Light-emitting substrate and display device

Abstract

A light-emitting substrate comprises a substrate, a reflective layer, at least one first alignment mark, a plurality of support columns and a plurality of light-emitting devices. The reflective layer is arranged on the substrate, and the reflective layer is provided with a plurality of openings and a plurality of mounting openings, and the plurality of openings include at least one first opening. A first alignment mark is arranged in the first opening. The orthographic projection of at least one support column on the substrate at least partially overlaps with the orthographic projection of the opening on the substrate. A plurality of light-emitting devices are arranged on the substrate, and the light-emitting devices are located in the mounting openings of the reflective layer.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate and a display device. Background Art

[0002] At present, many processes are required in the preparation process of micro-LED light panels, such as automated optical inspection (AOI), die bonding, rework and bonding.

[0003] In the above-mentioned multiple process steps, an alignment mark is provided on the substrate of the Mini LED light board, and the position accuracy of the mounting structure on the substrate is ensured by capturing the image of the alignment mark for alignment.

[0004] Public Content

[0005] On the one hand, a light-emitting substrate is provided. The light-emitting substrate includes a substrate, a reflective layer, at least one first alignment mark, a plurality of support columns and a plurality of light-emitting devices. The reflective layer is arranged on the substrate, and the reflective layer is provided with a plurality of openings and a plurality of mounting openings, and the plurality of openings include at least one first opening. A first alignment mark is arranged in the first opening. The orthographic projection of at least one support column on the substrate at least partially overlaps with the orthographic projection of the opening on the substrate. A plurality of light-emitting devices are arranged on the substrate, and the light-emitting devices are located in the mounting openings of the reflective layer.

[0006] In some embodiments, a fixing layer is disposed on the substrate, and the support column is fixedly connected to the substrate through the fixing layer.

[0007] In some embodiments, the plurality of support columns include at least one first support column and / or at least one second support column. The first support column includes a base disposed in the opening, and a first main body located on a side of the base away from the substrate and connected to the base. The second support column includes a second main body.

[0008] In some embodiments, the orthographic projection of the first support column on the substrate covers the orthographic projection of the corresponding opening on the substrate. The side of the base away from the first main body is the first bottom surface, the side of the base connected to the first main body is the first top surface, the side of the first main body connected to the base is the second bottom surface, and the orthographic projection of the second bottom surface on the substrate covers the orthographic projection of the first top surface on the substrate. The size of the base along the thickness direction of the substrate is less than or equal to the size of the opening along the thickness direction of the substrate.

[0009] In some embodiments, the first bottom surface is located in the fixed layer, and along the thickness direction of the substrate, the first bottom surface is located between a side of the reflective layer close to the substrate and a side away from the substrate. The second bottom surface abuts against a surface of the reflective layer away from the substrate. The orthographic projection of the second bottom surface on the substrate covers the orthographic projection of the corresponding opening on the substrate.

[0010] In some embodiments, the first main body includes a plurality of cross sections along a direction parallel to the plane where the substrate is located, and an area of ​​at least one cross section is greater than or equal to an area of ​​a cross section located on a side of the at least one cross section away from the substrate.

[0011] In some embodiments, along the thickness direction of the substrate and in the direction from the base to the first main body, the cross-sectional area of ​​the first main body along the direction parallel to the plane where the substrate is located gradually decreases.

[0012] In some embodiments, the orthographic projection of the base on the substrate is in the shape of a ring; or the base is in the shape of a column; or the base includes a plurality of protrusions extending from the second bottom surface toward the substrate.

[0013] In some embodiments, a surface of the second supporting column close to the substrate is fixedly connected to the substrate through the fixing layer.

[0014] In some embodiments, at least one groove is formed on a side of the second supporting column close to the substrate, and at least a portion of the fixing layer is located in the groove of the second supporting column.

[0015] In some embodiments, the orthographic projection of the groove on the substrate is in the shape of a circle; or a ring; or a plurality of arcs arranged at intervals.

[0016] In some embodiments, the second support column includes a plurality of cross sections along a direction parallel to the plane where the substrate is located, and an area of ​​at least one cross section is greater than or equal to an area of ​​a cross section located on a side of the at least one cross section away from the substrate.

[0017] In some embodiments, along the thickness direction of the substrate and in the direction from the substrate to the second supporting pillar, the cross-sectional area of ​​the second supporting pillar along the direction parallel to the plane where the substrate is located gradually decreases.

[0018] In some embodiments, the maximum distance between the outer boundary of the orthographic projection of the at least one support column on the substrate and the boundary of the orthographic projection of the opening on the substrate is D1; ​​the installation tolerance of the support column is A1; the radial dimension tolerance of the opening is A2; and the maximum allowable displacement of the support column is A3. Wherein, A1+A2≤D1≤A3.

[0019] In some embodiments, the substrate has a middle area and an edge area around the middle area, and the first opening is disposed in the edge area of ​​the substrate.

[0020] In some embodiments, the middle region has no opening, and the middle region is provided with the second supporting column, wherein the second supporting column is fixedly connected to a surface of the reflective layer away from the substrate through the fixing layer.

[0021] In some embodiments, the plurality of openings further include at least one second opening, and the first alignment mark is not disposed in the second opening. The middle area is provided with the second opening.

[0022] In some embodiments, the plurality of openings include a plurality of first openings, and a second alignment mark is disposed in at least one of the first openings. The second alignment mark is made of the same material as the reflective layer and is disposed in the same layer.

[0023] In some embodiments, the first opening without the second alignment mark is farther away from the center of the substrate than the first opening with the second alignment mark.

[0024] In some embodiments, the substrate includes a substrate, and a first conductive layer and / or a second conductive layer disposed on the substrate. The first alignment mark is disposed on the same layer as the first conductive layer. And / or, the first alignment mark is disposed on the same layer as the second conductive layer.

[0025] In some embodiments, the plurality of light emitting devices include a plurality of groups of light emitting devices, each group including at least two light emitting devices. Each group of light emitting devices is evenly arranged around the support column, and each light emitting device in each group of light emitting devices is substantially equidistant from the support column.

[0026] In some embodiments, the light-emitting substrate has a plurality of light-emitting areas, and the light-emitting areas are provided with at least one group of light-emitting devices. At least two light-emitting areas are spaced apart between the support column and the boundary of the substrate.

[0027] In some embodiments, the color of the fixed layer is substantially the same as the color of the reflective layer.

[0028] In some embodiments, the light emitting substrate further includes a plurality of reflective sub-layers, and the reflective sub-layers include compensation portions and protruding portions.

[0029] The compensation portion of at least one reflective sublayer is arranged on the inner wall of the opening, and the protrusion is arranged on the edge of the opening; and / or the compensation portion of at least one reflective sublayer is arranged on the inner wall of the installation opening, and the protrusion is arranged on the edge of the installation opening.

[0030] On the other hand, a display device is provided. The display device comprises a display panel, and a light-emitting substrate as described in any of the above embodiments and a plurality of optical films. The light-emitting substrate is arranged on a non-display side of the display panel, and the plurality of optical films are arranged between the light-emitting substrate and the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 is a top view of a light-emitting substrate according to some embodiments of the present disclosure;

[0033] Figure 2A for Figure 1 A cross-sectional view of the light-emitting substrate along QQ';

[0034] Figure 2B for Figure 2A A partial enlarged view of the M in the middle;

[0035] Figure 2C for Figure 2A A local enlarged view of the N position in the middle;

[0036] Figure 3 is a structural diagram of another light-emitting substrate according to some embodiments of the present disclosure;

[0037] Figure 4 is a structural diagram of another light-emitting substrate according to some embodiments of the present disclosure;

[0038] Figure 5A is a structural diagram of a first support column according to some embodiments of the present disclosure;

[0039] Figure 5B is a structural diagram of another first supporting column according to some embodiments of the present disclosure;

[0040] Figure 5C is a structural diagram of another first support column according to some embodiments of the present disclosure;

[0041] Figure 5D is a structural diagram of another first support column according to some embodiments of the present disclosure;

[0042] Fig. 6Ais a structural diagram of a second supporting column according to some embodiments of the present disclosure;

[0043] Figure 6B is a structural diagram of another second supporting column according to some embodiments of the present disclosure;

[0044] Figure 6C is a structural diagram of another second supporting column according to some embodiments of the present disclosure;

[0045] Fig. 7A is a structural diagram of another second supporting column according to some embodiments of the present disclosure;

[0046] Figure 7B is a structural diagram of another second supporting column according to some embodiments of the present disclosure;

[0047] Fig. 8A is a structural diagram of a reflective layer according to some embodiments of the present disclosure;

[0048] Figure 8B is a structural diagram of another reflective layer according to some embodiments of the present disclosure;

[0049] Figure 8C is a structural diagram of another reflective layer according to some embodiments of the present disclosure;

[0050] Fig. 9 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0051] Fig.10 is a flow chart of a method for preparing a light-emitting substrate according to some embodiments of the present disclosure;

[0052] Fig.11A A diagram showing steps for preparing a substrate according to some embodiments of the present disclosure;

[0053] Fig. 11B A diagram showing steps for preparing a reflective layer according to some embodiments of the present disclosure;

[0054] Fig. 11C A diagram showing steps for preparing a light-emitting device according to some embodiments of the present disclosure;

[0055] Fig.11D A diagram showing steps for preparing a support column according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0056] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0057] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0058] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0059] When describing some embodiments, the term "electrically connected" and its derivative expressions may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact.

