LED light source, LED module and display device

Abstract

The application belongs to the field of display, and particularly relates to an LED light source, an LED module and a display device. The LED light source comprises an LED chip, a transparent propagation layer and a light barrier. The LED chip comprises a light emitting part and a binding end. The transparent propagation layer covers the light emitting part and exposes the binding end. The bottom surface of the transparent propagation layer is used for configuring a first reflection layer. The light barrier is arranged on the top surface of the transparent propagation layer. The light barrier comprises a reflection cavity and a light outlet. The reflection cavity has a first reflection surface. The first reflection surface is arranged obliquely relative to the bottom surface of the transparent propagation layer. Part of light rays of the LED chip are reflected by the first reflection surface and the first reflection layer in sequence and exit through the side surface of the transparent propagation layer. The design increases the light exit angle of the light source, improves the light utilization rate and the backlight brightness, and the LED light source used in the backlight module or the LED direct display device can reduce the number of LED light sources, thereby reducing the production cost.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to an LED light source, an LED module, and a display device. Background Technology

[0002] The backlight module is a crucial component of an LCD display, providing high-brightness and uniformly distributed light. Within the constraints of a fixed screen size, backlight brightness is affected by the number of LEDs (light-emitting diodes). Arranging as many LEDs as possible with the smallest possible spacing can improve backlight brightness, but increasing the number of LEDs significantly increases production costs. Summary of the Invention

[0003] The purpose of this application is to provide an LED light source, an LED module, and a display device to increase the light emission angle of the LED light source and improve the backlight brightness.

[0004] To achieve the above objectives, this application provides a display panel including an LED chip. The LED chip includes a light-emitting portion and a bonding end for bonding with a driving substrate. The bonding end is located on the bottom surface of the light-emitting portion. The LED light source further includes:

[0005] A transparent propagation layer, which covers the light-emitting part and exposes the bonding end, and the bottom surface of the transparent propagation layer is used to configure a first reflective layer;

[0006] A light-blocking plate is disposed on the top surface of the transparent propagation layer. The light-blocking plate includes a reflective cavity and a light-emitting port. The reflective cavity has a first reflective surface, which is inclined relative to the bottom surface of the transparent propagation layer.

[0007] In this process, some of the light from the LED chip can be emitted through the light outlet, and some of the light from the LED chip is reflected sequentially by the first reflective surface and the first reflective layer, and then emitted through the side of the transparent propagation layer.

[0008] Optionally, the reflective cavity extends from the top surface of the light-blocking plate to the bottom surface of the light-blocking plate, with a light inlet formed on the bottom side of the reflective cavity and a light outlet formed on the top side of the reflective cavity, and the first reflective surface is located on the inner cavity surface of the reflective cavity.

[0009] Optionally, the reflecting cavity is a frustum-shaped cavity, and the light inlet is larger than the light outlet.

[0010] Optionally, multiple reflecting cavities are arranged at intervals on the light-blocking plate, wherein: the distance between adjacent reflecting cavities gradually decreases from the center of the light-blocking plate to its edge; and / or

[0011] The light outlet of the reflective cavity gradually increases from the center of the light-blocking plate to its edge.

[0012] Optionally, the orthographic projection of a portion of the reflective cavity onto the transparent propagation layer is located within the region where the LED chip is located, while the orthographic projection of a portion of the reflective cavity onto the transparent propagation layer is located outside the region where the LED chip is located.

[0013] Optionally, the bottom surface of the light-blocking plate includes a second reflective surface.

[0014] Optionally, the LED light source further includes the first reflective layer, which is disposed on the bottom surface of the transparent propagation layer.

[0015] This application also provides an LED module, including:

[0016] Drive substrate;

[0017] LED light source, wherein the LED chip is bonded to the top surface of the driving substrate through the bonding end, and there are multiple LED light sources arranged at intervals;

[0018] A second reflective layer is disposed on the top surface of the driving substrate and surrounds the LED light source;

[0019] The bottom surface of the transparent propagation layer is projected onto the driving substrate in the second reflective layer.

[0020] Optionally, the size of the plurality of LED light sources is less than 200 micrometers, and the spacing between adjacent LED light sources is less than 0.3 millimeters; and / or

[0021] The LED light source includes red LED light source, green LED light source and blue LED light source.

