Light emitting device and method of forming the same, laser radar

Abstract

The application provides a light emitting device and a forming method thereof, and a laser radar, the light emitting device comprising: a light emitting chip, which is a vertical cavity surface emitting laser chip; the light emitting chip comprises a plurality of light emitting units for providing an emitting light beam; a collimating device is located on a downstream light path of the light emitting units and comprises a plurality of lens units, the lens units correspond to the light emitting units one by one, and the arrangement shape of the lens units corresponds to the arrangement shape of the plurality of light emitting units, and the lens units are used for collimating the emitting light beam of the light emitting units. The one-to-one correspondence between the lens units and the light emitting units reduces the emitting angle of the emitting light beam after passing through the lens units, thereby improving the emitting power density. In addition, because the arrangement shape of the lens units corresponds to the arrangement shape of the plurality of light emitting units, the emitting light beam provided by the light emitting units almost all passes through the lens units, thereby improving the utilization rate of the emitting light beam and further improving the emitting power density.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser radar, in particular to a light emitting device and a forming method thereof, and a laser radar. BACKGROUND

[0002] Laser radar (LIDAR) undertakes important tasks such as road edge detection, obstacle identification, and real-time positioning and mapping (SLAM) in autonomous driving. Laser radar can accurately measure target position (distance and angle), motion state (speed, vibration and attitude), and shape, and detect, identify, distinguish and track targets. Due to the advantages of fast measurement speed, high precision and long range, laser radar has been widely used in the field of unmanned vehicles.

[0003] Specifically, the LIDAR system includes a transmitting device and a receiving device. The transmitting device includes a laser that generates a transmitting light pulse, which is incident on a target object, reflected and generates a return light beam, and finally the return light beam is received by the receiving device. The receiving device accurately measures the propagation time from transmission to reception of the transmitting light pulse. Because the light pulse propagates at the speed of light, and the speed of light is known, the propagation time can be converted into the distance between the target object and the LIDAR system.

[0004] Compared with the edge-emitting laser (EEL) widely used in current laser radar, the vertical cavity surface emitting laser (VCSEL) has the advantage of spatially symmetric distribution of divergence angle. In the application of laser radar, the requirement of high peak power for laser radar makes more and more VCSELs use three-layer and five-layer quantum well structures to increase the transmitting power.

[0005] However, the transmitting device of the current laser radar has the problem of low transmitting power density. SUMMARY

[0006] The problem solved by the present application is to provide a light emitting device and a forming method thereof, and a laser radar, to improve the transmitting power density.

[0007] In order to solve the technical problem, the technical scheme of the present application provides a light emitting device, comprising: a light emitting chip, the light emitting chip is a vertical cavity surface emitting laser chip; the light emitting chip comprises a plurality of light emitting units for providing a transmitting light beam; a collimating device is located on the downstream light path of the light emitting unit, comprising a plurality of lens units, the lens units correspond one-to-one to the light emitting units, and the arrangement shape of the lens units corresponds to the arrangement shape of the plurality of light emitting units, the lens units are used for collimating the transmitting light beam of the light emitting units.

[0008] Optionally, the plurality of lens units are contactingly arranged in a plane parallel to the light emitting chip.

[0009] Optionally, the arrangement shape of the plurality of light emitting units is hexagonal, and the arrangement shape of the plurality of lens units is hexagonal; or the arrangement shape of the plurality of light emitting units is quadrangular, and the arrangement shape of the plurality of lens units is quadrangular.

[0010] Optionally, the lens unit is a plano-convex lens, and the convex side is a spherical surface or an aspherical surface.

[0011] Optionally, the distance between the centers of adjacent light emitting units is equal to the inner diameter of the lens unit.

[0012] Optionally, the light emitting chip is fixed on a substrate; the collimating device further comprises a substrate, and the plurality of lens units are located on the substrate; the substrate is fixed on the substrate by curing glue, so that the lens units correspond to the light emitting units one by one.

[0013] Optionally, the light emitting device further comprises a substrate and a plurality of side walls located on the substrate, the side walls and the substrate form a groove, and the light emitting chip is located on the substrate at the bottom of the groove; the collimating device further comprises a substrate, and the plurality of lens units are located on the substrate; the substrate covers the groove, so that the lens units correspond to the light emitting units in the groove one by one.

[0014] Optionally, the substrate is fixed on the top of the side wall by welding or gluing.

[0015] Optionally, the light emitting device further comprises a substrate, the substrate comprises a light emitting area for arranging the light emitting chip and a peripheral area located around the light emitting area; the light emitting device further comprises a pad fixed on the peripheral area of the substrate; the collimating device further comprises a substrate, and the plurality of lens units are located on the substrate; the substrate is fixed on the pad by a fixing member.

[0016] Optionally, the pad comprises a ceramic pad.

[0017] Optionally, the number of the light emitting chip and the collimating device is plural, the light emitting chip and the collimating device correspond to each other to form a packaging structure, and the plurality of packaging structures are arranged in an array in the light emitting device.

[0018] Optionally, the collimating device comprises a process layer covering the plurality of light emitting units, and the plurality of lens units are formed in the process layer.

[0019] Correspondingly, the present application also provides a forming method of the light emitting device, comprising: providing a light emitting chip, the light emitting chip being a vertical cavity surface emitting laser chip, the light emitting chip comprising a plurality of light emitting units for providing emitting beams; and providing a collimating device downstream of the light emitting units, the collimating device comprising a plurality of lens units corresponding to the light emitting units, the lens units being arranged in a shape corresponding to the arrangement of the light emitting units, and the lens units being used for collimating the emitting beams of the light emitting units.

[0020] Optionally, the step of providing the light emitting chip comprises: providing a substrate, and arranging the light emitting chip on the substrate; and the step of providing the collimating device comprises: selecting lens units corresponding to the arrangement of the light emitting units of the light emitting chip, aligning the lens units with the light emitting units, and fixing the collimating device to the light emitting chip.

[0021] Optionally, the step of providing the collimating device further comprises: providing a substrate, forming a process layer on the substrate, and processing the process layer by using an imprint process to form the lens units in the process layer.

[0022] Optionally, the imprint process comprises a nano-imprint process.

[0023] Optionally, the step of fixing the collimating device to the light emitting chip comprises: fixing the substrate to the substrate by using point coating and curing glue, and the lens units correspond to the light emitting units one by one.

[0024] Optionally, the step of providing the light emitting chip further comprises: providing a substrate and a plurality of side walls on the substrate, the side walls and the substrate forming a groove; and arranging the light emitting chip on the substrate at the bottom of the groove; and the step of fixing the collimating device comprises: covering the substrate on the groove, and making the lens units correspond to the light emitting units in the groove one by one.

[0025] Optionally, the substrate is fixed to the top of the side walls by using welding or gluing.

[0026] Optionally, the forming method of the light emitting device further comprises: providing a substrate, the substrate comprising a light emitting area and a peripheral area surrounding the light emitting area; and arranging the light emitting chip on the light emitting area of the substrate; and the step of fixing the collimating device comprises: fixing a block to the peripheral area of the substrate, and fixing the substrate to the block by using a fixing member, so that the lens units correspond to the light emitting units one by one.

[0027] Optionally, the substrate is fixed to the block by using gluing or welding.

[0028] Optionally, the step of disposing the collimating device comprises: forming a process layer covering the plurality of light emitting units; and processing the process layer by using an imprint process to form a plurality of lens units in the process layer, the lens units corresponding to the light emitting units one by one.