[0060] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0061] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0062] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0063] As used herein, "approximately" includes the stated values ​​and averages that are within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0064] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0065] Some embodiments of the present disclosure provide a light-emitting substrate, such as Figure 1 and Figure 2A As shown, the light emitting substrate 100 includes a substrate 10 and a reflective layer 11 disposed on the substrate 10 .

[0066] At least a portion of the boundary of the reflective layer 11 overlaps with at least a portion of the boundary of the substrate 10 , and the reflective layer 11 is provided with a plurality of openings H and a plurality of mounting openings H3 , and the plurality of openings H include at least one first opening H1 .

[0067] It should be noted that Figure 1 and Figure 2A FIG. 4 shows a situation where a portion of the boundary of the reflective layer 11 overlaps with a portion of the boundary of the substrate 10. The substrate 10 may also have a portion of a functional area, such as Figure 1 and Figure 2C The illustrated region 16 of the bonding circuit board is a functional region where the reflective layer 11 is not provided.

[0068] Exemplarily, the color of the reflective layer 11 is white, so that the reflective layer 11 has a higher reflectivity.

[0069] For example, the shape of the orthographic projection of the opening H on the substrate 10 may be a circle, a triangle, a rectangle, or the like.

[0070] like Figure 2AAs shown, the light emitting substrate 100 further includes at least one first alignment mark 12 , and the first alignment mark 12 is disposed in the first opening H1 .

[0071] It can be understood that the first alignment mark 12 can be set at any position in the first opening H1. For example, the first alignment mark 12 can be set at the center of the first opening H1, or can be set at other positions in the first opening H1 except the center, to ensure that the first opening H1 exposes the first alignment mark 12, so as to facilitate the capture of the image of the first alignment mark 12 for alignment.

[0072] It should be noted that if Figure 2A As shown, the substrate 10 includes a substrate 101, and a driving circuit disposed on the substrate 101, the driving circuit includes a plurality of thin film transistors and a signal line, and the first alignment mark 12 can be made of the same material as any conductive pattern of the driving circuit and disposed in the same layer. For example, the first alignment mark 12 is made of the same material as the signal line in the driving circuit and disposed in the same layer, the signal line is provided with a hollow area, along the thickness direction Z of the substrate 10, the hollow area passes through the signal line, the first alignment mark 12 is disposed in the hollow area, and the first alignment mark 12 is insulated from the signal line.

[0073] Alternatively, any conductive pattern of the driving circuit is a laminated structure, and the first alignment mark 12 is also a laminated structure.

[0074] "Same layer" refers to a layer structure formed by using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0075] like Figure 2A As shown, the light-emitting substrate 100 further includes a plurality of support columns 13 , and an orthographic projection of at least one support column 13 on the substrate 10 at least partially overlaps with an orthographic projection of the opening H on the substrate 10 .

[0076] It should be noted that the color of the support column 13 can be selected as needed. For example, the color of the support column 13 can be white, so that the reflectivity of the support column 13 is close to the reflectivity of the reflective layer 11. For another example, the support column 13 can be transparent.

[0077] It can be understood that the display device includes multiple optical films arranged between the display panel and the light-emitting substrate 100, and multiple support columns 13 are used to support the multiple optical films, so that there is a light mixing distance between the reflective layer 11 in the light-emitting substrate 100 and the optical films, which can improve the light shadow produced by the light-emitting substrate 100 and improve the display quality of the display device.

[0078] The orthographic projection of the support column 13 on the substrate 10 may be completely overlapped with the orthographic projection of the opening H on the substrate 10 , or may be partially overlapped with the orthographic projection of the opening H on the substrate 10 . For example, the opening H is within the range of the support column 13 .

[0079] The different structural designs of the support column 13 depend on its different installation methods. The structure of the support column 13 will be described in conjunction with the installation method of the support column 13 later in this article.

[0080] like Figure 2A and Figure 2B As shown, the light-emitting substrate 100 further includes a plurality of light-emitting devices 14, which are arranged on the substrate 10, and the light-emitting devices 14 are located in the mounting opening H3 of the reflective layer 11. The light emitted by the light-emitting devices 14 is reflected by the reflective layer 11 to increase the light output of the light-emitting substrate 100 in the direction Z perpendicular to the plane where the substrate 10 is located, thereby improving the light output efficiency of the light-emitting substrate 100.

[0081] Understandably, Figure 2A In the cross-sectional view of the light-emitting substrate 100 along QQ' shown in FIG. 1 , the number of the light-emitting devices 14 should be the same as that of the light-emitting devices 14. Figure 1 The number of light emitting devices 14 in each row arranged along the direction X is the same.

[0082] It should be noted that the light emitting device 14 can be electrically connected to the driving circuit on the substrate 10 through the mounting opening H3 on the reflective layer 11, and the driving circuit drives the light emitting device 14 to emit light. Alternatively, the light emitting device 14 can be electrically connected to the signal line on the substrate 10 through the mounting opening H3 on the reflective layer 11, and the signal line is electrically connected to the driving integrated circuit (IC) for transmitting a voltage signal or a current signal from the driving integrated circuit to the light emitting device 14, so as to drive the light emitting device 14 to emit light.

[0083] In the related art, the alignment mark of the light-emitting substrate is set at the edge area of ​​the substrate, which increases the edge area of ​​the substrate, resulting in a wider frame of the display device installed with the light-emitting substrate, which is not conducive to the narrow frame design of the display device. If the edge area of ​​the substrate where the alignment mark is set is cut off by a cutting process after the alignment is completed, the cost of introducing the cutting process will increase.

[0084] Based on this, the light-emitting substrate 100 in the above embodiment of the present disclosure sets the first alignment mark 12 in the first opening H1 of the reflective layer 11, so that the substrate 10 does not need to be provided with an edge region, so that at least part of the boundary of the reflective layer 11 coincides with at least part of the boundary of the substrate 10, which is beneficial to the narrow frame design of the display device. In addition, since the substrate 10 does not have an edge region, the cost of cutting the edge region will not be increased.

[0085] In some embodiments, Figure 2A As shown, the substrate 10 includes a substrate 101 , and a first conductive layer 103 and / or a second conductive layer 106 disposed on the substrate 101 .

[0086] The first alignment mark 12 is disposed on the same layer as the first conductive layer 103 . And / or, the first alignment mark 12 is disposed on the same layer as the second conductive layer 106 .

[0087] Exemplarily, the substrate 10 includes a substrate 101 and a first conductive layer 103 disposed on the substrate 101 .

[0088] The first alignment mark 12 is disposed on the same layer as the first conductive layer 103 .

[0089] Exemplarily, the substrate 10 includes a substrate 101 and a second conductive layer 106 disposed on the substrate 101 .

[0090] The first alignment mark 12 is disposed on the same layer as the second conductive layer 106 .

[0091] For example, Figure 2A As shown, the substrate 10 includes a substrate 101, and a buffer layer 102, a first conductive layer 103, a first passivation layer 104, a first planar layer 105, a second conductive layer 106, a second passivation layer 107, and a second planar layer 108 sequentially stacked on the substrate 101, wherein the first conductive layer 103 and the second conductive layer 106 are used to form a conductive pattern of a driving circuit. The first alignment mark 12 can be formed by one of the first conductive layer 103 or the second conductive layer 106, or can be formed by both the first conductive layer 103 and the second conductive layer 106.

[0092] For example, the first alignment mark 12 may be formed by the second conductive layer 106 to reduce the distance between the first alignment mark 12 and the surface of the substrate 10, so that the image of the first alignment mark 12 collected from the surface of the substrate 10 is clearer, which is conducive to improving the alignment accuracy.

[0093] In some embodiments, Figure 2AAs shown, the substrate 101 of the substrate 10 may be a printed circuit board (PCB) or a glass substrate. Exemplarily, the thickness of the substrate 101 may range from 0.4 mm to 3 mm, for example, the thickness may be 0.4 mm, 1 mm, 1.5 mm, 2 mm or 3 mm.

