Antenna module and communication device equipped with antenna module

Abstract

The antenna module (100) includes: a dielectric substrate (130) on which a feed element (121) is formed; a dielectric substrate (140) on which a ground electrode (GND) is formed; and a conductive member (170). The dielectric substrate (140) is configured to face the dielectric substrate (130). When viewed from the normal direction of the feed element (121), the conductive member (170) is disposed around the feed element (121). An air layer (185) is formed between the dielectric substrate (130) and the dielectric substrate (140), and the conductive member (170) is formed in the air layer (185).

Description

Technical Field

[0001] This disclosure relates to an antenna module and a communication device equipped with the antenna module, and more specifically, to a technique for achieving reduced reflection loss and wide directivity across the entire broadband in the antenna module. Background Technology

[0002] International Publication No. 2016 / 067969 (Patent Document 1) discloses an antenna module in which a feed element and a high-frequency semiconductor element are integrally mounted on a dielectric substrate. The antenna module disclosed in International Publication No. 2016 / 067969 (Patent Document 1) can be used, for example, in portable terminals such as mobile phones or smartphones.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2016 / 067969 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] In portable terminals, in addition to miniaturization and thinning, further improvements are required for antenna characteristics such as reflection loss and gain.

[0008] Generally speaking, to achieve broadband reflection loss, methods are known to either increase the distance between the radiating element and the ground electrode or reduce the effective dielectric constant of the dielectric substrate forming the antenna module. However, in the former case, the overall thickness of the antenna module increases, thus hindering miniaturization and height reduction of the antenna module.

[0009] Furthermore, in the latter case, although the reflection characteristics are broadbanded due to the reduction in the effective dielectric constant, the peak gain increases, resulting in a sharper directivity. Therefore, the beamwidth required to achieve the specified gain becomes narrower. In other words, there is a trade-off between ensuring reduced reflection loss across the entire broadband and ensuring broad directivity when reducing the effective dielectric constant.

[0010] This disclosure was made to solve such a problem, with the aim of achieving reduced reflection loss and wide directivity across the entire broadband in an antenna module.

[0011] Solution for solving the problem

[0012] An antenna module according to a certain aspect of the present invention includes: a first dielectric substrate on which a first radiating element is formed; a second dielectric substrate on which a ground electrode is formed; and a conductive member. The second dielectric substrate is configured to face the first dielectric substrate. Viewed from the normal direction of the first radiating element, the conductive member is disposed around the first radiating element. A low-dielectric-constant layer having a dielectric constant lower than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate, and the conductive member is formed in this low-dielectric-constant layer.

[0013] Other aspects of the present invention relate to an antenna module comprising: a first dielectric substrate on which a first radiating element is formed; a second dielectric substrate on which a ground electrode is formed; and a conductive member. The second dielectric substrate is configured to face the first dielectric substrate. Viewed from the normal direction of the first radiating element, the conductive member is disposed around the first radiating element. An air layer is formed between the first and second dielectric substrates, and the conductive member is formed in this air layer.

[0014] The effects of the invention

[0015] According to the antenna module disclosed herein, the dielectric substrate forming the antenna module is constructed using a first dielectric substrate including a radiating element and a second dielectric substrate including a ground electrode. A low-dielectric-constant layer (air layer) with a dielectric constant lower than that of the first dielectric substrate is formed between the two dielectric substrates. By forming this low-dielectric-constant layer, the effective dielectric constant can be reduced, thereby achieving a reduction in reflection loss over the entire broadband. Furthermore, conductive members are disposed around the radiating element in this low-dielectric-constant layer, thereby blocking a portion of the electromagnetic field generated between the radiating element and the ground electrode, thus ensuring wide directivity. Attached Figure Description

[0016] Figure 1 This is a block diagram of a communication device using the antenna module described in Implementation Method 1.

[0017] Figure 2 These are top views and cross-sectional views of the antenna module involved in Implementation Method 1.

[0018] Figure 3 This is a diagram used to illustrate the antenna characteristics of the antenna module involved in Embodiment 1 and the antenna module of the comparative example.

[0019] Figure 4 This is a diagram used to illustrate the gain characteristics of an antenna module.

[0020] Figure 5 This is a diagram used to illustrate the directivity of the antenna module.

[0021] Figure 6 This is a cross-sectional view of the antenna module involved in Implementation Method 2.

[0022] Figure 7 This is a diagram showing the details near the conductive component when a photoresist has been applied to the dielectric substrate.

[0023] Figure 8 This is a diagram used to illustrate the antenna characteristics of the antenna module involved in Embodiment 3.

[0024] Figure 9 This is a diagram used to illustrate the antenna characteristics of the antenna module involved in Embodiment 4.

[0025] Figure 10 This is a cross-sectional view of the antenna module involved in Implementation Method 5.

[0026] Figure 11 These are top views and cross-sectional views of the antenna module involved in Implementation Method 6.

[0027] Figure 12 It is used for explanation Figure 11 A diagram showing the reflection loss of the second harmonic in the antenna module.

[0028] Figure 13 This is a diagram illustrating a modified example of the configuration of conductive components.

[0029] Figure 14 This is a diagram used to illustrate a modified example of a low dielectric constant layer.

[0030] Figure 15 This is a top view of the dual-polarized antenna module according to embodiment 7.

[0031] Figure 16 This is a top view of the first example of the array-type antenna module according to Embodiment 8.

[0032] Figure 17 This is a top view of a second example of an array-type antenna module according to Embodiment 8.

[0033] Figure 18 This is a top view of the first variant of the antenna module in the second example.

[0034] Figure 19 This is a top view of a second variation of the antenna module in the second example.

[0035] Figure 20 This is a top view of the third example of the array-type antenna module according to Embodiment 8.

[0036] Figure 21This is a top view of the fourth example of the array-type antenna module according to Embodiment 8.

[0037] Figure 22 This is a cross-sectional view of the antenna module involved in Implementation Method 9.

[0038] Figure 23 This is a cross-sectional view of the antenna module involved in Implementation Method 10.

[0039] Figure 24 These are top views and cross-sectional views of the antenna module involved in Embodiment 11.

[0040] Figure 25 These are top views and cross-sectional views of the array-type antenna module involved in Embodiment 12.

[0041] Figure 26 This is a top view used to illustrate a first example of the antenna module involved in Embodiment 13.

[0042] Figure 27 This is a top view of a second example of the antenna module according to Embodiment 13. Detailed Implementation

[0043] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0044] [Implementation Method 1]

[0045] (Basic structure of a communication device)

[0046] Figure 1 This is an example of a block diagram of a communication device 10 using the antenna module 100 described in Embodiment 1. The communication device 10 may be, for example, a portable terminal such as a mobile phone, smartphone, or tablet computer, a personal computer with communication capabilities, or a base station. An example of the frequency band of the radio waves used by the antenna module 100 described in this embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands can also be used.

[0047] Reference Figure 1 The communication device 10 includes an antenna module 100 and a BBIC 200 constituting a baseband signal processing circuit. The antenna module 100 includes an RFIC 110 as an example of a feed circuit and an antenna device 120. The communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and then radiates it from the antenna device 120. Furthermore, the high-frequency signal received by the antenna device 120 is down-converted and processed by the BBIC 200.

[0048] exist Figure 1 For ease of explanation, only the structures corresponding to four of the multiple feed elements 121 constituting the antenna device 120 are shown; structures corresponding to other feed elements 121 having the same structure are omitted. Furthermore, in Figure 1 The diagram shows an example of an antenna device 120 formed by a plurality of feed elements 121 arranged in a two-dimensional array. However, the feed elements 121 do not necessarily have to be multiple; the antenna device 120 may also be formed by a single feed element 121. Alternatively, a one-dimensional array of multiple feed elements 121 arranged in a column may also be used. In this embodiment, the feed element 121 is a patch antenna with a generally square planar shape.

[0049] RFIC 110 includes switches 111A-111D, 113A-113D, 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, signal synthesizer / demultiplexer 116, mixer 118, and amplifier circuit 119.