[0029] Optionally, the step of providing the light emitting chip comprises: providing a device wafer, the device wafer comprising a plurality of spaced-apart light emitting regions, each of the light emitting regions having the plurality of light emitting units formed therein; and the step of forming the collimating device comprises: forming a process layer covering the device wafer, and processing the process layer by using an imprint process to form lens units corresponding to the light emitting units one by one in the process layer; and after forming the collimating device, cutting the device wafer.

[0030] Optionally, the step of disposing the collimating device further comprises: arranging the plurality of lens units in a contact manner in a plane parallel to the substrate.

[0031] Optionally, in the step of providing the light emitting chip, the number of the light emitting chips is a plurality; and the step of disposing the collimating device further comprises: corresponding the light emitting chips and the collimating device to form a package structure; and arranging the plurality of package structures in the light emitting device in an array.

[0032] Correspondingly, the present application also provides a laser radar, which comprises the light emitting device.

[0033] Compared with the prior art, the technical scheme of the present application has the following advantages:

[0034] In the light emitting device provided by the embodiment of the present application, the light emitting chip is a vertical cavity surface emitting laser chip, the light emitting chip comprises a plurality of light emitting units for providing an emitted light beam; the collimating device in the light emitting device comprises a plurality of lens units, the lens units are located on a downstream light path of the light emitting units, the lens units correspond to the light emitting units one by one, so that the emitted light beam provided by the light emitting units can pass through the corresponding lens units, thereby collimating the passed emitted light beam through the corresponding lens units, so as to reduce the emission angle of the passed emitted light beam, and further improve the emission power density; in addition, because the arrangement shape of the lens units corresponds to the arrangement shape of the plurality of light emitting units, the proportion of the emitted light beam passing through the lens units can be increased, the utilization rate of the emitted light beam is improved, and the emission power density is further improved.

[0035] In an alternative, the plurality of lens units are contactingly arranged in parallel to the plane of the light emitting chip, that is, there is no gap between adjacent lens units, and when the light emitting chip is in operation, the emission light beam provided by the light emitting unit can not pass through the gap between adjacent lens units, and almost all of the emission light beam provided by the light emitting unit can pass through the lens units to be collimated, so that the utilization rate of the emission light beam is high, and the emission power density is improved. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a structural schematic diagram of a light emitting device;

[0037] Figure 2 is Figure 1 is a view of A in

[0038] Figure 3 is a structural schematic diagram of a light emitting device of a first embodiment of the present application;

[0039] Figure 4 is Figure 3 is a first embodiment schematic diagram of the packaging structure linear array arrangement in

[0040] Figure 5 is Figure 3 is a second embodiment schematic diagram of the packaging structure linear array arrangement in

[0041] Figure 6 is a structural schematic diagram of a light emitting chip in a light emitting device of a second embodiment of the present application;

[0042] Figure 7 is a structural schematic diagram of a substrate in a light emitting device of a second embodiment of the present application;

[0043] Figure 8 is a structural schematic diagram of a light emitting device of a second embodiment of the present application;

[0044] Figure 9 is a structural schematic diagram of a light emitting device of a third embodiment of the present application;

[0045] Figure 10 is a structural schematic diagram of a light emitting device of a fourth embodiment of the present application;

[0046] Figures 11 to 16 is a structural schematic diagram of each step in a forming method of a light emitting device of a first embodiment of the present application;

[0047] Figure 17 and Figure 18 is a structural schematic diagram of each step in a forming method of a light emitting device of a second embodiment of the present application;

[0048] Figure 19 and Figure 20is a structural schematic diagram of each step in the forming method of the light emitting device of the third embodiment of the present application;

[0049] Figure 21 and Figure 22 is a structural schematic diagram of each step in the forming method of the light emitting device of the fourth embodiment of the present application;

[0050] Figures 23 to 25 is a structural schematic diagram of each step in the forming method of the light emitting device of the fifth embodiment of the present application. DETAILED DESCRIPTION

[0051] As described in the background, the emission power density of the vertical cavity surface emitting laser (VCSEL) in the prior art is small. The VCSEL used in the current laser radar has multiple light emitting units, the VCSEL divergence angle is large, and the emission power density cannot be greatly improved. The existing VCSEL collimation scheme mostly uses a single large-aperture lens to collimate the entire VCSEL.

[0052] The following will be described in combination with Figure 1 and Figure 2 to illustrate a light emitting device, Figure 1 a structural schematic diagram of a light emitting device is shown, Figure 2 is Figure 1 a top view of A in

[0053] The light emitting device comprises a substrate 1, a light emitting chip 2 located on the substrate 1, the light emitting chip 2 being a vertical cavity surface emitting laser chip, the light emitting chip 2 comprising multiple light emitting units 4 for providing an emitted light beam, and a lens unit 3 located on the light emitting chip 2 and corresponding to the multiple light emitting units 4 in the light emitting chip 2, so that the lens unit 3 can collimate the emitted light beam of the light emitting unit 4.

[0054] The lens unit 3 is a single large-aperture plano-convex lens, and the lens unit 3 collimates the emitted light beam provided by the multiple light emitting units 4 in the entire vertical cavity surface emitting laser chip, which will cause the equivalent light emitting area to become large, thereby reducing the emission power density of the light emitting device.

[0055] In order to solve the above technical problems, the present application provides a light emitting device, comprising: a light emitting chip, the light emitting chip being a vertical cavity surface emitting laser chip; the light emitting chip comprising multiple light emitting units for providing an emitted light beam; and a collimation device located on the downstream optical path of the light emitting unit, comprising multiple lens units, the lens units corresponding one-to-one to the light emitting units, and the arrangement shape of the lens units corresponding to the arrangement shape of the multiple light emitting units, the lens units being used to collimate the emitted light beam of the light emitting units.

[0056] The light emitting device provided by the embodiment of the present application is characterized in that the light emitting chip is a vertical cavity surface emitting laser chip, the light emitting chip comprises a plurality of light emitting units for providing emitting beams; the collimating device in the light emitting device comprises a plurality of lens units, the lens units are located on the downstream light path of the light emitting units, the lens units correspond to the light emitting units one by one, so that the emitting beams provided by the light emitting units can pass through the corresponding lens units, the collimating device collimates the passing emitting beams through the corresponding lens units, so that the emitting angle of the passing emitting beams is reduced, and the emitting power density is improved; in addition, because the arrangement shape of the lens units corresponds to the arrangement shape of the plurality of light emitting units, the proportion of the emitting beams passing through the lens units can be increased, the utilization rate of the emitting beams is improved, and the emitting power density is further improved.

[0057] In order to make the above-mentioned purpose, characteristics and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0058] Reference Figure 3 is a structural schematic diagram of the light emitting device according to the first embodiment of the present application.

[0059] The light emitting device comprises: a light emitting chip 100, which is a vertical cavity surface emitting laser chip; the light emitting chip 100 comprises a plurality of light emitting units 101 for providing emitting beams; a collimating device 102 is located on the downstream light path of the light emitting units 101 and comprises a plurality of lens units 103, the lens units 103 correspond to the light emitting units 101 one by one, and the arrangement shape of the lens units 103 corresponds to the arrangement shape of the plurality of light emitting units 101, and the lens units 103 are used for collimating the emitting beams of the light emitting units 101.

[0060] The light emitting chip 100 is a vertical cavity surface emitting laser chip, and the light emitting chip 100 comprises a plurality of light emitting units 101, the light emitting direction of which is perpendicular to the substrate. Specifically, the emitting beams provided by the light emitting units 101 are along the normal direction of the surface of the light emitting chip 100 (i.e. the direction of the vertical paper surface in the figure). Figure 3

[0061] The light emitting chip 100 further comprises a first electrode 107, the first electrode 107 and the light emitting surface of the light emitting unit 101 are located on the same surface of the light emitting chip 100, and the first electrode 107 is used for supplying power to the light emitting chip 100.

