Shell system shelf

Abstract

A set of one or more shelves is configured to be disposed within a housing system of a substrate processing system. The set of one or more shelves includes a first upper surface generally disposed in a first plane, a carrier alignment feature configured to align a carrier on the first upper surface, a second upper surface generally disposed in a second plane above the first plane, and a processing accessory ring alignment feature configured to align a processing accessory ring on the carrier above the second upper surface.

Description

Technical Field

[0001] Embodiments of this disclosure relate to shelving (such as shelving used in conjunction with a wafer processing system), and more specifically to housing system shelving configured to support processing accessory kit rings and / or carriers for processing accessory rings. Background Technology

[0002] Platforms are often used in semiconductor and other electronic component processing, employing robotic arms to transport objects (such as wafers) between processing chambers, from storage areas (e.g., front-opening wafer transfer cassettes (FOUPs)) to processing chambers, and from processing chambers to storage areas. Processing systems (such as wafer processing systems) have one or more processing chambers for wafer processing. Gases are used within the processing chambers to etch the wafers (e.g., etching the wafer while it is electrostatically held in an etching chamber). Robotic arms are used to pick up objects from a specific location and transport them to another specific location. Summary of the Invention

[0003] The following is a simplified summary of this disclosure to provide a basic understanding of certain aspects of it. This summary is not a broad overview of this disclosure. It is not intended to identify key or essential elements of this disclosure, nor to define any scope of specific embodiments or claims. Its sole purpose is to present some of the concepts of this disclosure in a simplified form as a prelude to the more detailed embodiments that will be presented later.

[0004] In one aspect of this disclosure, a group of one or more shelves is configured to be disposed within a housing system of a substrate processing system. The group of one or more shelves includes a plurality of first upper surfaces generally disposed in a first plane, a plurality of carrier alignment features configured to align carriers on the first upper surfaces, a plurality of second upper surfaces generally disposed in a second plane above the first plane, and a plurality of processing accessory ring alignment features configured to align processing accessory rings on the carriers above the second upper surfaces.

[0005] In another aspect of this disclosure, a housing system pertains to a substrate processing system. The housing system includes a plurality of surfaces and a set of one or more shelves, the plurality of surfaces at least partially surrounding an internal volume of the housing system, the set of one or more shelves being at least partially disposed within the internal volume of the housing system. The set of one or more shelves includes a plurality of carrier alignment features and a plurality of processing accessory ring alignment features, the plurality of carrier alignment features being configured to align carriers on the set of one or more shelves in a first plane, and the plurality of processing accessory ring alignment features being configured to align processing accessory rings on the carriers in a second plane above the first plane.

[0006] In another aspect of this disclosure, a method includes: transporting a carrier supporting a processing accessory ring to a position above a set of one or more shelves disposed within a housing system of a substrate processing system; and, in response to lowering the carrier supporting the processing accessory ring, causing the carrier to align on the set of one or more shelves via a plurality of carrier alignment features of the set of one or more shelves. Attached Figure Description

[0007] This disclosure is illustrated by way of example (and not limitation) in the accompanying drawings, in which similar reference numerals indicate similar components. It should be noted that different references to "a" or "one" embodiment in this disclosure do not necessarily refer to the same embodiment, and such references indicate at least one.

[0008] Figure 1 A processing system according to certain embodiments is described.

[0009] Figure 2 A front view of a housing system according to certain embodiments is depicted.

[0010] Figures 3A-3J Depicts one or more shelves of a housing system according to certain embodiments.

[0011] Figures 4A-4E A shelf with a fixing device is depicted according to certain embodiments.

[0012] Figure 5 A method is described that utilizes one or more shelves of a housing system according to certain embodiments.

[0013] Figures 6A-6H Depicts the shelving of a housing system according to certain embodiments. Detailed Implementation

[0014] The embodiments described herein relate to the housing system shelf.

[0015] The wafer processing system includes a factory interface and a transfer chamber. A housing system (such as a FOUP) is mounted to the factory interface, and the processing chamber is mounted to the transfer chamber. A processing accessory ring is disposed within the processing chamber to protect the components of the processing chamber. Over time, the processing accessory ring wears out and will be replaced.

[0016] Robotic arms are used to transfer contents within a wafer processing system. They are used to move wafers from a housing system to one or more processing chambers for processing and back to the housing system. Robotic arms are also used to transport used processing accessory rings from processing chambers to the housing system and new processing accessory rings from the housing system to processing chambers. In some instances, robotic arms use carriers (e.g., connectors) to transfer processing accessory rings. For example, a carrier is mounted on the robotic arm while other contents are mounted on that carrier.

[0017] The contents will be placed in a specific location by a robotic arm and picked up from that location. In an embodiment, a housing system secures the contents (e.g., a carrier and / or a handling accessory ring) in the specific location. In this embodiment, securing the contents in the specific location increases the robotic arm's ability to pick up the contents from the source location, and also increases its ability to place the contents in a specific target location.

[0018] Errors are introduced during the placement of contents. These errors can be introduced through robotic errors, misalignment of chambers, incorrect content prevention in the storage location (e.g., within a container), and / or offset of contents within the storage location. For example, one or more of a region center finding (LCF) device, alignment device, robotic arm, etc., introduces errors in the placement of contents (e.g., a carrier supporting a processing accessory ring) within the housing system. In some examples, incorrectly placed contents in the housing system are not substantially horizontal (e.g., sitting on the edge of a support structure). In some examples, the housing system fails to secure incorrectly placed contents during transport, resulting in further errors in the contents' position, damage to the contents, and / or damage to the housing system. In some examples, the robotic arm fails to remove incorrectly placed contents from the housing system. In some examples, incorrectly placed contents in the housing system are transported in the wrong orientation (e.g., via a robotic arm), resulting in damage to the contents, damage to the wafer processing system, misalignment of the contents, and / or improper handling of the contents.

[0019] The apparatus, systems, and methods disclosed herein provide one or more shelves configured to be disposed within a housing system (e.g., FOUP) of a processing system (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system). In some embodiments, a single shelf is configured to support contents (e.g., a carrier, a processing accessory ring disposed on the carrier, a position verification wafer, etc.). The shelf includes a first portion and a second portion. The first portion includes a first upper surface in a first plane, a second upper surface in a second plane above the first plane, a first carrier alignment feature, and a first processing accessory ring alignment feature. The second portion includes a third upper surface in the first plane, a fourth upper surface in the second plane, a second carrier alignment feature, and a second processing accessory ring alignment feature. The first and second carrier alignment features are configured to align (e.g., contact or be disposed above) the carrier on the first and third upper surfaces. The first and second processing accessory ring alignment features are configured to align (e.g., contact or be disposed above) the processing accessory ring on the second and fourth upper surfaces.

[0020] In some embodiments, the first portion and the second portion include attachment features configured to attach the shelf to the housing system (e.g., openings for receiving fasteners, fasteners, etc.).

[0021] In some embodiments, the shelf further includes a third portion disposed between the first portion and the second portion, wherein the third portion includes a third processing accessory ring alignment feature configured to align a processing accessory ring on the shelf above the carrier. In some embodiments, the first, second, and third portions of the shelf form a "U" shape, wherein the first portion is a first side, the second portion is a second side, and the third portion is a rear side disposed between the first and second sides. In some embodiments, the first, second, and third portions of the shelf are integrated with each other. In some embodiments, the first, second, and third portions of the shelf are attached to each other.

[0022] One or more of the carrier and / or processing accessory ring alignment features include corresponding sidewalls. In some embodiments, the sidewalls include a lower portion at an angle of approximately 100 to 110 degrees to the first plane and an upper portion at an angle of approximately 130 to 140 degrees to the first plane.

[0023] In some embodiments, the first carrier alignment feature and the second carrier alignment feature include a first sidewall configured to prevent x-direction movement and yaw movement of the carrier. In some embodiments, the first carrier alignment feature and the second carrier alignment feature further include a second sidewall configured to prevent y-direction movement of the carrier. In some embodiments, a first upper surface and a third upper surface are configured to prevent z-direction movement, pitch movement, and tumble movement of the carrier.

[0024] In some embodiments, the processing accessory ring alignment feature includes a sidewall configured to prevent yaw movement of the processing accessory ring. In some embodiments, the sidewall is at an angle of approximately 100 to 110 degrees to the first plane. In some embodiments, the carrier is configured to prevent x-direction movement, y-direction movement, z-direction movement, pitch movement, and tumble movement of the processing accessory ring.

[0025] In some embodiments, the shelf further includes one or more carrier securing devices configured to secure a carrier to the shelf and one or more processing accessory ring securing devices configured to secure a processing accessory ring to the shelf.

[0026] In some embodiments, a carrier supporting the processing accessory ring is transported (e.g., via a robotic arm) to a position above a shelf within a housing system (e.g., FOUP). In response to lowering the carrier supporting the processing accessory ring (e.g., via the robotic arm), the processing accessory ring is aligned on the shelf via a processing accessory ring alignment feature of the shelf, and the carrier is aligned on the shelf via a carrier alignment feature of the shelf. In some embodiments, in response to lowering the carrier supporting the processing accessory ring, the processing accessory ring is secured to the shelf via one or more first securing devices, and the carrier is secured to the shelf via one or more second securing devices.