[0050] When transmitting high-frequency signals, switches 111A-111D and 113A-113D are switched to the power amplifier 112AT-112DT side, and switch 117 is connected to the transmitting-side amplifier of amplifier circuit 119. When receiving high-frequency signals, switches 111A-111D and 113A-113D are switched to the low-noise amplifier 112AR-112DR side, and switch 117 is connected to the receiving-side amplifier of amplifier circuit 119.

[0051] The signal transmitted from BBIC 200 is amplified by amplifier circuit 119 and then up-converted by mixer 118. The up-converted high-frequency transmission signal is divided into four signals by signal synthesizer / demultiplexer 116 and fed to different feed elements 121 through four signal paths. At this time, the directivity of antenna device 120 can be adjusted by independently adjusting the phase shift of phase shifters 115A to 115D configured in each signal path.

[0052] The received signals, which are high-frequency signals, received by each feed element 121 are combined in the signal synthesizer / demultiplexer 116 via four different signal paths. The combined received signal is down-converted by the mixer 118, amplified by the amplifier circuit 119, and then transmitted to the BBIC 200.

[0053] RFIC 110 may be formed, for example, as a monolithic integrated circuit component including the circuit structure described above. Alternatively, the devices (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters) in RFIC 110 corresponding to each feed element 121 may be formed as monolithic integrated circuit components for each feed element 121.

[0054] (Structure of the antenna module)

[0055] Next, the detailed structure of the antenna module 100 in Embodiment 1 will be described. Figure 2 In the middle, on top ( Figure 2 (a) shows a top view of the antenna module 100, below ( Figure 2 (b) shows a cross-sectional view at line II-II in the top view.

[0056] Reference Figure 2 In addition to the feed element 121 and RFIC 110, the antenna module 100 also includes dielectric substrates 130 and 140, feed wiring 150, conductive components 170 and 180, and a ground electrode GND. Furthermore, in the following description, the positive direction of the Z-axis in each figure is sometimes referred to as the upper side, and the negative direction as the lower side. Additionally, in... Figure 2 In the top view of (a), a portion of the dielectric substrate 130 is omitted for easier observation of the internal structure.

[0057] The dielectric substrates 130 and 140 are, for example, low-temperature co-fired ceramic (LTCC) multilayer substrates, multilayer resin substrates formed by stacking multiple resin layers composed of epoxy, polyimide, or other resins, multilayer resin substrates formed by stacking multiple resin layers composed of liquid crystal polymer (LCP) with a lower dielectric constant, multilayer resin substrates formed by stacking multiple resin layers composed of fluorine-based resins, or ceramic multilayer substrates other than LTCC. Furthermore, the dielectric substrates 130 and 140 are not necessarily multilayer structures and may also be single-layer substrates. Furthermore, in... Figure 2 In the antenna module 100 shown, the example is that the dielectric substrate 130 is formed of polyimide and the dielectric substrate 140 is formed of LTCC. However, the dielectric substrate 130 and the dielectric substrate 140 may also be formed of the same material.

[0058] Dielectric substrates 130 and 140 have rectangular flat plate shapes and are configured such that the back surface 132 of dielectric substrate 130 and the surface 141 of dielectric substrate 140 face each other at a predetermined interval. Specifically, an air layer 185 is formed between dielectric substrates 130 and 140. Conductive members 170 and 180 are formed in the air layer 185, and dielectric substrates 130 and 140 are connected via these conductive members 170 and 180.

[0059] A roughly square power supply element 121 is disposed in an inner layer of the dielectric substrate 130 or on the upper surface 131. A ground electrode GND is disposed on the dielectric substrate 140. Conductive members 170 and 180 are connected to the upper surface 141 of the dielectric substrate 140, and an RFIC 110 is disposed on the lower back surface 142 across solder bumps 160.

[0060] Feed wiring 150 extends from RFIC 110 through the ground electrode GND, passes through conductive member 180, and reaches feed point SP1 of feed element 121. Conductive member 180 functions as a connection electrode connecting the portion of feed wiring 150 located within dielectric substrate 130 to the portion of feed wiring 150 located within dielectric substrate 140. According to this structure, the high-frequency signal supplied from RFIC 110 is transmitted to feed point SP1 of feed element 121 via feed wiring 150. Feed point SP1 is located at the intersection of the center (diagonal lines) of feed element 121. Figure 2 The position offset in the negative direction of the X-axis. A high-frequency signal is supplied to the feed point SP1 to radiate an electromagnetic wave polarized in the X-axis direction from the feed element 121. Furthermore, the portion of the feed wiring 150 located within the dielectric substrate 130 is not a necessary structure. If the dielectric substrate 130 is thin, a high-frequency signal can be supplied to the feed element 121 non-contactly via capacitive coupling between the conductive member 180 and the feed element 121.

[0061] The conductive component 170 is any device or component formed in a manner that incorporates a conductive material. The conductive component 170 may, for example, be as described in Embodiment 2 (…). Figure 6 The electrode connection material described later in this paper includes solder bumps, columnar conductor posts, conductor pins, and / or electroplated electrodes (terminals). Alternatively, the conductive member 170 may also be as described in Embodiment 9. Figure 22 Electronic components (resistors, capacitors, etc.) as described later in the section on antenna module 100. In antenna module 100, conductive member 170 is a rectangular conductive material with dimensions smaller than those of feed element 121.

[0062] In the antenna module 100, when viewed from above in the normal direction of the flat-shaped feed element 121, a plurality of conductive members 170 are arranged around the feed element 121 in a manner separate from the feed element 121. More specifically, the plurality of conductive members 170 are arranged in a manner that they are spaced apart from each other along the sides of the rectangular-shaped feed element 121.

[0063] The conductive member 170 is provided to impede a portion of the electromagnetic field generated between the feed element 121 and the ground electrode GND, as described later. Therefore, it is preferable that, with the wavelength of the electromagnetic wave radiated from the feed element 121 set to λ, the conductive member 170 is positioned within a distance of λ / 4 from the feed element 121. Furthermore, the conductive member 170 can be configured as follows: Figure 2 As shown in (b), it can be directly connected to the ground electrode GND, or it can be indirectly connected to the ground electrode GND through capacitive coupling.

[0064] Antenna modules like those described above are sometimes used in portable terminals such as mobile phones or smartphones. In recent years, portable terminals have been required to achieve both miniaturization and thinness, as well as further widening of antenna characteristics such as reflection loss and gain.

[0065] Generally speaking, in antenna modules using patch antennas with a flat panel shape, methods to achieve broadband reflection loss include increasing the distance between the radiating element and the ground electrode, or reducing the effective dielectric constant of the dielectric substrate forming the antenna module. However, increasing the distance between the radiating element and the ground electrode, as in the former case, results in an increase in the overall thickness of the antenna module, which may become a major obstacle to reducing the height and miniaturizing the antenna module.

[0066] On the other hand, when the effective dielectric constant of the dielectric substrate is reduced, as in the latter case, in addition to broadbanding of reflection loss, the peak gain also increases, potentially leading to sharp directivity. Increased peak gain is preferable because it extends the radiation distance of the radio wave. However, there is a situation where, because the energy of the radiated radio wave is concentrated in a certain direction, the space within which the specified gain can be ensured becomes narrower. Thus, it is possible that the desired gain cannot be achieved within the target space.

[0067] In the antenna module 100 according to Embodiment 1, the feed element 121 and the ground electrode GND are formed on different dielectric substrates 130 and 140, respectively, and an air layer 185 is formed between the dielectric substrates 130 and 140. Generally speaking, the dielectric constant of air is lower than that of the dielectric substrates 130 and 140. Therefore, compared with the case without the air layer 185, by forming the air layer 185 on the dielectric substrate as in the antenna module 100, the effective dielectric constant between the feed element 121 and the ground electrode GND can be reduced. As a result, reflection loss can be reduced, and broadband reflection loss can be achieved.

