Figure 8 , Figure 10 and Figure 11 The second limiting mechanism 500 includes a limiting groove 510, and the second punching mechanism 600 includes a second punching cylinder 610. The output shaft of the second punching cylinder 610 is provided with a second punching blade 620. The limiting groove 510 is located below the first punching mechanism 300 and is used to receive the sub-circuit board 110 that has fallen off after being punched by the first punching mechanism 300, so that the sub-circuit board 110 is limited in the limiting groove 510. The first wall of the limiting groove 510 has an opening 511, and the sub-circuit board 110 is at least partially exposed from the opening 511. The blade of the second punching blade 620 is located in the opening 511 and is used to break the seam under the drive of the second punching cylinder 610.

[0086] In this embodiment, optionally, the limiting groove 510 can be cylindrical. After the first punching and breaking mechanism 300 punches the sub-circuit board 110 off the circuit board 100 to be divided, the sub-circuit board 110 falls into the cylindrical limiting groove 510. The shape of the cylindrical limiting groove 510 is adapted to the shape of the sub-circuit board 110, so that the sub-circuit board 110 is confined within the limiting groove 510. The limiting groove 510 has a first wall with an opening 511. During the punching and breaking process, the second punching and breaking blade 620 extends from the opening 511, thereby breaking the seam between the sub-circuit boards 110. During this operation, since the sub-circuit board 110 is accurately limited by the limiting groove 510, the punching and breaking accuracy of the second punching and breaking blade 620 is ensured.

[0087] Optionally, the limiting groove 510 can limit the sub-circuit board 110 in various ways, including but not limited to the following.

[0088] Method 1, please refer to Figure 10 and Figure 11 ,like Figure 10 and Figure 11 As shown, the sub-circuit board 110 includes two small circuit boards 111 arranged side by side. When the sub-circuit board 110 falls into the limiting groove 510, the two sides of the sub-circuit board 110 are limited by the limiting groove 510. The opening 511 is located at the joint between the two small circuit boards 111, so that the joint is exposed from the opening 511.

[0089] In this embodiment, the seam between the two small circuit boards 111 is exposed through the opening 511. When the second punching and breaking knife 620 extends into the opening 511, it breaks the seam between the two small circuit boards 111, thereby completing the division of the small circuit boards 111.

[0090] Method 2: The sub-circuit board 110 includes three small circuit boards 111 arranged side by side. The small circuit boards 111 on the sub-circuit board 110 are connected by seams. When the sub-circuit board 110 is inserted into the limiting groove 510, one of the small circuit boards 111 in the middle of the sub-circuit board 110 is limited by the limiting groove 510, and the opening 511 is located at the position of the two small circuit boards 111 on both sides. At this time, there are two second punching blades 620, which punch through the two seams respectively.

[0091] In this embodiment, since a sub-circuit board 110 contains three small circuit boards 111, the limiting groove 510 limits one small circuit board 111 in the middle, and the two small circuit boards 111 on both sides are exposed from the openings 511 on the left and right sides. The two second punching and breaking blades 620 work in parallel to break the joint between the two, thereby dividing the circuit board 100 to be divided in the case where a sub-circuit board 110 has three small circuit boards 111.

[0092] It should be noted that, based on the above principle, the cooperation between the opening 511 of the limiting groove 510 and the second punching blade 620 can also be achieved in other ways. This application embodiment does not limit this. For ease of understanding, the following description will take the above method one as an example.

[0093] Optionally, since the limiting groove 510 is designed to limit the sub-circuit board 110, its thickness is often set to be relatively thin. When the second punching and bending blade 620 enters the limiting groove 510 from the opening 511, its travel is relatively limited. Therefore, to solve this problem, this application embodiment further provides the following solution: by providing a clearance 512 on the other side of the limiting groove 510, the punching and bending travel of the second punching and bending blade 620 is increased. For ease of understanding, this solution will be described in detail below with reference to the accompanying drawings.

[0094] Please see Figure 11 and 12 , Figure 12This is a partial schematic diagram of at least some components of the depaneling machine provided in the embodiments of this application, such as... Figure 11 and Figure 12 As shown, the second wall of the limiting groove 510 has a clearance position 512, and the second wall is opposite to the first wall, as shown. Figure 11 As shown, a retaining edge 513 for limiting the sub-circuit board 110 is provided between the first wall and the second wall; as Figure 8 As shown, a material box 700 is provided below the limiting groove 510; during the process of the second punching and breaking blade 620 breaking the seam, the second punching and breaking blade 620 enters from the opening 511 and exits from the clearance position 512; the side of the small circuit board 111 away from the seam is limited by the retaining edge 513 during the punching and breaking process, and the side of the small circuit board 111 close to the seam moves towards the clearance position 512 during the punching and breaking process; after the second punching and breaking blade 620 completes the punching and breaking, the small circuit board 111 falls into the material box 700 through the clearance position 512.

