Substrate processing system and method of operation thereof

Abstract

A substrate processing system and a working method thereof, wherein the substrate processing system comprises a transfer chamber, a process chamber, the transfer chamber and the process chamber are arranged along a first direction, the process chamber is provided with a first pedestal unit and a second pedestal unit, the first pedestal unit and the second pedestal unit are arranged along the first direction, the first pedestal unit comprises at least one first pedestal, the second pedestal unit comprises at least one second pedestal, the first pedestal is used for carrying a first substrate, and the second pedestal is used for carrying a second substrate; a robot device is arranged in the transfer chamber and has a first working position and a second working position, the robot device is used for transferring the first substrate when being at the first working position, the robot device is used for transferring the second substrate when being at the second working position, and the positions of the first pedestal and the second pedestal do not change when the robot device is transferring the first substrate and the second substrate. The substrate processing system has good stability in operation of the process chamber.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and more particularly to a substrate processing system and its operating method. Background Technology

[0002] Existing substrate processing systems are typically vacuum cluster devices, which include a front-end module, a load lock, a transfer chamber, and a process chamber surrounding the transfer chamber. A robotic arm is installed within the transfer chamber. This robotic arm removes the substrate from the load lock and places it into one of the process chambers. Within the process chamber, the substrate's surface is processed. After surface processing, the robotic arm removes the processed substrate from the process chamber and transports it to the external atmospheric environment.

[0003] Typically, multiple substrates are placed within the process cavity. To enable the transfer of each substrate, an additional drive device is required within the process cavity to rotate the substrate to be transferred closer to the robotic arm. However, the inclusion of this drive device complicates the design of the process cavity and results in poor operational stability. Summary of the Invention

[0004] The technical problem solved by this invention is to provide a substrate processing system and its working method, so that no complex driving device is added inside the process cavity, thereby reducing the stability of operation inside the process cavity and reducing the design difficulty.

[0005] To address the aforementioned technical problems, the present invention provides a substrate processing system, comprising: a transmission cavity; a process cavity, wherein the transmission cavity and the process cavity are arranged along a first direction, and the process cavity is provided with a first base unit and a second base unit, the first base unit and the second base unit being arranged along the first direction, the first base unit including at least one first base, the second base unit including at least one second base, the first base being used to support a first substrate, and the second base being used to support a second substrate; and a robotic arm device disposed within the transmission cavity, having a first working position and a second working position, wherein the robotic arm device is used to transmit the first substrate in the first working position, and the robotic arm device is used to transmit the second substrate in the second working position, wherein the positions of the first base and the second base do not change when the robotic arm device transmits the first substrate and the second substrate.

[0006] Optionally, the robotic arm device includes a first robotic arm assembly and a second robotic arm assembly, wherein the first robotic arm assembly is used to transfer a first substrate and the second robotic arm assembly is used to transfer a second substrate.

[0007] Optionally, when the first base unit includes one first base, or when the first base unit includes multiple first bases and the multiple first bases are arranged along a first direction, the first robotic arm assembly has one first robotic arm; when the second base unit includes one second base, or when the second base unit includes multiple second bases and the multiple second bases are arranged along a first direction, the second robotic arm assembly has one second robotic arm.

[0008] Optionally, when the first base unit includes two or more first bases, and a portion of the first bases are arranged along a second direction perpendicular to the first direction, the number of first robotic arms in the first robotic arm assembly is the same as the number of first bases in the second direction, and one first robotic arm is used to transfer one first substrate in the first direction; when the second base unit includes two or more second bases, and a portion of the second bases are arranged along a second direction perpendicular to the first direction, the number of second robotic arms in the second robotic arm assembly is the same as the number of second bases in the second direction, and one second robotic arm is used to transfer one second substrate in the first direction.

[0009] Optionally, along the second direction, when the first base unit includes two first bases and the second base unit includes two second bases, the robotic arm device includes: a first large arm, a second large arm, a first small arm, a second small arm, a pair of first robotic arms, a pair of second robotic arms, and a rotating shaft. One end of the first large arm and the second large arm are overlapped and connected to the top of the rotating shaft via a first movable shaft. The first large arm and the second large arm can rotate along the first movable shaft. The other end of the first large arm is connected to one end of the first small arm via a second movable shaft. The other end of the first small arm is connected to the pair of first robotic arms. The other end of the second large arm is connected to one end of the second small arm. The other end of the second small arm is connected to the pair of second robotic arms. The first small arm rotates along the second movable shaft, allowing the first robotic arms and the second robotic arms to be stacked vertically, with the first robotic arms and the second robotic arms located between the first small arm and the second small arm.