[0068] Furthermore, in the antenna module 100 according to Embodiment 1, as described above, conductive members 170 are arranged around the feed element 121 in the air layer 185 when viewed from above. The antenna module 100 functions as an antenna by electromagnetically coupling the feed element 121 to the ground electrode GND, generating an electromagnetic field between the feed element 121 and the ground electrode GND. The electric field lines generated at this time are mainly on the sides of the feed element 121 that are orthogonal to the same polarization direction (i.e., on the side where the polarization direction is the same). Figure 2 The side parallel to the Y-axis in the middle is connected to the ground electrode GND as follows: Figure 2 The electromagnetic field is generated as shown by arrow AR1. Therefore, by placing the conductive member 170 at a location separate from the feeding element 121, a portion of the generated electromagnetic field is captured by the conductive member 170. As a result, although the peak gain at the resonant frequency decreases slightly, gain drop over a wide range can be suppressed. Thus, it is possible to suppress directivity narrowing while maintaining broadband reflection loss.

[0069] Figure 3 This is a diagram used to illustrate the antenna characteristics of the antenna module 100 according to Embodiment 1. Figure 3 In this example, the antenna characteristics of the antenna module 100 according to Embodiment 1 will be compared with the antenna characteristics of two comparative examples for explanation. Figure 3 The diagram above shows the structure of the antenna module of Embodiment 1 and Comparative Examples 1 and 2, the curve of reflection loss, the bandwidth when the reflection loss is less than 6dB, the peak gain, and the angle at which the peak gain of -3dB can be achieved (hereinafter referred to as "-3dB angle").

[0070] Here, use Figure 4 and Figure 5 Let's explain the definitions of "peak gain" and "-3dB angle" in more detail. Figure 4 This is a three-dimensional diagram showing the gain of the electromagnetic waves radiated from the feed element 121. Figure 4 In this context, "φ" represents the tilt angle about the Z-axis starting from the X-axis, and "θ" represents the tilt angle about the X-axis starting from the Z-axis. For example... Figure 4 As shown, the gain peaks in the positive direction of the Z-axis. Additionally, Figure 5 This is a graph showing the gain when the tilt angle θ around the X-axis is 90°, using the tilt angle θ around the X-axis as a parameter. In this embodiment, Figure 5 The maximum value of the gain shown is set as the "peak gain", and the magnitude of the tilt angle θ when the gain drops by 3dB from the peak gain is defined as the "-3dB angle". In other words, the "-3dB angle" is equivalent to the radiation angle of the radio wave.

[0071] Refer again Figure 3 The antenna module 100#1 of Comparative Example 1 is an antenna module with a structure in which no air layer is provided between the feed element 121 and the ground electrode GND. The antenna module 100#2 of Comparative Example 2 is an antenna module with a structure in which the conductive member 170 is removed from the structure of Embodiment 1.

[0072] In antenna module 100#1 of Comparative Example 1, the bandwidth is 3.2 GHz with a reflection loss of less than 6 dB, the peak gain is 6.64 dB, and the -3 dB angle is 92.0°. In Comparative Example 2, the bandwidth is 3.4 GHz with a reflection loss of less than 6 dB, achieving broadband performance compared to Comparative Example 1. On the other hand, the peak gain is 6.87 dB, which is larger than that of Comparative Example 1, and the -3 dB angle is narrowed to 88.4°.

[0073] In contrast, in the antenna module 100 of Embodiment 1, the bandwidth is 3.4 GHz when the reflection loss is less than 6 dB, which is broadband compared to Comparative Example 1, similar to Comparative Example 2. Furthermore, the peak gain is 6.72 dB, which is greater than the peak gain of Comparative Example 1 but less than the peak gain of Comparative Example 2. Regarding the -3 dB angle, it is also a value between Comparative Example 1 and Comparative Example 2 (89.2°). That is, compared to Comparative Example 2, wide directivity can be ensured while maintaining bandwidth.

[0074] Furthermore, the effect of the conductive member 170 on the gain can vary depending on the size, number, position, conductivity, etc. of the conductive member 170. Therefore, the configuration of the conductive member 170 can be appropriately selected according to the desired gain characteristics.

[0075] As described above, in the antenna module, by forming the feed element and the ground electrode on different dielectric substrates and forming an air layer between these two dielectric substrates, it is possible to ensure a reduction in reflection loss and wide directivity across the entire broadband.

[0076] Furthermore, the "feeding element 121" in Embodiment 1 corresponds to the "first radiating element" of this disclosure. Additionally, the "dielectric substrate 130" and "dielectric substrate 140" in Embodiment 1 correspond to the "first dielectric substrate" and "second dielectric substrate" of this disclosure, respectively. The "air layer 185" in Embodiment 1 corresponds to the "low dielectric constant layer" and "air layer" of this disclosure.

[0077] [Implementation Method 2]

[0078] In Embodiment 2, the case where the conductive component is formed of an electrode connecting material will be described.

[0079] Figure 6 This is a cross-sectional view of the antenna module 100A according to Embodiment 2. (Refer to...) Figure 6 The antenna module 100A has a structure in which the conductive members 170 and 180 of the antenna module 100 of Embodiment 1 are formed using an electrode connection material 175, and the other structures are the same as those of the antenna module 100. Solder can be used as the electrode connection material 175, for example. The electrode connection material 175 is connected to the electrode pads 190 formed on the back surface 132 of the dielectric substrate 130 and the electrode pads 195 formed on the surface 141 of the dielectric substrate 140.

[0080] Furthermore, a protective resist can be formed on the back surface 132 of the dielectric substrate 130 and the surface 141 of the dielectric substrate 140. For example... Figure 7 As shown, the photoresist 196 can be a clearance resist formed by creating a gap between the photoresist 196 and the electrode pad. Figure 7 (a) can also be an over-resist, formed by covering a portion of the electrode pads. Figure 7 (b)

[0081] Furthermore, regarding the antenna characteristics in the antenna module 100A of Embodiment 2, if the conductivity of the conductive member and the electrode connection material are the same, then it is essentially the same as... Figure 3 The antenna characteristics of the antenna module 100 in Embodiment 1 shown are the same. Therefore, in the antenna module 100A, it is also possible to ensure the reduction of reflection loss and wide directivity across the entire broadband.

[0082] [Implementation Method 3]

[0083] In Embodiment 3, it is explained that a structure in which a through hole is formed in the dielectric substrate on which a ground electrode is disposed is also connected to a conductive member.

[0084] Figure 8This is a diagram illustrating the antenna characteristics of the antenna module 100B according to Embodiment 3. Furthermore, in Figure 8 In this description, the antenna module 100A shown in Embodiment 2 will be used as a comparative example.

[0085] Reference Figure 8 In the antenna module 100B of Embodiment 3, in addition to the structure of the antenna module 100A of Embodiment 2, it also has a through-hole electrode 197 connected to the electrode pad 195 of the dielectric substrate 140. One end of the through-hole electrode 197 is connected to the electrode pad 195, and the other end is set to an open circuit state not connected to other conductive components. By providing such a through-hole electrode, the area that hinders the electromagnetic field between the feed element 121 and the ground electrode GND is increased, and as a result, the directivity can be adjusted.

[0086] like Figure 8 As shown, in antenna module 100A without the through-hole electrode 197, the peak gain is 6.72 dB and the -3 dB angle is 89.2°. On the other hand, in antenna module 100B of Embodiment 3 with the through-hole electrode 197, the peak gain is 6.65 dB and the -3 dB angle is 90.4°. That is, in antenna module 100B, the directivity is amplified.

[0087] By forming through-hole electrodes on a dielectric substrate with a ground electrode and connecting them to conductive members disposed in an air layer, as described above, the directionality can be further enhanced.

[0088] Furthermore, the "through-hole electrode 197" in Embodiment 3 corresponds to the "first through-hole electrode" in this disclosure.

[0089] [Implementation Method 4]

[0090] In Embodiment 4, a structure is described that adjusts the antenna characteristics by changing the position of the air layer between the feed element and the ground electrode.

[0091] Figure 9 This is a diagram used to illustrate the antenna characteristics of the antenna module 100C according to Embodiment 4. Figure 9 In this example, the antenna module 100A of Embodiment 2 is used as a comparative example.