[0095] In this embodiment, as Figure 11 and Figure 12 As shown, a sub-circuit board 110 includes two small circuit boards 111 arranged side by side. When the sub-circuit board 110 falls into the limiting groove 510, the two sides of the sub-circuit board 110 (i.e., the side of the small circuit board 111 away from the seam) are connected by the retaining edge 513 of the limiting groove 510, thereby limiting the sub-circuit board 110 in the limiting groove 510. At this time, the second punching and bending blade 620 enters the limiting groove 510 from the opening 511 and then exits from the clearance position 512. As a result, during the process of the second punching and bending blade 620 breaking the seam, the side of the small circuit board 111 near the seam moves towards the clearance position 512 (i.e., the outside of the limiting groove 510) as the second punching and bending blade 620 punches and bends. In this way, the stroke of the second punching and bending blade 620 is increased, so that the second punching and bending blade 620 can fully break the seam. Furthermore, a material box 700 is provided below the limiting groove 510. When the seam on the sub-circuit board 110 is broken, the retaining edge 513 of the limiting groove 510 can no longer limit the two broken small circuit boards 111. At this time, the two small circuit boards 111 fall into the material box 700 below under the action of gravity, thereby realizing the collection of the processed finished products.

[0096] Optionally, such as Figure 6 As shown, an inclined guide groove 710 can be provided between the material box 700 and the limiting groove 510. The small circuit board 111 falling from the limiting groove 510 first falls into the guide groove 710, and then falls into the material box 700 under the guidance of the guide groove 710. On the one hand, it prevents the small circuit board 111 from splashing out of the material box 700 during the falling process, and on the other hand, it cushions the small circuit board 111 to prevent it from falling directly and breaking.

[0097] It should be noted that the limiting groove 510, in order to limit the sub-circuit board 110, must have a shape that matches the sub-circuit board 110 to ensure accurate engagement and limiting. However, the sub-circuit board 110 is relatively thin, which results in a correspondingly thinner limiting groove 510. This makes it difficult for the sub-circuit board 110, which is broken off by the first punching mechanism 300, to fall accurately into the limiting groove 510. Therefore, to solve this problem, this embodiment of the application provides a guiding device between the first punching mechanism 300 and the limiting groove 510, guiding the sub-circuit board 110 into the limiting groove 510. For ease of understanding, this solution will be described in detail below with reference to the accompanying drawings.

[0098] Please see Figure 13 , Figure 13 This is a partial schematic diagram of at least some mechanisms of the depaneling machine provided in the embodiments of this application, as shown below. Figure 13 As shown, a guide plate 340 is provided below the first punching mechanism 300, and a guide groove 520 is provided between the limiting groove 510 and the first punching mechanism 300; optionally, the guide groove 520 can be configured as a funnel shape, or it can be configured as... Figure 13 The inclined plate shape is shown. After the first punching mechanism 300 breaks the sub-circuit board 110 from the circuit board 100 to be divided, the sub-circuit board 110 falls into the guide groove 520 under the guidance of the guide plate 340, and falls into the limiting groove 510 under the guidance of the guide groove 520 and is limited by the limiting groove 510.

[0099] In this embodiment, the guide plate 340 is positioned at the same location as the aforementioned first punching and bending blade 400. The difference lies in that the guide plate 340 has a larger included angle and does not have a blade. Thus, when the first punching and bending mechanism 300 punches and bends the sub-circuit board 110 off the circuit board 100 to be divided, the falling sub-circuit board 110 will contact the guide plate 340 and fall into the funnel-shaped guide groove 520 under the guidance of the guide plate 340. The guide groove 520 guides the sub-circuit board 110 to slide into the limiting groove 510, thereby being limited by the limiting groove 510. Therefore, through the cooperation of the guide plate 340 and the guide groove 520, the falling sub-circuit board 110 is guided, allowing it to accurately fall into the limiting groove 510, overcoming the problem of the narrow opening of the limiting groove 510.