[0010] Optionally, the lengths of the first upper arm and the first lower arm may be equal or unequal; the lengths of the second upper arm and the second lower arm may be equal or unequal.

[0011] Optionally, it may also include a drive mechanism for positioning the robotic arm in a first working position or a second working position.

[0012] Optionally, the number of robotic arms is one, and when the robotic arm switches between the first working position and the second working position, the driving device drives the robotic arm to move up and down.

[0013] Optionally, there may be multiple process cavities surrounding the transmission cavity, and each process cavity may contain the first base and the second base.

[0014] Optionally, it also includes: a substrate loading and unloading machine, a front-end module of the equipment, and an airlock chamber. The two sides of the front-end module of the equipment are respectively connected to the substrate loading and unloading machine and the airlock chamber, and the two sides of the airlock chamber are respectively connected to the front-end module of the equipment and the transmission cavity.

[0015] Accordingly, the present invention also provides a method for operating a substrate processing system, comprising: providing the substrate processing system described in any of the above claims; placing the robotic arm device in a first working position and using the robotic arm device to transfer a first substrate; placing the robotic arm device in a second working position and using the robotic arm device to transfer a second substrate.

[0016] Optionally, the method for placing the first substrate and the second substrate includes: placing the robotic arm device in a second working position and placing the second substrate using the robotic arm device; after placing the second substrate, placing the robotic arm device in a first working position and placing the first substrate using the robotic arm device.

[0017] Optionally, the method for removing the substrate and the second substrate includes: placing the robotic arm device in a first working position and using the robotic arm device to remove the first substrate; after removing the first substrate, placing the robotic arm device in a second working position and using the robotic arm device to remove the second substrate.

[0018] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0019] In the substrate processing system provided by this invention, the robotic arm has a first working position and a second working position. In the first working position, the robotic arm is used to transfer a first substrate, and in the second working position, it is used to transfer a second substrate. Therefore, during transfer, the first or second substrate does not need to rotate from its original position to bring it closer to the robotic arm, thus achieving the transfer of the first and second substrates. Since no additional drive mechanism is required within the process cavity, the operational stability of the process cavity is not affected by the drive mechanism, thereby improving the stability of the process cavity. Furthermore, it also reduces the design complexity of the process cavity. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a substrate processing system in a waiting state according to the present invention;

[0021] Figure 2This is a schematic diagram of the structure of a substrate processing system of the present invention in its first working position;

[0022] Figure 3 This is a schematic diagram of the structure of a substrate processing system of the present invention in the second working position;

[0023] Figure 4 This is a flowchart of the substrate processing system of the present invention. Detailed Implementation

[0024] As described in the background section, the operational stability of the process cavity in existing substrate processing systems is poor. To address this technical problem, the present invention provides a substrate processing system in which a robotic arm device includes a first working position and a second working position. The robotic arm device is used to transfer a first substrate in the first working position and to transfer a second substrate in the second working position. Therefore, the positions of the first base and the second base do not need to be changed during the transfer of the first and second substrates, eliminating the need for an additional driving device within the process cavity. This improves the operational stability of the process cavity within the substrate processing system.

[0025] To make the above-mentioned objectives, features and beneficial effects of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the structure of a substrate processing system of the present invention in a waiting state.

[0027] Please refer to Figure 1 The substrate processing system includes a process cavity 100, a transmission cavity 101, and a gas lock cavity 102, wherein the process cavity 100 and the gas lock cavity 102 surround the transmission cavity 101.

[0028] The process module (PM) 100 is a vacuum environment used for semiconductor processing on the surface of the substrate.

[0029] In this embodiment, tungsten deposition is performed within the process chamber using low-pressure chemical vapor deposition (LPCVD). Each process chamber 100 contains four pedestals, each supporting one substrate. Adjacent pedestals are not isolated, and all four substrates undergo the same process. In other embodiments, the process performed within the process chamber may be other processes.

[0030] The transfer module (TM) 101 is a vacuum environment and contains a robotic arm for transferring a substrate from the transfer module 101 into one of the process cavities 100. There are multiple process cavities 100 surrounding the transfer module 101.

[0031] The loadlock 102 is used to switch between atmospheric and vacuum environments.

[0032] The substrate processing system further includes: an equipment front-end module (EFEM) 110 and a substrate loader (Loadport) 111. The equipment front-end module 110 is an atmospheric environment, and the substrate loader 111 is used to load substrates.