[0062] In the embodiment, the number of the first electrodes 107 is two, for example, and the polarities of the two first electrodes 107 are the same, for example, both are anodes, and the two first electrodes 107 are located on the top surface of the light emitting chip 100.

[0063] ​The light emitting chip 100 further comprises a second electrode, i.e. a cathode (not shown), which is located on the bottom surface of the light emitting chip 100. The plurality of light emitting units 101 are configured in a common cathode structure.

[0064] It is further noted that the light emitting chip 100 is fixed on a substrate 104. The substrate 104 is provided with a first pad (not shown) and a second pad (not shown). The first pad (e.g. an anode pad) is used to electrically connect the anode of the light emitting chip 100 via a gold wire, and the second pad (e.g. a cathode pad) is directly soldered to the cathode of the light emitting chip 100.

[0065] In the embodiment, the substrate 104 comprises a printed circuit board (PCB). In other embodiments, the substrate can further comprise a semiconductor substrate, an insulating layer on the semiconductor substrate, and an interconnection structure formed in the insulating layer. The interconnection structure is used to electrically connect the light emitting chip with a peripheral circuit or other electrical elements. The peripheral circuit can be one or more of a power switch circuit, a multiplexing circuit, a signal amplification circuit, and a signal sampling circuit.

[0066] In the embodiment, the lens unit 103 is a plano-convex lens, and the convex side of the plano-convex lens is a spherical or aspherical surface. The thickness of the central region of the plano-convex lens is greater than the thickness of the edge region, and the emitted light beams can be collimated by the refraction of light.

[0067] In the embodiment, the camber height of the plano-convex lens is 1-10 microns.

[0068] It is noted that the lens unit 103 corresponds to the light emitting unit 101 one-to-one, so that the emitted light beams provided by each light emitting unit 101 are collimated by a unique corresponding lens unit 103. Compared with the case of using a large-aperture lens to collimate the emitted light beams, the effect of using the corresponding lens unit 103 to collimate the emitted light beams provided by the unique light emitting unit 101 is better, which is conducive to reducing the equivalent light emitting surface of the light emitting chip 100 and improving the power density. After using a single large-aperture plano-convex lens, the entire light emitting region of the light emitting chip 100 (including the spacing part between the light emitting units) is the light emitting surface. The equivalent light emitting surface of the embodiment of the present application is equivalent to the entire part composed of the light emitting units 101 (excluding the spacing part between the light emitting units), so the equivalent light emitting surface is reduced, and the power density is improved under the same output power.

[0069] In this embodiment, the arrangement shape of the lens units 103 corresponds to the arrangement shape of the plurality of light-emitting units 101. Specifically, with the plane where the light-emitting surface of the light-emitting device is located as the projection plane, the arrangement shape of the lens units 103 refers to the projection shape of each lens unit on the light-emitting surface; the arrangement shape of the plurality of light-emitting units 101 refers to the shape formed by the plurality of light-emitting units 101 adjacent to each light-emitting unit 101, that is, the shape formed by connecting the centers of the light-emitting surfaces of the plurality of light-emitting units 101 adjacent to each light-emitting unit 101, such as Figure 3 As shown in . The outline of the light-emitting surface of the light-emitting chip 100 (including all the light-emitting units 101 as a whole) is the same as this shape. The arrangement shape of the lens units 103 is the same as the arrangement shape of the multiple light-emitting units 101. When the light-emitting chip 100 is in operation, the emission light beams emitted by the light-emitting units 101 can pass through the corresponding lens units 103 at a greater proportion, which is conducive to improving the utilization rate of the emission light beam and increasing the emission power density.

[0070] In this embodiment, the plurality of lens units 103 are arranged in contact with each other on a plane parallel to the light-emitting chip 100. In other words, adjacent lens units 103 are closely arranged on a plane parallel to the light-emitting chip 100, i.e., there are no gaps between adjacent lens units 103. When the light-emitting chip 100 is operating, the emission light beams provided by the light-emitting units 101 do not pass through the gaps between adjacent lens units 103. This results in a high utilization rate of the emission light beam (almost all of the light beams pass through the lens units 103), which helps to improve the emission power density.

[0071] Specifically, as an example, the arrangement shape of the multiple light-emitting units 101 is a hexagon, and the shape formed by the multiple light-emitting units 101 adjacent to the light-emitting unit 101 outside each light-emitting unit 101 is a hexagon, that is, the shape formed by connecting the centers of the light-emitting surfaces of the multiple light-emitting units 101 adjacent to the light-emitting unit 101 outside each light-emitting unit 101 is a hexagon, and the outline of the light-emitting surface of the light-emitting chip 100 (including the whole of all light-emitting units 101) is also a hexagon. The arrangement shape of the lens unit 103 is a hexagon, that is, the projection shape of each lens unit on the light-emitting surface is a hexagon, and the hexagon is easy to achieve dense arrangement. As another example, the arrangement shape of the multiple light-emitting units is a quadrilateral, and the arrangement shape of the multiple lens units is a quadrilateral, and the quadrilateral can also achieve dense arrangement. In other embodiments, the lens unit can also be other polygons that can achieve dense arrangement.

[0072] It should be noted that the distance d1 between the centers of adjacent light emitting units 101 (e.g. Figure 3 ) is equal to the inner diameter d2 of the lens unit 103 (as shown Figure 3The lens units 103 are arranged in a close-packed manner (as shown in the figure), which is conducive to the close arrangement of the lens units 103, so that there is no gap between adjacent lens units 103, and the emission beam provided by the light emitting unit 101 does not pass through the gap between adjacent lens units 103 when the light emitting chip 100 is working, so that the utilization rate of the emission beam is high, which is conducive to improving the emission power density.

[0073] The light emitting device further comprises an anti-reflection film (not shown in the figure) located on one or both of the convex surface and the plane of the plano-convex lens, which is used to improve the transmittance of the emission beam.

[0074] The collimation device 102 further comprises a substrate 105, and the plurality of lens units 103 are located on the substrate 105. The substrate 105 is fixed to the base 104 by the curing glue 106, so that the lens units 103 correspond one-to-one to the light emitting units 101.

[0075] The plurality of lens units 103 are located on the substrate 105, and by adjusting the position of the substrate 105 and the base 104, the positional relationship between the plurality of lens units 103 in the substrate 105 and the light emitting units 101 in the base 104 can be adjusted, so that the lens units 104 and the light emitting units 101 are in an aligned state.

[0076] In this embodiment, the substrate 105 has a light transmission property, and specifically, the material of the substrate 105 includes glass. The thickness of the substrate 105 is in the order of magnitude of 200 microns to 500 microns.

[0077] In this embodiment, the curing glue 106 fixes the substrate 105 and the base 104, and the curing glue 105 is located between the substrate 105 and the base 104. The thickness of the curing glue 105 controls the interval between the lens units 103 and the light emitting units 101, and the interval is the working distance of the lens units 103, so that the lens units 103 can collimate the emission beam provided by the light emitting units 101.

[0078] In this embodiment, the material of the curing glue 106 includes ultraviolet glue.

[0079] In this embodiment, the substrate 105 is fixed to the base 104 by the curing glue 106, and the substrate 105 exposes the first electrode 107 on the light emitting chip 100, which is convenient for the electrical connection between the first electrode 107 and the first pad (such as an anode pad) on the base 104. In other embodiments, the substrate exposes the electrode on the light emitting chip, which is convenient for the electrical connection between the electrode and other elements.

[0080] It should be noted that when the curing adhesive 106 fixes the substrate 105 and the base 104 together, the lens unit 103 and the light emitting unit 101 are spaced apart on the light path.