[0100] The depaneling process and mechanism of the depaneling machine provided in this application embodiment have been described in detail above. In specific operation, the depaneling machine provided in this application embodiment also has a feeding mechanism for storing the circuit board 100 to be depaneled and placing the circuit board 100 to be depaneled onto the depaneling device. For ease of understanding, the following detailed description is provided in conjunction with the accompanying drawings.

[0101] Please see Figure 5 , Figure 14 and Figure 15 , Figure 14 This is a schematic diagram of the board splitter provided in an embodiment of this application. Figure 15 for Figure 14 A schematic diagram of section G, as shown below. Figure 5 , Figure 14 and Figure 15 As shown, the PCB separator also includes a feeding device 800 and a working platform 900; the first PCB separator 10 is mounted on the working platform 900. Figure 5 This is a schematic diagram after removing the feeding device 800, as shown below. Figure 5 As shown, the work platform 900 is provided with a loading guide rail 910 for transporting the circuit board 100 to be divided to the first separating device 10; as Figure 14 and Figure 15 As shown, the feeding device 800 is located above the work platform 900. The feeding device 800 is used to store the circuit board 100 to be divided and place the circuit board 100 to be divided on the feeding guide rail 910.

[0102] In this embodiment, the loading device 800 is disposed on the working platform 900, and the working platform 900 is provided with a loading guide rail 910. The loading device 800 is used to store the circuit board 100 to be divided and to place the circuit board 100 to be divided on the loading guide rail 910, so that the circuit board 100 to be divided moves in the loading guide rail 910 to the position of the first board separating device 10. Optionally, as Figure 5 As shown, a mounting bracket 920 is provided on the working platform 900, and a pressure plate cylinder 210 is provided on the mounting bracket 920. The output shaft of the pressure plate cylinder 210 faces the working platform 900 and is perpendicular to the plane where the working platform 900 is located. A first pressure block 220 is provided on the output shaft of the pressure plate cylinder 210. The bottom wall of the corresponding part of the feeding guide rail 910 and the first pressure block 220 forms a support part 230. Under the drive of the output shaft of the pressure plate cylinder 210, the first pressure block 220 presses the first end of the circuit board 100 to be divided against the bottom wall of the feeding guide rail 910, thereby forming a limit on the first end of the circuit board 100 to be divided.

[0103] Optionally, the first punching cylinder 310 is also mounted on the mounting bracket 920, and the pressure plate cylinder 210 and the first punching cylinder 310 are respectively mounted at both ends of the mounting bracket 920. In this way, the first pressure block 220 connected to the pressure plate cylinder 210 can press the first end of the circuit board 100 to be divided, and the second pressure block 320 connected to the first punching cylinder 310 can punch and break the second end of the circuit board 100 to be divided.

[0104] Optionally, in the above scheme, when the feeding device 800 places the circuit board 100 to be divided onto the feeding guide rail 910, the feeding guide rail 910 can transport the circuit board 100 to the location of the first separating device 10 in various ways. For example, the feeding guide rail 910 can be provided with a conveyor belt for transporting the circuit board 100 to be divided, or the feeding guide rail 910 can be provided with a pushing mechanism for pushing the circuit board 100 to be divided. This application embodiment does not limit the specific implementation of this method. For ease of understanding, a specific implementation of the feeding guide rail 910 is provided below.

[0105] Please see Figures 16 to 18 ,in, Figure 16 This is a schematic diagram of the depaneling machine provided in the embodiments of this application after removing the feeding device. Figure 17 Another schematic diagram of the depaneling machine provided in the embodiment of this application after removing the feeding device; Figure 18 for Figure 17 A schematic diagram of section F. (See diagram below.) Figures 16-17 As shown, a drive device 930 is provided below the work platform 900. The drive device 930 includes a motion guide rail 931 and a drive plate 932 that moves along the motion guide rail 931. The loading guide rail 910 is provided with a strip-shaped through hole 911 along the transport direction of the circuit board 100 to be divided. Optionally, the strip-shaped through hole 911 can be opened on the bottom wall of the loading guide rail 910 or on the side wall of the loading guide rail 910. The upper end of the drive plate 932 extends into the loading guide rail 910 through the strip-shaped through hole 911. When the drive plate 932 moves along the motion guide rail 931, it drives the circuit board 100 to be divided located on the loading guide rail 910 to move toward the first dividing device 10.