[0094] In some embodiments, the preparation process of the first conductive layer 103 may include a magnetron sputtering process, such as Figure 2A and Figure 2B As shown, the first conductive layer 103 prepared by the magnetron sputtering process includes a first conductive sub-layer 103A and a second conductive sub-layer 103B.

[0095] The first conductive sublayer 103A may include copper. The second conductive sublayer 103B may include molybdenum-niobium alloy (MoNb), copper and molybdenum-niobium alloy stacked in sequence, the molybdenum-niobium alloy close to the substrate 101 plays an adhesion role, and the molybdenum-niobium alloy far from the substrate 101 plays an oxidation prevention role.

[0096] For example, the thickness of the molybdenum-niobium alloy of the second conductive sublayer 103B close to the substrate 101 may be in the range of For example, the thickness can be or The thickness of the molybdenum-niobium alloy of the second conductive sublayer 103B away from the substrate 101 may range from For example, the thickness can be or

[0097] In some embodiments, the preparation process of the first conductive layer 103 may also include an electroplating process. The first conductive layer 103 prepared by the electroplating process may include a first molybdenum nickel titanium alloy (MoNiTi), copper, and a second molybdenum nickel titanium alloy stacked in sequence. The first molybdenum nickel titanium alloy can increase the grain nucleation density, and the second molybdenum nickel titanium alloy plays an anti-oxidation role.

[0098] For example, the thickness of the first molybdenum nickel titanium alloy of the first conductive layer 103 may be in the range of For example, the thickness can be or The thickness of the second molybdenum nickel titanium alloy of the first conductive sublayer 103A may range from For example, the thickness can be or

[0099] In some embodiments, the first conductive layer 103 may have a thickness ranging from 1.5 μm to 7 μm, for example, the thickness may be 1.5 μm, 2 μm, 4 μm, 6.5 μm or 7 μm.

[0100] In some embodiments, Figure 2A and Figure 2B As shown, the second conductive layer 106 may include a molybdenum-niobium alloy, copper and a protective layer stacked in sequence, and the protective layer may include any one of copper-nickel alloy (CuNi), nickel or indium tin oxide (ITO). The molybdenum-niobium alloy plays an adhesion role, and the protective layer plays an anti-oxidation role and ensures the firmness of the solid crystal.

[0101] For example, the thickness of the second conductive layer 106 may range from For example, the thickness can be or

[0102] In some embodiments, the reflective layer 11 may be a reflective sheet, for example, a white reflective sheet, or may be a reflective coating.

[0103] Alternatively, the material of the reflective layer 11 may include white oil, and the white oil may include resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and organic solvent (e.g., dipropylene glycol methyl ether), etc.; the material of the reflective layer 11 may also include silicone white glue. In the case where the material of the reflective layer 11 includes white oil or silicone white glue, a screen printing process may be used to print white oil to form the reflective layer 11. Exemplarily, the thickness of the reflective layer 11 may range from 10 μm to 300 μm, for example, the thickness may be 10 μm, 50 μm, 80 μm, 155 μm, 200 μm, or 300 μm. Exemplarily, the reflective layer 11 may be formed by one or more screen printing processes. Among them, when the reflective layer 11 is made by multiple screen printing processes, the size of the opening H may be different to improve the manufacturing accuracy of the reflective layer 11 near the opening H, so that the reflective layer 11 at the edge of the opening H presents a step shape.

[0104] In some embodiments, Figure 2B As shown, the light emitting substrate 100 further includes a plurality of reflective sublayers 19, and the reflective sublayers 19 include compensation portions 19A and protrusions 19B. The compensation portions 19A of at least one reflective sublayer 19 are disposed on the inner wall of the mounting opening H3, and the protrusions 19B are disposed on the edge of the mounting opening H3.

[0105] Exemplarily, the compensation portion 19A is disposed around the inner wall of the mounting opening H3 , and the protrusion 19B is disposed around the edge of the mounting opening H3 .

[0106] By providing the compensation portion 19A of the reflective sublayer 19 , the radial dimension of the mounting opening H3 can be compensated, thereby improving the dimensional accuracy of the mounting opening H3 .

[0107] In some embodiments, the compensation portion 19A of at least one reflective sub-layer 19 is disposed on an inner wall of the opening H, and the protrusion 19B is disposed on an edge of the opening H.

[0108] Exemplarily, the compensation portion 19A is disposed around the inner wall of the opening H, and the protrusion 19B is disposed around the edge of the opening H.

[0109] By providing the compensation portion 19A of the reflective sublayer 19 , the radial dimension of the opening H can be compensated, thereby improving the dimensional accuracy of the opening H.

[0110] In some embodiments, the thickness of the reflective sublayer 19 is greater than that of the reflective layer 11. Exemplarily, the thickness of the reflective sublayer 19 may range from 40 μm to 330 μm, for example, the thickness may be 40 μm, 50 μm, 80 μm, 185 μm, 200 μm or 330 μm.

[0111] It should be noted that, unlike the screen printing process for preparing the reflective layer 11, the reflective sub-layer 19 is prepared using a patching process (i.e., using a jet valve to spray glue), and glue is sprayed around the edge of the opening H and / or the installation opening H3, so that the thickness of the reflective sub-layer 19 is greater than the thickness of the reflective layer 11.

[0112] In some embodiments, the material of the reflective sublayer 19 includes silicone white glue, which is white in color, so that the color of the reflective sublayer 19 is roughly the same as the color of the reflective layer 11, so as to ensure that the reflectivity of the fixed layer 15 to light is close to the reflectivity of the reflective layer 11 to light.

[0113] In some embodiments, Figure 2B As shown, the light-emitting substrate 100 further includes an encapsulation layer 17 disposed on a side of the light-emitting device 14 away from the substrate 10 , for protecting the light-emitting device 14 .

[0114] For example, the encapsulation layer 17 may be a whole layer covering the light emitting device 14 .

[0115] For example, Figure 2B As shown, the encapsulation layer 17 may include a plurality of encapsulation sublayers, each of which encapsulates a light-emitting device 14 .

[0116] In some embodiments, the orthographic projection of the support column 13 on the substrate 10 does not overlap with the second conductive layer 106 of the substrate 10. For example, the minimum distance between the boundary of the orthographic projection of the support column 13 on the substrate 10 and the contour boundary of the second conductive layer 106 is greater than or equal to 3 mm. This can reduce the pressure exerted by the support column 13 on the second conductive layer 106 and prevent the second conductive layer 106 from being damaged due to the force.

[0117] In some embodiments, Figure 2AAs shown, a fixing layer 15 is disposed on the substrate 10 , and the support column 13 is fixedly connected to the substrate 10 through the fixing layer 15 .

[0118] Exemplarily, the material of the fixing layer 15 may include glue, and the fixing layer 15 is formed after the glue is cured.

[0119] In some embodiments, the material of the fixing layer 15 may include a reactive hot melt adhesive, such as polyurethane resin (PUR for short), which has the characteristic of high temperature resistance and can ensure the stability of the fixing layer 15 at high temperatures.

[0120] It should be noted that the bonding strength and viscosity of the glue required for preparing the fixing layer 15 can be adjusted as needed to ensure the bonding strength between the support column 13 and the fixing layer 15 .

[0121] Furthermore, the color of the fixing layer 15 can be white, colorless and transparent, or light yellow. By setting the color of the fixing layer 15 to white, the color of the fixing layer 15 is substantially the same as the color of the reflecting layer 11, so as to ensure that the reflectivity of the fixing layer 15 to light is close to the reflectivity of the reflecting layer 11 to light.

[0122] In other embodiments, the support column 13 and the base plate 10 may be fixedly connected by welding or clamping.

[0123] As mentioned above, the structure of the support column 13 is related to its installation method. The support column 13 in some embodiments of the present disclosure is described in detail below.

[0124] In some embodiments, Figure 2A As shown, the plurality of support columns 13 include at least one first support column 131, and at least a portion of the structure of the first support column 131 is disposed in the opening H, so that the first support column 131 is installed in the opening H. In the case where the glue used to stick the first support column 131 is not solidified, the opening H can be used to limit the displacement of the first support column 131 along the direction S parallel to the plane where the substrate 10 is located, thereby preventing the first support column 131 from falling off, thereby ensuring the surface flatness of the optical film and ensuring its optical performance.

[0125] It should be noted that “the plane where the substrate is located” refers to the surface of the substrate 10 located on the light emitting side of the light emitting substrate 100 .

[0126] In some embodiments, Figure 2A As shown, the orthographic projection of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10, so that the first support column 131 can block the opening H, thereby avoiding the exposure of the opening H in the reflective layer 11 and affecting the overall light output efficiency of the light-emitting substrate 100 and the display effect of the display device.