[0081] In this embodiment, the collimating device 102 further includes: a process layer (not shown in the figure), which is located on the substrate 105; and the lens unit 103 is located in the process layer.

[0082] The lens unit 103 is formed by an imprinting process, and the process layer is an imprinting object of a mold during the imprinting process.

[0083] In this embodiment, the material of the process layer includes ultraviolet glue.

[0084] In this embodiment, the process layer is located on the substrate 105 in the area where the lens unit is to be formed, so that the curing adhesive 106 can directly fix the substrate 105 and the base 104 together. In other embodiments, the process layer can also be located on the entire surface of the substrate, and the curing adhesive fixes the substrate and the base, specifically referring to the curing adhesive fixing the process layer and the base together.

[0085] In this embodiment, the material of the process layer includes UV glue, and the material of the curing glue 106 includes UV glue. The thermal expansion coefficients of the UV glue used in the process layer and the curing glue 106 are similar.

[0086] It should also be noted that the UV glue used in the process layer is light-transmissive and has a refractive index close to that of the substrate 105 , while the UV glue used in the curing glue 106 can be light-transmissive or opaque.

[0087] Preferably, when the substrate 105 and the base 104 are fixed with the curing adhesive 106 , the convex surfaces of the plurality of lens units 103 on the substrate 105 point toward the direction of the light emitting chip 100 (ie, downward).

[0088] It should be noted that, as an example, the light-emitting chip 100 and the collimating device 102 are both multiple in number, and the light-emitting chip 100 and the collimating device 102 respectively constitute a package structure, and the multiple package structures are arranged in an array in the light-emitting device. Depending on the requirements of the collimated light beam, the package structures can be arranged linearly in a direction, so that when the light-emitting device is in operation, multiple spaced-apart emission lights can be provided in a direction.

[0089] like Figure 4 FIG. 1 is a schematic diagram of a first embodiment of a linear array arrangement of package structures, in which, in one extending direction, the number of the package structures is 7. In other embodiments, the number of the package structures may be more than 7 or less than 7.

[0090] It should be noted that as another example, the number of the light emitting chips 100 and the number of the collimating devices 102 are both plural, the plural collimating devices 102 are connected as a whole, that is, the whole composed of the plural collimating devices 102 includes one substrate 105 and the plural lens units 103 which are discrete on the substrate 105, and each of the plural lens units 103 corresponds to one light emitting chip 100, and the light emitting chips 100 are arranged in an array. According to the requirement of the collimated light beam, the light emitting chips 100 can be linearly arranged in one direction, and when the light emitting device is working, a plurality of spaced apart emitted light beams can be provided in one direction.

[0091] As shown in Figure 5 , it is a second embodiment schematic diagram of the package structure linear array arrangement, in an extension direction, the number of the light emitting chips 100 is 7. In other embodiments, the number of the light emitting chips 100 can be more than 7 or less than 7.

[0092] Referring to Figures 6 to 8 , Figure 6 , it is a structure schematic diagram of the light emitting chip in the light emitting device of the second embodiment of the present application, Figure 7 , it is a structure schematic diagram of the substrate in the light emitting device of the second embodiment of the present application, Figure 8 , it is a structure schematic diagram of the light emitting device of the second embodiment of the present application.

[0093] The same as the first embodiment of the light emitting device is not described here, the difference is that:

[0094] The light emitting device includes: a substrate 204 and a plurality of side walls 208 on the substrate 204, the side wall 208 and the substrate 204 enclose a groove 209, and the light emitting chip 200 is located on the substrate 204 at the bottom of the groove 209. The collimating device 202 includes: a substrate 205, and the plurality of lens units 203 are located on the substrate 205; the substrate 205 covers the groove 209, so that the lens units 203 correspond to the light emitting units 201 in the groove 209 one by one.

[0095] In the embodiment of the present application, the substrate 205 of the light emitting device covers the groove 209, that is, the substrate 205 is located on the top surface of the side wall 208, and the substrate 205 is kept spaced apart from the substrate 204 under the support of the side wall 208, so that the lens units 203 on the substrate 205 are kept spaced apart from the light emitting units 203 on the substrate 204, and by controlling the size (i.e. height) of the side wall 208 on the normal line of the surface of the substrate 204, the spacing between the lens units 203 and the light emitting units 201 can be adjusted, and the collimation of the emitted light beam provided by the light emitting units 203 can be realized.

[0096] In this embodiment, the substrate 205 is fixed on the top of the side wall 208 by welding. For example, the welding includes gold plating welding. In other embodiments, the substrate can also be fixed on the top of the side wall by gluing, for example, the gluing includes the way of dotting ultraviolet glue.

[0097] Reference Figure 9 Fig. 3 shows a structural schematic diagram of a light emitting device according to a third embodiment of the present application.

[0098] The same parts of the light emitting device in this embodiment and the first embodiment will not be described here, and the difference is that:

[0099] The light emitting device includes a substrate 304, the substrate 304 includes a light emitting area for arranging the light emitting chip 300 and a peripheral area around the light emitting area; the light emitting device further includes a cushion block 308 fixed on the peripheral area of the substrate 304; the collimating device further includes a substrate 305, the plurality of lens units 303 are located on the substrate 305, and the substrate 305 is fixed on the cushion block 308 by a fixing member.

[0100] In the embodiment of the present application, the cushion block 308 is fixed on the peripheral area of the substrate 304, the cushion block 308 has a certain height in the direction of the normal line of the surface of the substrate 304, the substrate 305 is fixed on the cushion block 308 by the fixing member, and the substrate 305 is kept spaced apart from the substrate 304 under the support of the fixing member and the cushion block 308, so that the lens units 303 located on the substrate 305 are kept spaced apart from the light emitting units 301 on the substrate 304, and the interval between the lens units 303 and the light emitting units 301 can be adjusted by controlling the size of the fixing member and the cushion block 308 in the normal line of the surface of the substrate 304, so as to realize the collimation of the emitted light beam provided by the light emitting units 301.

[0101] The light emitting area of the substrate 304 defines the arrangement area of the light emitting chip 300, and the peripheral area defines the arrangement area of the cushion block 308.

[0102] It should be noted that the height of the cushion block 308 is slightly smaller than the working distance (the working distance refers to the focal length of a plano-convex lens) of the lens unit 303, because the height of the cushion block 308 and the thickness of the fixing member can make this embodiment applicable to the packaging of the laser with a longer working distance under the limitation of the height of the dotting.

[0103] In this embodiment, the substrate 305 and the cushion block 308 are fixedly connected by the way of dotting ultraviolet glue. In other embodiments, the substrate and the cushion block can also be fixedly connected by welding.

[0104] In the embodiment, the cushion block 308 comprises a ceramic cushion block, and the cushion block 308 can also be a cushion block of other materials, such as a quartz cushion block.

[0105] Reference Figure 10 Fig. 4 shows a structural schematic diagram of a fourth embodiment of the light emitting device.

[0106] The light emitting device comprises a light emitting chip 400, and the light emitting chip comprises a plurality of light emitting units 401. The collimating device further comprises a process layer 406 covering the plurality of light emitting units 401, and the plurality of lens units 403 are formed in the process layer 406. The light emitting chip 400 can be arranged on a substrate 404, for example.

[0107] In the embodiment, the process layer 406 covers the plurality of light emitting units 401, and the process layer 406 is used to form the lens units 403 and also to keep the lens units 403 apart from the light emitting units 401. The size (i.e. height) of the process layer 406 in the normal direction of the surface of the light emitting chip 400 is set according to the working distance of the lens units 403, so that the emitted light beams provided by the light emitting units 401 can be collimated by refraction of the lens units 403 when the light emitting device is working.