[0106] In this embodiment, optionally, a drive motor (not shown in the figure) is provided inside the motion guide rail 931, and the drive motor is used to drive the drive plate 932 to move along the motion guide rail 931. Further, as... Figure 4 , Figure 5 , Figures 16 to 18As shown, the drive plate 932 includes a connecting part 932A, a reinforcing plate 932B, a transmission plate 932C, and a drive hook 932D. The connecting part 932A is connected to the motion guide rail 931 and can slide along the motion guide rail 931 under the drive of the drive motor. The reinforcing plate 932B is triangular and parallel to the length direction of the motion guide rail 931. The transmission plate 932C is connected to the reinforcing plate 932B and perpendicular to the reinforcing plate 932B. The drive hook 932D is located at the upper end of the transmission plate 932C and extends into the strip-shaped through hole 911 located on the bottom wall of the feeding guide rail 910. In actual operation, the drive motor drives the connecting part 932A to move along the motion guide rail 931. The connecting part 932A drives the reinforcing plate 932B to move. Since the reinforcing plate 932B is set as a triangle and parallel to the length direction of the motion guide rail 931, it plays a stabilizing role during the movement of the connecting part 932A. The transmission plate 932C is connected to the reinforcing plate 932B, and the drive hook 932D is connected to the transmission plate 932C, so that it moves in the strip-shaped through hole 911 on the bottom wall of the feeding guide rail 910.

[0107] As a result, the drive board 932 pushes the circuit board 100 to be divided, located within the loading guide rail 910, toward the position of the first separating device 10. It should be noted that, as... Figure 1 As shown, a partitioned circuit board includes multiple sub-circuit boards 110 along the pushing direction of the drive board 932. After the drive board 932 pushes the circuit board 100 to be partitioned to the position of the first partitioning device 10, it advances one sub-circuit board 110 at a time. For example, the circuit board 100 to be partitioned initially includes 8 rows of sub-circuit boards 110. The specific working process is as follows:

[0108] For the first time you break it open, please refer to Figure 19 , Figure 19 This is a schematic diagram illustrating the state changes of the circuit board to be divided during the first punching and bending process of the depaneling machine provided in this application embodiment. Figure 19 As shown, the first limiting mechanism 200 presses against the second-to-last sub-circuit board 110 (shaded area) located at the first end, or the first limiting mechanism 200 presses against all sub-circuit boards 110 located at the first end. At this time, the first punching mechanism 300 breaks off the last sub-circuit board 110 located at the second end. Afterwards, as... Figure 18 As shown, the drive board 932 pushes the circuit board 100 to be divided forward by the distance of a sub-circuit board 110, in preparation for the second punching.

[0109] For the second punching and breaking, please refer to Figure 20 , Figure 20 This is a schematic diagram illustrating the state changes of the circuit board to be divided during the second punching and bending process of the depaneling machine provided in this application embodiment. Figure 20As shown, the first limiting mechanism 200 presses against the third-to-last sub-circuit board 110 (shaded area) located at the first end, or the first limiting mechanism 200 presses against all remaining sub-circuit boards 110 located at the first end. At this time, the first punching mechanism 300 breaks off the last sub-circuit board 110 located at the second end. Afterwards, as... Figure 18 As shown, the drive board 932 pushes the circuit board 100 to be divided forward by the distance of a sub-circuit board 110, in preparation for the third punching.

[0110] The subsequent punching and breaking steps are the same as the two punching and breaking steps mentioned above, until the final punching and breaking is completed. When only the last sub-circuit board 110 remains on the feeding guide rail 910, the drive plate 932 advances one more sub-circuit board 110, thus pushing the current last sub-circuit board 110 into the guide groove 520. At this time, the motion guide rail 931 drives the drive plate 932 to return to the initial position, ready to transport the next circuit board 100 to be divided by the feeding device 800.

[0111] It should be noted that during the process of the drive board 932 pushing the circuit board 100 to be divided, in order to prevent the circuit board 100 to be divided from tilting off the loading guide rail 910 due to the pushing of the drive board 932, a pressure plate mechanism 940 is also provided on the loading guide rail 910. Please refer to [link to relevant documentation]. Figure 18 ,like Figure 18 As shown, the pressure plate mechanism 940 includes a fixing block 941 and a pressing plate 942. The fixing block 941 is fixedly installed above the feeding guide rail 910, and the pressing plate 942 is disposed in the feeding guide rail 910 and connected to the lower surface of the fixing block 941 through a connecting arm 943. Thus, during the process of the drive plate 932 pushing the circuit board 100 to be divided, the pressure plate mechanism 940 presses the upper surface of the circuit board 100 to be divided, preventing the circuit board 100 to be divided from tilting away from the feeding guide rail 910 as the drive plate 932 pushes it.