[0127] It should be noted that the material of the first support column 131 may include a reflective material, and the reflectivity of the first support column 131 to light is substantially equal to the reflectivity of the reflective layer 11 to light. By shielding the opening H with the first support column 131, it is possible to avoid reducing the reflective area of ​​the reflective layer 11 due to the provision of the opening H in the reflective layer 11, thereby avoiding affecting the overall light extraction efficiency of the light-emitting substrate 100 and the display effect of the display device.

[0128] For example, Figure 2A As shown, the portion of the first support column 131 close to the substrate 10 (i.e., the bottom of the first support column 131) is arranged in the opening H, and the orthographic projection of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10, so that the first support column 131 can block the opening H.

[0129] Next, the structure of the first supporting column 131 is described in detail.

[0130] In some embodiments, in combination Figure 2A and Figure 5A The first supporting column 131 includes a base 1313 disposed in the opening H, and a first main body 1314 located at a side of the base 1313 away from the substrate 10 and connected to the base 1313 .

[0131] By installing the base 1313 of the first support column 131 in the opening H, the displacement of the first support column 131 along the direction S parallel to the plane where the substrate 10 is located can be limited, ensuring the uniformity of the distribution of the first support column 131 in the direction S, thereby reducing the difference in deformation of different areas of the optical film supported by the first support column 131, improving the surface flatness of the optical film, and ensuring its optical performance. The first main body 1314 of the first support column 131 is used to support the optical film to reduce the deformation caused by the force on the optical film.

[0132] Combination Figure 2A and Figure 5A The side of the base 1313 away from the first main body 1314 is the first bottom surface 1311, the side of the base 1313 connected to the first main body 1314 is the first top surface 1315, the side of the first main body 1314 connected to the base 1313 is the second bottom surface 1312, and the orthographic projection of the second bottom surface 1312 on the substrate 10 covers the orthographic projection of the first top surface 1315 on the substrate 10, so that the base 1313 and the first main body 1314 form a step surface. The size of the base 1313 along the thickness direction Z of the substrate 10 is less than or equal to the size of the opening H along the thickness direction Z of the substrate 10.

[0133] In some embodiments, Figure 2A As shown, the size of the base 1313 along the thickness direction Z of the substrate 10 is roughly equal to the size of the opening H along the thickness direction Z of the substrate 10, ensuring that the first bottom surface 1311 of the base 1313 abuts against the surface of the second flat layer 108 of the substrate 10, and at the same time, the second bottom surface 1312 of the first main body 1314 can abut against the surface of the reflective layer 11.

[0134] In some embodiments, in combination Figure 2A and Figure 5A The first bottom surface 1311 is located in the fixed layer 15, and along the thickness direction Z of the substrate 10, the first bottom surface 1311 is located between the side of the reflective layer 11 close to the substrate 10 and the side away from the substrate 10. The second bottom surface 1312 abuts against the surface of the reflective layer 11 away from the substrate 10.

[0135] It should be noted that Figure 2A 2 shows a situation where the first bottom surface 1311 abuts against the surface of the second flat layer 108 of the substrate 10 . In fact, there is a part of the fixed layer 15 between the first bottom surface 1311 and the second flat layer 108 , and this part of the fixed layer 15 can be ignored.

[0136] Through the step surface formed by the first bottom surface 1311 and the second bottom surface 1312, the first bottom surface 1311 is abutted against the surface of the second flat layer 108 of the substrate 10, and the second bottom surface 1312 is abutted against the surface of the reflective layer 11, so as to limit the first support column 131 and ensure the installation height of the first support column 131, thereby improving the uniformity of the installation height of each first support column 131, so that the supporting height of each first support column 131 for the corresponding area of ​​the optical film is roughly equal, and the deformation amount of different areas of the optical film is roughly equal, which is beneficial to improving the surface flatness of the optical film to ensure its optical performance.

[0137] like Figure 2A As shown, the orthographic projection of the second bottom surface 1312 of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10, so that the second bottom surface 1312 of the first support column 131 can block the opening H, thereby avoiding the reduction of the reflection area of ​​the reflection layer 11 due to the setting of the opening H in the reflection layer 11, thereby avoiding affecting the overall light output efficiency of the light-emitting substrate 100 and the display effect of the display device.

[0138] In some embodiments, Figure 5A and Figure 5B As shown, along the thickness direction Z of the substrate 10 and in the direction U pointing from the base 1313 to the first main body 1314 , the cross-sectional area of ​​the first main body 1314 along the direction S parallel to the plane where the substrate 10 is located gradually decreases.

[0139] Through the above-mentioned arrangement, the volume of the first main body 1314 can be reduced while the area of ​​the second bottom surface 1312 of the first main body 1314 remains unchanged, thereby reducing the blocking effect of the first main body 1314 of the first support column 131 on light, and increasing the amount of light emitted by the light-emitting substrate 100 in the direction Z of the thickness of the substrate 10, thereby improving the light extraction efficiency of the light-emitting substrate 100.

[0140] In some embodiments, Figure 5A As shown, the first main body 1314 of the first support column 131 includes multiple cross sections along a direction S parallel to the plane where the substrate 10 is located, and at least one cross section has an area greater than or equal to the cross section located on the side of the cross section away from the substrate 10 .

[0141] For example, Figure 5A As shown, the first main body 1314 of the first support column 131 may be in the shape of a cone. Figure 5B As shown, the shape of the first main body 1314 of the first support column 131 may also be a truncated cone. Figure 5C As shown, the first main body portion 1314 of the first support column 131 may also be in the shape of a column.

[0142] In some embodiments, the first support column 131 is Figure 5D In the structure shown, the base 1313 of the first support column 131 is a buckle, and the buckle includes a first bottom surface 1311 close to the substrate 10. The first main body 1314 of the first support column 131 includes a seat body connected to the buckle, and a truncated cone connected to the seat body and located on a side of the seat body away from the buckle, wherein the seat body includes a second bottom surface 1312 connected to the buckle.

[0143] In the related art, the substrate of the light emitting substrate is provided with a through hole. Figure 5D The base 1313 of the first support column 131 shown in the figure passes through the through hole of the substrate and is stuck on the through hole of the substrate to fix the first support column 131. However, this also results in that the alignment mark cannot be set in the opening corresponding to the first support column 131. The above embodiment of the present disclosure does not require a through hole to be set on the substrate 10. Figure 5D The first support column 131 shown is fixedly connected to the substrate 10 via the fixing layer 15 , and a first alignment mark 12 may also be disposed in the first opening H1 .

[0144] Next, the fixing method of the first supporting column 131 is described in detail.

[0145] In some embodiments, in combination Figure 2A and Figure 5AA fixing layer 15 is disposed in the opening H of the reflective layer 11 , and at least a portion of the base 1313 of the first support column 131 is embedded in the fixing layer 15 and connected to the fixing layer 15 , so that the first support column 131 is fixed on the substrate 10 through the fixing layer 15 .

[0146] Exemplarily, when the fixing layer 15 is not solidified, the base 1313 of the first support column 131 is embedded in the fixing layer 15, so that part of the glue overflows from the opening H, and there will be glue between the second bottom surface 1312 of the first support column 131 and the reflective layer 11. The thickness of this part of the glue after solidification is relatively small, and the thickness range may be 0 to 10 μm (excluding 0), for example, 2 μm, 5 μm, 6 μm, 8 μm, or 10 μm.

[0147] By extending the base 1313 of the first support column 131 into the fixing layer 15, the bonding area between the first support column 131 and the fixing layer 15 can be increased, and the bonding strength between the first support column 131 and the fixing layer 15 can be improved. In addition, the bonding strength between the first support column 131 and the fixing layer 15 can be further improved by increasing the bonding area between the base 1313 of the first support column 131 and the fixing layer 15, for example, by using Figure 5A The first support column 1313 has a base 1313 with a hollow cylindrical structure, so that the interior of the base 1313 can also be bonded to the fixing layer 15.

[0148] In some embodiments, Figure 5A As shown, the orthographic projection of the base 1313 of the first support column 131 on the substrate 10 may be in the shape of a ring, that is, the base 1313 is a hollow cylindrical structure. Figure 5B As shown, the shape of the base 1313 can also be columnar. Figure 5C As shown, the base 1313 includes a plurality of protrusions 1315 extending from the second bottom surface 1312 toward the substrate 10 .

[0149] The above is a description of the first support column 131 , and the second support column 132 will be described next.

[0150] In some embodiments, Figure 3 As shown, the plurality of support columns 13 include at least one second support column 132, and the second support column 132 includes a second body portion 1323. It can be understood that, relative to the first support column 131, the second support column 132 does not have a base.