[0027] In some embodiments, instead of a single shelf having a first portion for supporting a first distal end of a content (e.g., a carrier, etc.) and a second portion for supporting a second distal end of a content (e.g., a carrier, etc.), the first shelf is used to support the first distal end of the content and the second shelf (e.g., coplanar with the first shelf) is used to support the second distal end of the content.

[0028] The apparatus, systems, and methods disclosed herein offer advantages over conventional techniques. A shelf aligns contents that have been misplaced within a housing system. In some embodiments, the shelf aligns both the carrier and the processing accessory ring within the housing system. A shelf that aligns the contents (e.g., the carrier and / or processing accessory ring) prevents damage to the contents, damage to the housing system, misdirection of the contents, damage to the wafer processing system, and mishandling of the contents. The shelf secures the contents placed on it, preventing damage to the contents and the housing system, preventing misalignment of the contents on the shelf, and so on.

[0029] Although this specification mentions processing accessory rings and carriers in some parts, it can be applied to different types of contents. Although this specification mentions substrate processing systems in some parts, it can be applied to other types of systems.

[0030] While this specification partially refers to shelves comprising different portions supporting contents (e.g., processing accessory rings, carriers, etc.), in some embodiments, the different portions of the shelf may be dissimilar components that are not interconnected. In some examples, a first portion of the shelf is configured to support a first distal end of a carrier, and a second portion of the shelf is configured to support a second distal end of the carrier; the first portion and the second portion are two dissimilar components (e.g., two dissimilar shelves in a set of shelves, the two dissimilar shelves being coplanar).

[0031] While this specification mentions sidewalls with a specific slope range, in some embodiments, curved sidewalls (e.g., with an average variation throughout the ascent that approaches a slope from a specific slope range) and / or multiple slopes (e.g., where the entire sidewall has an average variation throughout the ascent that approaches a slope from a specific slope range) may be used.

[0032] Figure 1 A processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) is depicted according to certain embodiments. The processing system 100 includes a factory interface 101 and loading ports 128 (e.g., loading ports 128A-128D). In some embodiments, loading ports 128A-128D are directly mounted to the factory interface 101 (e.g., sealed against the factory interface 101). A housing system 130 (e.g., a case, FOUP, processing accessory housing system, etc.) is configured to be removably coupled (e.g., mated) to the loading ports 128A-128D. See also Figure 1 Housing system 130A is coupled to loading port 128A, housing system 130B is coupled to loading port 128B, housing system 130C is coupled to loading port 128C, and housing system 130D is coupled to loading port 128D.

[0033] In some embodiments, one or more housing systems 130 are coupled to loading ports 128 for conveying wafers and / or other substrates into and out of the processing system 100. Each of the housing systems 130 is sealed against a respective loading port 128. In some embodiments, a first housing system 130A is mated to loading port 128A (e.g., for replacing a used processing accessory ring). Once this is done, the first housing system 130A is then unmated from loading port 128A, and a second housing system 130 (e.g., a FOUP containing a wafer) is then mated to the same loading port 128A. In some embodiments, housing system 130 (e.g., housing system 130A) is a housing system having a sheath for aligning carriers and / or processing accessory rings.

[0034] In some embodiments, the loading port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). The loading port 128 additionally includes a horizontal surface for supporting a housing system 130 (e.g., a cartridge, a processing accessory housing system). Each housing system 130 (e.g., a FOUP for a wafer, a processing accessory housing system) has a front interface forming a vertical opening. The front interface of the housing system 130 is sized to engage with (e.g., sealed to) the front interface of the loading port 128 (e.g., the vertical opening of the housing system 130 is approximately the same size as the vertical opening of the loading port 128). The housing system 130 is placed on the horizontal surface of the loading port 128, and the vertical opening of the housing system 130 is aligned with the vertical opening of the loading port 128. The front interface of the housing system 130 is interconnected with the front interface of the loading port 128 (e.g., the front interface of the housing system 130 is clamped to, secured to, or sealed to the front interface of the loading port 128). The base plate (e.g., a substrate plate) of the housing system 130 has features (e.g., loading features such as recesses or receptacles that engage with loading port movement pin features, loading port features for pin clearance, and / or housing system docking disc latch clamp features) that engage with the horizontal surface of the loading port 128. The same loading port 128 is used for different types of housing systems 130 (e.g., accessory housing systems, wafer-containing cassettes, etc.).

[0035] In some embodiments, the housing system 130 includes one or more sets of shelves for aligning the carrier and / or processing accessory rings. In some embodiments, the housing system 130 includes one or more sets of shelves for aligning the carrier and / or contents disposed on the carrier (e.g., processing accessory rings, processing chamber assemblies, etc.). In some embodiments, the housing system 130 includes three or more sets of shelves for aligning the carrier and / or processing accessory rings. In some embodiments, the housing system 130 includes six or more sets of shelves for aligning the carrier and / or processing accessory rings. In some embodiments, the housing system 130 includes eight or more sets of shelves for aligning the carrier and / or processing accessory rings.

[0036] In some embodiments, the housing system 130 (e.g., a processing accessory housing system) includes one or more items of the contents 110 (e.g., one or more of the following: a processing accessory ring, an empty processing accessory ring carrier, a processing accessory ring disposed on the processing accessory ring carrier, a position verification chip, etc.). In some examples, the housing system 130 is coupled to a factory interface 101 (e.g., via a loading port 128) to enable the automatic transfer of processing accessory rings from the processing accessory ring carrier to the processing system 100 for replacement of used processing accessory rings.

[0037] In some embodiments, the processing system 100 further includes first vacuum ports 103a and 103b, which couple the factory interface 101 to respective degassing chambers 104a and 104b. Second vacuum ports 105a and 105b are coupled to the respective degassing chambers 104a and 104b, and are disposed between the degassing chambers 104a and 104b and the transfer chamber 106 to facilitate the transfer of wafers and contents 110 (e.g., processing accessory rings) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103 and 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 via respective ports 108 (such as slit valves, etc.). In some embodiments, the plant interface 101 is at a higher pressure (e.g., atmospheric pressure) while the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., loading gate, pressure chamber) has a first door (e.g., a first vacuum port 103) to seal the degassing chamber 104 from the plant interface 101 and a second door (e.g., a second vacuum port 105) to seal the degassing chamber 104 from the transfer chamber 106. When the first door is open and the second door is closed, the contents are transferred from the plant interface 101 to the degassing chamber 104. The first door will then close, and the pressure in the degassing chamber 104 will be reduced to match the transfer chamber 106. The second door will then open, and the contents will be transferred out of the degassing chamber 104. A region center finding (LCF) device will be used to align the contents in the transfer chamber 106 (e.g., before entering the processing chamber 107 and after exiting the processing chamber 107).

[0038] In some embodiments, the processing chamber 107 includes one or more of the following: an etching chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an annealing chamber, etc.

[0039] Factory interface 101 includes factory interface robot 111. Factory interface robot 111 includes a robotic arm, such as a Selective Compliant Assembly Robotic Arm (SCARA) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, and so on. Factory interface robot 111 includes an end effector at one end of the robotic arm. The end effector is configured to pick up and carry specific objects (such as wafers). Alternatively or additionally, the end effector is configured to carry objects such as carriers and / or handle accessory loops (edge ​​loops). The robotic arm has one or more links or components (e.g., wrist components, upper arm components, forearm components, etc.) configured to be moved to move the end effector in different orientations and to different locations.

[0040] Factory interface robot 111 is configured to transfer objects between housing system 130 (e.g., a cassette, FOUP) and degassing chambers 104a, 104b (or loading ports). While conventional systems may misalign or open (e.g., disassemble, break seals, contaminate) processing system 100 (e.g., factory interface 101) to align misaligned contents, processing system 100 is configured to facilitate alignment of contents (e.g., via a set of shelves in housing system 130) without the operator opening (e.g., disassembling, breaking seals, contaminating) processing system 100. Accordingly, in this embodiment, a sealed environment including the internal volume of housing system 130 and the internal volume of factory interface 101 is maintained during alignment of contents (e.g., via a set of shelves in housing system 130).

[0041] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robotic arm with an end effector at one end. The end effector is configured to handle a specific object, such as a wafer. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments it has fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0042] Controller 109 controls various aspects of processing system 100. Controller 109 is and / or includes computing devices (such as personal computers, server computers, programmable logic controllers (PLCs), microcontrollers, etc.). Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices, such as microprocessors, central processing units, etc. More specifically, in some embodiments, the processing device is a composite instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets, or multiple processors implementing combinations of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, etc. In some embodiments, controller 109 includes data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, network interfaces, and / or other components. In some embodiments, controller 109 executes instructions to perform any or more of the methods or procedures described herein. Instructions are stored on a computer-readable storage medium, which includes one or more of the following: main memory, static memory, auxiliary storage, and / or processing means (during instruction execution). In some embodiments, controller 109 receives signals from factory interface robot 111 and wafer transfer chamber robot 112 and sends control to factory interface robot 111 and wafer transfer chamber robot 112.