[0022] This application also provides a display device, including:

[0023] LED modules;

[0024] The driving module is connected to the driving substrate.

[0025] The LED light source, LED module, and display device disclosed in this application have the following beneficial effects:

[0026] In this embodiment, a transparent propagation layer covers the light-emitting part and exposes the bonding end. The transparent propagation layer has a top surface and a bottom surface opposite each other. A light-blocking plate is disposed on the top surface of the transparent propagation layer, and the bottom surface of the transparent propagation layer is used to configure a first reflective layer. The light-blocking plate includes a reflective cavity and a light-emitting port. The reflective cavity has a first reflective surface, which is inclined relative to the bottom surface of the transparent propagation layer. Part of the light from the LED chip can be emitted through the light-emitting port. Part of the light from the LED chip is reflected sequentially by the first reflective surface and the first reflective layer, and then emitted through the side of the transparent propagation layer. This increases the light emission angle of the light source, improves the light utilization rate and the backlight brightness. Using LED light sources in backlight modules or LED direct display devices can reduce the number of LED light sources, thereby reducing production costs.

[0027] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1 This is a schematic diagram of the structure of the LED light source in Embodiment 1 of this application.

[0031] Figure 2 This is a schematic diagram of the structure of the LED light source in Embodiment 2 of this application.

[0032] Figure 3 This is a schematic diagram of the LED module in Embodiment 3 of this application.

[0033] Figure 4 This is a schematic diagram of the display device in this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. LED chip; 110. Light-emitting part; 120. Bonding end;

[0036] 200. Transparent propagation layer;

[0037] 300. Light baffle; 310. Reflective cavity; 311. Light outlet; 312. First reflective surface; 313. Light inlet; 320. Second reflective surface;

[0038] 400, driving substrate; 500, first reflective layer; 600, second reflective layer;

[0039] 10. LED module; 20. Driver module; 30. LCD display panel. Detailed Implementation

[0040] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0041] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0042] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0043] Example 1

[0044] See Figure 1 As shown, in this embodiment, the LED light source includes an LED chip 100, a transparent propagation layer 200, and a light-blocking plate 300. The LED chip 100 includes a light-emitting part 110 and a bonding end 120 for bonding with the driving substrate 400. The bonding end 120 is located on the bottom surface of the light-emitting part 110. The light-emitting part 110 is embedded in the transparent propagation layer 200, that is, the transparent propagation layer 200 covers the light-emitting part 110 and exposes the bonding end 120.

[0045] The transparent propagation layer 200 has a top surface and a bottom surface. The light-blocking plate 300 is disposed on the top surface of the transparent propagation layer 200, and the bottom surface of the transparent propagation layer 200 is used to configure the first reflective layer 500. That is, the light-blocking plate 300 is disposed on the side of the transparent propagation layer 200 away from the LED chip 100, and the side of the transparent propagation layer 200 close to the LED chip 100 is used to configure the first reflective layer 500.

[0046] The light-blocking plate 300 includes a reflective cavity 310 and a light-emitting port 311. The reflective cavity 310 has a first reflective surface 312, which is inclined relative to the bottom surface of the transparent propagation layer 200. Part of the light from the LED chip 100 can be emitted through the light-emitting port 311. Part of the light from the LED chip 100 is reflected sequentially by the first reflective surface 312 and the first reflective layer 500, and then emitted through the side of the transparent propagation layer 200, which is the side of the transparent propagation layer 200 other than the top and bottom surfaces.

[0047] It should be noted that the transparent propagation layer 200 is used to configure the first reflective layer 500 on the side near the LED chip 100. The LED light source may include, but is not limited to, the first reflective layer 500. The first reflective layer 500 may also be configured on the driving substrate 400, depending on the specific situation. The light-blocking plate 300 is provided with a light-emitting port 311 and a reflective cavity 310. The light-emitting port 311 and the reflective cavity 310 may be configured separately, but are not limited to. The light-emitting port 311 may also be formed on the inner wall of the reflective cavity 310, depending on the specific situation.