[0033] Please continue to refer to this. Figure 1 The transmission cavity 101 and the process cavity 100 are arranged along a first direction X. The process cavity 100 is provided with a first base unit 103 and a second base unit 104. The first base unit 103 and the second base unit 104 are arranged along the first direction X. The first base unit 103 includes at least one first base 103a, and the second base unit 104 includes at least one second base 104a. The first base 103a is used to support a first substrate, and the second base 104a is used to support a second substrate. A robotic arm device 105 is disposed in the transmission cavity 101 and has a first working position and a second working position. The robotic arm device 105 is used to transmit the first substrate in the first working position and to transmit the second substrate in the second working position. The positions of the first base 103a and the second base 104a do not change when the robotic arm device 105 transmits the first substrate and the second substrate.

[0034] To improve substrate processing efficiency, multiple bases are typically provided within the process cavity 100, each base supporting one substrate. Specifically, a first base 103a and a second base 104a are provided within the process cavity 100. The first base 103a and the second base 104a are arranged along a first direction X. Since the first base 103a is closer to the robotic arm device 105, transferring the first substrate on the first base 103a is relatively easy. However, the second base 104a is farther from the robotic arm device 105, making it relatively difficult to transfer the second substrate on the second base 104a.

[0035] The substrate processing system further includes a drive mechanism for switching the robotic arm device 105 between the first working position and the second working position.

[0036] Since the robotic arm device 105 has a first working position and a second working position, the first substrate or the second substrate does not need to rotate the original position of the first base 103a or the second base 104a during the transfer process to bring the first substrate or the second substrate closer to the robotic arm device 105, thus achieving the transfer of the first substrate and the second substrate. Since no additional drive mechanism is required within the process cavity 100, the operational stability of the process cavity 100 is not affected by the drive mechanism, thereby improving the stability of the process cavity 100. Furthermore, the elimination of the need for an additional drive mechanism within the process cavity 100 reduces the design complexity of the process cavity 100, lowers the difficulty of debugging the process cavity 100, and also helps to reduce the production cost of the process cavity 100 and save space in the process cavity 100.

[0037] In one embodiment, the robotic arm device 105 includes a telescopic arm and a robotic hand connected to the telescopic arm. When the telescopic arm extends by a first amount, the robotic arm device 105 is in a first working position, at which time the robotic arm device 105 is used to transfer a first substrate. When the telescopic arm extends by a second amount, which is greater than the first amount, the robotic arm device 105 is in a second working position, at which time the robotic arm device 105 is used to transfer a second substrate.

[0038] In another embodiment, the robotic arm device 105 includes a first robotic arm assembly and a second robotic arm assembly, wherein the first robotic arm assembly is used to transfer a first substrate and the second robotic arm assembly is used to transfer a second substrate.

[0039] Specifically, in one embodiment, when the first base unit 103 includes one first base 103a, the first robotic arm assembly has one first robotic arm, which can transfer the first substrate on the first base 103a in the first working position; when the first base unit 103 includes multiple first bases 103a, and the multiple first bases 103a are arranged along the first direction X, the first robotic arm assembly may also have only one first robotic arm, which can transfer multiple first substrates at once. Similarly, when the second base unit 104 includes one second base 104a, the second robotic arm assembly has one second robotic arm, which can transfer the second substrate on the second base 104a in the second working position; when the second base unit 104 includes multiple second bases 104a, and the multiple second bases 104a are arranged along the first direction X, the second robotic arm assembly may also have only one second robotic arm, which can transfer multiple second substrates at once.

[0040] In another embodiment, when the first base unit 103 includes two or more first bases 103a, and a portion of the first bases 103a are arranged along a second direction Y perpendicular to the first direction X, the number of first robotic arms in the first robotic arm assembly is the same as the number of first bases 103a in the second direction Y. Thus, one first robotic arm can transmit one first substrate in the first direction X. In other words, when there are multiple first substrates in the first direction X, one first robotic arm can transmit multiple first substrates in the first direction X at once. Similarly, when the second base unit 104 includes two or more second bases 104a, and a portion of the second bases 104a are arranged along a second direction Y perpendicular to the first direction X, the number of second robotic arms in the second robotic arm assembly is the same as the number of second bases 104a in the second direction. Thus, one second robotic arm can transmit one second substrate in the first direction X. In other words, when there are multiple second substrates in the first direction X, one second robotic arm can transmit multiple second substrates in the first direction X at once.

[0041] In one embodiment, the number of robotic arms is one, and when the robotic arm switches between a first working position and a second working position, the driving device drives the robotic arm to move up and down.

[0042] The following uses a robotic arm device as an example to illustrate how to achieve the transmission of the first substrate and the second substrate without rotating the first base 103a and the second base 104a.