[0043] Figure 1 The transfer of contents 110 (e.g., a processing accessory ring coupled to a processing accessory ring carrier) into processing chamber 107 is schematically depicted. According to one aspect of this disclosure, contents 110 are removed from housing system 130 via a factory interface robot 111 located in factory interface 101. Factory interface robot 111 transfers contents 110 through one of first vacuum ports 103a, 103b and into respective degassing chambers 104a, 104b. Transfer chamber robot 112, located in transfer chamber 106, removes contents 110 from one of degassing chambers 104a, 104b through a second vacuum port 105a or 105b. Transfer chamber robot 112 moves contents 110 into transfer chamber 106, where contents 110 are transferred to processing chamber 107 via respective ports 108. Although in Figure 1 For clarity, the transfer of contents 110 includes transferring a processing accessory ring disposed on a processing accessory ring carrier, transferring an empty processing accessory ring carrier, transferring a position verification chip, etc.

[0044] Figure 1 The illustration depicts an example of the transfer of contents 110; however, other examples are contemplated. In some examples, a housing system 130 is conceived to be coupled to a transfer chamber 106 (e.g., via a loading port mounted to the transfer chamber 106). Contents 110 are loaded from the transfer chamber 106 by a transfer chamber robot 112 into a processing chamber 107. Additionally, in some embodiments, contents 110 are loaded into a substrate support base (SSP). In some embodiments, an additional SSP is positioned to communicate with a factory interface 101 opposite to the illustrated SSP. Processed contents 110 (e.g., a used processing accessory ring) are conversely removed from the processing system 100 in any manner described herein. When multiple housing systems 130 or a combination of housing systems 130 and SSPs are employed, in some embodiments, one SSP or housing system 130 will be used for unprocessed contents 110 (e.g., a new processing accessory ring), while another SSP or housing system 130 will be used to receive processed contents 110 (e.g., a used processing accessory ring). The housing system 130 is used to align the contents 110 (e.g., via one or more shelves in the housing system 130) before and / or before the contents 110 are transferred via the robotic arm. Aligning the contents 110 with the one or more shelves enables the robotic arm to properly remove the contents 110 from a specific location in the housing system 130, allows the contents 110 to be properly secured in the housing system 130 (e.g., allows the one or more shelves to secure the contents 110), and enables the housing system 130 to properly transport the contents 110.

[0045] Processing system 100 includes chambers, such as a plant interface 101 (e.g., a device front-end module (EFEM)) and adjacent chambers adjacent to the plant interface 101 (e.g., a loading port 128, a housing system 130, an SSP, a degassing chamber 104 such as a loading gate, etc.). One or more chambers are sealed (e.g., each of the chambers is sealed). Adjacent chambers are sealed to the plant interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided in one or more chambers (e.g., the plant interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the plant interface 101 is an inert EFEM that maintains an inert environment within the plant interface 101 (e.g., an inert EFEM mini-environment) such that a user does not need to enter the plant interface 101 (e.g., the processing system 100 is configured to allow no human access within the plant interface 101).

[0046] In some embodiments, a gas stream (e.g., inert gas, nitrogen) is supplied to one or more chambers (e.g., plant interface 101) of the processing system 100. In some embodiments, the gas stream is greater than leakage through the one or more chambers to maintain positive pressure in the one or more chambers. In some embodiments, the inert gas within the plant interface 101 is recirculated.

[0047] In some embodiments, a portion of the inert gas is vented. In some embodiments, the flow rate of non-recirculated gas entering the plant interface 101 is greater than the flow rate of vented and leaked gas to maintain a positive pressure of the inert gas within the plant interface 101. In some embodiments, the plant interface 101 is coupled to one or more valves and / or pumps to provide gas flow into and out of the plant interface 101. A processing device (e.g., the processing device of controller 109) controls the gas flow into and out of the plant interface 101.

[0048] In some embodiments, the processing device receives sensor data from one or more sensors (e.g., an oxygen sensor, a humidity sensor, a motion sensor, a door actuation sensor, a temperature sensor, a pressure sensor, etc.) and determines the flow rate of inert gas flowing into and / or out of the plant interface 101 based on the sensor data.

[0049] The housing system 130 allows alignment of contents 110 (e.g., carriers, handling fitting rings, etc.) without opening the sealed environment within the factory interface 101 and adjacent chambers. The housing system 130 seals to the loading port 128 in response to being engaged with it. The housing system 130 provides a cleaning port opening so that the interior of the housing system 130 can be cleaned before opening, minimizing disturbance to the inert environment within the factory interface 101.

[0050] Figure 2 Depicting a housing system 200 according to certain embodiments (e.g.) Figure 1 A front perspective view of the housing system 130. The housing system 200 includes one or more shelves 230 configured to align contents such as carriers and / or handling accessory rings. Figure 2 As shown, in some embodiments, shelf 230 may have a left portion, a right portion, and a middle portion, with the left portion supporting a first distal end of the contents, the right portion supporting a second distal end of the contents, and the middle portion connecting the left and right portions. In some embodiments, shelf 230 may be two or more dissimilar components (e.g., far apart from each other, not connected to each other, not integrated into each other, etc.), such as a left shelf and a right shelf that are not connected to each other.

[0051] The housing system 200 includes surfaces (e.g., walls, sidewalls, generally flat structures, etc.) that at least partially surround the internal volume 202 (e.g., forming cavities or chambers). In some embodiments, the internal volume 202 is a miniature environment (e.g., a sealed environment). In some embodiments, the internal volume 202 is maintained as generally particle-free (e.g., generally uncontaminated). In some embodiments, the housing system 200 includes a fan (e.g., at the top surface) to eliminate any particles in the internal volume 202. In some embodiments, the internal volume is generally free (or completely free) of one or more of moisture, oxygen, particles (e.g., dust), etc.

[0052] The surfaces include sidewall surfaces 210A–210B (e.g., sidewalls), bottom surface 212 (e.g., bottom wall), top surface 214 (e.g., top wall), and rear surface 216 (e.g., rear wall). In some embodiments, the surfaces form a clampable tub. One or more of the surfaces (e.g., sidewall surfaces 210A–210B, bottom surface 212, top surface 214, etc.) form a front interface. This front interface is configured to engage with a door interface for transporting the housing system 200 (e.g., seal to a door) (also for providing a sealed environment). The front interface is configured to engage with a generally vertical portion interface of a loading port of the wafer processing system (e.g., seal to the generally vertical portion). In response to the front interface being sealed to a door or loading port, the housing system 200 creates a sealed environment (e.g., gases and / or particles do not leave the housing system 200 or enter the housing system 200 from the surrounding environment outside the wafer processing system).

[0053] In some embodiments, the housing system 200 includes a base plate 220 (e.g., a mating plate) coupled to a bottom surface 212. The base plate 220 is configured to engage with a horizontal portion of the loading port interface. The base plate 220 has features (e.g., recesses, sockets, motion interfaces) to receive motion devices (e.g., motion pins, precision positioning pins) of the horizontal portion of the loading port. In some embodiments, the base plate 220 is secured to the bottom surface 212 before the housing system 200 is engaged with the loading port interface. In some embodiments, the base plate 220 is secured to the loading port and then the bottom surface 212 is secured to the base plate 220. In some embodiments, the housing system 200 has seals (e.g., crushable seals, gaskets) to seal one or more openings in the bottom surface 212.

[0054] In some embodiments, one or more of the overhead transport flange 222 or at least one handle 224 are coupled to one or more surfaces of the housing system 200 for transport of the housing system 200 (e.g., automated transport, manual transport, etc.). In some embodiments, the overhead transport (OHT) flange 222 is coupled to the top surface 214. In some embodiments, a first handle 224A is disposed on a first sidewall surface 210A and a second handle 224B is disposed on a second sidewall surface 210B.

[0055] In some embodiments, one or more purge adapters are disposed in the bottom surface 212 (e.g., inserted into openings formed in the bottom surface 212). The purge adapters are used to perform one or more of the following: filling the housing system 200 with a gas (e.g., nitrogen (N2)), removing a gas from the housing system, passing a gas through the housing system 200, etc. The purge adapters extend through the base plate 220 to be fluidly coupled to one or more gas lines or vacuum lines (e.g., for purging the housing system 200, for creating a vacuum in the housing system 200, for filling the housing system 200 with gas, etc.). Each of the purge adapters provides a seal (e.g., to provide a sealed environment) at a corresponding opening in the bottom surface 212. In some embodiments, the housing system 200 is sealed to the loading port in response to being docked to the loading port. The internal volume of the housing system 200 is configured to be cleaned via one or more purge adapters before the housing system 200 is opened.