[0048] In this embodiment, the transparent propagation layer 200 covers the light-emitting part 110 and exposes the bonding end 120. The transparent propagation layer 200 has a top surface and a bottom surface. The light-blocking plate 300 is disposed on the top surface of the transparent propagation layer 200. The bottom surface of the transparent propagation layer 200 is used to configure the first reflective layer 500. The light-blocking plate 300 includes a reflective cavity 310 and a light-emitting port 311. The reflective cavity 310 has a first reflective surface 312. The first reflective surface 312 is inclined relative to the bottom surface of the transparent propagation layer 200. Part of the light from the LED chip 100 can be emitted through the light-emitting port 311. Part of the light from the LED chip 100 is reflected sequentially by the first reflective surface 312 and the first reflective layer 500, and is emitted through the side of the transparent propagation layer 200. This increases the light emission angle of the LED light source, improves the light utilization rate and backlight brightness. Using the LED light source in a backlight module or LED direct display device can reduce the number of LED light sources, thereby reducing production costs.

[0049] Currently, the light emission angle of an LED light source is approximately 130°. By setting a reflective cavity 310 and a first reflective layer 500 to reflect the light, the light emission angle of the LED light source can be increased to over 150°.

[0050] For example, see Figure 1 As shown, the light-blocking plate 300 has a top surface and a bottom surface. The side of the light-blocking plate 300 away from the transparent propagation layer 200 is the top surface, and the side of the light-blocking plate 300 closer to the transparent propagation layer 200 is the bottom surface. The reflecting cavity 310 extends from the top surface of the light-blocking plate 300 through the bottom surface of the light-blocking plate 300. A light inlet 313 is formed on the bottom side of the reflecting cavity 310, and a light outlet 311 is formed on the top side of the reflecting cavity 310. The first reflecting surface 312 is located on the inner cavity surface of the reflecting cavity 310.

[0051] It should be noted that the reflective cavity 310 may penetrate the light-blocking plate 300, but it is not limited to this. The reflective cavity 310 may also not penetrate the light-blocking plate 300. The reflective cavity 310 is opened on the side of the light-blocking plate 300 near the LED chip 100, and the light inlet 313 is opened on the light-blocking plate 300 and is spaced apart from the reflective cavity 310. The specific arrangement can be determined according to the situation.

[0052] The top surface of the reflective cavity 310 extends through the bottom surface of the light-blocking plate 300, and the bottom side of the reflective cavity 310 forms a light inlet 313, while the top side of the reflective cavity 310 forms a light outlet 311. The reflective cavity 310 can both emit and reflect light, making its structure simpler and easier to implement.

[0053] See Figure 1 As shown, the reflective cavity 310 is a frustum-shaped cavity, and the light inlet 313 is larger than the light outlet 311.

[0054] It should be noted that the reflecting cavity 310 can be a frustum-shaped cavity, and the first reflecting surface 312 can be a conical surface, but it is not limited to this. The first reflecting surface 312 can also be concave inward or outward into an arc surface, depending on the specific situation. The light inlet 313 can be larger than the light outlet 311, but it is not limited to this. The light inlet 313 can also be smaller than or equal to the light outlet 311, depending on the specific situation.

[0055] The reflective cavity 310 is a frustum-shaped cavity, and the first reflective surface 312 is a conical surface. At the same time, the light inlet 313 is larger than the light outlet 311. This design can avoid the light inlet 313 blocking the light and facilitate the first reflective surface 312 to reflect the light to the first reflective layer 500.

[0056] See Figure 1 As shown, the orthographic projection of the first reflective surface 312 onto the transparent propagation layer 200 is located within the area where the LED chip 100 is located.

[0057] It should be noted that the orthographic projection of the first reflective surface 312 on the transparent propagation layer 200 may be located in the area where the LED chip 100 is located, but it is not limited to this. The orthographic projection of the first reflective surface 312 on the transparent propagation layer 200 may also be located outside the area where the LED chip 100 is located, depending on the specific circumstances.

[0058] Since the LED chip 100 emits a large amount of light in the middle and a small amount of light at the edges, the orthographic projection of the first reflective surface 312 on the transparent propagation layer 200 can be located in the area where the LED chip 100 is located. The first reflective surface 312 mainly reflects the light emitted from the middle of the LED chip 100 to the first reflective layer 500, and then reflects it again to the side of the transparent propagation layer 200 for emission. With this design, the light emission from the middle and the light emission from the edges of the LED light source are close. Using the LED light source in the backlight module can reduce the requirements for the light guide plate and optical film.

