Method for evaluating compatibility of an adhesive with a polymeric material

Abstract

The application discloses a kind of compatible evaluation method of adhesive and high polymer material, belong to material analysis technical field.This method includes: the same electronic product containing high polymer material to be measured is divided into sample test sample and control test sample, sample test sample and the adhesive to be measured are placed in first closed container, heated to make the small molecule volatile contained in adhesive volatilize and diffuse to the inside of high polymer material in sample test sample;Control test sample as control;After heating treatment, two groups of electronic products are subjected to accelerated degradation treatment;Then compare, if there is no obvious difference between the two groups of electronic products after accelerated degradation treatment, the adhesive is compatible with electronic product, otherwise incompatible.This method is simple, easy to operate, which can be used in research and development process to determine whether the adhesive is compatible with adjacent high polymer material, and can also be used in failure analysis work to reproduce the failure phenomenon caused by the incompatibility of adhesive and adjacent high polymer material.

Description

Technical Field

[0001] This invention relates to the field of materials analysis technology, and more specifically, to a method for evaluating the compatibility of adhesives with polymer materials. Background Technology

[0002] Compared to traditional connection methods such as bolts, riveting, and welding, using adhesives to bond electronic components, assemblies, or products has advantages such as simple process, non-destructive operation, light weight, continuous stress distribution, and ease of precision operation. It can also achieve diverse functions such as sealing, shock absorption, conductivity, thermal conductivity, insulation, and corrosion resistance, and can specifically improve the impact and vibration resistance, dust and moisture protection, insulation, and thermal conductivity of electronic components, assemblies, or products.

[0003] As electronic devices develop towards miniaturization, lightweighting, multifunctionality, and high performance, adhesives are widely used in many fields such as component potting, chip and COB encapsulation, PCB board coating, chip bonding, component sealing and fixing, conductive and thermally conductive bonding, and structural component bonding.

[0004] Although adhesive bonding can greatly simplify processes, reduce costs, shorten production cycles, and improve production efficiency, if the adhesive is incompatible with other polymer materials in electronic devices or board assemblies, it can cause those other polymer materials to fail, reducing the reliability and lifespan of the devices or assemblies.

[0005] Adhesive formulations contain a large number of small molecule solvents and additives, such as reactive diluents, accelerators, toughening agents, and plasticizers in epoxy adhesives, and solvents, accelerators, and stabilizers in acrylate adhesives. These small molecules will inevitably volatilize from the adhesive during the curing and subsequent use of the adhesive, and then diffuse into other adjacent polymer materials, where they will undergo physical or chemical reactions, leading to failure.

[0006] For example, phenol is a commonly used accelerator in epoxy adhesives, while polycarbonate (PC) is very sensitive to phenol. Even a small amount of phenol entering PC products or alloy products containing PC can cause the products to become brittle and fail rapidly during use.

[0007] In our failure analysis of electronic components, we have found that small volatile molecules in adhesives, and even trace amounts of small organic molecules produced over long periods of use, can volatilize and diffuse into adjacent polymeric materials within the device or assembly, leading to component or assembly failure. Selecting adhesives with good compatibility with adjacent polymeric materials can effectively improve the reliability and extend the lifespan of components or assemblies.

[0008] However, the adhesives used in electronic devices are diverse and complex in composition compared to other polymer materials. It is difficult to predict this type of failure during the research and development process. Often, the incompatibility between the adhesive and adjacent polymer materials is only discovered after a malfunction occurs during product deployment and a detailed failure analysis is performed. Besides the lack of methods to verify the compatibility of adhesives and polymer materials during the research and development phase, there is also a lack of efficient methods to reproduce failures caused by incompatibility between adhesives and adjacent polymer materials during failure analysis.

[0009] In view of this, the present invention is proposed. Summary of the Invention

[0010] The purpose of this invention is to provide a method for evaluating the compatibility of adhesives with polymer materials, in order to solve the above-mentioned technical problems.