[0056] In some embodiments, one or more shelves 230 are at least partially disposed within the internal volume 202. In some embodiments, one or more shelves 230 are completely disposed within the internal volume 202. In some embodiments, one or more shelves 230 are attached to sidewall surfaces 210A-210B. In some embodiments, one or more shelves 230 are attached to one or more support structures (e.g., columns, etc.) that are attached to the housing system 200 (e.g., sidewall surfaces 210A-210B, bottom surface 212, base plate 220, or the like).

[0057] One or more shelves 230 are configured to receive contents, such as carriers 232 and / or processing accessory rings 234. In some embodiments, carriers 232 are disposed on one or more shelves 230 and processing accessory rings are disposed on the carriers 232 on the shelves 230 (e.g., with or without contact). In some embodiments, carriers 232 are disposed on one or more shelves 230 and processing accessory rings are disposed on the carriers 232 above the one or more shelves 230 (e.g., without contact with the one or more shelves).

[0058] The group of one or more shelves 230 has alignment features and / or surfaces configured to align contents on the group of one or more shelves 230. If the robotic arm places contents on the group of one or more shelves 230 in an incorrect position, the alignment features and / or surfaces will align the contents to the correct position. In some embodiments, the group of one or more shelves 230 has one or more securing devices configured to secure contents to at least one shelf 230 of the group of one or more shelves 230.

[0059] Figures 3A-3J A shelf 300 (e.g., a group of one or more shelves or a single shelf) is depicted according to certain embodiments of a housing system (e.g., a FOUP of a wafer processing system). In some embodiments, shelf 300 corresponds to... Figure 2 230 shelves. Figure 3A A perspective view of a shelf 300 according to certain embodiments is depicted. Figure 3B A front view of a shelf 300 according to certain embodiments is depicted. Figure 3C A rear view of a shelf 300 according to certain embodiments is depicted. Figure 3D A left view of a shelf 300 according to some embodiments is depicted. Figure 3E A right view of a shelf 300 according to some embodiments is depicted. Figure 3F A top view of a shelf 300 according to certain embodiments is depicted. Figure 3G A bottom view of a shelf 300 according to certain embodiments is depicted. Figure 3H A top view depicting a shelf 300 with a support carrier 330 and a processing accessory ring 340 according to certain embodiments. Figures 3I-3J A cross-sectional side view of a shelf 300 depicting a support carrier 330 and a processing accessory ring 340 according to certain embodiments.

[0060] The shelf 300 includes a first portion 310A and a second portion 310B. In some embodiments, the first portion 310A and the second portion 310B are mirror images of each other. In some embodiments, the first portion 310A and the second portion 310B are joined by a third portion 310C. In some embodiments, the first portion 310A, the second portion 310B, and the third portion 310C of the carrier form a "U" shape, wherein the first portion 310A is a first side, the second portion 310B is a second side, and the third portion 310C is a rear side disposed between the first and second sides. In some embodiments, the first portion 310A, the second portion 310B, and the third portion 310C of the shelf 300 are integrated with each other. In some embodiments, two or more of the first portion 310A, the second portion 310B, and the third portion 310C of the shelf 300 are attached to each other (e.g., via one or more fasteners, via adhesive, via welding, via fusion, etc.). In some embodiments, two or more of the first portion 310A, the second portion 310B, and the third portion 310C of the shelf 300 are far apart from each other (e.g., not attached, not connected, etc.). In some embodiments, the first portion 310A is a first shelf and the second portion 310B is a second shelf, wherein the first shelf and the second shelf are coplanar and not connected to each other (e.g., there is no third portion 310C).

[0061] The first portion 310A and the second portion 310B include a first upper surface 312A in a first plane, a second upper surface 312B in a second plane above the first plane, a first carrier alignment feature 314A, and a processing accessory ring alignment feature 316A. In some embodiments, the first portion 310A and the second portion 310B further include a second carrier alignment feature 314B. In some embodiments, the first portion 310A and the second portion further include attachment features 318 configured to attach the shelf 300 to the housing system (e.g., an opening for receiving fasteners, fasteners, etc.).

[0062] In some embodiments, the shelf further includes a third portion disposed between the first portion 310A and the second portion 310B. The third portion 310C includes a processing fitting ring alignment feature 316B.

[0063] Carrier alignment feature 314 is configured to align the carrier on (e.g., in contact with, or disposed above) the first upper surface 312A. Processing accessory ring alignment feature 316 is configured to align a processing accessory ring on the carrier, wherein the processing accessory ring is disposed above the second upper surface 312B. In some embodiments, the carrier is supported by a first portion 310A and a second portion 310B, and the processing accessory ring is disposed on the carrier without contacting the first portion 310A and the second portion 310B (e.g., without contacting one or more shelves 300). In some embodiments, in response to movement (e.g., pushing, shaking, squeezing, rapid movement, etc.), the processing accessory ring contacts the first portion 310A and / or the second portion 310B, and the processing accessory alignment feature 316 realigns the processing accessory ring on the carrier.

[0064] One or more of the carrier alignment feature 314 and / or the processing accessory ring alignment feature 316 include respective sidewalls. In some embodiments, the sidewalls of the carrier alignment feature 314 and / or the processing accessory ring alignment feature 316 form an angle of approximately 100 to 110 degrees with the first plane. In some embodiments, the sidewalls of the carrier alignment feature 314 and / or the processing accessory ring alignment feature 316 include a lower portion and an upper portion, the lower portion forming an angle of approximately 100 to 110 degrees with the first plane, and the upper portion forming an angle of approximately 130 to 140 degrees with the first plane.

[0065] In some embodiments, carrier alignment feature 314A includes a first sidewall configured to prevent x-direction and yaw movement of the carrier. In some embodiments, carrier alignment feature 314B further includes a second sidewall configured to prevent y-direction movement of the carrier. In some embodiments, a first upper surface 312A is configured to prevent z-direction, pitch, and tumble movement of the carrier.

[0066] In some embodiments, the processing accessory ring alignment feature 316A includes sidewalls configured to prevent yaw movement of the processing accessory ring. In some embodiments, the sidewalls have an angle of approximately 100 to 110 degrees with the first plane. In some embodiments, the carrier is configured to prevent x-direction movement, y-direction movement, z-direction movement, pitch movement, and tumbling movement of the processing accessory ring (e.g., in the case that the processing accessory ring does not contact the first portion 310A or the second portion 310B).

[0067] refer to Figure 3HThe shelf 300 is configured to support the carrier 330 and / or the processing accessory ring 340. The carrier 330 includes a rigid body 332 forming an opening, fasteners 336 configured to be removably attached to the rigid body 332 via a plurality of openings, and fingers 334 configured to be removably attached to the rigid body via the fasteners 336 and the openings. The fingers 334 are configured to support contents (e.g., the processing accessory ring 340) during transport of the carrier 330 within the substrate processing system. In some embodiments, the processing accessory ring 340 contacts the carrier 330 when it is disposed on the carrier 330. In some embodiments, the processing accessory ring 340 is disposed above the carrier 330 without contacting it when it is disposed on the carrier 330. In some embodiments, the processing accessory ring 340 is disposed above the shelf 300 without contacting it when the carrier is disposed on the carrier 330 and the carrier is disposed on the shelf 300.

[0068] refer to Figure 3I Shelves 300 (e.g., a group or a group of shelves or a single shelf) are configured to support carrier 330 and / or processing accessory ring 340. Processing accessory ring alignment feature 316B is configured to align the processing accessory ring 340 on carrier 330 (e.g., above a shelf or group of shelves). Finger 334 is attached to a rigid body 332 of carrier 330 via fastener 336. In some embodiments, finger 334 supports processing accessory ring 340 while carrier 330 (e.g., supporting processing accessory ring 340) is positioned on shelf 300.

[0069] refer to Figure 3J The shelf 300 is configured to align the carrier 330 and / or the processing accessory ring 340 on the shelf 300. The shelf includes a carrier alignment feature 314 and a processing accessory ring alignment feature 316. The carrier alignment feature 314 includes one or more sidewalls and the processing accessory ring alignment feature 316 includes one or more sidewalls.

[0070] In some embodiments, the sidewalls of the shelf 300 (e.g., the sidewalls of the carrier alignment feature 314A) have one or more small planes or are curved. In some embodiments, the sidewalls of the shelf 300 (e.g., the sidewalls of the carrier alignment feature 314A) form an angle of approximately 100 to 150 degrees, approximately 120 to 150 degrees, or approximately 130 to 140 degrees with the first upper surface 312A. In some embodiments, the sidewalls (e.g., the sidewalls of the carrier alignment feature 314A) include a lower portion and an upper portion, the lower portion forming an angle of approximately 100 to 110 degrees with the first upper surface 312A (e.g., approximately 15 degrees orthogonal), and the upper portion forming an angle of approximately 130 to 140 degrees with the first upper surface 312A (e.g., approximately 45 degrees orthogonal, exceeding the lower portion by approximately 30 degrees).