[0059] See Figure 1 As shown, the bottom surface of the light-blocking plate 300 includes a second reflective surface 320, that is, the second reflective surface 320 is the side of the light-blocking plate 300 near the transparent propagation layer 200.

[0060] The side of the light-blocking plate 300 near the transparent propagation layer 200 is the second reflective surface 320. The second reflective surface 320 can reflect light, thus avoiding light absorption and reducing optical utilization.

[0061] See Figure 1 As shown, the LED light source also includes a first reflective layer 500, which is disposed on the bottom surface of the transparent propagation layer 200. That is, the first reflective layer 500 is disposed on the side of the transparent propagation layer 200 away from the light-blocking plate 300, and the first reflective layer 500 is located in the peripheral area of ​​the LED chip 100.

[0062] It should be noted that the LED light source may include, but is not limited to, the first reflective layer 500. The first reflective layer 500 may also be disposed on the driving substrate 400, depending on the specific circumstances.

[0063] The LED light source also includes a first reflective layer 500, which is disposed on the side of the transparent propagation layer 200 away from the light-blocking plate 300. This simplifies the process of bonding the LED light source to the driving substrate 400. The first reflective layer 500 is located in the peripheral area of ​​the LED chip 100, preventing it from obstructing the bonding end 120. If the first reflective layer 500 were disposed on the driving substrate 400, a bonding area would need to be reserved on the driving substrate 400 for bonding the LED light source, making the process more complex. If the first reflective layer 500 is fabricated after bonding the LED light source to the driving substrate 400, it is likely to obstruct the side of the transparent propagation layer 200, resulting in a reduced light emission angle of the LED light source.

[0064] Example 2

[0065] The main difference between Embodiment 2 and Embodiment 1 is that in Embodiment 2, the light-blocking plate 300 is provided with multiple reflective cavities 310.

[0066] See Figure 2 As shown, the light-blocking plate 300 includes multiple reflective cavities 310, which are arranged at intervals on the light-blocking plate 300. From the center of the light-blocking plate 300 to the edge of the light-blocking plate 300, the spacing between adjacent reflective cavities 310 gradually decreases, as shown in the figure, H1>H2>H3, that is, the reflective cavities 310 are sparser in the middle region and denser in the edge region.

[0067] It should be noted that the light-blocking plate 300 can be provided with reflective cavities 310 of the same size. From the inside to the outside, the distance between adjacent reflective cavities 310 gradually decreases. However, it is not limited to this. The light-blocking plate 300 can also be provided with reflective cavities 310 of different sizes. From the center of the light-blocking plate 300 to the edge of the light-blocking plate 300, the light outlet 311 of the reflective cavity 310 gradually increases.

[0068] Because the light output of the LED chip 100 is large in the middle and small at the edge, the spacing between adjacent reflective cavities 310 gradually decreases from the inside to the outside, making the reflective cavities 310 in the middle region sparser and the reflective cavities 310 in the edge region denser. With this design, the reflective cavities 310 mainly reflect the light output from the middle of the LED chip 100 to the first reflective layer 500, and then reflect it again to the side of the transparent propagation layer 200 for emission. This makes the light output from the middle and edge of the LED light source similar, and the LED light source can reduce the requirements for light guide plates and optical films when used in backlight modules.

[0069] See Figure 2 As shown, the area where the LED chip 100 is located is within the orthographic projection of the light-blocking plate 300 onto the driving substrate 400, meaning the size of the light-blocking plate 300 is larger than the size of the LED chip 100. Part of the orthographic projection of the reflective cavity 310 onto the driving substrate 400 is located within the area where the LED chip 100 is located, while the other part of the orthographic projection of the reflective cavity 310 onto the driving substrate 400 is located outside the area where the LED chip 100 is located.