[0108] Specifically, the lens units 403 are formed on the surface of the process layer 406 which is away from the light emitting chip 400.

[0109] In the embodiment, the material of the process layer 406 comprises ultraviolet glue. In other embodiments, other materials which can form the lens units 403 can also be used, such as resin.

[0110] In the embodiment, the process layer 406 is in contact with the light emitting units 401. In this way, the light emitting units 401 can provide the forming interface of the process layer 406, and the structure compactness of the light emitting device can also be improved.

[0111] It should be noted that the process layer 406 exposes the electrodes, so as to facilitate the electrical connection between the electrodes and the peripheral circuit or other elements.

[0112] It should be noted that the lens units in the above-mentioned embodiments can also compress the divergence angle of the light emitting units to a certain extent, rather than completely collimate, which is also within the protection scope of the present application.

[0113] The present application further provides a forming method of a light emitting device. Figures 11 to 16 The first embodiment of the forming method of the light emitting device of the present application will be described in detail.

[0114] Reference Figure 11, a schematic diagram of a light emitting chip according to the present application is shown. The light emitting chip 100 is a vertical cavity surface emitting laser chip. The light emitting chip 100 comprises a plurality of light emitting units 101 for providing light beams, and the light beams are emitted in a direction perpendicular to the substrate. Specifically, the light beams provided by the light emitting units 101 are emitted in a direction along the normal of the surface of the light emitting chip 100 (i.e. in a direction perpendicular to the paper surface in the present embodiment). Figure 11

[0115] The step of providing the light emitting chip 100 comprises: providing a substrate; and disposing the light emitting chip 100 on the substrate.

[0116] In the step of providing the light emitting chip 100, the light emitting chip 100 is provided with a first electrode 107. The first electrode 107 and the light emitting surface of the light emitting unit 101 are located on the same surface of the light emitting chip 100. The light emitting chip 100 is powered through the first electrode 107.

[0117] In the present embodiment, the number of the first electrodes 107 is two, and the polarities of the two first electrodes 107 are the same, for example, both are anodes, and the two first electrodes 107 are located on the top surface of the light emitting chip 100.

[0118] In the step of providing the light emitting chip 100, the light emitting chip 100 further comprises a second electrode, which is a cathode (not shown). The cathode is located on the bottom surface of the light emitting chip 100, and the plurality of light emitting units 101 are configured in a common cathode structure. It should be noted that the substrate 104 is provided with a first pad (not shown) and a second pad (not shown). The first pad (for example, an anode pad) is used to electrically connect the anode of the light emitting chip 100 through a gold wire, and the second pad (for example, a cathode pad) is directly soldered to the cathode of the light emitting chip 100 to electrically connect the cathode.

[0119] In the present embodiment, the substrate 104 comprises a printed circuit board (PCB). In other embodiments, the substrate can further comprise a semiconductor substrate, an insulating layer located on the semiconductor substrate, and an interconnection structure formed in the insulating layer. The interconnection structure is used to electrically connect the light emitting chip with a peripheral circuit or other electrical elements. The peripheral circuit can be one or more of a power switch circuit, a multiplexing circuit, a signal amplification circuit, and a signal sampling circuit.

[0120] Reference is made to Figures 12 to 16 ​As shown, on the downstream light path of the light emitting unit 101, a collimation device 102 is arranged, the collimation device 102 comprises a plurality of lens units 103, the lens units 103 are used to correspond to the light emitting unit 101 one by one, and the arrangement shape of the lens units 103 corresponds to the arrangement shape of the plurality of light emitting units 101, the lens units 103 are used to collimate the emitted light beams of the light emitting unit 101.

[0121] The light emitting chip 100 is a vertical cavity surface emitting laser chip, the light emitting chip 100 comprises a plurality of light emitting units 101 for providing emitted light beams; the collimation device 102 in the light emitting device 102 comprises a plurality of lens units 103, the lens units 103 are located on the downstream light path of the light emitting unit 101, the lens units 103 correspond to the light emitting unit 101 one by one, so that the emitted light beams provided by the light emitting unit 101 can pass through the corresponding lens units 103, the lens units 103 can collimate the passed emitted light beams, so that the emission angle of the emitted light beams after passing through the lens units 103 is reduced, and the emission power density is improved. In addition, because the arrangement shape of the lens units 103 corresponds to the arrangement shape of the plurality of light emitting units 101, it is beneficial to make the emitted light beams provided by the light emitting unit 101 pass through the corresponding lens units 103 in a larger proportion, and it is beneficial to improve the utilization rate of the emitted light beams and improve the emission power density.

[0122] In the embodiment, in the step of arranging the collimation device 102, the plurality of lens units 103 are arranged in contact on the plane parallel to the light emitting chip 100. That is to say, there is no gap between adjacent lens units 103, and when the light emitting chip 100 works, the emitted light beams provided by the light emitting unit 101 do not pass through the gap between adjacent lens units 103, so that the utilization rate of the emitted light beams is high (almost all pass through the lens units 103), which is beneficial to improve the emission power density.

[0123] In the embodiment, the lens units 103 are plano-convex lenses, and the convex side is a spherical or aspherical surface. The thickness of the central region of the plano-convex lens is greater than the thickness of the edge region, and the refraction of light can collimate the emitted light beams.

[0124] In the embodiment, the camber height of the plano-convex lens is 1 micrometer to 10 micrometers.

[0125] In the embodiment, the lens units 103 correspond to the light emitting units 101 one by one, so that each lens unit 103 collimates the emission light beam provided by a unique light emitting unit 101. Compared with the case of using a large-aperture lens to collimate the emission light beam, the effect of using the corresponding lens unit 103 to collimate the emission light beam provided by a unique light emitting unit 101 is better, which is conducive to reducing the equivalent light emitting surface and improving the power density. After using a single large-aperture plano-convex lens, the overall light emitting region of the light emitting chip 100 (including the interval between the light emitting units) is the light emitting surface, and the overall light emitting region of the light emitting units 101 (excluding the interval between the light emitting units) is the equivalent light emitting surface in the embodiment. Therefore, the equivalent light emitting surface is reduced, and the power density is improved under the same output power.

[0126] Specifically, the step of arranging the collimating device 102 includes selecting the lens units 103 corresponding to the arrangement shape of the light emitting units 101 of the light emitting chip 100.

[0127] According to the arrangement shape of the light emitting units of the light emitting chip 100, the lens units 103 corresponding to the arrangement shape are selected, which means that the arrangement shape of the lens units 103 is the same as the arrangement shape of the light emitting units 101. Specifically, taking the plane of the light emitting surface of the light emitting device as the projection plane, the arrangement shape of the lens units 103 refers to the projection shape of each lens unit 103 on the light emitting surface. The arrangement shape of the light emitting units 101 refers to the shape formed by the light emitting surfaces of the light emitting units 101 adjacent to each light emitting unit 101 on the periphery of the light emitting unit 101 (see the hexagon in FIG. 6). Figure 15 When the light emitting chip 100 works, the emission light beams emitted by the light emitting units 101 can pass through the corresponding lens units 103 in a larger proportion, which is conducive to improving the utilization rate of the emission light beams and improving the emission power density.

[0128] In the embodiment, the arrangement shape of the light emitting units 101 is a hexagon, and the arrangement shape of the lens units 103 is also a hexagon, that is, the projection shape of each lens unit on the light emitting surface is a hexagon. The hexagon is easy to arrange densely. In other embodiments, the arrangement shape of the light emitting units is a quadrilateral, and the arrangement shape of the lens units is also a quadrilateral. The quadrilateral can also be arranged densely.