[0071] In some embodiments, the sidewall (e.g., the sidewall of the processing fitting ring alignment feature 316A) forms an angle of approximately 90 to 150 degrees, 100 to 150 degrees, or 100 to 110 degrees with the second upper surface 312B (e.g., approximately 15 degrees orthogonal).

[0072] In some embodiments, the sidewalls of carrier alignment feature 314 and / or processing accessory ring alignment feature 316 provide a capturing ramp to allow misaligned processing accessory rings and / or carriers returning from the substrate processing system (e.g., from a tool) to be aligned and secured after being lowered onto shelf 300. Proper alignment of the processing accessory ring with the carrier is utilized to properly orient and place the processing accessory ring within the processing chamber. Conventionally, systems have improper alignment of the processing accessory with the carrier, resulting in mispositioning or dropping of the carrier and processing accessory ring within the tool. In some examples, processing accessory rings removed from the processing chamber return misaligned to the housing system (e.g., due to errors by robotic arms, LCF devices, aligner devices, etc.). Shelf 300 aligns the misaligned processing accessory rings and carriers returned from the substrate processing system. In some embodiments, shelf 300 constrains the processing accessory rings and / or carriers for transport (e.g., via tool automation on an OHT).

[0073] In some embodiments, all alignment features (e.g., carrier alignment feature 314 and / or processing accessory ring alignment feature 316) are created from a single piece of material and capture ramps (e.g., sidewalls of the alignment features) for aligning misaligned returned contents. In some embodiments, self-actuating hooks (e.g., fasteners) are used to secure the contents and are automatically locked via tools. In some embodiments, shelf 300 provides for separating the processing accessory ring from the carrier to allow for automatic realignment of both the processing accessory ring and the carrier.

[0074] In some embodiments, the shelf 300 is made of polyethylene terephthalate (PET). In some embodiments, the shelf 300 is a single comb spanning one station (e.g., a single shelf supporting the handling fitting rings and carriers from the left and right sides of the housing system), rather than separate combs on each side. Using a single shelf 300 to support the handling fitting rings and carriers on both sides reduces tolerance stack.

[0075] In some embodiments, the material forming the shelf 300 is secured (e.g., by a securing device with four screw holes) and then processed while being secured. In some embodiments, windows (e.g., openings) are cut into the shelf 300 to reduce weight (see, for example, see...). Figure 4B (Carrier 430).

[0076] In some embodiments, the fitting ring alignment feature 316B is used to align the fitting ring, the second upper surface 312B is used to center the fitting ring, and the fitting ring fixing device (see, for example, see...) Figures 4A-4E ) is used to process accessory ring constraint members. In some embodiments, carrier alignment features 314A-314B are used for carrier alignment and carrier fixing devices (see, for example, see...) Figures 4A-4E Used for carrier constraint components.

[0077] In some embodiments, the robotic arm controls six degrees of freedom of the carrier 330 and the handling accessory ring 340. During the transfer of the carrier 330 and the handling accessory ring 340 to the shelf 300, the robotic arm transfers control of the six degrees of freedom to the shelf 300. In some examples, as the six degrees of freedom are transferred, they are not transferred simultaneously, which conventionally results in misalignment of the carrier 330 and the handling accessory ring 340. In some examples, the robotic arm and the shelf are in non-perfectly parallel planes, which conventionally results in misalignment of the carrier 330 and the handling accessory ring 340. Alignment features (e.g., carrier alignment feature 314 and handling accessory ring alignment feature 316) align the misaligned carrier 330 and handling accessory ring 340.

[0078] Figures 4A-4E Depicting a shelf 400 with fixing devices according to certain embodiments (e.g.) Figure 2 Shelves 230 Figures 3A-3J (shelf 300). In some embodiments, Figures 4A-4E Features and Figures 3A-3J Features with similar numbers have similar or identical functions.

[0079] Shelf 400 includes a first part 410A (e.g. Figures 3A-3J Part 1 310A), Part 2 410B (e.g.) Figures 3A-3J Part II 310B), and Part III 410C (e.g. Figures 3A-3J The third part 310C). The first part 410A and / or the second part 410B include the first upper surface 412A (e.g., Figures 3A-3J First upper surface 312A), second upper surface 412B (e.g.) Figures 3A-3J The second upper surface 312B), one or more carrier alignment features 414A (e.g. Figures 3A-3J The carrier alignment feature 314A), one or more carrier alignment features 414B (e.g., carrier alignment feature 314A), and one or more carrier alignment features 414B. Figures 3A-3J Carrier alignment feature 314B), one or more processing accessory ring alignment features 416A (e.g. Figures 3A-3J First processing accessory ring alignment feature 316A), and processing accessory ring alignment feature 416B (e.g. Figures 3A-3J(The processing accessory ring alignment feature 316B). In some embodiments, shelf 400 is a group of one or more shelves. In some embodiments, a first portion 410A is a first shelf and a second portion 410B is a second shelf, wherein the first shelf and the second shelf are far apart from each other (e.g., not connected to each other, not attached to each other, etc.).

[0080] In some embodiments, the shelf 400 includes one or more carrier securing devices 460 (e.g., self-actuated hooks for securing carriers 430) and / or handling accessory ring securing devices 450 (e.g., self-actuated hooks for securing handling accessory rings 440). The handling accessory ring 440 is lowered (e.g., via a robotic arm 470) to support the handling accessory ring 440. Figures 3H-3J The carrier 430 (e.g., the processing accessory ring 340) is a carrier for the accessory ring 340. Figures 3H-3J After the carrier 330 is in place, the processing fitting ring 440 engages (e.g., pushed down) with the first end portion of the processing fitting ring retainer 450, causing the second end portion of the processing fitting ring retainer 450 to secure the processing fitting ring 440. In some examples, the processing fitting ring 440 is lowered onto the first end portion of the processing fitting ring retainer 450 and the processing fitting ring retainer is rotated such that the first end portion is pushed into the shelf 400 (e.g., to be substantially parallel to the second upper surface 412B) and the second end portion is rotated to a position above at least a portion of the processing fitting ring 440.

[0081] After the carrier 430 is lowered onto the first upper surface 312A, the carrier 430 engages with the first end portion of the carrier fixing device 460 (e.g., pushed down), causing the second end portion of the carrier fixing device 460 to secure the carrier 430. In some examples, the carrier fixing device 460 is rotated while the carrier 430 is lowered onto the first end portion, such that the first end portion is pushed into the shelf 400 (e.g., to be substantially parallel to the first upper surface 412A) and the second end portion is rotated to a position above at least a portion of the carrier 430.

[0082] refer to Figure 4C The robotic arm 470 is positioned above the shelf 300. The carrier 430 supporting the handling accessory ring 440 is mounted on the robotic arm 470.

[0083] refer to Figure 4D The robotic arm 470 lowers the carrier 430 supporting the processing accessory ring 440, causing the processing accessory ring 440 to actuate the first remote portion of the processing accessory ring fixing device 450 (e.g., a self-actuated hook), causing the second remote portion of the processing accessory ring fixing device 450 to be positioned above the processing accessory ring 440 to fix the processing accessory ring 440 to the shelf 400.

[0084] refer to Figure 4E The robotic arm 470 lowers the carrier 430 so that the carrier 430 actuates the first remote portion of the carrier fixing device 460 (e.g., a self-actuated hook), causing the second remote portion of the carrier fixing device 460 to be positioned above the carrier 430 to secure the carrier 430 to the shelf 400.

[0085] refer to Figures 4A-4E In some embodiments, the shelf 400 further includes a locking device 480. In some embodiments, the locking device 480 locks the carrier securing device 460 and / or the handling accessory ring securing device 450 into a fixed position. In some embodiments, closing the door of the housing system (e.g., closing the FOUP door) actuates the locking device 480 to lock the carrier securing device 460 and the handling accessory ring securing device 450 into a fixed position (e.g., for transporting the housing system).

[0086] In some embodiments, the first portion 410A includes one or more of a carrier fixing device 460, a processing accessory ring fixing device 450, and / or a locking device 480. In some embodiments, the second portion 410B includes one or more of a carrier fixing device 460, a processing accessory ring fixing device 450, and / or a locking device 480. In some embodiments, both the first portion 410A and the second portion 410B include one or more of a carrier fixing device 460, a processing accessory ring fixing device 450, and / or a locking device 480.

[0087] Figure 5 A method 500 using one or more shelving units with a housing system is depicted according to certain embodiments. In some embodiments, one or more operations of method 500 are performed by a robotic arm (e.g., Figure 1 The robotic arm of the factory interface robot 111 Figures 4B-4E The robotic arm 470) and / or the controller (e.g. Figure 1 The controller 109) performs the process. Although illustrated with a specific sequence or order, the order of processes can be modified unless otherwise indicated. Therefore, the depicted embodiments should be understood as examples, and the depicted processes may be performed in different orders, and some processes may be executed in parallel. Additionally, one or more processes may be omitted in different embodiments. Therefore, not all processes are necessary in every embodiment.