[0070] A transparent propagation layer 200 covers the light-emitting part 110 of the LED chip 100 and exposes the bonding end 120. A light-blocking plate 300 is disposed on the side of the transparent propagation layer 200 away from the LED chip 100, and there is a certain distance between the light-blocking plate 300 and the LED chip 100. The light emission angle of the LED chip 100 is approximately 130°, and the size of the light-blocking plate 300 is larger than the size of the LED chip 100, that is, the light-blocking plate 300 can cover the entire light-emitting surface of the LED chip 100. The orthographic projection of part of the reflective cavity 310 on the driving substrate 400 is located within the area where the LED chip 100 is located, while the orthographic projection of part of the reflective cavity 310 on the driving substrate 400 is located outside the area where the LED chip 100 is located. With this design, the light reflected from the middle area of ​​the LED chip 100 to the side of the transparent propagation layer 200 is greater, while the light reflected from the edge area of ​​the LED chip 100 to the side of the transparent propagation layer 200 is relatively less. This makes the light output from the middle and the light output from the edge of the LED light source more similar. Using the LED light source in the backlight module can reduce the requirements for the light guide plate and optical film.

[0071] Example 3

[0072] See Figure 3As shown, in this embodiment, the LED module includes a driving substrate 400, an LED light source, and a second reflective layer 600. The LED light source includes the LED light sources disclosed in Embodiments 1 and 2. Multiple LED light sources are bonded to the top surface of the driving substrate 400 via bonding ends 120, and these LED light sources are spaced apart. The second reflective layer 600 is disposed on the driving substrate 400 near the LED light source, i.e., on the top surface of the driving substrate 400. The second reflective layer 600 is located in the peripheral area of ​​the LED light source, i.e., surrounding the LED chip 100 and exposing the bonding area. The orthographic projection of the bottom surface of the transparent propagation layer 200 onto the driving substrate 400 is located within the second reflective layer 600.

[0073] It should be noted that the LED module may include a second reflective layer 600, but is not limited to this. When the LED light source includes a first reflective layer 500, the second reflective layer 600 may be omitted, depending on the specific circumstances.

[0074] The LED module includes an LED light source. In the LED light source, a transparent propagation layer 200 covers the light-emitting part 110 and exposes the bonding end 120. The transparent propagation layer 200 has a top surface and a bottom surface. A light-blocking plate 300 is disposed on the top surface of the transparent propagation layer 200. The bottom surface of the transparent propagation layer 200 is used to configure the first reflective layer 500. The light-blocking plate 300 includes a reflective cavity 310 and a light-emitting port 311. The reflective cavity 310 has a first reflective surface 312, which is inclined relative to the bottom surface of the transparent propagation layer 200. Part of the light from the LED chip 100 can be emitted through the light-emitting port 311. Part of the light from the LED chip 100 is reflected sequentially by the first reflective surface 312 and the first reflective layer 500, and then emitted through the side of the transparent propagation layer 200. This increases the light emission angle of the LED light source, improves the light utilization rate and backlight brightness. Using the LED light source in a backlight module or LED direct-view display device can reduce the number of LED light sources, thereby reducing production costs.

[0075] In addition, by increasing the light emission angle of the LED light source, dark bands are less likely to form between the LED light sources when the LED light sources are bonded to the driving substrate 400.

[0076] See Figure 3 As shown, the size of the LED light source is less than 200 micrometers, and the spacing between the LED light sources is less than 0.3 millimeters. Specifically, the LED light source can be a Mini LED / Micro LED light source. The size of the Mini LED light source is 50 micrometers to 200 micrometers, and the gap between two adjacent LED light sources is 0.3 millimeters to 1.2 millimeters; the size of the Micro LED light source is less than 50 micrometers, and the gap between two adjacent light sources is less than 0.3 millimeters.

[0077] Mini LED / Micro LED light sources are small in size and have small gaps between them. The number of light sources integrated on the driver substrate 400 is large, which can be divided into more fine backlight zones, greatly improving the screen's contrast.

[0078] See Figure 3 As shown, multiple LED light sources include red LED light sources, green LED light sources and blue LED light sources.

[0079] It should be noted that multiple LED light sources may include red LED light sources, green LED light sources and blue LED light sources, but are not limited to these. Multiple LED light sources may also include only white LED light sources, depending on the specific situation.

[0080] LED modules include red LED light sources, green LED light sources, and blue LED light sources. These three LED light sources can be mixed to produce white light. LED modules can be used in backlight modules or directly in LED direct-view display devices.