[0151] The orthographic projection of the opening H on the substrate 10 covers the orthographic projection of the corresponding second support column 132 on the substrate 10. Along the thickness direction Z of the substrate 10, the side of the second support column 132 close to the substrate 10 is located between the side of the reflective layer 11 close to the substrate 10 and the side away from the substrate 10. In the case where the glue used to stick the second support column 132 is not solidified, the opening H can be used to limit the displacement of the second support column 132 along the direction S parallel to the plane where the substrate 10 is located, thereby preventing the second support column 132 from falling off, so as to ensure the surface flatness of the optical film and ensure its optical performance.

[0152] For example, Figure 3 As shown, a portion of the second supporting column 132 close to the substrate 10 (ie, a bottom portion of the second supporting column 132 ) is fixedly disposed in the opening H. As shown in FIG.

[0153] Or, if Figure 3 As shown, the second support column 132 is arranged on the side of the reflective layer 11 away from the substrate 10, that is, the opening H is not set in the area of ​​the reflective layer 11 corresponding to the second support column 132, and the opening H does not need to be blocked, thereby avoiding the problem of exposure of the opening H due to lax blocking. The second support column 132 can be directly set on the surface of the reflective layer 11.

[0154] It should be noted that the material of the second support column 132 may include reflective material, and the reflectivity of the second support column 132 to light is roughly equal to the reflectivity of the reflective layer 11 to light, which can avoid the reflection area of ​​the reflective layer 11 being reduced due to the second support column 132 blocking the reflective layer 11, thereby avoiding affecting the overall light output efficiency of the light-emitting substrate 100 and the display effect of the display device.

[0155] In some other embodiments, the orthographic projection of the second supporting column 132 on the substrate 10 may also cover the orthographic projection of the corresponding opening H on the substrate 10 , that is, the second supporting column 132 is not disposed in the opening H.

[0156] In some embodiments, Fig. 6A and Figure 6B As shown, along the thickness direction Z of the substrate 10 and in the direction V from the substrate 10 to the second support pillar 132 , the cross-sectional area of ​​the second support pillar 132 along the direction S parallel to the plane where the substrate 10 is located gradually decreases.

[0157] Through the above-mentioned arrangement, the volume of the second support column 132 can be reduced while the area of ​​the bottom surface (the side close to the substrate 10) of the second support column 132 remains unchanged, thereby reducing the blocking effect of the second support column 132 on light, increasing the amount of light emitted by the light-emitting substrate 100 in the direction Z of the thickness of the substrate 10, and thus improving the light extraction efficiency of the light-emitting substrate 100.

[0158] For example, in combination Figure 3 and Fig. 7A The second support column 132 includes a base 1322 and a second main body 1323 located on a side of the base 1322 away from the substrate 10 and connected to the base 1322. At least one groove 1321 is provided on a side of the base 1322 close to the substrate 10, and a radial dimension D2 of an orthographic projection of a side of the second main body 1323 close to the base 1322 on the substrate 10 is smaller than a radial dimension D3 of an orthographic projection of a side of the base 1322 close to the second main body 1323 on the substrate 10.

[0159] For example, Fig. 7A As shown, the radial dimension D2 of the orthographic projection of the side of the second main body 1323 close to the base 1322 on the substrate 10 is smaller than the radial dimension D3 of the orthographic projection of the side of the base 1322 close to the second main body 1323 on the substrate 10, the base 1322 of the second support column 132 is in the shape of a column, and the shape of the second main body 1323 is in the shape of a cone. This is equivalent to removing part of the volume of the column from the column to obtain a second support column 132 with a smaller volume, thereby reducing the blocking effect of the second support column 132 on light.

[0160] For example, Figure 7B As shown, the radial dimension D2 of the orthographic projection of the side of the second main body 1323 close to the base 1322 on the substrate 10 is smaller than the radial dimension D3 of the orthographic projection of the side of the base 1322 close to the second main body 1323 on the substrate 10, the base 1322 of the second support column 132 is in the shape of a truncated cone, and the shape of the second main body 1323 is in the shape of a cone. This is equivalent to removing part of the volume of the cone from the cone to obtain a second support column 132 with a smaller volume, thereby reducing the blocking effect of the second support column 132 on light.

[0161] In some embodiments, Fig. 6A As shown, the second support column 132 includes a plurality of cross sections along a direction S parallel to the plane where the substrate 10 is located, and an area of ​​at least one cross section is greater than or equal to an area of ​​a cross section located on a side of the cross section away from the substrate 10 .

[0162] For example, Fig. 6A As shown, the second support column 132 may be in the shape of a truncated cone. Figure 6B As shown, the shape of the second support column 132 may also be a cone. Figure 6C As shown, the second support column 132 may also be in the shape of a column.

[0163] Next, the fixing method of the second supporting column 132 is described in detail.

[0164] In some embodiments, in combination Figure 3 and Fig. 6A A surface of the second support column 132 close to the substrate 10 is fixedly connected to the substrate 10 through the fixing layer 15 .

[0165] For example, in combination Figure 3 and Fig. 7A A fixing layer 15 is disposed in the opening H of the reflective layer 11 , and a surface of the second support column 132 close to the substrate 10 is fixedly connected to the substrate 10 through the fixing layer 15 .

[0166] Alternatively, the second support column 132 is disposed on a side of the reflective layer 11 away from the substrate 10, a fixing layer 15 is disposed between the second support column 132 and the reflective layer 11, and a side of the second support column 132 close to the substrate 10 is fixedly connected to the substrate 10 through the fixing layer 15. It should be noted that the thickness of the fixing layer 15 should be set relatively thin, and the thickness range can be 30 μm to 100 μm, for example, the thickness is 30 μm, 40 μm, 65 μm, 80 μm or 100 μm, to ensure the bonding strength between the second support column 132 and the fixing layer 15.

[0167] In some embodiments, in combination Figure 3 and Fig. 6A At least one groove 1321 is formed on one side of the second support column 132 close to the substrate 10, and at least part of the fixed layer 15 is located in the groove 1321 of the second support column 132, which can increase the bonding area between the second support column 132 and the fixed layer 15 and improve the bonding strength between the second support column 132 and the fixed layer 15.

[0168] For example, Fig. 6A As shown, the shape of the orthographic projection of the groove 1321 on the substrate 10 is a circle. Figure 6B As shown, the shape of the orthographic projection of the groove 1321 on the substrate 10 is annular. Figure 6C As shown, the shape of the orthographic projection of the groove 1321 on the substrate 10 is a plurality of arcs arranged at intervals.

[0169] In some embodiments, Figure 4 As shown, the multiple support columns 13 include at least one first support column 131 and at least one second support column 132. At least part of the structure of the first support column 131 is arranged in the opening H, and the orthographic projection of the first support column 131 on the substrate 10 covers the orthographic projection of the corresponding opening H on the substrate 10, so that the first support column 131 is installed in the opening H and can cover the opening H.

[0170] like Figure 3As shown, the orthographic projection of the opening H on the substrate 10 covers the orthographic projection of the corresponding second support column 132 on the substrate 10, and along the thickness direction Z of the substrate 10, the side of the second support column 132 close to the substrate 10 is located between the side of the reflective layer 11 close to the substrate 10 and the side away from the substrate 10. Alternatively, the second support column 132 is disposed on the side of the reflective layer 11 away from the substrate 10, that is, the opening H is not disposed in the region of the reflective layer 11 corresponding to the second support column 132, and the second support column 132 is directly disposed on the surface of the reflective layer 11.

[0171] In some embodiments, the maximum radial dimension of the first support column 131 and the second support column 132 ranges from 2 mm to 10 mm, for example, 2 mm, 4 mm, 5 mm, 8 mm or 10 mm. The height of the first support column 131 and the second support column 132 ranges from 1 mm to 12 mm, for example, 1 mm, 4 mm, 6 mm, 8 mm or 12 mm.

[0172] In some embodiments, Figure 2A As shown, the installation of the support column 13 in the opening H also meets the following requirements:

[0173] The maximum distance between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10 is D1. It can be understood that when the support column 13 can move in the opening H along the direction S parallel to the plane where the substrate 10 is located, the maximum distance that the support column 13 can move is D1.

[0174] The installation tolerance of the support column 13 is A1, that is, the installation tolerance of the support column 13 along the direction S parallel to the plane where the substrate 10 is located is A1.

[0175] The radial dimension tolerance of the opening H is A2, and the radial direction of the opening H is parallel to the plane of the substrate 10 .