[0011] This application can be implemented as follows:

[0012] This application provides a method for evaluating the compatibility of adhesives with polymer materials, comprising the following steps:

[0013] Electronic products containing the same polymer material to be tested are divided into sample samples and control samples. The sample samples and the adhesive to be tested are placed together in a first sealed container and heated to allow the small molecule volatiles contained in the adhesive to volatilize and diffuse into the interior of the polymer material in the electronic sample sample. The control sample is placed in a second sealed container identical to the first sealed container and heated under the same heating conditions as the sample sample.

[0014] The heat-treated sample and the control sample were subjected to accelerated degradation treatment.

[0015] The accelerated degradation treatment sample was compared with the control sample. If there was no significant difference between the accelerated degradation treatment sample and the control sample, the adhesive was compatible with the electronic product; otherwise, it was not compatible.

[0016] In an optional embodiment, heating is performed at 50-200°C for 12-48 hours.

[0017] In optional implementations, the accelerated degradation treatment method includes any one of thermal-oxidative degradation, damp-heat degradation, light degradation, salt spray degradation, ozone degradation, and high-low temperature cycle degradation.

[0018] In an optional implementation, the comparison includes at least one of visual observation, performance testing, and material analysis.

[0019] In an optional implementation, visual inspection includes observing whether the electronic product shows signs of discoloration, corrosion, bulging, or cracking.

[0020] In an optional implementation, performance testing includes...

[0021] Impact strength test, bending strength test, tensile strength test, torsion test, hardness test, pressure resistance test, flame retardancy test, luminous intensity test, output power test, resistance value test, capacitance value test, and conductivity test.

[0022] In an optional implementation, the material analysis includes at least one of infrared absorption spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

[0023] In an optional embodiment, the adhesive includes at least one of structural adhesive, thermally conductive adhesive, conductive adhesive, sealant, and damping adhesive.

[0024] In optional embodiments, the electronic product includes resistors, capacitors, inductors, potentiometers, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, PCBAs, FPCs, plastic encapsulation structures, potting structures, or housings, etc.

[0025] In an optional embodiment, the sealed container includes a base and a sealing cap that mates with the base;

[0026] The base has an electronics compartment and an adhesive compartment on the side facing the sealing cover.

[0027] In an alternative implementation, the electronic product placement chamber is located in the middle area of ​​the base.

[0028] In an optional embodiment, there are multiple adhesive placement chambers, which are arranged around the outside of the electronic product placement chamber.

[0029] In an optional embodiment, the contact area between the sealing cap and the base is sealed with a sealant before heat treatment.

[0030] In an optional implementation, the sealant is petroleum jelly.

[0031] The beneficial effects of this application include:

[0032] The method provided in this application can rapidly verify the compatibility of adhesives in electronic devices with adjacent polymeric materials. It can be used not only during component development to determine the compatibility between adhesives and adjacent polymeric materials, reducing the risk of failure, but also to reproduce failure phenomena caused by incompatibility between adhesives and adjacent polymeric materials, thus pinpointing the cause of failure. Furthermore, compared to traditional solvent resistance tests, this method better reflects actual service conditions and yields more accurate results. In addition, this method has extremely high practicality. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A schematic diagram of the structure of the sealed container provided in this application;

[0035] Figure 2 This is the TGA curve of the silicone in Example 2 of this application after being baked in air at 150°C for 24 hours;

[0036] Figure 3 This is the TGA curve of the silicone in Example 2 of this application after baking in an acidic glass sealant atmosphere at 150°C for 24 hours;

[0037] Figure 4 This is a photograph of the appearance of the sample specimen in Example 3 of this application;

[0038] Figure 5 This is a photograph of the appearance of the control sample in Example 3 of this application;

[0039] Figure 6 This is a comparison chart of thermogravimetric analysis results in Example 3 of this application.