[0043] Figure 2 This is a schematic diagram of the structure of a substrate processing system of the present invention in its first working position.

[0044] Please refer to Figure 2The robotic arm device 105 includes: a first large arm 200, a second large arm 201, a first small arm 202, a second small arm 203, a pair of first robotic arms 204, a pair of second robotic arms 205, and a rotating shaft 206. One end of the first large arm 200 and the second large arm 201 are overlapped and connected to the top of the rotating shaft 206 via a first movable shaft. The first large arm 200 and the second large arm 201 can rotate along the first movable shaft. The other end of the first large arm 200 is connected to the first small arm via a second movable shaft. One end of the first forearm 202 is connected to the other end of the pair of first robotic arms 204, the other end of the second large arm 201 is connected to one end of the second forearm 203, and the other end of the second forearm 203 is connected to the pair of second robotic arms 205. The first forearm 203 rotates along the second movable axis, so that the first robotic arms 204 and the second robotic arms 205 are stacked on top of each other, and the first robotic arms 204 and the second robotic arms 205 are located between the first forearm 202 and the second forearm 203.

[0045] Rotate the first large arm 200 and the second large arm 201. The second large arm 201 drives the second small arm 203. The second small arm extends the second robotic arm 205. The second robotic arm 205 is used to place or unload the second substrate on the second base 104a.

[0046] In one embodiment, the first large arm 200 and the second large arm 201 can rotate along the first movable axis, and during the rotation, the included angle between the first large arm 200 and the second arm 201 remains unchanged, so that when the first robotic arm 204 rotates, the second robotic arm 205 also rotates, and the first robotic arm 204 and the second robotic arm 205 can give way to each other.

[0047] In another embodiment, the first large arm 200 and the second large arm 201 can rotate along the first movable axis, and the included angle between the first large arm 200 and the second arm 201 can be variable during the rotation.

[0048] In addition, the lengths of the first large arm 200 and the first small arm 202 may be equal or unequal; similarly, the lengths of the second large arm 201 and the second small arm 203 may be equal or unequal.

[0049] Figure 3 This is a schematic diagram of the structure of a substrate processing system of the present invention in its second working position.

[0050] Please refer to Figure 3Rotate the first large arm 200 and the second large arm 201. The first large arm 200 drives the first small arm 202. The first small arm 202 extends the first robotic arm 204. The first robotic arm 204 is used to place or unload the first substrate on the second base 103a.

[0051] Figure 4 This is a flowchart of the substrate processing system of the present invention.

[0052] Please refer to Figure 4 Step S1: Provide the above-mentioned substrate processing system; Step S2: Place the robotic arm device in a first working position, the robotic arm device being used to transfer the first substrate; Step S3: Place the robotic arm device in a second working position, the robotic arm device being used to transfer the second substrate.

[0053] To transfer the first substrate and the second substrate onto the first base 103a and the second base 104a, the diagrams of the various stages of the robotic arm device 105 are as follows: Figure 1 , Figure 2 , Figure 3 Then returned to Figure 1 The location shown. Where Figure 1 The position is the standby position.

[0054] Accordingly, in order to transmit the first substrate and the second substrate placed on the first base 103a and the second base 104a, the diagrams of each stage of the robotic arm device 105 are as follows: Figure 1 , Figure 3 , Figure 2 Then returned to Figure 1 .in Figure 1 The position is the standby position.

[0055] Therefore, whether the substrate is being fed in or detached, the positions of the first base 103a and the second base 104a remain unchanged. The first substrate on the first base 103a and the second substrate on the second base 104a can be placed or removed simply by switching between the first and second working positions using the robotic arm 105. Since no additional driving device is needed within the process cavity 100 to adjust the positions of the first base 103a and the second base 104a, the stability of the process cavity 100 is not affected by the driving device. This improves the stability of the process cavity, reduces its manufacturing cost and complexity, and saves space.