[0176] The maximum allowable displacement of the support column 13 is A3, that is, the maximum distance that the support column 13 is allowed to move in the opening H along the direction S parallel to the plane where the substrate 10 is located. It can be understood that if the distance that the support column 13 moves in the opening H along the direction S parallel to the plane where the substrate 10 is located is greater than the maximum allowable displacement A3, in this case, the support column 13 is unevenly distributed in the direction S, and the surface flatness of the optical film cannot be guaranteed.

[0177] Among them, A1+A2≤D1≤A3. It can be understood that D1≥A1+A2, that is, the maximum distance D1 between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10 is greater than or equal to the sum of the installation tolerance A1 of the support column 13 and the radial dimension tolerance A2 of the opening H, so that the support column 13 can be inserted into the opening H.

[0178] Moreover, D1≤A3, that is, the maximum distance D1 between the outer boundary of the orthographic projection of the support column 13 on the substrate 10 and the boundary of the orthographic projection of the opening H on the substrate 10 is less than or equal to the maximum allowable displacement A3 of the support column 13, so that the maximum distance that the support column 13 can move in the opening H along the direction S parallel to the plane where the substrate 10 is located is less than or equal to the maximum allowable displacement A3, which can ensure the uniformity of the distribution of the support column 13 in the direction S, thereby ensuring the surface flatness of the optical film and its optical performance.

[0179] In some embodiments, Figure 1 to Figure 4 As shown, the substrate 10 has a middle region 11A and an edge region 11B located around the middle region 11A.

[0180] For example, Figure 4 As shown, a first support column 131 can be arranged at the opening H located in the edge area 11B, so that the base 1313 of the first support column 131 is inserted into the fixing layer 15 in the opening H, and the first support column 131 is bonded to the substrate 10 through the fixing layer 15. According to the foregoing, it can be known that the uniformity of the distribution of the first support column 131 in the direction S and the installation height of the first support column 131 can be guaranteed.

[0181] For example, Figure 3 As shown, a second support column 132 can also be set at the opening H located in the edge area 11B, so that the base 1322 of the second support column 132 is embedded in the fixing layer 15 in the opening H, and the fixing layer 15 is at least partially located in the groove 1321 of the second support column 132, and the second support column 132 is bonded to the substrate 10 through the fixing layer 15.

[0182] It should be noted that there is an optical distance (OD) between the light emitting device 14 in the light emitting substrate 100 and the optical film, which can improve the light shadow produced by the light emitting substrate 100 and improve the display quality of the display device 200. When the optical distance is large, for example, the optical distance is greater than or equal to 6 mm, Figure 3 The second supporting column 132 shown exposes a partial area of ​​the opening H, which has little influence on the light extraction efficiency of the light emitting substrate 100 and the display effect of the display device and can be ignored.

[0183] In some embodiments, Figure 3 and Figure 4 As shown, the middle area 11A of the substrate 10 has no opening, and the middle area 11A is provided with a second support column 132. The second support column 132 is fixedly connected to the surface of the reflective layer 11 away from the substrate 10 through the fixing layer 15.

[0184] For example, Figure 3 In the illustrated light-emitting substrate 100, the middle region 11A of the substrate 10 is not provided with an opening, and the opening H does not need to be shielded, thereby avoiding the problem of the opening H being exposed due to poor shielding. The second support column 132 can be provided on a side of the reflective layer 11 away from the substrate 10, and a fixing layer 15 is provided between the second support column 132 and the reflective layer 11, and at least a portion of the fixing layer 15 is embedded in the groove 1321 of the second support column 132, so that the second support column 132 is fixed on the reflective layer 11 through the fixing layer 15.

[0185] In some embodiments, Figure 2A As shown, the plurality of openings H of the reflective layer 11 further include at least one second opening H2 , the first alignment mark 12 is not disposed in the second opening H2 , and the middle region 11A is provided with the second opening H2 .

[0186] For example, Figure 2A In the light-emitting substrate 100 shown, openings H are provided in each region (middle region 11A and edge region 11B) of the substrate 10 , and first support columns 131 are provided at all openings H, so as to ensure uniformity of installation heights of the first support columns 131 .

[0187] Through the above configuration, it can be ensured that the difference between the maximum and minimum values ​​of the installation height of each first support column 131 is in the range of 0 to 0.2 mm, for example, the difference is 0, 0.03 mm, 0.01 mm, 0.18 mm or 0.2 mm.

[0188] Next, the arrangement method of the first alignment mark 12 is introduced.

[0189] In some embodiments, Fig. 8A As shown, the first opening H1 is disposed in the edge region 11B of the substrate 10 , so that the first alignment mark 12 in the first opening H1 is disposed in the edge region 11B, so as to capture an image of the first alignment mark 12 for alignment.

[0190] Exemplarily, the distance between the first alignment mark 12 and the boundary of the substrate 10 ranges from 90 mm to 110 mm, for example, the distance may be 90 mm, 96 mm, 100 mm, 105 mm or 110 mm.

[0191] In some embodiments, Figure 8B and Figure 8C As shown, the reflective layer 11 has a plurality of groups of first openings H1 , and the plurality of groups of first openings H1 are evenly distributed on the edge of the reflective layer 11 , and each group of first openings H1 includes at least one first opening H1 .

[0192] For example, Figure 8BAs shown, each group of first openings H1 includes one first opening H1 , so that alignment is performed through the first alignment mark 12 in each first opening H1 .

[0193] For example, Figure 8C As shown, each group of first openings H1 includes two first openings H1 , and the first alignment marks 12 in different first openings H1 are used for alignment in different process steps.

[0194] In some embodiments, Figure 8A to Figure 8C As shown, the shape of the reflective layer 11 is a quadrilateral with four corners. Along the extension direction (X direction or Y direction) of the boundary of the reflective layer 11, the shapes of the first alignment marks 12 at two adjacent corners of the reflective layer 11 are different, for example, the shape of the first alignment mark 12 at one corner is circular, and the shape of the first alignment mark 12 at the other corner is cross-shaped. Along the diagonal direction (M direction or N direction) of the reflective layer 11, the shapes of the first alignment marks 12 at two opposite corners of the reflective layer 11 are the same, for example, the shapes of the first alignment marks 12 at the two corners are both circular, or both cross-shaped.

[0195] By setting the first alignment marks 12 as described above, during the alignment process, the first alignment marks 12 at two adjacent corners of the reflective layer 11 can be easily distinguished, thereby facilitating the positions of the corners where the first alignment marks 12 are located, to ensure the accuracy of the alignment position.

[0196] In some embodiments, the shape of the reflective layer 11 is a quadrilateral, and the first alignment marks 12 at the four corners of the reflective layer 11 may also be set to the same shape. Exemplarily, the shapes of the first alignment marks 12 are all cross-shaped, or they may all be circular. The first alignment marks 12 may also be designed in other ways, for example, three of the four corners are provided with cross-shaped first alignment marks 12, and one corner is provided with a circular first alignment mark 12.

[0197] In some embodiments, Figure 8C As shown, at least one first opening H1 is further provided with a second alignment mark 18. The second alignment mark 18 is made of the same material as the reflective layer 11 and is provided in the same layer.

[0198] It should be noted that the first alignment mark 12 is used for alignment, and the reflective layer 11 is prepared on the substrate 10. In the same process step, the second alignment mark 18 is prepared. The second alignment mark 18 is made of the same material as the reflective layer 11 and is arranged in the same layer. In addition, along the thickness direction Z of the substrate 10, the second alignment mark 18 corresponds to the first alignment mark 12 in the same first opening H1.

[0199] In some embodiments, Figure 8CAs shown, the first opening H1 without the second alignment mark 18 is farther away from the center E of the substrate 10 than the first opening H1 with the second alignment mark 18 .

[0200] It can be understood that the first alignment mark 12 in the first opening H1 provided with the second alignment mark 18 is used for alignment during the preparation of the reflective layer 11. After the preparation is completed, the second alignment mark 18 blocks the first alignment mark 12, and the first alignment mark 12 in the first opening H1 cannot be reused for alignment. Therefore, by making the first opening H1 without the second alignment mark 18 farther away from the center E of the substrate 10 relative to the first opening H1 with the second alignment mark 18, the first opening H1 without the second alignment mark 18 is closer to the boundary of the substrate 10, which facilitates the subsequent process steps to use the first alignment mark 12 in the first opening H1 for alignment, and helps to improve the accuracy of alignment.

[0201] In some embodiments, Figure 1 As shown, the multiple light-emitting devices 14 include multiple groups of light-emitting devices D, each group of light-emitting devices D includes at least two light-emitting devices 14, and each group of light-emitting devices D is evenly arranged around the supporting column 13. The distance between each light-emitting device 14 and the supporting column 13 in each group of light-emitting devices D is approximately equal, so as to avoid the support column 13 and any light-emitting device 14 being too close to each other, thereby preventing the light output of the light-emitting device 14 from being blocked, thereby avoiding uneven light output of the light-emitting substrate 100.