[0040] Icons: 1-Holding knob; 2-Sealing cap; 3-Electronic product storage compartment; 4-Adhesive storage compartment; 5-Base. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0042] The following is a detailed description of the compatibility assessment method between the adhesive and polymer materials provided in this application.

[0043] This application proposes a method for evaluating the compatibility of adhesives with polymer materials, comprising the following steps:

[0044] Electronic products containing the same polymer material to be tested were divided into sample samples and control samples. The sample samples and the adhesive to be tested were placed together in a first sealed container (e.g., ...). Figure 1The sample is heated in a sealed container (as shown) to allow the small molecule volatiles in the adhesive to evaporate and diffuse into the interior of the polymer material in the sample; the control sample is placed in a second sealed container identical to the first sealed container and heated under the same heating conditions as the sample.

[0045] The heat-treated sample and the control sample were subjected to accelerated degradation treatment.

[0046] The accelerated degradation treatment sample was compared with the control sample. If there was no significant difference between the accelerated degradation treatment sample and the control sample, the adhesive was compatible with the electronic product; otherwise, it was not compatible.

[0047] It should be noted that the above "no significant difference" refers to differences that are generally acceptable in this technical field (such as error range).

[0048] For reference, the electronic products in this application are structural or functional components containing polymer materials used in the manufacturing process of electronic devices. For example, they may include resistors, capacitors, inductors, potentiometers, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, PCBAs, FPCs, plastic-encapsulated structures, potting structures, or housings, etc.

[0049] The adhesives used include at least one of structural adhesives, thermally conductive adhesives, conductive adhesives, sealants, and damping adhesives. The adhesives can be cured in an uncured, partially cured, or fully cured manner.

[0050] In this application, both the first and second sealed containers have the same structure and are made of high-temperature glass.

[0051] Specifically, the aforementioned sealed container includes a base 5 and a sealing cap 2 that mates with the base 5.

[0052] The sealing cover 2 is a hemispherical protective cover. A handle 1 is provided on the top of the sealing cover 2.

[0053] The cross-sectional shape of the base 5 can be circular, square, or other shapes.

[0054] The base 5 has an electronic product placement chamber 3 and an adhesive placement chamber 4 on the side facing the sealing cover 2. The former is used to place electronic products and the latter is used to place adhesives.

[0055] The electronic product placement chamber 3 is located in the middle area of ​​the base 5, preferably in the center of the base 5.

[0056] The number of adhesive placement chambers 4 can be one or more (e.g., six). When there are multiple adhesive placement chambers 4, they are arranged around the outside of the electronic product placement chamber 3. Preferably, the multiple adhesive placement chambers 4 are equidistantly spaced along the circumference of the same circle.

[0057] It should be noted that when the first sealed container contains multiple adhesive placement chambers 4, the compatibility of multiple adhesives with electronic products can be verified simultaneously. If the electronic product does not fail (i.e., there is no significant difference from the control sample), it indicates that multiple adhesives have good compatibility with electronic products. If the electronic product fails (i.e., there is a significant difference from the control sample), it indicates that at least one adhesive is incompatible with the electronic product.

[0058] In some specific embodiments, taking the cross-sections of the base 5, the electronic product placement chamber 3, and the adhesive placement chamber 4 as all being circular as an example, the height of the sealing cover 2 is 11.8cm, the height of the base 5 is 5cm, and the diameter of the base 5 is 25cm; the center of the electronic product placement chamber 3 is the center of the base 5, the number of adhesive placement chambers 4 is 6, the included angle between each adhesive placement chamber 4 is 60°, the height of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 25mm, the diameter of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 50mm, and the distance between the center of the adhesive placement chamber 4 and the center of the electronic product placement chamber 3 is 75mm.

[0059] It should be noted that the above dimensions and quantities can be adjusted as needed, which will not be elaborated on here.

[0060] In this application, before heat treatment, a sealant is used to seal the contact area between the sealing cap 2 and the base 5 to prevent the small molecule volatiles contained in the adhesive from volatilizing and diffusing outside the sealed container and affecting the evaluation results.