[0056] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A substrate processing system, characterized in that, include: Transmission cavity; At least two process cavities are provided, the transfer cavity and the process cavity are arranged along a first direction, and a first base unit and a second base unit are provided in the process cavity. The first base unit and the second base unit are arranged along the first direction. The first base unit includes at least one first base, and the second base unit includes at least one second base. The first base is used to support a first substrate, and the second base is used to support a second substrate. A robotic arm device, disposed within the transmission cavity, has a first working position and a second working position. It includes a first robotic arm assembly and a second robotic arm assembly. The first robotic arm assembly includes a first large arm, a first small arm, and a first robotic hand. The second robotic arm assembly includes a second large arm, a second small arm, and a second robotic hand. One end of the first large arm and the second large arm are connected by a first movable shaft. The two ends of the first small arm are respectively connected to the other end of the first large arm and the first robotic hand. The two ends of the second small arm are respectively connected to the other end of the second large arm and the second robotic hand. In the first working position, the robotic arm device is used to transmit the first substrate. In the second working position, the robotic arm device is used to transmit the second substrate. When the first and second robotic hands are stacked vertically within the transmission cavity, their projections at the bottom of the transmission cavity completely overlap. Furthermore, the positions of the first and second bases do not change when the robotic arm device transmits the first and second substrates. The first and second large arms can rotate along the first movable shaft, and during rotation, the angle between the first and second large arms remains unchanged, allowing the second robotic hand to rotate as the first robotic hand rotates, enabling the first and second robotic hands to make way for each other.

2. The substrate processing system as described in claim 1, characterized in that, When the first base unit includes one first base, or when the first base unit includes multiple first bases and the multiple first bases are arranged along a first direction, the first robotic arm assembly has one first robotic arm; when the second base unit includes one second base, or when the second base unit includes multiple second bases and the multiple second bases are arranged along a first direction, the second robotic arm assembly has one second robotic arm.

3. The substrate processing system as described in claim 1, characterized in that, When the first base unit includes two or more first bases, and a portion of the first bases are arranged along a second direction perpendicular to the first direction, the first manipulator assembly has the same number of first manipulators as the number of first bases in the second direction, and one first manipulator is used to transfer one first substrate in the first direction. When the second base unit includes two or more second bases, and a portion of the second bases are arranged along a second direction perpendicular to the first direction, the second manipulator assembly has the same number of second manipulators as the number of second bases in the second direction, and one second manipulator is used to transfer one second substrate in the first direction.

4. The substrate processing system as described in claim 3, characterized in that, Along the second direction, when the first base unit includes two first bases and the second base unit includes two second bases, the first robotic arm assembly has a pair of first robotic arms and the second robotic arm assembly has a pair of second robotic arms. The robotic arm device further includes: a rotating shaft, one end of the first large arm and the second large arm are connected to the top of the rotating shaft by overlapping through the first movable shaft, the other end of the first large arm is connected to one end of the first small arm through a second movable shaft, the other end of the first small arm is connected to the pair of first robotic arms, the other end of the second large arm is connected to one end of the second small arm, and the other end of the second small arm is connected to the pair of second robotic arms. The first small arm rotates along the second movable shaft, so that the first robotic arms and the second robotic arms can be stacked vertically, and the first robotic arms and the second robotic arms are located between the first small arm and the second small arm.

5. The substrate processing system as described in claim 4, characterized in that, The lengths of the first upper arm and the first lower arm are equal or unequal; the lengths of the second upper arm and the second lower arm are equal or unequal.

6. The substrate processing system as described in claim 1, characterized in that, Also includes: A drive mechanism is used to position the robotic arm device in a first working position or a second working position.

7. The substrate processing system as described in claim 6, characterized in that, The number of robotic arms is one. When the robotic arm switches between the first working position and the second working position, the drive mechanism drives the robotic arm to move up and down.

8. The substrate processing system as described in claim 1, characterized in that, The number of process cavities is multiple, and the multiple process cavities surround the transmission cavity. Each process cavity is provided with the first base and the second base.

9. The substrate processing system as described in claim 1, characterized in that, Also includes: The equipment includes a substrate loading and unloading machine, a front-end module, and an airlock chamber. The two sides of the front-end module are connected to the substrate loading and unloading machine and the airlock chamber, respectively. The two sides of the airlock chamber are connected to the front-end module and the transmission chamber, respectively.

10. A method for operating a substrate processing system, characterized in that, include: Provide a substrate processing system as described in any one of claims 1 to 9; Position the robotic arm device in a first working position and use the robotic arm device to transfer the first substrate; The robotic arm is positioned in the second working position, and the second substrate is transferred using the robotic arm.

11. The method of operating the substrate processing system as described in claim 10, characterized in that, The method for placing the first substrate and the second substrate includes: placing the robotic arm device in a second working position and placing the second substrate using the robotic arm device; after placing the second substrate, placing the robotic arm device in a first working position and placing the first substrate using the robotic arm device.

12. The operating method of the substrate processing system as described in claim 10, characterized in that, The method for removing the substrate and the second substrate includes: placing the robotic arm device in a first working position and using the robotic arm device to remove the first substrate; after removing the first substrate, placing the robotic arm device in a second working position and using the robotic arm device to remove the second substrate.

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