[0088] refer to Figure 5 In method 500, at frame 502, a carrier supporting the handling fitting ring is transported (e.g., by a robotic arm) to a position above a set of one or more shelves disposed within the housing system.

[0089] At frame 504, the carrier supporting the handling accessory ring is lowered (e.g., by a robotic arm).

[0090] In some embodiments, at block 506, in response to lowering the carrier, processing accessory rings are aligned on one or more shelves and / or carriers via a processing accessory ring alignment feature. In some embodiments, the processing accessory ring alignment feature includes a sloping sidewall that guides the processing accessory ring into the alignment orientation.

[0091] In some embodiments, at block 508, in response to lowering the carrier, the processing accessory ring is secured to one or more shelves via a processing accessory ring securing device. As the material (e.g., the carrier and the processing accessory ring) moves downward, the weight of the processing accessory ring actuates the processing accessory ring securing device (e.g., a processing accessory (PK) constraint).

[0092] At frame 510, in response to the lowering of the carrier, the carrier is aligned on one or more shelves via a carrier alignment feature. In some embodiments, the carrier alignment feature includes a sloping sidewall that guides the carrier into the alignment orientation.

[0093] At frame 512, in response to lowering the carrier, the carrier is secured to one or more shelves in the group via a carrier securing device. As the carrier is positioned, the weight of the carrier actuates the carrier securing device (e.g., a carrier restraint).

[0094] At frame 514, the carrier securing device and / or the handling accessory ring securing device is locked (e.g., this actuates the locking device in response to closing the door of the housing system). In some embodiments, the FOUP door actuates the locking device to lock both the PK constraint and the carrier constraint. In some embodiments, as the handling accessory ring and the carrier are lowered, the handling accessory ring and the carrier are separated by the set of one or more shelves. This allows for the capture and alignment of both the carrier and the handling accessory ring from any misalignment introduced by automation during handling accessory ring removal. In some embodiments, as the handling accessory ring and the carrier (e.g., the handling accessory ring is positioned on the carrier) are lowered, the carrier contacts the set of one or more shelves and the handling accessory ring does not contact the set of one or more shelves.

[0095] In some embodiments, each operation of method 500 is performed while maintaining a sealed environment (e.g., without opening the factory interface or the enclosure system).

[0096] Figures 6A-6H A view depicting a housing system 600 according to certain embodiments. Figure 6A A front perspective view of a housing system 600 according to certain embodiments is depicted. Figure 6B A front cross-sectional view of a housing system 600 according to certain embodiments is depicted. Figure 6C A side cross-sectional view of a housing system 600 according to certain embodiments is depicted. Figure 6DA top cross-sectional view of a housing system 600 according to certain embodiments is depicted. Figures 6E-6F A front cross-sectional view depicting a portion of a housing system 600 according to certain embodiments. Figures 6G-6H A top sectional view depicting a portion of a housing system 600 according to certain embodiments. In some embodiments, features having reference numerals similar to those in other figures include features described in other figures and / or features and / or functions that are functionally similar. In some examples, Figures 6A-6H One or more of the housing systems 600 have with Figure 1 The enclosure system 130 and / or Figure 2 The housing system 200 has similar features and / or functionality.

[0097] refer to Figure 6A The housing system 600 includes side walls 610 (e.g., side walls 610A-610B), one or more rear walls, and a bottom wall 620. The housing system 600 includes a housing cover 630 (e.g., a removable upper wall, a non-removable upper wall, etc.) coupled to (e.g., top surface mounted, side perimeter mounted) one or more walls (e.g., one or more side walls 610 and / or one or more rear walls) to at least partially enclose the internal volume of the housing system 600. In some embodiments, the housing cover 630 is configured to be removably attached to one or more of the walls.

[0098] In some embodiments, the housing cover 630 is attached to the air transport assembly 632. In some embodiments, the housing system has one or more windows (e.g., observation windows). In some embodiments, the housing cover 630 includes an upper window 634 (e.g., an upper observation window). In some embodiments, at least one rear wall of the housing system includes a rear window 636 (e.g., a rear observation window).

[0099] Support column 640 is coupled to base wall 620 (e.g., via base connector 642). Shelves 644 are disposed within the internal volume of housing system 600. Each shelf 644 can be configured to support a corresponding object (e.g., Figure 1 (Content 110). In some embodiments, each shelf 644 is connected to at least one support 640.

[0100] In some embodiments, a first set of supports 640 (e.g., a first pair of supports 640, two supports 640) is coupled to a bottom wall 620 near sidewall 610A (e.g., via the same base connector 642), and a second set of supports 640 (e.g., a second pair of supports 640, two additional supports 640) is coupled to a bottom wall 620 near sidewall 610B (e.g., via different base connectors 642). A set of shelves 644 (e.g., a pair of shelves 644, two shelves 644, a first shelf 644 and a second shelf 644, coplanar shelves 644) may be used to support an object (e.g., contents 110). A first shelf 644 may be attached to a first set of supports 640, and a second shelf 644 may be attached to a second set of supports 640. A first subset and a second subset of shelves 644 may be oriented relative to each other within the internal volume (e.g., in mirror positions).

[0101] The objects supported by the shelf 644 may include a carrier 650, one or more processing accessory rings 652 disposed on the carrier 650, a position verification chip 654, a substrate, etc. In some embodiments, the carrier 650 is disposed on a first shelf 644 and a second shelf 644, and one or more processing accessory rings 652 are disposed on the carrier 650 without contacting the shelf 644. Each shelf 644 may be formed with recesses to guide the processing accessory rings 652 to the correct position on the carrier 650 in response to movement of the housing system 600 (e.g., being pushed, being rapidly moved).

[0102] In some embodiments, the upper window 634 is configured for orientation verification (e.g., automatic or manual orientation verification) of objects positioned within the internal volume. In some embodiments, the rear window 636 is removable for orientation adjustment (e.g., manual or automatic orientation adjustment) of one or more objects.

[0103] In some embodiments, each processing accessory ring 652 has a corresponding flat portion (e.g., a flat inner portion) that can be viewed through the upper window 634. In some embodiments, each processing accessory ring 652 includes features (e.g., notches, peripheral notches, recesses, markings, upper surface peripheral notches, etc.) on its upper (or lower) surface that can be viewed through the upper window 634. In some embodiments, the flat portions and / or features of each processing accessory ring 652 (e.g., on its upper surface) can be viewed through the upper window 634 at the same time (e.g., simultaneously). In some embodiments, each carrier 650 has carrier features that can be viewed through the upper window 634 simultaneously. In some embodiments, the carrier features of each carrier 650, the features on the upper surface of each processing accessory ring 652, and the flat portions of each processing accessory ring 652 can be viewed through the upper window 634 simultaneously. If the flat portion of the handling accessory ring 652 is not in the correct position or the carrier feature is not in the correct position, the rear window 636 may be removed to adjust the orientation of the handling accessory ring 652 and / or the carrier 650. If the upper features of the handling accessory ring 652 cannot be viewed through the upper window 634 (e.g., not in an upward orientation, or flipped over), the housing cover 630 and / or housing door are removed to flip the handling accessory ring 652.

[0104] The respective upper surface of each pillar 640 may be configured to removably engage with the respective component interface of the housing cover 630. In some embodiments, the respective upper surface of each pillar 640 forms a tapered recess configured to receive a tapered protrusion (e.g., a fastener, etc.) coupled to the housing cover 630 to align the pillar 640 with the housing cover 630.

[0105] Each shelf 644 can be configured to align objects (e.g.) Figure 1 The contents 110), such as carrier 650 and / or handling accessory ring 652. In some embodiments, each shelf 644 has alignment features and / or surfaces configured to align objects on the shelf 644. These alignment features and / or surfaces align the object into the correct position if the robotic arm places an object in an incorrect position on the shelf 644 and / or the transport housing system 600 causes the object to move. In some embodiments, the shelf 644 has a securing device configured to hold the object to the shelf 644.

[0106] In some embodiments, the internal volume of the housing system 600 is a miniature environment (e.g., a sealed environment). In some embodiments, the internal volume of the housing system 600 is maintained as substantially particle-free (e.g., substantially uncontaminated). In some embodiments, the housing system 600 includes a fan (e.g., at the top surface) to eliminate any particles in the internal volume. In some embodiments, the internal volume is substantially free of (or completely free of) one or more of moisture, oxygen, particles (e.g., dust), etc.

[0107] One or more walls of the housing system 600 may form a front interface or be coupled to a front interface. The front interface is configured to engage with a door interface (e.g., sealed to a door) for transporting the housing system 600 (e.g., to provide a sealed environment). The front interface is configured to engage with a generally vertical portion interface of a loading port of a wafer processing system (e.g., sealed to a generally vertical portion). In response to the front interface being sealed to a door or loading port, the housing system 600 creates a sealed environment (e.g., gases and / or particles do not leave the housing system 600 or enter the housing system 600 from the surrounding environment outside the wafer processing system).