[0081] Example 4

[0082] See Figure 4 As shown, the display device in this embodiment includes an LED module 10 and a driving module 20. The driving module 20 is connected to the driving substrate 400. The LED module 10 includes the LED module 10 disclosed in Embodiment 3.

[0083] The display device may be a liquid crystal display device, and the liquid crystal display device may also include a liquid crystal display panel 30, which is disposed on the light-emitting side of the LED module 10, and the LED module 10 is the backlight module of the display device.

[0084] It should be noted that the display device can be a liquid crystal display device, but is not limited to this. The display device can also be an LED direct-view device, in which case the liquid crystal display panel 30 can be omitted. In addition to the LED module 10, the driving module 20, and the liquid crystal display panel 30, the display device also includes other necessary components and parts. Taking a monitor as an example, it may also include a housing, a main circuit board, a power cord, etc. Those skilled in the art can supplement these components according to the specific usage requirements of the display device, which will not be elaborated here.

[0085] The display device includes an LED module 10, which includes an LED light source. Part of the light from the LED chip 100 in the LED light source can be emitted through the light outlet 311. Part of the light from the LED chip 100 is reflected sequentially by the first reflective surface 312 and the first reflective layer 500, and then emitted through the side of the transparent propagation layer 200. This increases the light emission angle of the LED light source, improves the light utilization rate and backlight brightness. Using the LED light source in a backlight module or LED direct display device can reduce the number of LED light sources, thereby reducing production costs.

[0086] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0087] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0088] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0089] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. An LED light source, comprising an LED chip, the LED chip including a light-emitting portion and a bonding end for bonding with a driving substrate, the bonding end being located on the bottom surface of the light-emitting portion, characterized in that, The LED light source also includes: A transparent propagation layer, which covers the light-emitting part and exposes the bonding end, and the bottom surface of the transparent propagation layer is used to configure a first reflective layer; A light-blocking plate is disposed on the top surface of the transparent propagation layer. The light-blocking plate includes a reflective cavity that extends from the top surface of the light-blocking plate to the bottom surface of the light-blocking plate. A light inlet is formed on the bottom side of the reflective cavity, and a light outlet is formed on the top side of the reflective cavity. The light inlet is larger than the light outlet. A first reflective surface is formed on the inner surface of the reflective cavity. The first reflective surface is inclined relative to the bottom surface of the transparent propagation layer. In this process, some of the light from the LED chip can be emitted through the light outlet, and some of the light from the LED chip is reflected sequentially by the first reflective surface and the first reflective layer, and then emitted through the side of the transparent propagation layer.

2. The LED light source according to claim 1, characterized in that, The reflecting cavity is a frustum-shaped hollow cavity.

3. The LED light source according to claim 1, characterized in that, Multiple reflective cavities are arranged at intervals on the light-blocking plate, wherein: the distance between adjacent reflective cavities gradually decreases from the center of the light-blocking plate to its edge; and / or The light outlet of the reflective cavity gradually increases from the center of the light-blocking plate to its edge.

4. The LED light source according to claim 3, characterized in that, The orthographic projection of some of the reflective cavities onto the transparent propagation layer is located within the area where the LED chip is located, while the orthographic projection of some of the reflective cavities onto the transparent propagation layer is located outside the area where the LED chip is located.

5. The LED light source according to claim 1, characterized in that, The bottom surface of the light-blocking plate includes a second reflective surface.

6. The LED light source according to claim 1, characterized in that, The LED light source also includes the first reflective layer, which is disposed on the bottom surface of the transparent propagation layer.

7. An LED module, characterized in that, include: Drive substrate; The LED light source as described in any one of claims 1 to 6, wherein the LED chip is bonded to the top surface of the driving substrate via the bonding end, and the LED light source is multiple and spaced apart; A second reflective layer is disposed on the top surface of the driving substrate and surrounds the LED light source; The bottom surface of the transparent propagation layer is projected onto the driving substrate in the second reflective layer.

8. The LED module according to claim 7, characterized in that, The size of the LED light source is less than 200 micrometers, and the spacing between adjacent LED light sources is less than 0.3 millimeters; and / or The plurality of LED light sources include red LED light sources, green LED light sources and blue LED light sources.

9. A display device, characterized in that, include: The LED module as described in claim 7 or 8; The driving module is connected to the driving substrate.

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