[0092] The basic structure of antenna module 100C is the same as that of antenna module 100A in Embodiment 2, but compared to antenna module 100A, the air layer 185 in antenna module 100C is formed closer to the feed element 121. More specifically, in antenna modules 100A and 100C, the distance H0 between the feed element 121 and the ground electrode GND is the same. However, in antenna module 100A, the distance H1 from the feed element 121 to the conductive member (electrode pad 190) in the dielectric substrate 130 is greater than the distance H2 from the ground electrode GND to the conductive member (electrode pad 195) in the dielectric substrate 140 (H1>H2). On the other hand, in antenna module 100C, the distance H1A from the feed element 121 to the conductive member (electrode pad 190) in the dielectric substrate 130 is less than the distance H2A from the ground electrode GND to the conductive member (electrode pad 195) in the dielectric substrate 140 (H1A>H2). <H2A)。

[0093] Generally speaking, the intensity of the electromagnetic field formed between the feed element 121 and the ground electrode GND tends to increase the closer it is to the feed element 121. Therefore, the closer the air layer 185 is to the feed element 121, the greater the effect of reducing the effective dielectric constant and the greater the effect of widening the bandwidth. In addition, when the air layer 185 is brought closer to the feed element 121, the conductive member also comes closer to the feed element 121, thus increasing the electromagnetic field impeded by the conductive member. Therefore, the closer the air layer 185 is to the feed element 121, the greater the effect of directional widening.

[0094] exist Figure 9 In the example, when comparing antenna module 100A and antenna module 100C, the bandwidth for reflection loss increased from 3.4 GHz to 4.1 GHz. Additionally, the -3 dB angle also increased from 89.2° to 90.4°. Therefore, by adjusting the thickness of the dielectric substrates 130 and 140 and bringing the air layer 185 close to the feed element 121, it is possible to ensure reduced reflection loss and wide directivity across the entire broadband.

[0095] Furthermore, the peak gain of the antenna module 100C is 6.56dB, which is higher than... Figure 3The peak gain (6.64dB) of antenna module 100#1 without an air layer is low. Therefore, depending on the required peak gain specifications, the structure of antenna module 100C may be unsuitable. That is, when peak gain is important, it is preferable that the distance between the feed element 121 in the dielectric substrate 130 and the electrode pad 190 is greater than the distance between the ground electrode GND and the electrode pad 195 of the dielectric substrate 140, as in antenna module 100A. Conversely, when wider directivity is important, it is preferable that the distance between the feed element 121 in the dielectric substrate 130 and the electrode pad 190 is smaller than the distance between the ground electrode GND and the electrode pad 195 of the dielectric substrate 140, as in antenna module 100C.

[0096] [Implementation Method 5]

[0097] In Embodiment 5, a structure is described in which a phase adjustment circuit is formed on the feed wiring that transmits high-frequency signals from the RFIC to the feed element.

[0098] Figure 10 This is a cross-sectional view of the antenna module 100D according to Embodiment 5. In addition to having the structure of the antenna module 100A shown in Embodiment 2, the antenna module 100D also has a phase adjustment circuit 155 formed on the feed wiring 150 in the dielectric substrate 140. Moreover, the dielectric constant ε2 of the dielectric substrate 140 is greater than the dielectric constant ε1 of the dielectric substrate 130 (ε1<ε2).

[0099] The phase adjustment circuit 155 is used, for example, in situations where high-frequency signals are supplied to two different feed points to radiate radio waves with the same polarization direction, by forming a coupler or a distributed constant filter that utilizes line length and / or capacitance patterns to make the phases of the supplied high-frequency signals out of phase with each other. Alternatively, it is used in situations where high-frequency signals are supplied to two radiating elements with different resonant frequencies through the same feed wiring, by forming a stub on the feed wiring to remove the signal on the other side.

[0100] The amount of phase adjustment by the phase adjustment circuit 155 is determined by the wavelength of the high-frequency signal passing through the dielectric substrate and the length of the line forming the phase adjustment circuit 155. The wavelength varies depending on the dielectric constant of the dielectric substrate on which the phase adjustment circuit 155 is formed; a higher dielectric constant results in a shorter wavelength. Therefore, when a large phase adjustment is required, a smaller dielectric constant of the dielectric substrate necessitates a larger size for the phase adjustment circuit 155. Consequently, the phase adjustment circuit 155 can be miniaturized by making the dielectric constant of the dielectric substrate on which the phase adjustment circuit 155 is formed relatively large.

[0101] Furthermore, as explained in Embodiment 4, the reduction in effective dielectric constant makes it more effective to have a lower dielectric constant in the region close to the feed element 121. Therefore, by forming the phase adjustment circuit 155 on the dielectric substrate 140, which is far from the feed element 121, and by making the dielectric constant of the dielectric substrate 140 higher than that of the dielectric substrate 130, it is possible to improve the efficiency of broadbanding of reflection loss and to achieve miniaturization of the phase adjustment circuit 155.

[0102] [Implementation Method 6]

[0103] In Embodiment 6, a structure is described that uses a conductive member disposed in the air layer to suppress higher harmonics of electromagnetic waves radiated from the radiating element.

[0104] Figure 11 This is a diagram illustrating the structure of the antenna module 100E according to Embodiment 6. Figure 11 In the middle, on top ( Figure 11 (a) shows a top view of the antenna module 100E, below ( Figure 11 (b) shows a cross-sectional view at line XI-XI in the top view.

[0105] Reference Figure 11 In antenna module 100E, similarly to antenna module 100 of Embodiment 1, a plurality of conductive members 170 are arranged in air layer 185 along each side of the generally square feed element 121. Furthermore, adjacent conductive members 170 are connected by connection lines 177 formed on dielectric substrate 140. More specifically, six conductive members 170-1 to 170-6 are arranged along each side of feed element 121, and each pair of conductive members 170-1 and 170-2, 170-3 and 170-4, and 170-5 and 170-6 are connected by connection lines 177.

[0106] Here, the length of the connecting line 177 is set such that the resonant frequency of the structure formed by the connecting line 177 and the two conductive members 170 connected thereto is twice the resonant frequency of the feed element 121. Thus, the second harmonic radiated from the feed element 121 is captured by the structure formed by the connecting line 177 and the conductive members 170. Consequently, the second harmonic component in the radio waves radiated from the antenna module 100E can be reduced.

[0107] Furthermore, in the example above, the reduction of the second harmonic component was illustrated. However, the length of the connecting line 177 can be adjusted so that the resonant frequency of the structure formed by the connecting line 177 and the two conductive members 170 connected thereto is N times the resonant frequency of the feeding element 121 (N is an integer greater than or equal to 3), thereby suppressing the Nth harmonic component. However, generally speaking, the magnitude of harmonic components above the third harmonic component is smaller than that of the second harmonic component. Therefore, it is practically possible to sufficiently reduce the influence of higher harmonic components by suppressing the second harmonic component.

[0108] Figure 12 It is used for explanation Figure 11 A diagram showing the reflection loss of the second harmonic in antenna module 100E. Figure 12 In the diagram, solid line LN10 shows the antenna module 100E of Embodiment 6 where the conductive members 170 are connected, and broken line LN11 shows a comparative example where the conductive members 170 are not connected. Furthermore, in Figure 12 In the example, the frequency band of the radio waves radiated from the feed element 121 is 26.5 GHz to 29.5 GHz, and therefore, the frequency band of the second harmonic is 53 GHz to 59 GHz.

[0109] like Figure 12 As shown, in the frequency band of the second harmonic ( Figure 12 Within the range (BW), the reflection loss of antenna module 100E is greater than that of the comparative example. That is, compared to the comparative example, it is difficult to radiate the second harmonic in antenna module 100E. Therefore, the influence of harmonic components in the radio waves radiated from feed element 121 is suppressed.

[0110] Furthermore, in Embodiment 6, one of the conductive components connected by the connecting line 177 corresponds to the "first component" of this disclosure, and the other conductive component corresponds to the "second component" of this disclosure.

[0111] (Modified Example)

[0112] exist Figure 13 and Figure 14 The text describes variations in the configuration of conductive components and alternative examples of air layers.