[0061] For example, the sealant can be petroleum jelly, or other substances that can provide a seal without causing additional damage to electronic components, assemblies or products and adhesives during heating, which will not be elaborated further here.

[0062] In this application, heating can be performed at 50-200℃ for 12-48 hours.

[0063] For reference, the heating temperature can be 50℃, 55℃, 60℃, 65℃, 70℃, 75℃, 80℃, 85℃, 90℃, 95℃, 100℃, 120℃, 150℃, 180℃ or 200℃, or any other value within the range of 50-200℃.

[0064] The heating time can be 12h, 15h, 18h, 20h, 24h or 48h, or any other value within the range of 12-48h.

[0065] By treating the adhesive under the above heating conditions, a high-temperature diffusion effect can be achieved, causing the small molecule volatiles contained in the adhesive to evaporate into the atmosphere of the first sealed container and come into full contact with the sample. Furthermore, under the action of high temperature, the volatile small molecules will diffuse into the interior of the polymer material in the sample.

[0066] It should be noted that if the temperature is too low, diffusion will not be effective; if the temperature is too high, it may cause changes in other components of the sample, affecting the accuracy of the results.

[0067] Preferably, both the first and second sealed containers used in the above process are dry and clean containers. The mass ratio of the sample to the adhesive placed inside can be 2:1.

[0068] In this application, the accelerated degradation treatment scheme needs to be determined with reference to the actual service environment of the electronic product, including but not limited to accelerated tests such as thermal oxidation degradation, damp heat degradation, light degradation, salt spray degradation, ozone degradation, or high and low temperature cycle degradation. The accelerated degradation treatment can be carried out in the corresponding degradation chamber according to the relevant accelerated test standards.

[0069] This process allows for rapid degradation of both sample and control samples, shortening the verification cycle and facilitating the observation of the impact of small molecule volatiles on the degradation rate.

[0070] Furthermore, the components after accelerated degradation treatment are compared, and the comparison may include, but is not limited to, at least one of visual observation, performance testing, and material analysis.

[0071] The above-mentioned visual inspection may include observing whether there is discoloration, corrosion, bulging, cracking or other damage on the surface of electronic components, assemblies or products.

[0072] The aforementioned performance tests include at least one of mechanical performance tests and functional tests. Performance tests for structural components primarily involve mechanical performance tests, such as at least one of the following: impact strength test, bending strength test, tensile strength test, torsion test, and hardness test. Performance tests for functional components primarily involve corresponding functional tests, such as at least one of the following: luminous intensity test, output power test, resistance value test, capacitance value test, and conductivity performance test for electronic components, assemblies, or products.

[0073] The aforementioned material analysis includes at least one of infrared absorption spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

[0074] The above comparison can effectively determine whether volatile small molecules in adhesives will accelerate the degradation of electronic products.

[0075] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0076] Example 1

[0077] This embodiment provides a method for evaluating the compatibility of adhesives with polymer materials, the steps of which are as follows:

[0078] (1) High-temperature diffusion stage: The switch of the electronic product to be tested (sample, polycarbonate material, 10g) was placed in the electronic product placement chamber 3 of the first sealed container in a dry and clean environment. 5g of 704 silicone rubber (a structural adhesive) was placed in the adhesive placement chamber 4 of the first sealed container. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 80°C. After 24 hours of constant temperature, the sample was taken out and used as a verification sample. The same switch (control sample) was placed in the electronic product placement chamber 3 of the second sealed container (same as the first sealed container) in a dry and clean environment. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 80°C. After 24 hours of constant temperature, the sample was taken out and used as a comparison sample.

[0079] The first and second sealed containers mentioned above each independently include a base 5 and a sealing cap 2 that mates with the base 5.

[0080] The sealing cover 2 is a hemispherical protective cover, and the top of the sealing cover 2 is provided with a lifting knob 1.