[0112] It should be noted that in this embodiment, the feeding device 800 is used to store the circuit boards 100 to be divided, and simultaneously, one circuit board 100 to be divided is placed onto the feeding guide 910 at a time. Based on the solution provided in this embodiment, those skilled in the art can choose various implementations of the feeding device 800, and this embodiment does not limit the implementation. For ease of understanding, a preferred implementation is provided below with reference to the accompanying drawings.

[0113] Please see Figure 21 , Figure 21 This is a schematic diagram of the feeding device in the PCB depaneling machine provided in an embodiment of this application. Figure 21As shown, the feeding device 800 includes a storage bin 810, the cross-section of which is adapted to the circuit board 100 to be divided. The storage bin 810 is used to vertically stack multiple circuit boards 100 to be divided. A first switch part 820 and a second switch part 830 are provided at the bottom of the storage bin 810, wherein the first switch part 820 is located above the second switch part 830. When the second switch part 830 is opened, the last circuit board 100 to be divided at the bottom of the storage bin 810 falls onto the feeding guide rail 910. The first switch part 820 remains closed when the second switch part 830 is open to limit the other circuit boards 100 to be divided above from falling. When the second switch part 830 is closed, the first switch part 820 is opened to allow the circuit boards 100 to be divided above the storage bin 810 to fall downward as a whole.

[0114] In this embodiment, the storage bin 810 is perpendicular to the circuit board 100 to be divided, minimizing the space occupied by the PCB separator. Since the cross-section of the storage bin 810 is adapted to the circuit board 100 to be divided, the probability of the circuit board 100 flipping during its fall is reduced, ensuring that the processing of the circuit board 100 is not affected by its fall from the feeding device 800. Simultaneously, to ensure that only one circuit board 100 falls from the storage bin 810 at a time, a first switch 820 and a second switch 830 are provided at the bottom of the storage bin 810. The combined operation of these two switches controls the falling of the circuit board 100. The specific working process is as follows.

[0115] Please see Figure 22 , Figure 22 This is a cross-sectional view of the bottom of the feeding device of the depaneling machine provided in the embodiments of this application, as shown below. Figure 22 As shown, when the feeding device 800 needs to place a circuit board 100 to be divided onto the feeding guide rail 910, the second switch 830 opens, allowing the last circuit board 100 located at the opening of the storage bin 810 to fall into the feeding guide rail 910 under gravity. During this process, the first switch 820 remains closed, restricting other circuit boards 100 above it from falling with the last one. After placement is complete, the second switch 830 closes and the first switch 820 opens. At this time, all the circuit boards 100 in the storage bin 810 fall as a whole, waiting for the next placement. Thus, by combining the two switches, the feeding mechanism ensures that only one circuit board 100 is placed at a time, resulting in a simple structure and reliable operation.

[0116] It should be noted that the first switch portion 820 and the second switch portion 830 described above only need to be able to switch between two states: on and off. When in the on state, the circuit board 100 to be divided is allowed to pass through. When in the off state, the passage of the circuit board 100 to be divided is restricted. Based on this inventive concept, those skilled in the art can choose various implementation methods. This application does not limit these methods. For ease of understanding, this application provides a preferred embodiment for the first switch portion 820 and the second switch portion 830 as follows.

[0117] Please see Figures 21 to 23 , Figure 23 This is a partial bottom view of the feeding device for the depaneling machine provided in an embodiment of this application. Figures 21 to 23 As shown, the first switch section 820 is disposed on the side wall of the storage bin 810. Preferably, there are two first switch sections 820 symmetrically disposed on the two side walls of the storage bin 810. Each first switch section 820 includes a first switch cylinder 821 and a pressure head 822 disposed on the output shaft of the first switch cylinder 821. A through hole 811 is provided in the side wall of the storage bin 810, and the pressure head 822 extends into the storage bin 810 through the through hole 811. When the first switch section 820 is closed, the pressure head 822, driven by the first switch cylinder 821, presses against the circuit board 100 to be divided, thereby restricting the falling of the circuit board 100. When there are two first switch sections 820, the two pressure heads 822 symmetrically press against the circuit board 100 to be divided from both sides, thereby restricting the falling of the circuit board 100.

[0118] In this embodiment, since the first switch part 820 is located above the second switch part 830 and its space is relatively narrow, the first switch part 820 is opened and closed by using the pressure head 822 to squeeze and restrict the falling of the circuit board 100 to be divided.