[0129] The step of forming the lens units 103 includes providing a substrate 105, forming a process layer 109 on the substrate 105, and forming the lens units 103 on the process layer 109. Figure 12 As shown in FIG. 6, the lens units 103 are arranged on the process layer 109. Figure 13 and Figure 14 As shown in FIG. 6, the lens units 103 are arranged on the process layer 109.Figure 14 To Figure 13 At the section view at AA, the process layer 109 is processed by using an imprint process to form the plurality of lens units 103 in the process layer 109.

[0130] The substrate 105 provides a base for the process layer.

[0131] In this embodiment, the substrate 105 has a light transmission property, and specifically, the material of the substrate 105 includes glass. The thickness of the substrate 105 is in the order of 200 microns to 500 microns.

[0132] In this embodiment, the process layer 109 is formed on the substrate 105 by using a coating process.

[0133] In this embodiment, the material of the process layer 109 includes ultraviolet glue.

[0134] In this embodiment, the process layer 109 is formed on the entire substrate 105 in the step of forming the process layer 109 on the substrate 105. In other embodiments, the process layer can also be formed only on the area of the substrate 105 where the lens units are to be formed.

[0135] In the process of processing the process layer 109 by using the imprint process, the process layer 109 is processed by using a lens mold.

[0136] In this embodiment, the imprint process includes a nanolithography process.

[0137] The step of setting the collimating device 102 further includes: after the lens units 103 are formed, forming an anti-reflection film on one or both of the convex surface and the flat surface of the plano-convex lens, the anti-reflection film being used to improve the transmittance of the emitted light beam.

[0138] The step of setting the collimating device 102 further includes: aligning the lens units 103 with the light emitting units 101.

[0139] Aligning the lens units 103 with the light emitting units 101 allows the emitted light beam provided by the light emitting units 101 to be able to pass through the lens units 103 when the light emitting device is in operation, and prepares for the subsequent fixation of the lens units 103 and the light emitting units 101.

[0140] In the process of aligning the lens units 103 with the light emitting units 101, the relative positional relationship between the plurality of lens units 103 in the substrate 105 and the light emitting units 101 in the base 104 is adjusted by adjusting the positions of the substrate 105 and the base 104, so that the lens units 104 and the light emitting units 101 are in an aligned state.

[0141] In this embodiment, the step of aligning the light-emitting unit 101 with the lens unit 103 includes: under a microscope, making the image of the light-emitting unit 101 correspond to the image of the lens unit 103; or, in the step of providing the light-emitting chip 100, the base 104 has a first alignment mark (Mark); in the step of providing the collimating unit 102, the substrate 105 has a second alignment mark (Mark); in the step of aligning the light-emitting unit 101 with the lens unit 103, the first alignment mark and the second alignment mark coincide with each other; or, the step of aligning the light-emitting unit 101 with the lens unit 103 includes: judging based on the spot shape of the emission light beams of multiple emission units 101 after passing through the collimating device 102, and adjusting so that the spot shape is the same as the standard shape.

[0142] It should be noted that during the step of aligning the lens unit 103 with the light-emitting unit 101, the substrate 105 exposes the first electrode 107 on the light-emitting chip 100, facilitating electrical connection between the first electrode 107 and the first pad (e.g., anode pad) on the base 104. In other embodiments, the substrate exposes the electrode on the light-emitting chip to facilitate electrical connection between the electrode and other components.

[0143] like Figure 15 and Figure 16 As shown, Figure 16 for Figure 15 In the cross-sectional view at BB, the step of disposing the collimating device 102 further includes: fixing the positions of the collimating device 102 and the light-emitting chip 100 .

[0144] The positions of the collimating device 102 and the light emitting chip 100 are fixed. Specifically, the positions of the lens unit 103 in the collimating device 102 and the light emitting unit 101 in the light emitting chip 100 are fixed.

[0145] In this embodiment, the step of fixing the positions of the collimating device 102 and the light emitting chip 100 includes: fixing the substrate 105 on the base 104 by applying curing glue 106 , and the lens units 103 correspond to the light emitting units 101 one by one.

[0146] The curing glue 106 fixes the substrate 105 and the base 104 together. The curing glue 105 is located between the substrate 105 and the base 104. The thickness of the curing glue 105 controls the interval between the lens unit 103 and the light-emitting unit 101. The interval meets the working distance of the lens unit 103, so that the lens unit 103 can collimate the emission light beam provided by the light-emitting unit 101.

[0147] In the embodiment, when the cured adhesive 106 fixes the substrate 105 and the base 104 together, the lens units 103 are spaced apart from the light emitting units 101 in the light path.

[0148] In the embodiment, the cured adhesive 106 comprises ultraviolet adhesive.

[0149] In the embodiment, the material of the process layer comprises ultraviolet adhesive, and the material of the cured adhesive 106 comprises ultraviolet adhesive. The ultraviolet adhesive used by the process layer and the cured adhesive 106 has similar thermal expansion coefficients.

[0150] It should be further noted that the ultraviolet adhesive used by the process layer is transparent and has similar refractive index to the substrate 105, while the ultraviolet adhesive used by the cured adhesive 106 can be transparent or non-transparent.

[0151] Preferably, when the cured adhesive 106 is used to fix the substrate 105 and the base 104 together, the convex surfaces of the lens units 103 on the substrate 105 are directed downward (i.e. toward the light emitting chip 100).

[0152] In the embodiment, when the process layer is only located on the region of the substrate 105 where the lens units 103 are to be formed, the cured adhesive 106 is directly in contact with the substrate 105. In other embodiments, the process layer is located on the entire surface of the substrate, and the cured adhesive is used to fix the substrate and the base together, specifically, the cured adhesive is used to fix the process layer and the base together.

[0153] In the embodiment, the distance d1 (as shown in Figure 15 ) between the centers of adjacent light emitting units 101 is equal to the inner diameter d2 (as shown in Figure 15 ) of the lens units 103, which is beneficial to densely arrange the lens units 103, so that there is no gap between adjacent lens units 103. When the light emitting chip 100 is working, the emitted light beam provided by the light emitting unit 101 does not pass through the gap between adjacent lens units 103, so that the utilization rate of the emitted light beam is high, which is beneficial to improve the emission power density.

[0154] It should be noted that, as an example, in the step of providing the light emitting chip 100, the number of the light emitting chip 100 is multiple; the step of arranging the collimating device 102 further comprises: the light emitting chip 100 and the collimating device 102 correspond one by one, and a pair of light emitting chip 100 and collimating device 102 constitute a packaging structure, and the multiple packaging structures in the light emitting device are arranged in an array. According to the requirement of the collimated light beam, the packaging structure can be linearly arranged in a direction, and when the light emitting device is working, multiple spaced apart emitted lights can be provided in a direction.

[0155] As an example, the number of the encapsulation structures is 7 in an extending direction. In other embodiments, the number of the encapsulation structures can be more than 7 or less than 7.

[0156] It should be noted that, as another example, in the step of providing the light emitting chips 100, the number of the light emitting chips 100 is multiple; the step of providing the collimating device 102 further comprises that one of the collimating devices 102 comprises one substrate 105 and the multiple lens units 103 which are discrete on the substrate 105, and each of the multiple lens units 103 corresponds to one of the light emitting chips 100, and the light emitting chips 100 are arranged in an array. According to the requirement of the collimated light beam, the light emitting chips 100 can be linearly arranged in one direction, and when the light emitting device is working, multiple spaced emission lights can be provided in one direction.

[0157] In an extending direction, the number of the multiple light emitting chips 100 is 7, and the substrate 105 of the collimating device 102 is formed with 7 multiple spaced lens units 103. In other embodiments, the number of the light emitting chips 100 can be more than 7 or less than 7.

[0158] Reference Figure 17 and Figure 18 The second embodiment of the method for forming the light emitting device of the present application will be described in detail.