[0081] The base 5 has an electronic product placement chamber 3 and an adhesive placement chamber 4 on the side facing the sealing cover 2. The cross-sections of the base 5, the electronic product placement chamber 3, and the adhesive placement chamber 4 are all circular.

[0082] The height of the sealing cover 2 is 11.8cm, the height of the base 5 is 5cm, and the diameter of the base 5 is 25cm. The center of the electronic product placement chamber 3 is the center of the base 5. There are 6 adhesive placement chambers 4, which are equidistantly spaced along the circumference of the same circle (i.e., the included angle between each adhesive placement chamber 4 is 60°). The height of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 25mm, and the diameter of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 50mm. The distance between the center of the adhesive placement chamber 4 and the center of the electronic product placement chamber 3 is 75mm.

[0083] (2) Accelerated deterioration stage: The heat-treated sample and the control sample were placed in a humid heat chamber at 85°C and 85%RH for 96 hours.

[0084] (3) Deterioration analysis stage: The sample and control sample after accelerated deterioration treatment are subjected to appearance observation and performance testing.

[0085] Visual inspection items include observing whether there is corrosion, holes or bulges on the surface of electronic components, assemblies or products.

[0086] The performance test item is the torsion test.

[0087] The comparison showed that there was no significant difference in appearance between the sample and the control sample. However, the torque of the sample was 2.256 N·m, while that of the control sample was 9.152 N·m. This indicates that a certain type of volatile substance in the 704 silicone rubber significantly accelerated the deterioration process of the switch. Therefore, it was concluded that the 704 silicone rubber and the switch are incompatible.

[0088] Example 2

[0089] This embodiment provides a method for evaluating the compatibility of adhesives with polymer materials, the steps of which are as follows:

[0090] (1) High-temperature diffusion stage: The potting structure component (sample, mainly made of silicone, 20g) of the electronic product to be tested was placed in the electronic product placement chamber 3 of the first sealed container in a dry and clean environment. 10g of acidic glass glue (a kind of sealant) was placed in the adhesive placement chamber 4 of the first sealed container. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 150°C. After being kept at a constant temperature for 24 hours, the container was taken out as a verification sample for later use. The same potting structure component (control sample) was placed in the electronic product placement chamber 3 of the second sealed container (same as the first sealed container) in a dry and clean environment. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 150°C. After being kept at a constant temperature for 24 hours, the container was taken out as a comparison sample for later use.

[0091] The first and second sealed containers mentioned above each independently include a base 5 and a sealing cap 2 that mates with the base 5.

[0092] The sealing cover 2 is a hemispherical protective cover, and the top of the sealing cover 2 is provided with a lifting knob 1.

[0093] The base 5 has an electronic product placement chamber 3 and an adhesive placement chamber 4 on the side facing the sealing cover 2. The cross-sections of the base 5, the electronic product placement chamber 3, and the adhesive placement chamber 4 are all circular.

[0094] The height of the sealing cover 2 is 11.8cm, the height of the base 5 is 5cm, and the diameter of the base 5 is 25cm. The center of the electronic product placement chamber 3 is the center of the base 5. There are 6 adhesive placement chambers 4, which are equidistantly spaced along the circumference of the same circle (i.e., the included angle between each adhesive placement chamber 4 is 60°). The height of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 25mm, and the diameter of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 50mm. The distance between the center of the adhesive placement chamber 4 and the center of the electronic product placement chamber 3 is 75mm.

[0095] (2) Accelerated deterioration stage: The heat-treated sample and the control sample were placed in an air aging chamber at 80°C for 48 hours.

[0096] (3) Deterioration analysis stage: The appearance and material analysis of the sample and control sample after accelerated deterioration treatment are carried out.

[0097] Visual inspection items include observing whether there is corrosion, holes or bulges on the surface of electronic components, assemblies or products.

[0098] The material analysis item is thermogravimetric analysis.