[0113] In the antenna modules of the various embodiments described above, a structure is described in which multiple rectangular conductive members are arranged separately from each other along the sides of a generally square feed element. However, the shape and arrangement of the conductive members can be any other manner as long as they can impede the electromagnetic field between the feed element and the ground electrode.

[0114] For example, it can also be like Figure 13The conductive member 170A in antenna module 100F (a) is formed as a straight line that runs continuously along each side of the feed element 121. Furthermore, in the example of conductive member 170A in antenna module 100F, the straight members along each side are connected to each other and are configured to surround the feed element 121.

[0115] In the case of a rectangular feeding element 121, the electric field is mainly generated from the side orthogonal to the polarization direction. Therefore, it is effective to arrange the conductive member along at least one side orthogonal to the polarization direction. Specifically, it can also be done as follows: Figure 13 In antenna module 100G (b), multiple conductive members 170 are arranged along the edge of the feed element 121 in the Y-axis direction. Alternatively, it can be arranged as follows: Figure 13 A rectangular conductive member 170B is arranged along the side of the feed element 121 in the Y-axis direction, as in the antenna module 100H of (c).

[0116] In addition, in the antenna modules of the above embodiments, a space (air layer 185) is formed between the dielectric substrate 130 and the dielectric substrate 140. However, for the portion of the air layer 185, a low dielectric constant layer can also be formed using a material with a lower dielectric constant than that of the dielectric substrate 130.

[0117] Specifically, it could also be, for example Figure 14 The antenna module 100I of (a) has a structure in which a dielectric 186 with a lower dielectric constant than that of the dielectric substrate 130 is filled between the dielectric substrate 130 and the dielectric substrate 140. Furthermore, it can also be, as in... Figure 14 The antenna module 100J of (b) has a structure in which, in addition to filling the space between the dielectric substrate 130 and the dielectric substrate 140 with dielectric 186A, the side of the dielectric substrate 130 is also covered with dielectric 186A.

[0118] Alternatively, the entire low-dielectric-constant layer can be made without a dielectric material; for example, it can be done in the following way: Figure 14 Like antenna module 100K (c), a dielectric 186B is disposed between dielectric substrates 130 and 140, in a portion inner than the conductive member 170, and a space is formed in a portion outer than the conductive member 170. Alternatively, it can be in the following manner: Figure 14In the antenna module 100L of (d), a dielectric 186C is disposed between the dielectric substrate 130 and the dielectric substrate 140, around the conductive member 170, and a space is formed in the portion inward of the dielectric 186C. Alternatively, although not shown in the figure, the dielectric may be partially formed in the thickness direction (Z-axis direction) between the dielectric substrate 130 and the dielectric substrate 140.

[0119] [Implementation Method 7]

[0120] In the above embodiments, a single-polarized antenna module in which the polarization direction of the radio wave radiated from the radiating element is directional is described. However, the features of this disclosure can also be applied to a dual-polarized antenna module in which the radio wave radiates from the radiating element in two different polarization directions.

[0121] Specifically, it could also be, in cases such as Figure 15 In the structure of antenna module 100M (a), which supplies high-frequency signals to feed point SP1 located in the negative X-axis direction relative to the center of feed element 121 and feed point SP2 located in the positive Y-axis direction relative to the center of feed element 121, a low dielectric constant layer is formed between dielectric substrate 130 and dielectric substrate 140, and conductive members 170 are disposed on the low dielectric constant layer. In this case, since radio waves are radiated in the X-axis and Y-axis directions, conductive members 170 are disposed along each side of feed element 121.

[0122] Alternatively, it could be like this: Figure 15 The antenna module 100N (b) has a structure in which multiple feed points are formed in each polarization direction. Specifically, for radio waves polarized along the X-axis, high-frequency signals are supplied to feed point SP1A, which is located in the negative X-axis direction relative to the center of feed element 121, and feed point SP1B, which is located in the positive X-axis direction relative to the center of feed element 121. For radio waves polarized along the Y-axis, high-frequency signals are supplied to feed point SP2A, which is located in the positive Y-axis direction relative to the center of feed element 121, and feed point SP2B, which is located in the negative Y-axis direction relative to the center of feed element 121.

[0123] Furthermore, when supplying high-frequency signals to two feed points with the same polarization direction, it is necessary to supply high-frequency signals with opposite phases to each feed point. Therefore, although in Figure 15 (b) is not shown, but a phase adjustment circuit as described in Embodiment 5 is formed on each feed line. Preferably, as described in Embodiment 5, the phase adjustment circuit is formed on a dielectric substrate 140 that is far from the feed element 121, and the dielectric constant of the dielectric substrate 140 is greater than that of the dielectric substrate 130.

[0124] <Array Antenna>

[0125] [Implementation Method 8]

[0126] In Embodiment 8, the case of an array-type antenna module in which multiple radiating elements are configured in an array shape will be described.

[0127] (first example)

[0128] Figure 16 This is a top view of the first example of the array-type antenna module according to Embodiment 8. Figure 16 In the antenna module 100P, two dielectric substrates 130A and 130B are arranged adjacently on a common dielectric substrate 140 in the X-axis direction, and feed elements 121A and 121B are formed on the dielectric substrates 130A and 130B, respectively. Furthermore, in the low dielectric constant layer (air layer) between the dielectric substrates 130A and 130B and the dielectric substrate 140, a plurality of conductive members 170 are arranged along each side of the feed elements 121A and 121B.

[0129] By adopting the structure described above, it is also possible to achieve both reduced reflection loss and wide directivity across the entire broadband in an array-type antenna module.

[0130] Furthermore, in the first example, "dielectric substrate 130A" and "dielectric substrate 130B" correspond to "first substrate" and "second substrate" in this disclosure, respectively. In addition, in the first example, "feeding element 121A" and "feeding element 121B" correspond to "first radiating element" and "third radiating element" in this disclosure, respectively.

[0131] (Second example)

[0132] Figure 17 This is a top view of a second example of the array-type antenna module according to Embodiment 8. Figure 17 In the antenna module 100Q, feed elements 121A and 121B are arranged along the X-axis on a common dielectric substrate 130, which is disposed on a dielectric substrate 140. Furthermore, in a low-dielectric-constant layer (air layer) between the dielectric substrates 130 and 140, a plurality of conductive members 170 are arranged along each side of the feed elements 121A and 121B. In the antenna module 100Q, each feed element is surrounded by a plurality of conductive members.

[0133] In array-type antenna modules as described above, it is also possible to ensure reduced reflection loss and wide directivity across the entire broadband.

[0134] Furthermore, in the case of an antenna module configured as in the second example, where the feed elements are arranged on a common dielectric substrate and capable of radiating radio waves in both the X-axis and Y-axis polarization directions, it is desirable to vary the length of the side of each feed element according to the length of the side of the common dielectric substrate in order to reduce the difference in radiation characteristics between the two polarizations. More specifically, in the case of... Figure 18 When the dielectric substrate 130 shown in the antenna module 100Q1 is rectangular with the X-axis as the long side, the same applies to the feed elements 121A and 121B. It is desirable to make the dimension LX in the X-axis direction greater than LY in the Y-axis direction (LX>LY) so as to narrow the spacing between the feed elements.

[0135] Compared to the antenna module 100P in the first example, the structure where the dielectric substrate is shared is equivalent to adding a dielectric material to the space between two dielectric substrates 130A and 130B. As a result, the effective dielectric constant in adjacent directions (i.e., the X-axis direction) of the two feed elements may change, and the impedance of the feed elements related to polarized waves in the X-axis direction may change. Consequently, the radiation characteristics of radio waves polarized in the X-axis direction may differ from those polarized in the Y-axis direction.

[0136] In this case, the impedance related to the polarization of the X-axis wave can be adjusted by making the X-axis dimension of the feed elements 121A and 121B larger than the Y-axis dimension, as in antenna module 100Q1. Therefore, the difference between the radiation characteristics of the radio wave polarized in the X-axis direction and the radiation characteristics of the radio wave polarized in the Y-axis direction can be reduced.

[0137] Alternatively, instead of changing the size of the feeding element, the shape of the conductive member 170 arranged around the feeding element can be changed, thereby reducing the difference between the radiation characteristics of the radio wave polarized in the X-axis direction and the radiation characteristics of the radio wave polarized in the Y-axis direction.