[0108] In some embodiments, the bottom wall 620 includes or is coupled to a base plate (e.g., a mating plate). The base plate is configured to engage with a horizontal portion of the loading port interface. The base plate has features (e.g., recesses, sockets, motion interfaces) to receive motion devices (e.g., motion pins, precision positioning pins) of the horizontal portion of the loading port. In some embodiments, the base plate is secured to the bottom wall 620 before the housing system 600 is engaged with the loading port interface. In some embodiments, the base plate is secured to the loading port and then the bottom wall 620 is secured to the base plate. In some embodiments, the housing system 600 has seals (e.g., crushable seals, gaskets) to seal one or more openings in the bottom wall 620.

[0109] In some embodiments, one or more of an overhead transport assembly 632 (e.g., an overhead transport flange) or at least one handle 612 are coupled to one or more surfaces of the housing system 600 for transport of the housing system 600 (e.g., automated transport, manual transport, etc.). In some embodiments, the overhead transport (OHT) assembly 632 is coupled (e.g., attached) to the housing cover 630. In some embodiments, a handle 612A is provided on a side wall 610A and a second handle is provided on a side wall 610B.

[0110] In some embodiments, one or more cleaning adapters are disposed in the bottom wall 620 (e.g., inserted into openings formed in the bottom wall 620). The cleaning adapter is used to perform one or more of the following: filling the housing system 600 with a gas (e.g., nitrogen (N2)), removing a gas from the housing system, passing a gas through the housing system 600, etc. The cleaning adapter extends through the base plate to be fluidly coupled to one or more gas or vacuum lines (e.g., for cleaning the housing system 600, for creating a vacuum in the housing system 600, for filling the housing system 600 with gas, etc.). Each of the cleaning adapters provides a seal (e.g., to provide a sealed environment) at a corresponding opening in the bottom wall 620. In some embodiments, the housing system 600 is sealed to a loading port in response to being docked to a loading port. The internal volume of the housing system 600 is configured to be cleaned via one or more cleaning adapters before the housing system 600 is opened.

[0111] refer to Figure 6B The housing system 600 includes walls, which include one or more of the following: side walls 610A-610B, rear walls 614A, 614B, 614C, and / or a bottom wall 620. A housing cover 630 is configured to couple to one or more walls of the housing system 600 (e.g., via one or more fasteners 674, such as flathead screws). The housing cover 630 includes a top window. One or more rear walls 614 include a rear window 636. One or more of the rear windows 636 are removable to adjust the orientation of one or more of the carrier 650, the handling accessory ring 652, and / or the position verification chip 654. An air transport assembly 632 may be coupled to the housing cover 630.

[0112] A support post 640 is coupled to a bottom wall 620 (e.g., via a base connector 642 and one or more fasteners 674). The support post 640 is removably interfaced with a housing cover 630. In some embodiments, the upper surface of each support post 640 forms a recess 672, and components 670 of the housing cover 630 (e.g., fasteners 674, protrusions, lead pins, etc.) interface with the recess 672 (e.g., sleeves, plastic sleeves, nylon sleeves, etc.). In some embodiments, the recess 672 is a tapered recess, and the component 670 is a tapered protrusion to align the housing cover 630 with the support post 640. A shelf 644 is coupled (e.g., via fasteners 674) to the support post 640. A carrier 650 is disposed on two shelves 644. A position verification chip 654 is disposed on both shelves. One or more processing accessory rings are disposed on the carrier 650 (e.g., where one or more processing accessory rings 652 do not contact the shelf 644).

[0113] In some embodiments, shelf 644 includes a sloped surface 680A to align carrier 650 on shelf 644. In some embodiments, shelf 644 includes a recess 682 (e.g., a pocket of deep pocket shelf 644) formed by sloped surfaces 680B-680C to align handling accessory ring 652 on carrier 650 in response to movement of housing system 600 (e.g., pushing, rapid movement, etc.).

[0114] refer to Figure 6C Each shelf 644 may be coupled (e.g., fastened, attached, etc.) to two supports 640 via fasteners 674. The two supports 640 are coupled to the bottom wall 620 via the same base connector 642. In some embodiments, the housing door 690 is configured to be removably coupled (e.g., attached, clamped, sealed, etc.) to one or more walls and / or housing covers 630 of the housing system 600.

[0115] refer to Figure 6D The processing accessory ring 652 has a flat surface 660 (e.g., a flat inner surface, etc.) and / or an upper surface feature 662 (e.g., a notch, mark, recess, etc.) of each processing accessory ring 652, which is visible via a top window. If the flat surface 660 is not in the correct position in the view via the top window, the orientation of the processing accessory ring 652 is adjusted (e.g., rotated to be in the correct position). If the upper surface feature 662 is not visible, the processing accessory ring 652 is flipped (e.g., so that the upper surface feature 662 is oriented upwards instead of downwards). In some embodiments, the carrier has a carrier feature 664 (e.g., a recess, cutout) positioned close to the flat surface 660 of the processing accessory ring 652. The carrier feature 664 is visible via a top window of the housing cover to determine if the carrier 650 is correctly oriented. In some embodiments, the carrier 650 includes fingers 692 supporting the processing accessory ring 652.

[0116] refer to Figures 6E-6F A carrier 650 supporting one or more processing accessory rings 652 (e.g., processing accessory rings 652A-652B) is lowered onto a shelf 644. The shelf is connected to a support post 640 via fasteners 674. In some embodiments, components 670 further couple the shelf 644 to the support post 640. In some examples, the shelf is connected to the support post 640 via one or more components 670 (e.g., front guide pins, etc.) and then the fasteners 674 secure the shelf 644 to the support post 640.

[0117] In some embodiments, a set of processing accessory rings 652 stacked one on top of the other are supported by a carrier 650. In some embodiments, a shelf 644 includes a beveled surface 680A (e.g., a carrier alignment feature) to align the carrier 650 on the shelf 644. In some embodiments, the shelf 644 includes a recess 682 (e.g., a pocket of a deep pocket shelf 644) formed by beveled surfaces 680B–680C (e.g., processing accessory ring alignment features) to align the processing accessory rings 652 on the carrier 650 in response to movement of the housing system 600 (e.g., pushing, rapid movement, etc.). In some embodiments, the processing accessory rings 652 are disposed above or within the recess 682 without contacting the shelf 644.

[0118] In some embodiments, the shelf 644 includes a carrier fixing device 694 (e.g., Figures 4A-4E The carrier fixing device 460 and the self-actuated hook are used to secure the carrier 650. After the carrier 650 (e.g., a carrier supporting the handling accessory ring 652, lowered via a robotic arm) is lowered onto the shelf 644 (e.g., inclined surface 680A), the carrier 650 engages with the first end portion of the carrier fixing device 694 (e.g., pushes it down), causing the second end portion of the carrier fixing device 694 to secure the carrier 650. The carrier fixing device 694 can be rotated from a non-fixed position to a fixed position about an axis 696. In some examples, the carrier fixing device 694 is rotated (e.g., about an axis 696) to lower the carrier 650 onto the first end portion of the carrier fixing device 694, such that the first end portion is pushed into the shelf 644 (e.g., to be substantially parallel to the first upper surface of the shelf 644) and the second end portion is rotated to a position above at least a portion of the carrier 650. In some embodiments, a locking device (e.g., Figures 4A-4E The locking device 480 is configured to insert into the recess 698 (e.g., in response to the door 690 being secured to the housing system 600) to lock the carrier fixing device 694 in a non-fixed or fixed position. The carrier fixing device 694 is then secured from the non-fixed position (e.g., by placing the carrier 650 on the shelf 644) to the fixed position. Figure 6E Rotate to a fixed position (e.g.) Figure 6F The door 690 is secured to the housing system 600 so that the locking device is inserted into the recess 698, and the carrier is secured by the carrier fixing device 694 until the door 690 is removed from the housing system 600.

[0119] refer to Figures 6G-6HThe carrier securing device 694 (e.g., a latch, a PET latch) is pivotable about a shaft 696 (e.g., a pin). The locking device 622 may include a rod 624 (e.g., a stainless steel rod), a cover 626 (e.g., a contact door 690, a UHMW polyethylene cover, etc.), a guide assembly 628 (e.g., a guide, a connecting nut, a UHMW polyethylene guide, etc.), and / or a spring 629. In the unlocked position (e.g., door 690 not secured to housing system 600), spring 629 expands, and rod 624 moves out of recess 698, allowing the carrier securing device 694 to move between a secured and unlocked position. In the locked position (e.g., door 690 secured to housing system 600), spring 629 is compressed, and rod 624 is in recess 698, preventing the carrier securing device 694 from moving between a secured and unlocked position (e.g., locking carrier 650 to shelf 644).

[0120] In some embodiments, each shelf 644 includes a carrier fixing device 694 and / or a locking device 622. In some embodiments, two coplanar shelves 644 (e.g., both supporting the same carrier 650) both include a carrier fixing device 694 and / or a locking device 622. In some embodiments, at least one of two coplanar shelves 644 (e.g., both supporting the same carrier 650) includes a carrier fixing device 694 and / or a locking device 622.