[0099] The comparison results are shown in Table 1 and Figure 2 and Figure 3 As shown.

[0100] The comparison showed that there was no significant difference in appearance between the sample and the control sample, but the thermogravimetric analysis results of the two samples were inconsistent. The sample was significantly more prone to thermal degradation, indicating that a certain type of volatile substance in the acidic glass sealant could significantly promote the thermal degradation process of the encapsulated structural component. Therefore, it was concluded that the acidic glass sealant and the silicone encapsulated structural component are incompatible.

[0101] Table 1 Comparison Results

[0102]

[0103]

[0104] Example 3

[0105] This embodiment provides a method for evaluating the compatibility of adhesives with polymer materials, the steps of which are as follows:

[0106] (1) High-temperature diffusion stage: The casing of the electronic product to be tested (sample, polymer material, 32g) was placed in the electronic product placement chamber 3 of the first sealed container in a dry and clean environment. 16g of B9016 organosilicon deoxygenated sealant was placed in the adhesive placement chamber 4 of the first sealed container. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 80°C. After being kept at a constant temperature for 24 hours, the container was taken out as a verification sample for later use. The same casing (control sample) was placed in the electronic product placement chamber 3 of the second sealed container (same as the first sealed container) in a dry and clean environment. Vaseline was applied to the contact position between the sealing cap 2 and the base 5 for sealing. The container was placed in an oven and heated to 80°C. After being kept at a constant temperature for 24 hours, the container was taken out as a comparison sample for later use.

[0107] The first and second sealed containers mentioned above each independently include a base 5 and a sealing cap 2 that mates with the base 5.

[0108] The sealing cover 2 is a hemispherical protective cover, and the top of the sealing cover 2 is provided with a lifting knob 1.

[0109] The base 5 has an electronic product placement chamber 3 and an adhesive placement chamber 4 on the side facing the sealing cover 2. The cross-sections of the base 5, the electronic product placement chamber 3, and the adhesive placement chamber 4 are all circular.

[0110] The height of the sealing cover 2 is 11.8cm, the height of the base 5 is 5cm, and the diameter of the base 5 is 25cm. The center of the electronic product placement chamber 3 is the center of the base 5. There are 6 adhesive placement chambers 4, which are equidistantly spaced along the circumference of the same circle (i.e., the included angle between each adhesive placement chamber 4 is 60°). The height of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 25mm, and the diameter of both the adhesive placement chamber 4 and the electronic product placement chamber 3 is 50mm. The distance between the center of the adhesive placement chamber 4 and the center of the electronic product placement chamber 3 is 75mm.

[0111] (2) Accelerated deterioration stage: The heat-treated sample and the control sample were placed in a humid heat chamber at 85°C and 85%RH for 96 hours.

[0112] (3) Deterioration analysis stage: The appearance and material analysis of the sample and control sample after accelerated deterioration treatment are carried out.

[0113] Visual inspection items include observing whether there is corrosion, holes or bulges on the surface of electronic components, assemblies or products.

[0114] The performance test item is thermogravimetric analysis.

[0115] The results are as follows Figures 4 to 6 As shown.

[0116] The comparison results showed that the sample exhibited shell corrosion and cracking, and the outer coating peeled off. Thermogravimetric analysis indicated that the sample decomposed prematurely, suggesting that a certain volatile substance in the B9016 silicone deoxygenated sealant may cause corrosion of the shell. Therefore, it was concluded that the B9016 silicone deoxygenated sealant and the shell are incompatible.

[0117] Therefore, the method provided in this application can quickly and effectively verify the compatibility between adhesives and polymer materials.

[0118] In summary, the method provided in this application has at least the following advantages:

[0119] (1) This method can quickly verify the compatibility of adhesives in electronic devices with adjacent polymeric materials, filling a gap in related technologies. This method can be used in the process of component research and development to determine whether adhesives are compatible with adjacent polymeric materials and reduce the risk of failure; it can also be used to reproduce failure phenomena caused by incompatibility between adhesives and adjacent polymeric materials, helping relevant workers to locate the cause of failure.