[0202] It should be noted that the reference Figure 1 A plurality of light emitting devices 14 are also arranged between two adjacent groups of light emitting devices D, so that the light emitting devices 14 on the light emitting substrate 100 are evenly distributed, thereby ensuring the uniformity of light emission of the light emitting substrate 100 .

[0203] Furthermore, the light emitting devices 14 of each group of light emitting devices D may be connected in series, in parallel, or in a combination of series and parallel. Figure 1 As shown, the light emitting devices 14 of each group of light emitting devices D are connected in series.

[0204] For example, Figure 1 As shown, each group of light-emitting devices D includes four light-emitting devices 14, and the four light-emitting devices 14 are evenly arranged around the supporting column 13. For example, the supporting column 13 is located at the center C of the area surrounded by the center lines of the four light-emitting devices 14, so that the distance between the supporting column 13 and each light-emitting device 14 is roughly equal, thereby avoiding the support column 13 and any light-emitting device 14 from being too close, thereby preventing the light output of the light-emitting device 14 from being blocked, thereby avoiding uneven light output of the light-emitting substrate 100.

[0205] In some embodiments, Figure 1 As shown, the light emitting substrate 100 has a plurality of light emitting areas A, and the light emitting areas A are provided with at least one group of light emitting devices D. At least two light emitting areas A are spaced apart between the support column 13 and the boundary of the substrate 10 .

[0206] For example, Figure 1 As shown, the light-emitting area A is provided with 4×1 groups of light-emitting devices D, that is, four groups of light-emitting devices D are provided along the direction X, and one group of light-emitting devices D is provided along the direction Y. The light-emitting area A is provided with four groups of light-emitting devices D in total.

[0207] Exemplarily, the light emitting area A is provided with 2×2 groups of light emitting devices D, that is, two groups of light emitting devices D are provided along the direction X, and two groups of light emitting devices D are provided along the direction Y. The light emitting area A is provided with four groups of light emitting devices D in total.

[0208] Exemplarily, the support column 13 closest to the boundary of the substrate 10 has a distance from the boundary of the substrate 10 that is less than or equal to 150 mm.

[0209] By the above-mentioned arrangement of the support column 13, when the substrate 101 of the substrate 10 is a glass substrate and the structural strength of the edge area of ​​the substrate 101 is low and it is easy to break and warp when subjected to force, the orthographic projection of the support column 13 on the substrate 101 is made as far away from the edge area of ​​the substrate 101 as possible to ensure the supporting stability of the support column 13 on the optical film.

[0210] In some embodiments, in combination Figure 1 and Figure 2A , the plurality of openings H are evenly arranged on the reflective layer 11 , for example, the plurality of openings H are arranged in an array on the reflective layer 11 .

[0211] In some embodiments, in combination Figure 1 and Figure 2A A plurality of support pillars 13 are evenly arranged on the surface of the substrate 10 . For example, a plurality of support pillars 13 are arranged in an array on the surface of the substrate 10 , so as to facilitate batch pasting of the support pillars 13 and improve pasting efficiency of the support pillars 13 .

[0212] In some embodiments, the distance between two closest support columns 13 is less than or equal to a distance threshold, so as to ensure the supporting effect of the support columns 13 on the optical film.

[0213] It should be noted that the "spacing threshold" represents the effective spacing between the support columns 13. If the spacing between the two closest support columns 13 is less than or equal to the spacing threshold, the deformation amount of the optical film under the support of the support columns 13 meets the requirements; if the spacing between the two closest support columns 13 is greater than the spacing threshold, the deformation amount of the optical film under the support of the support columns 13 does not meet the requirements.

[0214] Exemplarily, the spacing threshold is 300 mm, and the spacing between two closest support columns 13 is less than or equal to 300 mm.

[0215] For example, Figure 1 As described, the plurality of support columns 13 are arranged in an array on the surface of the substrate 10. In this case, along the column direction (Y direction) of the plurality of support columns 13, the spacing between two adjacent support columns 13 is less than or equal to 300 mm; along the row direction (X direction) of the plurality of support columns 13, the spacing between two adjacent support columns 13 is less than or equal to 300 mm.

[0216] The light-emitting substrate 100 provided in some embodiments of the present disclosure may be a Mini LED light-emitting substrate, and the radial size of the orthographic projection of the light-emitting device 14 of the Mini LED light-emitting substrate on the substrate 10 is in the range of 100 μm to 500 μm, for example, 100 μm, 200 μm, 300 μm, 400 μm or 500 μm. The light-emitting substrate 100 may also be a Micro LED light-emitting substrate, and the radial size of the orthographic projection of the light-emitting device 14 of the Micro LED light-emitting substrate on the substrate 10 is less than 100 μm, for example, 30 μm, 50 μm, 60 μm, 85 μm or 100 μm.

[0217] Some embodiments of the present disclosure also provide a display device, such as Fig. 9 As shown, the display device 300 includes a display panel 301 and a light-emitting substrate 100 as described in any of the above embodiments. The light-emitting substrate 100 is arranged on a non-display side P of the display panel 301 to provide a backlight source for the display panel 301 .

[0218] The display device 300 further includes a plurality of optical films 201 disposed between the light emitting substrate 100 and the display panel 301 , ie, on the light emitting side M of the light emitting substrate 100 .

[0219] Exemplarily, the plurality of optical films 201 may include a diffuser 202, a quantum dot film 203, a diffuser sheet 204, and a composite film 205, which are sequentially arranged in a direction away from the light-emitting substrate 100. The diffuser 202 and the diffuser sheet 204 are used to improve the light shadow produced by the light-emitting substrate 100 and improve the display quality of the display device 300. The quantum dot film 203 can convert the blue light into white light under the excitation of the blue light emitted by the light-emitting substrate 100, thereby improving the utilization rate of the light energy of the light-emitting substrate 100. The composite film 205 can be used to improve the brightness of the light after being transmitted through the composite film 205.

[0220] The display device 300 may be a liquid crystal display (LCD).

[0221] In the display device 300 in the above embodiment of the present disclosure, the substrate 10 of the light emitting substrate 100 does not need to be provided with an edge region, which is beneficial to the narrow frame design of the display device 300. In addition, since the substrate 10 is not provided with an edge region, the cost of cutting the edge region will not be increased.

[0222] The display device 300 described above may be any device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether textual or . More specifically, it is contemplated that the embodiments described may be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controls and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0223] Some embodiments of the present disclosure also provide a method for preparing a light-emitting substrate, such as Fig.10 As shown, it includes the following S1~S4:

[0224] S1: Provide a substrate.

[0225] For example, Fig.11A As shown, a substrate 10 is provided, and at least one first alignment mark 12 is disposed on the substrate 10 .

[0226] It should be noted that the substrate 10 includes a substrate 101 and a driving circuit disposed on the substrate 101, the driving circuit includes a plurality of thin film transistors and a signal line, and the first alignment mark 12 can be formed in the same process step as any conductive pattern of the driving circuit. Alternatively, any conductive pattern of the driving circuit is a laminated structure, and the first alignment mark 12 is also the same laminated structure.

[0227] Exemplarily, the substrate 10 includes a substrate 101, and a buffer layer 102, a first conductive layer 103, a first passivation layer 104, a first planar layer 105, a second conductive layer 106, a second passivation layer 107, and a second planar layer 108 sequentially stacked on the substrate 101, wherein the first conductive layer 103 and the second conductive layer 106 are used to form a conductive pattern of a driving circuit. The first alignment mark 12 is formed in the same process step as the first conductive layer 103 or the second conductive layer 106.

[0228] S2: a reflective layer 11 is disposed on the substrate 10. The reflective layer 11 reflects the light to increase the light output of the light-emitting substrate 100 in the thickness direction Z of the substrate 10, thereby improving the light output efficiency of the light-emitting substrate 100.

[0229] For example, Fig. 11B As shown, at least part of the boundary of the reflective layer 11 overlaps with at least part of the boundary of the substrate 10 , and the reflective layer 11 is provided with a plurality of openings H and a plurality of mounting openings H3 , wherein the plurality of openings H include at least one first opening H1 , and a first alignment mark 12 is disposed in the first opening H1 .

[0230] It should be noted that the reflective layer 11 may be a reflective sheet. In this case, the plurality of openings H on the reflective layer 11 may be prepared in advance, and the reflective layer 11 may be directly attached to the substrate 10 .