[0119] The second switch part 830 is disposed at the bottom of the storage bin 810; wherein, the second switch part 830 includes a second switch cylinder 831 and a limiting plate 832 connected to the second switch cylinder 831; when the second switch part 830 is closed, the second switch cylinder 831 drives the end of the limiting plate 832 to extend into the bottom opening of the storage bin 810 to restrict the circuit board 100 to be divided from falling from the bottom opening.

[0120] In this embodiment, optionally, the number of second switch parts 830 is two and they are symmetrically arranged in the bottom opening of the storage bin 810. When the end of the limiting plate 832 extends into the bottom opening of the storage bin 810, it blocks the opening, thereby restricting the circuit board 100 to be divided from falling from the bottom opening, thereby realizing the function of the switch.

[0121] Optionally, embodiments of this application further provide an installation method between the second switching cylinder 831 and the limiting plate 832; please refer to [link to relevant documentation]. Figure 23 ,like Figure 23 As shown, the second switch unit 830 also includes a transmission mechanism 833, which transmits power from the second switch cylinder 831 to move the limiting plate 832. Optionally, the transmission mechanism 833 includes a mounting block 833A, a slide rail 833B, and a slider 833C. The mounting block 833A is disposed on the outer wall of the storage bin 810, and the end of the output shaft of the second switch cylinder 831 is connected to the mounting block 833A. Further, the slide rail 833B is disposed on the outer wall of the mounting block 833A, and the slider 833C is sleeved on the slide rail 833B. The body of the second switch cylinder 831 and the limiting plate 832 are respectively connected to the slider 833C.

[0122] In this embodiment, the output shaft of the second switching cylinder 831 extends and retracts. When the second switch 830 is open, the second switching cylinder 831 drives the output shaft to extend. Since the end of the output shaft is connected to the mounting block 833A, when the output shaft extends, it drives the body of the second switching cylinder 831 to move away from the mounting block 833A. Since the body of the second switching cylinder 831 is connected to the slider 833C, the body of the second switching cylinder 831 drives the slider 833C to move away from the opening of the storage bin 810. Since the slider 833C is connected to the limiting plate 832, it ultimately drives the end of the limiting plate 832 away from the opening of the storage bin 810, thus realizing the opening of the second switching section 830. Conversely, when the second switching section 830 is closed, the second switching cylinder 831 drives the output shaft to retract, thereby moving the end away from the limiting plate 832 towards the opening of the storage bin 810, thus realizing the closing of the second switching section 830. Therefore, only one second switch cylinder 831 is needed on each side to drive multiple parallel limit plates 832 to open or close the bottom opening of the storage bin 810.

[0123] Optionally, such as Figure 5 As shown, a shallow groove 912 is provided on the upper surface of the work platform 900. When the feeding device 800 is installed on the work platform 900, the limiting plate 832 located at the bottom outlet of the feeding device 800 is embedded in the shallow groove 912. The shallow groove 912 enables the work platform 900 to avoid the limiting plate 832. On the other hand, the shallow groove 912 can form a guide rail to guide the movement of the limiting plate 832.

[0124] In summary, the board splitting machine provided in this application embodiment is used to divide a circuit board to be split into multiple sub-circuit boards. It includes a board splitting device, which comprises a limiting mechanism and a punching mechanism. The limiting mechanism is used to limit the circuit board to be split; the punching mechanism is located on one side of the surface of the circuit board limited by the limiting mechanism, and is used to punch the circuit board to be split, thus splitting it into multiple sub-circuit boards. Therefore, through the cooperation of the limiting mechanism and the punching mechanism, the effect of manually breaking the circuit board to be split is simulated, solving the problem of insufficient precision in the process of cutting circuit boards with a tool.

[0125] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A board splitting machine for dividing a circuit board into multiple sub-circuit boards, characterized in that, The device includes a plate-separating mechanism, which comprises a limiting mechanism and a punching / bending mechanism. The limiting mechanism is used to limit the circuit board to be divided; The punching and breaking mechanism is located on one side of the board surface of the segmented circuit board that is limited by the limiting mechanism, and is used to punch the circuit board to be segmented that is limited by the limiting mechanism, and punch and break the circuit board to be segmented into multiple sub-circuit boards. The plate-splitting device includes a first plate-splitting device, which includes a first limiting mechanism and a first punching mechanism. The circuit board to be divided has multiple rows of small circuit boards integrated in the length direction and multiple columns in the width direction. There are seams between the multiple small circuit boards at the adjacent points in the width and length directions. The sub-circuit board that the first punching and breaking mechanism breaks off each time includes a row of small circuit boards. The first board separating device also includes a first punching and breaking blade, wherein the first punching and breaking blade is located below the first punching and breaking mechanism. During the process of the first punching and breaking mechanism punching the sub-circuit board, the first punching and breaking blade abuts against the seam of a row of small circuit boards.