[0120] (2) This method volatilizes small molecules in the adhesive into a closed space, allowing the atmosphere containing volatiles to fully contact the electronic product, avoiding direct contact between the adhesive and the electronic product, and eliminating interference from non-volatile substances in the adhesive. Compared with traditional solvent resistance tests, this design is more realistic and makes the verification results more convincing.

[0121] (3) This method is highly practical. The sealed container used in the high-temperature diffusion stage has a simple structure and is easy to manufacture. The oven is a commonly used laboratory equipment. The accelerated degradation stage and degradation analysis stage can refer to relevant national standards. Verification workers can conduct the experiments themselves or entrust relevant institutions to conduct the experiments. There are no technical obstacles.

[0122] (4) This method can simultaneously verify the compatibility of multiple adhesives with electronic products, which can help relevant companies quickly screen out suitable adhesive products and improve R&D efficiency.

[0123] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for evaluating the compatibility of adhesives and polymer materials in electronic products, characterized in that, Includes the following steps: Electronic products containing the same polymer material to be tested are divided into sample samples and control samples. The sample samples and the adhesive to be tested are placed together in a first sealed container and heated to allow the small molecule volatiles contained in the adhesive to volatilize and diffuse into the interior of the polymer material in the sample sample. The control sample is placed in a second sealed container identical to the first sealed container and heated under the same heating conditions as the sample sample. The heat-treated sample and the control sample were subjected to accelerated degradation treatment. The sample after accelerated degradation treatment is compared with the control sample. If there is no significant difference between the sample after accelerated degradation treatment and the control sample after accelerated degradation treatment, the adhesive is compatible with the electronic product; otherwise, it is not compatible. Heating is performed at 50-200℃ for 12-48 hours; The sealed container includes a base and a sealing cover that mates with the base; the base has an electronic product placement chamber and an adhesive placement chamber on the side facing the sealing cover; the electronic product placement chamber is located in the middle area of ​​the base; there are multiple adhesive placement chambers, and the multiple adhesive placement chambers are arranged around the outside of the electronic product placement chamber. Before heat treatment, a sealant is used to seal the contact area between the sealing cap and the base.

2. The evaluation method according to claim 1, characterized in that, Accelerated degradation treatment methods include any one of the following: thermal-oxidative degradation, damp-heat degradation, light degradation, salt spray degradation, ozone degradation, and high-low temperature cycle degradation.

3. The evaluation method according to claim 1, characterized in that, The comparison includes at least one of the following: visual inspection, performance testing, and material analysis.

4. The evaluation method according to claim 3, characterized in that, Visual inspection includes observing whether electronic products show signs of discoloration, corrosion, bulging, or cracking.

5. The evaluation method according to claim 3, characterized in that, Performance testing includes at least one of the following: impact strength test, bending strength test, tensile strength test, torsion test, hardness test, pressure resistance test, flame retardancy test, luminous intensity test, output power test, resistance value test, capacitance value test, and conductivity performance test.

6. The evaluation method according to claim 3, characterized in that, Material analysis includes at least one of infrared absorption spectroscopy, differential scanning calorimetry, and thermogravimetric analysis.

7. The evaluation method according to any one of claims 1-6, characterized in that, The adhesive includes at least one of structural adhesive, thermally conductive adhesive, electrically conductive adhesive, sealant, and shock-absorbing adhesive.

8. The evaluation method according to any one of claims 1-6, characterized in that, The electronic products mentioned are electronic components or assemblies containing polymer materials used in the production process of electronic devices.

9. The evaluation method according to claim 8, characterized in that, The electronic products include resistors, capacitors, inductors, potentiometers, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, PCBAs, FPCs, plastic encapsulation structures, potting structures, or housings.

10. The evaluation method according to claim 1, characterized in that, The sealant is petroleum jelly.

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