[0159] The same parts of the embodiment of the method for forming the light emitting device of the present application as the first embodiment will not be described again, and the different parts are as follows:

[0160] As shown in Figure 17 , the step of providing the light emitting chips 200 comprises providing a substrate 204 and multiple side walls 208 on the substrate 204, the side walls 208 and the substrate 204 form a groove 209, and the light emitting chips 200 are arranged on the substrate 204 at the bottom of the groove 209.

[0161] In the embodiment, the side walls 208 are formed on the substrate 204 by an adhesive process. In other embodiments, the side walls and the substrate can also be an integral structure.

[0162] As shown in Figure 18 , the step of fixing the position of the collimating device comprises covering the substrate 205 on the groove 209, so that the lens units correspond to the light emitting units in the groove 209 one by one.

[0163] The side wall 208 is located on the substrate 204, and the top of the side wall 208 is a certain distance from the light emitting chip 200 in the direction of the normal to the surface of the substrate 204. The substrate 205 covers the recess 209, and the substrate 205 is in contact with the top of the side wall 208. Accordingly, the lens unit is spaced apart from the light emitting unit in the light emitting chip 200, and the spacing between the lens unit and the light emitting unit is the working distance of the lens unit. By controlling the size (i.e. height) of the side wall 208 in the direction of the normal to the surface of the substrate 204, the spacing between the lens unit and the light emitting unit can be adjusted, thereby collimating the emitted light beam provided by the light emitting unit.

[0164] In this embodiment, the substrate 205 is fixed to the top of the side wall 208 by soldering. For example, the soldering includes gold plating soldering. In other embodiments, the substrate 205 can also be fixed to the top of the side wall by gluing, for example, the gluing includes the method of applying ultraviolet glue by dotting.

[0165] Reference Figure 19 and Figure 20 A third embodiment of the method for forming the light emitting device of the present application will be described in detail.

[0166] The embodiments of the method for forming the light emitting device of the present application are the same as the first embodiment, and the differences are as follows:

[0167] As shown in Figure 19 , in the step of providing the substrate 304, the substrate 304 includes a light emitting region and a peripheral region located around the light emitting region. The light emitting chip 300 is arranged in the light emitting region of the substrate 304.

[0168] The light emitting region of the substrate 304 defines the arrangement area of the light emitting chip 300, and the peripheral region defines the arrangement area of the pad 308.

[0169] As shown in Figure 20 , the step of fixing the position of the collimating device includes fixing the pad 308 in the peripheral region of the substrate 304, and fixing the substrate 305 to the pad 308 by the fixing member 309, so that the lens unit corresponds to the light emitting unit one by one.

[0170] In the embodiment, the cushion block 308 is fixed on the peripheral area of the substrate 304, the cushion block 308 has a certain height in the direction of the normal line of the surface of the substrate 304, the substrate 305 is fixed on the cushion block 308 through the fixing member, the substrate 305 is kept spaced from the substrate 304 under the support of the fixing member and the cushion block 308, so that the lens unit 303 on the substrate 305 is kept spaced from the light emitting unit 301 on the substrate 304, the interval between the lens unit 303 and the light emitting unit 301 can be adjusted by controlling the size of the fixing member and the cushion block 308 in the normal line of the surface of the substrate 304, and the collimation of the emitted light beam provided by the light emitting unit 301 is realized.

[0171] It should be noted that the height of the cushion block 308 is less than the working distance (the working distance refers to the focal length of the plano-convex lens) of the lens unit 303, because the height of the dispensing is limited, the height of the cushion block 308 and the thickness of the fixing member can make the embodiment applicable to the packaging of the laser with long working distance.

[0172] In the embodiment, the substrate 305 and the cushion block 308 are fixed and connected by the ultraviolet glue dispensing. In other embodiments, the substrate and the cushion block can also be fixed and connected by welding. In the embodiment, the cushion block 308 includes a ceramic cushion block. The cushion block 308 can also be a cushion block made of other materials, such as a quartz cushion block.

[0173] Reference Figure 21 and Figure 22 The fourth embodiment of the method for forming the light emitting device of the present application will be described in detail.

[0174] The same parts of the embodiment of the method for forming the light emitting device as the first embodiment will not be described here, and the different parts are as follows:

[0175] The step of setting the collimation device includes: as shown in Figure 21 forming a process layer 406 covering the plurality of light emitting units 401.

[0176] In the embodiment, the step of forming the process layer 406 includes: forming a process material layer on the light emitting chip 400, the process material layer covers the light emitting unit 401, and the process material layer is patterned to make the shape of the process layer same as the arrangement shape of the plurality of light emitting units 401.

[0177] In the embodiment, the material of the process layer 406 includes ultraviolet glue. In other embodiments, the material of the process layer can also be resin.

[0178] As shown in Figure 22As shown, the process layer 406 is processed by an embossing process to form a plurality of lens units 403 in the process layer 406 , and the lens units 403 correspond to the light-emitting units 401 one by one.

[0179] In an embodiment of the present invention, the process layer 406 covers a plurality of light-emitting units 401. The process layer 406 keeps the lens unit located on the process layer 406 spaced apart from the light-emitting unit 401 on the light-emitting chip 400. The size of the process layer 406 in the normal direction of the surface of the light-emitting chip 400 is set according to the working distance of the plano-convex lens in the lens unit. Therefore, when the light-emitting device is working, the emission light beam provided by the light-emitting unit 401 can be collimated by refraction through the lens unit.

[0180] In this embodiment, the lens unit 403 is formed on a surface of the process layer 406 facing away from the light emitting chip 400 .

[0181] In this embodiment, the process layer 406 is in contact with the light emitting unit 401 .

[0182] It should be noted that the process layer 406 exposes the electrodes to facilitate electrical connection between the electrodes and peripheral circuits or other components.

[0183] Combined with reference Figures 23 to 25 , a fifth embodiment of the method for forming a light-emitting device of the present invention is described in detail.

[0184] The similarities between the embodiment of the method for forming a light emitting device and the first embodiment are not repeated here. The differences are as follows:

[0185] like Figure 23 As shown, the step of providing the light-emitting chip includes: providing a device wafer 50 , wherein the device wafer 50 includes a plurality of spaced-apart light-emitting areas, and each light-emitting area is formed with the plurality of light-emitting units 501 .

[0186] The light emitting area defines a formation area for subsequent process layers.

[0187] like Figure 24 As shown, the steps of forming the collimating device include: forming a process layer 502 covering the device wafer 50 , processing the process layer 502 by an imprinting process, and forming lens units 503 corresponding to the light emitting units 501 in the process layer 502 .

[0188] In the embodiment, the step of forming the process layer 502 includes: forming a process material layer on the device wafer 50, the process material layer covering the light emitting units 501, and patterning the process material layer to make the shape of the process layer same as the arrangement shape of the plurality of light emitting units 501. In the embodiment, the material of the process layer 502 includes ultraviolet glue.

[0189] As shown in Figure 25 , the process layer 502 is processed by using an imprint process to form a lens unit 503 corresponding to each of the light emitting units 501 in the process layer 502. In the embodiment, the lens unit 503 is formed on the surface of the process layer 502 away from the light emitting units 501.

[0190] After the collimation device is formed, the device wafer 50 is cut.

[0191] After the device wafer 50 is separated, a plurality of the packaging structures are obtained. In the embodiment, the process layer 502 is formed on the device wafer 50, the lens unit 503 is formed in the process layer 502, and the device wafer 50 is cut. The packaging structure formed after the cutting does not need to be packaged again, and can be directly used by using a chip mounter, which greatly improves the use efficiency of the packaging structure and avoids the process of aligning the lens unit 503 with the light emitting unit 501.