[0121] Unless specifically indicated to the contrary, terms such as “transport,” “move,” “lower,” “cause,” “fix,” “remove,” “place,” “set,” “act,” “position,” “close,” and “lock” refer to actions and processes performed or implemented by a computer system that manipulates data represented as physical (electronic) measurements in computer system caches and memories and converts it into other data similarly represented as physical measurements in computer system memory or caches (or other such information storage, transmission, or display devices). Furthermore, the terms “first,” “second,” “third,” “fourth,” etc., as used herein are intended to distinguish different components and do not have an ordered meaning based on their numerical names.

[0122] The examples described herein also relate to an apparatus for performing the methods described herein. In some embodiments, this apparatus is specifically configured to perform the methods described herein, or it includes a general-purpose computer system selectively programmed with a computer program stored in the computer system. In some embodiments, this computer program is stored in a computer-readable tangible storage medium.

[0123] The methods and illustrative examples described herein are not inherently related to any particular computer or other device. Various general-purpose systems can be used in accordance with the teachings described herein, or more specialized devices can be constructed to perform the methods described herein and / or each of their respective functions, routines, subroutines, or operations. Structural examples for a wide variety of such systems are illustrated in the foregoing description.

[0124] The foregoing description sets forth several specific details, such as examples of specific systems, components, methods, etc., to provide a good understanding of several embodiments of this disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of this disclosure can be practiced without these specific details. In other examples, well-known components or methods have not been described in detail or are presented in a simple block diagram format to avoid unnecessarily obscuring this disclosure. Therefore, the specific details set forth are merely illustrative. Specific implementations may differ from these exemplary details and are still contemplated within the scope of this disclosure.

[0125] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in association with that embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in different places throughout this specification do not necessarily all refer to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the terms "about" or "approaching" are used herein, they mean that the represented nominal values ​​are accurate within a range of ±10%.

[0126] Although the operations of the methods described herein are shown and illustrated in a specific order, the order of the operations can be changed so that some operations are performed in reverse order, or so that some operations are performed at least partially synchronously with other operations. In another embodiment, instructions or sub-operations of different operations are performed intermittently and / or alternately.

[0127] It will be understood that the above description is intended to be exemplary and not restrictive. Many other embodiments will be apparent to those skilled in the art after reading and understanding the above description. The scope of this disclosure should therefore be determined by reference to the appended claims and the full scope of their equivalents.

Claims

1. A group of one or more shelf units configured to be disposed within a housing system of a substrate processing system, the group of one or more shelf units comprising: The first shelf, comprising: A plurality of first upper surfaces, the plurality of first upper surfaces being disposed substantially in a first plane; A plurality of carrier alignment features are configured to align a carrier on a plurality of first upper surfaces, the plurality of carrier alignment features being disposed above the plurality of first upper surfaces, wherein the plurality of carrier alignment features includes one or more first carrier alignment features and one or more second carrier alignment features, the one or more first carrier alignment features being configured to be close to a first distal end of the carrier and the one or more second carrier alignment features being configured to be close to a second distal end of the carrier; A plurality of second upper surfaces, the plurality of second upper surfaces being generally disposed in a second plane, the second plane being above the first plane; as well as Multiple processing accessory ring alignment features are configured to align processing accessory rings on the carrier above the multiple second upper surfaces.

2. The set of one or more shelves as described in claim 1, wherein: The first shelf comprises a first portion and a second portion that are coplanar; The plurality of first upper surfaces include the first upper surface of the first portion and the third upper surface of the second portion; The plurality of second upper surfaces include a second upper surface and a fourth upper surface of the second portion; The first portion includes one or more first carrier alignment features and the second portion includes one or more second carrier alignment features; and The plurality of processing accessory ring alignment features include one or more first processing accessory ring alignment features in the first part and one or more second processing accessory ring alignment features in the second part.

3. The set of one or more shelves as described in claim 2, wherein: The first portion further includes one or more first attachment features configured to attach the first portion to one or more first components of the housing system; and The second portion further includes one or more second attachment features configured to attach the second portion to one or more second components of the housing system.

4. A set of one or more shelves as described in claim 2, wherein: The one or more first carrier alignment features include a first sidewall; The one or more second carrier alignment features include a second sidewall; and The first sidewall and the second sidewall are configured to prevent the carrier from moving in the x-direction and from rolling.

5. A set of one or more shelves as described in claim 4, wherein: The first sidewall is located at an angle of 120 to 150 degrees to the first upper surface; and The second sidewall is located at an angle of 120 to 150 degrees to the third upper surface.

6. The set of one or more shelves as described in claim 4, wherein: The one or more first carrier alignment features include a third sidewall; The one or more second carrier alignment features include a fourth sidewall; and The third and fourth sidewalls are configured to prevent movement of the carrier in the y-direction.

7. The set of one or more shelves as claimed in claim 6, wherein the first upper surface and the third upper surface are configured to prevent z-direction movement, pitch movement and tumble movement of the carrier.

8. A set of one or more shelves as described in claim 3, wherein: The one or more first processing accessory ring alignment features include a fifth sidewall; The one or more second processing accessory ring alignment features include a sixth sidewall; and The fifth and sixth sidewalls are configured to align with the processing accessory ring on the carrier.

9. A set of one or more shelves as described in claim 8, wherein: The fifth sidewall is located at an angle of 100 to 110 degrees to the first upper surface; and The sixth sidewall is located at an angle of 100 to 110 degrees to the third upper surface.

10. The set of one or more shelves as claimed in claim 1, further comprising one or more carrier securing devices configured to secure the carrier to the set of one or more shelves.

11. A housing system for a substrate processing system, the housing system comprising: Multiple surfaces, said multiple surfaces at least partially surrounding the internal volume of the housing system; and A group of one or more shelves, said group of one or more shelves being disposed at least partially within the internal volume of the housing system, wherein said group of one or more shelves comprises: The first shelf, comprising: A plurality of carrier alignment features are configured to align carriers on a first shelf in a first plane, wherein the plurality of carrier alignment features includes one or more first carrier alignment features and one or more second carrier alignment features, the one or more first carrier alignment features being configured to be proximate to a first distal end of the carrier and the one or more second carrier alignment features being configured to be proximate to a second distal end of the carrier; and Multiple processing accessory ring alignment features are configured to align processing accessory rings on the carrier in a second plane above the first plane, and the multiple processing accessory ring alignment features are disposed above the multiple carrier alignment features.

12. The housing system of claim 11, wherein: The first shelf comprises a first portion and a second portion that are coplanar; The first portion includes one or more first carrier alignment features and the second portion includes one or more second carrier alignment features; and The plurality of processing accessory ring alignment features include one or more first processing accessory ring alignment features in the first part and one or more second processing accessory ring alignment features in the second part.

13. The housing system of claim 11, wherein the plurality of carrier alignment features include a first sidewall and a second sidewall, wherein the first sidewall and the second sidewall are configured to prevent x-direction movement and yaw movement of the carrier.

14. The housing system of claim 13, wherein the plurality of carrier alignment features further comprises a third sidewall and a fourth sidewall, wherein the third sidewall and the fourth sidewall are configured to prevent movement of the carrier in the y-direction.

15. The housing system of claim 14, wherein the first shelf further comprises a first upper surface and a third upper surface, the first upper surface and the third upper surface being in the first plane and configured to prevent z-direction movement, pitch movement and tumble movement of the carrier.

16. The housing system of claim 11, wherein the plurality of processing accessory ring alignment features include a plurality of sidewalls configured to align the processing accessory rings on the carrier.

17. The housing system of claim 16, wherein the carrier is configured to prevent x-direction movement, y-direction movement, z-direction movement, pitch movement, and tumble movement of the processing accessory ring.

18. The housing system of claim 16, further comprising a plurality of sets of one or more shelves, the plurality of sets of one or more shelves comprising the set of one or more shelves, wherein each of the plurality of sets of one or more shelves is configured to support one or more of: a corresponding carrier, a corresponding processing accessory ring, a corresponding location verification wafer, or an assembly of the substrate processing system.

19. A method comprising: The carrier supporting the processing accessory ring is transported to a position above the first shelf in a group of one or more shelves, said group of one or more shelves being disposed within the housing system of the substrate processing system; and In response to lowering the carrier supporting the processing accessory ring, the carrier is aligned on a first plane of the first shelf via a plurality of carrier alignment features of the first shelf, and the processing accessory ring is aligned on a second plane of the carrier via a plurality of processing accessory ring alignment features of the first shelf, wherein the plurality of carrier alignment features includes one or more first carrier alignment features and one or more second carrier alignment features, the one or more first carrier alignment features being configured to be close to a first distal end of the carrier and the one or more second carrier alignment features being configured to be close to a second distal end of the carrier, the plurality of processing accessory ring alignment features being disposed above the plurality of carrier alignment features.

20. The method of claim 19, wherein, In further response to the lowering of the carrier supporting the processing accessory ring, the carrier is secured to the first shelf via one or more fastening devices on the first shelf.

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