[0231] In addition, the reflective layer 11 may also be a reflective coating or white oil, and a plurality of openings H may be formed while the reflective layer 11 is formed by a film forming process. For example, the first alignment mark 12 may be used for alignment, a mask may be set on the substrate 10, and white oil may be printed on the substrate 10 to form a plurality of openings H on the reflective layer 11. For another example, a reflective coating may be formed on the substrate 10 by an evaporation process, and a plurality of openings H may be formed on the reflective coating by an exposure and development process and an etching process.

[0232] To ensure the dimensional accuracy of the opening H of the reflective layer 11 and / or the mounting opening H3 , a patching process may be used to spray white glue along the edges of the opening H and / or the mounting opening H3 . The reflectivity of the white glue should be close to that of the reflective layer 11 .

[0233] S3: using the first alignment mark 12 to perform alignment, a plurality of light emitting devices 14 are arranged on a side of the reflective layer 11 away from the substrate 10 .

[0234] For example, Fig. 11C As shown, the first opening H1 exposes the first alignment mark 12 , and alignment is performed by capturing an image of the first alignment mark 12 . A plurality of light emitting devices 14 are arranged on the substrate 10 , and the light emitting devices 14 are located in the installation opening H3 of the reflective layer 11 , thereby ensuring the installation accuracy of the light emitting devices 14 .

[0235] S4: Arrange multiple support columns 13. The multiple support columns 13 are used to support multiple optical films, so that there is a light mixing distance between the reflective layer 11 in the light-emitting substrate 100 and the optical films, which can improve the light shadow produced by the light-emitting substrate 100 and improve the display quality of the display device.

[0236] For example, Fig.11DAs shown, at least one support column 13 is disposed at the opening H, and the orthographic projection of the support column 13 disposed at the opening H on the substrate 10 at least partially overlaps with the orthographic projection of the corresponding opening H on the substrate 10. For example, the support column 13 can be adhered to the substrate 10 through the fixing layer 15 to achieve the fixing of the support column 13.

[0237] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A light-emitting substrate, characterized in that: The light-emitting substrate comprises: Substrate; the substrate comprises a substrate, and a first conductive layer and / or a second conductive layer disposed on the substrate; A reflective layer is disposed on the substrate; the reflective layer is provided with a plurality of openings and a plurality of mounting openings, and the plurality of openings includes at least one first opening; At least one first alignment mark; a first alignment mark is disposed in the first opening; the first alignment mark is disposed in the same layer as the first conductive layer; and / or the first alignment mark is disposed in the same layer as the second conductive layer; A plurality of support pillars, wherein the orthographic projection of at least one support pillar on the substrate at least partially overlaps with the orthographic projection of the opening on the substrate; at least one support pillar is partially located in the opening, and along the thickness direction of the substrate, a side of the support pillar close to the substrate is located between a side of the reflective layer close to the substrate and a side away from the substrate; A plurality of light emitting devices are arranged on the substrate; the light emitting devices are located in the mounting openings of the reflective layer.

2. The light-emitting substrate according to claim 1, characterized in that: A fixing layer is arranged on the substrate, and the supporting column is fixedly connected to the substrate through the fixing layer.

3. The light-emitting substrate according to claim 2, characterized in that: The plurality of support columns include: at least one first support column, comprising a base disposed in the opening, and a first main body located on a side of the base away from the substrate and connected to the base; and / or, At least one second support column includes a second body portion.

4. The light-emitting substrate according to claim 3, characterized in that: The orthographic projection of the first supporting column on the substrate covers the orthographic projection of the corresponding opening on the substrate; The side of the base away from the first main body is a first bottom surface, the side of the base connected to the first main body is a first top surface, and the side of the first main body connected to the base is a second bottom surface; the orthographic projection of the second bottom surface on the substrate covers the orthographic projection of the first top surface on the substrate; A dimension of the base along a thickness direction of the substrate is smaller than or equal to a dimension of the opening along the thickness direction of the substrate.

5. The light-emitting substrate according to claim 4, characterized in that: The first bottom surface is located in the fixed layer; along the thickness direction of the substrate, the first bottom surface is located between a side of the reflective layer close to the substrate and a side away from the substrate; The second bottom surface abuts against a surface of the reflective layer on a side away from the substrate; an orthographic projection of the second bottom surface on the substrate covers an orthographic projection of a corresponding opening on the substrate.

6. The light emitting substrate according to claim 3, characterized in that: The first main body portion includes a plurality of cross sections along a direction parallel to a plane where the substrate is located; The area of ​​at least one cross section is greater than or equal to the area of ​​a cross section located on a side of the at least one cross section away from the substrate.

7. The light-emitting substrate according to claim 6, characterized in that: Along the thickness direction of the substrate and in the direction from the base to the first main body, the cross-sectional area of ​​the first main body along the direction parallel to the plane where the substrate is located gradually decreases.

8. The light-emitting substrate according to claim 3, characterized in that: The orthographic projection of the base on the substrate is in the shape of a ring; or the base is in the shape of a column; or the base includes a plurality of protrusions extending from the second bottom surface toward the substrate.

9. The light-emitting substrate according to claim 3, characterized in that: A surface of the second supporting column close to the substrate is fixedly connected to the substrate through the fixing layer.

10. The light emitting substrate according to claim 9, characterized in that: At least one groove is formed on a surface of the second supporting column close to the substrate, and at least a portion of the fixing layer is located in the groove of the second supporting column.

11. The light emitting substrate according to claim 10, characterized in that: The orthographic projection of the groove on the substrate is in the shape of a circle; or a ring; or a plurality of arcs arranged at intervals.

12. The light emitting substrate according to claim 9, characterized in that: The second support column includes a plurality of cross sections along a direction parallel to the plane where the substrate is located; The area of ​​at least one cross section is greater than or equal to the area of ​​a cross section located on a side of the at least one cross section away from the substrate.

13. The light emitting substrate according to claim 12, characterized in that: Along the thickness direction of the substrate and in the direction from the substrate to the second supporting pillar, the cross-sectional area of ​​the second supporting pillar along the direction parallel to the plane where the substrate is located gradually decreases.

14. The light emitting substrate according to claim 1, characterized in that: The maximum distance between the outer boundary of the orthographic projection of the at least one support column on the substrate and the boundary of the orthographic projection of the opening on the substrate is D1; The installation tolerance of the support column is A1; The radial dimension tolerance of the opening is A2; The maximum allowable displacement of the support column is A3; Among them, A1+A2≤D1≤A3.

15. The light emitting substrate according to claim 3, characterized in that: The substrate has a middle area and an edge area around the middle area; The first opening is disposed in an edge region of the substrate.

16. The light emitting substrate according to claim 15, characterized in that: The middle area has no opening, and the middle area is provided with the second supporting column; The second supporting column is fixedly connected to a surface of the reflective layer on a side away from the substrate through the fixing layer.

17. The light emitting substrate according to claim 15, characterized in that: The plurality of openings further include at least one second opening, wherein the first alignment mark is not disposed in the second opening; The middle area is provided with the second opening.

18. The light emitting substrate according to claim 1, characterized in that: The plurality of openings include a plurality of first openings, and a second alignment mark is further disposed in at least one of the first openings; The second alignment mark is made of the same material as the reflective layer and is disposed in the same layer.

19. The light emitting substrate according to claim 18, characterized in that: The first opening without the second alignment mark is farther away from the center of the substrate than the first opening with the second alignment mark.

20. The light emitting substrate according to claim 1, characterized in that: The plurality of light emitting devices comprises a plurality of groups of light emitting devices, each group comprising at least two light emitting devices; Each group of light emitting devices is evenly arranged around the supporting column, and the distance between each light emitting device in each group of light emitting devices and the supporting column is substantially equal.

21. The light-emitting substrate according to claim 20, characterized in that: The light-emitting substrate has a plurality of light-emitting areas; the light-emitting areas are provided with at least one group of light-emitting devices; At least two light emitting areas are spaced between the support column and the boundary of the substrate.

22. The light-emitting substrate according to claim 2, characterized in that: The color of the fixing layer is substantially the same as the color of the reflecting layer.

23. The light emitting substrate according to claim 1, characterized in that: The light-emitting substrate further comprises: A plurality of reflective sublayers; the reflective sublayers include a compensation portion and a protruding portion; The compensating portion of at least one reflective sublayer is arranged on the inner wall of the opening, and the protruding portion is arranged on the edge of the opening; and / or, The compensation portion of at least one reflective sublayer is arranged on the inner wall of the installation opening, and the protrusion portion is arranged on the edge of the installation opening.

24. A display device, characterized in that: The display device comprises: Display panel; The light emitting substrate according to any one of claims 1 to 23, arranged on the non-display side of the display panel; A plurality of optical films are arranged between the light emitting substrate and the display panel.

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