[0192] It should be noted that the lens unit in the above-mentioned embodiments can also compress the divergence angle of the light emitting unit to a certain extent, rather than completely collimate, which is also within the protection scope of the present application.

[0193] In order to solve the technical problem, the present application also provides a laser radar, which comprises the light emitting device.

[0194] The laser radar emits an emission beam by using the light emitting device. The light emitting device comprises a light emitting chip and a collimation device downstream of the light emitting chip. The light emitting unit in the light emitting chip is used to provide the emission beam. The lens unit in the collimation device corresponds to each of the light emitting units. The lens unit is used to collimate the emission beam provided by the light emitting unit, so that the emission angle of the emission beam after passing through the lens unit is reduced, and the emission power density is improved. In addition, because the arrangement shape of the lens unit corresponds to the arrangement shape of the plurality of light emitting units, a large proportion of the emission beam provided by the light emitting unit can pass through the lens unit, the utilization rate of the emission beam is improved, the emission power density is improved, and the detection distance of the laser radar is improved.

[0195] In addition, the multiple lens units are arranged in contact on a plane parallel to the light-emitting chip, that is, there is no gap between adjacent lens units. When the light-emitting chip is working, the emission light beam provided by the light-emitting unit does not leak from the gap between adjacent lens units. Almost all of the emission light beam provided by the emission unit can be collimated through the lens unit, so that the utilization rate of the emission light beam is high, which is beneficial to improving the emission power density and the detection distance of the laser radar.

[0196] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A light emitting device, characterized by, The application relates to a light emitting device, comprising: a light emitting chip, which is a vertical cavity surface emitting laser chip; the light emitting chip is fixed on a substrate; the light emitting chip comprises a plurality of light emitting units for providing emitting beams; a collimating device is arranged in the downstream light path of the light emitting units, and comprises a plurality of lens units corresponding to the light emitting units; the arrangement shape of the lens units corresponds to the arrangement shape of the light emitting units; the lens units are used for collimating the emitting beams of the light emitting units; the plurality of lens units are arranged in contact in a plane parallel to the light emitting chip; the collimating device further comprises a substrate, and the plurality of lens units are arranged on the substrate; the substrate is fixed on the substrate by curing glue, so that the lens units correspond to the light emitting units one by one; the distance between the centers of adjacent light emitting units is equal to the inner diameter of the lens units.

2. The light emitting device of claim 1, wherein The arrangement shape of the plurality of light emitting units is hexagonal, and the arrangement shape of the plurality of lens units is hexagonal. Alternatively, the arrangement shape of the plurality of light emitting units is quadrilateral, and the arrangement shape of the plurality of lens units is quadrilateral.

3. The light emitting device of claim 1, wherein The lens units are plano-convex lenses, and the convex side is a spherical surface or a non-spherical surface.

4. The light emitting device according to any one of claims 1 to 3, wherein The light emitting device further comprises a substrate and a plurality of side walls arranged on the substrate; the side walls and the substrate form a groove; the light emitting chip is arranged on the substrate at the bottom of the groove; the collimating device further comprises a substrate, and the plurality of lens units are arranged on the substrate; the substrate covers the groove, so that the lens units correspond to the light emitting units in the groove one by one.

5. The light emitting device of claim 4, wherein The substrate is fixed on the top of the side wall by welding or gluing.

6. The light emitting device of any of claims 1-3, wherein, The light emitting device further comprises a substrate, and the substrate comprises a light emitting area for arranging the light emitting chip and a peripheral area around the light emitting area; the light emitting device further comprises a cushion block fixed on the peripheral area of the substrate; the collimating device further comprises a substrate, and the plurality of lens units are arranged on the substrate; the substrate is fixed on the cushion block by a fixing member.

7. The light emitting device of claim 6, wherein the first and second light emitting devices are arranged in a vertical stack. The cushion block is a ceramic cushion block.

8. The light emitting device of claim 1, wherein The number of the light emitting chips and the collimating devices is plural; the light emitting chips and the collimating devices correspond to each other to form a packaging structure; and the plurality of packaging structures are arranged in an array in the light emitting device.

9. The light emitting device of any of claims 1-3, wherein, The collimating device comprises a process layer covering the plurality of light emitting units, and the plurality of lens units are formed in the process layer.

10. A method for forming a light emitting device, comprising: The application relates to a light emitting device, comprising: a light emitting chip, which is a vertical cavity surface emitting laser chip; the light emitting chip is fixed on a substrate; the light emitting chip comprises a plurality of light emitting units for providing emitting beams; the light emitting chip is arranged on the substrate; a collimating device is arranged in the downstream light path of the light emitting units; the collimating device comprises a plurality of lens units corresponding to the light emitting units; the arrangement shape of the lens units corresponds to the arrangement shape of the light emitting units; the lens units are used for collimating the emitting beams of the light emitting units; and the plurality of lens units are arranged in contact in a plane parallel to the substrate. The step of setting the collimating device further comprises: providing a substrate; fixing the substrate on the base by spot curing glue, the lens units corresponding to the light emitting units one by one; The interval between the centers of adjacent light emitting units is equal to the inner diameter of the lens units.

11. The formation method of claim 10, wherein, The step of setting the collimating device comprises: selecting lens units corresponding to the arrangement shape of the light emitting units of the light emitting chip according to the arrangement shape of the light emitting units; aligning the lens units with the light emitting units; fixing the position of the collimating device with the light emitting chip.

12. The formation method of claim 11, wherein, The step of setting the collimating device further comprises: forming a process layer on the substrate, processing the process layer by using an imprint process to form the lens units in the process layer.

13. The formation method of claim 12, wherein, The imprint process comprises a nano-imprint process.

14. The formation method of claim 12, wherein, The step of providing the light emitting chip further comprises: providing a base and a plurality of side walls on the base, the side walls and the base enclosing a groove; The light emitting chip is arranged on the base at the bottom of the groove; The step of fixing the position of the collimating device comprises: covering the substrate on the groove so that the lens units correspond to the light emitting units in the groove one by one.

15. The method of forming according to claim 14, wherein, The substrate is fixed on the top of the side walls by welding or gluing.

16. The formation process of claim 12, wherein, The method of forming the light emitting device further comprises: providing a base, the base comprising a light emitting area and a peripheral area surrounding the light emitting area, and arranging the light emitting chip on the light emitting area of the base; the step of fixing the position of the collimating device comprises: fixing a pad on the peripheral area of the base, and fixing the substrate on the pad by the fixing member so that the lens units correspond to the light emitting units one by one.

17. The formation process of claim 16 wherein, The substrate is fixed on the pad by gluing or welding.

18. The formation process of claim 10 wherein, The step of setting the collimating device comprises: forming a process layer covering the light emitting units; The process layer is processed by using an imprint process to form the lens units in the process layer, the lens units corresponding to the light emitting units one by one.

19. The method of forming according to claim 18, wherein, The step of providing the light emitting chip comprises: providing a device wafer, the device wafer comprising a plurality of spaced-apart light emitting areas, and the light emitting units are formed in each of the light emitting areas; The step of forming the collimating device comprises: forming a process layer covering the device wafer, and processing the process layer by using an imprint process to form the lens units corresponding to the light emitting units in the process layer; After the collimating device is formed, the device wafer is cut.

20. The formation process of claim 10 wherein, In the step of providing the light emitting chip, the number of the light emitting chips is a plurality; The step of setting the collimating device further comprises: corresponding the light emitting chip and the collimating device to form a package structure; and arranging the plurality of package structures in the light emitting device in an array.

21. A lidar, comprising: The light emitting device comprises: The light emitting device according to any one of claims 1 to 9.

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