[0138] Specifically, such as Figure 19As shown in the antenna module 100Q2, when viewed from the normal direction of the dielectric substrate 130, the conductive member 170 arranged facing the edges of the feed elements 121A and 121B along the X-axis is smaller than the conductive member 170 arranged facing the edges of the feed elements 121A and 121B along the Y-axis. Therefore, compared to the coupling in the X-axis direction between the radiating element and the conductive member, the coupling in the Y-axis direction is smaller, and the impedance in the Y-axis direction increases. Thus, for the impedance change in the X-axis direction caused by the shared dielectric substrate, the impedance in the Y-axis direction can be adjusted by changing the coupling with the conductive member, thereby reducing the impedance difference between the two polarization directions. Therefore, the difference in the radiation characteristics of the radio waves in the two polarization directions can be reduced.

[0139] (Third case)

[0140] Figure 20 This is a top view of the third example of the array-type antenna module according to Embodiment 8. Figure 20 The antenna module 100R is in Figure 17 The third example of the antenna module 100Q is obtained by removing the conductive member 170 between the feed element 121A and the feed element 121B.

[0141] In array-type antenna modules with structures like those described above, it is also possible to ensure reduced reflection loss and wide directivity across the entire broadband.

[0142] Furthermore, in the second and third examples, "feeding element 121A" and "feeding element 121B" correspond to "first radiating element" and "fourth radiating element" in this disclosure, respectively.

[0143] (Fourth case)

[0144] Figure 21 This is a top view of the fourth example of the array-type antenna module according to Embodiment 8. Figure 21 The antenna module 100S has the following structure: two sets of antenna modules are arranged on a common dielectric substrate 140. Figure 20 The structure shown depicts multiple feeding elements arranged on a common dielectric substrate. That is, the antenna module 100S is a 2×2 array antenna.

[0145] More specifically, in the antenna module 100S, rectangular dielectric substrates 130 and 130C are arranged adjacently on a common dielectric substrate 140 in the Y-axis direction, and feed elements 121A and 121B are arranged adjacently on the dielectric substrate 130 in the X-axis direction. Feed elements 121C and 121D are arranged adjacently on the dielectric substrate 130C in the X-axis direction. Furthermore, in the low dielectric constant layer (air layer) between the dielectric substrates 130 and 140 and between the dielectric substrates 130C and 140, a plurality of conductive members 170 are arranged around each feed element. In addition, the conductive members 170 between feed elements 121A and 121B, and between feed elements 121C and 121D, are removed.

[0146] In array-type antenna modules with structures like those described above, it is also possible to ensure reduced reflection loss and wide directivity across the entire broadband.

[0147] Furthermore, the examples above illustrate the application of the features of this disclosure to 1×2 or 2×2 array antennas, but the features of this disclosure can also be applied to array antennas that include more feed elements.

[0148] <Stacked Antenna>

[0149] The antenna modules described in Embodiments 1 to 7 are antenna modules having individual radiating elements. In Embodiments 9 to 12 below, the structures in which the features of this disclosure are applied to stacked antenna modules are described.

[0150] [Implementation Method 9]

[0151] Figure 22 This is a cross-sectional view of the antenna module 100T according to Embodiment 9. The antenna module 100T includes a feed element 121 and a passive element 122 as radiating elements. The passive element 122 is formed on a dielectric substrate 130. On the other hand, the feed element 121 is disposed on a dielectric substrate 140 facing the passive element 122. The feed element 121 and the passive element 122 have approximately the same dimensions, and their resonant frequencies are also set to approximately the same.

[0152] Ground electrodes GND1 and GND2 are disposed on dielectric substrate 140 facing the power supply element 121. Ground electrodes GND1 and GND2 are positioned below the power supply element 121 (in the negative Z-axis direction), with ground electrode GND1 disposed in the layer between the power supply element 121 and ground electrode GND2. That is, the power supply element 121 is disposed between the passive element 122 and the ground electrode GND1. The layer between ground electrodes GND1 and GND2 is used as a wiring layer. Power supply wiring 150 extends from RFIC 110 through ground electrodes GND2 and GND1 and connects to the power supply element 121.

[0153] An air layer 185 is formed between dielectric substrate 130 and dielectric substrate 140, and an electronic component 176, serving as a conductive member, is disposed in the air layer 185. Viewed from the normal direction of the antenna module 100T, the electronic component 176 is disposed around the radiating elements (feed element 121, passive element 122) in a manner separate from the radiating elements. When the wavelength of the radiated electromagnetic wave is set to λ, the electronic components 176 are arranged such that the distance between adjacent electronic components 176 is λ / 4 or less.

[0154] In the antenna module 100T, a passive element 122 with a resonant frequency close to that of the feed element 121 is arranged in the radiation direction, thus expanding the bandwidth of reflection loss. Furthermore, an air layer 185 (a low-dielectric-constant layer) is formed between the dielectric substrates 130 and 140, further expanding the bandwidth of reflection loss. Moreover, by arranging an electronic component 176 (a conductive member) in the air layer 185, wide directivity is ensured. Generally, the dimensional accuracy of the electronic component 176 is higher than that of the solder. Therefore, by using the electronic component 176 as a conductive member, the dimensional accuracy in the height direction (Z-axis direction) of the air layer 185 can be improved.

[0155] In addition, Figure 22 In this embodiment, the power supply element 121 is disposed on the dielectric substrate 140, but the power supply element 121 may also be disposed on the dielectric substrate 130.

[0156] In embodiment 9, "passive element 122" and "feeding element 121" correspond to the "first radiating element" and "second radiating element" of this disclosure, respectively.

[0157] [Implementation Method 10]

[0158] In Embodiment 10, a stacked dual-band antenna module is described.

[0159] Figure 23This is a cross-sectional view of the antenna module 100U according to Embodiment 10. Compared to the antenna module 100T of Embodiment 9, the arrangement of the radiating elements in the antenna module 100U is different. Furthermore, in the description of the antenna module 100U, the description of the structures that are the same as those in the antenna module 100T will not be repeated.

[0160] Reference Figure 23 The antenna module 100U includes a feed element 121 disposed on a dielectric substrate 130 and a passive element 123 disposed on a dielectric substrate 140 as radiating elements. The feed element 121 and the passive element 123 are configured to face each other, with the passive element 123 disposed between the feed element 121 and the ground electrode GND1. The size of the passive element 123 is larger than the size of the feed element 121. That is, the resonant frequency of the feed element 121 is higher than the resonant frequency of the passive element 123.

[0161] The feed wiring 150 extends from the RFIC 110 through the ground electrodes GND2 and GND1 and the passive component 123, and is connected to the feed component 121 via a conductive member 180 disposed in the air layer 185 between the dielectric substrates 130 and 140. A high-frequency signal corresponding to the resonant frequency of the feed component 121 is supplied from the RFIC 110 to the feed wiring 150, thereby radiating radio waves from the feed component 121. Furthermore, when the feed wiring 150 is supplied with a high-frequency signal corresponding to the resonant frequency of the passive component 123, the feed wiring 150 and the passive component 123 are electromagnetically coupled, and radio waves are radiated from the passive component 123. In other words, the antenna module 100U functions as a dual-band antenna module.

[0162] In this antenna module structure, an air layer 185 is formed between the feed element 121 and the passive element 123. Therefore, especially for radio waves radiated from the feed element 121, it is possible to ensure reduced reflection loss and wide directivity across the entire broadband.

[0163] Furthermore, in the antenna module 100U, the passive element 123 can also be disposed on the dielectric substrate 130. In this case, an air layer 185 is formed between the passive element 123 and the ground electrode GND1, thus, especially for radio waves radiated from the passive element 123, it is possible to ensure a reduction in reflection loss and wide directivity over the entire broadband.

[0164] In embodiment 10, the “feeding element 121” and the “passive element 123” correspond to the “first radiating element” and the “second radiating element” of this disclosure, respectively.