2. The PCB depaneling machine as described in claim 1, characterized in that, The first limiting mechanism is used to limit the first end of the circuit board to be divided; The first punching and breaking mechanism is used to punch the second end of the circuit board to be divided, so that the sub-circuit board located at the second end is broken off from the circuit board to be divided.

3. The PCB depaneling machine as described in claim 2, characterized in that, The first limiting mechanism includes a pressure plate cylinder, and a first pressing block is provided on the output shaft of the pressure plate cylinder. The first pressing block is used to press and limit the first end of the circuit board to be divided under the drive of the pressure plate cylinder.

4. The depaneling machine as described in claim 2, characterized in that, The first punching and splitting mechanism includes a first punching and splitting cylinder, and a second pressing block is provided on the output shaft of the first punching and splitting cylinder. The second pressing block is used to punch the second end of the circuit board to be split under the drive of the first punching and splitting cylinder.

5. The PCB depaneling machine as described in claim 4, characterized in that, The second pressing block has a rolling element on one side of the circuit board to be divided, which is used to roll the circuit board to be divided during the pressing process of the second pressing block.

6. The depaneling machine as described in claim 1, characterized in that, The blade of the first punching cutter has an acute angle with the plane on which the circuit board to be divided is located.

7. The PCB depaneling machine as described in claim 1, characterized in that, The PCB separator also includes a feeding device and a working platform; The first board splitting device is disposed on the working platform, and the working platform is provided with a loading guide rail for transporting the circuit board to be split to the first board splitting device; The feeding device is located above the working platform and is used to store the circuit boards to be divided and place them on the feeding guide rail.

8. The PCB depaneling machine as described in claim 7, characterized in that, A drive device is provided below the work platform. The drive device includes a motion guide rail and a drive plate that moves along the motion guide rail. The feeding guide rail is provided with a strip-shaped through hole along the transport direction of the circuit board to be divided, and the upper end of the drive plate extends into the feeding guide rail through the strip-shaped through hole; when the drive plate moves along the motion guide rail, it drives the circuit board to be divided located on the feeding guide rail to move toward the first board dividing device.

9. The PCB depaneling machine as described in claim 7, characterized in that, The feeding device includes a storage bin, the cross-section of which is adapted to the circuit board to be divided, and the storage bin is used to vertically stack multiple circuit boards to be divided; the bottom of the storage bin is provided with a first switch section and a second switch section, wherein... The first switch section is located above the second switch section; When the second switch is turned on, the last circuit board to be divided at the bottom of the storage bin falls onto the feeding guide rail. The first switch remains closed when the second switch is turned on to prevent other circuit boards to be divided from falling. When the second switch is closed, the first switch is opened, causing the circuit board to be divided above the storage bin to fall downwards as a whole.

10. The PCB depaneling machine as described in claim 9, characterized in that, The first switch is disposed on the side wall of the storage bin; wherein, The first switch part includes a first switch cylinder and a pressure head disposed on the output shaft of the first switch cylinder. The side wall of the storage bin has a through hole, and the pressure head extends into the storage bin through the through hole. When the first switch part is closed, the pressure head is driven by the first switch cylinder to squeeze the circuit board to be divided, so as to restrict the falling of the circuit board to be divided.

11. The depaneling machine as described in claim 9, characterized in that, The second switch is located at the bottom of the storage hopper; wherein, The second switch part includes a second switch cylinder and a limiting plate connected to the second switch cylinder; when the second switch part is closed, the second switch cylinder drives the end of the limiting plate to extend into the bottom opening of the storage bin to restrict the circuit board to be divided from falling from the bottom opening.