[0165] [Implementation Method 11]

[0166] In Embodiment 11, a structure is described in which through-hole electrodes coupled to conductive members are formed on two dielectric substrates.

[0167] Figure 24 This is a diagram illustrating the antenna module 100V involved in Embodiment 11. The above... Figure 24 (a) is a top view of the 100V antenna module; below... Figure 24 (b) is Figure 24 A cross-sectional view of line XXII-XXII in (a).

[0168] Reference Figure 24 In addition to having the structure of the antenna module 100T described in Embodiment 9, the antenna module 100V is also configured to have a through-hole electrode V2 formed on the dielectric substrate 130, a connecting conductor 165 connecting the through-hole electrodes V2 to each other, and a through-hole electrode formed on the dielectric substrate 140. Furthermore, in Figure 24 The description does not repeat the same points as... Figure 22 Explanation of recurring elements.

[0169] Through-hole electrode V1 connects electronic component 176 to ground electrode GND1 in dielectric substrate 140. Additionally, through-hole electrode V2 penetrates dielectric substrate 130, with one end connected to electronic component 176. The other end of through-hole electrode V2 is connected to connecting conductor 165 disposed on surface 131 of dielectric substrate 130. In the case of a top-view antenna module 100V, connecting conductor 165 is configured to surround passive component 122 (and feed component 121) and connect through-hole electrodes V2 to each other.

[0170] The area that impedes the electromagnetic field generated from the radiating element is increased due to the through-hole electrode and the connecting conductor, thus suppressing peak gain to ensure wide directivity. Furthermore, by connecting the through-hole electrode to the ground electrode, the influence of external electromagnetic fields can be reduced.

[0171] Furthermore, the "through-hole electrode V2" in Embodiment 11 corresponds to the "second through-hole electrode" in this disclosure.

[0172] [Implementation Method 12]

[0173] In Embodiment 12, the structure of the antenna module 100V array of Embodiment 11 will be described. Figure 25 This is a top view of the antenna module 100W according to embodiment 12. Figure 25 (a) and the cross-sectional view at line XXIII-XXIII in the top view ( Figure 25 (b)

[0174] Reference Figure 25In the antenna module 100W, compared with embodiment 8 Figure 16 The antenna module 100P shown is similarly configured with two dielectric substrates 130A and 130B arranged adjacent to each other on a shared dielectric substrate 140 in the X-axis direction. A passive element 122A is disposed on dielectric substrate 130A, and a passive element 122B is disposed on dielectric substrate 130B. In the shared dielectric substrate 140, a feed element 121A is disposed facing the passive element 122A, and a feed element 121B is disposed facing the passive element 122B.

[0175] An air layer 185 is formed between dielectric substrates 130A and 140, and between dielectric substrates 130B and 140. In antenna module 100W, similarly to antenna module 100V, a plurality of electronic components 176 are arranged in the air layer 185 such that they surround each radiating element when viewed from above. The electronic components 176 are connected to a ground electrode GND1 disposed on dielectric substrate 140 via a through-hole electrode V1. Furthermore, the electronic components 176 are connected to connecting conductors 165 formed on the surfaces of dielectric substrates 130A and 130B via through-hole electrodes V2 formed on dielectric substrates 130A and 130B.

[0176] In such an array antenna, the area that impedes the electromagnetic field generated from the radiating elements is increased due to the electronic components, via electrodes, and connecting conductors, thus suppressing peak gain to ensure wide directivity. Furthermore, by connecting the via electrodes to the ground electrode, the isolation between adjacent radiating elements can be improved. Additionally, by forming a space between two adjacent dielectric substrates 130A and 130B to prevent contact between the dielectric substrates 130A and 130B, beam deviation of the radio waves radiated from each substrate can be suppressed.

[0177] [Implementation Method 13]

[0178] In embodiment 13, a structure for miniaturizing an antenna module is described by arranging the radiating element at an angle relative to the dielectric substrate.

[0179] Figure 26 This is a top view used to illustrate a first example of the antenna module 100X according to Embodiment 13. Figure 26 In order to make a comparison, in the left figure ( Figure 26 Figure (a) shows the antenna module 100 shown in Embodiment 1, in the right figure ( Figure 26 (b) shows the antenna module 100X of embodiment 13.

[0180] Reference Figure 26In antenna module 100X, the sides of the feed element 121 are arranged at an angle of 45° relative to the sides of the dielectric substrates 130X and 140X. In antenna modules 100 and 100X, the feed element 121 is the same size, but the dielectric substrates 130X and 140X are miniaturized compared to the corresponding dielectric substrates 130 and 140 in antenna module 100. Consequently, the number of conductive members 170 disposed around the feed element 121 is reduced.

[0181] Furthermore, in antenna module 100X, even though the dielectric substrate is smaller than that in antenna module 100, the distance from the end of the feed element 121 to the end of the dielectric substrate 130X in the polarization direction can be ensured to be the same as that in antenna module 100. Therefore, bandwidth narrowing can be suppressed by miniaturizing the dielectric substrate.

[0182] In this way, in the antenna module, in the structure in which the radiating element is arranged at an angle relative to the dielectric substrate, wide directivity can also be ensured by arranging conductive members around the feeding element, and the miniaturization of the antenna module can be further realized.

[0183] Furthermore, in the antenna module 100X, the spacing of the conductive members 170 arranged around the feed element 121 is different, but it can also be, for example... Figure 27 As shown in the second example of the antenna module 100Y, the spacing of the conductive members 170 arranged along each side of the dielectric substrate 130X is set to be equal. In addition, the tilt angle of the feed element 121 is not necessarily limited to 45°. As long as the distance from the end of the feed element 121 to the end of the dielectric substrate 130X in the polarization direction can be ensured, it can also be an angle other than 45°.

[0184] It should be considered that the embodiments disclosed herein are illustrative in all respects and not restrictive. The scope of the invention is shown by the claims rather than by the description of the embodiments above, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0185] Explanation of reference numerals in the attached figures

[0186] 10: Communication device; 100, 100A~100N, 100P~100Y, 100Q1, 100Q2, 100#1, 100#2: Antenna module; 110: RFIC; 111A~111D, 113A~113D, 117: Switch; 112AR~112DR: Low noise amplifier; 112AT~112DT: Power amplifier; 114A~114D: Attenuator; 115A~115D: Phase shifter; 116: Signal synthesizer / demultiplexer; 118: Mixer; 119: Amplifier circuit; 121, 121A~121D: Feeding element; 120: Antenna device; 122, 122A, 122B, 123: Passive component; 1 30, 130A~130C, 130X, 140, 140X: Dielectric substrate; 150: Power supply wiring; 155: Phase adjustment circuit; 160: Solder bump; 165: Connecting conductor; 170, 170A, 170B, 180: Conductive components; 175: Electrode connection material; 176: Electronic components; 177: Connecting wire; 185: Air layer; 186, 186A~186C: Dielectric; 190, 195: Electrode pads; 196: Resist; 197, V1, V2: Through-hole electrodes; 200: BBIC; GND, GND1, GND2: Ground electrodes; SP1A, SP1B, SP1, SP2, SP2A, SP2B: Power supply points.

Claims

1. An antenna module, comprising: First radiating element; Grounding electrode; A first dielectric substrate has a first surface and a second surface, and the first radiating element is formed on or inside the first surface of the first dielectric substrate. A second dielectric substrate is configured to face the second surface of the first dielectric substrate, and the ground electrode is formed on the second dielectric substrate; as well as A conductive component, viewed from above in the direction normal to the first radiating element, is disposed around the first radiating element in a manner separate from the first radiating element. The first radiating element is a feeding element. A low dielectric constant layer or air layer having a lower dielectric constant than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate. The conductive component is formed in the low dielectric constant layer or the air layer. Multiple conductive components are arranged spaced apart from each other along the sides of the first radiating element. When the wavelength of the electromagnetic wave radiated from the first radiating element is set to λ, the plurality of conductive members are arranged within a range of λ / 4 from the first radiating element.

2. The antenna module according to claim 1, wherein, The low dielectric constant layer is formed between the first dielectric substrate and the second dielectric substrate. At least a portion of the low dielectric constant layer has a space formed.