12. A board splitting machine for dividing a circuit board to be split into multiple sub-circuit boards, characterized in that, The device includes a board splitting device, which includes a limiting mechanism and a punching mechanism. The limiting mechanism is used to limit the board to be split. The punching mechanism is located on one side of the board surface of the board to be split, which is limited by the limiting mechanism, and is used to punch the board to be split, which is limited by the limiting mechanism, to punch and break the board to be split into multiple sub-boards. The plate-splitting device includes a first plate-splitting device, which includes a first limiting mechanism and a first punching mechanism. The circuit board to be divided has multiple rows of small circuit boards integrated in the length direction and multiple columns in the width direction. Seams exist between the adjacent small circuit boards in both the width and length directions. Each time the first punching and bending mechanism breaks off a sub-circuit board, it includes one row of small circuit boards. The board-splitting device also includes a second board-splitting device, which includes a second limiting mechanism and a second punching and bending mechanism. The second limiting mechanism is used to limit the position of the sub-circuit board; the second punching and bending mechanism is used to punch the seams between the rows of small circuit boards in the sub-circuit board. The second limiting mechanism includes a limiting groove, and the second punching mechanism includes a second punching cylinder. The output shaft of the second punching cylinder is provided with a second punching blade. The limiting groove is located below the first punching mechanism and is used to receive the sub-circuit board that falls off after being punched by the first punching mechanism, so that the sub-circuit board is limited to the limiting groove. The first wall of the limiting groove has an opening, and the sub-circuit board is exposed at least partially through the opening. The blade of the second punching blade is located in the opening and is used to break the seam under the drive of the second punching cylinder.

13. The depaneling machine as described in claim 12, characterized in that, The second wall of the limiting groove has a clearance position, the second wall is opposite to the first wall, and a baffle for limiting the sub-circuit board is provided between the first wall and the second wall; a material box is provided below the limiting groove. During the process of the second punching and breaking the seam, the second punching and breaking blade enters from the opening and exits from the clearance position; The side of the small circuit board away from the seam is limited by the guard edge during the punching and bending process, while the side of the small circuit board closer to the seam moves towards the clearance position during the punching and bending process; after the second punching and bending knife completes the punching and bending, the small circuit board falls into the material box through the clearance position.

14. The PCB depaneling machine as described in claim 12, characterized in that, A guide plate is provided below the first punching and bending mechanism, and a guide groove is provided between the limiting groove and the first punching and bending mechanism; After the first punching and breaking mechanism breaks the sub-circuit board from the circuit board to be divided, the sub-circuit board falls into the guide groove under the guidance of the guide plate, and then falls into the limiting groove under the guidance of the guide groove and is limited by the limiting groove.

15. The PCB depaneling machine as described in claim 12, characterized in that, The PCB separator also includes a feeding device and a working platform; The first board splitting device is disposed on the working platform, and the working platform is provided with a loading guide rail for transporting the circuit board to be split to the first board splitting device; The feeding device is located above the working platform and is used to store the circuit boards to be divided and place them on the feeding guide rail.

16. The depaneling machine as described in claim 15, characterized in that, A drive device is provided below the work platform. The drive device includes a motion guide rail and a drive plate that moves along the motion guide rail. The feeding guide rail is provided with a strip-shaped through hole along the transport direction of the circuit board to be divided, and the upper end of the drive plate extends into the feeding guide rail through the strip-shaped through hole; when the drive plate moves along the motion guide rail, it drives the circuit board to be divided located on the feeding guide rail to move toward the first board dividing device.

17. The depaneling machine as described in claim 15, characterized in that, The feeding device includes a storage bin, the cross-section of which is adapted to the circuit board to be divided, and the storage bin is used to vertically stack multiple circuit boards to be divided; the bottom of the storage bin is provided with a first switch section and a second switch section, wherein... The first switch section is located above the second switch section; When the second switch is turned on, the last circuit board to be divided at the bottom of the storage bin falls onto the feeding guide rail. The first switch remains closed when the second switch is turned on to prevent other circuit boards to be divided from falling. When the second switch is closed, the first switch is opened, causing the circuit board to be divided above the storage bin to fall downwards as a whole.

18. The depaneling machine as described in claim 17, characterized in that, The first switch is disposed on the side wall of the storage bin; wherein, The first switch part includes a first switch cylinder and a pressure head disposed on the output shaft of the first switch cylinder. The side wall of the storage bin has a through hole, and the pressure head extends into the storage bin through the through hole. When the first switch part is closed, the pressure head is driven by the first switch cylinder to squeeze the circuit board to be divided, so as to restrict the falling of the circuit board to be divided.

19. The depaneling machine as described in claim 17, characterized in that, The second switch is located at the bottom of the storage hopper; wherein, The second switch part includes a second switch cylinder and a limiting plate connected to the second switch cylinder; when the second switch part is closed, the second switch cylinder drives the end of the limiting plate to extend into the bottom opening of the storage bin to restrict the circuit board to be divided from falling from the bottom opening.

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