3. The antenna module according to claim 1 or 2, wherein, It also includes a first through-hole electrode formed on the second dielectric substrate. One end of the first through-hole electrode is connected to the conductive component, and the other end is open.

4. The antenna module according to claim 1 or 2, wherein, The distance from the first radiating element to the conductive member in the normal direction in the first dielectric substrate is shorter than the distance from the ground electrode to the conductive member in the normal direction in the second dielectric substrate.

5. The antenna module according to claim 1 or 2, wherein, The first radiating element is a patch antenna with a rectangular flat plate shape. The conductive member is arranged along an edge orthogonal to the polarization direction of the electromagnetic wave radiated from the first radiating element.

6. The antenna module according to claim 1 or 2, wherein, The conductive component includes a first component and a second component. The antenna module also includes a connecting line that connects the first component and the second component in the second dielectric substrate.

7. The antenna module according to claim 6, wherein, The connecting line has a length such that the resonant frequency of the structure formed by the first component and the second component connected by the connecting line is twice the resonant frequency of the first radiating element.

8. The antenna module according to claim 1 or 2, wherein, The conductive component is formed from electronic components or electrode connecting materials.

9. The antenna module according to claim 1 or 2, wherein, The conductive component is connected to the grounding electrode.

10. The antenna module according to claim 1 or 2, wherein, It also has a second through-hole electrode, which is connected to the conductive member and penetrates the first dielectric substrate.

11. The antenna module according to claim 1 or 2, wherein, It also includes a second radiating element, which is formed on the first dielectric substrate or the second dielectric substrate and disposed between the first radiating element and the grounding electrode.

12. The antenna module according to claim 11, wherein, The second radiating element is a passive element. The resonant frequency of the first radiating element is higher than that of the second radiating element. The antenna module also includes a power supply wiring that passes through the second radiating element and transmits high-frequency signals to the first radiating element.

13. The antenna module according to claim 1 or 2, wherein, The first dielectric substrate includes a first substrate and a second substrate configured to be adjacent to each other. The first radiating element is formed on the first substrate. The antenna module also includes a third radiating element formed on the second substrate. The conductive component is also disposed around the third radiating element.

14. The antenna module according to claim 1 or 2, wherein, It also includes a fourth radiating element, which is configured adjacent to the first radiating element on the first dielectric substrate. The conductive component is also disposed around the fourth radiating element.

15. The antenna module according to claim 14, wherein, The first dielectric substrate has a rectangular shape with the adjacent directions of the first radiating element and the fourth radiating element as its long sides. The first radiating element and the fourth radiating element are respectively configured to radiate radio waves polarized in the adjacent direction and radio waves polarized in a direction orthogonal to the adjacent direction. The first radiating element and the fourth radiating element are each formed into a rectangular shape with the adjacent direction as the longer side.

16. The antenna module according to claim 1 or 2, wherein, It also has: The power supply wiring transmits high-frequency signals to the first radiating element; and A phase adjustment circuit, which is connected to the feed wiring in the second dielectric substrate. The dielectric constant of the second dielectric substrate is greater than that of the first dielectric substrate.

17. The antenna module according to claim 1 or 2, wherein, It also has a power supply circuit configured to supply high-frequency signals to each radiating element.

18. An antenna module comprising: First radiating element; Grounding electrode; A first dielectric substrate, wherein the first radiating element is formed on the first dielectric substrate; A second dielectric substrate is configured to face the first dielectric substrate, and the ground electrode is formed on the second dielectric substrate; as well as A conductive component, viewed from above in the direction normal to the first radiating element, is disposed around the first radiating element in a manner separate from the first radiating element. A low-dielectric-constant layer or air layer having a lower dielectric constant than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate. The conductive component is formed in the low dielectric constant layer or the air layer. The conductive component includes a first component and a second component. The antenna module also includes a connecting line that connects the first component and the second component in the second dielectric substrate. Multiple conductive components are arranged spaced apart from each other along the sides of the first radiating element. When the wavelength of the electromagnetic wave radiated from the first radiating element is set to λ, the plurality of conductive members are arranged within a range of λ / 4 from the first radiating element.

19. The antenna module according to claim 18, wherein, It also has a power supply circuit configured to supply high-frequency signals to each radiating element.

20. An antenna module, comprising: First radiating element; Grounding electrode; A first dielectric substrate, wherein the first radiating element is formed on the first dielectric substrate; A second dielectric substrate is configured to face the first dielectric substrate, and the ground electrode is formed on the second dielectric substrate; A conductive member, when viewed from the normal direction of the first radiating element, is disposed around the first radiating element in a manner separate from the first radiating element; as well as A second radiating element is formed on either the first or the second dielectric substrate and is disposed between the first radiating element and the ground electrode. A low-dielectric-constant layer or air layer having a lower dielectric constant than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate. The conductive component is formed in the low dielectric constant layer or the air layer. The first radiating element is a feeding element. The second radiating element is a passive element. The resonant frequency of the first radiating element is higher than that of the second radiating element. The antenna module also includes a feed wiring that passes through the second radiating element and transmits high-frequency signals to the first radiating element. Multiple conductive components are arranged spaced apart from each other along the sides of the first radiating element. When the wavelength of the electromagnetic wave radiated from the first radiating element is set to λ, the plurality of conductive members are arranged within a range of λ / 4 from the first radiating element.

21. The antenna module according to claim 20, wherein, It also has a power supply circuit configured to supply high-frequency signals to each radiating element.

22. An antenna module, comprising: First radiating element; Grounding electrode; A first dielectric substrate, wherein the first radiating element is formed on the first dielectric substrate; A second dielectric substrate is configured to face the first dielectric substrate, and the ground electrode is formed on the second dielectric substrate; A conductive member, when viewed from the normal direction of the first radiating element, is disposed around the first radiating element in a manner separate from the first radiating element; as well as A fourth radiating element is configured adjacent to the first radiating element on the first dielectric substrate. A low-dielectric-constant layer or air layer having a lower dielectric constant than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate. The conductive member is disposed on the low dielectric constant layer or the air layer and is disposed around the fourth radiating element. The first dielectric substrate has a rectangular shape with the adjacent directions of the first radiating element and the fourth radiating element as its long sides. The first radiating element and the fourth radiating element are respectively configured to radiate radio waves polarized in the adjacent direction and radio waves polarized in a direction orthogonal to the adjacent direction. The first radiating element and the fourth radiating element are each formed into a rectangular shape with the adjacent direction as the longer side. Multiple conductive components are arranged spaced apart from each other along the sides of the first radiating element. When the wavelength of the electromagnetic wave radiated from the first radiating element is set to λ, the plurality of conductive members are arranged within a range of λ / 4 from the first radiating element.

23. The antenna module according to claim 22, wherein, It also has a power supply circuit configured to supply high-frequency signals to each radiating element.

24. An antenna module, comprising: First radiating element; Grounding electrode; A first dielectric substrate, wherein the first radiating element is formed on the first dielectric substrate; A second dielectric substrate is configured to face the first dielectric substrate, and the ground electrode is formed on the second dielectric substrate; A conductive member, when viewed from the normal direction of the first radiating element, is disposed around the first radiating element in a manner separate from the first radiating element; The power supply wiring transmits high-frequency signals to the first radiating element; as well as A phase adjustment circuit, which is connected to the feed wiring in the second dielectric substrate. A low-dielectric-constant layer or air layer having a lower dielectric constant than that of the first dielectric substrate is formed between the first dielectric substrate and the second dielectric substrate. The conductive component is formed in the low dielectric constant layer or the air layer. The dielectric constant of the second dielectric substrate is greater than that of the first dielectric substrate. Multiple conductive components are arranged spaced apart from each other along the sides of the first radiating element. When the wavelength of the electromagnetic wave radiated from the first radiating element is set to λ, the plurality of conductive members are arranged within a range of λ / 4 from the first radiating element.

25. The antenna module according to claim 24, wherein, It also has a power supply circuit configured to supply high-frequency signals to each radiating element.

26. A communication device comprising an antenna module according to any one of claims 1 to 25.

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